TW201140041A - Apparatus for inspecting substrate and method using the same - Google Patents
Apparatus for inspecting substrate and method using the same Download PDFInfo
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
- G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
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Description
201140041 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種基板檢查的裝置，且特別是有關 於一種用於一顯示器的基板檢查裝置及其使用的方法。 【先前技術】 一般而言，在製造一種平面顯示器的過程中，如製造 一種液晶顯示器或一種有機發光二極體顯示器的過程 中，檢查基板的步驟是為了確認組成平面顯示器的基板是 否有缺陷或瑕疲（defect)。 在檢查基板的過程中，一種光學感應器是用來偵測附 著於基板上的微粒（particle)或裂痕（crack)。 近來，隨著平面顯示裝置的尺寸逐漸增大，製造過程 中所使用之基板尺寸也變大，致使檢查基板的光學感應器 數量增加。 光學感應器包括一攝影機，用以攝影基板正面，攝影 機的數量隨著基板尺寸的增大而增加。此外，隨著攝影機 數量增加，攝影基板數據增加。因此，成本與分析數據時 間便增加。 以上揭露的資訊僅為了提升對本發明背景知識的了 解，因此其所包含的資訊並不構成具有通常知識者於本國 内已知悉的先前技術。 【發明内容】 本發明致力於提供一種用以檢查基板的裝置與其方 201140041 I w 法其優點在於可用一個或少數個光學感應器來檢查基板 的裂痕。 本發明的一範例性實施例’提出一種檢查基板的裝 置，裝置包括：至少一光學感應器，用以檢查基板之垂直 邊*基板包括一第一水平邊與一第二水平邊，第一水平邊 ^二水平邊平行於基板的運送方向，基板㈣直邊包括 -則垂i邊與-後垂直$，前垂直邊與後垂i邊垂直於基 ^的運送方向；以及一光學感應器移動單元，用以移動光 f感應器；其中’在基板的運送過程中，光學感應器係朝 著與第一水平邊與第二水平邊之延伸線形成一預定角度 的方向上被移動，且光學感應器係沿著前垂直邊與後垂直 邊被來回移動。 光學感應器係沿著前垂直邊在一第一路徑上被來回 移動。 光學感應器係沿著後垂直邊在一第二路徑上被來回 移動，且第一路徑與該第二路徑係相同。 基板檢查裝置更包括：一光學感應器旋轉單元，用以 使光學感應器旋轉預定角度。 光學感應器係沿者後垂直邊在一第三路徑上被來回 移動，且第一路徑與第三路徑彼此不同。 第一路徑與第三路徑線具有與前垂直邊與後垂直邊 相關的線性對稱性（linear symmetry)。 至少一光學感應器的數量為兩個或多數個，且兩個或 夕數個光學感應器係沿著前垂直邊與後垂直邊被來回移 動。 201140041 光學感應器包括一 CCD攝影機或一 CMOS攝影機、 及一光源，光源用來供應光線給CCD攝影機或CMOS攝 影機。 CCD攝影機或CMOS攝影機係配置於基板上方，而 光源係配置於基板下方。 CCD攝影機或CMOS攝影機與光源係配置於基板上 方。 本發明的另一範例性實施例，提出一種檢查基板的方 法，包括：運送一基板，基板包括平行於基板之運送方向 之一第一水平邊與一第二水平邊，基板更包括垂直於基板 之運送方向之一前垂直邊與一後垂直邊；以及於運送基板 時，使用至少一光學感應器來檢查前垂直邊與後垂直邊， 至少一光學感應器係沿著前垂直邊與後垂直邊而被來回 移動；其中光學感應器係朝著與第一水平邊與第二水平邊 之延伸線形成一預定角度的方向上被移動。 檢查基板之垂直邊的步驟包括：於光學感應器沿著前 垂直邊在一第一路徑上被移動時，檢查前垂直邊；容許光 學感應器朝第一路徑的一相反方向移動；以及於光學感應 器沿著後垂直邊在一第二路徑上移動時，檢查後垂直邊； 其中第一路徑與第二路徑係相同。 於檢查前垂直邊與後垂直邊的預定區域的步驟後，光 學感應器係被移動以檢查下一預定區域。 檢查基板之垂直邊的步驟包括：於光學感應器沿著前 垂直邊在一第一路徑上被移動時，檢查前垂直邊；使用光 學感應器旋轉單元使光學感應器旋轉預定角度；及當光學 201140041201140041 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate inspection apparatus, and more particularly to a substrate inspection apparatus for a display and a method of using the same. [Prior Art] In general, in the process of manufacturing a flat panel display, such as in the process of manufacturing a liquid crystal display or an organic light emitting diode display, the step of inspecting the substrate is to confirm whether the substrate constituting the flat display is defective or Defect. In the process of inspecting a substrate, an optical sensor is used to detect particles or cracks attached to the substrate. Recently, as the size of a flat display device has gradually increased, the size of a substrate used in a manufacturing process has also become large, resulting in an increase in the number of optical sensors for inspecting a substrate. The optical sensor includes a camera for photographing the front side of the substrate, and the number of cameras increases as the size of the substrate increases. In addition, as the number of cameras increases, photographic substrate data increases. As a result, costs and time for analyzing data increase. The information disclosed above is only for enhancement of the background of the present invention, and therefore the information contained therein does not constitute a prior art that is known to those of ordinary skill in the country. SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a device for inspecting a substrate. The advantage of the method is that one or a few optical sensors can be used to inspect cracks in the substrate. An exemplary embodiment of the present invention provides an apparatus for inspecting a substrate, the apparatus comprising: at least one optical sensor for inspecting a vertical side of the substrate. The substrate includes a first horizontal edge and a second horizontal edge, the first level The horizontal edge of the substrate is parallel to the transport direction of the substrate, and the straight edge of the substrate (4) includes - then the vertical side and the back vertical $, the front vertical side and the rear vertical side are perpendicular to the transport direction of the base; and an optical sensor moves a unit for moving the light f sensor; wherein during the transport of the substrate, the optical sensor is moved in a direction forming a predetermined angle with an extension line of the first horizontal edge and the second horizontal edge, and the optical The sensor is moved back and forth along the front vertical edge and the rear vertical edge. The optical sensor is moved back and forth along a first vertical path along the front vertical edge. The optical sensor is moved back and forth along a second vertical path along the rear vertical edge, and the first path is the same as the second path. The substrate inspection apparatus further includes an optical sensor rotation unit for rotating the optical sensor by a predetermined angle. The optical sensor is moved back and forth along a rear vertical edge on a third path, and the first path and the third path are different from each other. The first path and the third path line have linear symmetry associated with the front vertical edge and the rear vertical edge. The number of at least one optical sensor is two or more, and two or a plurality of optical sensors are moved back and forth along the front vertical edge and the rear vertical edge. The 201140041 optical sensor consists of a CCD camera or a CMOS camera, and a light source that supplies light to a CCD camera or CMOS camera. A CCD camera or a CMOS camera is disposed above the substrate, and the light source is disposed below the substrate. A CCD camera or a CMOS camera and a light source are disposed above the substrate. In another exemplary embodiment of the present invention, a method for inspecting a substrate is provided, comprising: transporting a substrate, the substrate comprising a first horizontal side and a second horizontal side parallel to a transport direction of the substrate, the substrate further comprising a substrate perpendicular to the substrate One of the transport direction is a front vertical edge and a rear vertical edge; and when transporting the substrate, at least one optical sensor is used to inspect the front vertical edge and the rear vertical edge, and at least one optical sensor is vertically along the front vertical edge and the rear vertical edge Moving side by side; wherein the optical sensor is moved in a direction that forms a predetermined angle with an extension line of the first horizontal edge and the second horizontal edge. The step of inspecting the vertical sides of the substrate includes: checking the front vertical edge when the optical sensor is moved along a front vertical edge on a first path; allowing the optical sensor to move in an opposite direction of the first path; When the sensor moves along a rear vertical edge on a second path, the rear vertical edge is examined; wherein the first path is the same as the second path. After the step of inspecting the predetermined areas of the front vertical side and the rear vertical side, the optical sensor is moved to check the next predetermined area. The step of inspecting the vertical side of the substrate includes: checking the front vertical edge when the optical sensor is moved along the front vertical edge on a first path; rotating the optical sensor to rotate the predetermined angle using the optical sensor; and when optical 201140041
1 W /302KA 感應器係沿著後垂直邊在一第三路徑上被來回移動時，檢 查後垂直邊。 至少一光學感應器的數量為兩個或多數個。 檢查基板之垂直邊的步驟包括：於兩個或多數個光學 感應器係沿著前垂直邊的每個區域被來回移動時，割分前 垂直邊為兩個或多數個區域，並檢查前垂直邊的每個區 域；以及於兩個或多數個光學感應器係沿著後垂直邊的每 個區域被來回移動時，劃分後垂直邊為兩個或多數個區 域’並檢查後垂直邊的每個區域。 、檢查完每個垂直邊之預定區域後，兩個或多數個光學 感應移動以檢查下·—預定區域。 本發明的另一範例性實施例，提出一種檢查基板的裝 置，包括.至少一光學感應器，用以檢查基板之多數個邊， 基板的多數個邊包括一第一水平邊與一第二水平邊，第一 水平邊與第二水平邊平行於基板的運送方向，基板的多數 個邊另包括一前垂直邊與一後垂直邊，前垂直邊與後垂直 邊垂直於基板的運送方向；以及一光學感應器移動單元， ^以移動光學感應器；其中光學感應器包括一前光學感應 器及與刚光學感應器分離的一後光學感應器，光學感應器 移動單元包括一前光學感應器移動單元及一後光學感應 器移動單元，前光學錢器移動單用以移動前光學感應 器，後光學感應器移動單元用以移動後光學感應器，在基 板的運送過程十，前光學感應器與後光學感應器的每一者 的移動方向與第一水平邊與第二水平邊之延伸線形成一 預定角度，前光學感應器係沿著前垂直邊被來回移動，而 201140041 後光學感應器係沿著後垂直邊被來回移動，及後光學感應 器檢查第一水平邊及後垂直邊，而前光學感應器檢查第二 水平邊及前垂直邊。 月J光干感應器包括一則CCD攝影機或一前CMOS攝 影機，以及供應光線給前CCD攝影機或前CM〇s攝影機 的一刖光源，後光學感應器包括一後CCD攝影機或一後 CMOS攝影機’以及供應光線給後CCD攝影機或後CM〇s 攝影機的一後光源。 月’j CCD攝影機或前CMOS攝影機與後CCD攝影機或 後CMOS冑影機係配置於基板上方，而前光源與後光源係 配置於基板下方。 前CCD攝影機或前CM0S攝影機、後CCD攝影機或 後CMOS攝影機、前光源、與後光源係配置於基板上方。 則光學感應器由前垂直邊與後垂直邊之間的間隔而 與後感應器分離。 本發明的再一範例性實施例，提出一種檢查基板的方 法，包括：運送一基板，基板包括平行於基板之運送方向 之一第一水平邊與一第二水平邊，基板更包括垂直於基板 之運送方向之一前垂直邊與一後垂直邊；以及於運送基板 時，藉由在與第一水平邊之延伸線形成一預定角度的方向 上，使用後光學感應器檢查第一水平邊與後垂直邊，後光 學感應器沿著後垂直邊被來回移動；以及於運送基板時， 藉由在與第二水平邊之延伸線形成一預定角度的方向 上’使用剛光學感應|§檢查第二水平邊與前垂直邊，前光 學感應器沿著前垂直邊被來回移動。 201140041When the 1 W / 302KA sensor is moved back and forth along a rear vertical edge on a third path, the rear vertical edge is checked. The number of at least one optical sensor is two or more. The step of inspecting the vertical sides of the substrate includes: when two or more optical sensor systems are moved back and forth along each of the front vertical sides, the vertical edges before splitting are two or more regions, and the front vertical is checked. Each region of the edge; and when each of the two or more optical sensor systems is moved back and forth along each of the rear vertical edges, the divided vertical edges are two or more regions' and each of the rear vertical edges is examined Areas. After checking the predetermined area of each vertical side, two or more optical sensing moves to check the next predetermined area. In another exemplary embodiment of the present invention, an apparatus for inspecting a substrate is provided, including: at least one optical sensor for inspecting a plurality of sides of the substrate, the plurality of sides of the substrate including a first horizontal edge and a second horizontal The first horizontal side and the second horizontal side are parallel to the transport direction of the substrate, and the plurality of sides of the substrate further comprise a front vertical side and a rear vertical side, and the front vertical side and the rear vertical side are perpendicular to the transport direction of the substrate; An optical sensor moving unit, for moving the optical sensor; wherein the optical sensor comprises a front optical sensor and a rear optical sensor separated from the rigid optical sensor, the optical sensor moving unit comprises a front optical sensor moving Unit and a rear optical sensor moving unit, the front optical money moving single is used to move the front optical sensor, the rear optical sensor moving unit is used to move the rear optical sensor, in the substrate transport process ten, the front optical sensor and The moving direction of each of the rear optical sensors forms a predetermined angle with the extension line of the first horizontal edge and the second horizontal edge, and the front optical sensing The system moves back and forth along the front vertical edge, and the 201140041 rear optical sensor is moved back and forth along the rear vertical edge, and the rear optical sensor checks the first horizontal edge and the rear vertical edge, while the front optical sensor checks the second level. Edge and front vertical edge. The J-ray dry sensor includes a CCD camera or a front CMOS camera, and a light source that supplies light to the front CCD camera or the front CM 〇 camera. The rear optical sensor includes a rear CCD camera or a rear CMOS camera'. Supply light to a rear light source of the rear CCD camera or the rear CM〇s camera. The month 'j CCD camera or the front CMOS camera and the rear CCD camera or the rear CMOS camera are disposed above the substrate, and the front and rear light sources are disposed below the substrate. The front CCD camera or the front CMOS camera, the rear CCD camera or the rear CMOS camera, the front light source, and the rear light source are disposed above the substrate. The optical sensor is separated from the rear inductor by the spacing between the front vertical edge and the rear vertical edge. In still another exemplary embodiment of the present invention, a method for inspecting a substrate includes: transporting a substrate including a first horizontal side and a second horizontal side parallel to a transport direction of the substrate, the substrate further including a substrate a front vertical edge and a rear vertical edge of the transport direction; and when the substrate is transported, the first horizontal edge is checked using the rear optical sensor by forming a predetermined angle with the extension line of the first horizontal edge a rear vertical edge, the rear optical sensor is moved back and forth along the rear vertical edge; and when the substrate is transported, by using a rigid optical induction in the direction of forming a predetermined angle with the extension line of the second horizontal edge| The two horizontal edges and the front vertical edge, the front optical sensor is moved back and forth along the front vertical edge. 201140041
1 W /^OZKA 在檢查第二水平邊與前垂直邊的步驟中，於前光學感 應器係沿著前垂直邊被來回移動時，檢查運送中之基板之 前垂直邊；於前光學感應器檢查前垂直邊後，前光學感應 器被固定，並檢查運送中之基板之第二水平邊。 在檢查該第一水平邊與該後垂直邊的步驟中，於後光 學感應器被固定時，後光學感應器檢查運送中之基板之第 一水平邊；後光學感應器檢查第一水平邊後，後光學感應 器係沿著後垂直邊被來回移動，並檢查該運送中之基板之 後垂直邊。 檢查前垂直邊與檢查後垂直邊同時進行。 為了對本發明之上述及其他方面有更佳的暸解，下文 特舉範例性實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 以下將參照圖式及繪示其中之範例性實施例，更詳細 地說明本發明。具有通常知識者應知，所述之範例性實施 例可以許多不同方式進行改良，而不脫離本發明之精神與 範圍。 在圖式中，層、膜、平板、區域等之厚度，係為了使 圖式清楚而誇張化。整份說明書中，類似的標號係標示於 類似的元件上。當像是層、膜、區域或基板的一元件被稱 為“位在另一元件上”，它可被理解為直接位於另一元件 之上、或位於另一介於其間元件的之上。相對地，當一元 件被稱為“直接位於另一元件上”，則不包含另一介於其 間的元件情況。 201140041 第一範例性實施你[ 第1圖繪示本發明之第一範例性實施例之檢查基板的 裝置與方法。 如第1圖所示，依據本發明之第一範例性實施例的檢 查基板100裝置包括一光學感應器500及一光學感應器移 動單元（未緣出）。光學感應器500用以檢查基板1〇〇之 一前垂直邊110與一後垂直邊120。基板100包括平行於 基板100的運送方向的一第一水平邊130與一第二水平邊 140、及垂直於該基板100的運送方向的前垂直邊110與 後垂直邊120。光學感應器移動單元用以移動光學感應器 500。 基板100由一運送裝置運送。運送裝置包括構成侧邊 的多個邊框架200、與設置於邊框架200之間並且用來運 送基板100之多數個運送框架210。每一個運送框架210 包括夕數個滾輪220(如第1圖所示，每一個運送框架21〇 有二個滚輪220) ’滾輪220用來支撐基板1〇〇 ,滾輪220 可由塑膠及均等物所組成。運送框架210的數量與滾輪220 的數量與間隔可依據運送裝置與運送基板100的尺寸而有 不同的實施例。 檢查基板100的裝置所包含的光學感應器5〇〇可用以 债測附著於基板1〇〇上的微粒或裂痕。光學感應器5〇〇包 括電荷麵合裝置（charge-coupled device, CCD)攝影機 300及一光源4〇〇。CCD攝影機3〇〇用以攝影基板1〇〇表 面。光源400提供CCD攝影機300於攝影表面時所需之 2011400411 W /^OZKA In the step of checking the second horizontal edge and the front vertical edge, when the front optical sensor is moved back and forth along the front vertical edge, the vertical edge of the substrate in transit is checked; the front optical sensor is inspected After the front vertical edge, the front optical sensor is fixed and the second horizontal edge of the substrate being transported is inspected. In the step of inspecting the first horizontal edge and the rear vertical edge, when the rear optical sensor is fixed, the rear optical sensor checks the first horizontal edge of the substrate being transported; after the rear optical sensor checks the first horizontal edge The rear optical sensor is moved back and forth along the rear vertical edge and the vertical side of the substrate after the transport is inspected. Check the vertical edge before the inspection and the vertical edge after inspection. In order to better understand the above and other aspects of the present invention, the following detailed description of the exemplary embodiments, together with the accompanying drawings, The invention will be described in more detail by way of examples. It will be apparent to those skilled in the art that the described exemplary embodiments may be modified in many different ways without departing from the spirit and scope of the invention. In the drawings, the thicknesses of layers, films, plates, regions, etc. are exaggerated for clarity. Throughout the specification, like numerals are indicated on like elements. When an element such as a layer, film, region or substrate is referred to as "positioned on another element," it can be understood to be either directly over the other element or the other element. In contrast, when an element is referred to as being "directly on" another element, it does not. 201140041 First Exemplary Implementation [First Embodiment] FIG. 1 is a diagram showing an apparatus and method for inspecting a substrate according to a first exemplary embodiment of the present invention. As shown in Fig. 1, the apparatus for inspecting a substrate 100 according to the first exemplary embodiment of the present invention includes an optical sensor 500 and an optical sensor moving unit (not shown). The optical sensor 500 is used to inspect a front vertical side 110 and a rear vertical side 120 of the substrate 1''. The substrate 100 includes a first horizontal side 130 and a second horizontal side 140 parallel to the transport direction of the substrate 100, and a front vertical side 110 and a rear vertical side 120 perpendicular to the transport direction of the substrate 100. The optical sensor moving unit is used to move the optical sensor 500. The substrate 100 is transported by a transport device. The transport device includes a plurality of side frames 200 constituting the side edges, and a plurality of transport frames 210 disposed between the side frames 200 and for transporting the substrate 100. Each of the transport frames 210 includes a plurality of rollers 220 (as shown in FIG. 1 , each of the transport frames 21 has two rollers 220). The rollers 220 are used to support the substrate 1 , and the rollers 220 can be made of plastic and equal objects. composition. The number of transport frames 210 and the number and spacing of the rollers 220 may vary depending on the size of the transport device and transport substrate 100. The optical sensor 5 included in the apparatus for inspecting the substrate 100 can be used to measure particles or cracks attached to the substrate 1 . The optical sensor 5 includes a charge-coupled device (CCD) camera 300 and a light source 4A. The CCD camera 3 is used to photograph the surface of the substrate. The light source 400 provides the CCD camera 300 required for the photographic surface 201140041
1 W/J02PA 光線。本發明此處之範例性實施例係以使用CCD攝影機 為例做說明，但亦可使用一互補式金氧半導體 (complementary metal oxide semiconductor，CMOS)攝影機。 如第1圖所示，在此實施例中，CCD攝影機300係配 置於運送裝置上方，而光源400係配置於邊框架200的下 側。也就是說，自光源400射出的光線係被調校以穿越基 板100而進入CCD攝影機300。CCD攝影機300連接至 一台控制器600。控制器600經由一條連接線610連接至 CCD攝影機300，用以分析基板1〇〇上的汙染物或裂痕。 光學感應裔移動早元的構成包含·一第·一上支樓框架 350與一第一下支撐框架45〇。cCd攝影機300是被附加 式地連接(attached to)於第一上支撐框架35〇，以沿著第— 上支撐框架350被來回移動。光源4〇〇被連接於第一下支 撐框架450，以沿著該第一下支撐框架45〇被來回移動。 一第一垂直框架360連接於第一上支撐框架35〇的兩端， 而一第二垂直框架460連接於第一下支撐框架45〇的兩 ^第垂直框架360與第二垂直框架460的每一者被固 疋於邊框架200,而第一垂直框架36〇與第二垂直框架46〇 刀別支撐第一上支撐框架350與第一下支撐框架450。第 上支撐框架350與第一下支撐框架45〇被安置而傾斜於 相對基板100運送方向的一預定角度。 基板100係由運送框架21〇上的滚輪220運送。CCD 攝衫機300與光源400係沿著基板ι〇〇之前垂直邊u〇， 於相對基板100運送方向之—對角線方向上，在第一路徑 上破來回移動，以從一端至另一端檢查運送中的基板1〇〇 201140041 之前垂直邊110。 於此例中，因為CCD攝影機300與光源400之移動 速度可隨基板100的運送速度作調整、或對角線方向的角 度可調整為一預定角度，故CCD攝影機300與光源400 便可由一端至另一端檢查基板1〇〇的前垂直邊110。再者， 基板100的運送速度可調整，故CCD攝影機300與光源 400能由一端至另一端檢查基板100的前垂直邊11〇。 此外，當基板100之前垂直邊110檢查完成時，CCD 攝影機300與光源400循第一路徑之相反方向移動回到原 點。之後，當基板1〇〇之後垂直邊12〇進入時，CCD攝影 機300與光源400係沿著基板100之後垂直邊120在一第 一路彳至上來回移動’以同於檢查前垂直邊110的速度與時 間’由一端至另一端檢查基板1〇〇之後垂直邊12〇。於此， 該第一路禋與該第二路徑係相同的。 再者’也可使用擁有大視角（field of view，FOV)之一 種區域掃插攝影機，來重複攝影一預定區域，以檢查基板。 也就是說，朝相對於基板1〇〇之運送方向之對角線方 =攝影機300與光源4〇〇係沿著基板丨〇〇之前垂直 〇與後垂直邊12〇被來回移動、攝影預定區域、然後 並重複攝影該預定區域，故能由一端至另一端檢查基 板100之前垂直邊110與後垂直邊120。 第一範例性實施例 2、3圖繪示本發明之第二範例性實施例之檢查基 板的展Μ料。 一 2011400411 W/J02PA light. The exemplary embodiments of the present invention are described using a CCD camera as an example, but a complementary metal oxide semiconductor (CMOS) camera can also be used. As shown in Fig. 1, in this embodiment, the CCD camera 300 is disposed above the transport device, and the light source 400 is disposed on the lower side of the side frame 200. That is, the light emitted from the light source 400 is calibrated to pass through the substrate 100 into the CCD camera 300. The CCD camera 300 is connected to a controller 600. The controller 600 is connected to the CCD camera 300 via a connection line 610 for analyzing contaminants or cracks on the substrate 1 . The optically sensitive mobile early element consists of a first upper support frame 350 and a first lower support frame 45〇. The cCd camera 300 is attached to the first upper support frame 35A to be moved back and forth along the first upper support frame 350. The light source 4 is coupled to the first lower support frame 450 to be moved back and forth along the first lower support frame 45. A first vertical frame 360 is coupled to both ends of the first upper support frame 35〇, and a second vertical frame 460 is coupled to each of the two vertical frames 360 and the second vertical frame 460 of the first lower support frame 45〇. One is fixed to the side frame 200, and the first vertical frame 36A and the second vertical frame 46 do not support the first upper support frame 350 and the first lower support frame 450. The first upper support frame 350 and the first lower support frame 45 are disposed to be inclined at a predetermined angle with respect to the conveying direction of the substrate 100. The substrate 100 is transported by rollers 220 on the transport frame 21〇. The CCD camera 300 and the light source 400 are moved along the vertical side u〇 of the substrate ι in the diagonal direction of the opposite substrate 100 in the diagonal direction, and are moved back and forth on the first path to extend from one end to the other end. Check the vertical edge 110 before the substrate 1〇〇201140041 in transit. In this example, since the moving speed of the CCD camera 300 and the light source 400 can be adjusted according to the conveying speed of the substrate 100, or the angle of the diagonal direction can be adjusted to a predetermined angle, the CCD camera 300 and the light source 400 can be from one end to The other end checks the front vertical side 110 of the substrate 1〇〇. Furthermore, since the transport speed of the substrate 100 can be adjusted, the CCD camera 300 and the light source 400 can inspect the front vertical side 11 of the substrate 100 from one end to the other end. Further, when the inspection of the vertical side 110 of the substrate 100 is completed, the CCD camera 300 and the light source 400 are moved back to the origin in the opposite direction of the first path. Thereafter, when the vertical side 12〇 enters the substrate 1〇〇, the CCD camera 300 and the light source 400 are moved back and forth along the vertical edge 120 of the substrate 100 along the first pass to the same speed as the front vertical edge 110. And the time 'from the one end to the other end of the substrate 1 〇〇 after the vertical side 12 〇. Here, the first path is the same as the second path. Furthermore, it is also possible to use a zone-sweeping camera having a field of view (FOV) to repeatedly photograph a predetermined area to inspect the substrate. That is to say, the diagonal direction of the transport direction with respect to the substrate 1 = the camera 300 and the light source 4 are moved back and forth along the vertical 〇 and the rear vertical side 12 丨〇〇 of the substrate 、, and the predetermined area is photographed. Then, the predetermined area is repeatedly photographed, so that the vertical side 110 and the rear vertical side 120 of the substrate 100 can be inspected from one end to the other end. The first exemplary embodiment 2, 3 is a view showing the inspection substrate of the second exemplary embodiment of the present invention. One 201140041
i W/JOZKA 如第2、3圖所系，相較於本發明第一範例性實施例 之檢查基板100裝置，依據本發明第二範例性實施例之檢 查基板100裳置在構造上有所不同β本發明第二範例性貫 施例之不同之處在於，一第一上支撐框架350與一第一下 支樓框架450被固定於一轉盤700，藉以旋轉該第一上支 撐框架350與該第一下支樓框架450而使其朝向一對角線 方向。其餘構造可視為相同。 根據第二範例性實施例檢查基板1 〇〇裝置之一光學感 應器移動單元的構成包含一第一上支撐框架35〇與一第一 下支撐框架450。CCD攝影機300被附加式地連接於該第 一上支撐框架350 ’並沿著該第一上支撐框架350被來回 移動。光源400被附加式地連接於該第一下支樓框架450， 並沿著該第一下支撐框架45〇被來回移動。一第三垂直框 架370連接於第一上支撐框架35〇兩端與第一下支撐框架 450兩端。 固定第一上支撐框架350與第一下支撐框架450的旋 轉盤700係配置於一傳送框架21〇下方。第三垂直框架370 被固定於旋轉盤7〇〇以至於第一上支撐框架350與第一下 支撐框架450被安置而傾斜於相對基板1〇〇運送方向的一 預定角度。 於運送基板100時，CCD攝影機300與光源400係沿 著基板100之一前垂直邊u〇在第一路徑上，分別由第一 上支撐框架350與第一下支撐框架450 —端至另一端被來 回移動’檢查運送中的基板1〇〇之前垂直邊110。 於此例中，因為CCD攝影機300與光源400之移動 13 201140041 速度隨基板100運送速度作調整，或對角線方向的角度調 整為一預定角度’ CCD攝影機300與光源400便可由一端 至另一端檢查基板100的前垂直邊110。再者，基板1〇〇 速度可調整’使CCD攝影機300與光源400能由一端至 另一端檢查基板100的前垂直邊110。 完成基板100之前垂直邊110之檢查後，藉由移動旋 轉盤700使第一上支樓框架350與第一下支樓框架450自 原位置旋轉一預定角度。同樣地，旋轉角度必須為一可檢 查基板100之後垂直邊120的角度。也就是說，於此例中， 基板100的速度是恆定的’第一上支撐框架35〇與第一下 支撐框架450在旋轉前後係具有與基板1〇〇之前垂直邊 11 〇及後垂直邊120相關的線性對稱性(linear symmeti>y}。 之後’ CCD攝影機300與光源4〇〇沿著基板丨〇〇之後 垂直邊120在一第三路徑上來回移動，分別於第一上支撐 框架350與第一下支撐框架450上從另一端至一端檢查基 板100之後垂直邊。 一土 再者，也可使用擁有大視角之一種區域掃描攝影機， 來重複攝影一預定區域，以檢查基板10〇。 第三範例性實施例 第4圖繪示依照本發明之第三範例性實施例之檢查基 板的裝置與方法。 —1 如第4圖所示，相較於本發明第一範例性實施例之檢 查基板100裝置’依據本發明第三範例性實施例之檢查基 板1〇〇裝置在構造上有所不同。於第三範例性實施例中， 201140041 1 w i〇O^.r/\ 一光源400係配置於一邊框架2〇〇上方，且並不包括一下 支撐框架與一第二垂直框架，其餘構造係與本發明第一範 例性實施例相同。 依據本發明第三範例性實施例檢查基板100裝置之一 光學感應器500包括一電荷輕合裝置（charge-coupled device, CCD)攝影機300 ’用以攝影基板1〇〇表面。光學感 應器500還包括一光源4〇〇,用以提供CCD攝影機300於 攝影表面時所需之光線。於此，本發明範例性實施例使用 CCD攝影機’但亦可使用一互補式金氧半導體 (complementary metal oxide semiconductor, CMOS)攝影機。 CCD攝影機300與光源400係配置於該運送裝置上 方。光線自光源400射出，於基板1〇〇前垂直邊ho或後 垂直邊120反射後進入CCD攝影機300。CCD攝影機3〇〇 連接至一台控制器600’該控制器600藉由一條連接線61〇 連接至CCD攝影機300’用以分析基板1〇〇上的汙染物或 裂痕。 一光學感應器移動單元（未繪出）的構成包括一第— 上支樓框‘ 350。CCD攝影機300被附加式地連接於該第 一上支撐框架350，並沿著該第一上支撐框架35〇被來回 移動。光源400透過一光源支架440連接至CCD攝影機 300。因此，於CCD攝影機300移動時，光源4〇〇會同時 移動。 一第四垂直框架380連接於第一上支撐框架35〇的兩 端。第四垂直框架380被固定於邊框架2〇〇且支樓第一 支撐框架350。第一上支撐框架350被安置而傾斜於相對 15 201140041 基板100運送方向的一預定角度。 第四範例性實施例 第5圖繪示依照本發明之第四範例性實施例之檢查基 板的裝置與方法。 如第5圖所示，於第四範例性實施例中，不同於上述 該些範例性實施例之處在於，依據本發明第四範例性實施 例之檢查基板裝置可應用於大尺寸的基板100。 如第5圖所示，依據本發明之第四範例性實施例的檢 查基板100裝置包括：一第一光學感應器510，一第二光 學感應器520，及一第三光學感應器530，用以檢查基板 100之一前垂直邊110與一後垂直邊120。基板1〇〇包括 一第一水平邊130與一第二水平邊HO，其等係平行於該 基板100的運送方向；基板100還包括前垂直邊110與後 垂直邊120 ’其等係垂直於該基板1〇〇的運送方向。檢查 基板100裝置還包括一光學感應器移動單元（未繪出）， 用以移動第一光學感應器510、第二光學感應器52〇與第 三光學感應器530。 基板100由一運送裝置運送。該運送裝置包括邊框架 200。該邊框架200的構成包含侧邊與排列於邊框架2〇〇 之多數個運送框架210,該邊框架200用以運送基板1〇〇。 母一個運送框架210包括多數個滾輪220。該滾輪220由 j膠及均專物組成，用以支樓基板1〇〇。運送框架21〇的 數量與滾輪220的數量與間隔，可依據運送裝置與運送基 板100的尺寸而有不同的實施例。 201140041i W/JOZKA is as shown in FIGS. 2 and 3, and the inspection substrate 100 according to the second exemplary embodiment of the present invention is arranged in construction compared to the inspection substrate 100 device of the first exemplary embodiment of the present invention. Different β is different from the second exemplary embodiment of the present invention in that a first upper support frame 350 and a first lower floor frame 450 are fixed to a turntable 700, thereby rotating the first upper support frame 350 and The first lower floor frame 450 is oriented in a diagonal direction. The rest of the construction can be considered the same. The optical sensor moving unit of one of the substrates 1 is inspected according to the second exemplary embodiment. The optical sensor moving unit comprises a first upper supporting frame 35 and a first lower supporting frame 450. The CCD camera 300 is additionally coupled to the first upper support frame 350' and moved back and forth along the first upper support frame 350. The light source 400 is additionally coupled to the first lower deck frame 450 and moved back and forth along the first lower support frame 45〇. A third vertical frame 370 is coupled to both ends of the first upper support frame 35 and the first lower support frame 450. The rotary table 700 that fixes the first upper support frame 350 and the first lower support frame 450 is disposed below a transfer frame 21A. The third vertical frame 370 is fixed to the rotary disk 7 so that the first upper support frame 350 and the first lower support frame 450 are disposed to be inclined at a predetermined angle with respect to the transport direction of the opposite substrate 1. When the substrate 100 is transported, the CCD camera 300 and the light source 400 are disposed on the first path along one of the front vertical sides of the substrate 100, respectively, from the first upper support frame 350 to the first lower support frame 450 to the other end. Moved back and forth 'check the vertical edge 110 before the substrate 1 in transit. In this example, because the movement of the CCD camera 300 and the light source 400 13 201140041 speed is adjusted with the transport speed of the substrate 100, or the angle of the diagonal direction is adjusted to a predetermined angle ′, the CCD camera 300 and the light source 400 can be from one end to the other end. The front vertical side 110 of the substrate 100 is inspected. Further, the substrate 1 速度 speed can be adjusted 'to enable the CCD camera 300 and the light source 400 to inspect the front vertical side 110 of the substrate 100 from one end to the other end. After the inspection of the vertical side 110 of the substrate 100 is completed, the first upper branch frame 350 and the first lower floor frame 450 are rotated by a predetermined angle from the original position by moving the rotary table 700. Similarly, the angle of rotation must be an angle at which the vertical edge 120 after the substrate 100 can be inspected. That is, in this example, the speed of the substrate 100 is constant. 'The first upper support frame 35' and the first lower support frame 450 have a vertical edge 11 〇 and a rear vertical edge before and after the substrate 1 旋转 before and after the rotation. 120 related linear symmetry (linear symmeti> y}. After the CCD camera 300 and the light source 4 〇〇 move along the substrate 丨〇〇 after the vertical side 120 on a third path, respectively, on the first upper support frame 350 A vertical side after the substrate 100 is inspected from the other end to the one end of the first lower support frame 450. Alternatively, an area scanning camera having a large viewing angle may be used to repeatedly photograph a predetermined area to inspect the substrate 10A. Third Exemplary Embodiment FIG. 4 is a view showing an apparatus and method for inspecting a substrate according to a third exemplary embodiment of the present invention. 1 as shown in FIG. 4, compared with the first exemplary embodiment of the present invention. The inspection substrate 100 device 'the inspection substrate 1 according to the third exemplary embodiment of the present invention is different in construction. In the third exemplary embodiment, 201140041 1 wi〇O^.r/\ a light source 400 system It is placed above one frame 2〇〇, and does not include the lower support frame and a second vertical frame, and the rest of the structure is the same as the first exemplary embodiment of the present invention. The device for inspecting the substrate 100 according to the third exemplary embodiment of the present invention One of the optical sensors 500 includes a charge-coupled device (CCD) camera 300' for photographing the surface of the substrate 1. The optical sensor 500 further includes a light source 4 for providing the CCD camera 300. The light required for the photographic surface. Here, the exemplary embodiment of the present invention uses a CCD camera 'but a complementary metal oxide semiconductor (CMOS) camera can also be used. The CCD camera 300 and the light source 400 are configured. Above the transport device, light is emitted from the light source 400, reflected on the front vertical edge ho or the rear vertical side 120 of the substrate 1 and enters the CCD camera 300. The CCD camera 3 is connected to a controller 600'. Connected to the CCD camera 300' by a connecting line 61' for analyzing contaminants or cracks on the substrate 1's. The composition (not shown) includes a first upper frame '350. The CCD camera 300 is additionally coupled to the first upper support frame 350 and moved back and forth along the first upper support frame 35. The 400 is connected to the CCD camera 300 through a light source holder 440. Therefore, the light source 4 同时 moves simultaneously when the CCD camera 300 moves. A fourth vertical frame 380 is coupled to both ends of the first upper support frame 35A. The fourth vertical frame 380 is fixed to the side frame 2 and the first support frame 350 of the branch. The first upper support frame 350 is disposed to be inclined at a predetermined angle with respect to the direction in which the substrate 100 is transported. Fourth Exemplary Embodiment FIG. 5 is a view showing an apparatus and method for inspecting a substrate in accordance with a fourth exemplary embodiment of the present invention. As shown in FIG. 5, in the fourth exemplary embodiment, the exemplary embodiments are different from the above-described exemplary embodiments in that the inspection substrate device according to the fourth exemplary embodiment of the present invention can be applied to the substrate 100 of a large size. . As shown in FIG. 5, the apparatus for inspecting a substrate 100 according to the fourth exemplary embodiment of the present invention includes: a first optical sensor 510, a second optical sensor 520, and a third optical sensor 530. A front vertical side 110 and a rear vertical side 120 of the substrate 100 are inspected. The substrate 1A includes a first horizontal side 130 and a second horizontal side HO, which are parallel to the transport direction of the substrate 100. The substrate 100 further includes a front vertical side 110 and a rear vertical side 120'. The transport direction of the substrate 1〇〇. The inspection substrate 100 apparatus further includes an optical sensor moving unit (not shown) for moving the first optical sensor 510, the second optical sensor 52A, and the third optical sensor 530. The substrate 100 is transported by a transport device. The transport device includes a side frame 200. The side frame 200 is constructed to include a side edge and a plurality of transport frames 210 arranged in the side frame 2'', and the side frame 200 is for transporting the substrate 1''. The parent one transport frame 210 includes a plurality of rollers 220. The roller 220 is composed of j glue and uniform materials, and is used for supporting the base plate. The number of transport frames 21A and the number and spacing of the rollers 220 may vary depending on the size of the transport device and the transport substrate 100. 201140041
1 W 檢查基板100的裝置包括第一光學感應器510、第二 光學感應器520及第三光學感應器530。檢查基板100的 裝置用以偵測附著於基板100上的微粒或裂痕。第一光學 感應器510、第二光學感應器520與第三光學感應器530 包括第一、第二與第三電荷輕合裝置（charge-coupled device，CCD)攝影機310、320與330，用以攝影基板1〇〇 表面，以及第一、第二與第三光源410、420與430，用以 分別提供CCD攝影機310、320與330於攝影表面時所需 之光線。於此，本發明範例性實施例使用CCD攝影機， 但亦可使用一互補式金氧半導體（complementary metal oxide semiconductor, CMOS)攝影機。 如第5圖所示’在實施例中第一、第二與第三ccd 攝影機310、320與330係配置於該運送裝置上方，而第 第一與第二光源410、420與430係配置於邊框架2〇〇 下方。也就是說，光線自第一、第二與第三光源41〇、42〇 與430射出穿越基板1〇〇而分別進入第一、第二與第三 CCD攝衫機31 〇、320與330。第一、第二與第三CCD攝 影機310、320與330連接至一台控制器6〇〇，該控制器 600刀別藉由連接線620、630與640連接至第一、第二盘 第三CCD攝影機310、320與330 ’用以分析基板1〇〇上 的汙染物或裂痕。 一光學感應器移動單元的構成包括一第一上移動框 架351，一第二上移動框架352、與一第三上移動框架353, 以及一第一下移動框架451、一第二下移動框架452、一 第三下移動框架453。 17 201140041 第一、第二與第三CCD攝影機310、320與330分別 被附加式地連接於第一、第二與第三上移動框架351、352 與353，並沿著第一、第二與第三上移動框架35卜352與 353被來回移動。第一、第二與第三光源410、420與430 分別被附加式地連接於該第一、第二與第三下移動框架 451、452與453，並沿著該第一、第二與第三下移動框架 451、452與453被來回移動。 一第二上支撐框架395與一第三上支撐框架396連接 第一、第二與第三上移動框架351、352與353的每一者 的兩端；一第二下支撐框架495與一第三下支撐框架496 連接第一、第二與第三下移動框架451、452與453的每 一者的兩端。 一第五垂直框架390連接於第二支撐框架395兩端， 以及一第六垂直框架391連接於第三上支撐框架396兩 端。一第七垂直框架490連接於第二下支撐框架495兩 端，以及一第八垂直框架491連接於第三下支撐框架496 兩端 第五垂直框架390與第六垂直框架391被固定於邊框 架200，分別支撐第二與第三上支撐框架395與396，以 及第七垂直框架490與第八垂直框架491被固定於邊框架 200，分別支撐第二與第三下支撐框架495與496。 第二與第三上支撐框架395與396以及第二與第三下 支撐框架495與496係安置垂直於基板100之傳送方向； 第一、第二與第三上移動框架351、352與353以及第一、 第二與第三下移動框架451、452與453係被安置而傾斜 201140041The device for inspecting the substrate 100 includes a first optical sensor 510, a second optical sensor 520, and a third optical sensor 530. The device for inspecting the substrate 100 is for detecting particles or cracks attached to the substrate 100. The first optical sensor 510, the second optical sensor 520, and the third optical sensor 530 include first, second, and third charge-coupled device (CCD) cameras 310, 320, and 330 for The photographic substrate 1 surface, and the first, second, and third light sources 410, 420, and 430 are used to provide the light required by the CCD cameras 310, 320, and 330 on the photographic surface, respectively. Here, the exemplary embodiment of the present invention uses a CCD camera, but a complementary metal oxide semiconductor (CMOS) camera can also be used. As shown in FIG. 5, in the embodiment, the first, second, and third ccd cameras 310, 320, and 330 are disposed above the transport device, and the first and second light sources 410, 420, and 430 are disposed. The side frame 2 is below. That is, light rays are emitted from the first, second, and third light sources 41, 42, and 430 through the substrate 1 to enter the first, second, and third CCD cameras 31, 320, and 330, respectively. The first, second and third CCD cameras 310, 320 and 330 are connected to a controller 6A, which is connected to the first and second disks by connecting wires 620, 630 and 640. The CCD cameras 310, 320 and 330' are used to analyze contaminants or cracks on the substrate 1 . The optical sensor moving unit comprises a first upper moving frame 351, a second upper moving frame 352, a third upper moving frame 353, and a first lower moving frame 451 and a second lower moving frame 452. A third lower moving frame 453. 17 201140041 The first, second and third CCD cameras 310, 320 and 330 are additionally connected to the first, second and third upper moving frames 351, 352 and 353, respectively, along the first and second The third upper moving frame 35 352 and 353 are moved back and forth. First, second and third light sources 410, 420 and 430 are additionally connected to the first, second and third lower moving frames 451, 452 and 453, respectively, along the first, second and third The three moving frames 451, 452, and 453 are moved back and forth. A second upper support frame 395 is coupled to a third upper support frame 396 to each of the first, second and third upper moving frames 351, 352 and 353; a second lower support frame 495 and a first The three lower support frames 496 connect both ends of each of the first, second, and third lower moving frames 451, 452, and 453. A fifth vertical frame 390 is coupled to both ends of the second support frame 395, and a sixth vertical frame 391 is coupled to both ends of the third upper support frame 396. A seventh vertical frame 490 is coupled to both ends of the second lower support frame 495, and an eighth vertical frame 491 is coupled to the third lower support frame 496. The fifth vertical frame 390 and the sixth vertical frame 391 are fixed to the side frame. 200, supporting the second and third upper support frames 395 and 396, respectively, and the seventh vertical frame 490 and the eighth vertical frame 491 are fixed to the side frame 200 to support the second and third lower support frames 495 and 496, respectively. The second and third upper support frames 395 and 396 and the second and third lower support frames 495 and 496 are disposed perpendicular to the conveying direction of the substrate 100; the first, second and third upper moving frames 351, 352 and 353 and The first, second, and third lower moving frames 451, 452, and 453 are placed and tilted 201140041
1 w/jozrA 於相對基板100運送方向的一預定角度。 基板100係由運送框架210上的滾輪220運送，而第 一、第二與第三CCD攝影機310、32〇與33〇以及第一、 第二與第三光源410、420與430係沿著基板丨〇〇之前垂 直邊110，於相對於基板1〇〇運送方向之一對角方向上， 在第一路徑上被來回移動’以從一端至另一端檢查運送中 的基板100之前垂直邊110。 基板100之前垂直邊110被劃分為三個區域，且該三 個分區分別同時由第一、第二與第三CCD攝影機31〇、32〇 與330以及第一、第二與第三光源41〇、420與430檢查。 於此例中，因為第一、第二與第三CCD攝影機31〇、 320與330以及第一、第二與第三光源41〇、420與430之 移動速度隨基板100運送速度作調整，或對角線方向的角 度§周整為一預定角度’ CCD攝影機300與光源400便可由 一端至另一端檢查基板1〇〇的前垂直邊n〇。再者，基板 100速度可調整，使第一、第二與第三CCD攝影機310、 320與330以及第一、第二與第三光源41〇、420與430能 由一端至另一端檢查基板100的前垂直邊110。 此外，當基板100之前垂直邊11〇檢查完成，第一、 第二與第三CCD攝影機310、320與330以及第一、第二 與第三光源410、420與430循原第一路徑相反方向移動 回到原點。之後，當基板100之後垂直邊120進入，第一、 第二與第三CCD攝影機310、320與330以及第一、第二 與第三光源410、420與430係沿著基板1〇〇之後垂直邊 120被來回移動，以同於檢查前垂直邊11〇的速度與時間， 201140041 由一端至另一端檢查基板100之後垂直邊12〇。 如同檢查基板100之前垂直邊110—般，基板之 後垂直邊120被劃分為三個區域且該三個分區分別同時由 第一、第二與第三CCD攝影機310、320與330以及第一、 第二與第三光源410 ' 420與430檢查。 再者，也可使用擁有大視角之一種區域掃描攝影機， 來重複攝影一預定區域，以檢查基板100。 如上所述’當基板100為一大尺寸時，可藉由會 板100為三個區域且使用三台CCD攝影機與三個^刀基 查每個分區，減少檢查時間。 、原、撿 於此，本發明範例性實施例劃分基板100為= 織 範 且使用三台CCD攝影機與三個光源檢查每個分區甸區 CCD攝影機與光源數量以及基板的分區數量有多°，然 例性實施例。 夕橡的 第五範例性實施例 第6圖繪示依照本發明之第五範例性實施例之 板的裝置與方法。 檢查基 施例之掩 之檢4基 施例中， 柃〜邊槌 T移動樞 八垂直樞 如第6圖所示，相較於本發明第四範例性實 查基板100裝置，依據本發明第五範例性實施例 板100裝置在構造上有所不同。於第五範例性實 第一、第二與第三光源410、420與430係配置 架200上’且不包括一第一下移動框架、一第二 架、一第二下移動框架、一第七垂直框架、一第 架，但其餘構造皆相同。 20 2011400411 w/jozrA is at a predetermined angle with respect to the transport direction of the substrate 100. The substrate 100 is carried by the roller 220 on the transport frame 210, and the first, second and third CCD cameras 310, 32A and 33B and the first, second and third light sources 410, 420 and 430 are along the substrate. The front vertical edge 110 is moved back and forth on the first path in a diagonal direction with respect to the substrate 1 〇〇 transport direction to check the vertical side 110 before the substrate 100 in transit from one end to the other end. The vertical side 110 of the substrate 100 is divided into three regions, and the three partitions are simultaneously composed of the first, second and third CCD cameras 31, 32, and 330 and the first, second, and third light sources 41, respectively. , 420 and 430 check. In this example, since the moving speeds of the first, second, and third CCD cameras 31A, 320, and 330 and the first, second, and third light sources 41A, 420, and 430 are adjusted with the substrate 100 transport speed, or The angle of the diagonal direction § is a predetermined angle. The CCD camera 300 and the light source 400 can inspect the front vertical side n〇 of the substrate 1 from one end to the other end. Furthermore, the substrate 100 can be adjusted in speed such that the first, second and third CCD cameras 310, 320 and 330 and the first, second and third light sources 41A, 420 and 430 can inspect the substrate 100 from one end to the other. The front vertical edge 110. In addition, when the vertical edge 11 〇 of the substrate 100 is completed, the first, second and third CCD cameras 310, 320 and 330 and the first, second and third light sources 410, 420 and 430 follow the original first path. Move back to the origin. Thereafter, when the substrate 100 enters the vertical side 120, the first, second and third CCD cameras 310, 320 and 330 and the first, second and third light sources 410, 420 and 430 are vertically along the substrate 1 The edge 120 is moved back and forth to be the same as the speed and time of the vertical edge 11 检查 before inspection. 201140041 The substrate 100 is inspected from one end to the other and the vertical side is 12 〇. As with the vertical edge 110 before the substrate 100 is inspected, the vertical edge 120 after the substrate is divided into three regions and the three partitions are simultaneously composed of the first, second and third CCD cameras 310, 320 and 330 and the first and the The second and third light sources 410' 420 and 430 are inspected. Furthermore, it is also possible to use a zone scanning camera having a large viewing angle to repeatedly photograph a predetermined area to inspect the substrate 100. As described above, when the substrate 100 is of a large size, the inspection time can be reduced by using the panel 100 as three areas and using three CCD cameras and three knives to check each partition. The original embodiment of the present invention divides the substrate 100 into a fabric and uses three CCD cameras and three light sources to check the number of CCD cameras and the number of light sources and the number of partitions of the substrate in each of the districts. An exemplary embodiment. Fifth Exemplary Embodiment of the Oak Rubber FIG. 6 is a view showing an apparatus and method of a panel according to a fifth exemplary embodiment of the present invention. In the case of the inspection of the base embodiment, the 柃~槌槌T moving pivot eight vertical pivot is as shown in FIG. 6, compared to the fourth exemplary physical inspection substrate 100 device of the present invention, according to the present invention. The five exemplary embodiment panel 100 devices differ in construction. The fifth exemplary first, second, and third light sources 410, 420, and 430 are disposed on the rack 200 and do not include a first lower moving frame, a second frame, a second lower moving frame, and a first Seven vertical frames, one frame, but the rest of the structure is the same. 20 201140041
1 W/J02PA 根據本發明第五範例性實施例檢查基板裝置之第 一、第一與第三光學感應器510、520與530包括第一、 第 一 第—電何耗合裝置（charge-coupled device, CCD)攝 影機310、320與330’用以攝影基板1〇〇表面，以及第一、 第一與第二光源410、420與430，用以分別提供CCD攝 影機310、320與330於攝影表面時所需之光線。於此， 本發明範例性實施例使用CCD攝影機，但亦可使用一互 補式金氧半導體（complementary metal oxide semiconductor, CMOS)攝影機。 ’ 如第6圖所示，在實施例中第一、第二與第三ccd 攝影機310、320與330係配置於該運送裝置上方，且第 一、第一與第三光源410、420與430係配置於邊框架2〇〇 上方。也就是說，光線自第一、第二與第三光源41〇、42〇 與430射出，於基板1〇〇前垂直邊110或後垂直邊12〇反 射後分別進入第一、第二與第三CCD攝影機31〇、320與 330。第一、第二與第三CCD攝影機310、320與330連 接至一台控制器600，該控制器600分別藉由連接線620、 630與640連接至第一、第二與第三CCD攝影機310、320 與330，用以分析基板100上的汙染物或裂痕。 一光學感應器移動單元（未繪出）的構成包括一第一 上移動框架351、一第二上移動框架352與一第三上移動 框架353。 第一、第二與第三CCD攝影機310、320與330被分 別附加式地連接於該第一、第二與第三上移動框架351、 352與353。第一、第二與第三光源410、420與430透過 21 201140041 第一、第二與第二光源支架441、442與443分別連接至 第一、第二與第三CCD攝影機310、320與330。因此， 於第一、第二與第三CCD攝影機310、320與330移動時， 第一、第二與第三光源410、420與430會同時移動。 一第二上支撐框架395與一第三上支撐框架396連接 於第一、第二與第三上移動框架351、352與353兩端， 一第九垂直框架392連接於第二上支撐框架395兩端，以 及一第十垂直框架393連接於第三上支撐框架396兩端。 第九垂直框架392與第十垂直框架393被固定於邊框架 202，且分別支撐第二與第三上支撐框架395與396。 第二與第三上支撐框架395與396安置垂直於基板 100之傳送方向，而第一、第二與第三上移動框架351、 352與353係被安置而傾斜於相對基板ι〇〇運送方向的一 預定角度。 第六範例性實施例 第7至9圖綠示依照本發明之第六範例性實施例之檢 查基板的裝置與方法。 如第7至9圖所示，第六範例性實施例相較於本發明 第一範例性貫施例之檢查基板裝置不同處在於，依據 本發明第六範例性實施例之檢查基板1〇〇包括兩個光學感 應器，用來偵測附著於基板上的微粒或裂痕。 也就是說’依據本發明第六範例性實施例之檢查基板 100包括一前光學感應器951與一後光學感應器950，用 來檢查基板100的四個邊11〇、12〇、13〇與14〇。檢查基 22 2011400411 W/J02PA The first, first and third optical sensors 510, 520 and 530 for inspecting the substrate device according to the fifth exemplary embodiment of the present invention include first and first first-charged devices (charge-coupled) Device, CCD) cameras 310, 320, and 330' are used to photograph the substrate 1 surface, and first, first, and second light sources 410, 420, and 430 for respectively providing CCD cameras 310, 320, and 330 on the photographic surface. The light that is needed. Here, the exemplary embodiment of the present invention uses a CCD camera, but a complementary metal oxide semiconductor (CMOS) camera can also be used. As shown in FIG. 6, in the embodiment, the first, second, and third ccd cameras 310, 320, and 330 are disposed above the transport device, and the first, first, and third light sources 410, 420, and 430 are disposed. It is arranged above the side frame 2〇〇. That is to say, the light is emitted from the first, second and third light sources 41〇, 42〇 and 430, and is reflected on the front side vertical edge 110 or the rear vertical side 12〇 of the substrate 1 and then enters the first, second and the first respectively. Three CCD cameras 31, 320 and 330. The first, second, and third CCD cameras 310, 320, and 330 are coupled to a controller 600 that is coupled to the first, second, and third CCD cameras 310 by connection lines 620, 630, and 640, respectively. , 320 and 330, for analyzing contaminants or cracks on the substrate 100. An optical sensor moving unit (not shown) is constructed to include a first upper moving frame 351, a second upper moving frame 352 and a third upper moving frame 353. The first, second, and third CCD cameras 310, 320, and 330 are additionally coupled to the first, second, and third upper moving frames 351, 352, and 353, respectively. The first, second, and third light sources 410, 420, and 430 are transmitted through the 21 201140041, the first, second, and second light source brackets 441, 442, and 443 are connected to the first, second, and third CCD cameras 310, 320, and 330, respectively. . Therefore, when the first, second, and third CCD cameras 310, 320, and 330 move, the first, second, and third light sources 410, 420, and 430 move simultaneously. A second upper support frame 395 and a third upper support frame 396 are coupled to the first, second and third upper moving frames 351, 352 and 353, and a ninth vertical frame 392 is coupled to the second upper support frame 395. Both ends, and a tenth vertical frame 393 are connected to both ends of the third upper support frame 396. The ninth vertical frame 392 and the tenth vertical frame 393 are fixed to the side frame 202, and support the second and third upper support frames 395 and 396, respectively. The second and third upper support frames 395 and 396 are disposed perpendicular to the conveying direction of the substrate 100, and the first, second and third upper moving frames 351, 352 and 353 are disposed to be inclined with respect to the opposite substrate transport direction a predetermined angle. Sixth Exemplary Embodiment A seventh embodiment of the present invention provides a device and method for inspecting a substrate in accordance with a sixth exemplary embodiment of the present invention. As shown in FIGS. 7 to 9, the sixth exemplary embodiment is different from the inspection substrate device of the first exemplary embodiment of the present invention in that the substrate 1 is inspected according to the sixth exemplary embodiment of the present invention. Includes two optical sensors to detect particles or cracks attached to the substrate. That is, the inspection substrate 100 according to the sixth exemplary embodiment of the present invention includes a front optical sensor 951 and a rear optical sensor 950 for inspecting the four sides 11〇, 12〇, 13〇 of the substrate 100. 14〇. Inspection base 22 201140041
1 W/30/FA 板100還包括一光學感應器移動單元（未緣出），用以移 動前光學感應器951與後光學感應器950。 前光學感應器951與後光學感應器950彼此平行且被 一預定間隔所劃分。此外，前光學感應器951與後光學感 應器950可以不平行彼此。 於此例中，前光學感應器951與後光學感應器950有 著不同的移動速度。 用來偵測附著於基板上的微粒或裂痕之前光學感應 器951與後光學感應器950包括一前CCD攝影機911與 一後CCD攝影機910，用以攝影基板100表面，以及一前 光源921與一後光源920,提供前CCD攝影機911與後攝 影機910於攝影表面時所需之光線。於此，本發明範例性 實施例使用CCD攝影機，但亦可使用一 CMOS攝影機。 如第7至9圖所示，在實施例中前CCD攝影機911 與後攝影機910係配置於該運送裝置上方，而前光源921 與後光源920係配置於邊框架200下方。也就是說，光線 自前光源921與後光源920射出穿越基板100而進入前 CCD攝影機911與後攝影機910。前CCD攝影機911與後 攝影機910連接至一台控制器600，該控制器600藉由一 條前連接線660與一條後連接線650分別連接至前CCD 攝影機911與後攝影機910，用以分析基板100上的汙染 物或裂痕。 光學感應器移動單元的構成包括一前上支撐框架810 與一前下支撐框架820，以及一後上支撐框架710與一後 下支撐框架720。 23 201140041 則CCD攝影機911被附加式地連接於該前上支撐框 架810 ’並沿著該前上支撐框架81〇被來回移動。前光源 9：21被附加式地連接於該前下支樓框架㈣，並沿著該前 下支撐框架820被來回移動。一前上垂直框架83〇連接前 上支撐框架810兩端，一前下垂直框架84〇連接前下支撐 框架820兩端。前上垂直框架83〇與前下垂直框架84〇被 固定於邊框架200，而前上垂直框架83〇與前下垂直框架 840分別支撐前上支撐框架81〇與前下支撐框架82〇。前 上支撐框架810與前下支撐框架82〇被安置而傾斜於相對 基板100運送方向的一預定角度。 後CCD攝影機910被附加式地連接於該後上支撐框 架710，並沿著該後上支撐框架710被來回移動。後光源 920被附加式地連接於該後下支撐框架72〇,並沿著該後 下支撐框架720被來回移動。一後上垂直框架730連接後 上支撐框架710兩端，一後下垂直框架740連接後下支撐 框架720兩端。候上垂直框架730與後下垂直框架740被 固定於邊框架200，而後上垂直框架730與後下垂直框架 740分別支撐後上支撐框架710與後下支撐框架720。後 上支撐框架710與後下支撐框架720被安置而傾斜於相對 基板100運送方向的一預定角度。 在此處，前上支撐框架810與前下支撐框架820以及 後上支撐框架710與後下支撐框架720彼此平行且彼此以 一預定間隔分離。 此外，前上支撐框架810與前下支撐框架820以及後 上支撐框架710與後下支撐框架720可以基板100之前垂 24 201140041The 1 W/30/FA board 100 also includes an optical sensor moving unit (not shown) for moving the front optical sensor 951 and the rear optical sensor 950. The front optical sensor 951 and the rear optical sensor 950 are parallel to each other and are divided by a predetermined interval. Further, the front optical sensor 951 and the rear optical sensor 950 may not be parallel to each other. In this example, the front optical sensor 951 and the rear optical sensor 950 have different moving speeds. Before detecting the particles or cracks attached to the substrate, the optical sensor 951 and the rear optical sensor 950 include a front CCD camera 911 and a rear CCD camera 910 for photographing the surface of the substrate 100, and a front light source 921 and a The rear light source 920 provides the light required by the front CCD camera 911 and the rear camera 910 when the surface is photographed. Here, the exemplary embodiment of the present invention uses a CCD camera, but a CMOS camera can also be used. As shown in FIGS. 7 to 9, in the embodiment, the front CCD camera 911 and the rear camera 910 are disposed above the transport device, and the front light source 921 and the rear light source 920 are disposed below the side frame 200. That is, light rays from the front light source 921 and the rear light source 920 are emitted through the substrate 100 to enter the front CCD camera 911 and the rear camera 910. The front CCD camera 911 and the rear camera 910 are connected to a controller 600, which is connected to the front CCD camera 911 and the rear camera 910 by a front connection line 660 and a rear connection line 650, respectively, for analyzing the substrate 100. Contaminants or cracks on it. The optical sensor moving unit is constructed to include a front upper support frame 810 and a front lower support frame 820, and a rear upper support frame 710 and a rear lower support frame 720. 23 201140041 Then the CCD camera 911 is additionally attached to the front upper support frame 810' and moved back and forth along the front upper support frame 81. The front light source 9:21 is additionally attached to the front lower frame (4) and moved back and forth along the front lower support frame 820. A front upper vertical frame 83 is connected to both ends of the upper support frame 810, and a front lower vertical frame 84 is connected to both ends of the front lower support frame 820. The front upper vertical frame 83〇 and the front lower vertical frame 84〇 are fixed to the side frame 200, and the front upper vertical frame 83〇 and the front lower vertical frame 840 support the front upper support frame 81〇 and the front lower support frame 82〇, respectively. The front upper support frame 810 and the front lower support frame 82 are disposed to be inclined at a predetermined angle with respect to the conveying direction of the substrate 100. The rear CCD camera 910 is additionally coupled to the rear upper support frame 710 and moved back and forth along the rear upper support frame 710. The rear light source 920 is additionally coupled to the rear lower support frame 72A and is moved back and forth along the rear lower support frame 720. A rear upper vertical frame 730 is connected to both ends of the upper support frame 710, and a rear lower vertical frame 740 is connected to both ends of the lower support frame 720. The upper vertical frame 730 and the lower rear vertical frame 740 are fixed to the side frame 200, and the rear upper vertical frame 730 and the rear lower vertical frame 740 respectively support the rear upper support frame 710 and the rear lower support frame 720. The rear upper support frame 710 and the rear lower support frame 720 are disposed to be inclined at a predetermined angle with respect to the conveying direction of the substrate 100. Here, the front upper support frame 810 and the front lower support frame 820 and the rear upper support frame 710 and the rear lower support frame 720 are parallel to each other and separated from each other by a predetermined interval. Further, the front upper support frame 810 and the front lower support frame 820 and the rear upper support frame 710 and the rear lower support frame 720 may be suspended from the substrate 100.
1 W/JOZKA 直邊110與後垂直邊120之間的距離，彼此分離。 於基板100係由運送框架210上的滾輪220運送時， 後CCD攝影機910與後光源920分別被固定在後上支撐 框架710與後下之稱框架720之第一點A，由一端至令一 端檢查運送中基板之一第一水平邊130。第一點A位於與 第一水平邊130垂直對應之位置上。 之後，後CCD攝影機910與後光源920沿著基板100 之後垂直邊120，於基板100之傳送方向之對角方向上， 從第一點A至一第二點B被來回移動，由一端至另一端檢 查運送中基板100之後垂直邊120。第二點B位於與第二 水平邊140垂直對應之位置上。 進一步地，前CCD攝影機911與前光源921沿著基 板100之前垂直邊110，於基板100之傳送方向之對角方 向上，從一第三點C至一第四點D被來回移動，由一端至 另一端檢查運送中基板100之前垂直邊110。第三點C位 於與第一水平邊130垂直對應之位置上，而第四點D位於 與第二水平邊140垂直對應之位置上 而後，前CCD攝影機911與前光源921被固定於前 上支撐框架810與前下支撐框架支第四點D，由一端至另 一端檢查基板100之第二水平邊140。 接著，後CCD攝影機910與後光源920移動至第一 點A，前CCD攝影機911與前光源921移動至第三點C， 準備檢查另一片運送中的基板。 在此，基板100之後垂直邊120與前垂直邊110可同 時受到檢查。也就是說，於運送基板100時，基板之後垂 25 201140041 直邊120、前垂直邊no、第一水平邊i3〇與第二水平邊 140可同時地且容易地被檢查。 此外，攝影機可使用一直線掃描（Line Scan)攝影機 戈 ^域知推（Area Scan )攝影機。 如此’可以使用前光學感應器951與後光學感應器951 檢查運送中基板之四邊，確認基板是否有缺陷。 第七範例性實施例 第圖繪示依照本發明之第七範例性實施例之檢查 基板的裝置與方法。 如第10圖所示，相較於本發明第六範例性實施例之 檢查基板100裝置，依據本發明第七範例性實施例之檢查 基板100裝置在構造上有所不同。於第七範例性實施例 中’一前光源921與一後光源920係配置於一邊框架200 上’且不包括一前下支撐框架、一後下支撐框架、一前下 垂直框架、一後下垂直框架，但其餘構造皆相同。 根據本發明第七範例性實施例，在檢查基板裝置中， 一前CCD攝影機911、一後CCD攝影機910、一前光源 92卜與一後光源920，可配置於該運送裝置上方。光線自 前光源921射出’於基板1〇〇之一前垂直邊no與一第二 水平邊140反射後進入前CCD攝影機911，而光線自後光 源920射出，於基板100之一後垂直邊120與一第一水平 邊130反射後進入後CCD攝影機910。 一光學感應器移動單元（未繪出）的構成包括一前上 支撐框架810與一後上支撐框架910。 26 201140041 1 w / j〇zr/\ 刖CCD攝影機911被附加式地連接於該前上支撐框 架810並沿著該前上支撐框架81〇被來回移動。前光源921 透過一則光源支架931連接至前CCD攝影機911。因此， 於前CCD攝影機911移動時，前光源921會同時移動。 後CCD攝衫機91 〇被附加式地連接於該後上支樓框 架710並沿著該後上支撐框架71〇被來回移動。後光源92〇 透過一後光源支架930連接至後ccd攝影機910。因此， 於後CCD攝影機91〇移動日夺，後光源92〇會同時移動。 儘管於上述之實施例列舉本發明之實施態樣，用以闡 釋本發明之技術特徵’但並非用來限制本發明於該些實施 例。相反地，任何與本發明精神與範疇相關的多樣性改變 與均等性的組合’皆包含於本發明專利範圍中。 綜上所述，雖然本發明已以範例性實施例揭露如上， 然其並非用以限定本發明。本發明所屬技術領域中具有通 常知識者，在不脫離本發明之精神和範圍内，當可作各種 之更動與潤飾。因此，本發明之保護範圍當視後附之申請 專利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示依照本發明之第一較佳實施例之檢查基板 的一種裝置與方法； 第2、3圖繪示依照本發明之第二較佳實施例之檢查 基板的一種装置與方法； 第4圖繪示依照本發明之第三較佳實施例之檢查基板 的一種裝置與方法； 27 201140041 第5圖繪示依照本發明之第四較佳實施例之檢查基板 的一種裝置與方法； 第6圖繪示依照本發明之第五較佳實施例之檢查基板 的一種裝置與方法； 第7至9圖繪示依照本發明之第六較佳實施例之檢查 基板的一種裝置與方法； 第10圖繪示依照本發明之第七較佳實施例之檢查基 板的一種裝置與方法。 【主要元件符號說明】 100 ： 基板 110 ： 前垂直邊 120 ： 後垂直邊 130 ： 第一水平邊 140 ： 第二水平邊 200 ： 邊框架 210 ： 傳送訊框 220 ： 滾輪 300 ： CCD攝影機或CMOS攝影機 310 ： 第一 CCD攝影機 320 ： 第二CCD攝影機 330 ： 第三CCD攝影機 350 ： 第一上支撐框架 351 ： 第一上移動框架 352 ： 第二上移動框架 28 201140041 I W /362FA 353 360 370 380 390 391 392 393 395 396 400 410 420 430 440 441 442 443 450 451 452 453 460 490 491 ： 第三上移動框架 第一垂直框架 第三垂直框架 第四垂直框架 第五垂直框架 第六垂直框架 第九垂直框架 第十垂直框架 第二上支撐框架 第三上支撐框架 光源 第一光源 第二光源 第三光源 光源支架 第一光源支架 第二光源支架 第三光源支架 第一下支撐框架 第一下移動框架 第二下移動框架 第三下移動框架 第二垂直框架 第七垂直框架 :第八垂直框架 29 201140041 495 第二下支撐框架 496 第三下支撐框架 500 光學感應器 510 第一光學感應器 520 第二光學感應器 530 第三光學感應器 600 控制器 610、620、630、640 :連接線 650 :後連接線 660 :前連接線 700 :旋轉盤 710 :後上支撐框架 720 :後下支撐框架 730 :後上垂直框架 740 :後下垂直框架 810 :前上支撐框架 820 :前下支撐框架 830 :前上垂直框架 840 :前下垂直框架 910 :後CCD攝影機 911 :前CCD攝影機 920 :後光源 921 :前光源 950 :後光學感應器 951 :前光學感應器1 W/JOZKA The distance between the straight edge 110 and the rear vertical edge 120 is separated from each other. When the substrate 100 is transported by the roller 220 on the transport frame 210, the rear CCD camera 910 and the rear light source 920 are respectively fixed to the first point A of the rear upper support frame 710 and the lower rear frame 720, from one end to one end. A first horizontal edge 130 of one of the substrates in transit is inspected. The first point A is located at a position perpendicular to the first horizontal side 130. Thereafter, the rear CCD camera 910 and the rear light source 920 are moved back and forth along the vertical side 120 of the substrate 100 from the first point A to the second point B in a diagonal direction of the substrate 100, from one end to the other. The vertical side 120 after the substrate 100 in transit is inspected at one end. The second point B is located at a position perpendicular to the second horizontal side 140. Further, the front CCD camera 911 and the front light source 921 are moved back and forth along a vertical side 110 of the substrate 100 from a third point C to a fourth point D in a diagonal direction of the substrate 100. The vertical side 110 before the substrate 100 in transit is inspected to the other end. The third point C is located at a position vertically corresponding to the first horizontal side 130, and the fourth point D is located at a position vertically corresponding to the second horizontal side 140, and then the front CCD camera 911 and the front light source 921 are fixed to the front upper support. The frame 810 and the front lower support frame support the fourth point D, and the second horizontal side 140 of the substrate 100 is inspected from one end to the other end. Next, the rear CCD camera 910 and the rear light source 920 are moved to the first point A, and the front CCD camera 911 and the front light source 921 are moved to the third point C, ready to inspect the substrate in the other transport. Here, the vertical side 120 and the front vertical side 110 of the substrate 100 can be inspected at the same time. That is, when the substrate 100 is transported, the substrate is slanted 25 201140041, the straight side 120, the front vertical side no, the first horizontal side i3 〇 and the second horizontal side 140 can be simultaneously and easily inspected. In addition, the camera can use the Line Scan camera Area Scan camera. Thus, the front optical sensor 951 and the rear optical sensor 951 can be used to check the four sides of the substrate in transit to confirm whether the substrate is defective. Seventh Exemplary Embodiment FIG. 1 is a view showing an apparatus and method for inspecting a substrate in accordance with a seventh exemplary embodiment of the present invention. As shown in Fig. 10, the apparatus for inspecting the substrate 100 according to the seventh exemplary embodiment of the present invention is different in construction from the apparatus for inspecting the substrate 100 of the sixth exemplary embodiment of the present invention. In the seventh exemplary embodiment, 'a front light source 921 and a rear light source 920 are disposed on one side of the frame 200' and do not include a front lower support frame, a rear lower support frame, a front lower vertical frame, and a lower rear frame. Vertical frame, but the rest of the structure is the same. According to the seventh exemplary embodiment of the present invention, in the inspection substrate device, a front CCD camera 911, a rear CCD camera 910, a front light source 92 and a rear light source 920 can be disposed above the transport device. The light from the front light source 921 is emitted from the front vertical edge no and the second horizontal side 140 of the substrate 1 into the front CCD camera 911, and the light is emitted from the rear light source 920, and is disposed on the rear vertical side 120 of the substrate 100. A first horizontal edge 130 reflects and enters the rear CCD camera 910. An optical sensor moving unit (not shown) is constructed to include a front upper support frame 810 and a rear upper support frame 910. 26 201140041 1 w / j〇zr/\ The CCD camera 911 is additionally attached to the front upper support frame 810 and moved back and forth along the front upper support frame 81. The front light source 921 is connected to the front CCD camera 911 through a light source holder 931. Therefore, when the front CCD camera 911 moves, the front light source 921 moves at the same time. A rear CCD camera 91 is additionally attached to the rear upper frame 710 and moved back and forth along the rear upper support frame 71. The rear light source 92 is coupled to the rear cdc camera 910 through a rear light source holder 930. Therefore, after the rear CCD camera 91 moves, the rear light source 92 同时 moves at the same time. Although the embodiments of the present invention are described in the above embodiments, the technical features of the present invention are illustrated, but are not intended to limit the present invention to the embodiments. On the contrary, any combination of diversity changes and equality relating to the spirit and scope of the present invention is included in the scope of the present invention. In the above, the present invention has been described above by way of example embodiments, and is not intended to limit the invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing an apparatus and method for inspecting a substrate according to a first preferred embodiment of the present invention; and FIGS. 2 and 3 are diagrams showing an inspection substrate according to a second preferred embodiment of the present invention. 4 is a device and method for inspecting a substrate according to a third preferred embodiment of the present invention; 27 201140041 FIG. 5 is a view showing a substrate according to a fourth preferred embodiment of the present invention. A device and method; FIG. 6 is a view showing a device and a method for inspecting a substrate according to a fifth preferred embodiment of the present invention; and FIGS. 7 to 9 are views showing a substrate according to a sixth preferred embodiment of the present invention. A device and method; FIG. 10 illustrates an apparatus and method for inspecting a substrate in accordance with a seventh preferred embodiment of the present invention. [Main component symbol description] 100 : Substrate 110 : Front vertical side 120 : Rear vertical side 130 : First horizontal side 140 : Second horizontal side 200 : Side frame 210 : Transmission frame 220 : Roller 300 : CCD camera or CMOS camera 310: First CCD camera 320: Second CCD camera 330: Third CCD camera 350: First upper support frame 351: First upper moving frame 352: Second upper moving frame 28 201140041 IW / 362FA 353 360 370 380 390 391 392 393 395 396 400 410 420 430 440 441 442 443 450 451 452 453 460 490 491 : Third upper moving frame First vertical frame Third vertical frame Fourth vertical frame Fifth vertical frame Sixth vertical frame Ninth vertical frame Ten vertical frame second upper support frame third upper support frame light source first light source second light source third light source light source bracket first light source bracket second light source bracket third light source bracket first lower support frame first lower moving frame second lower Moving frame third lower moving frame second vertical frame seventh vertical frame: eighth vertical frame 29 201140041 495 Second lower support frame 496 Third lower support frame 500 Optical sensor 510 First optical sensor 520 Second optical sensor 530 Third optical sensor 600 Controller 610, 620, 630, 640: Connection line 650 : Rear connection line 660 : Front connection line 700 : Rotating disk 710 : Rear upper support frame 720 : Rear lower support frame 730 : Rear upper vertical frame 740 : Rear lower vertical frame 810 : Front upper support frame 820 : Front lower support frame 830 : Front upper vertical frame 840 : Front lower vertical frame 910 : Rear CCD camera 911 : Front CCD camera 920 : Rear light source 921 : Front light source 950 : Rear optical sensor 951 : Front optical sensor
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090127313A KR100975645B1 (en) | 2009-12-18 | 2009-12-18 | Appartus for inspecting substrate and method using the same |
| KR1020100109861A KR101046566B1 (en) | 2010-11-05 | 2010-11-05 | Appartus for inspecting substrate and method using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201140041A true TW201140041A (en) | 2011-11-16 |
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| TW99143526A TW201140041A (en) | 2009-12-18 | 2010-12-13 | Apparatus for inspecting substrate and method using the same |
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| Country | Link |
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| TW (1) | TW201140041A (en) |
| WO (1) | WO2011074806A2 (en) |
Cited By (1)
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|---|---|---|---|---|
| CN106405895A (en) * | 2016-11-25 | 2017-02-15 | 深圳市华星光电技术有限公司 | One-off light-on fragment detection device and application method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108519390B (en) * | 2018-04-09 | 2021-02-02 | 芜湖立普德机械科技有限公司 | Glass substrate detection device |
| KR102215123B1 (en) * | 2018-11-26 | 2021-02-16 | 주식회사 탑 엔지니어링 | Apparatus and method for inspecting surface of substrate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01169343A (en) * | 1987-12-25 | 1989-07-04 | Nippon Sheet Glass Co Ltd | Cut defect detector for glass plate |
| JP2001272306A (en) * | 2000-03-24 | 2001-10-05 | Canon Inc | Inspection method for color filter |
| TW200519473A (en) * | 2005-01-18 | 2005-06-16 | Optimax Tech Corp | Inspection device and method of polarizer |
| KR100925787B1 (en) * | 2007-12-28 | 2009-11-11 | 주식회사 디엠에스 | Apparatus for drying substrates and method using the same |
-
2010
- 2010-12-02 WO PCT/KR2010/008575 patent/WO2011074806A2/en active Application Filing
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106405895A (en) * | 2016-11-25 | 2017-02-15 | 深圳市华星光电技术有限公司 | One-off light-on fragment detection device and application method thereof |
| CN106405895B (en) * | 2016-11-25 | 2019-09-17 | 深圳市华星光电技术有限公司 | Lighting fragmentation detection device and its application method |
Also Published As
| Publication number | Publication date |
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| WO2011074806A2 (en) | 2011-06-23 |
| WO2011074806A3 (en) | 2011-11-03 |
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