TW201317564A - Automatic inspection apparatus for substrate appearance - Google Patents
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Description
本發明係有關於電子元件之外觀檢測機，特別係有關於一種基板外觀自動檢測機。The present invention relates to an appearance detecting machine for an electronic component, and more particularly to an automatic appearance detecting machine for a substrate.
按，外觀檢測機依欲檢測的電子元件不同而會有不同的結構，例如IC晶片的外觀檢測偏重於檢查晶片表面是否沾矽屑或灰塵、有無電路斷線、或是有無外力刮損表面，但晶片尺寸過小不能亦不需要針對不良晶片作墨水標記，而是作成晶圓地圖檔案，在後續的黏晶或晶片包裝製程中避開不良的晶片。而關於LED晶片的外觀檢測則是在檢測作業之過程中直接將不良晶片剔除。以上的傳統外觀檢測機皆不適用於基板外觀自動檢測機，這是因為基板內的不良單元區是一體連接於基板中，不可被剔除，如製成圖檔再轉工作站做墨水標記，易有資料失誤或誤標之情事，並且需要額外建構墨水標記工作站的成本且檢測效率未有提昇。目前的做法是在完成基板之外觀檢測之後，利用人工方式對不良單元區進行墨水標記，不符合全自動化外觀自動檢測之要求。According to the appearance, the appearance detector has different structures depending on the electronic components to be detected. For example, the appearance inspection of the IC wafer is focused on checking whether the surface of the wafer is stained with dust or dust, whether there is a circuit break, or whether there is an external force to scratch the surface. However, if the size of the wafer is too small, it is not necessary to mark the defective wafer, but a wafer map file is created to avoid the defective wafer in the subsequent die bonding or wafer packaging process. The appearance inspection of the LED chip is to directly remove the defective wafer during the inspection operation. The above traditional appearance inspection machines are not applicable to the automatic inspection machine for the appearance of the substrate. This is because the defective unit area in the substrate is integrally connected to the substrate and cannot be removed. For example, if the image is formed and then transferred to the workstation for ink marking, it is easy to have Mistakes or mislabeling of the data, and the need to additionally construct the cost of the ink marking workstation and the detection efficiency has not improved. The current practice is to manually mark the defective unit area by ink after the appearance inspection of the substrate, which does not meet the requirements of automatic detection of fully automated appearance.
為了解決上述之問題，本發明之主要目的係在於一種基板外觀自動檢測機，能在作基板外觀檢測之後隨即作不良單元區的墨水標記，不需要工作站轉移，亦不會有工作站轉移的資料失誤與誤標之情事。In order to solve the above problems, the main object of the present invention is an automatic appearance inspection machine for a substrate, which can be used as an ink mark of a defective unit area immediately after the appearance inspection of the substrate, without requiring a workstation transfer, and no data error of the workstation transfer. And the wrong thing.
本發明的目的及解決其技術問題是採用以下技術方案來實現的。本發明揭示一種基板外觀自動檢測機，包含一用以攝影一基板之攝像機構、一設於該攝像機構之下方之勻散光源機構、一用以標記該基板之不良單元區之Z軸自動點墨機構以及一XZ平面移動載台。該XZ平面移動載台係設置有一基板固定治具，用以固定該基板，利用該XZ平面移動載台之水平移動使該基板固定治具活動於該攝像機構與該Z軸自動點墨機構兩者作業區之間。The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses an automatic appearance detecting machine for a substrate, comprising an image capturing mechanism for photographing a substrate, a dispersing light source mechanism disposed under the image capturing mechanism, and a Z-axis automatic point for marking a defective unit region of the substrate. Ink mechanism and an XZ plane moving stage. The XZ plane moving stage is provided with a substrate fixing fixture for fixing the substrate, and the horizontal movement of the XZ plane moving stage is used to move the substrate fixing fixture to the camera mechanism and the Z-axis automatic ink-receiving mechanism. Between the work areas.
本發明的目的及解決其技術問題還可採用以下技術措施進一步實現。The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.
在前述之基板外觀自動檢測機中，該Z軸自動點墨機構係可包含一筆桿夾具、一筆蓋夾具以及一多軸傳動機構，以使一墨水筆可由一筆蓋中拔出並於標記作動完成之後插回該筆蓋。In the foregoing automatic substrate inspection machine, the Z-axis automatic ink-receiving mechanism may include a rod clamp, a cover clamp, and a multi-axis transmission mechanism, so that an ink pen can be pulled out from the cover and actuated on the mark. Then insert the pen cover back.
在前述之基板外觀自動檢測機中，該筆桿夾具係可固定於一升降座，該筆蓋夾具係可固定於一固定座，並且該多軸傳動機構係可包含一傳動螺桿以及一氣壓缸，利用該傳動螺桿之旋轉帶動該升降座之升降，利用該氣壓缸帶動該固定座的水平移動。In the above-mentioned automatic substrate inspection machine, the pen holder can be fixed to a lifting base, the pen holder can be fixed to a fixing base, and the multi-shaft transmission mechanism can include a driving screw and a pneumatic cylinder. The rotation of the driving screw drives the lifting and lowering of the lifting seat, and the pneumatic cylinder drives the horizontal movement of the fixing seat.
在前述之基板外觀自動檢測機中，該攝像機構係可包含一CCD彩色攝影機與一可變倍數之鏡頭。In the above-described automatic substrate inspection machine, the camera mechanism may include a CCD color camera and a variable magnification lens.
在前述之基板外觀自動檢測機中，該勻散光源機構係可為多光源結構，其係包含一半圓球燈罩、一設於該半圓球燈罩內之第一光源以及一設於該半圓球燈罩上方之第二光源。In the above-mentioned substrate appearance automatic detecting machine, the dispersing light source mechanism may be a multi-light source structure, which comprises a half ball lamp cover, a first light source disposed in the semi-spherical ball cover, and a semi-spherical lamp cover. The second source above.
在前述之基板外觀自動檢測機中，該第二光源係可為一利用菱鏡之外同軸燈源。In the foregoing substrate appearance automatic detecting machine, the second light source may be a coaxial light source other than the prism.
在前述之基板外觀自動檢測機中，該第二光源係可為一直接照射該基板之小環燈光源。In the foregoing automatic substrate inspection machine, the second light source may be a small ring light source directly illuminating the substrate.
在前述之基板外觀自動檢測機中，該基板固定治具係可具有一固定之第一角隅固定件以及一可調式之第二角隅固定件。In the foregoing automatic substrate inspection machine, the substrate fixing fixture may have a fixed first corner gusset fixing member and an adjustable second corner gusset fixing member.
在前述之基板外觀自動檢測機中，該基板係可為一LED陶瓷構裝基板。In the above-described automatic substrate inspection machine, the substrate may be an LED ceramic package substrate.
在前述之基板外觀自動檢測機中，該Z軸自動點墨機構之墨水標記方向係可與該攝像機構之攝影取像方向為平行。In the above-described automatic substrate inspection machine, the ink marking direction of the Z-axis automatic ink-receiving mechanism can be parallel to the image capturing direction of the imaging mechanism.
以下將配合所附圖示詳細說明本發明之實施例，然應注意的是，該些圖示均為簡化之示意圖，僅以示意方法來說明本發明之基本架構或實施方法，故僅顯示與本案有關之元件與組合關係，圖中所顯示之元件並非以實際實施之數目、形狀、尺寸做等比例繪製，某些尺寸比例與其他相關尺寸比例或已誇張或是簡化處理，以提供更清楚的描述。實際實施之數目、形狀及尺寸比例為一種選置性之設計，詳細之元件佈局可能更為複雜。The embodiments of the present invention will be described in detail below with reference to the accompanying drawings in which FIG. The components and combinations related to this case, the components shown in the figure are not drawn in proportion to the actual number, shape and size of the actual implementation. Some size ratios are proportional to other related sizes or have been exaggerated or simplified to provide clearer description of. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated.
依據本發明之一具體實施例，一種基板外觀自動檢測機舉例說明於第1圖之立體示意圖。該基板外觀自動檢測機100係包含一用以攝影一基板10之攝像機構110、一設於該攝像機構110之下方之勻散光源機構120、一用以標記該基板10之不良單元區之Z軸自動點墨機構130以及一XZ平面移動載台140。該XZ平面移動載台140係設置有一基板固定治具141，用以固定該基板10，利用該XZ平面移動載台140之水平移動使該基板固定治具141活動於該攝像機構110與該Z軸自動點墨機構130兩者作業區之間，例如利用第一傳動帶142等傳動結構與X軸導軌及Y軸導軌使該XZ平面移動載台140在XZ平面作水平移動，其中該XZ平面移動載台140之水平移動行程可為200mmx200mm。故能在作基板外觀檢測之後隨即作不良單元區的墨水標記，不需要工作站轉移，亦不會有工作站轉移的資料失誤與誤標之情事。According to an embodiment of the present invention, a substrate appearance automatic detecting machine is illustrated in a perspective view of FIG. The substrate appearance automatic detecting machine 100 includes an image capturing mechanism 110 for photographing a substrate 10, a uniform light source mechanism 120 disposed under the image capturing mechanism 110, and a Z for marking the defective unit area of the substrate 10. The axis automatic ink receiving mechanism 130 and an XZ plane moving stage 140. The XZ plane moving stage 140 is provided with a substrate fixing jig 141 for fixing the substrate 10, and the horizontal fixing of the XZ plane moving stage 140 causes the substrate fixing jig 141 to move to the imaging mechanism 110 and the Z The XZ plane moving stage 140 is horizontally moved in the XZ plane between the working areas of the shaft automatic ink receiving mechanism 130, for example, by using a transmission structure such as the first belt 142 and the X-axis rail and the Y-axis rail, wherein the XZ plane moves The horizontal movement of the stage 140 can be 200 mm x 200 mm. Therefore, it can be used as the ink mark of the defective unit area immediately after the appearance inspection of the substrate, and no workstation transfer is required, and there is no information error or misclassification of the workstation transfer.
在本實施例中，該攝像機構110係可包含一CCD彩色攝影機111與一可變倍數之鏡頭112。更具體地，該CCD彩色攝影機111係為500萬畫素彩色攝影機，晶片尺寸為2/3”CCD、有效畫素為2608(H) x 1950(V)、掃描方式為Progressive Scan，因其內部晶片尺寸較大，在固定解析度下其視野較大，可降地所拍攝的影像張數，以加快檢測速度。而該鏡頭112因其光學解析度訂在10um/pixel左右，故選用的鏡頭為0.7x~4.5x的變倍鏡頭，並搭配0.67x轉接器、0.5x倍鏡，依此搭配起來的倍率為0.2345x~1.5x。例如，變倍鏡頭搭配5M攝影機，攝影機晶片的cell size為3.4um，其解析度計算為：當倍率為0.24x時，解析度3.4/0.24=14.16um；當倍率為1.5x時，其解析度為3.4/1.5=2.27um。In this embodiment, the camera mechanism 110 can include a CCD color camera 111 and a variable multiple lens 112. More specifically, the CCD color camera 111 is a 5 million pixel color camera, the chip size is 2/3" CCD, the effective pixel is 2608 (H) x 1950 (V), and the scanning mode is Progressive Scan, because of its internal The size of the chip is large, and the field of view is large at a fixed resolution, and the number of images taken can be reduced to speed up the detection. The lens 112 is set at 10 um/pixel because of its optical resolution, so the lens is selected. It is a 0.7x~4.5x zoom lens with a 0.67x adapter and a 0.5x mirror. The ratio is 0.2345x~1.5x. For example, the zoom lens is matched with a 5M camera, the cell of the camera chip. The size is 3.4um, and the resolution is calculated as: when the magnification is 0.24x, the resolution is 3.4/0.24=14.16um; when the magnification is 1.5x, the resolution is 3.4/1.5=2.27um.
如第2圖所示，在本實施例中，該基板固定治具141係可具有一固定之第一角隅固定件143以及一可調式之第二角隅固定件144，皆為L形板夾具，其中該第二角隅固定件144係可利用調整螺桿調整其相對位置。故該基板固定治具141為通用型，可裝載不同尺寸之基板，例如4.5”、4.8”或5”尺寸之基板。As shown in FIG. 2, in the embodiment, the substrate fixing jig 141 can have a fixed first corner gusset 143 and an adjustable second corner gusset 144, both of which are L-shaped plates. The clamp, wherein the second corner clamp 144 is adjustable by the adjustment screw. Therefore, the substrate fixing jig 141 is of a general type and can be loaded with substrates of different sizes, for example, substrates of 4.5", 4.8" or 5" size.
如第3圖所示，該基板10係包含複數個矩陣排列之單元區11，每一單元區11可作為一個電子元件之晶片載板。在本實施例中，該基板10係可為一LED陶瓷構裝基板，特別適用於運用該基板外觀自動檢測機100進行外觀檢測並在同工作站進行墨水標記之自動作業。利用該XZ平面移動載台140之水平移動，使該基板固定治具141及其搭載之基板10可被帶入該攝像機構110之作業區內。As shown in FIG. 3, the substrate 10 includes a plurality of matrix-arranged unit regions 11, each of which can serve as a wafer carrier for an electronic component. In this embodiment, the substrate 10 can be an LED ceramic package substrate, and is particularly suitable for performing the appearance inspection using the substrate appearance automatic inspection machine 100 and performing automatic operation of ink marking on the same workstation. By the horizontal movement of the XZ plane moving stage 140, the substrate fixing jig 141 and the substrate 10 mounted thereon can be carried into the working area of the image capturing mechanism 110.
如第4圖所示，在本實施例中，該勻散光源機構120係可為多光源結構，其係包含一半圓球燈罩121、一設於該半圓球燈罩121內之第一光源122以及一設於該半圓球燈罩121上方之第二光源123。更具體地，該第二光源123係可為一利用菱鏡124之外同軸燈源。其中，使用多光源結構之用意在於，一般人員在顯微鏡下進行缺陷檢查時，常利用轉動待測物以不同角度觀察是否有缺陷，因為缺陷在不同的光線角度下，所產生的反應可能不同，甚至有些特殊缺陷必須在特殊的角度下才可見，故在光學檢測中有所謂的亮視野(Bright filed)檢測與暗視野(Dark filed)檢測，因此，利用該第一光源122與該第二光源123可進行不同光源角度或光色溫的多種檢測。此外，該半圓球燈罩121之內表面係塗布一層均勻的特殊原料，使得環燈式之該第一光源122之光線可以被該半圓球燈罩121反射並平均地照射在待測物之基板10上，藉以產生適當的光折射路徑，達到高效勻散光之效果。而該外同軸燈源之第二光源123係透過該菱鏡124折射將光源照射至該基板10上，再反射回該攝像機構110之該鏡頭112。該外同軸燈源之第二光源123之使用係由於對於視野較大的拍攝方式較不適用內同軸燈，容易造成光源不均，因此需要使用外同軸燈。而光源的均勻度係可在檢測影像中有效區域內上下左右取四點，灰階差異在10%以內以灰卡測試外同軸光源的均勻度，取中心/左上/右上/左下/右下五點，其灰階值最大差異為0.78%((Gmax-Gmin)/255)，即表示符合在10%以內的標準。As shown in FIG. 4 , in the embodiment, the dispersing light source mechanism 120 can be a multi-light source structure, which comprises a half ball lamp cover 121 , a first light source 122 disposed in the semi-spherical ball cover 121 , and A second light source 123 is disposed above the semi-spherical ball cover 121. More specifically, the second light source 123 can be a coaxial light source other than the prism 124. Among them, the purpose of using a multi-light source structure is that when a person performs a defect inspection under a microscope, it is often used to rotate the object to be tested to observe whether there is a defect at different angles, because the reaction may be different under different ray angles. Even some special defects must be visible at a special angle, so there is a so-called Bright filed detection and Dark filed detection in optical detection, and therefore, the first light source 122 and the second light source are utilized. 123 can perform multiple detections of different light source angles or light color temperatures. In addition, the inner surface of the semi-spherical bulb 121 is coated with a uniform special material, so that the light of the first light source 122 of the ring lamp type can be reflected by the semi-spherical bulb 121 and evenly irradiated on the substrate 10 of the object to be tested. In order to produce an appropriate light refraction path, the effect of efficiently dispersing light is achieved. The second light source 123 of the external coaxial light source is refracted by the prism 124 to illuminate the light source onto the substrate 10 and then reflected back to the lens 112 of the imaging mechanism 110. The use of the second light source 123 of the external coaxial light source is due to the fact that the inner coaxial light is less suitable for a larger field of view, and the light source is uneven, so an outer coaxial light is required. The uniformity of the light source can take four points up, down, left and right in the effective area of the detected image, and the gray level difference is within 10% to test the uniformity of the external coaxial light source with gray card, and take center/top left/top right/bottom left/bottom right Point, the maximum difference of the grayscale value is 0.78% ((Gmax-Gmin)/255), which means that the standard is within 10%.
除了使用外同軸燈搭配半圓球燈的方式之外，亦可使用小環燈搭配半圓球燈，亦可達到同樣效果。如第5圖所示，在本實施例之一變化例中，該第二光源123’係可為一直接照射該基板10之小環燈光源。該小環燈光源係可透過斜向角度的LED白光直接照射至該基板10。該小環燈光源之第二光源123’之亮度至少為78000 Lux，較佳為可達到80000 Lux。在該實施例中，該小環燈光源的LED光線角度係可為24度，其色溫可在5500～6500 K。In addition to the use of external coaxial lights with semi-spherical lights, small ring lights can also be used with semi-spherical lights to achieve the same effect. As shown in Fig. 5, in a variation of this embodiment, the second light source 123' can be a small ring light source that directly illuminates the substrate 10. The small ring light source is directly illuminable to the substrate 10 through the oblique angle LED white light. The second light source 123' of the small ring light source has a brightness of at least 78,000 Lux, preferably up to 80,000 Lux. In this embodiment, the LED light source of the small ring light source can have an angle of 24 degrees and a color temperature of 5500-6500 K.
第6圖係為利用該攝像機構110取得該基板10之攝像照片之後，並利用一基板缺陷分析模組(圖中未繪出)進行分析的畫面圖，可辨識之缺陷包括：刮傷、突點、異物、汙點、印刷圖形不良等，及客戶自訂缺陷。經實驗得知，該基板外觀自動檢測機之辨識準確率可達99%，辨識判別速度約為0.125 sec/pcs，故可迅速測得該基板10之不良單元區。此外，利用一客製化缺陷檢測規格模組(圖中未繪出)，在其介面中可以建立模型的名稱、長度、寬度、掃描長度、掃描寬度與檢測項目等資訊。再進行一標準樣本的設定，主要為建立一個標準模型，其包含標準pattern的尺寸、各區域的定義、各區域的平均灰階值與RawData等資訊，並能夠設定光源亮度，作為檢測時的亮度依據。而檢測參數的設定主要是利用灰階值的變化偵測缺陷，當缺陷的灰階值落於正常的灰階值之外時，藉由兩個閥值即可切割出亮灰階與暗灰階的缺陷。此外，定位參數的設定主要為透過Pattern Match獲得畫面中所有的pattern的資訊，包括pattern在影像中的位置、旋轉的角度、與標準pattern的相似度等。因此，可偵測位於陶瓷基板上不同區域內的表面異常狀態，計算異常區域之面積、長寬、位置、色彩…等特徵資訊。使用者依需求，對缺陷之各項特徵資訊標準進行設定。例如污點，一般污點為暗色異常區域，因此可設定依需求定義”暗色”標準與面積限制，藉此可偵測出面積大於容許值的”污點”缺陷。FIG. 6 is a screen diagram of the substrate 10 obtained by the imaging mechanism 110 and using a substrate defect analysis module (not shown) for analysis. The identifiable defects include: scratches and protrusions. Points, foreign objects, stains, poor print graphics, etc., and customer-defined defects. It is found through experiments that the identification accuracy of the automatic appearance inspection machine of the substrate is up to 99%, and the identification speed is about 0.125 sec/pcs, so that the defective unit area of the substrate 10 can be quickly measured. In addition, using a customized defect detection specification module (not shown), information such as the name, length, width, scan length, scan width, and inspection items of the model can be established in the interface. Then set a standard sample, mainly to establish a standard model, including the size of the standard pattern, the definition of each region, the average grayscale value of each region and RawData, and can set the brightness of the light source as the brightness during detection. in accordance with. The detection parameter is mainly set to detect the defect by using the change of the gray scale value. When the gray scale value of the defect falls outside the normal gray scale value, the bright gray scale and the dark gray can be cut by two threshold values. Defects of the order. In addition, the positioning parameter is mainly set to obtain information of all the patterns in the picture through Pattern Match, including the position of the pattern in the image, the angle of rotation, the similarity with the standard pattern, and the like. Therefore, the surface abnormal state in different regions on the ceramic substrate can be detected, and the characteristic information such as the area, length, width, position, color, and the like of the abnormal region can be calculated. The user sets the information standard of each defect according to the requirements. For example, stains, the general stain is a dark anomalous area, so you can set the "dark" standard and area limit according to the requirements, so as to detect the "stain" defect whose area is larger than the allowable value.
如第7圖所示，該Z軸自動點墨機構130係可包含一筆桿夾具131、一筆蓋夾具132以及一多軸傳動機構133。該筆桿夾具131係用以固定一墨水筆20，該筆蓋夾具132係用以固定一筆蓋21，該多軸傳動機構133則帶動該筆桿夾具131及其固定之墨水筆20進行墨水標記與復位之動作。因此該墨水筆20可由該筆蓋21中拔出並於標記作動完成之後插回該筆蓋21。在本實施例中，該筆桿夾具131係固定在一升降座138，該筆蓋夾具132係固定在一固定座137。而該多軸傳動機構133係可包含一第二傳動帶134、一連動之傳動螺桿135以及一氣壓缸136(如第1圖所示)。該第二傳動帶134的轉動係帶動該傳動螺桿135之旋轉，該傳動螺桿135之順逆時針旋轉則帶動該升降座138之升降。另外，可利用該氣壓缸136帶動該固定座137的水平移動。As shown in FIG. 7, the Z-axis automatic ink dispensing mechanism 130 can include a stroke bar clamp 131, a cover clamp 132, and a multi-axis transmission mechanism 133. The pen holder 131 is used for fixing an ink pen 20 for fixing a cover 21, and the multi-axis transmission mechanism 133 drives the pen holder 131 and its fixed ink pen 20 for ink marking and resetting. The action. Therefore, the ink pen 20 can be pulled out of the pen cover 21 and inserted back into the pen cover 21 after the marking operation is completed. In the present embodiment, the pen holder 131 is fixed to a lifting base 138, and the pen holder 132 is fixed to a fixing base 137. The multi-axis transmission mechanism 133 can include a second transmission belt 134, a linked transmission screw 135, and a pneumatic cylinder 136 (as shown in FIG. 1). The rotation of the second belt 134 drives the rotation of the transmission screw 135. The counterclockwise rotation of the transmission screw 135 drives the lifting and lowering of the lifting seat 138. In addition, the pneumatic cylinder 136 can be used to drive the horizontal movement of the fixing base 137.
該Z軸自動點墨機構130之自動墨水標記作業係可參閱第8圖之流程圖以及第9A至9D圖之在作墨水標記過程中之側視圖。首先利用該XZ平面移動載台140之水平移動，使該基板固定治具141及其搭載之基板10可被帶入該Z軸自動點墨機構130之作業區內。The automatic ink marking operation of the Z-axis automatic ink dispensing mechanism 130 can be seen in the flow chart of Fig. 8 and the side view of the ink marking process in Figs. 9A to 9D. First, the horizontal movement of the XZ plane moving stage 140 is utilized to bring the substrate fixing jig 141 and the substrate 10 mounted thereon into the work area of the Z-axis automatic ink receiving mechanism 130.
如第9A圖所示，為該Z軸自動點墨機構130復位或初始之狀態，該墨水筆20之筆頭係插接於該筆蓋21內。欲進行墨水標記作業時，首先，步驟1可參閱第9B圖，利用該傳動螺桿135之旋轉帶動該升降座138之上升，使該墨水筆20由該筆蓋21抽離並上升至最高點。接著，步驟2可參閱第9C圖，利用該氣壓缸136(如第1圖所示)的作動將該固定座137往左移動，使該墨水筆20之筆頭水平地遠離該筆蓋21。接著，步驟3可參閱第9D圖，利用該傳動螺桿135之反向旋轉帶動該升降座138之下降，使該墨水筆20之筆頭下降至點墨位置，以標記該基板之某一被指定之不良單元區。步驟4則由系統判定是否繼續點墨。如需要繼續點墨，則進行步驟5，該墨水筆20上升到一暫時位置，待移動該基板至另一被指定之不良單元區對準至點墨位置，再重複地進行步驟3、4。如不需要繼續點墨，則進行以下步驟之復位操作，在步驟6中該墨水筆20上升到最高點(狀態如第9C圖所示)，在步驟7中由該氣壓缸作動將該固定座137往右移動，使該墨水筆20之筆頭垂直地對準該筆蓋21(狀態如第9B圖所示)，最後在步驟8中，Z軸方向下降該墨水筆20，使該墨水筆20之筆頭插回該筆蓋21(狀態如第9A圖所示)，即完成該墨水筆20之復位動作，以避免該墨水筆20在長時間不使用時的墨水乾枯。此時，該基板外觀自動檢測機100係可為停機狀態或是處於該攝像機構110之作業時間。As shown in FIG. 9A, in a state in which the Z-axis automatic ink receiving mechanism 130 is reset or initialized, the pen tip of the ink pen 20 is inserted into the pen cover 21. In order to perform the ink marking operation, first, step 1 can refer to FIG. 9B, and the rotation of the lifting screw 138 is driven by the rotation of the driving screw 135, so that the ink pen 20 is pulled away from the pen cover 21 and raised to the highest point. Next, in step 2, referring to FIG. 9C, the fixing seat 137 is moved to the left by the action of the pneumatic cylinder 136 (shown in FIG. 1), so that the writing head of the ink pen 20 is horizontally away from the pen cover 21. Next, step 3 can refer to FIG. 9D, and the reverse rotation of the driving screw 135 drives the lifting of the lifting base 138 to lower the writing head of the ink pen 20 to the ink position to mark a designated one of the substrates. Bad unit area. In step 4, the system determines whether to continue to ink. If it is necessary to continue to ink, proceed to step 5, the ink pen 20 is raised to a temporary position, the substrate is moved to another designated defective unit area to be aligned to the ink position, and steps 3 and 4 are repeated. If it is not necessary to continue to ink, perform the reset operation of the following steps. In step 6, the ink pen 20 rises to the highest point (state as shown in FIG. 9C), and the fixed seat is actuated by the pneumatic cylinder in step 7. 137 is moved to the right so that the pen tip of the ink pen 20 is vertically aligned with the pen cover 21 (the state is as shown in FIG. 9B), and finally, in step 8, the ink pen 20 is lowered in the Z-axis direction to make the ink pen 20 The pen tip is inserted back into the pen cover 21 (the state is as shown in FIG. 9A), that is, the resetting action of the ink pen 20 is completed to prevent the ink pen 20 from drying out when the ink pen 20 is not used for a long time. At this time, the substrate appearance automatic detecting machine 100 can be in a stop state or in the working time of the camera mechanism 110.
經實作得知，該Z軸自動點墨機構130作動之周期時間(cycle time)係為1次/sec以上。以馬達轉速50000 pluse/sec計算，在pitch為5mm的螺桿上移動，脈波與距離的換算為1 pulse=1 um，即每秒50000 pluse可以移動50mm，而實際上移動的行程約10 mm，因此上升與下降的時間加上加減速，cycle time大約需要0.6秒，故每秒至少可以進行點墨一次。According to the actual implementation, the cycle time of the Z-axis automatic ink-receiving mechanism 130 is one time/sec or more. Calculated by the motor speed of 50000 pluse/sec, moving on a screw with a pitch of 5 mm, the pulse wave and distance are converted to 1 pulse = 1 um, that is, 50000 pluse per second can move 50 mm, while the actual moving stroke is about 10 mm. Therefore, the time of rise and fall plus acceleration and deceleration, the cycle time takes about 0.6 seconds, so at least one ink can be dispensed per second.
較佳地，該Z軸自動點墨機構130之標記方向係可與該攝像機構110之攝影取像方向為平行。即該攝像機構110之該CD彩色攝影機111與該鏡頭112皆裝設在一Z軸支撐結構上，利用適當之螺桿與滑軌移動調整焦距位置。因此，該Z軸自動點墨機構130與該攝像機構110在XY平面的距離為固定，只要鎖定該基板10在該攝像機構110作業區之不良單元區之位置，該XZ平面移動載台140的水平移動包含該攝像機構110至該Z軸自動點墨機構130之XY平面固定距離，即為該Z軸自動點墨機構130供該Z軸自動點墨機構130在其作業區標記之不良單元區之位置，故能方便作計算以確定不良單元區之位置。Preferably, the marking direction of the Z-axis automatic ink-receiving mechanism 130 is parallel to the image capturing direction of the imaging mechanism 110. That is, the CD color camera 111 and the lens 112 of the camera mechanism 110 are all mounted on a Z-axis support structure, and the focal length position is adjusted by appropriate screw and slide movement. Therefore, the distance between the Z-axis automatic ink receiving mechanism 130 and the imaging mechanism 110 in the XY plane is fixed, and the XZ plane moves the stage 140 as long as the substrate 10 is locked at the position of the defective unit area of the working area of the imaging mechanism 110. The horizontal movement includes the fixed distance of the XY plane of the camera mechanism 110 to the Z-axis automatic ink-receiving mechanism 130, that is, the Z-axis automatic ink-receiving mechanism 130 is provided in the defective unit area of the Z-axis automatic ink-receiving mechanism 130 in the working area thereof. The location, so it can be easily calculated to determine the location of the defective unit area.
以上所述，僅是本發明的較佳實施例而已，並非對本發明作任何形式上的限制，雖然本發明已以較佳實施例揭露如上，然而並非用以限定本發明，任何熟悉本項技術者，在不脫離本發明之技術範圍內，所作的任何簡單修改、等效性變化與修飾，均仍屬於本發明的技術範圍內。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes and modifications made without departing from the technical scope of the present invention are still within the technical scope of the present invention.
10．．．基板10. . . Substrate
11．．．單元區11. . . Unit area
20．．．墨水筆20. . . Ink pen
21．．．筆蓋twenty one. . . Pen cap
100．．．基板外觀自動檢測機100. . . Substrate appearance automatic inspection machine
110．．．攝像機構110. . . Camera mechanism
111．．．CCD彩色攝影機111. . . CCD color camera
112．．．鏡頭112. . . Lens
120．．．勻散光源機構120. . . Diffuse light source mechanism
121．．．半圓球燈罩121. . . Semi-spherical lampshade
122．．．第一光源122. . . First light source
123、123’．．．第二光源123, 123’. . . Second light source
124．．．菱鏡124. . . Mirror
130．．．Z軸自動點墨機構130. . . Z-axis automatic ink dispensing mechanism
131．．．筆桿夾具131. . . Pen holder
132．．．筆蓋夾具132. . . Pen cover fixture
133．．．多軸傳動機構133. . . Multi-axis transmission
134．．．第二傳動帶134. . . Second belt
135．．．傳動螺桿135. . . Drive screw
136．．．氣壓缸136. . . Pneumatic cylinder
137．．．固定座137. . . Fixed seat
138．．．升降座138. . . Lifting seat
140．．．XZ平面移動載台140. . . XZ plane moving stage
141．．．基板固定治具141. . . Substrate fixing fixture
142．．．第一傳動帶142. . . First belt
143．．．第一角隅固定件143. . . First corner 隅 fixing
144．．．第二角隅固定件144. . . Second corner clamp
步驟1~步驟 Z軸自動點墨機構之標記流程步驟Step 1~Steps Z-axis automatic ink-receiving mechanism marking process steps
第1圖：依據本發明之一具體實施例的一種基板外觀自動檢測機之立體示意圖。1 is a perspective view of an automatic appearance inspection machine for a substrate according to an embodiment of the present invention.
第2圖：依據本發明之一具體實施例的該基板外觀自動檢測機之基板固定治具之立體示意圖。2 is a perspective view of a substrate fixing jig of the substrate appearance automatic detecting machine according to an embodiment of the present invention.
第3圖：依據本發明之一具體實施例的一基板之平面示意圖。Figure 3 is a plan view of a substrate in accordance with an embodiment of the present invention.
第4圖：依據本發明之一具體實施例之變化例中繪示該基板外觀自動檢測機之勻散光源機構之截面示意圖。Figure 4 is a cross-sectional view showing a dispersive light source mechanism of the substrate appearance automatic detecting machine in accordance with a variation of one embodiment of the present invention.
第5圖：依據本發明之一具體實施例之變化例中繪示該基板外觀自動檢測機之另一勻散光源機構之截面示意圖。Figure 5 is a cross-sectional view showing another dispersive light source mechanism of the substrate appearance automatic detecting machine in accordance with a variation of an embodiment of the present invention.
第6圖：依據本發明之一具體實施例的該基板外觀自動檢測機之影像拍攝與檢測成果影像畫面圖。Figure 6 is a diagram showing the image of the image capturing and detecting result of the substrate appearance automatic detecting machine according to an embodiment of the present invention.
第7圖：依據本發明之一具體實施例的該基板外觀自動檢測機之Z軸自動點墨機構之立體示意圖。Figure 7 is a perspective view showing the Z-axis automatic ink-receiving mechanism of the substrate appearance automatic detecting machine according to an embodiment of the present invention.
第8圖：依據本發明之一具體實施例的該基板外觀自動檢測機之Z軸自動點墨機構之標記流程圖。Figure 8 is a flow chart showing the marking of the Z-axis automatic ink dispensing mechanism of the substrate appearance automatic detecting machine according to an embodiment of the present invention.
第9A至9D圖：依據本發明之一具體實施例的該基板外觀自動檢測機之Z軸自動點墨機構在作墨水標記過程中之側視圖。9A to 9D are views showing a side view of the Z-axis automatic ink-receiving mechanism of the substrate appearance automatic detecting machine in the process of marking ink according to an embodiment of the present invention.
20．．．墨水筆20. . . Ink pen
21．．．筆蓋twenty one. . . Pen cap
100．．．基板外觀自動檢測機100. . . Substrate appearance automatic inspection machine
110．．．攝像機構110. . . Camera mechanism
111．．．CCD彩色攝影機111. . . CCD color camera
112．．．鏡頭112. . . Lens
120．．．勻散光源機構120. . . Diffuse light source mechanism
121．．．半圓球燈罩121. . . Semi-spherical lampshade
130．．．Z軸自動點墨機構130. . . Z-axis automatic ink dispensing mechanism
131．．．筆桿夾具131. . . Pen holder
132．．．筆蓋夾具132. . . Pen cover fixture
133．．．多軸傳動機構133. . . Multi-axis transmission
134．．．第二傳動帶134. . . Second belt
135．．．傳動螺桿135. . . Drive screw
136．．．氣壓缸136. . . Pneumatic cylinder
137．．．固定座137. . . Fixed seat
138．．．升降座138. . . Lifting seat
140．．．XZ平面移動載台140. . . XZ plane moving stage
141．．．基板固定治具141. . . Substrate fixing fixture
142．．．第一傳動帶142. . . First belt
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100138720A TWI502185B (en) | 2011-10-25 | 2011-10-25 | Automatic inspection apparatus for substrate appearance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100138720A TWI502185B (en) | 2011-10-25 | 2011-10-25 | Automatic inspection apparatus for substrate appearance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201317564A true TW201317564A (en) | 2013-05-01 |
| TWI502185B TWI502185B (en) | 2015-10-01 |
Family
ID=48871848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100138720A TWI502185B (en) | 2011-10-25 | 2011-10-25 | Automatic inspection apparatus for substrate appearance |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI502185B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108827370A (en) * | 2018-03-12 | 2018-11-16 | 中国电力科学研究院有限公司 | A kind of movable type visual inspection machine structure |
| CN111477558A (en) * | 2020-04-28 | 2020-07-31 | 天津福莱迪科技发展有限公司 | Visual detection equipment of product |
| US20220390510A1 (en) * | 2021-06-03 | 2022-12-08 | UTAC Headquarters Pte. Ltd. | Illuminator Method and Device for Semiconductor Package Testing |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200839218A (en) * | 2007-03-19 | 2008-10-01 | Ind Tech Res Inst | Diffuse illumination apparatus for inspection system |
| CN101431039B (en) * | 2007-11-08 | 2012-03-21 | 久元电子股份有限公司 | Wafer detection system |
-
2011
- 2011-10-25 TW TW100138720A patent/TWI502185B/en active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108827370A (en) * | 2018-03-12 | 2018-11-16 | 中国电力科学研究院有限公司 | A kind of movable type visual inspection machine structure |
| CN111477558A (en) * | 2020-04-28 | 2020-07-31 | 天津福莱迪科技发展有限公司 | Visual detection equipment of product |
| CN111477558B (en) * | 2020-04-28 | 2020-12-25 | 天津福莱迪科技发展有限公司 | Visual detection equipment of product |
| US20220390510A1 (en) * | 2021-06-03 | 2022-12-08 | UTAC Headquarters Pte. Ltd. | Illuminator Method and Device for Semiconductor Package Testing |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI502185B (en) | 2015-10-01 |
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