TW201129995A - Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof - Google Patents

Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof

Info

Publication number
TW201129995A
TW201129995A TW099140506A TW99140506A TW201129995A TW 201129995 A TW201129995 A TW 201129995A TW 099140506 A TW099140506 A TW 099140506A TW 99140506 A TW99140506 A TW 99140506A TW 201129995 A TW201129995 A TW 201129995A
Authority
TW
Taiwan
Prior art keywords
conductive paste
external electrode
manufacturing
same
multilayer ceramic
Prior art date
Application number
TW099140506A
Other languages
English (en)
Inventor
Byung-Jun Jeon
Byung-Gyun Kim
Myung-Jun Park
Hyun-Hee Gu
Chang-Hoon Kim
Kyu-Ha Lee
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201129995A publication Critical patent/TW201129995A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Conductive Materials (AREA)
TW099140506A 2009-12-14 2010-11-24 Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof TW201129995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090124123A KR20110067509A (ko) 2009-12-14 2009-12-14 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법

Publications (1)

Publication Number Publication Date
TW201129995A true TW201129995A (en) 2011-09-01

Family

ID=44142653

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099140506A TW201129995A (en) 2009-12-14 2010-11-24 Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof

Country Status (5)

Country Link
US (1) US20110141657A1 (zh)
JP (1) JP2011124571A (zh)
KR (1) KR20110067509A (zh)
CN (1) CN102208227A (zh)
TW (1) TW201129995A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556257B (zh) * 2013-08-07 2016-11-01 Mitsui Mining & Smelting Co Composite copper particles and methods for producing the same

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KR101477334B1 (ko) * 2011-08-29 2014-12-30 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR20140030611A (ko) * 2012-09-03 2014-03-12 삼성전기주식회사 외부 전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 전자 부품 및 그 제조 방법
KR101444613B1 (ko) * 2013-07-12 2014-09-26 삼성전기주식회사 복합 도전성 분말, 이를 포함하는 외부전극용 도전성 페이스트 및 적층 세라믹 커패시터의 제조방법
US20150070816A1 (en) * 2013-09-06 2015-03-12 Delphi Technologies, Inc. Capacitor fabrication using nano materials
KR102097329B1 (ko) 2013-09-12 2020-04-06 삼성전기주식회사 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터 실장 기판
KR101994723B1 (ko) 2013-10-30 2019-07-01 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 이용한 적층 세라믹 전자부품 및 그 제조방법
JP6530709B2 (ja) 2014-03-05 2019-06-12 積水化学工業株式会社 伝導性フィラー、伝導性フィラーの製造方法及び伝導性ペースト
KR102222611B1 (ko) * 2015-07-10 2021-03-05 삼성전기주식회사 수동소자 외부전극 형성방법 및 외부전극을 갖는 수동소자
US10068710B2 (en) * 2015-07-17 2018-09-04 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and method for manufacturing same
JP2017126715A (ja) * 2016-01-15 2017-07-20 株式会社村田製作所 電子部品、実装電子部品および電子部品の実装方法
KR102126417B1 (ko) 2018-10-11 2020-06-24 삼성전기주식회사 전자 부품
KR102442390B1 (ko) 2018-10-11 2022-09-14 삼성전기주식회사 전자 부품
KR20230092016A (ko) * 2019-03-28 2023-06-23 가부시키가이샤 무라타 세이사쿠쇼 칩형 세라믹 전자부품
KR102202459B1 (ko) 2019-11-14 2021-01-13 삼성전기주식회사 전극형성용 도전성 금속 분말, 그 제조방법 및 이를 포함하는 전자부품 외부전극용 도전성 페이스트
KR20230027853A (ko) * 2021-08-20 2023-02-28 삼성전기주식회사 도전성 페이스트 및 이를 이용한 적층형 세라믹 부품
KR20230102797A (ko) * 2021-12-30 2023-07-07 삼성전기주식회사 적층형 전자 부품

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JPH0320907A (ja) * 1989-06-16 1991-01-29 Kawasaki Steel Corp 導電ペースト
JP3082154B2 (ja) * 1994-07-26 2000-08-28 太陽誘電株式会社 セラミック電子部品用焼付型導電性ペースト及びセラミック電子部品
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DE10126099B4 (de) * 2000-05-30 2008-11-13 Tdk Corp. Keramischer Vielschichtkondensator und Verfahren zu seiner Herstellung
KR100351230B1 (ko) * 2000-06-09 2002-09-05 대주정밀화학 주식회사 전극용 도전 페이스트 조성물
JP2002134251A (ja) * 2000-10-26 2002-05-10 Ngk Spark Plug Co Ltd セラミックヒーター装置
JP2003123535A (ja) * 2001-10-19 2003-04-25 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP4182234B2 (ja) * 2002-09-20 2008-11-19 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用銅粉およびその製造方法
JPWO2005036571A1 (ja) * 2003-10-08 2007-11-22 Tdk株式会社 電極ペースト、セラミック電子部品及びその製造方法
JP4359919B2 (ja) * 2003-12-25 2009-11-11 京セラ株式会社 外部電極形成用導電性ペースト及びそれを用いた積層セラミック電子部品
JP4427785B2 (ja) * 2004-02-06 2010-03-10 昭栄化学工業株式会社 積層セラミック電子部品の端子電極用導体ペースト
JP4561574B2 (ja) * 2005-10-07 2010-10-13 昭栄化学工業株式会社 積層セラミック部品端子電極用導体ペースト
KR100905878B1 (ko) * 2007-09-28 2009-07-03 삼성전기주식회사 적층형 세라믹 캐패시터 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556257B (zh) * 2013-08-07 2016-11-01 Mitsui Mining & Smelting Co Composite copper particles and methods for producing the same

Also Published As

Publication number Publication date
KR20110067509A (ko) 2011-06-22
JP2011124571A (ja) 2011-06-23
US20110141657A1 (en) 2011-06-16
CN102208227A (zh) 2011-10-05

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