TW201214611A - Wafer inspecting device - Google Patents

Wafer inspecting device Download PDF

Info

Publication number
TW201214611A
TW201214611A TW100132966A TW100132966A TW201214611A TW 201214611 A TW201214611 A TW 201214611A TW 100132966 A TW100132966 A TW 100132966A TW 100132966 A TW100132966 A TW 100132966A TW 201214611 A TW201214611 A TW 201214611A
Authority
TW
Taiwan
Prior art keywords
wafer
transport
adsorption
inspection apparatus
transport path
Prior art date
Application number
TW100132966A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroaki Tsukimoto
Hiroshi Sato
Hayato Ikeda
Daisuke Fujita
Original Assignee
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tazmo Co Ltd filed Critical Tazmo Co Ltd
Publication of TW201214611A publication Critical patent/TW201214611A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW100132966A 2010-09-21 2011-09-14 Wafer inspecting device TW201214611A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010210425 2010-09-21

Publications (1)

Publication Number Publication Date
TW201214611A true TW201214611A (en) 2012-04-01

Family

ID=45873742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100132966A TW201214611A (en) 2010-09-21 2011-09-14 Wafer inspecting device

Country Status (3)

Country Link
JP (1) JPWO2012039252A1 (ja)
TW (1) TW201214611A (ja)
WO (1) WO2012039252A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104396002A (zh) * 2012-05-10 2015-03-04 瓦里安半导体设备公司 多单元旋转端末效应器机制

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10403533B2 (en) * 2015-05-04 2019-09-03 Applied Materials, Inc. Substrate rotary loader
CN105374723B (zh) * 2015-10-23 2017-10-27 温州城电智能科技有限公司 一种蜂鸣片自动化出料装置
CN113611653B (zh) * 2021-08-13 2023-09-05 苏州隐冠半导体技术有限公司 一种多气路吸附装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012652A (ja) * 1998-06-24 2000-01-14 Sony Corp 半導体ウェハ搬送装置
JP2001315951A (ja) * 2000-05-09 2001-11-13 Fukuyama Tekkosho:Kk 移送部材の回転装置
JP4719031B2 (ja) * 2006-02-28 2011-07-06 三菱重工業株式会社 太陽電池パネルの検査装置、膜研磨検査方法、及び太陽電池パネルの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104396002A (zh) * 2012-05-10 2015-03-04 瓦里安半导体设备公司 多单元旋转端末效应器机制
CN104396002B (zh) * 2012-05-10 2016-12-14 瓦里安半导体设备公司 工件操作***及应用于其中的端末效应器

Also Published As

Publication number Publication date
WO2012039252A1 (ja) 2012-03-29
JPWO2012039252A1 (ja) 2014-02-03

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