TW201115676A - Substrate positioning apparatus and method of positioning substrate using the same - Google Patents

Substrate positioning apparatus and method of positioning substrate using the same Download PDF

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Publication number
TW201115676A
TW201115676A TW098144948A TW98144948A TW201115676A TW 201115676 A TW201115676 A TW 201115676A TW 098144948 A TW098144948 A TW 098144948A TW 98144948 A TW98144948 A TW 98144948A TW 201115676 A TW201115676 A TW 201115676A
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Taiwan
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substrate
pad
unit
platform
perforation
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TW098144948A
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Chinese (zh)
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Jong-Hyoun Park
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Top Eng Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)

Abstract

Disclosed herein are a substrate positioning apparatus and a method of positioning a substrate using the apparatus. The substrate positioning apparatus includes a substrate position adjustment unit which is provided on a stage onto which the substrate is placed. The substrate position adjustment unit moves the substrate in the horizontal direction or rotates the substrate. Therefore, the present invention can reduce the drive force required to position the substrate and can precisely and easily position the substrate, compared to the conventional technique in which the entirety of the stage moves to position the substrate.

Description

201115676 六、發明說明: 【發明所屬之技術領域】 本發明關於安裝於處理基板之機器中的基板定位裝 置’以定位放置於平台上之基板,以及利用此基板定位寰置 定位基板之方法。 【先前技術】 ^ 一般而言’平面板顯示器(FPDs)是比傳統使用陰極射線 管(Braun tubes)的電視或監視器還輕薄的影像顯示裝置。已 開發使用的平面板顯示器的代表性範例為液晶顯示器 (LCDs)、電漿顯示面板(pDPs)、場發射顯示器(FEDs)、以及 有機發光二極體(OLEDs)。 液晶顯示器為根據影像資訊個別供應資料訊號到矩陣 配置的液晶胞的顯示器,因此控制液晶胞的光透射率,而顯 示所需影像。由於液晶顯示器輕又薄並具有其他包含低功率 请耗與低操作電壓之優點,所以廣為使用。製造用於液晶顯 示器之液晶面板的典型方法將說明如下。 +首先,彩色濾光片與共用電極形成於上基板上。之後, 薄膜電晶體(TFT)及晝素電極形成於面對上基板的下基板 上。接著,配向層分別塗佈於上基板及下基板。而後,配向 層摩擦以提供待形成於配向層間的液晶層中之液晶分子預 傾角及配向方向。 之後,藉由塗佈膠於至少一基板而形成膠圖案,以維持 201115676 基板間的_,避免液晶茂漏並密封基板_空間 形成液晶層於基板之間,因而完成液晶面板。 ’ 上。錄躺⑽祕_於基板 單元、二;具有卿之喷嘴之頭 缝ί形案基板均,塗軸㈣絲射嘴間之相 塗滕媳舰乂 ’當從喷嘴排出刺基板㈣成膠圖案時, 動頭早元之嘴嘴於ζ軸方向,即垂直方向,以二 =:嘴方:基:r:以及移動喷嘴及/或‘ 方疋轉基板或移動基板於水平方向來實施。 ’、曰 上的知技術巾’必織轉或移祕基板放置於其 =整^平。於水平方向,來旋轉或軸基板於水平方向。 mi 的架構非常複雜,且需要相當大的驅動力來 上之=中尤其 在平台相當大而可放置大面積基板於平台 t案例中’上述的缺點變得更顯著。如此-來,若精禮地 ==型平台變得更困難,則不能精確又輕易地執行 【發明内容】 題,本發明 因此’本發明有鑑於上述先前技術發生的問 201115676 之-目的在於提供可精確又㈣地定位基板之基板定位裝 置,以及利用此基板定位裝置定位基板之方法。 於一觀點,本發明提供一種基板定位裝置,包含:平台, 具有一或更多穿孔;基板位置調整單元,具有與平台上放置 之,板接觸的墊;提升墊之墊提升單元;以及旋轉墊之墊旋 轉單元;以及供氣單元,與平台之穿孔相通,以供應氣 穿孔。 再者,基板位置調整單元可更包含墊移動單元,移動墊 於水平方向。 於另一方面,本發明提供一種基板定位裝置,包含:平 台,具有一或更多穿孔;基板位置調整單元,具有與平台上 放置之基板接觸之墊;提升墊之墊提升單元;以及移動墊於 水平方向之墊移動單元;以及供氣單元,與平台之穿孔相 通’以供應氣體到穿孔。 〜 基板位置調整單元可包含複數基板位置調整單元,提供 於平台上。 八 墊移動單元可包含第一墊移動單元,移動墊於第一方 向;以及第二墊移動單元,移動墊於垂直於第一方向之第二 方向。 再者,通孔可形成於墊中 相通’以透過通孔吸氣。 ’以及吸氣單元可與墊之通孔 201115676 此外,基板定位裝置可更包含排氣單元,與平台之穿孔 相通,以透過穿孔排出氣體。 於又一觀點,本發明提供一種利用基板定位裝置定位基 板之方法’此基板定位裝置包含平台,具有一或更多穿孔; 基板位置調整單元’具有與平台上放置之基板接觸之墊;提 =墊之墊提升單元;娜墊之塾旋轉單元;以及移動塾於水 平方向之塾移動單元;以及供氣單元,與平台之穿孔相通, 以供應氣體到穿孔,此方法包含以·^驟…)放置基板於平 口上’(b)利用墊提升單元提升基板;⑷附接基板於墊之上 表面;.⑷自平台升高基板,以從供氣單元供應氣體到平台之 穿孔,以及(e)調整基板之位置,以利用墊旋轉單元旋轉基 板,或利用墊移動單元移動墊於水平方向。 步驟(b)可在步驟(a)之前執行。 再者’通孔可形成於塾中。吸氣單元可與塾之通孔相 通,以透過通孔吸氣。步驟⑹可包含透過墊之通孔,將氣體 吸入吸氣單元之步驟,以利収力附接基板於塾之上表面。 於根據本發明之基板定位裳置中,可利用提供於平台上 之基_置調整單元,藉由旋轉或移動基板於水平方向,來 定位基板。因此,她於f知技術,本發明可降蚊位基板 所需的驅動力,並可簡化裝置的結構。 【實施方式】 於後將參考伴隨圖式詳細說明根據本發明定位基板之 201115676 裝置及方法之較佳實施例。 【第一實施例】 參考圖1至圖6所示’以下將說明根據本發明第—實施 例之基板定位裝置。 & 如圖1至圖4所示,根據本發明第一實施例之基板定位 裝置包含平台1〇、基板位置調整單元20、以及供氣^元1〇。 平台10具有一或更多穿孔11於其中。基板s安置於平台 10上。基板位置調整單元20設置於平台1〇上,並水平二 動安置於平台1〇上之基板S。供氣單元3〇與平台1〇之穿 孔11相通,並供應氣體到穿孔U。再者,基板定位裝置更 包含排氣單元40,其與平台10之穿孔u相通,並透過穿 孔11排出氣體,而利用吸力將基板S附接到平台丨〇。 如圖1所示,至少一個基板位置調整單元2〇提供於平 台10上。如圖3及圖4所示,基板位置調整單元2〇包含與 基板s接觸之塾2卜提升墊21之墊提升單元22、以^ 墊21於水平方向之墊移動單元μ。 一如圆5所示’一或更多的通孔211形成於塾η中。吸 通孔211相通,以透過通孔211吸氣。於具有 ί ^ ί 置触單元2G中,藉由吸氣單元50的操 = 3Γ=211吸出,而使基板S可藉由吸力可靠地 寸接到塾21的上表面。於此,通211彎曲 使其具有區域是對應墊21上表面。 201115676 如圖3所示,墊提升單元22包含氣缸(cylinder)221以 致動彳干222。氣缸221藉由液壓或氣壓操作。致動桿 連接氣缸221到墊21。根據本發明之墊提升單元22不限於 包含氣缸221及致動桿222的結構,只要可向上提升墊 $種結構可細於墊提升單元22,例如連接旋轉馬達的 ’哀,螺桿結構,或利用線性馬達的結構。墊提升單元22用 ^提升墊21 ’而當調整基板S的位置時,使得基板s與墊 的上表面接觸。當完成基板s的位置調整時,墊提升單 兀22向下移動墊21,而使墊21自基板s移開。 .如圖3及圖4所示,墊移動單元23包含支撐墊提升單 =2之下部於其上的支樓構件231、連接支撐構件231的 澴珠螺桿232、以及轉動滾珠螺桿232的旋轉馬達233。於 =有上述結構的墊移動單元23中,旋轉馬達233的旋轉運 =透過滾珠螺桿232轉換成雜運動。藉此線性地移動連接 :滾珠螺桿232的支撐構件231。此外,墊提升單元22藉 ^支樓構件231的線性運動而線性地移動。結果,塾21線 =地移動。同時,於本發明第一實施例中,雖然墊移動單元 顯不具有利用旋轉馬達233及滾珠螺桿幻2的結構來線 移動^構件231或墊提升單元22,但是本發明不限於 。/奐言之,只要可線性移動墊提升單元22,墊移動單元 可具有各種結構’例如線性馬達或藉由液壓或氣壓 =作的氣紅。再者’於第—實施例之基板定位裝置中,雖然 ^顯不使墊移動單元23移動墊提升單元22之方式來線 動’但是本發明不限於此結構,例如可組態成使塾移動 早元23直接連接墊21而直接移動塾21。 如圖2所示,供氣單元3〇包含供氣閥31以及正壓源 8 201115676 32=氣=連接^平台1G之穿孔11相通之流動通道12。 正壓源連接供氣閥31。為了執行基板s位置的調整,供 過:動通道12及穿孔11供應氣體於平台20及 基板s之間’因而從平台1G之上表面升高基板s。缺後, ,單元3G從平台10之上表面升高基板sr而消 除與平台10上表面之間的摩擦。因此,可輕易地i 灯基板s位置的調整。再者,可避㈣壞基板s。 裝窨^t二^所不’根據本發明第—實施例之基板定位 f置更^排乳單70 40。排氣單元4〇包含排氣閥41及負 氣閥41連接與平台⑴之穿孔11相通之流動通 k。負錢42連接排_ 4卜具有上述架構之排氣單元 40用於透過穿孔U及流動通道12將氣體從平台ι〇與基板 I間間排㈣外部,而在調整基板S位置之操作完成 後’藉由吸力使基板S附接到平台1G之上表^如此一來, 排氣單A4G傳騎吸力而輕純祕到平台 利用吸力將基板s附接到墊21之吸氣單元50,可連接 到利用吸力將基板S附接到平纟1G上表面之難單元4〇之 負壓源42。 於後’將參考圖6說明根據本發明第一實施例之基板定 位裝置之操作。 當基板S放置於平台1〇上時,提供鄰***台】〇之偵測 裝置(例如相機或位置感測器),量測基板3是否放置在平台 10上的正確位置。若基板S設置在平台1〇上的正確位置,^ 201115676 則執行處理基板s之預定操作、然而,若基板s並未設置在 平台10上的正確位置,則執行調整基板s的操作。 為了雜基板S的位置,首先,基板位置調整單元2〇 的塾21藉由墊提升單元22向上移動。藉此,塾21的上表 面與基板s接觸。較佳地,在基板s放置於 置游單元可預先設置在其移動向^ ^此案例’當基衫放置在平台10上時,塾上 面可直接與基板S接觸。 乃诙伢有吸氣單元50之案例中,可透i 鱼塾二r吸氣單元5G的操作將氣體從基板 到塾部。因此,基板s可藉由吸細 丹考 動iim Λ 作㈣喊讀,供氣料3G透過3 此一穿孔11供應氣體於基板3與平台10之間。2 此,基板S從平台10上升。 之後,如圖6所示, 移動於水平方向。因此, 方向。 藉由墊移動單元21的操作,墊21 附接墊21之基板s也移動於水平 榻絲了絲s位置财 操作排氣單及吸氣單元料操作,同時或接! 台2〇 I基板S門夕 透過穿孔11及流動通道12將今 附接於平台1〇二公體排出到外部’而利用吸力使基板: 面。 201115676 如上所述,於根據本發明第一實施例之基板定位裝置 中,可利用提供於平台10上之基板位置調整單元2〇,藉由 水平移動基板S,而調整基板S的位置。因此,相較於習知 移動整個平台來定位基板之技術,本發明可降低定位基板S 所需的驅動力,且可簡化裝置結構。 【第二實施例】 於後,參考圖7及圖8詳細說明根據本發明第二實施例 之基板疋位裝置。於以下第二實施例之說明中,相同.的參考 符號用以表示與第一實施例對應的元件,並省略進一步的說 明。 ° 如圖7所示,於根據本發明第二實施例之基板定位裝置 :二基板位置調整單元2〇之墊移動單元23包含第一墊移動 單兀234 ’移動塾21於第一方向a,以及第二墊移動單元 235移動塾21於第工方向卜其中第三方向b垂直於第一 方向A。於與第一實施例相同的方式,第-塾移動單元234 及第-塾移動單元235各包含支撐墊提升單元Μ之下部之 232 ' n也 乏奴轉馬達233。只要可線性移動墊提升單 弓達及疋23可具有各種結構,^'可包含例如線性 馬違及藉由雜錢縣作的氣缸。 高美述結構之第二實施射,從平台ig上表面升 調整基板S位置的操作時,如圖8所示,附201115676 VI. Description of the Invention: Field of the Invention The present invention relates to a substrate positioning device mounted in a machine for processing a substrate to position a substrate placed on the stage, and a method of positioning the substrate by using the substrate. [Prior Art] ^ Generally, flat panel displays (FPDs) are image display devices that are thinner than conventional televisions or monitors that use cathode ray tubes (Braun tubes). Representative examples of flat panel displays that have been developed for use are liquid crystal displays (LCDs), plasma display panels (pDPs), field emission displays (FEDs), and organic light emitting diodes (OLEDs). The liquid crystal display is a display of liquid crystal cells that are individually supplied with data signals according to image information to the matrix, thereby controlling the light transmittance of the liquid crystal cell and displaying the desired image. Since the liquid crystal display is light and thin and has other advantages including low power consumption and low operating voltage, it is widely used. A typical method of manufacturing a liquid crystal panel for a liquid crystal display will be described below. + First, a color filter and a common electrode are formed on the upper substrate. Thereafter, a thin film transistor (TFT) and a halogen electrode are formed on the lower substrate facing the upper substrate. Next, the alignment layers are applied to the upper substrate and the lower substrate, respectively. Then, the alignment layer is rubbed to provide a liquid crystal molecule pretilt angle and an alignment direction to be formed in the liquid crystal layer between the alignment layers. Thereafter, a glue pattern is formed by applying a glue to at least one of the substrates to maintain the gap between the substrates of 201115676, avoiding liquid crystal leakage and sealing the substrate_space to form a liquid crystal layer between the substrates, thereby completing the liquid crystal panel. On. Recording lying (10) secret _ on the substrate unit, two; with the head of the nozzle of the Qing ί ί 形 形 形 形 形 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 涂 形The mouth of the moving head is in the direction of the x-axis, that is, the vertical direction, and the second side is: the mouth: base: r: and the moving nozzle and/or the square-turning substrate or the moving substrate are implemented in the horizontal direction. ', the technical towel on the ’ will be woven or transferred to the substrate to be placed in the = flat. In the horizontal direction, rotate or the shaft substrate is in the horizontal direction. The architecture of mi is very complex and requires considerable driving force. In particular, the disadvantages of the above-mentioned disadvantages become more pronounced in the case where the platform is quite large and a large-area substrate can be placed in the platform. In this way, if the platform is more difficult, the subject matter cannot be accurately and easily performed, and the present invention is therefore in view of the above prior art problem 201115676 - the purpose is to provide A substrate positioning device capable of accurately and (4) positioning a substrate, and a method of positioning the substrate by using the substrate positioning device. In one aspect, the present invention provides a substrate positioning apparatus comprising: a platform having one or more perforations; a substrate position adjusting unit having a pad in contact with the plate placed on the platform; a pad lifting unit of the lifting pad; and a rotating pad a pad rotation unit; and a gas supply unit that communicates with the perforation of the platform to supply the perforation. Furthermore, the substrate position adjusting unit may further include a pad moving unit that moves in a horizontal direction. In another aspect, the present invention provides a substrate positioning apparatus comprising: a platform having one or more perforations; a substrate position adjusting unit having a pad in contact with a substrate placed on the platform; a pad lifting unit of the lifting pad; and a moving pad a pad moving unit in a horizontal direction; and a gas supply unit communicating with the perforation of the platform to supply gas to the perforations. ~ The substrate position adjustment unit can include a plurality of substrate position adjustment units that are provided on the platform. The eight-pad moving unit may include a first pad moving unit that moves the pad in the first direction; and a second pad moving unit that moves the pad in a second direction that is perpendicular to the first direction. Further, the through holes may be formed in the pad to communicate with each other to inhale through the through holes. And the through hole of the suction unit and the pad 201115676 In addition, the substrate positioning device may further comprise an exhaust unit communicating with the perforation of the platform to discharge the gas through the perforation. In another aspect, the present invention provides a method for positioning a substrate by using a substrate positioning device. The substrate positioning device includes a platform having one or more through holes. The substrate position adjusting unit has a pad that is in contact with the substrate placed on the platform. Pad pad lifting unit; Na pad rotation unit; and moving unit in the horizontal direction; and gas supply unit, communicating with the perforation of the platform to supply gas to the perforation, the method includes... Place the substrate on the flat port' (b) lift the substrate with the pad lifting unit; (4) attach the substrate to the upper surface of the pad; (4) raise the substrate from the platform to supply gas from the gas supply unit to the perforation of the platform, and (e) The position of the substrate is adjusted to rotate the substrate using the pad rotation unit, or the pad is moved in the horizontal direction by the pad moving unit. Step (b) can be performed before step (a). Furthermore, the through hole can be formed in the crucible. The suction unit can communicate with the through hole of the crucible to inhale through the through hole. The step (6) may include the step of sucking the gas into the getter unit through the through hole of the pad to facilitate the attachment of the substrate to the upper surface of the crucible. In the substrate positioning skirt according to the present invention, the substrate can be positioned by rotating or moving the substrate in the horizontal direction by using the substrate-adjusting unit provided on the stage. Therefore, she knows the driving force required for the mosquito-repellent substrate and simplifies the structure of the device. [Embodiment] A preferred embodiment of the apparatus and method for positioning a substrate according to the present invention will be described in detail below with reference to the accompanying drawings. [First Embodiment] Referring to Figs. 1 to 6, a substrate positioning apparatus according to a first embodiment of the present invention will be described below. As shown in FIGS. 1 to 4, the substrate positioning apparatus according to the first embodiment of the present invention includes a stage 1A, a substrate position adjusting unit 20, and a supply unit. The platform 10 has one or more perforations 11 therein. The substrate s is placed on the platform 10. The substrate position adjusting unit 20 is disposed on the platform 1 and is horizontally and horizontally disposed on the substrate S on the platform 1 . The gas supply unit 3 is in communication with the perforation 11 of the platform 1 and supplies gas to the perforations U. Further, the substrate positioning device further includes an exhaust unit 40 that communicates with the through hole u of the stage 10 and discharges the gas through the through hole 11, and attaches the substrate S to the stage 利用 by suction. As shown in Fig. 1, at least one substrate position adjusting unit 2 is provided on the platform 10. As shown in Figs. 3 and 4, the substrate position adjusting unit 2 includes a pad lifting unit 22 that is in contact with the substrate s, and a pad moving unit μ that is horizontally oriented with the pad 21. As shown by the circle 5, one or more through holes 211 are formed in the 塾n. The suction holes 211 communicate with each other to inhale through the through holes 211. In the illuminating unit 2G, the suction unit 50 is sucked out by the operation of the suction unit 50, so that the substrate S can be reliably received by the suction force to the upper surface of the crucible 21. Here, the pass 211 is bent so that the area thereof is the upper surface of the corresponding pad 21. 201115676 As shown in FIG. 3, the pad lifting unit 22 includes a cylinder 221 to actuate the spine 222. The cylinder 221 is operated by hydraulic or pneumatic pressure. The actuating lever connects the cylinder 221 to the pad 21. The pad lifting unit 22 according to the present invention is not limited to the structure including the cylinder 221 and the actuating lever 222, as long as the upward lifting pad can be made thinner than the pad lifting unit 22, for example, the connection of the rotating motor, the screw structure, or the utilization The structure of the linear motor. The pad lifting unit 22 uses the ^ lifting pad 21' to adjust the position of the substrate S such that the substrate s comes into contact with the upper surface of the pad. When the position adjustment of the substrate s is completed, the pad lifting unit 22 moves the pad 21 downward, and the pad 21 is removed from the substrate s. As shown in FIG. 3 and FIG. 4, the pad moving unit 23 includes a branch member 231 on which the lower portion of the support pad lifter = 2 is attached, a bead screw 232 that connects the support member 231, and a rotary motor that rotates the ball screw 232. 233. In the pad moving unit 23 having the above structure, the rotation of the rotary motor 233 is converted into a miscellaneous motion by the ball screw 232. Thereby, the connection member 231 of the ball screw 232 is linearly moved. Further, the pad lifting unit 22 linearly moves by the linear motion of the branch member 231. As a result, 塾21 line = ground movement. Meanwhile, in the first embodiment of the present invention, although the pad moving unit does not have the structure of the rotary motor 233 and the ball screw 2 to linearly move the member 231 or the pad lifting unit 22, the present invention is not limited thereto. / In other words, as long as the pad lifting unit 22 can be linearly moved, the pad moving unit can have various structures such as a linear motor or a gas red by hydraulic or pneumatic pressure. Further, in the substrate positioning device of the first embodiment, although the pad moving unit 23 is not moved in the manner of moving the pad lifting unit 22, the present invention is not limited to this configuration, and for example, can be configured to move the crucible. In the early element 23, the pad 21 is directly connected and the 塾 21 is directly moved. As shown in Fig. 2, the air supply unit 3 includes a supply passage 31 and a positive pressure source 8 201115676 32 = gas = connection channel 1G perforation 11 communicating with the flow passage 12. The positive pressure source is connected to the air supply valve 31. In order to perform the adjustment of the position of the substrate s, the movable passage 12 and the perforations 11 supply gas between the stage 20 and the substrate s, thereby raising the substrate s from the upper surface of the stage 1G. After the absence, the unit 3G raises the substrate sr from the upper surface of the stage 10 to eliminate friction with the upper surface of the stage 10. Therefore, the adjustment of the position of the lamp substrate s can be easily performed. Furthermore, it is possible to avoid (four) bad substrate s. The mounting position of the substrate according to the first embodiment of the present invention is set to f. The exhaust unit 4A includes an exhaust valve 41 and a negative valve 41 connected to a flow passage k communicating with the through hole 11 of the platform (1). The negative unit 42 is connected to the exhaust unit 40. The exhaust unit 40 having the above structure is used for arranging gas from the platform ι〇 and the substrate I through the through hole U and the flow channel 12, and after the operation of adjusting the position of the substrate S is completed. 'By attaching the substrate S to the upper surface of the platform 1G by suction, so that the exhaust single A4G transmits the suction force and is light and secret, and the platform attaches the substrate s to the suction unit 50 of the mat 21 by suction. It is connected to a negative pressure source 42 that attaches the substrate S to the upper surface of the flat plate 1G by suction. The operation of the substrate positioning device according to the first embodiment of the present invention will be described later with reference to FIG. When the substrate S is placed on the platform 1 , a proximity detecting device (for example, a camera or a position sensor) is provided to measure whether the substrate 3 is placed at the correct position on the platform 10. If the substrate S is placed at the correct position on the stage 1 ,, ^ 201115676 performs a predetermined operation of processing the substrate s, however, if the substrate s is not disposed at the correct position on the stage 10, the operation of adjusting the substrate s is performed. For the position of the miscellaneous substrate S, first, the crucible 21 of the substrate position adjusting unit 2 is moved upward by the pad lifting unit 22. Thereby, the upper surface of the crucible 21 is in contact with the substrate s. Preferably, the substrate s is placed in the navigation unit to be pre-set in its movement direction. When the base plate is placed on the platform 10, the upper surface of the crucible can be directly in contact with the substrate S. In the case of the suction unit 50, the gas can be supplied from the substrate to the crotch portion by the operation of the 5G suction unit 5G. Therefore, the substrate s can be read by the micro-improvement iim ( (4), and the gas supply 3G supplies gas between the substrate 3 and the stage 10 through the through hole 11. 2 Thus, the substrate S rises from the platform 10. Thereafter, as shown in FIG. 6, the movement is in the horizontal direction. Therefore, the direction. By the operation of the pad moving unit 21, the substrate s of the pad 21 attachment pad 21 is also moved to the horizontal tat wire s position to operate the exhaust sheet and the suction unit material operation, at the same time or connected! The substrate 2 〇 I substrate S is passed through the through hole 11 and the flow channel 12 to be attached to the platform 1 and the second body is discharged to the outside, and the substrate is made by suction. 201115676 As described above, in the substrate positioning apparatus according to the first embodiment of the present invention, the position of the substrate S can be adjusted by horizontally moving the substrate S by using the substrate position adjusting unit 2 provided on the stage 10. Therefore, the present invention can reduce the driving force required to position the substrate S and simplify the structure of the apparatus as compared with the conventional technique of moving the entire platform to position the substrate. [Second Embodiment] Hereinafter, a substrate clamping device according to a second embodiment of the present invention will be described in detail with reference to Figs. 7 and 8. In the following description of the second embodiment, the same reference numerals are used to denote the elements corresponding to the first embodiment, and further explanation is omitted. As shown in FIG. 7, in the substrate positioning device according to the second embodiment of the present invention, the pad moving unit 23 of the two-substrate position adjusting unit 2 includes a first pad moving unit 234' moving the 塾 21 in the first direction a, And the second pad moving unit 235 moves the 塾 21 in the working direction, wherein the third direction b is perpendicular to the first direction A. In the same manner as the first embodiment, the first-twist moving unit 234 and the first-twist moving unit 235 each include a lower portion 232'n of the support pad lifting unit 也. As long as the linearly movable pad lifting single bow and the cymbal 23 can have various structures, the '' can include, for example, a linear horse against a cylinder made by a miscellaneous money county. The second implementation of the high-profile structure, from the upper surface of the platform ig, the operation of adjusting the position of the substrate S, as shown in FIG.

SJSJ

摔作移動於第t面的基板8可藉由第一塾移動單元234的 ”多動於卓-方向A,以及可藉由第二墊移動單元况的I 201115676 操作移動於垂直第一方向A之第二方向B。 如上所述’於根據本發明第二實施例之基板定位裝置 中,墊21可移動於第一方向及垂直於第一方向之第二方 向。因此,可輕易地執行調整基板s位置的操作。 【第三實施例】 於後,參考圖9及圖1〇詳細說明根據本發明第三實施 例,基板定位裝置。於以下第三實施例之說明中,相同的參 考符號用以表示與第一實施例或第二實施例對應的元件,並 省略進一步的說明。 如圖9所示’於根據本發明第三實施例之基板定位裝置 中,基板位置調整單元2〇包含與基板s接觸之墊21、向上 移動墊21之墊提升單元22、以及旋轉墊21之墊旋轉單元 24 〇 墊旋轉單元24包含提供於墊提升單元21之旋轉馬達 241 ’以及將旋轉馬達241與墊21連接之旋轉軸2幻,而將 旋轉馬達241之驅動力傳輸到墊21。 於具有上述結構之第三實施例中,從平台1〇上表面升 高基板S後執行調整基板S位置的操作時,如圖1〇所示, 附接於墊21之上表面的基板s可藉由墊旋轉單元24的操作 旋轉。 如上所述’於根據本發明第三實施例之基板定位裝置 12 201115676 中’因為塾21可藉由墊旋轉單元24旋轉’換言之,因為基 板S可旋轉,因此可輕易地調整基板s的位置。 【第四實施例】 於後’參考圖11至圖16詳細說明根據本發明第四實施 例之基板定位裝置。於以下第四實施例之說明中,相同的參 考符號用以表示與第一實施例、第二實施例、或第三實施例 對應的元件,並省略進一步的說明。 如圖11所示,於根據本發明第四實施例之基板定位裝 置中,基板位置調整單元2〇包含與基板s接觸之墊21、向 上移動墊21之墊提升單元22、移動墊21於水平方向之墊 移動單元23、以及旋轉墊21之墊旋轉單元24。 於具有上述結構之第四實施例中,當執行調整基板3位 置的操作時,如圖12所示,附接於墊21之上表面的基板3 由塾移動單it 23移動於水平方向,以及可藉由墊旋轉 單tl 24賴作旋轉。因此,可精確地調整基板s的位置。 再者,墊移動單元23可包含第一墊移動單元 234,移 塾21於第-方向a,以及第二墊移動單元,移動塾 方向A之第二方向B ’與第二實施例相同的 式。_於此案例中,當執行調整基板s位置的操作時,如圖 12所示〃’基板S不僅可旋轉,也可以移動於第—方向A以 ,垂直第-方向A之第二方向B。因此,可更地調 板S的位置。 m 13 201115676 於此架構中’如圖15所示,藉由蒋動其 元20的墊21於第一方向a戋 :::置調整早 κ a 』八及第一方向B,基板S可移動於 /二安—方向Β。如此—來’在提供許多基板位置 =整早=2G的案例中,因為基板s支#於複數個支樓位置, 所以可更平順地執行基板s位置的調整。 同時’如® 16所示’―對基板位置調整單元20可提供 於平台10上。於此’兩個基板位置調整單元2〇中的一個徂 態成使其,21水平移動於第—方向或第二方向。兩個基板 位置調整單元2G其餘的-個組態成使其㈣旋轉而旋轉基 板S。=此案例,基板位置調整單元2〇執行旋轉運動的塾 21,可藉由旋轉馬達241的操作旋轉,或選替地,即使在閒 置狀態可藉由移動於第—方向或第二方向之基板位置調整 單兀20之墊21的運動來旋轉。 如上所述,於根據本發明第四實施例之基板定位裝置 中,當調整基板S的位置時,因為基板s不僅可移動於水平 方向,也可以旋轉,所以可輕易地又精確地執行調整基板s 位置的操作。 本發明實施例中所述的技術精神可獨立地實施或可以 各種組合實施。 再者,根據本發明之基板定位裝置不僅可應用於塗膠 14 201115676 機 【圖式簡單說明】 圖式;==;的其,、以及優點,結合伴隨 平面ξ,1為顯示根據本發明第—實施例之基板定位裝置之 示r之基板定位裝置之平台之截面圖; 侧視=為顯補1之基缺轉置之基板位置調整單元之 ξ4為顯示圖3之基板位置調整單元之平面圖; 圖ίίί23之基板位置調整單元之整之示意圖; 作之=為圖顯相1之基板定位裝置之基板位置調整單元操 基板第二實施例之基板定位裝置之 作之顯示圖7之基板定位裝置之基板位置調整單元操 基板=置9調為發圖明第三實施例之基板定位裝置之 操作=0意為^示圖9之基板定位裝置之基板位置調整單元 基板細實施例之基缺位裝置之 單元為圖11之基板定位裝置之基板位置調整 201115676 圖14為顯示圖11之基板定位裝置之平台之平面圖;以 及 圖15及圖16為圖14之基板定位裝置之基板位置調整 單元操作之示意圖。 【主要元件符號說明】 10平台 11穿孔 12流動通道 20基板位置調整單元 21墊 22墊提升單元 23墊移動單元 24塾旋轉單元 30供氣單元 31供氣閥 32正壓源 40排氣單元 41排氣閥 42負壓源 50吸氣單元 211通孔 221氣缸 222致動桿 231支撐構件 232滾珠螺桿 233旋轉馬達 234第一墊移動單元 16 201115676 235第二墊移動單元 241旋轉馬達 242旋轉軸 A第一方向 B第二方向 S基板 17The substrate 8 that is moved to the t-th surface can be moved in the vertical first direction A by the "multiple motion-to-direction A" of the first cymbal moving unit 234 and the I 201115676 operation by the second pad moving unit condition. The second direction B. As described above, in the substrate positioning apparatus according to the second embodiment of the present invention, the pad 21 is movable in the first direction and in the second direction perpendicular to the first direction. Therefore, the adjustment can be easily performed. [Third Embodiment] Hereinafter, a substrate positioning device according to a third embodiment of the present invention will be described in detail with reference to Fig. 9 and Fig. 1. In the following description of the third embodiment, the same reference numerals are used. The components corresponding to the first embodiment or the second embodiment are used to omit further explanation. As shown in FIG. 9 , in the substrate positioning device according to the third embodiment of the present invention, the substrate position adjusting unit 2 includes The pad 21 in contact with the substrate s, the pad lifting unit 22 that moves the pad 21 upward, and the pad rotation unit 24 of the rotating pad 21, the pad rotating unit 24 includes a rotary motor 241' provided to the pad lifting unit 21, and a rotating horse The rotating shaft 2 connected to the pad 21 is phantom, and the driving force of the rotating motor 241 is transmitted to the pad 21. In the third embodiment having the above structure, the substrate S is adjusted after the substrate S is raised from the upper surface of the stage 1〇. In the operation of the position, as shown in FIG. 1A, the substrate s attached to the upper surface of the pad 21 can be rotated by the operation of the pad rotating unit 24. As described above, the substrate positioning device according to the third embodiment of the present invention 12 201115676 "Because the cymbal 21 can be rotated by the pad rotation unit 24" In other words, since the substrate S can be rotated, the position of the substrate s can be easily adjusted. [Fourth Embodiment] Hereinafter, reference is made to FIGS. 11 to 16 in detail. A substrate positioning device according to a fourth embodiment of the present invention is explained. In the following description of the fourth embodiment, the same reference numerals are used to denote elements corresponding to the first embodiment, the second embodiment, or the third embodiment. In the substrate positioning device according to the fourth embodiment of the present invention, the substrate position adjusting unit 2 includes a pad 21 that is in contact with the substrate s, and a pad lift that moves the pad 21 upward. The element 22, the pad moving unit 23 of the moving pad 21 in the horizontal direction, and the pad rotating unit 24 of the rotating pad 21. In the fourth embodiment having the above structure, when the operation of adjusting the position of the substrate 3 is performed, as shown in FIG. It is shown that the substrate 3 attached to the upper surface of the pad 21 is moved in the horizontal direction by the 塾 moving single it 23, and can be rotated by the pad rotation unit t12. Therefore, the position of the substrate s can be precisely adjusted. The pad moving unit 23 may include a first pad moving unit 234, the movement 21 in the first direction a, and the second pad moving unit, and the second direction B' of the movement direction A is the same as that of the second embodiment. In this case, when the operation of adjusting the position of the substrate s is performed, as shown in FIG. 12, the substrate S can be rotated not only in the first direction A but also in the second direction B in the first direction A. Therefore, the position of the board S can be adjusted more. m 13 201115676 In this architecture, as shown in FIG. 15 , the substrate S can be moved by the pad 21 of the Jiang Dongyuan 20 in the first direction a戋::: adjusting the early κ a 』8 and the first direction B. In / 2 An - direction Β. In this case, in the case where a plurality of substrate positions = early morning = 2 G are provided, since the substrate s is branched at a plurality of branch positions, the adjustment of the position of the substrate s can be performed more smoothly. At the same time, as shown in Fig. 16, the substrate position adjusting unit 20 can be provided on the stage 10. Here, one of the two substrate position adjusting units 2 is configured such that 21 moves horizontally in the first direction or the second direction. The remaining ones of the two substrate position adjusting units 2G are configured such that they rotate (4) to rotate the substrate S. In this case, the substrate position adjusting unit 2 performs the rotational movement of the crucible 21, can be rotated by the operation of the rotary motor 241, or alternatively, can be moved by the substrate in the first direction or the second direction even in an idle state. The movement of the pad 21 of the position adjustment unit 20 is rotated. As described above, in the substrate positioning apparatus according to the fourth embodiment of the present invention, when the position of the substrate S is adjusted, since the substrate s can be moved not only in the horizontal direction but also in rotation, the adjustment of the substrate can be easily and accurately performed. The operation of the s position. The technical spirit described in the embodiments of the present invention may be implemented independently or in various combinations. Furthermore, the substrate positioning device according to the present invention can be applied not only to the glue coating 14 201115676 machine [schematic description], but also to the accompanying plane ξ, 1 is shown in accordance with the present invention. - a cross-sectional view of the substrate positioning device of the substrate positioning device of the embodiment; a side view = a substrate position adjusting unit for the base defect of the display 1 is a plan view showing the substrate position adjusting unit of FIG. Figure 2 is a schematic diagram of the substrate position adjusting unit of the substrate positioning device; the substrate position adjusting unit of the substrate positioning device shown in Fig. 1 is the substrate positioning device of the second embodiment. The substrate positioning device of Fig. 7 is shown. Substrate position adjustment unit operation substrate=setting 9 is adjusted to indicate that the operation of the substrate positioning device of the third embodiment is 0, which means that the substrate position adjustment unit substrate of the substrate positioning device of FIG. The unit of the device is the substrate position adjustment of the substrate positioning device of FIG. 11 201115676. FIG. 14 is a plan view showing the platform of the substrate positioning device of FIG. 11; and FIGS. 15 and 16 are the base of FIG. A schematic view of the operation unit of the positioning device to adjust the position of the substrate. [Main component symbol description] 10 platform 11 perforation 12 flow channel 20 substrate position adjustment unit 21 pad 22 pad lifting unit 23 pad moving unit 24 rotation unit 30 air supply unit 31 air supply valve 32 positive pressure source 40 exhaust unit 41 row Air valve 42 negative pressure source 50 air suction unit 211 through hole 221 cylinder 222 actuation rod 231 support member 232 ball screw 233 rotation motor 234 first pad moving unit 16 201115676 235 second pad moving unit 241 rotation motor 242 rotation axis A One direction B second direction S substrate 17

Claims (1)

201115676 七、申請專利範圍: 1. 一種基板定位裝置,包含: 一平台’具有一或更多穿孔; 一基板位置調整單元,包含:與該平台上放置之一基板接 觸之一墊,提升該墊之一墊提升單元;以及旋轉該墊之一 轉單元;以及 子匕一供氣單元,與該平台之該穿孔相通,以供應氣體到該穿 2·如申β請專利範圍第1項所述之基板定位裝置,其中該基板位 置調整單7C更包含—塾移動單元,移動該墊於—水平方向。 3. 一種基板定位裝置,包含: 平台’具有一或更多穿孔; 雜夕二ί板Ϊ置調整單元,包含:與該平台上放置之一基板接 ,提升該墊之一墊提升單元;以及移動該墊於一水平 方向之一墊移動單元;以及 孔。供氣單元’與該平台之該穿孔相通’以供應氣體到該穿 5. 中該==圍含第2至4項任一項所述之基板定位裝置,其 m 18 201115676 一第一墊移動單元, 第一塾移動單元, 垂直於該第一方向。 移動該墊於一第一方向;以及 移動該墊於一第二方向,該第二方向 7. 包含: 如申明專利feu第丨至4項任—項所述之基板定位裝置,更 氣體 排氣單7L ’與該平台之該穿孔相通,以透過該穿孔排出 8. 板定位裝置故—基板之方法,絲板定位裝 二二1° ’具有—或更多穿孔;—基板位置調整單元,具 β/、“、°上放置之該基板接觸之-H升該墊之-墊提升 早7G ;旋轉該塾之-墊旋轉單元;以及移動該墊於-水平方向 之一塾移動單元;以及一供氣單元,與該平台之該穿孔相通, 以供應氣體到該穿孔,該方法包含以下步驟: (a) 放置該基板於該平台上; (b) 利用該墊提升單元提升該基板; (c) 附接該基板於該墊之一上表面; ⑷自該平台升高該基板’峨該供氣單元供聽體到該平 台之該穿孔;以及 (e)調整該基板之一位置,以利用該墊旋轉單元旋轉該基 板’或利用該墊移動單元移動該墊於該水平方向。 19 201115676 9.如申請專利範圍第 驟(a)之前執行。 8項所述之麵,該步驟(b)在該步 10.如申請專利範圍第8或9項所述之方法,其中一通孔形成於 該墊中,以及一吸氣單元與該墊之該通孔相通,以透過該通孔 吸氣;以及該步驟(c)包含透過該墊之該通孔,將氣體吸入該吸 氣單元之步驟,以附接該基板於該墊之該上表面。 20201115676 VII. Patent application scope: 1. A substrate positioning device, comprising: a platform having one or more perforations; a substrate position adjusting unit comprising: a pad contacting one of the substrates placed on the platform, lifting the pad a pad lifting unit; and rotating the one-turn unit of the pad; and a sub-gas supply unit communicating with the perforation of the platform to supply gas to the through-hole 2, as claimed in claim 1 The substrate positioning device, wherein the substrate position adjustment sheet 7C further comprises a movement unit that moves the pad in a horizontal direction. 3. A substrate positioning device, comprising: a platform having one or more perforations; and an adjustment unit comprising: a substrate attached to the platform, lifting a pad lifting unit of the pad; Moving the pad to move the unit in one of the horizontal directions; and the aperture. The gas supply unit 'connects to the perforation of the platform' to supply a gas to the perme 5. The substrate positioning device according to any one of items 2 to 4, m 18 201115676 a first pad movement The unit, the first mobile unit, is perpendicular to the first direction. Moving the pad in a first direction; and moving the pad in a second direction, the second direction 7. Containing: a substrate positioning device as described in the patented feu 丨 4 4 item, more gas exhaust The single 7L' communicates with the perforation of the platform to discharge through the perforation. 8. The method of positioning the substrate, the method of the substrate, the positioning of the silk plate is two or two degrees, and has a perforation; / /, ", ° placed on the substrate contact - H rise the pad - pad lift 7G early; rotate the 塾 - pad rotation unit; and move the pad in a horizontal direction 塾 mobile unit; and a a gas supply unit communicating with the perforation of the platform to supply gas to the perforation, the method comprising the steps of: (a) placing the substrate on the platform; (b) lifting the substrate by using the pad lifting unit; Attaching the substrate to an upper surface of the pad; (4) lifting the substrate from the platform to the perforation of the donor unit to the platform; and (e) adjusting a position of the substrate to utilize The pad rotating unit rotates the substrate 'or The pad moving unit moves the pad in the horizontal direction. 19 201115676 9. Execute before the step (a) of the patent application scope. In the case of the item 8 (b), the step (b) is in the step 10. The method of claim 8 or 9, wherein a through hole is formed in the pad, and an air suction unit communicates with the through hole of the pad to inhale through the through hole; and the step (c) includes transmitting the through hole The through hole, the step of drawing gas into the getter unit to attach the substrate to the upper surface of the pad.
TW098144948A 2009-10-20 2009-12-25 Substrate positioning apparatus and method of positioning substrate using the same TW201115676A (en)

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KR101133467B1 (en) * 2009-10-20 2012-04-09 강경호 Cradle For Automatic Vehicle
KR102068000B1 (en) * 2012-11-19 2020-01-20 주식회사 탑 엔지니어링 Substrate Loading Device for Deposition Apparatus
KR102605917B1 (en) * 2016-04-07 2023-11-27 주식회사 탑 엔지니어링 Scribing apparatus
KR20170115636A (en) * 2016-04-07 2017-10-18 주식회사 탑 엔지니어링 Scribing apparatus

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