TW201313412A - 機械手及機械人 - Google Patents

機械手及機械人 Download PDF

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TW201313412A
TW201313412A TW101108130A TW101108130A TW201313412A TW 201313412 A TW201313412 A TW 201313412A TW 101108130 A TW101108130 A TW 101108130A TW 101108130 A TW101108130 A TW 101108130A TW 201313412 A TW201313412 A TW 201313412A
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Kazunori Hino
Ryuji Ando
Katsuhiko Shimada
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Yaskawa Denki Seisakusho Kk
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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Abstract

根據一實施例的機械手及機械人包含支撐單元。該支撐單元是設置於一基座上，並接觸板的該周邊邊界來抓持該板。該支撐單元中至少一者係在抵住該板的該周邊邊界時轉動。

Description

機械手及機械人
本發明所討論之實施例是有關於一種機械手及一種機械人。
傳統用以運送如半導體晶圓之類板片的板片板材輸送機械人是已為人知的。此種機械人具有一機械手，其包含複數個抓持構件，例如抓持爪，並可夾住放置在機械手上抓持構件之間的板材周邊邊界，以供在預定位置處抓持該板材。
例如，日本專利申請案早期公開第H10-279068號中揭露一種板輸送裝置，其包含一機械手，具有一活動導件，其係為一活動的抓持構件，以及一固定導件，其係為一固定的抓持構件，並可利用該活動導件將一板壓抵於該固定導件的壁表面上，以進行抓持作業。
但是，該傳統的機械手有一項問題在於該抓持構件很容易因為重覆的壓迫而磨損。為此理由之故，該抓持構件要很頻繁地更換，因此其在維修上會有許多的問題。
一實施例的態樣是針對前述問題來達成的，而該實施例的目的在於提供一種機械手及一種機械人，其可抑制構件的磨損，以減低維修的困擾。
根據一實施例之態樣的機械手及機械人包含有支撐單元。該等支撐單元係設置於一基座上，並接觸一板的周邊邊界，以抓持該板。該等支撐單元的至少一者係抵住該板的周邊邊時是會轉動的。
根據一實施例的態樣，其可抑制構件的磨損，以減減低維修的困擾。
透過參閱下面的詳細說明，並配合於所附圖式，其將可以更清楚地理解本發明及其許多附帶優點，進而可以輕易地得到全面的瞭解。
在下文中將配合所附圖式詳細解釋根據本發明一實施例的機械手及機械人。
在下文中，其主要說明的板是一半導體晶圓。
本發明中夾住並抓持該板周邊邊界的抓持構件主要指的是一種“抓持爪”。再者，本發明所採用的“抓持爪”的“抓持”，除了夾住該板周邊邊界以外，還包括在預定位置處的支撐。換言之，該“抓持爪”亦可稱為“支撐單元”。
第1圖是一顯示出根據實施例之機械人1之架構範例的圖。為使得其說明能夠理解，第1圖中顯示出一個三維直角座標系統，其包括有Z軸，其正向是垂直向上的方向。該直角座標系統亦被用於其他用來解說以下的圖式中。
如第1圖所示，機械人1是一關節型機械人，包含一基座2、臂部3、5和7、關節4、6和8、以及一機械手 10。
一控制裝置20連接至機械人1。板的抓持作業及輸送作業是由被控制裝置20所控制的機械人1執行的。再者，該控制是根據先前儲存於控制裝置20教導數據而執行。
臂部3從基座2(見該圖中的雙頭箭號a0)以可滑動方式被設置於垂直方向(Z軸方向)。因此，機械手10可沿著垂直方向升高及下降。
臂部5透過關節4連接至臂部3。在此時，臂部5係以可繞著關節4之旋轉軸線a1轉動的方式被支撐(參見繞著旋轉軸線a1的雙頭箭號)。同樣的，臂部7是透過關節6連接至臂部5。在此時，臂部7係以可繞著關節6之旋轉軸線a2轉動的方式被支撐(參見繞著旋轉軸線a2的雙頭箭號)。
機械手10是一末端作用器(end effector)，可抓持放置於其上之例如半導體晶圓之類的板。機械手10透過關節8連接至臂部7的終端。在此時，機械手10係以可繞著關節8之旋轉軸線a3轉動的方式被支撐(參見繞著旋轉軸線a3的雙頭箭號)。
在本發明中，關節4、關節6、及關節8每一者之中均包含一驅動機構(未顯示)，例如致動器及馬達。臂部5、臂部7、及機械手10可根據該驅動機構的驅動而在圖面的XY平面上進行旋轉作業。
第1圖中顯示出機械人1包含有一機械手10。但是， 機械手的數量並不限於一個。例如，可以類似類比時鐘之分針及時針的重疊方式繞著旋轉軸線a3設置複數個機械手。
接著，將配合第2圖來解釋根據實施例的機械手10的架構範例。第2圖是一顯示出根據實施例之機械手10架構範例的圖式。第2圖中所示的圖式是機械手10自Z軸正向觀視時的平面圖。在本發明中，有關於臂部5、關節6、臂部7、關節8、旋轉軸線a2、及旋轉軸線a3已在第1圖中做過說明的將予以省略。
如第2圖所示，機械手10包含一平板11、固定爪12、一活動爪13、接收座14、以及一驅動單元15。固定爪12包含一可沿著板W周邊邊界轉動的滾輪12a及一接收座12b。再者，滾輪12a及接收座12b係連接成一體，接收座12b可與滾輪12a一起轉動。
平板11是一個亦稱為底座或基座的構件，可供板W放置於其上。在此，在第2圖中顯示出平板11的形狀是類似於鏟子。但是，平板11的形狀並不限於鏟子。再者，平板11就功能而言，可稱為“置放單元”。
固定爪12是一固定的抓持爪，其設置在平板11上且不會自給定位置移動開。例如，固定爪12是設置在靠近於平板11前端處。再者，第2圖中顯示出在平板11前端的二側末端處設置一對固定爪12。
在固定爪12的情形中，滾輪12a是與板W的周邊邊界接觸，而接收座12b則是自下方(換言之，在Z軸正向 方向上)支撐著板W。再者，固定爪12的細節將於下文中配合第4A圖及第4B圖再說明。
活動爪13是可活動的抓持爪。例如，活動爪13是設置在靠近於平板11的尾端處，而能沿著圖面中的X軸滑動。活動爪13的細節將於下文中配合第3圖再解釋。
與接收座12b一樣，接收座14是一個可自下方支撐板W的構件。再者，第2圖中顯示出在平板11尾端的二側末端處設有一對接收座14。
驅動單元15是一驅動機構，可用以滑動活動爪13。例如，驅動單元15是一空氣缸或類似者所構成。
在本發明中將配合第3圖來解釋活動爪13的操作。第3圖是一顯示出活動爪13之操作的圖式。第3圖中顯示出機械手在自Y軸負向觀視的情形。在此情形中，第3圖的上半部代表板W已置放但未被抓持的情形，而第3圖的下半部則代表板W被抓持的情形。
如第3圖上半部中所示，在板W被抓持之前，板W是僅由接收座12b及接收座14自下方支撐。在此時，有一餘隙“i”存在於板W與抓持爪之間，例如，固定爪12的滾輪12a。再者，雖然板W與活動爪13有餘隙存在，但此種情形則未顯示出。
接收座12b及接收座14具有預定的高度，並根據板W下表面與平板11上表面間之高度設定一預定之餘隙而支撐板W。因此之故，可以防止顆粒附著至板W上。
如第3圖下半部所示，尚當板W被抓持時，機械人1 會讓驅動單元15將活動爪13朝向平板11的前端滑動(參見圖式中的箭號101)(換言之即朝向圖式中X軸的正向)。
接著，滑動的活動爪13會沿著讓板W接觸到固定爪12並填滿餘隙“i”而使板W周邊邊界接觸到固定爪12之滾輪12a的方向來壓迫板W(參見圖式中的箭號102)。
其結果是板W的周邊邊界會夾住於固定爪12與活動爪13之間，因之而使板W被抓持。
在本發明中將配合第7圖來解釋傳統之固定爪12’的架構範例。第7圖是顯示出傳統固定爪12’的架構範例的圖式。如第7圖所示，該傳統的固定爪12’是由例如可供板W抵住其上的一側壁及一自下方支撐板W的接收座一體而固定地形成。
因此之故，當板W被重覆地壓迫於該側壁上時(參見圖式中的雙頭箭號106)，在該側壁的一特定區域內會被重覆地施加應力，因此會很容易發生磨損“a”(參見圖式中由封閉曲線M1圍繞的部位)。
由於當磨損“a”產生時，板W在平板11上的位置會偏移，因此每一次都必須更換固定爪12’。換言之，在維修上會有許多困擾。
回到第3圖，其係設定板W周邊邊界接觸到滾輪12a，其在根據本發明的機械手10中會沿著該周邊邊界轉動。因此，由於其可以防止應力重覆地施加至一特定區域上，所以可以防止固定爪12的磨損，以減少維修上的困擾 。
再者，在第3圖上半部所示板W是僅由下方支撐的情形中，除了X軸方向上的餘隙以外，在XY平面有許多機會會發生偏移。
就此而言，根據本實施例的機械手10是被動地轉動滾輪12a，其係沿著板W周邊邊界抵靠在板W上以修正XY平面上的偏移，並導引板W至預定的位置。此點的詳細情形將在下文中配合第5A圖及第5B圖解釋。
回到第2圖來說明板W的該預定位置。在第2圖中，板W是由該對固定爪12及活動爪13以三點支撐的方式抓持。
在本發明中，其係設定板W的預定位置是板W在此種狀態下所處的位置。下文中，其係設定板W在預定位置處的中心是中心P，平行X軸通過中心P的軸線是軸線C1，而平行Y軸通過中心P的軸線是軸線C2。
可以設置一通報單元，其計算活動爪13操作的次數，並根據操作的次數來通報使用者更換固定爪12的時間。例如，第2圖中顯示出驅動單元15包含一通報燈15a，其會根據活動爪13的操作次數而點亮。使用者可利用通報燈15a的點亮做為指示更換固定爪12之時間的信號。該通報燈15a可以設置在不同於驅動單元15的位置處。通報裝置並不限於燈。
接著將配合第4A圖及第4B圖來解釋固定爪12的架構範例。第4A圖及第4B圖是顯示出固定爪12之架構範 例的圖式。在第4A圖中顯示出固定爪12自Z軸正向觀視時的平面圖，而第4B圖中則顯示出第4A圖中A-A’剖面自Y軸負向觀視時的剖面圖。
在第4A圖及第4B圖中是顯示出第2圖中該對固定爪12中由軸線C1分割開的左側固定爪12。右側固定爪12是設定成具有相同架構。
雖然解說會部份與第2圖的解說重覆，但固定爪12是如第4A圖及第4B圖所示包含有滾輪12a及接收座12b。再者，滾輪12a及接收座12b是連接成一體。滾輪12a抵住板W周邊邊界上而被動地沿著板W的周邊邊界轉動。
接收座12b是一個亦稱為支柱的件，係與滾輪12a形成為一體，可隨著滾輪12a轉動。換言之，滾輪12a及接收座12b構成一個轉動體，其可沿著板W的周邊邊界轉動。再者，接收座12b具有的最大寬度是超過滾輪12a的直徑。接收座12b可讓板W於置於其上一個寬度超出滾輪12a直徑的區域內，以從下方支撐板W。
滾輪12a及接收座12b是以可轉動的方式設置成能繞著平板11上的一旋轉軸線a4而轉動(參見圖式中的雙頭箭號103)。換言之，固定爪12是一個固定而可旋轉的抓持爪，其如前所述是不會移位的，但是以可旋轉的方式設置於平板11上。固定爪12所具有的安裝結構是一根支撐銷12aa，其係設置成貫穿過平板11且由一附著於平板11內部之軸承12ab以及形成為一體的滾輪12a和接收座12h 來承載，例如，如第4B圖所示。
在採用該種安裝結構時，最好是在“滾輪12a及接收座12b”與平板11之間或是在平板11與支撐銷12aa之間設置一餘隙，以使得滾輪12a及接收座12b能平順地轉動。
如第4A圖及第4B圖所示，自各自的形狀來看，滾輪12a及接收座12b可分別稱為“圓柱部位”，其係形成為圓柱體的形狀，以及“環圈部位”，其係以環圈式的形狀自圓柱部份突伸出。換言之，該“圓柱部位”的外側周邊表面會接觸到板W周邊邊界的末端表面，而“環圈部位”的上表面會接觸到板W周邊邊界的下表面。
接著將配合第5A圖及第5B圖來解釋滾輪12a在板W抵靠住時的操作。第5A圖及第5B圖是顯示出滾輪12a操作的圖式。在第5A圖及第5B圖中，只有解說所必要的構件被顯示出，而與滾輪12a一起轉動的接收座12b則未顯示出。另外第5B圖中則放大並顯示出第5A圖中的區域M2。
首先，其係假設一對滾輪12a設置在軸線C1的對稱位置處，其中每一滾輪12a與軸線C1間的間距是“n”，如第5A圖所示。以此方式，最好該對滾輪12a是配置在該活動爪13壓迫板W之軌跡的對稱位置上。
在本發明中，如第5A圖實線板W所示，在許多情形中，板W在被抓持前是放置成在XY平面上偏離於位在預定位置上的虛擬板W0。例如，如第5A圖所示，其係假設 板W的中心Q是向著軸線C1的左側及軸線C2的下側偏離開該預定的中心位置P。
在此狀態下，其係假設活動爪13是沿著X軸方向推抵板W。在此情形中，板W並未同時壓著該對滾輪12a，而是僅抵住由封閉曲線M2圍繞的左側滾輪12a。
在本發明中，其係假設板W是如第5B圖所示在接觸點“m”處抵住滾輪12a上。在此情形中，板W，其係抵住位在通過滾輪12a轉動中心並平於活動爪13壓迫方向之軸線C3的右側的接觸點“m”，是透過該抵靠表面的壓迫力量而沿著逆時鐘方向被動地轉動滾輪12a(參見箭號104)。雖然並未顯示出，該轉動可透過額外加設的接收座12b(參見第4A圖及第4B圖)與板W周邊邊界接觸著接收座12b上表面的下表面間的摩擦力而進行。
隨著滾輪12a的轉動，板W會在轉動自身的過程中將其方向自壓迫方向改變成箭號105的方向而移動。接著，板W會因抵住位在軸線C1相對對稱位置上的右側滾輪12a而停止移動，並定位在由板W0標示的該預定位置處。換言之，板W會在沿著XY平面修正其偏移時被導引至該預定位置，並由該對固定爪12及活動爪13抓持。
接著，由於滾輪12a是在板W被導引的過程中，一邊轉動一邊抵靠在板W上，因此只有滾輪12a外側周邊表面上的特定區域不會接受到因抵靠而造成之應力。換言之，因為滾輪12a磨損會受到抑制，因此更換作業或類似者等維修上的困擾可以減低。
雖然並未顯示出，但接收座12b(參見第4A圖及第4B圖)在由下側支撐板W時會隨著滾輪12a旋轉，因此板W可平順地移動而不會刮傷下表面。
如前所述，由於滾輪12a及接收座12b(參見第4A圖及第4B圖)在被動地轉動時，會因他們與板W之間的抵靠表面而造成摩擦力，構成滾輪12a與接收座12b的外側周邊表面的材料最好是能夠在該等外側周邊表面與板W周邊邊界接觸時產生預定的摩擦力。
前面已說明過第5A圖及第5B圖中所顯示的是位在軸線C1左側的滾輪12a。但是，很明顯的，雖然左右有別，位在右側的滾輪12a也會進行相同的操作。
到目前為止已經解說過會因抵住板W上而被動地轉動的滾輪12a是包含於固定爪12內。但是，滾輪12a亦可設置在一個位在板W會被壓迫至其上的一側上的抓持構件內。
因此，另外一種範例將配合第6A圖及第6B圖來說明。第6A圖是顯示出根據另外一種範例的機械手10A的架構範例的圖式。第6B圖顯示出根據另一另外一種範例的機械手10B的架構範例。
第6A圖及第6B圖中與根據實施例之機械手10中相同的零組件只有在解說該等零組件時才需要。
如第6A圖所示，根據該另外一種範例的機械手10A包含一滾輪13a，做為可由驅動單元15滑動來壓迫板W的抓持構件。滾輪13a係以可轉動方式繞著旋轉軸線a5 設置。
當板W被放置成在XY平面上偏離開時，在滾輪13a抵靠在板W上，因為與第5A圖及第5B圖相同的理由之故，滾輪13a亦會轉動。換言之，由於只有外側周邊表面上的特定區域不易受到應力作用之故，因此可以抑制磨損，而減少維修的困擾。
類似的滾輪13a’係可繞著顯示於第6B圖中之機械手10B的旋轉軸線a6旋轉地移動，在壓迫側可以設置複數個抓持構件，由一連接構件13b連接在一起而能互相平行地滑動。在此情形中，不僅可以防止滾輪13a’的磨損，機械手亦能在板W之偏移很大時應付該偏移。
如前所述，根據實施例的機械手包含一做為基座的平板及複數個設置在該平板上並接觸一板的周邊邊界來抓持該板的抓持爪。該等抓持爪中至少一者可在抵住板之周邊邊界時轉動。
因此，根據實施例的機械手，可將構件的磨損抑制，以減少維修的困擾。
另外，前已針對實施例解說過，當機械手包含一對固定爪時，該二固定爪均包含各自的滾輪。但是，本實施例並不限於此。例如，可以僅有一固定爪包含一滾輪。
在此情形中，當置放於平板上的板是一直是朝向固定方向偏移時，或是當板的周邊邊界有一部份是呈R形形狀時，只有抵住該範圍內的固定爪包含一滾輪，因此至少該範圍內的磨損可被抑制。因此，板的形狀可以不限於圓形 。
僅有特定之固定以此方式包含滾輪的點，亦可同樣地適用於活動爪。
在轉動體是滾輪的實施例中已經解說過。但是，本實施例並不僅限於此。例如，該實施例中可以採用其中抵住板上的區域是球形轉動體的抓持構件。
再者，在該實施例中已解說過抓持構件是設置成靠近於平板的前端或尾端。抓持構件的設置位置並不限於此。
再者，在該實施例中主要是解釋的是板是半導體晶圓。很明顯的，板可以不區分型式來應用。
1‧‧‧機械人
2‧‧‧基座
3‧‧‧臂部
4‧‧‧關節
5‧‧‧臂部
6‧‧‧關節
7‧‧‧臂部
8‧‧‧關節
10‧‧‧機械手
10A‧‧‧機械手
10B‧‧‧機械手
11‧‧‧平板
12‧‧‧固定爪
12’‧‧‧固定爪
12a‧‧‧滾輪
12aa‧‧‧支撐銷
12ab‧‧‧軸承
12b‧‧‧接收座
13‧‧‧活動爪
13a‧‧‧滾輪
13a’‧‧‧滾輪
13b‧‧‧連接構件
14‧‧‧接收座
15‧‧‧驅動單元
15a‧‧‧通報燈
20‧‧‧控制裝置
101‧‧‧箭號
102‧‧‧箭號
103‧‧‧雙頭箭號
104‧‧‧箭號
105‧‧‧箭號
106‧‧‧雙頭箭號
a‧‧‧磨損
a0‧‧‧雙頭箭號
a1‧‧‧軸線
a2‧‧‧軸線
a3‧‧‧旋轉軸線
a4‧‧‧旋轉軸線
a5‧‧‧旋轉軸線
a6‧‧‧旋轉軸線
C1‧‧‧軸線
C2‧‧‧軸線
C3‧‧‧軸線
i‧‧‧餘隙
m‧‧‧接觸點
M1‧‧‧封閉曲線
M2‧‧‧封閉曲線
n‧‧‧間距
P‧‧‧中心
Q‧‧‧中心
W‧‧‧板
W0‧‧‧板
第1圖是一圖式，顯示出根據一實施例的機械人之架構範例。
第2圖是一圖式，顯示出根據該實施例之機械手的架構範例。
第3圖是一圖式，顯示出一活動爪的操作。
第4A圖及第4B圖是顯示出一固定爪架構範例的圖式。
第5A圖及第5B圖是顯示出一滾輪操作的圖式。
第6A圖及第6B圖是顯示出根據另外範例的機械手架構範例的圖式。
第7圖是一圖式，顯示出傳統固定爪的架構範例。
5‧‧‧臂部
6‧‧‧關節
7‧‧‧臂部
8‧‧‧關節
10‧‧‧機械手
11‧‧‧平板
12‧‧‧固定爪
12a‧‧‧滾輪
12b‧‧‧接收座
13‧‧‧活動爪
14‧‧‧接收座
15‧‧‧驅動單元
15a‧‧‧通報燈
C1‧‧‧軸線
C2‧‧‧軸線
P‧‧‧中心
W‧‧‧板

Claims (7)

  1. 一種機械手，包括：複數個支撐單元，係設置於一基座上並接觸一板的一周邊邊界，以抓持該板，該等支撐單元中至少一者係在抵住該板的該周邊邊界時轉動。
  2. 根據申請專利範圍第1項的機械手，其中該支撐單元中至少一者是一可移動支撐單元，其沿著該板抵住另一支撐單元之方向壓迫該板，以及該另一支撐單元是一旋轉動支撐單元，其係旋轉地被支撐於該基座上，並沿著被該可移動支撐單元抵靠之該板的該周邊邊界轉動。
  3. 根據申請專利範圍第2項的機械手，其中該旋轉動支撐單元包含至少一對支撐單元，其相對於該可移動支撐單元壓迫該板之軌跡而配置於對稱位置上。
  4. 根據申請專利範圍第2項或第3項的機械手，其中該旋轉動支撐單元包含：一圓柱部位，其形成為圓柱形的形狀，且其外側周邊表面接觸該板之該周邊邊界的一末端表面；以及一環圈部位，其係形成為以環圈形狀從該圓柱部位突伸出，且其上表面接觸到該板的該周邊邊界的下表面，以及該旋轉動支撐單元在抵住該板的該周邊邊界上時，根據該環圈部位與該板之該周邊邊界的該下表面間的摩擦力而轉動。
  5. 根據申請專利範圍第2項的機械手，其中 該旋轉動支撐單元是設置於靠近該基座之前導端處，以及該可移動支撐單元是設置靠近於該基座的尾端處。
  6. 根據申請專利範圍第2項的機械手，進一步包括一通報單元，其計數該可移動支撐單元操作的次數，以根據操作次數來通知使用者該旋轉動支撐單元的更換時間。
  7. 一種機械人，包括根據申請專利範圍第1項的機械手。
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US20130076055A1 (en) 2013-03-28
JP2013071186A (ja) 2013-04-22
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TWI500491B (zh) 2015-09-21
KR101490551B1 (ko) 2015-02-05

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