201105974 六、發明說明： c發明戶斤屬之技術領域3 發明領域 本發明關於一種能夠容易地拾起目標物件的拾起穿置 以及一種具有其之發光二極體晶片選別裝置。 I；先前技術3 發明背景 為了加工、測試及選別小尺寸或薄型目標物件，必須 拾取及移動目標物件。然而，若多個目標物件聚集在一起 或接近地黏附至饋入構件或類似物，則不容易拾起目標。 因此，拾起失敗或者會在目標物件上造成損壞(諸如破裂、 剝落或括痕），這樣會轉而導致產量的下降、處理時間的延 遲、生產成本的增加等等。 此種目標物件可為發光二極體晶片。發光二極體⑽⑺ 係-種將電力轉換為光線的半導體發光元件。發光二極體 也稱作冷光二極體。 發光二極體經由EPI製程、晶片製程（製造)及封裝製程 生產。發光二極體在通過封裝製程而封裝之後進行測試製 红。在κ製程中’不正常運作的[咖(以下稱作“劣質貨 品”)被排除，而正常運作的咖(以下稱作“優質貨品，，)依據 它們的表現被選別成為多個等級，㈣進行裝船運送。 此處，在測試製程中，由於封裝製程期間引起的問題， LEDS可能會被排除成為劣質貨品或被選減為較低的等 級’而且由於製造如(在崎«製歡前，LE崎製造 201105974 成晶片的狀態（以下稱作“LED晶片，，))產生的問題，它們會 排除成為劣質貨品或選別成為較低的等級。所以，必須正 則里發光一極體晶片的表現並選別它們以使其等不必 通過不必要的封裝製程及測試製程。在這種發光二棰艚晶 片選別製程中，為了將發光二極體晶片從饋人裝置務動至 承載裂置或者從卸«置移動至選別裝置，發光二極雜晶 片需要被快逮且穩定地拾起。 目標物件的另一實例為半導體晶片。在半導雜製程 ▲曰曰圓被切韻為晶片’然後組織成為半導體晶片。 因為這些半導體^財収絲•，各個半導赠晶月 必須從黏著帶分離以將它拾起。 卜就：而έ ’需要一種經濟的拾起裝置，其能夠快速、 穩定且容易地料目標物件，諸如發光二極體晶》成半導 體晶片。 【發明内容】 發明概要 上述情形，本發明提供-種能齡易拾起 的拾起裝置及—猶1女# ^, 種>、有其之發光二極體晶^{選別裝置 為了達到上述目的，本發明可包括以下構型。 康本發明一貫施例，提供一種構型成拾取位於持住 構:上之Μ票物件的拾起裝置，該裝置包括―支持構件， 、;Λ持住構件下方且在面向該持住構件之表面上備 置有一凹槽；-切針，其設置於該支持構件之凹槽内側 ° 乂持住構件突出且在穿透該饋人構件之後能夠支持 201105974 該目標物件；及一拾起件，其設置於該目標物件上方以拾 取該目標物件。而且至少一氣流抽吸洞穿過該支持構件的 凹槽而備置。 根據本發明一實施例，一安置洞穿過該支持構件的凹 槽而備置，且該支持針穿過該安置洞而定位。 根據本發明一實施例，該支持構件具有接觸該持住構 件的接觸表面，該凹槽位於該接觸表面的内側，而且，當 從該支持構件的上方觀看時，該抽吸洞與該支持構件中心 間的距離比該抽吸洞與該接觸表面間的距離還短。 根據本發明一實施例，拾起裝置更包括通過該抽吸洞 提供用於朝向該凹槽内側移動該持住構件之抽吸力的一抽 吸裝置。 根據本發明一實施例，構型成上下移動該支持針的一 針升高元件。 根據本發明一實施例，該拾起件藉由大氣壓力吸引該 目標物件。 根據本發明一實施例，該持住構件為朝著該目標物件 之面向表面具有黏合性的一薄膜。 根據本發明一實施例，該目標物件為一發光二極體晶 片或一半導體晶片。 根據本發明一實施例，多數的目標物件彼此相鄰地設 於持住構件上，及該裝置更包括一延伸構件，其構型成延 伸該持住構件以讓該多數的目標物件得以彼此空間上分 201105974 盆設=據本發明—實_，該延伸構件包括—支持機制， 同^維^持住構件的下方且構型成藉由上推該持住構件 ，°亥持住構件的底表面而延伸該持住構件。 其設ί據本發明—實施例，歧伸構件包括—支持機制， 同時纟於忒持住構件的上方且構型成藉由下推該持住構件 、准持該持住構件的頂表面而延伸該持住構件。 據本發明另一實施例，提供一種藉由測量發光二極 曰Μ ^ 寺性而選別發光二極體晶片的發光二極體晶片選 ^政置忒裝置包括：一饋入件，其包括構型成將發光二 極體晶片安裝於其上的—安裝構件’且其個為在-承載 位置、一測試位置及一卸載位置之間轉動該安裝構件，該 發光二極體晶片於該承載位置處被裝載於該安裝構件上， 。玄發光一極體晶片於該測試位置處被測試，該發光二極體 晶片於該卸載位置處從該安裝構件上卸載；一承載件，其 緊鄰該饋入件設置且包括一拾起裝置及一承載單元，該拾 起裝置構型成在該承載位置處從容納有多數發光二極體晶 片的饋入構件中拾取一發光二極體晶片，及該承載單元構 型成將該被拾起的發光二極體晶片承載於該安裝構件上； 一測試件，其緊鄰該饋入件設置且作用為在該測試位置處 測量該發光二極體晶片的特性；及一卸載件，其緊鄰該饋 入件設置且作用為在該卸載位置處從該安裝構件上卸載該 經測試的發光二極體晶片，其中該拾起裝置包括：一支持 構件，其設置於該饋入構件下方且在面向該饋入構件之表 面上備置有一凹槽；一支持針，其設置於該支持構件之四 201105974 槽内側以朝向該饋入構件突出且在穿透該饋入構件之後能 夠支持該目標物件；及一拾起件，其設置於該目標物件上 方以拾取該目標物件，其中至少一氣流抽吸洞穿過該支持 構件的凹槽而備置。 根據本發明另一實施例，提供一種藉由測量發光二極 體晶片之特性而選別發光二極體晶片的發光二極體晶片選 別裝置，該裝置包括：一饋入件，其包括構型成將發光二 極體晶片安裝於其上的一安裝構件，且其作用為在一承載 位置、一測試位置及一卸載位置之間轉動該安裝構件，該 發光二極體晶片於該承載位置處被裝載於該安裝構件上， 該發光二極體晶片於該測試位置處被測試，該發光二極體 晶片於該卸載位置處從該安裝構件上卸載；一承載件，其 緊鄰該饋入件設置且作用為在該承載位置處將要被測試的 發光二極體晶片饋入於該安裝構件上；一測試件，其緊鄰 該饋入件設置且作用為在該測試位置處測量該發光二極 體晶片的特性；及一卸載件，其緊鄰該饋入件設置且包括 一拾起裝置及一選別單元，該拾起裝置構型成在該卸載位 置處從容納多數發光二極體晶片的一容納構件中拾取一發 光二極體晶片，及該選別單元構型成轉送該拾起之LED， 其中該拾起裝置包括：一支持構件，其設置於該容納構件 下方且在面向該容納構件之表面上備置有一凹槽；一支持 針，其設置於該支持構件之凹槽内側以朝向該容納構件突 出且在穿透該容納構件之後能夠支持該目標物件；及一拾 起件，其設置於該目標物件上方以拾取該目標物件，其中 201105974 至少一氣流抽吸洞穿過該支持構件的凹槽而備置。 根據本發明另一實施例，該饋入件包括從轉動軸朝徑 向方向延伸的多數支持架，及該安裝構件設置於各個支持 架的一端部。 根據本發明另一實施例，該發光二極體晶片選別裝置 更包括通過該抽吸洞提供用於朝向該凹槽内側移動該持住 構件之抽吸力的一抽吸裝置。 根據本發明另一實施例，該發光二極體晶片選別裝置 更包括構型成上下移動該支持針的一針升高元件。 圖式簡單說明 藉由參考結合著以下圖式的下述說明，本揭露内容可 被最佳地了解： 第1圖為根據本發明第一實施例之拾起裝置的側橫截 面圖； 第2 a至2 c圖顯示本發明第一實施例之拾起裝置的操作 關係的側橫截面圖； 第3圖為本發明第一實施例之拾起裝置的平面圖； 第4及5圖為包括根據本發明第二實施例之拾起裝置的 目標饋入裝置的立體圖； 第6至8圖顯示根據本發明之拾起裝置延伸構件之操作 關係的側橫截面圖； 第9圖為根據本發明之發光二極體晶片選別裝置的立 體圖； 第10圖為根據本發明之發光二極體晶片選別裝置的平 201105974 面圖； 第11圖為概據本發明之發光二極體晶片選別裝置之饋 入件的放大立趲圖。 【實施令武】 發明之詳細說曰月 以下’參考附隨的圖式，根據本發明實施例的拾起裴 置將被詳細描迷。 [第一實施例] 第1圖為根據本發明第一實施例之拾起裝置的側橫截 面圖，第2a至2c圖顯示根據本發明第一實施例之拾起裝置 之操作上關聯的側橫截面圖；及第3圖為根據本發明第一實 施例之拾起裝置的平面圖。 參看第1圖，根據本發明的拾起裝置100被設計為拾取 位在持住構件1〇上的目標物件L，並包括一支持構件11〇、 支持針120及一拾起件。 目心物件L可為薄型處理的物件，諸如半導體晶片或發 光二極體晶片’但不限於此。通常上’當目標物件[位於黏 諸如藍膠帶)上之際，此種目標物件"皮持 ^存或饋人。此處，持住構件K)不限於藍膠帶，而是 2任何類型的薄膜，只要它朝向目標物件的面對表面具 广性或黏貼性以及具有可從目標物件分離的撓性即 播為了加工、測試及選別目標物壯，目標物件L在與持 Β 構件K)分狀後必紐拾起。町，將詳細描述拾起 知L所必要的構型。 201105974 在根據本發明的拾起裝置100中，支持構件110位於持 住構件10下方。支持構件110可形成為例如圓柱形，但是支 持構件110可具有各種其他的形狀而不限於圓柱形。 支持構件11 〇的頂表面構型為直接接觸持住構件i 〇之 底表面的接觸表面113，而且壓下至某深度的凹槽ill形成 於接觸表面113内側的區域中。凹槽1U作為用於將持住構 件10從目標物件L分離的空間。凹槽m可形成為半球形， 但不限於此。例如，凹槽111可具有各種其他的形狀諸如 圓柱形及長方形。 若支持構件110形成為圓柱形且凹槽111形成為半球 形’則提供的接觸表面113呈環狀，如第3圖之平面圖所示。 持住構件10接觸環狀接觸表面113並由環狀接觸表面113支 持。在此案例中，持住構件10上的目標物件L被置於凹槽 111區域的上方。 在凹槽111中央部上，提供有一安置洞114，支持針12〇 可穿過該安置洞114上下移動。安置洞114穿過凹槽11丨及容 納支持針120之支持構件110内側的安置空間而提供。安置 洞114形成於凹槽1U的中央部以讓支持針m可以支持目 標物件L的中央部。安置洞114具有合適的大小及形狀，所 以不致於阻礙支持針120的上下移動。如第1及3圖所示，雖 然安置洞114可以為圓柱形的洞，安置洞114的形狀可以依 據各種狀況（包括支持針120及類似物件的形狀）而作適當地 選擇。 再者，讓氣流流動的一或多個抽吸洞112可圍繞支持構 10 201105974 件110之凹槽111中的安置洞114而提供。如同安置洞114, 抽吸洞112穿過凹槽111及容納支持和0之支持構件11〇内 側的安置空間而提供。多數抽簡m可被提供，在這樣的 案例中抽吸洞112可朝著圓周方向排列成以預設距離(例 如以相等距離)彼此空間上分隔。如果抽吸洞ιΐ2彼此等距 離分隔，凹槽111内側的空氣可以用-致的方式流入及流 出。藉由通過抽吸洞m抽吸凹槽⑴内側的空氣，產生抽 吸力’藉此持住構件ίο被移動至凹槽1U的内側，亦即朝著 第1圖箭頭A所指的方向。 如第i圖所示，抽吸裂置2〇可提供於支持構件ιι〇的一 側向表面處。抽吸裝置20構型成與凹槽lu的抽吸洞ιΐ2溝 通，藉此提供移動持住構件1G之如箭頭辑示方向的抽吸 力。抽吸裝置2Git過形成在切構件仙之—側向表面或底 表面的連接；mi5與續構件11()連接料致干擾其他構件 (諸如持住構件10)。如第丨圖所示，#支持針m保持與持住 毒牛10刀離時，工氣可通過安置洞U4以及抽吸洞m而被 抽吸，而且抽吸洞112及安置洞114通過連接洞115及容納支 持針12 0之支持構件i G内部的安置空間與抽吸裝置料 接。如上所述，若抽吸裂置2G於流體中開始抽吸，則持住 構件10會朝向凹槽U1移動’若抽吸裝置2〇停止於流體中 抽吸則持住構件1〇可移動回到它的原始位置。 支持針12 G設置在支持構件11G處以穿過持住構件i 〇並 支持目標物件L。更特定地說，支持針120構型為朝凹槽lu 内側的持住構件K)突出。當抽吸裝置2G於流體中抽吸時， 11 201105974 持住構件1G被支持針12()穿過因此，持住構件⑺可容易地 攸目&物件L分離。支持針⑽位於持住構件1()下方。支持 針120可位於凹槽lu之内或在穿過支持構件丨⑴之後與持 住構件1〇的底表面接觸。 支持針120為垂直長柱狀或針狀構件，其大小可以朝著 凹才曰111内侧的方向（即朝著第i圖箭頭A所指的方向）逐漸 地土曰加。再者’若支持針120頂部為尖端’支持針120可容 易地牙過持住構件1G ’且支持針^與目標物壯接觸的面 積減少，因而減少目標物壯上所受的損壞程度。 支持針120可通過支持構件110的安置洞114上下移 動例如’藉由輕合至支持針n〇的分離移動單元，支持針 120構型射關於固定的支持針丨細移動，或者當支持針 120被固定時，支持構件_冓型成係可移動的。或者，支 持構件110及支持仙㈣者均構型成射移動的。 心起件130為叹置於目標物件[上方而能夠拾起目標物 的名置。例如，拾起件13〇能夠藉由空氣負壓而吸起目 &物件L’或者能夠以靜電力固定目標物件[。機制或拾起 件130的種類沒有特別的限制，只要它能夠穩定地拾起目標 物件L，同時造成目標物件上最少的損壞即可。再者，拾起 件130與拾起料或轉動t連接⑼者均未齡）。拾起件臂 及轉動臂與馬達或_物連接，因此，拾起件⑽拾起的目 標物件L藉由驅動馬達可移動至預設的位置。 >看第3圖虽從頂部向下觀看，柚吸洞丨丨2形成使得 抽吸洞112及支持構件u◦中心114之間的距離di小於拙吸 12 201105974 洞112及接觸表面丨13之間的距離d2。若抽吸洞丨12至接觸表 面113比至支持構件110中心114還要接近，則在持住構件⑺ 與目標物件L完全分離之前，抽吸洞112可能會被持住構件 1〇關閉。在這樣的案例中’抽吸力會不再被傳送。為了防 止此問題，想要的是，使抽吸洞112至支持構件11〇之中心 114的距離比至接觸表面U3更短。 以下，參考第1至2c圖解釋拾起裝置的操作。本實施例 將針對拾起裝置之支持構件11()係固定，而支持針12〇藉 由耦&至支持針120之未顯示的針升高元件上下移動的案 例而說明。 升高元件可設置在支持構件110上。再者，針升高元件 能夠藉由液壓式汽缸或氣壓式汽缸直接上下地移動支持針 120或者使用馬達及輕合至各個馬達及支持針㈣的連接 機制而能夠移動支持針12G。連接機制可包括滑輪及皮帶、 滾珠螺桿、凸輪構件' 齒條齒輪排標及類似物件的至少一 者。 支持針12〇於升高位置與下降位置之間上下移動，支持 針12〇在升高位置時接㈣住構件1G，支射⑽在下降位 置，位於持住構件10下方且未接觸持住構件10。亦即，針 升尚轉㈣升高支持針⑽以使得趙糾2㈣達升高位 置:如第2a®所示。再者，針升高元件_降低支持針120 使得支持針120到達下降位置，如第1圖所示。 於t起製程之第-步驟中，拾起裝置觸被設定至第1 圖所示的起始位置。亦即，目標物件L被固定在持住構件10 13 201105974 上，支持針丨纖在下降位置，支持針12該位置時係位 於持住構件10下方而未接觸持住構件1()，且拾起件請包持 於目標物件L上方而未接觸目標物件L。 於拾起製程的第二步驟中，支持針120關於支持構件 上移至升高位置。然後’拾起件丨3盯降並接觸目標物 件L，而且將它拾起。 當支持針1测達升高位置，—部分支持針⑽會*** 持住構件H)，如第2b圖所示。再者，當支持針⑽到達升高 位置’支持針12⑽了貞料穿過持住構件職會接觸目標物 件L的底表面，如第2C圖所示。 據此’若支持針120到達升高位置，持住構件10可部分 或整個被穿破。其後，持住構件卿動至凹槽lu内側。因 此，持住構件1G可更容易與拾起件13G拾起的目標物件匕分 離。更且，因為當持住構件1〇移動至凹槽U1内側時，目標 物件L由支持針120支持，拾起件13〇能夠拾起目標物件卜 此時，拾起件130可能會比拾取目標物件1所需下降更 夕的距離。再者’因為拾起件⑽在它高速下降後突然停 止，所以在拾起件130接觸到目標物件L時或產生震動。當 支持針120位在升高位置時，若拾起件13〇的下降太過分或 疋產生震動，則在升高位置的支持針12可能會在目標物件l 上造成損壞。 據此，第二步驟的另一方法是，在拾起件13〇下降接 觸目標物件L並拾起目標物机以後，支持針12〇可關於支持 構件110升高至升高位置。以此種，支持針⑽所施加 14 201105974 損壞風險可以降低。亦即，當拾起細 h样時，即使拾起細下降的距離比拾 目^1還大，或是即使當純件130接觸 置^時產生震動，因為切針尚未位於升高位 以目標物件L及持住構件1〇可移動至凹槽出内側。 間：’凹槽⑴可以用作能夠防止目標物壯損壞的淨空空 内：_程的第三步驟中’藉著抽吸裝置20從凹槽⑴ 件 6制112排光空氣，所以純力被施加至持住構 朝向⑽縣，#拾起件13G拾起目標㈣L且持住構件1〇 °胃111内侧移動時’持住構件1G與目標物件L分離。 H支持針12Q㈣保持在升高位置，支持著目 標物件L的底側。 ⑽者目 其後’拾起件130可藉由分開的拾起件臂或轉動臂或類 似物件移動或轉動拾起的目標物件Le再者，在完成拾起過 程之後，抽吸裝置20施加的抽吸力停止，使得持住構件⑴ 返回至其原始狀態，而且支持針12〇返回至其起始的下降位 置。經由這些步驟，目標物件L的拾起可以穩定及平順地完 成。 [第二實施例] 以下’根據本發明第二實施例的拾起裝置將參考第4至 8圖而說明。除了拾起裝置包括一延伸構件之外，第二者施 例與第一實施例相同。在說明中，與上述相同的部件將以 相同元件編號表示，而且對其重複的說明將予以省略。 15 201105974 第4圖為包含根據本發明第二實施例之拾起裝置之目 標饋入裝置的立體圖。如圖所示，目標饋入裝置包括一基 底單元30 ;提供於基底單元30上的一容納機制40 ;及一拾 起裝置100。 如圖所示，基底單元30包括一第一本體31及一第二本 體32。第一本體30可關於第二本體32朝X及Y方向移動且也 可以旋轉。在這樣的案例中，拾起裝置100關於第二本體32 被保持在固定位置，且容納機制40關於第一本體31被保持 在固定位置。隨著第一本體31的移動，附接至固定於容納 機制40上之持住構件10的目標物件可被。再者，目標物件 當第一本體31轉動時可以指向適當方向。於上述方法中， 僅有目標物件被移動至適當拾起位置並且轉動，而拾起裝 置100係固定的。 作為另一方法，也可能移動拾起裝置1〇〇至適當的拾起 位置並轉動它，同時目標物件的位置係固定的。例如，第 一本體31可關於第二本體朝X及Y方向移動，而且拾起裝置 100可關於第一本體31保持在固定位置，同時容納單元40關 於第二本體32保持在固定位置。在這樣的案例中，於第一 本體31移動時，拾起裝置100移動至適當的拾起位置。 此時，基底單元30可構型成得上下移動。例如，第一 本體31可構型成當第二本體32固定時得關於第二本體32上 下移動，而且當容納機制40關於第一本體31保持在固定位 置時，拾起裝置100關於第二本體32保持在固定位置。在這 樣的案例中，當第一本體31上下移動時，容納機制40關於 16 201105974 固定的拾起裝置100上下移動。 作為再一方法，第二本體32可構型成當第一本體31固 疋時得關於第-本體31上下移動。拾起裝置励關於第二本 體32保持在固定位置，而且容納機制侧於第—本體叫呆 持在时位置。在這樣的案例中，當第二本體32上下移動 時，拾起裝置100關於固定的容納機制4〇上下移動。 上述基底單元30的X-及γ_方向移動與上下移動可可藉 由使用液壓式汽缸、氣壓式汽虹或類似物件而實行，或藉 由使用馬達及耦合至馬達的連接機制而實行。連接機制包 括滑輪及皮帶、滾珠螺桿、凸輪構件、齒條齒輪排檔及類 似物件的至少一者。 基底單几30之第一本體31的上部分耦合至容納機制 40。在第一本體31的***部提供有設置拾起裝置1〇〇或類 似物的安置空間311 ’而且容納機制4〇***其中的容納凹槽 312 (見第6圖）也有提供。容納機制4〇***容納凹槽312中且 固定於定位。 容納機制40被固定於基底單元3〇的第一本體31上。容 納機制40包括構型成容納持住構件1〇的一外殼41。如第4圖 所示，外设41可形成為整體圓盤狀。再者，外殼々I可目.有 整體圓盤狀的中空部，而持住構件1〇被容納於中空部中β 多數目標物件L於持住構件1〇上聚集在一起。例如，目 ‘物件L可為發光二極體晶片，以及持住構件1〇可為藍膠 π。發光二極體晶片劃線及斷裂製程可附接於持住構件1〇 上。若在此狀態的持住構件1〇延伸，則發光二極體晶片彼 L Si 17 201105974 此以預設的距離空間上分離。 第5圖為包含根據本發明第二實施例之拾起裝置之目 標饋入裝置的立體圖，其顯示一延伸構件。如其中所示， 拾起裝置更包括備置於基底單元30之安置空間m的—延 伸構件140。延伸構件14〇使持住構件10延伸，因此讓該多 數目標物件可以預設距離彼此空間上分離。由於目標物件 係空間上彼此分離，所以可以個別地拾起它們。 參考第6至8圖，延伸構件140的操作將更為詳細地說 明。雖絲起裝置未_於第6至8圖，拾起件係設置在持 住構件H)上方，而支持構件、支持針等等係設置在持住構 件10正下方。 如第6圖所示，多數目標物壯貼附於持住構件職頂 表面上’而持住構件1G藉由外殼彻定 觸 _槽⑽。再者，延伸構件_支持機伽設置於; 本體31的安置空間311中。目標物件L聚集而彼此密切接 利氺一尽體31，同時固定支 2細，騎住構件崎被延伸，㈣讓目標物壯得 上間上彼此分離。作料—方法，藉由向上移動 =同時固定第—本體31，如第7圖所示，持住構件1〇 延伸’因此’目標物件L可彼此空間上分離。在又一方 Χ第.讀31及杨機制141^者都構型成可以移動。 ;述方法中’支持機制141設置於持住構件1〇下方， 而且當它被支持_141上推而支持機制⑷同時支撐持住 18 201105974 構件ίο的底表面時，持住構件會延伸。然而，不像此種 構型，支持機制141可設置於持住構件1〇上方，而且當被支 持機制141下推而支持機制14ι同時支撐持住構件1〇的頂表 面時’持住構件10會延伸。 在目標物件L彼此空間上分離之後，在根據第一實施例 的上述方法中，拾起製程可針對單一目標物件L實行。據 此，即使在該多數目標物件L彼此密切接觸而聚集的案例 中，僅有所要的目標物件L被穩定及容易地拾起。 [LED晶片選別裝置] 現在’將解釋包括根據本發明實施例之拾起裝置的發 光二極體晶片選別裝置。 第9圖為根據本發明之發光二極體晶片選別裝置的立 體圖，第10圖為根據本發明之發光二極體晶片選別裝置之 饋入件的放大立體圖。因為拾起裝置1〇〇的構型及功能與上 述實施例所述者相同，所以此處將省略對拾起裝置1〇〇之描 述。再者，上述實施例中所提及之目標物件為本實施例中 的發光二極體晶片。 在進行封裝製程與依照其等表現選別優質貨品及劣質 貨品成為多種等級之前，包含有本發明之拾起裝置1〇〇的發 光二極體晶片選別裝置200在晶片檯中測試發光二極體晶 片的特性。如第9及1〇圖所示，發光二極體晶片選別裝置2〇〇 包括一饋入件210、一承載件22〇、一測試件23〇及一卸載件 240。 饋入件210包括構型成轉動發光二極體晶片的轉動單 19 201105974 元211以使得發光二極體晶片得以進行測試；以及轉動地連 接於轉動單元211上的轉動構件215。旋轉轉動構件215的馬 達212備置於轉動單元211下方。 轉動構件215具有多數(例如8個）從轉動軸216中心朝徑 向方向延伸的懸臂型支持架217。構型成將發光二極體晶片 安裝於其上的安裝構件218備置在各支持架217的端部。當 轉動構件215轉動時，各安裝構件218轉動並移動至承載位 置LP’於該位置發光二極體晶片被裝載於安裝構件218上， 移動至測試位置TP，於該位置發光二極體晶片被測試，與 移動至卸載位置ULP，於該位置發光二極體晶片由安裝構 件218上卸載。 承載件220緊鄰饋入件2丨〇設置而且其作用係將要被測 試的發光二極體晶片饋入位在承載位置LP的安裝構件218 上。承載件220經由第一移動機制222將容納發光二極體晶 片的饋入構件從第一儲存單元221移至承載單元223。然 後’發光二極體晶片以承載單元223從饋入構件裝載至饋入 件210的安裝構件218上。 在饋入構件（未顯示）上，發光二極體晶片藉由承載件 2220被裝載於安裝構件218上，饋入構件（未顯示）對應上述 實施例的持住構件10。由於多數發光二極體晶片彼此緊密 接觸地聚集在饋入構件上，如上所述，承載件220配備有拾 起散置100。亦即，拾起裝置從饋入構件拾起發光二極體晶 片’且該拾起的發光二極體晶片藉由承載單元223被裝載於 安裝構件218上。 20 201105974 拾起裝置10 0的構型及功能與上述實施例中所描述者 相同。再者，拾起裝置100的拾起件可被設置於承載單元 223。亦即，藉著承載單元223的轉動且被安裝於安裝構件 218上，由拾起件從饋入構件拾起的發光二極體晶片被移動 至位在承載位置LP的安裝構件218。 測έ式件230緊鄰饋入件210設置，而且測試裝載於位在 測試位置ΤΡ之安裝構件218上之發光二極體晶片的特性。發 光二極體晶片的特性可包括’例如，亮度、波長、光通量、 光強度、照明、光譜分佈、色溫、彩色座標等等。測試件 230可包括積分球及光學測量元件以測量此種光學特性。 卸載件240緊鄰饋入件210設置，而且作用為從位在卻 載位置ULP的各個安裝構件218卸載發光二極體晶片，並於 選別它們之後安裝這些發光二極體晶片於容納構件上。卸 載件240包括一緩衝總成250 ’其構型成從安裝構件218收集 經測試的發光二極體晶片並將所收集的發光二極體晶片儲 存於其中；與一選別總成260,其構型成根據測試結果選別 儲存於緩衝單元250中的發光二極體晶片。在緩衝總成250 中’發光二極體晶片經由卸載單元251從安裝構件219移動 至容納構件。然後，容納構件藉著第二移動機制252被儲存 於第二儲存單元253中。所儲存的容納單元被移動至選別承 載單元261，然後基於發光二極體晶片之測試結果，依照它 的等級，其藉選別單元262被裝載於分離的承載構件上。承 載構件藉由第三移動機制263被儲存於第三儲存單元264 中。以此方式，發光二極體晶片在依據它們的表現而選別 21 201105974 之後可以饋人後製裎中。 、其上持住要從選別承載單元261裝載至選別單元261之 光—極體晶片的容納構件（未顯示）對應上述實施例中的 寺住構件1〇。因為多數發光二極體晶片彼此密切接觸地聚 $在4納構件上’選別總成細的選別承載單元261備置有 述的彳。起裝置100。藉由此種構型，拾起裴置100從容納 冓件中僅拾起對應某—等級的發光二極體晶片，而且所拾 <的發光—極體晶片被裝載在分類為多數等級之承載構件 相對應者上。拾起裝置10 〇的構型及功能與上述實施例 ^田述者蝴。再者’拾減置1⑽的拾起件可設置在選別 單7L262巾即，拾起件從容納構件拾起的發光二極體晶片 經由選別單元262轉動之後被置於承載構件上。 根據本發明的發光二極體晶片選別裝置200具有直線 狀的整體佈局。亦即，卸載件橫過饋人件21G位在承載 件220的對面。經由此種構型，製程流動得叫速地檢查， 而且修理與維護可以簡單的方式實行。 藉由使用本發明的發光二極體晶片選別裝置2〇〇，於封 裝之前晶片狀態中得以測試及選別發光二極體晶片。尤其 是，因為承載件22G及/或#p载件24G具有拾起裝置·，發 光二極體晶片可被容易及穩定地拾起。 本發明的以上描述僅係為了說明的目的而提供，習於 此藝者將會了解，可以為各種改變及修飾但是仍缺不合改 變本發_技雜念與基本雜。因楚的是二述 的實施例在每個方面而言都是說明性而不會限制本發明。 22 201105974 藉由使用根據本發明的拾起裝置，目標物件(諸如發光 二極體晶片或半導體晶片）可被快速、穩定及容易地拾起。 t：圖式簡單說明3 第1圖為根據本發明第一實施例之拾起裝置的側橫截 面圖； 第2a至2c圖顯示本發明第一實施例之拾起裝置的操作 關係的側橫截面圖； 第3圖為本發明第一實施例之拾起裝置的平面圖； 第4及5圖為包括根據本發明第二實施例之拾起裝置的 目標饋入裝置的立體圖； 第6至8圖顯示根據本發明之拾起裝置延伸構件之操作 關係的側橫截面圖； 第9圖為根據本發明之發光二極體晶片選別裝置的立 體圖； 第10圖為根據本發明之發光二極體晶片選別裝置的平 面圖； 第11圖為根據本發明之發光二極體晶片選別裝置之饋 入件的放大立體圖。 【主要元件符號說明】 40.. .容納機制 41.. .外殼 100…拾起裝置 110.. .支持構件 111…凹槽 10.. .持住構件 20.. .抽吸裝置 30…基底單元 31…第一本體 32…第二本體 23 201105974 112.. .抽吸洞 113.. .接觸表面 114…安置洞 115.. .連接洞 120.. .支持針 130.. .拾起件 140.. .延伸構件 141.. .支持機制 200.. . LED晶片選別裝置 210.. .饋入件 211…轉動單元 212.. .馬達 215.. .轉動構件 216.. .轉動轴 217.. .支持架 218.. .安裝構件 220.. .承載件 221.. .第一儲存單元 222.. .第一移動機制 223.. .承載單元 230.. .測試件 240.. .卸載件 250.. .缓衝總成 251.. .卸載單元 252.. .第二移動機制 253.. .第二儲存單元 260.. .選別總成 261.. .承載單元 262.. .選別單元 263.. .第三移動機制 264.. .第三儲存單元 311.. .安置空間 312.. .容納凹槽 24BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pick-up wearing capable of easily picking up a target object and a light-emitting diode wafer sorting apparatus having the same. I. Prior Art 3 Background of the Invention In order to process, test, and select small or thin target objects, the target object must be picked up and moved. However, if a plurality of target objects are gathered together or closely adhered to the feeding member or the like, it is not easy to pick up the target. Therefore, the pick-up fails or causes damage (such as cracks, flaking, or nicks) on the target object, which in turn leads to a decrease in yield, a delay in processing time, an increase in production cost, and the like. Such a target object may be a light emitting diode wafer. The light-emitting diode (10) (7) is a semiconductor light-emitting element that converts electric power into light. Light-emitting diodes are also known as luminescent diodes. The light-emitting diodes are produced through an EPI process, a wafer process (manufacture), and a packaging process. The light-emitting diode is tested for reddening after being packaged by a packaging process. In the κ process, 'the coffee machine (hereinafter referred to as "inferior goods") is excluded, and the normal operation coffee (hereinafter referred to as "quality goods,") is selected into multiple grades according to their performance, (4) Shipment is carried out. Here, in the test process, due to problems caused during the packaging process, LEDS may be excluded as inferior goods or selected to be reduced to a lower grade 'and due to manufacturing as before (in the case of , LE Saki made 201105974 the problem of the state of the wafer (hereinafter referred to as "LED wafer,"), which would be excluded as a poor quality product or a lower grade. Therefore, it is necessary to regularly illuminate the performance of the monolithic wafers and select them so that they do not have to pass unnecessary packaging processes and test processes. In such a light-emitting diode chip sorting process, in order to move the light-emitting diode wafer from the feeding device to the load-carrying device or from the unloading device to the sorting device, the light-emitting diode chip needs to be quickly caught and stabilized. Pick up. Another example of a target object is a semiconductor wafer. In the semi-conductive process ▲ 曰曰 round is cut into wafers' and then organized into semiconductor wafers. Because of these semiconductors, each semi-conductor must be separated from the adhesive tape to pick it up. It is desirable that an economic pick-up device is required to quickly, stably and easily feed a target object, such as a light-emitting diode, into a semiconductor wafer. SUMMARY OF THE INVENTION In the above circumstances, the present invention provides a pick-up device that is easy to pick up and can be picked up, and has a light-emitting diode crystal. Purpose, the invention may include the following configurations. In accordance with a consistent embodiment of the present invention, there is provided a pick-up device configured to pick up a security item located on a holding structure, the device comprising a "support member", holding the member underneath and facing the holding member a groove is provided on the surface; a cutting needle disposed inside the groove of the supporting member; the holding member protrudes and can support the target object after passing through the feeding member; and a picking member Set above the target object to pick up the target object. Further, at least one air suction hole is provided through the recess of the support member. According to an embodiment of the invention, a seating hole is provided through the recess of the support member, and the support pin is positioned through the seating hole. According to an embodiment of the invention, the support member has a contact surface contacting the holding member, the groove being located inside the contact surface, and the suction hole and the support member when viewed from above the support member The distance between the centers is shorter than the distance between the suction hole and the contact surface. According to an embodiment of the invention, the pick-up device further includes a suction means for providing a suction force for moving the holding member toward the inside of the groove through the suction hole. In accordance with an embodiment of the invention, a needle raising element that moves the support needle up and down is configured. According to an embodiment of the invention, the pick-up member attracts the target object by atmospheric pressure. According to an embodiment of the invention, the holding member is a film having adhesiveness toward the surface facing surface of the target article. According to an embodiment of the invention, the target object is a light emitting diode wafer or a semiconductor wafer. According to an embodiment of the invention, a plurality of target objects are disposed adjacent to each other on the holding member, and the apparatus further includes an extending member configured to extend the holding member to allow the plurality of target objects to be spaced with each other上分201105974 Basin setting = according to the invention - the _, the extension member comprises a support mechanism, holding the lower part of the member and configured to push the holding member by pushing up, holding the bottom of the member The surface retains the holding member. According to the present invention, the distracting member includes a support mechanism, and is disposed above the holding member and configured to push down the holding member to hold the top surface of the holding member. Extend the holding member. According to another embodiment of the present invention, a light emitting diode chip selection device for selecting a light emitting diode chip by measuring a light emitting diode is included: a feed member including a structure a mounting member configured to mount a light-emitting diode chip thereon and rotating the mounting member between a load-bearing position, a test position, and an unloading position, the light-emitting diode chip being at the load-bearing position The location is loaded on the mounting member. a sinusoidal light-emitting diode chip is tested at the test position, the light-emitting diode chip is unloaded from the mounting member at the unloading position; a carrier member disposed adjacent to the feed-in member and including a pick-up device and a carrying unit configured to pick up a light emitting diode wafer from the feeding member containing the plurality of light emitting diode chips at the carrying position, and the carrying unit is configured to pick up a light-emitting diode wafer is carried on the mounting member; a test piece disposed adjacent to the feed member and configured to measure characteristics of the light-emitting diode wafer at the test position; and an unloading member adjacent to the The feedthrough is configured to function to unload the tested light-emitting diode wafer from the mounting member at the unloading position, wherein the pick-up device comprises: a support member disposed below the feed member and facing a groove is formed on the surface of the feeding member; a supporting pin is disposed on the inner side of the slot of the support member 410105974 to protrude toward the feeding member and can penetrate the feeding member Supporting the target object; and a pick up member, which is disposed on the side to pick up the target object on the target object, wherein the at least one gas stream through the suction hole and the recess of the support member opposed prepared. According to another embodiment of the present invention, a light emitting diode chip sorting device for selecting a light emitting diode chip by measuring characteristics of a light emitting diode chip is provided, the device comprising: a feed member including a configuration a mounting member on which the LED chip is mounted, and functions to rotate the mounting member between a load bearing position, a test position and an unloading position, the LED chip being Loading on the mounting member, the LED chip is tested at the test position, the LED chip is unloaded from the mounting member at the unloading position; a carrier is disposed adjacent to the feed member And functioning to feed the LED chip to be tested on the mounting member at the carrying position; a test piece disposed adjacent to the feed member and configured to measure the light emitting diode at the test position a feature of the wafer; and an unloading member disposed adjacent to the feed member and including a pick-up device and a sorting unit configured to receive a majority at the unloading position Picking up a light emitting diode chip in a receiving member of the light emitting diode chip, and the sorting unit is configured to transfer the picked up LED, wherein the picking up device comprises: a supporting member disposed under the receiving member And a groove is disposed on a surface facing the receiving member; a supporting pin disposed inside the groove of the supporting member to protrude toward the receiving member and capable of supporting the target object after penetrating the receiving member; and And a pick-up member disposed above the target object to pick up the target object, wherein 201105974 at least one airflow suction hole is prepared through the groove of the support member. According to another embodiment of the present invention, the feed member includes a plurality of support frames extending in a radial direction from the rotation axis, and the mounting member is disposed at one end of each of the support frames. According to another embodiment of the present invention, the light-emitting diode wafer sorting apparatus further includes a suction means for providing a suction force for moving the holding member toward the inside of the groove through the suction hole. In accordance with another embodiment of the present invention, the LED chip sorting device further includes a needle raising member configured to move the support needle up and down. BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure is best understood by reference to the following description taken in conjunction with the following drawings: FIG. 1 is a side cross-sectional view of a pick-up device according to a first embodiment of the present invention; 1 to 2 c are side cross-sectional views showing the operational relationship of the pick-up device of the first embodiment of the present invention; FIG. 3 is a plan view of the pick-up device of the first embodiment of the present invention; FIGS. 4 and 5 are included A perspective view of a target feeding device of a pick-up device according to a second embodiment of the present invention; FIGS. 6 to 8 are side cross-sectional views showing an operational relationship of the pick-up device extension member according to the present invention; and FIG. 9 is a view of the present invention. FIG. 10 is a plan view of a light-emitting diode chip sorting device according to the present invention; FIG. 11 is a view showing the feeding of the light-emitting diode chip sorting device of the present invention; A magnified view of the piece. [Implementation of the Invention] Detailed Description of the Invention Hereinafter, the pick-up device according to the embodiment of the present invention will be described in detail with reference to the accompanying drawings. [First Embodiment] Fig. 1 is a side cross-sectional view showing a pick-up device according to a first embodiment of the present invention, and Figs. 2a to 2c are views showing an operationally associated side of the pick-up device according to the first embodiment of the present invention. Cross-sectional view; and Fig. 3 is a plan view of the pick-up device according to the first embodiment of the present invention. Referring to Fig. 1, a pick-up device 100 according to the present invention is designed to pick up a target object L positioned on a holding member 1 and includes a supporting member 11A, a supporting pin 120, and a pick-up member. The eyepiece L may be a thin processed article such as a semiconductor wafer or a light emitting diode wafer 'but is not limited thereto. Usually, when the target object [on a sticky such as blue tape), the target object is kept or fed. Here, the holding member K) is not limited to the blue tape, but 2 any type of film as long as it is broad or adhesive toward the facing surface of the target article and has flexibility to be separated from the target object, so as to be processed. The test object and the selected object are strong, and the target object L is picked up after being separated from the holding member K). The town will describe in detail the configuration necessary to pick up the knowledge. 201105974 In the pick-up device 100 according to the present invention, the support member 110 is located below the holding member 10. The support member 110 may be formed, for example, in a cylindrical shape, but the support member 110 may have various other shapes without being limited to a cylindrical shape. The top surface of the support member 11 is configured to directly contact the contact surface 113 holding the bottom surface of the member i, and the groove ill depressed to a certain depth is formed in the region inside the contact surface 113. The groove 1U serves as a space for holding the member 10 separated from the target object L. The groove m may be formed in a hemispherical shape, but is not limited thereto. For example, the grooves 111 can have various other shapes such as a cylindrical shape and a rectangular shape. If the support member 110 is formed in a cylindrical shape and the groove 111 is formed in a hemispherical shape, the contact surface 113 provided is annular, as shown in the plan view of Fig. 3. The holding member 10 contacts the annular contact surface 113 and is supported by the annular contact surface 113. In this case, the target object L on the holding member 10 is placed above the area of the groove 111. On the central portion of the recess 111, a seating hole 114 is provided through which the support pin 12 can be moved up and down. The seating hole 114 is provided through the recess 11 and the seating space inside the support member 110 that accommodates the support pin 120. The seating hole 114 is formed in the central portion of the recess 1U so that the supporting pin m can support the central portion of the target object L. The seating holes 114 are of a suitable size and shape so as not to impede the up and down movement of the support pins 120. As shown in Figs. 1 and 3, although the seating hole 114 may be a cylindrical hole, the shape of the seating hole 114 may be appropriately selected depending on various conditions including the shape of the supporting pin 120 and the like. Again, one or more suction holes 112 for the flow of air may be provided around the seating holes 114 in the grooves 111 of the support member 10 201105974. As with the seating hole 114, the suction hole 112 is provided through the recess 111 and the seating space for accommodating the inner side of the supporting member 11 of the support member. Most of the pumping m can be provided, and in such a case, the suction holes 112 can be arranged in the circumferential direction to be spatially separated from each other by a predetermined distance (e.g., at equal distances). If the suction holes ι ΐ 2 are equally spaced from each other, the air inside the groove 111 can flow in and out in a so-called manner. By sucking the air inside the groove (1) through the suction hole m, a suction force is generated, whereby the holding member ίο is moved to the inner side of the groove 1U, that is, toward the direction indicated by the arrow A in Fig. 1. As shown in Fig. i, a suction split 2 can be provided at a lateral surface of the support member ιι. The suction device 20 is configured to communicate with the suction hole ι 2 of the groove lu, thereby providing a suction force for moving the holding member 1G in the direction indicated by the arrow. The suction means 2Git passes over the connection formed on the lateral surface or the bottom surface of the cutting member; the connection of the mi5 with the continuation member 11() causes interference with other members (such as holding the member 10). As shown in the figure, when the support needle m is kept and held 10 times away from the poisonous cow, the working gas can be sucked by the installation hole U4 and the suction hole m, and the suction hole 112 and the installation hole 114 are connected. The installation space inside the hole 115 and the supporting member i G accommodating the supporting pin 120 is connected to the suction device. As described above, if the suction split 2G starts to be sucked in the fluid, the holding member 10 will move toward the groove U1. If the suction device 2 is stopped in the fluid, the member 1 can be moved back. Go to its original location. The support pin 12G is disposed at the support member 11G to pass through the holding member i 〇 and support the target object L. More specifically, the support pin 120 is configured to protrude toward the holding member K) inside the groove lu. When the suction device 2G is sucked in the fluid, 11 201105974 holding member 1G is supported by the needle 12 () so that the holding member (7) can be easily separated from the object L. The support pin (10) is located below the holding member 1 (). The support pin 120 can be located within the groove lu or in contact with the bottom surface of the holding member 1〇 after passing through the support member 丨(1). The support pin 120 is a vertically long columnar or needle-like member whose size can be gradually increased toward the inner side of the concave ridge 111 (i.e., in the direction indicated by the arrow A in Fig. i). Further, if the support pin 120 is a tip end support pin 120, the tooth can easily hold the member 1G' and the area supporting the needle to be in strong contact with the target is reduced, thereby reducing the degree of damage to the target. The support pin 120 can be moved up and down by the seating hole 114 of the support member 110, for example, by a separate moving unit that is lightly coupled to the support pin n〇, the support pin 120 is configured to be moved about the fixed support pin, or when the support pin 120 is supported. When fixed, the support member _ 成 type is movable. Alternatively, both the support member 110 and the support element (4) are configured to be moved. The ejector member 130 is a name that can be picked up by placing the object on the top of the target object. For example, the pick-up member 13 can suck up the object & L' by the negative air pressure or can fix the target object by electrostatic force. The kind of the mechanism or the pick-up member 130 is not particularly limited as long as it can stably pick up the target object L while causing the least damage on the target object. Further, the pick-up member 130 is not connected to the pick-up or rotation t (9). The pick-up arm and the swivel arm are coupled to the motor or the object, so that the target object L picked up by the pick-up member (10) can be moved to a preset position by the drive motor. > Looking at Fig. 3, viewed from the top downward, the pomelo hole 丨丨 2 is formed such that the distance di between the suction hole 112 and the support member u ◦ center 114 is smaller than that of the suction 12 201105974 hole 112 and the contact surface 丨 13 The distance between d2. If the suction hole 12 to the contact surface 113 is closer than the center 114 of the support member 110, the suction hole 112 may be closed by the holding member 1 before the holding member (7) is completely separated from the target member L. In such cases, the suction force will no longer be transmitted. In order to prevent this problem, it is desirable to make the distance of the suction hole 112 from the center 114 of the support member 11 to be shorter than the contact surface U3. Hereinafter, the operation of the pick-up device will be explained with reference to Figs. 1 to 2c. This embodiment will be fixed to the support member 11 () of the pick-up device, and the support pin 12 will be described by a case where the coupling-up to the needle-up member of the support pin 120 is moved up and down. The lifting element can be disposed on the support member 110. Further, the needle raising member can move the support needle 12G by directly moving the support needle 120 up and down by a hydraulic cylinder or a pneumatic cylinder or by using a motor and a connection mechanism for coupling to each of the motors and the support needle (4). The attachment mechanism can include at least one of a pulley and a belt, a ball screw, a cam member 'rack gear gauge, and the like. The support pin 12 is moved up and down between the raised position and the lowered position, the support pin 12 is connected to the (4) member 1G in the raised position, and the branch (10) is in the lowered position, under the holding member 10 and not in contact with the holding member. 10. That is, the needle is still turned (4) to raise the support needle (10) so that Zhao Zheng 2 (4) reaches the elevated position: as shown in 2a®. Further, the needle raising member_reducing the supporting needle 120 causes the supporting needle 120 to reach the lowered position as shown in FIG. In the first step of the process from t, the pickup device is set to the home position shown in Fig. 1. That is, the target object L is fixed on the holding member 10 13 201105974, and supports the needle fiber in the lowered position. When the needle 12 is supported, the needle 12 is positioned below the holding member 10 without contacting the holding member 1 (), and picks up The starting piece is wrapped above the target object L without contacting the target object L. In the second step of the picking up process, the support pin 120 is moved up to the raised position with respect to the support member. Then, the pick-up member 3 is stared down and touches the target object L, and picks up it. When the support pin 1 is measured in the raised position, the partial support pin (10) will be inserted into the holding member H) as shown in Fig. 2b. Further, when the support needle (10) reaches the raised position, the support needle 12 (10) passes through the holding member to contact the bottom surface of the target object L as shown in Fig. 2C. According to this, if the supporting needle 120 reaches the raised position, the holding member 10 can be partially or completely pierced. Thereafter, the member is held to move to the inside of the groove lu. Therefore, the holding member 1G can be more easily separated from the target object picked up by the pick-up member 13G. Moreover, since the target object L is supported by the support pin 120 when the holding member 1〇 is moved inside the groove U1, the pick-up piece 13 can pick up the target object. At this time, the pick-up piece 130 may be more than the pickup target. The distance that the object 1 needs to fall is even more. Further, since the pick-up member (10) suddenly stops after it descends at a high speed, vibration is generated when the pick-up member 130 comes into contact with the target object L. When the support pin 120 is in the raised position, if the drop of the pick-up member 13 is excessively excessive or the shock is generated, the support pin 12 in the raised position may cause damage on the target object 1. According to this, another method of the second step is that the support pin 12 can be raised to the raised position with respect to the support member 110 after the pick-up member 13 is lowered to contact the target object L and the target machine is picked up. In this way, the support needle (10) is applied 14 201105974 The risk of damage can be reduced. That is, when the fine h-like sample is picked up, even if the distance of picking up the fine drop is larger than the pickup ^1, or even when the pure member 130 is in contact with the vibration, the shock is generated because the cutting needle is not yet in the raised position to the target object. L and the holding member 1〇 can be moved to the inside of the groove. Between: 'The groove (1) can be used as a clear air inside to prevent the target from being damaged. In the third step of the process, 'the air is exhausted from the groove (1) by the suction device 20, so the pure force is When the picking member 13G picks up the target (four) L and holds the member 1 〇 while moving inside the stomach 111, the holding member 1G is separated from the target object L. The H support pin 12Q (4) is held in the raised position to support the bottom side of the target object L. (10) The latter's pick-up member 130 can be moved or rotated by a separate pick-up arm or a rotating arm or the like to move the picked-up target object Le again, after the pick-up process is completed, the suction device 20 applies The suction force is stopped, so that the holding member (1) is returned to its original state, and the support pin 12 is returned to its original lowered position. Through these steps, the pickup of the target object L can be completed stably and smoothly. [Second Embodiment] Hereinafter, a pick-up device according to a second embodiment of the present invention will be described with reference to Figs. 4 to 8. The second embodiment is the same as the first embodiment except that the pick-up device includes an extension member. In the description, the same components as those described above will be denoted by the same component numbers, and the repeated description thereof will be omitted. 15 201105974 Fig. 4 is a perspective view of a target feeding device including a pick-up device according to a second embodiment of the present invention. As shown, the target feedthrough includes a base unit 30; a receiving mechanism 40 provided on the base unit 30; and a pick-up device 100. As shown, the base unit 30 includes a first body 31 and a second body 32. The first body 30 is movable in the X and Y directions with respect to the second body 32 and is also rotatable. In such an case, the pick-up device 100 is held in a fixed position with respect to the second body 32, and the receiving mechanism 40 is held in a fixed position with respect to the first body 31. As the first body 31 moves, the target object attached to the holding member 10 fixed to the accommodation mechanism 40 can be. Further, the target object can be pointed in an appropriate direction when the first body 31 is rotated. In the above method, only the target object is moved to the proper pick-up position and rotated, and the pick-up device 100 is fixed. As another method, it is also possible to move the pick-up device 1 to the appropriate pick-up position and rotate it while the position of the target object is fixed. For example, the first body 31 is movable in the X and Y directions with respect to the second body, and the picking up device 100 can be held in a fixed position with respect to the first body 31 while the receiving unit 40 is held in the fixed position with respect to the second body 32. In such a case, when the first body 31 is moved, the pick-up device 100 is moved to an appropriate pick-up position. At this time, the base unit 30 can be configured to move up and down. For example, the first body 31 can be configured to move up and down with respect to the second body 32 when the second body 32 is fixed, and with the picking device 100 about the second body when the receiving mechanism 40 is held in a fixed position with respect to the first body 31 32 remains in a fixed position. In such a case, when the first body 31 moves up and down, the receiving mechanism 40 moves up and down with respect to the 16 201105974 fixed pick-up device 100. As still another method, the second body 32 can be configured to move up and down with respect to the first body 31 when the first body 31 is fixed. The pick-up device is held in a fixed position with respect to the second body 32, and the receiving mechanism side is held in the first position by the first body. In such a case, when the second body 32 moves up and down, the pick-up device 100 moves up and down with respect to the fixed accommodation mechanism 4〇. The X- and γ-direction movements and the up-and-down movement of the base unit 30 described above can be carried out by using a hydraulic cylinder, a pneumatic steam or the like, or by using a motor and a coupling mechanism coupled to the motor. The attachment mechanism includes at least one of a pulley and a belt, a ball screw, a cam member, a rack gear, and the like. The upper portion of the first body 31 of the substrate unit 30 is coupled to the receiving mechanism 40. Provided in the upper central portion of the first body 31 is a seating space 311' in which the pick-up device 1 or the like is provided, and the receiving groove 312 into which the receiving mechanism 4 is inserted (see Fig. 6) is also provided. The receiving mechanism 4 is inserted into the receiving recess 312 and fixed to the positioning. The housing mechanism 40 is fixed to the first body 31 of the base unit 3''. The containment mechanism 40 includes a housing 41 that is configured to receive a member 1 . As shown in Fig. 4, the peripheral device 41 can be formed in a unitary disk shape. Further, the outer casing 可I has an integral disk-shaped hollow portion, and the holding member 1 is accommodated in the hollow portion. β Most of the target objects L are gathered together on the holding member 1〇. For example, the object 'object L' may be a light-emitting diode wafer, and the holding member 1' may be a blue plastic π. The light-emitting diode wafer scribing and breaking process can be attached to the holding member 1''. If the holding member 1〇 in this state is extended, the light-emitting diode wafer is separated by a predetermined distance from the substrate L Si 17 201105974. Fig. 5 is a perspective view of a target feeding device including a pick-up device according to a second embodiment of the present invention, showing an extension member. As shown therein, the pick-up device further includes an extension member 140 disposed in the seating space m of the base unit 30. The extension member 14 causes the holding member 10 to extend, thereby allowing the plurality of target objects to be spatially separated from each other by a predetermined distance. Since the target objects are spatially separated from each other, they can be picked up individually. Referring to Figures 6 through 8, the operation of extension member 140 will be described in greater detail. Although the wire-drawing device is not in Figs. 6 to 8, the pick-up member is disposed above the holding member H), and the supporting member, the supporting pin, and the like are disposed directly under the holding member 10. As shown in Fig. 6, most of the target objects are attached to the top surface of the holding member, and the holding member 1G is fixed to the groove (10) by the outer casing. Furthermore, the extension member_supporting machine is disposed in the seating space 311 of the body 31. The target objects L are gathered and closely connected to each other, and the fixed body 2 is thin, the riding member is stretched, and (4) the target is strong and separated from each other. The material-method, by moving upwards = simultaneously fixing the first body 31, as shown in Fig. 7, holds the member 1〇 extended 'thus' the target objects L can be spatially separated from each other. In one side, the first reading, the reading 31 and the Yang mechanism 141 are all configured to be movable. In the method, the support mechanism 141 is disposed below the holding member 1〇, and when it is supported by the support_141 and the support mechanism (4) simultaneously supports the bottom surface of the 18201105974 member ίο, the holding member extends. However, unlike this configuration, the support mechanism 141 may be disposed above the holding member 1〇, and hold the member 10 when the support mechanism 141 is pushed down and the support mechanism 14i supports and holds the top surface of the member 1〇. Will extend. After the target objects L are spatially separated from each other, in the above method according to the first embodiment, the pick-up process can be performed for a single target object L. According to this, even in the case where the plurality of target objects L are in close contact with each other and gathered, only the desired target object L is stably and easily picked up. [LED wafer sorting device] Now, a light-emitting diode wafer sorting device including the pick-up device according to the embodiment of the present invention will be explained. Fig. 9 is a perspective view showing a light-emitting diode wafer sorting apparatus according to the present invention, and Fig. 10 is an enlarged perspective view showing a feed member of the light-emitting diode wafer sorting apparatus according to the present invention. Since the configuration and function of the pick-up device 1 are the same as those described in the above embodiment, the description of the pick-up device 1 will be omitted herein. Furthermore, the target object mentioned in the above embodiment is the light-emitting diode wafer of the embodiment. The light-emitting diode chip sorting apparatus 200 including the pick-up device 1 of the present invention tests the light-emitting diode wafer in the wafer stage before performing the packaging process and sorting the high-quality goods and the inferior goods according to their performance into various grades. Characteristics. As shown in Figures 9 and 1, the LED chip sorting device 2 includes a feedthrough 210, a carrier 22, a test piece 23, and an unloader 240. The feedthrough 210 includes a rotary unit 19 201105974 211 configured to rotate the light emitting diode wafer to enable the light emitting diode wafer to be tested; and a rotating member 215 rotatably coupled to the rotating unit 211. The motor 212 that rotates the rotating member 215 is placed under the rotating unit 211. The rotating member 215 has a plurality of (e.g., eight) cantilever type holders 217 extending from the center of the rotating shaft 216 in the radial direction. A mounting member 218 configured to mount the light emitting diode chip thereon is disposed at an end of each of the support frames 217. When the rotating member 215 is rotated, the mounting members 218 are rotated and moved to the carrying position LP' where the light-emitting diode wafer is loaded on the mounting member 218 and moved to the test position TP where the light-emitting diode wafer is The test is moved to the unloading position ULP where the light emitting diode wafer is unloaded by the mounting member 218. The carrier member 220 is disposed adjacent to the feed member 2'' and functions to feed the light-emitting diode wafer to be tested on the mounting member 218 at the load-bearing position LP. The carrier 220 moves the feed member accommodating the LED chip from the first storage unit 221 to the carrier unit 223 via the first movement mechanism 222. The 'light-emitting diode wafer' is then loaded onto the mounting member 218 of the feedthrough 210 from the feed member by the carrier unit 223. On the feed member (not shown), the light emitting diode wafer is loaded on the mounting member 218 by the carrier 2220, and the feed member (not shown) corresponds to the holding member 10 of the above embodiment. Since most of the light-emitting diode wafers are gathered in contact with each other in close contact with each other, as described above, the carrier 220 is provided with the pick-and-spread 100. That is, the pick-up device picks up the light-emitting diode wafer ' from the feed-in member and the picked-up light-emitting diode wafer is loaded on the mounting member 218 by the carrying unit 223. 20 201105974 The configuration and function of the pick-up device 100 are the same as those described in the above embodiments. Further, the pick-up member of the pick-up device 100 can be disposed on the carrying unit 223. That is, by the rotation of the carrying unit 223 and being mounted on the mounting member 218, the light-emitting diode wafer picked up by the pick-up member from the feeding member is moved to the mounting member 218 at the carrying position LP. The test piece 230 is disposed adjacent to the feed member 210 and tests the characteristics of the light-emitting diode wafer mounted on the mounting member 218 located at the test position. The characteristics of the light emitting diode wafer may include, for example, brightness, wavelength, luminous flux, light intensity, illumination, spectral distribution, color temperature, color coordinates, and the like. Test piece 230 can include an integrating sphere and an optical measuring element to measure such optical characteristics. The unloading member 240 is disposed adjacent to the feed member 210 and functions to unload the LED chips from the respective mounting members 218 located at the load position ULP, and after mounting them, mounts the LED chips on the receiving member. The unloading member 240 includes a buffer assembly 250' configured to collect the tested light-emitting diode wafer from the mounting member 218 and store the collected light-emitting diode wafer therein; and a sorting assembly 260, The LED is selected to be stored in the buffer unit 250 according to the test result. In the buffer assembly 250, the light-emitting diode wafer is moved from the mounting member 219 to the accommodating member via the unloading unit 251. The receiving member is then stored in the second storage unit 253 by the second movement mechanism 252. The stored housing unit is moved to the sorting carrier unit 261, and based on the test result of the LED chip, its sorting unit 262 is loaded on the separate carrier member in accordance with its grade. The load member is stored in the third storage unit 264 by the third movement mechanism 263. In this way, the LED chips can be fed back after they are selected according to their performance 21 201105974. The accommodating member (not shown) on which the photo-polar body wafer to be loaded from the sorting carrying unit 261 to the sorting unit 261 is held corresponds to the temple member 1 in the above embodiment. Since most of the light-emitting diode wafers are in close contact with each other, the sorting unit 261 of the sorting assembly is provided with the 彳. The device 100 is activated. With this configuration, the pick-up device 100 picks up only a certain level of the light-emitting diode wafer from the accommodating member, and picks up <The illuminating-pole wafer is loaded on the counterpart of the carrier member classified into most grades. The configuration and function of the pick-up device 10 are the same as those of the above embodiment. Further, the pick-up member of the pick-up and set 1 (10) may be disposed on the sorting sheet 7L262, that is, the pick-up member is rotated on the carrier member after being rotated by the sorting unit 262. The light-emitting diode wafer sorting apparatus 200 according to the present invention has a linear overall layout. That is, the unloading member is positioned across the feeder member 21G opposite the carrier member 220. With this configuration, the process flow is quickly checked, and repair and maintenance can be performed in a simple manner. By using the light-emitting diode wafer sorting device 2 of the present invention, the light-emitting diode wafer can be tested and selected in the wafer state prior to packaging. In particular, since the carrier 22G and/or the #p carrier 24G has the pick-up device, the light-emitting diode wafer can be easily and stably picked up. The above description of the present invention has been provided for the purpose of illustration only, and it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention. It is to be understood that the embodiments described herein are illustrative in all respects and not restrictive. 22 201105974 By using the pick-up device according to the present invention, a target object such as a light-emitting diode wafer or a semiconductor wafer can be picked up quickly, stably, and easily. t: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side cross-sectional view of a pick-up device according to a first embodiment of the present invention; FIGS. 2a to 2c are cross-sectional views showing the operational relationship of the pick-up device of the first embodiment of the present invention; 3 is a plan view of a pick-up device according to a first embodiment of the present invention; and FIGS. 4 and 5 are perspective views of a target feed device including a pick-up device according to a second embodiment of the present invention; The figure shows a side cross-sectional view of the operating relationship of the pick-up device extension member according to the present invention; FIG. 9 is a perspective view of the light-emitting diode wafer sorting device according to the present invention; and FIG. 10 is a light-emitting diode according to the present invention. A plan view of a wafer sorting apparatus; Fig. 11 is an enlarged perspective view of a feed member of the light emitting diode chip sorting apparatus according to the present invention. [Main component symbol description] 40.. Housing mechanism 41.. Housing 100... Pickup device 110.. Support member 111... Groove 10: Hold member 20: Suction device 30... Base unit 31...first body 32...second body 23 201105974 112.. suction hole 113.. contact surface 114...placement hole 115.. connection hole 120.. support pin 130.. pick up piece 140. . Extending member 141.. Support mechanism 200.. LED chip sorting device 210.. Feeding member 211... Rotating unit 212.. Motor 215.. Rotating member 216.. Rotating shaft 217.. Support frame 218.. Mounting member 220.. Carrying member 221... First storage unit 222.. First moving mechanism 223.. Carrying unit 230.. Test piece 240.. Unloading member 250. . Buffer assembly 251... Unloading unit 252... Second movement mechanism 253.. Second storage unit 260... Selection assembly 261.. Carrying unit 262... Sorting unit 263.. Third movement mechanism 264.. third storage unit 311.. placement space 312.. accommodation groove 24