201111798 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是有關一種積體電路測試探針卡之結構，尤 指一種結構簡易、成本低廉且電路訊號傳輸品質佳之測 試探針卡結構。 [先前技術] [0002] —般積體電路晶片於成型後，皆需經由測試以確定 其品質是否合乎規範，而較常見的測試方式係以一積體 電路測試卡設置於該積體電路晶片與相關測試裝置之間 Ο ，使該積體電路晶片之各接點得以與測試裝置之對應接 點形成電連接」藉以執行各測試動作； pjilsy :'肩釋變 耗f.201111798 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a structure of a test card for an integrated circuit test, and more particularly to a test probe card structure having a simple structure, low cost, and good signal transmission quality. . [Prior Art] [0002] After the integrated circuit chip is formed, it is tested to determine whether its quality is in conformity with the specification. The more common test method is to install an integrated circuit test card on the integrated circuit chip. Between the relevant test device, the contacts of the integrated circuit chip can be electrically connected with the corresponding contacts of the test device to perform various test actions; pjilsy: 'shoulder release variable f.
[0003] 而傳統習見之電路測試探針卡結構，乃如第1或1 A*圖所示，其主要包括：一電路板1 0、一固定環墊2 、一加強墊3、一探針固定裝置4、一基板6及複數探 針5，其中該固定環墊2、加強墊3係分別結合於電路 板10之二側中央部位’以續加該電路板10強度而可 Q 防止其（於高溫或外力環境下γ產生變形，於該固定環 墊2上設有一鏤空部2 1，且使該電路板1 0於對應鏤 空部2 1之部位設有複數銜接接點1 0 2，而該電路板 10另一側於加強墊3外旁侧部位設有複數外接點13 ，並於電路板1 〇内設有複數導電線路1 0 4銜接於各 外接點1 3與銜接接點1 〇 2之間，基板6係設置於固 定環墊2之鏤空部2 1内，其一側表面設有複數錫球6 2分別對應於各銜接接點1 〇 2，使該錫球6 2可經過 迴焊爐而與各銜接接點1 〇 2焊合，於該基板6之另一 098132830 表單編號Α0101 第3頁/共18頁 0982056281-0 201111798 側表面則設有複數内接點61，且於基板6内設有複數 導電線路6 3銜接於各内接點6 1與錫球6 2之間，探 針固定裝置4係固定於固定環墊2之另一側，其主要由 一上爽板4 1、一塾片4 3及一下爽板4 2依序疊置而 成，於該墊片43中央設有一鏤空部43 1，而該上夾 板4 1於對應鏤空部4 3 1區域内設有複數直徑等於探 針5外徑之定位孔4 1 1，而該下夾板4 2則於對應鏤 空部4 3 1區域内設有複數直徑大於探針5外徑之通孔 4 2 1，複數探針5係以一端分別穿過上夹板4 1之各 定位孔4 1 1而形成定位，且使各探針5之端部保持一 適當外凸長度，以供抵觸於基板6之各内接點6 1，各 探針5之另一端可通過下失板4 2之通孔4 2 1並向外 延伸，而於各探針5之中段則設有一彎折部5 1，使其 可保持一壓縮彈性。 [0004] 使用時，各外接點1 3可經由導體與外部之測試電 路（儀器）形成電連接，同時，其整體可受驅動而以各 探針5伸出通孔4 2 1之部位抵觸於待測試積體電路晶 片上之接點，藉由該探針5依序經由内接點6 1、導電 線路6 3、錫球6 2、銜接接點1 0 2、導電線路1 0 4至各外接點1 3，使該而該積體電路晶片之各接點與 外部測試電路（儀器）形成電連接，以供進行測試；然 而，上述結構於實際應用時有下列缺點： 1. 由於該電路板1 0與基板6係分別製作，再利用各 錫球6 2加以焊合，其整體之開發設計及製作流程 極為煩雜，且成品之良率因而大幅度下降，致使整 098132830 表單編號A0101 第4頁/共18頁 0982056281-0 [0005] 201111798 體成本不易下降。 2. 由於待測試積體電路晶片之接點與外部測試電路（ 儀器）之間具有導電線路1 0 4、6 3及各内接點 6 1、錫球6 2、銜接接點1 0 2、外接點1 3等 ，其整體之電路阻抗不易控制，且裸露性較高，容 易受到雜訊之干擾，難以保持其電路訊號傳輸之優 良品質。 3. 由於待測試積體電路晶片之接點與外部測試電路間 之接點繁複，且阻抗較高，致使其整體之阻抗匹配 〇 較難以控制，容易影響實際測試之品質。 有鑑於習見之積體電路測試探針卡結構有上述缺點 ，發明人乃針對該些缺點研究改進之道，終於有本發明 產生。 【發明内容】 [0006] 〇 [0007] 是以，本發明之主要目的在於提供一種積體電路測 試探針卡之結構，其可降彳％測試線路之阻抗，有效提昇 訊號傳輸之品質，且使負載之阻抗匹配較容易控制。 本發明之另一目的在於提供一種積體電路測試探針 卡之結構，可有效提昇良率，進而降低整體之生產成本 〇 [0008] 098132830 為達成上述目的及功效，本發明所採行的技術手段 包括：一電路板，其至少一側設有凸部，該凸部遠離電 路板之表面設有複數内接點，且該電路板之未對應設置 該凸部之另一侧表面則設有複數外接點，可經由導線與 外部之測試電路形成電連接，而於電路板及凸部之内則 表單編號A0101 第5頁/共18頁 0982056281-0 201111798 設有導電線路銜接於各該内、外接點之間；一固定環墊 ，設有一鏤空部，可結合於該電路板之凸部周圍；一探 針固定裝置，係經由該固定環墊結合於電路板具凸部之 一侧，且該探針固定裝置可固定複數探針之一端，並使 該等探針與各内接點接觸，各探針之另一端則用以與待 測試之積體電路晶片各接腳接觸形成電連接。 [0009] [0010] [0011] 又為更確實提昇上述發明之品質，更可特別在接近 電路板與凸部交界之部位，將其中之導電線路採用阻抗 同軸線來設置，使得此部位之訊號傳輸效果得以提昇， 且降低雜訊之干擾者。 為使本發明的上述目的、功效及特徵可獲致更具體 的暸解，茲依下列附圖說明如下： 【實施方式】 請參第2、3或3 A圖，明顯可看出，本發明之結 構主要包括：電路板1、固定環墊2、加強墊3、探針 固定裝置4及探針5等部份，其中該電路板1之一側設 有至少一凸部1 1，於該凸部1 1遠離電路板1方向之 表侧設有複數内接點1 2，而於電路板1在未對應設有 該凸部1 1之一側表面上則設有複數外接點1 3，且於 電路板1與凸部1 1之内設有導電線路1 4、1 1 4銜 接於各内、外接點1 2、1 3之間，固定環墊2係結合 於電路板1設具凸部1 1之一侧，其上設有一鏤空部2 1可套合於該凸部1 1周圍，加強墊3則係結合於該電 路板1遠離凸部1 1之一侧（使各外接點1 3分佈於該 加強墊3外周緣），藉由該固定環墊2、加強墊3可增 098132830 表單編號A0101 第6頁/共18頁 0982056281-0 201111798 Ο 加該電路板1之強度，以防止其於高溫或外力環境下產 生變形，探針固定裝置4係固定於該固定環墊2另一側 ，其主要由一上夾板4 1、一塾片4 3及一下夾板4 2 依序疊置而成，於墊片43中央設有一鏤空部43 1， 而該上夾板4 1於對應鏤空部4 3 1區域内設有複數直 徑等於探針5外徑之定位孔4 1 1，而該下夾板4 2則 於對應鏤空部4 3 1區域内設有複數直徑大於探針5外 徑之通孔421，複數探針5係分別以一端穿過該上夾 板4 1之定位孔4 1 1而形成定位且使各探針5之端部 保持一適當外凸長度，以供伸入鏤空部2 1抵觸於各内 接點1 2，而各探針5之中段設有一彎折部5 1，使其 另一端可通過下夾板4 2之通孔4 2 1並向外延伸。 [0012] 〇 使用時，電路板1之各外接點1 3可經由導體與外 部之測試電路（儀器）形成電連接，同時，其整體可受 驅動而以各探針5伸出通孔4 2 1之部位抵觸於待測試 積體電路晶片上之接點，藉由該探針5直接經由内接點 1 2、導電線路1 1 4、1 4至各外接點1 3，使該而 該積體電路晶片之各接點與外部測試電路（儀器）形成 電連接，以供進行測試，同時，利用通孔4 2 1大於探 針5外徑之直徑，可使各探針5具有活動空間，以利於 吸收其抵觸於待測試積體電路晶片上各接點所產生之變 形，以使其確實保持穩定接觸狀態；此種結構於實際應 用時有下列特點： 1. 由於該電路板1係一體成型，因此其整體之開發設 計及製作流程皆可簡化，以有效降低生產成本。 098132830 表單編號Α0101 第7頁/共18頁 0982056281-0 [0013] 201111798 2. 由於待測試積體電路晶片之接點與外部測試電路（ 儀器）間之總接點減少，使其整體之電路阻抗降低 ，可有效確保其電路訊號傳輸之品質。 3. 由於待測試積體電路晶片之接點與外部測試電路間 之接點減少且阻抗降低，致使其整體之阻抗匹配易 於控制，可提昇整體測試之品質。 再者請參第4及4 A圖，該實施例係特別將電路板 1及凸部1 1分別以兩分離單元體，且凸部1 1可以陶 瓷材料所製成，再加以結合為一體之型式，其中之凸部 11與電路板1交界部位的至少其一表面設有一凹入部 1 6 (圖示者係設置在凸部1 1之表面），且在該交界 部位附件之内部導電線路1 4、1 1 4之間，特別利用 阻抗同軸線（impedance Coaxial cable) 1 4 1通過 該凹入部1 6加以電聯接，再以類似環氧樹酯（Epoxy) 1 4 2等高效黏著材料，結合該電路板1及該凸部1 1 ，並進而填充該凹入部1 6及各電聯結線路通過路徑之 空隙，達到緊密結合及良好封閉性之目的；藉此，則可 在電路板1與凸部11結合交界部位之附近形成一良好 之電包覆特性，完全避免該部份導電線路之裸露現象， 進而大幅提昇該部位之訊號傳輸品質，具有更加提高整 體測試效果之潛在能力。 [0014] 綜合以上所述，本發明積體電路測試探針卡之結構 確可達成簡化結構、降低成本且提昇電路訊號傳輸品質 之功效，實為一具新穎性及進步性之發明，爰依法提出 申請發明專利；惟上述說明之内容，僅為本發明之較佳 098132830 表單編號A0101 第8頁/共18頁 0982056281-0 201111798 實施例說明，舉凡依本發明之技術手段與範疇所延伸之 變化、修飾、改變或等效置換者，亦皆應落入本發明之 專利申請範圍内。 【圖式簡單說明】 [0015] 第1圖係習見電路測試探針卡之結構剖視圖。 [0016] 第1 A圖係第1圖A部份之放大圖。 [0017] 第2圖係本發明及相關組成元件之構造分解圖。 [0018] 第3圖係本發明之組合剖視圖。[0003] The conventional circuit test probe card structure, as shown in the first or first A* diagram, mainly includes: a circuit board 10, a fixed ring pad 2, a reinforcing pad 3, a probe The fixing device 4, a substrate 6 and a plurality of probes 5, wherein the fixing ring pad 2 and the reinforcing pad 3 are respectively coupled to the central portion of the two sides of the circuit board 10 to continue the strength of the circuit board 10 to prevent it ( The γ is deformed in a high temperature or external force environment, and a hollow portion 2 1 is disposed on the fixing ring pad 2, and the circuit board 10 is provided with a plurality of connecting contacts 1 0 2 at a portion corresponding to the hollow portion 21, and The other side of the circuit board 10 is provided with a plurality of external contacts 13 on the outer side of the reinforcing pad 3, and a plurality of conductive lines 104 are connected in the circuit board 1 衔 to the external contacts 1 3 and the connecting contacts 1 〇 Between the two, the substrate 6 is disposed in the hollow portion 2 1 of the fixed ring pad 2, and a plurality of solder balls 6 2 are disposed on one surface thereof corresponding to the respective connecting contacts 1 〇 2, so that the solder balls 6 2 can pass through Reflow oven and solder joints with each joint 1 〇 2, another 098132830 on the substrate 6 Form No. 1010101 Page 3 / Total 18 Page 0982056281-0 20 The 1111798 side surface is provided with a plurality of internal contacts 61, and a plurality of conductive lines 6 3 are disposed in the substrate 6 to be connected between the inner contacts 61 and the solder balls 62, and the probe fixing device 4 is fixed to the fixing ring. The other side of the pad 2 is mainly formed by a top plate 4 1 , a blip piece 4 3 and a lower plate 4 2 , and a hollow portion 43 1 is disposed in the center of the pad 43 . The upper clamping plate 4 1 is provided with a plurality of positioning holes 4 1 1 having a diameter equal to the outer diameter of the probe 5 in the region corresponding to the hollow portion 433, and the lower clamping plate 4 2 is provided with a plurality of diameters in the region corresponding to the hollow portion 433 a through hole 4 2 1 which is larger than the outer diameter of the probe 5, and the plurality of probes 5 are formed at one end by respectively passing through the positioning holes 4 1 1 of the upper clamping plate 4 1 , and the ends of the probes 5 are kept properly. The outer length of the probe 5 is opposite to the inner contact point 161 of the substrate 6, and the other end of each probe 5 can pass through the through hole 4 2 1 of the lower plate 4 and extend outward, and the probe 5 is In the middle section, a bent portion 5 1 is provided to maintain a compressive elasticity. [0004] In use, each external contact 13 can be electrically connected to an external test circuit (instrument) via a conductor, The whole of the probe 5 can be driven to the contact point of the integrated circuit chip to be tested by the probe 5, and the probe 5 is electrically connected via the internal contact 61 in sequence. Line 6 3, solder ball 6 2, connecting contact 1 0 2, conductive line 1 0 4 to each external point 13 3, so that the contacts of the integrated circuit chip and the external test circuit (instrument) to make electrical connection For the purpose of testing; however, the above structure has the following disadvantages in practical applications: 1. Since the circuit board 10 and the substrate 6 are separately fabricated, and the solder balls 6 2 are used for soldering, the overall development design and The production process is extremely cumbersome, and the yield of the finished product is greatly reduced, resulting in a whole 098132830 form number A0101 page 4 / a total of 18 pages 0 892 852 827 - 0 [0005] 201111798 body cost is not easy to decline. 2. Between the contact of the integrated circuit chip to be tested and the external test circuit (instrument), there are conductive lines 1 0 4, 6 3 and internal contacts 6 1 , solder balls 6 2, connection contacts 1 0 2 The external circuit 1 and so on, the overall circuit impedance is not easy to control, and the bareness is high, which is easily interfered by noise, and it is difficult to maintain the excellent quality of its circuit signal transmission. 3. Due to the complicated connection between the contacts of the integrated circuit chip to be tested and the external test circuit, and the high impedance, the overall impedance matching 较 is difficult to control, which easily affects the quality of the actual test. In view of the above-mentioned shortcomings of the conventional integrated circuit test probe card structure, the inventors have made research on the improvement of these shortcomings, and finally the present invention has been produced. SUMMARY OF THE INVENTION [0007] Therefore, the main object of the present invention is to provide an integrated circuit test probe card structure, which can reduce the impedance of the test line, effectively improve the quality of signal transmission, and Matching the impedance of the load is easier to control. Another object of the present invention is to provide a structure of an integrated circuit test probe card, which can effectively improve the yield and thereby reduce the overall production cost. [0008] 098132830 The technology adopted by the present invention to achieve the above object and effect The method includes: a circuit board having a convex portion on at least one side thereof, wherein the convex portion is provided with a plurality of internal contacts away from a surface of the circuit board, and the other side surface of the circuit board not corresponding to the convex portion is provided The plurality of external contacts can be electrically connected to the external test circuit via the wires, and in the circuit board and the convex portion, the form number A0101, page 5/18 pages 0982582681-0 201111798, is provided with conductive lines connected to each of them. Between the external contacts; a fixed ring pad having a hollow portion that can be coupled around the convex portion of the circuit board; a probe fixing device is coupled to one side of the convex portion of the circuit board via the fixing ring pad, and The probe fixing device can fix one end of the plurality of probes and make the probes contact the inner contacts, and the other end of each probe is used to form an electrical connection with each pin of the integrated circuit chip to be tested. . [0011] [0011] In order to more accurately improve the quality of the above invention, in particular, in the vicinity of the junction of the circuit board and the convex portion, the conductive line therein is set by the impedance coaxial line, so that the signal of the part The transmission effect is improved and the noise interferers are reduced. In order to achieve a more specific understanding of the above objects, effects and features of the present invention, the following drawings are described as follows: [Embodiment] Referring to Figures 2, 3 or 3 A, it can be clearly seen that the structure of the present invention The main part includes: a circuit board 1, a fixed ring pad 2, a reinforcing pad 3, a probe fixing device 4, and a probe 5, wherein one side of the circuit board 1 is provided with at least one convex portion 1 1 at the convex portion. 1 1 is provided with a plurality of internal contacts 1 2 away from the front side of the circuit board 1 , and a plurality of external contacts 13 are provided on the side surface of the circuit board 1 on which the convex portion 11 is not correspondingly provided, and The circuit board 1 and the convex portion 1 1 are provided with conductive lines 14 and 1 1 4 connected between the inner and outer contacts 1 2 and 13 , and the fixed ring pad 2 is coupled to the circuit board 1 with the convex portion 1 One side of the first side is provided with a hollow portion 2 1 which can be fitted around the convex portion 1 1 , and the reinforcing pad 3 is coupled to one side of the circuit board 1 away from the convex portion 1 1 (so that the external contact points 1 3 Distributed on the outer periphery of the reinforcing pad 3, by the fixing ring pad 2, the reinforcing pad 3 can be increased by 098,132,830 Form No. A0101 Page 6 / Total 18 pages 0 985 852 827 -1 201111798 Ο Add the circuit The strength of 1 is to prevent deformation under high temperature or external force environment, and the probe fixing device 4 is fixed on the other side of the fixing ring pad 2, which mainly consists of an upper clamping plate 4 1 , a cymbal piece 4 3 and a lower clamping plate 4 2 is stacked in order, a hollow portion 43 1 is disposed in the center of the spacer 43 , and the upper clamping plate 4 1 is provided with a plurality of positioning holes 4 having a diameter equal to the outer diameter of the probe 5 in the corresponding hollow portion 433 1 1 , and the lower clamping plate 4 2 is provided with a plurality of through holes 421 having a diameter larger than the outer diameter of the probe 5 in the region corresponding to the hollow portion 433, and the plurality of probes 5 are respectively passed through the upper clamping plate 4 1 at one end. Positioning the holes 4 1 1 to form a positioning and maintaining the end portions of the probes 5 with a proper convex length for extending into the hollow portion 2 1 against the inner joints 1 2 , and a middle portion of each of the probes 5 is provided with a The bent portion 5 1 has its other end which can pass through the through hole 4 2 1 of the lower clamp plate 4 2 and extends outward. [0012] When in use, each external contact 13 of the circuit board 1 can be electrically connected to an external test circuit (instrument) via a conductor, and at the same time, the whole can be driven to protrude through the through hole 4 with each probe 5. The portion of 1 is in contact with the contact on the integrated circuit chip to be tested, and the probe 5 directly passes through the inner contact 1 2, the conductive line 1 1 4, 14 to the external contact 1 3, so that the product Each contact of the body circuit chip is electrically connected to an external test circuit (instrument) for testing, and at the same time, each of the probes 5 has an active space by using a diameter of the through hole 4 2 1 larger than the outer diameter of the probe 5. In order to facilitate absorption of the deformation caused by the contacts on the integrated circuit chip to be tested, so as to maintain a stable contact state; this structure has the following characteristics in practical applications: 1. Since the circuit board 1 is integrated Forming, so the overall development design and production process can be simplified to effectively reduce production costs. 098132830 Form No. 1010101 Page 7 of 18 0982056281-0 [0013] 201111798 2. Due to the reduction of the total joint between the contact of the integrated circuit chip to be tested and the external test circuit (instrument), the overall circuit impedance Reduced, can effectively ensure the quality of its circuit signal transmission. 3. Since the contact between the contact of the integrated circuit chip to be tested and the external test circuit is reduced and the impedance is lowered, the overall impedance matching is easy to control, and the quality of the overall test can be improved. In addition, please refer to FIG. 4 and FIG. 4A. In this embodiment, the circuit board 1 and the convex part 1 1 are respectively divided into two separate unit bodies, and the convex part 1 1 can be made of ceramic material, and then combined into one. a type in which at least one surface of the interface between the convex portion 11 and the circuit board 1 is provided with a recessed portion 16 (the figure is disposed on the surface of the convex portion 11), and the inner conductive line 1 is attached at the interface portion Between 4 and 1 14 , an impedance coaxial cable 1 4 1 is electrically connected through the recessed portion 16 , and is bonded with an efficient adhesive material such as epoxy resin (Epoxy) 142 . The circuit board 1 and the convex portion 1 1 further fill the recessed portion 16 and the gaps of the electrical connecting lines through the path to achieve the purpose of tight bonding and good sealing; thereby, the circuit board 1 and the convex portion can be The portion 11 forms a good electrical coating characteristic in the vicinity of the interface portion, completely avoiding the bare phenomenon of the portion of the conductive line, thereby greatly improving the signal transmission quality of the portion, and has the potential to further improve the overall test effect. [0014] In summary, the structure of the integrated circuit test probe card of the present invention can achieve the effects of simplifying the structure, reducing the cost, and improving the signal transmission quality of the circuit, and is a novel and progressive invention. The invention is filed; however, the content of the above description is only the preferred 098132830 of the present invention. Form No. A0101, page 8 / page 18, 098, 205, 628, 821, 2011, 2011, 798 It is also within the scope of the patent application of the present invention to modify, alter or substitute. BRIEF DESCRIPTION OF THE DRAWINGS [0015] Fig. 1 is a cross-sectional view showing the structure of a circuit test probe card. [0016] Fig. 1A is an enlarged view of a portion of Fig. 1A. 2 is a structural exploded view of the present invention and related constituent elements. 3 is a cross-sectional view of the combination of the present invention.
❹ [0019] 第3 A圖係第3圖A部份之放大圖。 [0020] 第4圖係本發明第二種實施例之組合剖視圖。 [0021] 第4 A圖係第4圖A部份之放大圖_ξ_ 【主要元件符號說明】第 [0019] Figure 3A is an enlarged view of a portion of Figure 3A. 4 is a combined cross-sectional view of a second embodiment of the present invention. [0021] Fig. 4A is an enlarged view of the portion of Fig. 4A of Fig. 4 _ ξ [Description of main component symbols]
[0022] 1、10____電路板 [0023] 11____凸部 [0024] 12、61____内接點 [0025] 13____外接點 [0026] 14、114、104、63...導電線路 [0027] 141...阻抗同軸線 [0028] 142...環氧樹酯 [0029] 15____貫孔 [0030] 16...凹入部 098132830 表單編號Α0101 第9頁/共18頁 0982056281-0 201111798 [0031] 102 銜接接點 [0032] 2... ..固定環墊 [0033] 21.. ..鏤空部 [0034] 3... ..加強墊 [0035] 4... ..探針固定裝置 [0036] 41. · ..上夾板 [0037] 411. ..定位孔 [0038] 42.. ..下夾板 [0039] 421. ..通孔 [0040] 43. · ..墊片 [0041] 431. ..鏤空部 [0042] 5... ..探針 [0043] 51.. ..彎折部 [0044] 6·.· ..基板 [0045] 62. · ..錫球[0022] 1, 10____ circuit board [0023] 11____ convex part [0024] 12, 61____ internal contact point [0025] 13____ external contact point [0026] 14, 114, 104, 63... conductive line [0027] 141...impedance coaxial line [0028] 142...epoxy resin [0029] 15____ through hole [0030] 16... recessed portion 098132830 Form number Α0101 Page 9/18 pages 0982056281-0 201111798 102 接接接[0032] 2.....Fixed ring pad [0033] 21...镂空部[0034] 3.....Reinforcement pad [0035] 4... Needle fixing device [0036] 41. ·.. upper splint [0037] 411. .. positioning hole [0038] 42... lower splint [0039] 421. .. through hole [0040] 43. ·.. pad Sheet [0041] 431. .. hollow portion [0042] 5... .. probe [0043] 51.. .. bending portion [0044] 6·.. .. substrate [0045] 62. · .. Solder balls
098132830 表單編號A0101 第10頁/共18頁 0982056281-0098132830 Form No. A0101 Page 10 of 18 0982056281-0