TWI592077B - Probe card and its probe module and power probe - Google Patents
Probe card and its probe module and power probe Download PDFInfo
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Description
本發明係與電性檢測裝置有關；特別是指一種探針卡及其探針模組與電源探針。 The invention relates to an electrical detection device; in particular to a probe card and a probe module thereof and a power supply probe.
按，待測電子物件的電性檢測方法，是將一探針卡電性連結於一檢測機(tester)上，藉由探針卡作為檢測機與待測電子物件(DUT)之間的測試訊號傳輸介面，以有效地將發自檢測機的測試訊號傳輸至待測電子物件上。 According to the electrical detection method of the electronic object to be tested, a probe card is electrically connected to a tester, and the probe card is used as a test between the detector and the electronic object to be tested (DUT). The signal transmission interface is used to effectively transmit the test signal sent from the detector to the electronic object to be tested.
然而，影響量測結果的因素許多，其中又以電源訊號透過探針卡傳輸予待測電子物件時，探針與對應之傳輸線路的阻抗常會造成傳輸電源訊號時的能量損耗，致使供予待測電子物件之電能不夠穩定，進而影響檢測結果甚鉅。是以，如何減少檢測時所造成的能量損耗，而能有效且穩定地利用探針供電予待測電子物件，一直是當今業者苦思改良之方向。 However, there are many factors affecting the measurement results. When the power signal is transmitted to the electronic object to be tested through the probe card, the impedance of the probe and the corresponding transmission line often causes energy loss when transmitting the power signal, so that the supply is waiting for The electrical energy of the electronic object is not stable enough, which in turn affects the detection results. Therefore, how to reduce the energy loss caused by the detection, and effectively and stably use the probe to supply power to the electronic object to be tested has been the direction of improvement of today's industry.
有鑑於此，本發明之目的用於提供一種探針卡及其探針模組與電源探針，可有效地降低檢測時所造成的能量損耗。 In view of this, the object of the present invention is to provide a probe card, a probe module thereof and a power supply probe, which can effectively reduce the energy loss caused by the detection.
緣以達成上述目的，本發明所提供之電源探針包含一探針頭、一傳導元件以及一電容性元件。其中，該探針頭以導體製成。該傳導元件具有以導體製成且相互分離的 一訊號傳導線路以及一接地傳導線路，且該訊號傳導線路與該探針頭的一端電性連接。該電容性元件一端電性連接至該訊號傳導線路，而另一端則電性連接至該接地傳輸線路。 In order to achieve the above object, the power supply probe provided by the present invention comprises a probe head, a conductive element and a capacitive element. Wherein, the probe head is made of a conductor. The conducting element has a conductor and is separated from each other A signal conducting line and a ground conducting line, and the signal conducting line is electrically connected to one end of the probe head. The capacitive element is electrically connected to the signal conducting line at one end and electrically connected to the grounded transmission line at the other end.
依據上述構思，本發明更提供有一種探針模組，其包括有一電源探針以及一接地探針。其中，該電源探針包含有一探針頭、一傳導元件及一電容性元件；該探針頭以導體製成；該傳導元件具有以導體製成且相互分離的一訊號傳導線路以及一接地傳導線路，且該訊號傳導線路與該探針頭的一端電性連接；該電容性元件一端電性連接至該訊號傳導線路，而另一端則電性連接至該接地傳輸線路；該接地探針以導體製成，且電性連接至該接地傳輸線路。 According to the above concept, the present invention further provides a probe module including a power probe and a ground probe. Wherein, the power probe comprises a probe head, a conducting component and a capacitive component; the probe head is made of a conductor; the conducting component has a signal conducting line made of a conductor and separated from each other and a ground conducting a line, and the signal conducting line is electrically connected to one end of the probe head; one end of the capacitive element is electrically connected to the signal conducting line, and the other end is electrically connected to the grounding transmission line; the grounding probe is The conductor is made and electrically connected to the ground transmission line.
依據上述構思，本發明更提供有一種探針卡，其包括有一基板、一固定座以及一探針模組。其中，該固定座設置於該基板上。該探針模組與該固定座連接，且包含有一電源探針以及一接地探針；該電源探針包含有一探針頭、一傳導元件及一電容性元件；該探針頭以導體製成；該傳導元件具有以導體製成且相互分離的一訊號傳導線路以及一接地傳導線路，且該訊號傳導線路與該探針頭的一端電性連接；該電容性元件一端電性連接至該訊號傳導線路，而另一端則電性連接至該接地傳輸線路；該接地探針以導體製成，且電性連接至該接地傳輸線路。 According to the above concept, the present invention further provides a probe card including a substrate, a fixing base and a probe module. The fixing base is disposed on the substrate. The probe module is connected to the fixing base and includes a power probe and a grounding probe; the power probe includes a probe head, a conducting component and a capacitive component; the probe head is made of a conductor The conductive element has a signal conducting line made of a conductor and separated from each other and a ground conducting line, and the signal conducting line is electrically connected to one end of the probe head; one end of the capacitive element is electrically connected to the signal The conductive line is electrically connected to the ground transmission line; the ground probe is made of a conductor and is electrically connected to the ground transmission line.
藉此，透過上數之結構設計，本發明之探針卡及其探針模組與電源探針便可於檢測時，有效地降低訊號傳輸時的能量損耗。 Therefore, through the structural design of the upper number, the probe card of the present invention, the probe module thereof and the power supply probe can effectively reduce the energy loss during signal transmission during detection.
10‧‧‧基板 10‧‧‧Substrate
12‧‧‧通孔 12‧‧‧through hole
20‧‧‧固定座 20‧‧‧ Fixed seat
22‧‧‧載座 22‧‧‧Hosting
24‧‧‧絕緣固定件 24‧‧‧Insulation fixtures
30‧‧‧探針模組 30‧‧‧ Probe Module
32‧‧‧電源探針 32‧‧‧Power probe
321‧‧‧探針頭 321‧‧‧ probe head
321a‧‧‧針尖段 321a‧‧‧needle section
321b‧‧‧連接段 321b‧‧‧ Connection section
322‧‧‧傳導元件 322‧‧‧Transmission elements
322a‧‧‧訊號傳導線路 322a‧‧‧ Signal transmission line
322b‧‧‧隔離層 322b‧‧‧Isolation
322c‧‧‧接地傳導線路 322c‧‧‧ Grounded Conduction Line
322d‧‧‧外皮 322d‧‧‧ skin
323‧‧‧電容性元件 323‧‧‧Capacitive components
324‧‧‧包覆件 324‧‧‧Cover parts
325‧‧‧電路板 325‧‧‧ circuit board
325a‧‧‧訊號連接墊 325a‧‧‧ signal connection pad
325b‧‧‧接地連接墊 325b‧‧‧Ground connection pad
325c‧‧‧連接結構 325c‧‧‧connection structure
34‧‧‧接地探針 34‧‧‧ Grounding probe
θ‧‧‧夾角 Θ‧‧‧ angle
圖1為本發明第一較佳實施例之探針卡結構圖； 圖2為本發明第一較佳實施例之探針模組結構圖；圖3為本發明第一較佳實施例之探針模組分解圖；圖4為本發明第二較佳實施例之探針模組結構圖；圖5為本發明第二較佳實施例之探針卡結構圖；圖6為一示意圖，揭示探針模組之電路板可相互堆疊。 1 is a structural view of a probe card according to a first preferred embodiment of the present invention; 2 is a structural view of a probe module according to a first preferred embodiment of the present invention; FIG. 3 is an exploded view of a probe module according to a first preferred embodiment of the present invention; FIG. 5 is a structural diagram of a probe card according to a second preferred embodiment of the present invention; and FIG. 6 is a schematic view showing that the circuit boards of the probe modules can be stacked on each other.
為能更清楚地說明本發明，茲舉較佳實施例並配合圖示詳細說明如後，請參圖1至3所示，本發明較佳實施例之探針卡用以供連接一檢測機(圖未示)與一待測電子物件(圖未示)，且其結構主要包含有一探針模組30、一基板10以及一固定座20。其中： In order to explain the present invention more clearly, the preferred embodiment will be described in detail with reference to the accompanying drawings. Referring to FIGS. 1 to 3, the probe card of the preferred embodiment of the present invention is used for connecting a detecting machine. (not shown) and an electronic object to be tested (not shown), and the structure mainly comprises a probe module 30, a substrate 10 and a fixing base 20. among them:
由圖2及圖3可知悉，該探針模組30包含有一電源探針32、一接地探針34以及一包覆件324。該電源探針32包含有一探針頭321、一傳導元件322以及一電容性元件323。該探針頭321以導體製成且具有相連接之一針尖段321a與一連接段321b，該針尖段321a用以供點觸該待測電子物件之電源接點(圖未示)，且該針尖段321a與該連接段321b之間具有一夾角θ，而該夾角θ介於90度至180度之間，其中又以介於120度至150度為佳，用以在該針尖段321a點觸該待測電子物件時，使該探針頭321產生彈性應變以卸除點觸時的撞擊力道，而可有效地提升該探針頭321之使用壽命。當然，在實際實施上，該探針頭321亦可呈現筆直而不具有夾角之結構設計。此外，該探針頭321之外徑係由該針尖段321a往該連接段321b之方向漸擴。 As can be seen from FIG. 2 and FIG. 3 , the probe module 30 includes a power probe 32 , a grounding probe 34 , and a covering member 324 . The power probe 32 includes a probe head 321, a conductive element 322, and a capacitive element 323. The probe head 321 is made of a conductor and has a connecting pin segment 321a and a connecting portion 321b for contacting the power contact (not shown) of the electronic object to be tested. The needle tip segment 321a has an angle θ with the connecting segment 321b, and the angle θ is between 90 degrees and 180 degrees, and preferably between 120 degrees and 150 degrees, for the point 321a of the needle tip segment When the electronic object to be tested is touched, the probe head 321 is elastically strained to remove the impact force when the touch is made, and the service life of the probe head 321 can be effectively improved. Of course, in practical implementation, the probe head 321 can also be designed to be straight without an angle. In addition, the outer diameter of the probe head 321 is gradually expanded from the tip end segment 321a toward the connecting portion 321b.
該傳導元件322係用以供與該檢測機之電源輸出端子(圖未示)電性連接，且於本實施例中，該傳導元件322係選用同軸訊號線為例，而具有以導體製成之一訊號傳 導線路322a與一接地傳導線路322c、以及以絕緣材料製成之一隔離層322b與一外皮322d。其中，該訊號傳導線路322a與該探針頭321之連接段321b連接，而該隔離層322b包覆於該訊號傳導線路322a上，該接地傳導線路322c包覆該隔離層322b上，且該外皮322d則包覆於該接地傳導線路322c上，使該隔離層322b位於該訊號傳導線路322a與該接地傳導線路322c之間，而該接地傳導線路322c則位於該隔離層322b與該外皮322d之間，使得檢測環境中之其他因素將受該外皮322d以及該隔離層322b之阻隔，而不會干擾到該訊號傳導線路322a與該接地傳導線路322c上的訊號傳遞。當然，在實際實施上，該傳導元件322亦可選用雙絞線、多蕊絞線、印刷電路板或是軟性電路板等材料製成來達到形成訊號傳導線路與接地傳導線路之目的。 The conducting component 322 is configured to be electrically connected to a power output terminal (not shown) of the detecting device. In the embodiment, the conductive component 322 is an example of a coaxial signal line and has a conductor. One of the signals The conductive line 322a and a grounded conductive line 322c, and an insulating layer 322b and an outer skin 322d are made of an insulating material. The signal conducting line 322a is connected to the connecting portion 321b of the probe head 321, and the isolation layer 322b is coated on the signal conducting line 322a. The ground conducting line 322c covers the isolation layer 322b, and the outer skin 322d is coated on the ground conductive line 322c, such that the isolation layer 322b is located between the signal conducting line 322a and the ground conducting line 322c, and the ground conducting line 322c is located between the isolation layer 322b and the outer skin 322d. Therefore, other factors in the detection environment will be blocked by the outer skin 322d and the isolation layer 322b without disturbing the signal transmission on the signal conducting line 322a and the ground conducting line 322c. Of course, in practical implementation, the conductive component 322 can also be made of materials such as twisted pair, multi-stranded wire, printed circuit board or flexible circuit board to achieve the purpose of forming a signal conducting line and a ground conducting line.
該電容性元件323一端電性連接至該訊號傳導線路322a，而另一端則電性連接至該接地傳輸線路322c。於本實施例中，該電容性元件323係以焊接之方式與該訊號傳導線路322a以及該接地傳輸線路322c直接連接，當然，在實際實施上，亦可透過以導體製成之連接元件(如金屬板、金屬線等，圖未示)分別連接該訊號傳導線路322a以及該接地傳輸線路322c，來達到使電容性元件323之兩端分別透過該連接元件電性連接該訊號傳導線路322a以及該接地傳輸線路322c。 The capacitive element 323 is electrically connected to the signal conducting line 322a at one end and electrically connected to the ground transmitting line 322c at the other end. In this embodiment, the capacitive component 323 is directly connected to the signal conducting line 322a and the grounding transmission line 322c by soldering. Of course, in practical implementation, the connecting component made of a conductor may also be A metal plate, a metal wire, or the like, which is not shown, is connected to the signal conducting line 322a and the grounding connecting line 322c, respectively, so that both ends of the capacitive element 323 are electrically connected to the signal conducting line 322a through the connecting element, respectively. Ground transmission line 322c.
該接地探針34係以導體製成且電性連接至該接地傳輸線路322c，並用以供點觸該待測電子物件之接地接點(圖未示)。於本實施例中，該接地探針34係彎折後直接以焊接於該接地傳輸線路322c之方式使其與該接地傳輸線路322c電性連接，以使該接地傳導線路322c具有接地之效果。當然，在其他實施方式中，亦可透過以導體製成之連 接元件(如金屬板、金屬線等，圖未示)分別連接該接地探針34與該接地傳輸線路322c，使該接地探針34透過該連接元件電性連接至該接地傳輸線路322c。 The grounding probe 34 is made of a conductor and electrically connected to the grounding transmission line 322c, and is used for contacting a grounding contact (not shown) of the electronic object to be tested. In this embodiment, the grounding probe 34 is bent and directly connected to the grounding transmission line 322c by soldering to the grounding transmission line 322c, so that the grounding conducting line 322c has the effect of grounding. Of course, in other embodiments, it can also be connected through a conductor. Connecting components (such as metal plates, metal wires, etc., not shown) are respectively connected to the grounding probe 34 and the grounding transmission line 322c, so that the grounding probe 34 is electrically connected to the grounding transmission line 322c through the connecting component.
該包覆件324以絕緣材質製成，且包覆於該探針頭321之部分部位、該傳導元件322之部分部位、該接地探針34之部分部位以及該電容性元件323上，藉以進一步固定該上述元件與其他元件相連接之地方，而可避免上述元件焊接固定後脫落之情形，進而增加該探針模組30之可靠度。於本實施例中，該包覆件324係以可固性之環氧樹脂(Epoxy)製成，該環氧樹脂之初始狀態係呈膠質並用以塗抹於該探針頭321之部分部位、該傳導元件322之部分部位、該接地探針34之部分部位以及該電容性元件323上後，再利用光照或是加熱使其固化，進而達到上述包覆該些元件之目的。當然，除使用環氧樹脂外，亦可使用其他絕緣材質來製成該包覆件。 The covering member 324 is made of an insulating material and covers a part of the probe head 321 , a part of the conductive element 322 , a part of the grounding probe 34 , and the capacitive element 323 , thereby further Fixing the connection between the above components and other components can avoid the situation that the components are detached after soldering and fixing, thereby increasing the reliability of the probe module 30. In the embodiment, the covering member 324 is made of a curable epoxy resin (Epoxy), and the initial state of the epoxy resin is gelatinized and applied to a part of the probe head 321 . A portion of the conductive element 322, a portion of the ground probe 34, and the capacitive element 323 are then cured by illumination or heating to achieve the above-described purpose of coating the components. Of course, in addition to the use of epoxy resin, other insulating materials can be used to make the covering member.
該基板10於本實施例中係一印刷電路板，除用以佈設有檢測所須之電路佈局(圖未示)外，主要用以支撐及承載該探針卡之其他元件。此外，該基板10上更具有一通孔12，且該通孔12貫穿該基板10相反的兩側，用以供該傳導元件322穿設，以達到節省設置空間，使該探針卡可達到小型化之目的。 In this embodiment, the substrate 10 is a printed circuit board, and is mainly used to support and carry other components of the probe card except for the circuit layout (not shown) for detecting. In addition, the substrate 10 further has a through hole 12, and the through hole 12 extends through opposite sides of the substrate 10 for the conductive element 322 to pass through, so as to save space and make the probe card small. The purpose of the transformation.
該固定座20設置於該基板10上，且於本實施例中，該固定座20包含有一載座22以及一絕緣固定件24，該載座22與該基板10連接，而該絕緣固定件34係以環氧樹脂(Epoxy)製成並設置於該載座22上，並包覆於該包覆件324外，使該探針頭321之部分部位、該傳導元件322之部分部位、該接地探針34之部分部位以及該電容性元件323埋設於該絕緣固定件24之中，進而達到固定該探針模組30 之目的。當然，除使用環氧樹脂外，該絕緣固定件24亦可使用其他絕緣材質來製成。此外，該探針頭321埋設於該絕緣固定件24之後，透過該探針頭321外徑呈現漸擴之結構設計，該探針頭321將不會輕易地自該包覆件324與該絕緣固定件24中脫出，而可提升該探針卡檢測時的可靠度。 The holder 20 is disposed on the substrate 10, and in the embodiment, the holder 20 includes a carrier 22 and an insulating fixture 24, the carrier 22 is coupled to the substrate 10, and the insulating member 34 is attached. It is made of epoxy resin (Epoxy) and is disposed on the carrier 22 and covered on the outside of the covering member 324 to make a part of the probe head 321 , a part of the conducting component 322 , and the grounding. A portion of the probe 34 and the capacitive component 323 are embedded in the insulating fixture 24 to fix the probe module 30. The purpose. Of course, in addition to the use of epoxy resin, the insulating fixture 24 can also be made using other insulating materials. In addition, the probe head 321 is embedded in the insulating fixture 24, and the outer diameter of the probe head 321 is designed to be gradually expanded. The probe head 321 will not easily be insulated from the covering member 324. The fixing member 24 is disengaged, and the reliability of the probe card detection can be improved.
是以，透過上述將該電容性元件323連接至該訊號傳導線路322a與該接地傳導線路322c的結構設計，將使得該電容性元件323呈現與該探針頭321相互並聯之電路結構。如此一來，當該檢測裝置之電源輸出端子輸出電源訊號時，電源訊號將透過該傳導元件322之訊號傳導線路322a對該電容性元件323進行儲能，並透過該探針頭321將該電容性元件323之儲能輸出至該待測電子物件之電源接點，而使得電能可透過最短之傳輸路徑供予該待測電子物件，而可大幅地降低傳輸時之耗損，進而達到提升供電穩定度之效果。 Therefore, the structural design of connecting the capacitive element 323 to the signal conducting line 322a and the ground conducting line 322c is such that the capacitive element 323 assumes a circuit configuration in parallel with the probe head 321 . In this way, when the power output terminal of the detecting device outputs a power signal, the power signal will store the capacitive component 323 through the signal conducting line 322a of the conducting component 322, and the capacitor is transmitted through the probe head 321 The energy storage of the component 323 is output to the power contact of the electronic object to be tested, so that the electrical energy can be supplied to the electronic object to be tested through the shortest transmission path, thereby greatly reducing the loss during transmission, thereby improving the stability of the power supply. The effect of the degree.
此外，由於上述之該電容性元件323係連接於該傳導元件322，而非直接連接至該探針頭321，而此連接方式之好處除可達到儲能與供能的效果外，亦不會影響該探針頭321點觸該待測電子物件時的機械作動，而具有提升效能並保持可靠度之多重優點。 In addition, since the capacitive element 323 is connected to the conductive element 322 instead of being directly connected to the probe head 321, the connection method has the advantages of energy storage and energy supply, and It affects the mechanical action of the probe head 321 when it touches the electronic object to be tested, and has the multiple advantages of improving performance and maintaining reliability.
除上述結構外，請參閱圖4，為本發明第二較佳實施例之探針模組，其包含有與上述結構相同之該探針頭321、該傳導元件322以及該電容性元件323，於此容不再贅述，而與上述實施例不同之處在於其電源探針更包含有一電路板325，且該電路板325上設有以導體製成且相互分離的一訊號連接墊325a以及一接地連接墊325b，且該探針頭321、傳導元件322、該電容性元件323以及接地探針36係設置於該電路板325上，而該探針頭321、該訊號傳導線路 322a以及該電容性元件323一端係與該訊號連接墊325a連接，而該接地傳導線路322c、該電容性元件323另一端、以及該接地探針36則與該接地連接墊325b連接，且透過上述該電路板325之設計，選用長度較短之接地探針36即可達到電性連接至該接地傳導線路322c，而可減少接地路徑上的損耗。 In addition to the above structure, referring to FIG. 4, a probe module according to a second preferred embodiment of the present invention includes the probe head 321, the conductive element 322, and the capacitive element 323. The difference from the above embodiment is that the power supply probe further includes a circuit board 325, and the circuit board 325 is provided with a signal connection pad 325a made of a conductor and separated from each other and a The grounding connection pad 325b, the probe head 321, the conductive element 322, the capacitive element 323 and the grounding probe 36 are disposed on the circuit board 325, and the probe head 321 and the signal conducting line 322a and one end of the capacitive element 323 are connected to the signal connection pad 325a, and the ground conduction line 322c, the other end of the capacitive element 323, and the ground probe 36 are connected to the ground connection pad 325b, and The circuit board 325 is designed to be electrically connected to the ground conducting line 322c by using a short length grounding probe 36 to reduce losses on the ground path.
如此一來，當該檢測裝置之電源輸出端子輸出電源訊號時，電源訊號將經由該訊號傳導線路322a與該訊號連接墊325a對該電容性元件323進行儲能，並透過該訊號連接墊325a與該探針頭321將該電容性元件323之儲能輸出至該待測電子物件，而同樣可達到提升供電穩定度以及保持機械作動可靠度之效果。 In this way, when the power output terminal of the detecting device outputs a power signal, the power signal will store the capacitive component 323 via the signal conducting line 322a and the signal connecting pad 325a, and through the signal connecting pad 325a and The probe head 321 outputs the energy storage of the capacitive element 323 to the electronic object to be tested, and the effect of improving the power supply stability and maintaining the mechanical operation reliability is also achieved.
另外，請參閱圖5，透過上述該電路板325之設計，本發明之探針卡亦可不用將該探針頭321、該傳導元件322、該接地探針34以及該電容性323元件埋設於前一實施例之該絕緣固定件24中，而將該電路板325直接鎖設於具有斜面之固定座40上，即可達到固定該探針頭321、該電容性元件323以及該傳導元件322等構件之目的。 In addition, referring to FIG. 5, through the design of the circuit board 325, the probe card of the present invention may not be embedded in the probe head 321, the conductive element 322, the grounding probe 34, and the capacitive 323 element. In the insulating fixing member 24 of the previous embodiment, the circuit board 325 is directly locked on the fixing base 40 having a slope, thereby fixing the probe head 321, the capacitive element 323 and the conducting element 322. The purpose of the components.
值得一提的是，請參閱圖6，於第二實施例之基礎下，該電路板325更可設置有一凸起之連接結構325c用以連接另外一電源探針之電路板325，使得該些電路板325可相互堆疊設置而具有複數組探針頭321，進而使得本發明之探針卡可達到多工檢測之目的。此外，由於該連接結構325c具有一定高度，而使得該些電路板325透過連接結構325c連接後，各該電路板325上之探針頭321將不會與另外一該電路板上325之探針頭321接觸，而可避免檢測時出現探針頭321相互干涉之情形，進而確保檢測時的可靠度。 It is to be noted that, referring to FIG. 6, on the basis of the second embodiment, the circuit board 325 can be further provided with a protruding connection structure 325c for connecting another circuit board 325 of the power probe. The circuit boards 325 can be stacked on each other to have a multi-array probe head 321, so that the probe card of the present invention can achieve the purpose of multiplex detection. In addition, since the connection structure 325c has a certain height, and the circuit boards 325 are connected through the connection structure 325c, the probe heads 321 on the circuit boards 325 will not be probed with another circuit board 325. The head 321 is in contact, and the occurrence of interference between the probe heads 321 at the time of detection can be avoided, thereby ensuring reliability at the time of detection.
必須說明的是，以上所述僅為本發明較佳可行實施例而已，並不以上述說明為限，舉凡應用本發明說明書及申請專利範圍所為之等效變化，理應包含在本發明之專利範圍內。 It should be noted that the above description is only a preferred embodiment of the present invention, and is not intended to be limited to the above description, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention. Inside.
30‧‧‧探針模組 30‧‧‧ Probe Module
32‧‧‧電源探針 32‧‧‧Power probe
321‧‧‧探針頭 321‧‧‧ probe head
322‧‧‧傳導元件 322‧‧‧Transmission elements
322a‧‧‧訊號傳導線路 322a‧‧‧ Signal transmission line
322b‧‧‧隔離層 322b‧‧‧Isolation
322c‧‧‧接地傳導線路 322c‧‧‧ Grounded Conduction Line
322d‧‧‧外皮 322d‧‧‧ skin
323‧‧‧電容性元件 323‧‧‧Capacitive components
324‧‧‧包覆件 324‧‧‧Cover parts
34‧‧‧接地探針 34‧‧‧ Grounding probe
Claims (18)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103144987A TWI592077B (en) | 2014-12-23 | 2014-12-23 | Probe card and its probe module and power probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103144987A TWI592077B (en) | 2014-12-23 | 2014-12-23 | Probe card and its probe module and power probe |
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| Publication Number | Publication Date |
|---|---|
| TW201625086A TW201625086A (en) | 2016-07-01 |
| TWI592077B true TWI592077B (en) | 2017-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW103144987A TWI592077B (en) | 2014-12-23 | 2014-12-23 | Probe card and its probe module and power probe |
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| TW (1) | TWI592077B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI692644B (en) * | 2019-06-18 | 2020-05-01 | 旺矽科技股份有限公司 | Electronic component probing device |
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| TW201625086A (en) | 2016-07-01 |
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