TW201210731A - Laser processing with multiple beams and respective suitable laser optics head - Google Patents

Laser processing with multiple beams and respective suitable laser optics head Download PDF

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Publication number
TW201210731A
TW201210731A TW100123995A TW100123995A TW201210731A TW 201210731 A TW201210731 A TW 201210731A TW 100123995 A TW100123995 A TW 100123995A TW 100123995 A TW100123995 A TW 100123995A TW 201210731 A TW201210731 A TW 201210731A
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TW
Taiwan
Prior art keywords
laser
substrate
plane
optical head
optical element
Prior art date
Application number
TW100123995A
Other languages
Chinese (zh)
Inventor
Heather Booth
Julian Cashmore
Original Assignee
Oerlikon Solar Ag Trubbach
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Application filed by Oerlikon Solar Ag Trubbach filed Critical Oerlikon Solar Ag Trubbach
Publication of TW201210731A publication Critical patent/TW201210731A/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • G02B27/106Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0808Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more diffracting elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • G02B27/1086Beam splitting or combining systems operating by diffraction only
    • G02B27/1093Beam splitting or combining systems operating by diffraction only for use with monochromatic radiation only, e.g. devices for splitting a single laser source
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation

Abstract

The invention relates to a laser optics head (10) configured for use in a laser scribing device, comprising a diffractive optical element (11), a focusing objective (13) and an adjusting means (21), whereby the diffractive optical element (11) and the focusing objective (13) are arranged spaced apart from each other on one common optical axis (16), and the adjusting means (21) is configured for rotating the diffractive optical element (11) in a third plane orthogonal to the optical axis (16). The invention provides for a reduction in leakage current of thin film solar cells.

Description

201210731 from each other on one common optical axis (16), and the adjusting means (21) is configured for rotating the diffractive optical element (11) in a third plane orthogonal to the optical axis (16). The invention provides for a reduction in leakage current of thin film solar cells. 四、指定代表圖: (一) 本案指定代表圖為:第(2)圖。 (二) 本代表圖之元件符號簡單說明: 11〜繞射光學元件; 13〜聚焦物鏡; 15〜第二平面; 17~節距; 19~直徑; 22〜距離。 10〜光學頭; 12〜多重雷射光束; 14〜入射雷射光束; 16〜光學軸; 18〜繞射光學元件分割; 21〜調整元件; 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式: 無0 六、發明說明: 【發明所屬之技術領域】 本發明係有關於用於雷射雕刻裝置(l aser k · ^crlblng device)的雷射光學頭(laser optic head),且特別是有 201210731 於一種包括雷射光學頭的雷射雕刻裝置。本發明更有關於 一種在基板表面上進行雷射製程的方法,以及關於製造薄 膜太陽能電池的方法。此外,本發明關於利用雷射雕刻裝 置將基板切割成為附設個區段的方法。 【先前技術】 多年來,e知可利用雷射形成溝槽以_薄膜太陽能 電池區段,如 US 4,292,092,及评 891 72274(此 1985/ 4542578)所述。 在已知文獻中,藉由調整用以控制光學頭的位置之機 械系統,使光學頭的方向與主要溝槽方向垂直,現存的雷 射雕刻工具的光學頭可用於各種寬度的電池區段。利用校 正程序(calibration procedure)來比較及修正區段中溝 槽的理想位置及f際位£。上述校正可根據&覆的程序 (iterative Procedure)或修正檢查表(1〇〇卜叩 correction table)。在製造環境中進行所謂ρι_ρ2_ρ3雕 刻製程的各個工具,例如在各個複合光學頭中的各雷射光 束必須個別進行其校正程序。此外,每當電池區段寬度改 變時上述校正程序就必須重複進行。 為了維持在區段内連遮蔽區(dead area)上的允許誤 差,以及避免雕刻圖案的重疊,上述校正是必要的。校正 程序的困難度會隨著區段溝槽位置準確度的需求而增加, 其本身係遮蔽區的函數··例如,當欲得遮蔽區寬度為4〇〇 微米時,校正準確度僅須達2〇微米,然而當遮蔽區寬度為 201210731 200微米時,妨-ς、准^ 準確度須高於10微米,通常須達3微来。 光學頭位置的進破# ^確度要足以符合1G微米或1G微米以下的 光束位置校正準確度變得非常困難。 -般而言’為了達到這樣高的準確度,校正程序必須 更深入且耗時,且必須更頻繁的重複。此外,在製造環境 般進行各P卜P2_P3製程時不同工具可具有許多種可 能的組合’因而導致區段溝槽位置錯誤㈣積,使得在整 個製造線中,各雷酿办丨 .雷射雕刻具的遮蔽區的安全限制(safe limit)必須遠大於性能限制(perf〇rmance 。 【發明内容】 本發明的目的之一是提供一種用於雷射雕刻裝置的光 學頭,其提供一種非常準確且可靠的雕刻薄膜太陽能電池 的方法’並減小遮蔽區的寬度。 本發明之上述目的可藉由獨立項達成。較佳實施例可 藉由附屬項達成。 特別地,本發明一實施例提供用於雷射雕刻裝置的雷 射光學頭’包括繞射(diffractive)光學元件、聚焦物鏡 (focusing objective)及調整元件,其中繞射光學元件及 聚焦物鏡係設置在一共同(common)光學軸上且彼此分開, 而調整元件則配置於與光學軸正交的第三平面上以旋轉繞 射光學元件。 繞射光學元件(diffractive optical element; D0E) 較佳為單一、小型(compact)的光學元件,其可將一入射光201210731 from each other on one common optical axis (16), and the adjusting means (21) is configured for rotating the diffractive optical element (11) in a third plane orthogonal to the optical axis (16). The invention provides for a reduction In the leakage current of thin film solar cells. IV. Designated representative map: (1) The representative representative of the case is: (2). (b) The symbol of the symbol of this representative diagram is briefly described: 11~ diffractive optical element; 13~ focusing objective lens; 15~ second plane; 17~ pitch; 19~ diameter; 22~ distance. 10~ optical head; 12~ multiple laser beam; 14~ incident laser beam; 16~ optical axis; 18~ diffractive optical element division; 21~ adjustment element; 5. If there is a chemical formula in this case, please reveal the best display TECHNICAL FIELD OF THE INVENTION The present invention relates to a laser optic head for a laser engraving device (l aser k · ^crlblng device), In particular, there is 201210731 for a laser engraving device comprising a laser optical head. More particularly, the present invention relates to a method of performing a laser process on a substrate surface, and to a method of fabricating a thin film solar cell. Further, the present invention relates to a method of cutting a substrate into a plurality of sections by means of a laser engraving device. [Prior Art] For many years, it has been known to use lasers to form trenches in a thin film solar cell segment as described in US 4,292,092, and 891 72274 (this 1985/4542578). In the known literature, the optical head of an existing laser engraving tool can be used for battery sections of various widths by adjusting the mechanical system for controlling the position of the optical head such that the direction of the optical head is perpendicular to the main groove direction. Use the calibration procedure to compare and correct the ideal position and the f-position of the groove in the section. The above correction may be based on an & iterative procedure or a correction table. The various tools for performing the so-called ρι_ρ2_ρ3 engraving process in a manufacturing environment, for example, each of the laser beams in each composite optical head must be individually subjected to its calibration procedure. In addition, the above calibration procedure must be repeated each time the battery section width changes. The above correction is necessary in order to maintain an allowable error in the zone dead zone and avoid overlapping of the engraving patterns. The difficulty of the calibration procedure will increase with the accuracy of the position of the groove of the section, which is a function of the masking area. For example, when the width of the masking area is 4 〇〇 micron, the correction accuracy only needs to be reached. 2 〇 micron, however, when the width of the occlusion area is 201210731 200 microns, the accuracy of the 妨-ς, 准^ must be higher than 10 microns, usually up to 3 micro. It is very difficult to correct the position of the optical head by a degree sufficient to meet the beam position correction accuracy of 1 Gm or less. - Generally speaking, in order to achieve such high accuracy, the calibration procedure must be deeper and more time consuming, and must be repeated more frequently. In addition, different tools can have many possible combinations when performing various P-P2_P3 processes in the manufacturing environment, thus resulting in a wrong position of the segment trenches (four), so that in the entire manufacturing line, each of the lightning brewing. Laser engraving The safety limit of the shaded area must be much greater than the performance limit (perf〇rmance). One of the objects of the present invention is to provide an optical head for a laser engraving device that provides a very accurate and Reliable method of engraving a thin film solar cell' and reducing the width of the masking area. The above object of the present invention can be achieved by a separate item. The preferred embodiment can be achieved by an accessory. In particular, an embodiment of the present invention provides The laser optical head of the laser engraving device includes a diffractive optical element, a focusing objective, and an adjustment element, wherein the diffractive optical element and the focusing objective are disposed on a common optical axis and Separate from each other, and the adjustment element is disposed on a third plane orthogonal to the optical axis to rotate the diffractive optical element. Diffractive optical element; D0E) is preferably a single, compact optical element that can transmit an incident light

S 4 201210731 束,例如為雷射光束,分為在特定平面上的許多光束。由 單一繞射光學元件所產生的所有光束具有幾乎相同的強 度,且彼此間具有固定的間隔角度(angular intervai)並 以光學頭的光學軸為中心。而後,由繞射光學元件而來的 多重光束入射至聚焦物鏡,其較佳將光束向太陽能電池傳 輸並聚焦,以製造太陽能電池層堆疊。聚焦物鏡的光學性 能較佳與繞射光學元件特定的光束間隔角纟及光學頭與太 陽能電池的距離相配。 因此,上述光學頭可用於將太陽能電池圖案化為不同 區段。聚焦物鏡可包括已知可用於將光聚焦的任何工具, 例如:透鏡、場透鏡(field lenses)、修復透鏡(以啸 lenses)、條狀鏡(strip mirr〇r)、及/或其他工具。在其 他實施例中,光學頭包括擴大望遠鏡光學工具— telescope optical means)以形成較大的入射直徑及/或下 降(fal 1 ing-out)光束。 繞射光學tl件及聚焦物鏡較佳設置在共同光學軸中 使得進入繞射光學元件的入射光,由聚焦物鏡光學傳輸至 如基板及/或太陽能電池上。繞射光學元件較佳作為相光拇 (Phasegrating)元件,以將入射光束分為複數個分割的光 束。上述光束較佳為雷射光束,纟包括大體為高斯強度分 佈(Gaussian intensity distributiQn)。複數個分割的光 束較佳以沿著一轴旋轉’該軸與光束分佈方向平行及/或盘 第三平面正交…’根據本發明所述知光學頭可用於在 基板表面製造溝槽,其中’ #由沿著光學轴旋轉繞射光學 201210731 元件,亦即在第三平面上與光學轴正交,使得相鄰光束間 的所得節距(pitch)可輕易且準確的調整。The S 4 201210731 beam, for example a laser beam, is divided into a number of beams on a particular plane. All of the beams produced by a single diffractive optical element have nearly the same intensity and have a fixed angular intervai with each other and centered on the optical axis of the optical head. The multiple beams from the diffractive optical element are then incident on the focusing objective, which preferably transmits and focuses the beam to the solar cell to produce a stack of solar cells. The optical properties of the focusing objective are preferably matched to the specific beam spacing angle of the diffractive optical element and the distance of the optical head from the solar cell. Therefore, the above optical head can be used to pattern solar cells into different sections. The focusing objective may include any tool known to be used to focus light, such as lenses, field lenses, repair lenses (strips), strip mirrors, and/or other tools. In other embodiments, the optical head includes a telescope optical means to form a larger incident diameter and/or fal ing-out beam. The diffractive optics tl and the focusing objective are preferably disposed in a common optical axis such that incident light entering the diffractive optical element is optically transmitted by the focusing objective onto, for example, a substrate and/or a solar cell. The diffractive optical element is preferably used as a phase optic finger to divide the incident beam into a plurality of divided beams. Preferably, the beam of light is a laser beam, and the beam comprises a Gaussian intensity distributi Qn. The plurality of split beams are preferably rotated along an axis 'the axis is parallel to the beam distribution direction and/or the third plane of the disk is orthogonal...' according to the present invention, the optical head can be used to fabricate trenches on the surface of the substrate, wherein The ## is rotated by the diffractive optical 201210731 element along the optical axis, that is, orthogonal to the optical axis in the third plane, so that the resulting pitch between adjacent beams can be easily and accurately adjusted.

根據本發明之包括繞射光學元件的光學頭,其製造可 非常微小且準確’因此由繞射光學元件而來的光束*** (bean-Splltting)的穩定性,可視為所形成多重光束 (nmlUpie beams)之性質的穩定性,例如,其能量分佈及 位置的準確度,使得在遮蔽區減小及/或最小化的情況下, 其性能相較於傳統而言非㈣定。此外,本發明所提供的 光學頭,#由沿光學軸旋轉繞射光學元件,可輕易調整電 池區段寬度,且仍可維持複合光束位置及性質的穩定性。 與翫头相反的疋’ 4 了連結繞射光學元件的旋轉角度及電 池區段寬度’卩需要單—校正程序,因此減少卫具設置及 調整所需的時間。本發明的光學頭特別適用於圖案化太陽 能電池之隔離的溝槽。藉由利用繞射光學元件可提升產能 (throughput),亦即利用多重光束及繞射光學元件以接近 或等於『或90。的角度旋轉圖案化隔離溝槽,而能夠同時 雕刻多重溝槽,藉此準確且良好的控制圖案化溝槽,其具 有很近的間隔及/或在單—製程路線(singU pass)中重疊,基板較佳隨光學頭而移動。因此,本發明提 供-種光束***的較佳方法’其可應用於如太陽能電池的 區段寬度的簡單變化,且可快速製造整體電池上的區段溝 槽及平行或正交於主要區段溝槽方向的隔離溝槽,例如在 太陽能電池的邊緣。本發明的光學頭及/或雕刻裝置的額外 優點是可減少薄膜太陽能電池的漏電流。 201210731 在本發明較佳實施例中,調整元件包括機動台 (m〇t〇riSed Stage)及 /或步進馬達(stepper m〇tor),以沿 著光學軸旋轉繞射光學元件。在其他較佳實施例中,雷射 光學頭包括控制器,且控制器係用以將繞射光學元件放置 在光學軸的-定義角度位置。在此,調整元件較佳用以將 繞射光學元件放置在角度位置的準確度^ 較佳各 0.1 mrad’且更佳".(π mrad。在上述實施例中,繞射光 學元件沿著光學軸的精確的旋轉,因此,使多重光束在這 目標上’例如在基板及/或太陽能電池上,在非常準確的對 位。當利用前述工具時,光束位置的準確度較佳心微米, 更加=3微米。因此’上述實施例可形成寬度小於_微 米的遮蔽區。 h在本發明其他較佳實施例中,在接合外殼(joint 〇USing)中至少包含繞射光學元件及聚焦物鏡,且接合外 ^包括:材料’其係用以降低接合外殼由於環境改變所造 、的熱膨服(thennai expansiQn)的敏感度。因此,上述材 二更佳包括低膨脹材料,較佳為溶… 這些都有㈣提升繞射光學元件及/或由繞射光 二進ί的多重光束的旋轉的準確度,特別是經過-段 ' 度,因此基板的雷射雕刻非常準確。 此相實㈣巾’繞射光學元件及聚焦物鏡彼 毫米且以〇毫米,較。25毫米且㈣毫 。:、射先學兀件的間隔角度範圍較佳介於^i 5m5 更佳"於至蕊5。。聚焦物鏡適當的光學直徑較佳$ 201210731 15毫米且$ 70毫米’且較佳$ 25毫米且$ 50毫米β 本發月之目的更提出用於在基板的表面上進行雷射製 f的雷射雕刻裝置’包括定位元件(p〇siti〇ning _小 前述雷射光學頭、及移動元件,其中定位元件係用以放置 第平面上待進行製程的基板表面,雷射光學頭係藉由 ***入射雷射光束以產生多重雷射光束,使得多重雷射光 束彼此間具有固定的預設距離,且使得多重雷射光束平行 並定義第二平面,聚焦物鏡係用以在基板上聚焦多重雷射 光束,以在表面上製造平行溝槽,使得第一平面及第二平 面形成相交的線(intersec1:ing i ine),且使得由各雷射光 束入射至基板上所形成在表面中的溝槽,其彼此間隔有節 距(pitch),且移動元件係用以相對於基板的一移動方向移 動雷射光學頭。 上述雷射雕刻裝置提供基板非常準確且可靠的雕刻, 較佳為太陽能電池雕刻。上述基板可為本領域技藝人士所 知的任何基板《較佳可為太陽能電池中的基板,例如為薄 膜太陽能電池。薄膜太陽能電池通常包括玻璃基板,在玻 璃基板上設置透明或半透明電極層,而後再形成光電轉換 半導體(photoelectric conversion semiconductor)及背 電極層’上述光電轉換半導體係由具有PIN或NIP結構(N 係負摻雜石夕;I係本質石夕(i ntr i ns i c s i 1 i con) ; P係正摻 雜石夕)的非晶(amorphous)或微晶(microcrystal 1 ine)石夕薄 臈所形成。背電極可再次包括透明導電層加上反射層、導 電及反射金屬層、或相似的技術。光電轉換半導體可形成An optical head comprising a diffractive optical element according to the invention, which can be manufactured very minutely and accurately 'so the stability of the beam-splitting by the diffractive optical element can be regarded as the resulting multiple beam (nmlUpie beams) The stability of the nature of the property, for example, its energy distribution and positional accuracy, makes the performance of the masked area smaller and/or minimized than conventionally. In addition, the optical head provided by the present invention, by rotating the optical element along the optical axis, can easily adjust the width of the battery section while still maintaining the stability of the composite beam position and properties. The opposite of the hoe '4', the angle of rotation of the connecting diffractive optical element and the width of the battery section' requires a single-correction procedure, thus reducing the time required for the setting and adjustment of the implement. The optical head of the present invention is particularly useful for patterning isolated trenches of solar cells. The throughput can be increased by using diffractive optical elements, i.e., using multiple beams and diffractive optical elements to approximate or equal to "or 90." The angular rotation of the patterned isolation trenches enables simultaneous engraving of multiple trenches, thereby accurately and well controlling the patterned trenches with very close spacing and/or overlap in a single-process singU pass. The substrate preferably moves with the optical head. Accordingly, the present invention provides a preferred method of beam splitting, which can be applied to simple variations in the width of a segment such as a solar cell, and can quickly fabricate segment trenches on an integrated cell and be parallel or orthogonal to the main segment. An isolation trench in the direction of the trench, for example at the edge of a solar cell. An additional advantage of the optical head and/or engraving apparatus of the present invention is that the leakage current of the thin film solar cell can be reduced. 201210731 In a preferred embodiment of the invention, the adjustment element includes a motorized stage (s) and/or a stepper motor to rotate the diffractive optical element along the optical axis. In other preferred embodiments, the laser optical head includes a controller and the controller is adapted to place the diffractive optical element at a defined angular position of the optical axis. Here, the adjustment element is preferably used to place the diffractive optical element at an angular position with an accuracy of preferably 0.1 mrad' and more preferably "π mrad. In the above embodiment, the diffractive optical element is along The precise rotation of the optical axis, therefore, enables multiple beams to be on this target, such as on a substrate and/or solar cell, in a very accurate alignment. When using the aforementioned tools, the beam position is preferably at a microcentre accuracy. More = 3 microns. Therefore, the above embodiment can form a masking region having a width of less than _micron. h In other preferred embodiments of the present invention, at least the diffractive optical element and the focusing objective lens are included in the joint casing (US). And the outer joint includes: the material 'is used to reduce the sensitivity of the joint housing due to environmental changes, the thermal expansion (thennai expansiQn). Therefore, the second material preferably comprises a low expansion material, preferably ... These have (iv) the accuracy of the rotation of the diffractive optical element and/or the multiple beams of the diffracted light, especially through the segmental degree, so the laser engraving of the substrate is very accurate. Real (four) towel 'diffractive optical element and focusing objective lens mm and 〇 mm, compared to 25 mm and (four) millimeter.:, the spacing of the first element is better than ^i 5m5 better than 5. The proper optical diameter of the focusing objective is preferably $201210731 15 mm and $70 mm' and preferably $25 mm and $50 mm. The purpose of this month is further proposed for laser fabrication on the surface of the substrate. The laser engraving device 'includes a positioning element (p〇siti〇ning_ small aforementioned laser optical head, and a moving element, wherein the positioning element is used to place the surface of the substrate on the first plane to be processed, and the laser optical head is used The incident laser beam is split to generate multiple laser beams such that the multiple laser beams have a fixed predetermined distance from each other, and the multiple laser beams are parallel and define a second plane, and the focusing objective is used to focus multiple times on the substrate. a laser beam to create parallel grooves on the surface such that the first plane and the second plane form intersecting lines (intersec1: ing i ine) and are formed in the surface by the respective laser beams incident on the substrate The trenches are spaced apart from each other by a pitch, and the moving element is configured to move the laser optical head relative to a moving direction of the substrate. The laser engraving device provides a very accurate and reliable engraving of the substrate, preferably Solar cell engraving. The substrate may be any substrate known to those skilled in the art. Preferably, it may be a substrate in a solar cell, such as a thin film solar cell. A thin film solar cell usually includes a glass substrate, and a transparent or half is disposed on the glass substrate. a transparent electrode layer, and then a photoelectric conversion semiconductor and a back electrode layer. The above-mentioned photoelectric conversion semiconductor system has a PIN or NIP structure (N-negative doping Shi Xi; I-system essence Shi Xi (i ntr i ns Icsi 1 i con) ; P system is doped with amorphous or microcrystalline 1 ine. The back electrode may again comprise a transparent conductive layer plus a reflective layer, a conductive and reflective metal layer, or a similar technique. Photoelectric conversion semiconductor can be formed

S 8 201210731 為單一的(single)、串聯的(tandem)、多重的(multiple) 接面;各接面又可具有PIN或NIP結構。因此,電極層包 括利用雷射雕刻裝置進行製程的表面。 玻璃基板可為本領域技藝人士所知任何適用於所製造 的薄膜裝置中的任何玻璃基板。在一較佳實施例中,玻璃 基板為浮動玻璃(float glass)、安全玻璃(security glass)、及/或石英玻璃。浮動玻璃,其尺寸較佳大於一般 用於製造太陽能電池的尺寸’通常在形成槽(f〇rming chamber)中,藉由輸送熔融玻璃,較佳為持續輸送,至延 伸的錫浴(extended tin bath)。而後,熔融玻璃分佈在錫 表面及/或以適當的工具往至少一個方向拉長熔融玻璃,而 作為平坦連續玻璃膜或層。藉由小心的控制冷卻及拉長的 製程’可調整所形成的玻璃薄膜的形狀及厚度。 根據本發明所述的薄膜層的沉積可藉由本領域技藝人 士所知的各種沉積技術《在本發明一較佳實施例中,薄膜 層的沉積係藉由化學氣相沉積或物理氣相沉積如真空濺鍍 製程。氣相沉積製程更佳為電漿化學氣相沉積(pECVD)、常 壓化學氣相沉積(APCVD)、及/或有機金屬化帛氣相沉積 (M0CVD)製程。 沉積在玻璃基板上的透明電極可包括任何已知的適當 材料。其較佳包括透明導電氧化㈣咖― c-uctive 0xlde ; TC0),更佳為氧化鋅或銦錫氧化物 (no)。上電極(front electrode)的沉積較佳利用真空/ 磁控管(VaCuum/magnetron)濺鍍、蒸發、或化學氣相沉積, 201210731 更佳為利用低壓化學氣相沉積(LPCVD),且最佳係以二乙基 鋅(diethyl zinc)作為前驅物進行低壓化學氣相沉積以形 成氧化鋅薄膜層。 本領域技藝人士可提供任何適當的工具作為定位元 件’較佳為平坦桌面及/或支持基板設置於其上。相同的, 本領域技藝人士可提供雷射工具以入射雷射光束至繞射光 學元件上,例如參照US 4,292,092及/或Us 1 985/ 4542578。雷射工具較佳在光譜的紅外光區中操作在第二 諧波波長(2nd harmonic wavelength ; 532nm)及 / 或第三諧 波波長(3rd harmonic wavelength ; 532nm),雷射工具脈 衝之脈波長(pulse length)的範圍在〇 〇1至5〇奈米秒之 間,且其操作脈衝重複頻率範圍在1kHz至40MHz之間,較 佳在40MHz。在基板中的溝槽製程藉由雷射雕刻裝置例如 :為所謂# P卜P2及/或p3圖案,也可係、為了邊緣及/或 橫向隔離(transverse is〇lati〇n)的單一雷射雕刻圖案 P4。移動元件較佳包括運送機(conveyer)及/或帶狀物,且 係適用於以固定速度移動基板,且其移動方向較佳平行於 溝槽製&amp;方向°在另—較佳實施例中,移動元件係用於移 動光學頭,使得基板在複數個路徑上被雷射雕刻。 因此,根據本發明,較佳分別利用由繞射光學元件 生多重***的雷射光束以在基板中形成溝槽,且各雷射 束彼匕門存在有—預定距離,其係與繞射光學元件的間 角度有關’而在基板中產生的溝槽彼此相隔有節距的 離。备以調整元件旋轉繞射光學元件時’節距的尺寸較 10 201210731 隨著角度的位置來改變。在此,根據 整元株兹山 &lt; 权《 Τ施例’調 由改變移動方向及相交線的角度而調 距亦即,藉由旋轉繞射光學元件可調整節距的: 此改變移動太士血妨·’ 八了因 的角度 、第一平面及第二平面所形成的相交線間 =度。移動方向較佳與溝槽方向相^節 更佳係為兩個相鄰溝槽間的最近距離,其係正 相鄰溝槽測量而得。 、 π在又-較佳實施例中’角度η。及錢。及/或該角度 :吏得至少相鄰二溝槽至少部分重疊。由於至少相鄰二溝: 部分重疊’可精準的確定例如在連續區中的太陽能電池的 所有材料層都被移除。當角度為。。時,較佳為由多&quot;射 光束形成”單一”溝槽’而當角度為90。時,較佳為節距 等於雷射光束的距離。 在本發明另一較佳實施例中,第二平面大體上與第一 平面正乂及/或光學軸大體與第一平面正交。雷射光學頭 更佳產生S3及$9的雷射光束,較佳產生4雷射光束,其 中多重光朿較佳彼此平行。在又一實施例中,調整元件形 成2 4毫米及$ 1 〇. 8毫米的節距,較佳為&amp; 5. 5毫米及$ 8.5毫米,更佳為$〇.i毫米。雷射光學頭更佳可達到 微米的溝槽位置準確度,較佳為$ 3微米。在另一實施例 中’設置多重雷射光束以將溝槽形成於沉積在表面的薄膜 材料中。薄膜材料可包括非晶及/或微晶矽薄膜,其設置有 PIN或NIP接面結構平行於薄膜表面。piN/NIp結構可夾置 於透明薄膜電極間’其可在基板的一主要表面上的各個複 11 201210731 數個區域中持續延伸,例如透光基板或覆板 (superstrate) ° 本發明之目的更包括達成在基板的表面上進行雷射製 程的方法,包括以下步驟: (a) 设置該基板之該表面在一第一平面進行製程, (b) 藉由一繞射光學元件***一單一雷射光以產生多 重雷射光束,使得該多重雷射光束彼此間具有一預設的固 定距離,以及使得該多重雷射光束平行設置已定義一第二 平面, (c) 將該多重雷射光束聚焦至該基板上以在該表面形 成平行溝槽’使得該第一表面及該第二表面形成一交叉 線’且藉由該個別雷射光束入射至該基板以在表面中形成 該溝槽,使得該溝槽藉由一節距彼此間隔,且該節距藉由 改變該欲得移動方向及該交叉線間的角度來調整,以及 (d) 在一移動方向上相對於該基板移動該多重雷射光 束。 在更佳實施例中,設置第二平面以大體正交於第一平 面。較佳地,改變欲得移動方向及交叉線間的角度係被旋 轉繞射光學元件所影響。更佳為旋轉該繞射光學元件係由 一移動台所影響,該移動台能夠沿一光學軸的一旋轉,在 該光學軸上該繞射光學元件及用以聚焦該多重雷射光束的 一聚焦物鏡彼此間隔設置。在另一實施例中,繞射光學元 件在一第三平面上旋轉,且第三平面大體與入射單一雷射 光束正交,及/或大體與第二平面正交。在又一實施例中, 12 201210731 上述方法包括校正在該移動方向及該交叉線之間的角度。 在又f施例中,角度係^ 〇。及S 9。。,及/或設置該角度 使得至/ —相鄰溝槽至少部分重疊。在—更佳實施例中, 步驟(e)係可選擇的以—角度進行以形成至少部分重疊的 溝槽在t佳實施例中,設置該繞射光學元件以產生^ 3 且S 9個雷射光束,較佳為4個雷射光束。較佳地,調整 移動方向及父又線之間的角度使得節距係“關且^ 10.8關,較佳g5.5職且5顧,且更佳$〇1態。在一 更佳實施例巾,設置該繞射光學元件以在該基板上聚焦該 多重雷射光束’因此達到一溝槽定位準確度$1〇”。 本領域之技藝人士可根據之前所述雷射光學頭及/或 雷射雕刻裝置衍生出更多實施例及/或在基板表面進行雷 射製程的方法之優點。 本發明另一目的更達成一種製造一薄膜太陽能電池的 方法’包括以下步驟: (1) 在一基板上沉積一薄膜材料,以及 (2) 利用如申請專利範圍第16_26項任一項所述之方 法對該基板進行雷射製程,纟中該薄膜材料包括對該表面 進行處理,或 (2’ )利用如申請專利範圍第8_15項任一項所述之雷 射雕刻裝置對該基板⑺進行雷射製程,其中該薄臈材料包 括對該表面進行處理。 在一較佳實施例中’步驟(2)或步驟(2,)包括對該基 板至少2 0 %的該表面面積進行雷射製程。較佳地,表面在 13 201210731 焊條(ribbon)與區段溝槽垂直方向上進行製程。上述步驟 較佳重複進行,例如在數千的重疊橫向溝槽中以有效的增 加太陽能電池中的光穿透。 本發明又一目的在於達成利用所述之雷射雕刻裝置以 將該基板切割成為複數個區段,包括一薄膜太陽能電池, 該薄膜太陽能電池包括該基板及一薄膜材料沉積在該積板 上,且該薄膜材料包括藉由該雷射雕刻裝置處理的該表面。 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂’下文特舉出較佳實施例,並配合所附圖式,作詳 細說明如下: 【實施方式】 第1圖為傳統薄膜太陽能電池1的一部分的剖面圖。 在透明絕緣基板2上設置透明上電極層3,在透明上電極 層3上形成光電轉換半導體4,以及在光電轉換半導體4 上再形成透明背電極5。光電轉換半導體4包括非晶及/或 微晶碎薄膜堆疊。 第1圖更顯示溝槽6、7、8。上述結構的目的在於建 立由電性串聯連接的多重太陽能區段所組成的單片光伏模 組。因此’透明電極層3由第一隔離溝槽6所分割,其決 定電池區段的寬度。光電轉換半導體層4填入上述溝槽, 在製造的製程中,其整體層狀堆疊的順序依次為:層3、 溝槽6、層4、溝槽7、層5、溝槽8。以透明背電極層5 的材料填入的溝槽7,使得相鄰的電池丨電性接觸。事實 14 201210731 ^電池1的背電極5與另一相鄰電幻的上電極3接觸。 寺表面電極層5及光電轉換半導體4由第二隔離溝層8分 割。上述結構的製程較佳利用雷射光等方法。 薄膜太陽能電池【的製造方法例如如下:首先在透明 絕緣基板2上沉積透明電㈣3,例如利用低壓化學氣相 沉瞻叫透明電極層3,也稱為透明導電氧化物(⑽ 包括如氧化鋅(Zn〇)、氧化錫(Sn〇2)及/或銦錫氧化物 (_。而後’以雷射雕刻移除部份透明電極層3 ,而形成 第-隔離溝槽6’其將透明電㈣3分割為複數個隔離、 相鄰層。 接著,在透明電極層3上,進行電衆化學氣相沉積以 沉積光電轉換堆疊層4。堆疊層4包括至少一 p摻雜層、 1-本質層&amp; η摻雜層在例如薄膜非晶石夕中。可重複進形上 述步驟已形成多接面非晶矽薄膜太陽能電池卜因此,ρ+η 接面可由微晶(mierQeystaU ine)材料或非晶及微晶的混 合材料所形成,以建立光電轉換層4。 而後雷射雕刻光電轉換半導體層4以移除部份光電 轉換半導體層4’而形成將光電轉換半導體層4分割微複 數個隔離層4的溝槽7。 接著,沉積背表面電極層5以填入溝槽7中,因此形 成接觸線,並覆蓋光電轉換半導體層4。背表面電極層5 也可為透明導電氧化物(TC0),例如氧化鋅(Zn〇)、氧化錫 (Sn〇2)、銦錫氧化物(ίΤ〇)、或金屬層如鋁、或前述之組合。 最後’雷射雕刻光電轉換半導體層4及背表面電極層 15 201210731 ,以形成第二隔離溝槽8,其將光電轉換半導體層4分割 為電性串聯連接的複數個光主動(photoactive)層4或區 段因此製造出第1圖所顯示的薄膜太陽能電池1 ^ 本發明一實施例揭示藉由大體為5-1 0毫米的間隔之 雷射雕刻溝槽’在太陽能電、池1並延伸至其整體長度間, 將TC0層3分成複數個電性隔離區。在沉積後,利用雷射 雕刻光電轉換半導體層4。在此層中雕刻的溝槽7應與起 初在TC0層3中的溝槽平行,其整體長度一般在5-30毫米 之内,且盡量靠近初始溝槽6,一般距離介於10至150毫 米。 在沉積背表面電極層5之後,利用雷射形成溝槽8, 其同時分割背表面電極層5及光電轉換半導體層4,以完 成區段的電性串聯内連線。雕刻的溝槽8與TC0層中初始 溝槽6平行,其整體長度一般在5_3〇毫米之内,且盡量靠 近光電轉換半導體層的溝槽7,一般距離介於10至150毫 米。 所形成具有串聯内連線太陽能電池區段的太陽能電池 1,可減少薄膜太陽能電池的漏電流,且整體面板所產生的 電壓係由在各電池及多重電池中所形成的電位所產生。一 般而言,1.4m2的面板被分為50-200個電池,使得整體面 板的輸出電壓在30-200V的範圍内。 除了在 US 4, 292, 092 及 JP 591 72274(US 1985/4542578) 所述的材料之外’可利用許多其他的材料製造薄膜太陽能 電池1°在其他等效的裝置中’光電轉換半導體層4係以 16 201210731 蹄化錫(CdTe)、砸化銅銦(copper-indium-diselenide ; CIS)、石西化銅銦鎵(copper-indium-gallium-diselenide ; CIGS)、結晶石夕玻璃(crustalline silicon on glass ; CSG) 等。一般利用雷射來雕刻層3、4、5中部分或全部的溝槽 6、7、8’以在這些裝置中形成具有串聯内連線的複數個太 陽能電池1。 分別在層3、4、5中雕刻溝槽6、7、8有時候係從玻 璃板塗佈的一側施加雷射光束,但其也可從相反側施加雷 射光束’此時光束在與薄膜反應之前先通過玻璃。所使用 的雷射一般在光譜的紅外光(IR)範圍操作,但也可用在例 如在 532nm 的第二错波波長(2nd harmonic wavelength) 及在 532nm 的第二 s皆波波長(3rd harmoni c wave 1 ength)。 一般而言雷射脈衝之脈波長(pUlse length)的範圍在〇 〇1 至50奈米秒之間,且其操作脈衝重複頻率範圍在lkHz至 1 MHz之間,但也可尚至4〇MHz。利用一般稱為光學頭的光 機械系統,將雷射光束導向層堆疊3、4、5上進行習知製 矛王’上述光學頭係、设計為提供有效率的材才斗製程所需空間 上的強度分佈。 薄膜太陽能電池也可製作在如金屬板的非透明基板 上。在此實施例中’則不可能透過基板2進行光照,因此 所有的雕刻製程的光束都必須由塗佈的—側人射。在一些 其他實施例中’太陽能面板製造在彈性基板2±,例如薄 金屬或聚合物板。在前述的例子中,只能從塗佈的一側進 行先照1而在後述的例子中,從塗佈的一側或是穿過基 17 201210731 板2的光照都有可能β 在太陽此電池1上的溝槽6的位置決定了區段的寬 度區#又寬度的選擇,結合電池的尺寸,係取決於欲得太 IW能電池1的電性,例如,妒臂从广a a 較寬的區^又會增加漏電流I sc(sc 係短路),較窄(亦即較多)的區段會增加開路電壓(open circuit voltage)。其他可能影響區段溝槽6、7、8的寬 度的因素包括.電池的設置為申聯連接、並聯連接、或其 他電池連接的組合,藉此使被上電極層3及背電極層5的 材料層電阻所影響產生電池内的漏電流達最佳化。 為了達到太陽能電池1區段間有效的串聯連接,各溝 槽6(也稱為圖案1或P1)應與溝槽7(也稱為圖案2或p2) -起建造’而後在建造溝槽8(也稱為圖案3或p3),如習 知所述。在電池1由P1溝槽6的最外緣至相鄰p3溝槽7 的最外緣所定義的狹窄區域無法用來收集光伏電流,為有 效率的失去或遮蔽(dead)區9。在電池i中的各區段複製 此區域,且其數量可為電池!可用的主動區的數百分比。 因此’必須縮小遮蔽區9的數量’以獲得較大的電池效率。 可藉由檢小η至P2溝槽6、7間的距離’及P2&quot;3溝槽 7、8間的距離來縮小遮蔽區。然而,若任何圖案交疊( ) 則會造成區段間内連線的失效。亦即若溝槽順序ρι_ρ2_ρ3 被破壞’將會造成太陽能電池i功率的降低。縮小溝槽間 的距離必須在各製程步驟中設置有準確的雷射光束\^得 遮蔽區可縮小,但可避免溝槽圖案的交疊。 在雕刻製程開始之前’設定各製程P1_P2_P3w雷射雕S 8 201210731 is a single, tandem, multiple junction; each junction may in turn have a PIN or NIP structure. Therefore, the electrode layer includes a surface which is processed by a laser engraving device. The glass substrate can be any glass substrate suitable for use in the fabricated thin film device known to those skilled in the art. In a preferred embodiment, the glass substrate is a float glass, a security glass, and/or a quartz glass. Floating glass, preferably of a size larger than that typically used to make solar cells, is typically formed in a f〇rming chamber by delivering molten glass, preferably continuously, to an extended tin bath (extended tin bath) ). The molten glass is then distributed over the surface of the tin and/or the molten glass is elongated in at least one direction with a suitable tool as a flat continuous glass film or layer. The shape and thickness of the formed glass film can be adjusted by carefully controlling the cooling and elongation process. The deposition of the thin film layer according to the present invention can be carried out by various deposition techniques known to those skilled in the art. In a preferred embodiment of the present invention, the deposition of the thin film layer is by chemical vapor deposition or physical vapor deposition. Vacuum sputtering process. The vapor deposition process is preferably a plasma chemical vapor deposition (pECVD), a normal pressure chemical vapor deposition (APCVD), and/or an organometallic ruthenium vapor deposition (M0CVD) process. The transparent electrode deposited on the glass substrate may comprise any known suitable material. It preferably comprises a transparent conductive oxide (four) coffee - c-uctive 0xlde; TC0), more preferably zinc oxide or indium tin oxide (no). The deposition of the front electrode is preferably by vacuum/magnetron sputtering (VaCuum/magnetron) sputtering, evaporation, or chemical vapor deposition, 201210731 is better to utilize low pressure chemical vapor deposition (LPCVD), and the best system Low pressure chemical vapor deposition was carried out using diethyl zinc as a precursor to form a zinc oxide thin film layer. Those skilled in the art can provide any suitable tool as a positioning element, preferably a flat table top and/or support substrate disposed thereon. Similarly, a person skilled in the art can provide a laser tool to incident a laser beam onto a diffractive optical element, such as, for example, U.S. Patent No. 4,292,092 and/or Us 1 985/45,425,78. The laser tool preferably operates at a second harmonic wavelength (2nd harmonic wavelength; 532nm) and/or a third harmonic wavelength (3rd harmonic wavelength; 532nm) in the infrared region of the spectrum, and the pulse wavelength of the laser tool pulse ( The pulse length) ranges from 〇〇1 to 5 〇 nanoseconds, and its operating pulse repetition frequency ranges from 1 kHz to 40 MHz, preferably 40 MHz. The trench process in the substrate is performed by a laser engraving device such as a so-called #Pb P2 and/or p3 pattern, or a single laser for edge and/or lateral isolation (transverse is〇lati〇n) Engraving pattern P4. The moving element preferably comprises a conveyor and/or a belt and is adapted to move the substrate at a fixed speed, and the direction of movement is preferably parallel to the groove &amp; direction. In another preferred embodiment The moving element is used to move the optical head such that the substrate is laser engraved on a plurality of paths. Therefore, according to the present invention, it is preferred to respectively utilize a laser beam that is multi-split by the diffractive optical element to form a trench in the substrate, and each of the laser beams has a predetermined distance from the gate, which is coupled with diffractive optics. The inter-angles of the elements are related to 'the grooves created in the substrate are separated from each other by a pitch. When the adjustment element rotates the diffractive optical element, the size of the pitch is changed with respect to the position of the angle of 10 201210731. Here, according to the whole element, Zizhan &lt; 《 Τ ' 调 调 调 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变 改变士血妨· 'The angle between the eight angles, the intersection between the first plane and the second plane = degree. Preferably, the direction of movement is better than the direction of the groove. The closest distance between two adjacent grooves is measured by the adjacent grooves. π is in the preferred embodiment - angle η. And money. And/or the angle: at least the adjacent two grooves at least partially overlap. Due to at least the adjacent two grooves: partial overlap&apos;, it is possible to accurately determine, for example, that all material layers of the solar cells in the continuous zone are removed. When the angle is. . Preferably, the "single" groove is formed by a plurality of &quot;beams&apos; and the angle is 90. Preferably, the pitch is equal to the distance of the laser beam. In another preferred embodiment of the invention, the second plane is substantially orthogonal to the first plane and/or the optical axis is substantially orthogonal to the first plane. The laser optical head preferably produces S3 and $9 laser beams, preferably producing 4 laser beams, wherein the multiple apertures are preferably parallel to each other. In still another embodiment, the adjustment member forms a pitch of 24 mm and a thickness of $1. 8 mm, preferably &amp; 5. 5 mm and $8.5 mm, more preferably $〇.i mm. The laser optical head preferably achieves micron groove position accuracy, preferably $3 microns. In another embodiment, multiple laser beams are disposed to form trenches in the thin film material deposited on the surface. The film material may comprise an amorphous and/or microcrystalline film provided with a PIN or NIP junction structure parallel to the film surface. The piN/NIp structure can be sandwiched between transparent thin film electrodes' which can be continuously extended in a plurality of regions of a major surface of a substrate, such as a transparent substrate or a superstrate. The method includes performing a laser process on a surface of a substrate, comprising the steps of: (a) setting the surface of the substrate in a first plane, and (b) splitting a single laser light by a diffractive optical element Generating multiple laser beams such that the multiple laser beams have a predetermined fixed distance from each other, and the multiple laser beams are arranged in parallel to define a second plane, (c) focusing the multiple laser beams to Forming a parallel groove on the surface such that the first surface and the second surface form a cross line ' and the individual laser beam is incident on the substrate to form the groove in the surface, such that the substrate The trenches are spaced apart from each other by a pitch, and the pitch is adjusted by changing the desired moving direction and the angle between the intersecting lines, and (d) is relative to the substrate in a moving direction Moving the laser beam multiple. In a more preferred embodiment, the second plane is disposed to be substantially orthogonal to the first plane. Preferably, changing the desired direction of movement and the angle between the lines of intersection is affected by the rotating diffractive optical element. More preferably, the diffractive optical element is rotated by a moving stage that is rotatable along an optical axis on which the diffractive optical element and a focus for focusing the multiple laser beam are focused The objective lenses are spaced apart from each other. In another embodiment, the diffractive optical element rotates in a third plane, and the third plane is generally orthogonal to the incident single laser beam and/or substantially orthogonal to the second plane. In yet another embodiment, 12 201210731 the above method includes correcting an angle between the direction of movement and the line of intersection. In the case of f, the angle is ^. And S 9. . And/or setting the angle such that the adjacent trenches at least partially overlap. In a more preferred embodiment, step (e) is optionally performed at an angle to form at least partially overlapping trenches. In a preferred embodiment, the diffractive optical element is arranged to produce ^ 3 and S 9 thunder The beam of light is preferably four laser beams. Preferably, adjusting the direction of movement and the angle between the parent and the line is such that the pitch is "off and ^ 10.8 off, preferably g5.5 and 5, and better." in a better embodiment. The diffractive optical element is arranged to focus the multiple laser beam on the substrate 'thus achieving a groove positioning accuracy of $1". Those skilled in the art can derive the advantages of more embodiments and/or methods of performing a laser process on the surface of a substrate in accordance with the laser optical head and/or laser engraving apparatus previously described. Another object of the present invention is to further provide a method of fabricating a thin film solar cell comprising the steps of: (1) depositing a thin film material on a substrate, and (2) utilizing any one of claims 16-16. Method of performing a laser process on the substrate, wherein the film material comprises processing the surface, or (2') using the laser engraving device according to any one of claims 8-15, the substrate (7) is subjected to a laser The firing process, wherein the thin material comprises treating the surface. In a preferred embodiment, step (2) or step (2) comprises performing a laser process on at least 20% of the surface area of the substrate. Preferably, the surface is processed in a vertical direction of the 13 201210731 ribbon and the segment trench. The above steps are preferably repeated, for example, in thousands of overlapping lateral grooves to effectively increase light penetration in the solar cell. Still another object of the present invention is to achieve the use of the laser engraving apparatus to cut the substrate into a plurality of sections, including a thin film solar cell including the substrate and a thin film material deposited thereon. And the film material includes the surface treated by the laser engraving device. The above and other objects, features, and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; A cross-sectional view of a portion of the thin film solar cell 1. A transparent upper electrode layer 3 is provided on the transparent insulating substrate 2, a photoelectric conversion semiconductor 4 is formed on the transparent upper electrode layer 3, and a transparent back electrode 5 is formed on the photoelectric conversion semiconductor 4. The photoelectric conversion semiconductor 4 includes an amorphous and/or microcrystalline film stack. Figure 1 shows the grooves 6, 7, and 8. The purpose of the above structure is to establish a monolithic photovoltaic module consisting of multiple solar segments electrically connected in series. Therefore, the transparent electrode layer 3 is divided by the first isolation trench 6, which determines the width of the battery section. The photoelectric conversion semiconductor layer 4 is filled in the above-mentioned trenches, and in the manufacturing process, the order of the overall layered stacking is: layer 3, trench 6, layer 4, trench 7, layer 5, trench 8. The trenches 7 filled with the material of the transparent back electrode layer 5 are electrically connected to adjacent cells. Fact 14 201210731 ^The back electrode 5 of the battery 1 is in contact with another adjacent gyroscopic upper electrode 3. The temple surface electrode layer 5 and the photoelectric conversion semiconductor 4 are divided by the second isolation trench layer 8. The process of the above structure preferably uses a method such as laser light. The manufacturing method of the thin film solar cell is as follows: First, a transparent electric (4) 3 is deposited on the transparent insulating substrate 2, for example, by using a low-pressure chemical vapor deposition process, the transparent electrode layer 3, also referred to as a transparent conductive oxide ((10) includes, for example, zinc oxide ( Zn〇), tin oxide (Sn〇2) and/or indium tin oxide (_. Then 'remove the partial transparent electrode layer 3 by laser engraving to form the first isolation trench 6' which will be transparent (4) 3 Divided into a plurality of isolated, adjacent layers. Next, on the transparent electrode layer 3, electrical chemical vapor deposition is performed to deposit the photoelectric conversion stacked layer 4. The stacked layer 4 includes at least one p-doped layer, 1-essential layer &amp; The η-doped layer is, for example, in a thin film amorphous stone. The above steps can be repeated to form a multi-junction amorphous germanium thin film solar cell. Therefore, the ρ+η junction can be made of microcrystalline (mierQeystaU ine) material or amorphous. And a mixed material of microcrystals is formed to establish the photoelectric conversion layer 4. Then, the photoelectric conversion semiconductor layer 4 is laser-engraved to remove a portion of the photoelectric conversion semiconductor layer 4' to form the photoelectric conversion semiconductor layer 4 into a plurality of isolation layers 4 grooves 7. Next The back surface electrode layer 5 is deposited to fill the trench 7, thereby forming a contact line and covering the photoelectric conversion semiconductor layer 4. The back surface electrode layer 5 may also be a transparent conductive oxide (TC0) such as zinc oxide (Zn〇). ), tin oxide (Sn〇2), indium tin oxide, or a metal layer such as aluminum, or a combination of the foregoing. Finally 'laser engraved photoelectric conversion semiconductor layer 4 and back surface electrode layer 15 201210731 to form a second isolation trench 8 which divides the photoelectric conversion semiconductor layer 4 into a plurality of photoactive layers 4 or segments electrically connected in series, thereby fabricating the thin film solar cell 1 shown in FIG. 1 The embodiment discloses that the TC0 layer 3 is divided into a plurality of electrical isolation regions by solar engraving trenches in a space of approximately 5-1 0 mm intervals, between the solar cells, the cell 1 and extending over its entire length. The laser-transformed semiconductor layer 4 is laser-etched. The trench 7 engraved in this layer should be parallel to the trench initially in the TC0 layer 3, and its overall length is generally within 5-30 mm, and as close as possible to the initial trench. Slot 6, generally between 10 and 150 millimeters After depositing the back surface electrode layer 5, a trench 8 is formed by laser, which simultaneously divides the back surface electrode layer 5 and the photoelectric conversion semiconductor layer 4 to complete the electrical series interconnection of the segments. 8 is parallel with the initial trench 6 in the TC0 layer, and its overall length is generally within 5_3 mm, and as close as possible to the trench 7 of the photoelectric conversion semiconductor layer, generally having a distance of 10 to 150 mm. The solar cell 1 of the solar cell section can reduce the leakage current of the thin film solar cell, and the voltage generated by the entire panel is generated by the potential formed in each cell and the multiple cells. In general, the 1.4 m2 panel is Divided into 50-200 batteries, so that the output voltage of the overall panel is in the range of 30-200V. In addition to the materials described in US 4, 292, 092 and JP 591 72274 (US 1985/4542578), thin film solar cells can be fabricated using many other materials 1° in other equivalent devices 'photoelectric conversion semiconductor layer 4 16 201210731 CdTe, copper-indium-diselenide (CIS), copper-indium-gallium-diselenide (CIGS), crustalline silicon on Glass ; CSG) and so on. A portion or all of the trenches 6, 7, 8' of the layers 3, 4, 5 are typically engraved using a laser to form a plurality of solar cells 1 having series interconnects in these devices. The grooves 6, 7, 8 are engraved in layers 3, 4, 5, respectively, sometimes applying a laser beam from the side coated with the glass plate, but it can also apply a laser beam from the opposite side. The film passes through the glass before the reaction. The laser used is typically operated in the infrared (IR) range of the spectrum, but can also be used, for example, at a 2nd harmonic wavelength at 532 nm and a second s wavelength at 532 nm (3rd harmoni c wave) 1 ength). In general, the pulse wavelength (pUlse length) of the laser pulse ranges from 〇〇1 to 50 nanoseconds, and the operating pulse repetition frequency ranges from 1 kHz to 1 MHz, but it can be as high as 4 〇 MHz. . Using a optomechanical system, generally referred to as an optical head, directs the laser beam onto the layer stacks 3, 4, 5 for the conventional optical head system, designed to provide an efficient material for the process The intensity distribution above. Thin film solar cells can also be fabricated on non-transparent substrates such as metal sheets. In this embodiment, it is impossible to illuminate through the substrate 2, so that all of the engraving process beams must be shot by the coated side. In some other embodiments, the solar panel is fabricated on an elastic substrate 2, such as a thin metal or polymer sheet. In the above example, only the first side of the coating can be used for the first shot. In the example described later, the light from the coated side or through the base 17 201210731 board 2 is likely to be in the sun. The position of the groove 6 on the 1 determines the width of the segment. The width of the segment is selected, depending on the size of the battery, depending on the electrical properties of the battery 1 to be too IW. For example, the arm is wider from the wide aa. The area ^ will increase the leakage current I sc (sc is short circuited), and the narrower (ie, more) section will increase the open circuit voltage. Other factors that may affect the width of the segment trenches 6, 7, 8 include a combination of a battery connection, a parallel connection, or other battery connections, whereby the upper electrode layer 3 and the back electrode layer 5 are The influence of the material layer resistance is optimized to generate leakage current in the battery. In order to achieve an effective series connection between the sections of the solar cell 1, each trench 6 (also referred to as pattern 1 or P1) should be constructed with trenches 7 (also referred to as pattern 2 or p2) and then trenches 8 are constructed. (Also referred to as pattern 3 or p3), as conventionally described. The narrow region defined by the outermost edge of the cell 1 from the outermost edge of the P1 trench 6 to the outermost edge of the adjacent p3 trench 7 cannot be used to collect photovoltaic current for efficient loss or dead zone 9. This area is copied in each section of battery i, and the number can be battery! The percentage of active zones available. Therefore, the number of masking areas 9 must be reduced to obtain greater battery efficiency. The masking area can be reduced by detecting the distance between the η to P2 trenches 6, 7 and the distance between the P2 &quot; 3 trenches 7, 8. However, if any pattern overlaps ( ), it will cause the interconnection of the segments to fail. That is, if the groove order ρι_ρ2_ρ3 is broken, the solar cell i power is lowered. To reduce the distance between the grooves, an accurate laser beam must be set in each process step. The mask area can be reduced, but the overlap of the groove patterns can be avoided. Before the start of the engraving process, set the P1_P2_P3w laser engraving for each process.

S 18 201210731 刻工具在正確的距離設置 知技術中此步驟有賴…二冓槽6、7、8的位置。在習 、权正程序,其係藉由光學頭10的位 置來比較欲得溝槽6、7、β Μ , 8的位置及溝槽6、7、8的實際 位置’並根據需要修正氺 &quot;先學頭10的位置。此步驟在太陽能 &gt;上需要圖案排列元件或基準點(fiducials),且其進 行的::可改變,當所選的區段寬度為初次形成,則僅需 =仃-次’而一直到每—次利用上述工具形成太陽能電池 基板2時都需進行。明顯地’在習知技術 及/或各光學頭必須進行—次校正程序,且校正程序必須進 订的頻率越高’雷射製程步驟的整體週期時間就越長。若 排列X件測量系統或光學頭位置系統的準確度與穩定度遠 小於欲付區段溝槽6、7、8的位置準確度時,校正的頻率 則需增加。 雷射製心步驟的整體週期時間影響太陽能電池製造的 整體產犯,因此縮短時間可改善太陽能電池1的經營成 本縮紐雷射週期時間的數個方法包括操作多重光學頭1 〇 而將多重雷射光束12射至太陽能電幻,以在太陽::池 2的長邊上同時製造許多平行的區段溝槽6、?、8。上述方 法需要光學頭10或基板2的通過次數較少。如前述,在習 、統中必須校正各雷射光束及各光學頭1 〇以將區段溝 槽6、7、8準確的設置於太陽能電池1上。 平行且3又置在靠近太陽能電池1邊緣的邊緣隔離溝槽 ...... 的,因此在區段的一端與其他區段間、或與太陽能 電池1上用於收集電流的接觸區間不會產生電流短路。短 19 201210731 路’亦即分流(shunt),可降低太陽能電池的功率效能。 與區段溝槽正交的橫向隔離溝槽,其可橫跨太陽能電 池1,一般用於限制可流過電池1的最大電流,其中避免 太陽光照而避免電池上述區域的損害及太陽能電池丨整體 效能的降低。 邊緣及橫向隔離溝槽的形成皆可利用在區段製程 P1-P2-P3之後進行單一雷射雕刻製程,或利用與溝槽雕刻 成為P1及P3的一部分之製程。在上述兩者中皆需基板2 上太陽能電池1的所有材料層,並在隔離溝槽間提供足夠 的電阻。 -般而言’多次利用基板2或光學元件通過而形成多 重距離非常近或重疊的隔離溝槽6、7、8,此時相鄰溝槽6、 7、8的中心距離小於各溝槽的寬度。多重隔離溝槽6、了、 8降低隔離分流、或其他失效的可能性,導致會造成電池 性能降低的電流短路。 然而,隔離溝槽6、7、8的數量及距離越大,太陽能 電池1無法產生電流的區域也越大。在_般結合ρι及 以形成隔離溝槽6、8的製程中,P1及後續的P3溝槽6、丨 f此必須準確的重疊,以確保移除在連續區中太陽能電池 的所有材料層3、4、5。在製造環境中,為了在不同雕刻 =中實際上達到準確設置’必須多重、距離相近或重疊 1及P3組溝槽6、8,以確保兩製程重疊在太陽能電池 上’且形成有效的隔離溝槽。 形成隔離溝槽所需雷射雕刻溝槽6、?、8的數目以及 20 201210731 其彼此間距離的情況,會相當程度的影響製程時間,且可 佔雷射製程步驟的整體週期時間很大的一部分。 這些薄膜太陽能電池裝置的主要特性在於雕刻數個溝 槽6 7、8,各溝槽長度達一或多公尺,以在面板上形成 複數個區段。因此,每一層的整體雷射溝槽長度必須達1〇〇 公尺或超過1〇〇公尺。上述雷射溝槽必須在可接受的面板 製程週期時間内利用工業雷射雕刻工具所形成。其一般為 小於2分鐘,因此雷射雕刻速率必須達到每秒數公尺。 在雷射雕刻工具中,當雷射光束入射至太陽能電池1 或基板2上,利用雷射光照的太陽能電池丨的區段係倚賴 光干頭10的移動,其將雷射光束射至太陽能電池1及基板 2,其一可為固定或相對於參考的機械框架而移動使得持 續的溝槽6、7' 8形成在太陽能電池層中。 一種習知方法係利用單一光束雕刻所有的線,但利用 電流計驅動鏡掃描系統(galvan〇meter叶“印 SCanner ”以㈣)使光束高速移動。例如在美國專利公開號 US2003/0209527A1所述。利用掃描系統在全寬6〇〇毫 米的寬面板上移動雷射先束’其移動速度達4 metres/sec,且面板以正交方向通過掃描單元。前述習知 技術的缺點在於為了覆蓋面板的整體寬度,必須利用具有 較大掃描場範圍的掃描鏡。這通常表示掃描鏡具有相當長 的“、、距此匕外,在每次掃描時,通常也必須利用具有第三 軸的掃描系統以動態調整光束尺寸的延伸,以維持聚焦在 整體面板寬度。S 18 201210731 Engraving tools at the correct distance setting This step depends on the position of the two slots 6, 7, and 8. In the program of right and wrong, the position of the grooves 6, 7, β Μ , 8 and the actual position of the grooves 6, 7, 8 are compared by the position of the optical head 10 and corrected as needed. First learn the position of the first 10 . This step requires patterning elements or fiducials on the solar energy &gt; and it can be changed:: when the selected segment width is formed for the first time, it only needs to be =仃-times until all When the solar cell substrate 2 is formed by the above tools, it is required to perform. Obviously, the conventional technique and/or each optical head must perform a calibration procedure, and the higher the frequency at which the calibration procedure must be customized, the longer the overall cycle time of the laser processing step. If the accuracy and stability of the X-piece measurement system or the optical head position system are much smaller than the positional accuracy of the segments 6, 7, and 8 to be paid, the frequency of correction needs to be increased. The overall cycle time of the laser centroid step affects the overall production of the solar cell manufacturing, so shortening the time can improve the operating cost of the solar cell 1 and several methods of reducing the laser cycle time include operating the multiple optical heads 1 The beam 12 is directed to the solar power illusion to simultaneously create a plurality of parallel segment grooves 6, on the long side of the sun:: pool 2. ,8. The above method requires less passage of the optical head 10 or the substrate 2. As described above, it is necessary to correct the respective laser beams and the respective optical heads 1 to accurately set the segment grooves 6, 7, 8 on the solar cell 1 in the conventional system. Parallel and 3 are placed close to the edge of the solar cell 1 to isolate the trenches, so the contact between the one end of the segment and the other segments, or the solar cell 1 for collecting current is not A current short circuit will occur. Short 19 201210731 Road 'is shunt, which can reduce the power efficiency of solar cells. a lateral isolation trench orthogonal to the segment trenches, which can span the solar cell 1 and is generally used to limit the maximum current that can flow through the cell 1, wherein solar illumination is avoided to avoid damage to the above areas of the cell and the overall solar cell Reduced performance. The formation of the edge and lateral isolation trenches can be performed by a single laser engraving process after the segment process P1-P2-P3, or by a process of engraving the trench into portions of P1 and P3. In all of the above, all material layers of the solar cell 1 on the substrate 2 are required and sufficient resistance is provided between the isolation trenches. Generally speaking, the substrate 2 or the optical element is used multiple times to form isolation trenches 6, 7, 8 having multiple distances or overlapping, and the center distance of adjacent trenches 6, 7, 8 is smaller than each trench. The width. Multiple isolation trenches 6, 8 reduce the possibility of isolated shunts, or other failures, resulting in shorted currents that can degrade battery performance. However, the larger the number and distance of the isolation trenches 6, 7, 8 are, the larger the area in which the solar cell 1 cannot generate current. In the process of combining the cells and forming the isolation trenches 6, 8, the P1 and the subsequent P3 trenches 6, 丨f must be accurately overlapped to ensure removal of all material layers of the solar cells in the continuous region. 4, 5. In the manufacturing environment, in order to actually achieve the exact setting in different engravings = 'multiple, close or overlap 1 and P3 groups of grooves 6, 8 to ensure that the two processes overlap on the solar cell' and form an effective isolation trench groove. The laser engraving groove 6 required to form the isolation trench, ? The number of 8 and the distance between 20 201210731 and the distance between them will affect the process time to a considerable extent, and can account for a large part of the overall cycle time of the laser process step. The main feature of these thin film solar cell devices is the engraving of a plurality of trenches 6, 7 and 8 each having a length of one or more meters to form a plurality of segments on the panel. Therefore, the overall laser trench length of each layer must be 1 metre or more than 1 metre. The above laser trenches must be formed using an industrial laser engraving tool within an acceptable panel process cycle time. It is typically less than 2 minutes, so the laser engraving rate must be several meters per second. In the laser engraving tool, when a laser beam is incident on the solar cell 1 or the substrate 2, the section of the solar cell using the laser illumination depends on the movement of the optical head 10, which emits the laser beam to the solar cell. 1 and the substrate 2, one of which may be fixed or moved relative to the reference mechanical frame such that the continuous grooves 6, 7' 8 are formed in the solar cell layer. One conventional method uses a single beam to sculpt all of the lines, but uses a galvanometer to drive the mirror scanning system (galvan〇meter leaf "Print SCanner" to (4)) to move the beam at high speed. For example, it is described in U.S. Patent Publication No. US 2003/0209527 A1. The scanning system was used to move the laser beam on a wide panel with a full width of 6 mm. The moving speed was 4 me/sec, and the panel passed the scanning unit in an orthogonal direction. A disadvantage of the prior art described is that in order to cover the overall width of the panel, it is necessary to utilize a scanning mirror having a large scanning field range. This usually means that the scanning mirror has a relatively long ", out of this range, and each scan must also utilize a scanning system with a third axis to dynamically adjust the beam size extension to maintain focus on the overall panel width.

21 S 201210731 因此在控制系統上增加了複雜性,掃描鏡所需要的長 焦距導致所形成的焦點最小尺寸受到限制,因此所製造的 溝槽寬度不如欲得寬度㈣。i當具有鏡焦距的掃描系統 尺度造成位置设置的錯誤,也造成準確設置溝槽的困難。 上述困難都會造成問題,因理想的溝槽6、7、8的寬度應 該儘可能的狹窄,且相鄰溝槽應儘可能靠近以縮減溝槽6、 7、8之間的遮蔽區。此外,由於光學系統要達到線掃描(i n e scan)的限制,此方法一般限於雕刻與面板較短方向平行的 面板,一般長度達600豪米。上述系統無法形成與面板長 軸平行的溝槽6、7、8。 在一些習知的例子中的工具在雕刻時具有固定的光學 το件’亦即面版必須非常快速的移動。為了避免過大的面 板速度,常利用多重光學系統以產生平行的雷射光束來製 造溝槽6、7、8。在-例子中,尺寸約llm χ丨&amp;的面 板需要100個分別的溝槽6、7、8,其可在6〇秒内有8個 平行的雷射光束,且面板以少於的最大速度移 動。在許多雷射工具結構中具有多重光束方法。 習知的另一個方法係利用由功率相對低的單一雷射所 且成的光學系統’例如其功率在355nm或532nm時少於5W, 或在l〇64nm時少於i〇w。此低功率雷射耦接至將雷射傳送 至工作件的單一光學頭。複數個上述的光學系統組裝在工 八中以增加淨處理速度。在德國專利申請號N〇. DE 1〇 2〇〇6 〇33 296. 2及美國專利中請號ν〇· US 2008/0263877中有 上述系統的描述。 22 201210731 上述方法的缺點在於其面板或所有的光學系統必須以 與溝槽方向正交的方向進入’以在整個面板上都覆蓋有溝 槽6、7、8。Φ即,其定位系統必須非常準確,否則在光 學頭10的所有位置都必須進行每個雷射光束位置的校 正二以達模組需求的必要準確度。具有多重雷射來源的系 統花費通常很高,且會負面影響太陽能電池的經營成本。 此外,大量的雷射光源需要常規的保養服務且整體而言失 效的機率較高,因此降低可正常運作的時間且增加經營成 本。 習知另一個方法係利用由相對高功率的單一雷射所組 成的光學系統,例如在355nm的功率高於low,或在532nm 尚於5W ’或在i〇64nm高於20W。高功率雷射光束而後藉由 偏光***(polarization division)或強度*** (intensity division)以將多重雷射光束傳至複數個光學 頭10,般為2-4個。在此例子中,單一雷射工具可裝置 有許多上述光學系統。在德國專利申請號N〇. DE 2〇〇6 033 296. 2中有上述系統的描述。上述工具結構的優點在 於母個工具僅需要一個,或一般為二個,雷射光源,因此 減少母個工具之雷射光源的停工時間(d〇wnt丨me )。 然而’在上述光學系統中的校對、偏光控制及光束功 率的平衡在實際運用上複雜且耗時。光學系統中雷射光束 性質的任何改變,例如光束位置、功率、強度輪廓 (profile),可造成面板的上在製程區域的各光束間的重大 改變。光束間的功率改變及輪廓改變會影響溝槽6、7、8 23 201210731 的品質’而光束間位置的改變可造成需要頻繁的校正操 作。因此,由於必須有頻繁校正的常態工作且進行校對確 認,而造成工具可正常運作時間的縮短。 上述所有的習知雷射工具的光束位置一般為在工具中 直線雷射陣列中,#具有與溝槽方向正交的直線轴。為了 在工具上使雷射在兩個正交的方向上雕刻面板例如形成 邊緣隔離及橫向隔離溝槽6、7、8,可以只利用_個雷射 光束雕刻面板的所有路徑,或在工具中選轉面板以形成正 交溝槽6、7、8。在上述第-個方法的例子中,此單一光 束的製程沒有效率且通常佔卫具週期時間报大的_個因 素。在上述第二個方法的例子中,面板旋轉時間增加了工 具的周期時間。一般而t,面板尺寸為非對稱的,且工具 結構通常由於缺乏包含面板長邊的空間而造成面板無法旋 轉,該面板的長邊係在主要溝槽方向的正交方向。 可設置具有多重光學頭10的雷射雕刻工具使得多重 雷射光束可射向太陽能電池i,其多重雷射光束的方向正 交於區段溝槽方向,因此在太陽能電幻的長邊上可同時 產生數個平行的區段溝槽6、7、8。 然而,上述方法不適用於設置與主要區段溝槽6、了、 8方向正交的邊緣隔離溝槽及橫向隔離溝槽。在設置需 高準確度多重重疊或距離相近的邊緣隔離溝槽及橫向隔: 溝槽時,其方向與區段溝槽6、7、8的方向平行然而、 須在與區段溝槽6、7、8正交的方向準確定位才可以準与 設置區段溝槽6、7、8。機械系統的光學頭ig在兩個 24 201210731 準確設置溝槽因此相當複雜。—般而t,較簡單 -上二、留下一個光學頭1〇及雷射光束’而機械上或光 子上的關閉其他所有的光學頭1〇及雷射光束,使得一次口 :設置一個隔離溝槽6、7、8。沒有多重平行光束的製程, 元成圖案化6、7、8所需時間變得佔據雷射製程整體周期 時間的一大部分’且影響模組的經營成本。 能夠簡單的調整電池區段寬度、並在區段及隔離溝槽 多重圖案化及溝槽位置校正的耗減少的方法,冑有利於雷 射製程時間,且因此利於製造太陽能電池的經營成本。 根據本發明所提供的解決方法設置有光學頭1 〇,其利 用繞設光學元件(D0E)n以提供多重雷射光束12。在光學 頭10中,繞設光學元件u與聚焦物鏡13組合。繞設光學 π件11係單一、小型的光學構件,其可將入射雷射光束 14***成在特定的第二平面15中的多重雷射光束12。由 早一 D0EU所產生的光束12具有幾乎相等的強度,且彼此 門具有固疋的間隔角度(angular 並光學頭1〇 的光學轴16為中心。 而後’由DOE 11而來的多重光束12入射至聚焦物鏡 13,其將雷射光束12射入並聚焦在太陽能電池i上,以進 行太陽能電池堆疊3、4、5的製程。聚焦物鏡13的光學效 此’與DOE 11特定的光束***間隔角度X以及光學頭丄〇 與太陽能電池基板2的距離相配。由光學頭1〇的d〇E 11 所圖案化所得的電池區段寬17,係由d〇e 11的***角度 α及光學頭10及D0E 11間的距離18所決定。 25 201210731 在第2圖中,顯示太陽能電池製程中,入射雷射光束 14通過光學頭10可能的路徑以及所行成的多重聚焦雷射 光束1 2。在此實施例中,設置DOE 11,使得單一入射光束 14***為四個分開的光束12,其而後聚焦在太陽能電池堆 疊層3、4、5上,而能夠同時在太陽能電池1中形成四個 區段溝槽6、7、8。藉由在光學雷射頭10中旋轉DOE 11, 所形成在相鄰雷射光束12間正交於主要溝槽方向24的節 距(pitch)ll,亦即電池區段寬17,可依照不同製程需要 調整’因此提供了基板2的雷射處理的彈性,例如用以雕 刻太陽能電池堆盤層3、4、5。 根據本發明一實施例’ 一般的電池區段寬度1 7,即節 距17 ’介於5. 5至8. 5mm之間,但也可大到1〇 8随。如第 2圖所示’其係由d〇E 11至聚焦物鏡13的距離18,以及 DOE 11的***角度間隔α所決定,然而,其通常被聚焦 物鏡13的最大光學直徑1 9所限制。在一實施例中,D〇E工i 的角度間隔α —般可藉於1 · 5度至5度,但也可大到6. 5 度,而DOE 11與聚焦物鏡13的距離18 —般係在7〇至15〇mm 的範圍内。聚焦物鏡13適當的光學直徑19可在25至5〇隨 的範圍内。 在第3A至3C圖顯示在一可能的實施例中光學頭的工 程繪示圖。其包括中心設置區(central m〇unting bi〇ck) 设置有其他組件,包括聚焦物鏡13、DOE 11、及用於沿著 光學轴16旋轉D0E 11的調整元件21,例如機動台21。圖 中其他額外的元件係使光學頭1 〇在雷射雕刻工具中可正 26 .201210731 確運作的必要元件,包括:校對及位置控制系統、光束光 閘(beam shuttering)、以及設定及維護通道(setup and maintenance access)。然而,這些並非本發明之標的,因 此並未近一步詳述,但為本領域技藝人士可應用及/或了 解。整體組裝過程分別進行轉換及評估階段,其可準確的 叹置用於進行太陽能電池堆疊層3、4、5製程的光學頭 及多重雷射光束12。 如此緊密的組件排列,使得低重量的組件在需要快速 製程時可以高速移動’且可設計為具有高位置穩定性。此 外’在光學軸16的材料長度很短,因此組件對於環境改變 而產生的熱膨脹的容忍度更高。藉由選擇適當的D0E 11及 聚焦物鏡13,可利用一個光學頭1〇來提供3至7個的多 重光束12。 在_後方的多重光束12中的***角度間隔。的 準確-般小於0.1 mrad,且結合光學頭i。至_ U間隔 18約為100随,造成區段溝槽6、7、8的位置準確度大於 10毫米。然而’相較於其他形式的傳統光束***光學元件 上述光束間隔的穩定性已大幅提升,傳統的光學元件的職 11系統仰賴整合至doe 11紝糂认、田《 匕11 4的週期性精密標度元件 (periodic fine scale features)。 DOE n係利用適當的光學材料所製作,例如_石 (fused S1llca),其預期經過一段 町间设具穩定性且在環 境糾(如溫度)下不改變。光學頭1〇的_u緊密設置 以單一光學件提供多重區段溝 0 7、8 ’並具有高度 27 201210731 位置準確性及良好的穩定性。 克服穎的利用光學頭10的D〇Eu,而能夠 ::备電池區&amp;寬17改變時在機械定位上光學頭i。重複 進扞…从4由於疋位系統其他改變或偏移所必須 進订的杈正的複雜性。此光 + 子碩的D0E U之新穎的使 用方法也使得雷射雕刻工具 圖案化邊緣隔離及橫向隔離 溝槽6、7、8,並維持利用多 更元束12因此減少整體雷 程的週期時間。這些特徵在第4A及4B圖中將更進一 步的說明。 ,如上述,D0E 11在特定平面15中提供了多重光束12 ^的角度間隔°參照第4U4B圖’在第-製程平面23 的夕重光束12的距離22決定電池區段寬度17。平面22 的方向對應於週期性精密標度元件在D〇E丨丨結構中的方 向。 ,藉由沿著光學頭10的光學軸16旋轉D0E 11,可旋轉 涌面17,且其中具有***的多重光纟12。當多重光束12 、過聚焦物鏡1 3 ’且考慮到在區段溝槽方向24的正交方 的這些光束12的間隔或距離22’其係在多重光束12 、又25及太陽能電池1基板2間所繪直線的角度,這些 多重朵 的“束所雕刻的有效電池區段寬度17將直接隨著產物 、餘弦(cosine)角0及多重光束12的距離22而改變。 ^在實際應用中’沿著光學頭10的光學轴16旋轉的d〇E 箸*可藉由設置DOE 11的高準確度移動台21,因此可沿 光學轴16準確的旋轉,且其移動角度θ至少9〇。且準21 S 201210731 therefore adds complexity to the control system, and the long focal length required for the scanning mirror results in a limited minimum focus size, so the width of the groove produced is not as wide as desired (4). i When the scanning system with mirror focal length causes the position setting error, it also causes the difficulty of accurately setting the groove. The above difficulties can cause problems because the width of the ideal grooves 6, 7, 8 should be as narrow as possible, and the adjacent grooves should be as close as possible to reduce the shadow area between the grooves 6, 7, 8. In addition, since the optical system is limited to line scans, this method is generally limited to engraving panels that are parallel to the shorter direction of the panel, typically up to 600 meters in length. The above system cannot form the grooves 6, 7, 8 which are parallel to the long axis of the panel. In some conventional examples, the tool has a fixed optical τ when it is engraved. That is, the panel must move very quickly. To avoid excessive panel speeds, multiple optical systems are often utilized to create parallel laser beams to create trenches 6, 7, 8. In the example, a panel of approximately llm amp&amp; requires 100 separate grooves 6, 7, 8 which have 8 parallel laser beams in 6 seconds and a panel with less than the maximum Speed moves. There are multiple beam methods in many laser tool configurations. Another conventional method utilizes an optical system made up of a single laser having a relatively low power, e.g., having a power of less than 5 W at 355 nm or 532 nm, or less than i 〇 w at 10 〇 64 nm. This low power laser is coupled to a single optical head that delivers the laser light to the workpiece. A plurality of the above optical systems are assembled in the eighth to increase the net processing speed. A description of the above system is found in German Patent Application No. N. DE 1〇 2〇〇6 〇 33 296. 2 and U.S. Patent No. ν 〇 US 2008/0263877. 22 201210731 A disadvantage of the above method is that its panel or all of the optical systems must enter in a direction orthogonal to the direction of the grooves to cover the entire surface of the panels with grooves 6, 7, 8. Φ, the positioning system must be very accurate, otherwise the correction of each laser beam position must be performed at all positions of the optical head 10 to achieve the necessary accuracy of the module requirements. Systems with multiple laser sources are typically expensive and can negatively impact the operating costs of solar cells. In addition, a large number of laser light sources require conventional maintenance services and have a higher overall failure rate, thereby reducing the time required for normal operation and increasing operating costs. Another method is conventionally to utilize an optical system consisting of a single laser of relatively high power, such as a power at 355 nm higher than low, or at 532 nm still at 5 W ' or at i 〇 64 nm above 20 W. The high power laser beam is then transmitted to a plurality of optical heads 10, typically 2-4, by polarization division or intensity division. In this example, a single laser tool can be equipped with many of the above optical systems. A description of the above system is found in German Patent Application No. DE 2 〇〇 6 033 296. The advantage of the above tool structure is that only one, or generally two, laser sources are required for the master tool, thus reducing the downtime of the laser source of the parent tool (d〇wnt丨me). However, the proofreading, polarization control, and beam power balance in the above optical system are complicated and time consuming in practical use. Any change in the properties of the laser beam in the optical system, such as beam position, power, and intensity profile, can cause significant changes in the beam across the process area of the panel. Power changes and contour changes between the beams affect the quality of the grooves 6, 7, 8 201210731' and changes in the position between the beams can cause frequent correction operations. Therefore, since normal work that is frequently corrected must be performed and proofreading is performed, the normal operation time of the tool is shortened. The beam position of all of the above conventional laser tools is generally in a linear laser array in the tool, # has a linear axis orthogonal to the direction of the groove. In order to engrave the laser in two orthogonal directions on the tool, for example to form edge isolation and lateral isolation trenches 6, 7, 8 it is possible to engrave all paths of the panel with only one laser beam, or in a tool The rotating panel is selected to form orthogonal grooves 6, 7, 8. In the example of the first method described above, the process of the single beam is inefficient and typically accounts for a large factor in the period of the implement cycle. In the example of the second method above, the panel rotation time increases the cycle time of the tool. Typically, t, the panel size is asymmetrical, and the tool structure typically does not rotate due to the lack of space containing the long sides of the panel, the long sides of which are orthogonal to the main groove direction. A laser engraving tool having multiple optical heads 10 can be provided so that multiple laser beams can be directed toward the solar cell i, and the direction of the multiple laser beams is orthogonal to the segment groove direction, so that the long side of the solar power can be Several parallel segment grooves 6, 7, 8 are simultaneously produced. However, the above method is not suitable for providing edge isolation trenches and lateral isolation trenches orthogonal to the main section trenches 6, 8 and 8. In the case of setting edge isolation trenches and lateral spacers: trenches with high accuracy and multiple overlap or distance, the direction is parallel to the direction of the segment trenches 6, 7, 8 however, and must be in the segment trenches 6, 7, 8 orthogonal direction accurate positioning can be used to set the section grooves 6, 7, 8. The optical head of the mechanical system ig is precisely set in two 24 201210731 so the groove is so complicated. - generally t, simpler - upper two, leaving an optical head 1 〇 and laser beam 'and mechanically or photon off all other optical heads 1 and laser beam, so that one mouth: set an isolation Grooves 6, 7, 8. In the absence of multiple parallel beam processes, the time required for patterning 6, 7, and 8 becomes a large portion of the overall cycle time of the laser process' and affects the operating cost of the module. The method of simply adjusting the width of the battery section and reducing the patterning of the sections and the isolation trenches and the correction of the groove position is advantageous for the laser processing time, and thus facilitates the manufacturing cost of the solar cell. The solution provided in accordance with the present invention is provided with an optical head 1 绕 that utilizes an optical element (D0E)n to provide a plurality of laser beams 12. In the optical head 10, the optical element u is wound and combined with the focusing objective lens 13. The optical π-member 11 is a single, compact optical member that splits the incident laser beam 14 into multiple laser beams 12 in a particular second plane 15. The light beams 12 generated by the earlier D0EU have almost equal intensities, and the gates of each other have a solid separation angle (angular and centered on the optical axis 16 of the optical head 1). Then the multiple beams 12 from the DOE 11 are incident. To the focusing objective lens 13, which injects and focuses the laser beam 12 onto the solar cell i to perform the process of the solar cell stack 3, 4, 5. The optical effect of the focusing objective lens 13 is separated from the DOE 11 specific beam splitting interval. The angle X and the distance between the optical head 丄〇 and the solar cell substrate 2 are matched. The battery section width 17 patterned by the optical head 1 〇 d〇E 11 is the split angle α of the d〇e 11 and the optical head. 10 and D0E 11 are determined by the distance 18. 25 201210731 In Fig. 2, the possible path of the incident laser beam 14 through the optical head 10 and the resulting multi-focus laser beam 12 are shown in the solar cell process. In this embodiment, the DOE 11 is arranged such that the single incident beam 14 splits into four separate beams 12, which are then focused on the solar cell stack layers 3, 4, 5, while being able to form four in the solar cell 1 simultaneously. Section grooves 6, 7, 8. By forming a pitch 11 between the adjacent laser beams 12 orthogonal to the main groove direction 24 by rotating the DOE 11 in the optical laser head 10, That is, the battery section width 17 can be adjusted according to different process requirements. Thus, the elasticity of the laser processing of the substrate 2 is provided, for example, to engrave the solar cell stack layers 3, 4, 5. According to an embodiment of the present invention, The battery section width is 1, 7 , that is, the pitch 17 ' is between 5. 5 and 8. 5 mm, but it can be as large as 1 〇 8. As shown in Fig. 2, it is from d〇E 11 to focus. The distance 18 of the objective lens 13 and the splitting angle interval α of the DOE 11 are, however, generally limited by the maximum optical diameter 19 of the focusing objective 13. In one embodiment, the angular interval α of the D I Generally, it can be from 1 · 5 degrees to 5 degrees, but it can be as large as 6.5 degrees, and the distance 18 between the DOE 11 and the focusing objective lens 13 is generally in the range of 7 〇 to 15 〇 mm. The optical diameter 19 can be in the range of 25 to 5 inches. Figures 3A to 3C show an engineering drawing of the optical head in a possible embodiment. The central setting area (central m〇unting bi〇ck) is provided with other components, including a focusing objective 13, a DOE 11, and an adjustment element 21 for rotating the DOE 11 along the optical axis 16, such as a motorized stage 21. Other extras in the figure The components are the necessary components for the optical head 1 to be used in the laser engraving tool, including: proofreading and position control systems, beam shuttering, and setup and maintenance. Access). However, these are not the subject of the invention and are therefore not described in detail, but are applicable and/or understood by those skilled in the art. The overall assembly process is separately performed during the conversion and evaluation phase, which accurately slaps the optical head and the multiple laser beam 12 for the solar cell stacking layer 3, 4, and 5 processes. Such a tight assembly arrangement allows low weight components to move at high speeds when fast processes are required&apos; and can be designed to have high positional stability. In addition, the material length of the optical shaft 16 is very short, so the assembly is more tolerant of thermal expansion due to environmental changes. By selecting the appropriate DOE 11 and focusing objective 13, an optical head 1 can be utilized to provide 3 to 7 multiple beams 12. The angular separation of the splits in the multiple beams 12 at the rear. Accurately - generally less than 0.1 mrad, combined with optical head i. To _ U interval 18 is approximately 100, resulting in a positional accuracy of the segment grooves 6, 7, 8 greater than 10 mm. However, the stability of the above-mentioned beam spacing has been greatly improved compared to other forms of conventional beam splitting optics. The traditional 11-system of optical components relies on the integration of the periodic precision standard of doe 11 、, Tian 匕 11 4 Periodic fine scale features. The DOE n is made of a suitable optical material, such as fused S1llca, which is expected to be stable over a period of time and does not change under ambient conditions (e.g., temperature). The _u close arrangement of the optical head 1 提供 provides a multi-section groove 0 7 , 8 ′ with a single optics and has a height 27 201210731 Position accuracy and good stability. Overcoming the use of D〇Eu of the optical head 10, it is possible to mechanically position the optical head i when the battery area &amp; width 17 is changed. Repeated advances... From 4 the complexity of the corrections that must be made due to other changes or offsets in the clamping system. The novel use of this light + sub-dot D0E U also enables the laser engraving tool to pattern edge isolation and lateral isolation trenches 6, 7, 8 and maintain the use of multiple meta-beams 12 thereby reducing the overall retrograde cycle time . These features will be further explained in Figures 4A and 4B. As described above, the DOE 11 provides an angular interval of the multiple beams 12^ in the specific plane 15. The battery section width 17 is determined by referring to the distance 22 of the fourth beam 4' at the first-process plane 23. The direction of the plane 22 corresponds to the direction of the periodic precision scale element in the D〇E丨丨 structure. By rotating the DOE 11 along the optical axis 16 of the optical head 10, the surge face 17 can be rotated and has a split multiple stop 12 therein. When multiple beams 12, over-focusing objective lens 1 3 ' and considering the spacing or distance 22' of these beams 12 in the orthogonal direction of the segment groove direction 24 are tied to the multiple beams 12, 25 and the solar cell 1 substrate 2 The angle of the line drawn between the multiple lines, the effective battery segment width 17 engraved by the beam will vary directly with the product, the cosine angle 0 and the distance 22 of the multiple beam 12. ^In practical applications' The d〇E 箸* rotating along the optical axis 16 of the optical head 10 can be accurately rotated along the optical axis 16 by setting the high-accuracy moving stage 21 of the DOE 11, and its moving angle θ is at least 9 〇. quasi-

S 28 201210731 確到一般優於10&quot;m。因此,在太陽能電池i中的多重雷 射光束12可平行或正交於區段溝槽方向24,或在任何介 於此二極限的角度。 區段溝槽距離的最大值,亦即電池區段寬度17的最大 值,在Θ=(Γ時達到,亦即光束***方向正交於溝槽方向 24由D0E11所提供光學光束***的穩定特性,結合旋_ 台21的準確度,可麵各光學頭1〇只需要-次電池區段 寬1 7對D0E 11旋轉角唐a &amp; 狀符月度0的杈正,而不需要針對各*** 光束校正。 一旦在雷射雕刻工具中對各光學頭1G進行校正,可輕 易的依據後續製程設定^的區段寬度17,或者根據太陽 能電池1電性最佳化的雲亚视» j. G旳需要微小的調整區段寬17,或者在 電池寬度的基礎下校正並#尤於1 八他不欲得因素所造去區段寬17 的改變。校正程库一An. Ά 1 λ — 叹程序t化費1〇至2〇秒㈣㈣ 化在太陽能電池1未使用的區域, 琢而後注5己其位置並將校 正因素(correction fac十nr、S 28 201210731 is indeed better than 10&quot;m. Thus, the multiple laser beams 12 in solar cell i can be parallel or orthogonal to the segment trench direction 24, or at any angle between the two limits. The maximum value of the segment groove distance, that is, the maximum value of the battery segment width 17, is achieved when Θ = (Γ, that is, the beam splitting direction is orthogonal to the groove direction 24 by the optical beam splitting provided by D0E11. In combination with the accuracy of the rotary table 21, it is possible to face each optical head 1 〇 only need to - the battery segment width is 1 7 pairs D0E 11 rotation angle Tang a &amp; sign month 0 is correct, without the need for each split Beam correction Once the optical head 1G is calibrated in the laser engraving tool, it can be easily determined according to the segment width 17 of the subsequent process setting, or according to the solar cell 1 electrically optimized cloud sub-view » j. G旳A small adjustment section width of 17 is required, or the correction is made on the basis of the battery width, and the change of the section width 17 is made by the factor that he does not want. The calibration library is an An. Ά 1 λ - sigh program The t-cost is 1 〇 to 2 〇 (4) (4) In the unused area of the solar cell 1, and then the position is corrected and the correction factor (correction fac ten nr,

Ct〇r)施加在各製程光束的位置 上。在製造過程中,僅需不頻繁的 &amp; 两莱的進仃廷些步驟以確定校 正工具並未偏移,或當佈局改變睥 雙吟利用不同的電池區段寬 度。 當旋轉角度0接近90。或〇。時, 人υ - ’如第5Α及5Β圖所示, 可將多重光束12的距離減小,其 乃句0又置為在區段溝槽方 向24,或在正交方向,使得由光束12 厅元成的各個溝槽6、 7、8彼此間非常靠近或甚至部分 豐以有效率的形承擔 一寬度溝槽6、7、8。複合溝槽卩“ ρ 複 口溝槽(composite” _e)6、 29 201210731 ?、8受益於D〇E U光束***的相同特徵在於準確 定的控制整體寬度17,而在其結構中 w 僻^个罵建立額外的校正。 .這些多重隔離溝槽結構可在基板2對光學頭1()進行 對移動的單—製程過程中形成。上述複合溝槽6、7、8適 合用於邊緣隔離或橫向隔離溝槽6、7、8,因為這些元= 一般受益於由多重溝槽所提供額外的隔離。一般而+,利 用4至9個個別的溝槽6、7、8以形成邊緣隔離或:向隔 離溝槽6、7、8,且在一個全尺寸太陽能電池模組中,一 般會具有至少4個的各種型態的隔離溝槽6、7、8。相較 於以雷射製程光學頭之雷射製程步驟,其需利用單一雷射 光束的多重步驟以圖案化邊緣及橫向隔離溝槽6、7、8, 利用本發明所述新穎的技術所需週期時間可縮短託至Μ 秒0 此外,在關於建築整合太陽能(Building IntegratedCt〇r) is applied to the position of each process beam. In the manufacturing process, only infrequent &amp; two steps are taken to determine that the calibration tool is not offset, or when the layout changes, the double battery uses different battery section widths. When the rotation angle 0 is close to 90. Or 〇. , υ - 'As shown in Figures 5 and 5, the distance of the multiple beams 12 can be reduced, which is again set to be in the segment groove direction 24, or in the orthogonal direction, such that the beam 12 The respective grooves 6, 7, 8 of the chamber element are in close proximity to each other or even partially richly bear a width groove 6, 7, 8. The composite trench 卩 "ρ composite groove (composite) _e) 6, 29 201210731 ?, 8 benefit from the D〇EU beam splitting the same feature is the quasi-determined control overall width 17, and in its structure w ^骂 Create additional corrections. These multiple isolation trench structures can be formed during the single-process process in which the substrate 2 is moved to the optical head 1 (). The above composite trenches 6, 7, 8 are suitable for edge isolation or lateral isolation trenches 6, 7, 8 because these elements = generally benefit from the additional isolation provided by the multiple trenches. Typically, +, using 4 to 9 individual trenches 6, 7, 8 to form edge isolation or: to isolation trenches 6, 7, 8 and, in a full-size solar cell module, typically have at least 4 Various types of isolation trenches 6, 7, 8. In contrast to the laser processing steps of a laser-processed optical head, it is necessary to utilize multiple steps of a single laser beam to pattern the edge and lateral isolation trenches 6, 7, 8 using the novel techniques of the present invention. The cycle time can be shortened to Μ seconds 0. In addition, the building integrated solar energy (Building Integrated

Ph0t0V0ltaics; BIPV)的應用中,較佳移除焊條(ribb〇n) 中矽層在區段溝槽6、7、8的正交方向行進的面積至2〇%。 這一般需要在數千個重疊的橫向溝槽6、7、8中重複進行 P3的圖案化8,以有效的增加模組的光穿透率。 在上述描述的本發明中,D〇E u的旋轉角度0接近 90時,可同時雕刻多重重疊的橫向溝槽6、7、8,因此可 有效的降低雷射製程的週期時間,其影響大約等同於用以 圖案化的多重光束12的數目。 雖然本發明已以數個較佳實施例揭露如上’然其並非 用以限定本發明’任何所屬技術領域中具有通常知識者, 30 201210731 在不脫離本發明之精神和範圍内,當可作任意之更動與潤 飾’因此本發明之保護範圍當視後附之申請專利範圍所界 定者為準。 【圖式簡單說明】 第1圖顯示習知技術包括以雕刻線分割太陽能電池的 薄膜太陽能電池的原理。 第2圖根據本發明一較佳實施例,顯示雷射光學頭之 繞射光學元件及聚焦物鏡間的光學關係。 第3A-3C圖根據本發明一較佳實施例之光學頭的側視 或剖面圖。 第4 A 4 B、5 A、5 B圖根據本發明一較佳實施例,顯示 在各應用中利用雷射光學頭,其相鄰雷射光束的節距,以 及旋轉繞射光學元件所產生的附設個雷射光束。 【主要元件符號說明】 1〜薄膜太陽能電池;2〜基板; 3〜上電極層; [光電轉換半導體; 5〜背電極層; 7〜溝槽; 9〜遮蔽區; 11〜繞射光學元件 13〜聚焦物鏡; 15〜第二平面; 6〜第一隔離溝槽; 8〜第二隔離溝槽; 1〇~光學頭; 12〜多重雷射光束; 14〜入射雷射光束; 16〜光學軸; 31 201210731 1 7 ~節距; 19〜直徑; 21〜調整元件; 23〜第一平面; 2 5 ~交叉線。 18〜繞射光學元件分割; 2 〇 ~中心設置區; 2 2 ~距離; 24〜區段溝槽方向/移動方向;In the application of Ph0t0V0ltaics; BIPV), it is preferred to remove the area of the ruthenium layer in the orthogonal direction of the segment grooves 6, 7, 8 to 2% in the electrode ribb〇n. This generally requires patterning 8 of P3 to be repeated in thousands of overlapping lateral grooves 6, 7, 8 to effectively increase the light transmittance of the module. In the invention described above, when the rotation angle 0 of D〇E u is close to 90, the multiple overlapping lateral grooves 6, 7, 8 can be simultaneously engraved, so that the cycle time of the laser process can be effectively reduced, and the influence thereof is approximately It is equivalent to the number of multiple beams 12 to be patterned. The present invention has been disclosed in a number of preferred embodiments as described above, and is not intended to limit the invention, which is intended to be in the scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows the principle of a conventional technique including a thin film solar cell in which a solar cell is divided by an engraving line. Figure 2 is a diagram showing the optical relationship between a diffractive optical element of a laser optical head and a focusing objective, in accordance with a preferred embodiment of the present invention. 3A-3C are side or cross-sectional views of an optical head in accordance with a preferred embodiment of the present invention. 4A 4 B, 5 A, 5 B are diagrams showing the use of a laser optical head, the pitch of adjacent laser beams, and the rotation of a diffractive optical element, in accordance with a preferred embodiment of the present invention. Attached to a laser beam. [Major component symbol description] 1~ thin film solar cell; 2~ substrate; 3~ upper electrode layer; [photoelectric conversion semiconductor; 5~ back electrode layer; 7~ trench; 9~ masking area; 11~ diffractive optical element 13 ~ Focusing objective lens; 15~ second plane; 6~ first isolation trench; 8~ second isolation trench; 1〇~optical head; 12~multiple laser beam; 14~ incident laser beam; 16~ optical axis ; 31 201210731 1 7 ~ pitch; 19 ~ diameter; 21 ~ adjustment element; 23 ~ first plane; 2 5 ~ cross line. 18~Diffractive optical element division; 2 〇 ~ center setting area; 2 2 ~ distance; 24~ section groove direction/moving direction;

S 32S 32

Claims (1)

201210731 七、申請專利範圍: 1. 一種用於雷射雕刻裝置的雷射光學頭(10),包括一 繞射光學元件(11),一聚焦物鏡(13),以及一調整元件 (21),其中 該繞射光學元件(11)及該聚焦物鏡(13)在一共同光學 軸(16)上彼此間隔設置,以及 該調整元件(21)用於在正交於該光學軸(16)的一第三 平面上旋轉該繞射光學元件(11)。 2 ·如申請專利範圍第1項所述之用於雷射雕刻裝置的 雷射光學頭(10),其中該調整元件(21)包括一機動台(2}) 及/或一步進馬達,以沿著該光學軸(1 6)旋轉該繞射光學元 件(11)。 3,如前述任一申請專利範圍所述之用於雷射雕刻裝置 的雷射光學頭(1〇),包括一控制器,且該控制器用於將該 繞射光學元件(11)定位在該光學軸(16) 一定義角度位置 (0 ) ° 4. 如前述任一申請專利筋圖m J乾圍所述之用於雷射雕刻裝置 的雷射光學頭(10),JL中嗜嘴 叫”干該調整兀*件(21)用於將該繞射光 學元件(11)設置於一角度位置、 1 )且其準確度S〇lmrad。 5. 如前述任一申請專利範圚祕、+、&gt; 觀圍所述之用於雷射雕刻裝置 的雷射光學頭(10),其中至少 ^这繞射光學元件(Π)及該聚 焦物鏡(13)包含在一接合外殼中,且該接合外殼包括-材 料’該材料係用以降低該接合外殼對環境改變所造成的熱 膨脹的敏感度。 33 201210731 6. 如别述任一申請專利範圍所述之用於雷射雕刻裝置 的雷射光學頭(1〇)’其中該材料包括一低膨脹材料,較佳 為熔融梦石。 7. 如前述任一申請專利範圍所述之用於雷射雕刻裝置 的雷射光學頭(10),其中該繞射光學元件(11)及該聚焦物 鏡(13)彼此距離(i8)g 70mm且g 150mm,較佳2 25nm且g 50mm ° 8. —種雷射雕刻裝置,用於雷射處理一基板的一表 面,包括一定位元件,一根據前述任一申請專利範圍所述 之雷射光學頭(10),以及一移動元件,其中 該定位元件用於設置該基板(2)的該表面以在一第一 平面(23)上進行製程, 該雷射光學頭(10)係藉由***一入射雷射光束(14)以 產生多重雷射光束(12),使得該多重雷射光束(12)彼此間 存在有預定的固定距離(22),使得該多重雷射光束(12)平 行設置而定義一第二平面(15), 該聚焦物鏡(13)用於將該多重雷射光束(12)聚焦至該 基板(2)上’以在該表面製造平行溝槽(6、7、8),使得該 第一表面(23)及該第二表面(15)形成一交又線(25),且使 得藉由該各個雷射光束入射至該基板(2)上,而在該表面中 製造的該溝槽(6、7、8)彼此由一節距(17)間隔,以及 該移動元件用於以相對於該基板(2)的一移動方向(24) 上移動該雷射光學頭(10)。 9,如申請專利範圍第8項所述之雷射雕刻裝置,其中 、S 34 201210731 該調整元件係藉由改變該移動方向(24)及該交叉線(25)間 的該角度(9〇°-0),以調整該溝槽(6、7、8)的該節距(17)。 1 〇·如申請專利範圍第8或9項所述之雷射雕刻裝置, 其中該角度(0)20°且S 90°,及/或設置該角度(0)使得 至少二個相鄰的溝槽(6、7、8)至少部分重疊。 11·如申請專利範圍第8-10項任一項所述之雷射雕刻 裝置,其中該第二平面(15)主要設置為正交於該第一平面 (23)及/或該光學轴(16)主要設置為正交該第一平面(23)。 12 ·如申請專利範圍第8 -11項任一項所述之雷射雕刻 裝置,其中該雷射光學頭(10)產生S3且$9個雷射光束 (12)’較佳為4個雷射光束(12)。 13.如申請專利範圍第8-12項任一項所述之雷射雕刻 裝置,其中該調整元件(21)用以產生g4mm且$10.8111111的 一節距(17),較佳 2 5. 5mm 且 S 8· 5mm,且更佳 $ 〇. 。 14 ·如申睛專利範圍第8 -13項任—項所述之雷射雕列 裝置,其中該雷射光學頭(10)用以達到溝槽定位準確度$ 1 〇 m 〇 15.如申請專利範圍第8-14項任—項所述之雷射雕刻 裝置’其中該多重雷射光束(12)用以在該表面(2)沉積的1 薄骐材料中產生溝槽(6、7、8)。 包括以 16·—種雷射處理一基板(2)的一表面的方法 下步驟: 一平面(23)進行製 (a)設置該基板(2)之該表面在一第 程, 35 201210731 (b) 藉由一繞射光學元件(11)***一單一雷射光(η) 以產生多重雷射光束(12),使得該多重雷射光束彼此間具 有一預設的固定距離(22),以及使得該多重雷射光束(12) 平行設置已定義一第二平面(15), (c) 將該多重雷射光束(12)聚焦至該基板(2)上以在該 表面形成平行溝槽(6、7、8),使得該第一表面及該第二表 面形成一交又線(25),且藉由該個別雷射光束入射至該基 板(2)以在表面中形成該溝槽(6、7、8),使得該溝槽(6、7 “)藉由一節距(17)彼此間隔,且該節距(17)藉由改變該欲 得移動方向(24)及該交叉線(25)間的角度(90。- 0 )來調 整,以及 (d) 在一移動方向(24)上相對於該基板(2)移動該多重 雷射光束(12)。 17. 如申請專利範圍第16項所述之雷射處理一基板(2) 的一表面的方法’其中設置該第二平面(15)以大體正交於 該第一平面(23)。 18. 如申請專利範圍第16或17項所述之雷射處理一基 板(2)的一表面的方法,其中改變該欲得移動方向(24)及該 父叉線(25)間的角度(9〇。- Θ)係被旋轉該繞射光學元件 (11)所影響。 19. 如申請專利範圍第18項所述之雷射處理一基板(2) 的一表面的方法,其中旋轉該繞射光學元件(11)係由一移 動台(21)所影響’該移動台(21)能夠沿一光學軸(16)的一 旋轉’在該光學軸(16)上該繞射光學元件(11)及用以聚焦 36 201210731 該多重雷射光束(12)的一聚焦物鏡(13)彼此間隔設置。 20. 如申請專利範圍第18或19項所述之雷射處理一基 板(2)的一表面的方法,其中該繞射光學元件(ιι)在一第三 平面上旋轉’且該第三平面大體與該入射單-雷射光束(14) 正交,及/或大體與該第二平面正交。 21. 如申請專利範圍帛16_2()項任—項所述之雷射處 理基板(2)的-表面的方法,包括校正在該移動方向(24) 及該父叉線(25)之間的該角度(9〇。)。 22·如申請專利範㈣16_21項任—項所述之雷射處 理-基板(2)的-表面的方法,其中該角度⑽。七餘〇 。及$90°’及/或設置該备疮r〇n。 。 角度(9 0 - 0 )使得至少二相鄰溝槽 (6、7、8)至少部分重疊。 23. 如申請專利範圍第16_22項任—項所述之雷射處 理-基板⑵的-表面的方法,其中步驟(e)係可選擇的以 角度(9〇㈠進仃’以形成至少部分重疊的溝槽(6、7、 8) 〇 24. 如申請專利範圍第16,項任—項所述之雷射處 理一基板(2)的一表面的方沐,盆士&lt; 的方去其+設置該繞射光學元件 (11)以產生23且$9個雷ji+出由广10、 雷射光束(12),較佳為4個雷射光 束(12)。 25·如Μ㈣㈣第16_24項任—項所述之雷射處 理一基板(2)的—表面的方法,其中調整該移動方向(⑷ 及該父又線(25)之間的該角度(9(Γ_θ),使得該節距(⑺ 係^…亀’較佳“ 5m…8 ,且更佳^ 37 201210731 0. lmm 〇 26. 如申請專利範圍第16_25項任一項所述之雷射處 理一基板(2)的-表面的方法,纟中設置該繞射光學元件 (11)以在該基板(2)上聚焦該多重雷射光束(12),因此達到 一溝槽定位準確度S10#me 27. —種製造一薄膜太陽能電池的方法,包括以下步 驟: (1) 在基板(2)上沉積一薄膜材料(3、4、5),以及 (2) 利用如申凊專利範圍第16-26項任一項所述之方 法對該基板(2)進行雷射製程,其中該薄膜材料(3、4、5) 包括對該表面進行處理,或 (2’ )利用如申請專利範圍第8_15項任一項所述之雷 射雕刻裝置對該基板(2)進行雷射製程,纟中該薄膜材料 (3、4、5)包括對該表面進行處理。 28. 如申請專利範圍第27項所述之製造_薄膜 電池的方法,其中該步驟⑵或步驟(2,)包括對該基板⑺ 至少20%的該表面面積進行雷射製程。 29·利用申請專利範圍第8_15項任一項所述之雷射雕 刻裝置以將該基板⑵切割成為複數個區段,包括一薄膜太 陽能電池⑴,該薄膜太陽能電池⑴包括該基板⑺及」 膜材料〇、4、5)沉積在該基板⑺上’且該薄膜材料(3、4、 5)包括藉由該雷射雕刻裝置處理的該表面。 S 38201210731 VII. Patent application scope: 1. A laser optical head (10) for a laser engraving device, comprising a diffractive optical element (11), a focusing objective lens (13), and an adjusting component (21), Wherein the diffractive optical element (11) and the focusing objective (13) are spaced apart from each other on a common optical axis (16), and the adjusting element (21) is used for one orthogonal to the optical axis (16) The diffractive optical element (11) is rotated in a third plane. 2. The laser optical head (10) for a laser engraving device according to claim 1, wherein the adjusting element (21) comprises a motorized stage (2}) and/or a stepping motor, The diffractive optical element (11) is rotated along the optical axis (16). 3. A laser optical head (1) for use in a laser engraving apparatus according to any of the preceding claims, comprising a controller, and wherein the controller is for positioning the diffractive optical element (11) Optical axis (16) A defined angular position (0) ° 4. The laser optical head (10) for laser engraving device as described in any of the aforementioned patent claims, JL The dry adjustment element (21) is used to set the diffractive optical element (11) at an angular position, 1) and its accuracy S〇lmrad. 5. Any of the aforementioned patents, 圚, +, + And a laser optical head (10) for use in a laser engraving device, wherein at least the diffractive optical element (及) and the focusing objective lens (13) are contained in a joint housing, and The joint housing includes - material 'this material is used to reduce the sensitivity of the joint shell to thermal expansion caused by environmental changes. 33 201210731 6. Laser for laser engraving apparatus as described in any of the claims Optical head (1〇) wherein the material comprises a low expansion material, preferably molten 7. A laser optical head (10) for use in a laser engraving apparatus according to any of the preceding claims, wherein the diffractive optical element (11) and the focusing objective (13) are at a distance from each other (i8) g 70mm and g 150mm, preferably 2 25nm and g 50mm ° 8. A laser engraving device for laser processing a surface of a substrate, comprising a positioning element, according to any of the aforementioned patent claims a laser optical head (10), and a moving element, wherein the positioning element is configured to set the surface of the substrate (2) to be processed on a first plane (23), the laser optical head (10) The multiple laser beams (12) are generated by splitting an incident laser beam (14) such that the multiple laser beams (12) are present at a predetermined fixed distance (22) from each other such that the multiple laser beams (12) a second plane (15) defined in parallel, the focusing objective (13) for focusing the multiple laser beam (12) onto the substrate (2) to create parallel grooves on the surface (6, 7, 8), such that the first surface (23) and the second surface (15) form a cross a line (25), and such that the grooves (6, 7, 8) fabricated in the surface are separated from each other by a pitch (17) by the respective laser beams incident on the substrate (2), and The moving element is configured to move the laser optical head (10) in a moving direction (24) with respect to the substrate (2). 9. The laser engraving apparatus according to claim 8, wherein S 34 201210731 The adjusting element adjusts the section of the groove (6, 7, 8) by changing the moving direction (24) and the angle (9 〇 °-0) between the intersecting lines (25) Distance (17). The laser engraving device of claim 8 or 9, wherein the angle (0) is 20° and S 90°, and/or the angle (0) is set such that at least two adjacent grooves The slots (6, 7, 8) at least partially overlap. The laser engraving apparatus according to any one of claims 8 to 10, wherein the second plane (15) is mainly disposed orthogonal to the first plane (23) and/or the optical axis ( 16) Mainly arranged to be orthogonal to the first plane (23). The laser engraving apparatus of any one of claims 8-11, wherein the laser optical head (10) produces S3 and the $9 laser beam (12)' is preferably 4 lasers. Beam (12). 13. The laser engraving apparatus according to any one of claims 8 to 12, wherein the adjusting element (21) is for generating a pitch (17) of g4 mm and $10.8111111, preferably 2 5. 5 mm and S 8·5mm, and better $〇. 14. The laser engraving apparatus of claim 8, wherein the laser optical head (10) is used to achieve groove positioning accuracy of $1 〇m 〇 15. The laser engraving device of the invention of claim 8-14, wherein the multiple laser beam (12) is used to create a groove in the thin germanium material deposited on the surface (2) (6, 7, 8). The method includes the following steps of: processing a surface of a substrate (2) by a laser beam: a plane (23) is performed (a) the surface of the substrate (2) is disposed in a first pass, 35 201210731 (b) Generating a plurality of laser beams (12) by splitting a single laser beam (n) by a diffractive optical element (11) such that the multiple laser beams have a predetermined fixed distance (22) from each other, and The multiple laser beams (12) are arranged in parallel to define a second plane (15), (c) focusing the multiple laser beam (12) onto the substrate (2) to form parallel grooves on the surface (6) , 7, 8), such that the first surface and the second surface form an intersection line (25), and the individual laser beam is incident on the substrate (2) to form the trench in the surface (6) , 7, 8), such that the grooves (6, 7") are spaced apart from each other by a pitch (17), and the pitch (17) is changed by the desired moving direction (24) and the intersecting line (25) The angle between (90.- 0) is adjusted, and (d) the multiple laser beam is moved relative to the substrate (2) in a moving direction (24) ( 12) 17. The method of laser processing a surface of a substrate (2) as claimed in claim 16 wherein the second plane (15) is disposed to be substantially orthogonal to the first plane (23) 18. A method of laser processing a surface of a substrate (2) as claimed in claim 16 or 17, wherein the desired direction of movement (24) and the angle between the parental line (25) are changed. (9〇.-Θ) is affected by the rotation of the diffractive optical element (11). 19. The method of laser processing a surface of a substrate (2) according to claim 18, wherein the rotating The diffractive optical element (11) is affected by a mobile station (21) which is capable of rotating along an optical axis (16) on the optical axis (16). 11) and a focusing objective lens (13) for focusing the focus of 36 201210731 of the multiple laser beam (12). 20. The laser processing of a substrate (2) according to claim 18 or 19. a surface method in which the diffractive optical element (ιι) is rotated in a third plane and the third plane is substantially The incident single-laser beam (14) is orthogonal, and/or substantially orthogonal to the second plane. 21. The laser processing substrate (2) as described in the scope of claim 帛16_2() The method of the surface includes correcting the angle between the moving direction (24) and the parental crosshair (25) (9 〇.). 22) The laser processing as described in the application of the patent (4) 16_21-- The method of the surface of the substrate (2), wherein the angle (10) is seven 〇. And $90°' and/or set the sore r〇n. . The angle (9 0 - 0 ) causes at least two adjacent grooves (6, 7, 8) to at least partially overlap. 23. The method of claim 1, wherein the step (e) is selectable at an angle (9 〇 (1) to form at least partially overlapping). Grooves (6, 7, 8) 〇 24. As claimed in claim 16 of the scope of the invention, the laser treatment of a surface of a substrate (2) of a square, the basin of the + The diffractive optical element (11) is arranged to produce 23 and $9 ray + out of the wide 10, the laser beam (12), preferably 4 laser beams (12). 25 · Μ (4) (4) Item 16_24 The method of laser processing a surface of a substrate (2), wherein the moving direction ((4) and the angle between the parent and the line (25) (9 (Γ_θ)) is adjusted such that the pitch ( (7) 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the method, the diffractive optical element (11) is disposed to focus the multiple laser beam (12) on the substrate (2), thereby achieving a groove positioning accuracy S10#me 27. A method of fabricating a thin film solar cell comprising the steps of: (1) depositing a thin film material (3, 4, 5) on a substrate (2), and (2) utilizing items 16-26 of the patent scope of the application A method of performing a laser process on the substrate (2), wherein the film material (3, 4, 5) comprises processing the surface, or (2') utilizing any of the 8th to 15th claims The laser engraving device of the present invention performs a laser process on the substrate (2), wherein the film material (3, 4, 5) comprises processing the surface. 28. As described in claim 27 A method of manufacturing a thin film battery, wherein the step (2) or the step (2) comprises performing a laser process on the surface area of at least 20% of the substrate (7). The use of the mine according to any one of claims 8 to 15. The engraving device cuts the substrate (2) into a plurality of segments, including a thin film solar cell (1) including the substrate (7) and a film material 〇, 4, 5) deposited on the substrate (7) and The film material (3, 4, 5) includes the laser The surface treatment of the etching apparatus. S 38
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