201236954 ， 六、發明說明： t發明所屬之技術領域】 發明領域 本發明係有關於一種搬運托盤，係收納並搬運藉切削 裝置等切割裝置分割之半導體元件者。 t先前技袖5" 3 發明背景 半導體元件製程，係在以格栅狀配列於略圓板形之半 導體晶圓表面之多數區域，形成1C、LSI等元件，且沿著用 以劃分形成有該等元件之各區域之分割預定線裁斷，如此 來製造各個元件。如前述分割之元件被封裝並廣泛用於行 • 動電話和個人電腦等電子機器。 • 普遍期望行動電話和個人電腦等電子機器呈現輕量 化、小型化，而半導體元件之封裝亦已開發出稱為晶片尺 寸封裝(CSP)之小型化封裝技術。CSP技術其中之一，稱為 Quad Flat Non-lead Package(QFN ;四面扁平無引腳封裝）之 封裝技術目前已達實用程度。該名為qfn之封裝技術，係 在形成有對應元件之連接端子之多數連接端子，並形成有 按每元件劃分之格柵狀分割預定線之銅板等金屬板，將多 個元件配設成矩陣狀，並且藉由樹脂造模之樹脂部，自元 件之裏面側將金屬板與元件構造成一體，如此來形成csp 基板(封餘板）H分《彳狀線龍料基城斷以分 割成分別封裝之元件（晶片尺寸封裝）。 前述封裝基板之裁斷，一般藉具有切削刀之切削裝置 201236954 來執行。該切削裝置包含有治具，該治具於對應分割預定 線之區域形成有格栅狀之供切削刀之裁切刃通移之容移 槽，並於藉容移槽劃分之多數區域分別設有吸取孔，並且 封裝基板被吸取固持於定位在固持台上之該治具，且切削 刀旋轉並且固持台沿著封裝基板之分割預定線相對移動， 如此來將封裝基板沿著分割預定線裁斷，分割成個別元 件。之後’已個別地分割之元件被收納在具有多數收納室 之搬運托盤，並搬運到組裝製程線（參照例如專利文獻1)。 習知技術文獻 專利文獻 【專利文獻1】日本專利公開公報2001-239365號 【發明内容3 發明概要 發明欲解決之課題 而設在搬運托盤之多數收納室，係對應元件（晶片尺寸 封裝）之尺寸而分別藉由區隔壁來劃分，因此必須準備對應 元件尺寸之種類之搬運托盤，造成管理繁雜之問題。 又，已個別地分割之元件必須逐一自治具轉移到搬運 拕盤’此轉移步驟耗費時間，在生產性上未必能獲得滿足。 本發明係有鑑於前述事實而作成者，其主要技術課題 在於提供一種搬運托盤，係不囿於元件之尺寸，可有效率 地將元件自治具轉移到搬運托盤者。 用以欲解決課題之手段 為解決前述主要技術課題，依本發明，提供一種搬運 4 201236954 =H納並搬運多數元包含有 具有元件支梏Α 代崖本體，係 數元件之表面衫，且該元件支持部係具有支持多 、，δ亥框部係圍繞該元件支持部之外闲 =:者係安裝於前述托盤一支持部： 發明⑴述彳讀本體之元件域料黏層宜具有透光性。 由於本發明之搬運托盤包含有：托盤本體 =持部㈣部者，域林Α持料以心數; 4框部圍繞該元件支持部之外周而形成；及點層， 、女裝於前述托盤本體之元件支持部之表心具有點力 者:所以本發明之搬運托盤無須設4對應個別元件來劃= 之多數收納室’也無須準備對應個別元件尺寸之種類之刀 盤。因此，可以一種搬運托盤來對應各種元件，管理上: 化卉多。又，由於本發明之搬運托盤具有安裝於元件支^ 部之表面且具有黏力之黏層，所以可使用元件搬運裝置將 藉切削裝置等切割裝置個別分割之多數元件成抵地轉移到 點層上，於是生產性便提升。 圖式簡單說明 第1(a)、（b)圖係作為被加工物之封裝基板之立體 截·面圖。 ’ 第2(a)、（b)圖係顯示第1圖所示用以固持封|美板之 持治具及固持治具固持著封裝基板之狀態之立體圖 固 第3圖係用以將第1圖所示封裝基板分割成個別元件之 201236954 切削裝置之立體圖。 第4 (a )、（ b)圖係藉第3圖所示切削裝置執行之裁斷步驟 之說明圖。 第5圖係顯示執行第4圖所示裁斷步驟之封裝基板分割 成個別元件之狀態之立體圖。 第6圖係依本發明而構成之搬運托盤之立體圖。 第7圖係沿第6圖之A-A線截取之截面圖。 第8(a)〜（c)圖係顯示第5圖所示多數元件轉移到第6圖 及第7圖所示搬運托盤之狀態之說明圖。 第9圖係顯示拾取如第8圖所示轉移到搬運托盤之多數 元件之狀態之說明圖。 C實施方式3 用以實施發明之形態 以下，配合參照附加圖式，更詳細說明依本發明而構 成之搬運托盤之較佳實施態樣。 第1(a)及（b)圖中，顯示作為被加工物之封裝基板之立 體圖及截面圖。第1(a)及(b)圖所示封裝基板1包含有金屬板 11，於金屬板11之表面11a格柵狀地形成有：多數第1分割 預定線111，係沿預定方向延伸者；及第2分割預定線112， 係沿與該第1分割預定線111直交之方向延伸者。於藉第1分 割預定線111與第2分割預定線112劃分之多數區域，分別配 置著元件（晶片尺寸封裝）113，該元件113藉合成樹脂部12 自金屬板111之裏面側造模而成。如此構成之封裝基板1， 沿第1分割預定線111及第2分割預定線112裁斷，分割成個 201236954 別封裝之元件113。 沿多數第1分割預定線丨丨丨及第2分割預定線丨丨2將前述 封裝基板1裁斷時，如第2(a)及(b)圖所示藉固持治具2加以 固持。 固持冶具2如第2(a)圖所示，形成矩形，且表面中央部 大出設有吸取固持前述封裝基板1之吸取固持部2〇。在吸取 固持部20之上面（固持面），於對應形成在封裝基板丨之第i 分割預定線111及第2分割預定線112之區域，格柵狀地形成 供後述切削刀之裁切刀通移之容移槽21及22。又，在吸取 固持部20，於藉第1分割預定線lu及第2分割預定線112劃 分之多數區域’分別形成有吸取孔23，該吸取孔23與未圖 示之吸取機構連通。另，於固持治具2之四角處，設有定位 用之孔24。於如此構成之固持治具2，如第2(b)圖所示在吸 取固持部20之上面（固持面）載置封裝基板i。 接著’配合參照第3圖，說明將前述載置於固持治具2 之封裝基板1沿第1分割預定線111及第2分割預定線112裁 斷之切削裝置。 第3圖所示切削裝置3包含有略長方體狀之裝置殼體 31。該裝置殼體31内配設有用以固持被加工物之吸取台 32 ’該吸取台32配設成可沿切削進給方向之箭頭X所示方向 移動。吸取台32之上面設有吸取凹部321，該吸取凹部321 開設有與未圖示吸取機構連通之吸取口 322。又，吸取台32 之上面之四角處設有豎立之定位銷323，該定位銷323與設 於前述固持治具2之四角處之定位用之孔24嵌合。又，吸取 7 201236954 台32構造成可藉未圖示旋轉機構而旋轉。如此構成之吸取 台32藉未圖示切削進給機構而於沿箭頭X所示切削進給方 向移動。 切削裝置3包含有作為切削機構之轉軸單元33。轉軸單 元33，藉未圖示分度進給機構而沿第3圖箭頭γ所示分度進 給方向移動，並且藉未圖示切入進給機構而沿第3圖箭頭z 所示切入進給方向移動。該轉軸單元33包含有：轉軸殼體 331，係安裝於未圖示移動基台，且可沿分度方向之箭頭γ 所示方向及切入方向之箭頭Z所示方向調整移動者；旋轉軸 332，係於該轉軸殼體331被支持成旋轉自如狀態者；及切 削刀333 ’係安裝在該旋轉軸332之前端部者。 又，切削裝置3包含有攝像機構34，該攝像機構34用以 拍攝被固持於前述吸取台32上之被加工物之表面，且檢測 應藉前述切削刀333切削之區域《該攝像機構34包含具有顯 微鏡之光學系統與攝像元件(CCD;電荷耦合元件），可將所 拍攝影像訊號傳送至未圖示控制機構。 第3圖所示切削裝置3如前述所構成，以下，說明使用 切削裝置3將前述封裝基板丨沿多數第丨分割預定線丨丨〖及第 2分割預定線112裁斷之裁斷作業。 首先，將載置著封裝基板1之固持治具2載置於切削裝 置3之吸取台32上。此時，將設在固持治具2之四角處之多 數疋位用之孔24，與配設在吸取台32之四角處之定位銷323 嵌合，藉此載置封裝基板1，使固持治具2定位於預定位置。 然後，藉由未圖示吸取機構作動，且藉吸取台32之吸取口[Technical Field] The present invention relates to a transport tray that accommodates and transports semiconductor components divided by a cutting device such as a cutting device. BACKGROUND OF THE INVENTION The semiconductor device process is formed in a plurality of regions of a semiconductor wafer surface which is arranged in a grid shape on a substantially circular plate shape, and forms elements such as 1C and LSI, and is formed along the division. The division lines of the respective regions of the elements are cut, so that the respective components are manufactured. The components divided as described above are packaged and widely used in electronic devices such as mobile phones and personal computers. • It is widely expected that electronic devices such as mobile phones and personal computers will be lightweight and miniaturized, and semiconductor component packages have also developed a miniaturized packaging technology called a chip size package (CSP). One of the CSP technologies, called the Quad Flat Non-lead Package (QFN; four-sided flat leadless package), has been put to practical use. The encapsulation technique named qfn is a plurality of connection terminals in which connection terminals of corresponding components are formed, and a metal plate such as a copper plate which is divided into a grid-shaped division line for each element is formed, and a plurality of elements are arranged in a matrix. And the resin part molded by the resin, the metal plate and the element are integrally formed from the inner side of the element, thus forming a csp substrate (sealing plate) H, "The shape of the scorpion line is broken. Packaged components (wafer size package). The cutting of the package substrate is generally performed by a cutting device having a cutting blade 201236954. The cutting device comprises a jig, and the jig has a grid-shaped displacement groove for cutting the cutting edge of the cutting blade in a region corresponding to the dividing line, and is respectively disposed in a plurality of regions divided by the borrowing groove There is a suction hole, and the package substrate is sucked and held by the jig positioned on the holding table, and the cutting blade rotates and the holding table relatively moves along the dividing line of the package substrate, thereby cutting the package substrate along the dividing line , divided into individual components. Then, the components that have been individually divided are stored in a transport tray having a plurality of storage chambers, and are transported to an assembly process line (see, for example, Patent Document 1). 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Since they are divided by the partition walls, it is necessary to prepare a handling tray corresponding to the size of the component, which causes a problem of complicated management. Further, the individually divided components must be transferred to the carrying tray one by one. This transfer step takes time and may not be satisfactory in terms of productivity. The present invention has been made in view of the above-described facts, and a main technical object thereof is to provide a conveyance tray which can efficiently transfer a component autonomous device to a conveyance tray regardless of the size of the component. Means for Solving the Problem In order to solve the above-mentioned main technical problems, according to the present invention, there is provided a carrier 4 201236954=H and transporting a plurality of elements including a surface top having a component support, a coefficient element, and the component The supporting part has a large number of support, and the δ hai frame part is surrounded by the component support part. The system is mounted on the tray-supporting part: (1) The component layer of the reading body is preferably translucent. . Since the transport tray of the present invention comprises: a tray body=holding portion (four), the domain forest holding material is in a heart number; 4 a frame portion is formed around the outer periphery of the component supporting portion; and a dot layer, a women's clothing is on the tray The center of the component support portion of the main body has a point of strength: therefore, the transport tray of the present invention does not need to provide a plurality of storage chambers corresponding to individual components, and it is not necessary to prepare a cutter head corresponding to the size of the individual components. Therefore, it is possible to carry a tray to correspond to various components, and manage: Further, since the transport tray of the present invention has an adhesive layer attached to the surface of the component supporting portion and having adhesive force, the component transporting device can be used to transfer a plurality of components individually divided by the cutting device such as the cutting device to the point layer. On, the productivity will increase. BRIEF DESCRIPTION OF THE DRAWINGS The first (a) and (b) drawings are perspective views of a package substrate as a workpiece. 'Fig. 2(a) and (b) show the three-dimensional diagram of the state in which the holding fixture and the holding fixture are held in the first embodiment to hold the sealing plate. Figure 1 is a perspective view of the 201236954 cutting device with the package substrate divided into individual components. The fourth (a) and (b) drawings are explanatory diagrams of the cutting steps performed by the cutting device shown in Fig. 3. Fig. 5 is a perspective view showing a state in which the package substrate which performs the cutting step shown in Fig. 4 is divided into individual elements. Figure 6 is a perspective view of a transport tray constructed in accordance with the present invention. Fig. 7 is a cross-sectional view taken along line A-A of Fig. 6. Figs. 8(a) to 8(c) are explanatory views showing a state in which a plurality of components shown in Fig. 5 are transferred to the transport trays shown in Figs. 6 and 7. Fig. 9 is an explanatory view showing a state in which a plurality of components transferred to the transport tray are picked up as shown in Fig. 8. C. Embodiment 3 Mode for Carrying Out the Invention Hereinafter, a preferred embodiment of a transport tray constructed in accordance with the present invention will be described in more detail with reference to the accompanying drawings. In the first (a) and (b) drawings, a perspective view and a cross-sectional view of a package substrate as a workpiece are shown. The package substrate 1 shown in FIGS. 1(a) and 1(b) includes a metal plate 11, and a plurality of first division planned lines 111 are formed in a grid shape on the surface 11a of the metal plate 11, and are extended in a predetermined direction; And the second division planned line 112 extends in a direction orthogonal to the first division planned line 111. An element (wafer size package) 113 is disposed in a plurality of regions divided by the first division planned line 111 and the second division planned line 112, and the element 113 is molded from the inner side of the metal plate 111 by the synthetic resin portion 12. . The package substrate 1 thus constructed is cut along the first dividing line 111 and the second dividing line 112, and is divided into elements 113 which are packaged in 201236954. When the package substrate 1 is cut along the plurality of first divided planned lines 第 and the second divided predetermined line 丨丨2, the holding jig 2 is held as shown in Figs. 2(a) and 2(b). As shown in Fig. 2(a), the holding tool 2 has a rectangular shape, and a central portion of the surface is provided with a suction holding portion 2 that sucks and holds the package substrate 1. The upper surface of the suction holding portion 20 (the holding surface) is formed in a grid shape in a region corresponding to the i-th division planned line 111 and the second divided planned line 112 of the package substrate 格栅, and the cutting blade for the cutter to be described later is formed in a grid shape. Move the slots 21 and 22. Further, in the suction holding portion 20, a suction hole 23 is formed in each of the plurality of regions 'divided by the first division planned line lu and the second division planned line 112, and the suction hole 23 communicates with a suction mechanism (not shown). Further, at the four corners of the holding jig 2, a hole 24 for positioning is provided. In the holding jig 2 configured as described above, the package substrate i is placed on the upper surface (holding surface) of the suction holding portion 20 as shown in Fig. 2(b). Next, with reference to Fig. 3, a cutting device in which the package substrate 1 placed on the holding jig 2 is cut along the first dividing line 111 and the second dividing line 112 will be described. The cutting device 3 shown in Fig. 3 includes a device housing 31 having a substantially rectangular parallelepiped shape. A suction table 32' for holding a workpiece is disposed in the apparatus casing 31. The suction table 32 is disposed to be movable in a direction indicated by an arrow X in the cutting feed direction. A suction recess 321 is provided on the upper surface of the suction table 32, and the suction recess 321 is provided with a suction port 322 that communicates with a suction mechanism (not shown). Further, erected positioning pins 323 are provided at the four corners of the upper surface of the suction table 32, and the positioning pins 323 are fitted into the holes 24 for positioning provided at the four corners of the holding jig 2. Further, the suction 7 201236954 stage 32 is configured to be rotatable by a rotation mechanism not shown. The suction stage 32 thus constructed is moved in the cutting feed direction as indicated by an arrow X by a cutting feed mechanism (not shown). The cutting device 3 includes a shaft unit 33 as a cutting mechanism. The spindle unit 33 moves in the indexing feed direction indicated by the arrow γ in FIG. 3 by means of the indexing feed mechanism (not shown), and cuts in the feed as indicated by the arrow z in FIG. 3 by the cutting feed mechanism not shown. Move in direction. The spindle unit 33 includes a spindle housing 331 that is attached to a moving base (not shown) and that can be adjusted in a direction indicated by an arrow γ in the indexing direction and a direction indicated by an arrow Z in the cutting direction; the rotary shaft 332 The rotation shaft housing 331 is supported in a rotatable state; and the cutter 333' is attached to the front end of the rotation shaft 332. Further, the cutting device 3 includes an imaging mechanism 34 for capturing the surface of the workpiece to be held by the suction table 32, and detecting an area to be cut by the cutting blade 333. The imaging mechanism 34 includes The optical system with the microscope and the imaging element (CCD; charge coupled device) can transmit the captured image signal to a control mechanism not shown. The cutting device 3 shown in Fig. 3 is constructed as described above, and a cutting operation for cutting the package substrate 丨 along the plurality of second dividing line 丨丨 and the second dividing line 112 by the cutting device 3 will be described below. First, the holding jig 2 on which the package substrate 1 is placed is placed on the suction table 32 of the cutting device 3. At this time, a plurality of holes 24 provided at the four corners of the holding jig 2 are fitted to the positioning pins 323 disposed at the four corners of the suction table 32, whereby the package substrate 1 is placed to secure the treatment. The tool 2 is positioned at a predetermined position. Then, by the suction mechanism not shown, the suction port of the suction table 32 is taken.
201236954 322、吸取凹部32卜設在固持治具2之多數吸取孔23，負壓 作用在載置於固持治具2之吸取固持部2〇之封裝基板丨之各 元件113 ’遂而封裝基板丨之各元件113被吸附固持於固持治 具2之吸取固持部20上（封裝基板固持步驟）。 當執行了前述封裝基板固持步驟，便使未圖示切削進 給機構作動，令固持封裝基板丨之固持治具2移動直至攝像 機構34正下方。當固持治具2定位於攝像機構34之正下方 時，藉攝像機構34及未圖示控制機構執行校準作業，即檢 測應封裝基板1之應切削加工之加工區域。換言之，攝像機 構34及未圖示控制機構執行圖樣匹配等影像處理且完成應 切削加工之加工區域之校準，該圖樣匹配等影像處理用以 進行沿封裝基板1之預定方向形成之第丨分割預定線丨丨丨，與 沿第1分割預定線111切削之切削刀333之間之對位。又，對 於形成在封裝基板1且沿與前述預定方向直交之方向延伸 之第2分割預定線112，也執行相同之應切削加工之加工區 域之校準。 如前所述’當執行了檢測封裝基板i之應切削加工之加 工區域之校準作業，便移動固持治具2至切削區域，如第4(a) 圖所示使預定第1分割預定線111之一端定位於較切削刀 333之正下方之第4(a)圖中稍微右側處。然後，切削刀333 沿箭頭333a所示方向旋轉，並且使未圖示切入進給機構作 動以令切削刀333沿箭頭Z1所示方向切入進給預定量，定位 於預定之切入深度。該切入深度設定在切削刀333之裁切刀 之外周緣到達容移槽21(參照第2(a)圖）之位置，該容移槽21 9 201236954 形成在_治具2之吸取g]持部2Q。接下來，未圖示之切削 進給機構作動’使吸取台32以預定㈣進給速度沿第4⑷ 圖中箭頭X1所示方向移動。然後，當藉由固持治具2被固持 =吸取台32之封裝基板i之預定第丨分割取線⑴之另 端，如第4(b)圖所示到達較切削刀333之正下方略為左側 時’便停止吸取台32之移動’並且切削刀333沿箭頭Z2所示 方向上升，接著於應切削之第丨分割預定線iu分度進給並 反覆切削《。於是’《基板丨沿第丨分割預定線ιη被裁 斷（第1裁斷步驟）。 當執行了前述第1裁斷作業，便9〇度旋動吸取台32，使 形成在藉由固持治具2被固持於吸取台32之封裝基板丨之第 2分割預定線112定位於切削進給方向之箭頭續示方向，然 後，與前述第1裁斷步驟同樣地沿所有第2分割預定線112， 對封裝基板1執行裁斷步驟（第2裁斷步驟卜 如上所述，執行了第丨裁斷步驟及第2裁斷步驟之封裝 基板卜如第5圖所示沿…分割預定線⑴及第2分割預定線 ⑴被裁斷，分割成個別元件（晶片尺寸封裝）ιΐ3。如此分割 之個別元件113，維持被吸取固持於固持治具2之吸取固持 部20之狀態。 如前述分割之元件113收納於後述之搬運托盤並轉移 到下一步驟之組裝步驟區。在此，配合參照第6圖及第7圖， 說明依本發明構成之搬運托盤。 第6圖及第7圖所示搬運托盤5包含有矩形之把盤本體 51 ;及黏層52 ’係安裝於該托盤本體51之表面者。托盤本201236954 322, the suction recess 32 is provided in a plurality of suction holes 23 of the holding jig 2, and the negative pressure acts on each of the components 113' of the package substrate placed on the suction holding portion 2 of the holding jig 2 to package the substrate. Each of the elements 113 is adsorbed and held on the suction holding portion 20 of the holding jig 2 (package substrate holding step). When the package substrate holding step is performed, the cutting feed mechanism (not shown) is actuated to move the holding jig 2 holding the package substrate 直至 directly below the image pickup unit 34. When the holding jig 2 is positioned directly below the imaging mechanism 34, the calibration operation is performed by the imaging mechanism 34 and the control mechanism not shown, i.e., the processing area of the package substrate 1 to be subjected to the cutting process is detected. In other words, the imaging unit 34 and the control unit (not shown) perform image processing such as pattern matching and complete calibration of the processing area to be cut, and image processing such as pattern matching is performed for the second division of the predetermined direction along the package substrate 1. The alignment between the turns and the cutting blade 333 cut along the first dividing line 111 is performed. Further, for the second division planned line 112 formed on the package substrate 1 and extending in the direction orthogonal to the predetermined direction, the same processing area of the machining area to be cut is also performed. As described above, when the calibration operation for detecting the processing area of the package substrate i to be subjected to the cutting process is performed, the holding jig 2 is moved to the cutting area, and the predetermined first dividing line 111 is made as shown in Fig. 4(a). One end is positioned slightly to the right in the 4th (a) view directly below the cutting blade 333. Then, the cutting blade 333 is rotated in the direction indicated by the arrow 333a, and the cutting-in feeding mechanism (not shown) is actuated to cut the cutting blade 333 by a predetermined amount in the direction indicated by the arrow Z1 to be positioned at a predetermined cutting depth. The plunging depth is set at a position beyond the periphery of the cutting blade of the cutting blade 333 to reach the accommodating groove 21 (refer to FIG. 2(a)), and the accommodating groove 21 9 201236954 is formed in the suction of the _ jig 2 Department 2Q. Next, the cutting feed mechanism (not shown) is actuated to move the suction table 32 in the direction indicated by the arrow X1 in the fourth (4) drawing at a predetermined (four) feed speed. Then, when the other end of the predetermined second dividing line (1) of the package substrate i held by the holding table 2 is held by the holding jig 2, as shown in FIG. 4(b), it is slightly below the cutting blade 333. At the time of 'stopping the movement of the suction table 32' and the cutting blade 333 is raised in the direction indicated by the arrow Z2, and then the cutting is performed by dividing the predetermined line iu to be cut and cutting. Then, "the substrate 丨 is cut along the second dividing line ιη (first cutting step). When the first cutting operation is performed, the suction table 32 is rotated by 9 degrees, and the second dividing line 112 formed on the package substrate 固 held by the holding table 32 by the holding jig 2 is positioned at the cutting feed. The direction arrow continues the direction, and then the cutting step is performed on the package substrate 1 along all the second division planned lines 112 as in the first cutting step (the second cutting step is performed as described above, and the third cutting step is performed The package substrate of the second cutting step is cut along the dividing line (1) and the second dividing line (1) as shown in Fig. 5, and is divided into individual elements (wafer size packages) ΐ3. The individual elements 113 thus divided are maintained. The member to be held by the suction holding portion 20 of the holding jig 2 is sucked. The divided element 113 is stored in a transfer tray to be described later, and is transferred to the assembly step area of the next step. Here, reference is made to Figs. 6 and 7. A transport tray constructed in accordance with the present invention is illustrated. The transport tray 5 shown in Figures 6 and 7 includes a rectangular disk body 51; and the adhesive layer 52' is attached to the surface of the tray body 51.
S 10 201236954 係由具有透光性之合成樹脂（例如丙烯酸酯樹脂）所形 成’包含有：元件支持部5U，係具有支持前述多數元件（晶 片尺寸封裝）113之表面5lla者；及框部512，係目繞該元件 支持。1^11之外周而形成者。元件支持部sii具有形成於托 皿本體51之上面之矩形凹部，且該矩形凹部之底面發揮作 為支持多數兀件113之表面5Ua之魏。該元件支持部511 之底面’於短向兩側分別設有與未圖示搬運裝置之支持構 件卡合之兩個卡合凹部5Ub、5ub(第6圖中僅顯示一側之 卡合凹部511b、511b)。如此形成之元件支持部5ΐι之表面 仙安裂有㈣52。_52由具有黏力之片材構成。具有 黏力之片材，可使用新塔克化成公司了肛K咖i c〇， Ltd)製造販賣之商品名為「赛博勒斯咖㈣娜)」或「漢德 可塔克(Handyecotac)」之商品。如前述構成之搬運托盤5， 其托盤本體51之元件切部511絲層a宜具有透光性。 接下來，配合參照第8®，說明將如第5圖所示個別分 割之多數元件（晶片尺寸縣）113，自固持治具2之吸取固持 部20上收納到搬運托盤5之方法。 將多數元件113自固持治具2之吸取固持部2〇上收納到 搬運托盤5時，在圖示實施態樣中，使用元件搬運裝置6來 執行。το件搬運裝置6包含有：吸取固持多數元件之吸取固 持塾61 ’及於-端部支持該吸取固持倾之搬運㈣，該 搬運臂62藉由未圖示作動機構而作動。吸取固持塾&包含 有：墊本體61卜係於下面具有與形成前述多數元件⑴之 封裝基板1同樣尺寸之矩形之凹部611時；及吸著#612， 11 201236954 係與該墊本體611之凹部611a嵌合者。墊本體611於令央部 設有與前述凹部611a連通之吸取口 611b。該吸取口 611b與 未圖示吸取機構連通。前述吸著墊612形成為矩形，並與設 在前述固持治具2之吸取固持部20之吸取孔23同樣地，在對 應多數元件113之位置設有多述吸取孔612a。因此，當未圖 示吸取機構作動時，藉由吸取口611b及凹部611a，負壓作 用於多數吸取孔612a。 當使用前述元件搬運裝置6，將多數元件113自固持治 具2之吸取固持部20收納於搬運托盤5時，如第8(a)圖所示， 未圖示作動機構作動，使吸取固持墊61之吸著墊612之下 面，定位於載置在固持治具2之吸取固持部20上之多數元件 113之上面。然後，解除與吸取台32側連通之吸取機構之吸 取，並使與吸取固持墊61之吸取口 611b連通之未圖示吸取 機構作動，俾藉由吸取口 611b及凹部611a，負壓作用於設 在吸著墊612之多數吸取孔612a。於是，多數元件113被吸 取固持於設在吸著墊612之多數吸取孔612a。當如前述多數 元件113被吸取固持於設在吸著墊612之多數吸取孔612a 時，使未圖示作動機構作動而如第8(b)圖所示將吸取固持墊 61搬運到搬運托盤5上，且將被吸取固持於吸著墊612之下 面（吸著面）之多數元件113之下面，載置於安裝在托盤本體 51之元件支持部511之表面511a之黏層52上。然後，解除未 圖示吸取機構之吸取，並且使未圖示作動機構作動而令吸 取固持墊61自搬運托盤5上退開，藉此如第8(c)圖所示，多 數元件113被轉移到安裝在搬運托盤5之元件支持部511之S 10 201236954 is formed of a translucent synthetic resin (for example, an acrylate resin), and includes: an element supporting portion 5U having a surface 511a supporting the plurality of elements (wafer size package) 113; and a frame portion 512 The system is supported around this component. 1^11 is formed outside the week. The element supporting portion sii has a rectangular recess formed on the upper surface of the tray body 51, and the bottom surface of the rectangular recess serves as a surface supporting the surface 5Ua of the plurality of elements 113. The bottom surface of the element support portion 511 is provided with two engagement recesses 5Ub and 5ub that are engaged with the support members of the transport device (not shown) on the short sides (only the one side engagement recess 511b is shown in Fig. 6). 511b). The surface of the component supporting portion 5ΐ thus formed has a surface of (4) 52. _52 is composed of a sheet having adhesion. For the sticky sheet, you can use the new Tucker Chemical Company's anal K ic〇, Ltd. to sell and sell the product name "Syboleca (4) Na) or "Handyecotac". Goods. In the conveyance tray 5 configured as described above, the element layer 511 of the tray body 51 preferably has a light-transmitting property. Next, a method of accommodating a plurality of components (wafer size county) 113 which are individually divided as shown in Fig. 5 from the suction holding portion 20 of the holding jig 2 to the transport tray 5 will be described with reference to Fig. 8®. When the plurality of elements 113 are housed in the transport tray 5 from the suction holding portion 2 of the holding jig 2, they are executed by the component transport device 6 in the illustrated embodiment. The το conveying device 6 includes a suction holding 塾 61 ′ for sucking and holding a plurality of elements, and a conveyance (four) for supporting the suction holding at the end portion, and the conveying arm 62 is actuated by an actuation mechanism not shown. The suction holding 塾 & includes: the pad body 61 is attached to a rectangular recess 611 having the same size as the package substrate 1 forming the plurality of elements (1); and absorbing #612, 11 201236954 and the pad body 611 The recess 611a is fitted. The pad body 611 is provided with a suction port 611b communicating with the recess 611a at the central portion. The suction port 611b communicates with a suction mechanism (not shown). The suction pad 612 is formed in a rectangular shape, and similarly to the suction hole 23 provided in the suction holding portion 20 of the holding jig 2, a plurality of suction holes 612a are provided at positions corresponding to the plurality of elements 113. Therefore, when the suction mechanism is not illustrated, the negative pressure is applied to the plurality of suction holes 612a by the suction port 611b and the concave portion 611a. When the component transporting device 6 is used, when the plurality of components 113 are housed in the transport tray 5 from the suction holding portion 20 of the retaining jig 2, as shown in Fig. 8(a), the actuating mechanism is not shown to actuate the suction retaining pad. The underside of the absorbing pad 612 of 61 is positioned above the plurality of elements 113 placed on the suction holding portion 20 of the holding jig 2. Then, the suction mechanism that communicates with the side of the suction table 32 is released, and the suction mechanism (not shown) that communicates with the suction port 611b of the suction holding pad 61 is actuated, and the negative pressure acts on the suction port 611b and the concave portion 611a. A plurality of suction holes 612a are in the suction pad 612. Thus, the plurality of elements 113 are sucked and held by the plurality of suction holes 612a provided in the absorbing pad 612. When the plurality of elements 113 are sucked and held by the plurality of suction holes 612a provided in the absorbing pad 612, the urging mechanism (not shown) is actuated to transport the suction holding pad 61 to the carrying tray 5 as shown in FIG. 8(b). The upper portion 113 of the element supporting portion 511 of the tray body 51 is mounted on the adhesive layer 52 of the surface of the component supporting portion 511 of the tray body 51. Then, the suction of the suction mechanism (not shown) is released, and the suction mechanism (not shown) is actuated to retract the suction holding mat 61 from the transport tray 5, whereby the plurality of elements 113 are transferred as shown in Fig. 8(c). To the component support portion 511 mounted on the transport tray 5
S 12 201236954 表面511a之黏層52上。另，轉移到搬運托盤5之黏層52上之 多數元件113，藉由黏層52之黏力而被妥善固持並無脫落之 情形。 如以上所述，本發明之搬運托盤5，由於在元件支持部 511之表面511a安裝有具有黏力之黏層52，所以無須設置對 應個別元件113而劃分之多數收納室，也無須準備對應個別 元件113尺寸之種類之托盤。因此，利用一種搬運托盤5便 可對應各種元件113，管理上簡化許多。又，由於本發明之 搬運托盤5在元件支持部511之表面5Ua安裝有具有黏力之 黏層52，所以可如前述藉搬運裝置6將多數元件113成批地 自固持治具2之吸取固持部2〇轉移’如此遂能提升生產性。 如上進行後’收納在搬運托盤5之多數元件113搬運到 組裝步驟區《組裝步驟時，如第9圖所示，每一元件113藉 拾取裝置之拾取筒夾7拾取，此時由於構成搬運托盤5之托 盤本體51之元件支持部511及黏層52具有透光性，所以藉光 源8自搬運托盤5之下側照射，可確實辨識個別元件113。 ^由於個別元件113如上所述係沿第1分割預定線ill及第 2分割預定線112裁斷之裁斷槽來分割，所以自搬運托盤5之 下侧照射光，透過分割為個別元件113之裁斷槽，光可通 過，因此可確實辨識被該通過之光包圍之元件113。 t圖式簡單:t%*明;3 第1(a)、（b)圖係作為被加工物之封裝基板之立體圖及 截面圖。 第2(a)、（b)圖係顯示第1圖所示用以固持封裝基板之固 13 201236954 持治具及固持治具固持著封裝基板之狀態之立體圖。 第3圖係用以將第1圖所示封裝基板分割成個別元件之 切削裝置之立體圖。 第4(a)、（b)圖係藉第3圖所示切削裝置執行之裁斷步驟 之說明圖。 第5圖係顯示執行第4圖所示裁斷步驟之封裝基板分割 成個別元件之狀態之立體圖。 第6圖係依本發明而構成之搬運托盤之立體圖。 第7圖係沿第6圖之A-A線截取之截面圖。 第8(a)〜(c)圖係顯示第5圖所示多數元件轉移到第6圖 及第7圖所示搬運托盤之狀態之說明圖。 第9圖係顯示拾取如第8圖所示轉移到搬運托盤之多數 元件之狀態之說明圖。 【主要元件符號說明】 1...封裝基板 21,22...容移槽 2...固持治具 23...吸取孔 3...切削裝置 24...定位用之孔 5...搬運托盤 31...裝置殼體 6...元件搬運裝置 32...吸取台 7...拾取筒夾 33…轉轴單元 8...光源 34...攝像機構 11...金屬板 51...托盤本體 12...合成樹脂部 52...黏層 20...吸取固持部 61...吸取固持墊 14 201236954 62...搬運臂 333a...箭頭 111...第1分割預定線 511...元件支持部 112...第2分割預定線 511a...表面 113...元件 511b...卡合凹部 321...吸取凹部 512...框部 322...吸取口 611...墊本體 323...定位銷 611a...凹部 331...轉軸殼體 61 lb...吸取口 332...旋轉軸 612...吸著墊 333...切削刀 612a...吸取孔 15S 12 201236954 The adhesive layer 52 of the surface 511a. Further, the majority of the elements 113 transferred to the adhesive layer 52 of the carrying tray 5 are properly held by the adhesive force of the adhesive layer 52 without falling off. As described above, in the transport tray 5 of the present invention, since the adhesive layer 52 having the adhesive force is attached to the surface 511a of the component supporting portion 511, it is not necessary to provide a plurality of storage chambers corresponding to the individual elements 113, and it is not necessary to prepare individual ones. A tray of the type of component 113. Therefore, a variety of components 113 can be used with one type of transport tray 5, which is much simplified in management. Further, since the conveyance tray 5 of the present invention has the adhesive layer 52 having the adhesive force attached to the surface 5Ua of the component supporting portion 511, the plurality of components 113 can be sucked and held by the holding fixture 2 in batches as described above. Department 2 transfer 'so that can improve productivity. After the above, the plurality of components 113 accommodated in the transport tray 5 are transported to the assembly step area. In the assembly step, as shown in Fig. 9, each of the components 113 is picked up by the pick-up collet 7 of the pick-up device. Since the component supporting portion 511 and the adhesive layer 52 of the tray main body 51 of the fifth embodiment are translucent, the light source 8 is irradiated from the lower side of the transport tray 5, and the individual elements 113 can be surely recognized. Since the individual elements 113 are divided by the cutting grooves cut along the first dividing line ill and the second dividing line 112 as described above, the light is irradiated from the lower side of the conveying tray 5, and is cut into the cutting grooves of the individual elements 113. The light passes through, so that the element 113 surrounded by the passing light can be surely identified. t is simple: t%* 明; 3 1(a) and (b) are a perspective view and a cross-sectional view of a package substrate as a workpiece. Fig. 2(a) and Fig. 2(b) are perspective views showing the state in which the package substrate is held by the holding fixture and the holding fixture shown in Fig. 1 . Fig. 3 is a perspective view of a cutting apparatus for dividing a package substrate shown in Fig. 1 into individual elements. Fig. 4(a) and (b) are explanatory views of the cutting step performed by the cutting device shown in Fig. 3. Fig. 5 is a perspective view showing a state in which the package substrate which performs the cutting step shown in Fig. 4 is divided into individual elements. Figure 6 is a perspective view of a transport tray constructed in accordance with the present invention. Fig. 7 is a cross-sectional view taken along line A-A of Fig. 6. Figs. 8(a) to 8(c) are explanatory views showing a state in which a plurality of components shown in Fig. 5 are transferred to the transport trays shown in Figs. 6 and 7. Fig. 9 is an explanatory view showing a state in which a plurality of components transferred to the transport tray are picked up as shown in Fig. 8. [Main component symbol description] 1... package substrate 21, 22... accommodating groove 2... holding jig 23... suction hole 3... cutting device 24... hole for positioning 5. .. handling tray 31...device housing 6...component handling device 32...sucking station 7...picking collet 33...spindle unit 8...light source 34...camera mechanism 11.. Metal plate 51... Pallet body 12... Synthetic resin portion 52... Adhesive layer 20... Suction holding portion 61... Suction holding pad 14 201236954 62... Transport arm 333a... Arrow 111 ...the first division planned line 511...the element support portion 112...the second division planned line 511a...the surface 113...the element 511b...the engagement recess 321...the suction recess 512.. Frame portion 322 ... suction port 611 ... pad body 323 ... positioning pin 611a ... recess portion 331 ... shaft housing 61 lb ... suction port 332 ... rotating shaft 612 ... Suction pad 333...cutting blade 612a...sucking hole 15