201122788 六、發明說明： t發明戶斤屬之技術領域3 發明領域 本文揭露之實施例係關於一種散熱器。 【先前技術3 發明背景 用於消散從產品之產熱源（諸如CPUs(中央處理單元） 或開關元件）輻射的熱量之散熱器是習知的。 在許多被裝配有散熱器的產品中，一散熱器之空間受 到限制。另外，例如，在CPU速度或開關元件之開關速度 上已有增加，所以從產熱源輕射的熱量也持續增加。 因此，試圖在一有限空間内改進熱輻射效率。 一用於有效將熱量傳導至散熱片的熱管被包括在一散 熱器中為其中一種嘗試。 第5圖繪示一包括熱管的散熱器。 一散熱器90包括二彼此對置的基板91，及許多片狀散 熱片92與彼此對置基板91之表面成直角被安排在基板91 之間。 第5圖中所示的每一U型熱管93的平行部份94被裝入至 貫孔95中。二熱管93的平行部份94從兩側被裝入至一貫孔 95中，且平行部份94之末端在貫孔95中間彼此接觸。 曰本專利早期公開案第11-145354號案。 在第5圖所示結構中，二基板91之間的連接部份96從主 體伸出。然而，散熱片不被安排在連接部份96周圍，所以 201122788 此等部份周圍的熱輻射空間是無用的。 【日月 發明概要 ^本發明在上述背景環境下被完成 。本發明之一目標是 提供-能夠改良熱輻射空間效率的散熱器。 一依據本發明之—層面，提供—散熱器，包括一基座、 八有複數個放熱片與基座成直角地安排在基座上的散熱 至y _熱官’其二平直部份被安排成與該複數個 政…片平# 1從錢座傳導熱量至該複數個散熱片，及 bit >i 於該散熱片組上’且熱連接至該複數^^欠 熱片。 圖式簡單說明 第1圖疋依據一實施例，一散熱器之透視圖； 第2圖是該散熱器之一分解圖； 第3圖繪示該散熱器之一修改； 第4圖繪示該散熱器之一應用； 第5圖繪示一包括熱管之散熱器。 C實施方式3 較佳實施例之詳細說明 一實施例現在將參考附圖被詳細描述。 第1圖是依據一實施例，一散熱器之透視圖。 依據一實施例之一散熱器（輻射器）1包括一基板(加熱 片）2、一散熱片組3、熱管4a及4b ’及一輻射片5。 基板2是矩形的。 4 201122788 與基板2之一側2a平行的二槽21及22以確定之彼此随 離在基板2上被切割。熱管4a之一部份以居間的焊錫與槽21 接觸。熱管4b之一部份以居間的焊錫與槽22接觸。 另外’基板2與一配置散熱片組3之表面相對的一表面 藉由一熱傳導組件，諸如油脂或一熱片與一產熱源(未示於 圖中）接觸。 例如，一半導體晶片諸如一CPU、一開關元件、〜電 阻元件，或一包括它們的半導體封包是一產熱源。 另外，基板2由銅 '鋁或類似物製成。 如果基板2由鋁製成，那麼一熱管（並非熱管乜及仆)可 被埋置基板2中以供散熱。 散熱片組3以中介之焊錫配置在基板2上。 散熱片組3包括複數個散熱片3a。每一散熱片3a具有一 片狀形狀。該複數個散熱片允被安排成與基板2成直角。在 —相鄰散熱片3a之間有-確定的距離，且每—散熱片3&被 規則地配置使之平行於其他散熱片3a。 另外，每一散熱片3a被安排成使得其縱向將等於基板2 之縱向。 政熱片組3之長度(每-散熱片3峨向長度)長於其寬度。 每—散熱片3a由鋁、鋼或類似物製成。 例如，每一散熱片3a可具有一連接部份(未示於圖中）， ;連接至$ —散熱# 3a。散熱# 33可藉由此等連接部份 彼此連接。 熱管4a及4b被安排在散熱片組3中。 201122788 輻射片5被置放成與基板2相對’使其將覆蓋散熱片組3 之大部份頂部。這就是說，散熱器1具有一結構(稱為一夾 層結構），在該結構中，散熱片組3被置於基板2與輻射片5 之間。 在第1圖中，輻射片5縱向長度稍短於散熱片組3之縱向 長度。 輻射片5、散熱片組3，及熱管4a及4b彼此熱連接。 輻射片5之功能不僅是將從熱管乜及4b傳導的熱量傳 導至散熱片組3的每一散熱片3a，也是將從熱管4a及4b傳導 的熱量直接輻射至空氣中。 輻射片5由銅、鋁或類似物製成。 如果輻射片5由鋁製成，那麼一熱管（並非熱管4a及4b) 可被埋置輻射片5中用於散熱。 第2圖是該散熱器之一分解圖。 各該熱管4a及4b具有一主體，其具有字母“u”型，且由 金屬諸如銅製成。該主體是管狀的。該具有字母“U”型的主 體末端封閉’且該主體是氣密的。各具有多孔物質或狹槽 的芯被安排在主體内壁上。 一小量液體（工作液體)被密封在主體内。純水、氧水氟 氣碳化物-替代材料，或類似物被用作一工作液體。 對各該熱管4a及4b之橫截面形狀無特別限制。各該熱 管4a及4b之橫截面形狀可以是圓形、橢圓形或平的。如 果各該熱管4a及4b之難面形狀是平的，則易於操作。另 外’如果各該熱管域扑之橫截面形狀是平的，則基板2及 6 201122788 輻射片5可被製造地更薄。因此，散熱器1可被小型化。 另外，依據熱管4a中的一彎曲部份41及熱管4b中的一 彎曲部份42之形狀，散熱片組3所包含的該複數個散熱片3a 的一部份中被切割凹口 31。換句話說，其上被切割凹口31 的散熱片3a之縱向長度短於其他散熱片3a之縱向長度。 如第1圖所示，熱管4a及4b被安排成使得彎曲部份41及 42從一沿著邊2a所繪之箭頭A的起點一方看（從前方看），將 與基板2成直角。這就是說，熱管4a中的彎曲部份41及熱管 4b中的彎曲部份42被安排成平行於每一散熱片3a。 另外’在熱管4a中彎曲部份41被安排在散熱片3a之 間。在熱管4a中彎曲部份41與與其相鄰的散熱片3a之間， 及在熱管4b中彎曲部份42與與其相鄰的散熱片3a之間有一 大約2毫米的空間，以使空氣流動。 熱官4a的平直部份43及45及熱管4b之平直部份44及46 被安排在每—散熱片3a之縱向。 虽上述散熱器1被裝配時，熱管4a的平直部份43及45之 末知被放置在被切割凹口 31的散熱片3a之縱向的端部32。 另外，熱管4b之平直部份44及46之末端被放置在被切 割凹口 31的散熱片3a之縱向的端部32。 見在將描述切割凹口 31所導致的散熱片3a數目的實質 減少。 一例如，假定每—散熱片3a厚度是0.5毫米，散熱片3aa2 毫米間隔女排，熱管4a及4b直徑是6毫米，彎曲部份41及42 之曲率半彳二疋15亳米，且平直部份43、44、45及46之長度 201122788 是60毫米。 如上所述，每一熱管之内壁具有一微小結構，所以曲 率半徑有限制。如果熱管4a及4b直徑是6毫米，那麼曲率半 徑限制疋大約15宅米。曲率半徑以每一熱管之中心線作為 參考被量測。 被切割凹口 31的散熱片3a之數目依熱管知及仆之直徑 而定。 如果熱管4a及4b被安排在散熱片組3中，對於每一熱管 4a及4b ’被切割凹口 31的散熱片3a之數目是5(=1〇毫米（=6 毫米+2毫米（空間）x2)/2毫米）。因此被切割凹口 31的散熱片 3a之總數目是1〇。 另外’凹口31之面積依彎曲部份41及42之曲率半徑而 定。 在此範例中，一凹口 31占一整個散熱片3a面積的大約 百分之25。 因此，在複數個散熱片3a的一部份中切割凹口 31導致 的整個散熱片組3中的散熱片3a數目的減少量是 2.5(=l〇x25(%))。 另一方面，在第5圖中，彎曲部份96寬度是18毫米（=15 毫米（曲率半徑)+6毫米/2)。因此，大約7個散熱片（=18毫米 /(2毫米（間隔)+〇.5毫米（厚度)))不能被安裝在一側上。 這就是說，習知散熱器中不能安裝7個散熱器》然而， 依據本發明散熱器散熱片數目僅減少了 2.5。 如果熱管數目增加，此差異變小。然而，通常用於一 8 201122788 月丈熱中的熱管數目是二。 現在將描述散熱器1的熱輕射機制。 當散熱器1被使用時，散熱器丨被放置成使得一產熱源 將接觸基板2的一幾近中心部份。 首先熱量從產熱源被傳導至基板2。 部份被傳導至基板2的熱量從槽21被傳導至熱管如的 平直部份45 m部份被料至基板2的熱量從槽22 被傳導至熱管4b的平直部份46。再—部份被傳導至基板㈣ 熱量被直接傳導至散熱片3a。 田熱里被傳導至熱管4&與仆中的工作液體時，工作液 體溫度上升，且工作㈣紐絲汽m流經彎曲部 伤41及42 ’且流到熱管4a的平直部份43及熱i*4b的平直部 份44 。 . ° 流到熱官4a的平直部份43及熱管4b的平直部份44的 蒸'飞進而由政熱片M(低溫組件)3冷卻且被液化。具體而 5 ’熱里攸流至熱管4a之平直部份43及熱管4b之平直部份 的’、、、八被傳導至以焊财介被連接至平直部份43盘44的 輻射片5及散熱片3ae因此，蒸汽凝結成工作液體。一 工作液體㈣壁流動，且藉由毛細f作料回 份45及46 。 現在將&述''種用於製造散熱器1的方法之-範例。 首先準備被切割有槽21及22的基板2。 另外’散熱片3a藉由， 以形成散熱片組3。 例如上述連接部份被彼此連接， 201122788 焊錫膏進而被施加至基板2及輻射片5，且基板2及輕射 片5被黏結至散熱片組3 »此時，焊錫膏也被施加至基板2中 的槽21與22，及輻射片5中的槽51與52。 熱管4a之平直部份45進而被裝入至基板2中的槽21 内’使得平直部份45之端部將延伸到槽21之另一側。熱管 4a之平直部份43被裝入至輻射片5的槽51内，使得平直部份 43之末端將到達槽51之另一側。另外’熱管扑之平直部份 46被裝入至基板2中的槽22内，使得平直部份46之末端將到 達槽22之另一側。熱管4b之平直部份44被裝入至輻射片5中 槽52内，使得平直部份44之末端將到達槽52之另一側。 在此狀態中，基板2及輻射片5由夾具固定（未示於圖 中），使得它們的位置不會移動。 之後，此等組件被置於一爐中以熔化焊錫膏。焊錫硬 化，所以基板2、散熱片組3、熱管4a及4b及輻射片5彼此 黏附。 藉由如此實施，散熱器1可被製造。 在所述散熱器1中，熱管4a及4b大體上被安排成與散熱 片3a平行。因此，散熱器1之散熱片安裝效率升高，且熱輻 射效率可被改良。 另外，凹口31被切割在散熱片3a上，且熱管4a上的彎 曲部份41及熱管4b上的彎曲部份42被安排在散熱片組3内。 因此，熱管4a及4b可藉由一簡單加工被埋置散熱片組3 中。因此’散熱器1可容易被製造。 具體而言，例如，熱管成直角向散熱片***。爲了將 10 201122788 散熱片配置成圍繞熱管中的彎曲部份周圍，需依據熱管中 的彎曲部份形狀在散熱片上穿孔。然而，在此情況中，需 要形狀與散熱片不同的穿孔。 在另一方面’在散熱器1中，兩種長度不同的散熱片3a 被準備。另外’每一散熱片3a是矩形的，所以其易於操作。 另外，熱管4a中的彎曲部份41及熱管4b中的弯曲部份 42被埋置散熱片組3中，所以散熱器1可被小型化。例如， 如果散熱器1被置於一單元中，空間可被節省。 另外，藉由大體上平行於散熱片3 a安排熱管4a及4b， 被切割凹口 31的散熱片3a之數目及凹口 31面積可被減小。 因此，熱輻射效率可被改良。 另外，槽21及22被切割在基板2上。熱管知之平直部份 45被裝入至槽21中，且熱管4b之平直部份46被裝入至槽22 中。槽51及52被切割在輻射片5上。熱管知之平直部份“被 裝入至槽51中，且熱管4b之平直部份44被裝入至槽兄中。 因此，不需要加工熱管4a的平直部份43與45及熱管仆 的平直部份44與46。散熱器丨可容易地被製造。另外，當散 熱器1被製造時’基板2中的槽21與22及輕射片5中的槽㈣ 52也用作***熱管4a及4b的導件。 在此實施例中，每一散熱片3a被安排在基板2之縱向 上。然而，每—散熱片3a可被安排在基幻之橫向上。在此 情況中，熱管4a及4b也被安排成平行於每_散熱片3a，這 就是說，在基板2之橫行上。 熱管數目不限 在此實施例中，熱管數目是二。然而 201122788 制於二。熱管數目可以是一或三或更多。 另外，在此實施例中，熱管乜及牝被安排成使得彎曲 部份41及42從前面看將與基板2成直角。然而，從前面看， 熱管4a及4b可被安排成使得彎曲部份41與42將與基板2形 成一非90°的確定角度。 另外，在此貫施例中，熱管4a之平直部份43與45及熱 管4b之平直部份44與46被安排成與每一散熱片3a平行。然 而，從散熱角度看，它們被安排成與每一散熱片3&成一角。 (修改） 第3圖繪示散熱器之一修改。 在一散熱器la中，熱管4a之一平直部份43及一熱管4b 之一平直部份44向外延伸。因此，散熱效率改良。各該平 直部份43及44被安排成與每一散熱片3&之縱向成一確定 角。如第3圖所示，一槽未被切割在一輻射片元中。平直部 份43及44接觸輻射片5a之頂部。平直部份43及44可被進一 步焊接至輻射片5a。 在此實施例中，槽21及22被切割在基板2上，且槽51及 52被切割在輻射片5上。熱管4a的平直部份43及45被分別裝 入至槽51及21中，且熱管4b之平直部份44及46被分別裝入 至槽52及22中。然而，例如，熱管4a及4b可被埋置在基板2 與輻射片5中製造的貫孔中。在此情況中，熱管4a及4b可被 焊接至貫孔。 另外，不需要特別在輻射片5上切割一槽或一貫孔。僅 藉由將平直部份43及44焊接至輻射片5可獲得一效果。 12 201122788 另外’在此實施例中，熱管4a中彎曲部份41及熱管4b 中.f曲部份42之全部被安排在散熱片組3中。然而，彎曲部 份41及42之部份或全部可被安排在散熱片組3之外。藉由如 此實施’切割在散熱片3a中的凹口 31面積減少。 (應用） 現在將描述一風扇在其中被用於輻射熱量的範例。 第4圖繪示散熱器的一應用。 在第4圖所示應用中，未繪示一印刷板或一產熱元件。 第4圖繪示一冷卻系統10 ’包括一散熱器1、一外殼基 座11，及一風扇12。 外殼基座11包括一矩形片狀平面部份1丨丨及一彎曲與 平面部份111之一端成直角的側部112。 風扇12被安裝在側部112上。爲了送出一均勻量空氣， 在散熱器1與風扇12之間有某一程度空間。 風扇12從形成在側部112上的進氣口（開口）113吸入空 氣，且將空氣在散熱器1之散熱片3a方向上送出。一在相鄰 散熱片3a之間的空間形成一通風道。從風扇12送出的空氣 沿該通風道流動，且從與風扇12相對的一散熱片3之一側流出。 即使利用冷卻系統10的風扇12與散熱器1之間的空間 將部份或全部的彎曲部份41及42安排在散熱片組3之外 側，部份或全部的彎曲部份41及42之被容置在散熱器1與風 扇12之間的空間中。因此，不切割凹口 31或減少凹口 31面 積是可能的。 依據所揭露之散熱器，在一有限空間中熱輻射效率可 13 201122788201122788 VI. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The invention disclosed herein relates to a heat sink. [Prior Art 3] BACKGROUND OF THE INVENTION A heat sink for dissipating heat radiated from a heat generating source of a product such as a CPU (Central Processing Unit) or a switching element is conventional. In many products equipped with heat sinks, the space of a heat sink is limited. In addition, for example, there has been an increase in the CPU speed or the switching speed of the switching element, so the amount of heat that is lightly radiated from the heat generating source also continues to increase. Therefore, attempts have been made to improve the heat radiation efficiency in a limited space. A heat pipe for effectively conducting heat to the heat sink is included in a heat sink as one of the attempts. Figure 5 illustrates a heat sink including a heat pipe. A heat sink 90 includes two substrates 91 opposed to each other, and a plurality of sheet-shaped heat radiating fins 92 are arranged between the substrates 91 at right angles to the surfaces of the opposite substrates 91. The parallel portion 94 of each U-shaped heat pipe 93 shown in Fig. 5 is inserted into the through hole 95. The parallel portions 94 of the two heat pipes 93 are fitted into the constant holes 95 from both sides, and the ends of the parallel portions 94 are in contact with each other in the middle of the through holes 95. Japanese Patent Laid-Open Publication No. 11-145354. In the structure shown in Fig. 5, the connecting portion 96 between the two substrates 91 protrudes from the main body. However, the heat sink is not arranged around the connecting portion 96, so the heat radiation space around these portions of 201122788 is useless. [Sun and Moon Invention Summary] The present invention has been completed under the above background circumstances. It is an object of the present invention to provide a heat sink that is capable of improving the space efficiency of thermal radiation. In accordance with the present invention, a heat sink is provided, including a base, and a plurality of heat radiating fins disposed at a right angle to the base at a right angle to the heat dissipation of the y _ _ _ _ Arranged to be the same as the plural number of tablets ... sheet #1 from the money seat to conduct heat to the plurality of heat sinks, and bit > i on the heat sink group ' and thermally connected to the plurality of heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a heat sink according to an embodiment; FIG. 2 is an exploded view of the heat sink; FIG. 3 is a modification of the heat sink; One application of the heat sink; Figure 5 shows a heat sink including a heat pipe. C Embodiment 3 Detailed Description of Preferred Embodiment An embodiment will now be described in detail with reference to the accompanying drawings. Figure 1 is a perspective view of a heat sink in accordance with an embodiment. A heat sink (radiator) 1 according to an embodiment comprises a substrate (heating sheet) 2, a heat sink group 3, heat pipes 4a and 4b' and a radiation sheet 5. The substrate 2 is rectangular. 4 201122788 Two grooves 21 and 22 parallel to one side 2a of the substrate 2 are determined to be cut away from each other on the substrate 2. A portion of the heat pipe 4a is in contact with the groove 21 with the intervening solder. One portion of the heat pipe 4b is in contact with the groove 22 with the intervening solder. Further, a surface of the substrate 2 opposite to the surface on which the fin group 3 is disposed is brought into contact with a heat generating source (not shown) by a heat conducting member such as grease or a heat sheet. For example, a semiconductor wafer such as a CPU, a switching element, a resistive element, or a semiconductor package including them is a heat generating source. Further, the substrate 2 is made of copper 'aluminum or the like. If the substrate 2 is made of aluminum, a heat pipe (not a heat pipe and a servant) can be buried in the substrate 2 for heat dissipation. The heat sink group 3 is disposed on the substrate 2 with an intermediate solder. The heat sink group 3 includes a plurality of heat sinks 3a. Each of the fins 3a has a sheet shape. The plurality of heat sinks are arranged to be at right angles to the substrate 2. There is a certain distance between the adjacent fins 3a, and each of the fins 3& is regularly arranged to be parallel to the other fins 3a. In addition, each of the fins 3a is arranged such that its longitudinal direction will be equal to the longitudinal direction of the substrate 2. The length of the political heat sheet group 3 (each length of the heat sink 3) is longer than its width. Each of the fins 3a is made of aluminum, steel or the like. For example, each heat sink 3a may have a connecting portion (not shown) connected to $-heating #3a. The heat sink # 33 can be connected to each other by such a connecting portion. The heat pipes 4a and 4b are arranged in the heat sink group 3. 201122788 The radiation sheet 5 is placed opposite the substrate 2 so that it will cover most of the top of the heat sink group 3. That is to say, the heat sink 1 has a structure (referred to as a sandwich structure) in which the heat sink group 3 is placed between the substrate 2 and the radiation sheet 5. In Fig. 1, the longitudinal length of the radiation sheet 5 is slightly shorter than the longitudinal length of the heat sink group 3. The radiation sheet 5, the heat sink group 3, and the heat pipes 4a and 4b are thermally connected to each other. The function of the radiation sheet 5 is not only to transfer heat conducted from the heat pipes 4 and 4b to each of the heat sinks 3a of the heat sink group 3, but also to directly radiate heat conducted from the heat pipes 4a and 4b into the air. The radiation sheet 5 is made of copper, aluminum or the like. If the radiation sheet 5 is made of aluminum, a heat pipe (not the heat pipes 4a and 4b) can be buried in the radiation sheet 5 for heat dissipation. Figure 2 is an exploded view of the heat sink. Each of the heat pipes 4a and 4b has a main body having a letter "u" type and made of a metal such as copper. The body is tubular. The main body end of the letter "U" is closed and the body is airtight. The cores each having a porous substance or slot are arranged on the inner wall of the body. A small amount of liquid (working fluid) is sealed within the body. Pure water, oxygen water, fluorine gas-alternative materials, or the like are used as a working liquid. The cross-sectional shape of each of the heat pipes 4a and 4b is not particularly limited. The cross-sectional shape of each of the heat pipes 4a and 4b may be circular, elliptical or flat. If the difficult shape of each of the heat pipes 4a and 4b is flat, it is easy to handle. Further, if the cross-sectional shape of each of the heat pipe fields is flat, the substrates 2 and 6 201122788 radiation sheets 5 can be made thinner. Therefore, the heat sink 1 can be miniaturized. Further, in accordance with the shape of a curved portion 41 of the heat pipe 4a and a curved portion 42 of the heat pipe 4b, the recess 31 is cut in a portion of the plurality of fins 3a included in the heat sink group 3. In other words, the longitudinal length of the fins 3a on which the notches 31 are cut is shorter than the longitudinal length of the other fins 3a. As shown in Fig. 1, the heat pipes 4a and 4b are arranged such that the curved portions 41 and 42 are viewed from the starting point of the arrow A drawn along the side 2a (as viewed from the front) at a right angle to the substrate 2. That is to say, the curved portion 41 in the heat pipe 4a and the curved portion 42 in the heat pipe 4b are arranged in parallel to each of the fins 3a. Further, the curved portion 41 is arranged between the heat radiating fins 3a in the heat pipe 4a. Between the curved portion 41 of the heat pipe 4a and the fin 3a adjacent thereto, and between the curved portion 42 of the heat pipe 4b and the fin 3a adjacent thereto, there is a space of about 2 mm to allow air to flow. The flat portions 43 and 45 of the heat official 4a and the flat portions 44 and 46 of the heat pipe 4b are arranged in the longitudinal direction of each of the fins 3a. When the heat sink 1 is assembled, the flat portions 43 and 45 of the heat pipe 4a are disposed at the longitudinal end portions 32 of the fins 3a of the cut recess 31. Further, the ends of the flat portions 44 and 46 of the heat pipe 4b are placed at the longitudinal end portions 32 of the fins 3a of the cut recess 31. A substantial reduction in the number of fins 3a caused by the cutting recess 31 will be described. For example, suppose that the heat sink 3a has a thickness of 0.5 mm, the heat sink 3aa2 mm is spaced apart from the female row, the heat pipes 4a and 4b have a diameter of 6 mm, and the curved portions 41 and 42 have a curvature of half a 疋15 mm and a straight portion. The length of shares 43, 44, 45 and 46 201122788 is 60 mm. As described above, the inner wall of each heat pipe has a minute structure, so the radius of curvature is limited. If the heat pipes 4a and 4b are 6 mm in diameter, the radius of curvature is limited to about 15 square meters. The radius of curvature is measured with the centerline of each heat pipe as a reference. The number of fins 3a of the cut recess 31 depends on the diameter of the heat pipe and the diameter of the servant. If the heat pipes 4a and 4b are arranged in the heat sink group 3, the number of the fins 3a of the cut recess 31 for each heat pipe 4a and 4b' is 5 (= 1 mm (= 6 mm + 2 mm (space)) X2) / 2 mm). Therefore, the total number of fins 3a of the cut recess 31 is 1 〇. Further, the area of the recess 31 depends on the radius of curvature of the curved portions 41 and 42. In this example, a notch 31 occupies approximately 25 percent of the area of the entire heat sink 3a. Therefore, the reduction in the number of fins 3a in the entire fin group 3 caused by the cutting of the notches 31 in a part of the plurality of fins 3a is 2.5 (= l 〇 x 25 (%)). On the other hand, in Fig. 5, the curved portion 96 has a width of 18 mm (= 15 mm (curvature radius) + 6 mm/2). Therefore, about 7 fins (=18 mm / (2 mm (interval) + 〇.5 mm (thickness))) cannot be mounted on one side. That is to say, seven heat sinks cannot be installed in the conventional heat sink. However, the number of heat sink fins according to the present invention is only reduced by 2.5. If the number of heat pipes increases, the difference becomes smaller. However, the number of heat pipes that are usually used in the heat of a month is 2011. The heat-lighting mechanism of the heat sink 1 will now be described. When the heat sink 1 is used, the heat sink is placed such that a heat generating source will contact a nearly central portion of the substrate 2. First, heat is conducted from the heat generating source to the substrate 2. A portion of the heat conducted to the substrate 2 is conducted from the slot 21 to the flat portion of the heat pipe such as the flat portion 45 m. The heat transferred to the substrate 2 is conducted from the slot 22 to the flat portion 46 of the heat pipe 4b. Then, part of it is conducted to the substrate (4). Heat is directly conducted to the heat sink 3a. When the field heat is transmitted to the heat pipe 4& and the working liquid in the servant, the temperature of the working liquid rises, and the work (4) the wire steam m flows through the bending portion 41 and 42 ' and flows to the straight portion 43 of the heat pipe 4a and The flat part of the heat i*4b is 44. ° The steaming of the flat portion 43 of the heat official 4a and the flat portion 44 of the heat pipe 4b is further cooled by the political heat sheet M (low temperature component) 3 and liquefied. Specifically, the '', '8' of the flat portion 43 of the heat pipe 4a and the straight portion of the heat pipe 4b are transmitted to the radiation of the flat portion 43 of the flat portion 43 The sheet 5 and the fins 3ae thus, the steam condenses into a working liquid. A working liquid (4) wall flows and is returned by the capillary f to the portions 45 and 46. An example of a method for manufacturing the heat sink 1 will now be described. First, the substrate 2 on which the grooves 21 and 22 are cut is prepared. Further, the heat sink 3a is formed to form the heat sink group 3. For example, the above connecting portions are connected to each other, 201122788 solder paste is further applied to the substrate 2 and the radiation sheet 5, and the substrate 2 and the light projecting sheet 5 are bonded to the heat sink group 3 » At this time, the solder paste is also applied to the substrate 2 The grooves 21 and 22 in the middle, and the grooves 51 and 52 in the radiation sheet 5. The flat portion 45 of the heat pipe 4a is in turn loaded into the groove 21 in the substrate 2 so that the end of the straight portion 45 will extend to the other side of the groove 21. The flat portion 43 of the heat pipe 4a is fitted into the groove 51 of the radiation sheet 5 so that the end of the flat portion 43 will reach the other side of the groove 51. Further, the flat portion 46 of the heat pipe is loaded into the groove 22 in the substrate 2 such that the end of the straight portion 46 will reach the other side of the groove 22. The flat portion 44 of the heat pipe 4b is loaded into the groove 52 in the radiation sheet 5 such that the end of the flat portion 44 will reach the other side of the groove 52. In this state, the substrate 2 and the radiation sheet 5 are fixed by a jig (not shown) so that their positions do not move. Thereafter, the components are placed in a furnace to melt the solder paste. Since the solder is hardened, the substrate 2, the heat sink group 3, the heat pipes 4a and 4b, and the radiation sheet 5 adhere to each other. By doing so, the heat sink 1 can be manufactured. In the heat sink 1, the heat pipes 4a and 4b are arranged substantially in parallel with the heat sink 3a. Therefore, the heat sink mounting efficiency of the heat sink 1 is increased, and the heat radiation efficiency can be improved. Further, the notch 31 is cut on the heat sink 3a, and the curved portion 41 on the heat pipe 4a and the curved portion 42 on the heat pipe 4b are arranged in the heat sink group 3. Therefore, the heat pipes 4a and 4b can be buried in the heat sink group 3 by a simple process. Therefore, the heat sink 1 can be easily manufactured. Specifically, for example, the heat pipe is inserted at a right angle to the heat sink. In order to arrange the 10 201122788 heat sink around the curved portion of the heat pipe, it is necessary to perforate the heat sink according to the shape of the curved portion in the heat pipe. However, in this case, a perforation having a shape different from that of the heat sink is required. On the other hand, in the heat sink 1, two fins 3a of different lengths are prepared. Further, each of the fins 3a is rectangular, so that it is easy to handle. Further, the curved portion 41 in the heat pipe 4a and the curved portion 42 in the heat pipe 4b are buried in the heat sink group 3, so that the heat sink 1 can be miniaturized. For example, if the heat sink 1 is placed in a unit, space can be saved. Further, by arranging the heat pipes 4a and 4b substantially in parallel with the fins 3a, the number of fins 3a of the cut recess 31 and the area of the recess 31 can be reduced. Therefore, the heat radiation efficiency can be improved. In addition, the grooves 21 and 22 are cut on the substrate 2. The heat pipe knows that the straight portion 45 is fitted into the groove 21, and the flat portion 46 of the heat pipe 4b is loaded into the groove 22. The grooves 51 and 52 are cut on the radiation sheet 5. The heat pipe knows that the straight portion is "inserted into the groove 51, and the flat portion 44 of the heat pipe 4b is loaded into the groove brother. Therefore, it is not necessary to process the flat portions 43 and 45 of the heat pipe 4a and the heat pipe servant. The flat portions 44 and 46. The heat sink can be easily fabricated. In addition, when the heat sink 1 is manufactured, the grooves 21 and 22 in the substrate 2 and the grooves (four) 52 in the light projecting piece 5 are also used as insertions. The guides of the heat pipes 4a and 4b. In this embodiment, each of the fins 3a is arranged in the longitudinal direction of the substrate 2. However, each of the fins 3a may be arranged in the lateral direction of the base illusion. In this case, The heat pipes 4a and 4b are also arranged to be parallel to each of the fins 3a, that is, on the traverse of the substrate 2. The number of heat pipes is not limited to this embodiment, and the number of heat pipes is two. However, the number of heat pipes is two in 201122788. In addition, in this embodiment, the heat pipes 牝 and 牝 are arranged such that the curved portions 41 and 42 will be at right angles to the substrate 2 as viewed from the front. However, from the front, the heat pipes 4a and 4b can be arranged such that the curved portions 41 and 42 will form a defined angle of non-90 with the substrate 2. In this embodiment, the flat portions 43 and 45 of the heat pipe 4a and the flat portions 44 and 46 of the heat pipe 4b are arranged in parallel with each of the fins 3a. However, from the viewpoint of heat dissipation, they are arranged A corner of each heat sink 3 & (modified) Figure 3 shows a modification of the heat sink. In a heat sink la, one of the straight portion 43 of the heat pipe 4a and a flat portion of a heat pipe 4b 44 extends outwardly. Therefore, the heat dissipation efficiency is improved. Each of the flat portions 43 and 44 is arranged at a certain angle with the longitudinal direction of each of the fins 3 & as shown in Fig. 3, a slot is not cut in one In the radiation chip, the flat portions 43 and 44 contact the top of the radiation sheet 5a. The flat portions 43 and 44 can be further welded to the radiation sheet 5a. In this embodiment, the grooves 21 and 22 are cut on the substrate 2 Upper, and the grooves 51 and 52 are cut on the radiation sheet 5. The flat portions 43 and 45 of the heat pipe 4a are respectively inserted into the grooves 51 and 21, and the flat portions 44 and 46 of the heat pipe 4b are separately mounted. Into the slots 52 and 22. However, for example, the heat pipes 4a and 4b may be embedded in the through holes made in the substrate 2 and the radiation sheet 5. In this case, the heat pipes 4 A and 4b can be welded to the through holes. Further, it is not necessary to cut a groove or a uniform hole particularly on the radiation sheet 5. An effect can be obtained only by welding the flat portions 43 and 44 to the radiation sheet 5. 12 201122788 In addition, in this embodiment, all of the curved portion 41 of the heat pipe 4a and the curved portion 42 of the heat pipe 4b are arranged in the heat sink group 3. However, part or all of the curved portions 41 and 42 may be It is arranged outside the heat sink group 3. By thus performing the 'cutting of the recess 31 in the heat sink 3a, the area is reduced. (Application) An example in which a fan is used for radiating heat will now be described. Figure 4 illustrates an application of the heat sink. In the application shown in Fig. 4, a printing plate or a heat generating member is not shown. Figure 4 illustrates a cooling system 10' including a heat sink 1, a housing base 11, and a fan 12. The housing base 11 includes a rectangular sheet-like planar portion 1 and a side portion 112 which is bent at right angles to one end of the planar portion 111. The fan 12 is mounted on the side portion 112. In order to deliver a uniform amount of air, there is a certain amount of space between the radiator 1 and the fan 12. The fan 12 draws in air from an intake port (opening) 113 formed in the side portion 112, and sends the air in the direction of the fin 3a of the radiator 1. A space is formed in the space between adjacent fins 3a. Air sent from the fan 12 flows along the air passage and flows out from one side of a heat sink 3 opposite to the fan 12. Even if some or all of the curved portions 41 and 42 are arranged on the outer side of the heat sink group 3 by the space between the fan 12 of the cooling system 10 and the heat sink 1, some or all of the curved portions 41 and 42 are It is accommodated in the space between the radiator 1 and the fan 12. Therefore, it is possible to cut the notch 31 or reduce the area of the notch 31. According to the disclosed heat sink, the heat radiation efficiency in a limited space can be 13 201122788
被改良D 本文所述全部範例及條件語言是意欲供作教示 幫助閱讀者理解本發明及發明人所提供之改進該:二的， 念，且被理解成不限制此等特別闡述的範例及條件藝的概 書中此諸範例的組織也與展現發明的優勢與劣勢無說月 然本發明之實施例已被詳細描述，應理解可對兮（等）^ 雖 作各種改變、替換及更改，而不違背本發明之精神及 【圖式簡單說明】 第1圖是依據一實施例，一散熱器之透視圖 第2圖是該散熱器之一分解圖； 第3圖繪示該散熱器之一修改； 第4圖繪示該散熱器之一應用； 第5圖繪示一包括熱管之散熱器。 【主要元件符號說明】 1、la…散熱器 21、22、51、52... 2…基板 31.·.凹口 2a…基板之一側 32…端部 3…散熱片組 41、42.·.彎曲部份 3a…散熱片 43〜46···平直部份 4a、4b…熱管 111…平面部份 5、5a…幸1射片 112…側部 10…冷卻系統 I13…進氣口 11…外殼基座 A…箭頭 12…風扇 14MODIFIED D All of the examples and conditional language described herein are intended to be used as a teaching to assist the reader in understanding the invention and the improvements provided by the inventor: and are not to be construed as limiting the particular examples and conditions. The organization of these examples in the book of art also shows the advantages and disadvantages of the invention. The embodiments of the present invention have been described in detail, and it should be understood that various changes, substitutions and alterations may be made to 兮(etc.)^. Without departing from the spirit and scope of the invention, FIG. 1 is a perspective view of a heat sink according to an embodiment. FIG. 2 is an exploded view of the heat sink; A modification; FIG. 4 illustrates one application of the heat sink; and FIG. 5 illustrates a heat sink including a heat pipe. [Description of main component symbols] 1. la... heatsink 21, 22, 51, 52... 2... substrate 31.. recess 2a... one side of the substrate 32... end 3... heat sink group 41, 42. ·Bending part 3a...heat sink 43~46···straight part 4a,4b...heat pipe 111...plane part 5,5a...fortunately 1 shot 112...side 10...cooling system I13...air inlet 11...shell base A...arrow 12...fan 14