201102418 六、發明說明： 【發明所屬之技術領域】 本發明係關於具備無機密封膜等功能膜之黏著帶及 功能膜的轉印方法。 【先前技術】 近來 太陽能及平面顯示器等裝置係藉由有例啊竹稱 成含有密封膜等功能膜之主要構件，且謀求彈性化、輕量 化、薄膜化、大型基板化等（例如，參照專利文獻丨及2)。 但是，相較於由玻璃等無機材料所形成之密封膜（無 機密封膜），由有機材料所形成之密封膜（有機密封膜）之氣 體阻隔性較差。因此，藉由有機密封膜密封之裝置容易受 外界空氣中的水分及氧等影響而劣化，而有壽命短的問題。 另一方面，在使用無機密封臈代替有機密封膜的情形 中’由於輕量化等目的’有必要將無機密封膜予以薄膜化。 ^而’經薄膜化之無機密制的強度弱，在運送時容易破 二氧=冗3記載有藉由在樹脂膜上依序層積含氧之聚 口备0層及金射1卿成的配線基 若依據該轉印片，藉由在_膠層 無機密封膜以代替前述金屬荡，則亦被 〜為可較文全地使用無機密封膜。 用專利文獻3所記载的轉印片由於麵著劑層使 用聚矽氧橡膠，而有以下的門镅百災 著力通當A〜 亦即，聚砂氧橡膠的黏 黏著=二Γ機密封媒時的勸著力與取出時的 力實質上相同。因此，兹將聚發氧橡膠的黏著力設計 321600 4 201102418 - 成較弱而使無機密封膜容易取出，則在運送時等，無機密 . 封膜有自聚矽氧橡膠剝離的疑慮。反之，若將聚矽氧橡膠 的黏著力設計成較強，則在取出時施加過度的力於無機密 封膜，該無機密封膜會變形或破損。此外，由於聚矽氧橡 膠係昂貴的，並且無法重複使用，故回收再利用性差而不 經濟。 [專利文獻1]日本國特開2009-40951號公報 [專利文獻2]日本國特開2009-110873號公報 [專利文獻3]日本國特開2003-60329號公報 【發明内容】 (發明所欲解決之課題） 本發明的課題係提供可安全地取出功能膜且回收再 利用性優異的附有功能膜之黏著帶及功能膜的轉印方法。 (解決問題之手段） 本發明之附有功能膜之黏著帶係具備：基材膜、層積 於該基材膜的單面之黏著劑層、層積於該黏著劑層的表面 之功能膜。前述黏著劑層含有感壓性接著劑及側鏈結晶性 聚合物，同時，在該侧鏈結晶性聚合物的熔點以上之溫度 下，接著力會下降。 本發明功能膜的轉印方法為將前述附有功能膜之黏 著帶中的功能膜轉印至轉印構件的方法，其包含下述（i) 及（i i)的步驟： (0經由接著層將轉印構件接著至前述功能膜的表面之步 5 321600 201102418 (ii)繼而，將前述黏著劑層的溫度設成前述侧鏈結晶性聚 合物的熔點以上之溫度而使黏著力下降，並自前述黏著劑 層將功能膜取出，而將功能膜自黏著劑層轉印至轉印構件 的步驟。 此外，本發明中前述Γ功能膜」係指具有預定的功能 且在單獨使用時會強度不足而難以使用的膜。前述功能除 了密封功能以外，可列舉如電/電子的功能（導電性、絕緣 性、壓電性、介電性等）、光學的功能（反射性、遮光性、 偏光性、折射率控制功能等）、磁的功能（硬磁性、軟磁性、 非磁丨生、透磁性等）、化學的功能（撥水性、吸著性、觸媒 性、吸水性、離子傳導性、氧化還原性等）、熱的功能（傳 熱性、絕熱性、熱膨脹控制功能等）等，亦可為此等功能以 外的其他功能。 ，據本發明，由於功賴係藉由基制錢於該基材 膜的單面之黏著劑層所保持·，故可藉由前述基材膜賦予剛 性至功能膜’且由於前述黏著劑層係作為緩衝材而發揮功 能，故在運送時等可吸收功能膜所受的外力。並且，由於 前述黏著縣含有感麗性接著劑及侧鏈結晶性聚合物，故 在將黏著劑層加熱至侧鏈結晶性聚合物麟點以上之溫产 時’側鏈結晶性聚合物會顯示流祕祿礙前述感壓性ς 著劑的黏著性，藉此可使㈣力下降。因此，在取出功能 膜時’可藉由《㈣層的溫度加熱至前述側鏈結晶性聚 合物的炫點以上之溫度而伽著力充分下降，因而可安全 地使用功能膜。 321600 6 201102418 又，由於係利用側鍵結晶性聚合物的相變化，故可重 ^ 複使用，而可顯示優異的回收再利用性。再者，由於黏著 劑層係作為緩衝材而發揮功能，故可依據功能膜的構成而 捲取成捲狀，亦可應付由所謂的捲至捲製程（rol卜to-roll process)所進行的連續生產。 【實施方式】 〈附有功能膜之黏著帶〉 下文中，針對關於本發明之附有功能膜之黏著帶（下 文中有時亦稱為「黏著帶」）之一實施形態，列舉功能膜係 使用無機密封膜的情形為例，並參照第1圖予以詳細說 明。如該圖所示，本實施形態的附有功能膜之黏著帶10 係在基材膜1的單面依序層積黏著劑層2、無機密封膜3 及離型層4所構成。 作為基材膜1者，可列舉如聚乙烯、聚對苯二曱酸乙 二酯、聚丙烯、聚酯、聚醯胺、聚醯亞胺、聚碳酸酯、乙 烯-醋酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-聚丙烯共聚物、聚氯乙烯等合成樹脂膜。 基材膜1可由單層體或複層體所構成，其厚度則以約 2 5至2 5 0 // m較宜。藉此，可對無機密封膜3賦予剛性。 為了使對於黏著劑層2之密著性提高，可對基材膜1施行 例如電暈放電處理、電漿處理、喷砂處理（blast treatment)、化學#刻處理、底漆處理（primer treatment) 等表面處理。 黏著劑層2含有感壓性接著劑及側鍵結晶性聚合物。 321600 201102418 前述感壓性接著劑沒有特別限定，只要是具有黏著性的聚 合物即可，可列舉如天然橡膠接著劑、合成橡膠接著劑、 苯乙烯/丁二烯乳膠（latex)接著劑、丙烯酸系接著劑等。 列舉前述丙烯酸系接著劑為例說明時，作為構成該丙 烯酸系接著劑的單體者，可列舉如具有碳數丨至12的烷基 之（甲基）丙烯酸酯等；作為該（甲基）丙烯酸酯者，可列舉 如（甲基）丙烯酸乙基己酯、（甲基）丙烯酸甲酯、（甲基）丙 烯酸乙酯、（甲基）丙烯酸丁酯等。此外，亦可使用具有羥 基烧基之（甲基）丙烯酸酯等；作為該（甲基）丙稀酸醋者， 可列舉如（甲基）丙烯酸經基乙醋、（甲基）丙烯酸經基丙 酯、（甲基）丙烯酸羥基己醋等。可將例示之此等單體以^ 種或混合2種以上使用。 聚合方法並無特別限定，彳採用例如溶液聚合法、塊 狀聚合法、懸浮聚合法、乳化聚合法等。例如當採用溶液 聚合法時，可將前述所例示的單體混合至溶劑，並在約Μ 至90°C攪拌約2至10小時，藉此使前述單體聚合。 使刖述單體聚合所得之聚合物的重量平均分子量較 宜為25萬S 100冑。前述重量平均分子量若太小，則取出 無機密封膜3之際，黏著劑層2會殘留在無機密封膜3上， 而有所謂殘糊變多的疑慮。此外，前述重量平均分子量若 太太’則黏著劑層2的凝聚力會變得過高而使黏著力= 降。前述重量平均分子量係藉由凝膠渗透層析法（G】)C)測定 前述聚合物並將所得到的測定值進行聚笨乙烯換算後之 值。 321600 8 201102418 另一方面，前述側鏈結晶性聚合物為在未達熔點的溫 度下結晶化且在熔點以上的溫度下顯示流動性的聚合物。 亦即，前述侧鏈結晶性聚合物係對應於溫度變化而可逆地 引起結晶狀態及流動狀態。黏著劑層2中，係在前述熔點 以上的溫度下使前述侧鏈結晶性聚合物顯示流動性時，以 黏著力會下降的比例含有前述側鏈結晶性聚合物。因此， 在取出無機密封膜3時，若將黏著劑層2加熱至前述側鏈 結晶性聚合物的熔點以上之溫度，則會由於使前述側鏈結 晶性聚合物顯示流動性而阻礙前述感壓性接著劑的黏著 性，藉此而使黏著力下降，所以可輕易取出無機密封膜3。 此外，若將黏著劑層2冷卻至未達前述側鏈結晶性聚合物 的熔點之溫度，則會由於使前述側鏈結晶性聚合物結晶化 而回復黏著，故可重複使用。 前述熔點係意指藉由某種平衡過程而使最初已整合 為有秩序之排列的聚合物的特定部分變成無秩序狀態的溫 度，且其係藉由示差熱掃描熱量計（DSC)以10°C/分鐘的條 件測定所得之值。前述熔點為30°C以上，較宜為30至70 °C。若欲將前述熔點設為預定值，可藉由改變側鏈結晶性 聚合物的組成等而任意地進行。 前述側鏈結晶性聚合物的組成可列舉如：由20至100 重量份之具有碳數16以上的直鏈狀烷基之（曱基）丙烯酸 酯、0至70重量份之具有碳數1至6的烷基之（甲基）丙烯 酸酯、及0至10重量份之極性單體聚合而得之聚合物等。 作為前述具有碳數16以上的直鏈狀烧基之（曱基）丙 9 321600 201102418 稀酸者，可列舉如（曱基）丙稀酸十六醋、（曱基）丙烯酸十 八醋、（甲基）丙烯酸二十酯、（甲基）丙烯酸二十二酯等具 有碳數16至22的直鏈烷基之（甲基）丙烯酸酯。作為前述 具有碳數1至6的烷基之（甲基）丙烯酸酯者，可列舉如（曱 基）丙烯酸甲酯、（甲基）丙烯酸乙酯、（曱基）丙烯酸丙酯、 (甲基）丙烯酸己酯等。作為前述極性單體者，可列舉如： 丙烯酸、甲基丙烯酸、巴豆酸、伊康酸、馬來酸、富馬酸 等含有羧基之乙烯系不飽和單體；（曱基）丙稀酸2_羥基乙 醋、（曱基）丙烯酸2-羥基丙酯、（甲基）丙烯酸2_羥基己酯 等具有羥基之乙烯系不飽和單體等。此等可使甩一種或混 合二種以上使用。 聚合方法並無特別限定，可採用例如溶液聚合法、塊 狀聚合法、懸浮聚合法、乳化聚合法等。例如當採用溶液 聚合法時，可將前述所例示的單體混合至溶劑，並在約4〇 至90 C攪拌約2至1〇小時，藉此使前述單體聚合。 刚述側鏈結晶性聚合物的重量平均分子量為2〇〇〇以 上較且為2000至20000。前述重量平均分子量若太小， 貝J取出無機密封膜3之際，會有殘糊變多的疑慮。此外， 月述重量平均分子量若太太，則即使將側鍵結晶性聚合物 之溫度設為熔點以上之溫度，亦難以顯示流動性，故黏著 ^會難以變低。前述重量平均分子量係藉由Gpc測定側鍵 結晶性聚合物並將所得到的測定值進行聚苯乙烯換算後之 值。 以固形份換算時，相對於感壓性接著劑1〇〇重量份， 321600 10 201102418 -- 係以1至20重量份（較宜為1至10重量份）的比例含有側 , 鏈結晶性聚合物。藉此，在未達側鏈結晶性聚合物之溶點 的溫度中可確保充分之黏著力，且在前述熔點以上的溫度 下側鏈結晶性聚合物顯示流動性時，黏著力會下降。相對 於此，側鍵結晶性聚合物的含量太少時，即使將黏著劑層 2加熱至側鏈結晶性聚合物之炫點以上的溫度，黏著力亦 難以降低。此外，側鏈結晶性聚合物的含量太多時，則黏 著劑層2的黏著力會下降而難以保持無機密封膜3。 黏著劑層2的厚度為15至400 /zm，較宜為120至150 // m。黏著劑層2的厚度太薄時，黏著劑層2難以發揮作為 緩衝材的功能，而難以吸收搬送時等無機密封膜3所承受 的外力。此外，黏著劑層2的厚度太厚時，則難以調製厚 度均勻的黏著劑層，而變得難以安定地保持無機密封膜3。 為了於基材膜1的單面設置黏著劑層2，只要將已將 感壓性接著劑層及側鍵結晶性聚合物以預定比例添加至溶 劑中而成的塗佈液予以塗佈在基材膜1的單面並使其乾燥 即可。於前述塗佈液中可添加例如交聯劑、增黏劑 (tackif ier)、可塑劑、老化防止劑、紫外線吸收劑等各種 添加劑。前述塗佈一般而言可藉由刮刀塗佈機、滾筒塗佈 機、壓延塗佈機、逗號式塗佈機（comma coater)等來進行。 此外，依據塗佈厚度及塗佈液的黏度，亦可藉由凹版塗佈 機、桿式塗佈機等來進行。 無機密封膜3係由無機系材料所構成，且具有密封功 能。構成無機密封膜3的材料可列舉如石英玻璃、驗性玻 11 321600 201102418 璃、鈉#5玻璃（soda-lime glass)、錯玻璃、硼石夕酸玻璃、 鋁石夕酸玻璃、氧化;ε夕玻璃（si】ica glass)等玻璃：鋁、鉬、 組等金屬。 無機岔封膜3的厚度為〇. 〇1至1〇〇，較宜為〇. 〇1 至1/zm。如此之厚度之無機密封膜3係強度非常弱而容易 破損’使用性差。依據本實施形態，係藉由以前述基材膜 1及黏著劑層2支持該無機密封膜3，而可安全地予以使用。 離型層4係為保護無機密封膜3之表面者。離型層4 可列舉：在例如由聚對苯二甲酸乙二醋等所構成的膜表面 塗佈聚碎氧等離型劑者。離型層4的厚度以約1()至 m為適當。 〈功能膜的轉印方法〉 其次’關於前述附有功能膜之黏著帶10中的無機密 封膜3的轉印方法，參照第2圖詳細地予以說明。又，在 第2圖中’與前述第！圖為相同之構成部分係賦予相同的 元件符號並省略其說明。 如第2圖（a)、⑹所示，首先，使黏著帶ι〇之離型 θ 4朝箭號A方向移動’而將離型層4從無機密封膜3剝 離。藉此，使無機密封膜3的表面3a露出。其次，將剝離 離型層4後的黏著帶1〇a以第2圖（〇所示的方式予以上下 反轉。藉此，使無機密封膜3的表面3a朝向下方。 另方面’在無機密封膜3的下方，配置轉印構件2〇。 該轉印構件20係藉由無機密封膜3所密封者，可列舉 陽電池中的太陽能電池單元、平面顯示器中的發光元件等。 321600 12 201102418 在該轉印構件20的表面形成接著層。構 ,21的接著劑，只要是能豹膝总城^ 構成接耆層 予以接著固定者，則無特別限定，例如可列兴 件20 型接著鮮。纟外、—接著劑等光硬化 表面=二可藉_接著劑塗佈於轉印構件2〇的 無機密封膜3之表面M將别述接者劑塗佈於 表面3a而形成。接著層21的厚度宜為ι 至1〇〇βηι，較宜為大約1〇至5〇/^。 朝牛2〇的表面形成接著層21後，使黏著帶10a 方向移動，如第2圖⑷所示，將轉印構件20經 者層21而接著於無機密封膜3的表面3a。此接著可 f由以對應於前述所例示之各接著劑的硬化方法使前述接 耆劑硬化而進行。 然後’使職料加熱手段將環境溫度加熱至前述側 鏈結晶性聚合物之熔點以上的溫度，使黏著縣2的黏著 力降低。若㈣舉具體例，則在使祕點5(rc之側鍵結晶 ，聚合物的情形中，通常若加熱至6Gt左右即充分地使黏 著劑層2的黏著力降低。 △其後，如第2圖（e)所示，將黏著劑層2與基材膜1 朝箭號C方向移動。藉此，將無機密封膜3從黏著劑層2 取出，並將無機密封膜3從黏著劑層2轉印至轉印構件 20此時’黏著劑層2的黏著力由於上述之理由而充分地 降低，故在取出時對無機密封膜3施加的負荷小。 13 321600 201102418 對於已取出無機密封膜3後的黏著帶i〇b，當將黏著 劑層2冷卻至未達前述侧鏈結晶性聚合物之熔點的溫度 時’由於前述側鏈結晶性聚合物會進行結晶化，而使黏著 力回復。因此，只要在黏著力已回復的黏著劑層2上依序 層積另外的無機密封膜3與離型層4，即可作為新的附有 功能膜之黏著帶1〇而重複使用。 以上，已針對本發明的若干實施形態予以顯示，惟本 發明並非限定於以上的實施形態者，在申請專利範圍所記 載的範圍内，皆可進行各猃改善與變更。例如，在前述附 有功能膜之黏著帶所相關的實施形態中，係列舉無機密封 膜為例作為功能膜而進行說明，但本發明所相關之功能膜 f未限定於此’對於無機功能膜以外的功能膜，亦即具有 密封功能以外的其他功能、且在單獨使用時會強度不足而 難以使用的膜，皆適合使用。 此外，在前述實施形態t，係針對在黏著劑層上直接 層積無機密封膜的情形騎說明，但在黏著劑層與無機密 封，之間亦可介置例如非黏著層。藉此，可使無機密封膜 更容易地被取出。 ' ，述非黏著層係意指㈣上不具有黏著力的層。前述 ，黏著層並非為覆蓋黏著劑層之表面全面的均勻的層，而 是為使黏著劑層之表面呈部分性地露出的不均勻的層。亦 即:前述非黏著層為例如呈點狀、斑狀等形狀的非黏著性 的黏著劑層的表面面積 若調整從前述非黏著層露出 321600 14 201102418 接二卜審占著劑層與功能膜的接觸面積。若使前述接觸面 ’ g,^則黏著力變強。相反地，若使前述接觸面積變小， ^著力變弱。因此，若使非黏著層介置於黏著劑層與功 此膜之間，則可簡單地控制黏著劑層的黏著力，因此可更 :易地取出功能膜。此外，從非黏著層露出的黏著劑層的 積的比例可因應黏著劑層之黏著力和功能膜而任意 地§又疋，而非為有特別限定者。 减，述非點著層可藉由例如蒸鍵、喷乾（spray dry)、 Z等予：形成。特別是以效率佳地形成非黏著層之觀點 吕，以蒸鍍為佳。在以蒸鍍形成非黏著層時，只要在以 非黏著層覆蓋黏著劑層之表面全面 用前述嘴乾、賤鍍時亦相同。 'WT採 :前述非黏著層的組成而言，只要為實質上不具有黏 卩可。若㈣舉具體例，财騎㈣氧、氟樹脂、 ^⑼）等，特別以氟樹脂為適宜。前述_脂可 舉四氟乙婦/六氟丙稀共聚物（FEp)、聚四氣乙稀 (PTFE)、四氟乙烯/全氟烷基乙烯基醚共聚物（PFA)等。 下為2非黏著層的厚度以1㈣以下為佳，以以 二：佳。非黏著層的厚度若太大，則難 功能膜均勻地接觸，故不宜。此外，在介置有非黏 情形下的剝離通常係發生在非黏著層與功能膜之門θ 明二列舉合成例與實施例而詳細說明本發明:惟本發 月非為僅限定於以下的合成例與實施例者。 的說明中，「份」係意指重量份。 在乂下 321600 15 201102418 (合成例1) 以丙烯酸乙基己酯52份、丙烯酸曱酯40份、丙烯酸 羥基乙酯8份、及作為起始劑的PERBuTYL (日油公司 製）0· 2份的比例，分別添加至2〇〇份之曱苯，以60°C攪 拌5小時’而使此等單體聚合。所得到之共聚物的重量平 均分子量為46萬。 (合成例2) 以丙烯酸乙基己酯92份、丙烯酸羥基乙酯8份、及 作為起始劑的PERBUTYL ND (日油公司製）0. 2份的比例， 分別添加至200份之甲苯’以6(TC攪拌5小時，而使此等 單體聚合。所得到之共聚物的重量平均分子量為47萬。 (合成例3) 以丙烯酸二十二酯40份、丙烯酸十八酯35份、丙稀 酸甲S旨20份、丙稀酸5份、作為鍵轉移劑（chain transfer agent)的十二基硫醇（dodecyl mercaptan)6份、及作為起 始劑的PERHEXYL PV(日油公司製）1. 〇份的比例，分別添 加至100份之甲苯，以80°C攪拌5小時，而使此等單體聚 合。所得到之共聚物的重量平均分子量為8000，熔點為52 V。 (合成例4) 以丙烯酸十八酯9 5份、丙稀酸5份、作為鏈轉移劑 的十二基硫醇5份、及作為起始劑的PERHEXYL PV(日油公 司製）1.0份的比例，分別添加至100份之曱笨，以8〇。(： 攪拌5小時，而使此等單體聚合。所得到之共聚物的重量 321600 201102418 平均分子量為8500，熔點為51°C。 , 將前述合成例1至4的各共聚物顯示於表1。其中， 前述重量平均分子量係以GPC測定共聚物後將所得到之測 定值進行聚苯乙烯換算後之值。前述熔點係使用DSC並以 10°C/分鐘的測定條件所測得的值。 表1 單體的配方 重量平均分 子量 熔點 (°C) 備註 組成n 比率 合成例1 EHA/C1A/HEA 52/40/8 46萬 一 感壓性接 著劑 合成例2 EHA/HEA 92/8 47萬 — 感壓性接 著劑 合成例3 C22A/C18A/C1A/AA 40/35/20/5 8000 52 側鏈結晶 性聚合物 合成例4 C18A/AA 95/5 8500 51 側鏈結晶 性聚合物 1)EHA ··丙烯酸乙基己酯、C1A :丙烯酸曱酯、 HEA :丙烯酸羥基乙酯、C22A :丙烯酸二十二酯、 C18A :丙烯酸十八酯、AA :丙烯酸 (實施例1) 相對於上述所得之合成例1的共聚物溶液100份，添 加以固形份換算下之5份的合成例3之共聚物溶液、以及 0.5份之異氰酸酯交聯劑而得到黏著劑溶液，將此黏著劑 溶液塗佈於厚度100/zm之聚對苯二甲酸乙二酯膜的單面 並使其乾燥，而製作出形成有厚度30 /zm之黏著劑層的黏 著帶。 (實施例2) 除了分別使用合成例2之共聚物溶液以取代合成例 17 321600 201102418 1、使用合成例4之共聚物溶液以取代合成例3以外，與前 述實施例1相同地製作出在厚度lOOym之聚對笨二甲酸乙 二酯膜的單面形成有厚度30//m之黏著劑層的黏著帶。 (實施例3) 在前述實施例1之黏著帶中的黏著劑層的表面形成非 黏著層。形成條件如以下所示。 (非黏著層） 組成：氟樹脂（PTFE) 形狀：點狀 厚度：500 nm 形成方法：蒸鍍 前述蒸鍵的條件如以下所示。 (蒸鍍） 環境溫度：200°C 真空度：10-2托（torr) [比較例1] 相對於100份之丙烯酸系黏著劑（綜研化學公司製的 「SK-1340」），添加以固形份換算下之2· 4份的交聯劑'^畔 研化學公司製的「M-5A」）而得到黏著劑溶液，將此黏著劑 溶液塗佈於厚I 1〇()_之聚對笨m旨膜的單面 =其乾燥，而製作出形成有厚度3Mm之崎劑層 者帶。 〈評估〉 針對上述所得的各黏著帶，評估無機密封膜的取出 321600 18 201102418 性。評估方法如以下所示，且其結果係顯示於表2。 (無機密封膜的取出性） -* · 無機密封膜皆使用厚度50#m的鋁膜以及石英玻璃 膜。於23°C的環境溫度中將該等各無機密封膜層積於前述 黏著劑層的表面。其次，於各無機密封膜表面貼附丙烯酸 系黏著帶（日東電工公司製的「NO-535A」）。繼而，將環境 溫度從23°C升溫至60°C後，'以手指輕輕地拿起前述丙烯酸 系黏著帶，藉此評估無機密封膜的取出性。評估基準係以 下述方式設定。 〇：能夠簡單地從黏著劑層取出無機密封膜而無破損。 △:雖然要施加若干負荷，但在實際使用上係在無問題 的範圍内，能夠從黏著劑層取出無機密封膜而無破損。 X:施加大的負荷，使無機密封膜變形或破損。 表2BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer method of an adhesive tape and a functional film having a functional film such as an inorganic sealing film. [Prior Art] Recently, devices such as solar energy and flat-panel displays have been used as main components including functional films such as sealing films, and are required to be elasticized, lightweight, thinned, and large-sized substrates (for example, refer to patents). Literature and 2). However, the sealing film (organic sealing film) formed of an organic material has a poor gas barrier property as compared with a sealing film (an inorganic sealing film) formed of an inorganic material such as glass. Therefore, the device sealed by the organic sealing film is easily deteriorated by the influence of moisture and oxygen in the outside air, and has a problem of short life. On the other hand, in the case where an inorganic sealing film is used instead of the organic sealing film, it is necessary to thin the inorganic sealing film because of the purpose of weight reduction or the like. ^And 'the thinness of the thinned inorganic seal is weak, and it is easy to break the dioxane during transportation. The redundant 3 is described by layering the oxygen-containing layer on the resin film in sequence. According to the transfer sheet, the inorganic sealing film can be used as a whole by using the inorganic sealing film in the rubber layer instead of the metal. According to the transfer sheet described in Patent Document 3, since the surface layer is made of polyoxyxene rubber, the following thresholds are used for the purpose of A~, that is, the adhesion of the polyoxyethylene rubber = the seal of the second machine The persuasion of the media is essentially the same as the force when it is taken out. Therefore, the adhesive strength of the polyoxyethylene rubber is designed. 321600 4 201102418 - The inorganic sealing film is weakened and the inorganic sealing film is easily taken out, and the inorganic sealing is carried out during transportation, etc. The sealing film has a concern of peeling off from the polyoxyethylene rubber. On the other hand, if the adhesive strength of the polyoxyethylene rubber is designed to be strong, an excessive force is applied to the inorganic sealing film at the time of removal, and the inorganic sealing film may be deformed or broken. In addition, since polyoxyxene rubber is expensive and cannot be reused, recycling and recycling are poor and uneconomical. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2009-110873 [Patent Document 2] Japanese Laid-Open Patent Publication No. 2009-110873 (Patent Document 3) JP-A-2003-60329 (Summary of Invention) Problem to be Solved The problem of the present invention is to provide a transfer method of a functional film-attached adhesive tape and a functional film which can safely take out a functional film and which is excellent in recyclability. (Means for Solving the Problem) The adhesive film with a functional film of the present invention comprises: a base film, an adhesive layer laminated on one side of the base film, and a functional film laminated on the surface of the adhesive layer . The pressure-sensitive adhesive layer contains a pressure-sensitive adhesive and a side chain crystalline polymer, and at the same time, the bonding force is lowered at a temperature equal to or higher than the melting point of the side chain crystalline polymer. The transfer method of the functional film of the present invention is a method of transferring the functional film in the adhesive film with the functional film described above to the transfer member, which comprises the following steps (i) and (ii): (0 via the adhesive layer) Step of transferring the transfer member to the surface of the functional film 5 321600 201102418 (ii) Then, setting the temperature of the adhesive layer to a temperature higher than a melting point of the side chain crystalline polymer to lower the adhesion, and The step of removing the functional film from the adhesive layer and transferring the functional film from the adhesive layer to the transfer member. Further, the aforementioned Γ functional film in the present invention means having a predetermined function and is insufficient in strength when used alone. In addition to the sealing function, the above-mentioned functions include electrical/electronic functions (electrical conductivity, insulating properties, piezoelectricity, dielectric properties, etc.) and optical functions (reflectivity, light blocking property, and polarizing property). , refractive index control function, etc., magnetic functions (hard magnetic, soft magnetic, non-magnetic, magnetic, etc.), chemical functions (water repellency, sorption, catalyst, water absorption, ion conductivity, oxygen Other functions such as reducing power, heat function (heat transfer property, heat insulation property, thermal expansion control function, etc.), etc., may be used for the purpose of the present invention. Since the adhesive layer of one side of the base film is held, the rigidity of the base film can be imparted to the functional film ′, and since the adhesive layer functions as a cushioning material, the function can be absorbed during transportation. The external force applied to the film. Moreover, since the adhesive county contains a sensible adhesive and a side chain crystalline polymer, the side chain is heated when the adhesive layer is heated to a temperature above the side chain crystalline polymer. The crystalline polymer exhibits an adhesiveness to the adhesion of the pressure-sensitive adhesive, whereby the force can be lowered. Therefore, when the functional film is taken out, the temperature of the (four) layer can be heated to the aforementioned side chain. The temperature above the bright point of the crystalline polymer is sufficiently lowered, and the glazing force is sufficiently lowered, so that the functional film can be used safely. 321600 6 201102418 Further, since the phase change of the side bond crystalline polymer is utilized, it can be reused. Displayable Different recycling and recycling. Furthermore, since the adhesive layer functions as a cushioning material, it can be wound into a roll according to the structure of the functional film, and can also cope with the so-called roll-to-roll process (rol to -roll process) Continuous production. [Embodiment] <Adhesive tape with functional film> Hereinafter, an adhesive tape with a functional film according to the present invention (hereinafter sometimes referred to as "adhesive tape") In one embodiment, the case where the functional film is an inorganic sealing film is taken as an example, and will be described in detail with reference to Fig. 1. As shown in the figure, the functional film-attached adhesive tape 10 of the present embodiment is attached to the substrate. The single-sided layer of the film 1 is sequentially laminated with the adhesive layer 2, the inorganic sealing film 3, and the release layer 4. Examples of the substrate film 1 include polyethylene, polyethylene terephthalate, and poly A synthetic resin film of propylene, polyester, polyamide, polyimine, polycarbonate, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-polypropylene copolymer, polyvinyl chloride or the like. The base film 1 may be composed of a single layer or a laminate, and has a thickness of about 25 to 250 / m. Thereby, rigidity can be imparted to the inorganic sealing film 3. In order to improve the adhesion to the adhesive layer 2, the substrate film 1 may be subjected to, for example, corona discharge treatment, plasma treatment, blast treatment, chemical etching treatment, primer treatment. Wait for surface treatment. The adhesive layer 2 contains a pressure-sensitive adhesive and a side bond crystalline polymer. 321600 201102418 The pressure-sensitive adhesive is not particularly limited as long as it is a polymer having adhesiveness, and examples thereof include a natural rubber adhesive, a synthetic rubber adhesive, a styrene/butadiene latex adhesive, and acrylic acid. It is an adhesive or the like. In the case of exemplifying the acrylic adhesive, the monomer constituting the acrylic adhesive may, for example, be a (meth) acrylate having an alkyl group having a carbon number of 12 to 12; Examples of the acrylate include ethylhexyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, and butyl (meth)acrylate. Further, a (meth) acrylate having a hydroxy group can be used, and examples of the (meth) acrylate vinegar include, for example, (meth)acrylic acid, ethyl ketone, and (meth)acrylic acid. Propyl ester, hydroxyhexyl vinegar (meth) acrylate, and the like. These exemplified monomers may be used in combination of two or more kinds. The polymerization method is not particularly limited, and examples thereof include a solution polymerization method, a bulk polymerization method, a suspension polymerization method, and an emulsion polymerization method. For example, when a solution polymerization method is employed, the above-exemplified monomers may be mixed to a solvent and stirred at about Μ to 90 ° C for about 2 to 10 hours, whereby the aforementioned monomers are polymerized. The weight average molecular weight of the polymer obtained by polymerizing the monomer described above is preferably 250,000 S 100 Torr. When the weight average molecular weight is too small, when the inorganic sealing film 3 is taken out, the adhesive layer 2 remains on the inorganic sealing film 3, and there is a concern that the residual paste is increased. Further, if the weight average molecular weight is "too", the cohesive force of the adhesive layer 2 becomes too high and the adhesion = drop. The weight average molecular weight is a value obtained by measuring the polymer by gel permeation chromatography (G)) C) and converting the obtained measured value into polystyrene. 321600 8 201102418 On the other hand, the side chain crystalline polymer is a polymer which crystallizes at a temperature not reaching the melting point and exhibits fluidity at a temperature higher than the melting point. That is, the side chain crystalline polymer reversibly causes a crystal state and a flow state in response to a change in temperature. In the adhesive layer 2, when the side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, the side chain crystalline polymer is contained in a ratio at which the adhesive strength is lowered. Therefore, when the inorganic sealing film 3 is taken out, when the pressure-sensitive adhesive layer 2 is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer, the side chain crystalline polymer exhibits fluidity and hinders the pressure-sensitive pressure. The adhesiveness of the adhesive prevents the adhesive force from being lowered, so that the inorganic sealing film 3 can be easily taken out. Further, when the adhesive layer 2 is cooled to a temperature which does not reach the melting point of the side chain crystalline polymer, the side chain crystalline polymer is crystallized and returned to the adhesive, so that it can be reused. The aforementioned melting point means a temperature at which a specific portion of the polymer which has been originally integrated into an ordered arrangement is changed to an disordered state by a certain equilibrium process, and is 10 ° C by a differential thermal scanning calorimeter (DSC). The value obtained is determined by the condition of /min. The aforementioned melting point is 30 ° C or higher, preferably 30 to 70 ° C. If the melting point is to be a predetermined value, it can be arbitrarily carried out by changing the composition of the side chain crystalline polymer or the like. The composition of the aforementioned side chain crystalline polymer may, for example, be 20 to 100 parts by weight of a (fluorenyl) acrylate having a linear alkyl group having 16 or more carbon atoms, and 0 to 70 parts by weight having a carbon number of 1 to A polymer of (meth) acrylate of 6 and a polymer obtained by polymerizing 0 to 10 parts by weight of a polar monomer. Examples of the (acid-based) propylene 9 321600 201102418 dilute acid having a linear alkyl group having a carbon number of 16 or more include, for example, (mercapto)acrylic acid hexadecyl vinegar, (mercapto)acrylic acid octaacetate, A (meth) acrylate having a linear alkyl group having 16 to 22 carbon atoms such as behenyl methacrylate or behenyl (meth) acrylate. Examples of the (meth) acrylate having an alkyl group having 1 to 6 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and (methyl). ) hexyl acrylate and the like. Examples of the polar monomer include a carboxyl group-containing ethylenically unsaturated monomer such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, and fumaric acid; and (mercapto)acrylic acid 2 An ethylenically unsaturated monomer having a hydroxyl group such as 2-hydroxyethyl vinegar, 2-hydroxypropyl (meth) acrylate or 2-hydroxyhexyl (meth) acrylate. These may be used alone or in combination of two or more. The polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, or the like can be employed. For example, when a solution polymerization method is employed, the above-exemplified monomers may be mixed to a solvent and stirred at about 4 to 90 C for about 2 to 1 hour, whereby the aforementioned monomers are polymerized. The weight average molecular weight of the side chain crystalline polymer just described is 2 Å or more and is 2,000 to 20,000. When the weight average molecular weight is too small, when the shell J takes out the inorganic sealing film 3, there is a fear that the crumb becomes more. Further, if the monthly weight average molecular weight is too large, even if the temperature of the side bond crystalline polymer is set to a temperature higher than the melting point, it is difficult to exhibit fluidity, so that it is difficult to lower the adhesion. The weight average molecular weight is a value obtained by measuring a side bond crystalline polymer by Gpc and subjecting the obtained measured value to polystyrene. In the conversion of the solid content, relative to the pressure-sensitive adhesive 1 〇〇 by weight, 321600 10 201102418 -- in a ratio of 1 to 20 parts by weight (more preferably 1 to 10 parts by weight) containing side, chain crystalline polymerization Things. Thereby, sufficient adhesion can be ensured at a temperature at which the melting point of the side chain crystalline polymer is not reached, and when the side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the above melting point, the adhesive force is lowered. On the other hand, when the content of the side bond crystalline polymer is too small, even if the adhesive layer 2 is heated to a temperature higher than the bright point of the side chain crystalline polymer, the adhesion is hard to be lowered. Further, when the content of the side chain crystalline polymer is too large, the adhesive force of the adhesive layer 2 is lowered to make it difficult to hold the inorganic sealing film 3. The thickness of the adhesive layer 2 is 15 to 400 /zm, preferably 120 to 150 // m. When the thickness of the adhesive layer 2 is too small, the adhesive layer 2 hardly functions as a cushioning material, and it is difficult to absorb an external force which the inorganic sealing film 3 receives during transportation. Further, when the thickness of the adhesive layer 2 is too thick, it is difficult to prepare a pressure-sensitive adhesive layer having a uniform thickness, and it becomes difficult to stably maintain the inorganic sealing film 3. In order to provide the adhesive layer 2 on one surface of the base film 1, a coating liquid obtained by adding a pressure-sensitive adhesive layer and a side bond crystalline polymer to a solvent at a predetermined ratio is applied to the base. One side of the material film 1 can be dried. Various additives such as a crosslinking agent, a tackifier, a plasticizer, an anti-aging agent, and an ultraviolet absorber may be added to the coating liquid. The above coating can be generally carried out by a knife coater, a roll coater, a calender coater, a comma coater or the like. Further, depending on the coating thickness and the viscosity of the coating liquid, it may be carried out by a gravure coater, a bar coater or the like. The inorganic sealing film 3 is composed of an inorganic material and has a sealing function. The material constituting the inorganic sealing film 3 may, for example, be quartz glass, inspective glass 11 321600 201102418 glass, sodium #5 glass (soda-lime glass), mis-glass, borax acid glass, aluminite glass, oxidation; Glass such as ica glass: aluminum, molybdenum, group and other metals. The thickness of the inorganic cerium sealing film 3 is 〇1 to 1 〇〇, preferably 〇1 to 1/zm. The inorganic sealing film 3 having such a thickness is very weak and easily broken, and the usability is poor. According to this embodiment, the inorganic sealing film 3 is supported by the base film 1 and the adhesive layer 2, and can be used safely. The release layer 4 is a surface that protects the surface of the inorganic sealing film 3. The release layer 4 may be a coating agent such as polyacetal or the like which is coated on the surface of a film made of, for example, polyethylene terephthalate. The thickness of the release layer 4 is suitably from about 1 () to m. <Transfer method of functional film> Next, the transfer method of the inorganic sealing film 3 in the adhesive tape 10 with the functional film described above will be described in detail with reference to Fig. 2 . Also, in the second picture, 'and the above! The same components are denoted by the same reference numerals and the description thereof will be omitted. As shown in Fig. 2 (a) and (6), first, the release layer θ 4 of the adhesive tape is moved in the direction of the arrow A to peel off the release layer 4 from the inorganic sealing film 3. Thereby, the surface 3a of the inorganic sealing film 3 is exposed. Next, the adhesive tape 1〇a after peeling off the release layer 4 is reversed upside down in the second diagram (〇, whereby the surface 3a of the inorganic sealing film 3 faces downward. The other aspect is in the inorganic seal The transfer member 2 is disposed below the film 3. The transfer member 20 is sealed by the inorganic sealing film 3, and examples thereof include a solar battery cell in a solar battery, a light-emitting element in a flat display, and the like. 321600 12 201102418 The surface of the transfer member 20 is formed as an adhesive layer. The adhesive of the structure 21 is not particularly limited as long as it can be attached to the joint layer, for example, the type of the product can be fresh. The surface of the inorganic sealing film 3 of the transfer member 2 is applied to the surface M of the inorganic sealing film 3 of the transfer member 2A, and the adhesive is applied to the surface 3a. Next, the layer 21 is formed. The thickness of the layer is preferably ι to 1 〇〇βηι, preferably about 1 〇 to 5 〇 / ^. After forming the adhesive layer 21 on the surface of the ox 2, the adhesive tape 10a is moved, as shown in Fig. 2 (4). The transfer member 20 is passed through the layer 21 and then on the surface 3a of the inorganic sealing film 3. The curing can be carried out by hardening the bonding agent in a curing method corresponding to each of the above-exemplified adhesives. Then, the heating means is used to heat the ambient temperature to a temperature higher than the melting point of the side chain crystalline polymer. In order to reduce the adhesion of the adhesive layer 2, if the specific example is used, in the case of the secret point 5 (the side bond of rc is crystallized, in the case of a polymer, the adhesive layer 2 is sufficiently made to be heated to about 6 Gt. The adhesive force is lowered. Δ Thereafter, as shown in Fig. 2(e), the adhesive layer 2 and the base film 1 are moved in the direction of the arrow C. Thereby, the inorganic sealing film 3 is taken out from the adhesive layer 2, When the inorganic sealing film 3 is transferred from the adhesive layer 2 to the transfer member 20, the adhesive force of the adhesive layer 2 is sufficiently lowered for the above reasons, so that the load applied to the inorganic sealing film 3 at the time of taking out is small. 13 321600 201102418 For the adhesive tape i〇b after the inorganic sealing film 3 has been taken out, when the adhesive layer 2 is cooled to a temperature which does not reach the melting point of the aforementioned side chain crystalline polymer, 'because of the aforementioned side chain crystalline polymer Crystallization will occur and the adhesion will be restored. Therefore, as long as the additional inorganic sealing film 3 and the release layer 4 are sequentially laminated on the adhesive layer 2 whose adhesive force has recovered, it can be reused as a new adhesive tape with a functional film. The present invention has been described with respect to the embodiments of the present invention, and the present invention is not limited to the above embodiments, and various modifications and changes can be made within the scope of the claims. In the embodiment related to the adhesive tape, the inorganic sealing film is exemplified as a functional film. However, the functional film f according to the present invention is not limited to the functional film other than the inorganic functional film. A film that has a function other than the sealing function and that is insufficient in strength and difficult to use when used alone is suitable for use. Further, in the above-described embodiment t, the case where the inorganic sealing film is directly laminated on the adhesive layer is described. However, for example, a non-adhesive layer may be interposed between the adhesive layer and the inorganic seal. Thereby, the inorganic sealing film can be taken out more easily. ' Non-adhesive layer means a layer that does not have adhesion on (4). As described above, the adhesive layer is not a uniform layer covering the entire surface of the adhesive layer, but an uneven layer partially exposing the surface of the adhesive layer. That is, the non-adhesive layer is, for example, a non-adhesive adhesive layer having a shape of a dot or a spot, and the surface area of the non-adhesive layer is adjusted to be exposed from the non-adhesive layer 321600 14 201102418 Contact area. If the contact surface 'g, ^ is used, the adhesion becomes stronger. Conversely, if the contact area is made smaller, the force becomes weaker. Therefore, if the non-adhesive layer is interposed between the adhesive layer and the working film, the adhesive force of the adhesive layer can be easily controlled, so that the functional film can be easily taken out. Further, the ratio of the amount of the adhesive layer exposed from the non-adhesive layer may be arbitrarily determined in accordance with the adhesive force of the adhesive layer and the functional film, and is not particularly limited. Alternatively, the non-pointing layer may be formed by, for example, steaming, spray drying, Z, or the like. In particular, it is preferable to form a non-adhesive layer with high efficiency, and it is preferable to use vapor deposition. When the non-adhesive layer is formed by vapor deposition, the same applies to the case where the surface of the adhesive layer is covered with a non-adhesive layer. 'WT mining: The composition of the aforementioned non-adhesive layer is not substantially viscous. If (4) a specific example, Caiqi (4) oxygen, fluororesin, ^(9)), etc., especially fluororesin is suitable. The above-mentioned _ lipid may be a tetrafluoroethylene/hexafluoropropylene copolymer (FEp), a polytetraethylene (PTFE), a tetrafluoroethylene/perfluoroalkyl vinyl ether copolymer (PFA) or the like. The thickness of the 2 non-adhesive layer is preferably 1 (four) or less, and is preferably 2: good. If the thickness of the non-adhesive layer is too large, it is difficult to uniformly contact the functional film, which is not preferable. In addition, the peeling in the case where the non-adhesive layer is interposed is usually the door of the non-adhesive layer and the functional film. The present invention will be described in detail by way of synthesis examples and examples: the present invention is not limited to the following. Synthesis examples and examples. In the description, "parts" means parts by weight.乂下321600 15 201102418 (Synthesis Example 1) 52 parts of ethyl hexyl acrylate, 40 parts of decyl acrylate, 8 parts of hydroxyethyl acrylate, and PERBuTYL (manufactured by Nippon Oil Co., Ltd.) as a starter The proportions were separately added to 2 parts of toluene and stirred at 60 ° C for 5 hours to polymerize the monomers. The obtained copolymer had a weight average molecular weight of 460,000. (Synthesis Example 2) In a ratio of 0.2 parts of ethyl hexyl acrylate, 8 parts of hydroxyethyl acrylate, and PERBUTYL ND (manufactured by Nippon Oil Co., Ltd.) as a starter, respectively, to 200 parts of toluene' The monomer was polymerized by stirring 6 hours (TC) for 5 hours. The weight average molecular weight of the obtained copolymer was 470,000. (Synthesis Example 3) 40 parts of behenyl acrylate and 35 parts of octadecyl acrylate were used. 20 parts of acrylic acid methyl S, 5 parts of acrylic acid, 6 parts of dodecyl mercaptan as a chain transfer agent, and PERHEXYL PV as a starter (made by Nippon Oil Co., Ltd.) 1. The proportion of the mash was added to 100 parts of toluene and stirred at 80 ° C for 5 hours to polymerize the monomers. The obtained copolymer had a weight average molecular weight of 8,000 and a melting point of 52 V. Synthesis Example 4) Ratio of pentadecyl acrylate 95 parts, acrylic acid 5 parts, lauryl thiol as a chain transfer agent, and PERHEXYL PV (manufactured by Nippon Oil Co., Ltd.) as a starter , respectively, added to 100 parts of 曱, to 8 〇. (: stirring for 5 hours, and these monomers are polymerized. The weight of the material 321600 201102418 The average molecular weight is 8,500, and the melting point is 51 ° C. The copolymers of the above Synthesis Examples 1 to 4 are shown in Table 1. The weight average molecular weight is obtained by measuring the copolymer by GPC. The measured value is a value obtained by polystyrene conversion. The above melting point is a value measured by DSC and measured under the measurement conditions of 10 ° C / min. Table 1 Formulation of Monomer Weight Average Molecular Weight Melting Point (°C) Remarks Composition n Ratio Synthesis Example 1 EHA/C1A/HEA 52/40/8 46 million pressure-sensitive adhesive Synthesis Example 2 EHA/HEA 92/8 470,000 - Pressure-sensitive adhesive Synthesis Example 3 C22A/C18A/C1A/AA 40/ 35/20/5 8000 52 Side chain crystalline polymer Synthesis Example 4 C18A/AA 95/5 8500 51 Side chain crystalline polymer 1) EHA ··Ethylhexyl acrylate, C1A: decyl acrylate, HEA: Acrylic acid Hydroxyethyl ester, C22A: behenyl acrylate, C18A: octadecyl acrylate, AA: acrylic acid (Example 1) With respect to 100 parts of the copolymer solution of Synthesis Example 1 obtained above, 5 in terms of solid content was added. a copolymer solution of Synthesis Example 3, and 0.5 part of an isocyanate crosslinking agent An adhesive solution was obtained, and the adhesive solution was applied to one side of a polyethylene terephthalate film having a thickness of 100/zm and dried to prepare an adhesive layer having a thickness of 30 /zm. Adhesive tape. (Example 2) In the same manner as in the above Example 1, except that the copolymer solution of Synthesis Example 2 was used instead of Synthesis Example 17 321600 201102418, and the copolymer solution of Synthesis Example 4 was used instead of Synthesis Example 3. The lOOym polymer formed on the single side of the ethylene glycol diester film with an adhesive layer having a thickness of 30/m. (Example 3) A non-adhesive layer was formed on the surface of the adhesive layer in the adhesive tape of the above-mentioned Example 1. The formation conditions are as follows. (non-adhesive layer) Composition: fluororesin (PTFE) Shape: dot shape Thickness: 500 nm Formation method: vapor deposition The conditions of the above-mentioned steaming bonds are as follows. (vapor deposition) Ambient temperature: 200°C Vacuum degree: 10-2 Torr (torr) [Comparative Example 1] Addition to solid content with respect to 100 parts of acrylic adhesive ("SK-1340" manufactured by Amika Chemical Co., Ltd.) 2 to 4 parts of the cross-linking agent "M-5A" manufactured by Rigaku Chemical Co., Ltd.) to obtain an adhesive solution, and apply the adhesive solution to a poly-pair of thickness I 1 〇 () One side of the film of the stupid m = it is dried, and a band having a layer of a layer of 3 Mm is formed. <Evaluation> For the adhesive tape obtained above, the extraction of the inorganic sealing film was evaluated 321600 18 201102418. The evaluation methods are as follows, and the results are shown in Table 2. (Extraction property of inorganic sealing film) -* · For the inorganic sealing film, an aluminum film having a thickness of 50 #m and a quartz glass film were used. These inorganic sealing films were laminated on the surface of the above-mentioned adhesive layer at an ambient temperature of 23 °C. Next, an acrylic adhesive tape ("NO-535A" manufactured by Nitto Denko Corporation) was attached to the surface of each inorganic sealing film. Then, after raising the ambient temperature from 23 ° C to 60 ° C, the acrylic adhesive tape was gently picked up with a finger to evaluate the take-out property of the inorganic sealing film. The evaluation criteria are set as follows. 〇: The inorganic sealing film can be easily taken out from the adhesive layer without damage. △: Although a certain load was applied, the inorganic sealing film was taken out from the adhesive layer without damage in the range of no problem in practical use. X: A large load is applied to deform or break the inorganic sealing film. Table 2
黏著劑層 非黏著層 無機密封膜的取出性 厚度50 的鋁膜 厚度50//m的石英 玻璃膜 實施例1 合成例1+合成例3 — Δ Δ 實施例2 合成例2+合成例4 — Δ Δ 實施例3 合成例1+合成例3 〇 〇 〇 比較例1 丙烯酸系黏著劑” — X X 1)綜研化學公司製的「SK-1340」 由表2可得知，相較於比較例1，實施例1至3於無 機密封膜的取出性係較優異。特別是設有非黏著層的實施 例3係顯示比實施例1更優異的取出性。此外，在實施例 3中，剝離係發生於非黏著層與無機密封膜之間。 19 321600 201102418Adhesive layer non-adhesive layer inorganic sealing film 50 mm / thickness of aluminum film thickness 50 / / m quartz glass film Example 1 Synthesis Example 1 + Synthesis Example 3 - Δ Δ Example 2 Synthesis Example 2+ Synthesis Example 4 - Δ Δ Example 3 Synthesis Example 1 + Synthesis Example 3 〇〇〇 Comparative Example 1 Acrylic Adhesive "- XX 1" "SK-1340" manufactured by Amika Chemical Co., Ltd. As can be seen from Table 2, compared with Comparative Example 1 Further, Examples 1 to 3 were excellent in the removability of the inorganic sealing film. In particular, Example 3 in which a non-adhesive layer was provided showed superior take-up property than Example 1. Further, in Example 3, the peeling occurred between the non-adhesive layer and the inorganic sealing film. 19 321600 201102418
IT圖式簡單說明J 第1圖為顯示關於本發明之一 之點著帶的截面圖。 第2圖之（a)至（e)為顯示第 著帶中的功能m之轉印方法的示意說 【主要元件符號說明J 圖 施形態的附有功能膜 圖所 示附有功能膜之黏 1 基材膜 3 無機密封膜 4 離型層 20 轉印構件 黏著劑層 3a 無機密封膜的表面 10、10a黏著帶 接著層 321600 20Brief Description of the IT Drawings Fig. 1 is a cross-sectional view showing a dotted tape relating to one of the present inventions. Fig. 2(a) to (e) are schematic diagrams showing a transfer method of the function m in the first tape. [The main component symbol description J is attached to the functional film shown in the functional film diagram. 1 base film 3 inorganic sealing film 4 release layer 20 transfer member adhesive layer 3a inorganic sealing film surface 10, 10a adhesive tape subsequent layer 321600 20