TW201213622A - Device and method for electroplating thin board - Google Patents

Device and method for electroplating thin board Download PDF

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Publication number
TW201213622A
TW201213622A TW99132645A TW99132645A TW201213622A TW 201213622 A TW201213622 A TW 201213622A TW 99132645 A TW99132645 A TW 99132645A TW 99132645 A TW99132645 A TW 99132645A TW 201213622 A TW201213622 A TW 201213622A
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Taiwan
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flow
electroplating
anode
surge
tank
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TW99132645A
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Chinese (zh)
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TWI415976B (en
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Pin-Chun Huang
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Pin-Chun Huang
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Abstract

Disclosed is a device and method for electroplating a thin board, which comprises providing an electroplating tank having an inner width of 1 to 2 cm and individually installing a plurality of surge flow pipes and a plurality of anode devices at two opposite sides therein. Every anode device is located between two surge flow pipes to provide passage of electric current into electroplating solution. In addition, the electroplating solution from the surge flow pipes is provided as isolation media, thereby preventing the board from contacting and abrasion with the inner wall of the electroplating tank, which may possibly cause the problems of scratching the boards, breaking the lines and even locking the boards. A tilt angle is formed between the axial direction and the horizon of the surge flow pipes, such that the upper end of the surge flow pipes is closer to the delivered board than the lower end thereof; a plurality of reflow holes are installed on the bottom of the electroplating tank. By this way, while the board whose upper end is clamped by a transverse conveyor being delivered with a vertical state in the electroplating tank, the action force of spraying the electroplating solutions from the surge flow pipes at two sides to the board can be distributed to the bottom. Moreover, by cooperating with the sucking forces caused by the release of electroplating solutions from the reflow holes, the thin board in an immersion tank can go forwards with a steadily vertical way. The surge flow pipes at two sides of the electroplating tank spray the electroplating solutions in asymmetric direction, thereby making the electroplating solutions pass through the through holes or flow into the blind holes with high exchange rate.

Description

201213622 v 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種對超薄板進行電鍍處理過程中,無接觸到板 面的方法與裝置。 【先前技術】 印刷電路板或其他佈設有電路的板件製程必須經過電鍵處理 籲程序。早期的板件由於厚度較大’因此在電鍍處理製程中均採用 火平輸送方式進行輸送。隨著技術的不斷演進以及電子產品薄型 1匕與輕巧化的要求,若干印刷電路板或細板件的厚度已愈來愈 :輪25_〜75_),以致於板件已成為超薄的樹生板,因此, 右採用傳_水平輸送方式來輸送軟性板,板材將會因為自身的 柔性與重力伽導致板件變形,料在輪送造成卡板,板件 會因此損毁,甚至造成停機,產品不良率相當高。 【發明内容】 本發明的目的,在於解決超薄軟性板採用水平輸送方式進行 電錢處理製程時,容易在輪送過程造成卡板,板件損毁,甚至造 成停機,產品不良率居高不下的問題。 、本發明的特徵,係_横移輸送機將薄板夹持與輸送,使薄 板以登立狀態維持在盛裝電錢液的電鐘槽内水平方向輸送板 在包鍍匕内水平移動的同時,提供渴流的電鍵液在電簡的内側 201213622 v 表面流動’以及在電鍍槽内兩側設置複數陽極裝置,電錄液通過 陽極裝置後含有帶正電的金屬離子以附著於電性連接陰極之板件 上形成錢層,同時利㈣流的電鑛液做為薄板與陽極裝置間的隔 離”貝,避免板件和陽極裝置接觸而可能造成擦傷或刮斷線路, 甚至造成卡板的問題。 本發明的另—_,係在電鋪_姉_對板件提供由 上而下漸進式作用力的魏液,以及在電鋪_底部產生往下 籲的吸力’使上方被夾持於橫移輸送機的薄板件在電錢槽内得以維 持穩定的豎立狀態輸送行進。 +本發明的再一特徵,係在電鍍槽兩側提供往不對稱方向分別 噴冲的禮液,使麵液能以高交換率通過板件的通孔或進入盲 孔。 本發明的又—特徵,係提鋪組化的雜裝置與陽極裳置可 以快速地組裝於電鍍槽兩側的設計。 • 本發明的技術手段,係提供-内部寬度僅為1〜2cm的電鑛 槽’ f鍍勒的轉齡丨分舰置複㈣流裝置鑛極裝置,渴 流裝置具料辭,誠管_向與水平面之_斜-夾角,使 湧⑽ί的上鈿比下端接近被輸送而來的板件;電錢槽每一側的一 陽極裝置設於兩雜裝置之間。板件以豐立狀態在電鍍槽内朝水 平方向被輸送,通過陽極裝置流出的電鍍液除了提供帶正帶的金 屬離子以附著於電性連接陰極的板件表面形成鍍層外,渴流的電 鍍液還提供做為板件與陽極裝置之間的隔離介質;此外,板件被 201213622 ' 輸送通過湧流裝置與陽極裝置時,板件兩側的不同位置由上往下 • 逐漸承受湧流電鍍液,藉此分散湧流電鍍液對板件的作用力,避 免板件受到過度集中的作用力而變形或晃動,再配合設於電鍍槽 底面之複數回流孔排出電鍍液所產生的往下吸力,得以維持超薄 板件平穩的輸送。 做為一種的選擇,本發明傾斜設置的湧流管,其軸向與水平 面之間的最佳夾角為70。〜80。。 • 另一較佳的選擇,本發明從渴流裝置渴流而出的液體流速為 〇·3〜lm/sec 〇 本發明之陽極裝置包含有—陽極網,以及—具有複數傾斜槽 孔的阻隔板,該陽極網設於該阻極板的—面,阻隔板兩侧可和= 渴流裝置組合’藉以使陽極裝置位於兩消流裝置之間;所述槽孔 的傾斜方向’係高的—端迎向職板件輸送而來的方向,藉以降 低板件輸送過程巾,板件角端卡人槽孔而造成卡板。 釀 u由前述本發明的方法與裝置,對於薄板以暨立狀態在電鍍 槽内水平輸送時,利用渴流電條在電鑛槽的内側表面流動做為 薄板與陽極健之間的隔離介f,可以避免薄板和陽極裝置接’ 觸以及利用傾斜-角度邊流而出的電鍍液,得以避免超薄板件 兩側受到過度集中_流電鍍液作用力,從而避免板件在電· 内的輸达過程魏或晃動,防止超馳件因撓曲與陽極裝置之阻 隔板干涉造成卡板,得以大幅提昇產品良率。 201213622 w 【實施方式】 以下配合圖式及元件魏對本發明的實施方式做更詳細的說 明,俾使熟習該項技藝者在研讀本說明書後能據以實施。 第一圖至第四圖係顯示本發明電鍍薄板之裝置的示意圖。其 包含有-電鑛槽1 ’電鏡槽i相對兩側壁之間構成用來盛裝電鑛液 的沉浸區10,沉浸區10之間的最佳寬度”圍為卜2cm,電鍍 才曰1的上U包含昇降取板機的橫移輸送機4,以及可沿著橫移 •輸送機4移動的夾持器4卜續器41 _來夾㈣形板件再 猎由橫移輸送機4輸送板件5在沉浸區1〇内水平移動;板件5在 沉浸區10的始端與末端時,則藉由昇降取板機輸送分別將板件浸 入或取出沉浸區。 電鐘槽1内的相對兩侧分別傾斜地設置複㈣流裝置2知 極裝置3 ;其設置方式,係在電㈣丨_對兩_面分別設置 數傾斜-角度的第-滑槽聯第五A圖所示)。雜裝置2在 發明的實施例是-_流管2G,其_邊設有沿著雜管之轴向 成至少-排的複_流孔21;湧流管2G的後端相對兩侧設有對 的第-滑執22,渴流管20的前端相對兩側設有對稱的第二滑車 23 ’將第-滑執22滑入第一滑槽u(參第五B圖所示),即可將 流管20 --地組合於電鍍槽内之壁面;㈣流管卻完成植〜 Z簡後,相鄰_流管的第:滑㈣呈對稱,藉由第二滑轨 =陽繼购五G嶋)。_丨的底面設有複數 <、長度方向分佈_流孔12, _U2崎路連接至過據 201213622 •.備(圖中未顯示)’再由泵浦將過遽後的電鐘液輸送至電職循環 使用。 參六A圖至第六請所示,本發明之陽極裝置3,包含有一設 在欽框33上的氧化銀陽極網32(參第六㈣)、一覆設於陽極網又 32的PP布34(參第六b圖)、以及一用來和陽極網犯組合的阻隔 板31(參第六C圖與第六D圖)’阻隔板&設有複數傾斜一角度的 槽孔312以及姐缺31的姆兩做有第二雜犯,續槽 •孔312的傾斜方式,係使槽孔高的一端迎向板件輸送而來的称 設置了 PP布34的陽極網32組合於阻隔板31後方後,再將阻隔 板31兩側的第二滑槽311卿流管兩側的第二滑執23滑動配 合,使得整贿極裝置3設於_流裝置2之間;藉此結構設計, 無論是要進行_裝置錢極裝置的祕歧換更新,均十分方 便。此外’本發鴨極裝置3組合於電鍍槽兩側後,在沉浸區中 行進的板件’其板件表面與位於極裝置3最外側之陽極網犯之 • 間的最佳距離為6〜15mm。 本發明係㈣流管20經由管路連接至栗浦(圖中未顯示),泵 浦將電職經由管路輸送至驗㈣,進而_流孔2U勇流而 出;電舰從雜孔21 _而㈣最佳流速範圍為〇 3〜201213622 v VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method and apparatus for non-contact to a board surface during electroplating of an ultra-thin board. [Prior Art] A printed circuit board or other board-provided board process must be subjected to a key processing procedure. In the early stages, the plates were conveyed by means of a flat conveying method because of the large thickness. With the continuous evolution of technology and the thinness and lightness of electronic products, the thickness of several printed circuit boards or thin-plate parts has become more and more: wheels 25_~75_), so that the board has become an ultra-thin tree board. Therefore, the right side uses the transmission method to convey the flexible board. The board will deform the board due to its own flexibility and gravity. The board will cause the board to be damaged during the rotation, and the board will be damaged or even cause downtime. The rate is quite high. SUMMARY OF THE INVENTION The object of the present invention is to solve the problem that when an ultra-thin flexible board adopts a horizontal conveying method to perform an electric money processing process, it is easy to cause a card board in the wheeling process, the board is damaged, and even cause downtime, and the product defect rate is high. problem. The feature of the present invention is that the traverse conveyor clamps and conveys the thin plate, so that the thin plate is maintained in the state of being held in the horizontal direction of the electric bell jar containing the electric money liquid while horizontally moving in the coating rhodium plate. The thirsty electric button fluid flows on the inner side of the electric current 201213622 v surface and a plurality of anode devices are arranged on both sides of the electroplating tank. The electro-acoustic liquid passes through the anode device and contains positively charged metal ions to adhere to the plate of the electrical connection cathode. The money layer is formed on the piece, and the electric ore liquid of the flow of the (four) flow is used as the isolation between the thin plate and the anode device, and the contact between the plate and the anode device may be avoided, which may cause scratches or scraping of the circuit, and even cause problems of the card. Another method of the present invention is to provide the Wei liquid which has a progressive force from top to bottom on the electric plate, and the suction force which generates the downward movement at the bottom of the electric shop. The thin plate member of the transfer conveyor is maintained in a stable erect state in the electric money slot. + Another feature of the present invention is that a ritual liquid which is separately sprayed in an asymmetric direction is provided on both sides of the plating tank, so that the surface liquid can be High exchange The rate passes through the through hole of the plate member or enters the blind hole. The feature of the present invention is that the device for assembling the assembled device and the anode skirt can be quickly assembled on both sides of the plating tank. The system provides - an electric ore tank with an internal width of only 1~2cm. The f-plated squad is divided into four (four) flow device ore device, and the thirsty flow device has a material, and the pipe is _ oblique to the horizontal plane. The angle is such that the top of the surge (10) ί is closer to the plate to be conveyed than the lower end; an anode device on each side of the money slot is disposed between the two miscellaneous devices. The plate is horizontally oriented in the plating tank. The electroplating solution that is transported and discharged through the anode device provides a coating layer on the surface of the plate that is electrically connected to the cathode, in addition to providing a metal ion with a positive band, and the electroplating solution is provided between the plate member and the anode device. Isolation medium; in addition, when the plate is transported through the surge device and the anode device by 201213622', the different positions on both sides of the plate are from top to bottom. • Gradually withstand the inrush current plating solution, thereby dispersing the force of the inrush current plating solution on the plate. Avoid the board being subjected to The concentrated force is deformed or shaken, and the downward suction force generated by the plating solution is discharged by the plurality of return holes provided on the bottom surface of the plating tank, so as to maintain the smooth transportation of the ultra-thin plate. As an option, the present invention is inclined. The optimal angle between the axial direction and the horizontal plane of the surge tube is set to 70 to 80. • Another preferred option, the flow rate of the liquid from the thirsty flow device of the present invention is 〇·3~lm / sec The anode device of the present invention comprises an anode mesh, and a barrier having a plurality of inclined slots, the anode mesh being disposed on the surface of the barrier plate, and the two sides of the barrier plate can be combined with the thirst device. Therefore, the anode device is located between the two flow-discharging devices; the inclined direction of the slot is 'high'-end to the direction of the transport of the plate member, thereby reducing the plate conveying process towel, the plate corner end card holder The slot is caused by the slot. The method and the device of the present invention are used as the thin plate and the anode on the inner side surface of the electric ore tank when the thin plate is horizontally conveyed in the plating tank in the state of aging. Isolation between health f, can avoid the contact between the thin plate and the anode device and the electroplating solution flowing out by the oblique-angle side, so as to avoid excessive concentration of the electroplating liquid on both sides of the ultra-thin plate, so as to avoid the plate in the electricity The process of transmission is Wei or swaying, which prevents the over-capacity from causing the card due to the interference of the deflection and the barrier of the anode device, which can greatly improve the product yield. 201213622 w [Embodiment] The embodiments of the present invention will be described in more detail below with reference to the drawings and elements, and can be implemented by those skilled in the art after studying this specification. The first to fourth figures are schematic views showing the apparatus for electroplating a sheet of the present invention. The electro-magnetic tank 1 includes an immersion zone 10 between the two side walls for holding the electric ore liquid, and the optimal width between the immersion zones 10 is 2 cm, and the plating is on the upper side. U includes a traverse conveyor 4 of the lifting and lowering machine, and a holder 4 that can be moved along the traverse conveyor 4 _ _ clip (four) shaped plate and then hunted by the traverse conveyor 4 The piece 5 is horizontally moved in the immersion area 1 ;; when the plate member 5 is at the beginning and the end of the immersion area 10, the plate member is immersed or taken out of the immersion area by the lifting and lowering machine. The opposite two in the electric bell slot 1 The side is disposed obliquely to the complex (four) flow device 2 and the terminal device 3; the arrangement manner is set in the electric (4) 丨 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 2 In the embodiment of the invention, there is a -_flow tube 2G, the _ side of which is provided with at least a row of complex _ flow holes 21 along the axial direction of the miscellaneous tube; the rear end of the surge tube 2G is provided with opposite sides - Slipper 22, the front end of the thirsty flow tube 20 is provided with a symmetrical second pulley 23 on the opposite sides of the thirst flow tube 20. The first sliding gate 22 is slid into the first sliding slot u (as shown in Fig. 5B), and the flow can be tube 20 -- ground combined in the wall of the plating tank; (4) flow tube but completed planting ~ Z simple, adjacent _ flow tube of the: slip (four) is symmetrical, with the second slide = yang purchase five G 嶋) The bottom surface of the _ 设有 is provided with a plurality of <, the length direction distribution _ flow hole 12, _U2 is connected to the passage according to 201213622 •. As shown in the sixth to sixth figures, the anode device 3 of the present invention comprises a silver oxide anode mesh 32 (refer to the sixth (four)) disposed on the frame 33, and is coated on the anode. The PP cloth 34 of the net 32 (refer to the sixth b diagram), and the baffle plate 31 (refer to the sixth C and sixth D drawings) for combining with the anode mesh are provided with a plurality of tilting plates. The angled slot 312 and the sister's lack of 31 have a second miscellaneous, and the slanting manner of the slot/hole 312 is such that the one end of the slot is fed toward the board and is provided with the PP cloth 34. After the anode net 32 is combined with the back of the baffle plate 31, the second sliding block 23 on both sides of the second chute 311 on both sides of the baffle plate 31 is slidably fitted, so that the entire bribe device 3 is disposed in the _ stream Between the two; this structural design, whether it is to carry out the _ device money pole device to change the secret, it is very convenient. In addition, 'the hair duck pole device 3 combined in the plating tank, after the immersed area The optimum distance between the surface of the plate member and the anode mesh located at the outermost side of the pole device 3 is 6 to 15 mm. The flow tube 20 of the present invention is connected to the Lipu through a pipeline (not shown) ), the pump transports the electricity to the inspection via the pipeline (4), and then the _ orifice 2U flows out; the electric ship from the hole 21 _ and (4) the optimal flow rate range is 〇 3~

Wsec ’以避免對超薄板件造成過高作用力而變形或晃動。渴流 管20設於電賴的傾斜角度,係其轴向與水平面之間的夹角^最 佳範圍為7G〜8G,且傾斜的誠管2Q,其上端比下端接近被 輸送而來的板件5。電鑛槽1相對兩側的渴流裝置2並非設在對稱 201213622 w 位置,而是相互錯開—適當距離(參第四圖所示),俾使從兩側湧 流管流出的電鑛液可以高交換率通過板件的通孔或盲孔。 利用前述的輸送方法與裝置,本發明藉以進行電錢薄板製程 時,係在將薄板呈登立地進人電鍍槽1内之前,即從電賴i兩 側的勿20各歧孔21持賴出電鍍液進人電鑛槽,且回流 孔12亦持續將電錢槽中的電鍍液排出至過遽設備完成财後再^ 达回演流管2G流人電鍍槽;藉由電舰在電簡1相對兩内 •侧表面的流動而形成一層介質,然後由橫移輸送機4上的炎持器 41夾持板件5進人電簡1並在水平方向輸送,在輸送過程中, 板件5相對兩如糊流電舰的支承與侧而觸極裝置3產 生離作用’魏超薄板件5和剛_阐板μ接觸,配合阻隔 板31上之傾斜式槽孔312的設計,可以防止可能造成的卡板問 題。此外,本發明利用傾斜一角度而設置_流裝置2,可以在板 件5 Jc平輸送通過读流孔2丨時,讓板件5的_不同位置漸進地 ’由上而下承受渴流電鍍液的作用力,再配合回流孔12排出電鍵液 _生將板件往下拉的吸力’可以避免超薄板件5受到過度集中 的作用力而·文形或晃動,造成板件撓曲而與陽極裝置干涉造成卡 板。 以上所述者僅為用以解釋本發明之較佳實施例,並非企圖具 以對本發明做任何形式上之限制,是以,凡有在相同之發明精神 下所作有關本發明之任何修飾或變更,皆仍應包括在本發明意圖 保護之範疇。 201213622 【圖式簡單說明】 $ 本發明電㈣板裝置之前視示意圖。 本發明麵薄板裝置之側視示意圖。 第A圖為第一圖之2a區域的放大圖。 第圖為,4不本灸明電錢薄板裝置之局部前視示意圖。Wsec' to avoid deformation or sway caused by excessive force on the ultra-thin plate. The thirsty flow tube 20 is disposed at an inclination angle of the electric raft, and is an angle between the axial direction and the horizontal plane. The optimum range is 7G to 8G, and the inclined tube 2Q is closer to the lower end than the lower end. Item 5. The thirst flow devices 2 on opposite sides of the electric ore tank 1 are not located at the symmetrical 201213622 w position, but are staggered from each other - an appropriate distance (as shown in the fourth figure), so that the electric ore flowing out from the surge tubes on both sides can be high. The exchange rate passes through the through holes or blind holes of the plate. By using the foregoing conveying method and device, the present invention is used to carry out the process of the electric money thin plate, and the thin plate is held in the plating tank 1 before being placed in the plating tank 1 , that is, from the 20 holes 21 on both sides of the electric circuit i The electroplating solution enters the electric ore tank, and the return hole 12 also continuously discharges the electroplating liquid in the electric money tank to the over-carrying equipment to complete the re-entry of the flow tube 2G flow person electroplating tank; 1 forming a layer of medium with respect to the flow of the two inner side surfaces, and then holding the plate 5 into the electrician 1 by the illuminator 41 on the traverse conveyor 4 and transporting it in the horizontal direction, during the conveying process, the plate 5 Relative to the support of the two-phase electric current ship and the side of the contact device 3 to produce a disengagement 'Wei ultra-thin plate member 5 and just 阐 阐 plate μ contact, with the design of the inclined slot 312 on the baffle plate 31, can Prevent possible jamming problems. In addition, the present invention utilizes the tilting angle to provide the flow device 2, which allows the plate member 5 to be conveyed through the readout orifice 2 ,, allowing the plate 5 to be progressively 'top-down' from the top to bottom. The force of the liquid, together with the return hole 12 to discharge the key liquid _ the suction force of the pull-down of the plate member can avoid the excessive concentration of the plate member 5 to be excessively concentrated, and the shape or sway, causing the plate to flex and The anode device interferes with the card. The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the invention in any way, so that any modifications or changes relating to the invention may be made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention. 201213622 [Simple description of the drawing] $ Front view of the electric (four) board device of the present invention. A side view of a face sheet device of the present invention. Figure A is an enlarged view of the area 2a of the first figure. The picture is a partial front view of the device of the moxibustion power meter.

第四圖為顯示本發明I ^ 麵薄板裝置之局部俯視示意圖。 第五Α圖〜第五(:圖為 部前視示_。、示本㈣騎極綠安胁m槽之局 第六A圖〜苐六d圖 示意圖。 為顯 示本發明之陽麵置的喊結構之平 面 【主要元件符號說明】 1……電鍍槽 10…...沉浸區 • H……第一滑槽 12......回流孔 2……湧流裝置 2〇····..湧流管 21···.···湧流孔 22……第一滑軌 23……第二滑執 3“…·陽極裝置 201213622 31··· …阻隔板 311· ••…第二滑槽 312. …··槽孔 32… …陽極網 33… …鈦框 34… …PP布 4...· -也^移輸送機 41··· …夾持器 5……板件 W……電鍍槽寬度The fourth figure is a partial top plan view showing the I ^ face sheet device of the present invention. The fifth picture ~ the fifth (: the picture is the front view _., the present (four) riding the extreme green security threat m slot of the sixth A figure ~ 苐 six d diagram diagram. To show the shout of the sun face of the present invention Plane of the structure [Description of main components] 1... Plating tank 10... Immersion zone • H... First chute 12... Reflow hole 2... Inrush device 2〇····. Inrush tube 21·······surge hole 22...first slide rail 23...second slide 3”...anode device 201213622 31···blocker 311· ••...second chute 312. ...··Slot 32...Anode mesh 33...Titanium frame 34...PP cloth 4...·-Transfer conveyor 41···Clamp 5...plate W...plating Slot width

Claims (1)

201213622 七、申請專利範圍: ^ 一種電職的方法,她,寬度為丨〜2Cm的電鍍 心’電鍍槽_树兩綱設有驗裝置觸蹄置,該電 鍍槽的底面提(、排出該魏液而使電鍍_的麵液產生往 下的吸力,電錢液分別從該渴流裝置與陽極裝置流出進入電 鋪内,關流裝£_流出σ與水平面之間具有-夾角, 攸u n而出的電鍍液流速大於從陽極裝置流出的電 齡 Μ液抓it板件以登立狀態在該電鍵槽内的電鑛液中被輸 送而進行魏作業,藉由所㈣流電鍍液提供對板件支樓, 避免板件與陽極裳置接觸。 2.依據申睛專利範圍帛!項所述的方法,其中,所述陽極裝置 係設於該電鍍槽相對兩側之兩湧流裝置之間。 3·依據申請專利範圍第1項所述的方法,其中,所述湧流裝置 疋一種湧流管,所述夹角為該湧流管的軸向與水平面之間的 > 夾角。 4·依據申請專利範圍第1或3項所述的方法,其中,所述渴流 管之軸向與水平面之間的夾角為70。〜8〇。,且湧流管的上 端比下端接近被輸送而來的板件。 5. 依據申請專利範圍第1項所述的方法,其中,所述湧流電鍍 液的流速為〇. 3〜lm/sec。 6. 依據申請專利範圍第1項所述的方法,其中,所述板件在該 電鍍槽中時,該板件表面與該陽極裝置的最外側表面之間的 201213622 隶佳距離為6〜15mni。 7· —種電鍵薄板的裝置,包括有: 一電鍍槽,具有内部寬度為卜卩⑽的沉浸區,該電鑛槽的底 面設有複數沿著其長度方向分佈的回流孔; 複數渴流裝置’設於該電鍵槽内的相對兩側,提供湧流電錢 液進入電鍍槽内,賴流裝置_流出σ與水平面之間具^ -夾角’且電鑛槽姉兩侧_流裝置相互錯開在不對稱的 位置; 複數陽極裝置,設於該電鍍槽内的相對兩側,每一陽極裝置 設於兩消流裝置之間,該陽極裝置提供魏流通過以流入該 電錢槽内; 一橫移輸送機’肋輸送—板件以豎立狀態在該電鍵槽内的 電鍍液中朝水平方向移動。 8. 依據申料利顏第7項所述秘置,其中,所賴流裝置 為U ’所述夾角為該勇流管之軸向與水平面之間的夾 角《亥夾角為70〜80,且渴流管的上端比下端接近被輸 送而來的板件。 9. 依=申請專利範圍第7項所述的裝置,其中,所述陽極裝置 已3有陽極網’以及—具有絲傾斜槽孔邮隔板,該槽 孔的傾斜方向,係高的一端迎向所述板件輸送而來的方向。 10. 依據申睛專利範圍第9項所述的裝置,其中,所述電鍍槽 内的相對兩側壁分別設有複數傾斜一前述央角的第一滑槽, 12 201213622 _ % 所述湧流裝置的相對兩側分別設有一第一滑軌與一第一滑 軌,所述阻隔板的相對兩侧分別設有一第二滑槽,藉由該第 ,滑轨與第一滑槽的配合供湧流裝置組合於電鍍槽的内側壁 面’藉由該第二雜與第二滑槽的配合使陽絲置組合於兩 湧流裝置之間。201213622 VII, the scope of application for patents: ^ A method of electric service, she, the width of 电镀 ~ 2Cm plating heart 'plating tank _ tree two classes with inspection device touch hoof, the bottom of the plating tank to lift (, discharge the Wei The liquid causes the electroplating liquid to generate a downward suction force, and the electro-money liquid flows out from the thirteen flow device and the anode device into the electric shop, respectively, and the flow-off device has an angle between the σ and the horizontal plane, 攸un The flow rate of the electroplating solution is greater than that of the electro-age liquid from the anode device, and the plate is transported in the electric ore solution in the keyway to perform the Wei operation, and the plate is provided by the (four) flow plating solution. In the case of the slab, the slab is placed in contact with the anode. 2. The method according to the scope of the invention, wherein the anode device is disposed between two surge devices on opposite sides of the plating tank. The method according to claim 1, wherein the surge device is a surge tube, and the angle is an angle between an axial direction of the surge tube and a horizontal plane. The method described in item 1 or 3, The angle between the axial direction of the thirsty flow tube and the horizontal plane is 70 to 8 〇, and the upper end of the surge tube is closer to the plate member than the lower end. 5. According to the first item of the patent application scope The method of the present invention, wherein the flow rate of the inrush current plating solution is 〜. 3 lm/sec. 6. The method according to claim 1, wherein the plate member is in the plating tank, The 201213622 between the surface of the plate and the outermost surface of the anode device has a good distance of 6 to 15 mni. 7. A device for a thin electric plate, comprising: a plating tank having an immersion area having an inner width of dip (10), The bottom surface of the electric ore tank is provided with a plurality of return holes distributed along the longitudinal direction thereof; the plurality of thirteen flow devices are disposed on opposite sides of the electric key groove to provide the inrush current liquid into the plating tank, and the flow device _ flows out Between σ and the horizontal plane has an angle - and the flow device on both sides of the electric ore tank is staggered at an asymmetrical position; a plurality of anode devices are disposed on opposite sides of the plating tank, and each anode device is disposed at two Between the flow eliminator, the anode The Wei flow is provided to flow into the money slot; a traverse conveyor 'rib transport-plate is moved in the horizontal direction in the plating solution in the keyway to the horizontal direction. 8. According to the claim item 7 The secret, wherein the angle of the U-flow device is U', the angle between the axial direction of the flow tube and the horizontal plane is "the angle of the sea is 70~80, and the upper end of the thirsty flow tube is transported closer to the lower end than the lower end 9. The device of claim 7, wherein the anode device has 3 anode meshes and - a wire-sloping slotted mail partition, the direction of inclination of the slot The apparatus of the present invention, wherein the opposite side walls of the plating tank are respectively provided with a plurality of inclined ones as described above. The first chute of the central corner, 12 201213622 _ % respectively, a first sliding rail and a first sliding rail are disposed on opposite sides of the surge device, and a second sliding slot is respectively disposed on opposite sides of the blocking partition With the first, the rail and the first chute cooperate to provide a surge current Combined in opposite inner side wall surfaces of the plating bath 'by the second hybrid complex with a second chute placed between the male filaments combined in two surge device. 1313
TW99132645A 2010-09-27 2010-09-27 Device and method for electroplating thin board TW201213622A (en)

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JPS6393402A (en) * 1986-10-06 1988-04-23 Sumitomo Metal Ind Ltd Production of thin-web h-shape steel
TW517100B (en) * 1997-12-24 2003-01-11 Process Automation Int Ltd An electroplating apparatus
EP1055020A2 (en) * 1998-02-12 2000-11-29 ACM Research, Inc. Plating apparatus and method
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
KR100755661B1 (en) * 2005-03-07 2007-09-05 삼성전자주식회사 Electroplating apparatus and electroplating method using the same
JP2006312775A (en) * 2005-04-08 2006-11-16 Sharp Corp Plating apparatus, plating method, and method for manufacturing semiconductor device
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