201110255 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種晶圓劈裂整乎步 ^ a m Λ衣坌十衷置，尤指一種應用 於日日圓劈裂機中，用以晶圓劈裂蚌裎徂3 方衮時挺供晶圓整平功能之晶 圓劈裂整平裝置。 【先前技術】 半導體元件的製造過程，主要是將晶圓以切割或裂片 的手段分割成多數晶粒’再將晶粒固定在載體上進行電路 佈設，最後用封夥體包覆晶粒封裝成形，而t成一且有特 定功能的半導體元件’於此過程中，晶圓的裂片製程，主 要是將待分割的晶圓先進行預切割M吏晶圓表面形成多數 縱橫交錯的淺溝，並放置於晶圓劈裂機的載台i，再經過 對正定位後，驅動設置於載具上方的衝擊裝置衝擊劈刀， 進而給予晶圓一個衝擊力量’使晶圓自其預切割的淺溝位 置劈裂。 唯晶圓製造及加工過程中，往往因加工誤差或材料微 小變形’而產生晶圓微凸或翹曲等不平整的情形，進而 造成在晶圓劈裂過程中，劈刀無法精確地對正預割線，且 降低劈刀接觸晶圓表面的垂直度’進而使晶圓的劈裂面產 生不平整的情形響晶粒的品質，降低了半導體元 良率。 巧 【發明内容】 本發明之主I目的在於提供一種晶圓劈裂整平裝置， 希望藉此設計’改善因晶圓微凸或翹曲，巾導致劈裂時的 201110255 劈裂面不平整的情形。 為達前揭目的，本發明晶圓劈裂整平裝置係用以裝設 於晶圓劈裂機中可被驅動上下移動的活動基座±，及：： 晶圓劈刀的側邊，該晶圓劈裂整平裝置係包含： 一線性導件，其包含可相對於該活動基座上下直線運 動的活動端部；以及 一壓抵組件，其裝設於該線性導件的活動端部。 本發明藉由設置可相對於活動基座上下直線運動㈣ 抵組件，藉由壓抵組件本身的重力，纟晶圓劈裂前先行壓 抵整平晶圓，降低晶圓微凸或翹曲的情形，使劈刀可以更 精確地對準預割線，並提升劈刀與晶圓的接觸垂直度，進 而使晶圓的劈裂面更加平整。 本發明之次一目的，係令該線性導件尚包含二固定 座，該二固定座相對設置於該活動基座近底端處的兩側， 該二固定座各設有可相對其上下直線運動的二導桿，各導 桿近底端處形成該活動端部；該壓抵組件包含二連結塊以 及一配重塊，該一連結塊係設於該劈刀的兩側，其中一連 結塊固設於近活動基座側的二活動端部，另一連結塊固設 於遠離活動基座側的二活動端部，該二配重塊分別鎖接於 該二連結塊一側底端》 藉由設置該劈刀兩側的二連結塊與二配重塊，同時壓 抵晶圓劈裂位置的兩側’以防止晶圓一端翹起的情況；並 藉由可分離於連結塊之配重塊’使壓抵晶圓的力度可藉由 調整該配重塊的重量來調整，並可視需求靈活替換配重 塊，以達到最適當的整平效果。 201110255 本發明之另一目的，係令該晶圓劈裂整平裝置尚包含 二燈組，該二燈組位於該二連結塊的外側，各燈組包含一 燈座’該其中一燈組的燈座設於活動基座，另一燈組的燈 座固設於遠離活動基座側的連結塊，該二燈座底端各設有 直線排列的複數發光二極體，各燈座底端發光二極體外側 叹有透明罩體’該二透明罩體底端各形成一朝向連結塊 方向的斜切面。 藉由該二燈組的照明，使操作員在施行劈裂及整平過 鲁程時，方便進行檢查及掌握平台狀況，而透明罩體底端的 斜切面可將光線折射集中，提升聚光照明的效果。 【實施方式】 請參閱第一圖至第四圖所示，為本發明晶圓劈裂整平 裝置裝設於晶圓劈裂機之一較佳實施例，該晶圓劈裂機包 含一可藉由動力驅動而上下移動的活動基座（10)，以及設 於近該活動基座（1〇)底側的一劈刀（5)，本發明晶圓劈裂整 籲 平裝置係裝設於該活動基座（1 0)上，並位於該劈刀（5)的側 邊’該晶圓劈裂整平裝置包含一線性導件（2)及一壓抵組件 (3)’或更進一步包含有二燈組（4)。 該線性導件（2)可包含二固定座（21 )，該二固定座（21) 相對6又置於該活動基座（1 〇)近底端處的左右兩側，且該二 固定座（21)前後側各設有一上下貫穿的通孔（23)，各通孔 (23)中分別設有可上下直線運動的一導桿（22)，該四導桿 (22)近底端處各形成一活動端部（221)，各導桿（22)頂側可 進一步形成一凸緣（222)，且各凸緣（222)外徑大於通孔（23) 的孔徑’藉此限制導桿（22)下降的行程。 201110255 該壓抵組件（3)可包含二連結塊（31)以及二配重塊 (32)，請配合第四圖所示，該二連結塊（31)係設於劈刀（5) 的兩側，其中一連結塊（31)固設於近活動基座（1 〇)側的二活 動端部（221)’另一連結塊（31)固設於遠離活動基座（1 〇)側 的二活動端部（221) ’該二配重塊（32)分別鎖接於該二連結 塊（31)—側底端。 該二燈組（4)位於二連結塊（31)的外側，各燈組（4)包含 一燈座（40)，該其中一燈組（4)的燈座（40)設於活動基座 (10) ’另一燈組（4)的燈座（40)固設於遠離活動基座（1〇)側的 連結塊（31 )，該二燈座（40)底端各設有直線排列的複數發光 二極體（41)，各燈座（40)底端發光二極體（41)外側設有一透 明罩體（42)，該一透明罩體（42)底端各形成一朝向連結塊方 向的斜切面（421)。 本發明晶圓劈裂整平裝置於作動時，請配合參閱第五 圖，係藉由如馬達、氣壓缸…等動力源帶動活動基座（1〇) 向下移動’帶動固接於該活動基座（1〇)的二固定座（2 ”， 各導桿（22)藉由其頂側的凸緣（222)抵靠於相應的固定座 (21) 而隨之往下移動，使連結於各導桿（22)的壓抵組件（3) 連動下移，此時該活動基座（1〇)、二固定座（21)、四導桿 (22) 以及壓抵組件（3)同動下移；請配合參閱第六圖及第七 圖，當該活動基座（10)下移至壓抵組件（3)抵靠於晶圓（6) 時’藉由可相對於活動基座（10)及固定座（21)上下直線移 動的四導桿（22)，該壓抵組件（3)停止移動，並藉由該壓抵 組件（3)本身的重量壓抵晶圓（6)。 本發明藉由該相對於活動基座（彳〇)可上下垂直運動的 201110255 壓抵組件（3)，整平晶圓（6)微凸或翹曲的情形，使劈刀（5) 可以更精確地對準預切線’且提升劈刀(5)與晶圓⑹接觸 面的垂直度，進而使晶圓（6)劈裂面可以更加平整且準確； 其次，藉由設置該可與連結塊（31)分離的配重塊（32)，使 壓抵晶圓（6)的力度可藉由調整該配重塊（32)的重量來調 整，以達到最適當的整平效果；此外，並藉由二燈組⑷的 設置，方便操作員檢查劈裂及整平過程，透明罩體（42)底 端的斜切面（42”可將光線折射集中，提升聚光照明的效 【圖式簡單說明】 第一圖：為本發明晶圓劈裂整平裝置的一較佳實施例 裝設於晶圓劈裂機之立體分解圖。 第二圖：為本發明晶圓劈裂整平裝置的一較佳實施例 裝設於晶圓劈裂機之立體外觀圖。 第三圖：為本發明晶圓劈裂整平裝置的一較佳實施例 裝設於晶圓劈裂機之剖視圖。 第四圖：為本發明晶圓劈裂整平裝置較佳實施例之燈 組與連結塊的組合示意圖。 第五圖：為本發明晶圓劈裂整平裝置較佳實施例之未 壓抵晶圓的狀態示意圖。 第六圖：為本發明晶圓劈裂整平裝置較佳實施例之壓 抵晶圓的狀態示意圖。 第七圖：為第六圖中較佳實施例的側視圖。 【主要元件符號說明】 201110255 (1 ο)活動基座 (2) 線性導件 (22)導桿 (222)凸緣 (3) 壓抵組件 (3 2)配重塊 (4) 燈組 (41)發光二極體 (421)斜切面 (5) 劈刀 (6) 晶圓 (21)固定座 (221)活動端部 (23)通孔 (31)連結塊 (40)燈座 (42)透明罩體201110255 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a wafer splitting process, in particular, a method for use in a wafer splitting machine for wafers The splitting 蚌裎徂3 square 挺 is a wafer splitting leveling device for the wafer leveling function. [Prior Art] The manufacturing process of semiconductor components is mainly to divide the wafer into a plurality of crystal grains by means of cutting or splitting, and then fix the crystal grains on the carrier for circuit layout, and finally form the package by the package body. In this process, the wafer splicing process is mainly to pre-cut the wafer to be divided, and form a plurality of criss-cross shallow trenches on the surface of the wafer and place them. After the wafer i of the wafer splitting machine is aligned, the impact device disposed above the carrier is driven to impact the boring tool, thereby giving the wafer an impact force to make the wafer from its pre-cut shallow groove position. Splitting. In wafer fabrication and processing, irregularities such as micro-convex or warpage of the wafer are often caused by machining errors or slight deformation of the material, which causes the file to be accurately aligned during the wafer splitting process. Pre-cutting the line and reducing the verticality of the surface of the wafer contacting the wafer', so that the uneven surface of the wafer is uneven, the quality of the grain is reduced, and the yield of the semiconductor element is lowered. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a wafer splitting and leveling device, which is expected to be designed to improve the unevenness of the 201110255 split surface caused by the micro-convex or warpage of the wafer and the splitting of the towel. situation. For the purpose of the prior art, the wafer splitting and leveling device of the present invention is used for the movable base ± which can be driven to move up and down in the wafer splitting machine, and: the side of the wafer file, The wafer splitting leveling device comprises: a linear guide comprising a movable end portion movable linearly up and down with respect to the movable base; and a pressing member mounted on the movable end of the linear guide . The invention is arranged to move up and down with respect to the movable base (four) to abut the component, and by pressing the gravity of the component itself, the wafer is pressed against the flattening wafer before the wafer is split, thereby reducing the micro-convex or warpage of the wafer. In this case, the file can be more precisely aligned with the pre-cut line and the contact perpendicularity of the file to the wafer is increased, thereby making the split surface of the wafer smoother. The second object of the present invention is that the linear guide further includes two fixing bases, and the two fixing bases are oppositely disposed on two sides of the movable base near the bottom end, and the two fixing bases are respectively provided with a straight line up and down The movable guide rods are formed at the near end of each of the guide rods; the pressing member comprises two connecting blocks and a weighting block, the connecting blocks are disposed on two sides of the file, one of the links The block is fixed to the two movable ends of the side of the movable base, and the other connecting block is fixed to the two movable ends of the side of the movable base. The two weights are respectively locked to the bottom end of the two connecting blocks. By setting the two connecting blocks and the two weights on both sides of the file, and simultaneously pressing against both sides of the wafer splitting position to prevent the wafer from being lifted at one end; and by being separable from the connecting block The weight 'to make the force against the wafer can be adjusted by adjusting the weight of the weight, and the weight can be flexibly replaced as needed to achieve the most appropriate leveling effect. Another object of the present invention is that the wafer splitting and leveling device further comprises a second light group, the two light groups are located outside the two connecting blocks, and each of the light groups comprises a lamp holder. The lamp holder is disposed on the movable base, and the lamp holder of the other lamp group is fixed on the connecting block away from the side of the movable base. The bottom ends of the two lamp holders are respectively provided with a plurality of light-emitting diodes arranged in a line, and the bottom ends of the lamp holders are respectively arranged. The outer side of the light-emitting diode sighs a transparent cover. The bottom ends of the two transparent covers each form a chamfered surface facing the direction of the connecting block. By the illumination of the two groups of lights, the operator can conveniently check and grasp the condition of the platform when performing the splitting and leveling, and the chamfered surface at the bottom end of the transparent cover can refract the light to enhance the concentrated illumination. Effect. [Embodiment] Please refer to the first to fourth figures, which is a preferred embodiment of the wafer splitting and flattening device of the present invention. The wafer splitting machine comprises a a movable base (10) that moves up and down by power driving, and a trowel (5) disposed on a bottom side of the movable base (1〇), the wafer splitting and flattening device of the present invention is installed On the movable base (10) and on the side of the file (5) 'The wafer splitting and flattening device comprises a linear guide (2) and a pressing assembly (3)' or Further included are two light groups (4). The linear guide (2) may include two fixing seats (21), and the two fixing seats (21) are oppositely disposed on the left and right sides of the movable base (1 〇) near the bottom end, and the two fixing seats (21) A front and a through hole (23) is formed in each of the front and rear sides, and each of the through holes (23) is respectively provided with a guide rod (22) which can move up and down linearly, and the four guide rods (22) are near the bottom end Each of the movable end portions (221) is formed, and a flange (222) is further formed on the top side of each of the guide rods (22), and an outer diameter of each of the flanges (222) is larger than an aperture of the through hole (23). The stroke of the rod (22) is lowered. 201110255 The pressing component (3) may comprise two connecting blocks (31) and two weighting blocks (32), as shown in the fourth figure, the two connecting blocks (31) are provided on the two files of the file (5) On the side, one of the connecting blocks (31) is fixed to the two movable ends (221) on the side of the near movable base (1 '). The other connecting block (31) is fixed on the side away from the movable base (1 〇). The two movable ends (221) 'the two weights (32) are respectively locked to the two connecting blocks (31) - the side bottom end. The two light groups (4) are located outside the two connecting blocks (31), and each of the light groups (4) comprises a lamp holder (40), and the lamp holder (40) of one of the lamp groups (4) is disposed on the movable base (10) The lamp holder (40) of the other lamp group (4) is fixed to the connecting block (31) on the side away from the movable base (1〇), and the bottom ends of the two lamp holders (40) are arranged in a straight line. a plurality of light-emitting diodes (41), a transparent cover body (42) is disposed on the outer side of the bottom end of the light-emitting diodes (41) of each of the lamp holders (40), and a bottom end of the transparent cover body (42) is formed to face each other. A chamfered surface in the block direction (421). When the wafer splitting and leveling device of the present invention is actuated, please refer to the fifth figure. The power base (such as a motor, a pneumatic cylinder, etc.) is used to drive the movable base (1〇) to move downward to drive the activity. Two fixing bases (2" of the base (1", each guiding rod (22) is moved downward by the flange (222) of the top side thereof to abut against the corresponding fixing seat (21), so that the connecting The pressing member (3) of each guiding rod (22) is moved downward, and the movable base (1〇), the two fixing bases (21), the four guiding rods (22) and the pressing assembly (3) are Move down; please refer to the sixth and seventh figures, when the movable base (10) moves down to the pressing assembly (3) against the wafer (6) 'by being movable relative to the movable base (10) and the four guide rods (22) of the fixed seat (21) moving linearly up and down, the pressing assembly (3) stops moving, and the weight of the pressing assembly (3) itself is pressed against the wafer (6) The invention can be used to flatten the wafer (6) by micro-convex or warping by the 201110255 pressing component (3) which can move vertically up and down with respect to the movable base (彳〇), so that the file (5) can be More precise alignment The tangent line 'and the verticality of the contact surface of the boring tool (5) and the wafer (6), so that the cleavage surface of the wafer (6) can be more flat and accurate; secondly, by being disposed separately from the joint block (31) The weight (32) allows the force against the wafer (6) to be adjusted by adjusting the weight of the weight (32) to achieve the most appropriate leveling effect; (4) The setting is convenient for the operator to check the splitting and leveling process. The chamfered surface (42" at the bottom end of the transparent cover (42) can refract the light and concentrate the effect of the concentrated illumination. [Simple description of the figure] First figure: An exploded perspective view of a wafer splitting apparatus according to a preferred embodiment of the wafer splitting and leveling apparatus of the present invention. FIG. 2 is a perspective view of a preferred embodiment of the wafer splitting and leveling apparatus of the present invention. A perspective view of a wafer splitting machine. Fig. 3 is a cross-sectional view showing a wafer splitting machine according to a preferred embodiment of the wafer splitting and leveling device of the present invention. Schematic diagram of the combination of the lamp set and the connecting block of the preferred embodiment of the wafer splitting and leveling device. A schematic diagram of a state in which the wafer is not pressed against the wafer in the preferred embodiment of the wafer splitting and leveling device. Fig. 6 is a view showing a state of pressing the wafer against the preferred embodiment of the wafer splitting and leveling device of the present invention. Figure: is a side view of the preferred embodiment of the sixth figure. [Main component symbol description] 201110255 (1 ο) movable base (2) linear guide (22) guide rod (222) flange (3) pressed Component (3 2) Counterweight (4) Lamp group (41) Light-emitting diode (421) Oblique cut surface (5) Sickle (6) Wafer (21) Fixed seat (221) movable end (23) Hole (31) connecting block (40) lamp holder (42) transparent cover
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