201100202 A. 六、發明說明： 【發明所屬之技術領域】 且偌有關於一種保持墊’特別是有關於-種 =樹脂製的薄片材料’可用以保持被研磨物用的 【先前技術】 目前，透鏡、平行平面板、反射鏡等光學材料、 Ο ^者切晶®、硬碟絲板或液晶顯示n用玻璃基板 等材料中’由於要求須具有高精度的平坦性，所以需 使用研磨墊進行研磨加工。於進行研磨加工時，通常 使用的有可同時對被研磨物雙面進行研磨加工的雙 面研磨機，或者是分別對被研磨物其中一面、另一面 進行研磨加工的單面研磨機等。其中，雙面研磨機主 要是於表面平坦的上下平台分別貼附的研磨墊上，邊 供給包含可與被研磨物雙面抵接的研磨粒子等的研 ❹ 磨液，邊進行研磨加工。另一方面，單面研磨機則是 ，被研磨物的一面配置於保持平台的保持墊上保持 著，再將被研磨物的另一面藉由貼附於研磨平台上的 研磨墊，邊供給研磨液，邊進行研磨加工。於i行此 種研磨加工時，會有因保持墊而可保持的被研磨物， 於研磨加工進行中產生移動，進而損及加工表面的平 坦性的情況發生。為防止被研磨物的移動，通常會於 模板中置入被研磨物後’再進行研磨加工。 被研磨物，特別就液晶顯示器用玻璃基板而言， 伴隨著液晶顯示器之大型化，玻璃基板亦具有大型化 3 201100202 的傾向。例如，為了對厚度lmm、外圍尺寸丨5mxUm 的玻璃基板進行研磨加工時，由於難以將大型化玻璃 土板等被研磨物置入模板中，所以一種可無需使用模 板亦冑b文定保持被研磨物、具高平坦性及大型的保 持墊實為所需。此外，就矽晶圓而言，以提高研磨加 工效率為目的，且可同時對複數個材料進行研磨加工 的技術也正進行研究發展中。此種情況下，亦需將研 磨加工所使用的保持墊予以大型化。例如，已開發有 邊長為超過20〇〇mm的矩形或直徑超過2〇〇〇mm圓形 的大型化保持塾。 般來說，通常是使用具有基材的雙面膠帶將保 持墊配置於保持平台上。但是，當藉由單牧的雙面膠 f將保^墊黏貼於保持平台時，會在保持墊與保持平 口門因乙入空軋產生氣泡或是形成皺紋等問題存 在。此外，保持墊是需要被黏貼在保持平台的正確位 ^由於無法重新黏貼，因此黏貼作業的困難度極 门另外為因應保持墊的大型化，邊長或直徑是超 $ 〇〇m範圍的單枚的大型雙面膠帶是需要的，但 當：用上述大型的雙面膠帶來將保持墊黏貼於保持 ，台時會令黏貼作業的困難度更為增高。由上述 可知目則，仍是採用將複數枚雙面膠帶並列貼合， 藉由依序貼合各枚雙面膠帶，以因應保持墊的大型 另 ^ 面，保持墊中具備有保持被研磨物用的樹 曰=片材料。此樹脂製薄片材料，是藉由將聚胺 -曰’ θ命解於水混和性的有機溶媒後形成的樹脂溶 201100202201100202 A. VI. Description of the invention: [Technical field to which the invention pertains] There is a prior art relating to a holding pad, in particular, a sheet material made of a resin type to retain an object to be polished. In the case of optical materials such as lenses, parallel plane plates, and mirrors, etc., in materials such as glass-cutting substrates, hard disk boards, or liquid crystal display n, it is required to have high-precision flatness, so it is necessary to use a polishing pad. Grinding processing. In the polishing process, a double-side grinder which can simultaneously grind both sides of the object to be polished, or a single-side grinder which polishes one surface and the other side of the object to be polished is usually used. Among them, the double-side grinding machine mainly performs polishing processing while supplying a polishing slurry containing abrasive particles or the like which can be abutted on both sides of the object to be polished, on a polishing pad to which the upper and lower surfaces of the surface are attached. On the other hand, in the single-side grinding machine, the one surface of the object to be polished is placed on the holding mat of the holding platform, and the other side of the object to be polished is supplied to the polishing liquid by the polishing pad attached to the polishing table. , while grinding. When such a polishing process is performed, there is a case where the object to be polished which can be held by the holding pad is moved during the polishing process, and the flatness of the machined surface is damaged. In order to prevent the movement of the object to be polished, it is usually carried out after the object to be polished is placed in the template. In particular, in the case of a glass substrate for a liquid crystal display, the glass substrate has a tendency to increase in size by 3201100202. For example, in order to polish a glass substrate having a thickness of 1 mm and a peripheral size of m5 mxUm, it is difficult to place an object to be polished such as a large-scale glass plate in a template, so that it is possible to maintain the object to be polished without using a template. High flatness and large retaining pads are needed. In addition, in the case of wafers, the technology for improving the processing efficiency of the polishing, and the simultaneous grinding of a plurality of materials is also under development. In this case, it is also necessary to increase the size of the holding mat used in the grinding process. For example, a large-sized retaining crucible having a side length of more than 20 mm or a circular shape having a diameter of more than 2 mm has been developed. In general, it is common to use a double-sided tape with a substrate to place the retention pad on the retention platform. However, when the double-sided adhesive tape of the single animal husbandry is used to adhere the protective pad to the holding platform, problems such as bubbles or wrinkles may occur in the holding pad and the holding flat door due to the in-air rolling. In addition, the retaining pad is required to be adhered to the correct position of the holding platform. ^Because it cannot be re-adhered, the difficulty of the bonding operation is also in addition to the large size of the pad, and the length or diameter is a range exceeding the range of $ 〇〇m. A large double-sided tape is required, but when the large-sized double-sided tape is used to adhere the holding pad to the holding, the difficulty of the bonding operation is further increased. In view of the above, it is still possible to use a plurality of double-sided tapes in parallel, and to bond the double-sided tapes in order to maintain the large size of the mat, and to hold the mat with the object to be polished. Tree 曰 = sheet material. This resin sheet material is a resin solution formed by dissolving polyamine-曰' θ in a water-miscible organic solvent. 201100202
Ο 液’之後’ S將此樹脂溶液塗布在薄片狀的成膜基 材，於水系凝固液中使樹脂凝固再生（濕式成膜法） 所製成戶斤製成的薄片材料的表面上形成具有緻密的 微夕孔，厚度約略數以m程度的表面層（Skin Layer， 表層,)。由於緻密地形成了微多孔，所以表層的表面 具有微觀的平坦性。由於此表層與被研磨物間的接觸 優良所以可用以保持被研磨物。亦即，表層的表 面成f保持被研磨物用的保持面。然而，就濕式成膜 法:。’因樹脂溶液具有黏性’所以對成膜基材進行 塗時，會發生厚度不均的同時；於凝固再生時，則 會因為有機溶媒與水系凝固液的置換，而容易發生厚 度不均。a此’薄諸料本身的表面微觀的平坦性會 無法維持（成為大波浪型表面）。因此，可維持表層 2觀的平坦性之狀態’並減少厚度不均以提高微觀 、^旦性是極為重要。為了可維持表層的狀態，並減 -θ度不肖’舉例來說，有如日本專利公開第 2006:2059號公報所揭示的一種對薄片材料的保持 面的背面施以拋光處理的技術。 然而，就日本專利公開第2〇〇6_62059號公報所 揭=術而言’透過對薄片材料的保持面的背面進 =處理，雖可於維持表層的狀態下，製成厚度約 ==1#片！料’但是卻未提及任何針對保持 、因應手段。目前，就有關因應保持墊的大 的技，手段而言，為了使保持墊能易黏貼 二;二口上’疋採用將具有基材的複數個雙面膠帶 列貼-的手段。於此種情形中，有可能在搬運時， 5 201100202 ί個具有基材的雙面膠帶的間斷處部分產生f折現 ^ ’因而在薄片材料上造成裂痕、損傷等問題。此外， 2行配置至料平台時’射能會使薄片材料延伸 =雙面膠帶的間斷處部分，因而在薄片材料的兩表面 2形成皺紋、塌陷等凹凸不平的現象。當使用具有 乂凹凸不平狀態的保持墊來進行研磨加工時，由於 會將薄片材料的高低差轉印至被研磨物上，因而產生 條紋等，所以被研磨物的表面會變得難以平坦化。 【發明内容】 β有鑒於上述習知問題，本發明之其中一目的就是 f &供種保持墊，特別是就算大型化，仍可確保其 平坦性並可全面配置於保持平台上的一種保持墊。 *為解决上述課題，本發明的保持墊包含，樹脂製 的薄片材料、第1黏著層、第2黏著層以及樹脂基材。 其中，樹脂製的薄片材料，具有用以保持被研磨物的 保持=。第丨黏著層，具有用以與前述薄片材料保持 面的月面貼合的一面，且配置有相鄰接之具黏著性的 複，個第1黏著部材。第2黏著層，具有用以配置在 平台上的一面’且配置有相鄰接之具黏著性的複數個 第2黏著部材。樹脂基材，設置於前述第1黏著層與 第2黏著層間，且樹脂基材的一面是與前述第丨黏著 層的另一面貼合’而樹脂基材的另一面則是與前述第 2黏著層的另一面貼合。前述樹脂基材的前述一面及 另一面分別為連續表面。 在本發明中’第1黏著層由複數個第1黏著部材 201100202 複數個第2黏著部材構成，藉 同時，平台上的 9在第1黏者層與第2黏著声問，一 面及另一面分別為連續表二叹有一 因而可達到發揮立禮曰基材’此樹脂基材 在搬送時或;是配置=全::=，免 持面=成Γ文等問，，故能確保保持面的平=保 ❹ Ο 未且右其# /黏著部材及第2黏著部材亦可為僅以 下：簡稱為無支撐膠帶。）。此時，黏膠帶二 丙稀㈣、聚氨基甲酸料及環氧系 =為黏著劑。第2黏著層的一面較佳j= 2黏者柯的表面，覆蓋有可各自剝離的離型膜的 J互為士5之保持墊亦可應用在，薄片材料及樹脂基 t為相同的形狀，且對向方向的邊長是鳩脑以 、矩，或直徑為2000mm以上的圓形時。保持塾的 第黏著層、樹脂基材及第2黏著層可以是預先進行 =者。此外’複數個第2黏著部材的邊界部分彼此 與複數個f1㈣部材的邊界部分彼此 脂基材，而配置在與厚度方向相交的方向上了= 的位置上。此時，複數個第i黏著部材的邊界部分及 複數個第2黏著部材的邊界部分所形成的間隙，可皆 設定成2mm以下者較佳。構成第2黏著部材的黏著 劑可作成具有比構成第1黏著部材的黏著劑還大的 接著力。此外，薄片材料可以是以濕式成膜法形成的 聚氨基曱酸酯樹脂製薄片。 7 201100202 +根據本發明，藉由以複數個第1黏著部材構成第 1黏著層γ以複數個第2黏著部材構成第2黏著層， 因此即便薄片材料大型化，亦可全面配置於平台’同 時藉由在第1黏著層與第2黏著層間，設置有一面及 另一面分別為連續表面的樹脂基材，進而樹脂基材可 發揮支撐薄片材料全面的機能，而避免在搬送時或配 平σ夺發生彎折或在保持面上形成皺紋等問 題，故能確保保持面的平坦性。 【實施例】 以下，請參閱圖式，對適用本發明實 墊進行說明。 讨 伴梏保持塾之結構，如第1圖所示，本實施例之 中、寺f 具備有氨基甲酸s旨薄片2及安裝片7。其 作為略平坦的保持面？的氨基甲酸醋薄片； 2阶罟仿；。安裝片7則用以將聚氨基甲酸酯薄片 2配置於研磨機的保持平台上。 寻乃 甲酸醋薄片2乃是使用1〇〇_ (拉伸 成2倍長度時的應力）為繼Pa =成膜法所形成。於聚氨基甲酸酯薄：：曰持 ::::(:反面)上，使聚_醋薄= 的，進L Λ所示之縱向長度）成為大致相同為目 進仃抛光處理。聚氨基甲酸酯薄片2在 8的、有形成有緻密的微多孔（未圖示）的表層8。、表層 氨美甲微觀的平坦性。在靠表層8的内側（聚 風基甲酸㈣片2的内部），沿著聚氨基甲酸酿= 201100202 mi二向上’略均等地形成比表層8的微多孔具 大μ Γ且帶有圓形輪廊的剖面三角狀的大氣孔3。 P :相/5係开7成為具有於保持面P上的大小較保持面 小的孔徑。在大氣孔3彼此間的聚胺醋 曰〃成有比表層8的微多孔更大但比大氣孔3 =孔㈣小氣孔（未圖示）。表層8的微多==氣3 及小乳孔係藉連通孔繫接成網目狀。亦即，聚 Ο Ο 2具有連續狀的蜂巢構造。因於保持面 ^的相反面上，進行拋光處理，大氣孔3及小氣孔（未 孔^之部分係在保持面p的相反面的表面具有開 2貼人。疋與聚氨基甲酸酿薄片 2貼口黏者片6則用以作為第2黏著層， !==寺平台。於黏著^與黏著“間： :置=:基材5。樹脂基材5的一面與 Γ=’而樹脂基材5的另一面則與黏著“之 4另2(一第面Γ^°㈣片4収將2個無讀膠帶41、 (第黏者梢）財邊界D1轉的方式 著片6則是以2個無支撐膠帶6卜62 (第2黏者精）以在邊界的方式 ,界m及邊界D2係橫物旨基材5配：在 與厚度方向相交的方向上，相對應 f 二係酉:置成自保持面P觀察時，邊界Di及邊上 方式。無支撐膠帶41、42間所形成的 間隙（邊界D1的寬度）及無支揮膠帶61、62 = 9 201100202 形成的間隙（邊界D2的寬度）設定在2mm以内。無 支揮膠帶6卜62的一面分別覆蓋有離型膜61a、62a。 構成黏著片4的無支撐膠帶41，係為僅以黏著 贩成薄片狀之未具有基材的膠帶（無支撐型黏著 。無支撐膠帶42係與無支撐膠帶41以相同結 ^:形成。無支撐膠帶41、42任一者，皆可使用同 、丙烯酸系黏著劑。此外，無支撐膠帶41、42形 =具相同厚度及寬度，且於同—面上形成。黏著片4 人面是與聚氧基甲酸g旨薄片2的保持面？的背面貼 二’而黏著片4的另—面則是與樹脂基材5的一面貼 合0 構成黏著片6❾無支揮膠冑6卜係與無支標膠 材的朦1樣’為僅以黏著騎形成薄#狀之未具有基 “ 無支撐膠帶61的一面亦即用以配置在平 、面係覆蓋有離型膜61a，用以在保管保持墊 及在搬达保持墊ι〇時，保護無支撐膠帶61。 構支二膠帶62,係與無支撐膠帶61形成相同的結 :支:二气支撐膠帶62的一面覆蓋有離型膜仏。 黏著；’黏-1、62任一者，皆可使用同質的橡膠系 者片6係發揮將保持墊10固定於平台上 m击/研磨所引起的負荷較大，故使用比黏著 二4 :吏用的丙埽酸系黏著劑’具有更強接著力的橡 無支獅帶61、62係形成具相 Si二在同一面上形成。黏著片6的-面是分別 膜61“〜而黏著片6的另-面則是與 树月曰基材5的另一面貼合。離型膜61a、62a的邊界 201100202 部分與無支㈣帶61、62的邊界部分係配置在與厚 度方向相交的方向上，相對應的位置上。 、After the sputum 'after', the resin solution is applied to the flaky film-forming substrate, and the resin is solidified and regenerated in the aqueous coagulating liquid (wet film formation method). A skin layer having a dense micro-cavity and a thickness of about a few m (Skin Layer). Since the micropores are densely formed, the surface of the surface layer has microscopic flatness. Since the contact between the surface layer and the object to be polished is excellent, it can be used to hold the object to be polished. That is, the surface of the surface layer is f to maintain the holding surface for the object to be polished. However, the wet film formation method: When the film-forming substrate is coated with the viscosity of the resin solution, thickness unevenness occurs. When the film is solidified and regenerated, the thickness of the organic solvent and the aqueous coagulating liquid is likely to be uneven. The microscopic flatness of the surface of the thin material itself cannot be maintained (becomes a large wavy surface). Therefore, it is extremely important to maintain the state of the flatness of the surface layer 2 and to reduce the thickness unevenness to improve the microscopic properties. In order to maintain the state of the surface layer, and to reduce the θ degree, for example, a technique of applying a polishing treatment to the back surface of the holding surface of the sheet material as disclosed in Japanese Laid-Open Patent Publication No. 2006:2059 is exemplified. However, in the case of the back surface of the holding surface of the sheet material, it is possible to form a thickness of about ==# in the state of maintaining the surface layer, as disclosed in Japanese Patent Laid-Open No. Hei. No. 6-62059. sheet! However, there is no mention of any means of maintaining and responding. At present, in terms of the large techniques and means for maintaining the mat, in order to make the holding mat easy to stick two; the second one is used to attach a plurality of double-sided tapes having a substrate. In this case, it is possible that at the time of handling, the portion of the discontinuous portion of the double-sided tape having the substrate is f-folded, thereby causing problems such as cracks, damage, and the like on the sheet material. Further, when two rows are arranged to the material stage, the ejection energy causes the sheet material to extend = the discontinuous portion of the double-sided tape, so that wrinkles, collapses, and the like are formed on both surfaces 2 of the sheet material. When the polishing process is performed using a holding mat having a ruthenium unevenness state, since the difference in height of the sheet material is transferred to the object to be polished, streaks or the like are generated, so that the surface of the object to be polished becomes difficult to planarize. SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, one of the objects of the present invention is to provide a retaining pad for the f&, in particular, even if it is large, it can ensure its flatness and can be fully disposed on the holding platform. pad. In order to solve the above problems, the holding mat of the present invention comprises a resin sheet material, a first adhesive layer, a second adhesive layer, and a resin substrate. Among them, a resin sheet material has a hold to keep the object to be polished. The first adhesive layer has a side for bonding to the moon surface of the sheet material holding surface, and is provided with a plurality of first adhesive members adjacent to each other. The second adhesive layer has a side surface disposed on the platform and is provided with a plurality of second adhesive members which are adhesively adjacent to each other. The resin substrate is disposed between the first adhesive layer and the second adhesive layer, and one surface of the resin substrate is bonded to the other surface of the second adhesive layer, and the other surface of the resin substrate is bonded to the second adhesive layer. The other side of the layer fits. The one surface and the other surface of the resin substrate are continuous surfaces. In the present invention, the first adhesive layer is composed of a plurality of first adhesive members 201100202 and a plurality of second adhesive members, and at the same time, 9 on the platform is in the first adhesive layer and the second adhesive sound, and the other side is respectively For the continuous table two sighs, it is possible to achieve the performance of the base material 'this resin substrate when transporting or; is the configuration = full::=, free-holding surface = Cheng Yuwen, etc., so it can ensure the maintenance of the surface平=保❹ Ο 不和右其# / Adhesive parts and 2nd adhesive parts can also be only the following: simply referred to as unsupported tape. ). At this time, the adhesive tape dipropylene (tetra), polyurethane and epoxy are adhesives. One side of the second adhesive layer is preferably j=2, and the surface of the second adhesive layer, which is covered with a release film which can be peeled off separately, can also be applied to the same shape of the sheet material and the resin base t. And the side length in the opposite direction is a camphor, a moment, or a circle having a diameter of 2000 mm or more. The first adhesive layer, the resin substrate, and the second adhesive layer that hold the crucible may be previously performed. Further, the boundary portions of the plurality of second adhesive members and the boundary portions of the plurality of f1 (four) members are mutually bonded to each other, and are disposed at a position where the direction intersecting the thickness direction is =. In this case, it is preferable that the gap formed by the boundary portion of the plurality of i-th adhesive members and the boundary portion of the plurality of second adhesive members can be set to 2 mm or less. The adhesive constituting the second adhesive member can be made to have a larger pressing force than the adhesive constituting the first adhesive member. Further, the sheet material may be a sheet of a polyaminophthalate resin formed by a wet film formation method. According to the present invention, the first adhesive layer γ is formed of a plurality of first adhesive members, and the second adhesive layer is formed of a plurality of second adhesive members. Therefore, even if the sheet material is increased in size, it can be disposed on the platform at the same time. By providing a resin substrate having a continuous surface on one surface and the other surface between the first adhesive layer and the second adhesive layer, the resin substrate can exhibit a comprehensive function of supporting the sheet material, thereby avoiding the transfer or the balance. There is a problem such as bending or wrinkles on the holding surface, so that the flatness of the holding surface can be ensured. [Embodiment] Hereinafter, a mat for applying the present invention will be described with reference to the drawings. As shown in Fig. 1, in the present embodiment, the temple f is provided with a urethane sheet 2 and a mounting sheet 7. Is it a slightly flat retaining surface? Carbamate vinegar flakes; 2nd order imitation; The mounting sheet 7 is used to arrange the polyurethane sheet 2 on the holding platform of the grinder. The formic acid sheet 2 is formed by using 1 〇〇 (the stress when stretched to 2 times the length) for the Pa = film formation method. In the thinness of the polyurethane::::::: (the reverse side), the poly- vinegar thin =, the longitudinal length shown in the L Λ is made substantially the same as the polishing process. The polyurethane sheet 2 has a surface layer 8 having a dense microporous (not shown) formed therein. , surface layer of ammonia nail microscopic flatness. On the inner side of the surface layer 8 (inside of the poly (a) film 2), along the polyurethane [=201200202 mi two upwards] slightly equal to the microporous layer of the surface layer 8 is formed with a round wheel The triangular section of the gallery has a triangular atmospheric hole. P: The phase /5 system opening 7 has an aperture having a smaller size than the holding surface on the holding surface P. The polyamine vinegar between the atmospheric pores 3 is larger than the microporosity of the surface layer 8 but smaller than the atmospheric pores 3 = pores (four) (not shown). The micro-manifold of the surface layer 8 == gas 3 and the small milk hole system are connected to each other by a communication hole. That is, the polyfluorene Ο 2 has a continuous honeycomb structure. Since the polishing process is performed on the opposite surface of the holding surface, the atmospheric pores 3 and the small pores (the portions of the non-pores are attached to the surface opposite to the holding surface p.) The crucible and the polyurethane crucible 2 The adhesive sheet 6 is used as the second adhesive layer, !== temple platform. In the adhesion and adhesion "between: : set =: substrate 5. one side of the resin substrate 5 and Γ = ' and the resin base The other side of the material 5 is adhered to the "four other 2 (a first surface Γ ^ ° (four) sheet 4, two non-reading tapes 41, (the sticky tip) financial boundary D1 is turned, the film 6 is Two unsupported tapes 6b 62 (Second-adhesive) are arranged in the boundary, boundary m and boundary D2 are the same as the substrate 5: in the direction intersecting the thickness direction, corresponding to the f-system : When viewed from the holding surface P, the boundary Di and the side-by-side method. The gap formed between the unsupported tapes 41 and 42 (the width of the boundary D1) and the gap formed by the no-slipping tape 61, 62 = 9 201100202 (boundary) The width of D2 is set to be less than 2 mm. The one side of the non-woven tape 6 is covered with release films 61a and 62a, respectively. The unsupported tape 41 constituting the adhesive sheet 4 is only viscous. A sheet-like tape having no substrate (unsupported type of adhesion. The unsupported tape 42 is formed by the same connection as the unsupported tape 41. Any of the unsupported tapes 41 and 42 can be used with the same acrylic. In addition, the unsupported tapes 41 and 42 have the same thickness and width and are formed on the same surface. The adhesive sheet 4 is a surface of the back surface of the sheet 2 with the polyoxybenzoic acid sheet 2 The other side of the adhesive sheet 4 is bonded to one side of the resin substrate 5 to form an adhesive sheet 6 ❾ 支 挥 挥 胄 卜 卜 卜 卜 卜 卜 与 与 为 为 为 为 为 为 为 为 为 为 为 为 为Forming a thin #-like shape without a base "The one side of the unsupported tape 61 is disposed on the flat surface, and the surface is covered with the release film 61a for protecting the holding mat and moving the holding mat. Supporting tape 61. The two-tape 62 is formed to form the same knot as the unsupported tape 61: one side of the two-gas support tape 62 is covered with a release film 仏. Adhesive; 'Adhesive-1, 62, all It is possible to use a homogenous rubber-based sheet 6 to exert a negative effect caused by the m-hook/grinding of the holding mat 10 on the platform. The load is large, so the use of the adhesive bond 2: 埽 埽 埽 系 ' 具有 具有 具有 具有 具有 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 The face-to-face is the film 61 "~ and the other face of the adhesive sheet 6 is bonded to the other side of the tree-shaped base material 5. The boundary 201100202 of the release film 61a, 62a is partially and unsupported (four) with the 61, 62 The boundary portion is disposed in a direction intersecting the thickness direction at a corresponding position.
樹脂基材5可為聚對苯二曱酸乙二酯（以 稱為PET。）製的基材。樹脂基材5係^置於黏 ::黏著片6間。亦即’樹脂基材5的一面與黏著片 人的另一面貼合’而另一面與黏著片6的另一面貼 口。樹脂基材5係由具有與聚氨基曱酸醋薄片2相同 大J、的1枚薄片所形成，其一面及另一面分別是連續 =略平坦面。亦即，樹脂基材5是與聚氨基甲酸醋薄 片2具有相同的形狀。因此，樹脂基材$ 甲酸醋薄片2全面進行支撐。 …基 保持塾10之製造方法係藉由分別製作聚氨基甲 :::薄：2及安裝片7並使其貼合來加以製造。將依 …、“基甲酸酯薄片2的製作、安裝片7的製作、及 貼合的順序進行詳細說明如下。 關於聚氨基甲酸酯薄片2的製作，製作聚氨基甲 酸醋薄片2係包含下列步驟： 調製樹脂溶液的準備步驟； 將樹脂溶液於成膜基材上連續地塗布，於水系凝 :液中’使聚胺醋樹脂凝固再生成薄膜狀的凝固再生 將凝固再生的聚胺酯樹脂加以洗淨，並 以獲得聚氨基甲酸2的洗淨/賴㈣以及、 使乾燥後的聚氨基甲酸酯薄片2之保持面P的相 面厚度可均-化’而進雜光處理的平滑化處理步 11 201100202 於上述準備步驟中，係混合聚胺酯樹脂、可溶解 聚胺酯樹脂之水混和性的有機溶媒之N，N-二甲美甲 醯胺（以下，簡稱為DMF。）及添加劑等，以^聚 胺酯樹脂溶解。聚胺酯樹脂是自1〇〇%模量為2〇Μρ& 以下的聚酯系、聚醚系、聚碳酸酯系等樹脂中選擇其 中一種來使用，例如，以聚胺酯樹脂成為約3〇%程 度地於DMF中進行溶解。可使用控制大氣孔3的大 小、量（個數）用的碳黑等顏料、促進發泡的親水性 活性劑及使聚胺酯樹脂之凝固再生穩定的疏水性活 性劑等來作為添加劑。所取得的溶液則於減壓狀態下 進行脱泡’以調製樹脂溶液。 在上述凝固再生步驟中，係將在準備步驟所調製 出的樹脂溶液，連續地塗布於成膜基材上，於水系凝 固液中使聚胺酯樹脂凝固再生成薄膜狀，脂溶液是 藉由塗布裝置，在常溫下帶狀的成膜基材上略均一地 進行塗布。㈣裝置在本财是㈣刀式塗布機。此 時’可透過調整刀式塗布機與成膜基材間的間隙 (clearance)，來調整樹脂溶液之塗布厚度（塗布 量）。成膜基材可使用可撓性薄膜、不織布、織布等 來加以實施。本實施例中是採用pE 膜基材。 塗布於成膜基材上的樹脂溶液，經浸泡在對聚胺 6旨樹脂而言為不良溶媒的以水為主要成分的凝 中後’於此凝固液中，以，在被塗布有樹脂溶液之 表面上’形成有構成表層8的微多孔，此微多孔是橫 跨厚度數//m程度的。接著，藉由進行樹脂溶液中的 12 201100202 DMF與凝固液之置換，而使聚胺酯樹脂在成膜基材 的單面上，凝固再生為薄膜狀。DMF自樹脂溶液去 溶媒化，使DMF與凝固液進行置換，藉此而在靠表 層8内侧的聚胺酯樹脂中形成大氣孔3及小氣孔，並 且形成可使大氣孔3及小氣孔連通成網目狀的連通 孔。此時，由於成膜基材的PET製薄膜未被水浸透， 故在樹脂溶液的表面（表層8側）可進行去溶媒化， 於成膜基材侧上，則形成比表面還大的大氣孔3。 〇 在洗淨/乾燥步驟中，是將已凝固再生的帶狀（長 條狀）的聚胺酯樹脂洗淨後使之乾燥。亦即，聚胺酯 樹脂係自成膜基材剝離，並在水等之洗淨液中加以洗 淨’以除去殘留在聚胺酯樹脂中的DMF。洗淨後， 再以乾燥機等使聚胺酯樹脂乾燥。於本實施例中，乾 燥機，是以使用具有内含熱源圓筒的圓筒乾燥機。透 過使聚胺酯樹脂沿著圓筒的圓周面通過而乾燥。在平 滑化處理步驟中，為了使乾燥後的聚胺酯樹脂之厚度 ❹ 均，即對表層8的相反面進行拋光處理。於本實施 例中，平滑化處理後，將聚胺酯樹脂切割成寬度 2000mm，再以輥捲取，即可獲得聚氨基甲酸酯薄片 2 ° =安U 7的製作而言，，分別準備構成黏 者片❺黏耆膠帶41、42、構成黏著片6的黏著膠 =61、62以及樹脂基材5。使用貼膜機（詳細說明 你樹脂基材5上貼合黏著片6及黏著片4以進 订製作。 黏著片4的無支揮勝帶41、42及黏著片6的無 13 201100202 支撐膠帶61、62任一者皆設定成帶寬1〇〇〇醜、厚 度55/zm。無支撐膠帶41、42是採用黏著劑的兩表 面是分別覆蓋有離型膜者。無支撐膠帶61、62則是 採用配置於保持平台用的一面覆蓋有離型膜6ia、 62a而另一面則覆蓋其他離型膜者。樹脂基材5是 設定成寬度2000mm、厚度75//m。亦即，樹脂基材 5是採β用與聚氨基甲酸醋薄片2相同寬度者。樹脂基 材5是一面與另一面皆是連續平坦面的ρΕτ基材。 離型膜可使用PET製樹脂薄片或紙等。此外，為使r 離型膜可谷易剝離，更可執行離型處理。 如第2圖所示，貼膜機90具備有2個膠帶供給 輥95及1對加壓輥93。2個膠帶供給輥％用以分別 供給2個無支撐膠帶。丨對的加壓輥％則用以於樹 月曰基材5上，將無支撐膠帶加壓後黏貼。亦即，貼膜 機90係為2個無支撐膠帶分別使用2個膠帶供給輥 95進行供給的雙軸貼膜機。輥95是以可並列2個無 支撐膠帶進行供給的方式，配置於加壓輥93的上 方。在膠帶供給輥95的上游側，配置有回收無支撐 膠帶之離型膜用的輥91。於膠帶供給輥95與加壓輥 93間，則配置有可兼用作為控制膠帶的張力作用的 搬送輥96。在加壓輥93的上游側，配置有用以供給 樹脂基材5的基材供給輥％作為供給側。於基材供 給輥92與加壓輥93間，配置有搬送輥97。在加壓 輥93的下游侧，配置有用以捲取黏貼有無支撐膠帶 之樹脂基材5的輥94。於加壓輥93與輥94間，配 置有搬送輥98。 14 201100202 於貼膜機90中，自膠帶供給輥％取出的無支撐 >帶61 62疋透過搬送輥96進行搬送。無支撐膠帶 61、62的另一面之離型膜則被剝離，所剝離下來 離型膜則藉由親91捲取成捲轴狀。另-面之離型膜 被剝離的無支樓膠帶61、62則是在加壓親％侧進行 送另方面，樹脂基材5是自基材供給輥％搬 送至加壓輥93側’樹脂基材5的另一面會與無支撐 膠：6卜62的另一面接觸。無支撐膠帶“、J及樹 〇 月旨f材5是藉由通過加壓輥93的間隙，因而加壓， 使仵樹脂基材5的另一面與無支撐膠帶61、62的另 「面黏貼。黏貼有無支撐膠帶6卜62的樹脂基材5 透過搬运輥98搬送，而被輥94捲取。為使無支撐膠 帶61、62之間所形成的間隙（邊界D2的&度）能 介於2mm以内，可使用紅外線雷射來控制無支撐^ 帶61 62的位置。可以上述相同方式，將無支撑膠 帶41、42黏貼在樹脂基材5的一面，來製作安裝片 〇 7。此時，將無支撐膠帶41、42的邊界叫，橫跨樹 脂基材5與無支撐膠帶61、62的邊界D2，黏貼成配 置在與厚度方向相交方向上，相對應的位置上。 關於貼合，使用具備一對加壓輥的貼膜機，將所 製作的聚氨基甲酸酯薄片2與安裝片7貼合。亦即， 聚氨基甲酸酯薄片2和安裝片7係分別以朝加壓輥的 方向進行供給。此時安裝片7的離型膜會被剝離。透 過通過加壓輥間的間隙，對聚氨基甲酸酯薄片2和安 裝片7進行加壓並使之貼合。黏貼有安裝片7的聚氨 基曱酸S旨薄片2被捲取成捲軸狀。之後，切割成長产 15 201100202 2000mm，再進行確認是否附著有髒污或異物等的檢 查，即可完成長度2000mm、寬度2〇〇〇mm的大 持墊10。 當將保持墊10配置於保持平台時，是將離型膜 61a、62a除去後，以露出的無支撐膠帶61、62將保 持墊10黏貼於保持平台上。此時，由於是在依序除 去的2枚離型膜61a、62a後，將無支撐膠帶61、以 一次一牧依序黏貼的方式下，因此可在未發生偏位、 吃入空氣的清況下，正確地黏貼在平台上。且可於進 行研磨加工時，邊供給含有研磨粒子的研磨液 (slurry)，邊研磨所保持的被研磨物。 其次，就本實施例之保持墊1〇的作用效果而 言，以安裝片7的作用為中心，進行說明如下。 於本實施例之保持墊10中，黏著片4是由2個 無支撐膠帶41、42所構成，黏著片6則是由2個益 支撐膠帶6卜62所構成。因此，即使保持塾1〇大型 化，將聚氨基甲酸酯薄片2和安裝片7貼合時，還是 可抑制鈹紋等的發生。此外，藉由將構成黏著片6的 個無支撐膠帶61、62依序㈣於料平台上，則 可達到在未發生偏位之下，正確地黏貼於保持平台上 的效果。 此外，於本實施例之保持墊10中，於黏著片4 ?黏著片6間’設置有樹脂基材5。由於樹脂基材5 =和聚氨基曱酸S旨薄片2相同大小且—面及另一面 1是連續的略平坦面，故樹脂基材5可發揮支擇聚 風土甲酸醋薄片2全面的功能。因此’在保持墊10 201100202 搬$時、保持塾10配置至平台時，可抑制聚氨基曱 酸，薄片2之保持面p形成皺紋等。藉此，保持面p 的平坦性可受到確保，故能將被研磨物平坦地保持， 可圖謀提向研磨物之平坦性。 再者’於本實施例之保持墊丨〇中，於黏著片4 與黏著片6間，設置有一面及另一面是分別連續之屬 坦面的樹脂基材5。，亦即，樹脂基材5是相對於 t氨基甲酉“曰薄片2具有相同的开)狀。由於樹脂基材 5可支撐具彈性之柔軟的聚氛基甲酸醋薄片2，故可 避免在搬送時或配置至保持平台時的彎折等問題。此 外’即使將保持塾10大型化，，亦可容易進行對保持 平台的黏貼作業或交換保持墊10時的剝離作業。 更甚者，於本實施例之保持墊〗0中，構成黏著 片6的無支撐膠帶61、62之邊界部分D2係盘構成 黏著片4的無支撐膠帶4卜42之邊界部分D卜橫跨 樹脂基材5,而配置在與厚度方向相交的方向上，、相 0 冑應的位置上。換言之，無支撐膠帶41、42及無支 撐膠帶6卜62皆設定成相同寬度和長度。因此:’、 製作安裝片7時，黏著片4及黏著片6分別可使用相 同寬度的無支撐膠帶，可容易地進行部品管理。 且，本發明所使用之無支撐膠帶僅以黏著劑形 =並未具有基材。因此當使用傳統具有基材的雙面 膠帶之情況下，於聚氨基甲酸酯薄片2的保持面上， 沿著雙面穋帶的邊界形成有凹部，此乃是因為雙面腰 帶的基材比起聚氨基f酸g旨薄片2、黏著劑具 : 的剛性，且因為基材部分的厚度增加，擴大了邊界^ 17 201100202 雙面膠帶之剛性差、高低差，並因而被轉印在聚氨基 $酸酯薄片2。本發明則藉由使用無支撐膠帶，而可 減低邊界與雙面膠帶之剛性差、高低差，可使保持塾 10的保持面之平坦性提高。 再者，於本實施例之保持墊10中，邊界D1及 邊界D2的寬度，亦即，於鄰接的無支撐膠帶41、42 間形成的間隙，以及於鄰接的無支撐膠帶61、62間 形成的間隙係設定成2mm以下。邊界D1及邊界D2 的寬，超過2mm時，會在與保持墊1〇的保持面p上 產生尚低差，變得難以將被研磨物平坦地保持。藉由 將邊界D1及邊界D2的寬度設定成2mm以内，可減 低因無支撐膠帶狀高低差對歸面p之影響，而能 將被研磨物平坦地保持。若考慮到藉縮小邊界〇1及 邊界D2的寬度可保持被研磨物之平坦性，則更佳為 將邊界D1及邊界D2的寬度設定於lmm以内。 又，於本實施例的保持墊1〇中，雖僅例示於樹 脂基材5上貼合黏著片4, 6以作為安裝片7，但並 未受限於此。例如，除了黏著片4、6外，亦可再疊 層更多的黏著片’除了樹脂基材5以外亦可再疊層其 他的樹脂基材。在此種場合下，雖可期待提高支撐^ 氨基曱酸酯薄片2之效果，但亦有可能因安裝片7在 保持墊10整體所占的比例變大，而造成研^加工上 的阻礙。當顧慮到此點時，則以黏著片4、6及樹脂 基材5所構成之3層構造來作為安裝片7者較佳。曰 此外，於本實施例之保持墊1〇中，雖僅例示構 成黏著片4的黏著部材是使用2個無支撐膠帶4ι、 18 201100202 的黏著部材是使用2個無支樓膠帶 一並未文限於此。例如，黏著片4及黏著片 6成34偏上的無支㈣帶所構成。換言之，構 成黏者片4’6的無支揮膠帶的數量 基甲賴片2(樹脂基材5亦相同。）的 定。此外，分別構成黏著 Ο ο ”，、支撐膠f的數量，亦可依黏著 的大小而有所不同。亦即，無支樓膠帶61、62的邊 支撐膠帶41、42的邊界部分，亦可橫跨 樹月曰基材5，而配置在和厚度方向相交之方向上，於 不同位置上。即便如此，亦不會在安裝片7的製作中 產生不良情況，同樣可獲得上述的效果。 再者，於本實施例之保持墊10中，雖例示了是 以PET製基材作為樹脂基材5，但並未受限於此例 如，亦可使用聚丙烯或雙向拉伸聚丙稀（〇pp)。又， ^⑼支擇膠帶41、42的黏著劑，雖僅例示丙稀酸 脚=者，’而無支撑膠帶61、62的黏著劑則是以橡 ^黏著劑來實現’但並未受限於此，亦可使用聚氨 基曱酸酯系或環氧系的黏著劑。無支揮勝帶41、42 =著劑和無支揮膠帶61、62的黏著劑亦可使用同 質者。惟若顧慮到接著強度或聚氨基甲酸醋薄片2之 物性的影響’則以無支擇膠帶41、42的黏著劑與無 支樓膠帶61、62的黏著劍相異，並使各自接著力較 為合理的方式來實施為宜。 产再者，於本實施例之保持墊10中，雖僅例示於 聚氨基甲酸酯薄片2的保持面p之背面上進行抛光處 19 201100202 未受限於此。例如，亦可對聚氨基甲酸醋薄 的保持面P’進行拋域理，使大氣孔 3及小氣 之一部分在保持面p側具有開孔。惟若顧 慮到保持墊1G之被研磨物保持性 =面進行抛光處理以保留表層8之==為 ‘二亦可作成在黏著片4的一面（與聚氨基甲 么貝二的Γ合的面）及黏著片6的一面（與保持平 面）’具有分別覆蓋構成黏著片4,6的黏著 面ΐ可剝離的離型膜。如此-來，即可達到 =i進仃安裝# 7之保f、搬運等效果，從製造 &理的觀點來看亦具有極大的改良效果。 ,者’於本實施例之保持墊1〇中，係例示了以 濕式成錢基 為樹脂製薄片材料，但並未受限於此。例二片亦2可: =由使異氰酸化合物與㈣化合物或多胺化合物 仃反應後，再藉乾式成形的聚氨基甲酸酯薄片 ==亦可使用_或聚_樹脂來取代聚 此外，於本實施例之保持墊10中， 2000麵、寬度2〇〇〇mm的矩形為例但本發明^ 此所蚊。/料_，可為對向方向上之邊長為2_mm =的矩形、直徑為2_mm以上的圓形等形狀 持墊。 本發明乃提供—種即便大型化，亦能確保平坦性 同時可將全面配置於保持平台之保持墊，故在 的製造、販售上具有絲，係為極具產業彻性之發 20 201100202 明。 【圖式簡單說明】 第1圖 係為適用本發明實施例之保持墊之剖面示意 圖；以及 第2圖 係為製作實施例之保持墊所使用之貼膜機之剖 面示意圖。 〇 【主要元件符號說明】 2:聚氨基曱酸酯薄片； 3:大氣孔； 4 :黏著片； 5 :樹脂基材； 6 :黏著片； 7:安裝片； 8 :表層； ❹ 10 :保持墊； 41、42、61、62 :無支撐膠帶； 61a、62a :離型膜； 90 :貼膜機； 91 、 94 :輥； 92 :基材供給輥； 93 :加壓輥； 95 :膠帶供給輥； 96、97、98 :搬送輥； 21 201100202 D1、D2 :邊界；以及 P :保持面。 22The resin substrate 5 may be a substrate made of polyethylene terephthalate (referred to as PET). The resin substrate 5 is placed between the adhesive: adhesive sheets 6. That is, the one side of the resin substrate 5 is bonded to the other side of the adhesive sheet, and the other side is attached to the other side of the adhesive sheet 6. The resin substrate 5 is formed of one sheet having the same size as the polyaminophthalic acid sheet 2, and one surface and the other surface are continuous = slightly flat surfaces. That is, the resin substrate 5 has the same shape as the polyurethane sheet 2. Therefore, the resin substrate $ formic acid sheet 2 is fully supported. The manufacturing method of the substrate 塾10 is produced by separately forming and bonding the polyurethane:::2: and the mounting sheet 7. The production of the urethane sheet 2, the preparation of the mounting sheet 7, and the order of bonding will be described in detail below. The production of the polyurethane sheet 2 is carried out to produce a polyurethane sheet 2 The following steps: preparing a resin solution; preparing the resin solution continuously on the film-forming substrate, and solidifying the polyurethane resin in a water-based solution: a solidification of the polyurethane resin to form a film-like solidification regeneration Washing and obtaining the cleaning/lying (4) of the polyurethane 2 and smoothing the phase thickness of the holding surface P of the dried polyurethane sheet 2 to be homogenized Process step 11 201100202 In the above preparation step, a mixture of a polyurethane resin, a water-miscible organic solvent capable of dissolving a polyurethane resin, N,N-dimethylmetamine (hereinafter abbreviated as DMF), and an additive are used. The polyurethane resin is dissolved. The polyurethane resin is selected from the group consisting of polyester resins, polyether resins, and polycarbonate resins having a modulus of 2 〇Μ % and less, for example, a polyamine. The resin is dissolved in DMF to a level of about 3% by weight. A pigment such as carbon black for controlling the size and amount of the atmospheric pores 3, a hydrophilic active agent for promoting foaming, and a solidification regeneration of the polyurethane resin can be used. A stable hydrophobic active agent or the like is used as an additive. The obtained solution is subjected to defoaming under reduced pressure to prepare a resin solution. In the above-described coagulation regeneration step, the resin solution prepared in the preparation step is continuously The solution is applied to a film-forming substrate, and the polyurethane resin is solidified in a water-based coagulating liquid to form a film. The fat solution is applied to the film-formed substrate at a normal temperature in a strip shape by a coating device. (4) Device This is a (four) knife coater. At this time, the coating thickness (coating amount) of the resin solution can be adjusted by adjusting the clearance between the knife coater and the film-forming substrate. The film-forming substrate can be used. A flexible film, a nonwoven fabric, a woven fabric, or the like is used. In the present embodiment, a pE film substrate is used. The resin solution applied to the film-forming substrate is immersed in the resin for the polyamine 6 resin. After the condensation of water as a main component of the poor solvent, in this coagulating liquid, the microporous layer constituting the surface layer 8 is formed on the surface on which the resin solution is applied, and the microporous is across the thickness number // Then, by replacing the 12 201100202 DMF in the resin solution with the coagulating liquid, the polyurethane resin is solidified and regenerated into a film on one side of the film-forming substrate. DMF is desolvated from the resin solution. By replacing the DMF with the coagulating liquid, the atmospheric pores 3 and the small pores are formed in the polyurethane resin on the inner side of the surface layer 8, and a communication hole which allows the atmospheric pores 3 and the small pores to communicate with each other in a mesh shape is formed. The PET film of the film-forming substrate is not impregnated with water, so that the surface of the resin solution (on the surface layer 8 side) can be desolvated, and on the film-forming substrate side, the atmospheric pores 3 larger than the surface are formed. 〇 In the washing/drying step, the strip-shaped (long strip) polyurethane resin which has been solidified and regenerated is washed and dried. That is, the polyurethane resin is peeled off from the film-forming substrate and washed in a washing liquid such as water to remove DMF remaining in the polyurethane resin. After washing, the polyurethane resin is dried by a dryer or the like. In the present embodiment, the dryer is a cylinder dryer using a cylinder having an internal heat source. Drying is carried out by passing the polyurethane resin along the circumferential surface of the cylinder. In the smoothing treatment step, in order to make the thickness of the dried polyurethane resin ❹, the opposite surface of the surface layer 8 is polished. In the present embodiment, after the smoothing treatment, the polyurethane resin is cut into a width of 2000 mm, and then taken up by a roll to obtain a polyurethane sheet 2 ° = An U 7 is prepared, respectively, to prepare a sticky The adhesive tapes 41 and 42 and the adhesives 61 and 62 constituting the adhesive sheet 6 and the resin substrate 5 are used. Using a laminating machine (details on the resin substrate 5, the adhesive sheet 6 and the adhesive sheet 4 are bonded to each other for binding. The unsupported ribbons 41, 42 of the adhesive sheet 4 and the adhesive sheet 6 are not 13 201100202 support tape 61, Either 62 is set to have a bandwidth of 1 ugly and a thickness of 55/zm. The unsupported tapes 41 and 42 are those in which the adhesive film is covered with a release film, respectively. The unsupported tapes 61 and 62 are used. The one surface of the holding platform is covered with the release films 6ia and 62a, and the other surface is covered with the other release film. The resin substrate 5 is set to have a width of 2000 mm and a thickness of 75/m. That is, the resin substrate 5 is The β substrate is the same width as the polyurethane sheet 2. The resin substrate 5 is a ρΕτ substrate having a continuous flat surface on one surface and the other surface. The release film may be a PET resin sheet, paper, or the like. r The release film can be easily peeled off, and can be subjected to release treatment. As shown in Fig. 2, the film laminator 90 is provided with two tape supply rollers 95 and a pair of pressure rollers 93. Two tape supply rollers are used for Two unsupported tapes are respectively supplied. The pressure roller % of the pair is applied to the substrate 5 of the tree. The unsupported tape is adhered after being pressed, that is, the film laminator 90 is a biaxial laminating machine that supplies two unsupported tapes using two tape supply rollers 95. The roller 95 is supplied by two unsupported tapes in parallel. The method is disposed above the pressure roller 93. On the upstream side of the tape supply roller 95, a roller 91 for removing the release film without the support tape is disposed. The tape supply roller 95 and the pressure roller 93 are disposed. A transfer roller 96 that functions as a tension for controlling the tape can be used in combination. On the upstream side of the pressure roller 93, a substrate supply roller % for supplying the resin substrate 5 is disposed as a supply side. The substrate supply roller 92 is pressurized. A conveyance roller 97 is disposed between the rollers 93. On the downstream side of the pressure roller 93, a roller 94 for winding the resin substrate 5 to which the support tape is adhered is disposed. The transfer roller 93 and the roller 94 are disposed to be transported. Roller 98. 14 201100202 In the film laminator 90, the unsupported tape taken out from the tape supply roller % is transported by the transport roller 96. The release film on the other side of the unsupported tapes 61 and 62 is peeled off. The peeling off the release film is taken by the pro 91 In the form of a reel, the unsupported tapes 61 and 62 from which the release film of the other surface is peeled off are conveyed on the side of the pressurization pro-%, and the resin substrate 5 is transferred from the substrate supply roller to the pressurization. The other side of the resin substrate 5 on the side of the roller 93 is in contact with the other side of the unsupported rubber: 6b 62. The unsupported tape ", J, and the tree material 5 are passed through the gap of the pressure roller 93, Therefore, the other side of the base resin substrate 5 is adhered to the other surface of the unsupported tapes 61 and 62. The resin substrate 5 to which the support tape 6 is adhered is conveyed by the conveyance roller 98, and is taken up by the roll 94. In order to make the gap formed between the unsupported tapes 61, 62 (the degree of the boundary D2) within 2 mm, an infrared laser can be used to control the position of the unsupported belt 61 62. The unsupported tapes 41, 42 can be adhered to one side of the resin substrate 5 in the same manner as described above to fabricate the mounting sheet 7. At this time, the boundary of the unsupported tapes 41, 42 is called, and is disposed so as to be disposed at a position corresponding to the direction intersecting the thickness direction across the boundary D2 of the resin substrate 5 and the unsupported tapes 61, 62. For the bonding, the produced polyurethane sheet 2 and the mounting sheet 7 were bonded together using a filming machine equipped with a pair of pressure rollers. That is, the polyurethane sheet 2 and the mounting sheet 7 are supplied in the direction of the pressure roller, respectively. At this time, the release film of the mounting sheet 7 is peeled off. The polyurethane sheet 2 and the mounting sheet 7 are pressed and adhered by passing through a gap between the pressure rollers. The polyacrylic acid S sheet 2 to which the mounting sheet 7 is adhered is wound into a reel shape. After that, the cutting growth is 15 201100202 2000 mm, and it is checked whether or not any dirt or foreign matter adheres to the inspection, and the mat 10 having a length of 2000 mm and a width of 2 mm can be completed. When the holding mat 10 is placed on the holding stage, the release sheets 61a, 62a are removed, and the holding mat 10 is adhered to the holding stage with the exposed unsupported tapes 61, 62. In this case, since the two release films 61a and 62a are sequentially removed, the unsupported tape 61 is attached one by one, and the air can be removed without any deviation. In the case, properly glued to the platform. Further, when the polishing process is performed, the slurry to be polished is supplied while the slurry containing the abrasive particles is supplied. Next, with regard to the effect of the holding mat 1 of the present embodiment, the operation of the mounting sheet 7 will be mainly described below. In the holding mat 10 of the present embodiment, the adhesive sheet 4 is composed of two unsupported tapes 41 and 42, and the adhesive sheet 6 is composed of two advantageous support tapes 6 and 62. Therefore, even when the size of the crucible 1 is increased, when the polyurethane sheet 2 and the mounting sheet 7 are bonded together, the occurrence of crepe or the like can be suppressed. Further, by sequentially (four) the unsupported tapes 61, 62 constituting the adhesive sheet 6, on the material platform, the effect of properly adhering to the holding platform without occurrence of the offset can be achieved. Further, in the holding mat 10 of the present embodiment, the resin substrate 5 is provided between the adhesive sheet 4 and the adhesive sheet 6. Since the resin substrate 5 = the same size as the polyaminophthalic acid S sheet 2 and the surface and the other surface 1 are continuous slightly flat surfaces, the resin substrate 5 can function as a comprehensive feature of the selected fortified formic acid sheet 2 . Therefore, when the pad 10 201100202 is moved and the crucible 10 is placed on the stage, the polyaminophthalic acid can be suppressed, and the holding surface p of the sheet 2 can be wrinkled or the like. Thereby, the flatness of the holding surface p can be ensured, so that the object to be polished can be held flat, and the flatness of the polishing object can be improved. Further, in the holding mat of the present embodiment, between the adhesive sheet 4 and the adhesive sheet 6, a resin substrate 5 having a continuous surface and a continuous surface is provided. That is, the resin substrate 5 is in the same shape as the t-aminomethine "the bismuth sheet 2." Since the resin substrate 5 can support the elastic soft oleic acid sheet 2, it can be avoided. In addition, the problem of bending at the time of conveyance or when it is placed on the holding platform. Further, even if the size of the holding crucible 10 is increased, it is easy to perform the bonding work for holding the platform or the peeling operation when the holding mat 10 is exchanged. In the holding pad of the present embodiment, the boundary portion D2 of the unsupported tapes 61, 62 constituting the adhesive sheet 6 constitutes the boundary portion D of the unsupported adhesive tape 4 of the adhesive sheet 4 across the resin substrate 5, The arrangement is in the direction intersecting the thickness direction, at the position of the phase 0. In other words, the unsupported tapes 41, 42 and the unsupported tape 6 are all set to the same width and length. Therefore: ', making the mounting piece At 7 o'clock, the adhesive sheet 4 and the adhesive sheet 6 can each be easily managed using the unsupported tape of the same width. Moreover, the unsupported tape used in the present invention is only in the form of an adhesive = no substrate. When using traditional bases In the case of the double-sided tape, a concave portion is formed on the holding surface of the polyurethane sheet 2 along the boundary of the double-sided tape, because the base material of the double-sided belt is more than the poly-amino acid g The thickness of the sheet 2 and the adhesive: the rigidity of the substrate portion is increased, and the rigidity difference and height difference of the double-sided tape of the boundary are enlarged, and thus transferred to the polyamino acid ester sheet 2. In the present invention, by using the unsupported tape, the rigidity difference and the height difference between the boundary and the double-sided tape can be reduced, and the flatness of the holding surface of the retaining crucible 10 can be improved. Further, in the holding mat 10 of the present embodiment The width of the boundary D1 and the boundary D2, that is, the gap formed between the adjacent unsupported tapes 41 and 42 and the gap formed between the adjacent unsupported tapes 61 and 62 are set to 2 mm or less. The boundary D1 and the boundary are set. When the width of D2 exceeds 2 mm, a difference in the holding surface p of the holding mat 1 is caused, and it becomes difficult to hold the object to be polished flat. By setting the width of the boundary D1 and the boundary D2 to 2 mm or less Can reduce the height of the unsupported tape The effect of the return surface p can be maintained flat. If it is considered that the flatness of the object to be polished can be maintained by narrowing the width of the boundary 〇1 and the boundary D2, it is more preferable to set the boundary D1 and the boundary D2. Further, in the holding mat 1 of the present embodiment, the adhesive sheets 4 and 6 are bonded to the resin substrate 5 as the mounting sheet 7, but the invention is not limited thereto. In addition to the adhesive sheets 4 and 6, a plurality of additional adhesive sheets can be laminated. In addition to the resin substrate 5, another resin substrate can be laminated. In this case, it is expected to improve the support of the amino group. Although the effect of the phthalate sheet 2 is obtained, there is a possibility that the proportion of the mounting sheet 7 in the entire holding mat 10 becomes large, which hinders the processing. In view of this, it is preferable to use the three-layer structure of the adhesive sheets 4 and 6 and the resin substrate 5 as the mounting sheet 7. Further, in the holding mat 1 of the present embodiment, it is exemplified that the adhesive member constituting the adhesive sheet 4 is an adhesive member using two unsupported tapes 4ι, 18 201100202, and two unsupported tapes are used. Limited to this. For example, the adhesive sheet 4 and the adhesive sheet 6 are formed by the unsupported (four) belts on the upper side of the 34 sheets. In other words, the number of the unstriped tape constituting the adhesive sheet 4'6 is the same as that of the base sheet 2 (the resin substrate 5 is also the same). In addition, the number of the supporting adhesives f, respectively, may be different depending on the size of the adhesive. That is, the edges of the unsupported tapes 61, 62 support the boundary portions of the adhesive tapes 41, 42 The substrate 5 is placed across the tree and placed in a direction intersecting the thickness direction at different positions. Even in this case, no problem occurs in the production of the mounting sheet 7, and the above effect can be obtained. In the holding mat 10 of the present embodiment, a PET substrate is exemplified as the resin substrate 5, but it is not limited thereto. For example, polypropylene or biaxially oriented polypropylene may be used (〇pp). Further, ^(9) the adhesive for the tapes 41, 42 is merely exemplified as the acrylic foot = ', and the adhesive without the support tapes 61, 62 is realized by the rubber adhesive" but not In addition, it is also possible to use a polyamino phthalate-based or epoxy-based adhesive. The adhesives of the unscented belts 41 and 42 = the agent and the non-woven tapes 61 and 62 may be homogenous. However, if you are concerned about the influence of the strength or the physical properties of the polyurethane sheet 2, then The adhesives of 41 and 42 are different from the adhesive swords of the unsupported tapes 61 and 62, and it is preferable to carry out the adhesion of each of the adhesives. In the holding pad 10 of the present embodiment, although only The polishing is carried out on the back surface of the holding surface p of the polyurethane sheet 2. 19 201100202 is not limited thereto. For example, the porous holding surface P' of the polyurethane can be thrown to the air hole. 3 and one part of the small gas has an opening on the side of the holding surface p. However, if it is concerned that the object to be held by the holding mat 1G is to be polished, the surface is polished to leave the surface layer 8 == 'two can also be made in the adhesive sheet 4 One side (the side combined with the polyamidole) and one side (and the holding plane) of the adhesive sheet 6 have a release film which can be peeled off from the adhesive surface constituting the adhesive sheets 4, 6, respectively. , can achieve the effect of = i 仃 仃 # 7 7 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A thin sheet material made of a wet type of resin is exemplified, but is not limited thereto. The second film can also be: = by reacting the isocyanate compound with the (4) compound or the polyamine compound 仃, and then by dry-formed polyurethane sheet == can also be replaced with _ or poly-resin In the holding mat 10 of the present embodiment, a rectangle having a surface of 2000 and a width of 2 mm is taken as an example, but the mosquito of the present invention can be a rectangle having a side length of 2 mm in the opposite direction. A circular shape or the like having a diameter of 2 mm or more. The present invention provides a holding mat which can ensure flatness and can be disposed on the holding platform even when the size is increased, so that it is manufactured and sold. It is a very thorough industry 20 201100202. [Schematic description of the drawings] Fig. 1 is a schematic cross-sectional view of a holding mat to which the embodiment of the present invention is applied; and Fig. 2 is a holding mat of the manufacturing example A schematic view of the profile of the film laminating machine used. 〇【Main component symbol description】 2: Polyaminophthalate flakes; 3: Atmospheric pores; 4: Adhesive sheet; 5: Resin substrate; 6: Adhesive sheet; 7: Mounting sheet; 8: Surface layer; ❹ 10: Keep Mat; 41, 42, 61, 62: unsupported tape; 61a, 62a: release film; 90: film coater; 91, 94: roll; 92: substrate supply roll; 93: pressure roll; 95: tape supply Roller; 96, 97, 98: conveying roller; 21 201100202 D1, D2: boundary; and P: holding surface. twenty two