TW201304027A - Test sorting machine for semiconductor device - Google Patents
Test sorting machine for semiconductor device Download PDFInfo
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- TW201304027A TW201304027A TW100124274A TW100124274A TW201304027A TW 201304027 A TW201304027 A TW 201304027A TW 100124274 A TW100124274 A TW 100124274A TW 100124274 A TW100124274 A TW 100124274A TW 201304027 A TW201304027 A TW 201304027A
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Abstract
Description
本發明係提供一種可易於排出發生異常狀況時之水珠,並縮減測試裝置佔用機台台面空間,以提升測試品質及縮小設備體積之半導體元件測試分類機。The invention provides a semiconductor component test sorting machine which can easily discharge water drops when an abnormal situation occurs, and reduce the space occupied by the test device occupying the table top to improve the test quality and reduce the volume of the device.
在現今,半導體元件係應用於不同電子設備,由於電子設備所處之環境可能為常溫環境、高溫環境或低溫環境等,因此,業者為確保半導體元件之使用品質,於半導體元件製作完成後,必須視其應用之環境溫度,將半導體元件移載至常溫測試機或冷測機或熱測機,以分別於不同作業溫度環境中進行常溫測試作業或冷測作業或熱測作業,進而淘汰出不良品。In today's world, semiconductor components are used in different electronic devices. Since the environment in which the electronic devices are located may be a normal temperature environment, a high temperature environment, or a low temperature environment, the manufacturer must ensure the quality of the semiconductor components. Depending on the ambient temperature of the application, the semiconductor components are transferred to a normal temperature tester or a cold tester or a thermal tester to perform a normal temperature test operation or a cold test operation or a thermal test operation in different operating temperature environments, thereby eliminating the Good product.
請參閱第1、2圖,係為一種電子元件冷測機之示意圖,其係於機台11上配置有供料裝置12、收料裝置13、測試裝置14、預冷盤15及輸送裝置16,該供料裝置12係容納複數個待測之電子元件17,該收料裝置13係容納複數個完測之電子元件17,該測試裝置14係設有一具低溫作業環境之冷測室141,並於冷測室141內部之機台11上配置有一水平式且具複數個測試座143之測試電路板142,用以測試電子元件17,另於測試座143之側方設有一下壓治具144,用以下壓電子元件17,該預冷盤15係用以預冷待測之電子元件17,該輸送裝置16係設有至少一取放器161,用以於供料裝置12、收料裝置13、測試裝置14及預冷盤15間輸送待測/完測之電子元件;於執行冷測作業時,輸送裝置16之取放器161係於供料裝置12處取出待測之電子元件17,並先移載置入於預冷盤15內,該預冷盤15即將待測之電子元件17預冷至所需測試溫度(例如-20℃),於待測之電子元件17預冷後,輸送裝置16之取放器161再將待測之電子元件17移載至冷測室141,並置入於測試座143上,下壓治具144即下壓待測之電子元件17執行冷測作業,於冷測完畢後,輸送裝置16之取放器161係將完測之電子元件17移載至收料裝置13處收置;惟,半導體元件17於低溫作業環境之冷測室141內執行測試作業時,由於半導體元件17本身如在低溫環境執行測試程式發生異常狀況時,易導致半導體元件17之表面凝結水珠,但測試裝置14之測試座143係水平配置於機台11上,以致發生異常狀況時,水珠易殘留於測試座143內,不僅影響測試良率,亦降低測試電路板142及測試座143之使用壽命;再者,該測試裝置14係於測試電路板142上配置有複數個測試座143,使得測試電路板142之面積較大,當測試電路板142水平配置於機台11上時,勢必相當佔用機台11之台面空間,並無法有效縮小設備之體積,造成佔用空間之缺失。Please refer to FIGS. 1 and 2 , which are schematic diagrams of an electronic component cold measuring machine, which is provided with a feeding device 12 , a receiving device 13 , a testing device 14 , a pre-cooling plate 15 and a conveying device 16 on the machine table 11 . The feeding device 12 is configured to accommodate a plurality of electronic components 17 to be tested, the receiving device 13 is configured to accommodate a plurality of electronic components 17 that are tested, and the testing device 14 is provided with a cold measuring chamber 141 having a low temperature working environment, and A test circuit board 142 having a horizontal test panel 143 is disposed on the machine 11 inside the cold test chamber 141 for testing the electronic component 17, and a lower press fixture 144 is disposed on the side of the test socket 143. The pre-cooling disk 15 is used for pre-cooling the electronic component 17 to be tested, and the conveying device 16 is provided with at least one pick-and-placer 161 for the feeding device 12 and the receiving device 13 The test device 14 and the pre-cooling tray 15 transport the electronic component to be tested/tested; when performing the cold test operation, the pick-and-place device 161 of the transport device 16 takes out the electronic component 17 to be tested at the feeding device 12, and Firstly placed in the pre-cooling tray 15, the pre-cooling disc 15 is about to be tested electronic components 17 pre-cooling to the required test temperature (for example, -20 ° C), after the electronic component 17 to be tested is pre-cooled, the pick-and-place device 161 of the conveying device 16 transfers the electronic component 17 to be tested to the cold measuring chamber 141. And the test fixture 143 is placed on the test stand 143, and the electronic component 17 to be tested is pressed down to perform the cold test operation. After the cold test is completed, the pick-up device 161 of the transport device 16 is the electronic component 17 to be tested. Transfer to the receiving device 13 for storage; however, when the semiconductor device 17 performs a test operation in the cold room 141 of the low temperature working environment, the semiconductor device 17 itself is likely to cause an abnormal condition when the test program is executed in a low temperature environment. The surface of the semiconductor device 17 is condensed with water droplets, but the test socket 143 of the testing device 14 is horizontally disposed on the machine table 11, so that when an abnormal condition occurs, the water droplets are likely to remain in the test seat 143, which not only affects the test yield but also reduces the test yield. The test circuit board 142 and the test socket 143 have a service life. Further, the test device 14 is provided with a plurality of test sockets 143 on the test circuit board 142, so that the test circuit board 142 has a larger area when the test circuit board 142 is horizontal. When configured on the machine table 11 It is bound to take up considerable space 11 of the machine table, and can not effectively reduce the size of the device, resulting in lack of space.
因此,如何提供一種可提升測試良率及縮小體積之半導體元件測試分類機,即為業者研發之標的。Therefore, how to provide a semiconductor component test sorting machine that can improve the test yield and reduce the size is the standard developed by the industry.
本發明之目的一,係提供一種半導體元件測試分類機,係於機台上配置有供料裝置、收料裝置、測試裝置及輸送裝置,該供料裝置係容納至少一待測之半導體元件,該收料裝置係容納至少一完測之半導體元件,該測試裝置係設有至少一可執行不同溫度測試之測試區,並於測試區設有具至少一測試座之測試電路板,且使測試座之***口非朝向上方,用以測試半導體元件,該輸送裝置係設有具至少一轉盤之載送機構,用以移動於供、收料裝置及測試裝置間,並設有具至少一取放器之移料機構,用以於供、收料裝置及轉盤間移載半導體元件,另設有具至少一取放器之轉載機構,用以於轉盤與測試座間轉載半導體元件;藉此,可利用***口非朝向上方之測試座,易於排出發生異常狀況時之水珠,並增加測試電路板及測試座之使用壽命,達到提升測試品質及節省成本之實用效益。A first object of the present invention is to provide a semiconductor component test sorting machine, which is provided with a feeding device, a receiving device, a testing device and a conveying device, and the feeding device accommodates at least one semiconductor component to be tested. The receiving device is configured to receive at least one completed semiconductor component, the testing device is provided with at least one test zone capable of performing different temperature tests, and a test circuit board having at least one test socket is disposed in the test zone, and the test is performed The insertion opening of the seat is not facing upward for testing the semiconductor component, and the conveying device is provided with a carrier mechanism having at least one turntable for moving between the supply and receiving device and the testing device, and having at least one a transfer mechanism for transferring the semiconductor component between the supply and receiving device and the turntable, and a transfer mechanism having at least one pick-and-place device for transferring the semiconductor component between the turntable and the test stand; The test socket with the insertion port not facing upward can be used, it is easy to discharge the water drops when the abnormal situation occurs, and the service life of the test circuit board and the test socket is increased, thereby improving the test quality and Practical benefits of cost-saving.
本發明之目的二,係提供一種半導體元件測試分類機,係於機台上配置有供料裝置、收料裝置、測試裝置及輸送裝置,該供料裝置係容納至少一待測之半導體元件,該收料裝置係容納至少一完測之半導體元件,該測試裝置係設有至少一可執行不同溫度測試之測試區,並於測試區設有具至少一測試座之測試電路板,且使測試座之***口非朝向上方,用以測試半導體元件,該輸送裝置係設有具至少一第一、二載台之載送機構,用以移動於供、收料裝置及測試裝置間,並設有具至少一取放器之移料機構,用以於供、收料裝置及第一、二載台間移載半導體元件,另設有具至少一取放器之轉載機構,用以於第一、二載台與測試座間轉載半導體元件;藉此,可利用***口非朝向上方之測試座,易於排出發生異常狀況時之水珠,並增加測試電路板及測試座之使用壽命,達到提升測試品質及節省成本之實用效益。A second object of the present invention is to provide a semiconductor component test sorting machine, which is provided with a feeding device, a receiving device, a testing device and a conveying device, and the feeding device accommodates at least one semiconductor component to be tested. The receiving device is configured to receive at least one completed semiconductor component, the testing device is provided with at least one test zone capable of performing different temperature tests, and a test circuit board having at least one test socket is disposed in the test zone, and the test is performed The insertion opening of the socket is not facing upward for testing the semiconductor component, and the conveying device is provided with a carrier mechanism having at least one first and two carriers for moving between the supply and receiving device and the testing device. a material transfer mechanism having at least one pick-and-place device for transferring semiconductor components between the supply and receiving device and the first and second stages, and a transfer mechanism having at least one pick-and-place device for The semiconductor component is transferred between the first and second stages and the test stand; thereby, the test stand with the insertion port not facing upward can be utilized, and the water drops in the abnormal situation can be easily discharged, and the use of the test circuit board and the test stand can be increased. Life, to improve the quality and test cost-saving benefits of utility.
本發明之目的三,係提供一種半導體元件測試分類機,該輸送裝置之載送機構係以轉盤承載半導體元件循環移動於供、收料裝置及測試裝置間,可縮短移料機構及轉載機構之等待時間,達到提升測試產能之實用效益。A third object of the present invention is to provide a semiconductor component test sorting machine, wherein the transport mechanism of the transport device is cyclically moved between the supply and receiving device and the test device by the turntable-bearing semiconductor component, thereby shortening the transfer mechanism and the transfer mechanism. Waiting time to achieve practical benefits of increasing test capacity.
本發明之目的四,係提供一種半導體元件測試分類機,該輸送裝置係可視需求增設有至少一可變換半導體元件之角位方向的轉位機構,該轉位機構可獨立裝配於機台上,亦可裝配於移料機構或轉載機構上,進而可利用轉位機構變換待測半導體元件之角位方向,以符合測試座的角位方向,並於測試完畢後,再變換完測半導體元件之角位方向,以利收置於收料裝置,達到提升使用效能之實用效益。A fourth object of the present invention is to provide a semiconductor component test sorting machine, which can be provided with at least one indexing mechanism of an angular position of a switchable semiconductor component, which can be independently mounted on a machine table. It can also be mounted on the transfer mechanism or the transfer mechanism, and then the indexing mechanism can be used to change the angular direction of the semiconductor component to be tested to conform to the angular orientation of the test socket, and after the test is completed, the semiconductor component can be converted. In the direction of the corner position, it can be placed in the receiving device to achieve the practical benefit of improving the performance.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如后:請參閱第3、4圖,係本發明之第一實施例,該半導體元件測試分類機係於機台20上配置有至少一供料裝置、收料裝置、測試裝置及輸送裝置,於本實施例中,係於機台20上配置有供料裝置30、收料裝置40、測試裝置50及輸送裝置60;該供料裝置30係用以容納至少一待測之半導體元件,於本實施例中,該供料裝置30係設有至少一料盤31,用以盛裝複數個待測之半導體元件;該收料裝置40係用以容納至少一完測之半導體元件,於本實施例中,該收料裝置40係設有至少一料盤41,用以盛裝複數個完測之半導體元件;該測試裝置50係設有至少一測試區,並於測試區設有具至少一測試座之測試電路板,且使測試座之***口非朝向上方,用以測試半導體元件,於本實施例中,該測試裝置50係於機台20上設有一具至少一測試區52之作業室51,並於測試區52之側壁上開設有通孔521,而於通孔521之一側設有具至少一測試座54且垂直配置之測試電路板53,使得測試座54之***口朝向前方,供***待測之半導體元件,並以測試器(圖未示出)將測試結果傳輸至中央控制單元(圖未示出),由中央控制單元控制各裝置作動,又該測試區52內係設有溫控器522,而可視測試作業需求,將測試區52變換為一常溫作業環境、高溫作業環境或低溫作業環境等,使半導體元件於不同溫度之作業環境下執行測試作業,另該測試裝置50可視需求於作業室51上增設一可輸送乾燥空氣至測試區52之輸送管55,使測試區52形成一乾燥空間,以利執行冷測作業,並於測試區52增設一為CCD之取像器56,用以取像待測半導體元件之角位方向或是否有雜質或是否擺置正確,當半導體元件擺置不正確時,可進行警告或使用移料機構進行修正擺置位置;該輸送裝置60係設有具至少一轉盤611之載送機構61,用以移動於供、收料裝置30、40及測試裝置50間,並設有具至少一取放器之移料機構62,用以於供、收料裝置30、40及轉盤611間移載半導體元件,另設有具至少一取放器之轉載機構63,其取放器係擺置呈水平狀態時,可於轉盤611上取放半導體元件,並於旋轉擺置對應測試座54***口之角度狀態時,可將待測之半導體元件插置於測試座54內測試,於本實施例中,該載送機構61係於測試區52內裝設有一由驅動源驅動旋轉之轉盤611,轉盤611上設有至少一可承置半導體元件之容置槽612,而可循環載送半導體元件,於本實施例中,該轉盤611係等角配置有八個容置槽612,並使至少一容置槽612位於作業室51之外部,以供移料機構62取放半導體元件,另該載送機構61可視作業需求,於轉盤611之各容置槽612處增設溫控裝置,用以控制溫度,該溫控裝置可以致冷晶片控溫或以冷媒與散熱片的方式控溫,亦或以液氣轉換方式控溫;該移料機構62係設有二可作第一、二、三軸向位移(即為X-Y-Z軸向位移)之第一取放器621及第二取放器622,第一取放器621係於供料裝置30及轉盤611間移載待測之半導體元件,第二取放器622係於收料裝置40及轉盤611間移載完測之半導體元件,該轉載機構63係設有一具轉動架632之驅動源631,該驅動源可為馬達或旋轉缸,於本實施例中,該驅動源631係為馬達,並於馬達之轉軸上裝設有轉動架632,轉動架632上係設有二呈不同角度配置且具第三取放器634A之第一活動治具633A及具第四取放器634B之第二活動治具633B,於本實施例中,第一活動治具633A係位於轉動架632之下方且呈水平狀態,並以一位於轉動架632上方之第一驅動源635A驅動第一活動治具633A作第三軸向位移,使第三取放器634A取放半導體元件,另該第一驅動源635A亦可架設於作業區外之上方機架上,而不隨著第一活動治具633A移動,第一驅動源635A之伸縮桿並以抵頂的方式頂推第一活動治具633A作伸出位移,第一活動治具633A復位時則由其上之拉伸彈簧拉伸復位,而不限於前述之實施例;第二活動治具633B係位於轉動架632之一側方且呈垂直狀態,並以一位於轉動架632另一側方之第二驅動源635B驅動第二活動治具633B作第二軸向位移,使第四取放器634B取放半導體元件,另該第二驅動源635B亦可架設於作業區外之上方機架上,而不隨著第二活動治具633B移動,第二驅動源635B之伸縮桿並以抵頂的方式頂推第二活動治具633B作伸出位移,第二活動治具633B復位時則由其上之拉伸彈簧拉伸復位,而不限於前述之實施例;另可視冷測作業需求,於第一、二活動治具633A、633B上分別裝設有第一、二溫控裝置,用以控制溫度,第一、二溫控裝置可以致冷晶片控溫或以冷媒與散熱片的方式控溫,亦或以液氣轉換方式控溫,於本實施例中,第一、二溫控裝置係於第一、二活動治具633A、633B內分別設有第一、二致冷晶片636A、636B,第一、二致冷晶片636A、636B一端之吸熱端係形成一冷卻面,另一端之放熱端則形成一散熱面,並以各冷卻面分別貼合於第一、二活動治具633A、633B,經由第一、二活動治具633A、633B接觸半導體元件,使得半導體元件於模擬低溫環境中執行冷測作業,當執行冷測作業完畢後,係可視作業需求,於轉盤611載出完測半導體元件之行程中,使完測之半導體元件逐漸回溫至常溫,亦或控制第一、二致冷晶片636A、636B之電流方向,使貼合於第一、二活動治具633A、633B上之該面變換為散熱面,並經由第一、二活動治具633A、633B接觸半導體元件,使完測之半導體元件可迅速回溫至常溫,進而驅動源631可利用轉動架632帶動第一、二活動治具633A、633B及其上之第三、四取放器634A、634B旋轉交替變換呈水平狀態及垂直狀態,使第三取放器634A或第四取放器634B擺置呈水平狀態時,可於轉盤611上取放半導體元件,並使第三取放器634A或第四取放器634B擺置呈垂直狀態將待測之半導體元件插置於測試座54;再者,該輸送裝置60可視需求增設有至少一可變換半導體元件之角位方向的轉位機構,該轉位機構可獨立裝配於機台20上,亦可裝配於移料機構62或轉載機構63上,而可利用轉位機構變換待測半導體元件之角位方向,以符合測試座54的角位方向,並於測試完畢後,再變換完測半導體元件之角位方向,以利收置於收料裝置40;當轉位機構獨立裝配於機台20上時,係設有至少一承座供承置半導體元件,並控制承座轉動而變換半導體元件之角位方向,再配置一具取放器之移載機構,以於轉位機構及轉盤611間移載半導體元件,另當轉位機構裝配於移料機構62或轉載機構63上時,係可帶動第一、二取放器621、622或第三、四取放器634A、634B轉動,而變換半導體元件之角位方向,於本實施例中,該輸送裝置60係於移料機構62之第一取放器621上設有第一轉位機構64A,用以變換待測半導體元件之角位方向,並於第二取放器622上設有第二轉位機構64B,用以變換完測半導體元件之角位方向。In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment will be described in conjunction with the drawings, which are described in detail below. Referring to Figures 3 and 4, a first embodiment of the present invention, the semiconductor device The test sorting machine is provided with at least one feeding device, receiving device, testing device and conveying device on the machine table 20. In the embodiment, the feeding device 30 and the receiving device 40 are disposed on the machine table 20. The testing device 50 and the conveying device 60 are used to accommodate at least one semiconductor component to be tested. In the embodiment, the feeding device 30 is provided with at least one tray 31 for holding a plurality of The semiconductor device to be tested is used for accommodating at least one semiconductor component to be tested. In the embodiment, the receiving device 40 is provided with at least one tray 41 for holding a plurality of finishes. The test device 50 is provided with at least one test area, and a test circuit board having at least one test socket is disposed in the test area, and the insertion opening of the test socket is not facing upward for testing the semiconductor component. In this embodiment, the test The device 50 is provided with a working chamber 51 having at least one test area 52 on the machine base 20, and a through hole 521 is defined in the sidewall of the test area 52, and at least one test seat is disposed on one side of the through hole 521. 54 and vertically arranged test circuit board 53 such that the insertion opening of the test socket 54 faces forward for inserting the semiconductor component to be tested, and transmits the test result to the central control unit by a tester (not shown) (not shown) The central control unit controls the operation of each device, and the temperature control unit 522 is disposed in the test area 52, and the test area 52 is converted into a normal temperature working environment, a high temperature working environment or a low temperature working environment. The test device 50 is configured to perform a test operation in a different temperature operating environment. The test device 50 can additionally add a drying pipe 55 to the working chamber 51 to deliver the dry air to the test zone 52 to form a dry zone. Space, in order to perform the cold test operation, and add a CCD image pickup 56 in the test area 52 for taking the angular direction of the semiconductor component to be tested or whether there is impurity or whether it is placed correctly, when the semiconductor component When the setting is not correct, the warning device may be used to perform the correcting position by using the material moving mechanism; the conveying device 60 is provided with a carrying mechanism 61 having at least one turntable 611 for moving to the feeding and receiving devices 30, 40 and The test device 50 is provided with a transfer mechanism 62 having at least one pick-up device for transferring semiconductor components between the supply and receiving devices 30, 40 and the turntable 611, and at least one pick-and-place device. When the pick-and-place mechanism 63 is in a horizontal state, the semiconductor component can be taken and placed on the turntable 611, and the semiconductor component to be tested can be inserted when the angle of the insertion port of the corresponding test socket 54 is rotated and placed. In the present embodiment, the carrier mechanism 61 is mounted in the test area 52 with a turntable 611 driven by a driving source, and the turntable 611 is provided with at least one semiconductor component. The accommodating slot 612 can circulate and carry the semiconductor component. In this embodiment, the turntable 611 is equiangularly disposed with eight accommodating slots 612, and at least one accommodating slot 612 is located outside the working room 51. The feeding mechanism 62 picks up and discharges the semiconductor component, and the carrying mechanism 61. According to the requirements of the operation, a temperature control device is added to each of the receiving slots 612 of the turntable 611 for controlling the temperature. The temperature control device can control the temperature of the cold chip or control the temperature by means of a refrigerant and a heat sink, or a liquid. The gas shifting mode controls the temperature; the material moving mechanism 62 is provided with a first pick-and-placer 621 and a second pick-and-placer 622 which can be used for the first, second and third axial displacements (that is, the XYZ axial displacement), A pick-and-placer 621 is configured to transfer the semiconductor component to be tested between the feeding device 30 and the turntable 611, and the second pick-and-placer 622 is a semiconductor component that is transferred between the receiving device 40 and the turntable 611, and the transfer mechanism The 63 series is provided with a driving source 631 of a turret 632, which may be a motor or a rotating cylinder. In the embodiment, the driving source 631 is a motor, and a rotating frame 632 is mounted on the rotating shaft of the motor. The turret 632 is provided with two first movable fixtures 633A having different angles and having a third pick-and-placer 634A and a second movable fixture 633B having a fourth pick-and-placer 634B. In this embodiment, An activity fixture 633A is located below the turret 632 and is horizontal and is located above the turret 632 The first driving source 635A drives the first movable fixture 633A to perform a third axial displacement, so that the third pick-and-placer 634A can take the semiconductor component, and the first driving source 635A can also be mounted on the upper frame outside the working area. Up, without moving with the first movable fixture 633A, the telescopic rod of the first driving source 635A pushes the first movable fixture 633A to extend the displacement in an abutting manner, and when the first movable fixture 633A is reset The tension spring is tensioned and reset thereon without being limited to the foregoing embodiment; the second movable fixture 633B is located on one side of the turret 632 and is in a vertical state, and is located on the other side of the turret 632. The second driving source 635B drives the second movable jig 633B for the second axial displacement, so that the fourth pick-and-placer 634B can take the semiconductor component, and the second driving source 635B can also be mounted on the upper frame outside the working area. Up, without moving with the second movable fixture 633B, the telescopic rod of the second driving source 635B pushes the second movable fixture 633B to extend the displacement in an abutting manner, and when the second movable fixture 633B is reset Retracted by the tension spring thereon, without being limited to the foregoing embodiment; According to the requirements of the cold test operation, the first and second temperature control devices are respectively installed on the first and second activity fixtures 633A and 633B to control the temperature, and the first and second temperature control devices can cool the wafer to control the temperature or In the embodiment, the first and second temperature control devices are respectively provided in the first and second movable fixtures 633A and 633B, respectively, for controlling the temperature of the refrigerant and the heat sink, or controlling the temperature by the liquid-gas conversion method. The two cooling fins 636A, 636B, the heat absorbing end of one end of the first and second cooling fins 636A, 636B form a cooling surface, and the heat releasing end of the other end forms a heat dissipating surface, and the cooling surfaces are respectively attached to the cooling surface The first and second movable fixtures 633A and 633B contact the semiconductor components through the first and second movable fixtures 633A and 633B, so that the semiconductor components perform the cold measurement operation in the simulated low temperature environment, and when the cold test operation is completed, the visual operation requirements are met. During the travel of the turn-on 611 to load the semiconductor device, the completed semiconductor device is gradually warmed to normal temperature, or the current directions of the first and second cooled wafers 636A, 636B are controlled to be bonded to the first, Two activity fixtures on 633A, 633B The surface is transformed into a heat dissipating surface, and the semiconductor element is contacted via the first and second movable jigs 633A, 633B, so that the completed semiconductor component can be quickly warmed to normal temperature, and the driving source 631 can use the turret 632 to drive the first and second activities. When the fixtures 633A, 633B and the third and fourth pick-and-placers 634A, 634B are alternately rotated in a horizontal state and a vertical state, when the third pick-and-placer 634A or the fourth pick-and-placer 634B is placed in a horizontal state, The semiconductor component can be placed on the turntable 611, and the third pick-and-placer 634A or the fourth pick-and-placer 634B can be placed in a vertical state to insert the semiconductor component to be tested into the test seat 54. Further, the transport device 60 An indexing mechanism for at least one angular direction of the semiconductor element can be added as needed, and the indexing mechanism can be independently mounted on the machine table 20, or can be mounted on the material transfer mechanism 62 or the transfer mechanism 63, and can be rotated. The bit mechanism converts the angular direction of the semiconductor component to be tested to conform to the angular direction of the test socket 54 and, after the test is completed, converts the angular direction of the semiconductor component to be placed in the receiving device 40; Indexing mechanism When being disposed on the machine table 20, at least one socket is provided for receiving the semiconductor component, and the rotation of the socket is controlled to change the angular direction of the semiconductor component, and then a transfer mechanism of the pick and place device is arranged to rotate The semiconductor device is transferred between the position mechanism and the turntable 611, and when the indexing mechanism is mounted on the transfer mechanism 62 or the transfer mechanism 63, the first and second pick-and-placers 621, 622 or the third and fourth pick-and-placers can be driven. 634A, 634B rotate, and change the angular direction of the semiconductor component. In the embodiment, the transport device 60 is provided with a first indexing mechanism 64A on the first pick-and-place 621 of the loading mechanism 62 for transforming The angular position of the semiconductor component to be tested is provided, and a second indexing mechanism 64B is disposed on the second pick-and-placer 622 for transforming the angular direction of the semiconductor component.
本發明可提供業者視半導體元件日後應用之環境溫度,而選擇對半導體元件作常溫測試作業、熱測作業或冷測作業,以淘汰出不良品;請參閱第5圖,係為本發明對半導體元件執行冷測作業之實施例,該移料機構62之第一取放器621即作X-Y-Z軸向位移至供料裝置30之料盤31處取出待測之半導體元件70,並移載至載送機構61處,於移載過程中,第一轉位機構64A可帶動第一取放器621及其上之待測半導體元件70轉動,而變換待測半導體元件70之角位方向,於變換角位方向完畢後,第一取放器621係將待測之半導體元件70置入於轉盤611之容置槽612A;請參閱第6、7、8圖,該載送機構61係驅動轉盤611旋轉,使轉盤611將待測之半導體元件70載送進入測試裝置50之測試區52內,並使待測之半導體元件70通過取像器56而取像角位方向,再載送至轉載機構63處,而轉盤611上之其他容置槽612B、612C、612D所承載之待測半導體元件71、72、73亦同步旋轉依序位移,接著轉載機構63係控制第一驅動源635A驅動第一活動治具633A作Z軸向位移,使第一活動治具633A上之第三取放器634A於轉盤611上之容置槽612A內取出待測之半導體元件70,並以第一致冷晶片636A預冷待測之半導體元件70,再以驅動源631控制轉動架632帶動第一、二活動治具633A、633B作180度旋轉而變換位置,使第一活動治具633A及其上之第三取放器634A擺置呈垂直狀態,第二活動治具633B及其上之第四取放器634B則擺置呈水平狀態,第一驅動源635A係驅動第一活動治具633A作Y軸向位移,使第三取放器634A將待測之半導體元件70置入壓抵於測試裝置50之測試座54內,而使得半導體元件70於模擬低溫環境中執行冷測作業,又由於測試座54之***口非朝向上方,並不會使冷測作業發生異常狀況時所凝結之水珠殘留於測試座54內,進而可提升測試良率及測試電路板53、測試座54之使用壽命;請參閱第9、10圖,轉盤611係載送待測之半導體元件71至轉載機構63處,轉載機構63可控制第二驅動源635B驅動第二活動治具633B作Z軸向位移,使第四取放器634B於轉盤611上之容置槽612B取出待測之半導體元件71,並以第二致冷晶片636B預冷待測之半導體元件71;請參閱第11、12圖,於半導體元件70測試完畢後,轉載機構63之第一驅動源635A係驅動第一活動治具633A作Y軸向反向位移,使第三取放器634A於測試座54內取出完測之半導體元件70,再以驅動源631控制轉動架632帶動第一、二活動治具633A、633B作180度反向旋轉而變換位置,使第一活動治具633A及其上之第三取放器634A擺置呈水平狀態,第二活動治具633B及其上之第四取放器634B則擺置呈垂直狀態,接著控制第一驅動源635A驅動第一活動治具633A作Z軸向位移,使第三取放器634A將完測之半導體元件70置入於轉盤611上之容置槽612B,而第二驅動源635B則驅動第二活動治具633B作Y軸向位移,使第四取放器634B將待測之半導體元件71置入壓抵於測試裝置50之測試座54內,而使得半導體元件71於模擬低溫環境中執行冷測作業,之後,該轉盤611係旋轉作動將完測之半導體元件70載離轉載機構63,並使待測之半導體元件72位於轉載機構63處以供取料;請參閱第13、14圖,該轉盤611係將完測之半導體元件70載出作業室51,移料機構62之第二取放器622即作X-Y-Z軸向位移於轉盤611上取出完測之半導體元件70,接著以第二轉位機構64B帶動第二取放器622及其上之完測半導體元件70轉動,而變換完測半導體元件70之角位方向,於變換角位方向完畢後,第二取放器622再依測試結果(如良品半導體元件、不良品半導體元件或次級品半導體元件)而直接將完測之半導體元件70移載至收料裝置40之料盤41上,以完成分類收置作業。The invention can provide the ambient temperature for the semiconductor component to be applied in the future, and select the semiconductor component for the normal temperature test operation, the thermal test operation or the cold test operation to eliminate the defective product; refer to FIG. 5, which is the semiconductor of the present invention. An embodiment in which the component performs a cold-test operation, the first pick-and-placer 621 of the material transfer mechanism 62 is axially displaced to the tray 31 of the feeding device 30, and the semiconductor component 70 to be tested is taken out and transferred to the load. At the feeding mechanism 61, during the transfer process, the first indexing mechanism 64A can drive the first pick-and-placer 621 and the semiconductor component 70 to be tested to rotate, and transform the angular direction of the semiconductor component 70 to be tested. After the angular direction is completed, the first pick-and-place device 621 places the semiconductor component 70 to be tested into the receiving groove 612A of the turntable 611; please refer to FIGS. 6, 7, and 8, the driving mechanism 61 drives the turntable 611. Rotating, the turntable 611 carries the semiconductor component 70 to be tested into the test area 52 of the test device 50, and causes the semiconductor component 70 to be tested to pass through the image pickup unit 56 to take an angular position and then carry it to the transfer mechanism. 63, and other accommodating slots on the turntable 611 The semiconductor elements 71, 72, and 73 to be tested carried by the 612B, 612C, and 612D are also synchronously rotated in sequence, and then the transfer mechanism 63 controls the first driving source 635A to drive the first movable fixture 633A to perform Z-axis displacement. The third pick-and-place 634A of the movable fixture 633A takes out the semiconductor component 70 to be tested in the accommodating groove 612A on the turntable 611, and pre-cools the semiconductor component 70 to be tested with the first chilled wafer 636A, and then The driving source 631 controls the turret 632 to drive the first and second movable jigs 633A and 633B to rotate 180 degrees to change the position, so that the first movable jig 633A and the third pick-and-placer 634A thereon are placed in a vertical state. The second movable fixture 633B and the fourth pick-and-placer 634B thereon are placed in a horizontal state, and the first driving source 635A drives the first movable fixture 633A to perform Y-axis displacement, so that the third pick-and-placer 634A will be The measured semiconductor component 70 is placed in the test socket 54 of the test device 50, so that the semiconductor component 70 performs the cold test operation in a simulated low temperature environment, and since the insertion port of the test socket 54 is not facing upward, it does not cause Residual water droplets when an abnormal condition occurs in a cold test operation In the test socket 54, the test yield and the service life of the test circuit board 53 and the test socket 54 can be improved; refer to the figures 9 and 10, the turntable 611 carries the semiconductor component 71 to be tested to the transfer mechanism 63, and is reproduced. The mechanism 63 can control the second driving source 635B to drive the second movable jig 633B for Z-axis displacement, so that the fourth pick-and-placer 634B takes out the semiconductor component 71 to be tested on the receiving slot 612B on the turntable 611, and The cooled wafer 636B pre-cools the semiconductor component 71 to be tested; please refer to FIGS. 11 and 12, after the semiconductor component 70 is tested, the first driving source 635A of the transfer mechanism 63 drives the first movable fixture 633A as the Y-axis. The reverse displacement causes the third pick-and-placer 634A to take out the tested semiconductor component 70 in the test socket 54 and control the turret 632 with the driving source 631 to drive the first and second movable fixtures 633A, 633B to rotate 180 degrees. And changing the position, the first movable fixture 633A and the third pick-and-placer 634A thereon are placed in a horizontal state, and the second movable fixture 633B and the fourth pick-and-placer 634B thereon are placed in a vertical state. Then controlling the first driving source 635A to drive the first movable fixture 633A as the Z axis The displacement is such that the third pick-and-placer 634A places the completed semiconductor component 70 on the receiving groove 612B on the turntable 611, and the second driving source 635B drives the second movable jig 633B to be displaced in the Y-axis direction. The fourth pick-and-placer 634B places the semiconductor component 71 to be tested into the test socket 54 pressed against the test device 50, so that the semiconductor component 71 performs a cold test operation in a simulated low temperature environment, after which the turntable 611 is rotated. The completed semiconductor component 70 is carried away from the transfer mechanism 63, and the semiconductor component 72 to be tested is located at the transfer mechanism 63 for reclaiming; refer to Figures 13 and 14, the turntable 611 is to be completed by the semiconductor component 70. Out of the working chamber 51, the second pick-and-placer 622 of the loading mechanism 62 is XYZ axially displaced on the turntable 611 to take out the tested semiconductor component 70, and then the second pick-up mechanism 64B drives the second pick-and-placer 622 and After the measurement, the semiconductor component 70 is rotated, and the angular direction of the semiconductor component 70 is changed. After the direction of the conversion angle is completed, the second pick-and-placer 622 is further tested according to the test result (such as a good semiconductor component or a defective semiconductor component). Or secondary semiconductor components) Direct measurement of the finished semiconductor element 70 is transferred to the receiving material feeding device 40 of the disc 41, to complete the job classification stowed.
請參閱第4、15圖,係本發明配置轉位機構之另一實施例,該機台20上係配置有供料裝置30、收料裝置40、測試裝置50及輸送裝置60;該供料裝置30係設有至少一料盤31,用以盛裝複數個待測之半導體元件;該收料裝置40係設有至少一料盤41,用以盛裝複數個完測之半導體元件;該測試裝置50係設有至少一測試區,並於測試區設有具至少一測試座之測試電路板,且使測試座之***口非朝向上方,用以測試半導體元件,於本實施例中,該測試裝置50係於機台20上設有一具至少一測試區52之作業室51,並於測試區52之側壁上開設有通孔521,而於通孔521之一側設有具至少一測試座54且垂直配置之測試電路板53,使得測試座54之***口朝向前方,供***待測之半導體元件,並以測試器(圖未示出)將測試結果傳輸至中央控制單元(圖未示出),由中央控制單元控制各裝置作動,又該測試區52內係設有溫控器522,而可視測試作業需求,將測試區52變換為一常溫作業環境、高溫作業環境或低溫作業環境等,使半導體元件於不同溫度之作業環境下執行測試作業,另測試裝置50可視需求於作業室51上增設有一可輸送乾燥空氣至測試區52之輸送管55,使測試區52形成一乾燥空間,以利執行冷測作業,並於測試區52增設至少一為CCD之取像器56,用以取像待測半導體元件之角位方向或是否有雜質或是否擺置正確,當半導體元件擺置不正確時,可進行警告或使用移料機構進行修正擺置位置;該輸送裝置60之載送機構61係於測試區52內裝設有至少一由驅動源驅動旋轉之轉盤611,轉盤611上係等角配置有八個容置槽612,並使至少一容置槽612位於作業室51之外部,以供移料機構62取放半導體元件,另該載送機構61可視作業需求,於轉盤611之各容置槽612處增設溫控裝置,用以控制溫度,該溫控裝置可以致冷晶片控溫或以冷媒與散熱片的方式控溫,亦或以液氣轉換方式控溫;該移料機構62係設有二可作第一、二、三軸向位移(即為X-Y-Z軸向位移)之第一取放器621及第二取放器622,第一取放器621係用以移載待測之半導體元件,第二取放器622係用以移載完測之半導體元件,該轉載機構63係設有一為馬達之驅動源631,並於驅動源631之轉軸上裝設有轉動架632,轉動架632上係設有二呈不同角度配置且具第三取放器634A之第一活動治具633A及具第四取放器634B之第二活動治具633B,於本實施例中,第一活動治具633A係位於轉動架632之下方且呈水平狀態,並以一位於轉動架632上方之第一驅動源635A驅動第一活動治具633A作第三軸向位移,使第三取放器634A取放半導體元件,另該第一驅動源635A亦可架設於作業區外之上方機架上,而不隨著第一活動治具633A移動,第一驅動源635A之伸縮桿並以抵頂的方式頂推第一活動治具633A作伸出位移,第一活動治具633A復位時則由其上之拉伸彈簧拉伸復位,而不限於前述之實施例;第二活動治具633B係位於轉動架632之一側方且呈垂直狀態,並以一位於轉動架632另一側方之第二驅動源635B驅動第二活動治具633B作第二軸向位移,使第四取放器634B取放半導體元件,另該第二驅動源635B亦可架設於作業區外之上方機架上,而不隨著第二活動治具633B移動,第二驅動源635B之伸縮桿並以抵頂的方式頂推第二活動治具633B作伸出位移,第二活動治具633B復位時則由其上之拉伸彈簧拉伸復位,而不限於前述之實施例;另可視冷測作業需求,於第一、二活動治具633A、633B內分別裝設有第一、二溫控裝置,用以控制溫度,第一、二溫控裝置可以致冷晶片控溫或以冷媒與散熱片的方式控溫,亦或以液氣轉換方式控溫,於本實施例中,第一、二溫控裝置係分別於第一、二活動治具633A、633B內設有第一、二致冷晶片636A、636B,第一、二致冷晶片636A、636B一端之吸熱端係形成一冷卻面,另一端之放熱端則形成一散熱面,並以各冷卻面分別貼合於第一、二活動治具633A、633B,經由第一、二活動治具633A、633B接觸半導體元件,使得半導體元件於模擬低溫環境中執行冷測作業,於執行冷測作業完畢後,係可視作業需求,於轉盤611載出完測半導體元件之行程中,使完測之半導體元件逐漸回溫至常溫,亦或控制第一、二致冷晶片636A、636B之電流方向,使貼合於第一、二活動治具633A、633B上之該面變換為散熱面,並經由第一、二活動治具633A、633B接觸半導體元件,使完測之半導體元件可迅速回溫至常溫,進而驅動源631可利用轉動架632帶動第一、二活動治具633A、633B及其上之第三、四取放器634A、634B旋轉交替變換呈水平狀態及垂直狀態,使第三取放器634A或第四取放器634B擺置呈水平狀態時,可於轉盤611上取放半導體元件,並使第三取放器634A或第四取放器63B擺置呈垂直狀態將待測之半導體元件插置於測試座54;另該輸送裝置60係於供料裝置30、收料裝置40及轉盤611間獨立配置有至少一具承座之轉位機構,於本實施例中,係於供料裝置30及轉盤611間配置一具承座641C之第三轉位機構64C,用以變換待測半導體元件之角位方向,而符合測試座54的角位方向,並於收料裝置40及轉盤611間配置一具承座641D之第四轉位機構64D,用以變換完測半導體元件之角位方向,以利收置於收料裝置40;又該輸送裝置60係於第三轉位機構64C及第四轉位機構64D之側方設有具至少一取放器之移載機構65,用以於第三轉位機構64C、第四轉位機構64D及轉盤611間移載待測/完測之半導體元件,於本實施例中,移載機構65係設有第五取放器651及第六取放器652,第五取放器651係於第三轉位機構64C及轉盤611間移載已變換角位方向之待測半導體元件,第六取放器652係於第四轉位機構64D及轉盤611間移載完測半導體元件。Referring to Figures 4 and 15, another embodiment of the present invention provides a positioning mechanism. The machine 20 is provided with a feeding device 30, a receiving device 40, a testing device 50 and a conveying device 60; The device 30 is provided with at least one tray 31 for holding a plurality of semiconductor components to be tested; the receiving device 40 is provided with at least one tray 41 for holding a plurality of completed semiconductor components; the testing device The 50 series is provided with at least one test area, and a test circuit board having at least one test socket is disposed in the test area, and the insertion opening of the test socket is not facing upward for testing the semiconductor component. In this embodiment, the test The device 50 is provided with a working chamber 51 having at least one test area 52 on the machine base 20, and a through hole 521 is defined in the sidewall of the test area 52, and at least one test seat is disposed on one side of the through hole 521. 54 and vertically arranged test circuit board 53 such that the insertion opening of the test socket 54 faces forward for inserting the semiconductor component to be tested, and transmits the test result to the central control unit by a tester (not shown) (not shown) Out), the central control unit controls the operation of each device, Moreover, the temperature control unit 522 is disposed in the test area 52, and the test area 52 is converted into a normal temperature working environment, a high temperature working environment or a low temperature working environment, so that the semiconductor components can be operated under different temperature conditions. The test device 50 is further provided with a delivery pipe 55 that can deliver dry air to the test area 52, so that the test area 52 forms a dry space for performing the cold test operation and is in the test area. 52 is provided with at least one CCD image pickup unit 56 for taking the angular direction of the semiconductor component to be tested or whether there is impurity or whether it is placed correctly. When the semiconductor component is placed incorrectly, warning or use of the material can be performed. The mechanism is configured to correct the placement position; the carrier mechanism 61 of the transport device 60 is provided with at least one turntable 611 driven by the driving source, and eight accommodating slots 612 are arranged equiangularly on the turntable 611. And at least one accommodating groove 612 is located outside the working chamber 51 for the loading and unloading mechanism 62 to pick up and place the semiconductor component, and the carrying mechanism 61 is increased at each accommodating groove 612 of the turntable 611 according to the operation requirement. The temperature control device is configured to control the temperature, and the temperature control device can control the temperature of the cold chip or control the temperature by means of a refrigerant and a heat sink, or control the temperature by means of liquid-gas conversion; the material-feeding mechanism 62 is provided with two a first pick-and-placer 621 and a second pick-and-placer 622 for first, second, and third axial displacements (ie, XYZ axial displacement), and the first pick-and-placer 621 is configured to transfer the semiconductor component to be tested. The second pick-and-placer 622 is configured to transfer the completed semiconductor component. The transfer mechanism 63 is provided with a driving source 631 for the motor, and a rotating frame 632 is mounted on the rotating shaft of the driving source 631. The rotating frame 632 is mounted on the rotating frame 632. The first movable fixture 633A having the third pick-and-placer 634A and the second movable fixture 633B having the fourth pick-and-placer 634B are disposed in the first movable fixture. The 633A is located below the turret 632 and is horizontal, and drives the first movable fixture 633A for a third axial displacement by a first driving source 635A located above the turret 632, so that the third pick-and-place 634A is placed and lowered. The semiconductor component, the first driving source 635A can also be mounted on the upper frame outside the working area without The first movable fixture 633A moves, the telescopic rod of the first driving source 635A pushes the first movable fixture 633A to extend the displacement in an abutting manner, and the first movable fixture 633A is pulled up by the upper movable fixture 633A. The extension spring is tension-reset, and is not limited to the foregoing embodiment; the second movable fixture 633B is located on one side of the turret 632 and is in a vertical state, and is a second driving source located on the other side of the turret 632. The 635B drives the second movable fixture 633B to perform a second axial displacement, so that the fourth pick-and-placer 634B can take the semiconductor component, and the second driving source 635B can also be mounted on the upper frame outside the working area without The second movable fixture 633B moves, the telescopic rod of the second driving source 635B pushes the second movable fixture 633B to extend the displacement in a topping manner, and the second movable fixture 633B is pulled by the upper movable fixture 633B. Stretching and tensioning of the extension spring is not limited to the foregoing embodiment; in addition, the first and second temperature control devices are respectively installed in the first and second movable fixtures 633A and 633B to control the temperature, as shown in the cold test operation requirement. The first and second temperature control devices can cool the wafer to control the temperature or use the refrigerant and the heat sink In the present embodiment, the first and second temperature control devices are respectively provided with first and second cooling chips in the first and second movable fixtures 633A and 633B, respectively. 636A, 636B, the heat absorbing end of one end of the first and second refrigerating wafers 636A, 636B forms a cooling surface, and the heat releasing end of the other end forms a heat dissipating surface, and the cooling surfaces are respectively attached to the first and second active treatments. 633A, 633B, through the first and second movable fixtures 633A, 633B contact semiconductor components, so that the semiconductor components in the simulated low temperature environment to perform the cold test operation, after the completion of the cold test operation, according to the operational requirements, on the turntable 611 After the completion of the measurement of the semiconductor component, the completed semiconductor component is gradually warmed to normal temperature, or the current directions of the first and second cooled wafers 636A, 636B are controlled to be bonded to the first and second movable fixtures 633A. The surface on 633B is converted into a heat dissipating surface, and the semiconductor element is contacted via the first and second movable fixtures 633A, 633B, so that the completed semiconductor component can be quickly warmed to normal temperature, and the driving source 631 can be driven by the turret 632. the first, The movable fixtures 633A, 633B and the third and fourth pick-and-placers 634A, 634B thereon are alternately rotated into a horizontal state and a vertical state, so that the third pick-and-placer 634A or the fourth pick-and-placer 634B is placed horizontally. The semiconductor component can be placed on the turntable 611, and the third pick-and-placer 634A or the fourth pick-and-placer 63B can be placed in a vertical state to insert the semiconductor component to be tested into the test seat 54. The transport device 60 is also attached. At least one bearing indexing mechanism is disposed independently between the feeding device 30, the receiving device 40 and the turntable 611. In the present embodiment, a socket 641C is disposed between the feeding device 30 and the turntable 611. The third indexing mechanism 64C is configured to change the angular direction of the semiconductor component to be tested, and conform to the angular orientation of the test socket 54, and configure a fourth index of the socket 641D between the receiving device 40 and the turntable 611. The mechanism 64D is configured to change the angular direction of the semiconductor component to be placed in the receiving device 40. The conveying device 60 is disposed on the side of the third indexing mechanism 64C and the fourth indexing mechanism 64D. a transfer mechanism 65 having at least one pick and place device for the third indexing mechanism 64C, fourth In the present embodiment, the transfer mechanism 65 is provided with a fifth pick-and-placer 651 and a sixth pick-and-place 652, and the fifth pick-and-place device is disposed between the indexing mechanism 64D and the turntable 611. The device 651 is configured to transfer the semiconductor component to be tested in the direction of the converted angular position between the third indexing mechanism 64C and the turntable 611, and the sixth pick-and-placer 652 is connected between the fourth indexing mechanism 64D and the turntable 611 to transfer the semiconductor. element.
請參閱第16圖,係為本發明對半導體元件執行冷測作業之實施例,該移料機構62之第一取放器621即作X-Y-Z軸向位移至供料裝置30之料盤31處取出待測之半導體元件70,並移載至第三轉位機構64C之承座641C上,第三轉位機構64C即帶動承座641C轉動而變換待測半導體元件70之角位方向;請參閱第17圖,當第三轉位機構64C變換待測半導體元件70之角位方向完畢後,移載機構65之第五取放器651係於第三轉位機構64C上取出已變換角位方向之待測半導體元件70,並移載至轉盤611上之容置槽612A;請參閱第7、8、18圖,該載送機構61係驅動轉盤611旋轉,使轉盤611將待測之半導體元件70載送進入測試裝置50之測試區52,並使待測之半導體元件70通過取像器56而取像角位方向,再載送至轉載機構63處,而轉盤611上之其他容置槽612B、612C、612D所承載之待測半導體元件71、72、73亦同步旋轉依序位移,接著轉載機構63係控制第一驅動源635A驅動第一活動治具633A作Z軸向位移,使第一活動治具633A上之第三取放器634A於轉盤611上之容置槽612A內取出待測之半導體元件70,並以第一致冷晶片636A預冷待測之半導體元件70,再以驅動源631控制轉動架632帶動第一、二活動治具633A、633B作180度旋轉而變換位置,使第一活動治具633A及其上之第三取放器634A擺置呈垂直狀態,第二活動治具633B及其上之第四取放器634B則擺置呈水平狀態,第一驅動源635A係驅動第一活動治具633A作Y軸向位移,使第三取放器634A將待測之半導體元件70置入壓抵於測試裝置50之測試座54內,而使得半導體元件70於模擬低溫環境中執行冷測作業,又由於測試座54之***口非朝向上方,並不會使冷測作業發生異常狀況時所凝結之水珠殘留於測試座54內,進而可提升測試良率及測試電路板53、測試座54之使用壽命;請參閱第10、19圖,轉盤611係載送待測之半導體元件71至轉載機構63處,轉載機構63可控制第二驅動源635B驅動第二活動治具633B作Z軸向位移,使第四取放器634B於轉盤611上之容置槽612B取出待測之半導體元件71,並以第二致冷晶片636B預冷待測之半導體元件71;請參閱第11、20圖,於半導體元件70測試完畢後,轉載機構63之第一驅動源635A係驅動第一活動治具633A作Y軸向反向位移,使第三取放器634A於測試座54內取出完測之半導體元件70,再以驅動源631控制轉動架632帶動第一、二活動治具633A、633B作180度反向旋轉而變換位置,使第一活動治具633A及其上之第三取放器634A擺置呈水平狀態,第二活動治具633B及其上之第四取放器634B則擺置呈垂直狀態,接著控制第一驅動源635A驅動第一活動治具633A作Z軸向位移,使第三取放器634A將完測之半導體元件70置入於轉盤611上之容置槽612B,而第二驅動源635B則驅動第二活動治具633B作Y軸向位移,使第四取放器634B將待測之半導體元件71置入壓抵於測試裝置50之測試座54內,而使得半導體元件71於模擬低溫環境中執行冷測作業,之後,該轉盤611係旋轉作動將完測之半導體元件70載離轉載機構63,並使待測之半導體元件72位於轉載機構63處以供取料;請參閱第21圖,該轉盤611係將完測之半導體元件70載出作業室51,移載機構65之第六取放器652即作X-Z軸向位移於轉盤611上取出完測之半導體元件70;請參閱第22圖,移載機構65之第六取放器652係將完測之半導體元件70移載置入於第四轉位機構64D之承座641D上,第四轉位機構64D即帶動承座641D轉動而變換完測半導體元件70之角位方向,於完測之半導體元件70變換角位方向後,第二取放器622即作X-Y-Z軸向位移於第四轉位機構64D之承座641D上取出已變換角位方向之完測半導體元件70;請參閱第23圖,移料機構62之第二取放器622係依測試結果(如良品半導體元件、不良品半導體元件或次級品半導體元件)而直接將完測之半導體元件70移載至收料裝置40之料盤41上,以完成分類收置作業。Referring to FIG. 16, which is an embodiment of the present invention for performing a cold-test operation on a semiconductor device, the first pick-and-placer 621 of the material transfer mechanism 62 is axially displaced to the tray 31 of the feeding device 30. The semiconductor component 70 to be tested is transferred to the socket 641C of the third indexing mechanism 64C, and the third indexing mechanism 64C rotates the socket 641C to change the angular direction of the semiconductor component 70 to be tested; 17, after the third indexing mechanism 64C converts the angular direction of the semiconductor component 70 to be tested, the fifth pick-and-placer 651 of the transfer mechanism 65 is attached to the third indexing mechanism 64C to take out the direction of the converted angular position. The semiconductor component 70 to be tested is transferred to the accommodating groove 612A on the turntable 611; referring to Figures 7, 8, and 18, the carrier mechanism 61 drives the turntable 611 to rotate, so that the turntable 611 will be the semiconductor component 70 to be tested. It is carried into the test area 52 of the test device 50, and the semiconductor component 70 to be tested is taken in the angular direction by the image pickup unit 56, and then carried to the transfer mechanism 63, and the other receiving groove 612B on the turntable 611. The semiconductor components 71, 72, and 73 to be tested carried by the 612C and 612D are also synchronously rotated. The displacement mechanism, then the transfer mechanism 63 controls the first driving source 635A to drive the first movable jig 633A for Z-axis displacement, so that the third pick-and-place 634A of the first movable jig 633A is placed on the turntable 611. The semiconductor component 70 to be tested is taken out in 612A, and the semiconductor component 70 to be tested is pre-cooled by the first refrigerant chip 636A, and then the turret 632 is driven by the driving source 631 to drive the first and second movable fixtures 633A, 633B to 180 degrees. Rotating to change position, so that the first movable fixture 633A and the third pick-and-placer 634A thereon are placed in a vertical state, and the second movable fixture 633B and the fourth pick-and-placer 634B thereon are placed horizontally. The first driving source 635A drives the first movable fixture 633A for Y-axis displacement, so that the third pick-and-placer 634A puts the semiconductor component 70 to be tested into the test socket 54 of the testing device 50, so that The semiconductor device 70 performs the cold test operation in the simulated low temperature environment, and since the insertion port of the test seat 54 is not facing upward, the condensation water does not remain in the test seat 54 when the cold test operation is abnormal. Improve test yield and test circuit board 53, test seat 54 The service life; please refer to FIGS. 10 and 19, the turntable 611 carries the semiconductor component 71 to be tested to the transfer mechanism 63, and the transfer mechanism 63 can control the second drive source 635B to drive the second movable jig 633B for Z-axis displacement. The fourth pick-and-placer 634B takes out the semiconductor component 71 to be tested on the receiving slot 612B on the turntable 611, and pre-cools the semiconductor component 71 to be tested with the second refrigerant wafer 636B; see Figures 11, 20, After the semiconductor component 70 is tested, the first driving source 635A of the transfer mechanism 63 drives the first movable fixture 633A to perform a Y-axis reverse displacement, so that the third pick-and-placer 634A takes out the tested semiconductor in the test socket 54. The component 70 is further controlled by the driving source 631 to drive the first and second movable jigs 633A, 633B to rotate 180 degrees to change the position, so that the first movable jig 633A and the third pick-and-place 634A thereon The second movable fixture 633B and the fourth pick-and-placer 634B thereon are placed in a vertical state, and then the first driving source 635A is controlled to drive the first movable fixture 633A to perform Z-axis displacement. The third pick-and-placer 634A places the completed semiconductor component 70 on the turntable 61. The second driving source 635B drives the second movable jig 633B for Y-axis displacement, so that the fourth pick-and-placer 634B puts the semiconductor component 71 to be tested into the test device 50. In the test socket 54, the semiconductor component 71 is subjected to a cold test operation in a simulated low temperature environment. Thereafter, the turntable 611 is rotated to carry the completed semiconductor component 70 away from the transfer mechanism 63, and the semiconductor component 72 to be tested. It is located at the transfer mechanism 63 for reclaiming; referring to Fig. 21, the turntable 611 carries the finished semiconductor component 70 out of the working chamber 51, and the sixth pick-and-place 652 of the transfer mechanism 65 is XZ axially displaced. The semiconductor component 70 is removed from the turntable 611; referring to FIG. 22, the sixth pick-and-place 652 of the transfer mechanism 65 is configured to transfer the completed semiconductor component 70 to the socket of the fourth indexing mechanism 64D. In the 641D, the fourth indexing mechanism 64D rotates the socket 641D to change the angular direction of the semiconductor component 70. After the measured semiconductor component 70 changes the angular position, the second pick-and-placer 622 acts as the XYZ axis. The displacement to the socket 641D displaced to the fourth indexing mechanism 64D has been changed. The semiconductor component 70 is tested in the angular direction; referring to Fig. 23, the second pick and place 622 of the transfer mechanism 62 is directly dependent on the test result (such as a good semiconductor component, a defective semiconductor component, or a secondary semiconductor component). The completed semiconductor component 70 is transferred to the tray 41 of the receiving device 40 to complete the sorting and receiving operation.
請參閱第24、25圖,係本發明之第二實施例,該半導體元件測試分類機係於機台20上配置有供料裝置30、收料裝置40、測試裝置50及輸送裝置80;該供料裝置30係用以容納至少一待測之半導體元件,於本實施例中,該供料裝置30係設有至少一料盤31,用以盛裝複數個待測之半導體元件;該收料裝置40係用以容納至少一完測之半導體元件,於本實施例中,該收料裝置40係設有至少一料盤41,用以盛裝複數個完測之半導體元件;該測試裝置50係設有至少一測試區,並於測試區設有具至少一測試座之測試電路板,且使測試座之***口非朝向上方,用以測試半導體元件,於本實施例中,該測試裝置50係於機台20上設有一具至少一測試區52之作業室51,並於測試區52之側壁上開設有通孔521,而於通孔521之一側設有具至少一測試座54且垂直配置之測試電路板53,使得測試座54之***口朝向前方,供***待測之半導體元件,並以測試器(圖未示出)將測試結果傳輸至中央控制單元(圖未示出),由中央控制單元控制各裝置作動,又該測試裝置50可視測試作業需求,於測試區52內設有溫控器522,用以將測試區52變換為一常溫作業環境、高溫作業環境或低溫作業環境等,使半導體元件於不同溫度之作業環境下執行測試作業,另測試裝置50可視需求於作業室51上增設一輸送乾燥空氣至測試區52之輸送管55,使測試區52形成一乾燥空間,以利執行冷測作業,並於測試區52增設一為CCD之取像器56,用以取像待測半導體元件之角位方向或是否有雜質或是否擺置正確,當半導體元件擺置不正確時,可進行警告或使用移料機構進行修正擺置位置;該輸送裝置80係設有具至少一第一載台811及第二載台812之載送機構81,用以於供、收料裝置30、40及測試裝置50間載送半導體元件,並設有具至少一取放器之移料機構82,用以於供、收料裝置30、40及第一、二載台811、812間移載半導體元件,另設有具至少一取放器之轉載機構83,其取放器係擺置呈水平狀態時,可於第一、二載台811、812上取放半導體元件,並於旋轉擺置對應測試座54***口之角度狀態時,可將待測之半導體元件插置於測試座54內測試,於本實施例中,該載送機構81係於測試座54之一側方設有一由驅動源驅動作第二軸向位移之第一載台811,並於測試座54之另一側方設有一由驅動源驅動作第二軸向位移之第二載台812,可視作業需求,以第一載台811載送待測之半導體元件,第二載台812載送完測之半導體元件,亦或使第一、二載台811、812均可載送待測/完測之半導體元件,於本實施例中,第一載台811係載送待測之半導體元件,第二載台812則載送完測之半導體元件,另可視冷測作業需求,於第一載台811上裝設有第一溫控裝置,用以控制溫度,第一溫控裝置可以致冷晶片控溫或以冷媒與散熱片的方式控溫,亦或以液氣轉換方式控溫,於本實施例中,該第一溫控裝置係於第一載台811上裝設第一致冷晶片813,第一致冷晶片813係以一端之冷卻面預冷半導體元件,於執行冷測作業完畢後,第二載台812載出完測半導體元件之行程中,可使完測之半導體元件逐漸回溫至常溫,亦可視作業需求,於第二載台812上裝設有第二溫控裝置,用以控制溫度,第二溫控裝置可以致冷晶片控溫或以冷媒與散熱片的方式控溫,亦或以液氣轉換方式控溫,於本實施例中,該第二溫控裝置係於第二載台812上裝設第二致冷晶片814,並控制第二致冷晶片814之電流方向,以一端之散熱面使完測之半導體元件迅速回溫至常溫,該移料機構82係設有二可作第一、二、三軸向位移之第一取放器821及第二取放器822,第一取放器821係於供料裝置30及第一載台811間移載待測之半導體元件,第二取放器822係於收料裝置40及第二載台812間移載完測之半導體元件,該轉載機構83係於作業室51之外部固設有具第一轉軸832之第一驅動源831,第一驅動源831可為馬達或旋轉缸,於本實施例中,第一驅動源831係為馬達,第一轉軸832係為栓槽軸,並於第一轉軸832之兩端裝設有第一、二連動件833A、833B,第一、二連動件833A、833B係分別開設有可與第一轉軸832相互配合組裝之栓槽孔,使第一轉軸832可帶動第一、二連動件833A、833B轉動,又於第一連動件833A上係裝設有具第二轉軸835之第二驅動源834,該第二驅動源834可為馬達或旋轉缸,於本實施例中,第二驅動源834係為馬達,第二轉軸835係為螺桿,其兩端係連結第一、二連動件833A、833B,另於第一、二轉軸832、835上裝配一具活動治具837之第三驅動源836,該第三驅動源836可為馬達或壓缸,於本實施例中,該第三驅動源836係為壓缸,並於相對應第一轉軸832之位置開設有可相互配合之栓槽孔,於相對應第二轉軸835之位置開設有可相互配合之螺孔,使得第三驅動源836可由第一轉軸832帶動旋轉,並由第二轉軸835帶動作X軸向位移,又該活動治具837之下方則設有第三取放器838,用以取放半導體元件,進而第一驅動源831之第一轉軸832可帶動第二驅動源834、第三驅動源836及第三取放器838等元件作角度旋轉,使第三取放器838旋轉變換呈水平狀態或垂直狀態,於第三取放器838擺置呈水平狀態時,可於第一、二載台811、812上取放半導體元件,於第三取放器838擺置呈垂直狀態時,可將待測之半導體元件插置於測試座54,第二驅動源834之第二轉軸835係帶動第三驅動源836及第三取放器838等元件作第一軸向位(與)移至測試座54前方或第一、二載台811、812處取放料,第三驅動源836則帶動活動治具837及第三取放器838作伸縮位移於第一、二載台811、812及測試座54上取放料,再者,該輸送裝置80可視需求增設有至少一可變換半導體元件之角位方向的轉位機構,該轉位機構之配置如同第一實施例,係可獨立裝配於機台20或移料機構82或轉載機構83上,而利用轉位機構變換待測半導體元件之角位方向,以符合測試座54的角位方向,並於測試完畢後,再變換完測半導體元件之角位方向,以利收置於收料裝置40。Referring to Figures 24 and 25, a second embodiment of the present invention, the semiconductor component test sorting machine is provided with a feeding device 30, a receiving device 40, a testing device 50 and a conveying device 80 on the machine table 20; The feeding device 30 is configured to receive at least one semiconductor component to be tested. In the embodiment, the feeding device 30 is provided with at least one tray 31 for holding a plurality of semiconductor components to be tested; The device 40 is configured to receive at least one semiconductor component. In the embodiment, the receiving device 40 is provided with at least one tray 41 for holding a plurality of completed semiconductor components. The testing device 50 is At least one test area is provided, and a test circuit board having at least one test socket is disposed in the test area, and the insertion port of the test socket is not facing upward for testing the semiconductor component. In the embodiment, the test device 50 A working chamber 51 having at least one test area 52 is disposed on the machine 20, and a through hole 521 is defined in a sidewall of the test area 52, and at least one test seat 54 is disposed on one side of the through hole 521. The test board 53 is vertically arranged so that the test stand 54 The insertion port faces forward for inserting the semiconductor component to be tested, and transmits the test result to a central control unit (not shown) by a tester (not shown), and the central control unit controls the operation of each device, and the test The device 50 is provided with a temperature controller 522 in the test area 52 for converting the test area 52 into a normal temperature working environment, a high temperature working environment or a low temperature working environment, so that the semiconductor components can be operated at different temperatures. The test device 50 performs a test operation, and the test device 50 can add a drying air to the working chamber 51 to the delivery pipe 55 of the test area 52, so that the test area 52 forms a dry space for performing the cold test operation and is in the test area. 52 is further provided with a CCD image pickup unit 56 for taking the angular orientation of the semiconductor component to be tested or whether there is impurity or whether it is placed correctly. When the semiconductor component is improperly placed, a warning or a moving mechanism can be used. The feeding device 80 is provided with a carrying mechanism 81 having at least one first loading stage 811 and a second loading stage 812 for the feeding and receiving devices 30, 40 and the testing device 5 0 carries a semiconductor component, and is provided with a transfer mechanism 82 having at least one pick-up device for transferring semiconductor components between the supply and receiving devices 30, 40 and the first and second stages 811, 812, and A transfer mechanism 83 having at least one pick-and-place device is provided. When the pick-and-place device is placed in a horizontal state, the semiconductor component can be taken and placed on the first and second stages 811 and 812, and the corresponding test seat is rotated and placed. When the angle of the insertion port is 54, the semiconductor component to be tested can be inserted into the test socket 54 for testing. In this embodiment, the carrier mechanism 81 is driven by a driving source on one side of the test socket 54. a second stage 811 of the second axial displacement, and a second stage 812 driven by the driving source for the second axial displacement on the other side of the test seat 54 is visible for the first load. The stage 811 carries the semiconductor component to be tested, the second stage 812 carries the tested semiconductor component, or the first and second stages 811 and 812 can carry the semiconductor component to be tested/finished. In the embodiment, the first stage 811 carries the semiconductor component to be tested, and the second stage 812 carries the measured semiconductor The component, in addition to the cold test operation requirement, is provided with a first temperature control device on the first stage 811 for controlling the temperature, and the first temperature control device can control the temperature of the cold chip or control the refrigerant and the heat sink. In the present embodiment, the first temperature control device is provided with a first refrigerating wafer 813 on the first stage 811, and the first refrigerating wafer 813 is terminated at one end. The cooling surface pre-cools the semiconductor component, and after the cold test operation is completed, the second carrier 812 carries out the process of measuring the semiconductor component, and the completed semiconductor component can be gradually warmed to the normal temperature, which is also required by the operation. The second stage 812 is provided with a second temperature control device for controlling the temperature, and the second temperature control device can control the temperature of the cold chip or control the temperature by means of a refrigerant and a heat sink, or can be controlled by a liquid gas conversion method. In this embodiment, the second temperature control device is provided with a second refrigerating wafer 814 on the second stage 812, and controls the current direction of the second refrigerating wafer 814. The measured semiconductor component is rapidly warmed to normal temperature, and the material transfer mechanism 82 is provided The first pick-and-place 821 and the second pick-and-place 822 can be used as the first, second and third axial displacements, and the first pick-and-place 821 is transferred between the feeding device 30 and the first stage 811 for testing. The semiconductor component, the second pick-and-placer 822 is a semiconductor component that is transferred between the receiving device 40 and the second stage 812. The transfer mechanism 83 is fixed to the outside of the working room 51 and has a first rotating shaft 832. The first driving source 831, the first driving source 831 can be a motor or a rotating cylinder. In this embodiment, the first driving source 831 is a motor, and the first rotating shaft 832 is a bolting shaft and is disposed on the first rotating shaft 832. The first and second linking members 833A and 833B are respectively provided with the first and second linking members 833A and 833B, and the first and second linking members 833A and 833B are respectively provided with bolting holes that can be assembled with the first rotating shaft 832, so that the first rotating shaft 832 can drive the first rotating shaft 832. The first and second linking members 833A and 833B are rotated, and the second driving source 834 having the second rotating shaft 835 is attached to the first linking member 833A. The second driving source 834 can be a motor or a rotating cylinder. In the example, the second driving source 834 is a motor, and the second rotating shaft 835 is a screw, and the two ends are connected to the first and second linking members 833A and 8 And a third driving source 836 of the movable fixture 837 is mounted on the first and second rotating shafts 832 and 835. The third driving source 836 can be a motor or a pressure cylinder. In this embodiment, the third driving The source 836 is a pressure cylinder, and a bolt hole that can cooperate with each other is disposed at a position corresponding to the first rotating shaft 832, and a screw hole that can cooperate with each other is disposed at a position corresponding to the second rotating shaft 835, so that the third driving source is provided. The 836 can be rotated by the first rotating shaft 832, and is axially displaced by the second rotating shaft 835. The lower of the movable fixture 837 is provided with a third pick-and-placer 838 for picking and placing semiconductor components, and then The first rotating shaft 832 of the driving source 831 can drive the second driving source 834, the third driving source 836, and the third pick-and-placer 838 to rotate angularly, so that the third pick-and-placer 838 is rotated and converted into a horizontal state or a vertical state. When the third pick-and-place device 838 is placed in a horizontal state, the semiconductor component can be taken and placed on the first and second stages 811 and 812. When the third pick-and-placer 838 is placed in a vertical state, the test piece can be tested. The semiconductor component is inserted into the test seat 54, and the second rotating shaft 835 of the second driving source 834 is driven. The three driving sources 836 and the third pick-and-placer 838 and the like are moved to the front of the test seat 54 or the first and second stages 811 and 812 to take the material, and the third driving source 836 drives the material. The movable fixture 837 and the third pick-and-place 838 are used for the telescopic displacement on the first and second loading stages 811 and 812 and the test seat 54. Further, the conveying device 80 can be provided with at least one convertible semiconductor component as needed. In the angular position direction indexing mechanism, the indexing mechanism is configured as the first embodiment, and can be independently mounted on the machine table 20 or the material transfer mechanism 82 or the transfer mechanism 83, and the indexing mechanism is used to convert the semiconductor component to be tested. The angular direction is to conform to the angular direction of the test socket 54 and, after the test is completed, the angular direction of the semiconductor component is changed to be placed in the receiving device 40.
本發明可提供業者視半導體元件日後應用之環境溫度,而選擇對半導體元件作常溫測試作業、熱測作業或冷測作業,以淘汰出不良品;請參閱第26圖,係為本發明對半導體元件執行冷測作業之實施例,該移料機構82之第一取放器821即作X-Y-Z軸向位移至供料裝置30之料盤31處取出待測之半導體元件70,並移載至載送機構81之第一載台811上,第一載台811可利用第一致冷晶片813預冷待測之半導體元件70;請參閱第27、28圖,該載送機構81之第一載台811係作Y軸向位移將待測之半導體元件70載送至測試區52,並使待測之半導體元件70通過取像器56而取像角位方向,再載送至轉載機構83處,接著轉載機構83係控制第二驅動源834之第二轉軸835帶動第三驅動源836及第三取放器838作X軸向位移,使第三取放器838位於待測之半導體元件70上方,再控制第三驅動源836驅動活動治具837及第三取放器838作Z軸向伸縮位移,使第三取放器838於第一載台811上取出待測之半導體元件70;請參閱第29、30圖,轉載機構83係控制第二驅動源834之第二轉軸835帶動第三驅動源836及第三取放器838作X軸向位移,使第三取放器838位於測試座54之前方,再控制第一驅動源831之第一轉軸832帶動第二驅動源834、第三驅動源836及第三取放器838等元件作90度旋轉,使第三取放器838擺置呈垂直狀態,第三驅動源836係驅動活動治具837作Y軸向位移,使第三取放器838將待測之半導體元件70置入壓抵於測試裝置50之測試座54內,而使得半導體元件70於模擬低溫環境中執行冷測作業,又由於測試座54之***口非朝向上方,並不會使冷測作業發生異常狀況時所凝結之水珠殘留於測試座54內,進而可提升測試良率及測試電路板53、測試座54之使用壽命;請參閱第31、32圖,於半導體元件70測試完畢後,轉載機構83之第一驅動源831係以第一轉軸832驅動第二驅動源834、第三驅動源836及第三取放器838等元件作90度反向旋轉,使第三取放器838及其上之完測半導體元件70擺置呈水平狀態,接著第二驅動源834係驅動第二轉軸835帶動第三驅動源836及第三取放器838作X軸向位移至第二載台812處,第三驅動源836係驅動活動治具837作Z軸向位移,使第三取放器838將完測之半導體元件70置入於第二載台812上,第二載台812可利用第二致冷晶片814使完測之半導體元件70回溫至常溫;請參閱第33、34圖,第二載台812係將完測之半導體元件70載出作業室51,移料機構82之第二取放器822即作X-Y-Z軸向位移於第二載台812上取出完測之半導體元件70,第二取放器822再依測試結果(如良品半導體元件、不良品半導體元件或次級品半導體元件)而直接將完測之半導體元件70移載至收料裝置40之料盤41上,以完成分類收置作業。The invention can provide the ambient temperature for the semiconductor component to be applied in the future, and select the semiconductor component for the normal temperature test operation, the thermal test operation or the cold test operation to eliminate the defective product; refer to FIG. 26, which is the semiconductor of the present invention. In the embodiment in which the component performs the cold-test operation, the first pick-and-placer 821 of the material transfer mechanism 82 is axially displaced to the tray 31 of the feeding device 30, and the semiconductor component 70 to be tested is taken out and transferred to the load. On the first stage 811 of the feeding mechanism 81, the first stage 811 can pre-cool the semiconductor element 70 to be tested by using the first cooling chip 813; see Figures 27 and 28, the first load of the carrying mechanism 81 The stage 811 is used for Y-axis displacement to carry the semiconductor component 70 to be tested to the test area 52, and the semiconductor component 70 to be tested is taken in the angular direction by the image pickup unit 56, and then carried to the transfer mechanism 83. Then, the transfer mechanism 83 controls the second rotating shaft 835 of the second driving source 834 to drive the third driving source 836 and the third pick-and-placer 838 to perform X-axis displacement, so that the third pick-and-placer 838 is located at the semiconductor component 70 to be tested. Above, the third driving source 836 is controlled to drive the movable fixture 837 and The third pick-and-placer 838 is used for the Z-axis telescopic displacement, so that the third pick-and-placer 838 takes out the semiconductor component 70 to be tested on the first stage 811; see Figures 29 and 30, the transfer mechanism 83 controls the second drive. The second rotating shaft 835 of the source 834 drives the third driving source 836 and the third pick-and-placer 838 to perform X-axis displacement, so that the third pick-and-placer 838 is located before the test seat 54, and then controls the first of the first driving source 831. The rotating shaft 832 drives the second driving source 834, the third driving source 836 and the third pick-and-place 838 to rotate 90 degrees, so that the third pick-and-placer 838 is placed in a vertical state, and the third driving source 836 is driven to move. With the 837 as the Y-axis displacement, the third pick-and-placer 838 places the semiconductor component 70 to be tested into the test socket 54 pressed against the test device 50, so that the semiconductor component 70 performs the cold test operation in a simulated low temperature environment. Moreover, since the insertion port of the test seat 54 is not facing upward, the condensation water does not remain in the test seat 54 when an abnormal condition occurs in the cold test operation, thereby improving the test yield and the test circuit board 53 and the test seat. 54 lifetime; please refer to Figures 31 and 32 for testing on semiconductor component 70 After the completion, the first driving source 831 of the transfer mechanism 83 drives the second driving source 834, the third driving source 836, and the third pick-and-place 838 to rotate 90 degrees in the first rotating shaft 832, so that the third driving is performed. The 838 and the finished semiconductor component 70 are placed in a horizontal state, and then the second driving source 834 drives the second rotating shaft 835 to drive the third driving source 836 and the third pick-and-place 838 to X-axis displacement. At the second stage 812, the third driving source 836 drives the movable fixture 837 for Z-axis displacement, so that the third pick-and-placer 838 places the completed semiconductor component 70 on the second stage 812. The stage 812 can use the second refrigerating wafer 814 to return the completed semiconductor component 70 to normal temperature; refer to FIGS. 33 and 34, the second stage 812 carries the completed semiconductor component 70 out of the working chamber 51, and moves The second pick-and-placer 822 of the material mechanism 82 is XYZ axially displaced on the second stage 812 to take out the tested semiconductor component 70, and the second pick-and-placer 822 is further tested according to test results (such as good semiconductor components, defective semiconductors). Component or secondary semiconductor component) directly transfers the completed semiconductor component 70 to the material of the receiving device 40 41, to complete the job classification stowed.
據此,本發明實為一深具實用性及進步性之設計,然未見有相同之產品及刊物公開,從而允符發明專利申請要件,爰依法提出申請。Accordingly, the present invention is a practical and progressive design, but it has not been disclosed that the same products and publications are disclosed, thereby permitting the invention patent application requirements, and applying in accordance with the law.
11...機台11. . . Machine
12...供料裝置12. . . Feeding device
13...收料裝置13. . . Receiving device
14...測試裝置14. . . Test device
141...冷測室141. . . Cold room
142...測試電路板142. . . Test board
15...預冷盤15. . . Pre-cooling tray
16...輸送裝置16. . . Conveyor
161...取放器161. . . Pick and place
17...電子元件17. . . Electronic component
20...機台20. . . Machine
30...供料裝置30. . . Feeding device
31...料盤31. . . Trays
40...收料裝置40. . . Receiving device
41...料盤41. . . Trays
50...測試裝置50. . . Test device
51...作業室51. . . Work room
52...測試區52. . . Test area
521...通孔521. . . Through hole
522...溫控器522. . . thermostat
53...測試電路板53. . . Test board
54...測試座54. . . Test stand
55...輸送管55. . . Duct
56...取像器56. . . Imager
60...輸送裝置60. . . Conveyor
61...載送機構61. . . Carrier mechanism
611...轉盤611. . . Turntable
612...容置槽612. . . Locating slot
62...移料機構62. . . Transfer mechanism
621...第一取放器621. . . First pick and place
622...第二取放器622. . . Second pick and place
63...轉載機構63. . . Transfer mechanism
631...驅動源631. . . Drive source
632...轉動架632. . . Turret
633A...第一活動治具633A. . . First activity fixture
633B...第二活動治具633B. . . Second activity fixture
634A...第三取放器634A. . . Third pick and place
634B...第四取放器634B. . . Fourth pick and place
635A...第一驅動源635A. . . First drive source
635B...第二驅動源635B. . . Second drive source
636A...第一致冷晶片636A. . . First consistent cold wafer
636B...第二致冷晶片636B. . . Second cryogenic wafer
64A...第一轉位機構64A. . . First indexing mechanism
64B...第二轉位機構64B. . . Second indexing mechanism
64C...第三轉位機構64C. . . Third indexing mechanism
641C...承座641C. . . Seat
64D...第四轉位機構64D. . . Fourth indexing mechanism
641D...承座641D. . . Seat
65...移載機構65. . . Transfer mechanism
651...第五取放器651. . . Fifth pick and place
652...第六取放器652. . . Sixth pick and place
70、71、72、73...半導體元件70, 71, 72, 73. . . Semiconductor component
80...輸送裝置80. . . Conveyor
81...載送機構81. . . Carrier mechanism
811...第一載台811. . . First stage
812...第二載台812. . . Second stage
813...第一致冷晶片813. . . First consistent cold wafer
814...第二致冷晶片814. . . Second cryogenic wafer
82...移料機構82. . . Transfer mechanism
821...第一取放器821. . . First pick and place
82...移料機構82. . . Transfer mechanism
821...第一取放器821. . . First pick and place
822...第二取放器822. . . Second pick and place
83...轉載機構83. . . Transfer mechanism
831...第一驅動源831. . . First drive source
832...第一轉軸832. . . First shaft
833A...第一連動件833A. . . First linkage
833B...第二連動件833B. . . Second linkage
834...第二驅動源834. . . Second drive source
835...第二轉軸835. . . Second shaft
836...第三驅動源836. . . Third drive source
837...活動治具837. . . Activity fixture
838...第三取放器838. . . Third pick and place
第1圖:係習式半導體元件冷測機之示意圖。Figure 1: Schematic diagram of a conventional semiconductor component cold tester.
第2圖:係習式測試座之使用示意圖。Figure 2: Schematic diagram of the use of the test bench.
第3圖:本發明第一實施例之各裝置配置示意圖。Fig. 3 is a schematic view showing the configuration of each device of the first embodiment of the present invention.
第4圖:本發明轉載機構之示意圖。Figure 4: Schematic diagram of the transfer mechanism of the present invention.
第5圖:係第一實施例執行冷測作業之使用示意圖(一)。Fig. 5 is a schematic view showing the use of the cold test operation in the first embodiment (1).
第6圖:係第一實施例執行冷測作業之使用示意圖(二)。Fig. 6 is a schematic view showing the use of the cold test operation in the first embodiment (2).
第7圖:係轉載機構取出待測半導體元件之使用示意圖。Figure 7: Schematic diagram of the use of the transfer mechanism to take out the semiconductor component to be tested.
第8圖:係轉載機構壓抵待測半導體元件測試之使用示意圖。Figure 8: Schematic diagram of the use of the transfer mechanism against the test of the semiconductor component to be tested.
第9圖:係第一實施例執行冷測作業之使用示意圖(三)。Fig. 9 is a schematic view showing the use of the cold test operation in the first embodiment (3).
第10圖:係轉載機構取出及壓測半導體元件之使用示意圖。Figure 10: Schematic diagram of the use of the transfer mechanism to take out and test the semiconductor components.
第11圖:係轉載機構轉載待測/完測半導體元件之使用示意圖。Figure 11: Schematic diagram of the use of the reloading mechanism to transfer the semiconductor components to be tested/tested.
第12圖:係第一實施例執行冷測作業之使用示意圖(四)。Fig. 12 is a schematic view showing the use of the cold test operation in the first embodiment (4).
第13圖:係第一實施例執行冷測作業之使用示意圖(五)。Fig. 13 is a schematic view showing the use of the cold test operation in the first embodiment (5).
第14圖:係第一實施例執行冷測作業之使用示意圖(六)。Fig. 14 is a schematic view showing the use of the cold test operation in the first embodiment (6).
第15圖:係第一實施例之轉位機構另一實施例圖。Fig. 15 is a view showing another embodiment of the indexing mechanism of the first embodiment.
第16圖:係第一實施例之轉位機構另一實施例使用示意圖(一)。Fig. 16 is a schematic view (1) showing another embodiment of the indexing mechanism of the first embodiment.
第17圖:係第一實施例之轉位機構另一實施例使用示意圖(二)。Fig. 17 is a schematic view (2) showing another embodiment of the indexing mechanism of the first embodiment.
第18圖:係第一實施例之轉位機構另一實施例使用示意圖(三)。Fig. 18 is a schematic view (3) showing another embodiment of the indexing mechanism of the first embodiment.
第19圖:係第一實施例之轉位機構另一實施例使用示意圖(四)。Fig. 19 is a schematic view (4) showing another embodiment of the indexing mechanism of the first embodiment.
第20圖:係第一實施例之轉位機構另一實施例使用示意圖(五)。Fig. 20 is a schematic view (5) showing another embodiment of the indexing mechanism of the first embodiment.
第21圖:係第一實施例之轉位機構另一實施例使用示意圖(六)。Fig. 21 is a schematic view (6) showing another embodiment of the indexing mechanism of the first embodiment.
第22圖:係第一實施例之轉位機構另一實施例使用示意圖(七)。Fig. 22 is a schematic view (7) showing another embodiment of the indexing mechanism of the first embodiment.
第23圖:係第一實施例之轉位機構另一實施例使用示意圖(八)。Fig. 23 is a schematic view (8) showing another embodiment of the indexing mechanism of the first embodiment.
第24圖:本發明第二實施例之各裝置配置示意圖。Fig. 24 is a view showing the configuration of each device of the second embodiment of the present invention.
第25圖:本發明轉載機構之示意圖。Figure 25: Schematic diagram of the transfer mechanism of the present invention.
第26圖:係第二實施例執行冷測作業之使用示意圖(一)。Figure 26: Schematic diagram of the use of the second embodiment to perform a cold test operation (1).
第27圖:係第二實施例執行冷測作業之使用示意圖(二)。Figure 27: Schematic diagram of the use of the second embodiment to perform a cold test operation (2).
第28圖:係轉載機構轉載待測半導體元件之使用示意圖。Figure 28: Schematic diagram of the use of a reloading mechanism to transfer semiconductor components to be tested.
第29圖:係第二實施例執行冷測作業之使用示意圖(三)。Fig. 29 is a schematic view showing the use of the cold test operation in the second embodiment (3).
第30圖:係轉載機構壓抵待測半導體元件測試之使用示意圖。Figure 30: Schematic diagram of the use of the transfer mechanism against the test of the semiconductor component to be tested.
第31圖:係轉載機構轉載完測半導體元件之使用示意圖。Figure 31: Schematic diagram of the use of a semiconductor device that is reloaded by a transfer mechanism.
第32圖:係第二實施例執行冷測作業之使用示意圖(四)。Fig. 32 is a schematic view showing the use of the cold test operation in the second embodiment (4).
第33圖:係第二實施例執行冷測作業之使用示意圖(五)。Figure 33: Schematic diagram of the use of the second embodiment to perform a cold test operation (5).
第34圖:係第二實施例執行冷測作業之使用示意圖(六)。Figure 34 is a schematic view showing the use of the cold test operation in the second embodiment (6).
20...機台20. . . Machine
30...供料裝置30. . . Feeding device
31...料盤31. . . Trays
40...收料裝置40. . . Receiving device
41...料盤41. . . Trays
50...測試裝置50. . . Test device
51...作業室51. . . Work room
52...測試區52. . . Test area
521...通孔521. . . Through hole
522...溫控器522. . . thermostat
53...測試電路板53. . . Test board
54...測試座54. . . Test stand
55...輸送管55. . . Duct
56...取像器56. . . Imager
60...輸送裝置60. . . Conveyor
61...載送機構61. . . Carrier mechanism
611...轉盤611. . . Turntable
612...容置槽612. . . Locating slot
62...移料機構62. . . Transfer mechanism
621...第一取放器621. . . First pick and place
622...第二取放器622. . . Second pick and place
63...轉載機構63. . . Transfer mechanism
64A...第一轉位機構64A. . . First indexing mechanism
64B...第二轉位機構64B. . . Second indexing mechanism
Claims (10)
Priority Applications (1)
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TW100124274A TWI512866B (en) | 2011-07-08 | 2011-07-08 | Semiconductor component testing and sorting machine |
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Cited By (6)
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TWI472892B (en) * | 2013-03-21 | 2015-02-11 | Inventec Appliances Corp | Automatic alerting method for exceedance of defective product threshold |
TWI477792B (en) * | 2013-07-31 | 2015-03-21 | Hon Tech Inc | Working equipment and electronic component working apparatus of Application |
TWI491893B (en) * | 2014-01-28 | 2015-07-11 | Hon Tech Inc | Electronic components testing equipment |
TWI497086B (en) * | 2013-09-05 | 2015-08-21 | Chroma Ate Inc | Test System and Method of Semiconductor Packaging Component with Open Circuit Test |
TWI563267B (en) * | 2015-04-22 | 2016-12-21 | All Ring Tech Co Ltd | |
TWI638170B (en) * | 2017-12-29 | 2018-10-11 | 鴻勁精密股份有限公司 | Electronic component working machine |
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JPS594133A (en) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | Method for testing of semiconductor device |
JPH02210274A (en) * | 1989-02-10 | 1990-08-21 | Oki Electric Ind Co Ltd | Handler for integrated circuit device tester and its handling method |
JP2000338195A (en) * | 1999-05-31 | 2000-12-08 | Ando Electric Co Ltd | Method and device for testing integrated circuit |
JP4570208B2 (en) * | 2000-06-13 | 2010-10-27 | 株式会社アドバンテスト | Classification control method for tested electronic components |
JP2009031070A (en) * | 2007-07-25 | 2009-02-12 | Djtech Co Ltd | Semiconductor testing device, and type-switching method of semiconductor device for the device |
CN201371132Y (en) * | 2009-03-23 | 2009-12-30 | 常州新区爱立德电子有限公司 | Semiconductor chip automatic sorting machine |
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2011
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI472892B (en) * | 2013-03-21 | 2015-02-11 | Inventec Appliances Corp | Automatic alerting method for exceedance of defective product threshold |
TWI477792B (en) * | 2013-07-31 | 2015-03-21 | Hon Tech Inc | Working equipment and electronic component working apparatus of Application |
TWI497086B (en) * | 2013-09-05 | 2015-08-21 | Chroma Ate Inc | Test System and Method of Semiconductor Packaging Component with Open Circuit Test |
TWI491893B (en) * | 2014-01-28 | 2015-07-11 | Hon Tech Inc | Electronic components testing equipment |
TWI563267B (en) * | 2015-04-22 | 2016-12-21 | All Ring Tech Co Ltd | |
TWI638170B (en) * | 2017-12-29 | 2018-10-11 | 鴻勁精密股份有限公司 | Electronic component working machine |
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