TW201213113A - Epoxy resin laminate having excellent formability and method for preparing the same - Google Patents

Epoxy resin laminate having excellent formability and method for preparing the same Download PDF

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Publication number
TW201213113A
TW201213113A TW100135082A TW100135082A TW201213113A TW 201213113 A TW201213113 A TW 201213113A TW 100135082 A TW100135082 A TW 100135082A TW 100135082 A TW100135082 A TW 100135082A TW 201213113 A TW201213113 A TW 201213113A
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Taiwan
Prior art keywords
epoxy
printed circuit
metal
epoxy resin
circuit board
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TW100135082A
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Chinese (zh)
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TWI454377B (en
Inventor
Dong-Ki Nam
Dong-Bo Yang
Joong-Ho Song
Duk-Sang Han
Hang-Seok Lee
You-Mee Choi
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Doosan Corp
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Publication of TWI454377B publication Critical patent/TWI454377B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Abstract

The present invention relates to a an epoxy-containing laminate for metal-base printed circuit boards, which comprises a printed circuit layer, a dielectric layer, and a heat sink metal layer. Also, the present invention relates to an epoxy-containing laminate for metal-base printed circuit boards, in which the dielectric layer comprises a resin composition consisting of a mixture of a high-equivalent-weight epoxy and a low-equivalent-weight epoxy, and a large amount of an inorganic filler, so that it is excellent in formability such as heat resistance, bendability (bending processability), punchability, and the like as well as is excellent in the electrical properties such as heat conductivity, withstanding voltage, and the like. Particularly, the present invention exhibits the optimum performance as formability of the metal-base printed circuit boards as a result of an overall formability test.

Description

201213113 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種金屬基印刷電路板（也稱作〃金屬pCB ; 金屬印刷電路板〃）（其包含有一印刷電路層、—介電層、以及一 散熱金屬層）的含環氧樹脂的層壓板，並且特別地，本發明關於 種具有優良成形性的含環氧樹脂層壓板，以使得在彎曲及衝孔 過程中沒有躲以及分層，以及具有優㈣電性能，例如導熱性、 财受電壓等’其中該層壓板除了由—高當量環氧樹脂與一低當量 環氧樹脂的混合物組成的一環氧樹脂組成物之外，能夠另外包含 有一橡膠成分、以及一無機填料。 【先前技術】 -金屬基印刷電路板的層壓板包含有一印刷電路層，印刷電 路層之上形成有電路且安裝有一發熱電子裝置，例如一光半導體 裝置；-介電層，用以傳導自f子裝置發出之熱；以及一散熱金 屬層，其與介電層緊密地相接觸用以將熱釋放於外部。 金屬基印刷電路板之層壓板的技術發展在如此之一方式下取 付進展·各層彼此緊密地相結合，以及自印刷電路板產生的熱在 最大化介電層的熱傳送時，消散於外部。此外，金屬基印刷電路 板之層顯已經關注於通過各層的最佳設置，用以提高電性能， 例如導熱性、耐受電，以及成形性例如彎曲性（即，彎曲加 工性）、衝孔性等的技術發展。為此，已經進行—種提高金屬基印 刷電路板之含魏樹脂層之成形性的嘗試，此含環氧樹脂層 塵板包含有-作為活性元件的環氧樹脂，以及不同元件，例如一 ⑧ 4 201213113 無機填料、-固化劑、-固化促進劑…橡膠成分等。 傳統的習知技術之關於含環氧樹脂層壓板之實例包含日本公 開專利申凊案Hei 5-267808揭露的_金屬基底板，其包含有一銅 箔、-介電層、以及-金屬_板，其中介電層包含有：励重量 份的-環氧樹脂；25-27重量份的—環氧聚丁二稀；3⑻_5〇〇重 1份的-無機填料；以及-環氧触@化劑，細公開專利申請 第2005-82570號案揭露的一熱炫型黏合劑組成包含有：3〇_9〇% 重里份的-結晶聚§旨共聚物；5—35%重量份的具有芳香乙婦基化 a t s物塊與石躐化合聚合物塊的熱塑性彈性體；以及5 — 重 S份的-雙紛A型環氧樹脂’以及日本公開專利中請案第 1993-75225號揭露的-金屬基印刷電路板包含有一銅落；一黏合 層’其形成於銅箱之表面上且基本上包含有一聚乙稀醇縮丁酸樹 脂以及-可溶性祕樹脂；—介電樹脂層，其形成於黏合層上且 包含有-壤氧樹脂作為主要元件’以及一合成橡膠或彈性體；以 及-形成於介電樹脂層上的金屬底板。因此，作出嘗試，用以對 包含由各種成分組成的_聚合樹脂的層驗之金屬底板與無機填 料之間提高細力以及相溶性。然而，能賊造金屬基印刷電路 板之層壓板（其包含有不醜型的環倾脂且具有良好的成形 性）之技術仍然沒有進展。 【發明内容】 因此’鑒於上述問題’本發明之目的在於提供—種金屬基印 電路板之層壓板’其包含有混合有大量無機频的—傳統縣 樹脂’以使得此層壓板在例如彎曲性、打孔性、結合強度等的成 201213113 形性上優良，同時在例如導熱性、耐受電壓等的電特性上優良。 本發明之上述目的透過開發一種金屬基印刷電路板之含環氧 脂層壓減得，此含魏樹脂層壓板具錄良之成雜，以使 得在彎曲及打孔過程中不發生裂紋及分層，此金屬基印刷電路板 之含環氧樹脂層壓板包含有：一印刷電路層、一介電層、以及一 散熱金屬層’其巾介電層包含有_由高當量環紐脂與低當量環 氧樹脂之混合物組成的環氧樹脂、以及一無機填料。 本發明最優化金屬基印刷電路板之層壓板之成形性。此外， 本發明增加在印刷電路層、介電層、以及散熱金屬層之間的夹層 結合強度，以及提高例如導熱性、耐受電壓等的電特性，同時最 優化例如熱阻、彎曲性（f曲加工性能）、打孔性等的成形性。 【實施方式】 本發明之其鱗徵及實補將在以下的詳細說明及所附專利 申請範圍中更加明顯。 本發明提供-金屬基印刷電路板之層壓板，其包含有一印刷 電路層、-介電層、以及一散熱金屬層。根據本發明之層壓板係 為一具有一無機填料介電層之層壓板，以及該介電層包含有一環 氧樹脂組成物以及一無機填料。在本發明之層壓板之實現中，根 據使用目的’一高當量環氧樹脂與-低當量環氧樹脂相混合或摻 °以使得J衣氧樹脂組成物之當量能夠在金屬基印刷電路板之形 成時賦於最佳的可加工性。 此外，本發明關於一含環氧樹脂層壓板，其透過固化一包含 -環氧樹脂、-無機填料、一@化劑、—固化促進劑、以及一橡 ⑧ 6 201213113 主麵分敝絲，具錢㈣成雜及料性，由 此在形成金屬基印刷電路板之時提供最佳的可加工性 F 勵獅常咐自由魏Α峨樹脂、魏 苯甲燒型产稀型環氧樹脂 '三 環氧m、蔡型環氧樹脂、聯苯型環氧樹脂、以及含氫 财麵的至少—倾氧触。魏氧樹脂在 U此外’本發明之環氧樹脂可為-個或多個環氧 氫環氧樹脂較佳地係為—氫添加至雙Μ型環 氧树月曰、雙咖環氧樹脂、聯苯型環氧樹脂等的環氧樹脂。 氧樹月t本發明之一較佳實施例中，雙盼八型環氧樹脂可用作該環 本發明之魏翻旨由具有—高#量魏樹脂與—低當量環氧 合物之樹脂組成物組成。本發明之高當量環氧係為具有 魏虽讀圍為600麵00咖的環氧樹脂，以及本發明之低告 置環乳係為-料環氧當量範圍為觸至250咖的環氧樹月旨。 本發明之高當量魏旨之魏#4細，即，_至侧 躲錢紐軸翻。本㈣德當量魏樹脂之 滅虽賴圍’即，漏至250g/eq，係為表現最大塗覆效率的範 圍。本發批高當量職_之魏翻旨#錄_低當量環氧 樹脂之環氧樹脂當量範财混合的樹敝成示出最大的且有 無機填料的介電層之最大凝聚及塗覆效率，以使得由高當量環氧 樹脂與低當量環氧樹脂的混合物組成的—環氧樹脂組成物能夠最 優化金屬基印刷電路板的成形性。 201213113 如果高當1：環氧細旨根據雜驗成物之總重量，容納於7〇 :90%的重量巾’以及低當量魏樹蹄據該樹脂喊物之總重 容納於1G-3G%的重量中，則該高當量環氧樹脂與該低當量 %氧樹脂之混合組成的環氧樹脂組成物，表現出在金屬基印刷電 路板中使用的最佳成形性。 本發明之«成分可包含有魏聚丁二烯、—異紅稀聚入 物、-氣丁二烯聚合物、二基甲丁二稀橡膠、一乙添㈣共聚物口、 或者-氣基钾麵基騎物。本發明之橡膠成分係為—橡膠彈性 體。如果獅成分根據環騎敝成物、_成分以紗機填料 之總重量，容納(U-H)%之量，則展示出金屬基印刷電路板中的最 佳成形性。 本發明之錢频可包対自氧切、氧她、氮化銘、氣 化石夕、以及氮化服喊的-財選擇的至少—個。本發明之無機 填料具有大約2·4微米㈤之平触子錄。具有小於3微米㈤ 之粒子直徑，佔據6_%體積的—無機填料，與具有wo微米 ㈤之粒子直徑’佔據耗％體積的—無機填料彼此相混合。 該無機填料基於樹脂組成物與無機填料的總重量，容納於6〇概 之重量。此外，如果無機填料更包含有—橡膠成分，則其基於樹 脂組成物、_成分、以及域填料的總重量，錢填料包含重 量的6_%。錢轉之献係為齡於树明續驗成物之 成分，並且能夠表現高導熱性及最佳之成形性。 結果發現’根據本發明的無機填料與環氧樹脂組成物的最佳 組成，利用相比較於-般產品相對優良的結合強度及可彎性（即， 201213113 ‘彎曲加工性）’防止本發明之金屬基印猶路板的含環氧樹脂層壓 板出現裂紋，以及利用相比較於其他產品相對優良的打孔性，防 止含環氧樹脂層壓板的一裂紋或分層。 本發明之介電層除環氧樹脂組成物與無機填料之外，可更包 含有一固化劑、一固化促進劑'以及一偶聯劑。 本發明中使用的固化劑可包含有酐基樹脂、酚基樹脂、二氰 胺樹脂等。魏麟之-所名的耻劑可透過根據環氧樹脂之種 類選擇-適當的固化劑使用。該固化劑可為自野基樹脂、苯基樹 脂、二氰胺樹脂等組成的一組中選擇的一個或多個。本發明中使 用的該固化劑以該環氧樹脂的重量為100份為基礎，包含4〇一6〇 之重量份。如果固化劑之大於60重量份或小於4〇重量份，則將 不良好地執行固化且一最終製造的層壓板之成形性劣化。 本發明中使用的固化促進劑可包含有二氰胺、咪唑化合物、 鱗酸鹽化合物等。固化促進劑可為自二氰胺ϋ化合物、鱗酸 鹽化合物等組成的一組中選擇的一個或多個。由於固化促進劑具 有其根據固化溫度變化之特性，因此固化促進劑之量能夠根據樹 脂組成物與固化劑之種類確定。在本發明之中，固化促進劑基於 環氧樹脂組成物的100重量份’包含0 01_1()的重量份。固化促進 劑之含量可根據混合比與樹脂組成物與固化劑之固化狀態調整。 此外，介電層可更包含有一所知的偶聯劑用以提高樹脂組成 物與無機填料的分散效應，以及一有機共聚物可用作一較佳的偶 聯劑。 本發明之印刷電路層包含有一具有15-150微米（聊）厚度的 201213113 銅V白’以及本發明之具有環氧樹脂及無機填料的介電層形成為 50 200微米〇)之厚度。此外，本發明之散熱金屬層形成為 20議0微米㈤之厚度，並且可包含有她、齡金、面板 狀薄鋼板以及銅板（或厚銅板）組成的—組中的至少一個。 如第2圖」所不’具有優良成形性的含環氧樹脂層壓板之 製造方法包含以下步驟：—準備—環氧樹脂n、—無機填料12、 以絲加劑之步驟⑽）；—料混合該環械脂、無機填料、以 及這二添加劑，用以形成__混合物21之步驟⑼）；—將該混合 物21應跡係為—_電路層的_之表面上之步驟⑶）；一 乾燥應用於輔之表面上的混合物之步驟（則；以及—熱壓應用 於銅油之賴混合物及—散熱金助以形成層難之步驟⑼）。 因而如此形成的金屬基電路板之層壓板包含有如「第】⑷圖」 及「第1⑻圖」中所示的印刷電路層卜介電層2、以及散熱金 屬層3。 根據本發明製造的具有良好成形性的含環氧層驗，能夠使 用於用以絲—光半導體裝置或者-趙電子裝置的金屬基印刷 電路板中。 以下，將結合實例更詳細地描述本發明。本領域之技術人員 明顯可知’這些實繼為神m之絲，並且並不關本發明之 範圍。 實例 實例1 一％氧樹脂組成物基於該樹脂合成物之總重量，包含有8〇% 201213113 重^高當量環氧樹脂（環氧當量·· 600g/eq)，以及20%重量的 低:里％氧樹脂（環氧當量：2〇〇g/叫）。然後，高當量環氧樹脂與 低當量環氧樹脂均勻地混合。其後，-具有平均3微米（仰）粒 直仏的無機填料（昭和電工（Sh〇waDenko)氧化紹，產品名字 AL 45_H)基於該環氧樹脂組成物與無機填料之總重量，以80% 之重里添加於該混合物中。隨後，基於應重量份的樹脂組成物， _重里h的雙氫胺與丨重量份的2曱基命坐與該產生之混合物均 勻地混合’用以形成—介電層混合溶液。這樣’形成的混合物溶 液在=鋼（Cu) _ (具有一 35微米〇)之厚度）之表面上作用 1〇〇微米（卿）之厚度，以及然後乾燥為一 B狀態。然後，乾燥 的銅泪面板與一散熱金屬板（鋁，厚度：1500微米（_))在高溫 及向壓下堆豐用以形成一層麗板。 實例2 裒氧柯月a組成物基於該樹脂合成物之總重量，包含有8〇% 重量的高當量環氧樹脂（環氧當量：900g/eq)，以及20%重量的 低2量環氧触（魏#量：2_q)。鎌，高當量環氧樹脂與 低當量環氧樹脂彼此柄地混合。其後，—具有平均3微米㈤ 养子直彳二的無機填料（昭和電工（ShowaDenko)氧化銘,產品名 予AL 45-H)基於該環氧樹脂組成物與無機填料之總重量，以 /之重里添加於該混合物中。隨後，基於丨⑻重量份的樹脂組成 物，30重量份的雙氫胺與丨重量份的2曱基咪唑與該產生之混合 物句勻地混合，用以形成一介電層混合溶液。這樣，形成的混合 物溶液在一銅（Cu)箱（具有-35微米〇)之厚度）之表面上 201213113 作用100微米（…之厚度，以及然後乾燥為一 B狀態。然後， 乾燥的銅箱面板與-散熱金屬板（紹，厚度 :1500微米（卿））在 高溫及高壓下堆疊用以形成一層壓板。 實例3 一裱氧樹脂組成物基於該樹脂合成物之總重量，包含有80% 重1的南當量環氧樹脂（環氧當量：35〇〇g/eq)，以及2〇%重量的 低田里J衣氧樹脂（環氧當量：200g/eq)。然後，高當量環氧樹脂與 低虽量％氧樹脂彼此均勻地混合。其後，·-具有平均3微米〇) 粒子直I的無機填料（昭和電工（sh〇waDenk〇)氧化紹，產品名 子AL 45 H)基於該環氧樹脂組成物與無機填料之總重量，以8〇 %之重量添加於該混合物中。隨後，基於1〇〇重量份的樹脂組成 物，30重置份的雙氫胺與1重量份的2曱基咪唑與該產生之混合 物均句地混合，肋形成—介電層混合溶液。這樣，形成的混合 物溶液在-鋼（Cu)羯（具有一 35微米㈤之厚度）之表面上 作用100微米〇)之厚度，以及然後乾燥為一 B狀態。然後， 軋燥的銅箔面板與一散熱金屬板（鋁，厚度：15〇〇微米（娜乃在 鬲溫及高壓下堆疊用以形成一層壓板。 實例4 環氧樹脂組成物基於該樹脂合成物之總重量，包含有 重量的高當量環氧樹脂（環氧當量：600g/eq)，以及20%重量的 低當置喊翻旨（環氧當量：2GGg/eq)。然後，高當量環氧樹脂與 低當篁環氧翻旨均勻地混合。其後…具有平均3微米（卿）粒 子直役的無機填料（昭和電工（ShowaDenko)氧化銘，產品名字 ⑧ 12 201213113 Η)基於该環氧樹脂組成物與無機填料之總重量，以如％ 之，量添加於誠合物巾。此外，環氧聚了κ日本石油化學 ^⑽）作為一橡谬成分基於樹脂組成物、無機填料、以及橡膠成 刀的〜重里’以1%之重量添加於該混合物中。隨後，基於⑽ 重量知的納旨組成物’ 3Q重量份的雙氫胺與1重量份的2甲基味 、續該產生之混合物均句地混合，用以形成—介電層混合溶液。 匕樣’形成的混合物溶液在一銅（Cu)㈣（具有一 35微米（仰） 之厚度）之表面上作用1〇〇微米㈤之厚度，以及然後乾燥為 狀I、然後，乾燥的銅箔面板與一散熱金屬板（鋁，厚度： 5〇〇微米（卿））在南溫及高壓下堆疊用以形成一層壓板。 达較竇你| ' 實例1的介電層混合溶液之無機填料設置為具有大於2〇微米 (//B1)之平均粒子直徑’並且該無機猶之含量基於細旨組成物 與無機填料的總重量，設置為嘱的重量，用以形成-層壓板（隨 後之製造步驟與實例1中的步驟相同）。 fc較實例2 、實例1的介電層混合溶液之無機填料設置為具有i微米㈤ 之平均粒子紐，纽絲機频之含量躲樹驗錢與無機 填料的總重量，設置為8〇%的重量，用以形成一層壓板（隨後之 製造步驟與實例1中的步驟相同）。201213113 VI. Description of the Invention: [Technical Field] The present invention relates to a metal-based printed circuit board (also referred to as a base metal pCB; a metal printed circuit board) comprising a printed circuit layer, a dielectric layer, And an epoxy-containing laminate of a heat-dissipating metal layer, and in particular, the present invention relates to an epoxy-containing laminate having excellent formability so that there is no hiding and delamination during bending and punching. And having excellent (four) electrical properties, such as thermal conductivity, financial stress, etc., wherein the laminate can be additionally composed of an epoxy resin composition consisting of a mixture of a high equivalent epoxy resin and a low equivalent epoxy resin. It contains a rubber component and an inorganic filler. [Prior Art] - The laminate of the metal-based printed circuit board comprises a printed circuit layer on which a circuit is formed and a heat-generating electronic device such as an optical semiconductor device is mounted; a dielectric layer for conducting from The heat emitted by the sub-device; and a heat dissipating metal layer that is in intimate contact with the dielectric layer to release heat to the outside. Technological developments in laminates of metal-based printed circuit boards have progressed in such a manner that the layers are closely combined with each other, and the heat generated from the printed circuit board is dissipated to the outside when the heat transfer of the dielectric layer is maximized. In addition, layers of metal-based printed circuit boards have focused on optimum placement through layers to improve electrical properties such as thermal conductivity, electrical withstand, and formability such as bendability (ie, bending workability), punching. Technological developments such as sex. For this reason, attempts have been made to improve the formability of the Wei resin-containing layer of the metal-based printed circuit board, which comprises an epoxy resin as an active element, and different elements, such as an 8 4 201213113 Inorganic fillers, - curing agents, - curing accelerators, rubber components, etc. An example of a conventional art-containing epoxy-containing laminate includes a metal base plate disclosed in Japanese Laid-Open Patent Publication No. Hei 5-267808, which comprises a copper foil, a dielectric layer, and a metal plate. The dielectric layer comprises: an excipient part by weight - an epoxy resin; 25-27 parts by weight of an epoxy polybutylene; 3 (8) - 5 parts by weight of an inorganic filler; and an epoxy contact agent. A hot-type adhesive composition disclosed in Japanese Laid-Open Patent Application No. 2005-82570 comprises: 3〇_9〇% by weight of a crystalline polystyrene copolymer; 5-35% by weight of an aromatic female a thermoplastic elastomer which is a base of an ats block and a dendrite compound block; and a 5-weight S-type A-type epoxy resin', and a metal base disclosed in Japanese Laid-Open Patent Publication No. 1993-75225 The printed circuit board comprises a copper drop; an adhesive layer formed on the surface of the copper box and substantially comprising a polyvinyl acrylate resin and a soluble resin; a dielectric resin layer formed on the adhesive layer And contains - lye resin as the main component 'and a synthetic rubber Elastomer; and - a metal plate formed on the dielectric resin layer. Therefore, an attempt has been made to improve the fineness and compatibility between the metal base plate and the inorganic filler including the layer of the _polymer resin composed of various components. However, the technology capable of producing a metal-based printed circuit board laminate (which contains a non-ugly ring-turning grease and having good formability) has not progressed. SUMMARY OF THE INVENTION Therefore, in view of the above problems, an object of the present invention is to provide a laminate of a metal-based printed circuit board which includes a conventional resin which is mixed with a large amount of inorganic frequency to make the laminate, for example, bendable. In the 201213113, the holeability, the bonding strength, and the like are excellent in shape, and are excellent in electrical characteristics such as thermal conductivity and withstand voltage. SUMMARY OF THE INVENTION The above object of the present invention is achieved by developing an epoxy-containing laminate of a metal-based printed circuit board having a good recording of impurities so that cracks and delamination do not occur during bending and punching. The epoxy-containing laminate of the metal-based printed circuit board comprises: a printed circuit layer, a dielectric layer, and a heat-dissipating metal layer, wherein the dielectric layer of the towel comprises _ high-equivalent ring grease and low equivalent weight An epoxy resin composed of a mixture of epoxy resins, and an inorganic filler. The present invention optimizes the formability of a laminate of a metal-based printed circuit board. Further, the present invention increases the interlayer bonding strength between the printed circuit layer, the dielectric layer, and the heat dissipation metal layer, and improves electrical characteristics such as thermal conductivity, withstand voltage, etc., while optimizing, for example, thermal resistance and flexibility ( Formability of f-machining performance), punching property, and the like. [Embodiment] The scale and the actual compensation of the present invention will become more apparent in the following detailed description and the appended claims. The present invention provides a laminate of a metal-based printed circuit board comprising a printed circuit layer, a dielectric layer, and a heat dissipating metal layer. The laminate according to the present invention is a laminate having an inorganic filler dielectric layer, and the dielectric layer comprises an epoxy resin composition and an inorganic filler. In the implementation of the laminate of the present invention, a high-equivalent epoxy resin and a low-equivalent epoxy resin are mixed or blended according to the purpose of use so that the equivalent of the J-oxygen resin composition can be used in a metal-based printed circuit board. It is formulated to give optimum processability. In addition, the present invention relates to an epoxy-containing laminate which is cured to contain an epoxy resin, an inorganic filler, a @化剂, a curing accelerator, and an aluminum 8 6 201213113 main surface splitting wire. Money (4) is mixed and material, thus providing the best processability when forming a metal-based printed circuit board. F lion lion often free Wei Wei resin, Wei Benjia type thin epoxy resin 'three Epoxy m, Tsai-type epoxy resin, biphenyl type epoxy resin, and at least - tilting oxygen contact with hydrogen-containing surface. In addition, the epoxy resin of the present invention may be one or more epoxy hydrogen epoxies, preferably hydrogen-added to the bismuth-type epoxy tree ruthenium, double-coffee epoxy resin, An epoxy resin such as a biphenyl type epoxy resin. Oxygen Tree Month In a preferred embodiment of the present invention, a double-pear type epoxy resin can be used as the ring of the present invention. The resin having the high-weight Wei resin and the low-equivalent epoxy compound is used. Composition of the composition. The high-equivalent epoxy resin of the present invention is an epoxy resin having a width of 600 00 coffee, and the low-injection ring milk of the present invention is an epoxy resin having an epoxy equivalent equivalent to 250 coffee. The purpose of the month. The high-equivalent Wei-zhi of the present invention is fine #4, that is, the _ to the side hides the money. This (four) German equivalent of Wei resin is destroyed, that is, it leaks to 250 g/eq, which is the range for exhibiting the maximum coating efficiency. The high-equivalent position of the batch of _ _ _ _ _ _ _ low-equivalent epoxy resin epoxy equivalent of the mixed tree 敝 敝 示出 示出 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大The epoxy resin composition consisting of a mixture of a high equivalent epoxy resin and a low equivalent epoxy resin is capable of optimizing the formability of the metal-based printed circuit board. 201213113 If Gao Dang 1: Epoxy is based on the total weight of the miscellaneous test, it is contained in 7〇: 90% of the weight of the towel and the low equivalent Weishuho is contained in the 1G-3G% according to the total weight of the resin shout. The epoxy resin composition of the mixture of the high-equivalent epoxy resin and the low-equivalent-% oxygen resin exhibits optimum formability for use in a metal-based printed circuit board. The composition of the present invention may comprise a Wei polybutadiene, an iso-red dilute polymer, a gas butadiene polymer, a di-butadiene rubber, an ethylene (tetra) copolymer port, or a gas-based potassium surface. Base ride. The rubber component of the present invention is a rubber elastomer. If the lion composition is contained in the amount of (U-H)% based on the total weight of the woven fabric and the _ component in terms of the yarn filler, the optimum formability in the metal-based printed circuit board is exhibited. The money frequency of the present invention can be included in at least one of oxygen selection, oxygen her, nitriding, gasification, and nitriding. The inorganic filler of the present invention has a flat touch of about 2.4 micrometers (five). The inorganic filler having a particle diameter of less than 3 μm (five) occupying 6 % by volume is mixed with the inorganic filler having a particle diameter of wo micron (f). The inorganic filler is contained in a weight of 6 Å based on the total weight of the resin composition and the inorganic filler. Further, if the inorganic filler further contains a rubber component, the money filler contains 6% by weight based on the total weight of the resin composition, the _ component, and the domain filler. The money transfer is based on the composition of the sap of the tree, and can exhibit high thermal conductivity and optimum formability. As a result, it has been found that the optimum composition of the inorganic filler and the epoxy resin composition according to the present invention prevents the present invention from being relatively excellent in bonding strength and bendability (i.e., 201213113 'bending workability). The epoxy-containing laminate of the metal-based slab is cracked, and a crack or delamination of the epoxy-containing laminate is prevented by using a relatively excellent puncture property compared to other products. The dielectric layer of the present invention may further comprise a curing agent, a curing accelerator, and a coupling agent in addition to the epoxy resin composition and the inorganic filler. The curing agent used in the present invention may contain an anhydride-based resin, a phenol-based resin, a dicyanamide resin or the like. Wei Linzhi - the name of the shame can be selected according to the type of epoxy resin - the appropriate curing agent. The curing agent may be one or more selected from the group consisting of a field-based resin, a phenyl resin, a dicyanamide resin, and the like. The curing agent used in the present invention contains 4 parts by weight to 6 parts by weight based on 100 parts by weight of the epoxy resin. If the curing agent is more than 60 parts by weight or less than 4 parts by weight, curing will be poorly performed and the formability of a finally manufactured laminate is deteriorated. The curing accelerator used in the present invention may contain dicyanamide, an imidazole compound, a sulphate compound, and the like. The curing accelerator may be one or more selected from the group consisting of dicyandiamide compounds, sulphate compounds and the like. Since the curing accelerator has characteristics which vary depending on the curing temperature, the amount of the curing accelerator can be determined depending on the kind of the resin composition and the curing agent. In the present invention, the curing accelerator contains a part by weight of 0 01_1 () based on 100 parts by weight of the epoxy resin composition. The content of the curing accelerator can be adjusted depending on the mixing ratio and the curing state of the resin composition and the curing agent. Further, the dielectric layer may further comprise a known coupling agent for enhancing the dispersion effect of the resin composition and the inorganic filler, and an organic copolymer may be used as a preferred coupling agent. The printed circuit layer of the present invention comprises a thickness of 201213113 copper V white having a thickness of 15 to 150 μm and a dielectric layer of the present invention having an epoxy resin and an inorganic filler formed to be 50 200 μm. Further, the heat dissipating metal layer of the present invention is formed to have a thickness of 20 μm (5), and may include at least one of the group consisting of her, age gold, panel-like steel sheet, and copper plate (or thick copper plate). The method for manufacturing an epoxy-containing laminate having excellent formability as shown in Fig. 2 includes the following steps: - preparation - epoxy resin n, - inorganic filler 12, step (10) with silk addition agent; Mixing the ring grease, the inorganic filler, and the two additives to form the step (9) of the __ mixture 21; - the step of treating the mixture 21 as the step (3) on the surface of the circuit layer _; The step of drying the mixture applied to the auxiliary surface (then; and - the step of hot pressing applied to the copper oil mixture and the heat dissipating aid to form a layer (9)). Thus, the laminate of the metal-based circuit board thus formed includes the printed circuit layer dielectric layer 2 and the heat-dissipating metal layer 3 as shown in "Fig. 4" and "1 (8)". The epoxy-containing layer inspection having good formability produced in accordance with the present invention can be used in a metal-based printed circuit board for a wire-optic semiconductor device or a blue electronic device. Hereinafter, the present invention will be described in more detail with reference to examples. It will be apparent to those skilled in the art that these are in the sense of the present invention and are not intended to limit the scope of the invention. EXAMPLES Example 1 A % oxygen resin composition contained 8 % by weight of 201213113 weight ^ high equivalent epoxy resin (epoxy equivalent · 600 g / eq), and 20% by weight of low: based on the total weight of the resin composition % oxygen resin (epoxy equivalent: 2 〇〇 g / called). Then, the high equivalent epoxy resin is uniformly mixed with the low equivalent epoxy resin. Thereafter, an inorganic filler having an average of 3 μm (upward) granules (Sh〇wa Denko Oxidation, product name AL 45_H) is based on the total weight of the epoxy resin composition and the inorganic filler, 80% The weight is added to the mixture. Subsequently, based on the parts by weight of the resin composition, the dihydrogenamine of _hee h and the ruthenium of the ruthenium were uniformly mixed with the resulting mixture to form a dielectric layer mixed solution. The mixture solution thus formed acts on the surface of = steel (Cu) _ (having a thickness of 35 μm) to a thickness of 1 μm, and then dried to a B state. Then, the dried copper tear panel and a heat-dissipating metal plate (aluminum, thickness: 1500 μm (_)) were piled up at a high temperature and pressed to form a slab. Example 2 The oxime keue a composition contained 8% by weight of a high equivalent epoxy resin (epoxy equivalent: 900 g/eq) and 20% by weight of a low amount of epoxy based on the total weight of the resin composition. Touch (Wei # quantity: 2_q).镰, the high equivalent epoxy resin and the low equivalent epoxy resin are mixed with each other. Thereafter, an inorganic filler having an average of 3 micrometers (five) of nutrient bismuth (Showa Denko oxidation, product name to AL 45-H) is based on the total weight of the epoxy resin composition and the inorganic filler. Heavy is added to the mixture. Subsequently, based on ruthenium (8) parts by weight of the resin composition, 30 parts by weight of dihydroamine and ruthenium by weight of 2-mercaptoimidazole were mixed with the resulting mixture to form a dielectric layer mixed solution. Thus, the resulting mixture solution is applied to a surface of a copper (Cu) box (having a thickness of -35 μm) of 201213113 to a thickness of 100 μm, and then dried to a B state. Then, the dried copper box panel And a heat-dissipating metal plate (thickness: thickness: 1500 μm) was stacked at a high temperature and a high pressure to form a laminate. Example 3 An epoxy resin composition contained 80% by weight based on the total weight of the resin composition. 1 equivalent of epoxy resin (epoxy equivalent: 35 〇〇g / eq), and 2% by weight of low-field J-oxygen resin (epoxy equivalent: 200 g / eq). Then, high equivalent epoxy resin And the low-volume% oxygen resin is uniformly mixed with each other. Thereafter, the inorganic filler (having an average of 3 μm 〇) particles straight I (Showa Electric (sh〇waDenk〇) oxidation, product name AL 45 H) is based on The total weight of the epoxy resin composition and the inorganic filler was added to the mixture in an amount of 8% by weight. Subsequently, based on 1 part by weight of the resin composition, 30 parts by weight of the dihydrogenamine and 1 part by weight of the 2-mercaptoimidazole were uniformly mixed with the resulting mixture, and the ribs were formed into a dielectric layer mixed solution. Thus, the resulting mixture solution was applied to a thickness of -100 μm on a surface of a steel (Cu) crucible (having a thickness of 35 μm), and then dried to a B state. Then, the rolled copper foil panel and a heat-dissipating metal plate (aluminum, thickness: 15 〇〇 micron (Na Na is stacked at a temperature and a high pressure to form a laminate. Example 4 epoxy resin composition based on the resin composition) The total weight, including the weight of the high equivalent epoxy resin (epoxy equivalent: 600g / eq), and the low weight of 20% by weight (epoxy equivalent: 2GGg / eq). Then, high equivalent epoxy The resin is uniformly mixed with the low-grade bismuth epoxy. Thereafter... an inorganic filler having an average of 3 micrometers (clear) particles (Showa Denko oxidation, product name 8 12 201213113 Η) based on the epoxy resin The total weight of the composition and the inorganic filler is added to the chelate towel in an amount of, for example, %. In addition, the epoxy poly-kappa Japanese petrochemical compound (10) is used as a rubber component based on the resin composition, the inorganic filler, and the rubber. The granules of the granules were added to the mixture at a weight of 1%. Subsequently, based on the weight of (10), a composition of '3Q parts by weight of dihydroamine and 1 part by weight of 2 methyl sulphate, continued to be produced. The mixture is mixed and used Forming a dielectric layer mixed solution. The resulting mixture solution is applied to a surface of copper (Cu) (four) (having a thickness of 35 μm) for a thickness of 1 μm (v), and then dried. I. Then, the dried copper foil panel and a heat-dissipating metal plate (aluminum, thickness: 5 〇〇 micron (qing)) are stacked at a south temperature and a high pressure to form a laminate. The inorganic filler of the electric layer mixed solution is set to have an average particle diameter of greater than 2 〇 micrometers (//B1) and the inorganic helium content is set to the weight of ruthenium based on the total weight of the composition and the inorganic filler. Forming - laminate (subsequent manufacturing steps are the same as those in Example 1). fc is more than the inorganic filler of the dielectric layer mixed solution of Example 2, Example 1 is set to have an average particle size of i micrometer (f), and the machine frequency is The total weight of the content of the tree and the inorganic filler was set to 8% by weight to form a laminate (the subsequent manufacturing steps were the same as those in Example 1).

达較會你P 基於樹脂喊物馳重量’透過將95%重量的—高當量環氧 樹脂（環氧當量：3500g/eq)與5%重量的一低當量環氧樹脂（環 13 2〇1213113 氧當量：200g/eq)相混合，準備一環氧樹脂組成物，用以形成一 層壓板（隨後之製造步驟與實例3中的步驟相同）。 比較f例4 基於樹脂組成物的總重量，透過將60%重量的一高當量環氧 樹脂（環氧當量：3500g/eq)與40%重量的一低當量環氧樹脂（環 氧當量：200g/eq)相混合，準備一環氧樹脂組成物，用以形成一 層壓板（隨後之製造步驟與實例3中的步驟相同）。 I含成形性的性能之評杜 透過上述實例與比較實例製造的金屬基印刷電路板的層壓板 之性能測試結果如以下表1所列。 在實例與比較實例之性能中，根據ASTME1461標準測量熱 導率（W/mK)。根據1盎司（〇z)銅標準測量結合強度。如果當 作用135度之曲折角不出現裂紋及分層（或毛邊）（大約135度）， 則確定彎曲性良好。當使用1別-·頓之切割力切割時，評估打 孔性用以檢查是否出現裂紋及分層。總成形性按照如此的方式評 估：合乎鮮的樣本大小透過在每—實例與每—比較實例中測量 100個樣本量且徹底評估彎曲性及打孔性測量。 〔表1〕 實例 實例4 比較實 比較實 比較實 比較實 1〜3 *" — 例1 例2 例3 例4 導熱性 2.4 2.2 1.8 1.5 2.2 2.2 (W/mK) ^------ ⑧ 14 201213113 剝離 強度 ---^ r—___ 2.2-2.5 2.0 1.7 1.8 2.2 1.8 (kgf/cm) 彎曲性 (大約 良好 良好 微裂紋 微裂紋 良好 微裂紋 135°) __ -__— 打孔性 (150-200 0頓） 良好 良好 微裂紋 微裂紋 微裂紋 裂紋 總成形 性 (評估標 準透過 測量100 個樣本 量的樣 本大小） 95 〜98 ~84^ 75 70 74 60 作為评估之一結果’能夠自這些實例中看出，相比較於其他 實例’本發明之導熱性及結合力相當良好，以及相比較於其他實 例總成形性相對穩定。 雖然本發明以前述之較佳實施例揭露如上，然其並非用以限 定本發明。本領域之技術人員應當意識到在不脫離本發明所附之 15 201213113 =專利範圍所揭示之本發明之精神和範圍的情況下，所作之更 觸本發明之專利保護翻之内。關於本發明所界定 之保遵範圍請參照所附之申請專利範圍。 【圖式簡單說明】 第1 (a)圖係為本發明之一金屬基印刷電路板之層壓板之透 視圖； 第1 (b)圖係為本發明之金屬基印刷電路板之層壓板之侧視 圖；以及 第2圖係為本發明之金屬基印刷電路板之層壓板的製造過程 之流程圖。 【主要元件符號說明】 1 印刷電路層 2 介電層 3 散熱金屬層 11 壞氧樹脂 無機填料 混合物 21Reaching you P based on the resin shouting weight 'pass through 95% by weight of high-equivalent epoxy resin (epoxy equivalent: 3500g / eq) and 5% by weight of a low equivalent epoxy resin (ring 13 2〇 1213113 Oxygen equivalent: 200 g/eq) was mixed, and an epoxy resin composition was prepared to form a laminate (the subsequent manufacturing steps were the same as those in Example 3). Comparative Example 4 Based on the total weight of the resin composition, 60% by weight of a high equivalent epoxy resin (epoxy equivalent: 3500 g/eq) and 40% by weight of a low equivalent epoxy resin (epoxy equivalent: 200 g) /eq) Mixing, preparing an epoxy resin composition to form a laminate (the subsequent manufacturing steps are the same as those in Example 3). I. Evaluation of the properties of the moldability The performance test results of the laminate of the metal-based printed circuit board manufactured by the above examples and comparative examples are listed in Table 1 below. Among the properties of the examples and comparative examples, the thermal conductivity (W/mK) was measured in accordance with the ASTM E1461 standard. Bond strength was measured according to the 1 oz (〇z) copper standard. If cracks and delamination (or burrs) (about 135 degrees) do not occur when the zigzag angle of 135 degrees is applied, it is determined that the bending property is good. When cutting with a cutting force of 1 Å-Don, the puncturing property was evaluated to check for cracks and delamination. Total formability was evaluated in such a way that a sample size that was close to the original was measured by measuring 100 sample sizes in each of the examples and each of the comparative examples and thoroughly evaluating the bendability and puncture measurement. [Table 1] Example Example 4 Comparing the actual comparison with the actual comparison 1~3 *" - Example 1 Example 2 Example 3 Example 4 Thermal conductivity 2.4 2.2 1.8 1.5 2.2 2.2 (W/mK) ^------ 8 14 201213113 Peel strength ---^ r—___ 2.2-2.5 2.0 1.7 1.8 2.2 1.8 (kgf/cm) Flexibility (approximate good good microcrack microcrack good microcrack 135°) __ -__— Perforation (150 -200 0 ton) good good microcrack microcrack microcrack crack total formability (evaluation criteria by measuring the sample size of 100 sample sizes) 95 ~ 98 ~ 84 ^ 75 70 74 60 As one of the results of the evaluation 'can be from these examples It can be seen that the thermal conductivity and bonding strength of the present invention are relatively good compared to other examples, and the total formability is relatively stable compared to other examples. Although the invention has been disclosed above in the foregoing preferred embodiments, it is not intended to limit the invention. It will be appreciated by those skilled in the art that the invention may be practiced without departing from the spirit and scope of the invention as disclosed in the appended claims. Please refer to the attached patent application for the scope of the warranty defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1(a) is a perspective view of a laminate of a metal-based printed circuit board of the present invention; and FIG. 1(b) is a laminate of a metal-based printed circuit board of the present invention. The side view; and Fig. 2 is a flow chart showing the manufacturing process of the laminate of the metal-based printed circuit board of the present invention. [Main component symbol description] 1 Printed circuit layer 2 Dielectric layer 3 Heat-dissipating metal layer 11 Ozone resin Inorganic filler Mixture 21

Claims (1)

201213113 七、申請專利範圍： 種金屬基印刷電路板之含環氧樹脂層壓板，該金屬基印刷電 路板之含魏_層壓板具有優良之成雜，以使得在彎曲及 二=中不發生餘及分層，該金屬基印刷電路板之含環氧 樹月曰層壓板係包含有： 一印刷電路層； —介電層；以及 ~散熱金屬層， 2. 其中該介嫩含有，綱氧樹脂與低當量環氧 _之混合物組成的環氧樹脂、以及-無機填料。 基印刷電路板之含環氧樹脂層壓板，該金屬基印刷電 打==氧樹脂層壓板具有優良之成形性，以使得在彎曲及 、之含環氧 ^ $不發生裂紋及分層，該金屬基印刷電路板. Μ脂層壓板係包含有： —印刷電路層； —介電層；以及 一散熱金屬層， 射齡電層包含有—由高當量魏樹脂雜 機填:嫩组成的環氧樹爾物、-橡膠成分::及： 3·如凊求項第1項或第2項所述之金屬基印刷電路板之含環氧樹 17 201213113 脂二: 成物係為自_ A型環氧樹 型環氧樹脂、Μ祕型環氧樹脂、二環戍二婦型 ;:知、三”崎趣、萘型環氧樹脂、以及聯苯型 域树脂組成的-組中選擇的一種或多種環氧樹脂。 第2項所述之金屬基印刷電路板之含環氧樹 曰層塵板，其令該環氧樹脂組成物係為雙紛Α。 項第2項所述之金屬基印刷電路板之含環氧樹脂層愿 ，^_成分係為_氧聚丁二埽、_異紅稀聚合 、一風丁二騎合物、省丁二_、—冰丙稀共聚 、二及一氨基鉀酸酉旨基縮聚物組成的一組中選擇的—個或多 個橡膠彈性體，以及根據該環最 填料之總重量，包知-酬ΓΓ成分以及該無機 6.如請求項第丨項或第2項所述之金屬基印刷電路板之含環 脂層壓板，其中該無機填料係為自氧化妙、氧化銘、氣化紹、 氮化石夕、以及氮化蝴組成的一組中選擇的一個或多個。 I 項所述之金屬基印刷電路板之含環氧樹 月曰祕板，其中该高當量環氧樹脂係為具有環氧當量 6〇〇至侧g/eq的環氧樹脂，以及該低當量環氧係為―具有产 氧當量範圍為100至250 g/eq的環氧樹脂。 ^衣 8·如明求項第1項或第2項所述之金屬基印刷電路板之含環 脂層壓板，其中該高當量環氧樹脂根據該環氧樹脂組成 2〇12l3li3 重量三容納於7〇-9〇%的重量中’以及該低當量環氧樹脂根據 '•亥％氧树脂組成物之該總重量，容納於1〇—3〇%的重量中。 如》月^項第1項或第2項所述之金屬基印刷電路板之含環氧樹 脂層壓板，其巾該無機填料具有1_2〇微米（/M)之平均粒子直 傻，以及基於該環氧触組成物與該無機填制總重量，容納 於60-90%之重量。 如"月求項第1項或第2項所述之金屬基印刷電路板之含環氧樹 脂層壓板，其中該介電層更包含有一固化劑、一固化促進劑、 以及一偶聯劑。 11·-種具有優良成形_含魏娜層壓板之製财法，係包含 以下步驟： 準備-環氧樹脂、一無機填料、以及添加劑； 均勻地此合趣氧樹脂、該無機填料、以及該等添加劑， 用以形成一混合物； 將該/昆合物顧於係為_印刷電路層賴㊣之表面上； 乾燥應用於該鋼箱之該表面上的該混合物；以及 、鍵應祕該_之該賴混合物及-散熱金屬層以形 成該層壓板。 I2. 一_以絲辭導體或隸電子裝置之金屬基印刷電路 板、，該金屬基印刷電路板包含有具有如請求項第！項或第2項 斤述之金屬基印刷電路板之含環氧樹脂層壓板。 19201213113 VII. Patent application scope: The epoxy resin-containing laminate of the metal-based printed circuit board, the metal-based printed circuit board containing the Wei_laminate has excellent impurities, so that no difference occurs in the bending and the second= And layering, the epoxy-containing ruthenium laminate of the metal-based printed circuit board comprises: a printed circuit layer; a dielectric layer; and a heat-dissipating metal layer, wherein the medium contains a oxy-resin An epoxy resin composed of a mixture of a low equivalent weight epoxy resin, and an inorganic filler. The epoxy-containing laminate of the base printed circuit board, the metal-based printed ED==oxy-resin laminate has excellent formability, so that the crack and the epoxy-containing epoxy do not crack and delaminate. Metal-based printed circuit board. The resin laminate comprises: a printed circuit layer; a dielectric layer; and a heat-dissipating metal layer, the age-old electrical layer comprising - a ring consisting of a high-equivalent Wei resin machine: a tender ring Oxygen, rubber component:: and: 3. The epoxy-containing tree of the metal-based printed circuit board according to Item 1 or Item 2 201213113 Lipid 2: The system is from _A Type epoxy resin epoxy resin, bismuth epoxy resin, two-ring bismuth type; selected from the group consisting of: know, three "sakisaki, naphthalene epoxy resin, and biphenyl type resin" The epoxy resin-containing dust layer of the metal-based printed circuit board according to Item 2, wherein the epoxy resin composition is double-sided. The epoxy layer of the base printed circuit board is desired, and the composition of the film is _oxypolybutadiene, _hetero red, and One or more rubber elastomers selected from the group consisting of a wind ding erectile compound, a diced dibutyl ketone, an ice propylene copolymer, a di- and mono-amino potassium bismuth ruthenium polycondensate, and according to the ring The total weight of the filler, the composition of the filler, and the inorganic-containing composite of the metal-based printed circuit board according to claim 2 or claim 2, wherein the inorganic filler is self-oxidizing One or more selected from the group consisting of fascinating, oxidizing, oxidizing, nitriding, and nitriding. The metal-based printed circuit board of the present invention contains an epoxy tree. The high equivalent epoxy resin is an epoxy resin having an epoxy equivalent of 6 Å to a side g/eq, and the low equivalent epoxy is an epoxy resin having an oxygen equivalent weight ranging from 100 to 250 g/eq. The epoxy-containing laminate of the metal-based printed circuit board according to Item 1 or Item 2, wherein the high-equivalent epoxy resin is contained according to the epoxy resin composition of 2〇12l3li3 Between 7〇-9〇% by weight' and the low equivalent epoxy resin according to '•Hy% Oxygen Resin The total weight of the product is contained in a weight of 1〇—3〇%. The epoxy-containing laminate of the metal-based printed circuit board according to Item 1 or Item 2 of the item The inorganic filler has an average particle size of 1_2 〇 micrometer (/M), and is contained in a weight of 60-90% based on the total weight of the epoxy contact composition and the inorganic filler. For example, "monthly item 1 Or the epoxy-containing laminate of the metal-based printed circuit board according to Item 2, wherein the dielectric layer further comprises a curing agent, a curing accelerator, and a coupling agent. The method for preparing a Weina laminate comprises the steps of: preparing - an epoxy resin, an inorganic filler, and an additive; uniformly, the oxygen-containing resin, the inorganic filler, and the additives to form a mixture Applying the compound to the surface of the printed circuit layer; drying the mixture applied to the surface of the steel box; and, the key should be the mixture and the heat-dissipating metal Layers are formed to form the laminate. I2. A metal-based printed circuit board with a wire conductor or an electronic device, the metal-based printed circuit board containing the same as the request item! Item or Item 2 The epoxy-containing laminate of the metal-based printed circuit board. 19
TW100135082A 2010-09-29 2011-09-28 Epoxy resin laminate having excellent formability and method for preparing the same TWI454377B (en)

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KR101477353B1 (en) * 2012-11-09 2014-12-29 주식회사 두산 Resin composition and laminate for printed circuit board comprising the same
KR101377312B1 (en) * 2012-12-26 2014-03-25 주식회사 두산 Epoxy resin composition having an excellent adhesive property and copper foil with resin
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