201043432 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種壓印模具，特別係涉及一種用於壓印微 小光學元件例如微鏡片之壓印模具及其製作方法。 [先前技術] [0002] WLP(wafer level package)製程係目前新發展之相機 鏡頭模組製作方式，其係採用與半導體製程相整合之鏡 片堆疊方式或者雙面壓印方式，主要係利用壓印模具之 紫外線成型壓印技術’具體地，利用非球面鏡片壓印模 ^ 具於複製材料上壓印出非球面鏡片，然後再利用紫外線 光固化’使非球面鏡片定型，然後再以堆疊方式或雙面 -- .¾ - - *' 1 壓印方式形成鏡頭，並且與後段影像處理器4裝製程整 合，其製程之優點於於可大量生產光學鐃頭模組。 [00〇3]紫外線成型壓印技術（請參見Liang Ying-χin, Wang Tai-hong, A New Technique for Fabrication of Nanodevices —Nanoinj；prin-t； Lithography", ^ Micronanoelectronic Technology, 2003, Vol. 4-5)係採用紫外光照射室溫之聚合物實現固化成型之一 種壓印技術，特別適用於大抵量、重複性、精確製備微 結構。紫外線成型壓印技術為先製造具有微結構之壓印 模具，然後利用該模具進行壓印過程，最後進行圖形轉 移0 [0004]先前技術中壓印模具製造方法包括如下步驟：提供一透 光基底；於該透光基底一表面塗覆光阻層；曝光顯影； 蝕刻該基板形成微結構圖案；晶種層金屬化；對該基板 098119357 表單编號A0101 第3頁/共ι6頁 〇 201043432 進行電鑄；脫模並去除晶種層，形成壓印模具。 [0005] 惟，這種製造方法中需要經過蝕刻、電鑄等步驟才可以 完成壓印模具之製造，製程繁瑣，生產效率低。 【發明内容】 [0006] 有鑒於此，有必要提供一種製程相對簡單容易、生產效 率高之壓印模具及一種該壓印模具之製作方法。 [0007] —種壓印模具包括圖案層。該圖案層具有複數間隔分佈 之成型面。該圖案層之材料為軟質透光材料。該壓印模 具進一步包括形成於該複數成型面之硬質膜層。 ί [0008] 一種壓印模具之製作方法，其包括以下步驟： [0009] 提供一母模，該母模具有複數間隔分佈之微結構； [0010] 於該具有複數微結構之表面上設置軟質透光材料，固化 該軟質透光材料，以使該軟質透光材料成為具有複數間 隔分佈之成型面之圖案層； [0011] 於該圖案層遠離該母模之表面黏結一塊透光基板； … ί [0012] 移去該母模； [0013] 於該複數成型面形成硬質膜層，以形成具有該透光基板 、圖案層及硬質膜層之壓印模具。 [0014] 與先前技術相比，本發明實施例之壓印模具之由母模轉 印形成，製程較簡單，生產效率較高，且該壓印模具之 複數成型面上還形成有硬質膜層，可以增強該壓印模具 之強度，提高該壓印模具之耐磨性及可反復利用性。 098119357 表單編號Α0101 第4頁/共16頁 0982032860-0 201043432 【實施方式】 [0015] 下面將結合附圖對本發明作進一步詳細說明。 [0016] 請參閱圖1，其為本發明實施例中壓印模具製作方法之流 程圖。該方法包括以下步驟： [0017] 提供一母模，該母模具有複數間隔分佈之微結構； [0018] 於該具有複數微結構之表面上設置軟質透光材料，固化 該軟質透光材料，以使該軟質透光材料成為具有複數間 隔分佈之成型面之圖案層； 〇 [0019] 於該圖案層遠離該母模之表面黏結一塊透光基板； [0020] 移去該母模； [0021] 於該複數成型面形成硬質膜層，以形成具有該透光基板 、圖案層及硬質膜層之壓印模具。 [0022] 下面將以製造微小鏡片壓印模具50為例對本發明實施例 中壓印模具製作方法進行詳細說明。 Q [0023] 如圖2所示，首先提供一母模10。該母模10具有複數間隔 分佈之微結構101。本實施例中，該母模10由超精密切削 加工製成，且其微結構101為凸起。當然，該母模10亦可 以採用電子束蝕刻、鐳射蝕刻或者聚焦粒子束蝕刻等其 他超精密加工方法製得。當然，該微結構101亦可以為凹 陷。 [0024] 如圖3所示，於該具有複數微結構101之表面上設置軟質 透光材料，固化該軟質透光材料，以使該軟質透光材料 成為具有複數間隔分佈之成型面201之圖案層20。該成型 098119357 表單編號 A0101 第 5 頁/共 16 頁 0982032860-0 201043432 面201由該微結構101轉印形成。本實施例中，該軟質透 光材料為聚二甲基碎纽，該成型面2qi為凹陷。當然， 該軟質透紐料亦可以為聚甲基㈣酸脂或聚碳酸醋等 其他可以絲作祕具之㈣，稀於本纽中之聚二 曱基矽氧烷。 [0025] [0026] [0027] 如圖4所示，於該圖案層2〇1遠離該母模1〇之表面黏結一 塊透光基板3G。該透光基板3〇遠離該成型面2()1，其用來 支撐該圖案層2G卜以使該堡印模具5〇具有一定之承載強 度及透光性。 如圖5及圖6所示，移去該母模1G後，於該複數成型面2〇1 形成硬質膜層4G ’以形成該愿印模具5卜胃硬質膜層4〇 之厚度為議奈米，〇奈米。本實施例中，採用射頻磁控 濺鍍方法於該複數成型面2〇1形成3〇〇奈来厚之硬質膜層 40 ’該硬質膜層4G之材料為二氧切，採用射頻磁控減 鑛方法時’對設有二氧切之㈣之▲轉度為⑽攝氏 度至200攝氏度，真空腔體之壓強為0. 013332帕至 0.1 3332帕，為了防止該圖案層2〇1變形，可以對該真空 腔體不加熱，即，該真空腔體之溫度可以為室溫。當然 ，該硬質膜層40之厚度亦可根據實際情況來定，不限於 300奈米〜500奈米。當然，該硬質膜層4〇之材料亦可以 為石夕、碳化石夕或者類金剛石等其他硬質模具材料。 該壓印模具50之由母模1〇轉印形成，製程較簡單，生產 效率較高’且該壓印模具5〇之複數成型面2〇1上還設有硬 質膜層40，可以增強該壓印模具50之強度，提高該壓印 模具50之耐磨性及可反復利用性。 098119357 表單編號A0101 第6頁/共16頁 0982032860-0 201043432 酬]可以理解，該微結構m可根據需要設計，如圓柱狀結構 、v形槽結構、金字塔型結構或三肖錐型結構等三維微結 構，並不限於本實施例中之微小鏡片結構。 _]料，本領域技術人貞射崎本㈣精神内做其他變 化，當，然，這些依據本發明精神所做之變化，都應包含 於本發明所要求保護之範圍之内。 [0030] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 〇 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ’皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 ‘——^ [0031] 圖1係本發明實施例中壓印模具製作方法之流程圖。 [0032] 圖2係本發明實施例提供之母模之示意圖，該母模具有複 數間隔分佈之微結構。 * 〇 [〇〇33]圖3係於圖2中之該具有複數微結構表面形成圖案層之示 意圖，該圖案層具有複數間隔分佈之成型面。 [〇〇34]圖4係於該圖案層遠離該母模之表面黏結一塊透光基板之 示意圖。 [0035]圖5係移去該母模之示意圖。 [0036]圖6係於該複數成型面形成硬質膜層’以得到本發明實施 例製成之壓印模具之示意圖。 【主要元件符號說明】 098119357 表單編號A0101 第7頁/共16頁 0982032860-0 201043432201043432 VI. Description of the Invention: [Technical Field] The present invention relates to an imprint mold, and more particularly to an imprint mold for imprinting a micro optical element such as a microlens and a method of fabricating the same. [Prior Art] [0002] The WLP (wafer level package) process is a newly developed camera lens module manufacturing method, which adopts a lens stacking method or a double-sided imprinting method integrated with a semiconductor process, mainly using an embossing method. The UV forming embossing technology of the mold 'specifically, using an aspherical lens embossing die to emboss the aspherical lens on the replication material, and then using ultraviolet light curing to shape the aspherical lens, and then stacking or Double-sided - .3⁄4 - - *' 1 The embossing method forms a lens and is integrated with the rear-end image processor 4 process. The advantage of the process is that it can mass produce optical boring head modules. [00〇3] UV forming embossing technology (see Liang Ying-χin, Wang Tai-hong, A New Technique for Fabrication of Nanodevices - Nanoinj; prin-t; Lithography", ^ Micronanoelectronic Technology, 2003, Vol. 4- 5) An imprint technique that uses UV-irradiated room temperature polymer to achieve solidification molding. It is especially suitable for large-scale, reproducible and precise preparation of microstructures. The ultraviolet forming embossing technology firstly manufactures an imprinting mold having a microstructure, and then uses the mold to perform an imprinting process, and finally performs pattern transfer. [0004] The prior art imprinting mold manufacturing method includes the following steps: providing a transparent substrate Applying a photoresist layer on a surface of the light-transmissive substrate; exposing and developing; etching the substrate to form a microstructure pattern; seeding layer metallization; and the substrate 098119357 Form No. A0101 Page 3 / Total 6 Page 〇 201043432 Casting; demolding and removing the seed layer to form an imprinting mold. [0005] However, in this manufacturing method, etching, electroforming, and the like are required to complete the manufacture of the imprinting mold, the process is cumbersome, and the production efficiency is low. SUMMARY OF THE INVENTION [0006] In view of the above, it is necessary to provide an imprinting mold which is relatively simple and easy to manufacture, has high production efficiency, and a manufacturing method of the imprinting mold. [0007] An imprint mold includes a pattern layer. The pattern layer has a plurality of spaced apart profiled faces. The material of the pattern layer is a soft light transmissive material. The embossing mold further includes a hard film layer formed on the plurality of molding faces. [0008] A method for manufacturing an imprinting mold, comprising the following steps: [0009] providing a master mold having a plurality of spaced-apart microstructures; [0010] providing softness on the surface having the plurality of microstructures a light transmissive material, the soft light transmissive material is cured, so that the soft light transmissive material becomes a pattern layer having a plurality of spaced apart molding surfaces; [0011] the patterned layer is bonded to a surface of the ... [0012] removing the master mold; [0013] forming a hard film layer on the plurality of molding surfaces to form an imprint mold having the light transmissive substrate, the pattern layer, and the hard film layer. [0014] Compared with the prior art, the imprinting mold of the embodiment of the present invention is formed by transfer of a master mold, the process is relatively simple, the production efficiency is high, and a hard film layer is formed on the plurality of molding surfaces of the imprinting mold. The strength of the imprinting mold can be enhanced, and the wear resistance and reusability of the imprinting mold can be improved. 098119357 Form No. Α0101 Page 4 of 16 0982032860-0 201043432 [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. Please refer to FIG. 1, which is a flow chart of a method for fabricating an imprinting mold according to an embodiment of the present invention. The method includes the following steps: [0017] providing a master mold having a plurality of spaced-apart microstructures; [0018] providing a soft light-transmitting material on the surface having the plurality of microstructures, curing the soft light-transmitting material, The soft light transmissive material is a pattern layer having a plurality of spaced apart molding surfaces; 〇 [0019] bonding a transparent substrate to the surface of the pattern layer away from the mother mold; [0020] removing the master mold; [0021] Forming a hard film layer on the plurality of molding surfaces to form an imprinting mold having the light transmissive substrate, the pattern layer, and the hard film layer. [0022] Hereinafter, a method for manufacturing an imprint mold according to an embodiment of the present invention will be described in detail by taking a microlens imprint mold 50 as an example. Q [0023] As shown in FIG. 2, a master 10 is first provided. The master 10 has a plurality of spaced apart microstructures 101. In this embodiment, the master mold 10 is made by ultra-precision cutting, and its microstructure 101 is a projection. Of course, the master mold 10 can also be produced by other ultra-precision processing methods such as electron beam etching, laser etching, or focused particle beam etching. Of course, the microstructures 101 can also be recessed. [0024] As shown in FIG. 3, a soft light transmissive material is disposed on the surface of the plurality of microstructures 101, and the soft light transmissive material is cured to make the soft light transmissive material into a pattern of molding surfaces 201 having a plurality of spaced intervals. Layer 20. The molding 098119357 Form No. A0101 Page 5 of 16 0982032860-0 201043432 The face 201 is formed by transfer of the microstructure 101. In this embodiment, the soft light transmissive material is a polydimethyl crepe, and the molding surface 2qi is a depression. Of course, the soft translucent material can also be polymethyl (tetra) acid fat or polycarbonate, and the like, which can be used as a secret (4), which is dilute to the polydioxanoxane in the present. [0027] As shown in FIG. 4, a light-transmissive substrate 3G is adhered to the surface of the pattern layer 2〇1 away from the mother mold 1〇. The transparent substrate 3 is away from the molding surface 2 () 1 for supporting the pattern layer 2G so that the stamping mold 5 has a certain bearing strength and light transmittance. As shown in FIG. 5 and FIG. 6, after the master mold 1G is removed, the hard film layer 4G' is formed on the plurality of molding surfaces 2〇1 to form the thickness of the stomach hard film layer 4 M, 〇 nano. In this embodiment, a radio frequency magnetron sputtering method is used to form a 3 Å thick hard film layer 40 on the plurality of molding surfaces 2 ′. The material of the hard film layer 4G is dioxo, using radio frequency magnetron reduction. In the mining method, the ▲ degree of rotation of the (2) is set to (10) degrees Celsius to 200 degrees Celsius, and the pressure of the vacuum chamber is 0. 013332 Pa to 0.1 3332 Pa. In order to prevent the deformation of the pattern layer 2〇1, it may be The vacuum chamber is not heated, that is, the temperature of the vacuum chamber can be room temperature. Of course, the thickness of the hard film layer 40 can also be determined according to actual conditions, and is not limited to 300 nm to 500 nm. Of course, the material of the hard film layer 4 can also be other hard mold materials such as Shi Xi, carbonized stone or diamond-like. The imprinting mold 50 is formed by the transfer of the master mold 1 , the process is relatively simple, and the production efficiency is high, and the hard molding layer 40 is further provided on the plurality of molding surfaces 2〇1 of the imprint mold 5, which can be enhanced. The strength of the imprint mold 50 improves the wear resistance and reusability of the imprint mold 50. 098119357 Form No. A0101 Page 6 of 16 0982032860-0 201043432 Reward] It can be understood that the microstructure m can be designed according to needs, such as cylindrical structure, v-groove structure, pyramid structure or three-diagonal cone structure. The microstructure is not limited to the minute lens structure in this embodiment. It is to be understood that those skilled in the art will make other changes in the spirit of the present invention. The changes made in accordance with the spirit of the present invention should be included in the scope of the present invention. [0030] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0031] Fig. 1 is a flow chart showing a method of manufacturing an imprint mold in an embodiment of the present invention. 2 is a schematic view of a master mold provided by an embodiment of the present invention, the master mold having a plurality of spaced apart microstructures. * 〇 [〇〇33] Fig. 3 is a schematic view of the patterning layer having a plurality of microstructured surfaces in Fig. 2, the pattern layer having a plurality of spaced apart profiled faces. [4] Figure 4 is a schematic view showing the pattern layer being bonded to a surface of the master mold to bond a light-transmissive substrate. [0035] FIG. 5 is a schematic diagram of the removal of the master mold. Figure 6 is a schematic view showing the formation of a hard film layer on the plurality of molding faces to obtain an imprinting mold produced in an embodiment of the present invention. [Main component symbol description] 098119357 Form number A0101 Page 7 of 16 0982032860-0 201043432
[0037] 母模 10 微結構 101 圖案層 20 成型面 201 透光基板 30 硬質膜層 40 壓印模具 50 0982032860-0 098119357 表單編號A0101 第8頁/共16頁[0037] Master 10 Microstructure 101 Pattern Layer 20 Forming Surface 201 Light Transmissive Substrate 30 Hard Film Layer 40 Imprinting Mold 50 0982032860-0 098119357 Form No. A0101 Page 8 of 16