201114104 、發明說明： 【發明所屬之技術領域】 本發明的涉及-種薄膜天線，尤其是一種可撓式 及其製造方法。 玉天線 【先前技術】 參閱第一圖，習用技術可撓式薄型天線的示意圖。 ，可撓式_天線i包含基板1G及_ = =料:通常為錄基板。薄膜天線部具有无線圖案 用以收發#號，其中該天線圖案為金屬材料。 然基板1。及_天線部2。都具有可撓曲的性質， 為材料的不同，受到外力或熱漲冷縮時，常造成薄膜= =捲曲、形變、甚至從基板10剝離的附著性不佳現象，另= 溥膜天線20產生捲曲或形變n致阻卜 改變的縣，喊得天線效果與值沾上升而电性 【發明内容】 本發_主要目的錢供—前 該可撓式薄型天線包含基板、_天線部3導g 臈。基板為絕緣材料，係電路板、軟性基板、壓克力 2 天線部具有天線贿及收料件用& 號，其中該天線_為導電材料，如 == 或氧化紹鋅(az〇)等。導電薄膜設置在基板上，n=) 分連接的方式連接薄膜天線部，導電薄膜 王s * 撓性導電材料如賴、紹銀4銀膠^炭^可 墨膠所形成。 &跟胗I膠、妷膠或石 電美i發天㈣—觀構包含_天線部和導 上’再將導電基板連接於產品外殼上，其中產 201114104 料。 一本發明可撓式薄型天線之製造方法包含 r磨等==:=¾ =在基板上形成至少―個導電薄膜，形成導程步 ’、:方式、印刷方式、塗佈方式或遮罩方’ '、方式為 ，線部製程步驟係在導電薄膜上形成薄膜i線部二二薄膜 線部全面或部分連接，薄膜天線部的掣程方弋：與 ίί顧雕财式形成天關案，再連接彳 本發明可撓式薄型天線另一種製造方 ^ 3薄膜天、_製程步驟。前處理步驟鲜備導3電^理= 一步可以化侧、電漿酬或“研ϊί 式形成天線圖案再連接收發元件。t St ϊϋί成賴天線部製程步驟後’將導電基板與產品 體與ίί::ίί^ίΐί以要係在基板或殼 ^專c受到外力時電阻大幅上升的現象。進一步地，由 的严戶ί，有降低電阻的性質’製作時可降低薄膜天線部 的；度，而細短鍍膜時間，同時減少製作成本。 【實施方式】 的對本解之實财式做更詳細 ’ ° — 純技蟄者在研讀本朗紐能據以實施。 圄1々ΐ弟一圖，本發明可撓式薄型天線第一種結構的示意 圖。如弟二騎示’本伽可撓式_天線2包含基板Κ)、 201114104 薄膜天線部20以及導電薄膜30。基板l〇為絕緣材料，係電 路板、軟性基板、壓克力基板或其他高分子基板。薄膜天線部 jO具有天線圖案(未顯示)及收發元件(未顯示），用以收發信 唬二其中該天線圖案為一導電材料，如金屬、氧化銦錫(ITO) 或氧化紹鋅(AZO)等。導電薄膜30設置在基板10上，並以全 面連接方式連接薄膜天線部20，導電薄膜30具有可撓性，係 以可撓=導電材料如銀漿、鋁銀漿、碳漿、銀膠、金膠、碳膠 ，石墨膠所形成’用以改善基板10和薄膜天線部20之間受到 外力時的附著性，並可降低電阻。 第三圖，本發明可撓式薄型天線第二種結構的示意 i二ίΐ圖所示’本發明可挽式薄型天線2包含基板10、 20以及複數個導電薄膜3〇，導電細3〇設置在 土 之;上’並以部份連接方式連接薄膜天線部20。 ^第四圖，本發明可撓式薄型天線第三種結構的示音 如苐四圖所示，本發明可撓^薄型天 : ，料細納舰 顯if上接於產品外殼(未 天線之製造方法包含前處理步驟S1G、導電触 或機械研/等;4 Λ:柯以化學働卜電雜刻 裎牛驟處理’以增加附著性。導電薄膜制 式的其t之—桃聊方式、_方式、塗財式或遮罩方 線部2〇 ’導電上形成薄膜天 膜天線部2。的製程方式以遮罩缠膜方式;形】 201114104 本ΐΞί ’再連接收發树(未顯示）。遮罩賴方式係將具有 制^圖案的遮罩覆蓋於基板10及導電薄膜3〇之上，進行鑛膜 广二’鑛職將遮單去除而形成天線圖案。雕刻方式係先在基 =0及導電_ 30進行賴製程，再以魏雕刻或機械雕刻 雕刻出天線圖案，其中該賴製程係蒸鑛 或無電鍍的其中一種。 微 β ®參閱第六圖，本發明可撓式薄型天線另—種製造方法的流 ^。如第六圖所示，同時參照第四圖，本發明可撓式薄型天 . 種製造方法包含前處理步驟S15以及薄膜天線部製程201114104, invention description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a film antenna, and more particularly to a flexible type and a method of manufacturing the same. Jade Antenna [Prior Art] Referring to the first figure, a schematic diagram of a conventional flexible thin antenna. The flexible _ antenna i comprises a substrate 1G and _ = = material: usually a recording substrate. The film antenna portion has a wireless pattern for transmitting and receiving ##, wherein the antenna pattern is a metal material. The substrate 1 is. And _ antenna unit 2. They all have flexible properties. When they are subjected to external force or heat expansion and contraction, they often cause film ==curling, deformation, and even poor adhesion from the substrate 10. The other = the diaphragm antenna 20 is produced. The county that has been curled or deformed to cause obstruction changes, the antenna effect and the value of the antenna are increased and the electricity is invented. [Invention] The main purpose of the present invention is that the flexible thin antenna includes the substrate and the antenna portion 3 Hey. The substrate is an insulating material, and the circuit board, the flexible substrate, the acrylic 2 antenna portion has an antenna bribe and a receiving member & and the antenna _ is a conductive material such as == or zinc oxide (az〇). . The conductive film is disposed on the substrate, and n=) is connected to the film antenna portion by means of a connection, and the conductive film is formed by a flexible conductive material such as Lai, Shaoyin 4 silver glue, carbon, and ink. & 胗I glue, silicone or stone, the United States and the United States (four) - the view contains _ antenna and guides and then connect the conductive substrate to the product shell, which produced 201114104 material. A manufacturing method of the flexible thin antenna of the present invention comprises r grinding, etc. ==:=3⁄4 = at least one conductive film is formed on the substrate to form a lead step, a mode, a printing method, a coating method or a mask ' ', the method is that the wire part process steps are formed on the conductive film to form a thin film i-line part two or two film line parts are fully or partially connected, and the film antenna part of the process is formed by the ί 顾 Gu Gu-Feng form a Tianguan case, and then connected另一The flexible thin antenna of the present invention is another manufacturing method. The pre-processing steps are fresh and easy to control. 3 = One step can be used to make the side, the plasma is paid or “developing the antenna pattern and then connecting the transceiver components. t St ϊϋί depends on the antenna part process step after the conductive substrate and the product body Ίί:: ίί^ίΐί The phenomenon that the resistance is greatly increased when the substrate or the shell is subjected to an external force. Further, the strict ί has the property of reducing the resistance, and the film antenna portion can be reduced during fabrication. And the coating time is short, and the production cost is reduced at the same time. [Embodiment] The actual financial formula of the solution is more detailed '° — the pure technology is studied in the study of the New Zealand can be implemented. 圄1々ΐ弟一图A schematic diagram of a first structure of the flexible thin antenna of the present invention. For example, the second antenna shows that the 'Genaga flexible antenna 2 includes a substrate Κ, the 201114104 film antenna portion 20, and the conductive film 30. The substrate is an insulating material. a circuit board, a flexible substrate, an acrylic substrate or other polymer substrate. The film antenna portion jO has an antenna pattern (not shown) and a transceiver component (not shown) for transmitting and receiving signals, wherein the antenna pattern is a conductive material, Metal, indium tin oxide (ITO) or zinc oxide (AZO), etc. The conductive film 30 is disposed on the substrate 10 and is connected to the film antenna portion 20 in a fully connected manner. The conductive film 30 has flexibility and is flexible. Conductive materials such as silver paste, aluminum silver paste, carbon paste, silver paste, gold glue, carbon glue, and graphite glue are formed to improve the adhesion between the substrate 10 and the film antenna portion 20 when subjected to an external force, and the resistance can be lowered. The third figure shows the second structure of the flexible thin antenna of the present invention. The portable thin antenna 2 of the present invention comprises the substrate 10, 20 and a plurality of conductive films 3〇, and the conductive thin 3〇 The film antenna portion 20 is connected to the earth; and is connected in a partial connection manner. ^ Fourth, the sounding structure of the third structure of the flexible thin antenna of the present invention is as shown in FIG. Thin day: The material is displayed on the outer casing of the product. (The method of manufacturing the antenna does not include the pre-processing step S1G, conductive contact or mechanical research / etc.; 4 Λ: Ke to chemical 働 电 杂 裎 裎 骤 骤'To increase adhesion. The conductive film system's t-the peach way, _ mode, coated or masked square line 2〇' conductively formed thin film antenna unit 2. The process is masked and wrapped; shape] 201114104 本ΐΞί 'Reconnect the transceiver tree (not shown). In the masking method, a mask having a pattern is applied over the substrate 10 and the conductive film 3〇, and the film is removed by the mining film Guang'i. The engraving method is first in the base=0. And conductive _ 30 to carry out the process, and then engrave the antenna pattern by Wei engraving or mechanical engraving, wherein the Lai process is one of steaming or electroless plating. Micro β ® refers to the sixth figure, the flexible thin antenna of the present invention is another a flow of a manufacturing method. As shown in the sixth drawing, and referring to the fourth figure, the flexible manufacturing method of the present invention comprises a pre-processing step S15 and a film antenna portion process.
^驟S35。前處理步驟係準備導電基板4〇，並去除油墨及雜 貝由進一步可以化學侧、電雜刻錢械研鮮方式進行表 面处理:以增加附著性。天線製程步驟S35係在導電基板40 亡形成薄膜天線部20，薄膜天線部20的製程方式以上述的遮 罩鍍膜方式或鍍膜雕刻方式形成天線圖案再連接收發元件(未 顯不）。本發明可撓式薄型天線另一種製造方法進一步包含一 接合步驟’在完成薄膜天線部製程步驟後，將導電基板與產品 外殼(未顯示)連接。 μ 以上所述者僅為用以解釋本發明之較佳實施例，並非企圖 據以對本發明做任何形式上之限制’是以，凡有在相同之發明^Step S35. The pre-processing step prepares the conductive substrate 4〇, and removes the ink and the shell. The surface treatment can be further performed by chemical side or electric etching to increase adhesion. In the antenna manufacturing step S35, the thin film antenna portion 20 is formed on the conductive substrate 40, and the processing method of the thin film antenna portion 20 is such that the antenna pattern is formed by the above-described mask plating method or plating engraving method, and the transmitting/receiving element is connected (not shown). Another manufacturing method of the flexible thin antenna of the present invention further includes a bonding step of "connecting the conductive substrate to the product casing (not shown) after the film antenna portion processing step is completed. The above is only a preferred embodiment for explaining the present invention, and is not intended to impose any form of limitation on the present invention.
精神下所財關本發明之任何修飾或變更，皆仍應包括在 明意圖保護之範疇。 X 【圖式簡單說明】 ，一圖係習用技術可撓式薄型天線的示意圖。 圖係本發明可撓式薄型天線第一種結構的示意圖。 $三圖係本發明可撓式薄型天線第二種結構的示意圖。 ^四圖係本發明可撓式薄型天線第三種結構的示意圖。 第五圖本發明可撓式薄型天線之製造方法的流程圖。 第六圖本發明可撓式薄型天線另一種製造方法的流程圖。 201114104 【主要元件符號說明】 1 可撓式薄型天線 2 可撓式薄型天線 10 基板 20 薄膜天線部 30 導電薄膜 40 導電基板 S10 前處理步驟 S15 前處理步驟 S20 導電薄膜製程步驟 S30 薄膜天線部製程步驟 S35 薄膜天線部製程步驟 S40 接合步驟Any modification or alteration of the invention under the Spirit shall be included in the scope of the intention to protect. X [Simple description of the diagram], a diagram is a schematic diagram of a flexible thin antenna that is conventionally used. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the first structure of a flexible thin antenna of the present invention. $三图 is a schematic diagram of a second structure of the flexible thin antenna of the present invention. ^四图 is a schematic diagram of a third structure of the flexible thin antenna of the present invention. Fig. 5 is a flow chart showing a method of manufacturing a flexible thin antenna of the present invention. Figure 6 is a flow chart showing another manufacturing method of the flexible thin antenna of the present invention. 201114104 [Explanation of main component symbols] 1 Flexible thin antenna 2 Flexible thin antenna 10 Substrate 20 Thin film antenna part 30 Conductive film 40 Conductive substrate S10 Pre-processing step S15 Pre-processing step S20 Conductive film process Step S30 Film antenna part process steps S35 film antenna part process step S40 bonding step