201205166 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種光照射裝置。 【先前技術】 液晶顯示器面板，係以極為狹窄的間隔相對向配置有： 將薄膜電晶體配置形成為矩陣狀的元件基板；以及形成有遮 光膜及彩色渡光片等的對向基板。然後，在兩基板相互重疊 時，在此等兩基板間且由包含光硬化性樹腊之密封材所包圍 的區域封入有液晶。接著，將紫外線照射在密封材，藉由該 密封材硬化使兩基板貼合而製造出液晶顯示器面板。 此時，作為以紫外線使密封材硬化而黏接兩基板的裝置 有光照射裝置。此種光照射裝置，例如採用電弧放電式金屬 鹵素燈等作為光源，用以對貼合在一起的基板全面照射紫外 線(例如’專利文獻1)。 ..... ，又，近年來，為人注目的光照射裝置，係採用紫外線發 光二極體，該紫外線發光二極體只對直線狀密封材照射直線 狀紫外線束射光，以圖減低電力之消耗，並且可以簡單又快 速的方式對應貼合紐之規格變更等。在採 二極體的光騎裝置中，複數個紫外線發光二極 ^距進行單向排列。然後，在錢树發光二極Hi =:係予置有半球透鏡、柱面透鏡(cylindrical —等的光 。错此’從各紫外線發光二極體射出 等半球透鏡、柱面透鏡等的光學系統成為 束射光(直束縣)錢其歸在麵直線狀的 (專利文獻） 201205166 [專利文獻1]日本特開2〇〇6_66585號公報 【發明内容】 量 一，直線狀束射=二且直有線:率= 給紫外線照射能 將錄狀賴仏肖魏^親供仏至 密封材硬化所需的累積照明度:、:密 ϊί”目同。因而’由於可以相同的時間日 供給. ，在》 ^材的各位置，所以可驗 透於ΐ射a 封材的橫向寬度，並以半球透鏡、柱面 ί f = 來調整直線狀束射光之線寬是很困難 S短t會ϊί線狀束射光之線寬比密封材的橫向寬度 ;=寬兄度5;:^^ ^其疋，在直線狀束射光的線寬比密封材的橫向寬度還 長的情況，會產生沒錢射於密封材的料線束射光。離開 該密封材的紫外線束射光，係貫騎晶顯示^面板而到達載 物台°經到達載物台後的紫外線束射光，係在載物台反射， 並再次入射於液晶顯示器面板。此時，經反射而入射於液晶 顯示器面板的紫外線束射光，係人射於由密封材所包圍的區 域。由於在由密封材所包圍的區域，係封入有液晶，所以該 液晶有因經入射的紫外線束射光之作用而發生變質之虞。 又’有帶給形成於由密封材所包圍區域之基板上的薄膜電晶 體(ΊΤΤ)不良影響之虞。 本發明係為了解決上述課題而開發完成者，其目的在於 201205166 提=-種細職置，肋防止沒有㈣於直魏光硬化性 樹脂而到達載物台之直線狀束射光的反射，不使配置於基板 上的光硬化性樹脂以外的要素發生變質。 (解決課題之手段） ,本發明之一態樣係提供一種光照射裝置。光照射裝置 :糸具it ·載$台’其係載置形成有直線狀光硬化性樹脂之基 ，H、射單元，其係包含沿著單向而排列之複數個光學元 精由將從該複數個光學元件射出的光束重疊在一起而產 it，，延伸的直線狀束射光，且—邊使前述直線狀 而與形狀前述絲㈣述直線狀光 二==進行照射;以及光吸收構件’其係形成 【實施方式】 種基ΐ 線照射裝置1，係備置於用以製造在二 面板P減圖-ί封入有液晶的主動矩陣型之液晶顯示器 ifρ的未圖不之製造線中。紫外線照射裝置i，係用於液 曰曰顯不㈣板P之製造步驟中，對於 日、、 面板Ρ的下基板W1與上基板W2 曰== 如第1圖所不，紫外線照射裝置 面的機框5。機框5，係具有配置於四方二 該4支支柱以係相對於地板面而豎設。例如，機:5係； 201205166 有分別連結相鄰的2支支柱5a之下側位置的4個下部框體 5b。又’機框5，係具有分別連結前侧(Y方向相反側)之左右 一對支柱5a的中間位置、及後側(γ方向侧)之左右一對支柱 5a的中間位置之2個中間框體5c。更且，機框5，係具有連 結左側(X方向相反侧)之前後一對支柱5a的上端位置之左側 上部框體5d，並且具有連結右侧(X方向侧)之前後一對支柱 5a的上端位置之右側上部框體元。在此，係將紫外線照射裝 置1之左右方向稱為「X方向」，將前後方向稱為「Y方向」， 將上下方向稱為「2方向」。亦即，第1圖中，所謂前後方向， 係指上部框體5d、5e之長度方向，所謂左右方向，係指 於上部框體5d、5e間的支架2之長度方向。 ” 在機框5内，係設置有載置液晶顯示器面板p的八 f物台ST。如第2圖及第3圖所示，載物台ST之下面STa， ίίίΓ肖框體6的支承臂7破獅定，該支承臂 Τ之下側且藉由設置於下部框體％的4 支滚珠螺;f于而可上下移動。 如第3圖所示，在載物台ST之中央位置 裝置9,以兮她」千揭^以係鞛由基板移動 τρ °χ機0 ΤΒ之中心軸線L為中心而旋轉。 機台2之上面，係與載物台ST之上面位於同一轉面。又，該 運裝仏9ί#=ΛΤΒ，録將縣圖示之搬 =的液晶顯示器面板。旋轉動 201205166 m 5夂在’係以預定的間隔形成有複數個導孔 10。通過各導孔10 ’設置於四角框體6下 (未圖示)的升降銷(lift pinX未圖示)可出沒自如:換句話^， 在使各升降銷從各導孔10突出的狀態下，從未圖示之搬運 裝置搬運出的液晶顯示器面板P可交接至升降銷的前端部。 由使各升_认於各導孔1G，液晶顯示器面板 P ^可父接至對準機台TB ’且可_對準機台TB進行對準 作業。然後’當解作業結束時，H由使解機台ΤΒ沒入 ίίϊϋι液晶顯示料板？就可在對準後的狀態下直接 載置於载物台ST。 純ST且於貫通孔8之前後_，係分別貫 通形成有沿者左右方向(X方向)延伸的一對檢測窗u。 2 ^所不，在齡台ST之下·與前述檢職u相對向的 位置，係分別設置有照明度檢測裝置12。 裝置12’係具有被支禮固定於四角框體6 ^轨13。導軌13，係沿著檢測窗u而配置於左右 對面於檢測窗11的導軌13之上面，配設有可朝向 左右方向(X方向)往復移動的載具(carriage)14。 具馬ί(ί皮f _ng _(未_連接於載 2二 /、，係藉由載具馬達驅動，透過時規 皮帶而驅動，且沿著軸13，料著x方向往復移動。 ，載具Η之上面，係固設有照明度感測器，該照明 ίΪίϋ5係透過檢測窗1卜接收射出來的紫外線並檢測 透Γ著x方向形成之檢測窗u而入二 ^線狀束射光LB(參照第6圖)之位於χ方向之各位置的照明 度0 、、 / 施形態中’载物台ST，係由純所成形。然後， 在载物。ST之上面全體’係形成有作為光吸收構件的紫外 201205166 線吸收膜18。紫外線吸收膜18，係為黑色氧皮鋁(black alumite) ’且藉由對鋁製載物台ST之上面進行黑色表面滲鋁 處理而形成。因而，載物台ST之上面全體，係依由黑色氧 皮鋁所構成的紫外線吸收膜18而變成黑色。結果，當紫外 線照射在載物台ST時’該紫外線就不會被反射，而會被由 黑色氧皮鋁所構成的紫外線吸收膜18所吸收。 问樣地，在本實施形態中 所成形。然後，對準機台TB之上面，也是同樣地，進行黑 色表面滲鋁處理而形成有由黑色氧皮鋁所構成的紫外線^ 收膜19。然後，當紫外線照射在對準機台TB時，紫外線吸 收膜19就不會使該紫外線反射而會予以吸收。 如第1圖所示，支架2，係包含架設於左側上部框體5d 與右側上部框體5e之間的前後一對支架本體2a。二個支架 本體2a之左右兩端部下面，係被配置於在左側上部框體^ 與右側上部框體5e之上面所設置的—對導執2卜二 ^執2卜係為彼此平行絲著γ方向延伸，而，延伸 係可沿著¥方向分別移動。 示的馬賴滾珠螺/進珠合。，，以未圖 =2 執^即沿著γ方向(前後方向)往復移動。 的方式，沿著又方向平行地配置=SJ 2a之下面，係透過安裝構件23， ，支架本， X方向設置有紫外、線照射單元3。^體2a，即沿著 外線照射單元3，係可財紅]H各遽構件23的紫 動。各紫外線照射單S 3 ’著Y方向往復移 晶顯示器面板Ρ，照射朝向固定於裁物台ST的液 線所構成的直線狀束射财向以—直線延伸之由紫外 8 201205166 方向(左右方向)往復移動。两於支架本體2a，沿著χ201205166 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a light irradiation device. [Prior Art] The liquid crystal display panel is provided with an element substrate in which a thin film transistor is arranged in a matrix shape, and a counter substrate on which a light shielding film, a color light guide sheet, or the like is formed, with an extremely narrow interval. Then, when the two substrates overlap each other, liquid crystal is sealed between the two substrates and surrounded by the sealing material containing the photocurable wax. Then, ultraviolet rays were applied to the sealing material, and the sealing material was cured to bond the two substrates to produce a liquid crystal display panel. At this time, as a device for curing the sealing material by ultraviolet rays and bonding the two substrates, there is a light irradiation device. Such a light irradiation device is, for example, an arc discharge type metal halide lamp or the like as a light source for illuminating the substrates to be bonded together with ultraviolet rays (for example, 'Patent Document 1'). ..... In addition, in recent years, the attention-grabbing light-emitting device uses an ultraviolet light-emitting diode that irradiates a linear ultraviolet light to a linear sealing material to reduce power. It is consumed, and it can be changed in a simple and quick manner to match the specifications of the button. In the light riding device of the diode, a plurality of ultraviolet light emitting diodes are arranged in one direction. Then, in the money tree light-emitting diodes, Hi =: an optical system in which a hemispherical lens, a cylindrical lens, or the like is placed, and a hemispherical lens such as a cylindrical lens or a cylindrical lens is emitted from each ultraviolet light-emitting diode. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Wired: Rate = The ultraviolet ray can be used to supply the illuminating 仏 仏 魏 ^ 亲 亲 仏 仏 仏 仏 仏 仏 仏 : : : : : : : : : : : : : : : : : : : : : : 累积 累积 累积 累积 累积 累积》 ^The position of the material, so it can be verified that the lateral width of the sealing material is abrupt, and it is very difficult to adjust the line width of the linear beam of light with the hemispherical lens and the cylindrical surface ί f = S short t will be 线ί line The line width of the beam is wider than the lateral width of the sealing material; = the width of the brother is 5;: ^^ ^, in the case where the line width of the linear beam is longer than the lateral width of the sealing material, there is no money to shoot. The wire harness of the sealing material emits light. The ultraviolet beam that leaves the sealing material is lighted and is ridden When the panel is displayed and reaches the stage, the ultraviolet beam of light that has reached the stage is reflected by the stage and is incident on the liquid crystal display panel again. At this time, the ultraviolet beam incident on the liquid crystal display panel by reflection is reflected. The person is exposed to the area surrounded by the sealing material. Since the liquid crystal is sealed in the area surrounded by the sealing material, the liquid crystal is deteriorated by the action of the incident ultraviolet beam. The present invention has been developed to solve the above problems, and the object of the present invention is to solve the above problems. The purpose of the present invention is to provide a fine position for the 201205166. It is possible to prevent the reflection of the linear beam of light that has reached the stage without the (4) direct-light curing resin, and does not deteriorate the elements other than the photocurable resin disposed on the substrate. (Means for Solving the Problem) The present invention One aspect provides a light irradiation device: a light irradiation device: a cooker, a load, a base, a base for forming a linear photocurable resin, and an H unit. The method includes a plurality of optical elements arranged along a unidirectional direction, and a light beam emitted from the plurality of optical elements is superposed to produce an extended linear beam of light, and the linear direction is The shape of the wire (4) is linear light 2 == irradiation; and the light absorbing member is formed. [Embodiment] The substrate illuminating device 1 is provided for manufacturing a liquid crystal in the second panel P In the manufacturing line of the active matrix type liquid crystal display ifρ, the ultraviolet irradiation device i is used in the manufacturing step of the liquid helium display (four) plate P, for the lower substrate W1 and the upper surface of the panel Substrate W2 曰 == As shown in Fig. 1, the ultraviolet ray irradiates the frame 5 of the device surface. The frame 5 is disposed on the square. The four pillars are erected with respect to the floor surface. For example, the machine: 5 series; 201205166 has four lower frames 5b which are respectively connected to the lower side positions of the adjacent two pillars 5a. Further, the frame 5 has two intermediate frames at the intermediate position of the pair of right and left pillars 5a connecting the front side (the opposite side in the Y direction) and the middle position of the pair of left and right pillars 5a on the rear side (the γ direction side). Body 5c. Furthermore, the frame 5 has a left upper frame 5d that connects the upper end positions of the pair of left and right rear pillars 5a on the left side (the opposite side in the X direction), and has a pair of rear pillars 5a connected to the right side (X direction side). The upper part of the upper part of the upper end position. Here, the left-right direction of the ultraviolet irradiation device 1 is referred to as "X direction", the front-rear direction is referred to as "Y direction", and the vertical direction is referred to as "2-direction". In other words, the front-rear direction refers to the longitudinal direction of the upper frames 5d and 5e, and the left-right direction refers to the longitudinal direction of the bracket 2 between the upper frames 5d and 5e. In the casing 5, an eight-stage ST on which the liquid crystal display panel p is placed is provided. As shown in FIGS. 2 and 3, the support arm of the lower frame ST of the stage ST is shown below. 7 Broken lion, the lower side of the support arm 且 and the four ball snails provided in the lower frame body; f can be moved up and down. As shown in Fig. 3, the device is placed at the center of the stage ST 9. After the 兮 」 」 」 」 」 」 千 千 千 千 千 千 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛 鞛The upper surface of the machine table 2 is located on the same rotating surface as the upper surface of the stage ST. In addition, the shipment is 仏9ί#=ΛΤΒ, and the LCD panel of the county icon is moved. The rotation of the 201205166 m 5 夂 is formed by a plurality of guide holes 10 at predetermined intervals. The lift pins (not shown) provided under the four corner frames 6 (not shown) through the respective guide holes 10' can be freely opened. In other words, the lift pins are protruded from the respective guide holes 10. Next, the liquid crystal display panel P transported from the transport device (not shown) can be delivered to the front end portion of the lift pin. The liquid crystal display panel P^ can be parented to the alignment machine TB' and the alignment machine TB can be aligned for each lift hole 1G. Then, when the solution is finished, H is immersed in the illuminating LCD panel by the machine. It can be placed directly on the stage ST in the aligned state. Pure ST and before and after the through hole 8 are formed with a pair of detection windows u extending in the left-right direction (X direction). 2 ^ No, under the age station ST, the position opposite to the above-mentioned job placement u is provided with the illuminance detecting device 12, respectively. The device 12' has a bezel attached to the square frame 6 rail 13 . The guide rail 13 is disposed on the upper surface of the guide rail 13 opposite to the detection window 11 along the detection window u, and is provided with a carrier 14 that can reciprocate in the left-right direction (X direction).马马ί(ί皮f _ng _ (not _ connected to load 2 2 /, driven by the vehicle motor, driven by the timing belt, and along the axis 13, reciprocating in the x direction. The illuminating sensor is fixed on the upper surface of the cymbal, and the illuminating sensor receives the ultraviolet ray emitted through the detecting window 1 and detects the detecting window u formed in the x direction to enter the ray beam LB. (Refer to Fig. 6) The illuminance at each position in the χ direction is 0, and the 'stage ST is formed by pure. Then, the whole of the load is formed on the top of the ST. The UV 201205166 line absorbing film 18 of the light absorbing member. The ultraviolet absorbing film 18 is made of black alumite ' and is formed by subjecting the upper surface of the aluminum stage ST to black surface aluminizing treatment. The entire upper surface of the stage ST is blackened by the ultraviolet absorbing film 18 made of black oxygen aluminum. As a result, when the ultraviolet ray is irradiated on the stage ST, the ultraviolet ray is not reflected, but is caused by Absorbed by the ultraviolet absorbing film 18 made of black oxygen aluminum. Then, it is formed in the present embodiment. Then, the upper surface of the machine TB is aligned, and similarly, the black surface is aluminized to form an ultraviolet film 19 made of black oxygen aluminum. Then, when When the ultraviolet ray is irradiated on the aligning machine TB, the ultraviolet absorbing film 19 does not reflect the ultraviolet ray and absorbs it. As shown in Fig. 1, the cradle 2 includes the upper left frame 5d and the right upper frame. a pair of front and rear bracket bodies 2a between 5e. The left and right end portions of the two bracket bodies 2a are disposed on the upper left frame body ^ and the right upper frame body 5e - the guide 2 The two ^2 are extended parallel to each other in the γ direction, and the extensions are respectively movable along the direction of the ¥. The Malay ball snails/into the beads are shown. In the γ direction (front-rear direction), the lower side of the =SJ 2a is arranged in parallel along the parallel direction, and the mounting member 23 is passed through the mounting member 23, and the ultraviolet and line irradiation unit 3 is disposed in the X direction. That is, along the external line irradiation unit 3, the system can be red] H The purple movement of the member 23. Each ultraviolet ray is irradiated with a single S 3 'reciprocating crystal display panel Y in the Y direction, and the linear beam beam constituting the liquid line fixed to the cutting table ST is linearly extended by ultraviolet rays. 8 201205166 Direction (left and right direction) reciprocating movement. Two on the bracket body 2a, along the χ
因而’藉由使各紫外線照射單元3沪荖γ古 動:可使紫外線照射單元3之寬度方“中心二 =4圖)，停止在被載置固定於載物台 JJ 板ρ之上方的預定位置(與形成於基板w2 : 方向延伸的直線狀密封材S對峙的位置）。 从ί次々’按照第4圖至第7圖說明紫外線照射單元3。另 ;卜外===?3係相同的構成，所啤“ 如第4圖及第5圖所示，紫外線照射單元3 沾 31 沿著安賴件23 Ϊ1 數個本實施形態令為40個)照射模纽32 认营祐數 =射模組32 ’係由分別排列設置有複數個 (本實施㈣巾為8個)料線發光二極體咖所構成。 各照射模組32 ’係具有電路基板33,且如第5圖所示， 势ί 33 m x方向安|有作為光學元件的8個 ^體咖成—排。然後，當各電路基板幻利 固疋没置於連結板31之下面時，被安裝於電路基 板33上的紫外線發光二極體LED就會位於該基板％之下 側，並且8個紫外線發光二極體LED是沿著χ方向排列。 而且，鄰接的全部照射模組32之被安裝於電路基板％的紫 ==體勝係以等間隔沿著x方向排列成一直線 因而’在本實施形態中’ 320個紫外線發光二極體LED， 201205166 係以等間隔沿著χ方向配置成一直線狀。 在被女裝於電路基板33成一直線狀的各紫外線發光二 極體LED之下側，係分別配置有半球透鏡35，而各半球^ 鏡35係入射各自對應的紫外線發光二極體LED所射出的紫 外線UV。然後，各半球透鏡35，係用以抑制該經入射的紫 外線UV之擴散並分別朝向下方射出。 、 在各自對應紫外線發光二極體LED而配置的8個半球 透鏡35之下侧’係沿著X方向配置有用以覆蓋各半球透鏡 35之呈棒狀的柱面透鏡36。柱面透鏡36，係入射從各半球 透鏡35射出的紫外線uv。柱面透鏡36，係使從各半球透鏡 35入巧紫外線UV相對於γ方向收斂並聚光成橢圓形狀。 詳吕之，如第6圖⑷、（b)所示，從各紫外線發光二極 體LED射出的紫外線uv，係利聽置於正下方的半球透 3/5來抑制擴散。然後，從各半球透鏡35射出的紫外線， 係利用柱面魏36只收麟γ ^向並聚光細圓形狀 此’從各紫外線發光二極體LED射出的紫外線uv之位於丄 τ ’係成為於x方向具有長軸的長橢 J此間相互4疊，就可職沿著χ方向以直線狀延伸的光t 射面SF。換句話說，從各紫外線發光二極體led的^ =UV，係成為在X方向(左右方向)以直線狀延伸之且有 =寬上1)的紫外線(亦即，直線狀束射光LB)，並照射於上= 如第7圖所示，以線寬D照射於上基板W2的直 射光LB ’係在穿透上基板W2而照射於密封材s時緣 會在上基板W2内折射，所以全部不會照射於密封材s，有 密封材S。離開密封材8的直線狀束射光LB 係穿透下基板W1而照射於載物台ST。照射於載 離開密封材S的直線狀束射光LB，係由形成於載物$奵之 10 201205166 上面的紫外線吸收膜18所吸收。 換句話說，照射於載物台ST之離開密封材s的直線狀 束射光LB，並不會朝向液晶顯示器面板P進行反射。結果， 有在密封材S以外的區域中被配置於基板上的要素，例如在 被封入於由密封材S所包圍之區域内的液晶、或由密封材所 包圍的區域之形成於下基板W1(或上基板W2)的薄膜雷 (TFT)，被照射直線狀束射光LB之虞。 、體 另外，由於在機台TB上也同樣地形成紫外線吸收膜 19,所以離開密封材s而入射於機台TB的直線狀束射光[Η 也同樣不會被反射而可由紫外線吸收膜19所吸收。 “如第4圖所示，各半球透鏡35及柱面透鏡％，係由沿 著X方向而裝設於電路基板33之下面的保持構件4〇所保 持。保持構件40，係在電路基板33利用螺栓34固設於連^ 板上^之下面時，會一併利用該螺栓34對電路基板33進行 固定安裝。 —在保持構件40之下面中央位置，係沿著χ方向凹 谷納槽41，而在該容納槽41容納有柱面透鏡％。 夂主設於保持構件40的容納槽41之内底面，且與 械的位置：細等間隔貫通形成有貫通 rff. 'ά：χ 之直徑，係比半球透鏡35之直徑還稍微短， LED 树透鏡 35 於雷嵌ft貫通孔42。然後，當保持構件40固設 ί Ϊ球透鏡35 ’係在保持構件4G與被安裝 mi發光二極體哪之間被夹持固定。 落防配置有一對脫 栓34固設於電路;係在保持構件4〇利用螺 對保持構件40進行^定钱了面時’可—併侧該螺栓％ 一對贿防止板43，係簡定_配置於摘向的位 201205166 置。在脫落防止板43之前端係延伸出彈性卡止爪43a，利用 該彈性卡止爪43a ’可從下側彈壓卡止被容納於容納槽41的 柱面透鏡36,以免柱面透鏡36從容納槽41脫落。曰 其次，以下記載上述實施形態的紫外線照射裝置丨之 點。 (1) 在載物台ST之上面形成紫外線吸收臈18。然後，即 使離開密封材S的直線狀束射光LB照射於載物台ST，直線 狀束射光LB也會由紫外線吸收膜18所吸收，而不會朝向液 晶顯示器面板P進行反射。因而，沒有在被封入於由密封材 S所包圍之區域内的液晶、或由密封材所包圍的區域之形成 於下基板W1(或上基板W2)的薄膜電晶體(TFT)，被照射直 線狀束射光LB之虞。結果’液晶不會變質，薄膜電晶體(τρτ) 之電晶體特性不會變動。 (2) 藉由在鋁製載物台ST進行黑色表面滲鋁處理，而形 成紫外線吸收膜18。因而，可非常簡單地在載物台ST全面， 製作用以吸收紫外線的紫外線吸收膜18。 另外，上述實施形態也可變更如下。 在上述實施形態中，雖利用黑色表面處理形成紫外線吸 收膜18，但是並非被限定於此，也可塗敷形成用以吸收紫外 線之例如黑色塗料等來實施。 、 在上述實施形態中’係對應各紫外線發光二極體LED 而配置半球透鏡35，且在該半球透鏡35之下側配置呈棒狀 的柱面透鏡36 ’並利用柱面透鏡36，使從半球透鏡35射出 的紫外線UV，只收斂於γ方向而產生以直線狀延伸之具有 線寬D的直線狀束射光LB。 此也可使用第8圖所示的構造來產生直線狀束射光 LB。第8圖中’係在各紫外線發光二極體LED與各半球透 鏡35之間(換句話說，在各紫外線發光二極體LED之下面） 配置有第1遮罩MSI。第1遮罩MSI，係用以遮蔽從紫外線 12 201205166 發光二極體LED朝向半球透鏡35射出並擴散於γ方向的紫 外線UV ’且使直線狀束射光LB之線寬D與密封材S之線 寬二致。在該構造中，可實現一種能更有效地防止直線狀束 射光LB離開密封材S而照射的紫外線照射單元3。 又，如第8圖所示’也可在各半球透鏡35與柱面透鏡 36之間(換句話說，在柱面透鏡36之上面)配置第2遮罩 MS2。第2遮罩MS2，係用以遮蔽從半球透鏡35朝向柱面 ，鏡36射出並擴散於γ方向的紫外線且使直線狀束射 光線寬D與密封材s之線寬一致。在該構造中，可實 現一種忐更進一步有效地防止直線狀束射光LB離開密封材 S而照射的紫外線照射單元3。 ’另外，第8圖所示的紫外線照射單元3，雖為併設有第 =罩MSI及第2遮罩MS2,但是當然、也可以應用於只設置 其中一方的紫外線照射單元3。 實施賴巾，雜料賴射裝置1具體化作為 是本發明也可顧於使_出可視光的發光 二罢"代照射紫外線的紫外線發光二極體LED之光照 射褒置。 ' 在上述實施形態中，雖將為了使下基Therefore, by making each ultraviolet irradiation unit 3 荖 古 古 : : : : : : : : : : : : : : : : : : : : : : : : : : : : , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Position (position opposite to the linear seal member S formed in the direction of the substrate w2:). The ultraviolet irradiation unit 3 will be described from Fig. 4 to Fig. 7. The other is the same as the ===? The composition of the beer, as shown in Fig. 4 and Fig. 5, the ultraviolet irradiation unit 3 is immersed in 31 along the amps 23 Ϊ1, and the number of this embodiment is 40. The module 32' is composed of a plurality of wire-emitting diodes arranged in a plurality of (four for this embodiment). Each of the illumination modules 32' has a circuit board 33, and as shown in Fig. 5, there are eight electrons in the direction of the optical element. Then, when the circuit board is not placed under the connecting board 31, the ultraviolet light emitting diode LED mounted on the circuit board 33 is located on the lower side of the substrate, and 8 ultraviolet light emitting diodes The polar LEDs are arranged along the x-direction. Further, the purple== body wins of all the adjacent illumination modules 32 mounted on the circuit board % are arranged in a line along the x direction at equal intervals, so that 'in the present embodiment, '320 ultraviolet light emitting diodes LEDs, 201205166 is arranged in a straight line along the χ direction at equal intervals. The hemispherical lens 35 is disposed on the lower side of each of the ultraviolet light-emitting diode LEDs that are linearly formed on the circuit board 33, and each of the hemispherical mirrors 35 is incident on the corresponding ultraviolet light-emitting diode LED. UV UV. Then, each of the hemispherical lenses 35 is for suppressing the diffusion of the incident ultraviolet rays UV and respectively emitting them downward. A cylindrical lens 36 having a rod shape covering each hemispherical lens 35 is disposed along the X direction in the lower side of the eight hemispherical lenses 35 arranged corresponding to the ultraviolet light emitting diode LEDs. The cylindrical lens 36 is incident on the ultraviolet uv emitted from each of the hemispherical lenses 35. The cylindrical lens 36 converges from the respective hemispherical lenses 35 to align with the γ direction and condense into an elliptical shape. In detail, as shown in Fig. 6 (4) and (b), the ultraviolet uv emitted from each of the ultraviolet light-emitting diode LEDs is 3/5 of the hemispherical lens directly underneath to suppress the diffusion. Then, the ultraviolet rays emitted from the respective hemispherical lenses 35 are collected by the cymbal wei γ ^ and the condensed light is rounded, and the ultraviolet uv emitted from each of the ultraviolet illuminating diode LEDs is located at 丄 τ ' The long ellipsoids J having the long axis in the x direction are stacked one on another, and the light t-plane SF extending linearly along the χ direction is available. In other words, ^=UV from each of the ultraviolet light-emitting diodes is an ultraviolet ray that extends linearly in the X direction (left-right direction) and has a width of 1) (that is, linear beam light LB). And irradiated on the upper side. As shown in FIG. 7, the direct light LB' irradiated to the upper substrate W2 by the line width D is refracted in the upper substrate W2 while penetrating the upper substrate W2 and irradiating the sealing material s. Therefore, all of them are not irradiated to the sealing material s, and there is a sealing material S. The linear beam light LB leaving the sealing material 8 penetrates the lower substrate W1 and is irradiated onto the stage ST. The linear beam LB irradiated on the sealing member S is absorbed by the ultraviolet absorbing film 18 formed on the top of the carrier 10 201205166. In other words, the linear beam LB that is irradiated onto the stage ST away from the sealing material s does not reflect toward the liquid crystal display panel P. As a result, an element that is disposed on the substrate in a region other than the sealing material S is formed on the lower substrate W1, for example, a liquid crystal enclosed in a region surrounded by the sealing material S or a region surrounded by the sealing material. The thin film lightning (TFT) of (or the upper substrate W2) is irradiated with the linear beam light LB. In addition, since the ultraviolet ray absorbing film 19 is formed in the same manner on the machine TB, the linear beam of light that is incident on the machine table TB away from the sealing material s is also not reflected by the ultraviolet absorbing film 19. absorb. "As shown in Fig. 4, each of the hemispherical lens 35 and the cylindrical lens % is held by the holding member 4A mounted on the lower surface of the circuit board 33 along the X direction. The holding member 40 is attached to the circuit board 33. When the bolt 34 is fixed to the lower surface of the connecting plate, the circuit board 33 is fixedly mounted by the bolt 34. - At the center of the lower surface of the holding member 40, the groove 41 is grooved along the χ direction. The cylindrical lens lens 100 is accommodated in the accommodating groove 41. The cymbal is mainly disposed on the inner bottom surface of the accommodating groove 41 of the holding member 40, and is formed at a position equal to the distance between the mechanical and the ribs. The diameter of the hemispherical lens 35 is slightly shorter than that of the hemispherical lens 35. The LED tree lens 35 is embedded in the through hole 42. Then, when the holding member 40 is fixed, the ball lens 35' is attached to the holding member 4G and the mi-emitting diode is mounted. The body is clamped and fixed. The pair of anti-bolts 34 are fixed to the circuit; when the holding member 4 is fixed by the screw to the holding member 40, the bolt can be The bribery prevention board 43 is stipulated in the rounding position 201205166. The front end of the fall prevention plate 43 extends out of the elastic locking claw 43a, and the elastic locking claw 43a' can elastically lock the cylindrical lens 36 accommodated in the receiving groove 41 from the lower side, so that the cylindrical lens 36 is not received from the receiving groove 41. The ultraviolet irradiation device of the above-described embodiment is described below. (1) The ultraviolet absorbing dam 18 is formed on the upper surface of the stage ST. Then, even the linear beam LB leaving the sealing material S is irradiated. The stage ST, the linear beam light LB is also absorbed by the ultraviolet absorbing film 18, and does not reflect toward the liquid crystal display panel P. Therefore, there is no liquid crystal enclosed in the region surrounded by the sealing material S, Or a thin film transistor (TFT) formed on the lower substrate W1 (or the upper substrate W2) in a region surrounded by the sealing material, is irradiated with a linear beam of light LB. As a result, the liquid crystal does not deteriorate, and the thin film transistor (τρτ) The crystal characteristics of the crystal are not changed. (2) The ultraviolet absorbing film 18 is formed by a black aluminizing treatment on the aluminum stage ST. Therefore, the stage ST can be completely integrated. Absorb The ultraviolet absorbing film 18 of the outer line. The above embodiment may be modified as follows. In the above embodiment, the ultraviolet absorbing film 18 is formed by a black surface treatment, but the invention is not limited thereto, and may be coated to absorb ultraviolet rays. In the above embodiment, the hemispherical lens 35 is disposed corresponding to each of the ultraviolet light emitting diode LEDs, and a cylindrical lens lens 36' having a rod shape is disposed under the hemispherical lens 35. By the cylindrical lens 36, the ultraviolet ray UV emitted from the hemispherical lens 35 converges only in the γ direction, and linear beam light LB having a line width D extending linearly is generated. It is also possible to use the configuration shown in Fig. 8 to generate linear beam light LB. In Fig. 8, the first mask MSI is disposed between each of the ultraviolet light-emitting diodes LEDs and the respective hemispherical lenses 35 (in other words, under the respective ultraviolet light-emitting diode LEDs). The first mask MSI is for shielding the ultraviolet ray ' emitted from the ultraviolet ray 12 201205166 illuminating diode LED toward the hemispherical lens 35 and diffusing in the γ direction, and the line width D of the linear beam LB and the sealing material S Wide and second. In this configuration, it is possible to realize the ultraviolet irradiation unit 3 which can more effectively prevent the linear beam light LB from being irradiated away from the sealing material S. Further, as shown in Fig. 8, the second mask MS2 may be disposed between each of the hemispherical lenses 35 and the cylindrical lens 36 (in other words, on the upper surface of the cylindrical lens 36). The second mask MS2 shields the ultraviolet rays emitted from the hemispherical lens 35 toward the cylindrical surface, and the mirror 36 emits and diffuses in the γ direction, and the linear beam ray width D coincides with the line width of the sealing material s. In this configuration, it is possible to realize an ultraviolet ray irradiation unit 3 which is more effective in preventing the linear beam light LB from being irradiated away from the sealing material S. Further, although the ultraviolet irradiation unit 3 shown in Fig. 8 is provided with the reticle MSI and the second mask MS2, it is of course also applicable to the ultraviolet ray irradiation unit 3 in which only one of them is provided. In the present invention, it is also possible to embody the illumination of the ultraviolet light-emitting diode LED which is irradiated with ultraviolet light. In the above embodiment, in order to make the base
==由紫外線硬化樹脂所構成的密封材S 予以具體化，但是本發明也可以應2 處理除此⑽之基板用的光照織置。亦即 U應用於在液晶顯示H面板之製造裝置情用的光照射 雖然前述的描述及圖示已揭 須瞭解到各種增添、許多修改和取 理之h專利範圍所界定的本發明原 理之精神及關。縣該㈣者 = 很多形式、結構、佈置、比例、使用於 K列材枓、7C件和組件的修改。 201205166 ，此，本文於此所揭示的實施例於所有觀點， _本發明，而非用以限制本發明。本發；： 【圖式簡單說明】 第1圖係本實施形態之料、_概置的立體圖； ，2圖係本實卿態之料、_射裝置的前視圖;’ 圖；第3圖係說明紫外線照射襄置之載物台用的整體立體 主要卿餅_雜置之料、_射單元用的 第5圖係顯示照射膜組織配置狀態的示意圖； f 6 ®⑻、（_說明從紫外線照射裝置 束射光狀翻目； ^ 第7圖係說明依紫外線吸收膜進行直線狀束射吸 收用的說明圖；以及 第8圖係顯示其他例的說明圖。 【主要元件符號說明】 1紫外線照射裝置 2a 支架本體 5機框 5b下部框體 5d左側上部框體 6四角框體 8貫通孔 10導孔 U照明度檢測裝置 2支架 3紫外線照射單元 5a支柱 5c中間框體 5e右側上部框體 7支承臂 9基板移動裝置 11檢測窗 13導軌 14 201205166 14 載具 15 照明度感測器 18 ' * 19紫外線吸收膜 18 光吸收構件 21 導轨 23 安裝構件 30 框體 31 連結板 32 照射模組 33 電路基板 34 螺栓 35 半球透鏡 36 柱面透鏡 40 保持構件 41 容納槽 42 貫通孔 43 脫落防止板 43a 彈性卡止爪 LED紫外線發光二極體(光學元件） MSI第1遮罩 MS2 第2遮罩 P 液晶顯不裔面板 Puo 中心位置 S 直線狀光硬化性樹脂(密封材）SF 光照射面 ST 載物台 STa 載物台之下面 T 照射區域 TB 對準機台 UV 紫外線 LB 直線狀束射光 W1 下基板 W2 上基板 15== The sealing material S composed of the ultraviolet curable resin is embodied, but the present invention can also handle the light woven fabric for the substrate other than the above (10). That is, the U is applied to the light illumination of the manufacturing device of the liquid crystal display panel. Although the foregoing description and illustrations have revealed the spirit of the principles of the invention defined by various additions, many modifications and treatments. And off. County (4) = Many forms, structures, arrangements, proportions, modifications used in K-pillars, 7C parts and components. 201205166, the embodiments disclosed herein are hereby incorporated by reference in its entirety in its entirety herein. The present invention;: [Simplified description of the drawings] Fig. 1 is a perspective view of the material of the embodiment, _the overall view; 2, the front view of the material of the real state, the _shooting device; 'Fig; 3 It is a schematic diagram showing the overall three-dimensional main cake for the stage of the ultraviolet irradiation device. The fifth figure for the miscellaneous material and the _emission unit is a schematic view showing the arrangement state of the irradiation film; f 6 ®(8), (_ The ultraviolet irradiation device beam is flared; ^ Fig. 7 is an explanatory view for linear beam absorption by the ultraviolet absorbing film; and Fig. 8 is an explanatory view showing other examples. [Main component symbol description] 1 Irradiation device 2a Bracket body 5 Frame 5b Lower frame 5d Left upper frame 6 Square frame 8 Through hole 10 Guide hole U Illumination detection device 2 Bracket 3 Ultraviolet irradiation unit 5a Post 5c Intermediate frame 5e Right upper frame 7 Support arm 9 substrate moving device 11 detection window 13 rail 14 201205166 14 carrier 15 illuminance sensor 18 ' * 19 ultraviolet absorbing film 18 light absorbing member 21 rail 23 mounting member 30 frame 31 connecting plate 32 illuminating module 33 Electricity Substrate 34 Bolt 35 Hemispherical lens 36 Cylindrical lens 40 Holding member 41 accommodating groove 42 Through hole 43 Falling prevention plate 43a Elastic locking claw LED ultraviolet light emitting diode (optical element) MSI first mask MS2 Second mask P liquid crystal Display panel panel Puo center position S Linear photocurable resin (sealing material) SF Light irradiation surface ST Stage STa Below the stage T Irradiation area TB Aligning machine UV UV LB Linear beam light W1 Lower substrate W2 upper substrate 15