TW201026619A - Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display - Google Patents

Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display Download PDF

Info

Publication number
TW201026619A
TW201026619A TW098134578A TW98134578A TW201026619A TW 201026619 A TW201026619 A TW 201026619A TW 098134578 A TW098134578 A TW 098134578A TW 98134578 A TW98134578 A TW 98134578A TW 201026619 A TW201026619 A TW 201026619A
Authority
TW
Taiwan
Prior art keywords
substrate
glass substrate
line
region
laser
Prior art date
Application number
TW098134578A
Other languages
English (en)
Chinese (zh)
Inventor
Masayuki Kamei
Masayuki Nakayama
Hideyasu Shamoto
Original Assignee
Linkstar Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008268706A external-priority patent/JP2010095414A/ja
Priority claimed from JP2008321300A external-priority patent/JP5280825B2/ja
Application filed by Linkstar Japan Co Ltd filed Critical Linkstar Japan Co Ltd
Publication of TW201026619A publication Critical patent/TW201026619A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW098134578A 2008-10-17 2009-10-13 Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display TW201026619A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008268706A JP2010095414A (ja) 2008-10-17 2008-10-17 ディスプレイ用マザーガラス基板および脆性材料基板の切断方法、ディスプレイの製造方法
JP2008321300A JP5280825B2 (ja) 2008-12-17 2008-12-17 基板テーブルおよびそれを用いたレーザ加工装置

Publications (1)

Publication Number Publication Date
TW201026619A true TW201026619A (en) 2010-07-16

Family

ID=42106392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098134578A TW201026619A (en) 2008-10-17 2009-10-13 Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display

Country Status (2)

Country Link
TW (1) TW201026619A (ja)
WO (1) WO2010044217A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102617030A (zh) * 2012-04-06 2012-08-01 深圳市巨潮科技有限公司 一种带液晶的液晶面板切割方法
CN102964059A (zh) * 2011-08-30 2013-03-13 三星钻石工业股份有限公司 玻璃基板的刻划方法及加工装置
CN103170729A (zh) * 2011-12-20 2013-06-26 Ap***股份有限公司 激光处理装置及其控制方法
US11048137B2 (en) 2011-12-12 2021-06-29 View, Inc. Thin-film devices and fabrication
TWI738174B (zh) * 2010-11-08 2021-09-01 美商唯景公司 電致變色窗製造方法
TWI766993B (zh) * 2017-09-29 2022-06-11 日商三星鑽石工業股份有限公司 多層脆性材料基板的製作方法及製作系統
US11953798B2 (en) 2011-12-12 2024-04-09 View, Inc. Electrochromic laminates

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5522516B2 (ja) * 2009-12-07 2014-06-18 日本電気硝子株式会社 板状ガラスの切断方法及びその切断装置
CN102126229B (zh) * 2010-10-27 2012-07-04 意力(广州)电子科技有限公司 用于触摸屏半成品一次切割成型的切割机
CN102690051A (zh) * 2011-03-25 2012-09-26 海邦科技股份有限公司 玻璃板材的加工装置及方法
KR101623026B1 (ko) * 2014-10-06 2016-05-20 한국미쯔보시다이아몬드공업(주) 접합 기판의 커팅 방법
KR20200106755A (ko) * 2019-03-05 2020-09-15 코닝 인코포레이티드 유리 라미네이트 기판의 가공 장치, 이를 이용한 가공 방법 및 절단 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003002676A (ja) * 2001-06-19 2003-01-08 Seiko Epson Corp 基板の分割方法及び液晶装置の製造方法
JP4175636B2 (ja) * 2003-10-31 2008-11-05 株式会社日本製鋼所 ガラスの切断方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738174B (zh) * 2010-11-08 2021-09-01 美商唯景公司 電致變色窗製造方法
US11772366B2 (en) 2010-11-08 2023-10-03 View, Inc. Electrochromic window fabrication methods
CN102964059A (zh) * 2011-08-30 2013-03-13 三星钻石工业股份有限公司 玻璃基板的刻划方法及加工装置
CN102964059B (zh) * 2011-08-30 2015-08-19 三星钻石工业股份有限公司 玻璃基板的刻划方法及加工装置
US11048137B2 (en) 2011-12-12 2021-06-29 View, Inc. Thin-film devices and fabrication
US11953798B2 (en) 2011-12-12 2024-04-09 View, Inc. Electrochromic laminates
CN103170729A (zh) * 2011-12-20 2013-06-26 Ap***股份有限公司 激光处理装置及其控制方法
CN103170729B (zh) * 2011-12-20 2015-08-05 Ap***股份有限公司 激光处理装置及其控制方法
CN102617030A (zh) * 2012-04-06 2012-08-01 深圳市巨潮科技有限公司 一种带液晶的液晶面板切割方法
CN102617030B (zh) * 2012-04-06 2015-05-20 深圳市巨潮科技股份有限公司 一种成品的液晶面板切割方法
TWI766993B (zh) * 2017-09-29 2022-06-11 日商三星鑽石工業股份有限公司 多層脆性材料基板的製作方法及製作系統

Also Published As

Publication number Publication date
WO2010044217A1 (ja) 2010-04-22

Similar Documents

Publication Publication Date Title
TW201026619A (en) Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display
US10391588B2 (en) Method and system for scribing brittle material followed by chemical etching
JP6505773B2 (ja) 透明材料の内部でレーザーフィラメンテーションを実行する方法および装置
JP5822873B2 (ja) レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
JP5864988B2 (ja) 強化ガラス板切断方法
EP3535085B1 (en) Method of laser processing laminate workpiece stacks with forming a contour line in a first tranparent workpiece and then separating a resin layer from the first transparent workpiece
CN102581494B (zh) 加工对象物切断方法
JP5138219B2 (ja) レーザ加工方法
JP5280825B2 (ja) 基板テーブルおよびそれを用いたレーザ加工装置
US20080061043A1 (en) Scribing Method for Brittle Material and Scribing Apparatus
TW201536460A (zh) 顯示玻璃成分的雷射切割
KR20120098869A (ko) 레이저 가공과 스크라이빙 시스템 및 방법
JPWO2005098915A1 (ja) レーザ加工方法及び半導体チップ
JP5037082B2 (ja) レーザ加工方法及びレーザ加工装置
CN104364208A (zh) 玻璃基板的切割方法及玻璃基板的制造方法
JP5590642B2 (ja) スクライブ加工装置及びスクライブ加工方法
JP2013087000A (ja) レーザスクライブ装置
KR200415435Y1 (ko) 직립형 ｌｃｄ 기판용 유리판절단장치
JP2016128362A (ja) ガラス板の切断方法