TW201204820A

TW201204820A - Heat dissipation formulation

Info

Publication number: TW201204820A
Application number: TW099123425A
Authority: TW
Inventors: Gu-Hua Lin
Original assignee: Sequoia Radcure Co Ltd
Priority date: 2010-07-16
Filing date: 2010-07-16
Publication date: 2012-02-01
Also published as: DE102011106024A1; TWI425084B; JP2012021145A

Abstract

A heat dissipation formulation comprises, in aromatic hydrocarbon based on benzene, the double-bond material with hydroxyl group, such as 2-hydroxybenzophenone, 2-hydroxydibenzoic acid or 2-(2'-hydroxy)benzotriazole, in which resin coating agents are added, and diluents agents are added and spread on the surface of a heat dissipation member to facilitate heat dissipation. When the heat on the heat dissipation member is dissipated, the double-bond material will absorb heat and shift to produce resonance structure to allow faster heat dissipation; after heat release, the original double-bond state is recovered to increase the heat dissipation efficiency.

Description

201204820 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式201204820 V. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention.

吸熱Endothermic

六、發明說明：【發明所屬之技術領域】本發明此種散熱配方，為以特定化合之雙鍵原料添加添加樹脂類之塗料，以及添加稀釋劑塗在散熱件表面幫助散熱，當散熱件受熱散發時，此雙鍵原料會吸熱位移，產生共振結構’讓熱量更快消散，放熱後，又回復原雙鍵方式，達到提高散熱效率之新穎技術者。【先前技術】很多電器或電子設備襄的電子元件，例如電腦裏的 CPU间功率照明LED等，對作功產熱敏感雖然是元件自订作功之餘’自行生出的熱量，但如果不在其周圍加裝散熱材，幫它散出熱，就會錄細積熱過度燒壞。因此惟有良好的散熱效率，才能運作這類電子元件正常維持使用壽命，習見這些作功發熱元件多是在背面疊裝散熱板或散熱歧片之散熱件，藉由該些散熱件本身材料之南散熱度，或形體再增多之散熱表面積，幫助這些作功發熱元件維持適當工作溫度，然雨著電子產業越發進步， .201204820 各種電子產品越做越小，功率卻越發提高，使得光靠該些散熱件本身材料之高散熱度，或形體再增多之散熱表面積的方式已難以因應。有鐘於光靠習見電器内之散熱件結構，很難再進一步提幵散熱效率，以因應更新更高功效的電器使用，本人乃積極研究改進之道，經過一番艱辛的發明過程，終於有本發明產生。 Φ 【發明内容】本發明此種散熱配方，係為以苯為母體化合物之芳香烴類中具有髮g能基之雙鍵原料，（例如2_經基二苯曱酮，或2絲一笨甲酸，或2_ (2，_經基）笨耕三唾），添加樹月曰類之塗料’以及添加稀_獅敝在散熱件表面幫助散熱’虽散熱件受熱散發時，此雙鍵原料會吸熱位移，產生共 n讓熱量H肖散’放熱後，又回復原雙鍵方式，達 # 到提回散熱效率，此為本發明之主要目的。又’本發明此種散熱酉己方，其雙鍵原料所添加之樹脂類之塗料可為以下各項類型， 1.該樹脂類之塗料係為滾塗_，以適祕滾塗機滚塗平板類之散熱件產品。該树月曰類之塗料係為淋塗樹脂，以適用於淋塗機淋塗平板類之散熱件產品。 3.該樹脂類之塗料係為噴塗樹脂，以適用於倾機喷塗散熱 201204820 件產品。 4.該樹脂類之塗料係為電著用樹脂，加上水性之稀釋劑，以適用於電著塗料槽電鍍散熱件產品。而本發明散熱配方可廣泛應用於如擠型或壓鑄型鋁材質散熱鰭片與IS板：例如電視（τν)背光模組·52材料及鍍 ©捲鋼材料與MCPCB表面散熱處理或導熱型接著劑，且可因應材料規範需求調整物錄，她性強，如現行擠型材常以陽極 • 處理達到且SST由原先<24hr提升到>96hr、QUT>2〇Ohr △Ε 1· G ;除環餅物性更強；陽極處理麟低絕緣風險高，新型散熱塗裝膜厚彈性高絕緣風險低，另外，以往cnt/bn/ain 系統產品外觀粗糖均溫性受質疑，本發明此種配方配出之產品外觀透明平滑均溫佳，提供業界更有效散熱對策。至於本發明之詳細構造、顧原理、作賴姐，則參照下列依附圖所作之說明即可得到完全的了解。 φ 【實施方式】第一圖為本發明散熱配方之配方比例圖，由圖所示可知本發明此種散熱配方’係為以苯為母體化合物之芳香烴類中’具有經官能基之雙鍵原料10,（例如2-經基二苯甲酮’或2,基二苯甲酸，或2 一（2, 一經基）笨餅三嗤），添加樹脂類之塗料2〇，以及添加稀釋劑30，比例以塗料 20固成份為1〇〇的基準來說，雙鍵原料1〇約在5〜1〇〇，亦即雙鍵原料10比塗料2〇的比值為5〜1〇〇 : 1〇〇，而水 Εί 4 201204820 性之稀釋劑30約在100到900 ’即稀釋劑30比塗料20的比值為100〜900 : 100，若使雙鍵原料10比塗料20的比值達到120 :100，則會有黏度高、成本高’操作困難問題。由此將雙鍵原料10與塗料20、稀釋劑30混妥之混合液，塗在散熱件表面，就會幫助散熱件散熱，此因散熱件受熱散發時’雙鍵原料遇熱會打散吸熱’使鍵位移’產生共振結構，讓熱量更快消散，放熱後，又回復原雙鍵方式，例如， % 2-羥基二苯曱酮（2-hydroxybenzophenone)之受放熱狀況VI. Description of the Invention: [Technical Field] The heat-dissipating formula of the present invention is characterized in that a resin-based coating is added to a specific compound double-bond raw material, and a diluent is added to the surface of the heat-dissipating member to help dissipate heat, and when the heat-dissipating member is heated When dissipated, the double-bonded material absorbs heat and generates a resonance structure, which allows the heat to dissipate more quickly. After the heat is released, it returns to the original double-key mode to achieve a novel technique for improving heat dissipation efficiency. [Prior Art] Many electronic components of electrical or electronic equipment, such as CPU-powered lighting LEDs in computers, are sensitive to work heat, although they are self-made by the components themselves, but if they are not Add heat sink around it to help it dissipate heat, and it will record excessive heat and burn out. Therefore, only good heat dissipation efficiency can be used to operate such electronic components to maintain the service life. It is known that these heating elements are mostly heat sinks stacked on the back side of the heat sink or heat dissipating fins, and the materials of the heat sinks themselves are south. The heat dissipation, or the increased heat dissipation surface area of the body, helps these working heating elements maintain proper operating temperatures, but the electronics industry is getting more and more advanced. 201204820 The smaller and smaller the various electronic products, the more power they have, so that they rely on them. The high heat dissipation of the material of the heat sink itself, or the increased heat dissipation surface area of the body has been difficult to cope with. It is difficult to further improve the heat dissipation efficiency by Zhong Yuguang relying on the heat sink structure in the appliance. In order to update the use of higher-efficiency appliances, I am actively researching the improvement. After some hard process of invention, I finally have The invention is produced. Φ [Summary of the Invention] The heat-dissipating formulation of the present invention is a double-bonded raw material having a g-energy group in an aromatic hydrocarbon having benzene as a parent compound (for example, 2-dibenzophenone, or 2-filament Formic acid, or 2_ (2, _ base) stupid three saliva), add the tree sapphire coating 'and add thin _ lion 敝 on the surface of the heat sink to help the heat', although the heat sink is heated, this double bond raw material will absorb heat The displacement, which produces a total of n, allows the heat H to be dissipated, and then returns to the original double-key mode to reach the heat-dissipating efficiency, which is the main purpose of the invention. Moreover, the resin of the present invention can be of the following types: 1. The resin type coating is a roll coating _, and the slab is rolled by a suitable roller coater. Class of heat sink products. The coating of the tree scorpion is a coating resin, which is suitable for a heat sink product of a shower coating type. 3. The resin type coating is sprayed resin, which is suitable for the coating and cooling of 201204820 pieces. 4. The resin type coating is an electric resin, and an aqueous diluent is added to apply to an electroplating bath plating heat sink product. The heat-dissipating formula of the present invention can be widely applied to heat-dissipating fins and IS boards such as extruded or die-cast aluminum materials: for example, television (τν) backlight module·52 material and plated steel material and MCPCB surface heat treatment or thermal conductivity type Agent, and can adjust the record according to the material specification requirements, she is strong, such as the current extrusion profile is often achieved by the anode • treatment and the SST is upgraded from <24hr to >96hr, QUT>2〇Ohr △Ε 1· G; In addition to the physical properties of the ring cake, the anode treatment has a high risk of low insulation, and the new heat-dissipating coating film has high elasticity and high insulation risk. In addition, the appearance of crude sugar in the cnt/bn/ain system product has been questioned. The products are equipped with transparent, smooth and uniform appearance, which provides more effective heat dissipation measures in the industry. As for the detailed construction, the principle of the invention, and the work of Lai, the complete understanding can be obtained by referring to the following description made with reference to the accompanying drawings. φ [Embodiment] The first figure is a formulation ratio diagram of the heat dissipation formula of the present invention. It can be seen from the figure that the heat dissipation formula of the present invention is a double bond having a functional group in an aromatic hydrocarbon having benzene as a parent compound. Raw material 10, (for example, 2-pyridylbenzophenone' or 2, bisbenzoic acid, or 2 (2, one vial) apricot), adding a resin coating 2, and adding a diluent 30 The ratio of the solid content of the coating material 20 is 1 〇〇, the ratio of the double bond raw material is about 5 to 1 〇〇, that is, the ratio of the double bond raw material 10 to the coating 2 5 is 5 〇〇 1 〇〇: 1〇〇,和水Εί 4 201204820 Thinner 30 is about 100 to 900', that is, the ratio of the diluent 30 to the coating 20 is 100 to 900: 100. If the ratio of the double bond raw material 10 to the coating 20 is 120:100, There will be problems of high viscosity and high cost. Therefore, the mixture of the double bond raw material 10 and the coating material 20 and the diluent 30 is applied to the surface of the heat dissipating member, which will help the heat dissipating component to dissipate heat. When the heat dissipating component is dissipated by heat, the double-bonded material will dissipate heat when it is heated. 'Make the key shift' produces a resonant structure that allows the heat to dissipate more quickly, and after the exotherm, returns to the original double bond mode, for example, the exotherm of % 2-hydroxybenzophenone

吸熱放熱 > 2 -羥基二苯曱酸(2-hydroxyd i benzoac i d)之受放熱狀況Endothermic exothermic > 2-hydroxyd i benzoac i d

(2’ -羥基）苯駢*** (Alkyl2-cyano-3. 3-diphenylacrylate)之受放熱狀況Exothermic condition of (2'-hydroxy)benzotriazole (Alkyl2-cyano-3. 3-diphenylacrylate)

(註：此式以C及N雙鍵吸熱共振—位移—放熱—回復方式進行散熱，C及N雙鍵數愈多’效果愈好。）而本發明散熱配方可廣泛應用於如擠型或壓鎮型鋁材質 201204820 散熱鰭片與Is板：例如電視㈤背光模組# 5脱材料及錢面捲鋼材料與MCPCB表面散熱處理或導熱型接著劑，且可因應材料規範需求輕物化性’鶴性強，如現行擠型财以陽極處理達到且SST由原先<24hr提升到>96hr、QUT>200hr △E 1. G ’除稿外物性更強；陽極處频厚低絕緣風險高，新型散熱塗裝膜厚彈性高絕緣風險低，另外，以往CNT/BN/應系統產品外觀粗_溫性受質疑，本發明此種配方配出之產品 • 外觀透明平滑均溫佳，提供業界更有效散熱對策。本發明人曾以下表之溫度量測系統測試本發明配方，並請同時參照第二圖之量測架構圖:(Note: This formula uses C and N double-key endothermic resonance-displacement-exothermic-recovery mode to dissipate heat, and the more C and N double-keys are, the better the effect is.) The heat-dissipating formula of the present invention can be widely applied to, for example, extrusion or Press-type aluminum material 201204820 Heat sink fins and Is board: for example, TV (5) backlight module # 5 strip material and money surface coil steel material and MCPCB surface heat treatment or thermal conductivity type adhesive, and can be light materialized according to material specification requirements' The crane is strong, if the current extrusion type is achieved by the anode treatment and the SST is upgraded from the original <24hr to >96hr, QUT>200hr △E 1. G 'except the foreign matter is stronger; the anode has a low frequency and low insulation risk. The new type of heat-dissipating coating film has high flexibility and low insulation risk. In addition, the appearance of CNT/BN/supplied system products has been questioned. The product of this formula is equipped with a transparent, smooth and uniform appearance. More effective heat dissipation measures. The inventors have tested the formulation of the present invention in the temperature measurement system of the following table, and also refer to the measurement architecture diagram of the second figure:

實驗耗材模組規格數量 1 銘散熱鰭片（如第塗裝序號45101560 1只二圖標示60者） 2 — 加熱片（如第二圖 Lax <26(TC 1只標不50者） 3 電木板（如第二圖 1只標不40者）儀器設備型號 1 sorensen DLM 40-15 2 溫度量測系統量測時間：4 Hrs (每5秒取樣一 -- 次）量測參數：5W 201204820The number of specifications of the experimental consumables module 1 Ming fins (such as the first coating number 45101560 1 two icon shows 60) 2 - heating sheet (such as the second figure Lax < 26 (TC 1 only 50) 3 electric Wood board (such as the second figure 1 is only 40) Instrument and equipment model 1 sorensen DLM 40-15 2 Temperature measurement system measurement time: 4 Hrs (sampling every 5 seconds - times) Measurement parameters: 5W 201204820

量測點PIMeasuring point PI

量測位置加熱片中心點 ' -------- 散熱鰭片片基部中心點散熱鰭片片頂中心點定位狀態定位於加^- 一''~二圖標示 pi 處）疋位於鋁散熱鰭片上疋位於鋁散熱鰭片上定位於電木板上（距離ρι 約 9.7 cm) 約 2.5 cm)Measuring position of the heating piece center point ' -------- The center of the heat sink fin base point The heat sink fin top center point positioning state is positioned at the plus ^ - one ''~ two icon shows pi) 疋 is located in aluminum The heat sink fins are located on the aluminum fins and are positioned on the bakelite (approximately 9.7 cm from the distance ρ cm).

、、-——-_(距離 P1 約 9. 7 cm) 、此⑽度1測系統之設定環境，模擬咖作業，將 ⑽農設.散熱則經塗裝本發方，及⑽裝設之罐熱鰭片未錄本發舰方之進行量耻較，得㈣三圖為散熱籍片塗裝本發明配方於⑽作業環境之測試統計圖表，及第四圖為散熱鰭片未塗裝本發明配方於CPU作業環境之測試統相表’對照㈣之統計曲線及數值表，可贿現量測點 pi開始’有塗裝本發明配方情形下取得的溫度值，就已經比未塗裝本發明配方情形下取得的溫度值要低，足證有塗裝本發明散熱配方之散熱效率更佳，且能朗提高散熱效率，有導熱性佳、低溫熱輻紐佳、耐高溫及表面师敎之特點，右杈擬LE：D作業環境，如第五圖為模擬散熱鰭片塗裝本發明配方於LED作業環境之測試統計圖表，也可得出良好的散熱效果。 201204820 另外如前述其所添加之樹脂類之塗料20可為以下各項類型：、 s十月曰類之塗料係為滾塗樹脂，以適用於滾塗機滾塗平板類之散熱件產品。 2. 該樹月日類之塗料2Q係為淋塗樹脂，以顧於淋塗機淋塗平板類之散熱件產品。 3. 該树知類之塗料2G係為噴塗樹脂，以剌於倾機喷塗散熱件產品。 5樹月曰類之塗料2〇係為電著用樹脂，力吐水性之稀釋劑以適用於電著塗料槽電鍍散熱件產品。綜上所述，本發明此種散熱配方，確實能提高散熱效率且未見諸公開使用，合於專利法之規定，懇請賜准專利，實為德便。須陳明者，以上所述乃是本發明較佳具體的實施例，若依本發明之構想所作之賴，或其產生之魏作用，仍未超出說明書與圖式所涵蓋之精神時，均應在本發明之範圍内’合予陳明。【圖式簡單說明】第一圖為本發明散熱配方之配方比例圖。第二圖為本發明散熱配方之量測架構圖。第二圖為散熱鰭片塗裝本發明配方於CPU作業環境之測試統计圖表。, , --——-_ (distance P1 about 9. 7 cm), the setting environment of this (10) degree 1 measurement system, simulated coffee operation, (10) agricultural equipment, heat dissipation, painted by the sender, and (10) installed The hot fins of the tank are not recorded in the volume of the ship. The (4) three figures are the test charts of the heat-dissipating film coating of the invention in (10) working environment, and the fourth figure is the uncoated version of the heat-dissipating fins. Invented formula in the CPU operating environment test comparison table 'control (four) statistical curve and value table, can be measured at the point pi start 'the temperature value obtained under the condition of coating the invention, it is already better than the uncoated version The temperature value obtained in the case of the invention formula is low, and it is proved that the heat dissipation formula of the invention has better heat dissipation efficiency, and can improve the heat dissipation efficiency, has good thermal conductivity, low temperature heat transfer, high temperature resistance and surface division. The characteristics of the 敎, the right LE LE: D operating environment, such as the fifth figure is the simulation of the cooling fins of the invention in the LED operating environment test statistical chart, can also get a good heat dissipation. 201204820 Further, the resin-based coating material 20 added as described above may be of the following types: s. The sapphire bismuth coating is a roll-coated resin suitable for a heat sink product of a roll coater of a roll coater. 2. The 2Q series of the coatings of the tree and the sun is a coating resin, which is based on the heat sink products of the coating machine. 3. The 2G coatings of this tree are sprayed with resin to smash the sprayed heat sink products. The coating of 5 tree scorpion type 2 is an electric resin, and the water repellency diluent is suitable for electroplating heat sink products. In summary, the heat-dissipating formula of the present invention can effectively improve the heat-dissipating efficiency and is not disclosed for use. In accordance with the provisions of the Patent Law, it is a matter of granting a patent. It is to be understood that the above is a preferred embodiment of the present invention, and if the concept of the present invention or its effect is not exceeded by the spirit of the specification and drawings, It shall be incorporated in the scope of the present invention. [Simple description of the drawings] The first figure is a formula ratio diagram of the heat dissipation formula of the present invention. The second figure is a measurement architecture diagram of the heat dissipation formula of the present invention. The second figure is a test chart of the heat sink fins coated with the formulation of the present invention in the CPU operating environment.

i SJ 8 201204820 第四圖為散熱鰭片未塗裝本發明配方於CPU作業環境之測試統計圖表。第五圖為模擬散熱鰭片塗裝本發明配方於LED作業環境之測試統計圖表【主要元件符號說明】 10.. ..雙鍵原料 20.. ..塗料 30----稀釋劑 40.. ..電木板 50----加熱片 60.. ..銘散熱.韓片i SJ 8 201204820 The fourth figure shows the test chart of the heat sink fins not coated with the formulation of the invention in the CPU operating environment. The fifth figure is the test statistical chart of the simulated heat sink fin coating in the LED working environment of the invention. [Main component symbol description] 10.. .. double bond raw material 20.. .. coating 30----thinner 40. ...Electronic board 50----heating sheet 60.. .. Ming heat. Korean film

[SI 9[SI 9

Claims

201204820 七、申請專利範圍： 1·種散熱配方，係為以苯為母體化合物之芳香烴類中，耳有經官能基之魏願，添加樹脂類之塗料，以及添加稀釋劑’以適當的比例塗在散熱件表面幫助散熱，當散熱件受熱散發時’此雙鍵原料會吸熱位移，產生共振結構，讓熱量更快消散’放熱後，又回復原雙鍵方式，達到提高散熱效率者。 Ά • 2.如巾請專利範圍第1項之散熱配方，其中所述雙鍵原料，添加樹脂類之塗料，以及添加稀釋劑，以適當的比例塗在散熱件表面幫助散熱之該比例，係以塗料固成份為刚的基準來說，雙鍵原料約在5〜100，亦即雙鍵原料比塗料的比值為5〜100:100,而稀釋劑為水性者，約在1〇〇到嶋，即稀釋劑比塗料的比值為100〜900:100者。 3. 如申請專利細第丨項之散熱配方，其中該雙鍵原料為 • 2-羥基二苯曱酮者。 4. 如申請專利範圍第丨項之散熱配方，財該雙鍵原料為 2-羥基二苯甲酸者。 5. 如申請專利細第丨項之散熱配方，射該雙鍵原料為 2- (2’ -羥基）苯駢***者。 6. 如申請專利範圍第i項之散熱配方，其中該樹脂類之塗料係為滾塗樹脂’以適餘滾塗機滚塗平_之散熱件產品者。 7·如申請專纖圍第丨項之散熱财，其中靖職之=料係 201204820 / &以翻麵塗機淋塗平板類之散熱件產品者。 8. 如申請專利範圍第1項之散熱配方，其中該樹脂類之塗料係為喷塗納旨’以義於11塗機喷塗散熱件產品者。 9. 如申請專利範圍第1項之散熱配方，其中該樹脂類之塗料係為電著用樹脂’加上水性之稀釋劑，以適用於電著塗料槽電鍍散熱件產品者。201204820 VII. Patent application scope: 1. A kind of heat dissipation formula, which is an aromatic hydrocarbon with benzene as the parent compound, the ear has the functional group, the resin is added, and the thinner is added to the appropriate proportion. It is coated on the surface of the heat sink to help dissipate heat. When the heat sink is dissipated by heat, the double-key material absorbs heat and generates a resonance structure, which allows the heat to dissipate more quickly. After the heat is released, the original double-key method is restored to improve the heat dissipation efficiency. Ά • 2. For the towel, please refer to the heat-dissipating formula of the first item of the patent scope, in which the double-bond raw material, the resin-based coating, and the thinner are added, and the ratio of the heat-dissipating surface is applied to the surface of the heat-dissipating part to help the heat dissipation. In terms of the coating solid content, the double bond raw material is about 5 to 100, that is, the ratio of the double bond raw material to the coating material is 5 to 100:100, and the diluent is water-based, about 1 to 嶋. , that is, the ratio of the diluent to the coating is 100 to 900:100. 3. For the heat-dissipating formula of the patent application, the double-bonding material is • 2-hydroxydibenzophenone. 4. If the heat-dissipating formula of the scope of the patent application is applied, the double-bond raw material is 2-hydroxydibenzoic acid. 5. If the heat-dissipating formula of the patent application is applied, the raw material of the double bond is 2-(2'-hydroxy)benzotriazole. 6. For example, in the heat-dissipating formula of the scope of claim i, wherein the resin-based paint is a roll-coated resin, and the heat-dissipating product is rolled by a suitable roll coater. 7. If you apply for the heat dissipation of the special item, the affair is the 2012-0420 / & 8. For the heat-dissipating formula of the first application of the patent scope, the resin-based coating is the one that sprays the heat sink products. 9. For the heat-dissipating formulation of claim 1, wherein the resin-based coating is an electro-resin resin plus an aqueous diluent for use in an electro-coating tank plating heat sink product.