TW201301430A - Placing method of circuit board - Google Patents
Placing method of circuit board Download PDFInfo
- Publication number
- TW201301430A TW201301430A TW100121160A TW100121160A TW201301430A TW 201301430 A TW201301430 A TW 201301430A TW 100121160 A TW100121160 A TW 100121160A TW 100121160 A TW100121160 A TW 100121160A TW 201301430 A TW201301430 A TW 201301430A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printed circuit
- board
- sub
- image
- Prior art date
Links
Abstract
Description
本發明有關一種電路板置件方法，特別是指一種直接讀取數據資料庫中儲存瑕疵子板位址及每一子板的位置資訊的電路板置件方法。The invention relates to a circuit board mounting method, in particular to a circuit board mounting method for directly reading a data storage library and storing the position information of the board and the position information of each sub board.
習知的電路板為一種大面積的主板，但隨著電子裝置如PDA、手機或數位相機的體積越來越小，電路基板的體積也跟著縮小。而為了生產效率的考量，業者將多數個小型電路板(又稱為子板)合併成一片大型電路板(又稱為多聯板)以方便後續量產製程的進行。The conventional circuit board is a large-area motherboard, but as electronic devices such as PDAs, cell phones, or digital cameras become smaller and smaller, the size of the circuit substrate also shrinks. For the sake of production efficiency, the industry has combined most of the small circuit boards (also known as daughter boards) into a large circuit board (also known as multi-board) to facilitate the subsequent mass production process.
由於生產的過程中該等小型電路板可能會由於製程上的變異而造成不符合電性導通(即開路、短路等電路特徵)的規格，故上述列為不良品的小型電路板就會以人工的方式將一不良品標記(bad mark)設置於該些小型電路板上，以使後續的取置製程能依據檢知取得相關資訊後，避開上述不良的電路板，以避免將元件裝設於該些不良子板上。Since the small circuit boards may be inconsistent with the electrical continuity (ie, circuit characteristics such as open circuit and short circuit) due to variations in the process during the manufacturing process, the small circuit boards listed as defective products are artificially The method of setting a bad mark on the small circuit boards, so that the subsequent picking process can obtain the relevant information according to the detection, avoiding the bad circuit board to avoid the component mounting. On the bad sub-boards.
另考量該多聯板上的兩兩子板之間需有一固定間距，以利後續表面黏著元件置件的精度需求，但該兩兩子板之間存在有製造與材料收縮率不同所產生的距離誤差，經多聯板合併之後所累積的誤差將會造成表面黏著元件的置件精度問題，故後續的生產機台(如取置機、晶粒接合機[die bonder])均需額外針對每片子板的定位標靶(local fiducial mark)進行視覺辨識處理，以校正上述之誤差值來滿足高精度(±10μm)的需求。Another consideration is that there must be a fixed spacing between the two sub-boards on the multi-plate, in order to meet the precision requirements of the subsequent surface-adhesive component placement, but there is a difference between manufacturing and material shrinkage between the two sub-boards. Distance error, the accumulated error after the multi-plate combination will cause the placement accuracy of the surface-adhesive component, so the subsequent production machine (such as the pick-up machine, die bonder) need to be additionally targeted The local fiducial mark of each sub-plate is visually recognized to correct the above-mentioned error value to meet the high precision (±10 μm) requirement.
目前整個多聯板置件的生產過程先由多聯板製造廠商將多聯板製作完成，並且在多聯板上製作不良品標記，再轉交由封裝廠商的取置機針對不良品標記及子板定位標靶進行檢測，並於檢測完成後始能進行晶粒的高精度置件封裝。然而，傳統的取置機於載入該多聯板後，利用一移動式攝影機先進行標靶(fiducial mark)的定位，再利用上述攝影機進行不良品標記的分析檢知作業或是定位標靶(local fiducial mark)的辨識檢測作業，如此方能確保後續晶粒高精度置件的封裝作業。At present, the production process of the entire multi-panel device is first completed by the multi-plate manufacturer, and the defective product mark is produced on the multi-joint board, and then transferred to the packaging manufacturer's pick-up machine for the defective product mark and sub- The board positioning target is tested, and the high-precision package of the die can be performed after the detection is completed. However, after the conventional device is loaded into the multi-plate, the position of the fiducial mark is first performed by using a mobile camera, and the camera is used for analyzing and detecting the defective product or positioning the target. (local fiducial mark) identification detection operation, in order to ensure the subsequent high-precision packaging of the die.
換句話說，取置機取得多聯板後並非直接進行封裝作業，而必須先對每一片多聯板進行瑕疵與位置分析，此一額外的辨識處理時間將會增加了多聯板進入取置機的製成時間，故傳統取置機利用進行檢知不良子板的程序作業，對於聯板數越來越多的情況下，勢必會造成置件機台的生產時間大幅增加，導致生產線的稼動率大量降低(約10%-30%不等)。In other words, after the acquisition machine takes multiple boards, it does not directly perform the packaging operation, but must first perform the 瑕疵 and position analysis on each multi-plate. This additional recognition processing time will increase the multi-board entry. When the machine is made, the traditional pick-up machine uses the program to check the bad sub-board. As the number of boards increases, it will inevitably lead to a significant increase in the production time of the machine, resulting in the production line. The rate of utilization is greatly reduced (about 10%-30%).
本發明之主要目的，旨在提供一種電路板置件方法，於印刷電路板進行置件程序前，採用獨立的檢測裝置檢知印刷電路板之瑕疵子板位址及子板間距誤差位置資訊，並將檢測資訊儲存於數據資料庫，讓後續的置件製程能依據印刷電路板序列號讀取數據資料庫，直接取得對應的檢測資訊後進行加工，進而減少須於傳統置件程序前等待檢測之耗費時間，提升整體製作產能的稼動率。The main object of the present invention is to provide a circuit board mounting method for detecting the position information of the printed circuit board and the sub-board spacing error position by using an independent detecting device before the printed circuit board performs the placing process. The detection information is stored in the data database, so that the subsequent processing process can read the data database according to the serial number of the printed circuit board, directly obtain the corresponding detection information, and then process, thereby reducing the waiting for the detection before the traditional parting process. It takes time to increase the productivity of the overall production capacity.
為達上述目的，本發明電路板置件方法包含以下步驟：(A)提供至少一個印刷電路板，上述印刷電路板具有一可被辨識單元、複數個子板以及複數個定位標靶，其中，上述子板包括有屬於良品的無瑕疵子板、屬於不良品的瑕疵子板以及定位標靶，且上述瑕疵子板上設有一不良品標記；(B)提供一視覺檢測分析裝置，檢測上述印刷電路板上具有不良品標記的瑕疵子板位址，並將瑕疵子板的位址形成一第一檢視資訊，並把上述第一檢視資訊對應上述印刷電路板的可被辨識單元儲存於一數據資料庫；(C)由上述視覺檢測分析裝置檢測分析上述印刷電路板及每一子板的定位標靶，以分析每一子板的位置資訊形成一第二檢視資訊，並把上述第二檢視資訊對應上述印刷電路板的可被辨識單元儲存於上述數據資料庫；以及(D)提供一掃描裝置配合後續置件機組裝，由上述掃描裝置讀取印刷電路板的可被辨識單元，並由置件機於上述數據資料庫取得對應的第一檢視資訊及第二檢視資訊，且依據取得第一檢視資訊及第二檢視資訊，將複數個晶粒精準地定位結合至對應印刷電路板的每一無瑕疵子板。To achieve the above object, the circuit board mounting method of the present invention comprises the following steps: (A) providing at least one printed circuit board having an identifiable unit, a plurality of sub-boards, and a plurality of positioning targets, wherein The daughter board includes a scorpion-free board belonging to a good product, a scorpion board belonging to a defective product, and a positioning target, and the scorpion board is provided with a defective product mark; (B) providing a visual detecting and analyzing device for detecting the printed circuit a board address having a defective product mark on the board, and forming a first view information on the address of the board, and storing the first view information corresponding to the identifiable unit of the printed circuit board in a data file (C) detecting and analyzing the positioning target of the printed circuit board and each sub-board by the visual inspection and analysis device, analyzing the position information of each sub-board to form a second viewing information, and displaying the second viewing information And the (D) providing a scanning device for assembling with the subsequent device, wherein The reading device reads the identifiable unit of the printed circuit board, and the corresponding first viewing information and the second viewing information are obtained by the setting machine in the data database, and according to the first viewing information and the second viewing information, A plurality of dies are accurately positioned to bond to each of the scorpion-free boards of the corresponding printed circuit board.
其中，上述印刷電路板及複數個子板分別具有一組兩斜對角的定位標靶，且於兩斜對角的定位標靶之間取得一中點座標，再由印刷電路板及複數個子板的中點座標相互比較，以形成每一子板的位置資訊。Wherein, the printed circuit board and the plurality of sub-boards respectively have a set of two diagonally opposite positioning targets, and a midpoint coordinate is obtained between the two diagonally opposite positioning targets, and then the printed circuit board and the plurality of sub-boards are obtained. The midpoint coordinates are compared to each other to form positional information for each sub-board.
步驟(A)之前進一步包含一標記步驟，將上述可被辨識單元利用雷射、貼附或印刷的其中一種方式設置於上述印刷電路板一側，其中，上述可被辨識單元設為一維條碼或二維條碼的其中一種識別標記；上述標記步驟更包含在屬於不良品的瑕疵子板上設置一不良品標記。Before the step (A), further comprising a marking step of setting the identifiable unit to one side of the printed circuit board by using one of laser, attaching or printing, wherein the identifiable unit is set as a one-dimensional barcode Or one of the identification marks of the two-dimensional barcode; the marking step further includes setting a defective product mark on the electronic board belonging to the defective product.
步驟(B)之前更包含一掃瞄上述可被辨識單元取得上述印刷電路板的序列號。Step (B) further includes scanning the serial number of the printed circuit board by the identification unit.
於第一較佳實施例中，步驟(B)及步驟(C)是透過一視覺檢測分析裝置產生上述第一檢視資訊及第二檢視資訊。In the first preferred embodiment, the step (B) and the step (C) are to generate the first view information and the second view information through a visual inspection and analysis device.
於一可行實施例中，上述視覺檢測分析裝置包含一影像檢知單元以及一控制運算單元，上述影像檢知單元用以擷取上述印刷電路板表面影像的瑕疵子板及子板上的定位標靶而上述控制運算單元用以處理擷取影像上瑕疵子板位址以及分析每一定位標靶取得每一子板的位置資訊。In a possible embodiment, the visual inspection and analysis device includes an image detection unit and a control operation unit, and the image detection unit is configured to capture the position of the surface of the printed circuit board and the positioning plate on the daughter board. The control unit is configured to process the fingerprint address on the captured image and analyze each positioning target to obtain position information of each of the sub-boards.
其中，上述影像檢知單元擷取印刷電路板的全影像，並由上述控制運算單元分析影像中瑕疵子板上不良品標記與其他無瑕疵子板的色彩對比，以判斷上述印刷電路板的瑕疵子板位址來形成上述第一檢視資訊。Wherein, the image detecting unit captures a full image of the printed circuit board, and the control computing unit analyzes the color contrast of the defective product mark on the dieboard in the image and the other non-tweezers board to determine the flaw of the printed circuit board. The daughter board address is used to form the first view information described above.
上述影像檢知單元以一預定範圍擷取上述印刷電路板及複數個子板的範圍影像，上述範圍影像包括一印刷電路板及至少一子板的定位標靶，檢測上述範圍影像中的定位標靶，以分析上述印刷電路板上各子板的位置資訊以形成上述第二檢視資訊；又上述範圍影像另可為擷取印刷電路板的全影像，檢測上述全影像中所有的定位標靶，以分析上述印刷電路板上每一子板的位置資訊來形成上述第二檢視資訊。The image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, and the range image includes a printed circuit board and at least one sub-board positioning target, and detects the positioning target in the range image The second position information is formed by analyzing the position information of each of the sub-boards on the printed circuit board to form the second view information; and the range image is another full image of the printed circuit board, and detecting all the positioning targets in the whole image, The position information of each sub-board on the printed circuit board is analyzed to form the second view information.
於另一可行實施例中，上述視覺檢測分析裝置包含一線性掃描機、一影像檢知單元以及一控制運算單元，上述線性掃描機用以擷取上述印刷電路板的表面影像的瑕疵子板，上述影像檢知單元用以擷取上述印刷電路板表面影像上的定位標靶，而上述控制運算單元用以處理擷取影像上瑕疵子板位址並分析每一定位標靶取得每一子板的位置資訊。In another possible embodiment, the visual inspection and analysis device includes a linear scanner, an image detecting unit, and a control computing unit, wherein the linear scanner is configured to capture a surface of the printed circuit board. The image detecting unit is configured to capture a positioning target on the surface image of the printed circuit board, and the control computing unit is configured to process the image of the daughterboard on the captured image and analyze each positioning target to obtain each daughter board. Location information.
其中，上述線性掃描機擷取印刷電路板的全影像，並由上述控制運算單元分析影像中瑕疵子板上不良品標記與其他無瑕疵子板的色彩對比，以判斷上述印刷電路板的瑕疵子板位置來形成上述第一檢視資訊。Wherein, the linear scanner captures a full image of the printed circuit board, and the control computing unit analyzes the color contrast of the defective product mark on the dieboard in the image with other non-tweezers, to determine the dice of the printed circuit board. The board position is used to form the first view information described above.
上述影像檢知單元以一預定範圍擷取上述印刷電路板及複數個子板的範圍影像，上述範圍影像包括一印刷電路板及至少一子板的定位標靶，檢測上述範圍影像中的定位標靶，以分析上述印刷電路板上各子板的位置資訊來形成上述第二檢視資訊；又上述範圍影像另可為擷取印刷電路板的全影像，檢測上述全影像中所有的定位標靶，以分析上述印刷電路板上每一子板的位置資訊來形成上述第二檢視資訊。The image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, and the range image includes a printed circuit board and at least one sub-board positioning target, and detects the positioning target in the range image And analyzing the position information of each sub-board on the printed circuit board to form the second view information; and the range image may further capture the full image of the printed circuit board, and detecting all the positioning targets in the full image, The position information of each sub-board on the printed circuit board is analyzed to form the second view information.
於前述兩可行實施例中，上述影像檢知單元採用感光耦合元件(Charge Coupled Device，CCD)或互補式金屬氧化物半導體(Complementary Metal-Oxide Semiconductor，CMOS)影像感測器。In the above two possible embodiments, the image detecting unit uses a photosensitive coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) image sensor.
於一可行實施例中，上述影像檢知單元以一預定範圍擷取上述印刷電路板及複數個子板的範圍影像，上述範圍影像包括一印刷電路板及至少一子板的定位標靶，檢測上述範圍影像中的定位標靶，以分析上述印刷電路板上各子板的位置資訊來形成上述第二檢視資訊。In a preferred embodiment, the image detecting unit captures a range image of the printed circuit board and the plurality of sub-boards by a predetermined range, and the range image includes a printed circuit board and at least one sub-board positioning target, and the detecting The positioning target in the range image is used to analyze the position information of each sub-board on the printed circuit board to form the second view information.
於另一可行實施例中，上述範圍影像另可為擷取印刷電路板的全影像，檢測上述全影像中所有的定位標靶，以分析上述印刷電路板上每一子板的位置資訊來形成上述第二檢視資訊。In another possible embodiment, the image of the range may be a full image of the printed circuit board, and all the positioning targets in the whole image are detected to analyze the position information of each sub-board on the printed circuit board to form The above second viewing information.
於此一較佳實施例中，上述影像檢知單元同樣可採用感光耦合元件(Charge Coupled Device，CCD)或互補式金屬氧化物半導體(Complementary Metal-Oxide Semiconductor，CMOS)影像感測器。In the preferred embodiment, the image detecting unit can also adopt a photosensitive coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) image sensor.
另外，於前述第一及第二較佳實施例中，步驟(C)是透過一視覺檢測分析裝置產生上述第二檢視資訊，而步驟(D)是透過一置件機取得對應的第一檢視資訊及第二檢視資訊，並將複數個晶粒精準地定位結合至對應的印刷電路板。In addition, in the first and second preferred embodiments, the step (C) is to generate the second view information through a visual inspection and analysis device, and the step (D) is to obtain a corresponding first view through a set device. Information and second viewing information, and the precise positioning of a plurality of dies to the corresponding printed circuit board.
於一可行實施例中，上述數據資料庫設為一獨立系統，與上述視覺檢測分析裝置及上述置件機分別透過一網路傳輸上述第一檢視資訊、第二檢視資訊及可被辨識單元，該網路至少包括一區域網路與一廣域網路。In a possible embodiment, the data database is configured as an independent system, and the first inspection information, the second inspection information, and the identifiable unit are transmitted through the network by the visual inspection and analysis device and the device. The network includes at least one regional network and one wide area network.
於另一可行實施例中，上述數據資料庫裝設於上述置件機內部，與上述視覺檢測分析裝置透過一網路傳輸上述第一檢視資訊、第二檢視資訊以及可被辨識單元，該網路至少包括一區域網路與一廣域網路。In another possible embodiment, the data database is installed in the inside of the device, and the visual inspection and analysis device transmits the first view information, the second view information, and the identifiable unit through a network. The road includes at least one regional network and one wide area network.
於再一可行實施例中，上述數據資料庫裝設於上述視覺檢測分析裝置，與上述置件機透過一網路傳輸上述第一檢視資訊、第二檢視資訊以及可被辨識單元，該網路至少包括一區域網路與一廣域網路。In a further embodiment, the data database is installed in the visual inspection and analysis device, and the first device, the second view information, and the identifiable unit are transmitted through the network with the device. At least one regional network and one wide area network.
本發明透過事先檢測作業並將檢測資訊儲存於數據資料庫，並配合一組裝於後續置件機台的辨識裝置，由辨識裝置讀取印刷電路板上的序列號，再由數據資料庫傳輸對應印刷電路板的加工必須資訊至置件機台，讓置件機台可直接進行後續精密的置件加工，如此即可減少傳統封裝廠置件程序前需等待檢測之耗費時間，提升整體製作產能的稼動率。The invention stores the serial number on the printed circuit board by the identification device through the pre-detection operation and stores the detection information in the data database, and cooperates with an identification device assembled on the subsequent device, and then transmits the corresponding data on the printed circuit board. The processing of the printed circuit board must be information to the placing machine, so that the placing machine can directly carry out subsequent precise processing of the parts, thus reducing the time required to wait for the detection before the traditional packaging factory parting process, and improving the overall production capacity. Rate of utilization.
為使 貴審查委員易於瞭解本發明之其他特徵、內容與優點，使本裝置及其方法之功效更為顯現，茲將本發明配合附圖，詳細說明如下：請參考第1圖所示，於一最佳實施例中，本發明電路板置件方法主要包含以下步驟：步驟(A)：提供至少一個印刷電路板11，上述印刷電路板11設有一可被辨識單元13、複數個子板12及定位標靶11a、11b、12a、12b，其中，上述子板12包括有屬於良品的無瑕疵子板122、屬於不良品的瑕疵子板121及定位標靶12a、12b；步驟(B)：檢測上述印刷電路板11上屬於瑕疵子板121的不良品標記123，將瑕疵子板121的位址形成一第一檢視資訊，並把上述第一檢視資訊對應上述印刷電路板11的可被辨識單元13儲存於一數據資料庫16；步驟(C)：檢測上述印刷電路板11及每一子板12的定位標靶11a、11b、12a、12b，分析每一子板12的位置資訊Y以形成一第二檢視資訊，並把上述第二檢視資訊對應上述印刷電路板11的可被辨識單元13儲存於上述數據資料庫16；以及步驟(D)：提供一掃描裝置配合後續置件機組裝，由上述掃描裝置讀取印刷電路板11的可被辨識單元13，由置件機於上述數據資料庫16取得對應的第一檢視資訊及第二檢視資訊，並依據取得第一檢視資訊及第二檢視資訊，將複數個晶粒精準地定位結合至對應印刷電路板11的每一無瑕疵子板122。In order to make the reviewer easy to understand other features, contents and advantages of the present invention, the effects of the device and the method thereof are more apparent. The present invention will be described in detail with reference to the accompanying drawings: Please refer to FIG. In a preferred embodiment, the circuit board mounting method of the present invention mainly comprises the following steps: Step (A): providing at least one printed circuit board 11 having an identifiable unit 13 and a plurality of sub-boards 12 and Positioning targets 11a, 11b, 12a, 12b, wherein the sub-board 12 includes a defect-free tweezers plate 122, a tweezers plate 121 belonging to a defective product, and positioning targets 12a, 12b; and step (B): detecting The defective product mark 123 belonging to the die board 121 on the printed circuit board 11 forms a first view information on the address of the die board 121, and corresponds the first view information to the identifiable unit of the printed circuit board 11. 13 is stored in a data database 16; step (C): detecting the positioning target 11a, 11b, 12a, 12b of the printed circuit board 11 and each of the sub-boards 12, and analyzing the position information Y of each sub-board 12 to form a second inspection And storing the second view information corresponding to the identifiable unit 13 of the printed circuit board 11 in the data database 16; and step (D): providing a scanning device to be assembled with the subsequent device, and reading by the scanning device Taking the identifiable unit 13 of the printed circuit board 11 , the first viewing information and the second viewing information are obtained by the setting machine in the data database 16 , and the plurality of viewing information and the second viewing information are obtained according to the first viewing information and the second viewing information. The dies are accurately positioned and bonded to each of the raftless boards 122 of the corresponding printed circuit board 11.
首先，關於步驟(A)請參閱第2圖所示之印刷電路板11示意圖，上述印刷電路板11上具有複數個矩陣行列方式間隔排列的子板12，並於一側邊位置設有一具有序列號的可被辨識單元13，使每個印刷電路板11分別具有一專屬的序列號，且上述印刷電路板11及各子板12上分別設有用以確認位置的定位標靶11a、11b、12a、12b，另由於製成上的良率問題，會有屬於良品的無瑕疵子板122以及屬於不良品的瑕疵子板121；其中，上述可被辨識單元13是以雷射、印刷或貼附的其中一種方法設置於子板12上，且序列號可經由掃描上述可被辨識單元13取得，而上述可被辨識單元13設為一維條碼亦或二維條碼的其中一種辨識標記。First, regarding the step (A), please refer to the schematic diagram of the printed circuit board 11 shown in FIG. 2, wherein the printed circuit board 11 has a plurality of sub-boards 12 arranged in a matrix matrix arrangement, and has a sequence at one side position. Each of the printed circuit boards 11 has a unique serial number, and the printed circuit board 11 and each of the sub-boards 12 are respectively provided with positioning targets 11a, 11b, 12a for confirming the position. And 12b, and because of the yield problem on the production, there is a good scorpion-free board 122 and a scorpion board 121 belonging to a defective product; wherein the identifiable unit 13 is laser, printed or attached One of the methods is disposed on the sub-board 12, and the serial number can be obtained by scanning the identifiable unit 13, and the identifiable unit 13 is set as one of the one-dimensional barcode or the two-dimensional barcode.
為了方便後續步驟的檢測，步驟(A)提供之印刷電路板11另可包含一設置於上述瑕疵子板121的不良品標記123，其中，上述不良品標記123具有一預定尺寸，例如1×1(mm2)或4×4(mm2)大小但不限任何形狀，且上述不良品標記123主要是採用高度反差，以利影像分析的準確度。In order to facilitate the detection of the subsequent steps, the printed circuit board 11 provided in the step (A) may further include a defective product mark 123 disposed on the die board 121, wherein the defective product mark 123 has a predetermined size, for example, 1×1. (mm 2 ) or 4 × 4 (mm 2 ) size, but not limited to any shape, and the above-mentioned defective product mark 123 mainly adopts a high contrast to facilitate the accuracy of image analysis.
上述不良品標記123的方式首先是經過一電性檢測裝置判別印刷電路板11上的複數個子板12，之後便會將子板12依據檢測結果區分為瑕疵子板121及無瑕疵子板122，而上述瑕疵子板121就會利用雷射、印刷或貼附的其中一種方法將不良品標記123設置於瑕疵子板121上；從而使得檢測機10(如第3圖所示)即能快速的檢知上述不良品標記123來取得瑕疵子板121，使後續置件機可以根據測得的檢知資料針對無瑕疵子板122進行置件加工。The method of the defective product mark 123 is first to determine a plurality of sub-boards 12 on the printed circuit board 11 through an electrical detecting device, and then the sub-board 12 is divided into the dice plate 121 and the tweezers-free board 122 according to the detection result. The above-described scorpion plate 121 can be disposed on the scorpion plate 121 by one of laser, printing or attaching; thus, the detecting machine 10 (as shown in FIG. 3) can be quickly The defective product mark 123 is detected to obtain the forceps plate 121, so that the subsequent setting machine can perform the processing on the non-tweezer plate 122 based on the measured detection data.
由於此瑕疵子板121為亂數位置產生，因此每個印刷電路板11上的瑕疵子板121位置皆為不同，因此，如先前技術所述必須在置件加工程序前先行檢測出印刷電路板11上瑕疵子板121的位址，所以，關於步驟(B)之檢測上述印刷電路板11上屬於不良品的瑕疵子板121位址，將會依據印刷電路板11的子板12上是否有不良品標記123而區分為兩種不同的檢測方式。Since the dieboard 121 is generated in a random number position, the position of the dieboard 121 on each of the printed circuit boards 11 is different, and therefore, as described in the prior art, the printed circuit board must be detected before the placement process. 11 The address of the upper die board 121. Therefore, the detection of the address of the die board 121 on the printed circuit board 11 which is defective in the step (B) will depend on whether the daughter board 12 of the printed circuit board 11 has The defective product mark 123 is divided into two different detection methods.
請參閱第3圖所示，若子板12具有不良品標記123，則步驟(B)是以一視覺檢測分析裝置15來檢測屬於不良品的瑕疵子板121位址，於第一較佳實施例中，上述視覺檢測分析裝置15包含一影像檢知單元151，以擷取上述印刷電路板11的表面影像的瑕疵子板121；以及一控制運算單元152，處理擷取影像上之不良品標記123並形成第一檢視資訊。Referring to FIG. 3, if the sub-board 12 has the defective product mark 123, the step (B) is to detect the address of the die board 121 belonging to the defective product by a visual inspection and analysis device 15, in the first preferred embodiment. The visual inspection and analysis device 15 includes an image detecting unit 151 for capturing the surface of the printed circuit board 11 and a control unit 152 for processing the defective product mark 123 on the captured image. And form the first view information.
於一較佳實施例中，上述影像檢知單元151為感光耦合元件(Charge Coupled Device，CCD)或互補式金屬氧化物半導體(Complementary Metal-Oxide Semiconductor，CMOS)的其中一種影像感測器，該影像檢知單元151具有一預定解析度及一預定放大倍率且在一定預定工作距離(working distance)WD下擷取該印刷電路板11之影像。In one embodiment, the image detecting unit 151 is one of a Photocoupled Device (CCD) or a Complementary Metal-Oxide Semiconductor (CMOS). The image detecting unit 151 has a predetermined resolution and a predetermined magnification and captures an image of the printed circuit board 11 at a predetermined working distance WD.
舉例來說：本發明所提之影像檢知單元151之影像解析度(Image Resolution)可為768×576畫素(pixel)，搭配鏡頭所形成的空間解析度(Spatial Resolution)可為0.25至0.5公厘/畫素(mm/pixel)，而工作距離WD可為200至700公厘(mm)；然而此僅用為方便舉例說明，並非加以限制影像感測器的結構。For example, the image resolution of the image detecting unit 151 of the present invention may be 768×576 pixels, and the spatial resolution formed by the lens may be 0.25 to 0.5. The mm/pixel is used, and the working distance WD can be 200 to 700 mm (mm); however, this is only for convenience of illustration and does not limit the structure of the image sensor.
請參閱第2圖所示，本發明主要利用較大視野的視覺檢測分析裝置15配合相對應的預定工作距離WD的條件進行印刷電路板11影像之擷取工作，讓影像檢知單元151可以一次性的抓取印刷電路板11的完整全影像，並透過上述控制運算單元152將所擷取之完整全影像進行瑕疵子板121的行列位址判斷。Referring to FIG. 2, the present invention mainly utilizes the visual inspection and analysis device 15 of a larger field of view to perform the image capturing operation of the printed circuit board 11 in accordance with the condition of the corresponding predetermined working distance WD, so that the image detecting unit 151 can once The complete full image of the printed circuit board 11 is captured, and the complete full image captured by the control operation unit 152 is used to determine the row and address of the daughter board 121.
本發明於控制運算單元152中，預先將印刷電路板11的全影像設定為3×5個相同大小的行列區塊111，且由控制運算單元152分析影像中的各個行列區塊111上是否具有高度反差的不良品標記123，而該不良品標記123高度反差的行列位址即為後續置件機判斷印刷電路板11上瑕疵子板121位址。In the control arithmetic unit 152, the entire image of the printed circuit board 11 is set in advance to 3×5 rows and columns 111 of the same size, and the control arithmetic unit 152 analyzes whether each of the row and column blocks 111 in the image has The highly contrasting defective product mark 123, and the defective product mark 123 is highly contrasting, and the subsequent setter determines the address of the daughterboard 121 on the printed circuit board 11.
再把瑕疵子板121位址形成第一檢視資訊，並將此第一檢視資訊對應印刷電路板11可被辨識單元13的序列號傳至數據資料庫16儲存，以利後續置件機能至數據資料庫16抓取瑕疵子板121位址。Then, the address of the board 121 is formed into a first view information, and the first view information corresponding to the printed circuit board 11 can be transmitted to the data database 16 by the serial number of the identification unit 13 to facilitate subsequent device functions to the data. The database 16 captures the address of the board 121.
舉例來說，本發明可將行列區塊11的橫軸方向由左至右依序定義為a、b、c、d…，而縱軸方向由下而上定義為1、2、3、4…，如圖所示之實施例中，印刷電路板11上的b2、c3、d1具有不良品標記123的高度反差，因此，控制運算單元152會將此行列資料b2、c3、d1等行列位址定義為跳過加工之區塊，使後續置件機能避開瑕疵子板121的置件，進而減少廢品的產生。然而，上述3×5個行列區塊111僅用為方便舉例說明之用，並非加以限制，亦即，上述行列區塊111可設複數個相同大小的區塊。For example, the present invention can sequentially define the horizontal axis direction of the row and column block 11 from left to right as a, b, c, d, ..., and the vertical axis direction from bottom to top as 1, 2, 3, 4 In the embodiment shown in the figure, b2, c3, and d1 on the printed circuit board 11 have the height contrast of the defective product mark 123. Therefore, the control arithmetic unit 152 will rank the row and column data b2, c3, and d1. The address is defined as a block that skips machining, so that the subsequent device can avoid the placement of the dieboard 121, thereby reducing the generation of waste. However, the above-mentioned 3×5 row and column blocks 111 are only used for convenience of description, and are not limited, that is, the row and column block 111 may be provided with a plurality of blocks of the same size.
於第二較佳實施例中，上述視覺檢測分析裝置15包含一線性掃描機，擷取上述印刷電路板11的表面影像；以及一控制運算單元152，處理線性掃描機所擷取的表面影像上之瑕疵子板121位址以形成第一檢視資訊，並將此第一檢視資訊對應印刷電路板11可被辨識單元13的序列號傳至數據資料庫16儲存。然而，此一實施例的瑕疵子板121位址分析程序與前述較佳實施例相同，故不重新贅述。In the second preferred embodiment, the visual inspection and analysis device 15 includes a linear scanner that captures a surface image of the printed circuit board 11 and a control arithmetic unit 152 that processes the surface image captured by the linear scanner. The daughter board 121 address is formed to form the first view information, and the first view information corresponding to the printed circuit board 11 can be transmitted to the data library 16 by the serial number of the identification unit 13. However, the address analysis program of the die board 121 of this embodiment is the same as the foregoing preferred embodiment, and therefore will not be described again.
於一較佳實施例中，上述線性掃描機其工作距離WD可在5至30公厘(mm)的條件下擷取印刷電路板11的影像，而線性掃描機的影像分析動作與前述影像檢知單元151相同，在此不在贅述。In a preferred embodiment, the linear scanner has a working distance WD of 5 to 30 mm, and the image of the printed circuit board 11 is captured, and the image analysis operation of the linear scanner and the image inspection are performed. The unit 151 is the same and will not be described here.
另前述各個不同實施例的步驟(B)之前更包含掃瞄上述可被辨識單元13取得上述印刷電路板11的序列號，使後續檢測第一檢視資訊可對應印刷電路板11的序列號存入數據資料庫16，以利後續置件加工機器直接取得檢視資訊，減少傳統於置件前始進行檢測導致的產線等待之耗時。The step (B) of the foregoing various embodiments further includes scanning the serial number of the printed circuit board 11 by the identifiable unit 13 so that the subsequent detection of the first view information can be stored in the serial number corresponding to the printed circuit board 11. The data database 16 facilitates the subsequent processing of the processing information by the subsequent processing machine, thereby reducing the time consuming to wait for the production line waiting for the inspection before the installation.
請參考第2A圖所示，另考量印刷電路板11及子板12材質的收縮以及尺寸越來越小的情況，且電路板之間的線寬線也已到了奈米等級，為求達到置件的精確度，印刷電路板11及子板12產生距離的誤差就必須加以考慮，因此每一定位標靶11a、11b、12a、12b(local fiducial mark)是為了讓檢測機10能快速依據定位標靶11a、11b、12a、12b的位置，以決定每一子板12所需要的位置資訊Y，使置件機可根據該位置資訊Y來進行置件，即置件機不會因子板12距離誤差，而將元件置件於不準確位置的子板12上。為此，上述印刷電路板11於兩斜對角分別設置一組定位標靶11a、11b，且每一子板12也分別具有一組兩斜對角的定位標靶12a、12b，並由上述兩斜對角的定位標靶11a、11b、12a、12b之間取得該一中點座標X1、X2，透過印刷電路板11的中點座標X1與每一子板12的中點座標X2相互比較，以形成每一子板的位置資訊Y。Please refer to FIG. 2A, and consider the shrinkage of the printed circuit board 11 and the daughter board 12 and the smaller and smaller size, and the line width between the boards has reached the nanometer level. The accuracy of the piece, the error of the distance between the printed circuit board 11 and the daughter board 12 must be considered, so each positioning target 11a, 11b, 12a, 12b (local fiducial mark) is for the detection machine 10 to quickly locate. The positions of the targets 11a, 11b, 12a, 12b are determined to determine the position information Y required by each of the sub-boards 12, so that the setting machine can perform the setting according to the position information Y, that is, the setting machine does not have the factor board 12 The distance is offset and the component is placed on the daughter board 12 in an inaccurate position. To this end, the printed circuit board 11 is provided with a plurality of positioning targets 11a, 11b at opposite diagonal angles, and each of the sub-boards 12 also has a set of two diagonally opposite positioning targets 12a, 12b, respectively. two oblique diagonal positioning target 11a, 11b, 12a, obtains the X coordinate of a midpoint between 12b 1, X 2, the printed circuit board through the midpoint of the coordinates X 11 and a midpoint coordinate of each sub-plate 12 X 2 is compared with each other to form position information Y of each sub-board.
因此，關於步驟(C)本發明是以一視覺檢測分析裝置15來檢測上述印刷電路板11每一定位標靶11a、11b、12a、12b，以分析每一子板12的位置資訊Y，上述視覺檢測分析裝置15包含一影像檢知單元151，以擷取上述印刷電路板11上複數個定位標靶11a、11b、12a、12b；以及一控制運算單元152，處理擷取影像上每一子板12的定位標靶12a、12b並分析取得位置資訊Y。Therefore, with respect to the step (C), the present invention detects each of the positioning targets 11a, 11b, 12a, and 12b of the printed circuit board 11 by a visual inspection and analysis device 15 to analyze the position information Y of each of the sub-boards 12, The visual inspection and analysis device 15 includes an image detecting unit 151 for capturing a plurality of positioning targets 11a, 11b, 12a, and 12b on the printed circuit board 11 and a control computing unit 152 for processing each of the captured images. The positioning targets 12a, 12b of the board 12 are analyzed and the position information Y is obtained.
於一較佳實施例中，上述影像檢知單元151以一預定範圍擷取印刷電路板11及複數個子板12的範圍影像，上述範圍影像包括一印刷電路板11及至少一組子板12的定位標靶12a、12b，檢測上述範圍影像中的定位標靶12a、12b，以分析上述印刷電路板11上各位置子板12的位置資訊Y來形成第二檢視資訊，並把上述第二檢視資訊對應上述印刷電路板11的可被辨識單元13的序列號儲存於上述數據資料庫16。In a preferred embodiment, the image detecting unit 151 captures a range image of the printed circuit board 11 and the plurality of sub-boards 12 by a predetermined range, and the range of the image includes a printed circuit board 11 and at least one set of sub-boards 12 The positioning targets 12a, 12b are detected, and the positioning targets 12a, 12b in the range image are detected to analyze the position information Y of the sub-boards 12 at each position on the printed circuit board 11 to form a second viewing information, and the second viewing view is performed. The information corresponding to the serial number of the identifiable unit 13 of the printed circuit board 11 is stored in the data database 16.
本發明首先透過上述影像檢知單元151擷取印刷電路板11一組定位標靶11a、11b的影像，並由上述控制運算單元152處理所擷取的影像，取得印刷電路板11兩斜對角的定位標靶11a、11b共同構成之傾斜角度θ1，再取得兩點定位標靶11a、11b之間的中點座標X1，然後再一次透過影像檢知單元151擷取左上角子板12的一組定位標靶12a、12b的範圍影像，取得定位標靶12a、12b的傾斜角度θ2及中點座標X2，並經由上述控制運算單元152處理計算兩中點座標X1、X2以形成位置資訊Y，接著上述控制運算單元152會繼續進行下一預定範圍擷取子板12的影像，直到分析完印刷電路板11上所有子板12的位置資訊Y，再將各子板12所得之位置資訊Y及其他資訊(θ1、θ2、X1、X2、…)統整形成第二檢視資訊。The image capture unit 11 captures the image of a set of positioning targets 11a and 11b of the printed circuit board 11 through the image detecting unit 151, and the captured image is processed by the control computing unit 152 to obtain two oblique diagonals of the printed circuit board 11. The positioning targets 11a and 11b jointly form an inclination angle θ 1 , and then obtain a midpoint coordinate X 1 between the two positioning targets 11 a and 11 b , and then pass through the image detecting unit 151 to extract the upper left corner sub-board 12 again. A range image of the positioning targets 12a, 12b is obtained, and the tilt angle θ 2 and the midpoint coordinate X 2 of the positioning targets 12a, 12b are obtained, and the two midpoint coordinates X 1 , X 2 are calculated by the control operation unit 152. The position information Y is formed, and then the control operation unit 152 continues to perform the image of the sub-board 12 in the next predetermined range until the position information Y of all the sub-boards 12 on the printed circuit board 11 is analyzed, and then the sub-boards 12 are obtained. The position information Y and other information (θ 1 , θ 2 , X 1 , X 2 , ...) are integrated to form the second view information.
最後再將其第二檢視資訊對應印刷電路板11可被辨識單元13的序列號傳至數據資料庫16儲存，以利後續置件機能至數據資料庫16直接抓取此位置資訊Y進行置件，使後續置件機能準確將元件置件於子板12上，進而達到準確置件的功效。然而，預定範圍擷取一塊子板12的範圍影像僅用為方便舉例說明之用，並非加以限制，亦即，上述預定範圍可擷取複數個子板12的範圍影像。Finally, the second viewing information corresponding to the printed circuit board 11 can be transmitted to the data database 16 by the serial number of the identification unit 13, so that the subsequent setting machine can directly capture the position information Y to the data database 16 for setting. Therefore, the subsequent setting machine can accurately place the components on the sub-board 12, thereby achieving the effect of accurate placement. However, the range of images of the predetermined range of sub-boards 12 is only used for convenience of illustration, and is not limited, that is, the predetermined range can capture a range of images of the plurality of sub-boards 12.
於另一較佳實施例中，上述範圍影像另可為擷取印刷電路板11的全影像，檢測上述全影像中的所有印刷電路板11及子板12的定位標靶11a、11b、12a、12b，以分析上述印刷電路板11上各位置子板12的位置資訊Y來形成第二檢視資訊，並把上述第二檢視資訊對應上述印刷電路板11的可被辨識單元13的序列號儲存於上述數據資料庫16。本實施例中，影像檢知單元151高影像解析度之感測器並搭配工作距離WD，可一次性擷取印刷電路板11的全影像，且透過控制運算單元152分析全影像上所有子板12的定位標靶12a、12b之位置資訊Y，將分析後每一子板12的位置資訊Y統整形成上述第二檢視資訊，並把上述第二檢視資訊對應上述印刷電路板11可被辨識單元13的序列號儲存於上述數據資料庫16。然而，此一實施例的位置資訊Y分析程序與前述較佳實施例相同，故在此不重新贅述。In another preferred embodiment, the image of the range may be a full image of the printed circuit board 11, and the positioning targets 11a, 11b, and 12a of all the printed circuit boards 11 and 12 of the whole image are detected. 12b, analyzing the position information Y of each position sub-board 12 on the printed circuit board 11 to form a second view information, and storing the second view information corresponding to the serial number of the identifiable unit 13 of the printed circuit board 11 The above data database 16. In this embodiment, the image detecting unit 151 has a high image resolution sensor and is matched with the working distance WD, and can capture the entire image of the printed circuit board 11 at one time, and analyze all the daughter boards on the full image through the control computing unit 152. The position information Y of the positioning targets 12a and 12b of 12 is integrated to form the second viewing information of each sub-board 12 after analysis, and the second viewing information corresponding to the printed circuit board 11 can be identified. The serial number of the unit 13 is stored in the above data repository 16. However, the position information Y analysis program of this embodiment is the same as the foregoing preferred embodiment, and therefore will not be described again.
再者，請參考第3圖所示，前述步驟(B)及步驟(C)取得的第一檢視資訊及第二檢視資訊是儲存於一獨立系統的數據資料庫16，上述數據資料庫16介於上述視覺檢測分析裝置15及置件機之間，並透過一網路接收及傳輸上述第一檢視資訊、第二檢視資訊及可被辨識單元13的序列號。Furthermore, please refer to FIG. 3, the first view information and the second view information obtained in the foregoing steps (B) and (C) are stored in a data database 16 of a separate system, and the data database 16 is introduced. The first view information, the second view information, and the serial number of the identifiable unit 13 are received and transmitted through the network between the visual inspection and analysis device 15 and the device.
請參閱第3A圖所示另一較佳實施例，前述步驟(B)及步驟(C)取得的第一檢視資訊及第二檢視資訊是儲存於一位於上述置件機內部的數據資料庫16a，上述數據資料庫16a透過一網路由視覺檢測分析裝置15接收第一檢視資訊、第二檢視資訊及可被辨識單元13的序列號。Referring to another preferred embodiment shown in FIG. 3A, the first view information and the second view information obtained in the foregoing steps (B) and (C) are stored in a data database 16a located inside the set machine. The data database 16a receives the first view information, the second view information, and the serial number of the identifiable unit 13 through a network route visual inspection analyzing device 15.
請參閱第3B圖所示再一較佳實施例，述步驟(B)及步驟(C)取得的第一檢視資訊及第二檢視資訊是儲存於一位於上述視覺檢測分析裝置15的數據資料庫16b，上述數據資料庫16b透過一網路傳輸第一檢視資訊、第二檢視資訊及可被辨識單元13的序列號給上述置件機。Referring to the further preferred embodiment shown in FIG. 3B, the first view information and the second view information obtained in the step (B) and the step (C) are stored in a data database located in the visual inspection and analysis device 15. 16b. The data database 16b transmits the first view information, the second view information, and the serial number of the identifiable unit 13 to the setter through a network.
於前述三個實施例中，上述網路至少包括一區域網路與一廣域網路，且上述數據資料庫16、16a、16b亦可採網路連接置件完成的後續加工機器。In the foregoing three embodiments, the network includes at least a regional network and a wide area network, and the data database 16, 16a, 16b may also be a subsequent processing machine completed by the network connection.
關於步驟(D)，本發明提供一掃描裝置配合後續置件機組裝，由上述掃描裝置讀取印刷電路板11的可被辨識單元13，以取得該印刷電路板11對應的序列號，由置件機依據此序列號至數據資料庫16抓取對應的第一檢視資訊及第二檢視資訊，且由數據資料庫16提供置件機第一檢視資訊及第二檢視資訊，則置件機將依據提供的第一及第二檢視資訊避開瑕疵子板121位址並微調對應的加工位置，精準地使複數個晶粒分別定位結合至對應印刷電路板11的每一無瑕疵子板122上。With respect to the step (D), the present invention provides a scanning device for assembly with a subsequent device, and the identifiable unit 13 of the printed circuit board 11 is read by the scanning device to obtain a serial number corresponding to the printed circuit board 11. The machine picks up the corresponding first view information and the second view information according to the serial number to the data database 16, and the first view information and the second view information of the set machine are provided by the data database 16, then the device will According to the provided first and second viewing information, the address of the dieboard 121 is avoided and the corresponding processing position is fine-tuned, and the plurality of crystal grains are accurately positioned and coupled to each of the non-twisted boards 122 corresponding to the printed circuit board 11. .
綜上所述，本發明透過事先檢測作業並將檢測資訊儲存於數據資料庫，並配合一組裝於後續置件機台的辨識裝置，由辨識裝置讀取印刷電路板上的序列號，再由數據資料庫傳輸對應印刷電路板的加工必須資訊至置件機台，讓置件機台可直接進行後續精密的置件加工，如此即可減少傳統封裝廠置件程序前需等待檢測之耗費時間，提升整體製作產能的稼動率。In summary, the present invention stores the serial number on the printed circuit board by the identification device by pre-detecting the operation and storing the detection information in the data database, and with an identification device assembled on the subsequent setting machine. Data database transfer corresponds to the processing of the printed circuit board must be information to the machine, so that the machine can directly carry out subsequent precision processing, so as to reduce the time required to wait for the test before the traditional package factory To increase the utilization rate of the overall production capacity.
惟以上所述僅為本發明之較佳實施例，非意欲侷限本發明之專利保護範圍，故舉凡運用本發明說明書及圖示內容所為之等效變化，均同理皆包含於本發明之權利保護範圍內，合予陳明。The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalents of the present invention and the equivalents thereof are all included in the present invention. Within the scope of protection, it is given to Chen Ming.
10．．．檢測機10. . . Testing machine
11．．．印刷電路板11. . . A printed circuit board
11a．．．定位標靶11a. . . Targeting target
11b．．．定位標靶11b. . . Targeting target
111．．．行列區塊111. . . Row block
12．．．子板12. . . Daughter board
121．．．瑕疵子板121. . . Scorpion board
122．．．無瑕疵子板122. . . Tweezers-free board
123．．．不良品標記123. . . Bad product mark
12a．．．定位標靶12a. . . Targeting target
12b．．．定位標靶12b. . . Targeting target
13．．．可被辨識單元13. . . Can be identified
15．．．視覺檢測分析裝置15. . . Visual inspection and analysis device
151．．．影像檢知單元151. . . Image detection unit
152．．．控制運算單元152. . . Control arithmetic unit
16．．．數據資料庫16. . . Data library
16a．．．數據資料庫16a. . . Data library
16b．．．數據資料庫16b. . . Data library
WD．．．工作距離WD. . . Working distance
θ1．．．傾斜角度θ 1 . . . slope
θ2．．．傾斜角度θ 2 . . . slope
X1．．．中點座標X 1 . . . Midpoint coordinates
X2．．．中點座標X 2 . . . Midpoint coordinates
Y．．．位置資訊Y. . . Location information
第1圖係本發明置件之流程示意圖；Figure 1 is a schematic flow chart of the device of the present invention;
第2圖係本發明之不良品標記分析示意圖；Figure 2 is a schematic diagram of the analysis of the defective product of the present invention;
第2A圖係本發明之位置資訊分析示意圖；2A is a schematic diagram of location information analysis of the present invention;
第3圖係本發明之數據資料庫一較佳實施例示意圖；Figure 3 is a schematic diagram of a preferred embodiment of the data repository of the present invention;
第3A圖係本發明之數據資料庫另一較佳實施例示意圖；以及3A is a schematic diagram of another preferred embodiment of the data repository of the present invention;
第3B圖係本發明之數據資料庫再一較佳實施例示意圖。Figure 3B is a schematic diagram of still another preferred embodiment of the data repository of the present invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100121160A TWI449119B (en) | 2011-06-17 | 2011-06-17 | Circuit board placement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100121160A TWI449119B (en) | 2011-06-17 | 2011-06-17 | Circuit board placement method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201301430A true TW201301430A (en) | 2013-01-01 |
| TWI449119B TWI449119B (en) | 2014-08-11 |
Family
ID=48137604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100121160A TWI449119B (en) | 2011-06-17 | 2011-06-17 | Circuit board placement method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI449119B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI498573B (en) * | 2013-11-05 | 2015-09-01 | King Yuan Electronics Co Ltd | Semiconductor Chip Retesting System and Retesting Method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002014885A2 (en) * | 2000-08-15 | 2002-02-21 | Siemens Energy & Automation, Inc. | Defective circuit scanning device and method |
| JP4514322B2 (en) * | 2000-12-08 | 2010-07-28 | パナソニック株式会社 | Component mounting method and component mounting apparatus |
| TW200814873A (en) * | 2006-09-08 | 2008-03-16 | chen-xiang Yan | Device and method for positioning and assembling circuit boards |
| TW200942103A (en) * | 2008-03-25 | 2009-10-01 | Unimicron Technology Corp | Transplantation method for multi-circuit board |
| TWI452284B (en) * | 2008-10-08 | 2014-09-11 | D Tek Technology Co Ltd | The method of detecting the mark of the multi-board, the method of detecting the device and the multi-board |
| TWI386117B (en) * | 2009-05-22 | 2013-02-11 | Zhen Ding Technology Co Ltd | Printed circuit boards having optical readable identity code and method for manufacturing same |
-
2011
- 2011-06-17 TW TW100121160A patent/TWI449119B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI498573B (en) * | 2013-11-05 | 2015-09-01 | King Yuan Electronics Co Ltd | Semiconductor Chip Retesting System and Retesting Method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI449119B (en) | 2014-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3522280B2 (en) | Method and apparatus for a ball bond inspection system | |
| US6671397B1 (en) | Measurement system having a camera with a lens and a separate sensor | |
| US20120327215A1 (en) | High speed optical sensor inspection system | |
| JP4776197B2 (en) | Wiring board inspection equipment | |
| US10535157B2 (en) | Positioning and measuring system based on image scale | |
| TWI452284B (en) | The method of detecting the mark of the multi-board, the method of detecting the device and the multi-board | |
| CN103247548B (en) | A kind of wafer defect checkout gear and method | |
| JP2011158363A (en) | Soldering inspection device for pga mounting substrate | |
| JP2019027922A (en) | Electronic component conveyance device and electronic component inspection device | |
| CN102856214A (en) | Circuit board mounting method | |
| US6633663B1 (en) | Method and system for determining component dimensional information | |
| CN101339656A (en) | Image processing process of full-automatic lead wire bonding machine image processing system | |
| JP5060821B2 (en) | Substrate inspection apparatus and substrate inspection method | |
| TWI449119B (en) | Circuit board placement method | |
| TW201940840A (en) | Appearance inspection device | |
| TW201310024A (en) | Method for inspecting bad marks on PCB and correcting difference of PCB, and mounting method thereof | |
| JP4628665B2 (en) | Needle mark reading device and needle mark reading method | |
| JP2008261692A (en) | Substrate inspection system and substrate inspection method | |
| JP4706366B2 (en) | Position detection method | |
| JP3857668B2 (en) | Pattern alignment method | |
| JP2020201283A (en) | Substrate inspection device, inspection tool, and substrate inspection method therefor | |
| KR102153168B1 (en) | Semiconductor Device Attaching Method | |
| JP2005274309A (en) | Inspection method and inspection device for three-dimensional object | |
| JP3258607B2 (en) | Surface inspection equipment | |
| JPH11132735A (en) | Ic lead floating inspection device and inspection method |