TW201225729A

TW201225729A - Dispaly device and method for making the same

Info

Publication number: TW201225729A
Application number: TW100140842A
Authority: TW
Inventors: Masaru Kajitani
Original assignee: Sumitomo Chemical Co
Priority date: 2010-11-12
Filing date: 2011-11-09
Publication date: 2012-06-16
Also published as: TWI544836B; JP2012104430A; JP5573616B2; KR101867637B1; KR20130129934A; CN103210699A; WO2012063766A1

Abstract

This invention provides a display device having a simple construction and enabling the forming of an organic layer having a uniform thickness in a region surrounded by partition walls, the display device also having a substrate partition walls that define predetermined sections on the substrate, and a plurality of electroluminescent elements provided in each section defined by the partition walls. Each organic electroluminescent element has at least one layer of a first electrode, at least one layer of an organic layer, and at least one layer of a second electrode laminated sequentially from the substrate side. The partition wall has one end arranged to contact an upper part of the first electrode. The first electrode has a recess, when viewed from one side in the direction of the thick of the substrate, extending into the substrate side from the interface between the end portion of the partition wall and the first electrode in an excess portion other than the portion covered by the end portion of the partition wall and peripheral portion of the above said excess portion.

Description

201225729 六、發明說明：【發明所屬之技術領域】本發明係關於一種顯示裝置及其製造方法。【先前技術】顯示裝置依其構造及原理不同有各種裝置。其中一種目前正實用化於像素之光源利用有機電致發光元件（以下稱為「有機EL元件」。）之顯示裝置。前述顯示裝置中’對應像素之大量有機EL元件係排列於規定之基台上而進行配置。此外，在基台上設置有用以劃为規定之分區的分隔壁，大量有機EL元件係分別排列於藉由分隔壁而劃分之區域而進行配置。各有機EL元件係由基台侧開始以第1電極、有機層和第2電極之順序積層而形成。前述有機層例如可藉由塗佈法而形成。參考第8圖並說明有機層之形成方法。正如第8A圖所示，首先準備預先形成第1電極16和分隔壁13之基台12。接著在該基台12 中被分隔壁13包圍之區域15供給包含形成有機層18之材料之油墨17。供給之油墨π係收納在分隔壁13所包圍之區域（凹部）15(參考第8B圖）。接著藉由氣化油墨17之溶媒而形成有機層18(參考第8C圖）。此外，在分隔壁13對於油墨π顯示親液性時，供仏之油墨17係沿著分隔壁13之表面而流出至相鄰凹部: 止。為了防止此等油墨之流出，通常在基台12之上設置對於油墨顯示一定程度疏液性之分隔壁13。 323651 4 201225729 但是，分隔壁13顯示疏液性時，供給至凹部15之油墨係彈開於分隔壁13而氣化並且薄膜化，因此形成膜厚不均勻之發光層。例如有機層18接於分隔壁13之部位（也就是有機層 18之周邊部）係比中央部膜厚薄。此時，有機層周邊部之電阻比中央部低。結果在驅動有機EL元件時，在周邊部電流集中而流動，與周邊部相比中央部較暗。此外，相反地，發光層18之周邊部比起要求之膜厚還薄，因此發光層18 之周邊部也如所預期不會發光。為了解決前述問題，先前技術中，在分隔壁13和第1 電極16之間設置間隔部19，並在分隔壁端部和第1電極之間設置微細之間隙（參考第9圖）。在設置間隙之基台上供給油墨時，藉由毛細管現象使油墨吸入間隙並且薄膜化。如此，油墨不會因分隔壁端部彈開並且薄膜化，因此可形成預期膜厚之有機層。 [先前技術文獻] [專利文獻] 專利文獻1 :日本特開2009 — 506490號公報【發明内容】 [發明之概要] [發明所欲解決之課題] 但是，在前述先前技術中，為了形成間隙而需要間隔部，故有顯示裝置構造複雜化之問題。因此，本發明之目的係提供一種可在分隔壁所包圍之 323651 罾罾201225729 區域形成均勻膜厚之有機層，且具有簡易構造之顯示裝置。 [用以解決課題之手段] 本發明係提供以下之顯示裝置及其製造方法。 [1 ]: 一種顯示裝置，其係包含基台、在該基台上劃分預先設定之分區之的分隔壁、以及分別設置於藉由該分隔壁而劃分之分區的複數之有機電致發光元件的顯示裝置，其中，各有機電致發光元件係包含至少一層之第1電極、至少一層之有機層和至少一層之第2電極，並由前述之基台侧起以該順序層積；前述分隔壁其端部接合在前述之第1電極上；前述第1電極係前述分隔壁之端部所覆蓋之部位以外之殘餘部位及該殘餘部位之周邊部具有凹陷，由前述基台厚度方向之一邊來看，此凹陷係於較前述分隔壁端部與前述第1電極之界面更接近於基台側。。 [2] :如[1]所述之顯示裝置，其中，前述凹陷深度係 20nm 至 300nm。 [3] : —種顯示裝置之製造方法，該顯示裝置係包含基台、在該基台上劃分預先設定之分區的分隔壁、以及分別設置於藉由該分隔壁而劃分之分區的複數之有機電致發光元件；各有機電致發光元件係包含至少一層之第1電極、至少一層之有機層和至少一層之第2電極；並由前述之基台側起以該順序層積而成；該製造方法包含：準備具有至少一層之第1電極設在上面之基台之步驟；將分隔壁形成圖案（pattern)並使該分隔壁之端部接 6 323651 201225729 合在前述第1電極上之步驟；在前述第1電極中，於前述分隔壁之端部所覆蓋之部位以外之殘餘部位及該殘餘部位之周邊部之表面形成凹陷之步驟；在前述第1電極上形成至少一層之有機層之步驟；以及，在前述有機層上，形成至少一層之第2電極之步驟。 [4]:如[3]所述之顯示裝置，在形成前述凹陷之步驟中，藉由濕式姓刻（wet etching)而形成前述之凹陷。 [發明之效果] 根據本發明可提供一種可在分隔壁包圍之區域形成均勻膜厚之有機層，且具有簡易構造之顯示裝置。【實施方式】 [發明之實施形態] 以下參考圖式並更詳細地說明本發明之實施形態。此外，為了容易理解，故有圖式各構件之比例不同於實際之情形。在顯示裝置中也存在電極之導線等之構件，但在本發明說明中並不直接地需要故省略記載。為易於說明層構造等，以下所示例中係以基台配置於下面之圖而一同說明，但本發明之顯示裝置係不一定配置於該上下左右之方向，且不限定於製造或使用等所成之形態，而可適宜地調整。本發明之顯示裝置係包含基台、在該基台上劃分預先設定之分區的分隔壁、以及分別設置於藉由該分隔壁而劃 7 323651 201225729 分之分區的複數個有機電致發光元件的顯示裝置，其特徵為各有機EL元件係包含至少一層之第1電極、至少一層之有機層和至少一層之第2電極，並由前述基台側起以該順序層積’前述分隔壁其端部接合在前述之第1電極上；月’J述之第1電極係前述分隔壁端部所覆蓋之部位以外之殘餘部位及該殘餘部位之周邊部具有凹陷，由前述基台厚度方向之一邊來看此凹陷係於較前述分隔壁端部與前述第1 電極之界面更接近於基台側。顯示裝置主要有主動矩陣（active matrix)驅動型裝置和被動矩陣（passive matrix)驅動型之裝置。本發明係可適用於兩種型式之顯示裝置，但在本實施形態說明其一例之適用於主動矩陣驅動型顯示裝置之顯示裝置。 <顯示裝置之構造> 首先說明顯示裝置之構造。第1圖係擴大而示意地表示本實施形態之顯示裝置1之一部份的剖面圖。第2圖係擴大而示意地表示本實施形態之顯示裝置1之一部份的俯視圖。顯示裝置1係主要包含基台2、在該基台2上劃分預先設定之分區之分隔壁3、以及於藉由分隔壁3而劃分之分區所分別設置之複數有機EL元件4而構成。分隔壁3係在基台2上形成為例如格子狀或條紋狀。此外，在第2圖中’表示一實施形態之設置格子狀之分隔壁3的顯示裝置1。在同圖中’影線（hatching)區域係相當於分隔壁3。在基台2上設定藉由分隔壁3和基台2所規定之複數 8 323651201225729 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a display device and a method of fabricating the same. [Prior Art] The display device has various devices depending on its configuration and principle. One of the display devices which are currently applied to a light source of a pixel using an organic electroluminescence device (hereinafter referred to as "organic EL device"). In the display device, a large number of organic EL elements corresponding to the pixels are arranged on a predetermined base. Further, a partition wall which is divided into a predetermined partition is provided on the base, and a large number of organic EL elements are arranged in a region partitioned by the partition wall. Each of the organic EL elements is formed by laminating the first electrode, the organic layer, and the second electrode in this order from the base side. The organic layer can be formed, for example, by a coating method. Refer to Fig. 8 and explain how the organic layer is formed. As shown in Fig. 8A, first, the base 12 on which the first electrode 16 and the partition wall 13 are formed in advance is prepared. Next, the ink 17 containing the material forming the organic layer 18 is supplied to the region 15 surrounded by the partition wall 13 in the base 12. The supplied ink π is housed in a region (concave portion) 15 surrounded by the partition wall 13 (refer to Fig. 8B). Next, the organic layer 18 is formed by vaporizing the solvent of the ink 17 (refer to Fig. 8C). Further, when the partition wall 13 exhibits lyophilicity with respect to the ink π, the ink 17 for supplying ink flows out along the surface of the partition wall 13 to the adjacent concave portion: In order to prevent the outflow of such inks, a partition wall 13 for exhibiting a certain degree of liquid repellency to the ink is usually provided on the base 12. 323651 4 201225729 However, when the partition wall 13 exhibits lyophobic property, the ink supplied to the concave portion 15 is bounced off the partition wall 13 to be vaporized and thinned, so that a light-emitting layer having a non-uniform film thickness is formed. For example, the portion of the organic layer 18 that is connected to the partition wall 13 (i.e., the peripheral portion of the organic layer 18) is thinner than the central portion. At this time, the electric resistance of the peripheral portion of the organic layer is lower than that of the central portion. As a result, when the organic EL element is driven, current flows in the peripheral portion and flows, and the central portion is darker than the peripheral portion. Further, conversely, the peripheral portion of the light-emitting layer 18 is thinner than the required film thickness, so that the peripheral portion of the light-emitting layer 18 also does not emit light as expected. In order to solve the above problem, in the prior art, a partition portion 19 is provided between the partition wall 13 and the first electrode 16, and a fine gap is provided between the partition wall end portion and the first electrode (refer to Fig. 9). When the ink is supplied on the abutment on which the gap is provided, the ink is sucked into the gap by the capillary phenomenon and thinned. Thus, the ink does not bounce off and is thinned by the end of the partition wall, so that an organic layer of a desired film thickness can be formed. [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2009-506490 SUMMARY OF INVENTION [Summary of the Invention] [Problems to be Solved by the Invention] However, in the aforementioned prior art, in order to form a gap Since the spacer is required, there is a problem that the structure of the display device is complicated. Accordingly, it is an object of the present invention to provide a display device which can form an organic layer having a uniform film thickness in a region of 323651 罾罾 201225729 surrounded by a partition wall, and has a simple structure. [Means for Solving the Problems] The present invention provides the following display device and method of manufacturing the same. [1]: A display device comprising a base, a partition wall dividing a predetermined partition on the base, and a plurality of organic electroluminescent elements respectively disposed on the partition divided by the partition wall The display device, wherein each of the organic electroluminescent elements comprises at least one of a first electrode, at least one organic layer, and at least one second electrode, and is laminated in this order from the abutment side; The end portion of the partition wall is joined to the first electrode; the remaining portion of the first electrode portion other than the portion covered by the end portion of the partition wall and the peripheral portion of the residual portion have a recess, and one side of the thickness direction of the base portion In view of the above, the recess is closer to the base side than the interface between the end of the partition wall and the first electrode. . [2] The display device according to [1], wherein the recess depth is 20 nm to 300 nm. [3]: A method of manufacturing a display device, comprising: a base, a partition wall dividing a predetermined partition on the base, and a plurality of partitions respectively disposed on the partition by the partition wall An organic electroluminescent device; each of the organic electroluminescent elements comprising at least one of a first electrode, at least one organic layer, and at least one second electrode; and is laminated in this order from the base side; The manufacturing method includes: preparing a step of having at least one of the first electrodes provided on the upper surface; patterning the partition wall and connecting the end portion of the partition wall to the first electrode; a step of forming a recess on a surface of the first electrode other than a portion covered by the end portion of the partition wall and a peripheral portion of the residual portion; forming at least one organic layer on the first electrode And a step of forming at least one second electrode on the organic layer. [4] The display device according to [3], wherein in the step of forming the recess, the aforementioned recess is formed by wet etching. [Effect of the Invention] According to the present invention, it is possible to provide a display device which can form an organic layer having a uniform film thickness in a region surrounded by a partition wall and which has a simple structure. [Embodiment] [Embodiment of the Invention] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. In addition, for the sake of easy understanding, the proportion of each component in the drawing is different from the actual situation. Although a member such as a lead wire of an electrode is also present in the display device, it is not necessary to omit the description in the description of the present invention. In order to facilitate the description of the layer structure and the like, the following examples are described with the base plate arranged in the following drawings. However, the display device of the present invention is not necessarily arranged in the vertical and horizontal directions, and is not limited to manufacturing or use. It can be adjusted as appropriate. The display device of the present invention comprises a base, a partition wall dividing the predetermined partition on the base, and a plurality of organic electroluminescent elements respectively disposed on the partition by 7 323651 201225729 by the partition wall. A display device characterized in that each of the organic EL elements includes at least one of a first electrode, at least one organic layer, and at least one second electrode, and the end of the partition wall is laminated in this order from the base side. a portion is joined to the first electrode; the first electrode of the month described in the first electrode is a portion other than the portion covered by the end portion of the partition wall, and a peripheral portion of the remaining portion has a recess, and one side of the thickness direction of the base It is seen that the depression is closer to the abutment side than the interface between the end of the partition wall and the first electrode. The display device mainly includes an active matrix driving type device and a passive matrix driving type device. The present invention is applicable to two types of display devices. However, in this embodiment, a display device suitable for an active matrix drive type display device will be described. <Configuration of Display Device> First, the configuration of the display device will be described. Fig. 1 is a cross-sectional view showing a part of the display device 1 of the present embodiment in an enlarged manner. Fig. 2 is a plan view showing a part of the display device 1 of the present embodiment in an enlarged view. The display device 1 mainly includes a base 2, a partition wall 3 that divides a predetermined partition on the base 2, and a plurality of organic EL elements 4 that are respectively provided in the partitions partitioned by the partition wall 3. The partition wall 3 is formed, for example, in a lattice shape or a stripe shape on the base 2. Further, in Fig. 2, a display device 1 in which a lattice-shaped partition wall 3 of one embodiment is provided is shown. In the same figure, the hatching area corresponds to the partition wall 3. The plural specified by the partition wall 3 and the base 2 is set on the base 2 8 323651

S 201225729 之凹部5。該凹部5係相當於藉由分隔壁3而劃分之分區。本實施形態之分隔壁3係設為格子狀。因此由基台2 之厚度方向Z之一邊（以下稱為「平面俯視」。）來看，複數之凹部5係配置為矩陣狀。也就是說凹部5係在行方向X 空出預定間隔，同時也在列方向Y空出預定間隔並排列及設置。各凹部5之平面俯視之形狀並無特別限定。例如凹部5以平面俯視可形成為略矩形狀、略橢圓狀或橢圓形狀等之形狀。本實施形態中以平面俯視而設置略矩形狀之凹部5。此外，本說明書中，前述之行方向X及列方向Y係表示分別垂直於基台厚度方向Z、並且相互地垂直之方向。本實施形態之分隔壁3係所謂順錐形狀。也就是說本實施形態之分隔壁3係隨著離開於基台2而形成為尖細狀。例如將延在於列方向Y之分隔壁以垂直於其延在方向 (列方向Y)之平面切斷時之剖面形狀，係除了分隔壁3之基台附近之一部份區域（由基台之表面起該區域之高度係相當於第1電極6之周邊部之厚度。）以外，隨著離開於基台而形成為尖細狀。第1圖中，表示有略等邊梯形形狀（也就是除了前述基台附近之一部份區域以外之等邊梯形形狀）之分隔壁，若比較上底和梯形底侧下底之，則下底係比起上底更寬。此外，實際形成之分隔壁剖面不一定為梯形狀，梯形狀之直線部份及角可帶有圓形，並形成為所謂魚板狀 (圓頂（dome)狀）。分隔壁3在本實施形態中主要設置在設置有機EL元件之區域以外之區域。此外，分隔壁3係主要設置在後述 9 323651 201225729 第t極6之區域以外之區域，但其端部％也形成在 3電極6之周邊部上而重疊於第1電極6。此外，在分隔2 3之端部3a和第i電極6之間形成預定之間隙別。此，，分隔壁3之端部如係不需要覆蓋第1電極6之全周邊-P而形成。例如在形成後述條紋狀之分隔壁3時，可形成分隔壁而使分隔壁端部覆蓋第1電極6的4邊中相對向之2邊。本實施形態中，形成分隔壁3之端部3a而覆蓋第 I*電極6之全周邊部。此外，#由分隔壁3之端部％而覆蓋之第1電極6之周邊部的寬通常為2〇nm以上，較佳為 2〇nm至Ι/zm(在此，所謂藉由分隔壁端部而覆蓋之第卫電極之周邊。ρ的寬，係指由基台厚度方向之一邊來看時周邊部的寬。例如在藉由分隔壁端部而覆蓋第1電極之全周邊部之第2圖之形態中，係指稱沿著行方向χ之寬及沿著列方向Υ之寬，在藉由分隔壁端部而覆蓋第丨電極之4邊中相對向之2邊之第6圖之形態中，係指稱沿著行方向χ之幅寬。）。有機EL元件4係設置在藉由分隔壁3而劃分之分區 (也就是凹部5)。如本實施形態般設置格子狀之分隔壁3 時，各有機EL元件4係分別設置在各凹部5。因此有機el 兀件4係相同於各凹部5而呈矩陣狀地配置，在基台2上，在行方向X空出預定之間隔’同時也在列方向γ空出預定之間隔而排列並設置。在本實施形態設置有3種類之有機EL元件4。即設置 (1)射出紅色光之紅色有機EL元件4R、（2)射出綠色光之 10 323651 201225729 綠色有機EL元件4G、以及（3)射出藍色光之藍色有機EL 元件4B。這些3種類之有機EL元件4R、4G、4B係例如在列方向Y以（I)、（II)、（III)之行之順序重複地配置，藉此分別排列並配置（參考第2圖）。 (I) 在行方向X分別空出預定之間隔而配置紅色有機 EL元件4R之行。 (II) 在行方向X分別空出預定之間隔而配置綠色有機 EL元件4G之行。 (III) 在行方向X分別空出預定之間隔而配置藍色有機EL元件4B之行。此外’作為其他之實施形態，除了前述3種類之有機 EL元件以外例如也可設置射出白色光之有機el元件。此外’可藉由設置僅1種類之有機EL元件而實現單色顯示裝置。有機EL元件4係包含至少一層之第1電極、至少一層之有機層、至少一層之第2電極，而由基台2侧起以該順序進行層積。在本說明書中，將設置於第丨電極6和第 2電極1〇之間之層中，包含有機物之層稱為有機層。有機 EL兀件4具備至少一層之發光層作為有機層。此外，有機 EL元件除了 1層之發光層以外，亦可視其必要復具備不同於發光層之有機層或無機層。例如可在第1電極6和第2 電極1G之間設置電職人層、電洞輸送層、電子阻擋層、電子輸送層和電子注人層等。此外，可在第1電極6和第 2電極10之間設置2層以上之發光層。 323651 11 201225729 有機EL元件4係具備第1電極6和第2電極〗〇作為由陽極和陰極組成之一對的電極。第丨電極6和第2電極 10中邊之電極设置作為陽極，另一邊之電極設置作為陰極。作為本實施形態之一例而說明作為陽極機能之第^電極6、作為電洞注入層機能之第丨有機層7、作為發光層機能之第2有機層9、以及作為陰極機能之第2電極1〇，以該順序而層積於基台2上之構造之有機EL元件4。本實施形態中設置3種類之有機El元件，但該等之第2有機層（在本實施形態之發光層）9之構造係分別不同。紅色有機EL元件4R具備放射紅色光之紅色發光層9。綠色有機EL元件4G具備放射綠色光之綠色發光層9。藍色有機EL元件4B具備放射藍色光之藍色發光層9。本實轭形態中第1電極6係設置在每一個有機元件4。也就是說，有機EL元件4和相同數目之第丨電極6 係。又置在基台2上。第1電極6係對應於有機元件4 之配置而進行設置，且有機EL元件4相同地配置為矩陣狀。此外，本實施形態之分隔壁3係主要呈格子狀地形成在第1電極6以外之區域，此外形成其端部3aj^覆蓋第i 電極6之周邊部（參考第丨圖）。一由基台2厚度方向之一邊來看，第丨電極6在前述分隔壁之端部3a所覆蓋之部位以外之殘餘部位、以及該戔餘卩位之周邊部（也就是殘餘部位附近之外侧區域）6b 八有凹陷，此凹陷係於較前述分隔壁端部與前述第1電極 323651 12 201225729 之界面更接近於基台2側。藉由形成如此凹陷，而在分隔壁3之端部3a和第i電㈣之間形成預定之間隙31。此 f ’此種凹陷在第1電極6 +，可涵蓋前述分隔壁之端部 3a所覆蓋之部位以外之殘餘部位“與該殘餘部位之周邊部6b而設置，並在每—個第1電極6分別設置一個。作為電洞注入層機能之第i有機層7係設置於凹部5 中的第1電極6上。該第！有機層7視其必要而在每種類之有機EL it件設置不同材料或膜厚。此外由帛】有機層7 之形成步驟之簡易度的觀點來看，則可以相同之材料、^目同之膜厚形成全部之第丨有機層7。該第丨有機層7係以其端部填充於分隔壁3和第丨電極6之間的間隙3丨之方式而形成。作為發光層機能之第2有機層9係設置於凹部5中的第1有機層7上。如前述發光層係配合有機EL元件之種類而設置。也就是說，紅色發光層9係設置在設置紅色有機 ELtg件4R之凹部5。綠色發光層9係設置在設置綠色有機 EL tl件4G之凹部5。藍色發光層9係設置在設置藍色有機 EL元件4B之凹部5。此外’第2有機層9以其端部填充於分隔壁3和第i 電極6之間的間隙31之方式而形成。第2電極10係形成於設置有機EL元件4之顯示區域整面。也就是說第2電極10係不僅形成在第2有機層9 上，也形成在分隔壁3上，並涵蓋複數有機EL元件而連續地形成’而設置作為全部有機EL元件4共通之電極。 13 323651 201225729 本發明之顯示褒置之製造方法其特徵為包含：置至少一層之第1電極於其上之基台之步驟；將分隔壁形成圖案並使該分隔壁之端部接合在前述第i電極驟；在^之第丨電極中，於前述分隔”部覆蓋之部^ 以外之殘餘部位及該殘餘敎之周邊部之表面形成步驟、;在前述^ 1電極上，形成至少1之有機層之步驟，以及，在前述之有機層上，之步驟。 %成至'一層之第2電極以下參考第3圖至第5圖並說明顯示裝置之製造方法0 (準備基台之步驟）在本步驟中準備設置至少一層之第1電極於其上之基台。以下說明準備設置-層之第i電極於其上之基台施形態。本步驟中在基台2上形fS 2012 5729 recess 5. This recess 5 corresponds to a partition defined by the partition wall 3. The partition wall 3 of the present embodiment is formed in a lattice shape. Therefore, the plurality of concave portions 5 are arranged in a matrix shape from one side in the thickness direction Z of the base 2 (hereinafter referred to as "planar plan view"). That is, the recesses 5 are vacant at a predetermined interval in the row direction X, and are also arranged at a predetermined interval in the column direction Y and arranged and arranged. The shape of the plane of each of the recesses 5 is not particularly limited. For example, the concave portion 5 may be formed in a shape of a substantially rectangular shape, a slightly elliptical shape, or an elliptical shape in plan view. In the present embodiment, the concave portion 5 having a substantially rectangular shape is provided in a plan view. Further, in the present specification, the row direction X and the column direction Y are directions which are perpendicular to the thickness direction Z of the base and which are perpendicular to each other. The partition wall 3 of the present embodiment is a so-called tapered shape. That is, the partition wall 3 of the present embodiment is formed in a tapered shape as it leaves the base 2. For example, the shape of the cross section when the partition wall extending in the column direction Y is cut perpendicularly to the plane extending in the direction (column direction Y) is a part of the vicinity of the base of the partition wall 3 (by the abutment The height of the surface of the surface corresponds to the thickness of the peripheral portion of the first electrode 6, and is formed into a tapered shape as it leaves the base. In Fig. 1, a partition wall having a substantially equilateral trapezoidal shape (i.e., an equilateral trapezoidal shape other than a portion of the vicinity of the abutment) is shown, and if the upper bottom and the trapezoidal bottom side are compared, the lower The bottom is wider than the upper base. Further, the actually formed partition wall section is not necessarily trapezoidal, and the straight portion and the corner of the trapezoidal shape may have a circular shape and be formed into a so-called fish plate shape (dome shape). In the present embodiment, the partition wall 3 is mainly provided in a region other than the region where the organic EL element is provided. Further, the partition wall 3 is mainly provided in a region other than the region of the t-pole 6 of 9 323651 201225729 to be described later, but the end portion % is also formed on the peripheral portion of the third electrode 6 and overlaps the first electrode 6. Further, a predetermined gap is formed between the end portion 3a of the partition 23 and the i-th electrode 6. Therefore, the end portion of the partition wall 3 is formed so as not to cover the entire circumference -P of the first electrode 6. For example, when the stripe-shaped partition wall 3 to be described later is formed, the partition wall can be formed such that the partition wall end portion covers the opposite sides of the four sides of the first electrode 6. In the present embodiment, the end portion 3a of the partition wall 3 is formed to cover the entire peripheral portion of the first electrode 6. Further, the width of the peripheral portion of the first electrode 6 covered by the end portion % of the partition wall 3 is usually 2 〇 nm or more, preferably 2 〇 nm to Ι / zm (here, by the partition wall end) The periphery of the second electrode covered by the portion. The width of ρ refers to the width of the peripheral portion when viewed from one side of the thickness direction of the base. For example, the entire peripheral portion of the first electrode is covered by the end of the partition wall. In the form of Fig. 2, the width of the crucible along the row direction and the width of the crucible along the column direction are referred to, and the two sides of the four sides of the fourth electrode covering the second electrode are covered by the end of the partition wall. In the form, it refers to the width of the 沿着 along the row direction.). The organic EL element 4 is provided in a partition (i.e., the recess 5) divided by the partition wall 3. When the grid-shaped partition wall 3 is provided as in the present embodiment, each of the organic EL elements 4 is provided in each of the recesses 5. Therefore, the organic EL elements 4 are arranged in a matrix shape in the same manner as the respective concave portions 5, and are arranged at the predetermined interval in the row direction X on the base 2, and are arranged and arranged at predetermined intervals in the column direction γ. . In the present embodiment, three types of organic EL elements 4 are provided. In other words, (1) a red organic EL element 4R that emits red light, (2) a green light emitting device 10 323651 201225729 green organic EL element 4G, and (3) a blue organic EL element 4B that emits blue light. The three types of organic EL elements 4R, 4G, and 4B are arranged in the order of (I), (II), and (III) in the column direction Y, for example, and are arranged and arranged (refer to FIG. 2). . (I) The red organic EL element 4R is arranged at a predetermined interval in the row direction X. (II) The green organic EL element 4G is arranged at a predetermined interval in the row direction X. (III) The line of the blue organic EL element 4B is arranged at a predetermined interval in the row direction X. Further, as another embodiment, an organic EL element that emits white light may be provided in addition to the above-described three types of organic EL elements. Further, a monochrome display device can be realized by providing only one type of organic EL element. The organic EL element 4 includes at least one of a first electrode, at least one organic layer, and at least one second electrode, and is laminated in this order from the side of the base 2 . In the present specification, a layer provided between the second electrode 6 and the second electrode 1A is referred to as an organic layer. The organic EL element 4 has at least one light-emitting layer as an organic layer. Further, in addition to the light-emitting layer of one layer, the organic EL element may have an organic layer or an inorganic layer different from the light-emitting layer as necessary. For example, an electric person layer, a hole transport layer, an electron blocking layer, an electron transport layer, an electron injecting layer, or the like may be provided between the first electrode 6 and the second electrode 1G. Further, two or more light-emitting layers may be provided between the first electrode 6 and the second electrode 10. 323651 11 201225729 The organic EL element 4 includes an electrode in which the first electrode 6 and the second electrode are formed as one pair of an anode and a cathode. The electrodes on the middle of the second electrode 6 and the second electrode 10 are provided as anodes, and the electrodes on the other side are provided as cathodes. As an example of the present embodiment, the second electrode 6 as the anode function, the second organic layer 7 as the hole injection layer function, the second organic layer 9 as the light-emitting layer function, and the second electrode 1 as the cathode function can be described. Then, the organic EL element 4 having the structure laminated on the base 2 in this order. In the present embodiment, three types of organic EL elements are provided, but the structures of the second organic layers (the light-emitting layers of the present embodiment) 9 are different. The red organic EL element 4R includes a red light-emitting layer 9 that emits red light. The green organic EL element 4G includes a green light-emitting layer 9 that emits green light. The blue organic EL element 4B is provided with a blue light-emitting layer 9 that emits blue light. In the present yoke configuration, the first electrode 6 is provided in each of the organic elements 4. That is, the organic EL element 4 and the same number of the second electrode 6 are connected. It is placed on the base 2 again. The first electrode 6 is provided corresponding to the arrangement of the organic elements 4, and the organic EL elements 4 are arranged in a matrix shape in the same manner. Further, the partition wall 3 of the present embodiment is formed mainly in a lattice shape in a region other than the first electrode 6, and the end portion 3aj is formed to cover the peripheral portion of the i-th electrode 6 (refer to the first drawing). When viewed from one side in the thickness direction of the base 2, the remaining portion of the second electrode 6 outside the portion covered by the end portion 3a of the partition wall, and the peripheral portion of the remaining 卩 position (that is, the outer side near the residual portion) The region 6b has a depression which is closer to the side of the base 2 than the interface between the end of the partition wall and the first electrode 323651 12 201225729. By forming such a depression, a predetermined gap 31 is formed between the end portion 3a of the partition wall 3 and the i-th electric (four). The depression of the f' such that the first electrode 6 + may cover the remaining portion other than the portion covered by the end portion 3a of the partition wall "is provided with the peripheral portion 6b of the residual portion, and is provided for each of the first electrodes 6 is provided separately. The i-th organic layer 7 functioning as a hole injection layer function is provided on the first electrode 6 in the recess 5. The organic layer 7 is different in each type of organic EL-element as necessary. Further, the material or the film thickness. Further, from the viewpoint of the ease of the formation step of the organic layer 7, all of the second organic layer 7 can be formed by the same material and the film thickness. The second organic layer 7 The end portion is formed so as to fill the gap 3 between the partition wall 3 and the second electrode 6. The second organic layer 9 functioning as a light-emitting layer is provided on the first organic layer 7 in the recess 5. The light-emitting layer is provided in accordance with the type of the organic EL element. That is, the red light-emitting layer 9 is disposed in the recess 5 in which the red organic ELtg member 4R is disposed. The green light-emitting layer 9 is disposed in the green organic EL element 4G. Concave 5. Blue luminescent layer 9 is set in blue organic The recessed portion 5 of the EL element 4B. Further, the second organic layer 9 is formed such that its end portion is filled in the gap 31 between the partition wall 3 and the i-th electrode 6. The second electrode 10 is formed in the organic EL element 4 In other words, the second electrode 10 is formed not only on the second organic layer 9, but also on the partition wall 3, and covers a plurality of organic EL elements to be continuously formed and provided as all organic EL elements. 4 common electrode. 13 323651 201225729 The manufacturing method of the display device of the present invention is characterized by comprising: a step of placing at least one layer of the first electrode thereon; forming a partition wall and making the end of the partition wall a portion of the first electrode step; wherein, in the second electrode of the second portion, a step of forming a surface of the remaining portion other than the portion covered by the partition portion and a peripheral portion of the residual germanium; and a step of forming at least one organic layer, and a step on the aforementioned organic layer. %2 to the second electrode of the first layer. Referring to FIGS. 3 to 5 and explaining the manufacturing method of the display device 0 (the step of preparing the abutment), in this step, it is prepared to provide at least one layer of the first electrode thereon. station. The following is a description of the configuration in which the i-th electrode of the set-layer is prepared. In this step, the base 2 is shaped f

化成第1電極6(參考第3A 圖）。此外，在本步驟中，第1電極6預先形成於其上之基台可由市職得，而可藉此準備㈣形成第丨電極6 仝？〇主動矩陣型之齡裝置之料，可將㈣職㈣個別地驅動複數财機EL元件之迴路之基板作為基台2使用。可使用例如預先形成TFT(Thin Film MW)及電容器等之基板而作為基台。首先在基台2上呈矩陣狀地形成複數個第丨電極6。第1電極6係例如在基台2上之一面形成導電性薄膜，並以光刻（photol i thography )法圖案化該矩陣狀地而形成圖 323651 14 201225729 案。此外例如可將在預定之部位形成開口之遮罩配置於基台2上，並透過該遮罩而在基台2上預定部位選擇性地堆積導電性材料，藉此對第1電極6形成圖案。第1電極6 之材料係於後述。 (形成分隔壁之步驟）在本步驟中，對於前述之分隔壁形成圖案而使其端部接合於前述之第1電極上。本實施形態中首先將包含感光性樹脂之油墨塗佈於前述基台上而形成分隔壁形成用膜 8。油墨之塗佈方法可列舉例如旋轉塗佈法或縫隙塗佈法等。將包含感光性樹脂之油墨塗佈成膜於前述基台上之後通常係進行預烘烤。藉由例如80至110°C之溫度、60 秒至180秒加熱基台2而進行預烘烤，並除去溶媒（參考第 3B 圖）。接著將遮住預定圖案之光之光罩21配置於基台2上，並透過該光罩21而曝光分隔壁形成用膜8。感光性樹脂有正型和負型之樹脂，但在本步驟可使用任何一種樹脂。使用正型之感光性樹脂時，在分隔壁形成用膜8中主要照射光於應該形成分隔壁3之部位以外之殘餘部位。此外，使用負型之感光性樹脂時，在分隔壁形成用膜8中，主要照射光於應該形成分隔壁3之部位。在本步驟中就使用負型之感光性樹脂之情形，參考第3C圖而說明。正如第3C圖所示，在形成分隔壁形成用膜8之基板上配置光罩21，並透過該光罩21而照射光，藉此在分隔壁形成用膜8中之主 15 323651 201225729 要應β亥形成分隔壁3之部位昭^ ^ 位照射光。此外，在第3C圖中，藉由箭號s己喊而示音妯矣； r 光。 ^表不照射於分隔壁形成用臈8之接著顯影曝光之分隔壁形成用膜8 形成圖案（參考第4Α固、。μ 使刀隔壁3 八η 2 G C至23代之溫度、15分妒二里口:，、基台而進行後供烤並硬化分隔壁3。形成为隔壁所制之感紐樹脂有負型和正型。負型之感光性樹脂係照溶化而殘留b 料之雜對於顯影液呈不劑、=:=:=:^ 黏合劑樹脂係預先聚合者。其例子可列舉聚合性之非聚合性黏合劑樹脂、導入具有聚合性之之聚合性黏合賴脂。㈣苯乙料色譜法（GPC)所求出黏合劑樹脂之重量平均分凝膠透至400,000之範圍。里為5, 000 黏合劑秘脂可列舉例如紛樹脂、紛酸清漆樹ρ (η 1 resin)、二 t 氰胺樹脂（meiamine resin)、内缔萨 i t 環氧樹脂、聚酯樹脂等。黏合劑樹脂可使用均I物、 (homopolymer)與組合2種以上單體之共聚物住何一種。相對於包含，，性樹脂之油墨之總固形份，觀二樹脂目以質量分率通常為5%至90%。交聯劑係可藉由光照射而以光聚合起始劑產生之活 323651 16 201225729 性自由基、酸等而進行聚合之化合物，可列舉例如具有聚合性碳一碳不飽和鍵之化合物。交聯劑係可為在分子内具有1個聚合性碳一碳不飽和鍵之單官能化合物，也可為具有2個以上聚合性碳一碳不飽和鍵之2官能或3官能以上之多官能化合物。在包含前述感光性樹脂之油墨中，在黏合劑樹脂和交聯劑之合計量為10 0質量份時，交聯劑通常為0. 1質量份以上、70質量份以下。此外，在包含前述感光性樹脂之油墨中，在黏合劑樹脂和交聯劑之合計量為 100質量份時，光聚合起始劑通常為1質量份以上、30質量份以下。另一方面，正型感光性樹脂係光之照射部份相對於顯影液呈可溶化者。正型感光性樹脂係一般藉由將樹脂與以光反應進行親水化之化合物複合化而構成。正型感光性樹脂係可使用將酚醛清漆樹脂、聚羥基苯乙烯、丙烯酸系樹脂、甲基丙烯酸系樹脂、聚醯亞胺 (polyimide)等具有耐藥品性和密著性之樹脂與光分解性化合物組合者。可調配於包含感光性樹脂之油墨之添加劑係列舉例如在分隔壁賦予疏液性之材料。可在本步驟使用之賦予疏液性之材料（疏液劑）可列舉例如含氟化合物、含聚石夕氧 (silicone)化合物等。較佳為對於有機溶劑也顯示良好疏液性之含氟化合物。含氟化合物可列舉例如具有碳原子數1至8之直鏈狀或分支狀氟烧基及/或氣化聚醚基之化合物。含I化合物較 17 323651 201225729 更佳為具有碳原子數4至佳為具有交聯性基之聚合物此 ^烧基及/或敗化聚喊基、且具有交聯性基之聚合物外，含氟化合物較佳為對於δ 化人物仫口 fen— 、頌衫液具有可溶性機能。含氟性成分_後於分隔壁表面賦予疏液吐者即可，並不限定於聚合物，可為低分子化合物。 ”性基係在錢化合物賦予㈣性機能者，可例舉用^不紗鍵絲轉氧基、氫氧鱗。如果具有與使刀隔壁形成之感光性樹脂交聯之機能，則交聯性基之種類係並非限定於前述者。疏液劑可列舉例如Megaface RS—1〇1、rs_i〇2、防〜105、RS—4(H、RS —402、RS-5(H、RS— 502、RS—718(以上為DIC公司製）、〇PTO〇l DAC、0PT0ACE Hp系列（以上為 Daikin工業公司製）、全氟（甲基）丙烯酸酯、全氟二（… 内烯酸酯等。土前述疏液劑可單獨使用1種，也可組合2種以上使用。相對於包含前述感光性樹脂之油墨之總固形份，疏液劑以質量分率通常為0· 1質量份以上、3質量份以下。使用於顯影之顯影液可列舉例如氯化鉀水溶液、_ 化四甲基銨（TMAH)水溶液等。 _ 分隔壁3之形狀及其配置係配合像素數及解析户等不裝置之規格或製造之容易度等而適宜地設定。例如八_ 壁3之行方向X或列方向γ之寬係5/ζιη至50；um : m Μΐα程度，分词壁3之高度係〇.5em至5/zm程度，相鄰接於十、灯方向）或列方向Y之分隔壁3間之間隔，即凹部5之行方问X或 323651 18 201225729 此外，第1電極6 m至200 // m程度。列方向γ之寬係10//m至2〇〇“m程度。之打方向X或列方向Y之寬分別為10" (在第1電極形成凹陷之步驟）在前述第1電極6中’於前述分隔壁 =3a所覆蓋之部位以外之殘餘部位與該殘餘邊部之表面形成凹陷（參考第4B圖）。也就是說，在本步之驟周 =二之厚度方向之一邊來看，在前述分隔壁3之 W 3a缝μ部位以狀殘餘部位m ⑽Mb形成凹陷，此凹陷係於較前述分隔壁二 =前述第1電極6之界面η更接近於基台侧。（參^ 具體來說可利用第i電極6上在第1電極6施行等方性㈣，藉此在第1電極形成凹陷’ R時可對於利用作為遮罩之分隔壁3之正下方進行底切（undercut)底切。蝕刻有濕式餘刻法及乾式钱刻法，但較佳為濕式餘刻法。乾式則法中也關分隔壁3,或是也在表面堆積反應生成物。另一方面，在濕式钮刻法中，容易由分隔壁3 開始選擇性地_第丨電極6，且不肖彳切前述殘餘部位之周邊部上之分隔壁3,可在前述殘餘部位之周邊部形成凹陷，故為較佳。藉由進行如此之蝕刻，而可對於分隔壁3 之端部3a之下面進行所謂底切。在藉由濕式蝕刻法而蝕刻例如IT〇(IndiumTin〇xide : 銦錫氧化物）薄料，可制鹽酸和氯化鐵雜之混合溶 323651 19 201225729 液、及鹽酸和械之混合溶液進行㈣。此外，例刻IZOdndiumZincOxide:銦辞氧化物）時，可使用磷酽、硝酸和乙酸之混合溶液而進行餘刻。久、乾式钮刻法係列舉例如在反應氣體中曝露材料法（反應性氣體触刻）、及藉由電激而離子化•自由> 體並進行㈣之反應性離子_^❹於乾式^ ^ «氣體可列舉例如CF4、⑽3、CH2F2、W、C4Fe、Lb等, 可藉由像這樣施行ϋ刻’而可在第丨電極6中卞述分隔壁之端部所覆蓋<部位以外之殘餘部位和該^ 位之周邊部（也就是殘餘部位附近之外側區域）之表面形: 凹陷。此外，此凹陷係可在第i電極中，涵蓋前述分隔之端部所S蓋之雜财卜之殘餘部位和㈣料位之部之表面而設置，並在每一個第丨電極6分別設置—個。此外，可分2次進行分隔壁形成用膜8之後烘烤，在第1次後烘烤和第2次後烘烤之間進行前述蝕刻。此時，較佳為使第1次後烘烤之第丨溫度和第2次烘烤之第2溫度不同。具體地說，較佳為第丨溫度低於第 2溫度。此外，第2溫度係可確實地硬化分隔壁3之溫度，第1溫度係低於可確實地硬化分隔壁3溫度之溫度。彳=如藉由在110°C加熱3分鐘而進行第1後烘烤。若以此條件進行第1次後烘烤，則形成和第1電極6之密著性弱^八隔壁3。若在第1電極6和分隔壁3之密著性弱之狀截刀施行前述蝕刻，則在第1電極6和分隔壁3之界面容易# 透蝕刻液’即使是等方性蝕刻，在分隔壁3的下面，聲 323651 20 201225729 向钱刻也變得容易進行，可形成更寬之底切β 之後=Γ1溫度進行後供烤時，可在崎以通常就是在第2溫度進行後烘烤，藉此而確 =魏分隔壁3。可藉此而形成基台和η電極之密著性強之分隔壁3。第1次後料條件較料帛丨s 加熱時間為2分鐘至10分鐘，第？ ^ I主 9、w “ iU刀鐘_ 2次後烘烤條件較佳為第 L度為靴至23(rc、加熱時間為15分鐘至6。分鐘。凹陷之深度LD(參考第4B圖）較佳為2g⑽至獅⑽。卜笛在平面俯視之第！電極6之凹陷之前述周邊部（也就 ^ 中’ A隔壁之端部所|蓋之部位以外之殘餘 2之周邊部6b;參考第1圖。）的寬通常為2〇nm至 =為20nm至lem(在此’該周邊部的寬係指由基台之厚二方向之:邊來看時之周邊部的寬。例如在藉由分隔壁之而覆蓋第1電極之全周邊部之第2圖之形態中，係指订方向X之寬及沿著列方向Y之寬，在藉由分隔壁之 ^部而覆蓋第i電極之4邊中相對向之2邊之第6圖之形匕、’係指沿著行方向X之寬。）。 (形成有機層之步驟）機在本步驟中，在前述之第1電極上形成至少一層之有來層—以下就在第1電極上形成二層之有機層之實施形態 A進行說明。在本步驟中藉由塗佈法而形成至少一層之有幾層在本實施形態中，藉由塗佈法而形成第1有機層7 及第2有機層9。 21 323651 201225729 首先將包含成為第1有機層7之材料之油墨22供給至分隔壁3所包圍之區域（凹部5)(參考第4C圖）。油墨係考量分隔壁3之形狀、成膜步驟之簡易度、以及成膜性等之條件，而藉由最適當方法而適度地供給。油墨係例如可藉由喷墨印刷法、喷嘴塗佈法、凸版印刷法及凹版印刷法等而供給。接著，藉由固化所供給之油墨22而形成第1有機層 K參考第5A圖）。油墨之固化係可藉由例如自然乾燥、加熱乾燥、真空乾燥而進行。此外，油墨含有藉由加以能量而聚合之材料時，可在供給油墨後，藉由加熱薄膜或是在薄膜照射光而聚合構成有機層之材料。藉由像這樣聚合構成有機層之材料，可使第1有機層難溶化於在該有機層（以下稱為「第1有機層」。）上形成其他之有機層（以下稱為「第 2有機層」。）時所使用之油墨。供給至分隔壁3所包圍之區域（凹部5)之油墨22係藉由毛細管現象而吸入至分隔壁3之端部3a和第1電極6 之間之間隙31，並且氣化溶媒而薄膜化。如此藉由毛細管現象而可防止油墨彈開至分隔壁3,因此即使是分隔壁3 具有疏液性，也可防止分隔壁3附近之第1有機層7比起中央部還更為薄膜化。藉此而可形成平坦之第1有機層7。接著，形成發揮作為發光層機能之第2有機層9。第 2有機層9係可以與第1有機層7相同方式而形成。也就是說，可藉由將包含成為紅色發光層9之材料之油墨、包含成為綠色發光層9之材料之油墨、和包含成為藍色發光The first electrode 6 is formed (refer to Fig. 3A). Further, in this step, the base on which the first electrode 6 is previously formed can be commercially available, and thereby the preparation of the fourth electrode 6 can be prepared.之 The material of the active matrix type ageing device can be used as the base 2 for the circuit of the circuit of the EL element of the plurality of financial machines. For example, a substrate such as a TFT (Thin Film MW) and a capacitor can be used in advance as a base. First, a plurality of second electrodes 6 are formed in a matrix on the base 2. The first electrode 6 is formed by, for example, forming a conductive thin film on one surface of the base 2, and patterning the matrix by photolithography to form a pattern of 323651 14 201225729. Further, for example, a mask having an opening formed at a predetermined portion may be disposed on the base 2, and a conductive material may be selectively deposited on a predetermined portion of the base 2 through the mask, thereby patterning the first electrode 6. . The material of the first electrode 6 will be described later. (Step of Forming Partition Wall) In this step, the partition wall is patterned to have its end portion joined to the first electrode. In the present embodiment, first, an ink containing a photosensitive resin is applied onto the base to form a film for forming a partition wall 8. The coating method of the ink may, for example, be a spin coating method or a slit coating method. The ink containing the photosensitive resin is usually pre-baked after being coated on the above-mentioned base. The base 2 is heated by, for example, a temperature of 80 to 110 ° C for 60 seconds to 180 seconds, and the solvent is removed (refer to Fig. 3B). Then, the photomask 21 that blocks the light of the predetermined pattern is placed on the base 2, and the film for forming the partition wall 8 is exposed through the photomask 21. The photosensitive resin has a positive type and a negative type of resin, but any of the resins may be used in this step. When a positive-type photosensitive resin is used, the partition wall forming film 8 is mainly irradiated with a residual portion other than the portion where the partition wall 3 should be formed. Further, when a negative-type photosensitive resin is used, the partition wall forming film 8 mainly illuminates light at a portion where the partition wall 3 should be formed. In the case where a negative photosensitive resin is used in this step, it will be described with reference to Fig. 3C. As shown in Fig. 3C, the photomask 21 is placed on the substrate on which the partition wall forming film 8 is formed, and the light is transmitted through the mask 21, whereby the main film in the partition wall forming film 8 is required. The portion where the partition wall 3 is formed by the β-hai is irradiated with light. In addition, in the 3C figure, the sound is indicated by the arrow s shouting; r light. The surface of the partition wall forming film 8 which is formed by the subsequent development exposure of the partition wall is formed into a pattern (refer to the fourth tamping, μ so that the knife partition 3 η 2 2 GC to the temperature of the 23rd generation, 15 minutes 妒Likou: After the base is baked, the partition wall 3 is baked and hardened. The inductive resin formed into the partition wall has a negative type and a positive type. The negative type photosensitive resin is dissolved and the residual material b remains. The liquid is in the form of a solution, and the binder resin is prepolymerized. Examples thereof include a polymerizable non-polymerizable binder resin, and a polymerizable adhesive lyophilized resin. (IV) Benzene The average weight of the binder resin obtained by chromatography (GPC) is in the range of 400,000. The viscosity of the binder is 5,000. For example, the resin may be exemplified by a resin or a varnish ρ (η 1 resin). t meiamine resin, etasene epoxy resin, polyester resin, etc. The binder resin can be a homopolymer and a combination of two or more kinds of monomers. Contains, the total solid content of the ink of the resin, The amount of the crosslinking agent is usually from 5% to 90%. The crosslinking agent is a compound which can be polymerized by photo-irradiation using a photopolymerization initiator to produce a living radical 323651 16 201225729, a radical, an acid or the like, for example, having a polymerization. a compound having a carbon-carbon unsaturated bond. The crosslinking agent may be a monofunctional compound having one polymerizable carbon-carbon unsaturated bond in the molecule, or may have two or more polymerizable carbon-carbon unsaturated bonds. 1质量份。 The amount of the cross-linking agent is usually 0.1 parts by mass of the cross-linking agent, the cross-linking agent is usually 0.1 parts by mass. In the ink containing the photosensitive resin, when the total amount of the binder resin and the crosslinking agent is 100 parts by mass, the photopolymerization initiator is usually 1 part by mass or more and 30 parts by mass. On the other hand, the positive photosensitive resin-based light-irradiated portion is soluble with respect to the developer. The positive-type photosensitive resin is generally compounded by a resin which is hydrophilized by photoreaction. Composition. For the positive photosensitive resin, a resin having chemical resistance and adhesion such as a novolac resin, a polyhydroxystyrene, an acrylic resin, a methacrylic resin, or a polyimide can be used, and photodegradability can be used. A combination of a compound which can be blended with an ink containing a photosensitive resin, for example, a material which imparts lyophobicity to a partition wall. A material which can be used for lyophobicity (a lyophobic agent) which can be used in this step can be exemplified by fluorine. A compound, a polysilicon compound, etc., preferably a fluorine-containing compound which exhibits good lyophobicity with respect to an organic solvent. The fluorine-containing compound may, for example, have a linear or branched form having 1 to 8 carbon atoms. A compound of a fluoroalkyl group and/or a gasified polyether group. More preferably, the compound containing I is more than a polymer having a carbon number of 4 to preferably a polymer having a crosslinkable group, and a polymer having a crosslinkable group. The fluorine-containing compound preferably has a solubility function for the δ-shaped person 仫 fen 颂颂颂颂颂颂颂颂。。 The fluorine-containing component _ can be provided with a liquid repellency on the surface of the partition wall, and is not limited to a polymer, and may be a low molecular compound. "The basic system is a compound which imparts (4) sexual function to a money compound, and it can be exemplified by the use of a non-woven yarn to convert a hydroxyl group to a hydrogen hydroxide scale. If it has a function of crosslinking a photosensitive resin which forms a partition wall of a knife, crosslinkability is obtained. The type of the base is not limited to the above. For the lyophobic agent, for example, Megaface RS-1, rs_i 〇 2, anti-105, RS-4 (H, RS-402, RS-5 (H, RS-502) RS-718 (the above is manufactured by DIC Corporation), 〇PTO〇l DAC, 0PT0ACE Hp series (above, manufactured by Daikin Industries, Ltd.), perfluoro(meth)acrylate, perfluorodi(...). The lyophobic agent may be used singly or in combination of two or more kinds. The lyophobic agent is usually used in a mass fraction of 0.1 part by mass or more, based on the total solid content of the ink containing the photosensitive resin. The developing solution used for development may, for example, be an aqueous solution of potassium chloride or an aqueous solution of tetramethylammonium (TMAH). _ The shape of the partition wall 3 and its arrangement are matched with the number of pixels and the households It is set as appropriate in terms of specifications, ease of manufacture, etc. For example, _ _ wall 3 direction X or column The width of the direction γ is 5/ζιη to 50; um : m Μΐα degree, the height of the word segment wall 3 is 55em to 5/zm, adjacent to the ten, the lamp direction) or the column direction Y is the partition wall 3 The interval, that is, the row of the recess 5, X or 323651 18 201225729 In addition, the first electrode is 6 m to 200 // m. The width of the column direction γ is 10//m to 2 〇〇 "m degree. Or the width of the column direction Y is 10 " (the step of forming a recess in the first electrode). The remaining portion of the first electrode 6 other than the portion covered by the partition wall = 3a and the surface of the residual side portion are formed. The depression (refer to Fig. 4B). That is to say, in the side of the thickness direction of the second step of the step, the depression of the W 3a slit portion of the partition wall 3 is formed by the residual portion m (10) Mb, and the depression It is closer to the base side than the interface η of the partition wall 2 = the first electrode 6 (refer to the use of the i-th electrode 6 on the first electrode 6 to perform an isotropic (four), thereby When the first electrode forms the recess 'R, an undercut can be performed for the underside of the partition wall 3 as a mask. The wet remnant method and the dry money engraving method are engraved, but it is preferably a wet remnant method. In the dry method, the partition wall 3 is also closed, or the reaction product is also deposited on the surface. On the other hand, in the wet type In the button engraving method, it is easy to selectively _ the second electrode 6 from the partition wall 3, and the partition wall 3 on the peripheral portion of the remaining portion is not cut, and a recess can be formed in the peripheral portion of the residual portion. Preferably, by performing such etching, a so-called undercut can be performed on the lower surface of the end portion 3a of the partition wall 3. By etching a thin material such as IT〇 (Indium Tin Oxide) by wet etching, it is possible to prepare a mixed solution of hydrochloric acid and ferric chloride, 323651 19 201225729 liquid, and a mixed solution of hydrochloric acid and mechanical (4). . Further, in the case of IZOdndiumZincOxide: indium oxide, a mixture of phosphorus, nitric acid and acetic acid can be used for the remainder. For the long-term, dry button engraving series, for example, a method of exposing a material in a reactive gas (reactive gas engraving), and ionization by electromagnetization, and a free radical, and performing a reactive ion (4) in a dry type ^ ^ «The gas may, for example, be CF4, (10) 3, CH2F2, W, C4Fe, Lb, etc., and may be described in the second electrode 6 by the end portion of the partition wall. The surface shape of the residual portion and the peripheral portion of the position (that is, the outer side region near the residual portion): a depression. In addition, the recess may be disposed in the ith electrode, covering the remaining portion of the gap between the end portion of the partition and the surface of the portion of the (four) material level, and is disposed at each of the second electrodes 6 respectively. One. Further, the film for forming the partition wall 8 can be baked twice, and the etching can be performed between the first post-baking and the second post-baking. In this case, it is preferable that the second temperature of the first post-baking is different from the second temperature of the second baking. Specifically, it is preferred that the second temperature is lower than the second temperature. Further, the second temperature system can surely harden the temperature of the partition wall 3, and the first temperature system is lower than the temperature at which the temperature of the partition wall 3 can be surely hardened.彳 = The first post-baking was carried out by heating at 110 ° C for 3 minutes. When the first post-baking is performed under such conditions, the adhesion to the first electrode 6 is weakened and the partition wall 3 is formed. When the etching is performed on the cutter having the weak adhesion between the first electrode 6 and the partition wall 3, the interface between the first electrode 6 and the partition wall 3 is easy to be etched, even if it is an isotropic etching. Under the partition 3, the sound 323651 20 201225729 is also easy to carry out, and a wider undercut β can be formed. After the temperature is Γ1, the post-baking can be performed at the second temperature. By this, it is indeed = Wei partition wall 3. Thereby, the partition wall 3 having a strong adhesion between the base and the η electrode can be formed. The first post-feeding condition is 较s heating time is 2 minutes to 10 minutes, the first? ^ I main 9, w "iU knife bell _ 2 post-baking conditions are preferably the first L degree is boots to 23 (rc, heating time is 15 minutes to 6. minutes. Depth depth LD (refer to Figure 4B) Preferably, it is 2g (10) to the lion (10). The flute is in the plane of the top surface of the recessed portion of the electrode 6 (ie, the peripheral portion 6b of the residue 2 other than the end portion of the partition wall of the A partition wall; The width of Fig. 1) is usually 2 〇 nm to = 20 nm to lem (herein the width of the peripheral portion refers to the width of the periphery of the base: the width of the peripheral portion when viewed from the side. For example, In the form of the second figure covering the entire peripheral portion of the first electrode by the partition wall, the width of the pointing direction X and the width along the column direction Y are covered, and the i-th portion is covered by the partition wall In the four sides of the four sides of the electrode, the shape of the opposite side of the sixth figure, 'the width of the line along the row X.' (the step of forming the organic layer) is in this step, at the first electrode described above The formation of at least one layer of the upper layer is described below. Embodiment A in which a two-layer organic layer is formed on the first electrode will be described. In this step, at least one layer is formed by a coating method. In the present embodiment, the first organic layer 7 and the second organic layer 9 are formed by a coating method. 21 323651 201225729 First, the ink 22 including the material of the first organic layer 7 is supplied to the partition wall 3 The area enclosed by the recessed portion (refer to Fig. 4C). The ink is appropriately supplied by the most appropriate method in consideration of the shape of the partition wall 3, the ease of the film forming step, and the film forming property. The ink can be supplied, for example, by an inkjet printing method, a nozzle coating method, a relief printing method, a gravure printing method, etc. Next, the first organic layer K is formed by curing the supplied ink 22 with reference to FIG. 5A. The curing of the ink can be carried out, for example, by natural drying, heat drying, and vacuum drying. Further, when the ink contains a material polymerized by energy, the film can be heated or the film can be irradiated with light after the ink is supplied. The material constituting the organic layer is polymerized. By polymerizing the material constituting the organic layer as described above, the first organic layer can be hardly dissolved and another organic layer can be formed on the organic layer (hereinafter referred to as "the first organic layer"). Take The ink used in the following is called "the second organic layer". The ink 22 supplied to the region (recess 5) surrounded by the partition wall 3 is sucked into the gap 31 between the end portion 3a of the partition wall 3 and the first electrode 6 by capillary action, and is vaporized by a solvent. Thus, by the capillary phenomenon, the ink can be prevented from being bounced to the partition wall 3. Therefore, even if the partition wall 3 has liquid repellency, the first organic layer 7 in the vicinity of the partition wall 3 can be prevented from being thinner than the center portion. Thereby, the flat first organic layer 7 can be formed. Next, a second organic layer 9 functioning as a light-emitting layer is formed. The second organic layer 9 can be formed in the same manner as the first organic layer 7. In other words, the ink containing the material which becomes the red light-emitting layer 9, the ink which is the material which becomes the green light-emitting layer 9, and the blue light can be included.

22 323651 S 201225729 材料之油墨之3種類之油墨，分別供給至分隔壁3 所包圍之區域並固化該等，藉此而形成各發光層9。相同於㈣之第1有機層7，可以藉由來自於分隔壁之端部3a和第1電極6之間之間隙31之毛細管現象，而即使是分隔壁3具有疏液性，也可以形成平坦之第2有機層9。 (形成第2電極之步驟）、本步驟中’在前述有機層上形成至少一層之第2電極。、下就在有機層上形成__層之第2電極之實施形態來說明。在本實施形態中，第2電極1〇係形成在設置有機队兀件4之顯示區域整面。也就是說，第2電極_不僅形成於第2有機層9上，並且也形成於分隔壁3上，涵蓋複數有機EL元件而連續地形成。藉由像這樣形成第2電極，而設置機能為在全部有機EL元件4共通之電極 10。正如以上之說明，可藉由在第！電極6形成凹陷，並在分隔壁3之端部3和第！電極6之間設置間隙3卜而形成平坦之有機層。在先前技術中，藉由設置間隔部而在分隔壁3之端部3和第i電極6之間設置間隙31，但在本實施形態中’可僅藉由在第i電極6形成凹陷，而在分隔壁 3之端部3和第1電極6之間形成間隙3卜可不追加裝置之構，並可藉由簡易之裝置構造而形成平坦之有機層。以上就設置格子狀之分隔壁之形態之顯示裝置而說明’但正如前述，也可在基台上設置條紋狀之分隔壁。第 323651 23 201225729 6圖係擴大而示意地表示設置條紋狀之分隔壁之本實施形態之顯示裝置之一部份的俯視圖。在同圖中，影線區域係相冨於为隔壁3。第7.圖係顯不以.垂直於行方向X之平面切斷顯示裝置之顯示裝置的剖面形狀。此外以垂直於列方向Y之平面切斷顯示裝置之顯示裝置的剖面形狀係相同於第1圖。此外，本實施形態之顯示裝置其構造幾乎共通於前述實施形態之顯示裝置，因此以下僅就不同之部份進行說明，相對應之部份則附加相同之參考符號，並省略重複之說明。在設置條紋狀之分隔壁時，分隔壁係例如由延在於列方向Y之複數條分隔壁構件而構成。該分隔壁構件係在行方向X空出預定之間隔而進行配置。在設置條紋狀之分隔壁之形態中，藉由條紋狀之分隔壁和基台而規定條紋狀之凹部。在設置條紋狀之分隔壁時，有機EL元件4係在延在 =方向Y之各凹部中’於列方向γ分別空出預定而進行配置。第^電極6係相同於前述實施形態而呈矩陣狀地進行之邊=壁3其端部知以覆蓋第1電極6之行方向X 和其他邊之端部之方式形成(參如圖)。方向γ之㈠7圖所不’在本實施形態中，帛1電極6之列 ° 端部並無藉由分隔壁而覆蓋。別延有機層7及第2有機層9齡於在列方向Υ延在之各凹部而形成，並以涵蓋複數 323651 24 201225729 有機EL元件而連接之方式形成。，▲正如第1圖所示，本實施形態中，相同於前述之實施形態，S 1電極6在除去前述分隔壁之端部所覆蓋之部位以外之殘餘部位6a以及該殘餘部位之周邊部6b具有凹陷，由刖述基台厚度方向之一邊來看，此凹陷係於較前述为隔壁端部3a與前述第1電極6之界面11更接近於基台側。。藉由形成此種四陷，而在分隔壁3之端部3a和第j 電極6之間形成預定之間隙31。藉此以與前述實施形態同樣方式而形成平坦之有機層。〈有機EL元件之構造〉22 323651 S 201225729 The three types of inks of the ink of the material are respectively supplied to the region surrounded by the partition wall 3 and cured, whereby the respective light-emitting layers 9 are formed. The first organic layer 7 which is the same as (4) can be formed flat by the capillary phenomenon from the gap 31 between the end portion 3a of the partition wall and the first electrode 6, even if the partition wall 3 has liquid repellency. The second organic layer 9. (Step of Forming Second Electrode) In this step, at least one of the second electrodes is formed on the organic layer. The embodiment in which the second electrode of the __ layer is formed on the organic layer will be described. In the present embodiment, the second electrode 1 is formed on the entire surface of the display region where the organic component 4 is provided. In other words, the second electrode _ is formed not only on the second organic layer 9, but also on the partition wall 3, and is formed continuously covering the plurality of organic EL elements. By forming the second electrode as described above, the function is to provide the electrode 10 common to all of the organic EL elements 4. As explained above, it can be used in the first! The electrode 6 forms a recess and is at the end 3 of the partition wall 3 and the first! A gap 3 is provided between the electrodes 6 to form a flat organic layer. In the prior art, the gap 31 is provided between the end portion 3 of the partition wall 3 and the i-th electrode 6 by providing the spacer, but in the present embodiment, 'the recess can be formed only by the i-th electrode 6 A gap 3 is formed between the end portion 3 of the partition wall 3 and the first electrode 6. The structure of the device can be omitted, and a flat organic layer can be formed by a simple device structure. In the above description, a display device in the form of a lattice-shaped partition wall is provided. However, as described above, a stripe-shaped partition wall may be provided on the base. The 323 651 23 201225729 6 is an enlarged view schematically showing a plan view of a portion of the display device of the present embodiment in which the striped partition walls are provided. In the same figure, the hatched area is adjacent to the partition wall 3. The seventh figure shows that the cross-sectional shape of the display device of the display device is cut off in a plane perpendicular to the row direction X. Further, the cross-sectional shape of the display device in which the display device is cut in a plane perpendicular to the column direction Y is the same as in Fig. 1. In the display device of the present embodiment, the structure of the display device is substantially the same as that of the above-described embodiment. Therefore, the same reference numerals will be given to the corresponding parts, and the overlapping description will be omitted. When the striped partition wall is provided, the partition wall is constituted by, for example, a plurality of partition wall members extending in the column direction Y. The partition wall members are disposed at predetermined intervals in the row direction X. In the form in which the stripe-shaped partition walls are provided, the strip-shaped recesses are defined by the stripe-shaped partition walls and the base. When the stripe-shaped partition walls are provided, the organic EL elements 4 are disposed in the respective recesses in the = direction Y, and are arranged to be vacant in the column direction γ. The second electrode 6 is formed in a matrix shape in the same manner as in the above embodiment. The end portion of the wall 3 is formed so as to cover the row direction X of the first electrode 6 and the end portions of the other sides (see the figure). In the present embodiment, the end portion of the tantalum electrode 6 is not covered by the partition wall. The organic layer 7 and the second organic layer 9 are formed so as to extend in the respective recesses in the column direction, and are formed by connecting a plurality of 323651 24 201225729 organic EL elements. ▲ As shown in Fig. 1, in the present embodiment, in the same manner as the above-described embodiment, the S 1 electrode 6 has a residual portion 6a other than the portion covered by the end portion of the partition wall and a peripheral portion 6b of the remaining portion. The recess has a recess which is closer to the base side than the interface 11 between the partition end 3a and the first electrode 6 as viewed from the side of the thickness direction of the base. . By forming such a depression, a predetermined gap 31 is formed between the end portion 3a of the partition wall 3 and the j-th electrode 6. Thereby, a flat organic layer is formed in the same manner as in the above embodiment. <Configuration of Organic EL Element>

以下就有機EL元件之構造而更詳細地說明。有機EL 元件具有至少-層之發光層作為有機層。正如前述，有機 EL元件係可在一對之電極間具有例如電洞注入層、電洞輸送層、電子阻擋層、電洞阻擋層、電子輸送層和電子注入層等。以下顯示本實施形態之有機EL元件之可得之層構造之一例。 a) 陽極/發光層/陰極 b) 陽極/電洞注入層/發光層/陰極 c) 陽極/電洞注入層/發光層/電子注入層/陰極 d) 陽極/電洞注入層/發光層/電子輸送層/電子注入層/陰極 e) 陽極/電洞注入層/電洞輸送層/發光層/陰極〇陽極/電洞注入層/電洞輸送層/發光層/電子注入層/陰 25 323651 201225729 極 g) 陽極/電洞注入層/電洞輸送層/發光層/電子輸送層/電子注入層/陰極 h) 陽極/發光層/電子注入層/陰極 i) 陽極/發光層/電子輸送層/電子注入層/陰極 (在此，符號「/」係表示夾住符號「/」之各層相鄰接而進行層積。以下亦相同。）本實施形態之有機EL元件係可具有2層以上之發光層。在前述a)至i)之層構造中之任何一種中，若使失佐於陽極和陰極之層積體為「構造單位A」，則具有2層發光層之有機EL元件之構造係可列舉例如以下之j)所示之層構造。此外’ 2個（構造單位A )之層構造係可彼此相同或相異。 j) 陽極/(構造單位A)/電荷產生層/(構造單位A)/陰極在此，電荷產生層係藉由施加電場而產生電洞和電子之層。電荷產生層可列舉例如由氧化釩、銦錫氧化物（Indium Tin Oxide :簡稱 ΙΤ0)、銦鋅氧化物（Indium Zinc 〇xide : 簡稱IZO)、氧化鉬等而成之薄膜。此外，若使「（構造單位A)/電荷產生層」為「構造單位B」’具冑3層以上之發光層之有機EL元件之構造係可列舉例如以下之k)所示之層構造。 k) 陽極/(構造單位B)x/(構造單位A)/陰極 ^此外符號X」表不2以上之整數，（構造單位Β)χ 係表示層積xlx之構4單位Β之層積體^此外，複數（構造 26 323651 201225729 單位B)之層構造係可相同或相異。此外，可構成不設置電荷產生層、而直接地層積複數發光層之有機EL元件。 <基台> 基台適合使用在製造有機EL元件步驟中不會有化學變化者。基台之材料可列舉例如玻璃、塑膠、高分子薄膜和矽板、以及該等之層積體等。 <陽極> 由發光層放射之光通過陽極而射出至外界之構造之有機EL元件之情形，在陽極使用顯示光透過性之電極。顯不光透過性之電極可使用由金屬氧化物、金屬硫化物和金屬等之材料所成之薄膜，並適合使用電導率和光透過率高者。具體來說係使用由氡化銦、氧化鋅、氧化錫、IT〇、鋼辞氧化物（Indium Zinc 〇χ—:簡稱ΙΖ〇)、金、銘、銀和銅等所成之薄膜，該等當中適合使用由ITQ、IZQ或氧化锡戶^成之薄膜。此外’陽極可具有層積2層以上之層積構造。陽極之製作方法可列舉例如真空蒸艘法、濺鍍法、離子鍍去、鐘層法等。此外，該陽極可使用聚苯胺或其衍生物、聚嗟吩或其何生物等之有機透明導電膜。 <陰極> 丢極之材料係較佳為功函數小、電子層、且電導率言w 7 ^ Ϊ7Τ - ^ 材料。此外，由陽極側取出光之構造4 陽極為了將由發光層放射之光藉由陰極反射i ，’丢極之材料較佳為對於可見光呈高反射率之和 27 323651 201225729 料°相_極之材料可列舉例如金屬、層間化合物。前述之金屬可列舉例如驗金屬=和石墨過渡金屬及週期表金屬驗土類金屬、舒♦铯I鎮具體鐵、鎂、鈣、鳃、鋇、鋁、銳江銦、錦、釤、錄、级、糖莖辛、紀、上和由金、銀、麵、銅、錳、鈦、：1種以群組選出1種以上金鎳鎢、及锡所成乂上金屬之合金4’具體 :、鎂-銦合金、鎮，合金、銦—銀合金：:二合 ITJL Ϊ列舉例如氧化銦、氧化鋅、氧化錫、聚二二電性金屬氧化物；聚苯胺或其衍生物、細生物等之導電財機物。此外陰極可具有層積=以上之層積構造。此外電子注人層可使用作為陰才/。陰極之製作方法可列舉例如^蒸麟、離子 4。〃陽極錢極之膜厚料慮要求之雜及成膜步驟之簡易度等而適宜地設定，例如為i〇nm至i^『較佳為別⑽ 至1以m ’更佳為50nm至500nm。〈電洞注入層> 構成電洞注入層之電洞注入材料係可列舉例如氧化叙、氧化翻、氧化釕和氧化鋁等之氧化物；苯胺系化合物；星爆型（starburst)胺系化合物；酞菁（phthalocyanine) 系化合物；非晶質碳（amorph〇us carbon);聚苯胺；以及 28 323651Hereinafter, the structure of the organic EL element will be described in more detail. The organic EL element has at least a layer of a light-emitting layer as an organic layer. As described above, the organic EL element may have, for example, a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, an electron injecting layer, and the like between a pair of electrodes. An example of the layer structure of the organic EL device of the present embodiment is shown below. a) anode/light-emitting layer/cathode b) anode/hole injection layer/light-emitting layer/cathode c) anode/hole injection layer/light-emitting layer/electron injection layer/cathode d) anode/hole injection layer/light-emitting layer/ Electron transport layer / electron injection layer / cathode e) Anode / hole injection layer / hole transport layer / luminescent layer / cathode 〇 anode / hole injection layer / hole transport layer / luminescent layer / electron injection layer / yin 25 323651 201225729 Extremely g) Anode/hole injection layer/hole transport layer/light-emitting layer/electron transport layer/electron injection layer/cathode h) anode/light-emitting layer/electron injection layer/cathode i) anode/light-emitting layer/electron transport layer /Electron injection layer/cathode (herein, the symbol "/" means that the layers sandwiching the symbol "/" are adjacent to each other and laminated. The same applies hereinafter.) The organic EL device of the present embodiment may have two or more layers. The luminescent layer. In any one of the layer structures of the above-mentioned a) to i), if the layered body which is missing from the anode and the cathode is "structural unit A", the structure of the organic EL element having two light-emitting layers can be exemplified. For example, the layer structure shown in the following j). Further, the layer structures of the two (structural unit A) may be identical or different from each other. j) Anode / (structural unit A) / charge generating layer / (structural unit A) / cathode Here, the charge generating layer generates a layer of holes and electrons by applying an electric field. The charge generating layer may, for example, be a film made of vanadium oxide, indium tin oxide (Indium Tin Oxide: ΙΤ0), indium zinc oxide (Indium Zinc idexide: IZO), molybdenum oxide or the like. In addition, the structure of the organic EL element having three or more layers of the light-emitting layer of "structural unit A" and the charge-generating layer" is exemplified by the following k). k) Anode / (structural unit B) x / (structural unit A) / cathode ^ In addition, the symbol X" represents an integer of 2 or more, (structural unit Β) χ represents a layered body of 4 units 层 of the layer xlx In addition, the layer structure of the plural (structure 26 323651 201225729 unit B) may be the same or different. Further, an organic EL element in which a plurality of light-emitting layers are directly laminated without providing a charge generating layer can be constructed. <Bases> The base is suitably used in the process of manufacturing an organic EL element without chemical changes. Examples of the material of the base include glass, plastic, polymer film and enamel, and laminates thereof. <Anode> In the case of an organic EL element having a structure in which light emitted from the light-emitting layer is emitted to the outside through the anode, an electrode exhibiting light transmittance is used at the anode. For the light-transmissive electrode, a film made of a material such as a metal oxide, a metal sulfide, or a metal can be used, and a conductivity and a light transmittance are preferably used. Specifically, a film made of indium antimonide, zinc oxide, tin oxide, IT bismuth, steel oxide (Indium Zinc 〇χ-: ΙΖ〇), gold, Ming, silver, and copper is used. It is suitable to use a film made of ITQ, IZQ or tin oxide. Further, the anode may have a laminated structure in which two or more layers are laminated. Examples of the method for producing the anode include a vacuum steaming method, a sputtering method, an ion plating method, and a clock layer method. Further, as the anode, an organic transparent conductive film of polyaniline or a derivative thereof, polybenzazole or a living organism thereof may be used. <Cathode> The material of the pole is preferably a material having a small work function, an electron layer, and a conductivity of w 7 ^ Ϊ7Τ - ^. In addition, the structure of the light is taken out from the anode side. 4 In order to reflect the light emitted by the luminescent layer by the cathode, the material of the dynode is preferably a high reflectivity for visible light. 27 323651 201225729 material phase _ pole material For example, a metal or an interlayer compound can be mentioned. The foregoing metals may, for example, be metallurgical = and graphite transition metals and periodic metal metals of the periodic table, and the specific iron, magnesium, calcium, strontium, barium, aluminum, ruthenium, brocade, ruthenium, ruthenium, Grade, sugar stem sin, ji, upper and by gold, silver, noodles, copper, manganese, titanium, : 1 kind of group selected one or more gold nickel tungsten, and tin into a metal alloy 4' specific: , magnesium-indium alloy, town, alloy, indium-silver alloy:: dimeric ITJL Ϊ enumerates, for example, indium oxide, zinc oxide, tin oxide, polydielectric metal oxide; polyaniline or its derivatives, fine organisms, etc. Conductive goods. Further, the cathode may have a laminated structure of layer = above. In addition, the electronic injection layer can be used as a female. Examples of the method for producing the cathode include steaming and ion 4. The film thickness of the anode and the anode are suitably set as desired, and the ease of the film formation step, etc., for example, i〇nm to i^" preferably other (10) to 1 to m' more preferably 50 nm to 500 nm . <Cell injection layer> The hole injection material constituting the hole injection layer may, for example, be an oxide such as oxidized sulphur, oxidized ruthenium, yttrium oxide or aluminum oxide; an aniline compound; a starburst amine compound; ; phthalocyanine compound; amorphous carbon (amorph〇us carbon); polyaniline; and 28 323651

S 201225729 聚嗟吩衍生物等。電洞注入層之成膜方法可列舉例如由包含電洞注入材料之溶液而成膜。例如將包含電洞注入材料之溶液以預定之塗佈法而塗佈成膜，並固化該等藉此而形成電洞注入層。電洞注入層之膜厚係考慮要求之特性及步驟之簡易度等而適宜地設定，例如為lnm至1 // m，較佳為2nm至 500nm，更佳為 5nm 至 200nm。 <電洞輸送層〉構成電洞輸送層之電洞輸送材料可列舉例如聚乙烯基咔唾（polyvinylcarbazole)或其衍生物、聚矽燒或其衍生物、在側鏈或主鏈具有芳香族胺之聚矽氧烷衍生物、吡唑啉（pyrazoline)衍生物、芳基胺衍生物、芪（stilbene) 何生物、二苯基二胺衍生物、聚苯胺或其衍生物、聚噻吩或其打生物、聚芳基胺或其衍生物、聚如各或其衍生物、 ^對伸苯騎乙絲）或其射物、或是聚（2，卜伸嗟吩基伸乙稀基）或其衍生物等。 ”電洞輸層之财料“求之紐簡易度等而進行設定，例如為lnm至、々’ 50〇nm，更佳為5簡至2〇〇nm。 m’佳為2ηηι至 <發光層> 發光層通常主要包含發出螢發光層還可包含輔助該有機物之 ^先之有機物^S 201225729 Polybenzaldehyde derivatives, etc. The film formation method of the hole injection layer may be, for example, a film formed of a solution containing a hole injection material. For example, a solution containing a hole injecting material is applied as a film by a predetermined coating method, and cured to form a hole injecting layer. The film thickness of the hole injection layer is appropriately set in consideration of the required characteristics and the ease of the steps, etc., and is, for example, 1 nm to 1 // m, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm. <Cell Transport Layer> The hole transport material constituting the hole transport layer may, for example, be polyvinylcarbazole or a derivative thereof, polyfluorene or a derivative thereof, or aromatic in a side chain or a main chain. A polyoxane derivative of an amine, a pyrazoline derivative, an arylamine derivative, a stilbene, a diphenyldiamine derivative, a polyaniline or a derivative thereof, a polythiophene or the like a biological, polyarylamine or a derivative thereof, a poly- or a derivative thereof, or a benzoic acid, or a poly(2, benzophenanthene) or Derivatives, etc. The material of the hole transport layer is set to be simple, etc., for example, 1 nm to 々, 50 〇 nm, and more preferably 5 to 2 〇〇 nm. m' is preferably 2ηηι to < luminescent layer> The luminescent layer usually mainly comprises a luminescent layer which may further comprise an organic substance which assists the organic substance ^

了提高發光效钱改變發光波物。摻雜物係例如J 〇入。此外，構成發夫 323651 29 201225729 f之有機物係可為低分子化合物，也可為高分子化合物，稭由塗佈法而形成發光層時，較佳為包含高分子化合物。該尚f子化8合物之聚苯乙烯換算之數目平均分子量係例如為10至108程度。構成發光層之發光材料係可列舉例如以下之色素系材料、金屬錯合物系材料、高分子系材料、摻 (色素系材料）〜色素系材料係可列舉例如環戊丙曱胺（cy c 1叩咖am i 衍生物、四苯基了二:^衍生物化合物、三苯基胺衍生物、嗯二嗤（oxadiazoie)衍生物n 料（pyrazQlQquin〇iine) 衍生物、一笨乙烯基苯衍生物、二苯乙烯基伸芳基 (distyrylarylene)衍生物 '吡咯（Pyrr〇le)衍生物、噻吩環化合物、吡啶環化合物、紫環酮（perin〇ne)衍生物、茈 (perylene)衍生物、寡噻吩衍生物、噁二唑二聚物、吡唑啉二聚物（pyrazoline dimer)、喹吖酮（quinacrid〇ne)衍生物、香豆素（coumarin)衍生物等。 (金屬錯合物系材料）金屬錯合物系材料係可列舉例如稀土類金屬（例如Tb、 Eu、Dy)、Al、Zn、Be、Ir、Pt 等之中心金屬（centrai metal) 和嗯二峻、嚷二吐、苯基°比咬、笨基苯并tr米吐 (phenylbenzoimidazole)、喹啉構造等具有配位基之金屬錯合物。相關金屬錯合物可列舉例如銥錯合物、鉑錯合物等之昇有來自三重激發態之發光之金屬錯合物、鋁喹啉酚 (alumium-quinolinol)錯合物、苯并喹琳酚皱錯合物、苯 30 323651Improve the luminous efficiency to change the luminous wave. The dopant system is, for example, J intrusion. Further, the organic substance constituting the hair 323651 29 201225729 f may be a low molecular compound or a polymer compound, and when the straw is formed into a light-emitting layer by a coating method, it is preferred to contain a polymer compound. The polystyrene-equivalent number average molecular weight of the saponin 8 is, for example, about 10 to 108. Examples of the light-emitting material constituting the light-emitting layer include, for example, the following pigment-based materials, metal-based materials, polymer-based materials, and doped (pigment-based materials)-pigment-based materials, and examples thereof include cyclopentimide (cy c). 1 am am am 、 derivative, tetraphenyl bis: ^ derivative compound, triphenylamine derivative, oxadiazoie derivative n material (pyrazQlQquin〇iine) derivative, a stupid vinyl benzene derivative , distyryl arryrylarylene derivative Pyrrole derivative, thiophene ring compound, pyridine ring compound, perin〇ne derivative, perylene derivative, oligo Thiophene derivatives, oxadiazole dimers, pyrazoline dimers, quinacrid〇ne derivatives, coumarin derivatives, etc. (metal complex materials) The metal complex-based material may, for example, be a rare earth metal (for example, Tb, Eu, Dy), a central metal (centrai metal) such as Al, Zn, Be, Ir, Pt, or the like. Basal ratio biting, stupid benzotrim benzene (phenylbenzoimidaz) A metal complex having a ligand such as a quino structure or a quinoline structure. Examples of the metal complex include a metal complex which emits light from a triplet excited state, such as a ruthenium complex or a platinum complex. Aluminum quinolinol (alumium-quinolinol) complex, benzoquinolinol wrinkle complex, benzene 30 323651

S 201225729 并。惡°坐基鋅（benzooxazolyl zinc)錯合物、苯并嗔峻鋅 (benzothiazole zinc)錯合物、偶氮曱基辞（azomethyl zinc)錯合物、卟琳鋅（p〇rphyrin zinc)錯合物、啡淋銪 (phenanthroline europium)錯合物等。 (高分子系材料）高分子系材料係可列舉例如聚對伸苯基伸乙烯基衍生物、聚嘆吩衍生物、聚對伸苯基衍生物、聚矽烷衍生物、聚乙块衍生物、聚苐（P〇lyflu〇rene)衍生物、聚乙烯基咔唾衍生物、前述色素系材料及金屬錯合物系發光材料之高分子化者等。發光層之厚度通常大約為2nra至200nm。 <電子輸送層> 構成電子輸送層之電子輸送材料可使用公知者，可列舉例如噁二唑衍生物、蒽醌二曱烷（anthraqu inone dimethane)或其衍生物'苯酿^benzoquinone)或其衍生物、萘醌（naphthoquinone)或其衍生物、蒽醌或其衍生物、四氰基蒽酿i二曱烧或其衍生物、第酮（fluorenone)衍生物、二苯基二氰基乙烯或其衍生物、聯苯酿>(diphenoquinone) 衍生物、或者是8_羥基喹啉或其衍生物之金屬錯合物、聚喹淋或其衍生物、聚噎嚼琳（p〇lyqUin〇xaline)或其衍生物、聚苐或其衍生物等。電子輸送層之膜厚係考慮要求之特性及成膜步驟之簡易度等而適宜地設定，例如為lnm至Ι/zm，較佳為2nm 至500nm，更佳為5nm至200nm。 31 323651 201225729 <電子注入層:> 構成電子注入層之電子注入材料係依照發光層之類而適宜地選擇最適當之材料。電子注入材料可列ς例如驗金屬；驗土類金屬；包含驗金屬和驗土類金屬中之^種以上之合金，·驗金屬或驗土類金屬之氧化物、齒化物、石山酸鹽；以及該等物質之混合物等。前述驗金屬及其氧化物，南化物和碳酸鹽可列舉例如鋰、鈉、鉀、铷、鉋、、氧化鋰、' 氟化鋰、氧化鈉、氟化鈉、氧化鉀、氟化鉀、氧化铷、氟化物、氧化絶、i化鏠、碳酸鐘等。此外，前述驗土類金屬及其氧化物、鹵化物、碳酸鹽可列舉例如鎂、鈣、鋇、鋰、氧化鎮、氧化鎮、氧化約'氟化約、氧化鋇、氟化鋇、氧化錄、氟化錄、碳酸鎮等。電子注入層可具有層積2芦以上之層積構造’可列舉例如LiF/Ca等。電子注入層之膜厚較佳為lnm至i程度。各有機層之形成方法可列舉例如噴嘴印刷法、噴墨印刷法、凸版印刷法、凹版印刷法等塗佈法或真空蒸錢法等。此外在塗佈法中，藉由將包含成為各有機層之有機 EL材料之油墨塗佈成膜，並將其固化，而形成有機層。使用於塗佈法之油墨之溶媒可列舉例如三氯甲院、二氯甲烧、-氯乙烧等氣系溶媒、四氫七南等醚系溶媒、甲苯、一甲笨等芳香族烴系溶媒、丙酮、甲基乙基甲酮等酮系溶媒乙I乙自曰乙酉欠丁酿、乙酸乙赛璐蘇（dhyi ceii〇s〇ive acetate)等酯系溶媒和水等。 (實施例） 32 323651 201225729 首先準備形成由膜厚200nm之ΙΤ0薄膜所成第1電極之 TFT基板（參考第3Α圖）。在該TFT基板表面藉由旋轉塗佈器而塗佈感光性樹脂溶液（Toray股份公司製、ph〇t〇neece SL— 1904) ’並在加熱板上以ii〇°c加熱120秒鐘，之後進行預烘烤。藉由該預烘烤而蒸發感光性樹脂溶液之溶媒，並形成感光性樹脂薄膜（參考第3B圖）。接著’使用接近式（proximity)曝光機，透過預定之遮罩而曝光感光性樹脂薄膜（參考第3C圖）。其曝光量係 100mJ/cm2。接著，以顯影液（T0KUYAMA股份公司製、SD — l(TMAH2.38wt%)溶液）而顯影90秒鐘，形成順錐形狀之分隔壁（參考第4A圖）。在230°C加熱該分隔壁20分鐘並硬化樹脂《藉由該後烘烤而形成膜厚h 之分隔壁。將鹽酸和氯化鐵之混合溶液保持在4trc，並在該混合溶液浸潰形成分隔壁之基板，之後蝕刻膜厚為200nm之第 1電極（IT0)之表面9〇nm，藉此而在位於分隔壁之前端部之下側之第1電極（IT0)形成底切（參考第4B圖）。接著，在真空室導入基板，進行電漿表面處理，在分隔壁之表面賦予疏液性。接著，使用噴墨裝置（ULVAc公司製、Utrexl42P)，在分隔壁所包圍之像素内塗佈油墨。在油墨使用固形份濃度 1. 5%之聚（伸乙基二氧噻吩）（pED〇T)/聚苯乙烯磺酸（pss) 水分散液（拜耳公司製、AI4〇83)。油墨係彈開於被賦予疏液性且和該油墨之接觸角大之分隔壁之表面，並填充於分隔壁所包圍之像素内，同時以吸入至形成分隔壁之端部下 33 323651 201225729 之底切之部位（也就是分隔壁之端部和第1電極之間之間隙）之方式充填，並均勻地擴散至分隔壁所包圍之像素内之各角落（參考第4C圖）。在200°C燒成該基板，並形成膜厚 50nm之均勻膜厚之電洞注入層（參考第5A圖）。接著形成3種類之發光層。首先對於放射紅色光之高分子發光材料，以使濃度為〇.8wt%之方式混合於有機溶媒並調裝為、.工油墨。冋铱地，对;^風初·琢巴尤 < 肉/刀-1赞光材料，以使濃度為0· 8wt%之方式混合於有機溶媒並調製為綠油墨。此外，對於放射藍色光之高分子發光材料，以使濃度為0.8wt%之方式混合於有機溶媒並調製為藍油墨。分別使用喷墨裝置（ULVAC公司製、Utrexl42P)將該等紅、綠、藍油墨塗佈於預定之像素内（參考第犯圖）。油墨係箱由和該油墨之接觸角大之分隔壁而彈開，因此防止油墨& 著該頂面而溢流至相鄰區域，並收納於像素内。另一方收納於像素内之油墨係以吸人至形成分隔壁之端部下 :之部位之方式充填，並均句地擴散至分隔指素内之各角落。藉由在l3(rr.占兮^ 国之爲之發光層(參考基板㈣成均句模与成膜厚20::二發::上:由真空蒸鍍法而依序地形電極（陰極）。接著將層並形成第ι 成有機£1元件之基板和密封用以基板點合並密料製作麵如=封用破璃凡件係在顯示區域内均乍之有機肛地發光。 Μ地發光，_在各像素内也均勾 323651 34 201225729 【圖式簡單說明】第1圖係擴大而示意地表示本發明一實施形態之顯示裝置1之一部份的圖。第2圖係擴大而示意地表示本發明一實施形態之顯示裝置1之一部份的俯視圖。第3A圖係用以說明本發明一實施形態之顯示裝置之製造方法的圖。第3B圖係用以說明本發明一實施形態之顯示製造方法的圖。第3C圖係用以說明本發明一實施形態之顯製造方法的圖。第4A圖係用以說明本發明一實施形態之顯示裝置之製造方法的圖。第4B圖係用以說明本發明一實施形態之顯示裝製造方法的圖。第4C圖係用以說明本發明一實施形態之顯示裝置之製造方法的圖。 & 第5A ®係用以說明本發明一實施形態之製造方法的圖。置之第5B圖係用以說明本發明一實施形態之顯示裝置之製造方法的圖。第5C圖係用以說明本發明一實施形態之顯製造方法的圖。 " 第6圖係擴大而示意地表示本發明一實施形態之顯示 323651 35 201225729 裝置1之一部份的俯視圖。第7圖係擴大而示意地表示本發明一實施形態之顯示裝置1之一部份的圖。第8A圖係用以說明顯示裝置之製造方法的圖。第8B圖係用以說明顯示裝置之製造方法的圖。第8C圖係用以說明顯示裝置之製造方法的圖。第9圖係用以說明先前技術之顯示裝置之製造方法的【主要元件符號說明】顯示裝置分隔壁有機EL元件第1電極 2 基台 3a 分隔壁之端部 5 凹部 a 分隔壁端部所覆蓋部位以外之殘餘部位 bb 殘餘部位之周邊部 7 第1有機層（電洞注入層） 8 分隔壁形成用臈9 ^ 9 10 第2電極乐z有機層（發光層） 11 12 15 17 19 22 1電極之界面 13 分隔壁 16 第1電極 18 有機層 21 光罩 31 間隙分隔壁之端部和第基台凹部油墨間隔部油墨 323651 36S 201225729 and. The benzooxazolyl zinc complex, the benzothiazole zinc complex, the azomethyl zinc complex, and the p〇rphyrin zinc Compound, phenanthroline europium complex, and the like. (Polymer-based material) The polymer-based material may, for example, be a polyparaphenylene vinyl derivative, a polyphene derivative, a polyparaphenylene derivative, a polydecane derivative, a polyphenylene derivative, or a poly A fluorene (P〇lyflu〇rene) derivative, a polyvinyl sulfonium derivative, a polymerizer of the above-mentioned pigment-based material and a metal-based luminescent material, and the like. The thickness of the luminescent layer is typically from about 2 nra to about 200 nm. <Electron transport layer> The electron transport material constituting the electron transport layer can be a known one, and examples thereof include an oxadiazole derivative, anthraquinone dimethane or a derivative thereof, benzoquinone or a derivative thereof, naphthoquinone or a derivative thereof, an anthracene or a derivative thereof, a tetracyanohydrin, a diterpenoid or a derivative thereof, a fluorenone derivative, diphenyldicyanoethylene Or a derivative thereof, a diphenoquinone derivative, or a metal complex of 8-hydroxyquinoline or a derivative thereof, polyquinol or a derivative thereof, or polypyrrole (p〇lyqUin〇) Xaline) or a derivative thereof, polyfluorene or a derivative thereof. The film thickness of the electron transporting layer is suitably set in consideration of the required characteristics, the ease of the film forming step, and the like, and is, for example, 1 nm to Ι/zm, preferably 2 nm to 500 nm, and more preferably 5 nm to 200 nm. 31 323651 201225729 <Electron injection layer:> The electron injecting material constituting the electron injecting layer is appropriately selected from the most suitable material in accordance with the light emitting layer or the like. The electron injecting material may be listed, for example, in the inspection of metals; the soil-repairing metal; the alloy containing more than one of the metal and the soil of the soil, the metal oxide or the metal oxide of the soil or the metal salt; And mixtures of such substances and the like. The foregoing metal and its oxides, such as lithium, sodium, potassium, rubidium, planer, lithium oxide, 'lithium fluoride, sodium oxide, sodium fluoride, potassium oxide, potassium fluoride, oxidation, etc.铷, fluoride, oxidized, i 鏠, carbonic acid clock, etc. In addition, the aforementioned soil-based metals and their oxides, halides, and carbonates may, for example, be magnesium, calcium, barium, lithium, oxidized, oxidized, oxidized, 'fluorinated, cerium oxide, cerium fluoride, and oxidized. , fluoride recording, carbonic acid town, etc. The electron injecting layer may have a laminated structure 2 or more. The laminated structure may be, for example, LiF/Ca or the like. The film thickness of the electron injecting layer is preferably from 1 nm to i. Examples of the method for forming each organic layer include a coating method such as a nozzle printing method, an ink jet printing method, a relief printing method, and a gravure printing method, or a vacuum evaporation method. Further, in the coating method, an organic layer is formed by coating an ink containing an organic EL material which becomes each organic layer into a film and curing it. Examples of the solvent used in the coating method include a gas-based solvent such as trichloromethane, methylene chloride or chloroethane, an ether solvent such as tetrahydroseptan, an aromatic hydrocarbon such as toluene or monomethylbenzene. The ketone-based solvent such as a solvent, acetone or methyl ethyl ketone is an ester-based solvent such as butyl acetonitrile, dhyi ceii 〇〇 acetate acetate, and water. (Example) 32 323651 201225729 First, a TFT substrate having a first electrode formed of a film of a film thickness of 200 nm was formed (refer to Fig. 3). A photosensitive resin solution (manufactured by Toray Co., Ltd., ph〇t〇neece SL-1904) was applied onto the surface of the TFT substrate by a spin coater and heated on a hot plate at ii 〇 °c for 120 seconds. Pre-bake. The solvent of the photosensitive resin solution is evaporated by the prebaking, and a photosensitive resin film is formed (refer to FIG. 3B). Next, the photosensitive resin film is exposed through a predetermined mask using a proximity exposure machine (refer to Fig. 3C). The exposure amount is 100 mJ/cm2. Subsequently, development was carried out for 90 seconds using a developer (manufactured by TOKUYAMA Co., Ltd., SD-1 (TMAH2.38 wt%)) to form a partition wall having a tapered shape (refer to Fig. 4A). The partition wall was heated at 230 ° C for 20 minutes and the resin "partition wall having a film thickness h formed by the post-baking was hardened. The mixed solution of hydrochloric acid and ferric chloride was kept at 4 trc, and the substrate on which the partition wall was formed was immersed in the mixed solution, and then the surface of the first electrode (IT0) having a film thickness of 200 nm was etched by 9 〇 nm, thereby being located at The first electrode (IT0) on the lower side of the front end portion of the partition wall forms an undercut (refer to FIG. 4B). Next, the substrate was introduced into a vacuum chamber, and plasma surface treatment was performed to impart liquid repellency to the surface of the partition wall. Next, ink was applied to the pixels surrounded by the partition walls using an ink jet apparatus (Utrexl 42P, manufactured by ULVAc Co., Ltd.). In the ink, a solid dispersion of 1.5% poly(extended ethylenedioxythiophene) (pED〇T)/polystyrenesulfonic acid (pss) aqueous dispersion (manufactured by Bayer, AI4〇83) was used. The ink is bounced off the surface of the partition wall which is provided with lyophobicity and has a large contact angle with the ink, and is filled in the pixel surrounded by the partition wall while being sucked to the end portion forming the partition wall 33 323651 201225729 The cut portion (that is, the gap between the end of the partition wall and the first electrode) is filled and uniformly diffused to each corner of the pixel surrounded by the partition wall (refer to FIG. 4C). The substrate was fired at 200 ° C to form a hole injection layer having a uniform film thickness of 50 nm (refer to Fig. 5A). Then, three types of light-emitting layers are formed. First, a high-molecular luminescent material that emits red light is mixed with an organic solvent in such a manner that the concentration is 〇8 wt%, and it is adjusted to be an industrial ink.冋铱地,对;^风初·琢巴尤 < meat/knife-1 zanguang material, mixed with organic solvent in a concentration of 0. 8wt% and prepared into a green ink. Further, the polymer light-emitting material emitting blue light was mixed with an organic solvent so as to have a concentration of 0.8% by weight to prepare a blue ink. These red, green, and blue inks were applied to predetermined pixels using an inkjet device (Utrexl 42P, manufactured by ULVAC Co., Ltd.), respectively (refer to the first drawing). The ink box is bounced off by the partition wall having a large contact angle with the ink, so that the ink & the top surface is prevented from overflowing to the adjacent area and being housed in the pixel. The other ink contained in the pixel is filled in such a manner as to attract a portion which is formed under the end portion of the partition wall, and is uniformly spread to each corner of the partitioning finger. The electrode (cathode) is sequentially ordered by vacuum evaporation at a light-emitting layer of l3 (r. 兮兮 ( ( 参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考参考Then, the layer is formed into a substrate of the first organic component and sealed for the substrate to be combined with the dense material to make a surface, such as a sealed glass, which is illuminated by the organic anal in the display area. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A plan view showing a part of a display device 1 according to an embodiment of the present invention. Fig. 3A is a view for explaining a method of manufacturing a display device according to an embodiment of the present invention. Fig. 3B is a view for explaining an embodiment of the present invention. Fig. 3A is a view for explaining a display manufacturing method according to an embodiment of the present invention. Fig. 4A is a view for explaining a method of manufacturing a display device according to an embodiment of the present invention. Used to illustrate an embodiment of the present invention Fig. 4C is a view for explaining a method of manufacturing a display device according to an embodiment of the present invention. & 5A® is a view for explaining a manufacturing method according to an embodiment of the present invention. Fig. 5B is a view for explaining a method of manufacturing a display device according to an embodiment of the present invention. Fig. 5C is a view for explaining a display manufacturing method according to an embodiment of the present invention. " Fig. 6 is an enlarged and schematic view A plan view showing a part of the display device 323651 35 201225729 according to an embodiment of the present invention. Fig. 7 is a view schematically showing a part of the display device 1 according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 8B is a view for explaining a method of manufacturing a display device. Fig. 8C is a view for explaining a method of manufacturing a display device. Fig. 9 is a view for explaining a prior art. [Description of main components and symbols] The display device partition wall organic EL element first electrode 2 base 3a end portion of the partition wall 5 recessed portion a portion covered by the partition wall end portion Residual part other than the remaining part bb Residual part 7 First organic layer (hole injection layer) 8 Separation wall formation 臈9 ^ 9 10 Second electrode Le z organic layer (light-emitting layer) 11 12 15 17 19 22 1 electrode Interface 13 partition wall 16 first electrode 18 organic layer 21 photomask 31 end of gap partition wall and abutment recess ink spacer ink 323651 36

Claims

201225729 七、申請專利範圍： 1· 一種顯示裝置，係包含基台、在該基台上而劃分預先設定之分區之分隔壁、以及分別設置於藉由該分隔壁而劃分之分區之複數之有機電致發光元件的顯示裝置，其中’各有機電致發光元件係包含至少一層之第1電極、至少一層之有機層和至少一層之第2電極，並由前述之基台侧開始起以該順序層積；前述分隔壁其端部接合在前述之第1電極上；前述第1電極係於前述分隔壁之端部所覆蓋之部位以外之殘餘部位以及該殘餘部位之周邊部具有凹陷’由前述基台厚度方向之一邊來看，此凹陷係於較前述分隔壁端部與前述第1電極之界面更接近於基台側。 2. 如申請專利範圍第1項所述之顯示裝置，其中，前述凹陷深度係20nra至300nm。 3. —種顯示裝置之製造方法，該顯示裝置係包含基台、在該基台上而劃分預先設定之分區之分隔壁、以及分別設置於藉由該分隔壁而劃分之分區之複數之有機電致發光元件；各有機電致發光元件係包含至少一層之第1 電極、至少一層之有機層和至少一層之第2電極，並由基台側起以該順序層積而成；該製造方法包含：準備至少有一層之第1電極設在上面之基台之步驟；將分隔壁形成圖案並使該分隔壁之端部接合在前述第1電極上之步驟； 1 323651 201225729 第i電極尹，於前述分隔壁之部位以外之之~部所覆蓋之殘餘。P位和該殘餘部位形成凹陷之步驟；艾周邊部之表面爾’.^述之第1電極上形成至少-層之有機層之步驟在前述之有機層上形成至少一層之第2電極之步如申4專利範圍第3 中，在幵彡#此.+、員斤述之顯示裝置之製造方法，其甘心成别述凹陷之步乃 <宏长述之凹陷。 "’藉由濕式钱刻而形成前 323651 2201225729 VII. Patent application scope: 1. A display device comprising a base, a partition wall dividing a predetermined partition on the base, and a plurality of partitions respectively disposed by the partition wall A display device for an electroluminescent device, wherein each of the organic electroluminescent elements comprises at least one of a first electrode, at least one organic layer, and at least one second electrode, and is in the order from the abutment side. a layered portion; the end portion of the partition wall is joined to the first electrode; and the first electrode is recessed by a portion other than a portion covered by an end portion of the partition wall and a peripheral portion of the remaining portion. When viewed from one side of the thickness direction of the base, the recess is closer to the base side than the interface between the end of the partition wall and the first electrode. 2. The display device according to claim 1, wherein the recess depth is 20 nra to 300 nm. 3. A method of manufacturing a display device, comprising: a base, a partition wall dividing a predetermined partition on the base, and a plurality of partitions respectively disposed on the partition by the partition wall An electroluminescent device; each of the organic electroluminescent elements comprising at least one of a first electrode, at least one organic layer, and at least one second electrode, and is laminated in this order from the base side; The method includes: preparing a step of providing at least one layer of the first electrode on the upper surface; forming a pattern of the partition wall and bonding the end of the partition wall to the first electrode; 1 323651 201225729 The residue covered by the portion other than the portion of the partition wall. a step of forming a depression in the P-position and the residual portion; a step of forming an at least one layer of the organic layer on the first electrode of the surface of the periphery of the Ai; In the third paragraph of the patent scope of the claim 4, in the manufacturing method of the display device of the 幵彡#,., 员, the step of the depression is the depression of the macro. "’Formed by wet money engraving 323651 2