201227473 六、發明說明： 【發明所屬之技術領域】 本揭露書是有關於一種硬化結構觸控面板及其製造方 法’特別是一種電容觸控面板複合層結構及其製程。 【先前技術】 現有電容觸控螢幕或者觸控面板通常需要在基材上下 表面分別設置如ITO (Indium Tin Oxide，氧化銦錫）的導 ，線路，製造程序複雜，且生產成本高，價格遠比當前大 置應用的電阻觸控螢幕高，不利於電容式觸控螢幕與其觸鲁 控面板的推廣應用。 山而在習知的觸控面板中’其表面的感應層的感應線路 端通過與電信號線連接向信號處理器傳輸信號，但是，由 於觸控面板的尺寸和觸控精度要求不斷提高，使得電作號 排線的數目不斷增多。因此，如果在同一平面上進行^ 必然會使整體排線寬度變大’占用更多的基材面積，同樣 也造成製造成本上升。 故如何透過製程的改善以降低製造過程的成本與時間鲁 將成為電容式觸控螢幕、觸控面板未來發展上的重要課題 【發明内容】 曰針對改善電容式觸控螢幕、面板的需求，本揭露書所 提出的硬化結構觸控面板及其製造方法則可針對現有i術 處，僅採用單層導電玻璃（如IT〇)線路設置在基 5表面上，能藉此減少製造工序與降低生產成本，整 4/16 201227473 體結構上更可降低面板體的厚度，也減輕其重量，達成透 光性好與輕量化等優點。 根據μ%例，本揭露書所描述的—種硬化結構觸控面 • 主要包括有銘板層、透明基板層與其上所設的—油墨邊 框、設置於油墨邊框之框内的透明基板層表面上的透明硬 塗層、設置於透明硬塗層上的圖案感應層與一疊層走線， 結構中’銘板層係覆設於疊層走線和圖案感應層上。 、其中所述的圖案感應層為一氧化钢錫感應線路，上方 • €應線路圖案是—三角波形轉；且㈣走線特別由第-銀線層、絕緣油墨層與第二銀線層依次疊加構成。 、在上述硬化結構觸控面板之製作程序中，特別是先透 過印刷製程將油墨邊框於形成於透明基板層上，接著塗覆 硬度強化液於油墨邊框之框内上的透明基板層之表面上 後透·化程序固化硬度強化液以形成透明硬塗層。 接著，鍍一透明導電層於此透明硬塗層之表面上，再以圖 案化製程在透明導電層上形成圖案感應層，之後形成一疊 _ 、g走線纟巾疋利用印刷製程依序疊加第—導線層、絕緣 ’由墨層與第二導線層，最後在叠層走線和圖案感應層之上 形成銘板層。 在上述製作觸控面板的過程中，對基材表面進行硬化 ，理可以實現增強 PET (Polyethylene TerephthaIate，聚對 笨二甲酸乙二醇醋）表面硬度和透光率，有減少彩虹紋及 表面晶點等優點。此外，硬化塗層PET在韌性、硬度、抗 化學性、防到傷、清晰透明度、加工效果等方面性能表現 出色。 更者，揭露書所提的方案將採用一多層堆疊方式，將 5/16 201227473 電信號排線層堆疊在-起，可減少基材面積的使用，其中 更透過在排線層之間設魏緣油墨層以防止線路短路。 為使能更進-步瞭解本發明之特徵及技術内容，請參 閱以下有關本發明之詳細說明與附圖，但是此等說明與所 附圖式僅係用來說明本發明，而非對本發明的權利範圍作 任何的限制。 【實施方式】 本揭露書提種硬化結侧控面板及其製造方法， 主要實施例是針對改善電容式觸控營幕或面板的結構，能鲁 藉此結構減少製造工序與降低生產成本，且仍提供較薄的 結構與高效率的透光性。 根據實施例，硬化結構觸控面板之結構可參考圖m， f中依序有透明基板層4、油墨邊框3卜透明硬塗層32、 @層走線21與®案感應層22與銘板層卜此結構之製程可 參考圖1A至圖1H所示的硬化結構觸控面板之結構製程示 思圖。程序可參考圖4所描述的製程流程圖，此實施例之 製作硬化結構觸控面板的方法特別可在無塵乾燥條件下進鲁 行。 如圖1A，其中備置一透明基板層4 (步驟)。 如圖m ’透明基板層4之表面上則接著透過印刷製程 而设有-油墨邊框31 (步驟S403) ’油墨邊框31特別涵 於透明基板層4上之四周圍。 如圖1C與步驟S405，接著塗覆一硬度強化液n 別是塗覆於上述油墨邊框31所圍繞之框_透明基板層4 之表面上，由油墨邊框31所圍繞。 曰 6/16 ^ 201227473 接著，如圖ID，利用固化程序使得硬度強化液丨】固 化形成一透明硬塗層32,此透明硬塗層32即形成於油墨邊 框3】之框内的透明基板層4之表面（步驟S407)。 之後’如圖1E’在經固化形成的透明硬塗層32之表面 上錢上一透明導電層13 (步驟S409)。 接著執行一圖案化程序，如圖1F，藉此形成一圖案感 應層22，此圖案化的圖案感應層22即設置於透明硬 32上（步驟411)。 s201227473 VI. Description of the Invention: [Technical Field] The present disclosure relates to a hardened structure touch panel and a method of manufacturing the same, in particular, a capacitive touch panel composite layer structure and a process thereof. [Prior Art] Existing capacitive touch screens or touch panels usually need to be provided with conductive and indirect lines such as ITO (Indium Tin Oxide) on the upper and lower surfaces of the substrate. The manufacturing process is complicated, and the production cost is high, and the price is much higher than that. At present, the resistance touch screen of the large-scale application is high, which is not conducive to the promotion and application of the capacitive touch screen and the touch control panel. In the conventional touch panel, the sensing line end of the sensing layer on the surface transmits signals to the signal processor through connection with the electrical signal line. However, due to the increasing size and touch precision requirements of the touch panel, The number of electric wiring lines is increasing. Therefore, if the operation on the same plane will inevitably increase the overall line width, which occupies more substrate area, it also causes an increase in manufacturing cost. Therefore, how to reduce the cost and time of the manufacturing process through the improvement of the process will become an important issue in the future development of capacitive touch screens and touch panels. [Inventive content] 曰In order to improve the demand for capacitive touch screens and panels, The hardened structure touch panel and the manufacturing method thereof disclosed in the disclosure can be disposed on the surface of the base 5 only by using a single layer of conductive glass (such as IT〇), thereby reducing the manufacturing process and reducing the production. Cost, the whole 4/16 201227473 body structure can reduce the thickness of the panel body, reduce the weight, and achieve the advantages of good light transmission and light weight. According to the μ% example, the touch surface of the hardened structure described in the present disclosure mainly includes a nameplate layer, a transparent substrate layer and an ink frame disposed thereon, and a surface of the transparent substrate layer disposed in the frame of the ink frame. The transparent hard coat layer, the pattern sensing layer disposed on the transparent hard coat layer and a laminated trace, and the structure of the name plate is coated on the laminated trace and the pattern sensing layer. The pattern sensing layer is a tin oxide tin sensing line, and the upper • € line pattern is a triangular waveform; and (4) the trace is in particular a first-silver layer, an insulating ink layer and a second silver layer. Superimposed composition. In the manufacturing process of the hardened structure touch panel, in particular, the ink frame is formed on the transparent substrate layer through a printing process, and then the hardness strengthening liquid is coated on the surface of the transparent substrate layer on the frame of the ink frame. The post-transparation process cures the hardness-enhancing liquid to form a transparent hard coat layer. Then, a transparent conductive layer is plated on the surface of the transparent hard coating layer, and then a pattern sensing layer is formed on the transparent conductive layer by a patterning process, and then a stack of _, g traces are formed, and the printing process is sequentially superposed by using a printing process. The first-wire layer, the insulating layer is formed by the ink layer and the second wire layer, and finally the name plate layer is formed on the laminated wiring and the pattern sensing layer. In the above process of manufacturing the touch panel, the surface of the substrate is hardened, and the surface hardness and light transmittance of the PET (Polyethylene TerephthaIate) can be enhanced, and the rainbow pattern and the surface crystal are reduced. Points and other advantages. In addition, the hard-coated PET has excellent performance in terms of toughness, hardness, chemical resistance, damage prevention, clear transparency, and processing effects. In addition, the proposed solution will use a multi-layer stacking method to stack 5/16 201227473 electrical signal cable layers, which can reduce the use of substrate area, and more through the layer between the cable layers. Wei edge ink layer to prevent short circuit. The detailed description of the present invention and the accompanying drawings are to be understood as the invention The scope of the rights is subject to any restrictions. [Embodiment] The present disclosure provides a hardened junction side control panel and a manufacturing method thereof, and the main embodiment is directed to improving the structure of a capacitive touch camp screen or a panel, thereby reducing the manufacturing process and reducing the production cost by using the structure, and Still providing a thinner structure and high efficiency of light transmission. According to the embodiment, the structure of the touch panel of the hardened structure can refer to the figure m, f in sequence with the transparent substrate layer 4, the ink frame 3, the transparent hard coat layer 32, the @ layer trace 21 and the sense layer 22 and the nameplate layer. For the process of the structure, reference may be made to the structural process diagram of the hardened structure touch panel shown in FIG. 1A to FIG. 1H. The procedure can be referred to the process flow chart described in Fig. 4. The method of fabricating the hardened structure touch panel of this embodiment can be carried out in particular under dust-free drying conditions. As shown in FIG. 1A, a transparent substrate layer 4 is provided (step). The ink frame 31 is provided on the surface of the transparent substrate layer 4 as shown in Fig. 4 through the printing process (step S403). The ink frame 31 is particularly surrounded by the four layers on the transparent substrate layer 4. As shown in FIG. 1C and step S405, a hardness-enhancing liquid n is applied to the surface of the frame-transparent substrate layer 4 surrounded by the ink frame 31, surrounded by the ink frame 31.曰6/16 ^ 201227473 Next, as shown in FIG. ID, the hardness strengthening liquid is cured by a curing process to form a transparent hard coat layer 32, which is a transparent substrate layer formed in the frame of the ink frame 3]. The surface of 4 (step S407). Thereafter, a transparent conductive layer 13 is deposited on the surface of the cured transparent hard coat layer 32 as shown in Fig. 1E' (step S409). A patterning process is then performed, as shown in Fig. 1F, whereby a pattern sensing layer 22 is formed, which is disposed on the transparent hard 32 (step 411). s
再如圖1G，其中顯示有一疊層走線21形成於油墨邊 框31的上方，根據實施例，如步驟S413，疊層走線21的 形成^括於油墨邊框31上印刷第—導線層，此第—導線層 之％與上述圖案感應層22之邊緣端連接；如步驟S415 ’透過印刷製程於H線層上印刷絕緣油墨形成—絕緣 油墨層’再如步驟S417，更於絕緣油墨層之表面印刷形成 第二導線層’且使得第二導線層之—端與上述 22之邊緣連接。 錢增 取後’如圖1H與步驟S419 —苜1貝6令、於上过 疊層走線21與圖案感應層22上表面。因此，使得油 =:有/2層走線21，銘，即覆設在叠層走= 和圖案感應層22上。 言’圖案感應層22特別可實現為氧化銦錫（ ΙΤ0)感應線路，其感應線路圖制可為三角波形矩陣。 明基板層4可為硬化玻璃基板。疊層走線21中的由第 線層㈣二導線層之導線材料可為銀，即形成 與絕緣油墨層依次疊加構成此叠層走線2卜 另 根據實施例之―’上述步驟贿所描述利用固化程序 7/16 201227473 使硬度強化液11固化形成透明硬塗層32的步驟中，可以 通過光固化（如紫外光固化’ UV curing)或者熱固化其中 硬度強化液11形成透明硬塗層32，特別是此透明硬塗層 32的厚度與油墨邊框31的厚度相同。 根據貫施例之一，在上述透明硬塗層32的表面鍍上透 明導電層13之後，步驟S411圖案化的程序中包括對此透 明導電層13執行光阻蝕刻（photoresist etching)製程 ，或者雷射切割（laser* cutting)得到圖案感應層22。 根據圖2顯示的硬化結構觸控面板的疊層走線的剖面 結構組成示意圖。上述第一與第二導線層可以銀線實現，# 此例之@層走線21由依序利用印刷製程形成的第一銀線層 211、絕緣油墨層212與第二銀線層213。結合於圖ih所 示的結構，此在油墨邊框上印刷的第一銀線層2n之一端 與圖案感應層邊緣端連接’通過在第一銀線層211上印刷 兩層絕緣油墨則形成絕緣油墨層212，而此絕緣油墨層212 的表面即印刷有第二銀線層213，第二銀線層213之一端與 圖案感應層邊緣端連接。 上述之第一銀線層211或者第二銀線層213的厚度約φ 為15、’’内米至25納米，絕緣油墨層212的厚度約為π微米 至25微米。 上述硬化結構觸控面板的結構具有之效果包括透過在 硬化PET基材表面上採用單層ITQ線路設置，結合養層窄 邊線寬設計增大視窗操作面積’使得觸控面板結構安全簡 單生產成本低，減少面板的厚度和重量，並且提高整個感 測體透光率；實現觸控面板不易破損、容易加工、產品成 本較低、降低面板體的厚度、良品率高的目的。 _ s 201227473 社2 3疋顯不本揭露書中硬化結構觸控面板的感應線路 ’、’口構貝施二角波形矩陣圖案示意框圖，其中顯示的多個三 角形結構即為觸控面板内的感 應線路。 根據上述圖1A至圖1H，並結合圖4之流程描述，本 毛明的硬化結構觸控面板主要由銘板層】、疊層走線、 圖案感應層22、油墨邊框31 '透明硬塗層32與透明基板 層4組成。以下列舉幾種實施態樣。 第一實施例：1G, a laminated trace 21 is formed above the ink frame 31. According to an embodiment, in step S413, the formation of the laminated trace 21 is printed on the ink frame 31 to print the first conductive layer. The % of the first wire layer is connected to the edge end of the pattern sensing layer 22; as shown in step S415 'printing the insulating ink on the H line layer through the printing process to form the insulating ink layer', the surface of the insulating ink layer is further as shown in step S417. Printing forms a second wire layer 'and causes the end of the second wire layer to be joined to the edge of the 22 above. After the money is taken up, as shown in Fig. 1H and step S419, the upper surface of the pattern trace layer 21 and the pattern sensing layer 22 are overlaid. Therefore, the oil =: has 2 layers of traces 21, that is, overlaid on the laminate pass = and pattern sensing layer 22. In particular, the pattern sensing layer 22 can be implemented as an indium tin oxide (ITO) sensing circuit, and the sensing line pattern can be a triangular waveform matrix. The bright substrate layer 4 may be a hardened glass substrate. The wire material of the second wire layer of the first layer (4) in the layered wiring 21 may be silver, that is, the layer of the insulating ink layer is sequentially stacked to form the layered wiring 2, which is described in the above-mentioned steps. In the step of curing the hardness strengthening liquid 11 to form the transparent hard coat layer 32 by the curing procedure 7/16 201227473, the transparent hard coat layer 32 may be formed by photocuring (such as ultraviolet curing 'UV curing) or thermally curing the hardness reinforcing liquid 11 therein. In particular, the thickness of the transparent hard coat layer 32 is the same as the thickness of the ink frame 31. According to one of the embodiments, after the transparent conductive layer 13 is plated on the surface of the transparent hard coat layer 32, the step of patterning in step S411 includes performing a photoresist etching process on the transparent conductive layer 13, or The pattern sensing layer 22 is obtained by laser* cutting. A schematic structural view of the cross-sectional structure of the laminated trace of the hardened structure touch panel shown in FIG. The first and second wire layers may be realized by a silver wire. #@层线线21 is a first silver wire layer 211, an insulating ink layer 212 and a second silver wire layer 213 which are sequentially formed by a printing process. In conjunction with the structure shown in FIG. ih, one end of the first silver wire layer 2n printed on the ink frame is connected to the edge end of the pattern sensing layer. 'Insulating ink is formed by printing two layers of insulating ink on the first silver wire layer 211. The layer 212, and the surface of the insulating ink layer 212 is printed with a second silver wire layer 213, and one end of the second silver wire layer 213 is connected to the edge end of the pattern sensing layer. The first silver wire layer 211 or the second silver wire layer 213 has a thickness of about φ, 15 Å to 25 nm, and the insulating ink layer 212 has a thickness of about π μm to 25 μm. The structure of the hardened structure touch panel has the effects of adopting a single layer of ITQ line arrangement on the surface of the hardened PET substrate, and increasing the window operation area by combining the narrow side line width of the nutrient layer to make the touch panel structure safe and simple, and the production cost is low. The thickness and weight of the panel are reduced, and the transmittance of the entire sensing body is improved; the touch panel is not easily damaged, the processing is easy, the product cost is low, the thickness of the panel body is lowered, and the yield is high. _ s 201227473 社 2 3 疋 不 揭 揭 揭 揭 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化Inductive line. According to the above-mentioned FIG. 1A to FIG. 1H, and in conjunction with the flow of FIG. 4, the hardened structure touch panel of the present invention is mainly composed of a nameplate layer, a laminated trace, a pattern sensing layer 22, and an ink frame 31 'transparent hard coat layer 32. It is composed of a transparent substrate layer 4. Several implementation aspects are listed below. First embodiment:
步驟一：在透明基板層4上印刷油墨邊框31 ; 步驟二：油墨邊框31框内的透明基板層4表面塗覆硬 度強化液； 步驟二：通過光化或者熱化硬度強化液形成透明硬塗 層32，且透明硬塗層32的厚度與油墨邊框31的厚度相同 一步驟四：透明硬塗層32表面鍍透明導電層，對透明導 電層光阻蝕刻或者雷射切割得到圖案感應層22 ; 步驟五：在步驟三中油墨邊框31上印刷第一銀線層21】 ’、與圖案感應層22邊緣端連接，通過在第一銀線層211 上印刷兩層絕緣油墨形成絕緣油墨層212，所述絕緣油墨層 M2的表面印刷第二銀線層213纟一端與圖案感應層22邊 緣端連接； 步驟六：銘板層1平整貼合在疊層走線21和圖案感應 層22上。 、上述透明基板層4的厚度為50微米〜丨88微米；油墨 邊框31的厚度為5微米〜1〇微米；透明硬塗層32的厚度 為5微米〜1G微米；目案感應層22的厚度為15納米〜25 9/16 201227473 納米。 第一實施例： 步驟一：在透明基板層4上印刷油墨邊框31 ; 步驟二：油墨邊框31框内的透明基板層4表面塗覆硬 度強化液； 、步驟三：通過光化硬度強化液形成透明硬塗層32，且 透月硬塗層32的厚度與油墨邊框31的厚度相同； 步驟四.透明硬塗層32表面錢透明導電層，對透明導 電層雷射切割得到圖案感應層22 ; =驟五：在步驟三中油墨邊框31上印刷第一銀線層211 /、知與圖案感應層22邊緣端連接，通過在第一銀線層211 上印刷兩層絕緣油墨形成絕緣油墨I 2】2，所述絕緣油墨層 212的表面印刷第二銀線層2〗3其一端與圖案感應層邊 緣端連接； 步驟六.銘板層1平整貼合在疊層走線21和圖案感應 層22上。 、透明基板層4的厚度為115微米；油墨邊框31的厚度 為8微米；透明硬塗層32的厚度為8微米；圖案感應層22 的厚度為20納米；第一銀線層211和第二銀線層213的厚 度為20納米；絕緣油墨層212的厚度為2〇微米。 第三實施例： 步驟一 ·在透明基板層4上印刷油墨邊框31 ; 步驟一：油墨邊框31框内的透明基板層4表面塗覆硬 度強化液； 步驟二.通過光化硬度強化液形成透明硬塗層32，且 透明硬塗層32的厚度與油墨邊框31的厚度相同； 10/16 201227473 v驟四.透明硬塗層32表面鑛透明導電層，對透明導 電層光阻蝕刻得到圖案感應層22; 步驟五：在步驟三中油墨邊框31上印刷第^銀線層211 其端與圖案感應層22邊緣端連接，通過在第/銀線層211 上印刷兩層絕緣油墨形成絕緣油墨層212，所述絕緣油墨層 212的表面印刷第二銀線層213其一端與圖案感應層22邊 緣端連接； 步驟六：銘板層1平整貼合在疊層走線21和圖案感應 層22上。 透明基板層4的厚度為50微米；油墨邊樞31的厚度 為5微米；透明硬塗層32的厚度為5微米；圖案感應層22 的厚度為15納米；第一銀線層211和第二銀線層213的厚 度為15納米；絕緣油墨層212的厚度為15微米。 第四實施例： 制造硬化結構觸控面板的方法，包括如下步驟在無塵 幹燥條件下進行； 步驟一：在透明基板層4上印刷油墨邊框31 ; 步驟二：油墨邊框31框内的透明基板層4表面塗覆硬 度強化液； 步驟三：通過熱化硬度強化液形成透明硬耋層32，且 透明硬塗層32的厚度與油墨邊框31的厚度相同； 步驟四：透明硬塗層32表面鑛透明導電層’對透明導 電層雷射切割得到圖案感應層22 ; 步驟五：在步驟三中油墨邊框31上印刷第〆銀線層211 其一端與圖案感應層22邊緣端連接，通過在第/銀線層211 上印刷兩層絕緣油墨形成絕緣油墨層212，所述絕緣油墨層 11/16 201227473 了的表面印刷第二銀線層213其一端與 邊 緣端連接； 步驟六：銘板層！平整貼合在疊層走線21和 層22上。 透明基板層4的厚度為188微米；油墨邊框31的厚度 為1〇微米；透明硬塗層32的厚度為1〇微米；圖案感應層 22的厚度為25納米；第一銀線層211和第二銀線層川的 厚度^ 25納米；絕緣油墨層212的厚度為25微来。 、、’’丁、上所述，在技術上，本揭露書所描述的硬化結構觸 控面板主要包括銘板層、疊層走線、圖案感應層，油墨邊 C透明硬塗層、透明基板層，透過製程的設計，使得此 硬化結構觸控面板在硬化PET等面板基材表面上採用單層 =電玻璃（如ITG)的線路設置，並結合疊層窄邊線寬設計 立曰大視窗操作面積，使得製作出一種不易破損、容易加工 、產品成本較低、降低面板體的厚度、良品率高的單層感 應硬化結構觸控面板。 以上所述僅為本發明之實施例，其並非用以侷限本發 明之專利範圍。 【圖式簡單說明】 一圖1A至圖1H為本發明硬化結構觸控面板之結構製程 示意圖； 圖2顯示為本發明硬化結構觸控面板中之疊層走線之 剖面結構示意圖； 模組之内部功能方塊圖； 圖3顯示為本發明的硬化結構觸控面板的感應線路結 12/16 201227473 構實施例示意圖； 圖4顯示為本發明硬化結構觸控面板結構之製程流程 圖。 【主要元件符號說明】 銘板層1 圖案感應層22 透明硬塗層32 硬度強化液11 第一銀線層211 第二銀線層213 疊層走線21 油墨邊框31 透明基板層4 透明導電層13 絕緣油墨層212 步驟S401〜S419硬化結構觸控面板之製作流程Step 1: printing the ink frame 31 on the transparent substrate layer 4; Step 2: coating the surface of the transparent substrate layer 4 in the frame of the ink frame 31 with a hardness strengthening liquid; Step 2: forming a transparent hard coating by actinicizing or heating the hardness strengthening liquid The layer 32, and the thickness of the transparent hard coat layer 32 is the same as the thickness of the ink frame 31. Step 4: the surface of the transparent hard coat layer 32 is plated with a transparent conductive layer, and the transparent conductive layer is photoresist-etched or laser-cut to obtain the pattern-sensing layer 22; Step 5: In step 3, the first silver wire layer 21 is printed on the ink frame 31, connected to the edge end of the pattern sensing layer 22, and the insulating ink layer 212 is formed by printing two layers of insulating ink on the first silver wire layer 211. One end of the surface of the insulating ink layer M2 is printed with a second silver wire layer 213, and one end of the second silver wire layer 213 is connected to the edge of the pattern sensing layer 22; Step 6: The name plate layer 1 is flatly laminated on the laminated trace 21 and the pattern sensing layer 22. The transparent substrate layer 4 has a thickness of 50 μm to 丨88 μm; the ink frame 31 has a thickness of 5 μm to 1 μm; and the transparent hard coat layer 32 has a thickness of 5 μm to 1 μm; the thickness of the mesh sensing layer 22 For 15 nm ~ 25 9/16 201227473 nm. The first embodiment: Step 1: printing the ink frame 31 on the transparent substrate layer 4; Step 2: coating the surface of the transparent substrate layer 4 in the frame of the ink frame 31 with a hardness strengthening liquid; Step 3: forming through the actinic hardness strengthening liquid The transparent hard coat layer 32, and the thickness of the moon-permeable hard coat layer 32 is the same as the thickness of the ink frame 31; Step 4. The surface of the transparent hard coat layer 32 is transparent and conductive, and the transparent conductive layer is laser-cut to obtain the pattern sensing layer 22; = Step 5: In the third step, the first silver wire layer 211 is printed on the ink frame 31, and the edge of the pattern sensing layer 22 is connected, and the insulating ink I 2 is formed by printing two layers of insulating ink on the first silver wire layer 211. 2, the surface of the insulating ink layer 212 is printed with a second silver wire layer 2, and one end thereof is connected to the edge end of the pattern sensing layer; Step 6. The nameplate layer 1 is flatly bonded to the laminated trace 21 and the pattern sensing layer 22 on. The thickness of the transparent substrate layer 4 is 115 μm; the thickness of the ink frame 31 is 8 μm; the thickness of the transparent hard coat layer 32 is 8 μm; the thickness of the pattern sensing layer 22 is 20 nm; the first silver wire layer 211 and the second The thickness of the silver wire layer 213 is 20 nanometers; the thickness of the insulating ink layer 212 is 2 micrometers. The third embodiment: Step one: printing the ink frame 31 on the transparent substrate layer 4; Step 1: coating the surface of the transparent substrate layer 4 in the frame of the ink frame 31 with a hardness strengthening liquid; Step 2. Forming the transparency by the actinic hardness strengthening liquid The hard coat layer 32, and the thickness of the transparent hard coat layer 32 is the same as the thickness of the ink frame 31; 10/16 201227473 v. 4. The surface of the transparent hard coat layer 32 is transparent and conductive, and the transparent conductive layer is photoresist-etched to obtain pattern sensing. Step 22: Step 5: In step 3, the first silver wire layer 211 is printed on the ink frame 31, and the end thereof is connected to the edge end of the pattern sensing layer 22, and an insulating ink layer is formed by printing two layers of insulating ink on the silver/wire layer 211. 212, the surface of the insulating ink layer 212 is printed with a second silver wire layer 213, one end of which is connected to the edge end of the pattern sensing layer 22; Step 6: The nameplate layer 1 is flatly bonded on the laminated trace 21 and the pattern sensing layer 22. The transparent substrate layer 4 has a thickness of 50 μm; the ink side pivot 31 has a thickness of 5 μm; the transparent hard coat layer 32 has a thickness of 5 μm; the pattern sensing layer 22 has a thickness of 15 nm; and the first silver wire layer 211 and the second layer The silver wire layer 213 has a thickness of 15 nm; the insulating ink layer 212 has a thickness of 15 μm. The fourth embodiment: a method for manufacturing a hardened structure touch panel, comprising the following steps: performing dust-free drying conditions; Step 1: printing an ink frame 31 on the transparent substrate layer 4; Step 2: transparent substrate in the frame of the ink frame 31 The surface of the layer 4 is coated with a hardness strengthening liquid; Step 3: forming a transparent hard enamel layer 32 by heating the hardness strengthening liquid, and the thickness of the transparent hard coating layer 32 is the same as the thickness of the ink frame 31; Step 4: Surface of the transparent hard coating layer 32 The transparent conductive layer of the mine is laser-cut to the transparent conductive layer to obtain the pattern sensing layer 22; Step 5: In the third step, the second silver layer 211 is printed on the ink frame 31, and one end thereof is connected to the edge end of the pattern sensing layer 22, and the The two layers of insulating ink are printed on the silver wire layer 211 to form an insulating ink layer 212. The surface of the insulating ink layer 11/16 201227473 is printed on the second silver wire layer 213, and one end thereof is connected to the edge end; Step 6: Name plate layer! The flattening is applied to the laminated traces 21 and 22. The transparent substrate layer 4 has a thickness of 188 μm; the ink frame 31 has a thickness of 1 μm; the transparent hard coat layer 32 has a thickness of 1 μm; the pattern sensing layer 22 has a thickness of 25 nm; and the first silver layer 211 and the first The thickness of the two silver wire layer is 25 nm; the thickness of the insulating ink layer 212 is 25 micrometers. As described above, in the technical description, the hardened structure touch panel described in the present disclosure mainly includes a nameplate layer, a laminated trace, a pattern sensing layer, an ink side C transparent hard coating layer, and a transparent substrate layer. Through the design of the process, the hardened structure touch panel is arranged on the surface of the panel substrate such as hardened PET by a single layer=electric glass (such as ITG), and combined with the narrow side line width of the laminate to design a large window operation area. The single-layer induction hardened structure touch panel which is not easy to be damaged, easy to process, low in product cost, low in thickness of the panel body, and high in yield is produced. The above is only an embodiment of the present invention, and is not intended to limit the scope of the patents of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1H are schematic diagrams showing a structural process of a hardened structure touch panel according to the present invention; FIG. 2 is a cross-sectional structural view showing a laminated trace in a hardened structure touch panel of the present invention; FIG. 3 is a schematic view showing a process of the structure of the touch panel of the hardened structure of the present invention; FIG. 4 is a flow chart showing the structure of the touch panel structure of the hardened structure of the present invention. [Main component symbol description] Nameplate layer 1 Pattern sensing layer 22 Transparent hard coat layer 32 Hardness enhancement liquid 11 First silver wire layer 211 Second silver wire layer 213 Laminated trace 21 Ink frame 31 Transparent substrate layer 4 Transparent conductive layer 13 Insulating ink layer 212 Step S401~S419 Hardened structure touch panel manufacturing process
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