TW201316013A - Test device and test method - Google Patents
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本發明是有關於一種測試裝置以及測試方法。The invention relates to a test device and a test method.
先前，測試裝置是對中央處理單元(Central Processing Unit，CPU)、記憶體等被測試裝置(device)進行測試。而且，提出有以實際的動作速度進行測試的回送(loopback)測試(例如參照專利文獻1)。而且，提出有在被測試裝置中包括光學介面(optical interface)(例如參照專利文獻2)。Previously, the test device was tested on a device under test such as a central processing unit (CPU) and a memory. Further, a loopback test in which the test is performed at an actual operation speed has been proposed (for example, refer to Patent Document 1). Further, it has been proposed to include an optical interface in the device under test (for example, refer to Patent Document 2).
專利文獻1：日本專利早期公開公報特開2006-220660號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2006-220660
專利文獻2：國際公開第2007-013128號Patent Document 2: International Publication No. 2007-013128
非專利文獻1：Ian A. Young,et al.,“Optical I/O Technology for Tera-Scale Computing”,IEEE Journal of Solid-State Circuits,January 2010,Vol. 45,No. 1,pp.235-248Non-Patent Document 1: Ian A. Young, et al., "Optical I/O Technology for Tera-Scale Computing", IEEE Journal of Solid-State Circuits, January 2010, Vol. 45, No. 1, pp. 235- 248
非專利文獻2：Hiren D. Thacker,James D. Meindl,“Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects”,IEEE International Test Conference,2006,25-1Non-Patent Document 2: Hiren D. Thacker, James D. Meindl, "Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects", IEEE International Test Conference, 2006, 25-1
為了對此種包括光學介面的被測試裝置進行測試，而必需使用光信號作為測試信號來檢測光響應信號。因此，必需包括光通信用的光測定器等，但在此情況下，處理量(throughput)變低而導致測試成本上升。In order to test such a device under test including an optical interface, it is necessary to use an optical signal as a test signal to detect a photo response signal. Therefore, it is necessary to include a photometer for optical communication or the like, but in this case, the throughput is lowered to cause an increase in test cost.
為了解決上述課題，於本發明的第1態樣中，提供一種測試裝置以及測試方法，該測試裝置對被測試裝置進行測試，且包括：測試信號產生部，產生對被測試裝置進行測試的測試信號；電光轉換部，將測試信號轉換為光測試信號；光學介面部，將電光轉換部所轉換的光測試信號傳輸至被測試裝置的光輸入部，並且接收並輸出被測試裝置輸出的光響應信號；光電轉換部，將光學介面部輸出的光響應信號轉換為電信號的響應信號後發送；以及信號接收部，接收光電轉換部發送的響應信號。In order to solve the above problems, in a first aspect of the present invention, a test apparatus and a test method are provided, the test apparatus testing a device under test, and comprising: a test signal generating section that generates a test for testing the device under test a signal; an electro-optical conversion unit that converts the test signal into an optical test signal; an optical interface that transmits the optical test signal converted by the electro-optical conversion unit to the optical input unit of the device under test, and receives and outputs the optical response output by the device under test a signal; a photoelectric conversion unit that converts an optical response signal output from the optical interface into a response signal of the electrical signal; and a signal receiving unit that receives the response signal transmitted by the photoelectric conversion unit.
此外，上述發明的概要並未列舉本發明的所有必要特徵。而且，該些特徵群的次組合(sub combination)亦可成為發明。Further, the summary of the above invention does not recite all of the essential features of the invention. Moreover, the sub combination of these feature groups can also be an invention.
以下，透過發明的實施形態來說明本發明，但以下的實施形態並不限定申請專利範圍所述的發明。而且，實施形態中所說明的特徵的所有組合不限於發明的解決手段所必需者。Hereinafter, the present invention will be described by way of embodiments of the invention, but the following embodiments do not limit the invention described in the claims. Moreover, all combinations of the features described in the embodiments are not limited to those necessary for the solution of the invention.
圖1一併表示本實施形態的測試裝置100的構成例與被測試裝置10。測試裝置100對類比電路、數位電路、記憶體及系統級晶片(System on Chip，SOC)等的具有光學介面的被測試裝置10進行測試。而且，被測試裝置10亦可為將類比電路、數位電路、記憶體及系統級晶片(SOC)等中的至少1個與光學介面組合而成的電路。被測試裝置10分別包括收發光信號的1個以上的光輸入部12及1個以上的光輸出部14。而且，被測試裝置10可包括收發電信號的1個以上的輸入端子16及1個以上的輸出端子18。此處，輸入端子16及輸出端子18可為焊接凸塊、焊點或連接器等。FIG. 1 also shows a configuration example of the test apparatus 100 of the present embodiment and the device under test 10. The test apparatus 100 tests the device under test 10 having an optical interface such as an analog circuit, a digital circuit, a memory, and a system on chip (SOC). Further, the device under test 10 may be a circuit in which at least one of an analog circuit, a digital circuit, a memory, and a system-on-a-chip (SOC) is combined with an optical interface. Each of the devices under test 10 includes one or more light input units 12 that receive light emission signals and one or more light output units 14 . Further, the device under test 10 may include one or more input terminals 16 that transmit and receive electrical signals, and one or more output terminals 18. Here, the input terminal 16 and the output terminal 18 may be solder bumps, solder joints, connectors, or the like.
測試裝置100將對電性測試信號進行電光轉換後的光測試信號供給至被測試裝置10的光輸入部12。而且，測試裝置100接收如下的電性響應信號，並且藉由與期望值進行比較，從而判定被測試裝置10是否優良，上述電性響應信號是接收將自被測試裝置10的光輸出部14輸出的光響應信號後進行光電轉換而成。而且，測試裝置100亦可將測試信號供給至被測試裝置10的輸入端子16，並且接收自被測試裝置10的輸出端子18輸出的響應信號，藉由與期望值進行比較來判定被測試裝置10是否優良。測試裝置100包括測試部110、電光轉換部120、光信號產生部130、波長設定部135、第1光開關部140、裝置介面部150、光電轉換部160、光監測部170及第2光開關部180。The test apparatus 100 supplies an optical test signal that is electrically and optically converted to the electrical test signal to the light input unit 12 of the device under test 10 . Moreover, the test apparatus 100 receives an electrical response signal, and determines whether the device under test 10 is excellent by comparing with a desired value, and the electrical response signal is received from the light output portion 14 of the device under test 10 The photo response signal is photoelectrically converted. Moreover, the test apparatus 100 can also supply the test signal to the input terminal 16 of the device under test 10, and receive the response signal output from the output terminal 18 of the device under test 10, and determine whether the device under test 10 is compared by comparing with the expected value. excellent. The test apparatus 100 includes a test unit 110, an electro-optical conversion unit 120, an optical signal generation unit 130, a wavelength setting unit 135, a first optical switch unit 140, a device interface unit 150, a photoelectric conversion unit 160, a light monitoring unit 170, and a second optical switch. Department 180.
測試部110輸出測試信號並且接收與測試信號相對應的響應信號且與期望值進行比較。作為一例，測試部110自工作站等的外部電腦或記憶裝置等獲取用於測試的測試程式，或者藉由來自用戶的輸入而獲取測試程式，藉由執行該程式而輸出測試信號。而且，測試部110可對用戶顯示比較結果即測試結果，或傳送及記錄於外部電腦或記憶裝置等中。測試部110包含測試信號產生部112、信號接收部114及期望值比較部116。The test section 110 outputs a test signal and receives a response signal corresponding to the test signal and compares it with an expected value. As an example, the test unit 110 acquires a test program for testing from an external computer such as a workstation or a memory device, or acquires a test program by input from a user, and outputs a test signal by executing the program. Moreover, the test unit 110 can display the comparison result, that is, the test result, to the user, or transmit and record it in an external computer or a memory device or the like. The test unit 110 includes a test signal generation unit 112, a signal reception unit 114, and an expectation value comparison unit 116.
測試信號產生部112產生對被測試裝置10進行測試的測試信號。作為一例，測試信號產生部112根據藉由測試程式指定的測試圖案資料、測試順序等而產生測試信號。測試信號產生部112產生用於光信號測試的測試信號。此處，測試信號產生部112可產生用於被測試裝置10的電信號測試的測試信號。作為一例，測試信號產生部112生成被測試裝置10根據測試信號而輸出的響應信號的期望值且發送至期望值比較部116。The test signal generating section 112 generates a test signal for testing the device under test 10. As an example, the test signal generation unit 112 generates a test signal based on the test pattern data, the test sequence, and the like specified by the test program. The test signal generating section 112 generates a test signal for optical signal test. Here, the test signal generating section 112 may generate a test signal for testing the electrical signal of the device under test 10. As an example, the test signal generation unit 112 generates an expected value of the response signal output by the device under test 10 based on the test signal, and transmits it to the expected value comparison unit 116.
信號接收部114接收由被測試裝置輸出的光響應信號轉換而成的電信號。此處，信號接收部114亦可經由裝置介面部150來接收被測試裝置根據測試而輸出的響應信號。信號接收部114將接收信號發送至期望值比較部116。The signal receiving unit 114 receives an electrical signal converted by the optical response signal output from the device under test. Here, the signal receiving unit 114 can also receive the response signal output by the device under test according to the test via the device interface 150. The signal receiving unit 114 transmits the received signal to the expected value comparing unit 116.
期望值比較部116將信號接收部114所接收到的接收信號與期望值進行比較。期望值比較部116自測試信號產生部112接收期望值。測試裝置100可根據期望值比較部116的比較結果來判定被測試裝置10是否優良。The expected value comparison unit 116 compares the received signal received by the signal receiving unit 114 with an expected value. The expectation value comparison unit 116 receives the expected value from the test signal generation unit 112. The test apparatus 100 can determine whether or not the device under test 10 is excellent based on the comparison result of the expected value comparison unit 116.
電光轉換部120將測試信號轉換為光測試信號。作為一例，電光轉換部120使發光二極體(Light Emitting Diode，LED)、雷射等驅動以藉此轉換測試信號為對應的光測試信號。亦可代替該方法，而由電光轉換部120以測試信號來使LED、雷射等的發光調變而轉換為光測試信號。而且，電光轉換部120亦可將經轉換的光測試信號經由光纖或光學波導管等光傳輸路徑而傳輸。The electro-optical conversion section 120 converts the test signal into an optical test signal. As an example, the electro-optical conversion unit 120 drives a light emitting diode (LED), a laser, or the like to thereby convert the test signal into a corresponding optical test signal. Instead of this method, the electro-optical conversion unit 120 may convert the light emission of the LED, the laser, or the like into a light test signal by a test signal. Further, the electro-optical conversion unit 120 may transmit the converted optical test signal via an optical transmission path such as an optical fiber or an optical waveguide.
光信號產生部130產生光信號且以與電光轉換部120不同的路徑發送此光信號至被測試裝置10中。作為一例，光信號產生部130使LED或雷射等成為固定強度的連續光(CW(Continuous Wave)光)而輸出。而且，光信號產生部130所輸出的光亦可為波長可變的可變波長光源。光信號產生部130藉由波長設定部135來控制輸出的光的波長。波長設定部135根據被測試裝置10接收的光信號的波長來設定可變波長光源輸出的光的波長。The optical signal generating section 130 generates an optical signal and transmits the optical signal to the device under test 10 in a different path from the electro-optical conversion section 120. As an example, the optical signal generation unit 130 outputs a continuous light (CW (Continuous Wave) light) having a constant intensity such as an LED or a laser. Further, the light output from the optical signal generating unit 130 may be a variable wavelength light source having a variable wavelength. The optical signal generation unit 130 controls the wavelength of the output light by the wavelength setting unit 135. The wavelength setting unit 135 sets the wavelength of the light output from the variable wavelength light source based on the wavelength of the optical signal received by the device under test 10.
第1光開關部140接收光信號產生部130及電光轉換部120輸出的光信號，選擇其中一方的光信號並輸入至光學介面部152。作為一例，第1光開關部140亦可為波導管型開關，該波導管型開關將由熱、光或電等外部輸入而導致的折射率變化與波導管構造加以組合來切換傳輸路徑。第1光開關部140可為馬赫-任德(Mach-Zehnder)型光開關，即，對2條經分支的光學波導管中的一條光程施加電場等而改變所通過的光信號的相位，之後使該光程再次與另一條光程合波。The first optical switch unit 140 receives the optical signals output from the optical signal generating unit 130 and the electro-optical conversion unit 120, and selects one of the optical signals and inputs the optical signals to the optical interface unit 152. As an example, the first optical switch unit 140 may be a waveguide type switch that switches a transmission path by combining a change in refractive index caused by external input such as heat, light, or electricity with a waveguide structure. The first optical switch unit 140 may be a Mach-Zehnder type optical switch, that is, an electric field is applied to one of the two branched optical waveguides to change the phase of the passed optical signal. The optical path is then combined with another optical path.
亦可取而代之，第1光開關部140藉由電磁致動器等來驅動光纖，將傳輸中的光纖切換為其他應傳輸的光纖。亦可取而代之，第1光開關部140可切換為應該使稜鏡(lens)或反射鏡(mirror)動作以傳輸由透鏡等放大的光束的光傳輸路徑。亦可取而代之，第1光開關部140對在空間上傳播的光束***使用微機電系統(Micro Electro Mechanical Systems，MEMS)技術的微米尺寸的反射鏡或擋閘(shutter)來切換光的傳輸路徑。Alternatively, the first optical switch unit 140 may drive the optical fiber by an electromagnetic actuator or the like, and switch the optical fiber to be transmitted to another optical fiber to be transmitted. Alternatively, the first optical switch unit 140 may be switched to an optical transmission path in which a lens or a mirror should be operated to transmit a light beam amplified by a lens or the like. Alternatively, the first optical switch unit 140 may switch a light transmission path by inserting a micro-sized mirror or a shutter using a micro electro mechanical system (MEMS) technology into a spatially propagating light beam.
裝置介面部150搭載被測試裝置10。作為一例，裝置介面部150吸附固定被測試裝置10。裝置介面部150包含光學介面部152。而且，裝置介面部150於與被測試裝置10收發電信號而執行測試的情況下，可更包括電性介面部156。The device to be tested 150 is mounted on the device interface 150. As an example, the device interface portion 150 adsorbs and fixes the device under test 10. The device interface 150 includes an optical interface 152. Moreover, the device interface portion 150 may further include an electrical interface portion 156 in the case where the test is performed by transmitting and receiving an electrical signal with the device under test 10.
光學介面部152將電光轉換部120轉換的光測試信號傳輸至被測試裝置10的光輸入部，並且接收並輸出被測試裝置10輸出的光響應信號。光學介面部152亦可藉由第1光開關部140的切換而將光信號產生部130產生的光信號傳輸至被測試裝置10的光輸入部。作為一例，光學介面部152使用光傳輸路徑自第1光開關部140接收光信號，且使用光傳輸路徑將光信號輸出至光監測部170。光學介面部152例如包括被測試裝置10所包含的光輸入部12的數目以上的光輸出部154、及被測試裝置10所包含的光輸出部14的數目以上的光輸入部155。The optical interface portion 152 transmits the optical test signal converted by the electro-optical conversion portion 120 to the optical input portion of the device under test 10, and receives and outputs the optical response signal output from the device under test 10. The optical interface 152 can also transmit the optical signal generated by the optical signal generating unit 130 to the optical input unit of the device under test 10 by switching the first optical switch unit 140. As an example, the optical interface portion 152 receives an optical signal from the first optical switch unit 140 using the optical transmission path, and outputs the optical signal to the optical monitoring unit 170 using the optical transmission path. The optical interface portion 152 includes, for example, the light output portion 154 of the number of the light input portions 12 included in the device under test 10 and the light input portion 155 of the number of the light output portions 14 included in the device under test 10 .
光輸出部154將光信號輸出至被測試裝置10。光輸出部154例如藉由透鏡、稜鏡及/或反射鏡等輸出作為於空間上傳播的光束的光信號。亦可取而代之，光輸出部154將光傳輸路徑的輸出端配置於被測試裝置10的光輸入部12附近或與光輸入部12接觸的位置，從而供給光信號。此處，光輸出部154亦可於光傳輸路徑的輸出端具備準直透鏡(collimator lens)。The light output unit 154 outputs an optical signal to the device under test 10. The light output unit 154 outputs an optical signal as a light beam propagating in space, for example, by a lens, a chirp, and/or a mirror. Alternatively, the light output unit 154 may be configured such that the output end of the optical transmission path is disposed in the vicinity of the optical input unit 12 of the device under test 10 or in contact with the optical input unit 12 to supply an optical signal. Here, the light output unit 154 may also include a collimator lens at the output end of the light transmission path.
光輸入部155接收來自被測試裝置10的光響應信號。光輸入部155與光輸出部154同樣地，可藉由透鏡、稜鏡及/或反射鏡等接收光信號，亦可取而代之而將光傳輸路徑的輸入端配置於被測試裝置10的光輸出部14附近或與光輸出部14接觸的位置，從而接收光響應信號。The light input unit 155 receives the light response signal from the device under test 10. Similarly to the light output unit 154, the light input unit 155 can receive an optical signal by a lens, a cymbal and/or a mirror, or alternatively, the input end of the optical transmission path can be disposed in the light output unit of the device under test 10 A position near 14 or in contact with the light output portion 14, thereby receiving a photo response signal.
電性介面部156與被測試裝置10電性連接且收發電信號。電性介面部156接收來自測試信號產生部112的測試信號並供給至被測試裝置10，且接收被測試裝置10根據測試信號而輸出的響應信號並發送至信號接收部114。而且，電性介面部156亦可將頻率比光測試信號低的時脈信號及/或電源等供給至被測試裝置10。電性介面部156例如包括被測試裝置10所包含的輸入端子16的數目以上的輸出端子158、及被測試裝置10所包含的輸出端子18的數目以上的輸入端子159。The electrical interface 156 is electrically connected to the device under test 10 and transmits and receives electrical signals. The electrical interface portion 156 receives the test signal from the test signal generating portion 112 and supplies it to the device under test 10, and receives the response signal output by the device under test 10 according to the test signal and transmits it to the signal receiving portion 114. Further, the electrical interface portion 156 can also supply a clock signal and/or a power source having a lower frequency than the optical test signal to the device under test 10. The electrical interface portion 156 includes, for example, an output terminal 158 having a number or more of the input terminals 16 included in the device under test 10 and an input terminal 159 having the number of output terminals 18 included in the device under test 10 .
輸出端子158可為與輸入端子16直接接觸的端子、探針、懸臂(cantilever)或膜片凸塊等。而且，輸出端子158於輸入端子16為連接器的情況下，可為與輸入端子16嵌合的連接器。輸入端子159與輸出端子158同樣地，可為與輸出端子18直接接觸的端子、探針、懸臂、膜片凸塊或連接器等。The output terminal 158 can be a terminal, a probe, a cantilever or a diaphragm bump or the like that is in direct contact with the input terminal 16. Further, when the input terminal 16 is a connector, the output terminal 158 may be a connector that is fitted to the input terminal 16. Similarly to the output terminal 158, the input terminal 159 may be a terminal, a probe, a cantilever, a diaphragm bump, a connector, or the like that is in direct contact with the output terminal 18.
光電轉換部160將光學介面部152輸出的光響應信號轉換為電信號的響應信號並發送至信號接收部114。作為一例，光電轉換部160藉由光二極體將光響應信號轉化為響應信號。亦可取而代之，光電轉換部160為電荷耦合器件(Charge Coupled Device，CCD)等影像感測器，於此情況下，光電轉換部160可藉由多條光傳輸路徑接收多個光響應信號並轉換為多個響應信號。The photoelectric conversion unit 160 converts the optical response signal output from the optical interface portion 152 into a response signal of the electrical signal and transmits it to the signal receiving unit 114. As an example, the photoelectric conversion unit 160 converts the optical response signal into a response signal by the photodiode. Alternatively, the photoelectric conversion unit 160 is an image sensor such as a charge coupled device (CCD). In this case, the photoelectric conversion unit 160 can receive and convert a plurality of optical response signals through a plurality of optical transmission paths. For multiple response signals.
光監測部170將輸入的光信號轉換為電信號並進行監測。作為一例，光監測部170藉由光二極體將光信號轉換為電信號。亦可取而代之，光監測部170為CCD等影像感測器，於此情況下，光監測部170可藉由多條光傳輸路徑接收多個光信號並轉換為多個電信號。The light monitoring section 170 converts the input optical signal into an electrical signal and monitors it. As an example, the light monitoring unit 170 converts the optical signal into an electrical signal by the optical diode. Alternatively, the light monitoring unit 170 may be an image sensor such as a CCD. In this case, the light monitoring unit 170 may receive a plurality of optical signals by a plurality of optical transmission paths and convert the plurality of optical signals into a plurality of electrical signals.
第2光開關部180使光學介面部152輸出的光響應信號選擇輸入至光監測部170及光電轉換部160中的其中一個。第2光開關部180與第1光開關部140同樣地，可為波導管型式、機械式或MEMS式的光開關。The second optical switch unit 180 selectively inputs the optical response signal output from the optical interface portion 152 to one of the light monitoring unit 170 and the photoelectric conversion unit 160. Similarly to the first optical switch unit 140, the second optical switch unit 180 may be a waveguide type, a mechanical type, or a MEMS type optical switch.
圖2表示本實施形態的測試裝置100的動作流程。測試裝置100將被測試裝置10搭載於裝置介面部150(S200)。測試裝置100例如搭載封裝體、晶圓、或晶片形狀的被測試裝置10。作為一例，測試裝置100將被測試裝置10暫時固定於在至少三方向及旋轉方向上移動的XYZθ平台等上，藉由對XYZθ平台進行位置調整而將被測試裝置10搭載於裝置介面部150。Fig. 2 shows an operational flow of the test apparatus 100 of the present embodiment. The test apparatus 100 mounts the device under test 10 on the device interface portion 150 (S200). The test apparatus 100 is mounted, for example, on a package, a wafer, or a wafer-shaped device under test 10 . As an example, the test apparatus 100 temporarily fixes the device under test 10 on an XYZθ stage or the like that moves in at least three directions and a rotational direction, and mounts the device under test 10 on the device interface portion 150 by positionally adjusting the XYZθ platform.
繼而，測試裝置100對被測試裝置10與裝置介面部150的連接狀態進行確認(S210)。測試裝置100對被測試裝置10的光輸入部12及光輸出部14與光學介面部152的光信號的連接狀態進行確認。於此情況下，第1光開關部140選擇自光信號產生部130輸出的光信號並輸入至光學介面部152，第2光開關部180將自光學介面部152輸出的光響應信號選擇輸入至光監測部170。繼而，測試裝置100根據光監測部170監測的結果來對被測試裝置10與光學介面部152的連接狀態進行檢測，且對應於檢測到連接狀態而開始被測試裝置10的測試。Then, the test apparatus 100 confirms the connection state of the device under test 10 and the device interface portion 150 (S210). The test apparatus 100 confirms the connection state of the optical signals of the optical input unit 12 and the light output unit 14 of the device under test 10 and the optical interface portion 152. In this case, the first optical switch unit 140 selects the optical signal output from the optical signal generating unit 130 and inputs it to the optical interface 152, and the second optical switch unit 180 selectively inputs the optical response signal output from the optical interface 152 to Light monitoring unit 170. Then, the test apparatus 100 detects the connection state of the device under test 10 and the optical interface portion 152 based on the result monitored by the light monitoring section 170, and starts the test of the device under test 10 in response to the detection of the connection state.
為了對被測試裝置10與光學介面部152的連接狀態進行檢測，光信號產生部130可產生預先規定的強度的CW光並供給至被測試裝置10。而且，光監測部170於對預先規定的強度範圍的CW光進行監測時，對被測試裝置10與光學介面部152的連接狀態進行檢測。In order to detect the connection state of the device under test 10 and the optical interface portion 152, the optical signal generation portion 130 can generate CW light of a predetermined intensity and supply it to the device under test 10. Further, when the light monitoring unit 170 monitors the CW light of a predetermined intensity range, the connection state between the device under test 10 and the optical interface portion 152 is detected.
於被測試裝置10包括多個光輸入部12及光輸出部14的情況下，測試裝置100的第1光開關部140中包含將1個光信號產生部130產生的光信號於多條光傳輸路徑上切換的光開關，光學介面部152使多條光傳輸路徑傳輸的光信號分別輸入至多個光輸入部12。亦可取而代之，測試裝置100使多個光信號產生部130產生的光信號分別於多條光傳輸路徑上傳輸，光學介面部152可使多條光傳輸路徑傳輸的光信號分別輸入至多個光輸入部12。When the device under test 10 includes a plurality of optical input units 12 and light output units 14, the first optical switch unit 140 of the test apparatus 100 includes optical signals generated by one optical signal generating unit 130 in multiple optical transmissions. The optical switch that is switched on the path, the optical interface 152 inputs the optical signals transmitted by the plurality of optical transmission paths to the plurality of optical input portions 12, respectively. Alternatively, the test apparatus 100 may cause the optical signals generated by the plurality of optical signal generating sections 130 to be respectively transmitted on the plurality of optical transmission paths, and the optical interface 152 may respectively input the optical signals transmitted by the plurality of optical transmission paths to the plurality of optical inputs. Department 12.
光學介面部152將自多個光輸出部14輸出的光響應信號分別由多條光傳輸路徑接收，並供給至第2光開關部180。第2光開關部180以可由1個光監測部170依序監測多個光響應信號的方式，與第1光開關部140的切換時序同步地選擇切換多條光傳輸路徑與光監測部170。藉此，可藉由1組光信號產生部130及光監測部170來對多個光輸入部12及光輸出部14與光學介面部152的連接進行檢測。The optical interface portion 152 receives the optical response signals output from the plurality of light output portions 14 from the plurality of optical transmission paths, and supplies them to the second optical switch unit 180. The second optical switch unit 180 selectively switches the plurality of optical transmission paths and the optical monitoring unit 170 in synchronization with the switching timing of the first optical switching unit 140 so that the plurality of optical response signals can be sequentially monitored by the one optical monitoring unit 170. Thereby, the connection between the plurality of optical input sections 12 and the light output section 14 and the optical interface portion 152 can be detected by the one optical signal generation unit 130 and the optical monitoring unit 170.
亦可取而代之，測試裝置100包括多個光監測部170，並且藉由比第2光開關部180少的切換次數或不進行切換來對光輸入部12及光輸出部14與光學介面部152的連接進行檢測。亦可取而代之，測試裝置100包括多個光監測部170及多個光信號產生部130，並且藉由比第1光開關部140及第2光開關部180少的切換次數或不進行切換來對多個光輸入部12及光輸出部14與光學介面部152的連接進行檢測。Alternatively, the test apparatus 100 may include a plurality of light monitoring units 170, and the light input unit 12 and the light output unit 14 may be connected to the optical interface portion 152 by a smaller number of switching times than the second optical switch unit 180 or without switching. Test. Alternatively, the test apparatus 100 includes a plurality of light monitoring units 170 and a plurality of light signal generating units 130, and is controlled by a smaller number of switching times than the first optical switch unit 140 and the second optical switch unit 180. The connection between the light input unit 12 and the light output unit 14 and the optical interface portion 152 is detected.
而且，測試裝置100可將1個以上的光信號產生部130產生的光信號分支為多條光傳輸路徑而輸入。於此情況下，測試裝置100可藉由與光響應信號的數目相同的光監測部170來分別對光學介面部152輸出的多個光響應信號進行監測。藉此，測試裝置100可同時對多個光輸入部12及光輸出部14與光學介面部152的連接進行檢測。測試裝置100於無法檢測到被測試裝置10與光學介面部152的連接狀態的情況下，返回至步驟S200而重新搭載被測試裝置10。Further, the test apparatus 100 can branch and input the optical signal generated by one or more optical signal generation units 130 into a plurality of optical transmission paths. In this case, the test apparatus 100 can separately monitor the plurality of optical response signals output from the optical interface portion 152 by the light monitoring portion 170 having the same number of photo response signals. Thereby, the test apparatus 100 can simultaneously detect the connection of the plurality of light input sections 12 and the light output section 14 with the optical interface portion 152. When the test device 100 cannot detect the connection state between the device under test 10 and the optical interface portion 152, the test device 100 returns to step S200 to re-load the device under test 10 .
此處，於測試裝置100即便重複進行被測試裝置10的搭載亦無法檢測到連接狀態的情況下，可判斷被測試裝置10為不良。例如，於測試裝置100即便重複預先規定的次數來搭載被測試裝置10亦無法檢測到連接狀態的情況下，判斷被測試裝置10的光輸入部12及/或光輸出部14為不良。Here, when the test apparatus 100 cannot detect the connection state even if the apparatus to be tested 10 is repeatedly mounted, it can be determined that the device under test 10 is defective. For example, when the test apparatus 100 does not detect the connection state by repeating the predetermined number of times and the test device 10 is mounted, it is determined that the light input unit 12 and/or the light output unit 14 of the device under test 10 are defective.
而且，測試裝置100亦可對包含於被測試裝置10內部的光學零件的通過特性進行檢測。被測試裝置10於根據自光輸入部12輸入的光的波長在被測試裝置10內部進行分波或合波等的情況下，在內部包括波分複用(Wavelength Division Multiplexing，WDM)合波分波器、濾光器等光學零件。測試裝置100藉由波長設定部135使光信號產生部130產生的光信號的波長發生變化，並供給至光輸入部12，並且接收來自光輸出部14的光響應信號，並由光監測部170來對光響應信號進行監測。藉此，測試裝置100可針對被測試裝置10的光響應信號來對輸入光信號的波長依存性進行監測，並且可對包含於被測試裝置10內部的光學零件的通過特性進行檢測。Moreover, the test apparatus 100 can also detect the passing characteristics of the optical components included in the inside of the device under test 10. When the device under test 10 performs demultiplexing or multiplexing on the inside of the device under test 10 based on the wavelength of light input from the optical input unit 12, Wavelength Division Multiplexing (WDM) combining is included therein. Optical components such as filters and filters. The test apparatus 100 changes the wavelength of the optical signal generated by the optical signal generation unit 130 by the wavelength setting unit 135, supplies it to the optical input unit 12, and receives the optical response signal from the optical output unit 14, and the optical monitoring unit 170 To monitor the optical response signal. Thereby, the test apparatus 100 can monitor the wavelength dependence of the input optical signal for the optical response signal of the device under test 10, and can detect the passing characteristics of the optical components included in the inside of the device under test 10.
測試裝置100於對被測試裝置10與光學介面部152的連接狀態進行檢測的情況下，對被測試裝置10與電性介面部156的電信號的連接狀態進行檢測。測試裝置100自測試信號產生部112將預先規定的電信號即例如預先規定的Hi/Lo等邏輯值或圖案的電信號經由輸出端子158而供給至輸入端子16。繼而，測試裝置100中信號接收部114經由輸入端子159而接收自輸出端子18輸出的響應信號，並對電信號的連接狀態進行檢測。When the test apparatus 100 detects the connection state of the device under test 10 and the optical interface portion 152, the test device 100 detects the connection state of the electrical signals of the device under test 10 and the electrical interface portion 156. The test apparatus 100 supplies the electric signal of a predetermined predetermined electric signal, for example, a predetermined logical value or pattern such as Hi/Lo, to the input terminal 16 via the output terminal 158. Then, the signal receiving unit 114 in the test apparatus 100 receives the response signal output from the output terminal 18 via the input terminal 159, and detects the connection state of the electrical signal.
測試裝置100例如自測試信號產生部112供給固定電壓來作為預先規定的電信號，信號接收部114藉由接收預先規定的範圍的電壓值而對連接狀態進行檢測。測試裝置100可根據檢測到被測試裝置10與電性介面部156的連接狀態而判斷為被測試裝置10與裝置介面部150可正常連接。於測試裝置100無法檢測到被測試裝置10與電性介面部156的連接狀態的情況下，返回至步驟S200而重新搭載被測試裝置10。The test apparatus 100 supplies a fixed voltage from the test signal generation unit 112 as a predetermined electric signal, for example, and the signal reception unit 114 detects the connection state by receiving a voltage value of a predetermined range. The test apparatus 100 can determine that the device under test 10 and the device interface portion 150 can be normally connected according to the detected connection state of the device under test 10 and the electrical interface portion 156. When the test apparatus 100 cannot detect the connection state of the device under test 10 and the electrical interface portion 156, the process returns to step S200 to re-install the device under test 10 .
此處，於測試裝置100即便重複搭載被測試裝置10亦無法檢測到連接狀態的情況下，可判斷被測試裝置10為不良。例如，於測試裝置100即便重複預先規定的次數而搭載被測試裝置10亦無法檢測到連接狀態的情況下，判斷被測試裝置10的輸入端子16及/或輸出端子18為不良。Here, when the test apparatus 100 cannot detect the connected state even if the device under test 10 is repeatedly mounted, it can be determined that the device under test 10 is defective. For example, when the test apparatus 100 does not detect the connection state even if the test apparatus 10 is mounted a predetermined number of times, it is determined that the input terminal 16 and/or the output terminal 18 of the device under test 10 are defective.
測試裝置100若檢測到被測試裝置10與裝置介面部150為正常連接，則開始進行被測試裝置10的測試。測試裝置100判斷應執行的測試是光測試或是電信號的測試(S220)。測試裝置100例如根據測試程式、測試順序或控制指令等來判別應執行的測試是否為光測試。When the test apparatus 100 detects that the device under test 10 and the device interface portion 150 are normally connected, the test device 100 starts the test of the device under test 10. The test apparatus 100 determines whether the test to be performed is a light test or an electrical signal test (S220). The test apparatus 100 determines whether the test to be performed is a light test, for example, based on a test program, a test sequence, a control command, or the like.
測試裝置100於應執行的測試為電信號的測試的情況下，將由測試信號產生部112產生的測試信號經由輸出端子158而供給至輸入端子16(S230)。此處，測試信號產生部112將與所供給的測試信號相對應的期望值發送至期望值比較部116。測試裝置100將被測試裝置10根據所供給的測試信號而自輸出端子18輸出的響應信號經由輸入端子159而由信號接收部114接收(S240)。信號接收部114將接收到的響應信號發送至期望值比較部116，期望值比較部116將自信號接收部114接收的響應信號與自測試信號產生部112接收的期望值進行比較，從而判定被測試裝置10是否優良(S250)。When the test to be executed is the test of the electric signal, the test device 100 supplies the test signal generated by the test signal generating portion 112 to the input terminal 16 via the output terminal 158 (S230). Here, the test signal generation section 112 transmits the expected value corresponding to the supplied test signal to the expected value comparison section 116. The test apparatus 100 receives the response signal output from the output terminal 18 by the device under test 10 based on the supplied test signal via the input terminal 159 by the signal receiving section 114 (S240). The signal receiving unit 114 transmits the received response signal to the expected value comparing unit 116, and the expected value comparing unit 116 compares the response signal received from the signal receiving unit 114 with the expected value received from the test signal generating unit 112, thereby determining the device under test 10 Whether it is excellent (S250).
測試裝置100於應執行的測試為光測試的情況下，分別藉由第1光開關部140來連接電光轉換部120與光學介面部152，藉由第2光開關部180來連接光學介面部152與光電轉換部160。繼而，測試裝置100將由測試信號產生部112產生的測試信號經由電光轉換部120而轉換為光測試信號，並供給至光輸入部12(S260)。此處，測試信號產生部112將與所供給的測試信號相對應的期望值發送至期望值比較部116。When the test to be performed is the optical test, the test apparatus 100 connects the electro-optical conversion unit 120 and the optical interface portion 152 by the first optical switch unit 140, and connects the optical interface portion 152 via the second optical switch unit 180. And the photoelectric conversion unit 160. Then, the test apparatus 100 converts the test signal generated by the test signal generation unit 112 into an optical test signal via the electro-optical conversion unit 120, and supplies it to the optical input unit 12 (S260). Here, the test signal generation section 112 transmits the expected value corresponding to the supplied test signal to the expected value comparison section 116.
測試裝置100將被測試裝置10根據所供給的光測試信號而自光輸出部14輸出的光響應信號經由光電轉換部160轉換為作為電信號的響應信號，並由信號接收部114接收(S270)。信號接收部114將接收到的響應信號發送至期望值比較部116，期望值比較部116將自信號接收部114接收的響應信號與自測試信號產生部112接收的期望值進行比較，從而判定被測試裝置10是否優良(S250)。The test apparatus 100 converts the optical response signal output from the light output unit 14 by the device under test 10 based on the supplied optical test signal into a response signal as an electrical signal via the photoelectric conversion unit 160, and receives it by the signal receiving unit 114 (S270). . The signal receiving unit 114 transmits the received response signal to the expected value comparing unit 116, and the expected value comparing unit 116 compares the response signal received from the signal receiving unit 114 with the expected value received from the test signal generating unit 112, thereby determining the device under test 10 Whether it is excellent (S250).
測試裝置100重複進行步驟S220至步驟S250直至應執行的測試結束為止(S280)。藉此，測試裝置100可執行藉由被測試裝置10的光測試信號而進行的光測試。而且，測試裝置100可執行藉由被測試裝置10的光測試信號而進行的光測試與藉由電信號而進行的測試混合存在的測試。而且，測試裝置100可獨立執行光信號的收發與電信號的收發，因此於對於光測試信號的響應信號輸出的是電信號及光信號此兩者的情況下，可分別獨立地接收。測試裝置100於輸出的對於電性測試信號的響應信號為電信號及光信號此兩者的情況下，亦可同樣地獨立地接收。而且，於被測試裝置10自測試裝置100以外的裝置供給電信號或無需供給電信號的情況下，測試裝置100亦可僅執行被測試裝置10與光學介面部152的連接並進行光測試。The test apparatus 100 repeats steps S220 to S250 until the end of the test to be executed (S280). Thereby, the test apparatus 100 can perform a light test by the optical test signal of the device under test 10. Moreover, the test apparatus 100 can perform a test in which a light test by the optical test signal of the device under test 10 and a test performed by an electrical signal are mixed. Further, the test apparatus 100 can independently perform transmission and reception of an optical signal and transmission and reception of an electric signal. Therefore, in the case where both the electrical signal and the optical signal are outputted to the response signal to the optical test signal, they can be independently received. When the response signal to the electrical test signal outputted by the test apparatus 100 is both an electrical signal and an optical signal, the test apparatus 100 can also receive the same independently. Further, in a case where the device under test 10 supplies an electric signal from a device other than the test device 100 or does not need to supply an electric signal, the test device 100 may perform only the connection between the device under test 10 and the optical interface portion 152 and perform optical test.
而且，測試裝置100可將高速的測試信號及/或響應信號作為光信號來傳輸，將低速的時脈信號、測試信號、響應信號及/或電源等作為電信號來傳輸，從而執行被測試裝置10的測試。藉此，藉由使電信號中難以傳輸的例如數百MHz以上的高頻信號作為光信號來傳輸，從而可與被測試裝置10之間高速地收發測試信號及響應信號。而且，測試裝置100例如亦能夠以實際的動作速度來使被測試裝置10動作而實施測試。Moreover, the test apparatus 100 can transmit the high-speed test signal and/or the response signal as an optical signal, and transmit the low-speed clock signal, the test signal, the response signal, and/or the power source as an electrical signal, thereby executing the device under test. 10 tests. Thereby, a high-frequency signal of, for example, several hundred MHz or more which is difficult to transmit in an electric signal is transmitted as an optical signal, whereby the test signal and the response signal can be transmitted and received at high speed with the device under test 10. Further, the test apparatus 100 can also perform the test by operating the device under test 10 at an actual operating speed.
而且，測試裝置100藉由包括至少2個光開關部、光信號產生部130及光監測部170而可對被測試裝置10與光學介面部152的連接狀態進行檢測。如此，測試裝置100可高速進行測試動作並且可檢測與被測試裝置10的連接狀態，因而可提高測試的處理量。Further, the test apparatus 100 can detect the connection state of the device under test 10 and the optical interface portion 152 by including at least two optical switch portions, the optical signal generation portion 130, and the light monitoring portion 170. As such, the test apparatus 100 can perform the test action at a high speed and can detect the connection state with the device under test 10, thereby increasing the throughput of the test.
圖3表示本實施形態的測試裝置100的動作流程的變形例。本變形例對與圖2所示的本實施形態的測試裝置100的動作流程大致相同的部分附加相同的符號並省略說明。本變形例執行的是與如下兩種情況相對應的測試，即，被測試裝置10根據輸入的光信號而輸出電信號的情況或根據輸入的電信號而輸出光響應信號的情況。FIG. 3 shows a modification of the operational flow of the test apparatus 100 of the present embodiment. In the present modification, the same portions as those of the test apparatus 100 of the present embodiment shown in FIG. 2 are denoted by the same reference numerals, and their description is omitted. The present modification performs a test corresponding to two cases, that is, a case where the device under test 10 outputs an electric signal based on an input optical signal or a case where a photo response signal is output according to the input electric signal.
測試裝置100若於步驟210中檢測到被測試裝置10與裝置介面部150為正常連接，則開始測試被測試裝置10。測試裝置100判別是使用電信號的測試信號還是使用光測試信號(S220)。測試裝置100於使用電信號的測試信號的情況下，將由測試信號產生部112產生的測試信號經由輸出端子158供給至輸入端子16(S230)。此處，測試信號產生部112將與所供給的測試信號相對應的期望值發送至期望值比較部116。If the test device 100 detects that the device under test 10 and the device interface portion 150 are normally connected in step 210, the test device 10 starts testing the device under test 10 . The test apparatus 100 discriminates whether the test signal using the electric signal or the optical test signal is used (S220). In the case where the test signal of the electric signal is used, the test apparatus 100 supplies the test signal generated by the test signal generating section 112 to the input terminal 16 via the output terminal 158 (S230). Here, the test signal generation section 112 transmits the expected value corresponding to the supplied test signal to the expected value comparison section 116.
繼而，測試裝置100判別被測試裝置10根據測試信號是輸出作為電信號的響應信號還是輸出光響應信號(S310)。測試裝置100例如根據測試程式、測試順序或控制指令等判別根據測試信號是輸出響應信號還是輸出光響應信號。亦可取而代之，測試裝置100預先規定根據測試信號是輸出響應信號還是輸出光響應信號。Then, the test apparatus 100 discriminates whether the device under test 10 outputs a response signal as an electric signal or an output photo response signal according to the test signal (S310). The test apparatus 100 determines whether the test signal is an output response signal or an output photo response signal, for example, based on a test program, a test sequence, or a control command. Alternatively, the test apparatus 100 predetermines whether the test signal is an output response signal or an output photo response signal.
測試裝置100於被測試裝置10輸出作為電信號的響應信號的情況下，與圖2的示例相同，將自輸出端子18輸出的響應信號經由輸入端子159而由信號接收部114接收(S240)。信號接收部114將接收到的響應信號發送至期望值比較部116，期望值比較部116將自信號接收部114接收的響應信號與自測試信號產生部112接收的期望值進行比較，從而判定被測試裝置10是否優良(S250)。When the test apparatus 100 outputs a response signal as an electric signal to the device under test 10, the response signal output from the output terminal 18 is received by the signal receiving unit 114 via the input terminal 159 as in the example of FIG. 2 (S240). The signal receiving unit 114 transmits the received response signal to the expected value comparing unit 116, and the expected value comparing unit 116 compares the response signal received from the signal receiving unit 114 with the expected value received from the test signal generating unit 112, thereby determining the device under test 10 Whether it is excellent (S250).
另一方面，測試裝置100於被測試裝置10輸出光響應信號的情況下，將自光輸出部14輸出的光響應信號經由光電轉換部160而轉換為作為電信號的響應信號並由信號接收部114接收(S270)。信號接收部114將接收到的響應信號發送至期望值比較部116，期望值比較部116將自信號接收部114接收的響應信號與自測試信號產生部112接收的期望值進行比較，從而判定被測試裝置10是否優良(S250)。On the other hand, when the device under test 10 outputs a photo response signal, the test device 100 converts the photo response signal output from the light output unit 14 into a response signal as an electric signal via the photoelectric conversion unit 160, and the signal receiving unit 114 receives (S270). The signal receiving unit 114 transmits the received response signal to the expected value comparing unit 116, and the expected value comparing unit 116 compares the response signal received from the signal receiving unit 114 with the expected value received from the test signal generating unit 112, thereby determining the device under test 10 Whether it is excellent (S250).
而且，測試裝置100於使用光測試信號的情況下，將由測試信號產生部112產生的測試信號經由電光轉換部120轉換為光測試信號並供給至光輸入部12(S260)。此處，測試信號產生部112將與所供給的測試信號相對應的期望值發送至期望值比較部116。Further, when the optical test signal is used, the test apparatus 100 converts the test signal generated by the test signal generating unit 112 into an optical test signal via the electro-optical conversion unit 120 and supplies it to the optical input unit 12 (S260). Here, the test signal generation section 112 transmits the expected value corresponding to the supplied test signal to the expected value comparison section 116.
繼而，測試裝置100判別被測試裝置10根據光測試信號是輸出作為電信號的響應信號還是輸出光響應信號(S320)。測試裝置100例如根據測試程式、測試順序或控制指令等來判別根據光測試信號是輸出響應信號還是輸出光響應信號。亦可取而代之，測試裝置100預先規定根據光測試信號是輸出響應信號還是輸出光響應信號。Then, the test apparatus 100 discriminates whether the device under test 10 outputs a response signal as an electric signal or an output photo response signal according to the optical test signal (S320). The test apparatus 100 determines whether the optical test signal is an output response signal or an output photo response signal, for example, based on a test program, a test sequence, a control command, or the like. Alternatively, the test apparatus 100 predetermines whether the optical test signal is an output response signal or an output photo response signal.
測試裝置100於被測試裝置10輸出光響應信號的情況下，與圖2的示例相同，將自光輸出部14輸出的光響應信號經由光電轉換部160而轉換為作為電信號的響應信號並由信號接收部114接收(S270)。信號接收部114將接收到的響應信號發送至期望值比較部116，期望值比較部116將自信號接收部114接收的響應信號與自測試信號產生部112接收的期望值進行比較，從而判定被測試裝置10是否優良(S250)。In the case where the test apparatus 100 outputs a photo response signal, the photo response signal output from the light output unit 14 is converted into a response signal as an electric signal via the photoelectric conversion unit 160, as in the example of FIG. The signal receiving unit 114 receives (S270). The signal receiving unit 114 transmits the received response signal to the expected value comparing unit 116, and the expected value comparing unit 116 compares the response signal received from the signal receiving unit 114 with the expected value received from the test signal generating unit 112, thereby determining the device under test 10 Whether it is excellent (S250).
另一方面，測試裝置100於被測試裝置10輸出作為電信號的響應信號的情況下，將自輸出端子18輸出的響應信號經由輸入端子159而由信號接收部114接收(S240)。信號接收部114將接收到的響應信號發送至期望值比較部116，期望值比較部116將自信號接收部114接收的響應信號與自測試信號產生部112接收的期望值進行比較，從而判定被測試裝置10是否優良(S250)。On the other hand, when the test apparatus 100 outputs a response signal as an electric signal, the test apparatus 100 receives the response signal output from the output terminal 18 via the input terminal 159 via the signal receiving unit 114 (S240). The signal receiving unit 114 transmits the received response signal to the expected value comparing unit 116, and the expected value comparing unit 116 compares the response signal received from the signal receiving unit 114 with the expected value received from the test signal generating unit 112, thereby determining the device under test 10 Whether it is excellent (S250).
根據以上本變形例的測試裝置100，可執行與被測試裝置10根據所輸入的光信號而輸出電信號的情況或根據所輸入的電信號而輸出光響應信號的情況相對應的測試。而且，可對具備光輸入部12但不具備光輸出部14的被測試裝置10或具備光輸出部14但不具備光輸入部12的被測試裝置10等執行測試。According to the test apparatus 100 of the above modification, the test corresponding to the case where the device under test 10 outputs an electric signal based on the input optical signal or the case where the optical response signal is output based on the input electric signal can be performed. Further, the test device 10 including the light input unit 12 but not including the light output unit 14 or the device under test 10 including the light output unit 14 but not including the light input unit 12 can be tested.
圖4一併表示本實施形態的測試裝置100的第1變形例與被測試裝置10。本變形例對與圖1所示的本實施形態的測試裝置100大致相同的部分附加相同的符號並省略說明。本變形例的測試裝置100執行被測試裝置10的光回送測試。本變形例的測試裝置100包括回送光程部410。FIG. 4 also shows a first modification of the test apparatus 100 of the present embodiment and the device under test 10. In the present modification, the same portions as those of the test apparatus 100 of the embodiment shown in FIG. 1 are denoted by the same reference numerals, and their description is omitted. The test apparatus 100 of the present modification executes the optical loopback test of the device under test 10. The test apparatus 100 of the present modification includes a return optical path portion 410.
回送光程部410將來自被測試裝置10的光響應信號回送至被測試裝置10。作為一例，回送光程部410於光纖或光學波導管等光傳輸路徑上連接被測試裝置10的光輸出部14與光輸入部12。回送光程部410包含與測試項目相應的裝置。The loopback optical path section 410 returns a photo response signal from the device under test 10 to the device under test 10. As an example, the return optical path unit 410 connects the light output unit 14 of the device under test 10 and the light input unit 12 to an optical transmission path such as an optical fiber or an optical waveguide. The loopback optical path section 410 includes means corresponding to the test item.
作為一例，回送光程部410包含對所通過的光信號的相位時序進行控制的相位控制部。相位控制部可為藉由對強介電質結晶等電性光學結晶施加電場而使折射率變化，從而對所傳輸的光的相位進行控制的光相位調變器。亦可取而代之，相位控制部為藉由對馬赫-任德型波導管施加電場而對所傳輸的光的相位進行控制的光相位調變器。亦可取而代之，相位控制部是為對使光信號傳輸的光纖施加物理力而使纖維長度發生變化，從而對所傳輸的光的相位進行控制的光相位調變器。As an example, the loopback optical path unit 410 includes a phase control unit that controls the phase timing of the passed optical signal. The phase control unit may be an optical phase modulator that controls the phase of the transmitted light by applying an electric field to an electric optical crystal such as a ferroelectric crystal to change the refractive index. Alternatively, the phase control unit may be an optical phase modulator that controls the phase of the transmitted light by applying an electric field to the Mach-Rende type waveguide. Alternatively, the phase control unit may be an optical phase modulator that controls the phase of the transmitted light by applying a physical force to the optical fiber that transmits the optical signal to change the fiber length.
相位控制部藉由改變所通過的光信號的相位時序而可對回送輸入至被測試裝置10的光信號的偏移(skew)進行控制。即，測試裝置100藉由在回送光程部410中包含相位控制部而可執行被測試裝置10的偏移耐力測試等。而且，相位控制部藉由改變所通過的光信號的相位時序而可對回送輸入至被測試裝置10的光信號的抖動(jitter)進行控制。即，測試裝置100藉由在回送光程部410中包含相位控制部而可執行被測試裝置10的抖動耐力測試等。The phase control unit can control the skew of the optical signal input to the device under test 10 by changing the phase timing of the passed optical signal. That is, the test apparatus 100 can perform the offset endurance test or the like of the device under test 10 by including the phase control unit in the loopback optical path unit 410. Further, the phase control unit can control the jitter of the optical signal input to the device under test 10 by changing the phase timing of the passed optical signal. In other words, the test apparatus 100 can perform the jitter endurance test or the like of the device under test 10 by including the phase control unit in the loopback optical path unit 410.
而且，作為一例，回送光程部410包含使所通過的光信號的強度衰減的衰減部。衰減部較理想為可對衰減量進行控制的可變衰減器(attenuator)。衰減部藉由改變所通過的光信號的衰減量而可對回送輸入至被測試裝置10的光信號的強度進行控制。即，測試裝置100藉由在回送光程部410中包含衰減部而可執行被測試裝置10的光強度的衰減耐力測試等。此處，藉由測試裝置100與被測試裝置10的偏移耐力測試進行組合而可執行光測試中的修摩(shmoo)特性。Further, as an example, the return optical path unit 410 includes an attenuation unit that attenuates the intensity of the passed optical signal. The attenuation portion is preferably a variable attenuator that can control the amount of attenuation. The attenuation unit can control the intensity of the optical signal input to the device under test 10 by changing the amount of attenuation of the passed optical signal. That is, the test apparatus 100 can perform the attenuation endurance test or the like of the light intensity of the device under test 10 by including the attenuation portion in the return optical path portion 410. Here, the shmoo characteristic in the light test can be performed by combining the test device 100 with the offset endurance test of the device under test 10.
而且，回送光程部410可為將被測試裝置10的光輸出部14與光輸入部12加以連接的光傳輸路徑。於此情況下，測試裝置100藉由被測試裝置10產生偽隨機位序列信號(Pseudorandom Binary(Bit)Sequence，PRBS)而可對被測試裝置10的測試容易化設計(Design For Test，DFT)功能進行測試。Further, the return optical path portion 410 may be an optical transmission path that connects the light output portion 14 of the device under test 10 and the optical input portion 12. In this case, the test apparatus 100 can generate a Design For Test (DFT) function for the device under test 10 by generating a pseudo random bit sequence signal (Pseudorandom Binary (Bit) Sequence, PRBS) by the device under test 10 . carry out testing.
第1光開關部140接收回送光程部410及光信號產生部130輸出的光信號，並選擇其中一個光信號而輸出至光學介面部152。第2光開關部180將自光學介面部152輸入的光信號選擇輸入至回送光程部410及光監測部170中的其中一個。The first optical switch unit 140 receives the optical signals output from the optical path unit 410 and the optical signal generating unit 130, and selects one of the optical signals to output to the optical interface 152. The second optical switch unit 180 selectively inputs the optical signal input from the optical interface portion 152 to one of the return optical path portion 410 and the light monitoring portion 170.
圖5表示本實施形態的測試裝置100的第1變形例的動作流程。本變形例的動作流程對與圖2所示的本實施形態的測試裝置100的動作流程大致相同的部分附加相同的符號並省略說明。Fig. 5 is a flowchart showing the operation of the first modification of the test apparatus 100 of the embodiment. The operation flowchart of the present modification is substantially the same as the operation of the test apparatus 100 of the embodiment shown in FIG. 2, and the description thereof will be omitted.
測試裝置100若於步驟210中檢測到被測試裝置10與裝置介面部150為正常連接，則開始進行被測試裝置10的測試。測試裝置100判別是執行光回送測試還是執行電信號的測試(S510)。於測試裝置100執行電信號的測試的情況下，與圖2的步驟S230至步驟S250同樣地，將測試信號供給至被測試裝置10，並且接收被測試裝置10根據測試信號而輸出的響應信號，與期望值進行比較而判定被測試裝置10是否優良。When the test device 100 detects that the device under test 10 and the device interface portion 150 are normally connected in step 210, the test device 100 starts the test of the device under test 10. The test apparatus 100 discriminates whether it is performing an optical loopback test or a test of performing an electrical signal (S510). In the case where the test apparatus 100 performs the test of the electric signal, the test signal is supplied to the device under test 10, and the response signal output by the device under test 10 according to the test signal is received, similarly to steps S230 to S250 of FIG. 2, Whether or not the device under test 10 is excellent is determined by comparison with an expected value.
於測試裝置100執行光回送測試的情況下，切換第1光開關部140將回送光程部410輸出的光信號輸出至光學介面部152，並且切換第2光開關部180而使來自光學介面部152的光響應信號輸入至回送光程部410。測試裝置100將由測試信號產生部112產生的測試信號經由輸出端子158而供給至輸入端子16(S520)。When the test apparatus 100 performs the optical return test, the first optical switch unit 140 switches the optical signal output from the return optical path unit 410 to the optical interface portion 152, and switches the second optical switch unit 180 to bring the optical interface from the optical interface. The photo response signal of 152 is input to the return optical path portion 410. The test apparatus 100 supplies the test signal generated by the test signal generation section 112 to the input terminal 16 via the output terminal 158 (S520).
此處，測試信號產生部112產生的測試信號例如是使被測試裝置10開始回送測試的控制指令及/或用於光回送測試的測試圖案。而且，測試信號產生部112將與開始的光回送測試相對應的期望值發送至期望值比較部116。被測試裝置10對應於自測試裝置100的輸入端子16接收到測試信號而開始光回送測試，並且將測試結果作為響應信號而自輸出端子18輸出。Here, the test signal generated by the test signal generating portion 112 is, for example, a control command for causing the device under test 10 to return a test and/or a test pattern for an optical return test. Moreover, the test signal generation section 112 transmits the expected value corresponding to the start optical return test to the expected value comparison section 116. The device under test 10 starts the optical return test in response to receiving the test signal from the input terminal 16 of the test device 100, and outputs the test result as a response signal from the output terminal 18.
測試裝置100將被測試裝置10自輸出端子18輸出的響應信號經由輸入端子159而由信號接收部114接收(S530)。信號接收部114將接收到的響應信號發送至期望值比較部116，期望值比較部116將自信號接收部114接收的響應信號與自測試信號產生部112接收的期望值進行比較，從而判定被測試裝置10是否優良(S250)。測試裝置100重複進行步驟S510至步驟S250直至應執行的測試結束為止(S280)。藉此，測試裝置100可執行被測試裝置10的光回送測試。The test apparatus 100 receives the response signal output from the output terminal 18 by the device under test 10 via the input terminal 159 by the signal receiving unit 114 (S530). The signal receiving unit 114 transmits the received response signal to the expected value comparing unit 116, and the expected value comparing unit 116 compares the response signal received from the signal receiving unit 114 with the expected value received from the test signal generating unit 112, thereby determining the device under test 10 Whether it is excellent (S250). The test apparatus 100 repeats steps S510 to S250 until the end of the test to be executed (S280). Thereby, the test apparatus 100 can perform the optical loopback test of the device under test 10.
於以上變形例中，已說明測試裝置100將被測試裝置10的光回送測試的開始及響應信號藉由電信號收發的示例。亦可取而代之，例如在被測試裝置10包括控制信號的光輸入部及/或光響應信號的光輸出部的情況下，測試裝置100將光回送測試的開始及/或光響應信號以光信號進行收發。例如，被測試裝置10更包括1組光信號產生部130及光監測部170，將光回送測試的開始等以光信號供給至被測試裝置10的控制信號的光輸入部，並且接收光響應信號。In the above modification, the example in which the test apparatus 100 transmits and receives the start of the optical return test of the device under test 10 and the response signal is transmitted and received by an electric signal has been described. Alternatively, for example, in the case where the device under test 10 includes a light input portion of a control signal and/or a light output portion of a light response signal, the test device 100 performs the optical return test start and/or the optical response signal as an optical signal. Send and receive. For example, the device under test 10 further includes a set of the optical signal generating unit 130 and the light monitoring unit 170, and supplies the optical signal to the optical input unit of the control signal of the device under test 10 such as the start of the optical return test, and receives the optical response signal. .
於此情況下，與被測試裝置10的控制信號的光輸入部連接的光信號產生部130除了產生用於被測試裝置10與光學介面部152的連接檢測的光信號以外，亦產生包含光回送測試的開始等的光控制信號。而且，與被測試裝置10的光響應信號的光輸出部連接的光監測部170除了進行被測試裝置10與光學介面部152的連接檢測以外，亦對光響應信號進行監測。藉此，測試裝置100可藉由光控制信號執行被測試裝置10的光回送測試。In this case, the optical signal generating unit 130 connected to the optical input unit of the control signal of the device under test 10 generates optical echoes in addition to the optical signals for detecting the connection between the device under test 10 and the optical interface 152. A light control signal such as the start of the test. Further, the light monitoring unit 170 connected to the light output portion of the optical response signal of the device under test 10 monitors the optical response signal in addition to the connection detection between the device under test 10 and the optical interface portion 152. Thereby, the test apparatus 100 can perform the optical loopback test of the device under test 10 by the light control signal.
圖6一併表示本實施形態的測試裝置100的第2變形例與被測試裝置10。本變形例對與圖1所示的本實施形態的測試裝置100及圖4所示的測試裝置100的第1變形例大致相同的部分附加相同的符號並省略說明。本變形例的測試裝置100執行透過被測試裝置10的電信號的測試、光測試及光回送測試。Fig. 6 also shows a second modification of the test apparatus 100 of the present embodiment and the device under test 10. In the present modification, the same portions as those in the first modification of the test device 100 of the present embodiment shown in FIG. 1 and the test device 100 shown in FIG. 4 are denoted by the same reference numerals, and the description thereof will not be repeated. The test apparatus 100 of the present modification performs a test of an electrical signal transmitted through the device under test 10, an optical test, and an optical return test.
第1光開關部140接收光信號產生部130、回送光程部410及電光轉換部120輸出的光信號，選擇其中任一個光信號並輸入至光學介面部152。第2光開關部180將來自光學介面部152的光響應信號選擇輸入至光監測部170、回送光程部410及光電轉換部160中的任一個。The first optical switch unit 140 receives the optical signals output from the optical signal generating unit 130, the return optical path unit 410, and the electro-optical conversion unit 120, and selects one of the optical signals to be input to the optical interface 152. The second optical switch unit 180 selectively inputs the optical response signal from the optical interface portion 152 to any one of the light monitoring unit 170, the return optical path unit 410, and the photoelectric conversion unit 160.
於測試裝置100對被測試裝置10與光學介面部152的連接進行檢測的情況下，切換第1光開關部140而使光信號產生部130輸出的光信號輸入至光學介面部152。而且，測試裝置100切換第2光開關部180而使來自光學介面部152的光響應信號輸入至光監測部170。測試裝置100可藉由與上述實例中所說明的步驟S210大致相同的動作來對被測試裝置10與裝置介面部150的連接進行檢測。When the test device 100 detects the connection between the device under test 10 and the optical interface portion 152, the first optical switch unit 140 is switched and the optical signal output from the optical signal generating unit 130 is input to the optical interface portion 152. Further, the test apparatus 100 switches the second optical switch unit 180 to input a photo response signal from the optical interface portion 152 to the light monitoring unit 170. The test apparatus 100 can detect the connection of the device under test 10 to the device interface portion 150 by substantially the same actions as step S210 described in the above examples.
於測試裝置100執行藉由光測試信號而進行的光測試的情況下，切換第1光開關部140而使電光轉換部120輸出的光測試信號輸入至光學介面部152。而且，測試裝置100切換第2光開關部180而使來自光學介面部152的光響應信號輸入至光電轉換部160。本例可藉由與圖2或圖3所示的本實施形態的測試裝置100的實例的動作流程大致相同的動作來執行被測試裝置10的光測試。When the test apparatus 100 performs the optical test by the optical test signal, the first optical switch unit 140 is switched, and the optical test signal output from the electro-optical conversion unit 120 is input to the optical interface portion 152. Further, the test apparatus 100 switches the second optical switch unit 180 to input a photo response signal from the optical interface portion 152 to the photoelectric conversion unit 160. In this example, the optical test of the device under test 10 can be performed by substantially the same operation as the operation flow of the example of the test apparatus 100 of the present embodiment shown in FIG. 2 or FIG. 3.
於測試裝置100執行光回送測試的情況下，切換第1光開關部140而使回送光程部410輸出的光信號輸入至光學介面部152。而且，測試裝置100切換第2光開關部180而使來自光學介面部152的光響應信號輸入至回送光程部410。本例可藉由與圖5所示的本實施形態的測試裝置100的第1變形例的動作流程大致相同的動作來執行被測試裝置10的光回送測試。When the test apparatus 100 performs the optical return test, the first optical switch unit 140 is switched, and the optical signal output from the return optical path unit 410 is input to the optical interface portion 152. Further, the test apparatus 100 switches the second optical switch unit 180 to input a photo response signal from the optical interface portion 152 to the return optical path portion 410. In this example, the optical return test of the device under test 10 can be performed by substantially the same operation as the operation flow of the first modification of the test apparatus 100 of the present embodiment shown in FIG. 5.
於以上實例中，對電光轉換部120將1個測試信號轉換為對應的1個波長的光測試信號，於1條光傳輸路徑上傳輸並供給至1個光輸入部12的示例進行了說明。亦可取而代之，電光轉換部120轉換為對應多個測試信號的多個波長的光測試信號，於1條光傳輸路徑上傳輸並供給至1個光輸入部12。即，電光轉換部120將多個測試信號轉換為分別對應的波長的光測試信號後使該光測試信號合波，將經波長多工的光測試信號供給至被測試裝置10中。In the above example, an example in which the electro-optical conversion unit 120 converts one test signal into a corresponding one-wavelength optical test signal and transmits it on one optical transmission path and supplies it to one optical input unit 12 has been described. Alternatively, the electro-optical conversion unit 120 may convert the optical test signals of the plurality of wavelengths corresponding to the plurality of test signals to one optical transmission path and supply them to one optical input unit 12. That is, the electro-optical conversion unit 120 converts the plurality of test signals into optical test signals of respective wavelengths, multiplexes the optical test signals, and supplies the wavelength-multiplexed optical test signals to the device under test 10 .
而且，於以上實例中，對光電轉換部160將自1個光輸出部14而由1條光傳輸路徑傳輸的1個波長的光響應信號轉換為對應的1個響應信號的示例進行了說明。亦可取而代之，光電轉換部160將自1個光輸出部14而由1條光傳輸路徑傳輸的多個波長的光響應信號轉換為對應的多個響應信號。即，光電轉換部160將自被測試裝置10接收的經波長多工的光響應信號分波後光電轉換為與多個測試信號相對應的多個響應信號。Further, in the above example, an example has been described in which the photoelectric conversion unit 160 converts the optical response signal of one wavelength transmitted from one optical output unit 14 by one optical transmission path into one corresponding response signal. Alternatively, the photoelectric conversion unit 160 may convert the optical response signals of the plurality of wavelengths transmitted from the one optical output unit 14 by one optical transmission path into a plurality of corresponding response signals. That is, the photoelectric conversion unit 160 demultiplexes the wavelength-multiplexed optical response signal received from the device under test 10 into a plurality of response signals corresponding to the plurality of test signals.
於此情況下，作為一例，接收到經波長多工的光測試信號的被測試裝置10於被測試裝置10內部對光測試信號進行分波，並且分別將光測試信號分配供給至應測試的多個光學電路中。被測試裝置10使多個光學電路的多個響應信號成為進行合波且波長多工的光響應信號後自光輸出部14輸出。藉此，可將多個光測試信號由1條光傳輸路徑供給至被測試裝置10中，並且將多個光響應信號由1條傳輸路徑接收，可同時執行被測試裝置10的多個光測試。In this case, as an example, the device under test 10 that receives the wavelength-multiplexed optical test signal demultiplexes the optical test signal inside the device under test 10, and separately distributes the optical test signal to be tested. In an optical circuit. The device under test 10 causes a plurality of response signals of the plurality of optical circuits to be multiplexed and wavelength-multiplexed optical response signals, and then outputted from the light output unit 14. Thereby, a plurality of optical test signals can be supplied to the device under test 10 from one optical transmission path, and a plurality of optical response signals are received by one transmission path, and multiple optical tests of the device under test 10 can be simultaneously performed. .
以上，使用實施形態來說明瞭本發明，但本發明的技術性範圍並不限定於上述實施形態中所揭示的範圍。熟悉此技藝者當瞭解可於上述實施形態中附加多種變更或改良。根據申請專利範圍的揭示當瞭解，附加此種變更或改良的形態亦可包含於本發明的技術範圍內。The present invention has been described above using the embodiments, but the technical scope of the present invention is not limited to the scope disclosed in the above embodiments. Those skilled in the art will recognize that various modifications or improvements can be added to the above-described embodiments. It is to be understood from the disclosure of the scope of the invention that such modifications or improvements may be included in the technical scope of the present invention.
應注意到如下情況：申請專利範圍、說明書以及圖式中所示的裝置、系統、程式以及方法中的動作、順序、步驟、以及階段等的各處理的執行順序，只要未特別明示為「比…更前」、「在…之前」等，而且，只要不是將前一個處理的輸出用於後一個處理，則可以任意的順序而實現。關於申請專利範圍、說明書、以及圖式中的動作流程，即便為了方便起見而使用「首先，」、「其次，」等進行說明，但並不意味著必需以此順序來實施。It should be noted that the order of execution of the processes, the procedures, the steps, the stages, and the like in the devices, systems, programs, and methods shown in the claims, the description, and the drawings is not specifically stated as "Before", "Before", etc., and can be implemented in any order as long as the output of the previous process is not used for the latter process. The operation flow in the patent application scope, the specification, and the drawings is described using "first," "second," and the like for convenience. However, it is not necessarily required to be implemented in this order.
10．．．被測試裝置10. . . Tested device
12．．．光輸入部12. . . Light input
14．．．光輸出部14. . . Light output
16．．．輸入端子16. . . Input terminal
18．．．輸出端子18. . . Output terminal
100．．．測試裝置100. . . Test device
110．．．測試部110. . . Testing Division
112．．．測試信號產生部112. . . Test signal generation unit
114．．．信號接收部114. . . Signal receiving unit
116．．．期望值比較部116. . . Expectation comparison department
120．．．電光轉換部120. . . Electro-optic conversion unit
130．．．光信號產生部130. . . Optical signal generation unit
135．．．波長設定部135. . . Wavelength setting section
140．．．第1光開關部140. . . First optical switch unit
150．．．裝置介面部150. . . Device facial
152．．．光學介面部152. . . Optical interface
154．．．光輸出部154. . . Light output
155．．．光輸入部155. . . Light input
156．．．電性介面部156. . . Electrical facial
158．．．輸出端子158. . . Output terminal
159．．．輸入端子159. . . Input terminal
160．．．光電轉換部160. . . Photoelectric conversion unit
170．．．光監測部170. . . Light monitoring department
180．．．第2光開關部180. . . Second optical switch unit
410．．．回送光程部410. . . Return optical path
圖1一併表示本實施形態的測試裝置100的構成例與被測試裝置10。FIG. 1 also shows a configuration example of the test apparatus 100 of the present embodiment and the device under test 10.
圖2表示本實施形態的測試裝置100的動作流程。Fig. 2 shows an operational flow of the test apparatus 100 of the present embodiment.
圖3表示本實施形態的測試裝置100的動作流程的變形例。FIG. 3 shows a modification of the operational flow of the test apparatus 100 of the present embodiment.
圖4一併表示本實施形態的測試裝置100的第1變形例與被測試裝置10。FIG. 4 also shows a first modification of the test apparatus 100 of the present embodiment and the device under test 10.
圖5表示本實施形態的測試裝置100的第1變形例的動作流程。Fig. 5 is a flowchart showing the operation of the first modification of the test apparatus 100 of the embodiment.
圖6一併表示本實施形態的測試裝置100的第2變形例與被測試裝置10。Fig. 6 also shows a second modification of the test apparatus 100 of the present embodiment and the device under test 10.
10．．．被測試裝置10. . . Tested device
12．．．光輸入部12. . . Light input
14．．．光輸出部14. . . Light output
16．．．輸入端子16. . . Input terminal
18．．．輸出端子18. . . Output terminal
100．．．測試裝置100. . . Test device
110．．．測試部110. . . Testing Division
112．．．測試信號產生部112. . . Test signal generation unit
114．．．信號接收部114. . . Signal receiving unit
116．．．期望值比較部116. . . Expectation comparison department
120．．．電光轉換部120. . . Electro-optic conversion unit
130．．．光信號產生部130. . . Optical signal generation unit
135．．．波長設定部135. . . Wavelength setting section
140．．．第1光開關部140. . . First optical switch unit
150．．．裝置介面部150. . . Device facial
152．．．光學介面部152. . . Optical interface
154．．．光輸出部154. . . Light output
155．．．光輸入部155. . . Light input
156．．．電性介面部156. . . Electrical facial
158．．．輸出端子158. . . Output terminal
159．．．輸入端子159. . . Input terminal
160．．．光電轉換部160. . . Photoelectric conversion unit
170．．．光監測部170. . . Light monitoring department
180．．．第2光開關部180. . . Second optical switch unit
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI512309B (en) * | 2013-12-27 | 2015-12-11 | Chroma Ate Inc | Automatic test equipment and control method thereof |
| US11788885B2 (en) | 2021-02-26 | 2023-10-17 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
| US11800619B2 (en) | 2021-01-21 | 2023-10-24 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
-
2011
- 2011-10-12 TW TW100137002A patent/TW201316013A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI512309B (en) * | 2013-12-27 | 2015-12-11 | Chroma Ate Inc | Automatic test equipment and control method thereof |
| US11800619B2 (en) | 2021-01-21 | 2023-10-24 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
| US11788885B2 (en) | 2021-02-26 | 2023-10-17 | Advantest Corporation | Test apparatus, test method, and computer-readable storage medium |
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