ll 37613twf.doc/n 201242457 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子元件及其製造方法，且特別 是有關於一種可撓性電子元件及其製造方法。 【先前技術】 由於可撓性電子元件具有輕薄、可撓曲、耐衝擊、安 全性高以及方便攜帶等特性，因此可撓性電子元件勢必會 成為下一世代的主流。一般而言，製作可撓性電子元件的 方式可大致上分為兩種，其中一種方式是直接製作電子元 件於可撓性基板上’另一種方式為間接轉貼電子元件於可 撓性基板上。若採用直接製作電子元件於可撓性基板上的 方式來製作可撓性電子元件，則需先藉由黏著層將可撓性 基板貼附於硬質基板上，之後再於可撓性基板上製作所需 之電子元件。最後’再將可撓性基板及可撓性基板上的電 子元件從硬質基板上取下。然而，由於可撓性基板係透過 黏著層而緊密地貼附在硬質基板上，因此在將可撓性基板 自硬質基板上取下的過程中，可撓性基板上的電子元件會 有又損的可能性，進而使可撓性電子元件的製造良率下 降。對於此領域具有通常知識者而言，如何改善可撓性基 板的取下過程所導致的良率下降問題，實為亟待解決的課 題之一Ο 4 201242457 AU1101022 37613twf.doc/n 【發明内容】 本發明提供一種可撓性電子元件的製造方法，以提高 可撓性電子元件的製造良率。 本發明提供一種可撓性電子元件，其具有高製造良 率。 本發明提供一種可撓性電子元件的製造方法，其包括 下列步驟。藉由弱力介面層將可撓性基板結合於硬質基板 上。於可撓性基板上形成多個陣列排列之電子元件，各電 子元件分別具有功能部（active portion)以及環繞功能部 之擬部（dummyporti〇n)。切割可撓性基板與硬質基板， 以將硬質基板分離為多個子基板，其中各子基板上分別具 有一個電子元件。沿著各功能部的至少部分邊緣對電子元 件進行非接觸性切割，以於各功能部與對應之擬部之間形 成第一切割道。沿著各第一切割道對可撓性基板與弱力介 面層進行接觸性切割，以於可撓性基板與弱力介面層中形 成第二切割道，其中第二切割道使各子基板的部分區域暴 露。將各功能部與位於各功能部下方之可撓性基板從各子 基板取下。 在本發明的一實施例中，前述之弱力介面層之材質包 括五環芳香烴（perylene)、多環芳香烴（p〇iy ar〇matic hydrocarbon前述之）或氫化氮化矽（SiNx:H)，而前述之 可燒性基板之材質包括聚對苯二曱酸乙二醋（polyethylene terephthalate ’ PET )、聚秦二曱酸乙二醇酯（p〇iyethylene naphthalate ’ PEN)、聚謎礙、聚苯謎石風（Poiyethersulfone， PES )、聚碳酸酯（polycarbonate ’ PC )、聚亞醯胺（poiyimide， 201242457 —.....'22 37613twf.doc/n PI)、環狀烯腈聚合物（Cyclic Olefin Polymer，ARTON)或 聚芳酯樹脂（polyarylate resin，PAR)，而前述之硬質基板 之材質包括玻璃、聚碳酸g旨（polycarbonate，PC)或不錄 鋼板（rustless steel sheet)，且前述之電子元件包括可撓 性顯示面板、可撓性發光元件、可饒式吸光元件、可撓式 感應偵測器、可撓式電晶體、可撓式二極體、可撓式積體 電路或可撓式印刷電路板。 在本發明的一實施例中，前述之切割可撓性基板與硬 質基板以分離出多片子基板之步驟中，切割可撓性基板與 硬質基板的方法包括機械切割。 在本發明的一實施例中，前述之非接觸性切割包括雷 射切。j電弧切割或專離子切割，其中接觸性切割包括固 定式刀具切割、轉動式刀輪切割或固定式刀模切割。 止在本發明的一貫施例中，前述之可撓性電子元件的製 j方法y進一步包括：在切割可撓性基板與硬質基板之 著各功能部的部分邊緣對電子元件、可撓性基板與 能 層進行雷__，膽各魏部與對應之擬部 之間形成肋#丨道，其巾預蝴道與第— 部與對應之擬部分離。 、便谷力 、止方沐0Γ&、—貫施财，前狀可撓性電子元件的製 =:y進-步包括：在切割可挽性基板與硬質基板之 後’沿著各魏部的部分邊緣對電子元件 ^ 弱力介面層進行雷射預切割,以於各功能部 部與對應之擬部分離㈣财與第—_道使各功能 6 201242457 Αυΐ1ϋΚ)22 37613twf.doc/n 在本發明的-實施例中，前述之可撓性電子元件 造方法可進-步包括：在將各功能部與⑽各功能部下^ 之可撓性基板從各子基板取下之前，將各擬 部下方之可撓性基板從各子基板取下。 、各擬 本發明提供-種可撓性電子元件，其包括可撓性基板 以及電子70件。電子元伽置於可紐基板上，其中電子 元件具有傾斜之側壁（tapered sidewall)。 ' 在本發明的一貫施例中，前述之電子元件具有與可撓 性基板接合之絲面與底表面相對之頂表面，且頂表面的 面積小於底表面的面積。 在本發明的-實施例中，前述之傾斜的側壁包括多個 傾斜程度不同的子側壁。 基於上述，本發明之可撓性電子元件的製造方法藉由 在^可撓性基板及可撓性基板上之電子元件自硬質基板取 下刖先進行一取下前預處理，而使可撓性基板及可撓性基 巧上的電子元件可輕易地從硬雜板取下。並且，於此過 权中，可撓性基板上的電子元件不易發生受損或電子元件 中之膜層分離輪曲_題，從而提高了可橈性電子元件 的製造良率。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 [可撓性電子元件的製造方法] 20124245722 37613twf.doc/n 圖1A至圖1H為本發明一實施例之可撓性電子元件 的製造流程剖面示意圖，而圖2A至圖2F為本發明一實施 例之可撓性電子元件的製造流程上視示意圖。詳言之，圖 1A至圖1D以及圖1E至圖1F係分別依據圖2A至圖2D 之剖線AA’以及圖2E至圖2F之剖線BB，所繪示。以下將 搭配圖1A至圖1H以及圖2A至圖2F，針對可撓性電子元 件的製造方法進行詳細的描述。 請參照圖1A及圖2A，首先’藉由弱力介面層120將 可撓性基板130貼附於硬質基板11〇上。在本實施例中， 弱力介面層120之材質包括五環芳香烴（peryiene)、多環 芳香烴（poly aromatic hydrocarbon )或氫化氮化石夕 (SiNx:H)。本實施例之可撓性基板130之材質包括聚對 苯二曱酸乙二酯（polyethylene terephthalate ’ PET)、聚萘二 曱酸乙二醇酯（polyethylene naphthalate，PEN)、聚醚颯、 聚苯醚砜（Polyethersulfone ’ PES )、聚碳酸酯（p〇iyCarb〇nate， PC)、聚亞醯胺（polyimide ’ PI)、環狀烯腈聚合物（Cyclic Olefin Polymer ’ ARTON )或聚芳酉旨樹月旨（p〇iyaryiate resin， PAR)。本實施例之硬質基板的材質包括有機材料或無機材 料’例如玻璃、聚碳酸醋（polycarbonate，PC)或不錄鋼 板（rustless steel sheet)，但本發明不以此為限。在本實 施例中，弱力介面層120可先結合(舉例為貼附、沉積離型 層等方式)於可撓性基板130上，再使可撓性基板130透過 弱力介面層120與硬質基板110接合。在其他實施例中， 弱力介面層120可先結合於硬質基板110上，再使硬質基 板110透過弱力介面層120與可撓性基板13〇接合。 8 201242457 AU11U1U22 37613twf.doc/n 請參照圖IB及圖2B，接著，於可撓性基板13〇上形 成多個陣列排列之電子元件140(圖2B中僅繪出四個電子 元件140做為代表，然本實施例不限定電子元件14〇的數 量），各電子元件140分別具有功能部（active p〇rti〇n) 142以及環繞功能部142之擬部（dummy portion) 144。在 本實施例中，電子元件14〇之功能部142例如是呈矩形， 而電子元件140之擬部144例如是呈口字型且與功能部 142連接。本實施例之電子元件14〇包括可撓性顯示面板 (例如可撓性液晶顯示面板、可撓性電泳顯示面板、可撓 I·生f機電致發光顯示面板等）、可撓性發光元件、可撓式 吸光7C件、可撓式感應偵測器、可撓式電晶體、可撓式二 極體、、可撓式積體電路或可撓式印刷電路板，但本發明不 以此為限。以可撓性顯示面板為例，其功能部142係指顯 示區域，而擬部係指環繞顯示區域之周邊區域。 睛參照圖1C及圖2C，接著，沿著各功能部142的部 分邊緣142a對電子元件14〇、可撓性基板13〇與弱力介面 ，120進行雷射（例如二氧化碳雷射）預切割，以於各功 能部142與對應之擬部144之間形成預切割道η。詳言之， 在本實把例中，可沿著呈矩形之功能部142的三個邊緣 142a對電子元件14〇、可紐基板13()與弱力介面層12〇 進行雷射預切割’以於功能#⑷與對應的擬部144之間 形成近似门子型的預切割道H。在本實施例中，雖以雷射 預切割的料軸肋财H，⑽，本發㈣限定預切 d道Η的形成方法必須是雷射預切割。在其他實施例中， 亦可使用電弧_、轉子蝴或其他合適的方法形成預 37613twf.doc/n 201242457 LL 切割道H。此外，預切割道H的形狀亦不限定必須是门字 型，預切割道Η亦可以是l形、矩形或由兩條彼此平行的 預切割道所構成。 值得一提的是，在本實施例中，係採用雷射切割的方 式形成預切割道Η ’因此被移除之部分電子元件14〇、部 分可撓性基板130以及部分弱力介面層12〇會被氣化，而 不會在形成預切割道Η的過程中造成殘屑的問題。此外， 以雷射切割的方式形成預切割道Η時，會於電子元件"ο 的側壁呈現微溶融狀態，進而使電子元件14〇之側壁上披 覆一層混合物層（未繪示）。此混合物層係由電子元件14〇 中各膜層的材質所混合形成，其可有效保護電子元件 的側壁，且可使電子元件140中的各膜層獲得進一步的保 護，而不易有薄膜剝落(peeling)、分層(de_laminati〇n)或翹 曲(warpage)等問題。另外，在本實施例中，可藉由調整雷 射之功率、移動速度、聚焦深度(depth of focus，DOP)等參數， 可控制預切割道Η之寬度、深度以及電子元件14〇之侧壁 形狀。 需特別說明的是，在本實施例中，是在切割可撓性基 板130與硬質基板110之前，沿著各功能部142的部分邊 緣142a對電子元件丨4〇、可撓性基板13〇與弱力介面層12〇 進行雷射預切割，以於各功能部142與對應之擬部144之 間形成預切割道Η。但在其他實施例中，亦可於切割可撓 性基板130與硬質基板110之後，再進行雷射預切割的動 作。 ° 請參照圖ID及圖2D，接著，切割可撓性基板13〇與 201242457 AU1101022 37613twf.d〇c/n 硬質基板110’以將硬質基板110分離為多個子基板110，， 其中各子基板11〇,上分別具有一個電子元件14〇。切割可 撓性基板130與硬質基板11〇的方式有許多種，其中一種 疋採用機械切割的方式（例如固定式刀具切割、轉動式刀 輪t割或固定式刀模切割等）。但本發明不限於此，在其 他貫靶例中，亦可採用非機械切割的方式切割可撓性基板 130與硬質基板110。 請參照圖1E及圖2E，在將硬質基板11〇分離為多個 子，板110/之後（圖2E中僅繪出一個子基板做為代表）， 接著，沿著各電子元件14〇之功能部142的至少部分邊緣 對電子元件14〇及可撓絲板13()進行非接觸性切 :，以於各功能部H2麟應之擬部144之間形成第一切 j道Hi。在本實關巾，非制方式包括雷射切 、電弧切割或等離子切割。 值得-提的是，在本實施财，第—_道m斑預 吏各功能部142與對應之擬部崎離。詳言之， =貫_巾’近似Π字型歧形_切割道Η與 的，-切割道m圍成封閉的矩形，轉切割道η盘第一 =道m共同環繞功能部142，而將功能部142與對=之 =，分離。在其他實施例中，當預_道η為L _ 彼此平行的預切割道所構成，第—_道m㈣ 第：i =条彼此平行的第―切割道所構成。如此， 道11刊細_郷，且預匆 與第一切割道H1綠繞功能部142 丨 4 142與對應之擬部144分離。Ll 37613twf.doc/n 201242457 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic component and a method of manufacturing the same, and more particularly to a flexible electronic component and a method of manufacturing the same. [Prior Art] Since flexible electronic components are characterized by being thin, flexible, impact resistant, highly secure, and portable, flexible electronic components are bound to become the mainstream of the next generation. In general, the manner in which flexible electronic components are fabricated can be broadly divided into two types, one of which is to directly fabricate electronic components on a flexible substrate. Another way is to indirectly transfer electronic components to a flexible substrate. If a flexible electronic component is fabricated by directly fabricating an electronic component on a flexible substrate, the flexible substrate is first attached to the rigid substrate by an adhesive layer, and then formed on the flexible substrate. The required electronic components. Finally, the electronic components on the flexible substrate and the flexible substrate are removed from the rigid substrate. However, since the flexible substrate is closely attached to the rigid substrate through the adhesive layer, the electronic component on the flexible substrate may be damaged during the process of removing the flexible substrate from the rigid substrate. The possibility of further reducing the manufacturing yield of the flexible electronic component. For those of ordinary skill in the art, how to improve the yield reduction caused by the removal process of the flexible substrate is one of the problems to be solved Ο 4 201242457 AU1101022 37613twf.doc/n [Summary of the Invention] The invention provides a method of manufacturing a flexible electronic component to improve the manufacturing yield of the flexible electronic component. The present invention provides a flexible electronic component that has high manufacturing yield. The present invention provides a method of manufacturing a flexible electronic component comprising the following steps. The flexible substrate is bonded to the rigid substrate by a weak interface layer. A plurality of array-arranged electronic components are formed on the flexible substrate, each of the electronic components having an active portion and a dummy portion of the surrounding functional portion. The flexible substrate and the rigid substrate are cut to separate the hard substrate into a plurality of sub-substrates, wherein each sub-substrate has an electronic component. The electronic component is non-contact cut along at least a portion of the edges of the functional portions to form a first scribe line between each functional portion and the corresponding dummy portion. Contacting the flexible substrate and the weak interface layer along each of the first scribe lines to form a second scribe line in the flexible substrate and the weak interface layer, wherein the second scribe line makes each sub-substrate Some areas are exposed. The functional portions and the flexible substrate located under each functional portion are removed from the respective sub-substrates. In an embodiment of the invention, the material of the weak interface layer comprises a perylene, a polycyclic aromatic hydrocarbon (p前述iy ar〇matic hydrocarbon) or a hydrogenated hafnium nitride (SiNx:H). And the material of the above-mentioned flammable substrate comprises polyethylene terephthalate 'PET, p〇iyethylene naphthalate 'PEN, polymystery, Polyiethersulfone (PES), polycarbonate (PC), polyamidamine (poiyimide, 201242457-.....'22 37613twf.doc/n PI), cyclic olefin polymer (Cyclic Olefin Polymer, ARTON) or polyarylate resin (PAR), and the material of the aforementioned hard substrate includes glass, polycarbonate, or rustless steel sheet, and the foregoing Electronic components include flexible display panels, flexible light-emitting elements, absorbable light-absorbing elements, flexible inductive detectors, flexible transistors, flexible diodes, flexible integrated circuits, or Flexible printed circuit board. In an embodiment of the invention, in the step of cutting the flexible substrate and the rigid substrate to separate the plurality of sub-substrates, the method of cutting the flexible substrate and the rigid substrate includes mechanical cutting. In an embodiment of the invention, the aforementioned non-contact cutting includes laser cutting. j Arc cutting or ion cutting, where contact cutting includes fixed tool cutting, rotary cutter cutting or fixed die cutting. In the conventional embodiment of the present invention, the method for manufacturing the flexible electronic component further includes: cutting the electronic component and the flexible substrate at a portion of the edge of each functional portion of the flexible substrate and the rigid substrate. Ray __ is formed with the energy layer, and a rib #丨道 is formed between the Wei and the corresponding part of the biliary, and the towel pre-butter is separated from the corresponding part. , 谷谷力,止方沐0Γ&,-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Partial edge laser pre-cutting of the electronic component ^ weak interface layer, so that each function part is separated from the corresponding part (4) and the -_ way to make each function 6 201242457 Αυΐ1ϋΚ) 22 37613twf.doc/n In an embodiment of the invention, the method for manufacturing the flexible electronic component described above may further include: before removing each of the functional portions and (10) the flexible substrate of each functional portion from each of the sub-substrates, The flexible substrate is removed from each of the sub-substrates. Each of the present invention provides a flexible electronic component including a flexible substrate and 70 pieces of electrons. The electron gamma is placed on the susceptor substrate, wherein the electronic component has tapered sidewalls. In a consistent embodiment of the invention, the aforementioned electronic component has a top surface opposite the bottom surface to which the flexible substrate is bonded, and the area of the top surface is smaller than the area of the bottom surface. In the embodiment of the invention, the aforementioned inclined side wall includes a plurality of sub-side walls having different degrees of inclination. Based on the above, the method for manufacturing a flexible electronic component of the present invention is made to be flexible by removing the electronic component on the flexible substrate and the flexible substrate from the rigid substrate and performing a pre-removal pretreatment. The substrate and the electronic components on the flexible substrate can be easily removed from the hard board. Further, in this case, the electronic component on the flexible substrate is less likely to be damaged or the film separation in the electronic component is solved, thereby improving the manufacturing yield of the flexible electronic component. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] [Manufacturing method of flexible electronic component] 20124245722 37613twf.doc/n FIG. 1A to FIG. 1H are schematic cross-sectional views showing a manufacturing process of a flexible electronic component according to an embodiment of the present invention, and FIGS. 2A to 2F are views. A schematic diagram of a manufacturing process of a flexible electronic component according to an embodiment of the present invention. In detail, FIGS. 1A to 1D and FIGS. 1E to 1F are respectively illustrated in accordance with the line AA' of FIGS. 2A to 2D and the line BB of FIG. 2E to FIG. 2F. The method of manufacturing the flexible electronic component will be described in detail below with reference to Figs. 1A to 1H and Figs. 2A to 2F. Referring to Fig. 1A and Fig. 2A, first, the flexible substrate 130 is attached to the rigid substrate 11 by the weak interface layer 120. In this embodiment, the material of the weak interface layer 120 comprises a peryiene, a poly aromatic hydrocarbon or a hydrogen hydride nitride (SiNx:H). The material of the flexible substrate 130 of the present embodiment includes polyethylene terephthalate 'PET, polyethylene naphthalate (PEN), polyether oxime, polyphenylene Polyethersulfone ' PES , polycarbonate (p〇iyCarb〇nate, PC), polyimide ' PI , Cyclic Olefin Polymer ' ARTON or Polygonatum P〇iyaryiate resin (PAR). The material of the hard substrate of this embodiment includes an organic material or an inorganic material such as glass, polycarbonate, or rustless steel sheet, but the invention is not limited thereto. In this embodiment, the weak interface layer 120 may be bonded to the flexible substrate 130 by using a method such as attaching or depositing a release layer, and then passing the flexible substrate 130 through the weak interface layer 120 and the hard substrate 130. The substrate 110 is bonded. In other embodiments, the weak interface layer 120 may be bonded to the rigid substrate 110, and the rigid substrate 110 may be bonded to the flexible substrate 13 through the weak interface layer 120. 8 201242457 AU11U1U22 37613twf.doc/n Referring to FIG. 1B and FIG. 2B, a plurality of arrayed electronic components 140 are formed on the flexible substrate 13A (only four electronic components 140 are shown as representative in FIG. 2B). However, the present embodiment does not limit the number of electronic components 14 , , and each of the electronic components 140 has a functional portion ( 142 ) and a dummy portion 144 of the surrounding functional portion 142 . In the present embodiment, the functional portion 142 of the electronic component 14 is, for example, rectangular, and the dummy portion 144 of the electronic component 140 is, for example, in a lip shape and connected to the functional portion 142. The electronic component 14A of the present embodiment includes a flexible display panel (for example, a flexible liquid crystal display panel, a flexible electrophoretic display panel, a flexible I/O-electroluminescence display panel, etc.), a flexible light-emitting element, Flexible light absorbing 7C piece, flexible induction detector, flexible transistor, flexible diode, flexible integrated circuit or flexible printed circuit board, but the present invention does not limit. Taking the flexible display panel as an example, the functional portion 142 refers to the display area, and the pseudo portion refers to the peripheral area surrounding the display area. Referring to FIG. 1C and FIG. 2C, a laser (eg, carbon dioxide laser) pre-cut is performed on the electronic component 14A, the flexible substrate 13A, and the weak interface, 120 along a portion of the edge 142a of each functional portion 142. A pre-cut track η is formed between each functional portion 142 and the corresponding dummy portion 144. In detail, in the present embodiment, the electronic component 14A, the new substrate 13 () and the weak interface layer 12 can be laser pre-cut along the three edges 142a of the rectangular functional portion 142. A pre-cut track H of a similar gate type is formed between the function #(4) and the corresponding pseudo portion 144. In the present embodiment, although the laser pre-cutting shaft ribs H, (10), the method of forming the pre-cut d-turns of the present invention must be a laser pre-cut. In other embodiments, the pre-37613 twf.doc/n 201242457 LL cutting track H may also be formed using an arc _, rotor butterfly or other suitable method. Further, the shape of the pre-cutting path H is not necessarily limited to a gate shape, and the pre-cutting ballast may be formed in an l-shape, a rectangle, or two pre-cut streets parallel to each other. It is worth mentioning that, in this embodiment, the pre-cutting track is formed by laser cutting. Therefore, part of the electronic component 14A, the partially flexible substrate 130, and the partial weak interface layer 12 are removed. It will be vaporized without causing debris problems in the process of forming the pre-cutting ballast. In addition, when the pre-cut ball is formed by laser cutting, the side wall of the electronic component < ο is slightly melted, and the sidewall of the electronic component 14 is covered with a layer of mixture (not shown). The layer of the mixture is formed by mixing materials of the film layers of the electronic component 14 , which can effectively protect the sidewalls of the electronic component, and can further protect each film layer in the electronic component 140 without peeling off the film ( Peeling), layering (de_laminati〇n) or warpage (warpage). In addition, in this embodiment, the width, depth, and sidewalls of the electronic component 14 can be controlled by adjusting parameters such as power, moving speed, and depth of focus (DOP) of the laser. shape. It should be noted that, in this embodiment, before the flexible substrate 130 and the rigid substrate 110 are cut, the electronic component 〇4〇 and the flexible substrate 13 are along the partial edge 142a of each functional portion 142. The weak interface layer 12 is laser pre-cut to form a pre-cut ball between each functional portion 142 and the corresponding portion 144. However, in other embodiments, the laser pre-cutting operation may be performed after the flexible substrate 130 and the rigid substrate 110 are cut. Referring to FIG. 2 and FIG. 2D, the flexible substrate 13A and the 201242457 AU1101022 37613 twf.d〇c/n rigid substrate 110' are cut to separate the hard substrate 110 into a plurality of sub-substrates 110, wherein each sub-substrate 11 〇, each has an electronic component 14〇. There are many ways to cut the flexible substrate 130 and the rigid substrate 11 , one of which is mechanically cut (for example, a fixed cutter cutting, a rotary cutter t-cut or a fixed die cutting). However, the present invention is not limited thereto, and in other embodiments, the flexible substrate 130 and the rigid substrate 110 may be cut by a non-mechanical cutting method. Referring to FIG. 1E and FIG. 2E, after the hard substrate 11A is separated into a plurality of sub-boards, the board 110/after (only one sub-substrate is represented in FIG. 2E), and then along the functional parts of the electronic components 14 At least a portion of the edge of the 142 is non-contact-cut to the electronic component 14A and the flexible wire plate 13 () such that a first slice j is formed between the portions 144 of the functional portions H2. In this case, non-manufactured methods include laser cutting, arc cutting or plasma cutting. It is worth mentioning that, in the implementation of the present invention, the first function section 142 and the corresponding analogy section are separated. In detail, the _ _ towel 'approximate Π shape _ _ cutting the Η Η , - the cutting path m encloses a closed rectangle, the turning traverse η disk first = way m together around the functional part 142, and The functional unit 142 is separated from the ==. In other embodiments, when the pre-track η is a pre-cut track in which L _ is parallel to each other, the first-th track m (four) is: i = the first-cut line parallel to each other. Thus, the track 11 is fine-grained, and the pre-rush is separated from the first scribe line H1 green wrap function portion 142 丨 4 142 from the corresponding imaginary portion 144.
11 S 1 ^2. 37613twf.doc/n 此外，以非接觸性切割的方式形成第一切割道HI 時，會於電子元件140之功能部142的側壁呈現微熔融狀 態，進而使電子元件140之功能部142的側壁上披覆一層 混合物層（未繪示）。此混合物層係由電子元件140之功 能部142中各膜層的材質所混合形成，其可有效保護電子 元件140之功能部142的側壁，如此一來，於後續之第二 切割道形成之過程中或各功能部142與位於各功能部142 下方之可撓性基板130從各子基板110’取下的過程中，電 子元件140之功能部142中的各膜層間便不易有薄膜剝落 (peeling)、分層（de-lamination)或翹曲(warpage)等問題。 凊參照圖1F及圖2F，接著，沿著各第一切割道hi 對可撓性基板130與弱力介面層120進行接觸性切割，以 於可撓性基板130與弱力介面層120中形成第二切割道 H2 ’其中第一切割道H2使各子基板11〇’的部分區域1 i〇，a 暴露。在本實施中，接觸性切割包括固定式刀具切割、轉 動式刀輪切割或固定式刀模切割。 值得一提的是，以接觸性切割形成之第二切割道H2 破壞了子基板110’與可撓性基板130間之弱力介面層 120，而使子基板11〇,與可撓性基板13〇間之部份弱力^ 面層120產生離形的效果。如此一來，於後續製程中，欲 將各功能部142與位於各功能部丨42下方之可撓性基板 130從各子基板11〇,取下時，便可透過第二切割道輕 易地將各功能部142與位於各功能部142下方之可撓性基 板130取下。並且，於取下的過程中，可撓性基板不 會被過度地彎曲而使可撓性基板13〇上方之功能部142受 12 201242457 AU1101022 37613twf.doc/n 損。另外’需特別說明的是，如圖IF所示，於可撓性基 板130與弱力介面層120中形成第二切割道H2後’部份 之弱力介面層120可附著於可撓性基板130上，另一部份 之弱力介面層120可附著於子基板11〇,上。但在其他實施 例中’於可撓性基板130與弱力介面層120中形成第二切 割道H2後’弱力介面層120亦可僅附著於子基板110,上 或可撓性基板130上。 請同時參照圖1F及1G，接著，在本實施例中，可於 將各功能部142與位於各功能部142下方之可撓性基板 130從各子基板11〇’取下之前，可先將各擬部144與位於 各擬部144下方之可撓性基板130從各子基板110,取下。 然而’本發明不限於此，在其他實施例中，亦可僅將各功 能部142與位於各功能部142下方之可撓性基板130從各 子基板110’取下，而不將各擬部144與位於各擬部144下 方之可撓性基板130從各子基板110’取下。或者，於將各 功能部142與位於各功能部142下方之可撓性基板13〇從 各子基板110’取下之後，再將各擬部144與位於各擬部144 下方之可撓性基板130從各子基板110’取下。 請參照圖1H，最後，將各功能部142與位於各功能 部142下方之可撓性基板130從各子基板11〇,取下，而完 成了本實施例之可撓性電子元件的製程。 [可撓性電子元件] 圖3為本發明一實施例之可撓性電子元件剖面示意 圖。請參照圖3，本實施例之可撓性電子元件1〇〇包括可 13 37613twf.doc/n 201242457 δ1 撓性基板130以及電子元件ΐ4〇。電子元件14〇配置於可 撓性基板130上，其中電子元件14〇具有傾斜之側壁 (tapered sidewall) 140a。在本實施例中’傾斜之側壁14〇a 係指與可撓性基板13〇之法線方向n不平行之側壁。特別 的是，本實施例之可撓性電子元件1〇〇傾斜之側壁14〇a 了包括多個傾斜程度不同的子側壁14〇a，。各子側壁i4〇a， 的傾斜私度可視製程上之需求或可撓性電子元件丨⑻外觀 上之需求做調整。另外，本實施例之可撓性電子元件1〇〇 的電子元件14G具有與可撓性紐13G接合之絲面 140b 和與底表面140b相對之頂表面14〇c，且頂表面M〇c的面 積小於底表面140b的面積。 综上所述，在本發明之可撓性電子元件的製造方法 中，可藉由非接觸性切割形成切割道，而使可撓性基板上 的電子元件於後續製程中不易有薄膜剝落（peeling)、分 層（de-laminati〇n)或翹曲（肅卿〇等問題。此外，更 可利用接觸性切割破壞硬質基板與可撓性基板間之弱力介 面層’而使可紐基板及可撓性基板上的電子元件可輕易 地自硬質基板上取下，進而提高本發明之 的製造良率。 屯丁匕叶 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明’任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤部，故本 發明之保賴圍當視後附之巾請專利範圍所界定者為準。 【圖式簡單說明】 201242457 AU1101022 37613twf.doc/n 圖1A至圖1H為本發明一實施例之可撓性電子元件 的製造流程剖面示意圖。 圖2A至圖2F為本發明一實施例之可撓性電子元件的 製造流程上視示意圖。 圖3為本發明一實施例之可撓性電子元件剖面示意 圖。 【主要元件符號說明】 100 :可撓性電子元件 110 :硬質基板 110’ ：子基板 110’a :子基板的部分區域 120 :弱力介面層 130 :可撓性基板 140 :電子元件 140a、140a’ ：側壁 140b、140c :表面 142 :功能部 142a、142b :邊緣 144 :擬部 Η、HI、H2 :切割道 1511 S 1 ^2. 37613twf.doc/n Further, when the first dicing street HI is formed by non-contact cutting, the side wall of the functional portion 142 of the electronic component 140 is in a slightly molten state, thereby causing the electronic component 140 to The side wall of the functional portion 142 is covered with a layer of a mixture (not shown). The layer of the mixture is formed by mixing the materials of the film layers in the functional portion 142 of the electronic component 140, which can effectively protect the sidewalls of the functional portion 142 of the electronic component 140, and thus, the subsequent formation of the second scribe line. During the process of removing the flexible substrate 130 located under each functional portion 142 from the respective sub-substrate 110', the film portion of the functional portion 142 of the electronic component 140 is less likely to be peeled off (peeling). ), de-lamination or warpage. Referring to FIG. 1F and FIG. 2F, the flexible substrate 130 and the weak interface layer 120 are contact-cut along the first dicing streets hi to form the flexible substrate 130 and the weak interface layer 120. The second scribe line H2' wherein the first scribe line H2 exposes a partial region 1 i, a of each sub-substrate 11'. In this embodiment, the contact cut includes a fixed cutter cut, a rotary cutter cut, or a fixed die cut. It is worth mentioning that the second dicing street H2 formed by contact cutting breaks the weak interface layer 120 between the sub-substrate 110' and the flexible substrate 130, and the sub-substrate 11 is folded, and the flexible substrate 13 is Part of the weak force in the daytime ^ The surface layer 120 produces a distracting effect. In this way, in the subsequent process, when the functional portions 142 and the flexible substrate 130 located under each functional portion 丨42 are removed from the respective sub-substrates 11, the second dicing road can be easily passed through. Each functional portion 142 is removed from the flexible substrate 130 located below each functional portion 142. Further, during the removal process, the flexible substrate is not excessively bent, and the functional portion 142 above the flexible substrate 13 is damaged by 12 201242457 AU1101022 37613twf.doc/n. In addition, it should be particularly noted that, as shown in FIG. IF, after the second dicing street H2 is formed in the flexible substrate 130 and the weak interface layer 120, a portion of the weak force interface layer 120 may be attached to the flexible substrate. At 130, another portion of the weak interface layer 120 can be attached to the sub-substrate 11 〇. However, in other embodiments, the weak interface layer 120 may be attached to the sub-substrate 110, the upper substrate or the flexible substrate 130 after the second dicing street H2 is formed in the flexible substrate 130 and the weak interface layer 120. . Referring to FIGS. 1F and 1G simultaneously, in the present embodiment, before the functional portions 142 and the flexible substrate 130 located under each functional portion 142 can be removed from the respective sub-substrates 11A, Each of the dummy portions 144 and the flexible substrate 130 located under each of the dummy portions 144 are removed from the respective sub-substrates 110. However, the present invention is not limited thereto. In other embodiments, only the functional portions 142 and the flexible substrate 130 located under each functional portion 142 may be removed from the respective sub-substrates 110' without the respective portions. 144 and the flexible substrate 130 located under each of the dummy portions 144 are removed from the respective sub-substrates 110'. Alternatively, after the functional portions 142 and the flexible substrate 13A located under the respective functional portions 142 are removed from the respective sub-substrates 110', the dummy portions 144 and the flexible substrate located under each of the pseudo portions 144 are further disposed. 130 is removed from each sub-substrate 110'. Referring to Fig. 1H, finally, each functional portion 142 and the flexible substrate 130 located under each functional portion 142 are removed from the respective sub-substrates 11 to complete the process of the flexible electronic component of the present embodiment. [Flexible electronic component] Fig. 3 is a schematic cross-sectional view showing a flexible electronic component according to an embodiment of the present invention. Referring to FIG. 3, the flexible electronic component 1 of the present embodiment includes a 1337613 twf.doc/n 201242457 δ1 flexible substrate 130 and an electronic component ΐ4〇. The electronic component 14A is disposed on the flexible substrate 130, wherein the electronic component 14A has a tapered sidewall 140a. In the present embodiment, the "inclined side wall 14"a means a side wall which is not parallel to the normal direction n of the flexible substrate 13A. In particular, the side wall 14A of the flexible electronic component 1 of the present embodiment includes a plurality of sub-side walls 14A having different degrees of inclination. The tilting privacy of each sub-side wall i4〇a can be adjusted depending on the demand on the process or the appearance of the flexible electronic component 8(8). In addition, the electronic component 14G of the flexible electronic component 1 of the present embodiment has a surface 140b joined to the flexible button 13G and a top surface 14〇c opposite to the bottom surface 140b, and the top surface M〇c The area is smaller than the area of the bottom surface 140b. In summary, in the manufacturing method of the flexible electronic component of the present invention, the dicing street can be formed by non-contact cutting, so that the electronic component on the flexible substrate is less likely to be peeled off in the subsequent process (peeling). ), layering (de-laminati〇n) or warping (such as Su Qingqi. In addition, contact cutting can be used to break the weak interface layer between the hard substrate and the flexible substrate to make the substrate and The electronic component on the flexible substrate can be easily removed from the rigid substrate, thereby improving the manufacturing yield of the present invention. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. 'Anyone having ordinary knowledge in the art, without departing from the spirit and scope of the present invention, can make some changes and run the part, so the scope of the invention is defined by the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1H are schematic cross-sectional views showing a manufacturing process of a flexible electronic component according to an embodiment of the present invention. FIGS. 2A to 2F are views showing a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a schematic cross-sectional view showing a flexible electronic component according to an embodiment of the present invention. [Description of Main Components] 100: Flexible Electronic Component 110: Hard Substrate 110 ': Sub-substrate 110'a: partial region 120 of the sub-substrate: weak-force interface layer 130: flexible substrate 140: electronic components 140a, 140a': sidewalls 140b, 140c: surface 142: functional portions 142a, 142b: edge 144 : 拟 Η, HI, H2: cutting road 15