201035352 六、發明說明： 【發明所屬之技術領域】 ;、本發明係有關於成膜裝置用元件。又，本發明還有關 化成於該成膜裝置用元件之附著膜的除去方法。 【先前技術】 各知已有對半導體元件等施加成膜處理。成膜，在此 Ο 〇 是指形成薄膜於對象物，成模的例子舉例如濺艘。、㈣是 反應室成為真空後，_邊導入氬氣氣體等惰性氣體，一邊 ^對象物母材與薄膜的材料㈣（响et)之間施加高電 恩’使離子化之惰性氣體在 物質附著於母材上形成薄膜/ 藉此使彈飛的成膜 進行如上述藏鍍之成膜裝置’在成膜過程中，從靶材 彈飛之成膜物質不只附著 象物上，亦附著於保持對象 物之70件和反應室内的裝 茲“ 町袈置各部分，均形成薄膜。因此， .^ ^ 複進仃成膜，而在保持對象物之元件 从士 卩位，形成薄膜積層之濺鍍膜等的附 者膜。該附著膜，因反覆的勃底田 视緞犋等的附 覆㈣履歷從成膜裝置的元件剝落， 疋附著於母材的膜缺陷的 笮"… 成因。因此，成膜裝置用元件， 乂、疋4除去附著膜再進行成膜。 除去形成於成膜裝詈爾_ 作〜…、7"件的附著膜的方法，可使用 子性除去方法和物理性除 ni ^ 方法等’但是會有再生作辈 時枯間和成膜裝置用元件的 乍業 易除去附荖眩而才貝耗問蟪。因而需提案可更容 约除去附耆膜而改良之成 置用7L件，和更有效率從成 201035352 膜裝置用元件除去附著膜的方法。 例如，專利文獻i即揭露，由心或 複數個結晶粒構成之小境和粉體的外表面，以 及Sn、或該等合金之低融點金 11 Sn η 7]c - ^ . ” ’ 、皮膜覆蓋為特徵之使用 朋展丨生人1複5材料作為成膜裝置用 、 該等水崩壞性A1複合材料，為 、術。然而’ 膜，其步驟繁雜。又，因為=::::成低融:的皮 安全性的疑慮而不是較佳的。、、’產生虱氣，有 專利文獻2,則揭露在形成薄心基材上之成 的構成元件，以比上述構成 … .„ J却材金屬電化性f低之 ,屬膜層以溶射、蒸著、賤 * 凰认支 的方法，在母材金 屬的表面形成為特徵之成膜裝 里m 兀件然而，該成膜裝 置用構成元件因須以溶#帛；# & 煩。 备 令射4形成金屬膜層，因此步驟麻 、 又’附著膜比母材金屬雷古以iB 屬* 柯金屬電位局的場合’必須對母材金 屬施加正電，且為了讓母妯 屬具有比附著膜或者第2金 、曰更貝的金屬必須施予不動筚 附著膜的處理步驟變得繁雜。的措施，因而使除 專利文獻3,則揭露在氣體氛圍成膜裳置中於盆進行 :之場所的附近使用之元件的表面，形成比該元件之構 ，更低硬度之材料組成之軟質膜的膜之成膜裝置用元 件〇 一專利文獻4,則揭露以部份穩定化氧化錯溶射膜覆蓋 兀件在薄膜形成或電漿處理過程後，置於溫度 ，濕度50%以上的環境下將該溶射膜從該元件剝離之部 201035352 份穩定化氧化錘溶射膜的剝離方法。 專利文獻5,則揭露在真空處理裝置中防止汙毕物之 附著於形成處理室之密閉空件内之真空處理裝置用的防著 板〃有以銘為主材質的薄板，藉由層間材複數枚積層之 積層構造，呈現露出壯能令主& „ 、曰 層之薄板剝離使次層露出為特徵之真空處理裝 置用的防著板。 、 專利文獻 [專利文獻1 ]特開2005-256063號公報 [專利文獻2]特表2004-074545號公報 [專利文獻3 ]特開平6_49626號公報 [專利文獻4]特開2004-346374號公報 [專利文獻5]特開2005-1 01435號公報 【發明内容】 〇 因為形成於成膜裳置用元件之附著膜的除去容易，开 已開發有預先形成易從基材剝離之預塗層之成模裝置用天 件。成膜裝置，在此是在進行成膜處理的過程中，反應室 内的壓力減壓至"為的程度，反應室内的溫度升還 ^抓的程度時，即使在這樣的場合，預塗層亦不^ 基材剝離。因此’習知技術中以溶射等於基材形成預塗声 預塗層的形成是麻煩的問題。又，習知技術中，預塗層難 以從基材剝離，附著膜的除去也是麻煩的問題。 本發明之目的即為鐘於上述課題，提供可容易除去形 201035352 成之附著臈之成獏裝置用元件。又 能有效率除去形成於成膜 之目的為提供 除去方法。 凡件之附著膜的附著膜的 J解決上述課題之本發明的_裝置用元_ 為“基材，與形成於前述基材之預塗層，直卜、特徵 層是由水性無機塗佈_成者， &則迷預塗 (㈠與前述預塗層的線熱膨脹熱躁脹率 .18X10-Vt 以下。 為 則Γ’本發明中’因為僅須在基材上塗裝水性|機塗你 二乾燥形成預塗層’作業簡單，而能提高成膜裝= 、生產性。又，由水性無機塗佈劑形成之預塗層 :水及/或水蒸氣處理預塗層後’能降低對 ： :處形成附著膜之成膜裝置用元件，藉由施加：二 單除去附著膜預塗層可以輕易剝離’除去該預塗層同時亦'簡 再者，本發明之成膜裝置用元件，因為由水性 佈劑形成之預塗層與基材的線熱膨脹率差小層 熱性提高。其結果，利用韻裝置的場合，成膜 件即：暴露於35。。。之高溫’亦能抑制預塗層從基材剝二 苗前述水性無機塗伟劑，較佳是包含含有骨材與，水5〇 f4%以上的溶媒者’又，骨材較佳是含有至少i種擇自由 =m長岩（Nepheline syenite)、二氧切、銘、 曰曰質系二氧化矽以及氮化硼所組成之群組者。再者，前 遠水性無機塗佈劑’較佳是還包含至少1種擇自由二氧^ 201035352 矽溶膠、水溶性丙烯酸樹脂、丙烯酸系聚合物以及水玻璃 所組成之群組者作為結合劑。 塗佈乾燥水性無機塗佈劑形成之預塗層的對基材的接 者強度較佳疋超過1 ON/mm2 ’且對施加煮沸處理後的預塗層 的基材之接著強度較佳是l〇N/min2以下。前述預塗層，較 佳係即使施加在放置於45(rc之氛圍氣i小時後，放冷至 25°C之熱處理1〇回，亦不會從基材剝離❶前述預塗層，即 〇使在壓力Upa以下的真空下，亦不會從基材剝離者為較 佳。 、尽㈣是形成於前述成縣置用元件之附著膜的除去 方法’亦包含在附著膜形成後’以水及/或水蒸氣處理預塗 層後，除去附著膜之附著膜的除去方法。 、。根據本發明，藉由在基材上塗佈水性無機塗体劑乾 附：膜輕易形成預塗層’藉此可得到容易除去形成之 〇 去方*丨：裝置用元件。又’根據本發明之附著膜的除 去方法’可有效率除去形成於成棋裝置用元件的附著膜。 【實施方式】 本發明之成膜裝置用元件 成於前述基材之預㈣，其 ^為八有基材，與形 佈劑形成者，且前《材㈣性無機塗 的線熱膨脹率…的差(|α::率二)與前述預塗層 接鍫郑阳碰 α2Ι)為UxlO—Vt以下。 接者說明構成本發明 前述基材，是-般常^ 元件的基材。 常使用於成膜裝置用元件者的話， 7 201035352 限制。前述基材舉例如紹、鐵、銅、不錢鋼 '欽 ^者，近年來隨著成膜裝置的大型化，成膜裝置用元 ，土材多半使用銘。X，成膜物質（例如使減鑛的成分） 2多使用銘1此’在成膜裝置用元件中，亦多有在銘基 材上形成銘組成之附著膜的組合。在此，銘因物理強度弱， 容易溶解於酸，因此在習知技術中，有容易傷及基材而除 去附者膜的困難。本發明之成膜裝置用元件，在如上述銘 基材上，形成純成之附著膜的場合等特別能發揮效果。 前述基材的線熱膨料，沒有特別限制，通常為8xlrvt 〜24x10-6/。〇。 接著說明構成本發明之成膜裝置用元件的預塗層。 前述預塗層’是由水性無機塗佈劑形成者。在本發明 中，因為是使用水性無機塗饰劑形成預塗層，可僅在基材 塗裝水性無機塗佈劑乾燥而形成預塗層。 層的作業非常容易，生產性亦優異。 心成預塗 前述水性無機塗佈劑若是包含有骨材（包括顏料）與水 為主成分（50質量％以上）之溶媒，則無特別限制。 前述骨材舉例如矽藻土、霞石正長岩、矽石、黑鉛等 的礦物；二氧化石夕（Sl〇2)、非曰曰曰質二氧切（si〇2)、Y(氧 化銘:Ah〇3)、氧化始(C〇3〇4)、氧化鎮⑽)、三氧化絡(c响 等的金屬氧化物；氮化领⑽）、氮化梦（Si3N〇等的金屬氮 化物；鉻鈦黃（⑴，Sb，Cr)〇2)、鋅鐵棕（（Zn，Fe)Fe2〇4)、鐵 鈦黃（（Ti，Sb，Ni)〇2)等的複合氧化物系顏料等。該等骨材 201035352 可早獨使用，亦可卩絲 μ廿田 丨了 2種以上並用。該等之中，本發明使用 無機塗佈劑較佳是至少1種擇自由碎、霞石正長 石一氧化石夕、銘、非晶質二氧化石夕以及氮化硕所組成之 群組者。 前述水性無機塗佈劑，亦可為在骨材與水為主成分之 溶媒中加人結合劑者。前述結合劑可為無機結合劑，有機 結合劑任-者。前述無機結合劑舉例如二氧化石夕溶膠 Ο 〇 (Sl〇2·χίΐ2〇)、銘溶液、水玻璃等。前述有機結合劑可舉例 如水溶性丙缔酸樹脂，丙烯酸系聚合物等。該等結合劑可 皁獨使用，亦可2種以上並用。該蓉 通等中’本發明使用之水 性無機塗佈劑較佳是還包含至少 i種擇自由二氧化矽溶膠 (colloidal silica")、+、、交 μ 工，χ 、 咖）水4丙烯酸樹脂、丙烯酸系聚合 物以及水玻璃所組成之群組者。 前述水性無機塗佈劑，亦可 J j含有水以外的溶媒。藉由 添加水以外的溶媒，可提升水性盔 …、機塗佈劑的塗佈性。前 述水以外的溶媒可舉例如甲醇、 ^ 乙醇、η-丙醇、i-丙醇、 η-丁醇等的醇類；乙二醇、二 一乙—醇、二丁二醇（butyl (hglycol)等的乙二醇類；丙 甲乙酮等的酮類；醋酸乙 基、醋酸丁基等的酯類。 又，前述水性無機塗佈劑， 除了剛述骨材，結合劑以 及溶媒之外，在不損及本發明 + ¾ β之效果的程度内，亦可包含 硬化促進劑、增黏劑、流平劑、 4泡劑、防鏽劑等的添加 劑。 前述硬化促進劑舉例如硫酴 μ駿納、硫酸鎂、硫酸鉀、硫 9 201035352 酸鈉、碳酸鈣等的碳酸鹽； 鋁、氫氧化鉀、氫氧化鈣等 、氣化鐵等的氯化物；石夕酸 酸鈣、硫酸鋁等的硫酸鹽；碳 氫氧化鈉、氫氧化鎂、氫氧化 的氫氧化物；氣化鈣、氯化鎂 鋰、矽酸鈉、矽酸鉀等的矽酸鹽；磷酸銘等的磷酸鹽等。 該等硬化促進劑可單獨使用，亦可2種以上併用。 前述水性無機塗佈劑，可以混合上述骨材，結合劑調 製而成，亦可使用市售品。再者，上述的骨材，結合劑等 混合調製為水性無機塗佈劑的場合，其配合比例，對骨材 100部較佳是溶媒20部~80部（更佳為25部〜7〇部），結人 劑1部〜2。部(更佳為3部〜15部），其他(硬化促進劑’二 部〜2 0部（更佳為〇部~ i 5部）。 前：水性無機塗佈劑塗佈於基材的方法沒有特別限 制，通常可採用與-般塗料相同的塗佈方法。塗佈方法你 如有空氣錢法，#空氣喷塗法，熱浸法，刷毛塗佈等= 法。於是，塗裝於基材上的水性無機塗佈#j可藉由乾燥， 燒成形成預塗層。再者，水性無機塗佈劑的乾燥.燒 可根據使用結合劑的種類’在脫離成份完成脫離時適：調 整，通常是在100〜500t，乾燥.燒成〇.卜24小時 ° 前述預塗層的厚度較佳是以上，争杜a 尺住疋5 // m以 上，再更佳是10//in以上，較佳是5〇〇/zm以下， 25Mm以下’再更佳*工。。㈣以下。預塗層的厚声更，广 以上，可充分塗佈基材上，使附著膜的除去變=是。1 又’預塗層的厚度若是500/zm以下的衽，士、时灿 各易。 裝置用一 升降溫時，預塗層不會輕易剝離，可降低水 凡 * ，無機塗佈劑 2〇l〇35352 的塗佈次數，減少塗佈成本。 月中％述基材的線熱膨脹率（α〗)與前述預塗層 的線熱膨脹率（α2)的差（| W α !·Ί| )為 18χ1〇-6/1：以下。前 述線熱膨脹率的差（| α | , 21)右在上述範圍内，對升降溫 、預塗層穩定，即使成膜裝置 „ 用疋件重複加熱冷部，預塗 也不會剝離。前述線熱膨脹率 ,. 服手的差（I α 1-α 2| )較佳是201035352 VI. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention relates to an element for a film forming apparatus. Further, the present invention relates to a method of removing an adhering film formed on an element for a film forming apparatus. [Prior Art] It is known that a film forming process is applied to a semiconductor element or the like. Film formation, where Ο 〇 refers to the formation of a film on an object, and an example of molding is, for example, a splash. (4) After the reaction chamber is vacuumed, an inert gas such as argon gas is introduced into the reaction chamber, and a high electric energy is applied between the target base material and the material (4) of the film (event) to cause the ionized inert gas to adhere to the substance. Forming a film on the base material / thereby forming a film forming device such as the above-mentioned film forming device. In the film forming process, the film forming material flying from the target material is not only attached to the object but also adhered to the film. 70 pieces of the object and the parts in the reaction chamber are formed into thin films. Therefore, .^ ^ is re-injected into the film, and the element of the object is held from the girth to form a thin film. Attachment film such as a coating film. The adhesion film is peeled off from the element of the film forming apparatus due to the reattachment of the reversed Bottom line satin or the like, and the film defect of the base material adheres to the base material. For the film forming apparatus, the film is removed by 乂 and 疋4, and then the film is formed. The method of removing the film formed by the film-forming device is used to remove the film, and the method of removing the film and the physical property can be used. In addition to the ni ^ method, etc. The components of the components used in the dry and film-forming devices are easy to remove and the glare is lost. Therefore, it is necessary to propose a 7L piece that can be modified to remove the film and improve the use of the device, and more efficient from 201035352 A method for removing an adhering film by an element for a membrane device. For example, Patent Document i discloses a small surface composed of a heart or a plurality of crystal grains and an outer surface of a powder, and Sn, or a low melting point of the alloy, gold 11 Sn η 7]c - ^ . ” ', the film cover is characterized by the use of Peng Zhansheng 1 complex 5 material as a film forming device, the water-disintegrating A1 composite material, for surgery. However, the film has many complicated steps. Also, because =:::: is a low-melt: skin safety concern rather than better. In the case of the production of helium, Patent Document 2 discloses that the constituent elements formed on the thin-core substrate are lower than the above-mentioned composition. The J is low in electrical conductivity f, and the film layer is sprayed and evaporated.贱* 认 的 的 , 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰 凰4The formation of the metal film layer, so the step of the hemp, and the 'adhesive film than the base metal, the thundering of the iB genus * ke metal potential board' must be positively applied to the base metal, and in order to let the female genus have a specific film In addition, in the case where the processing of the second gold or the bismuth metal has to be carried out, the processing step of the sturdy smear film is complicated, and therefore, in addition to Patent Document 3, it is disclosed in the place where the gas atmosphere is formed in the film. The surface of the component to be used in the vicinity of the component, the film forming device for the film of the soft film composed of a material having a lower hardness than that of the device, is disclosed in Patent Document 4, and is covered with a partially stabilized oxidized spray film. The piece is in the film formation or plasma After the process, the method of peeling off the 201035352 parts of the stabilized oxidized hammer spray film from the part where the spray film is peeled off from the element is placed in an environment of temperature and humidity of 50% or more. Patent Document 5 discloses the prevention of contamination in a vacuum processing apparatus. The anti-sliding plate for the vacuum processing device attached to the sealed blank forming the processing chamber has a thin plate mainly made of the main material, and the laminated structure of the plurality of layers of the interlayer material is used to reveal the strong and strong mains & „, the thin layer of the enamel layer is peeled off to expose the sub-layer to the anti-sliding plate for the vacuum processing device. [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. Hei. No. 2004-346. [Patent Document 5] Japanese Laid-Open Patent Publication No. 2005-1 01435. SUMMARY OF THE INVENTION [In the meantime, it is easy to remove the adhesion film formed on the film forming device, and it has been developed to form a precoat layer which is easily peeled off from the substrate. The mold device uses a piece of paper. In the film forming apparatus, in the process of performing the film forming process, when the pressure in the reaction chamber is decompressed to the extent that the temperature in the reaction chamber rises and is grasped, even in such a case, the precoat layer Nor does the substrate peel off. Therefore, the formation of a pre-coated acoustic precoat layer by spraying in the prior art is a problem. Further, in the prior art, it is difficult for the precoat layer to be peeled off from the substrate, and the removal of the adhering film is also a troublesome problem. An object of the present invention is to provide an element for forming a crucible device which can easily remove the shape of 201035352. Further, it is possible to efficiently remove the film formation for the purpose of providing a removal method. The attached film of the present invention which solves the above problems is a "substrate, and a precoat layer formed on the substrate, and the feature layer is coated with an aqueous inorganic coating" The original, & the fan pre-coating ((a) with the aforementioned pre-coating line thermal expansion thermal expansion rate. 18X10-Vt or less. For the case of Γ 'in this invention' because only the substrate needs to be coated with water-based You can dry to form a pre-coating, which is easy to operate, and can improve film-forming equipment and productivity. In addition, the pre-coating formed by an aqueous inorganic coating agent: water and/or steam can be reduced after pre-coating For: a component for a film forming apparatus in which an adhesive film is formed, which can be easily peeled off by applying a two-layer removal of the adhesive film precoating layer. 'Removing the precoat layer and also simplifying the film forming device component of the present invention Because the difference between the thermal expansion coefficient of the precoat layer formed of the aqueous cloth and the substrate is small, the thermal properties of the layer are improved. As a result, in the case of using the rhyme device, the film formation member is exposed to 35%. The precoat layer is peeled from the substrate, and the aqueous inorganic coating agent is preferably contained. The aggregate and the water are 5 〇f4% or more of the solvent'. In addition, the aggregate preferably contains at least i kinds of free = m long rock (Nepheline syenite), dioxane, ming, yttrium type cerium oxide and nitrogen Further, the pre-far aqueous inorganic coating agent' preferably further comprises at least one selected from the group consisting of dioxin 201035352 sol, water-soluble acrylic resin, acrylic polymer and water glass. The composition of the group is used as a binder. The coating strength of the precoat layer formed by coating the dried aqueous inorganic coating agent is preferably more than 1 ON/mm 2 ' and is applied to the precoat layer after the boiling treatment. The adhesive strength of the substrate is preferably l〇N/min2 or less. The precoat layer is preferably applied even after being applied to a heat treatment at 45 °C for an hour after being placed at 45 rc atmosphere. The precoat layer is not peeled off from the substrate, that is, it is preferably not peeled off from the substrate under a vacuum of pressure Upa or less. (4) is formed by the above-mentioned components of the prefecture. Membrane removal method 'also includes treatment with water and/or steam after the adhesion film is formed After the coating, the method of removing the adhering film of the adhering film is removed. According to the present invention, the precoat layer is easily formed by coating an aqueous inorganic coating agent on the substrate: the film is easily formed. In the following, the device for use in the apparatus for film formation can be efficiently removed by the method of removing the adhesive film according to the present invention. [Embodiment] The device for film forming apparatus of the present invention In the pre-(4) of the above-mentioned substrate, it is a substrate having eight substrates, formed with a cloth, and the difference in the coefficient of thermal expansion of the material of the former (four) inorganic coating (|α:: rate two) and the foregoing The coated joint Zhengyang touches α2Ι) is UxlO-Vt or less. The substrate which constitutes the aforementioned substrate of the present invention is a general-purpose element. If it is used in components for film forming equipment, 7 201035352 is limited. For example, in the case of the above-mentioned substrate, the film forming apparatus has been enlarged in recent years, and the material for the film forming apparatus and the soil material are mostly used. X, a film-forming substance (for example, a component for reducing ore). 2. In the element for film forming apparatus, a combination of an adhesive film of the same type is formed on the substrate. Here, since the physical strength is weak and it is easily dissolved in the acid, in the prior art, it is difficult to damage the substrate and remove the attached film. The element for a film forming apparatus of the present invention can particularly exhibit an effect when a pure adhering film is formed on the above-mentioned substrate. The linear thermal expansion of the aforementioned substrate is not particularly limited and is usually 8 x l rvt to 24 x 10 -6 /. Hey. Next, a precoat layer constituting the element for a film forming apparatus of the present invention will be described. The aforementioned precoat layer 'is formed of an aqueous inorganic coating agent. In the present invention, since the precoat layer is formed using an aqueous inorganic finish, the aqueous inorganic inorganic coating agent can be dried only on the substrate to form a precoat layer. The layer work is very easy and the productivity is excellent. The core-based inorganic coating agent is not particularly limited as long as it contains a solvent containing a bone material (including a pigment) and water as a main component (50% by mass or more). The above-mentioned aggregates are minerals such as diatomaceous earth, nepheline syenite, vermiculite, black lead, etc.; sulphur dioxide (Sl〇2), non-tank dioxygen (si〇2), Y (oxidation) Ming: Ah〇3), oxidation start (C〇3〇4), oxidation town (10), trioxide (metal oxide such as c ring; nitride (10)), nitriding dream (metal nitrogen such as Si3N〇) Compound oxide system of chrome titanium yellow ((1), Sb, Cr) 〇 2), zinc iron brown ((Zn, Fe) Fe2 〇 4), iron titanium yellow ((Ti, Sb, Ni) 〇 2) Pigments, etc. These aggregates 201035352 can be used alone or in combination with two or more types. Among the above, the inorganic coating agent used in the present invention is preferably a group consisting of at least one selected from the group consisting of free-crushing, nepheline-positive feldspar, oxidized stone, ceremonial, amorphous, oxidized, and cerium. . The aqueous inorganic coating agent may be one in which a binder is added to a solvent containing the aggregate and water as a main component. The aforementioned binding agent may be an inorganic binder or an organic binder. The above inorganic binders are, for example, a cerium oxide sol S S (Sl〇2·χίΐ2〇), a solution of a solution, a water glass or the like. The above organic binder may, for example, be a water-soluble propionic acid resin, an acrylic polymer or the like. These binders may be used alone or in combination of two or more. In the Rongtong et al., the aqueous inorganic coating agent used in the present invention preferably further comprises at least one type of free cerium dioxide sol (colloidal silica", +, 交, χ, 咖, water) 4 acrylic resin , a group of acrylic polymers and water glass. The aqueous inorganic coating agent may contain a solvent other than water. By adding a solvent other than water, the coating properties of the water-based helmet and the coating agent can be improved. Examples of the solvent other than the above water include alcohols such as methanol, ^ethanol, η-propanol, i-propanol, and η-butanol; ethylene glycol, di-ethyl alcohol, and dibutyl glycol (butyl (hglycol). Ethylene glycols such as glycerides; ketones such as propyl methyl ketone; and esters such as ethyl acetate and butyl acetate. The aqueous inorganic coating agent is the same as the binder, the binder, and the solvent. To the extent that the effect of the + 3⁄4 β of the present invention is not impaired, an additive such as a hardening accelerator, a tackifier, a leveling agent, a foaming agent, a rust preventive agent, or the like may be contained. Nano, magnesium sulfate, potassium sulfate, sulfur 9 201035352 sodium carbonate, calcium carbonate and other carbonates; aluminum, potassium hydroxide, calcium hydroxide, etc., vaporized iron and other chloride; calcium sulphate, aluminum sulfate, etc. Sulfate; hydroxide of carbon sodium hydroxide, magnesium hydroxide or hydroxide; citrate of calcium carbonate, lithium magnesium chloride, sodium citrate, potassium citrate; phosphate of the phosphate, etc. The accelerator may be used singly or in combination of two or more. The above aqueous inorganic coating agent may be mixed. The above-mentioned aggregate material may be prepared by using a binder, and a commercially available product may be used. When the above-mentioned aggregate, binder, or the like is mixed and prepared into an aqueous inorganic coating agent, the blending ratio is preferably 100 for the aggregate. It is 20 to 80 parts of the solvent (more preferably 25 parts to 7 parts), and 1 part to 2 parts of the agent (more preferably 3 parts to 15 parts), and others (hardening accelerator 'two parts to 2 0 0 The part (more preferably the crotch part - i part 5). The method of applying the aqueous inorganic coating agent to the substrate is not particularly limited, and the same coating method as the general coating can be usually used. Air money method, #air spray method, hot dip method, brush coating method, etc. Therefore, the aqueous inorganic coating #j coated on the substrate can be dried to form a pre-coat layer. Drying of the aqueous inorganic coating agent. The firing may be carried out according to the type of the binder used. When the detachment is completed, the tempering is carried out: adjustment, usually at 100 to 500 ton, drying, firing, simmering, 24 hours, the aforementioned pre-coating. The thickness is preferably the above, and it is more than 5 // m or more, more preferably 10//in or more, preferably 5〇〇/zm or less, 25Mm. The following is 'better and better*. (4) The following. The thicker sound of the pre-coating is more than the above, and can be fully coated on the substrate to make the removal of the adhesive film = yes. 1 and the thickness of the pre-coating layer is 500. /zm below the 衽,士,时灿易. When the device uses a lifting temperature, the pre-coating will not be easily peeled off, can reduce the number of coatings of water, inorganic coating agent 2〇l〇35352, reduce coating Cloth cost. The difference between the linear thermal expansion coefficient (α) of the substrate in the month and the linear thermal expansion coefficient (α2) of the precoat layer (| W α !·Ί| ) is 18χ1〇-6/1: or less. The difference in the linear thermal expansion coefficient (|α | , 21) is within the above range, and is stable to the temperature rise and fall, and the precoat layer is not peeled off even if the film forming apparatus „ repeatedly heats the cold portion with the crucible. The linear thermal expansion rate, the difference of the hand (I α 1-α 2| ) is preferably
Xl0 /°c以下，更佳是13xl0-Vt以下。 ❹ Ο “水性無機㈣劑㈣乾_叙預㈣的對基材 的接著強度，也就是在預塗層 产 禮I成之後，以水以及/或水蒸 =處理前的接著強度較佳是超…随2,更佳是 咖以上，再更佳是15NW以上。預塗層的對基材的 2強度若超過—，使用具備成㈣置用元件之成膜 2置進行成膜時，形成於成膜裝置用元件之附著膜，在預 塗層脫離同時受到抑制。 成膜裝置用元件施加考沸#柿你Μ ^ 也加煮/弗處理後的預塗層之對基材的 Μ強度較佳請W以下’更佳是8Ν/職2以下，再更 佳是5N/mm2以下。對成膜裝 用凡件施加煮沸處理後的預 塗層之對基材的接著強度若在丨 iU1N/mni以下，可更加容易 裝置用元件上形成的附著膜。再者，水性無機塗 、月塗佈乾無而形成之預塗層之對基材的接著強度，以及 成膜裝置用元件施加煮沸處理德 % ^ 〜理後之預塗層之對基材的接著 強度的測定方法將後述如下。 前述預塗層’較佳是對成膜裝置用元件施加放置於450 之風圍氣1小時後’放冷到25t之熱處理時，即使重覆 201035352 該熱處理ίο回’亦不會從基材剝離。如此預塗層耐熱性優 良，本發明之成膜裝置用元件，在成膜過程暴露於高溫的 場合亦能抑制預塗層剝離。又，施加上述熱處理iq回後之 預塗層對基材的接著強度較佳是超過應丽2。 前述預塗層是即使成膜裝置用元件在壓力i 〇pa以下 的真空中亦不會從基材剝 雕有马較佳。如上述預塗層耐直 二性優良’本發明之&胺 發月之成膜裳置用-件，在成膜過程中暴露 洽"同工下的場合’能更加抑制預塗層剝離。前述預 塗層較佳是在壓力01 Pa以 具二下不會剝離，更佳县 在壓力U”a以下的真空下不會剝離。 疋 預塗層的線熱膨脹率，對基材之接著強度等等，可藉 適當調整前述骨材，結合劑等的配合量調整之。 接著，說明本發明之附著媒的除去方法。 本發明之附著膜的除去方 罢田_认 疋將形成於則述成膜裝 置用兀件之附著膜除去的 ^ v ^ °方去，其特徵是在附著膜形成 後，以水及/或水蒸氣處理預 & 或 j只土增後，除去附著膜。 即本發明之附著膜的除去方 Β ^ ^ ^ 玄万去，是猎由水及/或水蒗 軋處理預塗層，對預塗声 …、 雇η 士么上 層之基材的接著強度降低後，預塗 層同％除去附著膜。藉此，因 « j, _ .. 馬备易從基材剝離預塗層， 基材不會耗損，可在短時間 至禮 、义 町1爭工易進仃附著膜的除去。 以刖述水及/或水蒸氣處 Η ^ 預塗層的方法，若是可降低 例如…主+ 、別限制。以水處理的方法， 例如，次潰在水中〇卜24小 Α. ^ ^ ΑΑ 、、方去，浸潰於水中1〜1 2 0 U弗的方法等。以水蒸氣 心&日]方法例如暴露於水茱 2U1U35352 乳1 12°分鐘的方法等。該等 法，特別是適人蚀、 、之中，較佳是以水處理的方 以前述任―稽/'貝於水中煮彿卜120分鐘的方法。 沒有特別限制，可：處理預塗層後，除去附著膜的方法 附著膜的方法，可：:基：的磨損的方法為佳。除去前述 波照射1〜1 2〇八 如反潰於水和熱水等的狀態以超音 Ο 0 除去的方法；：=Π;使用壓力70Mpa〜i5°Mpa的水搶 ^ . # , 4 0.3MPa〜0.6MPa的蒸氣搶除去的 ==理性衝擊剝離的方法。該等之中，二 法。、 …、等的狀態以超音波照射卜120分鐘的方 藉由本發明之附著膜的除去方法除去附著 可再次形成預塗層，而再次利用。 基材 本發明之成膜裝置用元件，適合的有，藉由蒸著法， 藏鑛法等的物理性氣相成長法（PVD法），化學性氣相成長 法（CVD法）形成薄膜之真空成膜裝置，特別適合的是真空 蒸著裝置’濺鍍裝置。 二 又，本發明之成膜裝置用元件的具體範例如平面直 角顯示器（Flat Panel Display)固定用框架，汽車元件固 定用框架等。 實施例 以下舉數個實施例具體說明本發明，惟本發明不限定 於下述實施例，在符合前.後述之主旨的範圍内可適當變 更實施，該等亦包含在本發明之技術範圍内。 [評價方法] 201035352 1. 線熱膨脹率 基材以及預塗層的線熱膨脹率，是使用熱機械分析裝 置（BrukerAXS公司製造、「了以4〇〇〇^」）測定的。 再者基材的線熱膨脹率的測定，是將切成必5mmx5_ 之尺寸的基材做為試驗片’預塗層的線熱膨脹率測定，是 將0 之模型注入士从么从& & 主疋入水性無機塗佈劑，乾燥，燒成後， 取出模型而製作之試驗片。 2. 塗佈乾燥水性無機塗佈劑而形成之預塗層的接著強度 如第1圖所不，將基材2與水性無機塗佈劑塗佈乾燥 而形成之預塗層3組成之成膜裝置用元件1上以娜薄板 4(5mmx7〇mmx0. 2難）使用接著劑（東亞合成公司製造、「Ar〇n Alpha」（註冊商標）），以接著5面為5_1〇随而黏著製作 試驗片。第1圖中的Χ，Υ以及ζ ’分別表示成膜裝置用元 件1，SUS薄板4以及接著面5之長产 。心抆度，X-40mm，Y = 7〇mm， Z=1Omm 。 製得的試驗片，使用萬能試驗機（東京試驗機社製 造、小型桌上試驗機「LSC—1/3"」）進行拉長斷裂試驗， 測定SDS薄板4從成膜裝置用元件丨剝離時_力w 力）’其即為預塗層之對基材的接著強度。再者’測定條件 如第i圖箭頭A所示之方向為拉長“，試驗機 頭固定成膜裝置用元件1，上部夾頭固定 。久 υύ溥板4，把； 速度為 30mm/miη。 、 再者，SUS薄板與接著劑的界面發生剝離時 的對基材之接著強度超過10N/mm2。 、土增 201035352 3. 煮沸處理後的接著強度 將基材上形成預塗層之成膜裝置用元件浸潰於水中， 以約1 0 0 °C煮沸處理1 〇分鐘。 該煮沸處理後的成膜裝置用元件，與上述「2.接著強 度」同樣地，測定預塗層對基材的接著強度。 4. 耐熱性試驗 對未施加以水及/或水蒸氣之處理的成膜裝置用元 ❹件’進仃1 0回合放置於保持在45(TC之電子爐内1小時後， 從電子爐取出在室溫的環境（25。〇放冷至25£>c之熱處理。 完成1G回的熱處理後，與上述「2•接著強度」同樣地，測 定預塗層之對基材的接著強度。 於是，接著強度超過10N/mm2(即sus薄板與接著劑的 界面發生剥離的場合）為「〇」，熱處理後，預塗層從基材 剝離的，或者接著強度在ΙΟΝ/mm2以下的場合為「χ」。 5. 耐真空性試驗 ❹ 將成膜裂置用元件置於真空反應室内，真空反應室内 的壓力降低到h Qxl().5pa，保持6()分鐘。之後，解除真空 反應室内的減壓’目視觀察成膜裝置用元件，確認預塗層 是否從基材剝離。於是，預塗層完全沒有剝離者為「〇」， 一部分的預塗層剝離者為「x」。 [成膜裝置用元件的製作] 製造例1 將作為基材的A14 的Αί式驗片（4cm平方、厚度2mm)，以 WA#100施加表面砂磨虚 /潛慝理。在施加前述基材的砂磨處理的 201035352Below Xl0 / °c, more preferably 13xl0-Vt or less. ❹ Ο “Aqueous Inorganic (Four) Agent (4) Dry _ Pre- (4) The adhesion strength to the substrate, that is, after the pre-coating is completed, the water and/or water is steamed = the bonding strength before treatment is preferably super ... with 2, more preferably more than coffee, more preferably 15 NW or more. If the strength of the precoat layer to the substrate exceeds 2, the film formation is carried out using the film forming device (4), and formed in the film. The film attached to the film forming device is inhibited at the same time as the precoat layer is detached. The film forming device is coated with the component. #柿你Μ ^ The precoat layer after the boiled/fro treated is also stronger than the base material. The best strength is 8 Ν / job 2 or less, and more preferably 5 N / mm 2 or less. The adhesion strength of the substrate after applying the boiled precoat to the film-forming device is 丨iU1N/ In the case of mni or less, the adhesive film formed on the device can be more easily formed. Further, the adhesion strength of the base material formed by the aqueous inorganic coating or the monthly coating, and the coating device are subjected to boiling treatment. The method of measuring the adhesion strength of the base material of the pre-coating layer of the first embodiment will be described later. The pre-coating layer is preferably applied to the film forming device for a heat treatment of the wind for a period of 1 hour after being placed in a wind-proof atmosphere of 450, and even if the heat treatment is repeated for 201035352, the heat treatment will not peel off from the substrate. The precoat layer of the present invention is excellent in heat resistance, and the element for film forming apparatus of the present invention can suppress the peeling of the precoat layer even when the film forming process is exposed to a high temperature. Further, the precoat layer after the heat treatment is applied back to the substrate The bonding strength is preferably higher than that of Yingli 2. The precoat layer is preferably not peeled off from the substrate even if the film forming device member is in a vacuum below the pressure i 〇pa. It is excellent in the directness and the rightness of the present invention, and the exposure of the amine to the moon in the film formation process can be more effective in suppressing the peeling of the precoat layer during the film formation process. It is better that the pressure will not be peeled off at the pressure of 01 Pa, and the better county will not peel under the vacuum below the pressure U"a.线 The thermal expansion coefficient of the precoat layer, the adhesion strength to the substrate, and the like can be adjusted by appropriately adjusting the blending amount of the above-mentioned aggregate, binder, and the like. Next, a method of removing the adhering medium of the present invention will be described. The removal film of the present invention is formed by removing the film attached to the film for the film forming apparatus, and is characterized by water and/or after the formation of the adhesive film. After the steam treatment pre-amp; or j soil increase, the attached film is removed. That is, the removal method of the adhesive film of the present invention is ^ ^ ^ Xuan Wan, which is a pre-coating process by water and/or water rolling, and the bonding strength of the substrate of the upper layer of the pre-coating sound... Thereafter, the precoat layer was removed in the same manner as %. Therefore, because «j, _ .. Ma Beiyi peels off the pre-coating from the substrate, the substrate is not depleted, and it is possible to remove the adhesive film in a short time from the ceremony. To narrate the water and/or water vapor Η ^ pre-coating method, if it can be reduced, for example, ... main +, other restrictions. The method of water treatment, for example, the method of smashing in the water for 24 hours ^. ^ ^ ΑΑ , , ,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The method of using water vapor heart & day method, for example, exposure to leeches 2U1U35352 milk 1 12 ° minutes, etc. Such methods, particularly those suitable for human eclipse, are preferably water-treated. The method of boiling the buds in water for 120 minutes. There is no particular limitation, and the method of attaching the film after the pre-coating is applied. The method of attaching the film may be: a method of: wear of the base: preferably. The method of removing the above-mentioned wave irradiation 1~1 2〇8 as the state of water and hot water is removed by supersonic Ο 0; :=Π; using water of pressure 70Mpa~i5°Mpa to grab ^. 4 , 4 0.3 The method of removing the steam of MPa to 0.6 MPa == rational impact peeling. Among these, the second method. The state of ..., etc. is irradiated by ultrasonic waves for 120 minutes. The adhesion is removed by the method of removing the adhesive film of the present invention. The precoat layer can be formed again and reused. The substrate of the film forming apparatus of the present invention is suitably formed by a physical vapor phase growth method (PVD method) such as a vapor deposition method or a mining method, or a chemical vapor phase growth method (CVD method). A vacuum film forming apparatus is particularly suitable for a vacuum evaporation apparatus 'sputtering apparatus. Further, the specific components of the film forming apparatus of the present invention are, for example, a flat panel display fixing frame, an automobile component fixing frame, and the like. The present invention is specifically described by the following examples, but the present invention is not limited to the following examples, and may be appropriately modified within the scope of the spirit of the present invention, which is also included in the technical scope of the present invention. . [Evaluation method] 201035352 1. Linear thermal expansion coefficient The linear thermal expansion coefficient of the substrate and the precoat layer was measured using a thermomechanical analysis device (manufactured by Bruker AXS Co., Ltd., "4"). In addition, the linear thermal expansion coefficient of the substrate is measured by measuring the linear thermal expansion rate of the substrate which is cut into a size of 5 mm x 5 mm as the test piece 'precoat layer, and is a method of injecting a model of 0 into the &&& The test piece prepared by taking out the model after taking out the aqueous inorganic coating agent, drying, and baking. 2. The adhesive strength of the precoat layer formed by applying the dried aqueous inorganic coating agent is as shown in Fig. 1, and the film is formed by coating the substrate 2 with the aqueous inorganic inorganic coating agent to form a precoat layer 3 On the device component 1, an adhesive (manufactured by Toagosei Co., Ltd., "Ar〇n Alpha" (registered trademark)) was used as the thin plate 4 (5 mm x 7 mmx0. 2), and the adhesion test was carried out by 5_1 接着 followed by 5 faces. sheet. In the first drawing, Χ, Υ and ζ' respectively indicate the film forming apparatus member 1, the SUS thin plate 4, and the succeeding surface 5. Heart rate, X-40mm, Y = 7〇mm, Z=1Omm. The obtained test piece was subjected to an elongation fracture test using a universal testing machine (manufactured by Tokyo Test Instruments Co., Ltd., small table tester "LSC-1/3""), and the SDS sheet 4 was measured for peeling from the film forming apparatus member. _ force w)) which is the adhesion strength of the precoat to the substrate. Further, the measurement conditions are as shown in the direction indicated by the arrow A in Fig. i, and the test head is fixed to the film forming device 1 and the upper chuck is fixed. The long plate 4 is placed at a speed of 30 mm/miη. Further, when the interface between the SUS thin plate and the adhesive is peeled off, the adhesion strength to the substrate exceeds 10 N/mm 2 . , 2010: 201035352 3. Sublimation strength after boiling treatment A film forming apparatus for forming a precoat layer on a substrate The component was immersed in water and boiled at about 100 ° C for 1 〇 minutes. The component of the film forming apparatus after the boiling treatment was measured for the substrate by the precoat layer in the same manner as the above "2. Then the intensity. 4. Heat resistance test. For the film forming apparatus without water and/or water vapor treatment, the element is placed in a 10 round and placed in an electronic furnace at 45 °C for 1 hour. The heat treatment at room temperature (25. 〇cooling to 25 £>c. After completion of the heat treatment at 1 G back, the adhesion strength of the precoat layer to the substrate was measured in the same manner as in the above "2. Therefore, if the strength exceeds 10 N/mm 2 (that is, when the interface between the sus sheet and the adhesive is peeled off), it is "〇", and after the heat treatment, the precoat layer is peeled off from the substrate, or the strength is ΙΟΝ/mm2 or less. “χ.” 5. Vacuum resistance test 置于 Place the film forming unit in the vacuum chamber, and reduce the pressure in the vacuum chamber to h Qxl().5pa for 6 () minutes. Then, release the vacuum chamber. The pressure reduction was carried out by visually observing the components for the film forming apparatus, and it was confirmed whether or not the precoat layer was peeled off from the substrate. Thus, the precoat layer was not peeled off at all, and some of the precoat layer peeled off was "x". Production of element for membrane device] Production example 1 A14 of the test piece Αί formula (4cm square, 2mm thickness), is applied to the surface of WA # 100 sanding virtual / physical latent evil thought. 201035352 applied to the substrate in a sand processing
面，使用噴槍（明治機械製造所製造、「M 以6Gf量部成為骨材’二氧切溶膠12質量 合劑’水則量部作為溶制水性無機塗佈劑。 之水性無機塗佈劑，在15〇t使其乾燥i 、 (厚度2。，得到成膜 ’也成預塗層 人狀衣直用兀件No. 1。對_ p 裝置用元件No i，進扞褚&思 侍之成膜 試驗以及射直* 接著強度的測定’耐熱性 忒驗以及耐真空性試驗。其結果示於表i。 製造例2 量邻除/變更水性無機塗佈劑為含有以霞石正長岩42質 質^ f量部、絡鈦黃4f量部、非晶質二氧化石夕2 旦立 乳化姑4質量部作為骨材，丙婦酸系聚合物3質 里部作為結合劑，水3 5曾旦：&β ^(七炎+ 部 冑水35質里部作為溶媒’氫氧化鈣5質量 。之水性無機塗佈劑作為硬化促㈣之外 樣地，製得成膜裝置用元件Νο·2。對製得之出“例1同 .Μ η 耵I侍之成膜裝置用元 耐直0*行預塗層之接著強度的測定，耐熱性試驗以及 才真二性试驗。其結果示於表1。 製造例3 除了變更水性無機塗佈劑為含有以1_ Η質量 2黑们質量部作為骨材，水溶性丙稀酸樹脂5質量部 為結合劑，水64質量部、丁基二乙二醇3質量部作為溶 含㈣_ 15質量部之水性無機塗佈劑作為硬化促進 2外’與製造例1同樣地’製得成膜裝置用^件No. 3。 ^付之成膜裝置用元件N〇.3,進行預塗層之接著強度的 心’耐熱性試驗以及耐真空性試驗q結果示於表卜 201035352 製造例4 部、無機塗伟劑為含有以二氧化…量 l 系顏枓(Fe2〇3/Cr2〇3/si〇2)8質量部、非晶 貝-虱化⑪3質量部作為骨材，水33 f 部作為溶媒，含有磷 乙醇3質里 硬化… 磷酸銘7質置部之水性無機塗佈劑作為 硬化促進劑之外，鱼盡 .Ν , 坆例1同樣地，製得成膜裝置用元 件No. 4。對製得之成膜 、裝置用7^件N〇.4,進行預塗層之接 Ο 的測疋，耐熱性試驗以及耐真空性試驗。其結果示 於表1。 、 製造例5 除了變更水性無機塗佈劑為以氣化叙作為骨材，含有 之、、·。5劑之水性無機塗佈劑之外，與製造例1同樣 也製侍成膜裝置用元件No. 5。對製得之成膜裝置用元件 Ν〇· 5,進行預塗層之接著強度的測定耐熱性試驗以及耐 真空性試驗。其結果示於表1。 〇 [薄膜的形成] 對製得之成膜裝置用元件N0_丨〜5以及A1試驗片（施加 與製造例1同樣地砂磨處理），使用UBMS濺鍍裝置（神戶製 鋼所製這、「UBMS503」）以濺鍍形成A1層（附著膜）。 層在成膜裝置用元件N〇1〜5是形成於預塗層之上面，在 A1試驗片則是形成於施加砂磨處理的面上。 [附著膜的除去] 將形成A1層（附著膜）之成膜裝置用元件Ν〇·丨〜5以及 Α1试驗片，放入水中於燒瓶内煮沸1〇分鐘。接著，將煮 201035352 彿處理後的成膜裝置^件Nq小5以及ai試驗片，浸潰 、C的'皿水中之狀態’使用超音波洗淨器（AS ONE公司 製1^ US —3A」）照射超音波（頻率4GkHz)lG分鐘。 ’、、、射超θ波之後，目視觀察成膜裝置用元件n〇. 以 及㈣，確認附著膜是否除去以下列的基準評價之。 〇.完全剝離，或者幾近剝離而容易除去。 X :與處理前相同狀態，不易除去。” 【表1】 基材 預塗層 耐熱性 種類 耐真空性 膜的除去 成膜裝置用元件No. 線熱膨脹率α | (xi〇-6/°c) 線熱膨脹率α2 (χΗΓ6/1^) 線熱膨脹率差I αι_ 接著強度(N/mm2) — . 煮沸後的接著強度(N/nun2)In the surface, a water-based inorganic coating agent was used as a solvent-based inorganic coating agent by using a spray gun (manufactured by Meiji Machinery Co., Ltd., "M is a 6 Gf amount to become an aggregate material, a dioxo-sol sol 12 mass mixture agent" water amount. 15〇t to dry it i, (thickness 2. Get filmed 'also used as a pre-coated man-made garment with a piece No. 1. For the _ p device element No i, enter the 捍褚 & Film formation test and directing * subsequent strength measurement 'heat resistance test and vacuum resistance test. The results are shown in Table i. Production Example 2 Quantity omission/change of aqueous inorganic coating agent containing nepheline syenite 42 Quality ^ f amount, complex titanium yellow 4f amount, amorphous dioxide dioxide 2 2 denier emulsified 4 mass part as the bone material, the glycerol acid polymer 3 inner part as a binder, water 3 5 Zeng Dan: &β ^ (seven inflammation + part of the water 35 in the middle of the mass as a solvent 'calcium hydroxide 5 mass. The aqueous inorganic coating agent as a hardening (4) sample, the film forming device components Νο ·2. Determination of the subsequent strength of the pre-coating of the filming device for the filming device of Example 1 and Μ η 耵I The results are shown in Table 1. Production Example 3 In addition to changing the aqueous inorganic coating agent, the mass portion containing 1 Η mass 2 is used as the aggregate, and the water-soluble acryl resin is 5 parts by mass. In the film forming apparatus, the water-based inorganic coating agent containing the (fourth) to 15 parts by mass is used as the bonding agent, and the water-based inorganic coating agent containing the (four)- 15 mass portion is used as the curing agent. ^件No. 3. ^The film forming device N〇.3, the core strength of the pre-coating strength test and the vacuum resistance test q results are shown in Table 201035352 Manufacturing Example 4, inorganic The coating agent contains 8 parts by mass of bismuth oxide (Fe2〇3/Cr2〇3/si〇2), 113 parts of amorphous shell-deuterated as the aggregate, and 33 f of water as the solvent. In the case of the phosphorus-containing ethanol, the film-forming device No. 4 was obtained in the same manner as in Example 1, except that the water-based inorganic coating agent of the phosphoric acid was used as the hardening accelerator. For the film formation, the device is made of 7 pieces of N〇.4, the pre-coating is tested, the heat resistance test and the vacuum resistance The test results are shown in Table 1. Production Example 5 In addition to changing the aqueous inorganic coating agent, it is an aqueous inorganic coating agent containing five components, which are contained in the gasification, and the production example. (1) The film forming apparatus element No. 5 was also prepared. The film forming apparatus component Ν〇·5 was used to measure the adhesion strength of the precoat layer and the vacuum resistance test. The results are shown in Table 1. 形成 [Formation of film] The NBMS sputtering apparatus (manufactured by Kobe Steel Co., Ltd.) was used for the film forming apparatus for the film forming apparatus N0_丨~5 and the A1 test piece (applying the same sanding treatment as in Production Example 1). This, "UBMS503") is formed by sputtering to form an A1 layer (adhesive film). The layers N to 1 to 5 for the film forming apparatus are formed on the upper surface of the precoat layer, and the A1 test piece is formed on the surface to which the sanding treatment is applied. [Removal of Adhesive Film] The film forming apparatus for the A1 layer (adhesive film) was formed into a test piece of Ν〇·丨~5 and Α1, and placed in water and boiled in a flask for 1 minute. Next, the film forming apparatus of the 201035352 Buddha treatment method Nq small 5 and the ai test piece, the state of the impregnation, and the 'state of the dish' of the C use the ultrasonic cleaner (1 US US-3A manufactured by AS ONE) ) Irradiation (frequency 4 GkHz) lG minutes. After the super-theta wave was shot, the film forming apparatus element n〇. and (4) were visually observed, and it was confirmed whether or not the adhesion film was removed and evaluated according to the following criteria. 〇. Completely peeled off, or nearly peeled off and easily removed. X : The same state as before the treatment, and it is difficult to remove. [Table 1] Substrate pre-coating heat-resistant type Vacuum-resistant film removal element for film forming apparatus No. Linear thermal expansion coefficient α | (xi〇-6/°c) Linear thermal expansion coefficient α2 (χΗΓ6/1^) Line thermal expansion difference I αι_ followed by strength (N/mm2) — . Bound strength after boiling (N/nun2)
成膜裝置用元件No. 1〜3,具古 形成之預塗屏、有基材與水性無機塗佈 預塗層，别边基材的線熱膨脹率（αι)盘此、+、 的線熱膨脹率（α2)的差（丨’、剛述預塗 望士、… 1 α 2丨）為lsxurvt：以π 荨成骐裝置用元件Νο.卜3，預 Lu下。 . 預塗層的耐熱性以及耐亩+ 優良，且煮沸處理後，僅在 ^真二 傻值在水中照射超 18 1 J fe易除 201035352 附著膜。 成膜装置用元件Ν〇· 4，線熱膨脹率的差（| α ,-〇： 2| )為 18x1 0 / C以下，預塗層的耐熱性以及耐真空性優良。但 是，煮沸處理後的接著強度超過1 ΟΝ/mm2，即使在水中照射 超音波亦無法除去附著膜。Film forming apparatus No. 1 to 3, an anciently formed pre-coated screen, a substrate and an aqueous inorganic coating pre-coating, and the linear thermal expansion coefficient (αι) of the substrate, the linear thermal expansion of +, The difference of the rate (α2) (丨', just pre-painted Wangshi, ... 1 α 2丨) is lsxurvt: π 荨 into the device for the device Νο. Bu 3, pre-Lu. The heat resistance of the pre-coating and the excellent resistance to mu+, and after boiling treatment, only in the true two silly values in the water, super 18 1 J fe easy to remove 201035352 attached film. In the film forming apparatus, 差·4, the difference in linear thermal expansion coefficient (|α , -〇: 2| ) is 18x10 / C or less, and the heat resistance and vacuum resistance of the precoat layer are excellent. However, the subsequent strength after the boiling treatment exceeded 1 ΟΝ/mm2, and the attached film could not be removed even if the ultrasonic wave was irradiated in water.
成膜裝置用元件No. 5，是線熱膨脹率的差（I α广^ 2丨） 超過18x10 V°C的場合，、線熱膨服率差過Α，因此在施加 熱處理10回時，預塗層從基材剥離了。 △1 °式驗片’在煮彿處理後，即使在水中照射超音波亦 無法除去附著膜。 產業上可利用性 適用於濺鍍裝置等的成膜 本發明之成膜裝置用元件， 裝置。 【圖式簡單說明】 弟1圖係繪示接著強唐兮、齡_ & 者強以驗 【主要元件符號說明】 卜成膜裝置用元件； 2-基材； 3〜預塗層； 4〜SUS薄板； 5〜接著面； A〜拉長方向； 19 201035352 x〜成膜裝置用元件的長度； Y~SUS薄板的長度； Z〜接著面的長度。 20In the film forming apparatus, the component No. 5 is a difference in linear thermal expansion coefficient (I α wide ^ 2 丨). When the temperature exceeds 18 x 10 V ° C, the linear thermal expansion rate is too poor. Therefore, when the heat treatment is applied for 10 times, The coating was peeled off from the substrate. The Δ1 ° type test piece 'after the boiled Buddha treatment, the attached film could not be removed even if the ultrasonic wave was irradiated in water. Industrial Applicability It is suitable for film formation of a sputtering apparatus or the like, and an apparatus and device for a film forming apparatus of the present invention. [Simple description of the drawing] The brother 1 is shown as follows: Qiang Tang, age _ & strong to test [main component symbol description] Bu filming device components; 2-substrate; 3 ~ pre-coating; 4 ~ SUS thin plate; 5 ~ the following surface; A ~ elongated direction; 19 201035352 x length of the component for the film forming device; Y ~ SUS thin plate length; Z ~ the length of the back surface. 20