201041459 六、發明說明： ’ 【發明所屬之技術領域】 本發明係關於一種電路基板，尤其是由接地層及隔著 • 絕緣體層於前述接地層配設有信號配線而成的電路基板。 【先前技術】 例如，安裝有以高頻進行動作之裝置的電路基板，為 了抑制信紅反射及波形失真之發生，必須將信號傳輸路[Technical Field] The present invention relates to a circuit board, in particular, a circuit board in which a signal layer is disposed on a ground layer and a ground layer via an insulator layer. [Prior Art] For example, a circuit board on which a device operating at a high frequency is mounted is required to suppress signal reflection and waveform distortion, and it is necessary to transmit a signal transmission path.
徑之特性阻抗(以下，亦稱為zo)與前述裝置之輸出入阻 進行整合。 ,,為了整合則述信號傳輸路徑之特性阻抗，係採用使適 當圖案寬度之㈣傳輸路徑(帶狀線)，隔著適當厚度之絕緣 層而與接地層相對之長條構造或微帶。 前述電路基板構造之前述接地層，係用以規 輸路徑之特性阻抗的電性基準面。其次，—般^ 傳輸之特性阻抗大多選擇前後，差動 二 100Ω前後。 、彳人夕璉擇 斤^方面，前述電路基板之特性阻抗，係信 從之母单絲紅魏[、赠述·雜 ^ ^ 方根之近似值。 的平 然而，近年來，用以安裝於前述裝置之 通常使用薄的硬質基板或軟性電路基板，2 比之靜電紅之值紐额料以以成反 3/19 201041459 所以，對於為薄多層構造之電路基板之情況，為了得 到期望的③，不得不採用以下之手段，；= 層間較厚的電路基板，所形成之前述信號傳輸路徑(=統 信號配線)之寬度較窄(較細)，用以抑制前述靜電容c 瞎Γ二=到期望的& ’而欲形成較細之信號配線 寺’難免lx生W配線愈細愈難進行加卫的情形。此外， 例如，即使可能進行信號配線之加工，信號配線愈細，電 路加工精纽線寬的縣比率愈高，同時，Zq之誤差也會 權女。 因此’前述Zo變化較大之信號配線部分，會發生信號 之反射^波形失真的_。甚且，因為信號配線之配線電 P值4)¾ &對其供應之信號頻率愈高，而成為傳輸特性 惡化之要因。 所以，為了解決前述技術課題，有人提出以下之提案， 亦將做為所謂0電極層之前述接地層脫鋼成網目狀， 來實質地縮小每單位面積中接地層與信號配線的相對面 積，進而確保前述信號配線之寬度 。例如，如日本特開平 7-321463號公報所示。 /圖7係前述先前技術文獻所示之電路基板的構成例， 其係彳§就配線之方向於途中彎曲成45度程度時之例。亦 即’圖7顯示從垂直於電路基板面之方向透視的情形，係 對十分規則地於接地層6形成平行四邊形開口之網目圖 案重唛著以互相平行狀態進行配列之例如用以進行差動 傳輸之信號配線3a、3b的狀態。 圖7所示之例為以交又的二方向之線於接地層6形成 4/19 201041459 夕數個平行四邊形（_網目。其次，構成上，位於符號α 所^圖之下半部之信號配線3a、3b相對於接地層6側之 -方向之線的交叉角度，與位於符號B所示之圖之上半部 之信號配線3a、3b相對於接地層6側之二方向之線的交叉 角度大致相同。 阻尸防止於途巾f曲之信號配線3a、3b的特性 I1 k於區域a及B之途中會產生較大的變化。 Ο ❹ 前面所述，這種於接地層之全面形成開口， 相之錢轉的雜阻抗妨難之構成， =^在接地層之全_麟體讀_電極），接地層之 直biL電阻值會增大。 因此，例如，離開接地點之接地層 頻信號而被激發，而造成㈣配繞承為計/刀接收到问 取彳。琥配線承文到咼頻信號所導致 劇^問題。^者’流過㈣配線之高頻信號之漏茂程度變 【發明内容】 份進Stir係提供一種著眼於前述技術問題，可充 仏魏線之躲阻抗之㈣，且可㈣接地層之電 而可充份發揮前述假干擾等對策之電路基板。 層、及之目的，本發明的電路基板係由接地 IV 4體層於前述接地層配設信號配線而成者’ 二如㈣_接地層及信號配線間之電 號配線之特性阻抗之控制，其特徵在於 在愈〜、Γ板辑成為，於形成前述接地層之導電部上， 、刚述信號配線相對峙之位置，配置網目狀導體部，該 5/19 201041459 網目狀導體部係藉由形成多數鏤空孔而形成，以此控制前 述接地層及信號配線間之電容耦合，且於前述網目狀導艘 部之外侧，形成有未實施鏤空孔之/5電極區域。 此外，當令前述絕緣體層之厚度為t時，前述信號配線 及/3電極區域之距離U宜設定在20t^U23t之範圍。如 此，在前述絕緣體層為100//m以下厚度之薄層的電路義 板，可以發揮顯著之效果。 其次，形成於前述網目狀導體部之前述多數鏤空孔， 其係二方向之複數條各線交叉而形成平行四邊形開口的形 態0 此外，前述電路基板之一個良好實施形態中，前述絕 緣體層之一侧面積層有前述信號配線，且於另一側面配 有前述接地層。 此外 民奸貫施形態 -則现抬妮配線構成於前述 絕緣體層上’且隔著覆蓋於前述絕緣體層上之信號配線的 第2絕緣體層積層有前述接地層。 此外’另一良好實施形態，前述絕緣體層之-侧面穑 層有刚述㈣配線，於另—側面配置有前述接❹ 著覆蓋於前述絕緣體a 且隔 有第2接地層。 之仏虎配線的弟2絕緣體層積層 其次，前述絕緣體層宜使用膜狀基底材。 依據前述電路基板，㈣構成與_§ 置之接地層的導電部，其係形成有子' 立 體部，故可調整與其相對網目狀導 其次’位_開前述信號配線之位置 因為係未形成鏤空孔之^ j述導電郤， 電極區域’ 電極可抑制接 6/19 201041459 而使前述假干擾等之對策可有效 地層之直流電阻的上升， 地發揮。 此時’隔開信號配線與接地層 配兩者之電容辑程度，以前述絕緣 數時’前述信號配線與冷電極 旱X做為多 20邮：離U，藉由設定在 敕，—並3用L以進行前述信號配線之特性阻抗調 正並滿足用以確保做為接地層之低直The characteristic impedance of the path (hereinafter, also referred to as zo) is integrated with the output resistance of the aforementioned device. In order to integrate the characteristic impedance of the signal transmission path, a (4) transmission path (strip line) of an appropriate pattern width is used, and a strip structure or a microstrip which is opposed to the ground layer via an insulating layer of an appropriate thickness is used. The ground layer described above in the circuit board structure is an electrical reference plane for regulating the characteristic impedance of the path. Secondly, the characteristic impedance of the general ^ transmission is mostly selected before and after, and the difference is two hundred Ω. In terms of 斤 琏 琏 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 方面 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性 特性However, in recent years, a thin hard substrate or a flexible circuit board which is usually used for mounting to the above device is used, and the value of the electrostatic red is increased by 3/19 201041459, so that it is a thin multilayer structure. In the case of the circuit board, in order to obtain the desired 3, the following means must be employed; = the thicker circuit board between the layers, the width of the signal transmission path (= system signal wiring) formed is narrower (thinner), In order to suppress the aforementioned static capacitance c 瞎Γ two = to the desired & 'and want to form a thin signal wiring temple 'inevitable lx raw W wiring is finer and harder to strengthen. In addition, for example, even if signal wiring processing is possible, the finer the signal wiring, the higher the county ratio of the circuit processing fine line width, and the Zq error will also be the female. Therefore, the signal wiring portion where the aforementioned Zo changes greatly may cause a reflection of the signal and a distortion of the waveform. Moreover, because the wiring of the signal wiring has a P value of 4) 3⁄4 & the higher the frequency of the signal supplied thereto, the more the transmission characteristics deteriorate. Therefore, in order to solve the above-mentioned technical problems, the following proposals have been made, and the grounding layer of the so-called zero electrode layer is also stripped into a mesh shape to substantially reduce the relative area of the ground layer and the signal wiring per unit area, and further Make sure the width of the aforementioned signal wiring. For example, it is shown in Japanese Laid-Open Patent Publication No. Hei 7-321463. Fig. 7 is a configuration example of the circuit board shown in the above prior art document, which is an example in which the direction of the wiring is bent at a degree of 45 degrees on the way. That is, 'FIG. 7 shows a perspective view from the direction perpendicular to the surface of the circuit board, and the mesh patterns which form the parallelogram openings very regularly on the ground layer 6 are arranged in parallel with each other, for example, for differential operation. The state of the transmitted signal wirings 3a, 3b. The example shown in FIG. 7 is that the parallel direction quadrilateral (_ mesh) is formed on the ground layer 6 in the two directions of the intersection and the second direction. (Secondly, the signal at the lower half of the symbol α is formed. The intersection angle of the wires 3a, 3b with respect to the line in the direction of the ground layer 6 side, and the intersection of the signal wires 3a, 3b located in the upper half of the figure shown by the symbol B with respect to the line of the ground layer 6 side The angles are substantially the same. The tamper prevents the characteristic I1 k of the signal wirings 3a and 3b of the road towel f from being greatly changed on the way of the areas a and B. Ο ❹ As described above, this overall formation of the ground layer The opening, the impurity impedance of the phase of the money may be difficult to construct, =^ in the ground layer of the whole _ _ body reading _ electrode), the direct biL resistance value of the ground layer will increase. Thus, for example, the ground plane signal leaving the ground point is excited, causing (4) the winding to receive the 彳. A cable wiring to the frequency signal caused by the drama ^ problem. ^者's flow through (four) wiring high-frequency signal leakage degree [invention content] share into the Stir system provides a focus on the aforementioned technical problems, can fill the Wei line of the impedance (four), and (four) grounding layer of electricity Further, the circuit board can fully utilize the countermeasures such as the above-mentioned false interference. The purpose of the layer and the circuit board of the present invention is to control the characteristic impedance of the electric number wiring between the grounding layer and the signal wiring by the grounding IV 4 body layer in which the signal wiring is disposed on the ground layer. It is characterized in that, in the conductive portion where the ground layer is formed, a mesh-like conductor portion is disposed on the conductive portion where the ground layer is formed, and the mesh conductor portion is formed by the position of the signal wiring, and the mesh conductor portion is formed by the 5/19 201041459 mesh portion. A plurality of hollow holes are formed to control capacitive coupling between the ground layer and the signal wiring, and a/5 electrode region in which the hollow holes are not formed is formed on the outer side of the mesh guide portion. Further, when the thickness of the insulator layer is t, the distance U between the signal wiring and the /3 electrode region is preferably set to be in the range of 20 t ^ U23t. Thus, a circuit board in which the insulator layer is a thin layer having a thickness of 100 / / m or less can exhibit a remarkable effect. And a plurality of hollow holes formed in the mesh-shaped conductor portion, wherein the plurality of lines in the two directions intersect each other to form a parallelogram opening. Further, in a preferred embodiment of the circuit board, one side of the insulator layer The signal wiring is laminated, and the ground layer is provided on the other side. Further, in the form of the rape, the current wiring layer is formed on the insulator layer, and the second insulator is laminated on the signal wiring covering the insulator layer. Further, in another preferred embodiment, the side layer of the insulator layer has a (4) wiring, and the other side surface is disposed so as to cover the insulator a and is separated from the second ground layer. The second layer of the insulator 2 is laminated with an insulator. Next, the film layer is preferably used as the insulator layer. According to the circuit board, (4) forming a conductive portion of the ground layer and forming a sub-stereoscopic portion, so that the position of the signal line can be adjusted to be the same as the position of the signal line. The hole is electrically conductive, but the electrode area 'electrode can be prevented from being connected to 6/19 201041459, so that the countermeasures such as the above-mentioned false interference can be effectively exhibited by the increase of the DC resistance of the layer. At this time, the degree of capacitance of both the signal wiring and the ground layer is separated. When the number of insulation is used, the signal wiring and the cold electrode X are used as more than 20 stamps: from U, by setting in 敕, - and 3 Use L to perform the characteristic impedance adjustment of the aforementioned signal wiring and satisfy the low straightness to ensure the grounding layer
對於前述範圍，若使用於卩俨哚砂#值的條仵 ，思M u 配線及接地層之絕 ”度t 4 ioo"m以下而全體形成為較薄之電路基 板，可以得到更良好的結果。 其次，前述絕緣體層使用膜狀基底材，可以得到柔軟 f生良好之電路基板，例如，基底材使用聚醯亞胺時，可提 供耐熱性及機械雜皆十分優良之雜電路基板。 【實施方式】 ^以下，針對本發明之電路基板，依據圖式所示之實施 形態進仃制。圖i係第丨實施形態之電路基板的積層構 造。圖1所不之電路基板丨，其係由接地層、及隔著絕緣體 層對该接地層配設有信號配線之微帶構造所構成者。本實 施形態中，前述絕緣體層係採用膜狀之基底材2。 其次，於基底材2之一侧面（圖丨之上側），形成有例如 差動傳輸之信號配線3a、3b，於該信號配線3a、3b之上面 (圖1之上侧），積層著具有第2絕緣體層之機能的絕緣層 4a。此外’於絕緣層4&之更上面，配設著第1覆蓋層5a。 另一方面’於前述基底材2之另一侧面（圖1之下側) 形成有接地層6,於該接地層6之下面形成有具第3絕緣體 7/19 201041459 層之機能的絕緣層4b，於更為下面，形成著第2覆蓋層5b。 用以構成微帶構造之具中央絕緣體層之機能的前述基 底材2，亦具有做為電路基板丨之核心的機能。前述基底材 2之素材，例如，可以為樹脂膜、纖維基材等。 用以構成前述樹脂膜之素材，例如，可以為聚醯亞胺 樹脂、聚醯胺樹脂、聚醯胺醯亞胺樹脂等之聚醯亞胺樹脂、 環氧樹脂等之熱硬化性樹脂、或m合物等之熱可塑性 樹脂等。 其中’又以聚醯亞胺樹脂或液晶聚合物為佳。例如， 使用聚酿亞麟L兄，耐紐及機械特性優良，且容 易取得。此外，使驗晶聚合物之情況，因為其相對電容 η且Γί合於高速信號傳輸用途’且因為其吸濕性較 低，兼具優良之尺寸穩定性等。 此外，使用於絕緣體層之纖維基材，例如，可 1織布、玻料織料之玻_維紐、或成份為玻^以 物？哉布或不織布等之無機纖維基材、或由 樹脂、《亞胺樹脂、氟樹二之 又以玻璃織布所代表之玻璃纖維水率之觀點而言， 前述絕緣體層使用纖維基材1 著樹脂之狀態來使用為佳。錢維基材浸染 宜使用環氧樹脂系、丙烯酸樹脂系：：：維基材之樹脂， 中，以耐熱性之面而言，又以ί5_4之熱硬化性樹脂，其 前述基底材2之厚度，宜糸為佳。 —，最好㈣〜更佳為 8/19 201041459 則述基底材2之厚度在前述下限值以上 線之線寬成為加工限界以上，3_合易使k唬 -τ,.4 上另一方面，前述厚度為上限 H 卩_性過高，聽㈣軟性之軟性電祕 板等薄基板的特徵。 ·¥ r生電路丞 可亩Γ列於則述基底材2之—侧面的信號配線3a、3b，亦 二各配設。其 Ο Ο r 一等之===: =前述信號配線3a、3k絕緣層 性及撓'1。以域系樹脂為佳。藉此，可以提高财熱 容率方。採用前述液晶聚合物時，可以活用相對電 羊較低、南速信號傳輪特性優良的特質。 =刚4a之厚度，並無特別限制，細，以5〜4〇 二好為1Q〜％㈣藉由絕緣層4a之厚度為前 層4a^HJ；X抑制電路之埋人性的降低，藉由絕緣 出、^又為限值以下’可以抑制絕緣層4a之滲 出里的增加，且可維持層間黏著之可靠性。 月旨材=2^緣層面的第1覆蓋層 > 宜由樹For the above range, if it is used in the strip of the value of the 卩俨哚 sand #, the wiring of the wiring and the grounding layer is less than the degree t 4 ioo"m and the whole is formed into a thin circuit substrate, and better results can be obtained. Next, a film-shaped base material is used for the insulator layer, and a circuit board having a good softness and good quality can be obtained. For example, when a polyimide material is used as the base material, a circuit board excellent in heat resistance and mechanical noise can be provided. In the following, the circuit board of the present invention is formed according to the embodiment shown in the drawings. Fig. 1 is a laminated structure of the circuit board of the second embodiment. The ground layer and the microstrip structure in which the signal wiring is disposed on the ground layer via the insulator layer. In the embodiment, the insulating layer is formed of a film-shaped base material 2. Next, one of the base materials 2 On the side surface (on the upper side of the figure), for example, signal wirings 3a and 3b for differential transmission are formed, and on the upper surface of the signal wirings 3a and 3b (on the upper side in FIG. 1), insulation having a function of the second insulator layer is laminated. 4a. Further, the first cover layer 5a is disposed on the upper side of the insulating layer 4& On the other hand, a ground layer 6 is formed on the other side surface (the lower side in FIG. 1) of the base material 2, An insulating layer 4b having a function of a third insulator 7/19 201041459 layer is formed under the ground layer 6, and a second cladding layer 5b is formed on the lower surface. The function of the central insulator layer for forming the microstrip structure is The base material 2 also has a function as a core of the circuit board 2. The material of the base material 2 may be, for example, a resin film, a fiber base material, or the like. The material for constituting the resin film may be, for example, a polymer. a polyimide resin such as a polyimide resin, a polyamide resin, a polyamidimide resin, a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as an m compound. Polyimide resin or liquid crystal polymer is preferred. For example, the use of the poly-brandle L brother, Nike and mechanical properties are excellent, and easy to obtain. In addition, the case of the crystallographic polymer, because of its relative capacitance η and Γί For high-speed signal transmission purposes and It has low hygroscopicity and excellent dimensional stability, etc. In addition, the fiber substrate used for the insulator layer can be, for example, a woven fabric, a glass woven fabric, or a glass ray. An inorganic fiber substrate such as a crepe or a non-woven fabric, or a fibrous substrate using the resin, the imine resin, and the glass fiber water ratio represented by the glass woven fabric 1 It is preferable to use it in the state of the resin. It is preferable to use an epoxy resin-based or acrylic resin-based resin for the dip-dye substrate:: a resin of a base material, and a heat-curable resin of ί5_4 in terms of heat resistance. Preferably, the thickness of the base material 2 is preferably 。. - preferably (4) - more preferably 8/19 201041459. The thickness of the base material 2 is above the lower limit value and the line width is above the processing limit. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ - r r raw circuit 丞 The signal wirings 3a and 3b which are listed on the side surface of the base material 2 are also disposed. Ο Ο r ===== The above-mentioned signal wirings 3a, 3k have an insulating layer property and a deflection of '1'. It is preferred to use a domain resin. By this, you can increase the rate of financial reserves. When the liquid crystal polymer is used, it is possible to utilize characteristics which are relatively low in electric sheep and excellent in the characteristics of the south-speed signal transmission. = thickness of just 4a, not particularly limited, fine, 5~4〇2 is 1Q~% (4) By the thickness of the insulating layer 4a being the front layer 4a^HJ; the burial of the X suppression circuit is reduced by The insulation is further limited to the lower limit, and the increase in the bleeding of the insulating layer 4a can be suppressed, and the reliability of the adhesion between the layers can be maintained. Moon's material = 2^ edge layer of the first layer >
St 樹㈣料’例如’可以為《系樹脂、 1=胺=合物等。當中，又以聚醯亞胺為佳。藉 了以#疋南耐熱性及撓性。 5〜5〇別述^ 1復蓋層h之厚度，並無特別限制，然而，以 5〇_為佳，最好為㈣⑽。第！覆蓋層5a之厚度 9/19 201041459 為前限仙上，料使樹關之·，特於實用範 圍，藉由前述上限值以下，容易將滑動性及撓性發揮至最 大。 另外’刖述絕緣層4a亦可做為篦丨潘装a 劑層而與第！覆蓋層第1覆蓋層53之黏著 此時，第i覆蓋層5&係由樹脂層及黏著劑 此時，構成前職脂層之樹脂材料與構成前述第丨覆蓋層 5a之樹腊材料相同，例如，可以使用聚醋系樹脂、聚酿亞 胺^晶聚合物等。當中’最好使用聚醯亞胺。藉此，可 以挺南耐熱性及撓性。 此外，此時，構成前㈣著綱 述第2絕緣體層之機能之絕緣層4a的材料 丙烯酸系樹脂、環氧系樹脂、聚醯亞胺系樹脂等。 :中’又以環氧系樹脂為佳，藉此，可以提高耐熱性及撓 導電=置基底材2之另—側面_做為接地層㈣ ’係由利用鋼素材來構成之導電體所構成，於 電部之與前述錢配線3a、3b相對之位置 成料 之開口的多數鏤空孔。另外，該接地 構成，後面會依據圖2進行詳細說明。 八 絕緣妾地層6之下側面(圖1之下側)配設有做為第3 絕、，彖體層之絕緣層4b。構成該絕緣層4b之材料，可 ς。又叫氧絲m為佳。藉此，可叫高耐熱性及挽 另外，構成前述第2絕緣體層之絕緣層4a與構成第3 10/19 201041459 絕緣體層之絕緣層 前述絕綠層4b之厚戶尤2以相同，亦可以不同。 佳，最好為J0〜30_度無特別限制，以5〜40_為 此點，與已說明之 厚度為前述下限值以上，可目同，藉由絕緣層牝之 藉由絕緣層4b之户择& I7制電路之埋入性的降低， 4b之渗出量的增二::=7 ’可以抑制絕緣層 此外，用_心持雜著之可靠性。 以構成第3絕緣體斤之體層之絕緣層如的厚度與用 以不同。賴層之絕緣層4b的厚度，可以相同，亦可 配設於前述絕緣層4b之下側 =树所構成。該樹脂材料，例如:ί以=Γ宜由 聚醯亞I女、液晶聚合物等。 、’，，、聚酉曰系樹脂、 此’可以提高耐熱性及撓性。 乂聚知亞私為佳。藉 此外’用以構成第1覆蓋声 第2:χ之相二 藉由覆蓋層5b之厚度為前述下限值，^層5a相同’ 強度維持於實用範圍’藉由覆蓋層外之二^樹月旨層之 以下，谷易將滑動性及撓性發揮至最大。’、’、⑴述上限值 另外，前述絕緣廣仆亦可與做為第 者划層的覆蓋層5b為一體形成。此時 :5b之黏 由樹脂層及黏著劑層所構成。 覆盍層5b係 此時，構成前述樹脂層之材料與構成 之樹脂材料相同，例如，可以使用聚酯系樹月旨、 201041459 胺、液晶聚合物等。當中，以聚醯亞胺為佳，藉由採用上 述材料，可以提高耐熱性及撓性。 此外’此時，構成前述黏著劑層之材料與構成前述絕 緣層4b之構成材料相同，例如，可以使用丙烯酸系樹脂、 環氧系樹脂、聚醯亞胺系樹脂等。當中，又以環氧系樹脂 為佳，藉由採用上述材料，可以提高耐熱性及撓性。 圖2係前述接地層6之構成的局部放大圖。另外，圖2 係從垂直於面之方向，透視隔著基底材2將前述信號配線 3a、3b重疊於接地層6上的狀態。 接地層6如前面所述，係以由銅素材所構成導電體來 構成，於忒導電體之前述信號配線3a、3b相對之位置，構 成著形成有多數鏤空孔之網目狀導體部6B。 亦即，本實施形態之前述鏤空孔為由二方向之複數條 各線交叉所形成之平行四邊形（菱形）的開口。該二方向之複 數條各線’宜分別在5〜40度之範圍對信號配線如、孙傾 斜。此外’前述鏤空孔為前述菱形開σ之長方之對角線與 前述信號配線3a、3b之配線方向一致的網目圖案。 藉此’可以防止如圖2所示之於途中進行45度程度腎 曲之信號配線3a、3b的特性阻抗於區域A及B產生較= 變化。 八、 力廿間U，具大小（開口面積）可以互相不 然而，於前述區域A及B，宜為相同大小之開口面 此’可以f施信動&線3a、;^之特性阻抗的高精度控 另〆方面’於與前述信號配線如、3b相對崎= 導體部6B的外側，係未形成鏤空孔之由銅素材、 電極區域6A。 再成^ 12/19 201041459 亦即，除了對信號配 較大作用之前述網目狀導、3b之特性阻抗之控制具有 域6A。 導體# 6B以外，其外侧為/9電極區 圖3係隔著由前述膜壯 與信號配線3a、3b相對^之基底材2構成之絕緣體層而 目狀導體部6B之外側之^目狀導體部6B、及形成於網 圖。 万電極區域6A之關係的示意剖面 ❹ ❹ ^ t Α 1ΛΛ ^述做為絕緣體層之基底材2之厚 之距離，，之v=:。與鳩_ =圍，最好設定 間厚度t之倍數)為橫轴、以之距離U(層 -為縱轴所示之特性虎配線如、％之特性阻抗 體部6δ之鋼(導體«留二oiitilT。5 、網目狀導 與=區線圖所示，細號配線3a、3b 號配線以下時，Θ電極區域對信 距離U超^面3/ ^述信號配線3a、3b與沒電極區域6Α之 、1時，/5電極區域對信號配線之電容耦合The St tree (four) material 'for example' may be "resin resin, 1 = amine = compound, and the like. Among them, polybenzamine is preferred. Borrowed with #疋南 heat resistance and flexibility. 5 to 5 〇 述 ^ 1 1 The thickness of the cover layer h is not particularly limited, however, it is preferably 5 〇, preferably (4) (10). The first! The thickness of the cover layer 5a 9/19 201041459 is the upper limit, and the material is made to be closed. It is particularly useful in the practical range, and the slidability and flexibility are easily maximized by the above upper limit. In addition, the description of the insulating layer 4a can also be used as a layer of a coating layer and the first! At this time, the i-th cover layer 5& is composed of a resin layer and an adhesive. At this time, the resin material constituting the pre-lip layer is the same as the wax material constituting the second cover layer 5a. For example, a polyester resin, a polyacrylamide polymer, or the like can be used. It is preferable to use polyimine. Thereby, it is possible to achieve south heat resistance and flexibility. Further, in this case, the material of the insulating layer 4a which functions as the function of the second insulator layer in the front (fourth) is made of an acrylic resin, an epoxy resin, a polyimide resin or the like. In the middle, it is preferable to use an epoxy resin, whereby heat resistance and flexural conductivity can be improved, and the other side of the base material 2 can be used as a grounding layer (4), which is composed of an electric conductor formed of steel material. A plurality of hollow holes in the opening of the electric component at the position opposite to the money wires 3a and 3b. In addition, this grounding structure will be described in detail later with reference to FIG. 8. The lower side of the insulating crucible layer 6 (the lower side of Fig. 1) is provided with an insulating layer 4b as a third insulating layer. The material constituting the insulating layer 4b can be made of ruthenium. Also called oxygen wire m is better. Therefore, the heat-insulating property and the insulating layer 4a constituting the second insulator layer and the insulating layer constituting the insulating layer of the third layer 10/19 201041459 may be the same as the thickness of the green layer 4b. different. Preferably, the degree of J0~30_ is not particularly limited, and is 5~40_ for this point, and the thickness which has been described is above the lower limit value, which can be seen by the insulating layer 4b by the insulating layer The choice of the households & I7 system is reduced in embedding, and the increase in the amount of exudation of 4b::=7 'can suppress the insulating layer. In addition, the reliability of the hybrid is used. The thickness of the insulating layer constituting the body layer of the third insulator is different from that used. The thickness of the insulating layer 4b of the layer may be the same, or may be disposed on the lower side of the insulating layer 4b = a tree. The resin material is, for example, ί = Γ 宜 聚 聚 I I, liquid crystal polymer, and the like. , ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, It is better to gather in Zhiya. Therefore, the thickness of the cover layer 5b is the lower limit value, and the layer 5a is the same 'strength is maintained in the practical range' by the outer layer of the cover layer Below the monthly layer, Gu Yi maximizes slidability and flexibility. ‘,’, (1) The upper limit is defined. The insulating slab may be integrally formed with the cover layer 5b which is the first layer. At this time: the adhesion of 5b is composed of a resin layer and an adhesive layer. The covering layer 5b is the same as the resin material constituting the resin layer. For example, a polyester tree, a 201041459 amine, a liquid crystal polymer or the like can be used. Among them, polyiminoimine is preferred, and by using the above materials, heat resistance and flexibility can be improved. In addition, the material constituting the pressure-sensitive adhesive layer is the same as the constituent material constituting the insulating layer 4b. For example, an acrylic resin, an epoxy resin, a polyimide resin, or the like can be used. Among them, an epoxy resin is preferable, and by using the above materials, heat resistance and flexibility can be improved. 2 is a partially enlarged view showing the configuration of the ground layer 6 described above. Further, Fig. 2 is a state in which the signal wirings 3a, 3b are superposed on the ground layer 6 with a base material 2 in a direction perpendicular to the surface. As described above, the ground layer 6 is formed of a conductor made of a copper material, and a mesh-shaped conductor portion 6B in which a plurality of hollow holes are formed is formed at a position facing the signal wirings 3a and 3b of the tantalum conductor. That is, the hollow hole in the present embodiment is a parallelogram (diamond) opening formed by a plurality of lines intersecting in two directions. The plurality of lines in the two directions should be inclined to the signal wiring such as Sun in the range of 5 to 40 degrees. Further, the hollow hole is a mesh pattern in which the diagonal line of the rectangular shape of the rhombic opening σ coincides with the wiring direction of the signal wires 3a and 3b. Thereby, it is possible to prevent the characteristic impedance of the signal wirings 3a and 3b which are subjected to the 45-degree degree of kidney curvature on the way as shown in Fig. 2 from being changed in the regions A and B. 8. The U and the size of the force (opening area) may not be mutually different. In the above areas A and B, the opening surface of the same size should be the same as the characteristic impedance of the line 3a, ; The high-precision control method is the copper material and the electrode region 6A in which the hollow holes are not formed on the outer side of the conductor portion 6B with respect to the signal wiring such as 3b. Further, 12/19 201041459, that is, the control of the characteristic impedance of the above-mentioned mesh guide and 3b which has a large effect on the signal distribution has the domain 6A. In addition to the conductor #6B, the outer side is the /9 electrode region. Fig. 3 is an insulator layer formed on the outer side of the target conductor portion 6B via the insulator layer composed of the substrate 2 and the signal wiring 3a, 3b. Part 6B and formed in the network diagram. A schematic cross section of the relationship of the electrode region 6A ❹ t ^ t Α 1ΛΛ is described as the thickness of the base material 2 of the insulator layer, and v=:. And 鸠 _ = circumference, preferably set the multiple of the thickness t between the horizontal axis, and the distance U (the layer - the characteristic of the vertical axis of the tiger wiring, such as the characteristic impedance body 6δ of the steel (conductor « stay 2 oiitilT.5, mesh-like guide and = area line diagram, when the wiring of the fine number wiring 3a, 3b is below, the Θ electrode area is opposite to the signal distance U 面 surface 3 / ^ the signal wiring 3a, 3b and the electrodeless area 6Α, 1 hour, capacitive coupling of the 5 electrode region to the signal wiring
W 13/19 201041459 速減少，而可提高利用網目狀導體部6B對信號配線進行 阻抗控制的精度。 另外，於層間厚度t=100//m以下之條件下，進行相同 測疋，前述彳§號配線3a、3b與/3電極區域6A之距離u為 ， 3t以下時，發現々電極區域對信號配線之電容耦合會急速 增大，4§號配線之特性阻抗降低，皆可確認到與圖4所示 之特性大致相同之結果。 ’' t雖然前述距離U之值愈大，電極區域6A所造成的 影響愈少，然而’隨著網目狀導體部6B之面積的增大，接 地層之直流電阻值亦增加，此增加會導致電路基板 ❺ 特性的惡化。 $ 因此，為了避免接地層之直流電阻值的增加，信號配 線3a、3b與/3電極區域6Α之距離υ宜為施以下，最好 為10t以下之範圍。 如此’將前述信號配線3a、3b與沒電極區域6A之距 - 離υ μ知述範m，可以調整信號配線 3a、3b之特性阻 几並滿足用以確保做為接地層6之低直流電阻值的條件。 、生圖5係本發明之第2實施形態之電路基板的積層構 另外’圖5中’對與已說明之圖1所示之各部屬相同 機能的部分^賦倾同符號，並魅地省略其詳細說明。 广：不之構成中’前述信號配線3a、3b係構成於膜 土 &材2上’且隔著用以覆蓋前述基底材2上之信號 配線3a、3b並呈右笛9如 八’弟2絕緣體層機能的絕緣層4a，於其上 面積層接地層6’藉此，構成微帶構造。 一圖5所7F之積層構成中，相較於圖1所示之積層構成， 係前述接地層6隔著缔结a 1 者、、邑緣層4a而與信號配線3a、3b相對。 14/19 201041459 2所示之接地層6 本構成中’亦採用圖 相同之作用效果。 的構成’故可得到 圖6係本發明之第3實施形態 ^。另外，圖6中，亦對與已說明之圖基板的積層構 同機，的部分，賦予相同符號，並適度地省略屬相 圖6所示之構成中，於具有 ^說明。 底材2的一側面積層有信號配線3a、狀之基W 13/19 201041459 The speed is reduced, and the accuracy of impedance control of the signal wiring by the mesh-like conductor portion 6B can be improved. Further, the same measurement was carried out under the condition that the interlayer thickness t=100//m or less, and the distance u between the above-mentioned 彳 号 wirings 3a and 3b and the /3 electrode region 6A was 3 t or less, and the 々 electrode region pair signal was found. The capacitive coupling of the wiring is rapidly increased, and the characteristic impedance of the wiring of the 4th is reduced, and the results substantially the same as those shown in Fig. 4 can be confirmed. '' Although the value of the aforementioned distance U is larger, the influence of the electrode region 6A is less, but as the area of the mesh-like conductor portion 6B increases, the DC resistance value of the ground layer also increases, which increases Deterioration of the characteristics of the circuit board ❺. Therefore, in order to avoid an increase in the DC resistance value of the ground layer, the distance between the signal wirings 3a, 3b and the /3 electrode region 6Α is preferably less than or equal to 10 t. Thus, the distance between the signal wirings 3a and 3b and the electrodeless region 6A can be adjusted, and the characteristic resistance of the signal wirings 3a and 3b can be adjusted to satisfy the low DC resistance for ensuring the ground layer 6. The condition of the value. 5 is a laminated structure of a circuit board according to a second embodiment of the present invention, and a part of the same function as that of the parts shown in FIG. 1 has been assigned the same symbol, and is omitted. Its detailed description. Wide: In the case of the configuration, the signal wirings 3a and 3b are formed on the membrane soil and the material 2, and the signal wirings 3a and 3b for covering the base material 2 are interposed and the right flute is as shown. The insulating layer 4a of the insulator layer function is formed on the upper layer of the ground layer 6' to form a microstrip structure. In the laminated structure of Fig. 5 and 7F, the ground layer 6 is opposed to the signal wirings 3a and 3b via the bonding layer a and the edge layer 4a, respectively, in comparison with the laminated structure shown in Fig. 1 . 14/19 201041459 2 The grounding layer 6 shown in this section also uses the same effect as the figure. The configuration of Fig. 6 is a third embodiment of the present invention. In addition, in Fig. 6, the same components as those of the laminated substrate of the above-described substrate are denoted by the same reference numerals, and the configuration shown in Fig. 6 is omitted as appropriate. One side area layer of the substrate 2 has a signal wiring 3a and a base of a shape
一側面配置有第！接地層6a ,而且 用的另 底材上之信號配線3a、3b之且有第=以覆盍刚述基 層4a積層第2接π μ、 ，、邑、、彖體層機能的絕緣 檟層弟2接地層6b。藉此，構成長條構造。 圖6所示之積層構成中，相較於圖i所 ^接地層，分別隔著具有絕緣體層機 土底材2及絕緣層4a，而與錢配線3相對峙。、 本構成之前述各接地層6a、6b，分別採用圖 接地層的構成，故可得到相同之作用效果。 ’、 另外，以上說明之實施形態的網目狀導體部6β， 成係如圖2所示配列著多數菱形開口，然而，該開口並未 限制為前述特定形狀，例如，亦可藉由配列圓 之形狀的開口部來形成。 八外 此外，前述實施形態之接地層亦可能為被施加電路基 準電位的構成，此外，也可能有各裝置之動作電源重疊= 情形。所以’施加於接地層之電位並無特別限制。 本發明之電路基板’適用於印刷電路板、軟性印刷電 路板、多層軟性印刷電路板等，尤其最適合使用於用以安 I高頻動作裝置之電路板。 15/19 201041459 【圖式簡單說明】 圖1係本發明之第1實施形態之電路基板的積層構造 圖。 圖2係使用於圖〗所示之電路基板之接地層及信號配 線之局部構成的透視圖。 圖3係說明於信號配線與接地層間夾設絕緣體層之關 係的剖面圖。 圖4係線路之阻抗對信號配線與沒電極之距離的關係 線圖。 ,圖5係採用圊2所示之接地層構成之本發明第2實施 形態之電路基板的積層構造圖。 圖6係採關2所示之接地層構成之本發明第3實施 形％、之電路基板的積層構造圖。 圖7係傳統電路基板之接地層及信號配線之局部構成 日勺遇》視圖。 【主要元件符號說明】 1 電路基板 2 基底材(絕緣體層） 3a、3b信號配線 4a ' 4b 絕緣層 5a 第1覆蓋層 5b 第2覆蓋層 6 接地層 6a 第1接地層 6b 第2接地層 16/19 201041459One side is equipped with the first! The grounding layer 6a and the signal wirings 3a and 3b on the other substrate have the second layer of the insulating layer 2 which is the second layer of the π μ, , 邑, and 彖 layer functions. Ground layer 6b. Thereby, a long strip structure is constructed. In the laminated structure shown in Fig. 6, the ground layer 2 and the insulating layer 4a having the insulator layer are opposed to the money wiring 3, respectively. In the respective ground layers 6a and 6b of the present configuration, the ground layer is formed, and the same operational effects can be obtained. Further, in the mesh-like conductor portion 6β of the embodiment described above, a plurality of rhombic openings are arranged as shown in FIG. 2, however, the opening is not limited to the specific shape, and for example, by arranging a circle The shape of the opening is formed. In addition, the ground layer of the above embodiment may be configured to apply a circuit reference potential, and there may be cases where the operating power supply of each device overlaps. Therefore, the potential applied to the ground layer is not particularly limited. The circuit board of the present invention is suitable for use in a printed circuit board, a flexible printed circuit board, a multilayer flexible printed circuit board, etc., and is particularly suitable for use in a circuit board for a high frequency operation device. 15/19 201041459 [Brief Description of the Drawings] Fig. 1 is a laminated structure diagram of a circuit board according to a first embodiment of the present invention. Fig. 2 is a perspective view showing a partial configuration of a ground layer and a signal wiring used in the circuit board shown in Fig. Fig. 3 is a cross-sectional view showing the relationship between the signal wiring and the ground layer. Figure 4 is a graph showing the relationship between the impedance of the line and the distance between the signal wiring and the electrode. Fig. 5 is a laminated structure diagram of a circuit board according to a second embodiment of the present invention which is constituted by a ground layer shown by 圊2. Fig. 6 is a plan view showing a laminated structure of a circuit board according to a third embodiment of the present invention, which is constituted by a ground layer shown in Fig. 2. Fig. 7 is a view showing the grounding layer of the conventional circuit board and the partial configuration of the signal wiring. [Description of main components] 1 circuit board 2 base material (insulator layer) 3a, 3b signal wiring 4a' 4b insulating layer 5a first cover layer 5b second cover layer 6 ground layer 6a first ground layer 6b second ground layer 16 /19 201041459
6A6A
6B 電極區域 網目狀導體部6B electrode area mesh conductor