TW201232632A - Touch panel, method for manufacturing touch panel and conductive film - Google Patents

Touch panel, method for manufacturing touch panel and conductive film Download PDF

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Publication number
TW201232632A
TW201232632A TW100141145A TW100141145A TW201232632A TW 201232632 A TW201232632 A TW 201232632A TW 100141145 A TW100141145 A TW 100141145A TW 100141145 A TW100141145 A TW 100141145A TW 201232632 A TW201232632 A TW 201232632A
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Taiwan
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conductive
conductive film
area
layer
touch panel
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TW100141145A
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Chinese (zh)
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TWI567802B (en
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Kiyofumi Imamura
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Fujifilm Corp
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Priority claimed from JP2010258803A external-priority patent/JP2012108845A/en
Priority claimed from JP2010258802A external-priority patent/JP5581183B2/en
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Publication of TW201232632A publication Critical patent/TW201232632A/en
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Publication of TWI567802B publication Critical patent/TWI567802B/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Insulated Conductors (AREA)
  • Position Input By Displaying (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

A conductive film is disposed on a display panel. The conductive film includes a conductive part having a mesh pattern composed of thin metal wires. The mesh pattern has moire prevention portions at intersections thereof. The area Sa of the intersection and the area Sb of the moire prevention portion satisfy the following expression: Sa*0.01 < Sb ≤ Sa*5.00. The conductive film includes a transparent substrate, the conductive part composed of the thin metal wires, and a transparent coating layer. The conductive part is formed on one main surface of the transparent substrate with an adhesive layer being interposed therebetween. The transparent coating layer is coated on the conductive part and the exposed portions of the adhesive layer. The difference in refractive index between the adhesive layer and the transparent coating layer is 0.1 or less.

Description

201232632 六、發明說明： 【發明所屬之技術領域】 本發明是有關於包括如下的導電膜的觸控面板（touch panel)、使用有可見光透射率或視認性等的光學特性良好 的導電膜的觸控面板的製造方法以及導電膜，上述導電膜 可抑制波紋（moire )的產生。 【先前技術】 近來，觸控面板已受到關注。 對於此種觸控面板，已開發了如下的例子，即，為了 使排列為矩陣狀的電極不顯眼，利用氧化銦錫（Indium Tin201232632 VI. [Technical Field] The present invention relates to a touch panel including a conductive film, and a conductive film having good optical characteristics such as visible light transmittance or visibility. In the method of manufacturing the control panel and the conductive film, the conductive film can suppress the generation of moiré. [Prior Art] Recently, touch panels have received attention. For such a touch panel, an example has been developed in which indium tin oxide (Indium Tin) is used in order to make the electrodes arranged in a matrix inconspicuous.

Oxide ’ ITO )來構成電極（例如參照曰本專利特開 2010-86684 號公報）。 觸控面板主要應用於個人數位助理（Pers〇nal Digital Assistant ’ PDA)(行動資訊終端）或行動電話等的小尺寸 裝置仁般。心為由於應用於個人電腦（personai compUter ) 用顯示器（display)等，上述觸控面板的尺寸會變大。 對^於如上所述的將來的動向’先前的電極由於使用 ITO (氧化銦錫），因此，存在如下的問題，即，電阻大， 且Ik著應用尺寸變大，電極之_電流的傳導速度會變 且響應速度（自與指尖發线觸錄_該接觸位置 為止的時間）會變慢。 因此’考慮排列多個由金屬製的細線（金屬細線）構 '的格子來構成電極，藉此，使表面電阻下降。作為將金 、礼線用作電極的觸控面板’例如美國專利第5⑴⑽號 4 201232632, 說明書、國際專利公開第95/27334號小冊子、美國專利公 開申請案第2004/0239650號說明書、以及美國專利第 7202859號說明書已為人所知。 又，作為先前的觸控面板用的導電膜，已揭示有曰本 專利特開2010-108878號公報以及曰本專利特開 2010-108877號公報。於這些公報中記載了如下的例子， 該例子是於支持體12上包括導電層μ的導電膜1〇，上述 導電層14是對銀鹽乳劑層16進行曝光顯影而形成且含有 銀，將導電層14形成為間距（pitch)為6〇〇μπια上的網 眼圖案（mesh pattern )。根據上述曰本專利特開 2010-108878就公報以及日本專利特開2議·1()8877號公 報的導電膜’具有較佳地作為觸控面板用導電膜的導電 性，波紋充分地減少，且觸控面板特性優異。 【發明内容】 ' 然而，當將金屬細線用作電極時，由於利用不透 材料^作金屬細線，因此，透明性或視認性成為問題。 用於觸控面板時’需要使對觸控位置進行檢測的 月包力提局。 、 本發明是考慮如上所述的問題而成的發明， :在位置進行檢測的能力已提高_控 製二電膜的觸控面板、如下的觸控面板的 顯示面柄，，膜，上述導電膜即便絲於顯示袈置的 方法即便當利用金屬細線圖案來構成電極時， 5 201232632 透明性。 U]本發明之第1觀點提出的觸控面板是包括對觸控 位置進仃檢測的導電膜的觸控面板，該觸控面板的特徵在 上述導電膜包括導電部，該導電部具有由金屬製的細 繊ί成的糧醜，於上述峨随的蚊部，形成有使 將_^^的檢測能力提高_控位置檢測能力提高部，當 高部的免為广，將上述觸控位置檢測能力提 又為 Sb 時’ Sax〇 01&lt;Sb$Sax5 〇〇 〇 的面積設第1觀點巾，較佳為#將上述交叉部 為％時，二％=== 檢測能力提高部的面積設 的面較料當壯述交又部 Λ Sh眭c 控位置檢測能力提高部的面積設 為 sb 時，Sax〇.5(^Sb^Saxi 5〇。 又 的面m發明之第1觀點巾，難為#將上述交又部 為Sb:.; Y將上述觸控位置檢測能力提高部的面積設 為 Sb 時 ’Sax〇.9〇SSb$Saxl l〇。 力難硫技括設置於 ^ · U 'f'm ^ 、 王面板，該觸控面板的特徵在 線形成_眼圖二括導電部具有由金屬製的細 止部的面積設為Sb時，二Sa’將咖^ 丁加 u.〇l&lt;SbSSax5.00 〇 [6]於本發明之第2觀點中，較佳為當將上述交又部 6 201232632t 的面積設為Sa，將上述波紋抑止部的面積設為sb時， Sax0.50SSbSSax5.00。 [7]於本發明之第2觀點中’錄為當將上述交又部 的面積設為Sa，將上述波紋抑止部的面積設為sb時， Sax0.50SSbSSaxl.50。 m於本發明之第2觀財’較佳騎將上述交又部 的面積設為Sa，將上述波紋抑止部的面積設為sb時， Sax0.90SSbSSaxl.10。 ° 率發明之第…⑽控面板的製造方法是 包含製作導電膜的導電膜製作步驟的觸控面板的製造方 控面板的製造方法的特徵在t上述導電 貼合於透明基體㈤的一個主面 面的粗链面形狀轉印至上述接著層 口 接著層貼合的貼合面已粗糙化；萨由=屬、/白的朝上述 貼合的上述金屬fL部分予以除去，=來將已 導電圖案包含線寬為9 μιη以下且严声二成導電圖案’該 金屬箔；以及將透明包覆層包覆心以下的上述 上述接著層的部分’上述透明包覆與露出有 率之差為G.1以下。 上4接者層的折射 [1=於本發明之第3觀點卜彻上 ▲t 丁包覆的步驟，亦可是_上述翻包覆層來 Γ至上述接著層的嫩的貼合面“ 彳丁 201232632 [11]於本發明之第3觀點中，上述金屬绪亦可為。 婆a^12]本發私帛4觀點提&amp;的導1歧設置於顯禾與 i 導電膜的特徵在於包括導電 =眼=的交又部，形成有波轉止部，當將上述= ;、，。又為Sa，將上述波紋抑止部的面積設Oxide ’ ITO ) constitutes an electrode (for example, see Japanese Patent Laid-Open Publication No. 2010-86684). The touch panel is mainly applied to a small-sized device such as a personal digital assistant (PDA) (mobile information terminal) or a mobile phone. The size of the touch panel is increased due to the use of a display or the like for a personal computer (personai compUter). For the future movement as described above, the previous electrode uses ITO (indium tin oxide), and therefore, there is a problem that the electric resistance is large, and the application size becomes large, and the conduction speed of the current of the electrode It will change and the response speed (the time from the contact with the fingertips _ the contact position) will be slower. Therefore, it is considered that the electrodes are arranged by arranging a plurality of lattices made of metal thin wires (metal thin wires), whereby the surface resistance is lowered. As a touch panel using gold and a gift wire as an electrode, for example, U.S. Patent No. 5(1)(10) No. 4, 2012,326,32, the specification, International Patent Publication No. 95/27334, U.S. Patent Application Publication No. 2004/0239650, and U.S. Patent The specification No. 7202859 is known. Further, as a conductive film for a conventional touch panel, Japanese Laid-Open Patent Publication No. 2010-108878 and Japanese Patent Laid-Open No. 2010-108877 are hereby incorporated. In these publications, an example is described in which a conductive film 1 including a conductive layer μ is formed on a support 12, and the conductive layer 14 is formed by exposure and development of a silver salt emulsion layer 16 and contains silver to conduct electricity. The layer 14 is formed as a mesh pattern having a pitch of 6 μm. According to the above-mentioned Japanese Patent Laid-Open Publication No. 2010-108878, the conductive film of the Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 8877 has a conductivity which is preferably used as a conductive film for a touch panel, and the corrugation is sufficiently reduced. And the touch panel has excellent characteristics. SUMMARY OF THE INVENTION However, when a metal thin wire is used as an electrode, transparency or visibility is a problem because an impervious material is used as a metal thin wire. When used in a touch panel, it is necessary to make a monthly package for the detection of the touch position. The present invention is an invention in which the above-mentioned problems are considered, and the ability to detect at a position has been improved. The touch panel for controlling the two-electrode film, the display handle of the touch panel as follows, the film, the above-mentioned conductive film Even if the method of displaying the device is performed, even when the electrode is formed by the metal thin line pattern, 5 201232632 transparency. The touch panel of the first aspect of the present invention is a touch panel including a conductive film for detecting a touch position. The touch panel is characterized in that the conductive film includes a conductive portion, and the conductive portion has a metal portion. The fine grain of the system is made up of the above-mentioned mosquitoes, which has the ability to improve the detection ability of the _^^ _ control position detection ability, when the high part is free, the above touch position When the detection capability is Sb, the area of ' Sax〇01&lt;Sb$Sax5 〇〇〇 is set to the first point of view, preferably #, when the intersection is %, the second %=== the area of the detection capability improvement unit When the area of the 位置 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭 眭It is difficult to make the above-mentioned intersection part Sb:.; Y to set the area of the above-mentioned touch position detecting ability improving part to Sb 'Sax〇.9〇SSb$Saxl l〇. The force hard sulfur technology is set to ^ · U 'f'm ^ , the king panel, the characteristics of the touch panel are formed online. The eye diagram includes the surface of the conductive portion having a metal stopper. In the case of Sb, it is preferable that the area of the intersection portion 6 201232632t is Sa in the second viewpoint of the present invention in the second aspect of the present invention. When the area of the above-described corrugation suppressing portion is sb, Sax0.50SSbSSax5.00. [7] In the second aspect of the present invention, 'the area of the intersection is set to Sa, and the corrugation suppressing portion is When the area is sb, Sax0.50SSbSSaxl.50. m is the second aspect of the present invention. Preferably, the area of the intersection is Sa, and when the area of the ripple suppression is sb, Sax0 .90SSbSSaxl.10. The invention of the control panel is characterized in that the manufacturing method of the touch panel including the step of fabricating the conductive film for producing the conductive film is characterized in that the conductive layer is bonded to the transparent substrate. (5) The roughened surface shape of one main surface is transferred to the above-mentioned adhesive layer, and the bonding surface of the adhesive layer is roughened; the sacrificial genus/white is removed to the above-mentioned metal fL portion. = to make the conductive pattern contain a line width of 9 μηη or less and a strict two-conductivity pattern 'this gold And a portion of the above-mentioned adhesive layer in which the transparent coating layer is coated with the above-mentioned adhesive layer is less than G.1 or less. The refractive index of the upper four-layer layer [1 = in the present invention The third point of view is that the step of coating the ▲t can be carried out by the above-mentioned tumbling layer to the tender bonding surface of the above-mentioned adhesive layer. [King 201232632 [11] In the third aspect of the present invention The above metal can also be used. Po A ^ 12] The hair of the private opinion 4 viewpoints and the introduction of the 1 set in the display and the i conductive film is characterized by the inclusion of conductive = eye = intersection, forming a wave Turn-over, when the above =;,,. Also for Sa, the area of the above-mentioned corrugation suppressing portion is set

Sax〇.〇l&lt;SbSSax5.〇〇。 卞 本發明之第4觀點中，較佳為當將上述交又部 hx〇5〇^hSa將上述波紋抑止部的面積設為Sb時， bax〇.5〇SSb$sax5 00。 丁 設為[si於54本發明中較佳為當將上述交叉部的面積 • ，將上述波紋抑止部的面積 $Sax〇.〇l&lt;SbSSax5.〇〇. In the fourth aspect of the invention, it is preferable that bax〇.5〇SSb$sax5 00 when the area of the corrugation suppressing portion is Sb by the intersection portion hx〇5〇^hSa. D is set to [si in 54 invention, preferably when the area of the intersection is to be •, the area of the above-mentioned corrugation suppression portion $

Saxa_SbgSaxl5()。 槓认為 Sb 時， 的面發，第4觀點中’較佳為當將上述交又部 ’、a將上述波紋抑止部的面積設;％ sb fl# Sax〇.9〇SSl^Saxl 1〇。 ，積叹為 Sb 時， 屬f ITi Γ之第4觀財，構成上述網關案的金 :===線亦可交叉，藉此來構成上述交 上纽紋抑止部包括：第】抑止部 的另-個側面之門述广一個側面與上述第2細線 止部，形成;面之間；以及第4抑 上述第1細線的另-個側面與上述第2細線 8 20123263¾ 的另一個侧面之間。 上二於tr之第4觀點中，當將上述第1抑止部、 及以及上述第4抑止部 Sb㈣3 + Sb〇 Sb3、MSb4 時，Sb=祕 1 μπ^8ΐ]5=發明之第4觀點巾’询田線的線寬較佳為 1 μιη[〜9]μ:本I明之第4觀點中，上述細線的線寬較佳為 為65[2二^^第4觀點中’ ±14細，_間隔較佳 =著層而形成於上述透明基二=面:金屬= 二覆’上述接著層與上述透明包覆層的折:二 佳為[9 發明之第5觀財’上—線的線寬較 佳為’上述金屬細線的厚度較 個以上的導中’上述導電部亦可包括2 /、上这第1方向正交的第2方向排列， 201232632 且由上述金屬細線形成。 [25] 於本發明之第5觀點中，上述導電圖案亦可具有 排列有多個由上述金屬細線與開口部形成的網眼形狀的圖 案。 [26] 於本發明之第5觀點中，亦可沿著上述第i方 向，分別經由由上述金屬細線形成的連接部來將2個以上 的大格子予以連接，從而構成上述導電圖案，各上述大格 子为別疋將2個以上的小格子加以組合而構成。 根據本發明的觸控面板，由於包括導電膜，該導電膜 具有觸控位置檢測能力提高部，因此，觸控位置檢測能力 提高部可使電氣感知能力提高，故而可使觸控位置的檢測 能力提高。 ' 又，根據本發明的觸控面板，由於包括可抑制波紋的 產生的導電膜，因此，顯示晝面不會因波紋而模糊不清， 可實現顯示品質的提高、及操作性的提高。 又，根據本發明的導電膜，構成簡單，即便安裝於顯 示裝置的顯示面板上，亦可抑制波紋的產生，因而，可使 觸控面板的顯示品質良好，隨之亦可使操作性提高。 又，根據本發明的觸控面板的製造方法以及導電膜， 即便當於觸控面板中，利用金屬細線圖案來構成電極時， 由於利用特定的透聽覆層進行包覆，因此，可維持 的視認性。通常’導電材料的貼合面的粗_形狀會 至接著層上的導電材料已被除去的部分，因此，粗糖面妒 狀會使光散射，從而損害透明性，但於本發明中，若平= 201232632 '~ Γ 的折射/包Ϊ層’該透明包覆層的折射率接近於接著層 明袖。、’則度反射會被抑制至最小限度，從而表現出透 ^ ’將透明基體設為聚對苯H二賴膜，藉 ^可提供如下的導韻，料魏的義性、财熱性良 而且價廉’處雌優異且具有透明性。利㈣於金屬 θ、化學餘刻製程來形成透明基體上的導電圖案，藉此， 可提供加工性優異且具有透明性的導電膜。 :根據與隨附圖式協作的如下的較佳實施形態的例子的 說明，上述目的及其他目的、特徵以及優點會變得更明確。 【實施方式】 以下，一面參照圖1〜圖21，一面對本發明的導電膜、 包括導電膜的觸控面板以及觸控面板的製造方法的實施形 態的例子進行說明。再者，於本說明書中，表示數值範圍 的「〜」是作為如下的意思而被使用，該意思包含「〜」 刖後所記載的數值作為下限值以及上限值。 首先，第1實施形態的導電膜l〇a也被用作觸控面板 等的電極，如圖1以及圖2所示，該導電膜i〇a包括透明 基體12 (參照圖2)、與形成於透明基體丨2的一個主面的 導電部14。該導電部14包括由金屬製的細線（以下記作 金屬細線16)與開口部18形成的例如網眼圖案20。金屬 細線16例如由金（Au)、銀（Ag)或銅（Cu)構成。 具體而言，導電部14包括如下的網眼圖案20，該網 眼圖案20是由多條第1金屬細線i6a與多條第2金屬細線 16b分別交叉而形成’上述多條第1金屬細線16a沿著第1 11 201232632 方向（圖1中的x方向）延伸，且沿著第2方向（圖i中 的y方向）排列，上述多條第2金屬細線i6b沿著第2方 向延伸，且沿著第1方向排列。如圖1所示，網眼圖案2〇 的一個網眼形狀22的形狀，即，一個開口部18與將該一 個開口部18予以包圍的4條金屬細線16的組合形狀可為 正方形，亦可為菱形。此外亦可設為正六角形等的多角形 狀。又，一條邊的形狀除了可為直線狀之外，可為彎曲形 狀，亦可為圓弧狀。於設為圓弧狀的情形時，例如亦可將 相對向的2條邊設為朝外方凸出的圓弧狀’將其他的相對 向的2條邊設為朝内方凸出的圓弧狀。又’亦可將各邊的 形狀設為由朝外方凸出的圓弧與朝内方凸出的圓弧相連而 成的波線形狀。當然，亦可將各邊的形狀設為正弦曲線。 而且，如圖1以及圖3所示，於上述導電膜10a中， 與構成導電部14的網眼圖案20的交叉部24相鄰接地形成 有波紋抑止部26 (觸控位.置檢測能力提高部），當將交叉 部24的面積設為Sa，將波紋抑止部26的面積設為Sb時， 滿足 Sax〇.〇i&lt;sbSSax5.00。 較佳為Sax0.50SSbSSax5.00，進而較佳為 Sax0.50SSbSSaxl.50，更佳為 Sax〇9〇SSbSSaxl.20， 尤佳為 Sax〇.9〇SSb$Saxl.l〇。 波紋抑止部26包括：第1抑止部26a，形成於第丄金 屬細線16 a的一個側面與第2金屬細線丨6 b的一個側面之 間；第2抑止部26b，形成於第i金屬細線16a的一個側 面與第2金屬細線16b的另一個側面之間；第3抑止部 12 201232632 * ·ι 26c’形成於第1金屬細線16a的另一個側面與第2金屬細 線16b的一個側面之間；以及第4抑止部26d，形成於第1 金屬細線16a的另一個側面與第2金屬細線i6b的另一個 側面之間。 而且，當將第1抑止部26a、第2抑止部26b、第3 抑止部26c、以及第4抑止部26d的各面積設為sbl、Sb2、 Sb3、以及 Sb4 時’滿足 Sb=Sbl + Sb2 + Sb3 + Sb4。 於上述情形時，第1金屬細線16a的線寬La以及第2 金屬細線16b的線寬Lb為1 μιη〜ι5 μιη，較佳為i μπι〜9 第1金屬細線1如以及第2金屬細線脱的線寬可均 2 亦可不同。又第1金屬細線16a的線間隔以及第 線】^細線⑽的線間隔為6〇卿〜鄉μιη。第i金屬細 同。a以及第2金屬細、線i6b的線間隔可均相同，亦可不 案2〇的六於第1實施形態中’與構成導電部14的網眼圖 又部24 24相鄰接地形成波紋抑止部26，而且將交 遷過導電部^與波紋抑止部26的面積予以最佳化。結果， 的部分大I的光的積分量在交又部24與交叉部24以外 產生受到=同’網眼圖案2〇仿佛已消失，藉此，波紋的 〜15咖，將^且由於將金屬細線16的線寬設為1啤 ^ ^ 65 &quot;m^500 μΠ1 * 易顯目民）。 民好的視認性（網眼圖案20 月'者’如圖1以及圖3所 ^ ’構成波紋抑止部26的第 13 201232632 1抑止部26a〜第4抑止部26d的平面形狀亦可為 狀，/旦可為如圖4所示的矩形狀，可為如圖5所於三 角形中形成圓弧狀的缺口而成的形狀，亦可圖二： 的取^的^成的形狀。#然亦可設為非對稱的形狀。 製』[::照圖7Α〜圖U’一面對導電… 第1製造方法是如圖7Α所示，於透明 感光層3〇,而且如圖-所示，對銀鹽感光層3= 光之後，進，影處理’將金屬銀部32與光透射性部 加以組合，藉此來形成導電部14 (網眼圖案2〇等）。於 ^形時，金屬銀部32較佳為包含對減銀進行顯影而形 、顯影銀。然後，如圖7C所示，亦可將鍍敷層等的導 電金屬36承載於金屬銀部μ。 對於銀鹽感光層30的曝光過程中所使用的遮罩 mask)亦可具有如下的遮罩圖案，該遮罩圖案對應於在 、周眼圖案2G的交又部24形成波紋抑止部26而成的圖案。 或者，亦可藉由對於銀鹽感光層30的數位寫入曝光來 室如下的圖案曝光至銀鹽感光層3G，上述圖案是在網眼圖 。2〇的交又部24形成波紋抑止部26而成的圖案。 與旦，於上述情形時，當以圖8所示的曝光能量（energy) ^像濃度分布的特性來看時，於對第1金屬細線16a以 像、'曲2金屬細線161?進行數位寫入曝光的情形下’利用影 交j飽和的區域的第1曝光能量E1來進行曝光，當對 部24進行數位寫入曝光時，利用影像濃度飽和的區域 20123263¾ 的第2曝光能置E2來進行曝光。此時’第1曝光能量Ei &lt;第2曝光能量E2。 光會因曝光能量提高而朝交叉部24的鄰接部分泡 漏，藉此，產生光的渗出區域，然後，於顯影處理中，光 的滲出區域體現為與交又部24相鄰接的波紋抑止部26。 上述方法只要根據位置來選擇性地對曝光能量進行切換即 可，因此，可容易地與交又部24相鄰接地形成波紋抑止部 26，且亦可實現製造成本（c〇st)的低廉化。 作為其他形成方法，亦可如圖9A所示，例如對透明 基體12上所形成的銅箔4〇上的光阻膜Saxa_SbgSaxl5(). When the bar is considered to be Sb, in the fourth aspect, it is preferable to set the area of the above-mentioned corrugation suppressing portion when the above-mentioned intersection is further, and a sb fl# Sax〇.9〇SSl^Saxl 1〇 . When the sigh is Sb, it belongs to the fourth financial position of the ITI ,, and the gold that constitutes the above-mentioned gateway case: the === line can also cross, thereby constituting the above-mentioned hand-in-line stagnation part including: The other side surface is formed between the one side surface and the second thin line stop portion; between the faces; and the fourth side is between the other side of the first thin line and the other side of the second thin line 8 201232633⁄4 . In the fourth aspect of the second aspect, when the first suppression unit and the fourth suppression unit Sb (4) 3 + Sb〇Sb3 and MSb4 are used, Sb=sec 1 μπ^8ΐ]5=the fourth viewpoint of the invention The line width of the 'inquiry line' is preferably 1 μιη [~9] μ: in the fourth aspect of the present invention, the line width of the thin line is preferably 65 [2 2 ^ ^ in the fourth viewpoint of ' ± 14 thin, _ spacing is preferred = layer is formed on the transparent base two = surface: metal = two coating 'the above layer and the above transparent layer of the fold: two good for [9 invention of the fifth wealth] on the line The line width is preferably 'the thickness of the metal thin wire is more than one of the conductive members'. The conductive portion may include a second direction in which the first direction is orthogonal to the first direction, and 201232632 is formed of the thin metal wires. According to a fifth aspect of the invention, the conductive pattern may have a pattern in which a plurality of mesh shapes formed by the thin metal wires and the openings are arranged. According to a fifth aspect of the present invention, in the i-th direction, two or more large lattices may be connected via a connection portion formed of the thin metal wires to form the conductive pattern. The large grid is composed of two or more small squares. According to the touch panel of the present invention, since the conductive film has a touch position detecting capability improving portion, the touch position detecting capability improving portion can improve the electrical sensing capability, thereby enabling the detecting position of the touch position. improve. Further, since the touch panel according to the present invention includes a conductive film capable of suppressing generation of waviness, the display pupil surface is not obscured by the corrugation, and the display quality can be improved and the operability can be improved. Moreover, the conductive film according to the present invention has a simple structure, and even if it is mounted on the display panel of the display device, the generation of waviness can be suppressed, so that the display quality of the touch panel can be improved, and the operability can be improved. Moreover, according to the method for manufacturing a touch panel and the conductive film of the present invention, even when the electrode is formed by a thin metal pattern in the touch panel, it can be maintained by coating with a specific transmissive coating. Visually recognized. Generally, the thickness of the bonding surface of the conductive material is such that the conductive material on the subsequent layer has been removed. Therefore, the coarse sugar surface scatters light, thereby impairing transparency, but in the present invention, = 201232632 '~ 折射 Refractive/envelope layer' The refractive index of the transparent cladding is close to that of the subsequent sleeve. 'The degree of reflection will be suppressed to a minimum, so that the transparent substrate is set to a poly-p-phenylene H-layer film, which can provide the following rhyme, which is good for the righteousness and good fortune. The price is 'excellent' and is transparent. (4) A conductive pattern on a transparent substrate is formed by a metal θ, chemical remnant process, whereby a conductive film having excellent workability and transparency can be provided. The above and other objects, features and advantages will be more apparent from the description of the preferred embodiments illustrated in the accompanying drawings. [Embodiment] Hereinafter, an embodiment of a conductive film, a touch panel including a conductive film, and a method of manufacturing a touch panel according to the present invention will be described with reference to Figs. 1 to 21 . In the present specification, the "~" indicating the numerical range is used as the following meaning, and the meaning includes the numerical values described after "~" as the lower limit and the upper limit. First, the conductive film 10a of the first embodiment is also used as an electrode of a touch panel or the like. As shown in FIGS. 1 and 2, the conductive film i〇a includes a transparent substrate 12 (see FIG. 2) and is formed. The conductive portion 14 on one main surface of the transparent substrate 丨2. The conductive portion 14 includes, for example, a mesh pattern 20 formed of a thin metal wire (hereinafter referred to as a metal thin wire 16) and an opening portion 18. The metal thin wires 16 are made of, for example, gold (Au), silver (Ag), or copper (Cu). Specifically, the conductive portion 14 includes a mesh pattern 20 in which the plurality of first metal thin wires i6a and the plurality of second metal thin wires 16b intersect to form the plurality of first metal thin wires 16a. Extending along the first 11 201232632 direction (x direction in FIG. 1) and along the second direction (y direction in FIG. i), the plurality of second metal thin wires i6b extend along the second direction, and along Arrange in the first direction. As shown in FIG. 1, the shape of one mesh shape 22 of the mesh pattern 2〇, that is, the combined shape of one opening portion 18 and four metal thin wires 16 surrounding the one opening portion 18 may be square or It is a diamond. Further, it may be a polygonal shape such as a regular hexagon. Further, the shape of one side may be a curved shape or an arc shape, in addition to being linear. When it is set to an arc shape, for example, the two sides which are opposed to each other may be an arc shape which is convex toward the outside, and the other two sides which are opposed to each other may be formed in an arc shape which is convex inward. . Further, the shape of each side may be a wave shape formed by an arc which is convex toward the outside and an arc which is convex toward the inside. Of course, the shape of each side can also be set to a sinusoidal curve. Further, as shown in FIG. 1 and FIG. 3, in the conductive film 10a, a corrugation suppressing portion 26 is formed adjacent to the intersection portion 24 of the mesh pattern 20 constituting the conductive portion 14 (touch position. In the case where the area of the intersection portion 24 is Sa and the area of the corrugation suppression portion 26 is Sb, Sax〇.〇i&lt;sbSSax5.00 is satisfied. Preferably, it is Sax0.50SSbSSax5.00, further preferably Sax0.50SSbSSaxl.50, more preferably Sax〇9〇SSbSSaxl.20, and particularly preferably Sax〇.9〇SSb$Saxl.l〇. The corrugation suppressing portion 26 includes a first restraining portion 26a formed between one side surface of the second metal thin wire 16a and one side surface of the second metal thin wire 丨6b, and a second suppressing portion 26b formed on the ith metal thin wire 16a. Between one side surface and the other side surface of the second metal thin wire 16b; the third suppressing portion 12 201232632 * · ι 26c' is formed between the other side surface of the first metal thin wire 16a and one side surface of the second metal thin wire 16b; The fourth restraining portion 26d is formed between the other side surface of the first metal thin wire 16a and the other side surface of the second metal thin wire i6b. When the areas of the first suppressing portion 26a, the second suppressing portion 26b, the third suppressing portion 26c, and the fourth suppressing portion 26d are sbl, Sb2, Sb3, and Sb4, 'satisfy Sb=Sbl + Sb2 + Sb3 + Sb4. In the above case, the line width La of the first metal thin wires 16a and the line width Lb of the second metal thin wires 16b are 1 μm to 5 μm, preferably i μπι 9 and the first metal thin wires 1 and the second metal thin wires are off. The line width can be 2 or different. Further, the line spacing of the first metal thin wires 16a and the line spacing of the first thin line (10) are 6〇卿~乡μιη. The i-th metal is the same. The line spacing of a and the second metal thinner and the line i6b may be the same, or may be the same as the sixth embodiment in the first embodiment, and the grounding portion 2424 of the conductive portion 14 is grounded to form a corrugation suppressing portion. 26, and the area of the conductive portion and the corrugation suppressing portion 26 is optimized. As a result, the integral amount of the light of the part of the large I is generated outside the intersection portion 24 and the intersection portion 24, and the same mesh pattern 2 〇 seems to have disappeared, whereby the corrugated ~15 coffee will be ^ and due to the metal The line width of the thin line 16 is set to 1 beer ^ ^ 65 &quot; m ^ 500 μΠ 1 * easy to show the people). As shown in Fig. 1 and Fig. 3, the 13th 201232632 1st suppressing portion 26a to the fourth suppressing portion 26d which constitute the corrugation suppressing portion 26 may have a planar shape. The shape of the rectangle may be a rectangular shape as shown in FIG. 4, and may be a shape in which an arc-shaped notch is formed in a triangle as shown in FIG. 5, or may be a shape obtained by taking a shape of FIG. It can be set to an asymmetrical shape. The system [:: according to Figure 7Α~图U' faces the conductive... The first manufacturing method is as shown in Figure 7Α, in the transparent photosensitive layer 3〇, and as shown in Figure After the silver salt photosensitive layer 3 = light, the image processing " combines the metal silver portion 32 and the light transmissive portion, thereby forming the conductive portion 14 (mesh pattern 2, etc.). The silver portion 32 preferably includes a shape for developing silver and develops silver. Then, as shown in Fig. 7C, a conductive metal 36 such as a plating layer may be carried on the metal silver portion μ. The mask mask used in the exposure process may also have a mask pattern corresponding to the intersection 24 of the circumferential pattern 2G. Pattern groove portion 26 formed suppressed. Alternatively, the pattern may be exposed to the silver salt photosensitive layer 3G by a digital writing exposure to the silver salt photosensitive layer 30, which is in the mesh pattern. The two-part intersection 24 forms a pattern of the bellows suppression portion 26. In the above case, when the characteristics of the exposure energy (image) density distribution shown in FIG. 8 are used, the first metal thin wire 16a is digitally written with the image and the curved metal thin wire 161. In the case of exposure, the exposure is performed by the first exposure energy E1 in the region saturated by the shadow j, and when the portion 24 is subjected to the digital write exposure, the second exposure energy of the region 201232633⁄4 in which the image density is saturated is set to E2. exposure. At this time, the first exposure energy Ei &lt;second exposure energy E2. The light leaks toward the adjacent portion of the intersection portion 24 due to the increase in the exposure energy, whereby the light oozing region is generated, and then, in the development process, the light oozing region is embodied as a corrugation adjacent to the intersection portion 24. The suppression unit 26. In the above method, it is only necessary to selectively switch the exposure energy depending on the position. Therefore, the corrugation suppression portion 26 can be easily formed adjacent to the intersection portion 24, and the manufacturing cost (c〇st) can be reduced. . As another forming method, as shown in Fig. 9A, for example, a photoresist film on the copper foil 4 formed on the transparent substrate 12 can be used.

42進仃曝光、顯影處理而形成光阻圖案44，接著如圖PR 道ΐ自光阻圖案44露出的銅箱40進行侧，藉此來 膜42的1Μ4(網眼圖案2〇等）。於該情形時，對於光阻 Ϊ 光過程中所使用的遮罩亦可包括如下的遮罩圖 纹抑對應於在網目晴2G的交又部24形成波 、，又卻止部26而成的圖案。 下的可藉由對雜膜42進行數位寫人曝光來將如 1的圖案曝光至光阻膜42，μ、+、门+ 24 ^ ^ 、 上4圖案是在網眼圖案20的 乂又成波紋抑止部26__案。 又’亦可如圖10A所千，Μ办二 (Paste) 50印刷 體、卜匕含金屬微粒子的漿料 的圖案”，接著如=二2上工此來形成導電部14 案52,藉此來# ’、將金屬鍍層54鍍敷至圖 或二=導電部M (網眼圖案20等)。 …0圖11所不’藉由網版（screen)印刷版、 15 201232632 凹版（gravure)印刷版或喷墨（inkjet)來於透明基體12 印刷形成金屬薄膜60 ’從而構成導電部14 (網眼圖案20 等）。 接著，主要對如下的方法進行敍述，該方法將作為尤 佳形態的鹵化銀照片感光材料使用於第1實施形態的導電 膜 l〇a。 根據感光材料與顯影處理的形態，導電膜10a的製造 方法包含如下所述的3個形態。 (1 )形態是對不包含物理顯影核的感光性鹵化銀黑白 感光材料進行化學顯影或熱顯影而使金屬銀部形成於該感 光材料上。 (2)形態是對鹵化銀乳劑層中包含物理顯影核的感光 性鹵化銀黑白感光材料進行溶解物理顯影而使金屬銀部形 成於該感光材料上。 (3)形態是將不包含物理顯影核的感光性鹵化銀黑白 感光材料、與具有包含物理顯影核的非感紐層的領像片 予以疊合來進行擴散轉印崎彡，使金祕部形成於非感光 性顯像片上。 上述⑴的形態為一體型黑白顯影類型 ，成光透射性導電膜等的透光性導電性膜。所 衫銀為化學顯影銀或熱顯影銀，且為高比表面 ’因此，於後續的鍍輯物理彡過程中該 顯影銀的活性高。 對於上述（2)的形態而言，於曝光部中，物理顯影核 201232632 近緣的i化練子溶解而沈積於 性導電性膜等的透光性導== 作用，因i ϊ =型。顯影作用為物理顯影核上的析出 乍用因此’活性^但顯影銀為比表面小的球形。 子溶二ί。丄的Γ態而言，於未曝光部中，鹵化銀粒 積於顯像片上的顯影核上，藉此， 射性導電性膜等的透光性導電性膜。 謂的分_型，且為自感光材料將顯 像片予以剝離來使用的形態。 轉顯個形態而言，均可選擇負型顯影處理以及反 ^‘吉員^處財的任-種顯影（於擴散轉印方式的情形時， ::型感光材料用作感光材料’藉此，可進行負型顯 料=所謂的化學顯影、熱顯影、溶解物理顯影、以及 ϊ政轉印㈣是指如本職帽通常使㈣聽所述的意 直「片化學的一般教科書中有解說，例如已於菊 车路;者的照片化學（写真化学）」（共立出版社 ，1955 ，發仃）、C.E.K.Mees、編寫的「攝影法理論第*版咖 Theory of Photographic 加咖⑽，灿 ed )」（_咖 ^ ’ 977年發行）中有解說。本案是與液體處理相關的發 二：其他的應用熱顯影方式作為顯影方式的技術亦可作 為參考。例如，可應用日本專利特開2〇〇4 184693號、日乍 ^專利特開2004-334077號、日本專利制·5_〇ι〇752 號的各公報、錢日本專利_ 2⑻4 244_號、日本專 17 201232632 利特願2004-085655號的各說明書所揭示的技術。 此處，以下詳細地對本實施形態的導電膜l〇a的各層 的構成進行說明。 [透明基體12] 作為透明基體12，可列舉塑膠膜（plastic film)、塑膠 板（plastic plate)、以及玻璃板（glass plate)等。 作為上述塑膠膜以及塑膠板的原料，例如可使用聚對 苯二曱酸乙二醇醋（Polyethylene Terephthalate，PET)，聚 萘二甲酸乙二醇酯（Polyethylene Naphthalate，PEN)等的 聚酯類；聚乙稀（Polyethylene，PE )、聚丙稀 (Polypropylene ’ PP)、聚苯乙烯、乙烯醋酸乙烯酯 (Ethylene Vinyl Acetate，EVA )等的聚烯烴類；以及乙烯 系樹脂；此外可使用聚碳酸酯（Polycarbonate，PC )、聚醯 胺、聚醯亞胺、丙烯酸樹脂、以及三醋酸纖維素（Triacetyl Cellulose，TAC)等。 作為透明基體12，PET (熔點：258°C )、PEN (熔點： 269°C)、PE (熔點：135°C)、PP (熔點：163°C)、聚苯乙 烯（熔點：230°C )，聚氯乙烯（熔點：180°C )，聚偏二氯 乙烯（熔點：212°C)或TAC (熔點：29(TC)等的熔點約 為290°C以下的塑膠膜或塑膠板較佳，自光透射性或加工 性等的觀點考慮，PET尤佳。觸控面板用的導電膜1〇需要 具有透明性，因此，較佳為透明基體12的透明度高。 [銀鹽感光層30] 成為導電膜l〇a的導電部14 (網眼圖案20等）的銀 18 201232632 ιι =感光層30除了含有銀鹽與黏合劑（binder)之外 有溶劑或染料等的添加劑。 方3 益;本實^射所使用的銀#，可解_化銀等的 =銀鹽収雜料的錢_。財纽形態中1 =使用作為光感湘（Gptleal se_)㈣性優 化銀。 叫 銀鹽感光層30的塗佈銀量（銀鹽的塗佈量）換 銀，較佳為1 g/m2〜30 g/m2，更料i g/m2〜25咖2，進 2更：為5 g/m2〜20 g/m2。藉由將該塗佈銀量設為上述範 圍’虽形成導電膜10a時’可獲得所期望的表面電阻。 作為本實施形態中所使用的黏合劑，例如可列舉 膠（gelatin)、聚乙烯醇（Polyvinyl Ak〇h〇1，pvA) 烯吡咯細（PdyvinylPym)lidGne，pvp)、殿粉等的多 類、纖維素及其衍生物、聚氧化乙烯、聚乙稀胺、聚 胺糖（chitosan)、聚離胺酸、聚丙烯酸、聚海藻酸 明質酸、以讀基纖維料。根據官能基_子性，= 黏合劑具有中性、陰離子性、以及陽離子性的性質。a ^本實施形態的銀鹽感光層30中所含的黏合劑的含 畺並無特別的限疋，可於能夠發揮分散性與密著性的範 内，適當地決定上述黏合劑的含有量。以銀/黏合劑體積比 **十，銀鹽感光層30中的黏合劑的含有量較佳為I&quot;以上 更佳為1/2以上。銀/黏合劑體積比較佳為1〇〇/1以下，更 佳為50Λ以下。又，銀/黏合劑體積比進而更佳為in〜 4/1。最佳為1/1〜3/1。藉由將銀鹽感光層3〇中的銀/黏合 19 201232632 劑體積比設為上述範圍，即便於對塗佈銀量進 3二制電阻值的不均，從而可獲得具有 曰、電膜10a。再者，將原料的鹵化銀量/點人节 (重夏比）轉換為銀量/黏合劑4 (重量比菩^’ 量/黏合劑量（重量比）轉換為銀姆合劑量m銀 藉此’可求出銀/黏合龍積比。 體積比）， &lt;溶劑:&gt; 用以形成銀鹽感光層30的溶劑並無特別 可列舉水、有機溶劑（例如甲醇等的醇類、丙 :如 甲醯胺等_胺類、二甲基亞颯等的亞賴、酷酸乙^笼 ^類、及_等）、離子性、以及這餘_混^溶 本實施形態的銀鹽感光層30中所使用的溶 量才曰目對於銀鹽感光層3。中所含的銀鹽、黏合劑等的合二 =量，處於30質量％〜90質量％的範圍，較佳為處0於、 質量°/〇〜80質量％的範圍。 、〇 &lt;其他添加劑&gt; 本實施形態中所使用的各種添加劑並無特別的 可較佳地使用眾所周知的添加劑。 [其他‘的層構成] 亦可於銀鹽感光層30上設置未圖示的保護層。於本 施形態中，所謂「保護層」，是指包含如明膠或高分子聚合 物之類的黏合劑的層，為了表現出防止擦傷或對力學特^ 進行改良的效果，該保護層形成於具有感光性的銀鹽感光The photoresist pattern 44 is formed by exposure and development processing, and then the side of the copper case 40 exposed from the photoresist pattern 44 as shown in Fig. PR is formed, whereby 1Μ4 (mesh pattern 2, etc.) of the film 42 is obtained. In this case, the mask used in the photoresist photolithography process may also include the following mask pattern, which corresponds to the formation of a wave at the intersection 24 of the mesh 2G, and the stop portion 26 is formed. pattern. The pattern of 1 can be exposed to the photoresist film 42 by digitally exposing the impurity film 42 to the photoresist film 42, and the pattern of μ, +, gate + 24 ^ ^, and the upper 4 pattern is formed in the mesh pattern 20. Corrugation suppression section 26__ case. In addition, as shown in FIG. 10A, a pattern of a slurry of a paste containing 50 metal particles and a metal microparticle may be formed, and then a conductive portion 14 is formed as shown in FIG. ##, plating the metal plating 54 to the figure or two = conductive portion M (mesh pattern 20, etc.) ... 0 Figure 11 is not 'by screen printing plate, 15 201232632 gravure printing The plate or inkjet is printed on the transparent substrate 12 to form the metal thin film 60' to constitute the conductive portion 14 (mesh pattern 20, etc.) Next, the following method will be mainly described, which will be a halogenation in a particularly preferable form. The silver photo-sensitive material is used in the conductive film 10a of the first embodiment. According to the form of the photosensitive material and the development process, the method for producing the conductive film 10a includes the following three forms: (1) The form is not including physical The photosensitive silver halide black-and-white photosensitive material of the developing core is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material. (2) The form is a photosensitive silver halide black-and-white photosensitive material containing a physical developing core in the silver halide emulsion layer. Material for solute Developing, the metal silver portion is formed on the photosensitive material. (3) The form is a stack of a photosensitive silver halide black-and-white photosensitive material that does not include a physical development core and a non-inductive layer containing a physical development core. In the same manner, the form of the above (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is used as the light-transmissive conductive film. Silver is chemically developed silver or thermally developed silver, and is a high specific surface. Therefore, the activity of the developed silver is high in the subsequent plating physical enthalpy. For the above form (2), in the exposure portion, the physics Development nucleus 201232632 The near-edge i-acting is dissolved and deposited on a conductive film such as a light-conducting conductive film == function, because i ϊ = type. Development is a precipitation on the physical development nucleus, so 'active ^ but The developed silver has a spherical shape smaller than the surface. In the unexposed portion, silver halide grains are accumulated on the developing core on the developing sheet, whereby the conductive conductive film or the like is used. Translucent conductive film. It is a form used for peeling off a developing sheet from a photosensitive material. In terms of a form, it is possible to select a negative type development process and any type of development of the anti-growth (in the diffusion transfer mode). In the case, the ::type photosensitive material is used as the photosensitive material 'by this, negative type of material can be performed = so-called chemical development, thermal development, dissolved physical development, and 转印 transfer (4) means that the cap is usually used to listen to (4) The meaning of the above-mentioned "the general textbook of film chemistry is explained in the textbook, for example, in the car road; the photo chemistry (photo chemistry)" (Kyoritsu Press, 1955, hairpin), CEKMees, "Photography" The theory of the * version of the theory of Photographic plus coffee (10), cand ed) (_ _ ^ ^ 977 issue) has a commentary. This case is related to liquid treatment. II: Other techniques for applying thermal development as a development method can also be used as a reference. For example, Japanese Patent Laid-Open Publication No. Hei. No. 2,184,693, Japanese Patent No. 2004-334077, Japanese Patent No. 5_〇ι〇752, Japanese Patent No. 2(8) 4 244_, The technique disclosed in the specification of the Japanese Patent Application No. 2004-085655. Here, the configuration of each layer of the conductive film 10a of the present embodiment will be described in detail below. [Transparent Substrate 12] Examples of the transparent substrate 12 include a plastic film, a plastic plate, and a glass plate. As the raw material of the plastic film and the plastic sheet, for example, a polyester such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) can be used; Polyethylene (PE), Polypropylene 'PP, polystyrene, Ethylene Vinyl Acetate (EVA), and the like; and a vinyl resin; in addition, polycarbonate ( Polycarbonate, PC), polyamine, polyimine, acrylic, and Triacetyl Cellulose (TAC). As the transparent substrate 12, PET (melting point: 258 ° C), PEN (melting point: 269 ° C), PE (melting point: 135 ° C), PP (melting point: 163 ° C), polystyrene (melting point: 230 ° C) ), polyvinyl chloride (melting point: 180 ° C), polyvinylidene chloride (melting point: 212 ° C) or TAC (melting point: 29 (TC) and other melting point of about 290 ° C or less plastic film or plastic plate Preferably, PET is particularly preferable from the viewpoints of light transmittance, workability, etc. The conductive film 1 for a touch panel needs to have transparency, and therefore, it is preferable that the transparency of the transparent substrate 12 is high. [Silver salt photosensitive layer 30 ] Silver 18 which becomes the conductive portion 14 (mesh pattern 20, etc.) of the conductive film 10a 201232632 ιι = The photosensitive layer 30 contains an additive such as a solvent or a dye in addition to a silver salt and a binder. The silver # used by this real ^ shot can solve the problem of silver-containing silver salt and other materials. _. In the form of financial and neon 1 = use as a light-sensing (Gptleal se_) (four) qualitative optimization of silver. The coating silver amount (the coating amount of the silver salt) of the salt photosensitive layer 30 is changed to silver, preferably 1 g/m 2 to 30 g/m 2 , more preferably ig/m 2 〜 25 coffee 2, and 2 is more: 5 g / M2~20 g/m2. The coating silver amount is in the above range 'When the conductive film 10a is formed', a desired surface resistance can be obtained. Examples of the binder used in the present embodiment include gelatin and polyvinyl alcohol (Polyvinyl Ak). 〇h〇1, pvA) Polypyrrole (PdyvinylPym) lidGne, pvp), various types of powder, etc., cellulose and its derivatives, polyethylene oxide, polyethylene, chitosan, polychlorination Aminic acid, polyacrylic acid, polyalginic acid, and read-based fiber. Depending on the functional group, the binder has neutral, anionic, and cationic properties. a) The content of the binder contained in the silver salt photosensitive layer 30 of the present embodiment is not particularly limited, and the content of the binder can be appropriately determined within a range in which dispersibility and adhesion can be exhibited. . In the silver/binder volume ratio **, the content of the binder in the silver salt photosensitive layer 30 is preferably I&quot; or more preferably 1/2 or more. The silver/binder volume is preferably 1 〇〇/1 or less, more preferably 50 Å or less. Further, the silver/binder volume ratio is further preferably in 4 to 1/1. The best is 1/1 to 3/1. By setting the volume ratio of the silver/bonding 19 201232632 in the silver salt photosensitive layer 3〇 to the above range, even if the amount of coated silver is uneven, the electric film 10a can be obtained. . Furthermore, the amount of silver halide/point of the raw material (heavy summer ratio) of the raw material is converted into the amount of silver/binder 4 (the weight ratio is converted to the amount of the binder (weight ratio) converted to the silver dose of m silver. 'Yield ratio of silver/bonding ratio. Volume ratio>, &lt;solvent:&gt; The solvent for forming the silver salt photosensitive layer 30 is not particularly limited to water or an organic solvent (for example, an alcohol such as methanol or the like: For example, amides such as methotrexate, ylides such as dimethyl hydrazine, sulphuric acid, etc., ionic, and the silver salt photosensitive layer of the present embodiment The amount of solvent used in 30 is only for the silver salt photosensitive layer 3. The amount of the silver salt, the binder, and the like contained therein is in the range of 30% by mass to 90% by mass, preferably in the range of 0% by mass and 质量% to 80% by mass. 〇 &lt;Other Additives&gt; The various additives used in the present embodiment are not particularly preferably used. [Other 'layer structure') A protective layer (not shown) may be provided on the silver salt photosensitive layer 30. In the present embodiment, the term "protective layer" means a layer containing a binder such as gelatin or a high molecular polymer, and the protective layer is formed in order to exhibit an effect of preventing scratches or improving mechanical properties. Sensitive silver salt sensitization

II II201232632 L係f 層的厚度較佳為G.5 μηι以下。保護層 的塗佈方相及形齡法絲_驗定 ，所周知的塗佈方法以及職絲ϋ可於比銀= 光層30更靠下方處設置例如底塗層。 心 接著’對導電膜10a的製作方法的各步驟進行說明。 [曝光] ^ 本貫施形態中，包括藉由印刷方式來形成網眼圖案 2〇的仏形’但除了印刷方式以外，亦藉由曝 形成網眼_ 20 4即，對包括設置於透明基體’ 銀鹽感光層30的感光㈣或塗佈有光微影法用光聚合物 的感光材料進行曝光。可使用電磁波來進行曝光。作為電 磁波，例如可列舉可見光線、紫外線等的光、以及χ射線 等的放射線等。而且，可_具有波長分布的光源來進行 曝光，亦可使用特定的波長的光源來進行曝光。 [顯影處理] ^於本實施形態中，對銀鹽感光層30進行曝光之後，接 著進行顯影處理。該顯影處理可使用對於銀鹽照相膠片或 感光紙（photographic paper )、印刷製版用膠片、光罩 (photomask)用乳膠遮罩（emuisi〇n mask)等所使用的通 苇的顯影處理的技術。顯影液並無特別的限定，亦可使用 菲尼_對苯二酚（Phenidone Quino卜PQ)顯影液、米吐 爾對苯二酚（MetolQuino卜MQ)顯影液、以及曱基丙烯 酸（Methacrylic Acid，MAA )顯影液等，對於市售品而言， 例如可使用作為畐士軟片公司處方的CN-16、CR-56、 21 201232632 CP45X、FD-3、及 PAPITOL ;作為柯達（KODAK)公司 處方的C-41、E-6、RA-4、D-19、及D-72等的顯影液；或 上述顯影液的套組（kit)中所含的顯影液。又，亦可使用 微影顯影液。 本發明中的顯影處理可包括為了將未曝光部分的銀鹽 予以除去而貫現穩定化所進行的炫合處理。本發明中的熔 合處理可使用對於銀鹽照相膠片或感光紙、印刷製版用膠 片、光罩用乳膠遮罩等所使用的熔合處理的技術。 經由以上的步驟而獲得導電膜l〇a，但所獲得的導電 膜l〇a的表面電阻較佳為處於歐姆/叫〜1〇〇歐姆/叫 的範圍。上述下限值較佳為1歐姆/sq，進而較佳為1〇歐 姆/sq·。上述上限值較佳為7〇歐姆/sq ’進而較佳為5〇歐 姆/sq·。又，亦可進一步對顯影處理之後的導電膜1〇a進行 壓光（calender)處理，且可藉由壓光處理來調整為所期望 的表面電阻。 [物理顯影以及鍍敷處理] 、於本實施形態中，為了使上述曝光以及顯影處理所 成的金屬㈣32的導電性提高，亦可妨心使導電性 屬粒子承·上述金屬銀部32的物理顯影及/或 實施形態中’可僅利用物理顯影或魏處^中 ，處理來使導電性金屬粒子承載於金屬銀部 ’字對金屬銀部實施物理顯似/或職 一併稱為「導電性金屬部」。 W而成的4 [導電性金屬部] 22II II201232632 The thickness of the L-system f layer is preferably G.5 μηι or less. The coated phase of the protective layer and the age-formed ruled yarn, the well-known coating method, and the ruthenium wire can be provided, for example, under the silver layer 10, for example, an undercoat layer. The following steps of the method of manufacturing the conductive film 10a will be described. [Exposure] ^ In the present embodiment, the shape of the mesh pattern 2〇 is formed by printing. However, in addition to the printing method, the mesh is formed by exposure, that is, the pair is disposed on the transparent substrate. The photosensitive salt of the silver salt photosensitive layer 30 (4) or the photosensitive material coated with the photopolymer using photolithography is exposed. Electromagnetic waves can be used for exposure. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as xenon rays. Further, exposure may be performed with a light source having a wavelength distribution, or may be performed using a light source of a specific wavelength. [Development Treatment] ^ In the present embodiment, after the silver salt photosensitive layer 30 is exposed, development processing is subsequently performed. For the development treatment, a technique of developing treatment for silver salt photographic film or photographic paper, printing plate making film, photomask using a latex mask, or the like can be used. The developer is not particularly limited, and a fountain of Phenidone Quino (PQ), a solution of MetolQuino (MQ), and Methacrylic Acid can also be used. MAA) developer, etc. For commercial products, for example, CN-16, CR-56, 21 201232632 CP45X, FD-3, and PAPITOL, which are prescribed by the Gentleman Film Company, can be used; as a prescription of Kodak Company a developing solution such as C-41, E-6, RA-4, D-19, and D-72; or a developer contained in a kit of the above developing solution. Further, a lithographic developer can also be used. The development treatment in the present invention may include a scission treatment in which stabilization is performed in order to remove the silver salt of the unexposed portion. The fusion treatment in the present invention can be carried out by a fusion treatment technique for silver salt photographic film or photosensitive paper, a printing plate, a mask for a mask, or the like. The conductive film 10a is obtained through the above steps, but the surface resistance of the obtained conductive film 10a is preferably in the range of ohms / 〜1 〇〇 ohm / Å. The lower limit value is preferably 1 ohm/sq, and more preferably 1 ohm/sq. The upper limit is preferably 7 〇 ohm/sq ′ and further preferably 5 〇 ohm/sq·. Further, the conductive film 1a after the development process may be further subjected to calender treatment, and may be adjusted to a desired surface resistance by calendering. [Physical development and plating treatment] In the present embodiment, in order to improve the conductivity of the metal (four) 32 formed by the exposure and development processing, it is possible to make the conductivity of the metal particles 32 and the physical properties of the metal silver portion 32. In the development and/or embodiment, it is possible to use only physical development or processing, to carry the conductive metal particles on the metal silver portion, and to perform physical display and/or job-like Ministry of Metals." W made of 4 [conductive metal part] 22

Af 201232632 對於本實施形態的導電性金屬部的線寬（金屬細線16 的線寬）而言，下限較佳為1 μιη以上、3 μπ1以上、4 μπ1 以上、或5 μπι以上，上限較佳為15 μιη以下、1〇μπ1以下、 9 μηι以下、以及8 μιη以下。當線寬不足上述下限值時， 導電性不充分，因此，在使用於觸控面板的情形下，檢測 感度不充分。另一方面，若超過上述上限值，則由網眼圖 案20引起的波紋變得顯著，或使用於觸控面板時的視認性 變差。再者，使上述導電性金屬部的線寬處於上述範圍， 藉此，網眼圖案20的波紋得到改善，尤其視認性變佳。金 屬細線16的線間隔較佳為65 μιη以上且為500 μηι以下， 進而較佳為100 μιη以上且為4〇〇 μιη以下，更佳為15〇 μιη 以上且為300 μιη以下，最佳為21〇 以上且為250 以下。又’為了接地等，導電性金屬部亦可包括線寬比2〇〇 μιη更寬的部分。 對於本實施形態中的導電性金屬部而言，自可見光透 射率的方面考慮’開口率較佳為8 5 %以上，進而較 以上，最佳為95%以上。所謂開口率，是指除了導電部分 (後述的第1大格子202Α、第1連接部106Α、第2大格 子2〇2Β、第2連接部ΐ〇6Β、以及小格子1〇4等的導電部 分：參照圖15)之外的透光性部分於整體中所佔的比例， 例如’線寬為15 μιη且間距為3〇〇 μιη的正方形 的開口率為90%。 于狀 [光透射性部] 本實施形態中的所謂的「光透射性部」，是指導電膜 23 201232632 10a中的除了導電性金屬部以外的具有透光性的部分。對 於光透射性部的透射率而言’如上所述，透明基體12的除 了有助於光吸收及光反射的作用之外的380 nm〜780 nm 的波長區域中的透射率的最小值所示的透射率為9〇%以 上，較佳為95%以上，進而較佳為97%以上，進而更佳為 98%以上，最佳為99%以上。 曝光方法較佳為經由玻璃遮罩（glass mask)來實施的 方法或利用雷射（laser)描繪的圖案曝光方式。 [導電膜10a] 本實施形態的導電膜l〇a中的透明基體12的厚度較佳 為5 μιη〜350 μιη’進而較佳為30 μηι〜150 μιη。若為5 μιη 〜350 μηι的範圍，則可獲得所期望的可見光的透射率，且 亦易於處理。 可根據塗佈於透明基體12上的銀鹽感光層用塗料的 塗佈厚度，來適當地決定設置於透明基體12上的金屬銀部 的厚度。金屬銀部32的厚度可選自〇.〇〇1 mm〜〇2 mm， 但較佳為30 μηι以下’更佳為20 μιη以下，進而較彳圭* 〇⑴ —，最佳為—一。又’金進屬二= 為圖案狀。金屬銀部32可為1層，亦可為2層以上的疊層 構成。當金屬銀部32為圖案狀且為2層以上的疊層構成 時’可產生不同的感色性’使得能夠對於不同的波長感 藉此’若改變曝光波長來曝光，則可於各層形成不^的圖 案。 對於觸控面板的用途而言’導電性金屬部的厚度越 24 201232632 / τ^^/ii 示面板的視角越廣’因此，較佳為導電性金屬部 的厚㈣，即便於魏雛提高时面，亦要求實現薄膜 i匕的ii匕?ϊγ考慮’包含承载於導電性金屬部的導電金 =層的厚度較佳為不足9帅，更佳為〇1哗以上且不 足5 μιη，進而杈佳為01 μπι以上且不足3。 於本貫施幵人瘦'中，藉由對上述銀鹽感光層Μ的塗佈 度進行控制來形成所期望的厚度的金屬銀部32，而且可藉 影及/或鍍敷處理來自如地對包含導電金屬“ 的層的厚度進行㈣，因此，亦可容易地形成具有不足$ μιη的厚度，較佳為具有不足3帅的厚度的導電膜⑺。 —再者，於本實施形態的導電膜1〇a的製造方法中，不 進行鍍㈣的步驟。原因在於：於本實施形態的 、a的製造方法巾’可藉由對銀鹽感光層I%的塗 :銀/黏合劑體積比進行調整來獲得所期望的表面電 P 。再者，亦可根據需要而進行壓光處理等。 (顯影處理之後的硬膜處理） 較佳為對銀鹽感光層30進行顯影處理之後，將該銀鹽 f層3G浸潰於硬膜劑來進行硬膜處理。作為硬膜劑，二 如可列舉戊二酸、己二酿、2,3_二膝M•二魏、二^ 1以及爛酸等的日本專利特開平2_141279號 不的硬膜劑。 网 亦可於導電膜10a以及後述的積層導電膜54上形成抗 反射層或條瑪層（bar code layer )等的功能層。 再者，本發明可適當地與下述表1以及表2所揭示的 25 201232632 公開公報以及國際公開小冊子的技術組合地使用。省略「特 開」、「號公報」、以及「號小冊子」等的表述。 [表1] 2004-221564 2004-221565 2007-200922 2006-352073 2007-129205 2007-235115 2007-207987 2006-012935 2006-010795 2006-228469 2006-332459 2009-21153 2007-226215 2006-261315 2007-072171 2007-102200 2006-228473 2006-269795 2006-269795 2006-324203 2006-228478 2006-228836 2007-009326 2006-336090 2006-336099 2006-348351 2007-270321 2007-270322 2007-201378 2007-335729 2007-134439 2007-149760 2007-208133 2007-178915 2007-334325 2007-310091 2007-116137 2007-088219 2007-207883 2007-013130 2005-302508 2008-218784 2008-227350 2008-227351 2008-244067 2008-267814 2008-270405 2008-277675 2008-277676 2008-282840 2008-283029 2008-288305 2008-288419 2008-300720 2008-300721 2009-4213 2009-10001 2009-16526 2009-21334 2009-26933 2008-147507 2008-159770 2008-159771 2008-171568 2008-198388 2008-218096 2008-218264 2008-224916 2008-235224 2008-235467 2008-241987 2008-251274 2008-251275 2008-252046 2008-277428 [表2] 2006/001461 2006/088059 2006/098333 2006/098336 2006/098338 2006/098335 2006/098334 2007/001 〇〇r 接著’第2實施形態的導電膜勘亦被用作觸控面板 等的電極，如圖12所示，該導電膜1%包括：透明基體 12 ;接著層62，形成於上述透明基體12上；導電部14， 由形成於接著層62上的金屬細線16形成；以及透明包覆 層6心形成為將導電部Η與露出有接著層Q的部分予以 包覆。尤其’接著層62與透明包覆層64的折射率之差為 0.1以下’更佳為_以下，進續佳為Q Q5以下。於該 26 201232632 導電膜勘中，亦可形成上述波紋抑止部％。 此一面參照圖13A〜圖13C，一 的製造方法進行說明。 Γ等電膜10b 首先，如圖UA所示，將導電材料的金 接著層62而貼f於透明基體U的-個主面l2a上。= 者 將如下的金屬泊66貼合於接著層62， ， 著層62貼合的貼合面已粗輪化。藉此，金屬;= =面形狀轉印至接著層62中的與金編 如圖13B所示’藉由化學姓刻製 的金屬箔66的一部分予以除本 m 2上 料雷圖索12〇丄二 而形成導電圖案12〇, 該導電圖案120包含線寬為9帅 下的金屬猪66(金屬细唆16〕介ρ 与度為3μιη以 來形成導電部Η。 ）。亦即，利用金屬細線16 於==，利用透明包覆層64來將導電圖案120 與路出有接者層62的部分予以包覆，該透明包覆声64盘 接著層62的折射率之差為〇.1以下。 θ /、 由於金屬箱66的貼合面的粗糙面形狀會轉印至接著 層62上的金屬II 66已被除去的部分，因此 會使光散射，從而彳胃宝。# ； ’ 、止古、以心 然而，於本實施形態的製 ^明明包覆層64包覆於上述粗輪面形狀上，該 透明包覆層64與接著層62的折射率之差為q i以下，因 ==面形狀中的漫反射被抑制至最小限度，從而表現 27 201232632 於上述製造方法中，形成於透明基體12上的導電圖案 120包含線寬為9 μιη以下，且厚度為3 μιη以下的金屬細 線16,因此，亦會產生使導電圖案12〇不易被肉眼看到 效果。 接著，以下對本實施形態的導電膜10b的構成構件的 較佳形態進行說明。 [透明基體12] 透明基體12是包含：聚對笨二甲酸乙二醇酯（PET)、 聚萘一曱酸乙二醇酯等的聚酯類、聚乙稀、聚丙稀、聚笨 乙烯、E+VA等的聚烯烴類、聚氯乙烯、聚偏二氯乙烯等的 ^稀系樹月旨、聚颯、聚喊颯、聚石炭酸醋、聚醢胺、聚酿亞 胺、丙烯酸樹脂等的塑膠的膜，且總可見光透射率較佳 70%以上。 透明基體12可以不會妨礙觸控面板的功能的程度而 ^著色，而且亦可單層地使用透明基體12，但亦可使用組 口有2層以上的膜的多層膜。其中，自透明性、耐教性、 2理性、以及價格的方面考慮，聚對苯二曱酸乙I醇酿 、最佳。若該透明基體12的厚度薄，則處理性不佳，若誃 :月基體12的厚度厚，則可見光的透射率會下降，因此， §亥透明基體12的；ς 1〇1 W予度較佳為5 μιη〜200 μιη。進而較佳為 μΠ1〜100帅’更佳為25 μιη〜50 μιη。Af 201232632 The line width (the line width of the metal thin wires 16) of the conductive metal portion of the present embodiment is preferably 1 μm or more, 3 μπ1 or more, 4 μπ1 or more, or 5 μπι or more, and the upper limit is preferably 15 μηη or less, 1 μππ1 or less, 9 μηι or less, and 8 μιη or less. When the line width is less than the above lower limit value, the conductivity is insufficient. Therefore, in the case of use in a touch panel, the detection sensitivity is insufficient. On the other hand, when it exceeds the above upper limit value, the ripple caused by the mesh pattern 20 becomes conspicuous, or the visibility when used in a touch panel deteriorates. Further, the line width of the conductive metal portion is in the above range, whereby the corrugations of the mesh pattern 20 are improved, and the visibility is particularly improved. The line spacing of the fine metal wires 16 is preferably 65 μm or more and 500 μm or less, more preferably 100 μm or more and 4 μm or less, more preferably 15 μm or more and 300 μm or less, and most preferably 21 or less. 〇 above and below 250. Further, the conductive metal portion may include a portion having a wider line width than 2 〇〇 μη for grounding or the like. In the conductive metal portion of the present embodiment, the aperture ratio is preferably 85 % or more from the viewpoint of the visible light transmittance, and more preferably 95% or more. The aperture ratio is a conductive portion other than the conductive portion (the first large lattice 202 后, the first connection portion 106 Α, the second large lattice 2 〇 2 Β, the second connection portion ΐ〇 6 Β, and the small lattice 1 〇 4 described later). The ratio of the translucent portion other than the one shown in Fig. 15) to the whole, for example, the square of the line width of 15 μm and the pitch of 3 μm is 90%. [Light-transmitting portion] The "light-transmitting portion" in the present embodiment is a portion having a light-transmitting property other than the conductive metal portion in the electric film 23 201232632 10a. For the transmittance of the light transmissive portion, as described above, the minimum value of the transmittance in the wavelength region of 380 nm to 780 nm of the transparent substrate 12 other than the function of contributing to light absorption and light reflection is shown. The transmittance is 9% or more, preferably 95% or more, more preferably 97% or more, still more preferably 98% or more, and most preferably 99% or more. The exposure method is preferably a method implemented by a glass mask or a pattern exposure method using a laser drawing. [Conductive film 10a] The thickness of the transparent substrate 12 in the conductive film 10a of the present embodiment is preferably 5 μm to 350 μm, and more preferably 30 μm to 150 μm. If it is in the range of 5 μm to 350 μm, the desired transmittance of visible light can be obtained and it is easy to handle. The thickness of the metallic silver portion provided on the transparent substrate 12 can be appropriately determined according to the coating thickness of the coating material for the silver salt photosensitive layer applied to the transparent substrate 12. The thickness of the metal silver portion 32 may be selected from 〇.〇〇1 mm to 〇2 mm, but preferably 30 μηη or less, more preferably 20 μηη or less, and further preferably 彳(*)(1)-, preferably -1. Also, 'jinjin belongs to the second= is a pattern. The metal silver portion 32 may be one layer or a laminate of two or more layers. When the metal silver portion 32 is in the form of a pattern and is a laminate of two or more layers, 'different coloritivity can be produced', so that it is possible to form different layers by exposing the exposure wavelength to different wavelengths. ^ The pattern. For the use of the touch panel, the thickness of the conductive metal portion is 24 201232632 / τ ^ ^ / ii The wider the viewing angle of the panel is. Therefore, it is preferable that the thickness of the conductive metal portion is (4), even when the Wei chick is raised. In addition, it is also required to realize the ii匕?ϊγ of the film i匕. The thickness of the conductive gold-containing layer contained in the conductive metal portion is preferably less than 9, more preferably 〇1哗 or more and less than 5 μηη, and further 杈Good is 01 μπι or more and less than 3. In the present invention, the metal silver portion 32 of a desired thickness is formed by controlling the coating degree of the silver salt photosensitive layer ,, and can be processed by a shadow and/or a plating process. The thickness of the layer containing the conductive metal is (4), and therefore, it is also possible to easily form a thickness of less than $μηη, preferably a conductive film (7) having a thickness of less than three. - Again, the conductive layer of the present embodiment In the method for producing the film 1A, the step of plating (4) is not performed. The reason for this is that the manufacturing method of the embodiment of the present embodiment can be coated with a silver salt photosensitive layer by a ratio of silver/binder. Adjustment is made to obtain a desired surface electric power P. Further, calendering treatment or the like may be performed as needed. (Durament treatment after development treatment) It is preferred to develop the silver salt photosensitive layer 30 after the development treatment The silver salt f layer 3G is immersed in the hard coating agent for the hard film treatment. As a hard film agent, the glutaric acid, the second brew, the 2, 3_ two knees M• two Wei, the two ^ 1 and the rotten Japanese Patent Laid-Open No. 2_141279, which is not used as a hard film agent. A functional layer such as an antireflection layer or a bar code layer is formed on the laminated conductive film 54 to be described later. Further, the present invention can be suitably disclosed in Tables 1 and 2 below. And the technical use of the international public booklet is used in combination, and the expressions such as "special opening", "number bulletin", and "number booklet" are omitted. [Table 1] 2004-221564 2004-221565 2007-200922 2006-352073 2007-129205 2007-235115 2007-207987 2006-012935 2006-010795 2006-228469 2006-332459 2009-21153 2007-226215 2006-261315 2007-072171 2007 -102200 2006-228473 2006-269795 2006-269795 2006-324203 2006-228478 2006-228836 2007-009326 2006-336090 2006-336099 2006-348351 2007-270321 2007-270322 2007-201378 2007-335729 2007-134439 2007-149760 2007-208133 2007-178915 2007-334325 2007-310091 2007-116137 2007-088219 2007-207883 2007-013130 2005-302508 2008-218784 2008-227350 2008-227351 2008-244067 2008-267814 2008-270405 2008-277675 2008- 277676 2008-282840 2008-283029 2008-288305 2008-288419 2008-300720 2008-300721 2009-4213 2009-10001 2009-16526 2009-21334 2009-26933 2008-147507 2008-159770 2008-159771 2008-171568 2008-198388 2008 -218096 2008-218264 2008-224916 2008-235224 2008-235467 2008-241987 2008-251274 2008-251275 2008-252046 2008-277428 [Table 2] 2006/001461 2006/088059 2006/098333 2006/098336 2006/098338 2006/ 098335 2 006/098334 2007/001 〇〇r Next, the conductive film of the second embodiment is also used as an electrode of a touch panel or the like. As shown in FIG. 12, the conductive film 1% includes a transparent substrate 12; Formed on the transparent substrate 12; the conductive portion 14 is formed by the thin metal wires 16 formed on the adhesive layer 62; and the core of the transparent cover layer 6 is formed to coat the conductive portion Η with the portion where the adhesive layer Q is exposed . In particular, the difference between the refractive indices of the adhesive layer 62 and the transparent coating layer 64 is 0.1 or less, more preferably _ or less, and more preferably Q Q5 or less. In the 26 201232632 conductive film survey, the above-mentioned corrugation suppressing portion % can also be formed. This side will be described with reference to the manufacturing method of Fig. 13A to Fig. 13C. The iridium electric film 10b First, as shown in Fig. UA, the gold subsequent layer 62 of the conductive material is attached to the main surface 12a of the transparent substrate U. = The metal pouch 66 as follows is attached to the adhesive layer 62, and the bonding surface to which the layer 62 is bonded has been coarsely rounded. Thereby, the metal; = = the shape of the face is transferred to the backing layer 62 and the gold is as shown in Fig. 13B. 'The part of the metal foil 66 which is engraved by the chemical name is divided by the m 2 feed Retuso 12〇 Secondly, a conductive pattern 12 is formed, and the conductive pattern 120 includes a metal pig 66 having a line width of 9 (metal fine 16) and a conductive portion 形成 having a degree of 3 μm. That is, the portion of the conductive pattern 120 and the exiting layer 62 is covered by the transparent cladding layer 64 by the thin metal strip 16 at ==, which is the refractive index of the layer 64 of the transparent coated sound 64. The difference is 〇.1 or less. θ /, since the rough surface shape of the bonding surface of the metal case 66 is transferred to the portion of the bonding layer 62 where the metal II 66 has been removed, the light is scattered, thereby licking the stomach. #; ', 止古,心心 However, the coating layer 64 of the present embodiment is coated on the above-mentioned coarse wheel surface shape, and the difference in refractive index between the transparent cladding layer 64 and the adhesion layer 62 is qi Hereinafter, since the diffuse reflection in the == plane shape is suppressed to the minimum, the expression 27 201232632 In the above manufacturing method, the conductive pattern 120 formed on the transparent substrate 12 has a line width of 9 μm or less and a thickness of 3 μm. The following fine metal wires 16 also have an effect of making the conductive pattern 12〇 less visible to the naked eye. Next, a preferred embodiment of the constituent members of the conductive film 10b of the present embodiment will be described below. [Transparent Substrate 12] The transparent substrate 12 is a polyester comprising polyethylene terephthalate (PET), polyethylene naphthalate or the like, polyethylene, polypropylene, polystyrene, Polyolefins such as E+VA, polyvinyl chloride, polyvinylidene chloride, etc., polypyrene, polypyrrole, polyglycolic acid vinegar, polyamide, polyaniline, acrylic resin, etc. The plastic film has a total visible light transmittance of preferably 70% or more. The transparent substrate 12 can be colored without hindering the function of the touch panel, and the transparent substrate 12 can be used in a single layer. However, a multilayer film having a film of two or more layers may be used. Among them, poly-p-benzoic acid ethyl alcohol is the best in terms of transparency, resistance to education, rationality, and price. If the thickness of the transparent substrate 12 is thin, the handleability is not good. If the thickness of the moon base 12 is thick, the transmittance of visible light is lowered. Therefore, the thickness of the transparent substrate 12 is higher than that of the 透明1〇1 W Good for 5 μιη~200 μιη. Further preferably, μΠ1 to 100 handsome is more preferably 25 μm to 50 μmη.

[金屬細線16J :乍為金屬細線16，可使用銅、鋁、鎳、鐵、金、銀、 鑛鋼、嫣、鉻、以及鈦等的金屬内的1種金屬，或可使 28 20123263¾ ”上的金屬加以組合而成的 性、電路h的料㈣方面考慮，金電 控面板的魅，該觸㈣板的電極較料3 ’、、、觸 下的金箔。 子戾為3 μηι以 當使用銀作為金屬細線16時，為[Metal thin wire 16J: 乍 is a thin metal wire 16, which can be used in a metal such as copper, aluminum, nickel, iron, gold, silver, ore, bismuth, chrome, and titanium, or can be used on 28 201232633⁄4 ” The metal is combined with the material, the material of the circuit (4) is considered, the charm of the gold electric control panel, the electrode of the touch (four) board is 3', and the gold foil touched. The sub-戾 is 3 μηι for use. When silver is used as the thin metal wire 16, it is

作於开Hi案12G之前或之後進行黑化處理即可， 採用的案120之後，可使用印刷配線板領域中所 3 =進行上述黑化處理。例如於亞氯酸J 容二 (15 g/L)、以及磷酸三鈉（12 g/L)的水 ；：ίΙ/Χ95ΐ:進行2分鐘的處理，藉此，可進行上述黑 作為使金屬細線16密著於透明基體丨 隔著以丙稀酸系樹脂或=樹: 的膜^刀的接者層62來進行貼合。當必須使金屬細線16 (sputteri^ 盈電解雷Γ p g method)、化學蒸鍍法、 了 電鍍法/電鍍法等的薄膜形成技術中的丨個或2個以 的^加以組合’藉此，可使金屬細線16的 [導電圖案120] 工性I為於透明基體12上形成導制案12G的方法，自加 A體19方面考慮，有效果的是如上述製造方法般，於透明 二上形成金屬箔66之後，藉由化學蝕刻製程來形成 、’屬細線16形成的導電圖案120。此外，存在如下的方 29 201232632 法等，該方法是使用描繪有導電圖案120的遮罩，對配置 於透明基體12上的感光性樹脂層進行曝光、顯影，將無電 解電鍍或電鑛加以組合’從而形成由金屬細線16形成的導 電圖案120。應用於觸控面板的導電圖案120的例子後述。 [接著層62] 例如可使用環氧系的接著層、或丙烯酸系的接著層作 為接者層62。 [透明包覆層64] 對於本實施形態的製造方法所製作的導電膜1〇b，用 以將導電圖案120予以包覆的透明包覆層64與接著層62 的折射率之差設為0.1以下。原因在於：若接著層62^透 明包覆層64的折射率不同，則可見光透射率會下降，^折 射率之差為0.1以下，可見光透射率的下降程度小，且良 好。 當透明基體12為聚對苯二甲酸乙二醇酯（n=1 575 折射率）肖’作為滿足如上所述的要件的透明包覆舞6 的材料:可使用：雙盼八型環氧樹脂或雙酴F型環氧^旨 四羥基苯基？财環氧翻旨m漆 ::_脂、聚醇·聚乙二醇型環氧樹脂、聚二 =月曰^及脂環式·化雙料的環氧樹脂（折射料 =二除观樹脂以外，可列舉:天輸 15〇)、展 f 婦（n=1.52l)、聚以丁二烯（n = ^ )=„n=1.5G5〜Ul)、聚丁稀 丁二稀(n=15〇)、㈣三丁基*丁二 30 201232632t 烯（n=1.506)、聚-l，3-丁二烯（n=1.515)等的（二）烯 類，聚氧乙稀（n= 1.4563)、聚氧丙稀（n= 1.4495)、聚 乙烯基乙基醚（n= 1.454)、聚乙烯基己基醚（n=l.4591)、 聚乙浠基丁基趟（n=1.4563)等的聚趟類；聚乙酸乙稀酉旨 (n=1.4665)、聚丙酸乙烯酯（11= 1.4665)等的聚酯類； 聚胺基甲酸酯（n=1.5〜1.6)、乙基纖維素（η=ι·479)、 聚氣乙烯（η=1.54〜1.55)、聚丙烯腈（η=1·52)、聚曱基 丙烯腈（η= 1.52)、聚颯（η= 1.633)、聚硫醚（η= 1.6)、 笨氧樹脂（η=1.5〜1.6)等。上述材料會表現出較佳的可 見光透射率。 另一方面’當透明基體12為丙烯酸樹脂時，除了上述 樹脂以外，亦可使用：聚丙烯酸乙酯（η=1 4685)、聚丙烯 酸丁酯（η= 1.466)、聚丙烯酸-2-乙基己酯（11=1.463)、 聚丙烯酸第三丁酯（η=1.4638)、聚丙烯酸·3·乙氧基丙酯 (η=1.465)、聚氧羰基四甲基丙烯酸酯（η= 1 465)、聚 丙烯酸甲酯（η=1.472〜1.480)、聚曱基丙烯酸異丙酯（η = 1.4728)、聚曱基丙烯酸十二烷基酯（η=1 474)、聚甲 基丙烯酸十四烷基酯（η=ι.4746)、聚曱基丙烯酸正丙酯 U= 1.484)、聚甲基丙烯酸_3,3,5_三曱基環己酯（η== 1.484)、聚曱基丙烯酸乙酯（η= 1 485)、聚甲基丙烯酸_2_ 硝基-2-甲基丙基酯（η= 1 4868)、聚四氧羰基曱基丙烯酸 酯（η= 1.4889)、聚甲基丙烯酸_u_二乙基丙基酯（η== 1.4889)、聚甲基丙烯酸曱酯（η== 1 4893)等的聚（甲基） 丙烯酸酯。可根據需要，使2種以上的上述丙烯酸聚合物 31 201232632 共本，亦可混合地使用2種以上的上述丙烯酸聚合物。 而且，作為丙烯酸樹脂與丙烯酸樹脂以外的共聚樹 月曰，亦可使用：環氧丙烯酸酯、丙烯酸胺基甲酸酯、聚醚 丙烯if酯、以及聚酯丙烯酸酯等。尤其自接著性的方面考 慮，環氧丙烯酸酯、聚醚丙烯酸酯優異，作為環氧丙烯酸 酉曰叮列舉.1，6-己一醇二縮水甘油趟、新戊二醇二縮水 甘油峻、丙蝉醇二縮水甘油醚、間苯二盼二縮水甘油_、 己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、聚乙二 醇二縮水甘油醚、三羥曱基丙烷三縮水甘油醚、甘油三縮 水甘油醚、季戊四醇四縮水甘油醚、以及山梨糖醇四縮水 甘油醚等的（曱基）丙烯酸加成物。環氧丙烯酸酯於分子内 具有羥基，因此，可有效果地使接著性提高，可根據需要 而併用2種以上的上述共聚樹脂。成為透明包覆層64的主 成分的聚合物的重量平均分子量是使用〗，〇〇〇以上的分子 量。若分子量為1，000以下，則組成物的凝聚力過低，因 此，對於被接著體（透明基體12、接著層62、導電圖案 120)的密著性會下降。 作為透明包覆層64的硬化劑，可使用：三乙四胺、二 曱苯二胺、二胺基二苯甲烷等的胺類；鄰苯二曱酸酐、馬 來酸酐、十二烷基琥珀酸酐、均苯四甲酸二酐、二苯曱酮 四曱酸酐等的酸酐；二胺基二苯基砜、三(二曱基胺基曱基) 苯酚、聚醯胺樹脂、二氰基二醯胺、乙基曱基咪唑等。可 單獨地使用上述硬化劑，亦可混合地使用2種以上的上述 硬化劑。相對於100重量份的上述聚合物，於〇.1重量份 32 201232632 二内選擇上述硬化劑的交聯劑的添加 s份〜3G重量份的範圍内，選擇上述硬 =劑的父聯劑的添加量。若上述添加量不足q i重量份， =生匕:Γ广超過5〇重量份，則交聯過剩，有時會對 接者性產生不良影響。 亦可根據需要，將稀釋劑、塑化劑、抗氧化劑、填充 』、以及增黏解的添加賴配至本實卿態巾所使用的 透明包覆層64的樹脂組成物。接著，塗佈上述透明包覆層 64的樹脂組成物，以將透明基體12±的包含導電圖案12〇 的部分或整個面予以包覆，經由溶劑乾燥、加熱硬化步驟 之後’形成接著膜。上述接著膜的透明包覆層64可直接貼 附於液晶顯示裝置或有機電致發光（， EL)、無機EL等的顯示器’從而用作顯示器用的觸控面 板，或可貼附於預先描繪有鍵鈕（keybutt〇n)或數字等的 圖符（icon)或標記的壓克力板、玻璃板等的板或片材， 從而用作與顯示器獨立的鍵盤（keyb〇ar(j)或數字小鍵盤 用的觸控面板。 [應用於觸控面板時的應用例] 接著，一面參照圖14〜圖21，一面對如下的例子進行 說明，該例子是使用導電膜l〇a、導電膜10b來構成觸控 面板150的例子。再者，觸控面板150可為電阻膜式的觸 控面板，亦可為電容式的觸控面板。 觸控面板150包括感測器（sensor)本體152與未圖 示的控制電路（包含積體電路（Integrated Circuit ’ 1C)電 33 201232632 路等）。如圖14、圖15以及圖16A (或圖17A)所示，感 蜊器本體152包括：積層導電膜154，將後述的第1導電 祺10A與第2導電膜10B予以積層而構成；以及保護層 U6 ’積層於上述積層導電膜154上。積層導電膜154以及 保護層156例如配置於液晶顯示器等的顯示裝置157中的 顯示面板158上。第1導電膜i〇A以及第2導電膜10B包 含上述導電膜10a (參照圖1、圖2、及圖16A)或導電臈 l〇b (參照圖12、圖17A)。當自上表面來觀察時，感測器 本體152包括：感測器部160，配置於與顯示面板158的 顯示晝面158a相對應的區域；以及端子配線部ία (所謂 的額緣）’配置於與顯示面板158的外周部分相對應的區 對於應用於觸控面板150的第1導電膜1〇A而言，當 使用有圖2所示的導電膜1〇a時，如圖15、圖16A以及圖 U所示，包括第！導電部14A，該第i導電部14A形成於 第1透明基體12A (參照圖16A)的一個主面上。當使用 有圖12所示的導電膜l〇b時，如圖8、圖17A以及圖18 所不述第1導電膜10A包括：第1透明基體12A ;第 1導電部+MA ’由金屬細線形成，該金屬細線16隔著 1接著層62a而形成於上述第1透明基體12Α的一個主 ,12Μ上’以及第1透明包覆層64a，形成為將第1導電 ^ 14A與露出的第1接著層62a予以包覆，且與第1接著 g 62a的折射率之差為〇1以下。 如圖18所示，第1導電部14A包括：2個以上的第1 34 201232632 導電圖案1胤（包括網眼圖案2〇)，分別沿著第3方向（瓜 方向）延伸，且沿著與第3方向正交的第4方向u方向） 排列’且由包含多個格子的金屬細線16形成；以及第^ 補助圖案2GGA，由沿著各第i導電圖案12QA的周邊排列 的金屬細線16形成。 …第1導電圖案120A是由2個以上的第丄大格子2〇2A 沿者第3方向串聯地連接而構成，各第】大格子2〇2A分 別是將2個以上的小格子綱加以組合 =格子舰的邊_圍，形财不與第1大格子观A 連接的上述第1補助圖案2〇〇A。 於相鄰接的第i大格子2G2A之間，形成有將上述第i 大格子舰予以概連接的第丨連接部施A。配置中格 :208而構成第i連接部驗，該令袼子雇為將n佩n 為大於1的實數）小格子2〇4排列於第2方向（y方向） =的大小。於第1大格子搬A的沿著方向（χ方向） 2=中的42〇8相鄰接的部分，形成有第1缺口部 :而是將小格子204的-條邊予以 二小格子204設為最小的正方形狀。於圖 具加爾㈣排列於第 性丄==丄導電圖案亀之間’配置有電 (以包括··多條第1輔— 為轴線方向），沿著第〗大格子2G2A的邊 35 201232632 篇中的沿著第1方向的邊203a排列；多條第1輔助線 214A(以第1方向作為轴線方向），沿著第1大格子202a 的邊2〇3a中的沿著第2方向的邊2G3a排列；以及 彼此相對向地配置有2個第1L字狀圖案216A，該2個第 1L字狀圖案216A於第丨絕緣部212A中，分別由2條第 1輔助線214A組合為l字狀而成。 ’、 各第1輔助線2UA的軸線方向的長度為沿著小格子 二邊的4/5町的長度，較佳為該-條邊 的長又。又，各第1辅助線214A形成於盥第J =格子2G2A她規定轉的位置。規定距 沿著 ==的内周的—條邊的長度，減去第1辅助線= 向的長度所得的長度。例如若第1輔助線21从 4Λ 1/2向1長度為沿著小格子2〇4的内周的—條邊的 錢定麟為㈣小格子綱_周的一 條邊的1/5或1/2。 Π ^ 如下’以上述方式構成的第1導電膜10A為 ’在存在於各第1導電圖案120A的一個 ^側^丨大格子舰的開放端不存在第丨連接部 i大格子HZ1 12〇A的另一個端部側的第 H it 部’經⑷接線部购而電性連接 於由金屬細線16形成的第丨端子配線圖案驗。 ==、用於觸控面板150的第1導電膜i〇A如圖Μ 以及圖15所不，上述多個第1導雷 測器部160相對應的部分，自各第接$ A卜列於與感 1刀曰合弟1接線部184a導出的多 36 201232632 排列於端子配線部⑹。 面所見’帛1導電膜10八的外形為自上表 =所見的長方形狀，感測器部_ γ 緣部，在其長度方向中央部分’多_ 条長邊側的周 成於上述一條長邊的：产=夕個第1端子188a排列形 —條具、嘉r县土的長又方向。又，沿著感測器部160的 方5夕/近第1導電膜1〇A的-條長邊的長邊:η 線部18: = 1接線部18知排列為直線狀。自各第1接 : 的第1端子配線圖案186a被引向第1導電 雁沾楚1、條長邊的大致中央部，且分別電性連接於相對 應的第1端子188a。 對於應用於觸控面板15〇的第i導電膜i〇a而言，當 =用有圖2所示的導電膜施時，如圖15、圖i6A以及圖 所不’包括第1導電部14A，該第i導電部i4A形成於 =1透明基體12A (參關16A)的—個主面上。當使用 有圖12所示的導電膜通時，如圖15、圖17人以及圖18 d ’上述第1導電膜包括：第i透明基體12A;第 導電部UA ’由金屬細線b形成，該金屬細線16隔著 弟1縣層62a而形成於上述第丨透明基體m的一個主 面12Aa上，以及第i透明包覆層6知，形成為將第丄導電 °M4A與露出的第1接著層62&amp;予以包覆，且與第1接著 層62a的折射率之差為0.1以下。 另一方面’對於第2導電膜1GB而言，當使用有圖2 所不的導電膜10a時，如圖15、圖⑽以及圖19所示， 37 201232632 包括第2導電部14B，該形成於第2透明基體12B的一個 主面上。當使用有圖12所示的導電膜1〇b時如圖15、 圖17A以及圖19所示’上述第2導電膜1〇B包括：第2 透明基體;第2導電部HB，由金屬細線16形成，該 金屬細線16隔著第2接著層62b而形成於上述第2透明基 體12B的-個主面12Ba上；以及第2透明包覆層64b,$ 成為將第2導電部18B與露出的第2接著層62b予以包 覆，且與第2接著層62b的折射率之差為〇丨以下。 第2導電部14B包括：2個以上的第2導電圖案12〇b (包括網眼圖案20)，分別沿著第4方向（n方向）延 且沿著第3方向（m方向）排列，且由包含多個格子的金 屬細線16形成；以及第2補助圖案2〇〇B，由沪著各 導電圖案120B的周邊排列的金屬細線16形成f 導電隨議是由2個以上的第2大格子細 者第4方向串聯地連接而構成，各 別是^個以上的小格子204加以組合而構成 ^格子202B的邊的，形成有不與第2大格子綱 連接的上述第2補助圖案2〇〇b。 大格目的第2大格子纖之間，形成有將上述第2 子208而播士势以電性連接的第2連接部2〇6Β。配置中格 子208而構成第2連接 6Β Τ才 ㈣的與t格信相議部分m方口向部） 38 201232632 210B’該第2缺口部2l〇B是將小格子2〇4的一條 切除而成。 又，於相鄰接的第2導電圖案12〇B之間，配 性絕緣的第2絕緣部212b。 上述第2補助圖案2_包括：多條第2輔助線214B (以第1方向作為轴線方向）’沿著第2大格子2咖 203b令的沿著第2方向的邊通排列；多 (以第2方向作為軸線方向），沿著第2大格子補= 的邊203b中的沿著第丨方向的邊遍排列；以及圖案， 彼此相對向地配置有2個第2L字狀圖案216 個 二字狀圖案纖於第2絕緣部簡中 二第 輔助線2HB組合為L字狀而成。 田條第2 的轴助線2MA同樣地’各第2辅助線214B 45tT Λ/為沿著小格子綱的内周的—條邊的 Μ·，車乂佳為該一條邊的1/2以下的長度。又’各第2 形，與第2大格子2㈣相隔規定距離二 沿著;Μ·4:=ί214Α同樣地’該規定距離亦是自 測的車mi邊的長度，減去第2辅助線 214B的轴線方度所付的長度。例如若第2輔助線 邊的4/5或1/2 ^、卜長度為沿著小格子2〇4的内周的一條 的-條邊的1/5’或1/2返規定距離為沿著小格子204的内周 如下所示’以上述方式構成的第2導電膜10B為 如下的秘，即’在存在於各第2導電_丨簡的一 $ 39 201232632 端部側的第2大格子2G2B關放端不存在第2連接部 2_。另-方面’存在於第奇數個的各第2導電圖案删 的另-個端部側的第2大格子2G2B的端部、以及存在於 第偶數個的各第2導電圖案的—個端部側的第2大 格子2_的端部，分別經由第2接線部18扑而電性連接 於由金屬細線16形成的第2端子配線圖案18邰。 -亦即，應用於觸控面板150的第2導電膜_如圖Μ 所不’多個第2導電圖案膽排列於與感測器部⑽相 對應的部分，自各第2接線部i84b導出的多個第2端子配 線圖案186b排列於端子配線部m2。 如圖14所示，於端子配線部162中的第2導電膜_ 的-條長邊側的周緣部，在其長度方向中央部分，多個第 ^端子188b排列形成於上述一條長邊的長度方向。又沿 著感測器部160的一條短邊（最靠近第2導電膜的一 條短邊的短方向），多個第2接線部例如第 奇數個第2接線部祕)㈣為直線狀，沿魏;職部⑽ 的另-條短邊（最靠近第2導電膜的另—條短邊的短 邊m方向）’夕個第2接線部184b (例如第偶數個第2 接線部184b)排列為直線狀。 多個第2導電圖案120B中，例如第奇數個第2導電 圖案12GB分別連接於相對應的第奇數個第2接線部 獅，第偶數個帛2導電圖t 12〇B分別連接於相對應的 第偶數個第2接線部184b。自第奇數個第2接線部難 導出的第2端子配線圖案18 6 b以及自第偶數個第2接線部 201232632 •J ^ I —JJit 184b導出的第2端子配線圖案^的被引向第2導電膜1〇Β 的一條長邊的大致中央部，且分別電性連接於相對應的第 2端子188b。 再者，亦可使第1端子配線圖案18如的導出形態與上 述第2端子配線圖案186b的導出形態相同，且使第2端子 配線圖案186b的導㈣態與上述第丨端子喊圖案肠 的導出形態相同。 第1大格子202A以及第2大格子202B的一條邊的長 度較佳為3 mm〜10 mm，更佳為4 _〜6賴。若一條邊 的長度不足上述下限值，則檢測時的第i大格子2〇2a以 及第2大格子2_的電容會減少，因此，產生檢測不良 的&quot;I月bf生升向。另一方面，若上述一條邊的長度超過上述 ^限值’則存在位置檢測精度下降之虞。自同樣的觀點考 慮，構成第1大格子202A以及第2大格子2〇2B的小格子 204的一條邊的長度較佳為5〇 μιη〜500 μιη。當小格子2〇4 的一條邊的長度處於上述範圍時，可更良好地保持透明 f生且g女裳至顯示裝置157的顯示面板158上時，可對 顯示内容進行識別而無不協調感。 又，第1導電圖案120A (第i大格子2〇2A、中格子 208)的線寬、第2導電圖案12〇B (第2大格子2咖、中 格子208)的線寬、第！補助圖案魏(第i輔助線2i4A) 以及第2補助圖案200B (第2輔助線214B)的線寬分別 為1 μηι〜15 μιη。於該情形時，可與第i導電圖案i2〇A 的線寬或第2導電圖案1施的線寬相同，亦可與第ι導 201232632 第2導電圖案_線寬不同。然 第1補助圖案200A以及钕，乐Z守电圓系 亦即，金屬細線ί 補助圖案2〇〇B的各線寬相同。 隔（鄰接的金屬細線！6 ^ f寬較佳為1 μΙΏ〜15哗。線間 2導電膜U)B的開ί率考慮’第1導電膜1〇Α以及第 二〇 卞？乂佳為85%以上。 上而形成:嫌㈣電膜· 置第1導電圖案120A與第）道圖20所不，设為交叉地配 而言為如下的形態，即1 =圖案12〇B的形態，具體 部206A與第2導電圖亲_導電圖案12〇A的第1連接 1透明基體12A (參昭圖16A\的第2連接部2_隔著第 導電部14A的第】絕緣部212a^ 17A)而相對向，第1 絕緣部2UB隔著第j=2導電部1犯的第2 當自上表面來對積層導=而相對向。 所示，成為如下的形態，即，以 ^丁觀察時，如圖20 的第1大格子20M的間隙予以填埋1導電膜l〇A 導電膜_的第2大格子2㈣。此^方式，排列有第2 與第2大袼子2〇2B之間，形成有第 '第1大格子2〇2A 第2補助圖案2_相對向而成的％^助圖案200A與 218如圖21所示，第1輔助線214A^案218。組合圖案 第2輔助線214B的第2軸線22〇B 一 1軸線220A與 214A與第2輔助線214B不重疊 致且第1辅助線 及弟1輔助線214A的 42 201232632 一端與第2辅助線214B的一 — 2〇4的-條邊。亦即，組合_ 冓成小格子 的小格子2 0 4的形態。結果，U為：5有2個以上 W進行觀察時，如圖2G所示1 =面來對積層導電膜 滿有多個小格子綱。 成為如下的形態，即，鋪 線處當未形絲1輔助線祕以及第2輔助 、^mb時，會形成與組合圖案21 = 域，藉此，會產生如下的門s 見度相田的工白£ 的纽、P ’導致第1大格子纖 了避免上㈣子2〇2B的邊界顯眼，視認性變差。為 晶2 慮將第2大格子獅的邊雇重 的各條邊咖來消除空白區域，但 二ί = Ϊ精度的極小的偏差，直線形狀彼此的重疊 心的寬度變大（線變粗），藉此 導致第1大格子202A絲下的問通即 認性變差。 ”第A格子202B的邊界顯眼，視 相對於此’於本實施形態中，如上所述，由於第】辅 ί ί ΓΓ與第2辅助線214B重疊，第1大格子2〇2A與 弟2大格子2G2B的邊界不顯眼，視雛提高。 二如上所述，例如當將第2大格子搬B的邊遍 f第1大格子202A的邊2〇3a而消除空白區域時，第 〇ft子細的邊膽位於第1大格子腿的各條邊 a的正下方。此時，第j大格子2〇2a的邊施以及第 大格子2㈣㈣203b亦分別作為導電部分而發揮功 能’因此，於第1大格子202A的邊2〇3a與第2大格子2〇2b 43 201232632 的邊203b成托電容，科 資訊而言是作為雜訊(noise)成„於電何 ^取刀而起作用，會引起S/N 比』者地下降。而且，由於在各第i大格 大格子誦之間形成寄生電容，因此，成生第電 容並聯地連接於第i導電_ 12Q ，為夕個寄生電 5L:目 時間常數變大的問題。* CR時 間吊數k大，則供給至第i導電0案12 :漏）的電壓信號的波形的上升_變慢，二2 ϊί: 内’有可能幾乎不產生用於位置檢測的 電场。又，來自第！導電_ 12GA以及第2導電圖案趣 的傳遞##u的波形的上升時間或下降時間亦變慢，於規 的掃描時間内，有可能無法捕捉傳遞信號的波形的變化。 此會使檢_度下降，錢響應速度下降。亦即，為了實 現檢測精度的提高、及響應速度的提高，只能使第！大格 子2〇2A以及第2大格子2〇2b的數量減彡（分解能力減 小）’或使適應的顯示畫面的尺寸減小，從而會產生如下的 問題’即’無法適用於例如B5版、A4版、及這些版面以 上的大畫面。 相對於此，於本實施形態中，例如，如圖16A所示， 使第1 A格子202A的邊203a與第2大格子202B的邊2〇3b 之間的投影距離Lf與小格子2〇4的一條邊的長度大致相 同。因此，第1大格子202A與第2大格子202B之間所形 ，的寄生電容變小。結果，CR時間常數亦變小，從而可 實現檢測精度的提高、及響應速度的提高。再者，亦存在 44 201232632 如下的情形’即，於第i輔助線214a :，218中，第i輔助線214a的端 、=4B的端部分別相對向，但第i輔助線214a= 1大格子202A連接，與該第1大格子202A電性 2辅助線浦亦並不與第2大格子難連接、=第2 緣，因此’不會導致第1大格子 ”第2大格子2_之間卿成的寄生電容增加。 較佳為與根據第1大格子2G2A以及第2大格子2〇2b 的尺寸相比較，更根據構成第丨大格子2Q2a以及第2大 的小格子綱的尺寸（線寬以及—條邊的長度） 來適虽地設定上述投雜離Lf 佳轉。於該情形時， 若相對於具有固定的尺寸的第丨大格子2〇2A以及第2大 格^ 202B ’小格子204的尺寸過大，則透光性提高，但傳 遞k號的動態範圍（dynamic range)變小，因此，有可能 會引起檢測感度的下降。相反地，若小格子綱的尺寸過 小，則檢測感度提高，但線寬的減小程度有限，因此，透 光性有可能會變差。 因此，當將小格子204的線寬設為！ Mm〜9 μηι時， 上述技影距離Lf的最佳值（最佳距離）較佳為1〇〇 〜 〇〇 μηι進而較佳為2〇〇 gm〜3〇〇 。若使小格子204 ，，寬變窄，則亦可使上述最佳距離縮短，但電阻會逐步 變鬲，因此，即便寄生電容小，CR時間常數亦會變高， 結果，有可能會引起檢測感度的下降、及響應速度的下降。 因此’小格子204的線寬較佳處於上述範圍。 45 201232632 而且，例如基於顯示面板158的尺寸或感測器部 的尺寸與馳位置㈣的分解能力（轉脈衝（pu㈤的 脈衝週期4) ’來決定第1大格子2Q2A以及第2大格子 202B的尺寸以及小格子2()4的尺寸以小格子綱的線寬 為基準’算出第1大格子2G2A與第2大格子2㈣之間的 最佳距離。 又，於本實施形態、中，使用了形成有波紋抑止部％ 的導電膜10a或形成有波紋抑止部％的導電膜，因 此’例如’如圖卜圖3等所示，對於構成第i導電部14A 的第1導電圖案120A (網眼_ 2〇)以及構成第2導電 部14B的第2導電圖案i2〇B (網眼圖案2〇)而言，且有 上述關係的波紋抑止部26位於與網眼圖案2〇的交叉部、％ 相鄰接的位置。結果’可使透過第i導電部14A以及第2 導電部14B的光的積分量在交又部24與交又部24以外的 部分大致相同，從而可使由波紋等弓丨起的畫質劣化程度為 最小。亦即，顯示晝面不會因波紋而模糊不清，可實現 不品質的提高、及操作性的提高。而且，由於將金屬細線 16的線寬設為i吨〜15卿，將金屬細線16的線間隔設 為50哗〜500哗’因此，可同時具有高透光性與良好的 視認性（網眼圖案20不易顯眼）。而且，於本實施形綠中， 存在上述波紋抑止部26，藉此，該部位可使電氣感^力 提高，因&amp;，可使觸控位置的檢測能力提高。尤其對於電 容式觸控面板而言，由於電容的_能力提高，因此較佳。 亦即’波紋抑止部26亦作為觸控位置檢測能力提高部而發 46 201232632 —γΐί 揮功能。 _又’使用圖12所示的導電膜勘，藉此例如，如圖17Α 所不，與第1接著層必的折射率之差為〇 ]以下的第！ 透明包覆層64a，包覆於第1導電膜1GA的第1導電圖案 =0A與露出的第1接著層62a上，與第2接著層咖的折 射率之差為αΐ以下的第2透明包覆層64b，包覆於第2 導電膜1GB的第2導電圖案12GB與露出的第2接著層_ 上’因此’第1接著層仏以及第2接著層_上所形成 的凹凸面或城φ形狀中的漫反射被抑觀最小限度，當 形成積層導電膜154時’該積層導電膜154整體 透明性。 而且’當將上述積層導電膜154用作觸控面板15〇時， 將保護層156積層於第1導電膜1GA上，將自_丨導電膜 i〇A的多個第i導電圖案12GA導出的第1端子配線圖案 186a、與自第2導電膜1〇B的多個第2導電圖案i施導 出的第2端子配線醜186b連接關如控制電路，該控制 電路對掃描進行控制。 可較佳地採用自身電容方式或相互電容方式作為觸控 位置的檢測方式。亦即，若制自身電容方式，則依序將 用於觸控位置檢測的電壓信號供給至第丨導電圖案 120A，且依序將用於觸控位置檢測的電壓信號供給至第2 導電圖案1施。因指尖與保護㉟⑼的上表面發生接觸或 接近於該上表面，與觸控位置相對向的第i導電圖案i2〇a 以及第2導電圖案120B與GND (接地（ground))之間的 47 201232632 Λ 電容會增加，因此，來自上述第丨導電圖案職以及第2 導電圖案12GB的傳遞信號的波形，成為與來自盆他導電 號的波形不同的波形。因此，控制電路基於 信號來對觸控位置進行運算。另-方面，於相互電Ϊ = 的情形時，例如依序將用於觸控位置檢測 至第i導電圖案隐，且依序對第2導電圖案咖以進; 感測（sensing)(檢測傳遞信號）。因指尖與保護層156的 上表面發生闕或接近於該上表面，手指的浮動電容會並 聯地增加至與觸控位置相對向的第丨導電圖案12〇a與第2 導電圖案12GB之間的寄生電容，因此，來自上述第2導 電圖案120B的傳遞信號的波形，成為與來自其他第2導 電圖案120B的傳遞信號的波形不同的波形。因此，控制 電路基於供給著電壓信號的第i導電圖案12〇A的順^、 與所供給的來自第2導電圖案120B的傳遞信號，對觸控 位置進行運算。藉由採用如上所述的自身電容方式或相^ 電谷方式的觸控位置的檢測方法’即便使2個指尖同時邀 保護層156的上表面發生接觸或接近於該上表面，亦可檢 測出各觸控位置。再者，與投影型電容方式的檢測電路相 關的先前技術文獻有美國專利第4,582,955號說明書、美 國專利第4,686,332號說明書、美國專利第4,733,222號說 明書、美國專利第5,374,787號說明書、美國專利第 5,543,588號說明書、美國專利第7,〇3〇,860號說明書、以 及美國公開專利2004/0155871號說明書等。 48 201232632 於士述積層導電獏154巾，當使用有圖2所示的導電 的-:主面如升圖』=16Α所示’於第1透明基體12A -個主面電部14A ’於第2透明基體12B的 於第1透明基體 情形時，主面形成第2導電部14Β。於該 读成為如下的形態，即，第2透明基體12Β不存在， 日月基體12Α積層於第2導電部14BJl，且第 與第2層於第1透明基體12A上。又，第1導電膜10A Lam電膜—之間亦可存在其他的層，若第1導” 14Aj 22 14B之間為絕緣狀態’則該第1導電部 ，、第2導電部14β亦可相對向地配置。 於上述的積層導電膜154 _，當使用有® U^ :導電膜叫如圖15以及圖17A所示，：1， 基體12 A的-個主面形成第丨導電部2 4 a， 明 體12B的-個主面形成第2導電部i4B ,此 月基 ΠΒ所示’於第！透明基體UA的―個^…、可j 第1接著層62a而形成第1導電部14A， a ’隔著 12A的其他主面12Ab，隔著第2接著声6透明基體 導電部14B。於該情形時，成為如下的“:形^第2 明基體12B不存在，第丨透明基體UA積層 ^透 14B上，且第！導電部14A積層於第！透明，電部 於該情形時，亦以將第〗導電部14A與露^ =。 必予以包覆的方式，形成^透明包覆層…，且 49 201232632 2導電部14B與露出的第2技牮 m 9 接層予以包覆的方式， 形成第透月包覆層64b。又，第1導電膜10A盘第2導 電膜·之間村存在其他⑽，若第 _ 2導電部⑽為絕緣狀態，則該第丨導電部14^與第2t 電部14B亦可相對向地配置。 又，如圖14所示，將第1導電膜10A與第2導電腺 10B加以組合來製作積層導電膜1M，而且，將該積層導 電膜裝入至顯示|置157的齡面板158，藉此來製作嘴 控面板150。於該情形時，較佳為於第1導電膜10A與第 2導電膜10B的例如各角落（corner)部形成第丨對準j票記 (alignment mark) 194a以及第2對準標記194b，該第i 對準標記194a以及第2對準標記194b是第1導電膜1〇八 與第2導電膜i〇B貼合時所使用的定位用的標記。當將第 1導電膜10A與第2導電膜10B予以貼合而形成積層導電 膜154時’上述第1對準標記194a以及第2對準標記19处 成為新的複合對準標記，該複合對準標記亦作為將上述積 層導電膜154設置於顯示面板158時所使用的定位用的對 準標記而發揮功能 於上述例子中，表示了將第1導電膜10A以及第2導 電膜10B應用於投影型電容方式的觸控面板15〇的例子， 此外，亦可應用於表面型電容方式的觸控面板、或電阻膜 式的觸控面板。 作為形成於第1導電膜10A或第2導電膜10B的導電 圖案’除了可使用上述導電圖案之外，亦可使用如下的導 201232632. 電圖案，該導電圖案是利用絕緣部來呈帶狀地對網眼圖案 進行劃分，且平行地配置有多個上述網眼圖案。 亦即，亦可包括如下的2個以上的帶狀的第1導電圖 案作為第1變形例的圖案，上述2個以上的帶狀的第1導 電圖案分別自端子沿著第1方向（X方向）延伸，且沿著 與第1方向正父的第2方向（y方向）排列。又，亦可盘 第1變形例相反地，包括2個以上的帶狀的第2導電圖案 作為第2變形例的圖案，上述2個以上的帶狀的第2導電 圖案分別自端子沿著第2方向（y方向）延伸，且沿著第1 方向（X方向）排列。各導電圖案可設為如下的圖案，該 圖案是排列多個利用金屬細線來將一個開口部予以包圍的 封閉的多個網眼形狀而成。作為網眼形狀，例如可列舉正 方形狀、長方形狀、以及正六角形狀等。 而且’使上述第1變形例的圖案與第2變形例的圖案 例如隔著透明基體而重疊，藉此，成為使帶狀的第1導電 圖案與帶狀的第2導電圖案交叉的形態，此形態若使用於 例如投影型電容方式的觸控面板的導電圖案，則較佳。 以下，列舉本發明的實例，更具體地對本發明進行說 明。再者，只要不脫離本發明的宗旨，則可適當地將以下 的實例所示的材料、使用量、比例、處理内容、以及處理 順序等予以變更。因此，不應根據以下所示的具體例Ϊ限 定性地對本發明的範圍進行解釋。 [第1實例] 第1實例對實例i〜實例32、比較例卜比較例2〇、 201232632 • - ~ ι— 參1例1〜參考例8的導電膜的表面電阻以及透射率進行 測定，對波紋以及視認性進行評價。將實例丨〜實例32、 比較例1〜比較例20、參考例丨〜參考例8的細項、測定 結果以及評價結果表示於下述表3以及表4中。 &lt;實例1〜實例32、比較例丨〜比較例20、參考例！ 〜參考例8&gt; (鹵化銀感光材料） 調衣含有球等效直控（sphere-equivalent diameter)平 均0.1 μιη的破溴氣化銀粒子（〗=〇 2莫耳％、Br=40莫耳 %)的乳劑，該乳劑相對於水媒體中的15〇g的Ag而含有 lO.Og的明膠。 又，向該乳劑中添加K^Rl^Br9以及KaIrCl6以使濃度 達到10·7 (莫耳/莫耳銀）’從而於溴化銀粒子中摻雜Rh離 子及Ir離子。向該乳劑中添加NazPdCU，進而使用氣金酸 及硫代硫酸鋼進行五硫化二録增感後，與明膠硬膜劑一同 塗佈至第1透明基體12A以及第2透明基體12B (此處均 為聚對苯二曱酸乙二醇酯（PET))上，以使銀的塗佈量為 10 g/m2。此時，Ag/明膠體積比為2/卜 於寬度30 cm的PET支持體上以25 cm的寬度進行2〇 m的塗饰，以殘留塗佈的中央部24 cm的方式將兩端各切 除3 cm，獲得輥狀的鹵化銀感光材料。 (曝光） 鹵化銀感光材料的曝光是將使用日本專利特開 2004-1224號公報的發明的實施形態揭示的數位微鏡裝置 52 201232632^ (digital micromirror device，DMD )的曝光頭排列成 25 cm 寬度，且使曝光頭以及曝光台彎曲配置，以使雷射光於感 光材料的銀鹽感光層30上成像，安裝好感光材料送出機構 以及捲繞機構後，利用連續曝光裝置來進行曝光，上述連 續曝光裝置設有具有緩衝作用的彎曲，以使得曝光面的張 力控制以及捲繞、送出機構的速度變動不會影響曝光部分 的速度。曝光的波長為400 nm，光束形狀為12 μπι的大致 正方形’且雷射光源的輸出為1()〇pJ。 曝光是將隨後成為金屬細線16的細線圖案間的間隔 (線間隔）設為300 μιη，並依照下述設定來進行，以於銀 鹽感光層30上曝光出網眼圖案20。構成網眼圖案2〇的金 屬細線16的線寬、交又部24的面積Sa、波紋抑止部26 的面積Sb等示於表3。 為了對銀鹽感光層30進行曝光，以成為鄰接於網眼圖 案20的交叉部24而形成有波紋抑止部26的圖幸，接用蚀 3個曝光頭連動的曝光方式。 〃 亦即’第1曝光頭-方面使雷射光束沿著與銀鹽感光 層30的搬送方向成直角的方向往復運動，一方面照射單一 光束而於銀鹽感光層30上描繪曝光圖案。因此，^ 線狀地對銀鹽感光層30進行45。斜向描繪，該斜線狀3盘 銀鹽感光層30的搬送速度、與曝光頭的朝向與搬送 直角方向的移動速度之比相應，當該光束到達銀_ ; 1〇二部時’連動於曝光頭的往復運動而沿著反; 53 201232632 -， -a- 而於銀鹽感光層3〇上描緣曝光圖案她第== 第，:== μ 、月因此，當第1曝光頭自銀鹽感光 “二，部進行斜向描繪時，第2曝光頭自銀鹽感光 = 部朝著與第1曝光頭的移動方向相反的方向 成網_ :鹽_ 3G上進行反斜向描繪。如此，形 一第3，光頭相對於上述第丨曝光頭及第2曝光頭的雷 射光束著與銀縣光層3()的搬送方向餘肖的方向往 復運動的飾鱗辆而為目定㈣絲，以料頭通過 上述第1曝光頭及第2曝光頭的雷射光束的交叉部的方式 而a又。右要沿著銀鹽感光層3〇的寬度方向而描繪多個交叉 部，則設置與其數量對應的第3曝光頭。自第3曝光頭照 射的雷射光束將f射振設定成，僅在第3曝光頭通 過上述交又料，進行短時間關歇雷射絲照射。又， 照射時間被設定為可描繪出期望尺寸的波紋抑止部26的 時間。 (顯影處理） • 1 L顯影液的處方 對苯二酚 20 g 亞硫酸納 50 g 碳酸鉀 40 g 54 201232632 ^ I I ✓ |^lt 乙一胺四醋酸 2 g 漠化_ 3g 聚乙二醇2000 1 g 氫氧化卸 4g ΡΗ 調整至10.3 • 1 L定影液的處方 硫代硫酸錄液（75%) 3 00ml 亞硫酸録一水合物 25 g 1，3-丙二胺四醋酸 8g 醋酸 5g 氨水（27%) 1 g PH 調整至6.2 使用富士軟片公司製造的自動顯影機Fg ㈣、錢理劑完成曝光的感光 材枓進仃處理，即，於饥進行3G秒的顯影，於3代進 仃23秒的溶合’進行2G秒的水洗流水（5 L/分鐘）處理。 (參考例1) 已製作的參考例1的導電膜的網眼圖案20的線寬為 〇.5/m (線間隔為3〇〇 μιη)，交叉部24的面積％為〇乃 μιη ’波紋抑止部26的面積Sb為〇 〇〇5〇哗2。 (參考例2〜參考例4) 將波紋抑止部26的面積sb分別設為0.2250 μιη2、 0.2750 μιη2以及1.2500 μιη2，除此方面以外，與上述參考 例1同樣地製作參考例2、參考例3以及參考例4的導電 55 201232632 膜。 (比較例1、比較例2) 將波紋抑止部26的面積Sb分別設為〇.〇〇25 μιη2以及 1_5000 μπι2，除此方面以外，與上述參考例丨同樣地製作 比較例1以及比較例2的導電膜。 (實例1 ) 已製作的實例1的導電膜的網眼圖案2〇的線寬為1〇 μπι(線間隔為3〇〇μηι)，交叉部24的面積&amp;為（⑽哗2, 波紋抑止部26的面積Sb為0.0200 μιη2。 (實例2〜實例4) 將波紋抑止部26的面積Sb分別設為0 9〇〇〇 μπι2、 1.1000 μιη2以及5 0000 μπι2，除此方面以外，與上述實例】 同樣地製作實例2、實例3以及實例4的導電膜。 (比較例3、比較例4) 將波紋抑止部26的面積Sb分別設為o.oioo μηι2以及 6·0000 μιη2 ’除此方面以外，與上述實例丨同樣地製作比 較例3以及比較例4的導電膜。 (實例5) 已製作的實例5的導電膜的網眼圖案20的線寬為3.0 μιη(線間隔為300 μιη)，交叉部24的面積Sa為9 〇〇 ， 波紋抑止部26的面積Sb為0.1800 μιη2。 (實例6〜實例8) 將波紋抑止部26的面積Sb分別設為8.1000 μιη2、 9.9000 μιη2以及45.0000 μιη2 ’除此方面以外，與上述實例 56 .it 201232632 5同樣地製作實例6、實例7以及實例8的導電膜。 (比較例5、比較例6) 將波紋抑止部26的面積Sb分別設為0.0900 μιη2以及 54.0000 μιη2，除此方面以外，與上述實例5同樣地製作比 較例5以及比較例6的導電膜。 (實例9) 已製作的實例9的導電膜的網眼圖案20的線寬為4.0 μιη(線間隔為3〇〇μιη)，交叉部24的面積Sa為16·00μιη2, 波紋抑止部26的面積Sb為0.3200 μιη2。 (實例10〜實例12) 將波紋抑止部26的面積Sb分別設為14.4000 μιη2、 17.6000 μιη2以及80.0000 μιη2，除此方面以外，與上述實 例9同樣地製作實例1〇、實例η以及實例12的導電膜。 (比較例7、比較例8) 將波紋抑止部26的面積Sb分別設為0.1600 μιη2以及 96.0000 μιη2，除此方面以外，與上述實例9同樣地製作比 較例7以及比較例8的導電膜。 (實例13) 已製作的實例13的導電膜的網眼圖案20的線寬為5.0 μιη(線間隔為300 μιη)，交叉部24的面積Sa為25.00 μιη2, 波紋抑止部26的面積Sb為0.5000 μιη2。 (實例14〜實例16) 將波紋抑止部26的面積Sb分別設為22.5000 μιη2、 27.5000 μηι2以及125.0000 μιη2,除此方面以外，與上述實 57 201232632 例13同樣地製作實例14、實例15以及實例16的導電膜。 (比較例9、比較例1〇) 將波紋抑止部26的面積Sb分別設為0.2500 μπι2以及 150.0000 μπι2，除此方面以外，與上述實例13同樣地製作 比較例9以及比較例10的導電膜。 (實例17) 已製作的實例17的導電膜的網眼圖案20的線寬為8.0 μπι(線間隔為300 μπι)，交叉部24的面積Sa為64.00 μιη2’ 波紋抑止部26的面積Sb為1.2800 μιη2。 (實例18〜實例20) 將波紋抑止部26的面積Sb分別設為57.6000 μπι2、 70.4000 μιη2、以及320.0000 μιη2，除此方面以外，與上述 實例Π同樣地製作實例18、實例19以及實例20的導電 膜。 (比較例11、比較例12) 將波紋抑止部26的面積Sb分別設為0.6400 μιη2以及 384.0000 μιη2，除此方面以外，與上述實例17同樣地製作 比較例11以及比較例12的導電膜。 (實例21) 已製作的實例21的導電膜的網眼圖案20的線寬為9.0 μιη(線間隔為300 μιη)，交叉部24的面積Sa為81.00 μιη2, 波紋抑止部26的面積Sb為1.6200 μιη2。 (實例22〜實例24) 將波紋抑止部26的面積Sb分別設為72.9000 μιη2、 58The blackening process may be performed before or after the 12G of the Hi case, and after the case 120 is adopted, the blackening process may be performed using 3 = in the field of printed wiring boards. For example, water of J nitrous acid (15 g/L) and trisodium phosphate (12 g/L);: Ι Ι / Χ 95 ΐ: treatment for 2 minutes, whereby the above black can be used as a thin metal wire 16 is adhered to the transparent substrate with the contact layer 62 of the film of the acrylic resin or the = tree. When it is necessary to combine one or two of the thin film forming techniques such as the metal thin wire 16 (sputtering method), the chemical vapor deposition method, and the electroplating method/electroplating method, The [conductive pattern 120] of the thin metal wire 16 is a method of forming the guide 12G on the transparent substrate 12. From the viewpoint of adding the A body 19, it is effective to form on the transparent two as in the above manufacturing method. After the metal foil 66, the conductive pattern 120 formed by the thin lines 16 is formed by a chemical etching process. In addition, there is a method of using a mask in which the conductive pattern 120 is drawn, exposing and developing the photosensitive resin layer disposed on the transparent substrate 12, and combining electroless plating or electric ore. 'Therefore a conductive pattern 120 formed of thin metal wires 16 is formed. An example of the conductive pattern 120 applied to the touch panel will be described later. [Next layer 62] For example, an epoxy-based adhesive layer or an acrylic-based adhesive layer can be used as the contact layer 62. [Transparent Cladding Layer 64] The difference in refractive index between the transparent cladding layer 64 and the adhesion layer 62 for coating the conductive pattern 120 in the conductive film 1b produced in the manufacturing method of the present embodiment is set to 0. . 1 or less. The reason is that if the refractive index of the adhesive layer 64 of the adhesive layer 64 is different, the visible light transmittance is lowered, and the difference of the refractive index is 0. Below 1, the degree of decrease in visible light transmittance is small and good. When the transparent substrate 12 is polyethylene terephthalate (n = 1 575 refractive index), as a material for the transparent coated dance 6 which satisfies the above requirements: can be used: double-seeping eight-type epoxy resin Or double 酴F type epoxy ^ tetrahydroxy phenyl?环氧 环氧 旨 旨 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : , can be listed: the day loses 15 〇), exhibition f women (n = 1. 52l), polybutadiene (n = ^) = „n=1. 5G5~Ul), polybutadiene dibutyl (n=15〇), (tetra)tributyl*butyl 2 201232632tene (n=1. 506), poly-l,3-butadiene (n=1. 515) et al (di) olefins, polyoxyethylene (n = 1. 4563), polyoxypropylene (n = 1. 4495), polyvinyl ethyl ether (n = 1. 454), polyvinyl hexyl ether (n = l. 4591), polyethylidene butyl hydrazine (n=1. 4563) and other polybenzazoles; polyacetate acetonitrile (n=1. 4665), polyvinyl propionate (11 = 1. 4665) and other polyesters; polyurethanes (n=1. 5~1. 6), ethyl cellulose (η = ι · 479), polyethylene (η = 1. 54~1. 55), polyacrylonitrile (η=1·52), polyfluorenyl acrylonitrile (η= 1. 52), poly 飒 (η = 1. 633), polysulfide (η = 1. 6), styrene resin (η=1. 5~1. 6) Wait. The above materials will exhibit better visible light transmittance. On the other hand, when the transparent substrate 12 is an acrylic resin, in addition to the above resins, polyethyl acrylate (η = 14685) and butyl acrylate (η = 1. 466), polyethyl-2-ethylhexyl acrylate (11=1. 463), polybutyl acrylate (η = 1. 4638), polyacrylic acid · 3 · ethoxypropyl ester (η = 1. 465), polyoxycarbonyl tetramethacrylate (η = 1 465), polymethyl acrylate (η = 1. 472~1. 480), poly(isopropyl acrylate) (η = 1. 4728), dodecyl polydecyl acrylate (η = 1 474), tetradecyl polymethacrylate (η = ι. 4746), n-propyl polydecyl acrylate U= 1. 484), poly(methacrylic acid) _3,3,5-tridecylcyclohexyl ester (η== 1. 484), polyethyl methacrylate (η = 1 485), poly(methacrylic acid) 2_ nitro-2-methylpropyl ester (η = 1 4868), polytetraoxycarbonyl methacrylate (η = 1. 4889), poly(meth)acrylic acid _u_diethyl propyl ester (η == 1. 4889), poly(meth) acrylate such as poly(methyl methacrylate) (η== 1 4893). Two or more kinds of the above-mentioned acrylic polymer 31 201232632 may be used in combination, or two or more kinds of the above acrylic polymers may be used in combination. Further, as the copolymer resin other than the acrylic resin and the acrylic resin, epoxy acrylate, urethane acrylate, polyether propylene if ester, and polyester acrylate may be used. In particular, epoxy acrylate and polyether acrylate are excellent in terms of adhesion, and are listed as epoxy acrylate. 1,6-hexanol diglycidyl hydrazine, neopentyl glycol diglycidyl sulphate, propylene glycol diglycidyl ether, m-phenylene diglycidyl _, diglycidyl adipate, phthalic acid (glycosyl) such as diglycidyl ester, polyethylene glycol diglycidyl ether, trihydrocarbyl propane triglycidyl ether, glycerol triglycidyl ether, pentaerythritol tetraglycidyl ether, and sorbitol tetraglycidyl ether Acrylic acid adduct. Since the epoxy acrylate has a hydroxyl group in the molecule, the adhesion can be improved, and two or more kinds of the above copolymer resins can be used in combination as needed. The weight average molecular weight of the polymer which is the main component of the transparent coating layer 64 is a molecular weight of 使用 or more. When the molecular weight is 1,000 or less, the cohesive force of the composition is too low, and thus the adhesion to the adherend (the transparent substrate 12, the adhesive layer 62, and the conductive pattern 120) is lowered. As the hardener of the transparent coating layer 64, an amine such as triethylenetetramine, diphenylenediamine or diaminodiphenylmethane; phthalic anhydride, maleic anhydride, and dodecyl amber can be used. Anhydrides such as anhydrides, pyromellitic dianhydrides, benzophenone tetraphthalic anhydride; diaminodiphenyl sulfone, tris(didecylamino fluorenyl) phenol, polyamine resin, dicyanoquinone Amine, ethyl decyl imidazole, and the like. The above curing agent may be used singly or in combination of two or more kinds of the above-mentioned curing agents. Relative to 100 parts by weight of the above polymer, in 〇. 1 part by weight 32 201232632 The amount of the crosslinking agent added to the above-mentioned hardening agent is selected within the range of s parts to 3 parts by weight, and the amount of the parent agent to be added is selected. If the above-mentioned addition amount is less than q i parts by weight, = 匕: Γ 超过 more than 5 〇 by weight, the cross-linking is excessive, which may adversely affect the contact properties. The addition of a diluent, a plasticizer, an antioxidant, a filler, and an adhesion-promoting solution may be added to the resin composition of the transparent coating layer 64 used in the present invention, as needed. Next, the resin composition of the transparent coating layer 64 is applied to coat a portion or the entire surface of the transparent substrate 12± containing the conductive pattern 12?, and after drying through a solvent and a heat curing step, a film is formed. The transparent cover layer 64 of the adhesive film can be directly attached to a display of a liquid crystal display device, an organic electroluminescence (EL), an inorganic EL, or the like, and used as a touch panel for a display, or can be attached to a pre-depicted An icon (icon) with a button (keybutt〇n) or a number, or a plate or sheet of a labeled acrylic plate, glass plate, etc., thereby serving as a keyboard independent of the display (keyb〇ar(j) or Touch panel for a digital keypad. [Application example for application to a touch panel] Next, an example will be described with reference to FIGS. 14 to 21, which is a conductive film 10a, which is electrically conductive. The film 10b is configured as an example of the touch panel 150. The touch panel 150 can be a resistive touch panel or a capacitive touch panel. The touch panel 150 includes a sensor body. 152 and a control circuit (not shown) (including integrated circuit '1C) power 33 201232632, etc. As shown in FIG. 14, FIG. 15, and FIG. 16A (or FIG. 17A), the sensor body 152 includes: The laminated conductive film 154 is a first conductive raft 10A and a second guide to be described later. The electric film 10B is laminated, and the protective layer U6' is laminated on the build-up conductive film 154. The build-up conductive film 154 and the protective layer 156 are disposed, for example, on the display panel 158 of the display device 157 such as a liquid crystal display. The film i〇A and the second conductive film 10B include the conductive film 10a (see FIGS. 1, 2, and 16A) or the conductive layer 10b (see FIGS. 12 and 17A). When viewed from the upper surface, The sensor body 152 includes a sensor portion 160 disposed in a region corresponding to the display pupil surface 158a of the display panel 158, and a terminal wiring portion ία (so-called frontal edge) disposed on the outer peripheral portion of the display panel 158 Corresponding regions, for the first conductive film 1A applied to the touch panel 150, when the conductive film 1a shown in FIG. 2 is used, as shown in FIG. 15, FIG. 16A and FIG. The first conductive portion 14A is formed on one main surface of the first transparent substrate 12A (see FIG. 16A). When the conductive film 10b shown in FIG. 12 is used, as shown in FIG. 17A and FIG. 18, the first conductive film 10A is not included: the first transparent substrate 12A; the first conductive portion +MA ' is formed of a thin metal wire, and the metal thin wire 16 is formed on one main body of the first transparent substrate 12A via the first backing layer 62a, and the first transparent cover layer 64a is formed to be the first conductive ^ 14A is coated with the exposed first adhesive layer 62a, and the difference in refractive index from the first subsequent g 62a is 〇1 or less. As shown in Fig. 18, the first conductive portion 14A includes two or more first 34. 201232632 The conductive pattern 1胤 (including the mesh pattern 2〇) extends along the third direction (the melon direction) and is arranged along the fourth direction u direction orthogonal to the third direction) and includes a plurality of lattices The metal thin wires 16 are formed; and the second auxiliary pattern 2GGA is formed of thin metal wires 16 arranged along the periphery of each of the i-th conductive patterns 12QA. The first conductive pattern 120A is formed by connecting two or more second large lattices 2〇2A in series in the third direction, and each of the first large lattices 2〇2A is a combination of two or more small lattices. = The first auxiliary pattern 2〇〇A connected to the first large lattice view A is not the side of the lattice ship. A second connecting portion A for connecting the i-th large lattice ship is formed between the adjacent i-th large lattices 2G2A. The middle grid is configured to be 208, and the ith joint portion is configured to be arranged such that the n-n is a real number greater than 1 and the small lattice 2〇4 is arranged in the second direction (y direction). The first notch portion is formed in the portion adjacent to the 42〇8 in the direction (the direction of the first large lattice) A in the first large lattice A, but the side of the small lattice 204 is provided in the second small lattice 204. It is the smallest square shape. In the figure gal (4) arranged between the first sex 丄 == 丄 conductive pattern ' 'configured with electricity (to include · · multiple first auxiliary - for the direction of the axis), along the side of the larger lattice 2G2A 35 201232632 In the article, the sides 203a along the first direction are arranged; the plurality of first auxiliary lines 214A (the first direction is the axial direction), and the second direction along the side 2〇3a of the first large lattice 202a. The two sides 2G3a are arranged; and two first L-shaped patterns 216A are disposed facing each other, and the two first L-shaped patterns 216A are combined in the second insulating portion 212A by two first auxiliary lines 214A. Word-shaped. The length of the first auxiliary line 2UA in the axial direction is the length of 4/5 of the two sides of the small lattice, and it is preferable that the length of the side is longer. Further, each of the first auxiliary lines 214A is formed at a position where the 盥J = Grid 2G2A is rotated. The length from the length of the strip along the inner circumference of == is subtracted from the length of the first auxiliary line = the length of the direction. For example, if the first auxiliary line 21 is from 4 Λ 1/2 to 1 and the length is along the inner circumference of the small lattice 2〇4, the money side is (1) 1/5 or 1/ of the side of the small lattice _ week. 2. Π ^ As follows, the first conductive film 10A configured as described above has a large lattice HZ1 12〇A at the open end of the large lattice ship existing on each of the first conductive patterns 120A. The other H-th portion on the other end side is electrically connected to the second terminal wiring pattern formed by the thin metal wires 16 via the (4) wiring portion. ==, the first conductive film i〇A for the touch panel 150 is as shown in FIG. 15 and FIG. 15, and the corresponding portions of the plurality of first lightning detector units 160 are listed in each of the first A plurality of 36 201232632 derived from the connection 1 184 of the sensation 1 is arranged in the terminal wiring portion (6). As seen from the surface, the outer shape of the conductive film 10 is the rectangular shape seen from the above table, and the sensor portion _ γ edge portion is formed in the central portion of the longitudinal direction by more than one long side. Side: Production = eve a first terminal 188a arranged in a shape - strip, Jiaru County soil long and direction. Further, along the side of the sensor portion 160, the long side of the long side of the first conductive film 1A is η line portion 18: = 1 The wiring portion 18 is linearly arranged. The first terminal wiring pattern 186a from each of the first contacts is led to the substantially central portion of the long side of the first conductive stagnation, and is electrically connected to the corresponding first terminal 188a. For the ith conductive film i〇a applied to the touch panel 15A, when the conductive film shown in FIG. 2 is used, the first conductive portion 14A is included as shown in FIG. 15, FIG. The ith conductive portion i4A is formed on one main surface of the transparent substrate 12A (refer to the gate 16A). When the conductive film shown in FIG. 12 is used, as shown in FIG. 15 and FIG. 17 and FIG. 18 d 'the first conductive film includes: an i-th transparent substrate 12A; and the first conductive portion UA' is formed of a thin metal wire b. The thin metal wire 16 is formed on one main surface 12Aa of the second transparent substrate m via the first layer 62a, and the i-th transparent cladding layer 6 is formed to form the first conductive layer M4A and the first one exposed. The layer 62 &amp; is coated and the difference in refractive index from the first back layer 62a is 0. 1 or less. On the other hand, when the conductive film 10a shown in FIG. 2 is used for the second conductive film 1GB, as shown in FIG. 15, FIG. 10, and FIG. 19, 37 201232632 includes the second conductive portion 14B, which is formed in One main surface of the second transparent substrate 12B. When the conductive film 1b shown in Fig. 12 is used, as shown in Figs. 15, 17A and 19, the second conductive film 1B includes: a second transparent substrate; the second conductive portion HB is made of a thin metal wire. 16 is formed, the metal thin wires 16 are formed on the one main surface 12Ba of the second transparent substrate 12B via the second adhesive layer 62b, and the second transparent cladding layer 64b is used to expose the second conductive portion 18B. The second adhesive layer 62b is coated, and the difference in refractive index from the second adhesive layer 62b is 〇丨 or less. The second conductive portion 14B includes: two or more second conductive patterns 12 〇 b (including the mesh pattern 20), which are respectively arranged along the fourth direction (n direction) and arranged along the third direction (m direction), and The second auxiliary pattern 2〇〇B is formed by the thin metal wires 16 arranged in the periphery of each of the conductive patterns 120B, and the second conductive pattern is formed by two or more second large lattices. The fourth direction is connected in series in the fourth direction, and each of the smaller squares 204 is combined to form the side of the grid 202B, and the second auxiliary pattern 2 that is not connected to the second large lattice is formed. 〇b. Between the second large lattice fibers of the large grid, a second connecting portion 2〇6Β electrically connecting the second sub-208 to the broadcaster is formed. The middle lattice 6 is arranged to form the second connection 6 Β Τ 四 四 四 四 四 四 四 四 四 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 38 2012 38 2012 38 2012 38 38 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 to make. Further, between the adjacent second conductive patterns 12A, the second insulating portion 212b is insulated. The second auxiliary pattern 2_ includes a plurality of second auxiliary lines 214B (in the first direction as the axial direction) 'arranged along the second direction along the second large grid 2 203b; The second direction is the axial direction, the side along the second direction along the second large lattice complement 203b is arranged in a row, and the pattern is provided with two 216 second L-shaped patterns facing each other. The double-shaped pattern is formed by combining the second auxiliary line 2HB in the second insulating portion into an L shape. In the same way, the second auxiliary line 2MA of the second row is 'the second auxiliary line 214B 45tT Λ/ is the 边· along the inner circumference of the small lattice, and the rut is preferably 1/2 or less of the one side. length. Further, each of the second shapes is spaced apart from the second large lattice 2 (four) by a predetermined distance two; Μ·4:=ί214Α Similarly, the predetermined distance is also the length of the self-tested car mi side, minus the second auxiliary line 214B. The length of the axis of the square. For example, if the second auxiliary line side is 4/5 or 1/2 ^, and the length of the second auxiliary line is 1/5' or 1/2 of the side of the inner circumference of the small square 2〇4, the predetermined distance is along The inner circumference of the small lattice 204 is as follows. The second conductive film 10B configured as described above has the following secret, that is, the second large lattice which is present on the end side of one of the third conductive sheets. The 2G2B closing end does not have the second connecting portion 2_. In the other aspect, the end portion of the second large lattice 2G2B on the other end side of each of the odd-numbered second conductive patterns is present, and the end portions of the second conductive patterns present in the even-numbered second conductive patterns The end portion of the second large lattice 2_ on the side is electrically connected to the second terminal wiring pattern 18A formed of the thin metal wires 16 via the second wiring portion 18, respectively. In other words, the second conductive film applied to the touch panel 150 is arranged in a portion corresponding to the sensor portion (10), and is derived from each of the second wiring portions i84b. The plurality of second terminal wiring patterns 186b are arranged in the terminal wiring portion m2. As shown in FIG. 14 , in the peripheral portion of the long side of the second conductive film _ in the terminal wiring portion 162, a plurality of the second terminals 188b are arranged at the length of the one long side in the central portion in the longitudinal direction. direction. Further, along one short side of the sensor portion 160 (the shortest direction of one short side of the second conductive film), a plurality of second wiring portions, for example, an odd number of second wiring portions (4) are linear, along the line Wei; the other short side of the job department (10) (the short side m direction closest to the second conductive film), and the second second connection portion 184b (for example, the even number of second connection portions 184b) It is linear. In the plurality of second conductive patterns 120B, for example, the odd-numbered second conductive patterns 12GB are respectively connected to the corresponding odd-numbered second wiring portions lion, and the even-numbered 帛2 conductive patterns t 12〇B are respectively connected to the corresponding ones. The even number of second wiring portions 184b. The second terminal wiring pattern 18 6 b which is difficult to be derived from the odd-numbered second wiring portions and the second terminal wiring pattern ^ derived from the even-numbered second wiring portions 201232632 • J ^ I - JJit 184b are led to the second A substantially central portion of one long side of the conductive film 1A is electrically connected to the corresponding second terminal 188b. In addition, the lead-out pattern of the first terminal wiring pattern 18 may be the same as the lead-out form of the second terminal wiring pattern 186b, and the fourth (four) state of the second terminal wiring pattern 186b and the second terminal wiring pattern may be used. The export form is the same. The length of one side of the first large lattice 202A and the second large lattice 202B is preferably 3 mm to 10 mm, more preferably 4 _ to 6 Å. If the length of one side is less than the above lower limit value, the capacitance of the i-th large lattice 2〇2a and the second large lattice 2_ at the time of detection is reduced, so that the detection failure is caused by the &quot;I month bf. On the other hand, if the length of the one side exceeds the above-mentioned limit value, there is a possibility that the position detection accuracy is lowered. From the same viewpoint, the length of one side of the small lattice 204 constituting the first large lattice 202A and the second large lattice 2〇2B is preferably 5 〇 μηη to 500 μπη. When the length of one side of the small lattice 2〇4 is in the above range, the display content can be recognized without any uncomfortable feeling when the transparency is generated and the display is performed on the display panel 158 of the display device 157. . Further, the line width of the first conductive pattern 120A (the i-th large lattice 2〇2A, the middle lattice 208) and the line width of the second conductive pattern 12〇B (the second large grid 2 and the medium grid 208) are the first! The line widths of the auxiliary pattern Wei (i-th auxiliary line 2i4A) and the second auxiliary pattern 200B (second auxiliary line 214B) are 1 μηι to 15 μηη, respectively. In this case, the line width of the i-th conductive pattern i2〇A or the line width of the second conductive pattern 1 may be the same, or may be different from the line width of the second conductive pattern _201232632. However, the first auxiliary pattern 200A and the 钕, Le Z Shou electric circle, that is, the metal thin line ί auxiliary pattern 2 〇〇 B have the same line width. Separation (adjacent metal thin wire! 6 ^ f width is preferably 1 μΙΏ ~ 15 哗. Inter-line 2 conductive film U) B opening rate considering 'first conductive film 1 〇Α and second 卞 卞? Yu Jia is more than 85%. It is formed by the above (4) electric film. The first conductive pattern 120A and the first conductive pattern 120A are arranged in a cross-over manner, that is, the form of 1 = pattern 12 〇 B, and the specific portion 206A and The first connection 1 transparent substrate 12A of the second conductive pattern-conducting pattern 12A (the second connecting portion 2 of the first conductive portion 14A is opposed to the insulating portion 212a 17A of the first conductive portion 14A) The second insulating portion 2UB is opposed to the second layer from the upper surface via the j=2 conductive portion 1. As shown in the figure, in the case of observation, the second large lattice 2 (four) of the conductive film 10A conductive film _ is filled in the gap of the first large lattice 20M of FIG. 20 . In this method, between the second and second large dice 2〇2B, the first large lattice 2〇2A and the second auxiliary pattern 2_ are formed, and the % help patterns 200A and 218 are formed. As shown in Fig. 21, the first auxiliary line 214A is 218. The second axis 22〇B of the combined pattern second auxiliary line 214B does not overlap with the first auxiliary line 214B and the second auxiliary line 214B. The first auxiliary line and the first auxiliary line 214A are 42 201232632 one end and the second auxiliary line 214B. One - 2 〇 4 - strip side. That is, the combination _ is formed into a small lattice of a small lattice of 2 0 4 . As a result, U is: 5 when there are two or more W observations, as shown in Fig. 2G, 1 = face, the laminated conductive film is filled with a plurality of small lattices. It is a form in which, when the unlined wire 1 auxiliary line secret and the second auxiliary and ^mb are formed, the combined pattern 21 = field is formed, whereby the following door s visibility is generated. The white and the new P's lead to the first large lattice fiber to avoid the boundary of the (4) child 2〇2B, and the visibility is deteriorated. For the crystal 2, the side of the second large lion is hired to eliminate the blank area, but the minimum deviation of the accuracy of the two = = ,, the width of the overlapping heart of the straight line shape becomes larger (the line becomes thicker), As a result, the quality of the first large lattice 202A under the wire is deteriorated. The boundary of the A-grid 202B is conspicuous, and in this embodiment, as described above, since the first auxiliary ί 重叠 overlaps with the second auxiliary line 214B, the first large lattice 2〇2A and the younger brother 2 are larger. The boundary of the lattice 2G2B is inconspicuous, and it is improved. As described above, for example, when the side of the second large lattice is moved to the side 2 of the first large lattice 202A by the side 2〇3a, the blank area is eliminated. The side rib is located directly below each side a of the first large lattice leg. At this time, the side of the j-th large lattice 2 〇 2a and the first large grid 2 (four) (four) 203b also function as conductive portions respectively. Therefore, in the first large lattice The edge 2〇3a of 202A and the edge 203b of the second large lattice 2〇2b 43 201232632 are used as a capacitor, and the information is used as a noise to make a knife. N is lower than the one. Further, since the parasitic capacitance is formed between each of the i-th large lattices, the secondary capacitance is connected in parallel to the i-th conductive_12Q, which is a problem that the parasitic electric power 5L has a large time constant. * When the number of hangs of the CR time is large, the waveform of the voltage signal supplied to the ith conduction 0 case 12: drain) is slowed down, and the electric field for position detection is hardly generated. Also, from the first! The rise time or fall time of the waveform of the conductive _ 12GA and the second conductive pattern ##u is also slow, and the waveform of the transmitted signal may not be captured during the scan time of the gauge. This will cause the detection _ degree to drop and the money response speed to decrease. That is, in order to improve the detection accuracy and improve the response speed, only the first! The number of large lattices 2〇2A and the second large lattices 2〇2b is reduced (reduced decomposition ability)' or the size of the adapted display screen is reduced, which causes the following problem 'that' cannot be applied to, for example, the B5 version. , A4 version, and large screens above these layouts. On the other hand, in the present embodiment, for example, as shown in FIG. 16A, the projection distance Lf between the side 203a of the first A lattice 202A and the side 2〇3b of the second large lattice 202B and the small lattice 2〇4 are formed. The length of one side is approximately the same. Therefore, the parasitic capacitance between the first large lattice 202A and the second large lattice 202B is small. As a result, the CR time constant is also reduced, so that the detection accuracy can be improved and the response speed can be improved. Further, there is also a case in which the current auxiliary line 214a:, 218, the end of the i-th auxiliary line 214a, the end of the =4B are opposed to each other, but the i-th auxiliary line 214a = 1 is large. The lattice 202A is connected, and the first large lattice 202A is electrically connected to the second large grid, and is not connected to the second large lattice, and is not connected to the second large grid. Therefore, the first large lattice is not caused to be the second large lattice 2_ The parasitic capacitance of the squash is increased. It is preferably based on the size of the first large lattice 2G2A and the second large lattice 2〇2b, and further based on the size of the second large lattice 2Q2a and the second largest small lattice ( The line width and the length of the strip edge are used to appropriately set the above-mentioned pitch and the Lf. In this case, it is small with respect to the second large lattice 2〇2A and the second large lattice 202B having a fixed size. When the size of the lattice 204 is too large, the light transmittance is improved, but the dynamic range in which the k number is transmitted becomes small, so that the detection sensitivity may be lowered. Conversely, if the size of the small lattice is too small, the detection is performed. The sensitivity is improved, but the reduction in line width is limited, so the light transmittance is available. Therefore, when the line width of the small lattice 204 is set to !Mm~9 μηι, the optimum value (optimum distance) of the above-mentioned technical distance Lf is preferably 1〇〇~〇〇μηι and further preferably It is 2〇〇gm~3〇〇. If the small lattice 204 is narrowed, the above optimal distance can be shortened, but the resistance will gradually change. Therefore, even if the parasitic capacitance is small, the CR time constant will As a result, it is possible to cause a decrease in the detection sensitivity and a decrease in the response speed. Therefore, the line width of the small lattice 204 is preferably in the above range. 45 201232632 Moreover, for example, based on the size of the display panel 158 or the sensor portion The size and the resolution of the position (4) (rotation pulse (pul (5) pulse period 4) 'to determine the size of the first large lattice 2Q2A and the second large lattice 202B and the size of the small lattice 2 () 4 to a small lattice line In the present embodiment, the conductive film 10a in which the corrugation suppressing portion % is formed or the corrugated suppressing portion is formed is used as the standard "to calculate the optimum distance between the first large lattice 2G2A and the second large lattice 2 (four). % conductive film, so 'example As shown in FIG. 3 and the like, the first conductive pattern 120A (mesh _ 2 〇) constituting the i-th conductive portion 14A and the second conductive pattern i2 〇 B constituting the second conductive portion 14B (mesh pattern 2) In other words, the corrugation suppressing portion 26 having the above relationship is located adjacent to the intersection portion and the % of the mesh pattern 2A. As a result, the light transmitted through the i-th conductive portion 14A and the second conductive portion 14B can be made. The integral amount is substantially the same as the portion other than the intersection portion 24 and the intersection portion 24, so that the degree of image quality deterioration caused by the bow or the like can be minimized. In other words, the display surface is not obscured by the ripples, and the quality improvement and the operability are improved. Further, since the line width of the thin metal wires 16 is set to i ton to 15 qing, the line interval of the metal thin wires 16 is set to 50 哗 to 500 哗 ', so that high light transmittance and good visibility can be simultaneously achieved (mesh) The pattern 20 is not easily noticeable). Further, in the green form of the present embodiment, the above-described corrugation suppressing portion 26 is provided, whereby the electric power can be improved by the portion, and the detection capability of the touch position can be improved by &amp; Especially for the capacitive touch panel, it is preferable because the capacity of the capacitor is improved. That is, the 'ripple suppression unit 26' also functions as a touch position detecting capability improving unit. Further, the conductive film shown in Fig. 12 is used, for example, as shown in Fig. 17A, the difference between the refractive index of the first adhesive layer and the first adhesive layer is 〇] or less! The transparent cladding layer 64a is coated on the first conductive layer =0A of the first conductive film 1GA and the exposed first adhesive layer 62a, and the second transparent package having a difference in refractive index from the second adhesive layer of α ΐ or less The cladding layer 64b is coated on the second conductive pattern 12GB of the second conductive film 1GB and the exposed second surface layer _ on the first surface layer 仏 and the second surface layer _ The diffuse reflection in the shape is suppressed to a minimum, and when the build-up conductive film 154 is formed, the laminated conductive film 154 is entirely transparent. Further, when the laminated conductive film 154 is used as the touch panel 15A, the protective layer 156 is laminated on the first conductive film 1GA, and is derived from the plurality of ith conductive patterns 12GA of the conductive film i〇A. The first terminal wiring pattern 186a is connected to the second terminal wiring ug 186b derived from the plurality of second conductive patterns i of the second conductive film 1B, and is controlled by a control circuit that controls scanning. The self-capacitance mode or the mutual capacitance mode can be preferably used as the detection method of the touch position. That is, if the self-capacitance mode is formed, the voltage signal for the touch position detection is sequentially supplied to the second conductive pattern 120A, and the voltage signal for the touch position detection is sequentially supplied to the second conductive pattern 1 Shi. Since the fingertip comes into contact with or close to the upper surface of the protection 35(9), the ith conductive pattern i2〇a opposite to the touch position and the second conductive pattern 120B and GND (ground) 201232632 Λ The capacitance is increased. Therefore, the waveform of the transfer signal from the second conductive pattern and the second conductive pattern 12GB is different from the waveform from the potted conductive number. Therefore, the control circuit operates on the touch position based on the signal. On the other hand, in the case of mutual electric Ϊ =, for example, it will be used for touch position detection until the ith conductive pattern is hidden, and the second conductive pattern is sequentially applied; sensing (sensing) signal). As the fingertip and the upper surface of the protective layer 156 are twisted or close to the upper surface, the floating capacitance of the finger is increased in parallel to between the second conductive pattern 12a and the second conductive pattern 12GB opposite to the touch position. The parasitic capacitance is such that the waveform of the transmission signal from the second conductive pattern 120B is different from the waveform of the transmission signal from the other second conductive pattern 120B. Therefore, the control circuit calculates the touch position based on the pass of the i-th conductive pattern 12A supplied to the voltage signal and the supplied transfer signal from the second conductive pattern 120B. By using the self-capacitance method or the method of detecting the touch position of the phase-electric valley method as described above, even if the two fingertips simultaneously invite the upper surface of the protective layer 156 to contact or approach the upper surface, it is possible to detect Out of each touch position. Further, the prior art documents related to the projection type capacitive detection circuit include U.S. Patent No. 4,582,955, U.S. Patent No. 4,686,332, U.S. Patent No. 4,733,222, U.S. Patent No. 5,374,787, and U.S. Patent No. 5,543,588. The specification, the specification of U.S. Patent No. 7, 〇3, 860, and the specification of U.S. Patent Publication No. 2004/0155871. 48 201232632 Yu Shishu laminated conductive 154 towel, when using the conductive -: main surface shown in Figure 2 as shown in Figure _ = 16 ' 'in the first transparent substrate 12A - the main surface electrical part 14A ' in the When the transparent substrate 12B is in the first transparent substrate, the main surface forms the second conductive portion 14A. The reading is such that the second transparent substrate 12 does not exist, the eclipse substrate 12 is deposited on the second conductive portion 14BJ1, and the second layer is on the first transparent substrate 12A. Further, another layer may be present between the first conductive film 10A and the Lam film. If the first conductive portion 14Aj 22 14B is in an insulated state, the first conductive portion and the second conductive portion 14β may be opposed to each other. In the above-mentioned laminated conductive film 154 _, when using U 2 : a conductive film is shown in FIG. 15 and FIG. 17A, 1: a main surface of the base 12 A forms a second conductive portion 24 a, the main surface of the body 12B is formed with the second conductive portion i4B, and the first conductive portion 14A is formed by the first and second layers 62a of the first transparent substrate UA. , a 'the other main surface 12Ab of 12A is interposed, and the second base 6 transparent base conductive portion 14B is interposed. In this case, the following ": shape ^ second base 12B does not exist, and the second transparent base UA Laminated ^ through 14B, and the first! The conductive portion 14A is laminated on the first! In the case of this case, the first conductive portion 14A and the exposed portion are also exposed. The transparent coating layer is formed, and the second transparent coating layer 64b is formed by coating the conductive portion 14B with the exposed second technical layer 9 9 . Further, in the first conductive film 10A, the second conductive film is provided between the second conductive film and the other (10). When the second conductive portion (10) is in an insulated state, the second conductive portion 14 and the second electrical portion 14B may be opposed to each other. Configuration. Further, as shown in FIG. 14, the first conductive film 10A and the second conductive gland 10B are combined to form a laminated conductive film 1M, and the laminated conductive film is placed in the age panel 158 of the display 157. To make the mouth control panel 150. In this case, it is preferable that the first alignment mark j alignment mark 194a and the second alignment mark 194b are formed in, for example, corner portions of the first conductive film 10A and the second conductive film 10B. The i-th alignment mark 194a and the second alignment mark 194b are marks for positioning used when the first conductive film 1-8 is bonded to the second conductive film i〇B. When the first conductive film 10A and the second conductive film 10B are bonded together to form the laminated conductive film 154, the first alignment mark 194a and the second alignment mark 19 become new composite alignment marks, and the composite pair The alignment mark also functions as an alignment mark for positioning when the build-up conductive film 154 is provided on the display panel 158. In the above example, the first conductive film 10A and the second conductive film 10B are applied to the projection. An example of a capacitive touch panel 15A can also be applied to a surface capacitive type touch panel or a resistive film type touch panel. As the conductive pattern formed on the first conductive film 10A or the second conductive film 10B, in addition to the above-described conductive pattern, the following guide can be used 201232632.  In the electric pattern, the mesh pattern is divided into a strip shape by an insulating portion, and a plurality of the mesh patterns are arranged in parallel. In other words, the two or more strip-shaped first conductive patterns may be included as the pattern of the first modification, and the two or more strip-shaped first conductive patterns may be from the terminal in the first direction (X direction). ) extending and arranging along the second direction (y direction) of the father in the first direction. In addition, the second modification of the disk may include two or more strip-shaped second conductive patterns as the pattern of the second modification, and the two or more strip-shaped second conductive patterns may be respectively from the terminal. The 2 directions (y direction) extend and are arranged along the first direction (X direction). Each of the conductive patterns may be formed by arranging a plurality of closed mesh shapes in which a plurality of openings are surrounded by metal thin wires. Examples of the mesh shape include a square shape, a rectangular shape, and a regular hexagonal shape. In addition, the pattern of the first modification and the pattern of the second modification are overlapped, for example, via a transparent substrate, whereby the strip-shaped first conductive pattern and the strip-shaped second conductive pattern intersect each other. The form is preferably used for, for example, a conductive pattern of a projection type capacitive touch panel. Hereinafter, the invention will be more specifically described by way of examples of the invention. Further, the materials, the amounts used, the ratios, the processing contents, the processing order, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the present invention should not be construed as being limited to the specific examples shown below. [First Example] In the first example, the surface resistance and the transmittance of the conductive film of the example 1 to the example 32, the comparative example 2, 201232632, and the reference example 8 were measured, and the surface resistance and the transmittance were measured. Corrugation and visual recognition were evaluated. The details of the examples 丨 to 32, the comparative examples 1 to 20, the reference examples ～ the reference examples 8, the measurement results, and the evaluation results are shown in Tables 3 and 4 below. &lt;Example 1 to Example 32, Comparative Example 比较 to Comparative Example 20, Reference Example! ~Reference Example 8&gt; (silver halide photosensitive material) The bromine-containing brominated silver-containing particles having a sphere-equivalent diameter of 0.1 μιη are contained in the dressing (〗 〖〇2 mol%, Br=40 mol% An emulsion containing 1.0 g of gelatin in an amount of 15 g of Ag in an aqueous medium. Further, K^Rl^Br9 and KaIrCl6 were added to the emulsion to have a concentration of 10·7 (mole/mole silver) to dope the silver bromide particles with the Rh ion and the Ir ion. NazPdCU is added to the emulsion, and then nitriding and thiosulfate steel are used for sensitization of the pentoxide, and then applied to the first transparent substrate 12A and the second transparent substrate 12B together with the gelatin hard film. It was polyethylene terephthalate (PET) so that the coating amount of silver was 10 g/m2. At this time, the Ag/gelatin volume ratio was 2/b on a PET support having a width of 30 cm, and a width of 25 cm was applied for 2 μm, and the ends of the remaining coated portion were cut by 24 cm. 3 cm, a roll-shaped silver halide photosensitive material was obtained. (Exposure) The exposure of the silver halide photosensitive material is such that the exposure head of the digital micromirror device 52 201232632 (digital micromirror device, DMD) disclosed in the embodiment of the invention of the Japanese Patent Publication No. 2004-1224 is arranged to have a width of 25 cm. And exposing the exposure head and the exposure table to image the laser light on the silver salt photosensitive layer 30 of the photosensitive material, and after mounting the photosensitive material sending mechanism and the winding mechanism, performing exposure by using a continuous exposure device, the continuous exposure The device is provided with a cushioning effect so that the tension control of the exposure surface and the speed variation of the winding and feeding mechanism do not affect the speed of the exposed portion. The exposure wavelength is 400 nm, the beam shape is approximately square μ' of 12 μπι and the output of the laser source is 1 () 〇pJ. The exposure was performed by setting the interval (line interval) between the thin line patterns of the thin metal wires 16 to 300 μm, and the mesh pattern 20 was exposed on the silver salt photosensitive layer 30 in accordance with the following setting. The line width of the metal thin wires 16 constituting the mesh pattern 2, the area Sa of the intersection portion 24, and the area Sb of the corrugation suppression portion 26 are shown in Table 3. In order to expose the silver salt photosensitive layer 30, the corrugation suppressing portion 26 is formed adjacent to the intersection portion 24 of the mesh pattern 20, and an exposure method in which three exposure heads are linked is used. That is, the 'first exposure head' side reciprocates the laser beam in a direction at right angles to the direction in which the silver salt photosensitive layer 30 is transported, and irradiates a single light beam to draw an exposure pattern on the silver salt photosensitive layer 30. Therefore, the silver salt photosensitive layer 30 is linearly 45. Obliquely, the ratio of the transport speed of the oblique three-plate silver salt photosensitive layer 30 to the moving speed of the exposure head and the moving direction in the right direction is corresponding to when the light beam reaches the silver _; 1 〇 two parts The head reciprocates along the reverse; 53 201232632 -, -a- and on the silver salt photosensitive layer 3 描 on the edge exposure pattern her == first, :== μ, month, therefore, when the first exposure head from silver Salt Sensing "When the second part is obliquely drawn, the second exposure head is formed from the silver salt photosensitive = part in the opposite direction to the moving direction of the first exposure head _: salt _ 3G is reversely depicted. In the third form, the laser beam of the optical head reciprocating with respect to the direction of the transport direction of the silver light layer 3 () with respect to the laser beam of the first exposure head and the second exposure head is determined (4) The wire is passed through the intersection of the laser beam of the first exposure head and the second exposure head, and the right side is drawn along the width direction of the silver salt photosensitive layer 3〇. The third exposure head corresponding to the number is set. The laser beam irradiated from the third exposure head sets the f-radiation to only The third exposure head is subjected to short-time shut-off laser irradiation by the above-mentioned re-feeding. Further, the irradiation time is set to a time at which the corrugation suppression portion 26 of a desired size can be drawn. (Development treatment) • 1 L developer Prescription hydroquinone 20 g sodium sulfite 50 g potassium carbonate 40 g 54 201232632 ^ II ✓ |^lt Ethylamine tetraacetic acid 2 g Desertification _ 3g Polyethylene glycol 2000 1 g Hydrogen hydroxide unloading 4g ΡΗ Adjusted to 10.3 • 1 L fixer prescription thiosulfate recording solution (75%) 3 00ml sulfite monohydrate 25 g 1,3-propanediamine tetraacetic acid 8g acetic acid 5g ammonia water (27%) 1 g PH adjusted to 6.2 use The automatic developing machine Fg (4) manufactured by Fujifilm Co., Ltd., and the photosensitive material that has been exposed to the exposure of the money agent, are processed in 3G seconds for hunger, and 23 seconds of fusion in 3 generations for 2G seconds of washing. Flowing water (5 L/min) treatment (Reference Example 1) The mesh pattern 20 of the conductive film of Reference Example 1 which was produced had a line width of 〇.5/m (line spacing of 3〇〇μηη), and the intersection portion 24 The area % of the area of the ripple suppression portion 26 is 〇〇〇5〇哗2. (Reference Example 2 to Reference Example 4) Reference Example 2 and Reference Example 3 were prepared in the same manner as in Reference Example 1 except that the area sb of the corrugation suppression portion 26 was 0.2250 μm 2 , 0.2750 μm 2 , and 1.2500 μm 2 , respectively. Conductive 55 201232632 film of Reference Example 4. (Comparative Example 1 and Comparative Example 2) The area Sb of the corrugation suppressing portion 26 was set to 〇.25 μm 2 and 1 to 5000 μπ 2 , respectively, and the same as the above-described reference example. The conductive films of Comparative Example 1 and Comparative Example 2 were produced. (Example 1) The mesh pattern 2 of the conductive film of Example 1 which was produced had a line width of 1 μm (the line interval was 3 μμηι), and the area of the intersection 24 was ((10) 哗 2, the ripple was suppressed. The area Sb of the portion 26 is 0.0200 μm 2 (Example 2 to Example 4) The area Sb of the corrugation suppression portion 26 is set to 0 9 〇〇〇 μπι 2, 1.1000 μιη 2 and 5 0000 μπι 2, respectively, in addition to the above examples, The conductive films of Example 2, Example 3, and Example 4 were produced in the same manner. (Comparative Example 3, Comparative Example 4) The area Sb of the corrugation suppressing portion 26 was set to o. oioo μηι2 and 6·0000 μιη2, respectively. The conductive films of Comparative Example 3 and Comparative Example 4 were produced in the same manner as in the above Example (. (Example 5) The mesh pattern 20 of the conductive film of Example 5 which was produced had a line width of 3.0 μm (line interval of 300 μm), and was crossed. The area Sa of the portion 24 is 9 〇〇, and the area Sb of the corrugation suppressing portion 26 is 0.1800 μm 2 (Examples 6 to 8) The area Sb of the corrugation suppressing portion 26 is set to 8.1000 μm 2 , 9.9000 μm 2 and 45.0000 μm 2 ' In addition to the above example 56.it 20123263 The conductive film of Example 6, Example 7, and Example 8 was produced in the same manner. (Comparative Example 5, Comparative Example 6) The area Sb of the corrugation-inhibiting portion 26 was set to 0.0900 μm 2 and 54.0000 μm 2 , respectively, in addition to the above, Example 5 A conductive film of Comparative Example 5 and Comparative Example 6 was produced in the same manner. (Example 9) The mesh pattern 20 of the conductive film of Example 9 which was produced had a line width of 4.0 μm (line spacing of 3 μm μη), and was crossed. The area Sa of the portion 24 is 16·00 μm 2 and the area Sb of the corrugation suppressing portion 26 is 0.3200 μm 2 (Examples 10 to 12) The area Sb of the corrugation suppression portion 26 is set to 14.4000 μm 2 , 17.6000 μm 2 and 80.0000 μm 2 , respectively. The conductive films of Example 1A, Example η, and Example 12 were produced in the same manner as in the above Example 9. (Comparative Example 7 and Comparative Example 8) The area Sb of the corrugation suppressing portion 26 was set to 0.1600 μm 2 and 96.0000 μm 2 , respectively. In the same manner as in the above Example 9, the conductive films of Comparative Example 7 and Comparative Example 8 were produced. (Example 13) The mesh pattern 20 of the conductive film of Example 13 produced had a line width of 5.0 μm (line interval was 300). Ιι The area Sa of the intersection portion 24 is 25.00 μm 2 and the area Sb of the corrugation suppression portion 26 is 0.5000 μm 2 (Examples 14 to 16) The area Sb of the corrugation suppression portion 26 is set to 22.5000 μm 2 , 27.5000 μη 2 , and 125.0000 μιη 2 , respectively. Except for this point, the conductive films of Example 14, Example 15, and Example 16 were produced in the same manner as in the above-mentioned Example 13, 201232632. (Comparative Example 9 and Comparative Example 1) The conductive films of Comparative Example 9 and Comparative Example 10 were produced in the same manner as in Example 13 except that the area Sb of the corrugated-preventing portion 26 was changed to 0.2500 μm 2 and 150.0000 μm 2 , respectively. (Example 17) The mesh pattern 20 of the conductive film of Example 17 produced had a line width of 8.0 μm (line spacing of 300 μm), and the area Sa of the intersection portion 24 was 64.00 μm 2'. The area Sb of the corrugation suppressing portion 26 was 1.2800. Ιιη2. (Examples 18 to 20) The areas Sb of the corrugation suppressing portions 26 were set to 57.6000 μm 2 , 70.4000 μm 2 , and 320.0000 μm 2 , respectively, and the conductive of Example 18, Example 19, and Example 20 were produced in the same manner as in the above Example 除. membrane. (Comparative Example 11 and Comparative Example 12) A conductive film of Comparative Example 11 and Comparative Example 12 was produced in the same manner as in Example 17 except that the area Sb of the corrugation suppressing portion 26 was 0.6400 μm 2 and 384.0000 μm 2 , respectively. (Example 21) The mesh pattern 20 of the conductive film of Example 21 produced had a line width of 9.0 μm (line spacing of 300 μm), the area Sa of the intersection portion 24 was 81.00 μm 2 , and the area Sb of the bellows suppression portion 26 was 1.6200. Ιιη2. (Example 22 to Example 24) The area Sb of the corrugation suppressing portion 26 was set to 72.9000 μιη 2, respectively.

201232632 89.1000 μιη2以及405.0000 μηι2,除此方面以外，與上述實 例21同樣地製作實例22、實例23以及實例24的導電膜。 (比較例13、比較例14) 將波紋抑止部26的面積Sb分別設為0.8100 μιη2以及 486.0000 μιη2 ’除此方面以外，與上述實例21同樣地製作 比較例13以及比較例14的導電膜。 (實例25) 已製作的實例25的導電膜的網眼圖案20的線寬為 10.0 μιη(線間隔為300 μιη)’交又部24的面積Sa為100.00 μιη2 ’波紋抑止部26的面積Sb為2.0000 μιη2。 (實例26〜實例28) 將波紋抑止部26的面積Sb分別設為90.0000 μιη2、 110.0000 μιη2以及500.0000 μιη2 ’除此方面以外，與上述 實例25同樣地製作實例26、實例27以及實例28的導電 膜。 (比較例15、比較例16) 將波紋抑止部26的面積Sb分別設為1 .〇〇〇〇 μιη2以及 600.0000 μιη2 ’除此方面以外，與上述實例25同樣地製作 比較例15以及比較例16的導電膜。 (實例29) 已製作的實例29的導電膜的網眼圖案20的線寬為 15.0 μιη(線間隔為3〇〇 μιη)’交叉部24的面積Sa為225.00 μιη2，波紋抑止部26的面積Sb為4.5000 μιη2。 (實例30〜實例32) 59 201232632 將波紋抑止部26的面積Sb分別設為202.5000 μιη2、 247.5000 μιη2以及ι125 〇〇〇〇μιη2,除此方面以外，與上述 實例29同樣地製作實例3〇、實例31以及實例32的導電 膜。 (比較例17、比較例18) 將波紋抑止部26的面積Sb分別設為2.2500 μιη2以及 1350·0000 μιη2，除此方面以外，與上述實例29同樣地製 作比較例17以及比較例18的導電膜。 (參考例5) 已製作的參考例5的導電膜的網眼圖案20的線寬為 20.0 μιη(線間隔為300㈣），交叉部24的面積Sa為4〇〇 〇〇 μιη2，波紋抑止部26的面積sb為8.0000 μιη2。 (參考例6〜參考例8) 將波紋抑止部26的面積Sb分別設為360.0000 μιη2、 440.0000 μιη2以及2000.0000 pm2，除此方面以外，與上述 參考例5同樣地製作參考例6、參考例7以及參考例8的 導電膜。 (比較例19、比較例20) 將波紋抑止部26的面積Sb分別設為4.0000 μιη2以及 2400.0000 μΓη2 ’除此方面以外，與上述參考例5同樣地製 作比較例19以及比較例20的導電膜。 (表面電阻測定） 為了確認檢測精度的良否，利用Dia Instruments公司 製Loresta GP (型號MCP_T610 )直列4探針探頭（Asp) ,if 201232632 =任思10處測定導電賴表面餘率’糊定值的平均 (透射率的測定） 定透ίί確料·的良否，使时光光度計對導電_ (波紋的評價） 1 4」貫例1〜貫例32、比較例1〜比較例20、參者 板〜1;8 :匕分=導電膜貼附於顯示裝置157的顯示: 置⑸以使,1:裝置157設置於轉盤’鶴顯示裝 〜着之間旋轅色。在此狀態下，使轉盤在偏移角柳 為評严用的is _。進仃波紋的目測觀察、評價。再者，作 PC d^la ( U 叶，用 ΗΡ 公司製的 Ρ—〇η N〇teb〇〇k 央寸光澤液晶WXGA/1366x768：)。 觀察ΐ=:是:顯皮=”7的顯示畫面以^的 為盈問題的等的情況記為。，將波紋 著化的A $微會被相的情況記為△，將波紋顯 =f二广。並且’作為綜合得分，將成為。的角度 的情況記為為/A將成為。的角度範圍不足1〇。 範圍不足30。的情、兄為0的角度範圍而成為X的角度 61 201232632 [表3] 線寬 (μηι) Sa (μηι2) Sb (μ™2) Sb/Sa 波紋 導電性 透光性 比較例1 0.5 0.25 0.0025 0.01 c X ◎ 參考例1 0.5 0.25 0.0050 0.02 B X ◎ 參考例2 0.5 0.25 0.2250 0.90 B X ◎ 參考例3 0.5 0.25 0.2750 1.10 B X ◎ 參考例4 0.5 0.25 1.2500 5.00 B X ◎ 比較例2 0.5 0.25 1.5000 6.00 C X ◎ 比較例3 1.0 1.00 0.0100 0.01 C o ◎ 實例1 1.0 1.00 0.0200 0.02 B 〇 ◎ 實例2 1.0 1.00 0.9000 0.90 A 〇 ◎ 實例3 1.0 1.00 1.1000 1.10 A 〇 ◎ 實例4 1.0 1.00 5.0000 5.00 B 〇 ◎ 比較例4 1.0 1.00 6.0000 6.00 C 〇 ◎ 比較例5 3.0 9.00 0.0900 0.01 C 〇 ◎ 實例5 3.0 9.00 0.1800 0.02 B 〇 ◎ 實例6 3.0 9.00 8.1000 0.90 A 〇 ◎ 實例7 3.0 9.00 9.9000 1.10 A 〇 ◎ 實例8 3.0 9.00 45.0000 5.00 B 〇 ◎ 比較例6 3.0 9.00 54.0000 6.00 C 〇 〇 比較例7 4.0 16.00 0.1600 0.01 C 〇 ◎ 實例9 4.0 16.00 0.3200 0.02 B 〇 ◎ 實例10 4.0 16.00 14.4000 0.90 A 〇 ◎ 實例11 4.0 16.00 17.6000 1.10 A 〇 ◎ 實例12 4.0 16.00 80.0000 5.00 B 〇 比較例8 4.0 16.00 96.0000 6.00 C 〇 〇 比較例9 5.0 25.00 0.2500 0.01 C ◎ ◎ 實例13 5.0 25.00 0.5000 0.02 B ◎ ◎ 實例14 5.0 25.00 22.5000 0.90 A ◎ ◎ 實例15 5.0 25.00 27.5000 1.10 A ◎ ◎ 實例16 5.0 25.00 125.0000 5.00 B ◎ ◎ 比較例10 5.0 25.00 150.0000 6.00 C ◎ 〇 62 201232632 jy [表4]A conductive film of Example 22, Example 23, and Example 24 was produced in the same manner as in the above Example 21 except for the above. (Comparative Example 13 and Comparative Example 14) A conductive film of Comparative Example 13 and Comparative Example 14 was produced in the same manner as in Example 21 except that the area Sb of the corrugated-inhibiting portion 26 was 0.8100 μm 2 and 486.0000 μm 2 ′, respectively. (Example 25) The mesh pattern 20 of the conductive film of Example 25 produced had a line width of 10.0 μm (line spacing of 300 μm). The area Sa of the intersection portion 24 was 100.00 μm 2 The area Sb of the corrugation suppressing portion 26 was 2.0000 μιη2. (Examples 26 to 28) The conductive film of Example 26, Example 27, and Example 28 was produced in the same manner as in Example 25 except that the area Sb of the corrugation suppressing portion 26 was set to 90.0000 μm 2 , 110.0000 μm 2 and 500.0000 μm 2 , respectively. . (Comparative Example 15 and Comparative Example 16) Comparative Example 15 and Comparative Example 16 were produced in the same manner as in Example 25 except that the area Sb of the corrugation suppressing portion 26 was set to 1. 〇〇〇〇μιη2 and 600.0000 μηη2. Conductive film. (Example 29) The mesh pattern 20 of the conductive film of Example 29 produced had a line width of 15.0 μm (line spacing was 3 μm). The area Sa of the intersection portion 24 was 225.00 μm 2 , and the area Sb of the bellows suppression portion 26 It is 4.5000 μιη2. (Example 30 to Example 32) 59 201232632 The area Sb of the corrugation suppressing portion 26 was set to 202.5000 μm 2 , 247.5000 μm 2 and ι 125 〇〇〇〇 ι 2 , respectively. 31 and the conductive film of Example 32. (Comparative Example 17 and Comparative Example 18) A conductive film of Comparative Example 17 and Comparative Example 18 was produced in the same manner as in Example 29 except that the area Sb of the corrugation suppressing portion 26 was set to 2.2500 μm 2 and 1350·0000 μm 2 , respectively. . (Reference Example 5) The mesh pattern 20 of the conductive film of Reference Example 5 which was produced had a line width of 20.0 μm (line interval of 300 (four)), and the area Sa of the intersection portion 24 was 4 μm 2 , and the corrugation suppression portion 26 The area sb is 8.000 μιη2. (Reference Example 6 to Reference Example 8) Reference Example 6 and Reference Example 7 were produced in the same manner as in Reference Example 5 except that the area Sb of the corrugation suppression portion 26 was 360.0000 μm 2 , 440.0000 μm 2 and 2000.0000 pm 2 , respectively. The conductive film of Reference Example 8. (Comparative Example 19 and Comparative Example 20) A conductive film of Comparative Example 19 and Comparative Example 20 was produced in the same manner as in Reference Example 5 except that the area Sb of the corrugation suppressing portion 26 was set to 4.0000 μm 2 and 2400.0000 μΓη2, respectively. (Measurement of surface resistance) In order to confirm the accuracy of the detection, a Loresta GP (model MCP_T610) in-line 4-probe probe (Asp) manufactured by Dia Instruments, if 201232632 = Rensi 10, was used to measure the surface margin of the conductive surface. Average (Measurement of Transmittance) Determined whether or not the quality of the material is good or not, so that the time photometer is conductive _ (evaluation of the ripple) 1 4" Example 1 to Example 32, Comparative Example 1 to Comparative Example 20, and the member plate 〜1;8: 匕分=The display of the conductive film attached to the display device 157: (5) so that 1: the device 157 is placed on the turntable 'the crane display is placed between the rotations. In this state, the turntable is used to evaluate the is _ at the offset angle. Visual observation and evaluation of the ripples. Furthermore, as PC d^la (U-leaf, ΡN〇teb〇〇k 寸 光泽 光泽 〇 央 央 央 央 央 央 央 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Observation ΐ =: Yes: The display screen of the display skin = "7" is recorded as the problem of the profit of ^, and the A $ micro of the corrugation is marked as △ by the phase, and the ripple is displayed = f In the case of the angle of the angle, the angle of the angle is less than one. The range of the angle is less than 30. 201232632 [Table 3] Line width (μηι) Sa (μηι2) Sb (μTM2) Sb/Sa Corrugated conductive light transmittance Comparative Example 1 0.5 0.25 0.0025 0.01 c X ◎ Reference Example 1 0.5 0.25 0.0050 0.02 BX ◎ Reference example 2 0.5 0.25 0.2250 0.90 BX ◎ Reference Example 3 0.5 0.25 0.2750 1.10 BX ◎ Reference Example 4 0.5 0.25 1.2500 5.00 BX ◎ Comparative Example 2 0.5 0.25 1.5000 6.00 CX ◎ Comparative Example 3 1.0 1.00 0.0100 0.01 C o ◎ Example 1 1.0 1.00 0.0200 0.02 B 〇 ◎ Example 2 1.0 1.00 0.9000 0.90 A 〇 ◎ Example 3 1.0 1.00 1.1000 1.10 A 〇 ◎ Example 4 1.0 1.00 5.0000 5.00 B 〇 ◎ Comparative Example 4 1.0 1.00 6.0000 6.00 C 〇 ◎ Comparative Example 5 3.0 9.00 0.0900 0.01 C 〇 ◎ Example 5 3.0 9.00 0.1800 0 .02 B 〇 ◎ Example 6 3.0 9.00 8.1000 0.90 A 〇 ◎ Example 7 3.0 9.00 9.9000 1.10 A 〇 ◎ Example 8 3.0 9.00 45.0000 5.00 B 〇 ◎ Comparative Example 6 3.0 9.00 54.0000 6.00 C 〇〇Comparative Example 7 4.0 16.00 0.1600 0.01 C 〇 ◎ Example 9 4.0 16.00 0.3200 0.02 B 〇 ◎ Example 10 4.0 16.00 14.4000 0.90 A 〇 ◎ Example 11 4.0 16.00 17.6000 1.10 A 〇 ◎ Example 12 4.0 16.00 80.0000 5.00 B 〇Comparative Example 8 4.0 16.00 96.0000 6.00 C 〇〇Comparative Example 9 5.0 25.00 0.2500 0.01 C ◎ ◎ Example 13 5.0 25.00 0.5000 0.02 B ◎ ◎ Example 14 5.0 25.00 22.5000 0.90 A ◎ ◎ Example 15 5.0 25.00 27.5000 1.10 A ◎ ◎ Example 16 5.0 25.00 125.0000 5.00 B ◎ ◎ Comparative Example 10 5.0 25.00 150.0000 6.00 C ◎ 〇62 201232632 jy [Table 4]

線寬 (μιη) Sa (μηι2) Sb (μιη2) Sb/Sa 波紋 導電性 透光性 比較例11 8.0 64.00 0.6400 0.01 c ◎ ◎ 實例17 8.0 64.00 1.2800 0.02 B ◎ ◎ 實例18 8.0 64.00 57.6000 0.90 A ◎ ◎ 實例19 8.0 64.00 70.4000 1.10 A ◎ ◎ 實例20 8.0 64.00 320.0000 5.00 B ◎ ◎ 比較例12 8.0 64.00 384.0000 6.00 C ◎ 〇 比較例13 9.0 81.00 0.8100 0.01 C ◎ ◎ 實例21 9.0 81.00 1.6200 0.02 B ◎ ◎ 實例22 9.0 81.00 72.9000 0.90 A ◎ ◎ 實例23 9.0 81.00 89.1000 1.10 A ◎ ◎ 實例24 9.0 81.00 405.0000 5.00 B ◎ ◎ 比較例14 9.0 81.00 486.0000 6.00 C ◎ 〇 比較例15 10.0 100.00 1.0000 0.01 C ◎ ◎ 實例25 10.0 100.00 2.0000 0.02 B ◎ ◎ 實例26 10.0 100.00 90.000 0.90 A ◎ ◎ 實例27 10.0 100.00 110.0000 1.10 A ◎ ◎ 實例28 10.0 100.00 500.0000 5.00 B ◎ ◎ 比較例16 10.0 100.00 600.0000 6.00 C ◎ 〇 比較例17 15.0 225.00 2.2500 0.01 C ◎ ◎ 實例29 15.0 225.00 4.5000 0.02 B ◎ ◎ 實例30 15.0 225.00 202.5000 0.90 A ◎ ◎ 實例31 15.0 225.00 247.5000 1.10 A ◎ ◎ 實例32 15.0 225.00 1125.0000 5.00 B ◎ ◎ 比較例18 15.0 225.00 1350.0000 6.00 C ◎ 〇 比較例19 20.0 400.00 4.0000 0.01 D ◎ Δ 參考例5 20.0 400.00 8.0000 0.02 C ◎ Δ 參考例6 20.0 400.00 360.0000 0.90 C ◎ Δ 參考例7 20.0 400.00 440.0000 1.10 C ◎ Δ 參考例8 20.0 400.00 2000.0000 5.00 C ◎ Δ 比較例20 20.0 400.00 2400.0000 6.00 D ◎ X 根據表3以及表4，滿足Sax0_01&lt;SbSSax5.00的實 例1〜實例32的波紋、導電性、透光性皆為良好。尤其， 63 201232632 滿足Sax〇.90$SbSSaxl.lO的實例2、實例3、實例6、實 例7、實例1〇、實例u、實例14、實例15、實例18、實 例19、貫例22、實例23、實例26、實例27、實例30、實 例31未產生波紋。與此相對，比較例比較例2〇的波 紋皆顯著化。 使用上述實例1〜實例32的導電膜，分別製作投影型 電容方式的觸控面板。波紋皆未顯著化。又，用手指進行 觸摸操作，結果可知，響應速度快’檢測感度優異。又， 對2點以上進行觸控操作，結果同樣獲得良好的結果，可 確認亦能對應於多點觸控（multi_t〇uch )。 [第2實例] 第2實例是對使用實例41〜實例5〇、比較例21〜比 較例27的接著膜的構成物的可見光透射率、視認性進行測 定。將結果示於表5及表6。 (實例41) &lt;接著膜1的製作例〉 使用厚度50 μιη的透明ΡΕΊΓ膜（折射率n= 1 575)作 為透明基體12，於該透明基體12上，隔著成為接著層 的環氧系接著片（NlKAPLEXSAF;Nikkan工業（股）製， n= 1.58)，以導電材料即厚度2μιη的金箔的粗化面成為環 氧系接著片側的方式，以180°C、30kgf/crn2的條件進行2 熱層壓而使該金箔接著。對於所獲得的附金箔的pET膜， 經過光微影步驟（光阻膜貼附_曝光-顯影-化學蝕刻·光阻膜 剝離）’於PET膜上形成排列有由金屬細線16構成的多個 64 201232632 方二狀)的導電圖案’獲得構成材料1。金屬細 3線：的線i為6哗’金屬細線16間的間隔 3〇〇 。於該構成材料i上，以乾燥 的方式來塗佈後賴透明包覆層1並乾燥，獲彳t有透 =接著膜i。然後，使聽式層壓機，以靴、2〇kgf/cm2 :件’將接著膜i加熱壓接於市售的亞克力板 (Comoglas，（股）Kuraray 製’厚度 3 mm )。 (實例42) &lt;接著膜2的製作例&gt; ▲使用厚度25 μπι的透明PET膜作為透明基體12，於 該透明基體I2上，赋層壓機並幻机、2Qkg/cm2 的條件，隔著成為接著層14的Pyralux LF.〇⑺叩⑽ JapanLunited製，丙烯酸系接著膜，n=1 47)而層壓導電 材料即厚度3 μιη的金箱。對於該附金箱的ρΕτ膜，經過 與接著膜1的製作例同樣的光微影步驟，於ΡΕΤ膜上形成 排列有由金屬細線16構成的多個格子（正方形狀)'的導電 圖案，獲得構成材料2。金屬細線16的線寬為6 _，線 間隔為200卿。於該構成材料2上，以乾燥塗佈厚度為約 10 μηι的方式來塗佈後述的透明包覆層2並乾燥，獲得具 有透明性的接著膜2。然後，以110。〇 鐘的條件，使用熱壓機將接著膜2加熱壓接於市售的亞克 力板。 (實例43 ) &lt;接著膜3的製作例&gt; 65 201232632 使用厚度50 μι„的透明PET膜作為 &amp; 該透明基體12上，利用輥式層壓機並以 土 、2 的條件，隔著成為接著層14的p gemLine width (μιη) Sa (μηι2) Sb (μιη2) Sb/Sa Corrugated conductive light transmittance Comparative Example 11 8.0 64.00 0.6400 0.01 c ◎ ◎ Example 17 8.0 64.00 1.2800 0.02 B ◎ ◎ Example 18 8.0 64.00 57.6000 0.90 A ◎ ◎ Example 19 8.0 64.00 70.4000 1.10 A ◎ ◎ Example 20 8.0 64.00 320.0000 5.00 B ◎ ◎ Comparative Example 12 8.0 64.00 384.0000 6.00 C ◎ 〇Comparative Example 13 9.0 81.00 0.8100 0.01 C ◎ ◎ Example 21 9.0 81.00 1.6200 0.02 B ◎ ◎ Example 22 9.0 81.00 72.9000 0.90 A ◎ ◎ Example 23 9.0 81.00 89.1000 1.10 A ◎ ◎ Example 24 9.0 81.00 405.0000 5.00 B ◎ ◎ Comparative Example 14 9.0 81.00 486.0000 6.00 C ◎ 〇Comparative Example 15 10.0 100.00 1.0000 0.01 C ◎ ◎ Example 25 10.0 100.00 2.0000 0.02 B ◎ ◎ Example 26 10.0 100.00 90.000 0.90 A ◎ ◎ Example 27 10.0 100.00 110.0000 1.10 A ◎ ◎ Example 28 10.0 100.00 500.0000 5.00 B ◎ ◎ Comparative Example 16 10.0 100.00 600.0000 6.00 C ◎ 〇Comparative Example 17 15.0 225.00 2.2500 0.01 C ◎ ◎ Example 29 15.0 225.00 4.5000 0.02 B ◎ ◎ Example 30 15.0 225.00 202.5000 0.90 A ◎ ◎ Example 31 15.0 225.00 247.5000 1.10 A ◎ ◎ Example 32 15.0 225.00 1125.0000 5.00 B ◎ ◎ Comparative Example 18 15.0 225.00 1350.0000 6.00 C ◎ 〇Comparative Example 19 20.0 400.00 4.0000 0.01 D ◎ Δ Reference Example 5 20.0 400.00 8.0000 0.02 C ◎ Δ Reference Example 6 20.0 400.00 360.0000 0.90 C ◎ Δ Reference Example 7 20.0 400.00 440.0000 1.10 C ◎ Δ Reference Example 8 20.0 400.00 2000.0000 5.00 C ◎ Δ Comparative Example 20 20.0 400.00 2400.0000 6.00 D ◎ X According to Table 3 and Table 4, The ripples, conductivity, and light transmittance of Examples 1 to 32 of Sax0_01 & SbSSax5.00 were all good. In particular, 63 201232632 Instance 2, Example 3, Instance 6, Instance 7, Example 1, u, Instance 14, Instance 15, Instance 18, Instance 19, Example 22, Example satisfying Sax 〇.90$SbSSaxl.lO 23. Example 26, Example 27, Example 30, and Example 31 did not produce ripples. On the other hand, in the comparative example, the ridges of Comparative Example 2 were remarkable. Using the conductive films of the above Examples 1 to 32, a projection type capacitive touch panel was produced. The ripples are not significant. Further, when the touch operation was performed with a finger, it was found that the response speed was fast and the detection sensitivity was excellent. Moreover, when the touch operation is performed on two or more points, the result is also good, and it can be confirmed that it can correspond to multi-touch (multi_t〇uch). [Second example] The visible light transmittance and visibility of the constituents of the adhesive films of Examples 41 to 5 and Comparative Examples 21 to 27 were measured. The results are shown in Tables 5 and 6. (Example 41) &lt;Example of Preparation of Adhesive Film 1> A transparent ruthenium film (refractive index n = 1 575) having a thickness of 50 μm was used as the transparent substrate 12, and an epoxy resin which was an adhesive layer on the transparent substrate 12 was interposed therebetween. In the next sheet (NlKAPLEXSAF; manufactured by Nikkan Industrial Co., Ltd., n = 1.58), the roughened surface of the gold foil having a thickness of 2 μm, which is a conductive material, was formed on the epoxy-based sheet side, and was carried out under conditions of 180 ° C and 30 kgf/crn 2 . The gold foil is subsequently laminated by heat lamination. With respect to the obtained pET film with a gold foil, a plurality of thin metal wires 16 are formed on the PET film by a photolithography step (photoresist film attachment_exposure-development-chemical etching/resist film peeling). 64 201232632 The conductive pattern ' of the square shape) is obtained as the constituent material 1. Metal thin 3 line: The line i is 6 哗' the interval between the metal thin wires 16 is 3〇〇. On the constituent material i, the transparent coating layer 1 was applied in a dry manner and dried to obtain a transparent film. Then, the pad laminator was heated and pressure-bonded to a commercially available acrylic sheet (Comoglas, manufactured by Kuraray, thickness 3 mm) with a shoe, 2 〇 kgf/cm 2 : piece. (Example 42) &lt;Production Example of Adhesive Film 2&gt; ▲ A transparent PET film having a thickness of 25 μm was used as the transparent substrate 12, and a laminator and a machine, a condition of 2Qkg/cm2 were placed on the transparent substrate I2. A gold box having a thickness of 3 μm, which is a conductive material, is laminated as Pyralux LF.〇(7)叩(10) manufactured by Japan Lunited, manufactured by Japan Lunited, and n=147). In the ρΕτ film of the gold box, a conductive pattern in which a plurality of lattices (square shapes) composed of metal thin wires 16 are arranged is formed on the ruthenium film by the same photolithography step as in the production example of the adhesive film 1. Composition material 2. The metal thin line 16 has a line width of 6 _ and a line spacing of 200 sec. The transparent coating layer 2 to be described later is applied to the constituent material 2 so as to have a dry coating thickness of about 10 μm, and dried to obtain a film 2 having transparency. Then, to 110. Under the conditions of the clock, the adhesive film 2 was heated and crimped to a commercially available acrylic plate using a hot press. (Example 43) &lt;Preparation Example of Adhesive Film 3&gt; 65 201232632 A transparent PET film having a thickness of 50 μm was used as &amp; This transparent substrate 12 was placed on a transparent laminator 12 by a roll laminator under the conditions of soil and 2 Become the p gem of the layer 14

JapanLimited，丙稀酸系接著膜％ I 材料即厚度1 μιη的金箱。對 曰 ㈣m μ制n 靖金_服膜，經過 ”接者膜1攸作綱制光微影步驟，於航 排列有由金屬細線16構成的多個格子（正方形狀)、的導電 ^為?(Γ成材料3。金屬細線16的線寬為…’線 成材料3上，以乾燥塗佈厚度為約 μ的方式來塗佈後述的透明包覆層3並乾燥獲得且 ==的接著膜3。然後，以11〇ΐ、3〇kgW、3〇 ; t條件’使用熱壓機將接著膜3加熱壓接於市售的亞克 &lt;透明包覆層1的組成物&gt; 聰（日立化成工業（股）製；高 重量份、购叫東都化成⑷ (於^认氧樹脂）25重量份、1PDI (日立化成工業 公製:遮罩異氛_12.5重量份、2_乙基冰甲基咪 透日^ 330重量份、環己嗣15重量份、上述 =包覆相成分賴於ΜΕΚ及環己酮，製作透明包覆 二的清漆。賴清漆流驗麵魅進行加熱乾燥所得 的膜的折射率為1.57。 &lt;透明包覆層2的組成物&gt; 使ΥΡ-30 (東都化成（股）製；苯氧基樹脂，_=6 66 201232632 ^ &gt;· /JapanLimited, acrylic acid-based film % I material is a gold box with a thickness of 1 μηη. For the 四(4)m μ system n Jingjin _ film, after the "film of the film 1 攸 攸 攸 攸 攸 纲 纲 , , , , , 排列 排列 排列 排列 排列 排列 排列 排列 排列 排列 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? (Cleaning material 3. The line width of the metal thin wire 16 is ...' on the wire forming material 3, and the transparent coating layer 3 described later is applied so as to have a dry coating thickness of about μ, and dried to obtain an adhesive film of == 3. Then, 11 〇ΐ, 3 〇 kgW, 3 〇; t condition 'heating and bonding the film 3 to the commercially available yake &lt; composition of the transparent coating layer 1 using a hot press&gt; Hitachi Chemical Industry Co., Ltd.; high-volume, purchased Dongdu Huacheng (4) (in the oxygen resin) 25 parts by weight, 1PDI (Hitachi Chemical Industry metric: masking atmosphere _12.5 parts by weight, 2_ethyl ice 100 mg parts by weight of methyl methoxide, 15 parts by weight of cyclohexyl quinone, and the above-mentioned = coating phase components depend on hydrazine and cyclohexanone to prepare a varnish of transparent coating 2. The varnish is exposed to heat and dried. The refractive index of the film was 1.57. &lt;Composition of the transparent coating layer&gt; ΥΡ-30 (made by Dongdu Chemical Co., Ltd.); phenoxy resin, _=6 66 2012 32632 ^ &gt;· /

萬）100重量份、YD-8125 (東都化成（股）製；雙酚A 型環氧樹脂）10重量份、IPDI (日立化成工業（股）製； 遮罩異氰酸酯）5重量份、2-乙基-4-甲基咪唑0.3重量份、 MEK 285重量份、環己酮5重量份、上述透明包覆層的成 分溶解於MEK及環己酮，製作透明包覆層2的清漆。將 該清漆流延於玻璃板並進行加熱乾燥所得的膜的折射率為 1.55 〇 &lt;透明包覆層3的組成物&gt; 使HTR-600LB (帝國化學產業（股）製；聚丙烯酸酯， Mw=70萬）100重量份、Coronate L(曰本聚胺曱酸酷（股） 製，3官能異氰酸酯）4.5重量份、二月桂酸二丁基錫〇 4 重量份、甲苯450重量份、乙酸乙酯1〇重量份、上述透明 包覆層的成分溶解於曱苯及乙酸乙酯，製作透明包覆層3 的清漆。將該清漆流延於玻璃板並進行加熱乾燥所得的 的折射率為1.47。 、 (實例44) 除了將金屬細線16的線寬設為9 μιη以外，鱼實似 同樣地獲得接著膜。 w例4i (實例45) 除了將金屬細線16的線寬設為i μιη以外，盥實 同樣地獲得接著膜。 ^Μ2 (實例46) 除了將金屬細線16的線間隔設為500 μιη以外，與每 例43同樣地獲得接著膜。 〃只 67 201232632 (實例47) 除了將金屬細線16的線間隔設為200 μιη以外，與實 例41同樣地獲得接著膜。 (實例48) 除了將透明基體12的厚度設為25 μιη以外，與實例 41同樣地獲得接著膜。 (實例49) 將透明基體12的厚度設為50 μιη，將金屬細線16的 線間隔設為300 μιη，將厚度設為2 μιη，除了此方面以外， 與實例42同樣地獲得接著膜。 (實例50) 將金屬細線16的線寬設為6 μιη，將厚度設為2 μιη， 除了此方面以外，與實例43同樣地獲得接著膜。 (比較例21 ) 除了將金屬細線16的線寬設為20 μιη以外，與實例 41同樣地獲得接著膜。 (比較例22) 除了將金屬細線16的線間隔設為20 μιη以外，與實 例42同樣地獲得接著膜。 (比較例23 ) 除了將金屬細線16的厚度設為15 μηι以外，與實例 42同樣地獲得接著膜。 (比較例24) 使用透明包覆層4{笨酚-曱醛樹脂（Mw=5萬，η=1.73)} 68 it 201232632 作為透明包覆層64，除了此方面以外，與實例41同樣地 獲得接著膜。 (比較例25) 使用透明包覆層5{聚二曱基矽氧烷（Mw=4.5萬， n=1.43) }作為透明包覆層64，除了此方面以外，與實例 43同樣地獲得接著膜。 (比較例26) 使用透明包覆層6{聚偏二氟乙烯（Mw=12萬，n=1.42)} 作為透明包覆層64，除了此方面以外，與實例43同樣地 獲得接著膜。 (比較例27) 使用厚度為60 μηι的含有填充劑的聚乙烯膜（可見光 透射率為20%以下）作為透明基體12，除了此方面以外， 與實例41同樣地獲得接著膜。 對使用有以上述方式獲得的接著膜的構成物的可見光 透射率、視認性進行測定。將結果表示於表5與表6中。 69 201232632 J-a6 寸卜 6e 鬥 光學特性 視認性 I良好| jtfU jQid. ▲ 可見光透射率 (%) oo 〇 t^· § IQ 卜 接著劑 接著劑1 (η=1.57) 接著劑2 (n=1.55) 接著劑3 (η=1·47) 接著劑1 接著劑2 接著劑3 接著劑1 接著劑1 接著劑2 接著劑3 導電圖案 厚度 (μιη) (Ν m CN m CN (Ν (N (Ν 線間隔 (μηι) 300 __1 200 300 300 200 500 200 300 300 〇 線寬 (μπ〇 Os ν—^ Ο VO 圖案形成法 化學钱刻 化學蝕刻 化學蝕刻 化學敍刻 化學蝕刻 化學姓刻 化學姓刻 化學蝕刻 化學钱刻 i 化學ϋ刻 導電性材料 金箔 金箔 金箔 金箔 金箔 |金箔| |金箔| 金箔 |金箔| 金箔 透明基體 厚度 (μηι) CN yr) CA (N 材料 PET PET PET 1 PET I PET 1 1 PET 1 PET I PET I PET I PET 實例41 實例42 實例43 1實例44 1實例45 實例46 實例47 實例48 |實例49 實例50 201232632100 parts by weight, YD-8125 (manufactured by Tohto Kasei Co., Ltd.; bisphenol A type epoxy resin) 10 parts by weight, IPDI (manufactured by Hitachi Chemical Co., Ltd.; mask isocyanate) 5 parts by weight, 2-B 0.3 parts by weight of benzyl-4-imidazole, 285 parts by weight of MEK, and 5 parts by weight of cyclohexanone, and the components of the transparent coating layer were dissolved in MEK and cyclohexanone to prepare a varnish of the transparent coating layer 2. The film obtained by casting the varnish on a glass plate and heating and drying has a refractive index of 1.55 Å &lt;Composition of transparent coating layer &gt; HTR-600LB (manufactured by Imperial Chemical Industry Co., Ltd.; polyacrylate, Mw=700,000 parts) 100 parts by weight, Coronate L (manufactured by 曰 聚 聚 , , ,, trifunctional isocyanate) 4.5 parts by weight, dibutyltin dilaurate 4 parts by weight, toluene 450 parts by weight, ethyl acetate One part by weight of the transparent coating layer was dissolved in toluene and ethyl acetate to prepare a varnish of the transparent coating layer 3. The varnish was cast on a glass plate and dried by heating to have a refractive index of 1.47. (Example 44) The fish was similarly obtained as the adhesive film except that the line width of the fine metal wires 16 was set to 9 μm. wExample 4i (Example 45) A film was obtained in the same manner as the wire width of the metal thin wire 16 was set to i μm. ^Μ2 (Example 46) An adhesive film was obtained in the same manner as in Example 43, except that the line interval of the fine metal wires 16 was changed to 500 μm. 67 only 67 201232632 (Example 47) An adhesive film was obtained in the same manner as in Example 41 except that the line interval of the fine metal wires 16 was changed to 200 μm. (Example 48) An adhesive film was obtained in the same manner as in Example 41 except that the thickness of the transparent substrate 12 was changed to 25 μm. (Example 49) An adhesive film was obtained in the same manner as in Example 42 except that the thickness of the transparent substrate 12 was changed to 50 μm, the line interval of the fine metal wires 16 was set to 300 μm, and the thickness was set to 2 μm. (Example 50) An adhesive film was obtained in the same manner as in Example 43 except that the line width of the fine metal wires 16 was set to 6 μm and the thickness was set to 2 μm. (Comparative Example 21) An adhesive film was obtained in the same manner as in Example 41 except that the line width of the fine metal wires 16 was 20 μm. (Comparative Example 22) An adhesive film was obtained in the same manner as in Example 42, except that the line interval of the fine metal wires 16 was 20 μm. (Comparative Example 23) An adhesive film was obtained in the same manner as in Example 42 except that the thickness of the fine metal wires 16 was changed to 15 μm. (Comparative Example 24) A transparent coating layer 4 (a phenol-furfural resin (Mw = 50,000, η = 1.73)) 68 it 201232632 was used as the transparent coating layer 64, except that the same as in Example 41. Then the film. (Comparative Example 25) An adhesive film was obtained in the same manner as in Example 43 except that the transparent coating layer 5 {polydidecyloxyl (Mw = 45,000, n = 1.43)} was used as the transparent coating layer 64. . (Comparative Example 26) An adhesive film was obtained in the same manner as in Example 43 except that the transparent coating layer 6 {polyvinylidene fluoride (Mw = 120,000, n = 1.42)} was used as the transparent coating layer 64. (Comparative Example 27) An adhesive film was obtained in the same manner as in Example 41 except that a polyethylene film containing a filler (having a visible light transmittance of 20% or less) having a thickness of 60 μm was used as the transparent substrate 12. The visible light transmittance and visibility of the composition using the adhesive film obtained as described above were measured. The results are shown in Tables 5 and 6. 69 201232632 J-a6 inch 6e bucket optical property visibility I is good | jtfU jQid. ▲ visible light transmittance (%) oo 〇t^· § IQ paste adhesive 1 (η=1.57) follower 2 (n= 1.55) Next agent 3 (η=1·47) Next agent 1 Next agent 2 Next agent 3 Next agent 1 Next agent 1 Next agent 2 Next agent 3 Conductive pattern thickness (μιη) (Ν m CN m CN (Ν (N ( Ν line spacing (μηι) 300 __1 200 300 300 200 500 200 300 300 〇 line width (μπ〇Os ν-^ Ο VO pattern formation method chemistry money etching chemical etching chemical etching chemical characterization chemical etching chemical surname chemical engraving chemical Etching chemistry money engraving i chemical engraving conductive material gold foil gold foil gold foil gold foil gold foil | gold foil | | gold foil | gold foil | gold foil | gold foil transparent substrate thickness (μηι) CN yr) CA (N material PET PET PET 1 PET I PET 1 1 PET 1 PET I PET I PET I PET Example 41 Example 42 Example 43 1 Example 44 1 Example 45 Example 46 Example 47 Example 48 | Example 49 Example 50 201232632

Jft6 寸卜 6rn 鬥9&lt;】 光學特性 1 視認性 NG ϋ NG I 1 1 1 1 可見光透射率 (%) 〇 § &lt;20 1 &lt;20 1 . 1 &lt;20 &lt;20 接著劑 1 _1 接著劑1 (n= 1.57) j 接著劑2 (η=1.55) 接著劑2 接著劑4 (n=1.73) 接著劑5 (n=l_43) 接著劑6 i (n=1.42) 接著劑1 導電圖案 厚度 (μιη) (N m &lt;N m CN 線間隔 (μιη) 300 200 | 300 I 300 200 500 200 線寬 (μηι) σ\ 圖案形成法 化學蝕刻 化學蝕刻 化學蝕刻 化學蝕刻 化學蝕刻 化學蝕刻 化學钮刻 導電性材料 金箔 金箔 金箔 金箔 金箔 金箔 金箔 透明基體 厚度 (μιη) (N &lt;N 材料 PET 1 PET PET PET PET PET 填充劑的聚乙烯 比較例21 比較例22 m &lt;N jj jj 比較例25 比較例26 |比較例2^1 201232632 可見光透射率的測定是使用雙光束分光光度計（（股） 曰立製作所製，200-10型），並使用400 nm〜800 nm的透 射率的平均值。視認性是自距〇·5 m的場所目測貼附於亞 克力板的接著膜，根據能否辨識出導電材料上描繪的導電 圖案來進行評價，將無法辨識的情況記為「良好」，將可辨 識的情況記為NG。 再者，本發明的觸控面板、觸控面板的製造方法以及 導電膜並不限於上述實施形態，當然可不脫離本發明的宗 旨而採用各種構成。 【圖式簡單說明】 圖1是表示第1實施形態的導電膜的一例的平面圖。 圖2是局部省略地表示導電膜的剖面圖。 圖3是將一部分予以放大來表示導電膜的一例的平面 圖。 圖4是將一部分予以放大來表示導電膜的其他例子的 平面圖。 圖5是將一部分予以放大來表示導電膜的又一例子的 平面圖。 圖6是將一部分予以放大來表示導電膜的又一例子的 平面圖。 圖7A〜圖7C是表示第1實施形態的導電膜的製造方 法的一例的步驟圖。 圖8是表示對於銀鹽感光層的數位寫入曝光中的曝光 能量與影像濃度的關係的特性圖。 72 201232632 圖9A以及圖9B是表示第1實施形態的導電膜的製造 方法的其他例子的步驟圖。 圖10A以及圖1 〇B是表示第1實施形態的導電膜的製 造方法的又一例子的步驟圖。 圖Π是表示第1實施形態的導電膜的製造方法的又一 例子的步驟圖。 圖12是局部省略地表示第2實施形態的導電膜的剖面 圖13Ag〜圖i3C是表示導電膜的製造方法的步驟圖。 圖14疋表示觸控面板的構成的分解立體圖。 圖15是局部省略地麵制導親的分解立體圖。Jft6 inch 6rr bucket 9&lt;] optical property 1 visibility NG ϋ NG I 1 1 1 1 visible light transmittance (%) 〇§ &lt;20 1 &lt;20 1 . 1 &lt;20 &lt;20 Follower 1 _1 Next Agent 1 (n = 1.57) j Subsequent 2 (η = 1.55) Subsequent 2 Subsequent agent 4 (n = 1.73) Subsequent agent 5 (n = l_43) Subsequent agent 6 i (n = 1.42) Subsequent agent 1 Conductive pattern thickness (μιη) (N m &lt;N m CN line spacing (μιη) 300 200 | 300 I 300 200 500 200 line width (μηι) σ\ patterning chemical etching chemical etching chemical etching chemical etching chemical etching chemical etching chemical button Conductive material gold foil gold foil gold foil gold foil gold foil gold foil gold foil transparent substrate thickness (μιη) (N &lt; N material PET 1 PET PET PET PET PET filler polyethylene comparative example 21 Comparative Example 22 m &lt; N jj jj Comparative Example 25 Comparison Example 26 | Comparative Example 2^1 201232632 The visible light transmittance was measured using a two-beam spectrophotometer (manufactured by Hitachi, Ltd., model 200-10), and an average value of transmittance of 400 nm to 800 nm was used. The visibility is attached to the acrylic sheet by visual inspection from a place of 〇·5 m. Then, the film is evaluated based on whether or not the conductive pattern drawn on the conductive material can be recognized, and the unrecognizable case is referred to as "good", and the identifiable condition is referred to as NG. Further, the touch panel of the present invention, touch The method of manufacturing the control panel and the conductive film are not limited to the above-described embodiments, and various configurations are possible without departing from the spirit of the invention. Fig. 1 is a plan view showing an example of a conductive film according to the first embodiment. 2 is a cross-sectional view showing a conductive film in a partially omitted manner. Fig. 3 is a plan view showing an example of a conductive film in an enlarged manner. Fig. 4 is a plan view showing another example of a conductive film in an enlarged manner. Fig. 6 is a plan view showing a further example of a conductive film in an enlarged manner. Fig. 7A to Fig. 7C are views showing an example of a method for producing a conductive film according to the first embodiment. Figure 8 is a diagram showing the relationship between the exposure energy and the image density in the digital write exposure of the silver salt photosensitive layer. Fig. 9A and Fig. 9B are process diagrams showing another example of the method for producing a conductive film according to the first embodiment. Fig. 10A and Fig. 1B are views showing another method of manufacturing the conductive film according to the first embodiment. Step diagram of the example. Fig. Π is a process chart showing still another example of the method for producing the conductive film of the first embodiment. Fig. 12 is a partially omitted view showing a cross section of a conductive film according to a second embodiment. Figs. 13Ag to i3C are process diagrams showing a method of manufacturing a conductive film. FIG. 14A is an exploded perspective view showing the configuration of the touch panel. Fig. 15 is an exploded perspective view partially omitting the ground guidance parent.

示將第1導電膜與第2導電膜加 圖2〇是局部省略地表示將第It is shown that the first conductive film and the second conductive film are added.

例子的平面圖。 輔助線與第2辅助線來形成一條 73A plan view of an example. The auxiliary line and the second auxiliary line form a 73

201232632 a L 線的狀態的說明圖。 【主要元件符號說明】 10a、10b :導電膜 10A :第1導電膜 10B :第2導電膜 12 :透明基體 12A :第1透明基體 12B :第2透明基體 14 :導電部 14A :第1導電部 14B :第2導電部 16 :金屬細線 16a :第1金屬細線 16b :第2金屬細線 18 :開口部 20 :網眼圖案 22 :網眼形狀 24 :交叉部 26 :波紋抑止部 26a :第1抑止部 26b :第2抑止部 26c :第3抑止部 26d :第4抑止部 62 :接著層 74 it 201232632 62a :第1接著層 62b :第2接著層 64 :透明包覆層 66 :金屬箔 120 :導電圖案 120A :第1導電圖案 120B :第2導電圖案 150 :觸控面板 154 :積層導電膜 157 :顯示裝置 158 :顯示面板 200A :第1補助圖案 200B :第2補助圖案 202A :第1大格子 202B :第2大格子 204 :小格子 206A :第1連接部 206B :第2連接部 208 :中格子201232632 a Diagram of the status of the L line. [Main component code description] 10a, 10b: Conductive film 10A: First conductive film 10B: Second conductive film 12: Transparent substrate 12A: First transparent substrate 12B: Second transparent substrate 14: Conductive portion 14A: First conductive portion 14B: second conductive portion 16: metal thin wire 16a: first metal thin wire 16b: second metal thin wire 18: opening portion 20: mesh pattern 22: mesh shape 24: intersection portion 26: ripple suppressing portion 26a: first suppression Part 26b: second suppressing portion 26c: third suppressing portion 26d: fourth suppressing portion 62: adhesive layer 74 it 201232632 62a: first adhesive layer 62b: second adhesive layer 64: transparent covering layer 66: metal foil 120: Conductive pattern 120A: first conductive pattern 120B: second conductive pattern 150: touch panel 154: laminated conductive film 157: display device 158: display panel 200A: first auxiliary pattern 200B: second auxiliary pattern 202A: first large lattice 202B: second large lattice 204: small lattice 206A: first connecting portion 206B: second connecting portion 208: middle lattice

Claims (1)

201232632 易 七、申請專利範固： 1·種觸控面板’包括對觸控位置進行檢測的導電膜 (10)，、上賴控吨㈣徵在於： 上述導電膜包括導電部（14)，上述導電部（14) 具有由金屬製的細線（16)形成的網眼圖案（2〇)， 於上述網眼圖案（20)的交叉部（24)，形成有使觸控 位置=檢測能力提高的觸控位置檢測能力提高部 (26)， 虽將上述父又部（24)的面積設為Sa，將上述觸控位 置檢測能力提高部（26)的面積設為Sb時， Sax〇.〇l&lt;Sb$Sax5.00。 如申請專利範圍第1項所述之觸控面板，其中當將 上述，叉部（24)的面積設為Sa，將上賴控位置檢測能 力提高部（26)的面積設為Sb時， Sax〇.5〇SSb$Sa&gt;&lt;5.〇〇。 、、^；如申請專利範圍第1項所述之觸控面板，其中當將 上述亡又部（24)的面積設為Sa ’將上述觸控位置檢測能 力提尚部（26)的面積設為Sb時， Sax0.50SSbSSaxl.50。 、4·如申請專利範圍第1項所述之觸控面板，其中當將 j士又部（24)的面積設為Sa，將上賴独置檢測能 力提高部（26)的面積設為Sb時， Sax〇.9〇SSbSSaxl.l〇。 5· -種觸控面板，包括導電膜（1())，上述觸控面板 的特徵在於： 76 201232632 w / 上述導電臈（10)包括導電部（14)，上述導電部（14) 具有由金屬製的細線（16)形成的網眼圖案（20)， 於上述網眼圖案（2〇)的交又部（24)，形成有波紋抑 止部（26)， §將上述父又部（24)的面積設為，將上述波紋抑 止部（26)的面積設為Sb時， Sax〇.01&lt;Sb$Sax5.0〇。 6.如申請專利範圍第5項所述之觸控面板，其中當將 上述交叉部（24)的面積設為sa，將上述波紋抑止部（26) 的面積設為Sb時， Sax0.50gSbSSax5.00。 7 ·如申請專利範圍第5項所述之觸控面板，其中當將 上述交叉部（24)的面積設為Sa，將上述波紋抑止部（26) 的面積設為Sb時， Sax〇.50SSbSSaxl.50。 、、匕如申。月專利範圍帛5項所述之觸控面板，其中當將 上述父又部（24) #面積設為Sa，將上述波紋抑止部 的面積設為Sb時， Sax0.90SSbSSaxl.10。 9. -種觸控面板的製造方法，料包含製作導電膜 (10)的導電膜製作步驟的觸控面板（15〇)的製造方法， 上述觸控面板（150)的製造方法的特徵在於： 上述導電膜製作步驟包括如下的步驟： 將導電材料的金屬络㈤）隔著接著層（62)而貼合 77 201232632 於透I基體（12)的一個主面上（12a)，上述金屬羯（66) ^貼δ面的粗糙面形狀轉印至上述接著層（62)，上述金屬 =;(66)的朝上述接著層⑹貼合的上述貼合面^祕 - 刻製程來將已貼合的上述金屬箱（66)的 度為一 出有二覆於上述導電圖案（12。）與露 上述接荖展^〜）的'^刀，上述透明包覆層（64)與 上边接者層（62)的折射率之差為Q1以下。 法，項所述之觸控面板的製造方 是利用上述透二：層二 =述金射 1(66)的上述貼合面的上述 法二述之觸控面板的製造方 (158)上種電^置於顯示裝置⑽）的顯示面板 逑導電部⑼且料:/徵在於包括導電部⑼，上 * (2〇), ’、有由金屬製的細線（16)形成的網眼圖 止部二)述網眼圖索⑽）的交叉部⑻’形成有波紋抑 78 201232632 •j ^ I T-/ l··邱述交又部（24)的面積設為Sa，將上女 止。卩（26)的面積設為sb時， 將上述波紋抑 Sax〇.01cSbSSax5 00。 13·如申請專利範圍第口 上述交又部⑻的面積料Sa，虹述當將 的面積設為Sb時， ^上义皮紋抑止部（26) Sax〇.5〇ssb$Sax5 0〇。 H_如申請專利範圍第12項所 =:(srr 一將上述波以 Sax〇.50$Sb$Saxl.50。 5·如申μ專利範圍第12項所述之 士述交又部⑼的面積設為％，將上述波紋抑止字 的面積設為Sb時， K b) Sax0.90SSbSSaxl.10。 16.如申請專利範圍第12項所述之導電膜，其 上述網眼圖案（2G)的金屬製㈣1細線（16a)與第2 細線（16b)交又，藉此來構成上述交又部（24)，、 上述波紋抑止部（26)包括： 第1抑止部（26a)，形成於上述第}細線（16a)的— 個側面與上述第2細線（i6b)的一個側面之間； 第2抑止部（26b)，形成於上述第i細線（16a)的一 個側面與上述第2細線（16b)的另一個侧面之間； 第3抑止部（26c)，形成於上述第1細線（丨⑷的另 79 201232632 一個侧面與上述第2細線（16b)的一個側面之間；以及 第4抑止部（26d)，形成於上述第i細線（16a)的另 一個側面與上述第2細線（16b)的另一個側面之間。 17.如申請專利範圍第16項所述之導電膜，其中當將 上述第1抑止部（26a)、上述第2抑止部（26b)、上述第 3抑止部（26c)、以及上述第4抑止部（26d)的各面 為 Sbl、Sb2、Sb3、以及 Sb4 時， &quot; Sb=Sbl + Sb2 + Sb3 + Sb4。 18. 如申請專利範圍第12項所述之導電膜， 細線（16)的線寬為j μηι〜15μιηβ 、肀上让 19. 如申請專利範圍第U項所述之導電膜 細線（16)的線寬為】μιη〜9μιη。 、/、中上述 20·如申請專利範圍第12項 細線⑽的線間隔為65帅〜二導電臈，其中上述 21 -種導電膜’其特徵在於包括： 透明基體（12); 導電部（14)，由金屬細綠（16) 06)隔著接著層（62)而形成於^^述金屬細線 一個主面（12a)上；以及 疋透明基體（12)的 透明包覆層（64)，形成為 有上述接著層（62)的部分予以勺覆電祁（14)與露出 之差=下層。(62)與上‘覆層⑽的折射率 22.如申請專利範圍第21項所述之導電膜，其中上述 201232632 金屬細線（16)的線寬為9 μιη以下。 23. 如申請專利範圍第21項所述之導電膜，其中上述 金屬細線（16)的厚度為3 μιη以下。 24. 如申請專利範圍第21項所述之導電膜，其中上述 導電部（14)包括2個以上的導電圖案（120)，上述2個 以上的導電圖案（120)分別沿著第1方向延伸，且沿著與 上述第1方向正交的第2方向排列，且由上述金屬細線（16) 形成。 25. 如申請專利範圍第24項所述之導電膜，其中上述 導電圖案（120)具有排列有多個由上述金屬細線（16)與 開口部形成的網眼形狀的圖案。 26. 如申請專利範圍第24項所述之導電膜，其中沿著 上述第1方向，分別經由由上述金屬細線（16)形成的連 接部（106)來將2個以上的大格子（202)予以連接，從 而構成上述導電圖案（120)， 各上述大格子（202 )分別是將2個以上的小格子（204 ) 加以組合而構成。 81201232632 Yiqi, application for patents: 1. The touch panel includes a conductive film (10) for detecting the touch position, and the upper conductive layer (4) is characterized in that: the conductive film includes a conductive portion (14), The conductive portion (14) has a mesh pattern (2) formed of a thin metal wire (16), and an intersection portion (24) of the mesh pattern (20) is formed to improve the touch position = detection capability. The touch position detecting capability improving unit (26), when the area of the parent part (24) is Sa, and the area of the touch position detecting capability improving unit (26) is Sb, Sax〇.〇l&lt;;Sb$Sax5.00. The touch panel according to claim 1, wherein when the area of the fork portion (24) is Sa and the area of the upper position detecting capability improving portion (26) is Sb, Sax 〇.5〇SSb$Sa&gt;&lt;5.〇〇. The touch panel of claim 1, wherein the area of the touch position detecting capability (26) is set when the area of the dead portion (24) is set to Sa ' For Sb, Sax0.50SSbSSaxl.50. 4. The touch panel according to the first aspect of the invention, wherein the area of the squirrel (24) is set to Sa, and the area of the independent detection capability improving unit (26) is set to Sb. When, Sax〇.9〇SSbSSaxl.l〇. A touch panel comprising a conductive film (1()), wherein the touch panel is characterized by: 76 201232632 w / the conductive germanium (10) comprises a conductive portion (14), and the conductive portion (14) has A mesh pattern (20) formed by a thin metal wire (16) is formed on the intersection portion (24) of the mesh pattern (2), and a corrugation suppressing portion (26) is formed, § the parent part (24) When the area of the above-described corrugation suppressing portion (26) is Sb, Sax〇.01 &lt;Sb$Sax5.0〇. 6. The touch panel according to claim 5, wherein when the area of the intersection portion (24) is sa and the area of the ripple suppression portion (26) is Sb, Sax0.50gSbSSax5. 00. The touch panel according to claim 5, wherein when the area of the intersection portion (24) is Sa and the area of the ripple suppression portion (26) is Sb, Sax〇.50SSbSSaxl .50. , such as Shen. The touch panel according to item 5, wherein Sax0.90SSbSSaxl.10 is used when the area of the parent portion (24) # is Sa and the area of the bellows suppression portion is Sb. 9. A method of manufacturing a touch panel, comprising: a method of manufacturing a touch panel (15) for forming a conductive film of a conductive film (10), wherein the method for manufacturing the touch panel (150) is characterized by: The conductive film forming step includes the steps of: bonding a metal layer (5) of a conductive material to a main surface (12a) of the transparent substrate (12) via a bonding layer (62), the metal germanium ( 66) The rough surface shape of the δ surface is transferred to the adhesive layer (62), and the bonding surface of the metal (66) bonded to the adhesive layer (6) is bonded to the bonding layer. The above-mentioned metal box (66) has a degree of two-sided knives covering the conductive pattern (12.) and the above-mentioned conductive pattern (1), the transparent cladding layer (64) and the upper edge layer The difference in refractive index of (62) is not more than Q1. The manufacturing method of the touch panel described in the above method is the manufacturing method (158) of the touch panel described above by using the above-mentioned bonding surface of the second layer: the second layer of the gold film 1 (66). The electric panel is placed on the display panel 逑 conductive portion (9) of the display device (10) and is characterized by including a conductive portion (9), an upper * (2 〇), ', and a mesh pattern formed by a thin metal wire (16). Part 2) The cross section (8) of the mesh diagram (10) is formed with ripples. 78 201232632 • j ^ I T-/ l·· Qiu Shujiao The area of the section (24) is set to Sa, and the upper female is stopped. When the area of 卩(26) is sb, the above-mentioned ripple is suppressed by Sax〇.01cSbSSax5 00. 13. If the area of the application area is the same as that of the area (8) of the above-mentioned part (8), when the area of the section is set to Sb, the upper part of the skin is suppressed (26) Sax〇.5〇ssb$Sax5 0〇. H_If the scope of the patent application is 12th =: (srr one will use the above wave as Sax〇.50$Sb$Saxl.50. 5. As stated in the 12th article of the application scope of the patent, the division (9) The area is set to %, and when the area of the above-mentioned ripple suppression word is Sb, K b) Sax0.90SSbSSaxl.10. 16. The conductive film according to claim 12, wherein the metal (4) 1 thin line (16a) of the mesh pattern (2G) is intersected with the second thin line (16b), thereby forming the intersection ( 24) The corrugation suppressing portion (26) includes: a first suppressing portion (26a) formed between one side surface of the first thin line (16a) and one side surface of the second thin line (i6b); The suppressing portion (26b) is formed between one side surface of the ith thin line (16a) and the other side surface of the second thin line (16b); and the third suppressing portion (26c) is formed on the first thin line (丨(4) Another 79 201232632 between one side surface and one side surface of the second thin line (16b); and a fourth suppression portion (26d) formed on the other side surface of the ith thin line (16a) and the second thin line (16b) The conductive film according to claim 16, wherein the first suppressing portion (26a), the second suppressing portion (26b), and the third suppressing portion (26c) are provided. And when the respective faces of the fourth suppressing portion (26d) are Sb1, Sb2, Sb3, and Sb4, &quot; Sb=Sbl + Sb2 + Sb3 + Sb4. 18. The conductive film according to claim 12, wherein the line width of the thin line (16) is j μηι 1515 μηηβ, 肀上使19. The line width of the fine film (16) of the conductive film is μμη~9μηη. In the above, the line spacing of the thin line (10) of the 12th item of the patent application is 65 handsome to two conductive iridium, wherein the above 21 kinds of conductive films' The method comprises: a transparent substrate (12); a conductive portion (14) formed of a metal thin green (16) 06) on a main surface (12a) of the thin metal wire via the adhesive layer (62); The transparent cladding layer (64) of the transparent substrate (12) is formed such that the portion of the adhesive layer (62) is covered with a difference between the exposed electrode (14) and the exposed layer. (62) A conductive film according to the above-mentioned "2012", wherein the line width of the above-mentioned 201232632 metal thin wire (16) is 9 μm or less. The conductive film according to claim 21, wherein the metal thin wire (16) has a thickness of 3 μm or less. The conductive film according to claim 21, wherein the conductive portion (14) includes two or more conductive patterns (120), and the two or more conductive patterns (120) respectively extend along the first direction And arranged in the second direction orthogonal to the first direction, and formed of the metal thin wires (16). The conductive film according to claim 24, wherein the conductive pattern (120) has a pattern in which a plurality of mesh shapes formed by the metal thin wires (16) and the opening portion are arranged. 26. The conductive film according to claim 24, wherein two or more large lattices (202) are respectively connected via the connecting portion (106) formed by the metal thin wires (16) along the first direction. The conductive patterns (120) are formed by being connected, and each of the large lattices (202) is formed by combining two or more small lattices (204). 81
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CN104637573B (en) * 2013-11-15 2017-01-04 群创光电股份有限公司 Conducting membrane structure
TWI509632B (en) * 2014-12-05 2015-11-21 Nat Univ Tsing Hua Transparent conducting electrode using a metamaterial high pass filter
TWI690828B (en) * 2015-05-29 2020-04-11 日商日本寫真印刷股份有限公司 Manufacturing method of touch sensor
CN109947289A (en) * 2019-03-06 2019-06-28 苏州蓝沛光电科技有限公司 Touch screen and preparation method thereof

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