201212733 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電路板，且特別是有關於一種電 路板模組。 【先前技術】 在現今液晶顯示器（Liquid Crystal Display, LCD)的 製造過程中’電晶體陣列基板（transjst〇rarray substrate) φ 一般都是利用異方向性導電膠（Anisotropic Conductive201212733 VI. Description of the Invention: [Technical Field] The present invention relates to a circuit board, and more particularly to a circuit board module. [Prior Art] In the current manufacturing process of Liquid Crystal Display (LCD), the transistor array substrate (transjst 〇 rayray substrate) φ generally utilizes anisotropic conductive adhesive (Anisotropic Conductive).
Hlni’ACF)來連接軟式電路板（打⑷匕卜circuit board)，而 異方向性導電膠通常須要經過壓合流程，才能黏合電晶體 陣列基板與軟式電路板，並且讓電晶體陣列基板與軟式電 路板電性連接。 述壓合^之前’通常會先對壓合機台進行校 ^ σ機台能正常地進行壓合流程之後，才開始生Hlni'ACF) to connect the flexible circuit board (the (4) circuit board), and the different direction conductive adhesive usually needs to be pressed to bond the transistor array substrate and the flexible circuit board, and the transistor array substrate and the soft type The board is electrically connected. Before the pressure is combined, it is usually the first time that the press machine is first calibrated.
產液晶顯示器產品。 體陣列基板與軟式電路:述校正的過程中，首先，將電晶 時，工作人員先C二者的端子對準。在進行對準 板的位置，並檢視電日^操作壓合機台，調整軟式電路 位標記是否完全重/日體陣職板與軟式電路板二者的定 接著，壓合機：二判斷二者的端子是否對準。 者的端子是否仍然對準，並且 電路板二者之間的電訊號是否 軟式電路板。在進行^料’以使電晶體陣列基板連接 體陣列基板與軟式電路，工作人員會再次檢查電晶 測試電晶體陣列基板與二^ 201212733 ‘ 能正常地傳遞，以進一步地判斷壓合機台的參數，例如壓 ' 合時間、溫度以及壓力，是否須要調整，讓壓合機台能正 常地進行壓合流程。 【發明内容】 本發明提供一種電路板模組，其包括具有對準及檢測 功能的檢測結構與檢測圖案。 本發明提出一種電路板模組，包括一軟式電路板、一 核心電路板以及一導電連接材料。軟式電路板包括一軟性 • 基板、多個第一端子與至少一檢測結構。軟性基板具有彼 此相對的一上表面與一下表面。這些第一端子與檢測結構 皆配置在軟性基板中。檢測結構包括一第一定位件與一第 一檢測墊。上表面暴露第一檢測墊，而下表面暴露這些第 一端子。核心電路板包括一基板、多個第二端子與至少一 檢測圖案。這些第二端子與檢測圖案皆配置在基板的一平 面上。檢測圖案包括一第二定位件與一第二檢測塾。當第 Φ 一定位件重疊於第二定位件時，這些第一端子重疊於這些 第二端子。導電連接材料連接於這些第一端子與這些第二 端子之間，並且配置在第一定位件與第二定位件之間。 在本發明一實施例中，上述導電連接材料為異方向性 導電膠。 在本發明一實施例中，上述核心電路板為電晶體陣列 基板或印刷電路板。 在本發明一實施例中，上述軟性基板具有透光性。 201212733 ‘ 在本發明一實施例中，上述檢測結構的數量為多個， ' 而檢測圖案的數量為多個。這些第一端子位於其中二檢測 結構之間，而這些第二端子位於其中二檢測圖案之間。 在本發明一實施例中，上述第一定位件電性連接第一 檢測墊，而第二定位件電性連接第二檢測墊。下表面暴露 第一定位件，且第一定位件經由導電連接材料而電性連接 第二定位件。 在本發明一實施例中，上述檢測結構更包括至少一輔 • 助定位件。辅助定位件位在第一定位件旁，且不連接第一 定位件。 在本發明一實施例中，上述檢測圖案更包括至少一輔 助定位件，辅助定位件位在第二定位件旁，輔助定位件不 連接第二定位件。 在本發明一實施例中，上述第一定位件與第一檢測墊 電性絕緣，而第二定位件電性連接第二檢測墊。 • 在本發明一實施例中，上述檢測結構更包括一接墊 (pad)，接墊裸露於下表面，並電性連接第一檢測墊。 在本發明一實施例中，上述接墊的形狀實質上為U字 形，且接墊圍繞第一定位件。接墊的二端的延伸方向朝向 第二檢測墊。 在本發明一實施例中，上述第二定位件與第二檢測墊 電性絕緣，而第一定位件電性連接第一檢測墊。 在本發明一實施例中，上述檢測圖案更包括一接墊。 201212733 接塾電性連接第二檢測墊β ,在本發明一實施例中，上述接塾的形狀實質上為υ字 形’且接塾圍繞第二定位件，接塾的二端的延伸方向朝向 第一檢測墊。 基於上述，當第-定位件重疊於第二定位件時，軟式 電路板的第-端子也分別重疊於核心電路板的第二端子， 因此第$位件與第一定位件二者可作為用以讓第一端子 對準第二端子的定位標記。其次，工作人員可從第一檢測 塾與第一檢測塾來檢測電路板模組，以發現第一端子是否 對準第二端子，並且確認是否須要調整壓合機台的參數。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉貫施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1Α是本發明第一實施例之電路板模組在其元件未 結合以前的俯視示意圖’而圖1Β是圖1Α中的電路板模組 參在其元件結合之後的俯視示意圖。請參閱圖1A與圖1B， 電路板模組100包括一軟式電路板110以及一核心電路板 120’其中軟式電路板110連接於核心電路板12〇(如圖1B 所示），並且能與核心電路板120電性導通。 軟式電路板110包括一軟性基板112、多個第一端子 114以及多個檢測結構U6。這些第一端子114與檢測結構 116皆配置在軟性基板中，而這些第一端子114位於其 中二個檢測結構116之間。在第一實施例中，軟式電路板 201212733 no所包括的檢測結構116為多個，但是在其他树 施例中，軟式電路板110所包括的檢測結構ιΐ6可以僅$ -個’所以圖1A與圖1B中的檢測結構ιΐ6 兴 例說明’並非限定本發明。 里僅為舉Production of liquid crystal display products. Body array substrate and flexible circuit: In the process of calibration, first, when the crystal is used, the worker first aligns the terminals of both C. In the position of the alignment board, and inspect the electric day ^ operation of the press machine, adjust whether the soft circuit mark is completely heavy / the combination of the Japanese body board and the flexible circuit board, the press machine: two judgment two Is the terminal aligned? Is the terminal still aligned and the electrical signal between the boards is a flexible circuit board. In the process of performing the 'material array substrate connector array substrate and the flexible circuit, the staff will check the electro-crystal test transistor array substrate again and the second 201212733' can be normally transmitted to further judge the press machine Parameters such as pressure, time, temperature and pressure need to be adjusted to allow the press to perform the press-fit process normally. SUMMARY OF THE INVENTION The present invention provides a circuit board module including a detection structure and a detection pattern having alignment and detection functions. The invention provides a circuit board module comprising a flexible circuit board, a core circuit board and a conductive connecting material. The flexible circuit board includes a flexible substrate, a plurality of first terminals, and at least one detection structure. The flexible substrate has an upper surface and a lower surface opposite to each other. These first terminals and detection structures are disposed in a flexible substrate. The sensing structure includes a first positioning member and a first detecting pad. The upper surface exposes the first test pad and the lower surface exposes the first terminals. The core circuit board includes a substrate, a plurality of second terminals, and at least one detection pattern. The second terminals and the detection patterns are disposed on a plane of the substrate. The detection pattern includes a second positioning member and a second detecting frame. When the Φth locating member overlaps the second locating member, the first terminals overlap the second terminals. A conductive connecting material is connected between the first terminals and the second terminals, and is disposed between the first positioning member and the second positioning member. In an embodiment of the invention, the conductive connecting material is an anisotropic conductive paste. In an embodiment of the invention, the core circuit board is a transistor array substrate or a printed circuit board. In an embodiment of the invention, the flexible substrate has light transmissivity. 201212733 ‘ In one embodiment of the present invention, the number of the above-described detection structures is plural, and the number of detection patterns is plural. The first terminals are located between the two detection structures and the second terminals are located between the two detection patterns. In an embodiment of the invention, the first positioning member is electrically connected to the first detecting pad, and the second positioning member is electrically connected to the second detecting pad. The lower surface exposes the first positioning member, and the first positioning member is electrically connected to the second positioning member via the conductive connecting material. In an embodiment of the invention, the detecting structure further comprises at least one auxiliary positioning member. The auxiliary positioning member is located beside the first positioning member and is not connected to the first positioning member. In an embodiment of the invention, the detecting pattern further includes at least one auxiliary positioning member, the auxiliary positioning member is located beside the second positioning member, and the auxiliary positioning member is not connected to the second positioning member. In an embodiment of the invention, the first positioning member is electrically insulated from the first detecting pad, and the second positioning member is electrically connected to the second detecting pad. In an embodiment of the invention, the detecting structure further includes a pad, the pad is exposed on the lower surface, and electrically connected to the first detecting pad. In an embodiment of the invention, the pad is substantially U-shaped in shape, and the pad surrounds the first positioning member. The two ends of the pads extend in a direction toward the second detecting pad. In an embodiment of the invention, the second positioning member is electrically insulated from the second detecting pad, and the first positioning member is electrically connected to the first detecting pad. In an embodiment of the invention, the detecting pattern further includes a pad. 201212733 is electrically connected to the second detecting pad β. In an embodiment of the invention, the shape of the connecting piece is substantially U-shaped and the connecting piece surrounds the second positioning piece, and the extending direction of the two ends of the connecting piece faces the first direction. Test pad. Based on the above, when the first positioning member is overlapped with the second positioning member, the first terminal of the flexible circuit board is also overlapped with the second terminal of the core circuit board, respectively, so that the $th position member and the first positioning member can be used as A positioning mark for aligning the first terminal with the second terminal. Secondly, the worker can detect the circuit board module from the first detecting port and the first detecting port to find out whether the first terminal is aligned with the second terminal, and confirm whether the parameters of the pressing machine table need to be adjusted. The above features and advantages of the present invention will become more apparent and understood from the appended claims. 1 is a top plan view of a circuit board module according to a first embodiment of the present invention before its components are uncoupled. FIG. 1 is a top plan view of the circuit board module of FIG. 1 after its components are combined. Referring to FIG. 1A and FIG. 1B, the circuit board module 100 includes a flexible circuit board 110 and a core circuit board 120'. The flexible circuit board 110 is connected to the core circuit board 12 (shown in FIG. 1B) and can be combined with the core. The circuit board 120 is electrically conductive. The flexible circuit board 110 includes a flexible substrate 112, a plurality of first terminals 114, and a plurality of detecting structures U6. The first terminal 114 and the detecting structure 116 are disposed in the flexible substrate, and the first terminals 114 are located between the two detecting structures 116. In the first embodiment, the flexible circuit board 201212733 no includes a plurality of detecting structures 116, but in other tree embodiments, the detecting structure ι6 included in the flexible circuit board 110 may be only $-a' so that FIG. 1A and FIG. The detection structure ιΐ6 in Fig. 1B is illustrative of 'not limiting the invention. Just for
軟性基板112 Μ具有透紐，㈣成㈣基板112 的材料例如是聚酿亞胺（p〇lyimide，pi)等高分子材料。這 裡所謂的透光性意指軟性基板112能被波長位在可見 圍内的光線所穿透，例如軟性基板112可以僅讓紅光、綠 光或黃光所穿透；或者軟性基板112可以是透明的。因此， 從外觀來看’軟性基板112可以是有顏色或是透明無色。 各個檢測結構116包括一第一檢測墊 116a與一第一定 位件116b。第一定位件U6b電性連接第一檢測墊丨他， 例如檢測結構116可更包括一接線116c，而接線U6c連接 於第一檢測墊116a與第一定位件116b之間，以使第一定 位件116b得以電性連接第一檢測墊u6a。不過，在其他實 施例中，第一檢測墊l16a也可直接連接第一定位件116b， 而不需要接線116c來間接電性連接第一定位件U6b。 核心電路板12〇包括一基板122、多個第二端子124 以及多個檢測圖案126,而這些第二端子124以及檢測圖 案126.皆配置在基板122的一平面S1上，其中這些第二端 子124位於其中二個檢測圖案126之間。此外，核心電路 板120可以是電晶體陣列基板或印刷電路板（printed Circuit Board, PCB )，其中電晶體陣列基板例如是應用於液 IS3 8 201212733 晶顯示器的薄膜電晶體（Thin-Film Transistor，TFT )陣列 基板’而印刷電路板例如是硬式電路板。 這些檢測圖案126分別電性連接這些檢測結構116, 所以各個檢測圖案126會對應其中一個檢測結構116，且 檢測圖案126與檢測結構116二者的數量可以相等。由於 軟式電路板110所包括的檢測結構116可以僅為一個，因 此’在其他實施例中，核心電路板12〇所包括的檢測圖案 126也可以僅為一個。所以，圖ία與圖1B中的檢測圖案 126的數量僅為舉例說明，並非限定本發明。 各個檢測圖案126包括一第二定位件126b與一第二檢 測墊126a’而第二定位件126b電性連接第二檢測墊i26a。 舉例而言’檢測圖案126可更包括一接線126c,而接線126c 連接於第二檢測墊126a與第二定位件126b之間，以使第 二定位件126b電性連接第二檢測墊126a。不過，在其他 實施例中，第二檢測墊1263可直接連接第二定位件126b， 而不需要接線126c來間接電性連接第二定位件126b。 圖1C為圖1B中沿線w剖面而成的剖面示意圖。請 參閱圖1B與圖1C，軟性基板112具有彼此相對的一上表 面112a與一下表面U2b，其中上表面n2a暴露這些第一 檢測墊116a，而下表面112b暴露這些第一定位件⑽。 在軟式電路板110與核心電路板120結合之後，第一定位 件U6b能電性連接第二定位件126b。 詳細而言，電路板模組1〇〇更包括一導電連接材料 ί S3 9 201212733 130而導電連接材料13〇連接於軟式電路板與核心電 '路板120之間’並且配置在第—定位件116b與第二定位件 126b之間。導電連接材料130例如是異方向性導電膠或其 他導電高分子材料，而這些第一定位件驗能經由導電連 接材料130而電性連接這些第二定位件12补。 當導電連接材料13〇為異方向性導電膠時，導電連接 材料130包括多顆導電粒子132以及一黏著體（碰以㈣ _ 134 ’其中這些導電粒子132分布在黏著體i34中，且黏著 體134可為絕緣體。此外，|電連接材料㈣可以經過壓 3 "IL程而黏合在軟式電路板11〇與核心電路板之間。 虽進行上述壓合流程時，這些導電連接材料130會被 軟式電路板11〇與核心電路板12〇所壓迫，以至於一些導 電粒子132會接觸軟式電路板11〇與核心電路板工。當 這些第一定位件l16b分別重疊於這些第二定位件126b 時些導電粒子132能同時接觸第一定位件丨16b與第二 籲定位件mb ’讓第一定位件110b與第二定位件mb電性 導通。如此，這些第一定位件116b能經由導電連接材料 130中的導電粒子132而電性連接這些第二定位件12仍。 由於第一定位件116b電性連接第一檢測墊U6a，而第 二定位件126b電性連接第二檢測墊126a，因此，當第一 定位件116b經由導電連接材料130而電性連接第二定位件 126b時’這些第—檢測塾n 6a也會分別電性連接這些第二 檢測墊126a。也就是說，各個第一檢測墊U6a能與其所對 201212733 應的第二檢測墊126a電性導通。 S 1D為圖1B中沿線ιυ剖面而成的剖面示意圖。請 參閱圖1B與圖1D，軟性基板112的下表面丨丨沘暴露這些 第鈿子114’而在軟式電路板110與核心電路板120結合 之後’導電連接材料130連接於這些第一端子114與這些 第一端子I24之間’讓第一端子能透過導電連接材料 130中的導電粒子132而電性連接第二端子124。 詳細而言，當這些第一定位件U6b分別重疊於這些第 一疋位件126b時，這些第一端子114也會重疊於這些第二 翊子124 ’如圖1B與圖id所示。如此，在進衧壓合流程 之後，藉由導電連接材料13G，不僅這些第—定位件U6b 能分別與第二定位件126b電性連接，同時這些第一端子 114也能分別與第二端子124電性連接。 由此可知，工作人員能根據第一定位件116b與第二定 位件126b的重疊，讓這些第一端子114分別對準這些第二 端子124 ’以使第一端+ 114能經由導電連接材料13〇而 電性連接第一端子124。因此，第一定位件116b與第二定 位件126b二者可以作為用以讓這些第一端子114分別對準 這些第二端子124的定位標記，進而幫助工作人員判斷第 一端子114是否對準第二端子124。 此外，當這些第一定位件116b分別重疊於這些第二定 位件126b時，第一定位件n6b能透過導電連接材料ι3〇 而電性連接第二定位件126b，以至於各個第一檢測墊n6a [S3 11 201212733 能與其所對應的第二檢測墊126a電性導通。m ▼喝囚此，在進行 壓，流程中，可同時量測各個第一檢測* 116&與其所對應 的第一檢測墊126a之間的電阻值，即時私 ' 町士現第一端子114 是否對準第二端子124，並且根據此電阻值，立即確認是 否須要調整壓合機台的參數，例如壓合時間、、i疋 /皿度及壓力。 具體而言’當量測各個第—檢測塾叫與其所對應的 第二檢測塾126a之間的電阻值時，若各個第—檢測塾· 與其所對應的第二檢測墊126a電性導通，則矣一故 贏 ⑴表不第一端子 1M對準第二端子124’且壓合機台的參數整體上不須要作 調整；反之，若各個第-檢測塾116a與其所對應的第二檢 測墊126a並沒有電性導通，則表示第一端子ιΐ4可能沒有 對準第二端子124，或是壓合機台的參數須要作調整。 值得一提的是，從圖1A與圖1B來看，就外觀而言， 第一定位件116b與第二定位件126b二者的形狀實質上皆 為圓形，但在其他實施例中，第一定位件U6b與第二定位 • 件1261)二者的形狀實質上也可為矩形、三角形或星形等形 狀，因此圖1A與圖1B所示的第一定位件n6b與第二定 位件126b 一者的形狀僅為舉例說明，並非限定本發明。 圖2A是本發明第二實施例之電路板模組在其元件未 結合以前的俯視示意圖’而圖2B是圖2A中的電路板模組 在其元件結合之後的俯視示意圖。請參閱圖2A與圖2B， 本實施例的電路板模組200包括一軟式電路板210與一核 心電路板220,而軟式電路板210與核心電路板220結合。 12 201212733 軟式電路板210包括一軟性基板112、多個第一端子H4 以及至少一個松碉結構216，而核心電路板22〇包括一基 板122、多個第〜端子124與至少一個檢測圖案226。 本實施例的電路板模組2〇〇與第一實施例的電路板模 組100相似，但是二者的差異在於：就結構而言，檢測結 構216不同於楦剛結構116，而檢測圖案226不同於檢測 圖案126。為使電路板模組2〇〇的說明内容簡潔，以下僅 介紹檢測結構216與檢測圖案226二者的技術特徵。 • 在第二實施例中’各個檢測結構216包括一第一檢測 墊116a、一接線116c、一第一定位件216b與多個輔助定 位件216d，而各個檢測圖案226包括一第二檢測墊126a、 一接線126c、一第二定位件226b與多個輔助定位件226d， 其中第一定位件216b與第二定位件226b大體上分別相同 於第一實施例中的第一定位件116b與第二定位件126b， 惟'一者差異僅在於形狀的不同。從外觀來看，第一定位件 • 216b與第二定位件226b二者的形狀實質上皆為矩形。 第一檢測墊116a、接線116c與第一定位件216b三者 的配置關係與第一實施例的檢測結構116相同，而第二檢 測墊126a、接線126c與第二定位件226b三者的配置關係 也與第一實施例的檢測圖案126相同，因此以下不再重複 介紹檢測結構216與檢測圖案226二者的元件配置關係。 在同一個檢測結構216中，各個辅助定位件216d位在 其中一個第一定位件216b旁，並且不連接第一定位件 m 13 201212733 216b’而各個第一定位件216b可以位在相鄰二個辅助定位 件216d之間。相似於檢測結構216,在同一個檢測圖案226 中，辅助定位件226d配置在基板122的平面S1上，而各 個輔助定位件226d位在其中一個第二定位件226b旁，並 且不連接這些第二定位件226b，其中各個第二定位件226b 可位在相鄰二個辅助定位件226d之間。 另外，在本實施例中，二個輔助定位件216d與一個第 籲 疋位件216b可結合成一個位於軟式電路板21〇的十字型 疋位钛忑’而二個輔助定位件226d與一個第二定位件22仍 可結合成另一個位於核心電路板220的十字型定位標記， 如圖2八所示。當位於軟式電路板21〇的十字型定位標記 與位於核心電路板22〇的十字型定位標記重疊時，這些第 端子114也會重疊於這些第二端子124，如圖2B所示。 ^圖2c為圖2B中沿線m_m剖面而成的剖面示意圖。 月二閱圖2B與圖2C，電路板模組2〇〇更包括一導電連接 φ材料U〇 ’且導電連接材料⑽連接於軟式電路板MO與 核心電路板220之間。 由於各個輔助定位件2l6d不連接第一定位件216b， 各，辅助定位件226d不連接這些第二定位件遍，即輔 助疋位件2l6d與第-定位件216b電性絕緣，輔助定位件 226d與第二定位件22补電性絕緣，因此即使輔助定位件 電11連接輔助定位件226d，第一定位件21处並不會 從輔助定位件216d、226d而電性連接第二定位件22訃。 ί S3 14 201212733 ’ 在第二實施例中，檢測結構216與檢測圖案226二者 • 的作用、功效及優點皆與第一實施例相同，即工作人員利 用檢測結構216與檢測圖案226來判斷第一端子114是否 對準第二端子124 ’並續認是否須要調整壓合機台泉數的 方式皆與第一實施例相同，故不再重複贅述。 圖3A是本發明第三實施例之電路板模組在其元件未 結合以前的俯視示意圖，圖3B是圖3A中的電路板模組在 其元件結合之後的俯視示意圖。請參閱圖3 A與圖3B，第 籲三實施例的電路板模組400包括一軟式電路板41〇與一核 心電路板120 ’且軟式電路板410與核心電路板120結合。 電路板模組400與第一實施例的電路板模組丨〇〇相 似，二者都包括核心電路板12〇，惟二者的差異在於：軟 式電路板410不同於軟式電路板11〇。為了使電路板模組 400的說明内容簡潔，以下僅介紹軟式電路板41〇不同於 第一實施例的技術特徵，不再重複介紹核心電路板120。 • 軟式電路板410包括一軟性基板112、多個第一端子 114以及一個或多個檢測結構416,而這些第一端子114與 檢測結構416皆配置在軟性基板112中，其中軟性基板 112、第一端子114與檢測結構416三者的配置關係與第一 實施例的軟式電路板110相同，故不再重複贅述。 各個檢測結構416包括一第一檢測墊116a、一接線 116c、一第—定位件416b以及一接墊416心在同一個檢測 結構416中，接墊416d電性連接第一檢測墊n6a，例如接 15 201212733 線116c可以連接於第一檢測塾U6a與接塾侧之間，以 使接塾416d電性連接第—檢測塾U6a。不過，在其他實施 例中，第-檢測塾116a可直接連接於接塾伽，而不需要 接線116c來間接電性連接於接墊416d。 在第三實施例中’這些接墊416d的形狀實質上為u 子幵/且接墊416d的二端的延伸方向是朝向第二檢測墊 126a。也就是說，這些u字形接塾侧的缺口皆朝向對面 的第二檢測塾126a，如圖3A與圖3B所示。此外，各個接 塾篇圍繞其中一個第—定位件獅，但是這些接塾416d 皆不連接任何第-定位件416b，即這些第一定位件杨 與這些第一檢測塾ll6a電性絕緣。 圖3C為圖3B中沿線ν·ν剖面而成的剖面示意圖。請 參閱圖3Β與圖3C，電路板模組4〇〇更包括一導電連接材 料13〇 ’而導電連接材料u〇連接於軟式電路板彻與核 心電路板120之間。這些接塾侧皆裸露於軟性基板ιΐ2 的下表面112b，導電連接材料13()黏著於這些接塾 當这些第一定位件416b分別重疊於這些第二定位件 126b時，這些第-端子114也會重疊於這些第二端子124 (如圖3A與圖3B所示），而第一定位件416b能透過導電 連接材料130中的導電粒子132而電性連接第二定位件 126b。由於第-定位件4l6b與第一檢測塾驗電性絕緣， 而第二定位件126b電性連接第二檢測墊12如，因此即使 第-定位件416b電性連接第二定位件·，第一檢測塾 { S3 16 201212733 • 116a與第二檢測墊126a不一定會電性導通。 田這二第疋位件416b分別重疊於這些第二定位件 126b時’在正常的情況下，這些接塾·並不會重疊於 這些第二定位件126b。除非第—定位件_與第二定位 件126b 一者之間的相對位置嚴重偏移，以至於這些第一端 子114完全沒對準這些第二端子124。 此時，至少一個接墊416d會與其中一個第二定位件 126b重疊，並透過導電連接材料13〇而電性連接第二定位 •件126b。由於接墊416d電性連接第一檢測墊U6a，因此， 一旦接墊416d與第二定位件126b重疊的話，則接墊“以 會透過導電連接材料130而電性連接第二定位件12牝，以 至於第一仏測墊116a會與第二檢測墊126a電性導通。 由此可知，在進行壓合流程中，工作人員可以量測各 個苐一檢測墊116a與其所對應的第二檢測塾丨26a之間的 電阻值，以判斷第一端子114是否對準第二端子124。若 Φ 根據上述電阻值而發現第一檢測墊116a與第二檢測墊 126a電性導通的話，表示第一端子114完全沒有對準第二 端子124。此時，工作人員須要調整壓合機台，以修正軟 式電路板410與核心電路板120之間的相對位置，促使在 下次壓合流程中，第一端子114能對準第二端子124。 圖4A是本發明第四實施例之電路板模組在其元件未 結合以前的俯視示意圖，圖4B是圖4 A中的電路板模組在 其元件結合之後的俯視示意圖。請參閱圖4A與圖4B，第 m 17 201212733 四實施例的電路板模組500包括一軟式電路板11 〇與一核 心電路板520’而軟式電路板Π0與核心電路板520結合。 承上述，電路板模組500與第一實施例的電路板模組 100相似，二者都包括軟式電路板11〇，惟二者的差異在 於.核心電路板520不同於第一實施例的核心電路板12〇。 為了使電路板模組500的說明内容簡潔，以下僅介紹核心 電路板520不同於第一實施例的技術特徵。至於軟式電路 板110，則不再重複贅述。 ® 核心電路板520包括一基板122、多個第二端子124 以及一個或多個檢測圖案526，而這些第二端子丨24與檢 測圖案526皆配置在基板122的平面§1上，其中基板122、 第二端子124及檢測圖案526三者的配置關係與第一實施 例的核心電路板120相同，所以不再重複贅述。 各個檢測圖案526包括一第二檢測墊丨2如、一接線 126c、一第二定位件526b以及一接墊526d。在同一個檢 φ測圖案526中，接墊526d電性連接第二檢測墊126a，例 如接線126c可連接於第二檢測墊126a與接墊526d之間， 以使接墊526d電性連接第二檢測墊126a。不過，在其他 貫施例中’第二檢測塾126a可以直接連接於接塾526d， 而不需要接線126c來間接電性連接於接墊526d。 在第四實施例中，這些接墊526d的形狀實質上為u 字形，且接墊526d的二端的延伸方向是朝向第一檢測墊 116a。也就是說，這些u字形的接墊526d的缺口皆朝向對 18 201212733 面的第-檢測塾116a ’如圖4A與圖4B所示。此外，各個 接墊526d圍繞其中一個第二定位件伽，但是這些接塾 526d白不連接任何第二定位件5挪，即這些第二定位件 526b與這些第二檢測墊126a電性絕緣。 圖4C為圖4B中沿線VI_VI剖面而成的剖面示意圖。 請參閱® 4Β與圖4C，電路板模組5〇〇更包括一導電連接 材料130，而導電連接材料13〇連接於軟式電路板ιι〇與 _^核心電路板520之間，並黏著於這些接墊526d。 虽這些第一定位件U6b分別重疊於這些第二定位件 526b日守，這些第一端子114也會重疊於這些第二端子 (如圖4A與圖4B所示）’而第一定位件U6b能透過導電 連接材料130中的導電粒子132而電性連接第二定位件 526b。由於第二定位件526b與第二檢測墊12以電性絕緣， 而第-定位件116b電性連接第一檢測塾，因此即使第 定位件116b電性連接第二定位件526卜第一檢測墊116& 鲁會與第二檢測塾126a不-定會電性導通。 虽這些第一定位件116b分別重疊於這些第二定位件 526b時，在正常的情況下，這些第一定位件祕並不會 重疊於這些接墊526d。除非第一定位件服與第二定位 件526b二者之間的相對位置嚴重偏移，以至於這些第一端 子114完全沒對準這些第二端子124。 此時，至少-個接墊526d會與其中一個第一定位件 116b重$ ’並透過導電連接材料13()而電性連接第一定位 I S3 19 201212733 件116b。由於接墊526d電性連接第二檢測墊126a，因此， 一旦接墊526d與第一定位件1161)重疊的話，則接墊％“ 會透過導電連接材料130而電性連接第一定位件丨丨6b，以 至於第一檢測墊116a會與第二檢測墊126a電性導通。 由此可知，在進行壓合流程中，工作人員可以量測各 個第一檢測墊116a與其所對應的第二檢測墊126a之間的 電阻值，以判斷第一端子114是否對準第二端子124。在 鲁第四實施例中，工作人員利用上述電阻值來判斷這些第一 端子114是否對準這些第二端子124的方式與第三實施例 相同’故不再重複贅述。 綜上所述’當第一定位件重疊於第二定位件時，軟式 電路板的第一端子也分別重疊於核心電路板的第二端子， 因此第一定位件與第二定位件二者可作為用以讓第一端子 對準第二端子的定位標記，而工作人員能根據第一定位件 與第二定位件的重疊，來判斷第一端子是否對準第二端子。 鲁 其次，在壓合流程中，不論是第一定位件與第一檢測 墊電性絕緣，第二定位件與第二檢測墊電性連接；或者是， 弟一疋位件與第二檢測塾電性絕緣’第一定位件與第一檢 測塾電性連接，工作人員可以從第一檢測塾與第二檢測墊 之間的電阻值即時發現第一端子是否對準第二端子，並且 立即確認是否須要調整壓合機台的參數。 再者，當第一定位件與第一檢測墊電性連接，而第二 定位件與第二檢測墊電性連接時，在電路板模組完成後， 20 201212733 • 可利用三用電表等量測機台來量測第一檢測墊與第二檢測 • 墊之間的電阻值，以檢查完成後的電路板模組，其第一端 子是否正確地電性連接第二端子。藉此，工作人員能確認 壓合機台是否正常運作，以調整或維修異常的壓合機台， 減少需要重工（rework )或報廢的電路板模組的數量。 另外，當量測第一檢測墊與第二檢測墊之間的電阻值 時，量測機台可以只使用二根探針（probe )來進行量測， 因此量測機台不需要使用多根探針，即能檢測電路板模 • 組。由於量測機台可以只使用二根探針來進行量測，因此 只要這二根探針之間的距離能調整的話，量測機台可以量 測各種不同規格的電路板模組。如此，不同規格的電路板 模組可以共用一台量測機台。 雖然本發明以前述實施例揭露如上，然其並非用以限 定本發明，任何熟習相像技藝者，在不脫離本發明之精神 和範圍内，所作更動與潤飾之等效替換，仍為本發明之專 φ 利保護範圍内。 ί S3 21 201212733 ' 【圖式簡單說明】 ' 圖1A是本發明第一實施例之電路板模組在其元件未結合 以前的俯視示意圖。 圖1B是圖1A中的電路板模組在其元件結合之後的俯視示 意圖。 圖1C為圖1B中沿線I-Ι剖面而成的剖面示意圖。 圖1D為圖1B中沿線II-II剖面而成的剖面示意圖。 圖2A是本發明第二實施例之電路板模組在其元件未結合 _ 以如的俯視不意圖。 圖2B是圖2A中的電路板模組在其元件結合之後的俯視示 意圖。 圖2C為圖2B中沿線III-III剖面而成的剖面示意圖。 圖3A是本發明第三實施例之電路板模組在其元件未結合 以前的俯視示意圖。 圖3B是圖3A中的電路板模組在其元件結合之後的俯視示 φ 意圖。 圖3C為圖3B中沿線V-V剖面而成的剖面示意圖。 圖4A是本發明第四實施例之電路板模組在其元件未結合 以前的俯視示意圖。 圖4B是圖4A中的電路板模組在其元件結合之後的俯視示 意圖。 圖4C為圖4B中沿線VI-VI剖面而成的剖面示意圖。 22 201212733 【主要元件符號說明】 100 、 200 、 400 、 500 110 、 210 、 410 112 112a 112b 114 116 、 216 、 416The flexible substrate 112 has a transparent layer, and the material of the (four) to (four) substrate 112 is, for example, a polymer material such as polyacrylonitrile (pi). The term "transparent" as used herein means that the flexible substrate 112 can be penetrated by light having a wavelength in the visible periphery. For example, the flexible substrate 112 can only penetrate red, green or yellow light; or the flexible substrate 112 can be transparent. Therefore, the flexible substrate 112 may be colored or transparent and colorless in terms of appearance. Each of the detecting structures 116 includes a first detecting pad 116a and a first positioning member 116b. The first positioning member U6b is electrically connected to the first detecting pad. For example, the detecting structure 116 may further include a wire 116c, and the wire U6c is connected between the first detecting pad 116a and the first positioning member 116b to make the first positioning. The piece 116b is electrically connected to the first detecting pad u6a. However, in other embodiments, the first detecting pad 16a can also be directly connected to the first positioning member 116b without the wire 116c being indirectly electrically connected to the first positioning member U6b. The core circuit board 12 includes a substrate 122, a plurality of second terminals 124, and a plurality of detection patterns 126. The second terminals 124 and the detection patterns 126 are disposed on a plane S1 of the substrate 122, wherein the second terminals 124 is located between two of the detection patterns 126. In addition, the core circuit board 120 may be a transistor array substrate or a printed circuit board (PCB), wherein the transistor array substrate is, for example, a thin film transistor (Thin-Film Transistor, TFT) applied to a liquid IS3 8 201212733 crystal display. The array substrate 'and the printed circuit board is, for example, a hard circuit board. The detection patterns 126 are electrically connected to the detection structures 116, respectively, so that each of the detection patterns 126 corresponds to one of the detection structures 116, and the number of the detection patterns 126 and the detection structures 116 may be equal. Since the flexible circuit board 110 can include only one detection structure 116, in other embodiments, the core circuit board 12 can include only one detection pattern 126. Therefore, the number of the detection patterns 126 in Fig. 1B and Fig. 1B are merely illustrative and are not intended to limit the invention. Each of the detection patterns 126 includes a second positioning member 126b and a second detecting pad 126a', and the second positioning member 126b is electrically connected to the second detecting pad i26a. For example, the detection pattern 126 may further include a wire 126c, and the wire 126c is connected between the second detection pad 126a and the second positioning member 126b, so that the second positioning member 126b is electrically connected to the second detection pad 126a. However, in other embodiments, the second detecting pad 1263 can be directly connected to the second positioning member 126b without the wire 126c being indirectly electrically connected to the second positioning member 126b. 1C is a schematic cross-sectional view taken along line w of FIG. 1B. Referring to FIG. 1B and FIG. 1C, the flexible substrate 112 has an upper surface 112a and a lower surface U2b opposite to each other, wherein the upper surface n2a exposes the first detecting pads 116a, and the lower surface 112b exposes the first positioning members (10). After the flexible circuit board 110 is combined with the core circuit board 120, the first positioning member U6b can be electrically connected to the second positioning member 126b. In detail, the circuit board module 1 further includes a conductive connecting material ί S3 9 201212733 130 and the conductive connecting material 13 〇 is connected between the flexible circuit board and the core electric circuit board 120 and is disposed in the first positioning member Between 116b and the second positioning member 126b. The conductive connecting material 130 is, for example, an isotropic conductive paste or other conductive polymer material, and the first positioning members are electrically connected to the second positioning members 12 via the conductive connecting material 130. When the conductive connecting material 13 is an anisotropic conductive paste, the conductive connecting material 130 includes a plurality of conductive particles 132 and an adhesive body (in contact with (4) _ 134 ', wherein the conductive particles 132 are distributed in the adhesive body i34, and the adhesive body 134 may be an insulator. In addition, the electrical connection material (4) may be bonded between the flexible circuit board 11A and the core circuit board by pressing the 3 "IL process. Although the above-mentioned pressing process is performed, these conductive connecting materials 130 are The flexible circuit board 11 is pressed against the core circuit board 12 so that some of the conductive particles 132 contact the flexible circuit board 11 and the core circuit board. When the first positioning members 16b overlap the second positioning members 126b, respectively. The conductive particles 132 can simultaneously contact the first positioning member 16b and the second positioning member mb' to electrically connect the first positioning member 110b and the second positioning member mb. Thus, the first positioning members 116b can pass through the conductive connecting material. The conductive particles 132 in the 130 are electrically connected to the second positioning members 12. The first positioning member 116b is electrically connected to the first detecting pad U6a, and the second positioning member 126b is electrically connected to the second portion. The pads 126a, therefore, when the first positioning member 116b is electrically connected to the second positioning member 126b via the conductive connecting material 130, the first detecting electrodes 6a are also electrically connected to the second detecting pads 126a, that is, Each of the first detecting pads U6a can be electrically connected to the second detecting pad 126a corresponding to the 201212733. S 1D is a cross-sectional view taken along line ι of FIG. 1B. Referring to FIG. 1B and FIG. 1D, the flexible substrate 112 The lower surface 丨丨沘 exposes the first dice 114' and after the flexible circuit board 110 is bonded to the core circuit board 120, the conductive connection material 130 is connected between the first terminals 114 and the first terminals I24. The terminal can be electrically connected to the second terminal 124 through the conductive particles 132 in the conductive connecting material 130. In detail, when the first positioning members U6b are respectively overlapped with the first clamping members 126b, the first terminals 114 are also It will overlap with these second dice 124' as shown in FIG. 1B and FIG. id. Thus, after the squeezing process, not only the first positioning members U6b but also the second positioning members can be respectively used by the conductive connecting material 13G. 12 6b is electrically connected, and the first terminals 114 can also be electrically connected to the second terminals 124. It can be seen that the worker can make the first terminals according to the overlap of the first positioning member 116b and the second positioning member 126b. 114 aligning the second terminals 124 ′ respectively to enable the first end + 114 to be electrically connected to the first terminal 124 via the conductive connecting material 13 。. Therefore, both the first positioning member 116 b and the second positioning member 126 b can serve as The positioning marks for aligning the first terminals 114 with the second terminals 124 respectively help the staff to determine whether the first terminals 114 are aligned with the second terminals 124. In addition, when the first positioning members 116b are respectively overlapped with the second positioning members 126b, the first positioning members n6b can be electrically connected to the second positioning members 126b through the conductive connecting material ι3, so that the first detecting pads n6a are respectively [S3 11 201212733 can be electrically connected to the corresponding second detection pad 126a. m ▼Drinking this, in the process of pressure, in the process, the resistance value between each first detection * 116 & the corresponding first detection pad 126a can be measured at the same time, whether the first terminal 114 of the town is now The second terminal 124 is aligned, and based on the resistance value, it is immediately confirmed whether it is necessary to adjust parameters of the press table, such as press time, i疋/dish and pressure. Specifically, when the resistance value between each of the 'equivalent measurement-detection squeaks and the corresponding second detection 塾 126a is detected, if each of the first detection 塾· is electrically connected to the corresponding second detection pad 126a, then The first win 1 (1) indicates that the first terminal 1M is aligned with the second terminal 124' and the parameters of the press machine do not need to be adjusted as a whole; conversely, if each of the first detecting strips 116a and the corresponding second detecting pad 126a thereof If there is no electrical conduction, it means that the first terminal ιΐ4 may not be aligned with the second terminal 124, or the parameters of the pressing machine need to be adjusted. It should be noted that, as seen from FIG. 1A and FIG. 1B, in terms of appearance, both the first positioning member 116b and the second positioning member 126b are substantially circular in shape, but in other embodiments, The shape of both the positioning member U6b and the second positioning member 1261) may be substantially rectangular, triangular or star-shaped, and thus the first positioning member n6b and the second positioning member 126b shown in FIGS. 1A and 1B. The shape of one is merely illustrative and is not intended to limit the invention. Fig. 2A is a top plan view of the circuit board module of the second embodiment of the present invention before its components are unbonded. Fig. 2B is a top plan view of the circuit board module of Fig. 2A after its components are combined. Referring to FIG. 2A and FIG. 2B, the circuit board module 200 of the present embodiment includes a flexible circuit board 210 and a core circuit board 220, and the flexible circuit board 210 is combined with the core circuit board 220. 12 201212733 The flexible circuit board 210 includes a flexible substrate 112, a plurality of first terminals H4, and at least one loose structure 216, and the core circuit board 22 includes a substrate 122, a plurality of first terminals 124 and at least one detection pattern 226. The circuit board module 2 of the present embodiment is similar to the circuit board module 100 of the first embodiment, but the difference between the two is that, in terms of structure, the detecting structure 216 is different from the 楦 structure 116, and the detecting pattern 226 It is different from the detection pattern 126. In order to simplify the description of the circuit board module 2, only the technical features of the detecting structure 216 and the detecting pattern 226 will be described below. In the second embodiment, each of the detecting structures 216 includes a first detecting pad 116a, a wire 116c, a first positioning member 216b and a plurality of auxiliary positioning members 216d, and each detecting pattern 226 includes a second detecting pad 126a. a wire 126c, a second positioning member 226b and a plurality of auxiliary positioning members 226d, wherein the first positioning member 216b and the second positioning member 226b are substantially identical to the first positioning member 116b and the second in the first embodiment, respectively. The positioning member 126b, only one difference is only in the shape. The shape of both the first positioning member 216b and the second positioning member 226b is substantially rectangular in appearance. The arrangement relationship between the first detecting pad 116a, the wiring 116c and the first positioning member 216b is the same as that of the detecting structure 116 of the first embodiment, and the arrangement relationship of the second detecting pad 126a, the wiring 126c and the second positioning member 226b Also similar to the detection pattern 126 of the first embodiment, the component arrangement relationship of both the detection structure 216 and the detection pattern 226 will not be repeatedly described below. In the same detecting structure 216, each auxiliary positioning member 216d is located beside one of the first positioning members 216b, and is not connected to the first positioning member m 13 201212733 216b' and each of the first positioning members 216b can be positioned adjacent to the two Between the auxiliary positioning members 216d. Similar to the detecting structure 216, in the same detecting pattern 226, the auxiliary positioning member 226d is disposed on the plane S1 of the substrate 122, and each of the auxiliary positioning members 226d is located beside one of the second positioning members 226b, and the second is not connected. The positioning member 226b, wherein each of the second positioning members 226b can be positioned between the adjacent two auxiliary positioning members 226d. In addition, in the embodiment, the two auxiliary positioning members 216d and one of the first position clamping members 216b can be combined into a cross-type clamping titanium 忑 ' on the flexible circuit board 21 而 and two auxiliary positioning members 226d and one The two positioning members 22 can still be combined into another cross-shaped positioning mark on the core circuit board 220, as shown in FIG. When the cross-shaped positioning marks on the flexible circuit board 21 are overlapped with the cross-shaped positioning marks on the core circuit board 22, these first terminals 114 are also overlapped with the second terminals 124 as shown in Fig. 2B. ^ Figure 2c is a schematic cross-sectional view taken along line m_m in Figure 2B. Referring to FIG. 2B and FIG. 2C, the circuit board module 2 further includes a conductive connection φ material U 〇 ' and the conductive connection material (10) is connected between the flexible circuit board MO and the core circuit board 220. Since the auxiliary positioning members 216d are not connected to the first positioning members 216b, the auxiliary positioning members 226d are not connected to the second positioning members, that is, the auxiliary clamping members 216d are electrically insulated from the first positioning members 216b, and the auxiliary positioning members 226d are The second positioning member 22 is electrically insulated, so that even if the auxiliary positioning member 11 is connected to the auxiliary positioning member 226d, the first positioning member 21 is not electrically connected to the second positioning member 22 from the auxiliary positioning members 216d and 226d. S S3 14 201212733 ' In the second embodiment, the functions, functions, and advantages of both the detecting structure 216 and the detecting pattern 226 are the same as those of the first embodiment, that is, the worker uses the detecting structure 216 and the detecting pattern 226 to determine the first Whether the one terminal 114 is aligned with the second terminal 124' and the need to renew the number of the springs of the press machine is the same as that of the first embodiment, and thus the description thereof will not be repeated. 3A is a top plan view of a circuit board module according to a third embodiment of the present invention before its components are unbonded, and FIG. 3B is a top plan view of the circuit board module of FIG. 3A after its components are combined. Referring to FIG. 3A and FIG. 3B, the circuit board module 400 of the third embodiment includes a flexible circuit board 41A and a core circuit board 120', and the flexible circuit board 410 is combined with the core circuit board 120. The circuit board module 400 is similar to the circuit board module of the first embodiment, both of which include the core circuit board 12A, except that the difference is that the flexible circuit board 410 is different from the flexible circuit board 11A. In order to simplify the description of the circuit board module 400, only the flexible circuit board 41 is different from the technical features of the first embodiment, and the core circuit board 120 will not be repeatedly described. The flexible circuit board 410 includes a flexible substrate 112, a plurality of first terminals 114, and one or more detecting structures 416. The first terminals 114 and the detecting structures 416 are disposed in the flexible substrate 112, wherein the flexible substrate 112, the first The arrangement relationship between the one terminal 114 and the detecting structure 416 is the same as that of the flexible circuit board 110 of the first embodiment, and thus the description thereof will not be repeated. Each of the detecting structures 416 includes a first detecting pad 116a, a wire 116c, a first positioning member 416b, and a pad 416 in the same detecting structure 416. The pad 416d is electrically connected to the first detecting pad n6a, for example, 15 201212733 The line 116c can be connected between the first detecting port U6a and the connecting side, so that the port 416d is electrically connected to the first detecting unit U6a. However, in other embodiments, the first detecting port 116a can be directly connected to the connecting sag, without the need for the wiring 116c to be indirectly electrically connected to the pad 416d. In the third embodiment, the shape of these pads 416d is substantially u 幵 / and the two ends of the pads 416d extend in a direction toward the second detecting pad 126a. That is to say, the notches on the sides of the U-shaped sides are all facing the opposite second detecting turns 126a as shown in Figs. 3A and 3B. In addition, each of the joints surrounds one of the first positioning lions, but none of the joints 416d are connected to any of the first positioning members 416b, that is, the first positioning members YANG are electrically insulated from the first detecting electrodes ll6a. Fig. 3C is a schematic cross-sectional view taken along line ν·ν in Fig. 3B. Referring to FIG. 3A and FIG. 3C, the circuit board module 4A further includes a conductive connecting material 13'' and the conductive connecting material u' is connected between the flexible circuit board and the core circuit board 120. The contact sides are exposed on the lower surface 112b of the flexible substrate ι2, and the conductive connecting material 13() is adhered to the contacts. When the first positioning members 416b are respectively overlapped with the second positioning members 126b, the first terminals 114 are also The first positioning member 416b can be electrically connected to the second positioning member 126b through the conductive particles 132 in the conductive connecting material 130. The second positioning member 126b is electrically connected to the second detecting pad 12, for example, so that the first positioning member 416b is electrically connected to the second positioning member. The detection 塾{S3 16 201212733 • 116a and the second detection pad 126a are not necessarily electrically conductive. When the two second clamping members 416b are respectively overlapped with the second positioning members 126b, in the normal case, the interfaces do not overlap the second positioning members 126b. Unless the relative positions between the first locator _ and the second locator 126b are severely offset, the first terminals 114 are completely out of alignment with the second terminals 124. At this time, the at least one pad 416d overlaps with one of the second positioning members 126b and is electrically connected to the second positioning member 126b through the conductive connecting material 13〇. Since the pad 416d is electrically connected to the first detecting pad U6a, the pad "is electrically connected to the second positioning member 12" through the conductive connecting material 130, once the pad 416d overlaps with the second positioning member 126b. Therefore, the first test pad 116a is electrically connected to the second test pad 126a. It can be seen that in the process of performing the press-fit, the worker can measure each of the first test pads 116a and the second test corresponding thereto. The resistance value between 26a is used to determine whether the first terminal 114 is aligned with the second terminal 124. If Φ is found to be electrically connected to the second detection pad 126a according to the resistance value, the first terminal 114 is indicated. The second terminal 124 is not aligned at all. At this time, the worker needs to adjust the pressing machine table to correct the relative position between the flexible circuit board 410 and the core circuit board 120, so that the first terminal 114 is used in the next pressing process. Figure 4A is a top plan view of the circuit board module of the fourth embodiment of the present invention before its components are unbonded, and Figure 4B is the circuit board module of Figure 4A after its components are combined. Overlooking 4A and FIG. 4B, the circuit board module 500 of the fourth embodiment includes a flexible circuit board 11 and a core circuit board 520', and the flexible circuit board Π0 is combined with the core circuit board 520. In the above, the circuit board module 500 is similar to the circuit board module 100 of the first embodiment, both of which include a flexible circuit board 11A, but the difference is that the core circuit board 520 is different from the core circuit of the first embodiment. In order to simplify the description of the circuit board module 500, only the core circuit board 520 is different from the technical features of the first embodiment. As for the flexible circuit board 110, the details are not repeated. ® Core circuit board 520 A substrate 122, a plurality of second terminals 124, and one or more detection patterns 526 are disposed, and the second terminals 24 and the detection patterns 526 are disposed on a plane §1 of the substrate 122, wherein the substrate 122 and the second terminal 124 are disposed. The configuration relationship of the detection pattern 526 is the same as that of the core circuit board 120 of the first embodiment, so the detailed description is not repeated. Each of the detection patterns 526 includes a second detection pad 2 such as a wire 126c. The second positioning member 526b and a pad 526d. In the same inspection pattern 526, the pad 526d is electrically connected to the second detecting pad 126a. For example, the wire 126c can be connected between the second detecting pad 126a and the pad 526d. The second detecting pad 126a is electrically connected to the pad 526d. However, in other embodiments, the second detecting port 126a may be directly connected to the port 526d, and the wiring 126c is not required to be indirectly electrically connected to the pad. 526d. In the fourth embodiment, the pads 526d are substantially U-shaped in shape, and the two ends of the pads 526d extend toward the first detecting pad 116a. That is, the notches of these U-shaped pads 526d are all facing the first detecting 塾 116a ' of the 201212733 face as shown in Figs. 4A and 4B. In addition, each of the pads 526d surrounds one of the second positioning members, but the ports 526d are not connected to any of the second positioning members 5, i.e., the second positioning members 526b are electrically insulated from the second detecting pads 126a. 4C is a schematic cross-sectional view taken along line VI_VI of FIG. 4B. Referring to FIG. 4C and FIG. 4C, the circuit board module 5A further includes a conductive connecting material 130, and the conductive connecting material 13 is connected between the flexible circuit board and the core circuit board 520, and adheres to these. Pad 526d. Although the first positioning members U6b are respectively superposed on the second positioning members 526b, the first terminals 114 are overlapped with the second terminals (as shown in FIGS. 4A and 4B) and the first positioning member U6b can The second positioning member 526b is electrically connected through the conductive particles 132 in the conductive connecting material 130. The second positioning member 526b is electrically insulated from the second detecting pad 12, and the first positioning member 116b is electrically connected to the first detecting port. Therefore, even if the first positioning member 116b is electrically connected to the second positioning member 526, the first detecting pad 116& Lu and the second test 塾 126a will not be electrically conductive. Although these first positioning members 116b are respectively overlapped with the second positioning members 526b, these first positioning members do not overlap the pads 526d under normal circumstances. Unless the relative positions between the first keeper and the second keeper 526b are severely offset, the first terminals 114 are completely out of alignment with the second terminals 124. At this time, at least one of the pads 526d will be weighted with one of the first positioning members 116b and electrically connected to the first positioning I S3 19 201212733 piece 116b through the conductive connecting material 13 (). Since the pad 526d is electrically connected to the second detecting pad 126a, if the pad 526d overlaps with the first positioning member 1161), the pad %" is electrically connected to the first positioning member through the conductive connecting material 130. 6b, so that the first detecting pad 116a is electrically connected to the second detecting pad 126a. It can be seen that during the pressing process, the worker can measure each of the first detecting pads 116a and the corresponding second detecting pad. A resistance value between 126a to determine whether the first terminal 114 is aligned with the second terminal 124. In the fourth embodiment, the worker uses the resistance value to determine whether the first terminals 114 are aligned with the second terminals 124. The manner of the same as that of the third embodiment is not repeated here. In summary, when the first positioning member is overlapped with the second positioning member, the first terminals of the flexible circuit board are also overlapped with the second of the core circuit board, respectively. The terminal, so that both the first positioning member and the second positioning member can serve as positioning marks for aligning the first terminal with the second terminal, and the worker can judge according to the overlap of the first positioning member and the second positioning member. Whether the first terminal is aligned with the second terminal. In the press-fitting process, whether the first positioning member is electrically insulated from the first detecting pad, the second positioning member is electrically connected to the second detecting pad; or The first member is electrically connected to the first detecting member and the first detecting member is electrically connected to the first detecting member. The worker can immediately find out whether the first terminal is from the resistance value between the first detecting port and the second detecting pad. Align the second terminal and immediately confirm whether it is necessary to adjust the parameters of the press machine. Further, when the first positioning member is electrically connected to the first detecting pad and the second positioning member is electrically connected to the second detecting pad After the board module is completed, 20 201212733 • The resistance meter between the first test pad and the second test pad can be measured by using a three-meter electric measuring machine to check the completed circuit board mode. Group, whether the first terminal is correctly electrically connected to the second terminal. Thereby, the staff can confirm whether the pressing machine is operating normally to adjust or repair the abnormal pressing machine, and reduce the need for rework or scrapping. Circuit board mode In addition, when measuring the resistance between the first test pad and the second test pad, the measuring machine can use only two probes for measurement, so the measuring machine does not Multiple probes are required to detect the board mode group. Since the measuring machine can use only two probes for measurement, as long as the distance between the two probes can be adjusted, the measurement is performed. The machine can measure various circuit board modules of different specifications. Thus, the circuit board modules of different specifications can share one measuring machine. Although the present invention is disclosed above in the foregoing embodiments, it is not intended to limit the present invention. Any equivalents of modifiers and retouchings within the spirit and scope of the present invention are still within the scope of the invention. ί S3 21 201212733 ' [Simple description] 1A is a top plan view of a circuit board module according to a first embodiment of the present invention before its components are unbonded. Fig. 1B is a top plan view of the circuit board module of Fig. 1A after its components are combined. 1C is a schematic cross-sectional view taken along line I-Ι of FIG. 1B. 1D is a schematic cross-sectional view taken along line II-II of FIG. 1B. Fig. 2A is a plan view of a circuit board module according to a second embodiment of the present invention, in which the components are not combined. Figure 2B is a top plan view of the circuit board module of Figure 2A after its components are combined. 2C is a schematic cross-sectional view taken along line III-III of FIG. 2B. Fig. 3A is a top plan view of the circuit board module of the third embodiment of the present invention before its components are unbonded. Figure 3B is a top plan view of the circuit board module of Figure 3A after its components are combined. 3C is a schematic cross-sectional view taken along line V-V of FIG. 3B. Fig. 4A is a top plan view of the circuit board module of the fourth embodiment of the present invention before its components are unbonded. Figure 4B is a top plan view of the circuit board module of Figure 4A after its components are combined. 4C is a schematic cross-sectional view taken along line VI-VI of FIG. 4B. 22 201212733 [Description of main component symbols] 100, 200, 400, 500 110, 210, 410 112 112a 112b 114 116 , 216 , 416
116a 116b 、 216b 、 416b 116c 、 126c 120 ' 220 ' 520 122 124 126 ' 226 ' 526 φ 126a 126b 、 226b 、 526b 130 132 134 216d ' 226d 416d ' 526d116a 116b , 216b , 416b 116c , 126c 120 ' 220 ' 520 122 124 126 ' 226 ' 526 φ 126a 126b , 226b , 526b 130 132 134 216d ' 226d 416d ' 526d
SI 電路板模組 軟式電路板 軟性基板 上表面 下表面 第一端子 檢測結構 第一檢測墊 第一定位件 接線 核心電路板 基板 第二端子 檢測圖案 第二檢測墊 第二定位件 導電連接材料 導電粒子 黏著體 辅助定位件 接墊 平面 m 23SI circuit board module flexible circuit board soft substrate upper surface lower surface first terminal detection structure first detection pad first positioning member wiring core circuit board substrate second terminal detection pattern second detection pad second positioning member conductive connection material conductive particles Adhesive auxiliary positioning piece pad plane m 23