201019401 六、發明說明： 【發明所屬之技術領域】 本發明係關於半導體構件製造方法與使用該等方法之 黏著帶。 【先前技術】 —般而言，1C (積體電路Integrated Circuit)卡、行 動電話、及 PDA(個人數位助理 Personal Digital Assistants) 等電子機器，搭載著已形成電路圖案之晶片狀的電子零件。 φ 半導體構件係藉由個別分割形成複數個電路圖案於矽 或鎵-砷等之半導體晶圓、絕緣基板等的半導體構件所形成 者，由於電子機器之薄型化，電子零件亦正進行薄型化（參 照專利文獻1 )。 專利文獻1:特開2 00 3-257893號公報 【發明說明】 然而，在藉由具有鑽石硏磨粒之切塊刀片將變薄之半 導體構件單片化的情況下，會有產生半導體構件之破裂等 ❹ 情況。 根據本發明，提供一種半導體構件製造方法，其包含 在半導體構件上塗布接著性樹脂，經由接著性樹脂將半導 體構件暫時固定於固定用夾具並單片化的單片化步驟；在 已單片化之半導體構件上貼合黏著帶的貼合步驟；從浸漬 於介於接著性樹脂之接著力降低溫度X、與黏著帶之熱收 縮溫度Y間之溫度範圍的液體並已單片化之半導體構件， 剝離接著性樹脂及固定用夾具，將半導體構件轉印至黏著 201019401 帶的轉印步驟；與拾取黏著帶上之已單片化之半導體構件 的拾晶步驟。 又，根據本發明，提供一種半導體構件製造方法，其 包含在半導體構件上塗布接著性樹脂，經由接著性樹脂將 半導體構件暫時固定於固定用夾具並單片化的單片化步 驟；在已單片化之半導體構件上貼合黏著帶的貼合步驟； 從浸漬於介於接著性樹脂之接著力降低溫度X、與黏著帶 之熱收縮溫度γ間之溫度範圍之液體的接著性樹脂剝離固 〇 定用夾具，將半導體構件轉印至黏著帶的轉印步驟；在接 著性樹脂上貼合剝離膠帶的第二貼合步驟；從已單片化之 半導體構件，連同接著性樹脂一起將剝離膠帶剝離的第二 剝離步驟；與拾取黏著帶上已單片化之半導體構件的拾晶 步驟。 根據由上述構成所形成的半導體製造方法，可提供剝 離性、轉印性及拾晶性優異的半導體構件製造方法。 根據本發明之一樣態，在轉印步驟中所用之液體的溫 ❿ 度爲40°c以上100°C以下。 又，根據本發明之一樣態，在轉印步驟中，以半導體 構件之貼著黏著帶側爲上方，以半導體構件之貼著接著性 樹脂及固定用夾具側爲下方浸漬於液體中。又’在轉印步 驟中，藉由經由黏著帶將半導體構件漂浮液體中，使固定 用夾具連帶接著性樹脂一起自由落下。 又，根據本發明之一樣態，黏著帶之基材薄膜爲丙烯 系共聚物。 201019401 根據本發明之一樣態，記載於申請專利範圍第1至6 項中任一項之半導體構件製造方法，其特徵爲黏著帶之黏 著劑層含有（甲基）丙烯酸酯共聚物100質量份、多官能 異氰酸酯系硬化劑0.5質量份以上20質置份以下、具有4 個以上乙烯基之丙烯酸胺酯寡聚物20質量份以上200質量 份以下、及矽改質丙烯酸樹脂0.1質量份以上10質量份以 下。 根據本發明，可提供剝離性、轉印性及拾晶性優異的 〇 半導體構件製造方法》 【實施方式】 以下，雖然詳細說明關於本發明之半導體構件製造方 法的實施樣態與使用該方法之黏著帶的實施樣態，但本發 明並無限定於彼等之實施樣態的意思》 關於本實施樣態之半導體構件製造方法，係包含在半 導體構件上塗布接著性樹脂，經由接著性樹脂將半導體構 件暫時固定於固定用夾具並單片化之單片化步驟；在已單 9 片化之半導體構件上貼合黏著帶的貼合步驟；從浸漬介於 於接著性樹脂之接著力降低溫度X、與黏著帶之熱收縮溫 度Y間之溫度範圍的液體並已單片化的導體構件，剝離接 著性樹脂及固定用夾具，並將半導體構件轉印至黏著帶的 轉印步驟；拾取黏著帶上已單片化之半導體構件的拾晶步 驟的半導體構件製造方法。 <單片化步驟> 作爲在半導體構件上塗布接著性樹脂、經由接著性樹 201019401 脂將半導體構件暫時固定於固定用夾具並單片化之單片化 步驟中所用的半導體構件，有圓板狀之矽晶圓、玻璃、鎵_ 砷（GaAs)。 作爲接著性樹脂，較佳爲使用丙烯酸系樹脂、環氧系 樹脂。作爲固定用夾具，有玻璃、陶瓷。 作爲使半導體構件單片化的方法，有藉由具有鑽石硏 磨粒之切塊刀片之切斷、蝕刻等。 <貼合步驟> 〇 在已單片化之半導體構件上貼合黏著帶之貼合步驟， 係例如在無積層已單片化或藉由接著性樹脂維持全體爲圓 板狀之半導體構件的接著性樹脂的面上，貼著黏著帶的步 驟，貼合的方法有例如輥壓著、真空壓著。 <轉印步驟> 從浸漬於介於接著性樹脂之接著力降低溫度X、與黏 著帶之熱收縮溫度γ間之溫度範圍的液體中並已單片化之 半導體構件剝離接著性樹脂及固定用夾具，將半導體構件 ❹ 轉印至黏著帶的轉印步驟，具體而言，可謂藉由從半導體 構件剝離接著性樹脂與固定用夾具，將半導體構件轉印至 黏著帶。該剝離之方法方面，轉印步驟可藉由浸漬於介於 接著性樹脂之接著力降低溫度X、與黏著帶之熱收縮溫度γ 間之溫度範圍的液體中而達成。 接著性樹脂之接著力降低溫度X、黏著帶之熱收縮溫 度Y必須爲x<Y的關係，液體之溫度T必須爲X<T<Y 的關係。接著力降低溫度係隨採用做爲接著性樹脂與黏著 201019401 帶之基材薄膜的合成樹脂而異，液體之溫度T的設定値下 限低時則有不易產生接著性樹脂之接著力降低的傾向，設 定値之上限髙時則有黏著帶收縮的傾向。 該液體之設定溫度方面，具體而言，下限方面爲40°c、 較佳爲75°C，上限方面爲120°C、較佳爲100°C »液體方 面，雖然爲水、油，但考量對於半導體構件之影響時則較 佳爲水。 在轉印步驟中，較佳爲從上而下依據黏著帶、半導體 〇 構件、接著性樹脂、固定用夾具而配置，再浸漬於液體中。 即，在轉印步驟，較佳爲以半導體構件之貼著黏著帶側爲 上方，以半導體構件之貼著接著性樹脂及固定用夾具側爲 下方，浸漬於液體中。 藉由照該配置就這樣浸漬，接著性樹脂係可因固定夾 具之本身重量和接著性樹脂之黏著力降低而剝離》由於採 用藉由以該配置剝離，以本身重量而自由落下，而抑制附 著接著性樹脂之固定用夾具剝離時的負荷，未變動將已單 ® 片化之半導體構件轉移至黏著帶時之已單片化之半導體構 件彼此之間隔，可防止液體中之浸漬時之已單片化的半導 體構件破裂、缺陷，同時可促進對於接著性樹脂之液體的 浸透並縮短轉印時間。 藉由接著性樹脂之接著力，在轉印步驟中之剝離界面 有半導體構件•接著性樹脂間、或接著性樹脂•固定用夾 具間2種。在後者的情況下，在接著性樹脂上貼合剝離膠 帶，從已單片化之半導體構件連同接著性樹脂一起將剝離 201019401 除膠帶剝離。 (黏著帶） 黏著帶係由基材與黏著劑層所構成，積層具有較接著 性樹脂之黏著力降低溫度髙之黏著力降低溫度的黏著劑 者。 (黏著帶之基材） 黏著帶之基材方面，較佳爲即使浸漬亦無膨張、收縮 等之變形的材料，可爲合成樹脂、金屬。作爲基材之形狀， 〇 有薄膜、片材、薄片。 基材之厚度較佳爲50 μιη以上250 μιη以下。更佳之下 限爲70 μιη，更佳之上限爲150 μιη。基材之厚度變薄時，則 在拾晶步驟之延伸時有發生基材斷裂的傾向，基材之厚度 變厚實則有延伸性變差的傾向。 作爲使用做爲黏著帶之基材的合成樹脂，有PVC (聚 氯乙烯）、聚乙烯、PET (聚對苯二甲酸乙二酯）、EVA (乙烯-乙酸乙烯酯共聚物）、乙烯-丙烯酸乙酯共聚物、 ® 聚丙烯、丙烯系共聚物、乙烯-丙烯酸共聚物、離子聚合物 樹脂、聚醯亞胺，其中，較佳爲PET、丙烯系共聚物，更 佳爲丙烯系共聚物。 作爲使用做爲黏著帶之基材的金屬，有不銹鋼、銅、 鋁。作爲基材’亦可爲彼等合成樹脂之混合物、共聚物、 合成樹脂彼此之積層體、金屬彼此之積層體、合成樹脂與 金屬之積層體。 在選擇丙烯系共聚物做爲基材的情況下，無浸漬時之 201019401 變形、未發生剝離時之半導體構件的變動，同時在以下之 拾晶步驟中，因而得到較佳的拾晶性。 作爲該丙烯系共聚物，例如有丙烯與其他成分之隨機 共聚物、丙烯與其他成分之嵌段共聚物、丙烯與其他成分 之交替共聚物。作爲其他成分，可舉出有乙烯、1-丁烯、 1-戊烯、1-己烯、1·庚烯等之α-烯烴；由至少2種以上之（X-烯烴所構成之共聚物、苯乙烯-二烯共聚物等。彼等之中， 較佳爲1· 丁烯。因而，可特別抑制於切斷半導體構件時所 Ο 產生的切割屑。 (黏著帶之黏著劑） 作爲黏著帶之黏著劑方面，有聚合丙烯酸、甲基丙烯 酸及彼等之酯類單體的聚合物；共聚合可與彼等單體共聚 合之不飽和單體（例如，乙酸乙烯酯、苯乙烯、丙烯腈） 的共聚物，彼等黏著劑之中，較佳爲（甲基）丙烯酸酯共 聚物。 在黏著劑層中，亦可採用在藉由紫外線或放射線之照 ® 射而進行三位元網狀化之分子内具有至少2個以上光聚合 性碳-碳雙鍵於分子内的低分子量化合物、例如丙烯酸酯化 合物或丙烯酸胺酯寡聚物等的光硬化型壓敏性黏著劑》 ((甲基）丙烯酸酯共聚合物） 使用做爲黏著帶之黏著劑的（甲基）丙烯酸酯共聚物 並無特別限制，有共聚合（甲基）丙烯酸酯之主單體與其 他乙烯化合物單體者。乙烯化合物單體較佳爲使用具有由 羥基、羧基、環氧基、醯胺基、胺基、羥甲基、磺酸基、 201019401 磺胺酸基、及（亞）磷酸酯基所構成之官能基群中1種以 上的含官能基單體。 (甲基）丙烯酸酯之主單體方面，舉例有（甲基）丙 烯酸丁酯、（甲基）丙烯酸-2-丁酯、（甲基）丙烯酸第三 丁酯、（甲基）丙烯酸戊酯、（甲基）丙烯酸辛酯、（甲 基）丙烯酸-2-乙基己酯、（甲基）丙烯酸壬酯、（甲基） 丙烯酸癸酯、（甲基）丙烯酸月桂酯、（甲基）丙烯酸甲 酯、（甲基）丙烯酸乙酯、（甲基）丙烯酸異丙酯、（甲 〇 基）丙烯酸十三酯、（甲基）丙烯酸十四酯、（甲基）丙烯酸十 六酯、（甲基）丙烯酸十八酯、（甲基）丙烯酸環己酯、（甲基） 丙烯酸異莰酯、（甲基）丙烯酸二環戊酯、（甲基）丙烯酸苄 酯、（甲基）丙烯酸甲氧乙酯、（甲基）丙烯酸乙氧乙酯、（甲 基）丙烯酸丁氧甲酯、及（甲基）丙烯酸乙氧正丙酯等》 作爲含官能基之單體，舉例有具有羥基、羧基、環氧 基、醯胺基、胺基、羥甲基、磺酸基、胺磺酸基、（亞）磷 酸酯基做爲官能基的乙烯化合物。 ® 作爲具有羥基之單體，舉例有（甲基）丙烯酸-2-羥乙 酯、（甲基）丙烯酸-2-羥丙酯、及（甲基）丙烯酸-2_羥丁酯等》 作爲具有羧基之單體，舉例有（甲基）丙烯酸、巴豆 酸、馬來酸、馬來酸酐、伊康酸、富馬酸、丙烯酸醯胺-N-乙二醇酸、及桂皮酸等。 作爲具有環氧基之單體，舉例有烯丙基環氧丙基醚、 及（甲基）丙烯酸環氧丙基醚等。 作爲具有醯胺基之單體，舉例有（甲基）丙烯醯胺等。 -10- 201019401 作爲具有胺基之單體，舉例有（甲基）丙烯酸-N，N-二甲 胺基乙酯等。 作爲具有羥甲基之單體，舉例有N-羥甲基丙烯醯胺等。 (甲基）丙烯酸酯共聚物之製造方法，係可使用乳化聚 合、溶液聚合等公認的方法。以在放射線照射後黏著帶可 容易地與半導體構件剝離的方式下，較佳爲可藉由乳化聚 合所製造的丙烯酸橡膠。 (多官能異氰酸酯硬化劑） φ 作爲用做黏著帶之黏著劑的多官能異氰酸酯硬化劑， 除了具有2個以上異氰酸酯基方面以外則無特別限制，舉 例有芳香族聚異氰酸酯、脂肪族聚異氰酸酯、脂環族聚異 氰酸酯等。 芳香族聚異氰酸酯並無特別限制，舉例有二異氰酸 1，3-伸苯酯、二異氰酸4,4’·二苯酯、二異氰酸1,4-伸苯酯、 4，4’-二異氰酸二苯甲酯、2,4-二異氰酸甲苯酯、2,6-二異氰 酸甲苯酯、4，4’-二異氰酸甲苯胺、2,4,6-三異氰酸甲苯酯、 參 1,3,5-三異氰酸苯酯、二異氰酸二甲氧苯胺酯、4,4’-二異氰 酸二苯基醚酯、4,4’，4”-三異氰酸三苯甲酯、ω，ω’-二異氰 酸-1，3-二甲基苯酯、ω，ω’-二異氰酸-1，4-二甲基苯酯、ω，ω’-二異氰酸-1，4-二乙基苯酯、1，4-二異氰酸四甲基伸茬酯、 及1，3-二異氰酸四甲基伸茬酯等。 脂肪族聚異氰酸酯並無特別限制，舉例有二異氰酸酯 伸丙酯、二異氰酸伸丁酯、二異氛酸伸己酯、二異氰酸酯 伸戊酯、二異氟酸1,2-伸丙酯、二異氰酸2,3-伸丁酯、二 201019401 異氰酸-1，3-伸丁酯、二異氰酸酯伸十二酯、及二異氰酸 -2,4,4-三甲基伸己酯等。 脂環族聚異氰酸酯並無特別限制定，舉例有3 -異氰酸 酯甲基-3，5,5-三甲基環己異氰酸酯、1，3-二異氰酸環戊酯、 二異氰酸1,3-二異氰酸環己酯、1，4_二異氰酸環己酯、2,4-二異氰酸甲基環己酯、2,6-二異氰酸甲基環己酯、4，4’-亞 甲基雙（異氰酸環己酯）、1，4-雙（異氰酸甲酯）環己烷、 及1，4-雙（異氰酸甲酯）環己烷等。 ❹ 聚異氰酸酯之中，適用1,3-二異氰酸伸苯酯、4，4’-二 異氰酸二苯酯、1,4-二異氰酸伸苯酯、4,4’-二異氰酸二苯 甲酯、2,4-二異氰酸甲苯酯、2,6-二異氰酸甲苯酯、4,4’-二異氰酸甲苯胺酯、二異氰酸伸己酯。 多官能異氰酸酯硬化劑之配合比，相對於（（甲基） 丙烯酸酯共聚物）1〇〇質量份，較佳爲0.1質量份以上20 質量份以下，更佳爲以0.5質量份爲下限、以10質量份爲 上限。 ® 若多官能異氣酸酯硬化劑爲0.1質量份以上，由於黏 著力不會過強，可抑制拾取不良的發生。又，若多官能異 氰酸酯硬化劑爲20質量份以下，因黏著力不會降低，維持 在液體浸漬時之轉印步驟中之已單片化半導體構件的保持 性而佳。 (具有4個以上乙烯基的丙烯酸胺酯寡聚物） 作爲使用做黏著帶之黏著劑的具有4個以上乙烯基的 丙烯酸胺酯寡聚物（以下，簡稱爲「丙烯酸胺酯寡聚物」。）， -12- .201019401 若爲具有4個以上乙烯基、於分子内具有胺酯鍵的（甲基） 丙烯酸酯寡聚物，則無特別限制。 丙烯酸胺酯寡聚物之製造方法雖無特別限制，舉例有 使具有羥基與複數個（甲基）丙烯酸酯基之（甲基）丙烯 酸酯化合物，與具有複數個異氰酸酯基之化合物（例如二 異氰酸酯化合物）反應而成爲丙烯酸胺酯寡聚物的方法。 在具有複數個羥基終端的聚醇寡聚物中，添加過剩具有複 數個異氰酸酯基之化合物（例如二異氰酸酯化合物）而反 〇 應，成爲具有複數個異氰酸酯終端的寡聚物，再者亦可與 含有羥基與複數個（甲基）丙烯酸酯基之（甲基）丙烯酸 酯化合物反應而成爲丙烯酸胺酯寡聚物。 作爲含有羥基與複數個（甲基）丙烯酸酯基之（甲基） 丙烯酸酯化合物，舉例有羥丙基化三羥甲丙烷三丙烯酸 酯、新戊四醇三丙烯酸酯、二新戊四醇一羥五丙烯酸酯、 雙（新戊四醇）四丙烯酸酯、四羥甲烷三丙烯酸酯、環氧 丙醇二丙烯酸酯、或彼等丙烯酸酯之一部份或全部爲甲基 ® 丙烯酸酯基的化合物等。 具有複數個異氰酸酯基之異氰酸酯方面，舉例有芳香 族異氫酸酯、脂環族異氰酸酯、及脂肪族異氰酸酯等。彼 等異氰酸酯之中，適用具有複數個異氰酸酯基、芳香族異 氰酸酯或脂環族異氰酸酯。異氰酸酯成分之形態方面，有 單體、二聚體、三聚體，而適用三聚體。 作爲芳香族二異氰酸酯，例如二異氰酸甲苯酯、4,4-二異氰酸二苯甲酯、二異氰酸伸茬酯等。 -13- 201019401 脂環族二異氰酸酯方面，舉例有異佛酮二異氰酸酯、 亞甲基雙（異氰酸-4-環己酯）等。 脂肪二異氰酸酯方面，舉例有二異氰酸伸己酯、二異 氰酸三甲基伸己酯等。 聚醇成分方面，舉例有聚（環氧丙烷）二醇、聚（環 氧丙烷）三醇、共聚（環氧乙烷環氧丙烷）二醇、聚（環 氧丁烷）二醇、乙氧化雙酚A、乙氧化雙酚S螺甘油、己 內酯改質二醇、碳酸酯二醇等。 〇 具有乙烯基之丙烯酸胺酯寡聚物的乙烯基數若爲4個 以上，由於從放射線照射後黏著帶之半導體構件的剝離容 易，故可提升拾晶性。 具有4個以上乙烯基之丙烯酸胺酯寡聚物的調配量並 無特別限制，相對於（甲基）丙烯酸酯共聚物1 0 0質量份， 較佳爲20質量份以上200質量份以下。具有4個以上乙烯 基之丙烯酸胺酯寡聚物的調配量若爲20質量份以上，從放 射線照射後黏著帶之半導體構件的剝離變容易，可抑制拾 ® 晶性的問題發生。 又，具有4個以上乙烯基之丙烯酸胺酯寡聚物的調配 量若爲2 00質量份以下，可維持在液體中之浸漬時的轉印 步驟之已單片化半導體構件的保持性。 (矽改質丙烯酸樹脂） 使用做爲黏著帶之黏著劑的矽改質丙烯酸樹脂，係（甲 基）丙烯酸單體與在聚二甲基環矽氧烷鍵之終端上具有乙 烯基的單體（以下，稱爲「矽系巨單體」）的聚合物，除 -14- 201019401 了具有由在聚二甲基矽氧烷鍵之終端上具有乙烯基之單體 而來的單體單位方面以外並無特別限制，舉例有矽系巨單 體之均聚物、或聚合矽系巨單體與其他乙烯化合物所構成 的乙烯聚合物。 矽系巨單體適用聚二甲基矽氧烷鍵之終端爲（甲基） 丙烯醯基或苯乙烯基等之乙烯基的化合物（例如，參照特 開2000-080135號公報等）。 作爲（甲基）丙烯酸單體，除了（甲基）丙烯酸烷基酯 φ 之外，舉出有（甲基）丙烯酸羥烷酯、改質羥基（甲基）丙 烯酸酯、及（甲基）丙烯酸等。 (甲基）丙烯酸烷基酯方面，舉例有（甲基）丙烯酸甲酯、 (甲基）丙烯酸乙酯、（甲基）丙烯酸正丙酯、（甲基）丙烯酸正 丁酯、（甲基）丙烯酸異丁酯 '(甲基）丙烯酸第三丁酯、（甲 基）丙烯酸2-乙基己酯、（甲基）丙烯酸十二烷酯、（甲基）丙 烯酸十八烷酯、及（甲基）丙烯酸異莰酯、及（甲基）丙烯酸羥 烷酯等。 ® (甲基）丙烯酸羥烷酯方面，舉例有（甲基）丙烯酸羥乙 酯、（甲基）丙烯酸羥丙酯、及（甲基）丙烯酸羥丁酯等。 改質羥基（甲基）丙烯酸酯方面，舉例有環氧乙烷改 質羥基（甲基）丙烯酸酯、及內酯改質羥基（甲基）丙烯 酸酯等。 在使用（甲基）丙烯酸的情況下，在合成矽改質丙烯 酸樹脂之後，與使用具有環氧基之（甲基）丙烯酸環氧丙酯 等之丙烯酸反應，而得到具有乙烯基的聚合物。 -15- 201019401 爲了防止稱爲微粒之微小糊狀殘留，則適用具有反應 性之（甲基）丙烯酸羥烷酯、或改質羥基（甲基）丙烯酸酯、及 至少具有一個乙烯基的矽改質丙烯酸樹脂》 矽改質丙烯酸樹脂之矽系巨單體單位的比例雖無特別 限制，但在矽改質丙烯酸樹脂100質量份中，矽系巨單體 單位較佳爲15質量份以上50質量份以下。矽系巨單體單 位之含量若爲15質量份以上，可容易地從半導體構件剝離 放射線照射後的黏著帶，而可提升拾晶性。 ❹ 又，矽系巨單體單位之含量若爲50質量份以下，可維 持在液體中之浸漬時的轉印步驟中之已單片化的半導體構 件保持性。 矽改質丙烯酸樹脂之調配量雖無特別限制，但相對於 (甲基）丙烯酸酯聚合物100質量份，較佳爲0.1質量份 以上10質量份以下。矽改質丙烯酸樹脂之調配量若爲0.1 質量份以上，可’容易地從半導體構件剝離放射線照射後的 黏著帶，而可提升拾晶性。又，矽改質丙烯酸樹脂之配合 G 量若爲ίο質量份以下，可維持在液體中之浸漬時的轉印步 驟中之已單片化的半導體構件保持性。 在黏著劑層中，亦可添加例如聚合起始劑、軟化劑、 抗老化劑、塡充劑、紫外線吸收劑、及光安定劑等的各種 添加劑。 黏著劑層之厚度雖無特別限制，但一般爲5 μιη以上 ΙΟΟμιη以下左右，較佳爲5μιη以上40μιη以下左右。 在基材薄膜上形成黏著劑層而成爲黏著帶的方法並無 201019401 特別限制，舉例有以凹槽輥塗布機、逗點型刮刀塗布機 (comma coater)、刮條塗布機、刮刀塗布機、或輥塗機等之 塗布機在基材上直接塗布黏著劑的方法。亦可藉由凸版印 刷、凹版印刷、平版印刷、柔版（elexo)印刷、膠版（offset) 印刷、或網版印刷等，在基材薄膜上印刷黏著劑層。 (接著性樹脂） 接著性樹脂必須有具備該黏著力降低溫度X相對於黏 著帶之收縮溫度Y爲X<Y的關係、液體之溫度T較低、X φ <Τ<Υ的關係，較佳爲接著性樹脂可爲即使與水接觸亦不 會因膨潤所導致之對於半導體構件發生錯位者。具體而 言，較佳爲具有疏水性、或即使與水接觸亦不大幅膨潤者 或不溶解者。作爲具有該性質之接著性樹脂，有丙烯酸系 樹脂、胺酯系接著劑、環氧系接著劑，較佳爲丙烯酸系樹 接著性樹脂更佳爲可由具有疏水性之（Α)多官能（甲 基）丙烯酸酯、（Β)單官能（甲基）丙烯酸酯及（C)聚 Φ 合起開始劑所構成者。較佳爲相對於（A )多官能（甲基） 丙烯酸酯與（B)單官能（甲基）丙烯酸酯之合計量100 質量份，可含有彼等配合50至97質量份、（C)聚合起始 劑〇.1至20質量份者》 (A)多官能（甲基）丙烯酸酯之添加量，在（A)多 官能（甲基）丙烯酸酯及（B)單官能（甲基）丙烯酸酯之 合計量1〇〇質量份中，較佳爲3至50質量份。（A)多官 能（甲基）丙烯酸酯之添加量少時，則有未發揮使接著性 -17- .201019401 樹脂之硬化體升溫時從半導體構件剝離之性質（以下、簡 稱爲「剝離性」）的傾向，多時則因而有初期之接著性降 低的傾向。 ((A)多官能（甲基）丙烯酸酯） 作爲用作接著性樹脂之（A)多官能（甲基）丙烯酸酯， 可使用在寡聚物/聚合物終端或側鏈上具有2個以上（甲基） 丙烯醯化之多官能（甲基）丙烯酸酯寡聚物/聚合物或2個 以上之（甲基）丙烯醯基的單體。 G 多官能（甲基）丙烯酸酯寡聚物/聚合物方面，舉例有 1,2-聚丁二烯終端（甲基）丙烯酸胺酯（例如，日本曹達 公司製TE-2000、TEA-1000) 、1，2·聚丁二烯終端（甲基） 丙烯酸胺酯氫化物（例如，日本曹達公司製TEAI-1000)、 1，4-聚丁二烯終端（甲基）丙烯酸胺酯（例如，大阪有機 化學公司製BAC-45)、聚異戊二烯終端（甲基）丙烯酸酯、 聚酯系（甲基）丙烯酸胺酯、聚醚系（甲基）丙烯酸胺酯、 聚酯（甲基）丙烯酸酯、雙A型環氧基（甲基）丙烯酸酯 ® (例如，大阪有機化學公司製VISCOTE #540、昭和高分子 公司製 VISCOTE VR-77 )。 作爲2官能（甲基）丙烯酸酯單體，可舉出1，3-丁二 醇二（甲基）丙烯酸酯、1，4-丁二醇二（甲基）丙烯酸酯、 1,6-己二醇二（甲基）丙烯酸酯、i，9-壬二醇二（甲基）丙 烯酸酯、新戊二醇二（甲基）丙烯酸酯、二（甲基）丙烯酸 二環戊酯、2-乙基-2-丁基丙二醇（甲基）丙烯酸酯、新戊 二醇改質（甲基）丙烯酸三羥甲基丙酯、十八酸三丙酯改質 -18- 201019401 新戊四醇二丙烯酸酯、聚丙二醇二（甲基）丙烯酸酯、2，2_ 雙（4-(甲基）丙烯氧基二乙氧苯基）丙烷、2，2-雙（4-(甲基）丙烯氧基丙氧苯基）丙烷、2,2-雙（4-(甲基）丙 烯氧基四乙氧苯基）丙烷等。作爲3官能（甲基）丙烯酸 酯單體，可舉出有三（甲基）丙烯酸三羥甲基丙酯、參〔（甲 基）丙烯醯乙基〕異氰酸酯等。作爲4官能以上之（甲基） 丙烯酸酯單體，可舉出有四（甲基）丙烯酸二羥甲基丙酯、 新戊四醇四（甲基）丙烯酸酯、新戊四醇乙氧基四（甲基） φ 丙烯酸酯、二新戊四醇五（甲基）丙烯酸酯、二新戊四醇 六（甲基）丙烯酸酯。 ((B)單官能（甲基）丙烯酸單體） 作爲用作接著性樹脂之（B)單官能（甲基）丙烯酸單 體，舉出有（甲基）丙烯酸甲酯、（甲基）丙烯酸乙酯、（甲基） 丙烯酸丙酯、（甲基）丙烯酸丁酯、（甲基）丙烯酸-2-乙基己 酯、（甲基）丙烯酸異辛酯、（甲基）丙烯酸異癸酯、（甲基）丙 烯酸十二酯、（甲基）丙烯酸十八酯、（甲基）丙烯酸苯酯、（甲 © 基）丙烯酸環己酯、（甲酯）丙烯酸二環戊烯、（甲基）丙烯酸 二環戊烯酯、（甲基）丙烯酸二環戊烯氧乙酯、（甲基）丙烯酸 異莰酯、甲氧基化（甲基）丙烯酸環十三碳烯酯、（甲基）丙烯 酸-2-羥乙酯、（甲基）丙烯酸-2-羥丙酯、（甲基）丙烯酸-3-羥 丙酯、（甲基）丙烯酸-4-羥丁酯、（甲基）丙烯酸四氫糠酯、（甲 基）丙烯酸-2-羥基-3-苯氧丙酯、（甲基）丙烯酸環氧丙酯、 己內酯改質（甲基）丙烯酸四氫糠酯、（甲基）丙烯酸-3-氯-2-羥丙酯、（甲基）丙烯酸-N，N-二甲胺基乙酯、（甲基）丙烯酸 -19- .201019401 -N，N-二乙胺基乙酯、（甲基）丙烯酸第三丁胺基乙酯、（甲基） 丙烯酸乙氧羧基甲酯、酚基環氧乙烷改質丙烯酸酯、丙烯 酸酚（環氧乙烷2莫耳改質）酯、丙烯酸酚（環氧乙烷4 莫耳改質）酯、對異苯丙酚基環氧乙烷改質丙烯酸酯、壬 酚基環氧乙烷改質丙烯酸酯、丙烯酸壬酚（環氧乙烷4莫 耳改質）酯、丙烯酸壬酚（環氧乙烷8莫耳改質）酯、丙 烯酸壬酚（環氧丙烷2.5莫耳改質）酯、2 -乙基己卡必醇 丙烯酸酯、環氧乙烷改質酞酸（甲基）丙烯酸酯、環氧乙 〇 烷改質丁二酸（甲基）丙烯酸酯、（甲基）丙烯酸三氟乙酯、 丙烯酸、甲基丙烯酸、馬來酸、富馬酸、ω-羧基聚己內酯 單（甲基）丙烯酸酯、酞酸（甲基）丙烯酸單羥乙酯、（甲 基）丙烯酸二聚體、β-(甲基）丙烯醯氧基乙基氫丁二酸 酯、正（甲基）丙烯醯氧烷基六氫酞醯亞胺等。 配合於接著性樹脂之（C)聚合起始劑較佳爲配合用於 藉由可見光線或紫外線之活性光線增感以促進接著性樹脂 之光硬化者，可使用公認之各種光聚合起始劑。 ® (C)聚合起始劑之添加量，相對於（Α)多官能（甲 基）丙烯酸酯及（B)單官能（甲基）丙烯酸酯之合計100 質量份，較佳爲0.1至20質量份。更佳爲3至20質量份。 若爲0.1質量份以上，確實得到硬化促進的效果，在20質 量份以下則可得到充分之硬化速度。作爲更佳之形態，藉 由添加3質量份以上（C)成分，變得可不依附光照射量地 硬化、再者接著性樹脂之硬化體的交聯度變高、在切削加 工時變得不會引起錯位等觀點或提升剝離性之觀點而較 *20- 201019401 佳。 作爲（C)聚合開始劑，具體而言，舉出有二苯基酮及 其衍生物；苄基及其衍生物；蒽醌及其衍生物；安息香、 安息香甲基醚、安息香乙基醚、安息香丙基醚、安息香丁 基醚、苄基二甲基縮酮等之安息香衍生物；二乙氧基苯乙 酮、4-第三丁基三氯苯乙酮等之苯乙酮衍生物；苯甲酸-2_ 二甲胺基乙酯、苯甲酸對二甲胺基乙酯、二苯基二硫化物、 9-氧硫灿喔及其衍生物；樟腦醌、7,7-二甲基-2,3-二側氧 φ 基雙環〔2.2.1〕庚-1-羧酸、7,7-二甲基-2,3-二側氧基雙環 〔2.2.1〕庚-1-羧基-2-溴乙酯、7,7-二甲基-2,3-二側氧基雙 環〔2.2.1〕庚-1-羧基·2·甲酯、7,7-二甲基-2,3-二側氧基聯 環〔2.2.1〕庚-1-羧酸氯化物等之樟腦醌衍生物；2-甲基-1-〔4-(甲硫基）苯基〕-2-嗎福林丙-1-酮、2-苄基-2-二甲胺 基-1-(4-嗎福林苯基）-丁 -1-酮等之α-胺烷基苯酮衍生物； 氧化苯甲酿二苯基膦、氧化2,4,6-三甲基苯甲醯二苯基膦、 氧化苯甲醯二乙氧基膦、氧化2,4,6-三甲基苯甲醯二甲氧 ® 苯基膦、氧化2,4,6-三甲基苯甲醯二氧苯基膦等之氧化醯 基膦衍生物等。光聚合起始劑可組合1種或2種以上來使 用。 在本發明中，亦可在接著性樹脂中共用極性有機溶 劑。藉由共用極性有機溶劑，可使樹脂層與液體接觸而容 易膨潤以降低接著強度。 極性有機溶劑之添加量，相對於（A )多官能（甲基） 丙烯酸酯及（B)單官能（甲基）丙烯酸之合計量1〇〇質量 -21- 201019401 份，較佳爲0.5至l〇質量份。若爲〇·5質量份以上則可確 保剝離性，若爲1 〇質量份以下’則無初期之接著性降低之 虞，亦有可將接著性樹脂剝離成薄膜狀的傾向。 極性有機溶劑係因更進一步發現接著性樹脂與液體接 觸而使接著強度降低的現象’故其沸點較佳爲30 °c以上 200 °C以下。該等極性有機溶劑方面，有醇、酮、酯，較佳 可爲醇類。 作爲醇類，舉出有甲醇、乙醇、正丙醇、異丙醇、正 φ 丁醇、異丁醇、第二丁基醇、第三丁基醇、正戊醇、異戊 醇、2-乙基丁醇等。再者，在前述醇類之中，較佳爲沸點 爲120°C以下的甲醇、乙醇、正丙醇、異丙醇、正丁醇、 異丁醇、第二丁醇、第三丁醇，其中更佳爲甲醇、乙醇、 異丙醇、正丁醇。 在本發明中，亦可共用（A)多官能（甲基）丙烯酸酯 及（B)單官能（甲基）丙烯酸酯及不溶解於（C)聚合起 始劑的粒狀物質。因而，由於樹脂層可保持固定的厚度， ® 故提升厚度精確度。 粒狀物質之添加量，相對於（A)多官能（甲基）丙烯 酸酯及（B)單官能（甲基）丙烯酸酯之合計量100質量份， 較佳爲0.1至20質量份，特佳爲0.1至10質量份。若爲 0.1質量份以上則接著性樹脂之膜厚約略固定，若爲20質 量份以下，亦無初期的接著性降低之虞。 粒狀物質之材質一般爲所使用之有機粒子、無機粒 子。具體而言，作爲有機粒子，舉出有聚乙烯粒子、聚丙 -22- 201019401 烯粒子、交聯聚甲基丙烯酸甲酯粒子、交聯聚苯乙烯粒子 等；作爲無機粒子，舉出有玻璃、氧化矽、氧化鋁、氧化 鈦等陶瓷粒子。 粒狀物質之材質，從均勻控制接著性樹脂之膜厚的觀 點來看，較佳爲球狀且粒徑固定、粒子之變形少、粒徑之 不均勻少者。作爲具備該條件之較佳的有機粒子，有藉由 甲基丙烯酸甲酯單體、苯乙烯單體與交聯性單體之藉由已 知的乳化聚合法而得做爲單分散粒子的交聯聚甲基丙烯酸 〇 甲酯粒子、交聯聚苯乙烯粒子或作爲無機粒子則有球狀氧 化矽。彼等粒狀物質之中，進一步從粒子沈降等之貯藏安 定性或組成物之反應性的觀點看，更進一步較佳爲交聯聚 甲基丙烯酸甲酯粒子、交聯聚苯乙烯粒子。 本發明之接著性樹脂在無損於本發明之目的的範圍 中，亦可使用一般所使用的丙烯酸橡膠、胺酯橡膠、ABS (丙烯腈-丁二烯-苯乙烯橡膠）等各種彈性體、無機塡充 劑、溶劑、增量材、補強材、可塑劑、增黏劑、染料、顔 ® 料、難燃劑、聚合抑制劑、矽烷偶合劑及界面活性劑等的 添加劑。 (接著性樹脂之塗布方法） 塗布接著性樹脂於半導體構件的方法，可使用刮條塗 布機、噴槍、旋轉塗布機等。 (剝離膠帶） 剝離膠帶係由基材與黏著劑層所構成，接著性樹脂·剝 離膠帶間之黏著力較半導體構件·接著性樹脂間之黏著力 -23- 201019401 高者。 (剝離膠帶之基材） 作爲剝離膠帶之基材，可爲合成樹脂。形狀方面爲薄 膜、片材。基材之厚度可爲50μιη以上25 0μιη以下。較佳 下限爲7〇μπι，較佳上限爲150μπι。 使用做爲剝離膠帶之基材的合成樹脂方面，有PVC(聚 氯乙烯） '聚乙烯、PET (聚對苯二甲酸乙二酯）、EVA (乙烯·乙酸乙烯酯共聚物）、乙烯-丙烯酸乙酯共聚物、 Ο 聚丙烯、丙烯系共聚物、乙烯-丙烯酸共聚物、離子聚合物 樹脂、聚醯亞胺，其中，較佳爲EVA (乙烯-乙酸乙烯酯共 聚物）、乙烯-丙烯酸乙酯共聚物。基材方面，亦可爲彼等 合成樹脂之混合物、共聚物、合成樹脂彼此之積層體。 (剝離膠帶之黏著劑） 作爲剝離膠帶之黏著劑，可爲丙烯酸系黏著劑、胺酯 系黏著劑、聚矽氧系黏著劑等，較佳爲丙烯酸系黏著劑。 作爲丙烯酸系黏著劑，有聚合丙烯酸、甲基丙烯酸及彼等 ® 酯類單體的聚合物；和可與彼等單體共聚合之不飽和單體 (例如，乙酸乙烯酯、苯乙烯、丙烯腈）共聚合的共聚物， 彼等黏著劑之中，較佳爲（甲基）丙烯酸酯共聚物。 在黏著劑層中，藉由紫外線或放射線中任一者或照 射，亦可採用在分子內具有至少2個以上在三次元網狀化 的分子内光聚合性碳-碳雙鍵的低分子量化合物，例如使用 丙烯酸酯化合物或丙烯酸胺酯寡聚物等的光硬化型壓敏性 黏著劑。 -24- 201019401 在剝離膠帶的黏著劑層中，亦可添加例如聚 劑、軟化劑、抗老化劑、塡充劑、紫外線吸收劑、 定劑等的各種添加劑。 剝離膠帶之黏著劑層的厚度雖無特別限制，但 5 μιη以上1 ΟΟμπι以下左右，較佳爲以5 μιη爲下限、_[ 爲上限。 在基材薄膜上形成黏著劑層而成爲黏著帶的方 特別限制，舉例有以凹槽輥塗布機、刮條塗布機、 ❹ 布機、或輥塗機等之塗布機，在基材上直接塗布黏 方法。亦可藉由凸版印刷、凹版印刷、平版印刷、 刷、膠版印刷、或網版印.刷等在基材薄膜上印刷黏著 (固定用夾具） 作爲固定用夾具，由於係經由接著性樹脂固定 構件，若半導體構件爲板狀，可爲平滑的材料，可 狀體或膜狀體之單獨或2種以上的積層體。固定用 材料有不銹鋼、鋁、鐵等金屬板狀體；丙烯酸、聚碳 ® ABS (丙烯腈-丁二烯-苯乙烯）、PET、耐綸、胺酯 亞胺、聚烯烴或PVC等的合成樹脂；玻璃、陶瓷等 在本發明中，固定用夾具較佳爲透過2 0%以上 之波長者。若爲透過20%以上365nm之波長透過者 化接著性樹脂中亦未花費太多時間而佳。固定用夾 度若滿足上述條件雖無特別限制，較佳爲ΙΟΟμπι至 更佳爲2至5mm。透過率之測定係採用TOPCON UVR-2做爲測定機器，基於波長3 6 5nm的透過率。 合起始 及光安 一般爲 k 40μιη 法並無 刮刀塗 著劑的 柔版印 劑層。 半導體 採用板 夾具之 酸酯、 、聚醯 〇 3 6 5 nm 則在硬 具之厚 10mm, 公司製 -25- .201019401 [實施例] 針對本發明之半導體構件製造方法中的實施例，使用 圖式來説明。 本實施例中之半導體構件製造方法爲具有單片化步 驟、貼合步驟、轉印步驟、拾晶步驟者。以下’說明個別 之步驟。還有，第1圖至第10圖爲模式地顯示者，與實際 縮小比例尺不同。 <單片化步驟> φ 在單片化步驟中，在半導體構件1(直徑8吋、厚度 725 μιη的矽晶圓）上，藉由旋轉塗布機塗布20 μιη接著性樹 脂2，接著貼合厚度700μπι的固定用夾具3(玻璃板）， 加重 10kg成爲均句面，使用黑光，以 365nm波長在 3 0 0m J/cm2的條件下使接著性樹脂硬化，然後，進行切塊。 固定用夾具3爲透過80%波長365nm之光的玻璃板。 切塊係使用DISCO公司製DAD 341 (圖示省略），切 塊刀片係使用DISCO公司製NBC-ZH205O-27HEEE (圖示 © 省略），以7.2mm xl 4.4mm之晶片尺寸進行。單片化步驟 後之狀態示於第1圖" <貼合步驟> 在貼合步驟中，藉由使用無電極放電燈之FUSION公 司製硬化裝置（圖示省略），以365 nm波長在16000m J/cm2 之條件下進一步使接著性樹脂硬化後，在成爲單片化步驟 後之半導體構件1之已分割的晶片面上，經由環狀板框5 使用滾輪安裝機貼合黏著帶4。貼合步驟後之狀態示於第2 -26- 201019401 圖。 <轉印步驟> 在轉印步驟中，以貼合步驟後原來的狀態，浸漬於90°C 的溫水6之後，從半導體構件1自由落下並將接著性樹脂 2及固定用夾具3剝離下來。第3圖顯示浸漬的狀態，第4 圖顯示自由落下後的狀態。 轉印步驟中之溫水6的溫度爲9 0 °C，藉由將接著性樹 脂2之接著力降低溫度X設定爲較90 °C低，將黏著帶4之 G 熱收縮溫度Y設定於較90°C高，則無半導體構件1與黏著 帶4之界面、接著性樹脂2與固定用夾具3之界面，可在 半導體構件1與接著性樹脂2之界面剝離。還有，第3圖 中之符號7爲支撐環狀板框5的支柱、符號9爲裝入溫水 6的容器。 <拾晶步驟> 在轉印步驟後，在每個半導體構件1拉起接著於環狀 板框5之黏著帶4(參照第5圖），從黏著帶4之基材薄 〇 膜面側（第5圖之下側），以USHIO電機公司製高壓水銀 燈以150mJ/cm2的條件照射紫外線，在使黏著帶4之黏著 劑層硬化後，使用圖示以外之佳能機械製CAP-3 0011，以 針栓高度〇.3mm的條件進行。拾晶時之狀態示於第6圖。 第7圖係顯示在使用剝離膠帶之情況下的轉印步驟之 截面的模式圖》 在該方法中，除了將半導體構件1變更成在其表面（與 接著性樹脂2之接觸面）形成聚醯亞胺蒸鍍膜（圖示省略） -27- 201019401 的矽晶圓以外，與前述之方法相同的構成。在該方法中’ 爲了在半導體構件1之表面（與接著性樹脂2之接觸面） 上，成爲形成聚醯亞胺蒸鍍膜的矽晶圓，在轉印步驟中無 半導體構件1與黏著帶4之界面、接著性樹脂2與固定用 夾具3之界面，而在接著性樹脂2與固定用夾具3之界面 剝離。 在該轉印步驟後，由從示於第8圖之溫水6拉起的狀 態，將剝離膠帶8貼於接著性樹脂2的表面（參照第9圖）， 〇 在每個接著性樹脂2拉起剝除剝離膠帶8(參照第10圖）。 之後，如第5圖、第6圖所示。 以下，針對於上述步驟所用之黏著帶、接著性樹脂， 使用表1來説明。 【表1】 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 網 90 90 40 100 30 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 方法 半導·Νΐη^η方向 下 上 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 挪 A A A A A B C A A A A A A A A A A A A A A 基挪 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 黏 著 黏 著 3 3 3 3 3 3 3 0.5 20 0.1 25 3 3 3 3 3 3 3 3 3 3 帶 劑 nmwmmme A100 A100 A100 A100 A100 A100 A100 A100 A100 Λ100 A100 A20 A200 A10 A300 B100 A100 A100 A100 A100 A100 矽改肪嫌教樹胞 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 0.1 10 αοι 20 2 剝離性 ◎ 〇 〇 ◎ X ◎ ◎ ◎ ◎ 〇 ◎ ◎ 〇 © ◎ ◎ 〇 〇 fHfi 轉印性 ◎ 〇 ◎ X 〇 © ◎ ◎ 〇 〇 ◎ ◎ © 〇 @ © ◎ © o 〇 拾ft性 ◎ ◎ ◎ X ◎ o ◎ 〇 ◎ 〇 © o @ © 〇 @ ◎ 縴合 ◎ ◎ o © X 〇 〇 ◎ ◎ 〇 〇 ◎ ◎ 〇 〇 〇 ◎ ◎ 〇 o 〇 ntm «1 m ❹ -28- 201019401 (黏著帶） 黏著帶係使用以下之基材。 基材A:丙烯系共聚物（含有丙烯、乙烯、1·丁烯做 爲聚合成分、MFR(熔融流速）値7.5g/10分鐘、密度〇·89 g/cm3(Sunallomer 公司製、X500F))。厚度 80μιη。 基材Β:乙烯與乙酸乙烯酯之隨機共聚物（MFR値2·5 g/l〇分鐘，乙酸乙烯酯含量12%，密度0.93 g/cm3 (三井 杜邦聚化學品公司製）。厚度80μιη。 ❹ 基材C : PET、厚度38μιη。 (黏著帶之黏著劑） 採用以下者作爲黏著劑。表1中之數字爲質量份° (甲基）丙烯酸酯共聚物：由丙烯酸乙酯54%、丙烯 酸丁酯19%、丙烯酸甲氧基乙酯24%所構成之共聚物’藉 由乳化聚合而得者（該公司聚合品）。 多官能異氰酸酯硬化劑··二異氰酸伸己酯之三羥甲基 丙烷加成體的市售品（日本聚胺酯公司製，製品名 ❹ CORONATE HL )。 丙烯酸胺酯寡聚物A:其爲在聚（環氧丙烷）二醇之 終端上使二異氰酸伸己酯（脂肪族二異氰酸酯）的三聚體 所構成之終端異氰酸酯寡聚物上，進一步使二新戊四醇五 丙烯酸酯反應所構成的終端丙烯酸酯寡聚物，數量平均分 子量（Μη)爲3,700且丙烯酸酯官能基數15個的丙烯酸胺 酯寡聚物（該公司聚合品）。 丙烯酸胺酯寡聚物Β:在聚（環氧丙烷）二醇之終端 •29- 201019401 上使丙烯酸-2-羥乙酯反應所構成的終端異氰酸酯寡聚物 上，進一步使丙烯酸-2-羥乙酯反應所構成的終端丙烯酸酯 寡聚物，數量平均分子量（Μη)爲3,400，乙烯基數爲每1 分子有2個的丙烯酸胺酯寡聚物（該公司聚合品）。 矽改質丙烯酸樹脂：在矽分子鏈之終端上具有（甲基） 丙烯醯基之矽系寡聚物，及聚合由甲基丙烯酸甲酯等所構 成的丙烯酸乙烯酯單位所構成的矽系接枝共聚物的市售品 (綜硏化學公司製' 製品名ActflowUTMM-LS2)。 0 雖於表1上無記載，但在黏著帶之黏著劑中，配合6 質量份任一種光聚合起始劑（苄基二甲基縮酮、市售品）。 例如，第1實驗之黏著劑係調配（甲基）丙烯酸酯共 聚物A 100質量份、多官能異氰酸酯硬化劑A 3質量份、 丙烯酸胺酯寡聚物A 100質量份、矽改質丙烯酸樹脂A 2 質量份、光聚合起始劑6質量份者。 黏著帶係將表1記載之配合的黏著劑塗布於PET製的 分隔膜上，以乾燥後之黏著劑層的厚度成爲ΙΟμηι的方式 ® 塗布，積層於基材者》 (接著性樹脂） 接著性樹脂係採用配合（Α)多官能（甲基）丙烯酸酯、 (Β)單官能（甲基）丙烯酸酯及（C)聚合起始劑者。 具體而言’添加丙烯酸胺酯（日本合成化學公司製 「UV-3000B」）8質量份、二丙烯酸二環戊酯（日本化藥 公司製「KAY ARAD R-684」）12質量份之合計20質量份 做爲（A)多官能（甲基）丙烯酸酯；丙烯酸_2-(1，2_環己 -30- 201019401 羧基醯亞胺）乙酯（東亞合成公司製「ARONIXM-140」） 3〇質量份、甲基丙烯酸二環戊烯氧基乙酯（R〇hm & Haas 公司製「QM-657」）50質量份之合計80質量份做爲丙烯 酸胺酯（B)單官能（甲基）丙烯酸酯；2_甲基(甲 硫基）苯基〕-2 -嗎福林丙-1 _酮（汽巴•特化品·化學品公 司製「IRGACURE907」）2質量份做爲（C)聚合起始劑； 2，2-亞甲基雙（4-甲基-6-第三丁基酚）〇.1質量份做爲聚合 抑制劑以製成接著性樹脂。 〇 (剝離膠帶） 剝離膠帶係使用以下之基材、黏著劑。 基材：採用形成乙烯與乙酸乙烯酯之隨機共聚物（MFR 値2.5g/10分鐘，乙酸乙烯酯含量12%，密度0.93g/cm3, 三井杜邦聚化學品公司製）成爲厚度1〇〇μιη者。 黏著劑：其爲配合以下之配合材料者，將該黏著劑塗 布於PET製之分隔膜上並以乾燥後之黏著劑層厚度爲 2 Ομιη的方式塗布，積層於基材者。 ® (配合材料） 剝離膠帶之配合材料方面，則使用以下者。 (甲基）丙烯酸酯共聚物：其爲丙烯酸乙酯54% '丙 烯酸丁酯19%、丙烯酸甲氧乙酯2 4 %之共聚物’藉由乳化 聚合而得者（本公司聚合品）100質量份 多官能異氰酸酯硬化劑：二異氰酸-2,4-甲苯酯的三羥 甲基丙烷加成體的市售品（日本聚胺酯公司製、製品名 CORONATE HL ) 3 質量份 -31- 201019401 丙烯酸胺酯寡聚物：在聚（環氧丙烷）二醇之終端上 使二異氰酸伸己酯（脂肪族二異氰酸酯）之三聚體反應所 構成的終端異氰酸酯寡聚物上，進一步使二新戊四醇五丙 烯酸酯反鹰所構成之終端丙烯酸寡聚物，數量平均分子量 (Μη)爲3,700且丙烯酸酯官能基數15個的丙烯酸胺酯寡 聚物（本公司聚合品）100質量份 光聚合起始劑：苄基二甲基縮酮（市售品）6質量份 (固定用夾具） 固定用夾具係使用透過 80%波長 365nm光之厚度 700μηι的玻璃板。 使用上述之黏著帶、接著性樹脂、剝離膠帶、固定用 夾具，針對半導體構件（矽晶圓），以上述方法實施關於 本發明之半導體構件製造方法，並進行評估。評估結果示 於表1。 還有，僅實施例21使用剝離膠帶，從已單片化之半導 體構件剝離接著性樹脂。 © (剝離性之評估） 藉由在直徑8吋、厚度72 5 μιη之矽晶圓上旋轉塗布接 著性樹脂來貼合20μιη塗布、厚度700μιη的玻璃板，加重 10 kg成爲均勻面。之後，始用黑光並以365 nm波長且在 3 00mJ/cm2條件下使接著性樹脂硬化。 切塊係使用DISCO公司製DAD 341、切塊刀片DISCO 公司製 NBC-ZH205O-27HEEE，以 7.2 mm χ 1 4.4mm 的晶片尺 寸進行，藉由使用無電極放電燈之FUSION公司製硬化裝 -32- 201019401 置，在以3 65nm波長1 6000mJ/cm2的條件下進一步硬化接 著性樹脂後，使用滾輪安裝機，在所分割之晶片面上經由 環狀板框貼合黏著帶，將半導體構件朝下浸漬於90°C的液 體中，從固定用夾具使接著性樹脂從半導體構件及玻璃自 由落下而剝離。第2實驗係將半導體構件朝上浸漬。 以剝離時在1分鐘內可從接著性樹脂及玻璃剝離晶片 者爲◎，以可在30分鐘以内剝離者爲〇,以不能在30分以 上剝離的情況爲X。還有，在將半導體構件朝下浸漬於90°C φ 的液體時，僅有玻璃從半導體構件剝離，而接著性樹脂附 著於半導體構件上的情況下，乾燥後，將剝離膠帶貼合於 接著性樹脂，在每個接著性樹脂從已單片化之半導體構件 剝離剝離膠帶。 (轉印性之評估） 在縱向、橫向各一列測定以上述方法所轉印之晶片的 間隔，與轉印前之晶片間隔比較。以由轉印前之晶片間隔 的最大變動量爲未滿ΙΟμιη者爲◎，以ΙΟμιη以上未滿20μιη Φ 者爲〇，以20μπι以上者爲X。 (拾晶性之評估） 以上述方法轉印後，從黏著帶之基材薄膜面，以USHIO 電機公司製高壓水銀燈在150mJ/cm2的條件下照射紫外 線，在硬化黏著劑層後，使用佳能機械製CAP-3 0011，以 針栓高度〇.3mm的條件進行評估，以可100%拾晶的情況 爲◎，以90%以上未滿100%的情況爲〇，以未滿90%的情 況爲x。 -33- 201019401 藉由本發明之半導體構件製造方法，提供剝離性、轉 印性及拾晶性優異之半導體構件製造方法。 【圖式簡單說明】 第1圖係顯示本發明之實施例中之單片化步驟後之半 .導體構件、接著性樹脂及固定用夾具的截面槪略圖。 第2圖係顯示貼合步驟後之狀態的截面槪略圖。 第3圖係顯示在轉印步驟中浸漬之狀態的截面槪略 圖。 Φ 第4圖係顯示在轉印步驟中自由落下後之狀態的截面 槪略圖。 第5圖係顯示在轉印步驟後、將接著於環狀板框5之 黏著帶4連同半導體構件1 一起拉起之狀態的截面槪略圖。 第6圖係顯示拾晶時之狀態的截面槪略圖。 第7圖係顯示使用剝離膠帶8之轉印步驟的截面槪略 圖。 第8圖係顯示在使用剝離膠帶8之轉印步驟後，從溫 ❿ 水6拉起之狀態的截面槪略圖。 第9圖係顯示將剝離膠帶8貼於接著性樹脂2表面之 狀態的截面槪略圖。 第10圖係顯示將剝離膠帶8連同接著性樹脂2 —起拉 起剝離之狀態的截面槪略圖。 【主要元件符號說明】 1 已單片化之半導體構件 2 接著性樹脂 -34- 201019401 3 固定用夾具 4 黏著帶 5 環狀板框 6 溫水 7 支柱 8 剝離膠帶 9 容器201019401 VI. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a semiconductor member and an adhesive tape using the same. [Prior Art] In general, electronic devices such as 1C (Integrated Circuit) cards, mobile phones, and PDAs (Personal Digital Assistants) are equipped with wafer-shaped electronic components in which circuit patterns have been formed. φ The semiconductor component is formed by forming a plurality of circuit patterns on a semiconductor wafer such as germanium or gallium-arsenic or a semiconductor substrate such as an insulating substrate, and the electronic component is thinned (the electronic component is being thinned ( Refer to Patent Document 1). Patent Document 1: JP-A No. 00 3-257893 [Description of the Invention] However, in the case where a thinned semiconductor member is singulated by a dicing blade having diamond honing particles, a semiconductor member is produced. The rupture is equal to the situation. According to the present invention, there is provided a method of producing a semiconductor member comprising the step of applying a bonding resin to a semiconductor member, temporarily fixing the semiconductor member to a fixing jig via a via resin, and singulating the singulation; a bonding step of bonding an adhesive tape to a semiconductor member; and a semiconductor member immersed in a liquid immersed in a temperature range between a heat-reducing temperature X of the adhesive resin and a heat shrinkage temperature Y of the adhesive tape The peeling adhesive resin and the fixing jig are used to transfer the semiconductor member to the transfer step of the adhesive tape 201019401; and the picking step of picking up the singulated semiconductor member on the adhesive tape. Moreover, according to the present invention, there is provided a method of manufacturing a semiconductor member comprising the step of applying a bonding resin to a semiconductor member, temporarily fixing the semiconductor member to a fixing jig via an adhesive resin, and singulating the singulation; a bonding step of bonding the adhesive tape to the sheet-like semiconductor member; peeling the adhesive from the adhesive resin immersed in a temperature range between the adhesive strength lowering temperature X of the adhesive resin and the heat shrinkage temperature γ of the adhesive tape a step of transferring a semiconductor member to an adhesive tape by a jig, a second bonding step of laminating the adhesive tape on the adhesive resin, and peeling off from the singulated semiconductor member together with the adhesive resin a second stripping step of tape stripping; and a picking step of picking up the singulated semiconductor component on the adhesive tape. According to the semiconductor manufacturing method formed by the above configuration, a method of manufacturing a semiconductor member excellent in peeling property, transfer property, and crystal pick-up property can be provided. According to the state of the present invention, the temperature of the liquid used in the transfer step is 40 ° C or more and 100 ° C or less. Further, according to the state of the present invention, in the transfer step, the semiconductor member is placed on the adhesive tape side, and the semiconductor member is immersed in the liquid under the adhesive resin and the fixing jig side. Further, in the transfer step, the semiconductor member is floated in the liquid via the adhesive tape, and the fixing jig is freely dropped together with the adhesive resin. Further, according to the state of the present invention, the base film of the adhesive tape is a propylene-based copolymer. The method for producing a semiconductor member according to any one of claims 1 to 6, wherein the adhesive layer of the adhesive tape contains 100 parts by mass of a (meth) acrylate copolymer, 0.5 parts by mass or more and 20 parts by mass or less of the polyfunctional isocyanate-based curing agent, 20 parts by mass or more and 200 parts by mass or less of the urethane oligoacrylate having 4 or more vinyl groups, and 0.1 parts by mass or more and 10 parts by mass of the enamel-modified acrylic resin. The following. According to the present invention, a method for producing a ruthenium semiconductor member excellent in peelability, transfer property, and crystal pick-up property can be provided. [Embodiment] Hereinafter, an embodiment of a method for producing a semiconductor member of the present invention and a method of using the same will be described in detail. The embodiment of the adhesive tape is not limited to the embodiment of the present invention. The method for manufacturing a semiconductor member according to the present embodiment includes applying an adhesive resin to the semiconductor member via an adhesive resin. a singulation step in which a semiconductor member is temporarily fixed to a fixing jig and singulated; a bonding step of bonding an adhesive tape to a semiconductor member which has been singulated in a single piece; and a temperature lowering from a bonding force of the adhesive resin X, a liquid member having a temperature range between the heat shrinkage temperature Y of the adhesive tape, and a conductor member which has been singulated, peeling the adhesive resin and fixing jig, and transferring the semiconductor member to the transfer step of the adhesive tape; picking up the adhesive A method of fabricating a semiconductor member with a pick-up step of a semiconductor component that has been singulated. <Single-sheeting step> The semiconductor member used in the singulation step of applying the adhesive resin to the semiconductor member and temporarily fixing the semiconductor member to the fixing jig via the adhesive tree 201019401 grease and singulating the dicing is round Plate-shaped silicon wafer, glass, gallium arsenic (GaAs). As the adhesive resin, an acrylic resin or an epoxy resin is preferably used. As a fixing jig, there are glass and ceramics. As a method of singulating a semiconductor member, there is a cutting, etching, or the like by a dicing blade having diamond honing particles. <Finishing Step> The bonding step of laminating the adhesive tape on the singulated semiconductor member is, for example, a semiconductor member which is singulated without a build-up layer or which is maintained in a disk shape by an adhesive resin. The surface of the adhesive resin is adhered to the surface of the adhesive tape, and the bonding method is, for example, roll pressing or vacuum pressing. <Transfer step> The peeling of the adhesive resin from the semiconductor member which has been immersed in the liquid which is immersed in the temperature range between the adhesive force lowering temperature X of the adhesive resin and the heat shrinkage temperature γ of the adhesive tape The fixing jig transfers the semiconductor member 至 to the transfer step of the adhesive tape. Specifically, the semiconductor member is transferred to the adhesive tape by peeling off the adhesive resin and the fixing jig from the semiconductor member. In the method of the peeling, the transfer step can be achieved by immersing in a liquid having a temperature range between the adhesive strength lowering temperature X of the adhesive resin and the heat shrinkage temperature γ of the adhesive tape. The adhesive force of the subsequent resin lowers the temperature X, and the heat shrinkage temperature Y of the adhesive tape must be x. <Y relationship, the temperature of the liquid T must be X <T <Y relationship. Then, the force lowering temperature differs depending on the synthetic resin used as the adhesive film and the base film of the 201019401 tape. When the lower limit of the temperature T of the liquid is set, the adhesive strength of the adhesive resin tends to be less likely to decrease. When the upper limit of 値 is set, there is a tendency for the adhesive tape to shrink. Specifically, the lower limit of the liquid is 40 ° C, preferably 75 ° C, and the upper limit is 120 ° C, preferably 100 ° C. In terms of liquid, although it is water or oil, it is considered. Water is preferred for the influence of the semiconductor member. In the transfer step, it is preferably disposed from the top to the bottom in accordance with the adhesive tape, the semiconductor crucible member, the adhesive resin, and the fixing jig, and is further immersed in the liquid. In other words, in the transfer step, it is preferable that the semiconductor member is placed on the adhesive tape side, and the semiconductor member is placed on the adhesive resin and the fixing jig side, and is immersed in the liquid. By immersing in this configuration as described above, the adhesive resin can be peeled off due to the weight of the fixing jig itself and the adhesive force of the adhesive resin. Since the peeling is carried out in this configuration, it is free to fall by its own weight, thereby suppressing adhesion. The load at the time of peeling of the fixing resin fixing jig is not changed, and the singulated semiconductor members are separated from each other when the singly-sliced semiconductor member is transferred to the adhesive tape, thereby preventing the immersion in the liquid. The chipped semiconductor member is broken and defective, and at the same time, it is possible to promote the penetration of the liquid of the adhesive resin and shorten the transfer time. The peeling interface in the transfer step by the adhesive force of the adhesive resin is between the semiconductor member and the adhesive resin, or between the adhesive resin and the fixing clip. In the latter case, the release tape is bonded to the adhesive resin, and the peeling of the tape is removed from the taped 201019401 from the singulated semiconductor member together with the adhesive resin. (Adhesive tape) The adhesive tape is composed of a substrate and an adhesive layer, and the adhesive layer has an adhesive which lowers the adhesive temperature of the adhesive resin to lower the temperature and lower the adhesive force. (Substrate of Adhesive Tape) The base material of the adhesive tape is preferably a material which is deformed by swelling or shrinkage even if immersed, and may be a synthetic resin or a metal. As the shape of the substrate, there are films, sheets, and sheets. The thickness of the substrate is preferably 50 μm or more and 250 μm or less. More preferably, the limit is 70 μιη, and the upper limit is 150 μιη. When the thickness of the substrate is reduced, the substrate tends to be broken during the extension of the crystal picking step, and the thickness of the substrate tends to be deteriorated. As a synthetic resin used as a substrate for an adhesive tape, there are PVC (polyvinyl chloride), polyethylene, PET (polyethylene terephthalate), EVA (ethylene-vinyl acetate copolymer), ethylene-acrylic acid. The ethyl ester copolymer, the polypropylene, the propylene copolymer, the ethylene-acrylic acid copolymer, the ionic polymer resin, and the polyimine. Among them, a PET or a propylene copolymer is preferable, and a propylene copolymer is more preferable. As the metal used as the base material of the adhesive tape, there are stainless steel, copper, and aluminum. The substrate ' may be a mixture of synthetic resins, a copolymer, a laminate of synthetic resins, a laminate of metals, and a laminate of a synthetic resin and a metal. When the propylene-based copolymer is selected as the substrate, the deformation of the semiconductor member at the time of no immersion and the change of the semiconductor member at the time of peeling do not occur, and at the same time, in the following crystal picking step, better crystal pick-up property is obtained. Examples of the propylene-based copolymer include a random copolymer of propylene and other components, a block copolymer of propylene and other components, and an alternating copolymer of propylene and other components. Examples of the other component include α-olefins such as ethylene, 1-butene, 1-pentene, 1-hexene, and 1-heptene; and copolymers composed of at least two or more (X-olefins). The styrene-diene copolymer, etc., among them, is preferably butylene. Therefore, it is possible to particularly suppress the cutting chips generated when the semiconductor member is cut. (Adhesive of adhesive tape) as adhesion In terms of the adhesive, there are polymers of polymerized acrylic acid, methacrylic acid and their ester monomers; copolymerization of unsaturated monomers copolymerizable with their monomers (for example, vinyl acetate, styrene, The copolymer of acrylonitrile, among them, is preferably a (meth) acrylate copolymer. In the adhesive layer, it is also possible to use a luminescence by ultraviolet light or radiation. a photocurable pressure-sensitive adhesive having at least two photopolymerizable carbon-carbon double bonds in a molecule, such as an acrylate compound or an urethane acrylate oligomer, in a networked molecule ( (Meth)acrylate copolymer) used as an adhesive tape The (meth) acrylate copolymer of the adhesive is not particularly limited, and a main monomer of a copolymer (meth) acrylate and another monomer of a vinyl compound are used. The vinyl compound monomer is preferably used having a hydroxyl group, One or more functional group-containing monomers in the functional group consisting of a carboxyl group, an epoxy group, a decylamino group, an amine group, a methylol group, a sulfonic acid group, a 201019401 sulfamic acid group, and a (phosphite) group. Examples of the main monomer of (meth) acrylate include butyl (meth)acrylate, 2-butyl (meth)acrylate, tert-butyl (meth)acrylate, and amyl (meth)acrylate. , octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, decyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, (methyl) Methyl acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, hexadecyl (meth) acrylate, ( Octadecyl methacrylate, cyclohexyl (meth)acrylate (meth)isodecyl acrylate, dicyclopentanyl (meth)acrylate, benzyl (meth)acrylate, methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, (methyl) ) Butoxymethyl acrylate, and ethoxypropyl (meth) acrylate, etc. As the monomer having a functional group, for example, a hydroxyl group, a carboxyl group, an epoxy group, a decylamino group, an amine group, a hydroxymethyl group, A vinyl compound having a sulfonic acid group, an amine sulfonic acid group, or a (phosphite) group as a functional group. As a monomer having a hydroxyl group, exemplified is 2-hydroxyethyl (meth)acrylate or (meth)acrylic acid. -2-hydroxypropyl ester, and 2-hydroxybutyl (meth)acrylate, etc. As the monomer having a carboxyl group, for example, (meth)acrylic acid, crotonic acid, maleic acid, maleic anhydride, and itaconic acid are exemplified. , fumaric acid, decylamine-N-glycolic acid, cinnamic acid, etc. As the monomer having an epoxy group, examples include allyl epoxypropyl ether, and (meth)acrylic acid propylene-propylene Ether and the like. Examples of the monomer having a guanamine group include (meth) acrylamide and the like. -10-201019401 Examples of the monomer having an amine group include N,N-dimethylaminoethyl (meth)acrylate and the like. As the monomer having a methylol group, N-methylol acrylamide or the like is exemplified. As a method for producing the (meth) acrylate copolymer, a known method such as emulsion polymerization or solution polymerization can be used. The acrylic rubber which can be produced by emulsion polymerization is preferably a method in which the adhesive tape can be easily peeled off from the semiconductor member after irradiation with radiation. (Polyfunctional isocyanate curing agent) φ is a polyfunctional isocyanate curing agent used as an adhesive for an adhesive tape, and is not particularly limited as long as it has two or more isocyanate groups, and examples thereof include aromatic polyisocyanate, aliphatic polyisocyanate, and fat. Ring polyisocyanate and the like. The aromatic polyisocyanate is not particularly limited, and examples thereof include 1,3-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, and 1,4-phenylene diisocyanate, 4, 4'-Diphenylmethyl diisocyanate, toluene 2,4-diisocyanate, toluene 2,6-diisocyanate, toluidine 4,4'-diisocyanate, 2,4, Toluene 6-triisocyanate, phenyl 1,3,5-triisocyanate, dimethoxyaniline diisocyanate, diphenyl ether 4,4'-diisocyanate, 4, 4',4"-triphenylmethyl triisocyanate, ω,ω'-diisocyanate-1,3-dimethylphenyl ester, ω,ω'-diisocyanate-1,4-two Methyl phenyl ester, ω, ω'-diisocyanate-1,4-diethyl phenyl ester, 1,4-diisocyanato tetramethyl decyl ester, and 1,3-diisocyanate Methyl decyl ester, etc. The aliphatic polyisocyanate is not particularly limited, and examples thereof include diisocyanate propyl ester, butyl diisocyanate, diisohexyl hexyl ester, diisocyanate pentyl ester, diisofluoric acid. 1,2-propenyl ester, diisocyanate 2,3-butyl butyl ester, two 201019401 isocyanate-1,3-butylene ester, diisocyanate didecyl ester, and diisocyanate-2,4 , 4-trimethyl extension Ester, etc. The alicyclic polyisocyanate is not particularly limited, and examples thereof include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-diisocyanate cyclopentyl ester, and diisocyanate. Cyclohexyl 1,3-diisocyanate, cyclohexyl 1,4-diisocyanate, methylcyclohexyl 2,4-diisocyanate, methyl 2,6-diisocyanate Hexyl ester, 4,4'-methylenebis(cyclohexyl isocyanate), 1,4-bis(isocyanatomethyl)cyclohexane, and 1,4-bis(methyl isocyanate) Cyclohexane, etc. 之中 Among the polyisocyanates, phenyl diisocyanate, 4,4'-diisocyanate, 1,4-diisocyanate, 4 , 4'-diphenylisophthalate, 2,4-diisocyanate, 2,6-diisocyanate, 4,4'-diisocyanate, diiso The mixture ratio of the polyfunctional isocyanate curing agent is preferably 0.1 parts by mass or more and 20 parts by mass or less, more preferably 0.5% by mass based on 1 part by mass of the ((meth) acrylate copolymer). The mass part is the lower limit and the upper limit is 10 parts by mass. ® If the polyfunctional isocyanate hardener is 0.1 part by mass or more, The adhesive force is not too strong, and the occurrence of picking failure can be suppressed. Further, if the polyfunctional isocyanate hardener is 20 parts by mass or less, the adhesive force is not lowered, and the single sheet in the transfer step at the time of liquid immersion is maintained. The retention of the semiconductor member is good. (Amino acid acrylate oligomer having four or more vinyl groups) As the urethane oligo acrylate having four or more vinyl groups as an adhesive for the adhesive tape (hereinafter, referred to as The "acrylic acid acrylate oligomer".), -12-.201019401 is not particularly limited as long as it is a (meth) acrylate oligomer having four or more vinyl groups and having an amine ester bond in the molecule. The method for producing the urethane acrylate oligomer is not particularly limited, and examples thereof include a (meth) acrylate compound having a hydroxyl group and a plurality of (meth) acrylate groups, and a compound having a plurality of isocyanate groups (for example, a diisocyanate). The compound is reacted to form an acrylate oligo oligomer. In a polyol oligomer having a plurality of hydroxyl terminals, a compound having a plurality of isocyanate groups (for example, a diisocyanate compound) is added and reacted to form an oligomer having a plurality of isocyanate terminals, and further, The (meth) acrylate compound having a hydroxyl group and a plurality of (meth) acrylate groups is reacted to form an urethane acrylate oligomer. As the (meth) acrylate compound having a hydroxyl group and a plurality of (meth) acrylate groups, hydroxypropylated trimethylolpropane triacrylate, neopentyl alcohol triacrylate, and dipentaerythritol are exemplified. Part or all of hydroxypentaacrylate, bis(neopentitol) tetraacrylate, tetrahydroxymethane triacrylate, propylene glycol diacrylate, or some of these acrylates are methyl acrylate-based Compounds, etc. Examples of the isocyanate having a plurality of isocyanate groups include an aromatic isocyanate, an alicyclic isocyanate, and an aliphatic isocyanate. Among the isocyanates, a plurality of isocyanate groups, aromatic isocyanates or alicyclic isocyanates are suitable. The form of the isocyanate component is a monomer, a dimer, a trimer, and a trimer. Examples of the aromatic diisocyanate include toluene diisocyanate, diphenyl methyl 4,4-diisocyanate, and didecyl isocyanate. -13- 201019401 Examples of the alicyclic diisocyanate include isophorone diisocyanate, methylene bis(isocyanate-4-cyclohexyl ester) and the like. Examples of the aliphatic diisocyanate include dihexyl isocyanate, trimethylhexyl diisocyanate, and the like. Examples of the polyol component include poly(propylene oxide) glycol, poly(propylene oxide) triol, copolymerized (ethylene oxide propylene oxide) glycol, poly(butylene oxide) glycol, and ethoxylation. Bisphenol A, ethoxylated bisphenol S spiroglycerol, caprolactone modified diol, carbonate diol, and the like. 〇 If the number of vinyl groups of the vinyl acrylate oligomer having a vinyl group is four or more, the peeling of the semiconductor member of the adhesive tape after radiation irradiation is easy, so that the crystal pick-up property can be improved. The amount of the urethane acrylate oligomer having four or more vinyl groups is not particularly limited, and is preferably 20 parts by mass or more and 200 parts by mass or less based on 100 parts by mass of the (meth) acrylate copolymer. When the amount of the urethane acrylate oligomer having four or more vinyl groups is 20 parts by mass or more, the peeling of the semiconductor member of the adhesive tape after the irradiation of the radiation becomes easy, and the problem of the crystallinity of the pick-up can be suppressed. Further, when the amount of the urethane acrylate oligomer having four or more vinyl groups is 200 parts by mass or less, the retention of the singulated semiconductor member in the transfer step during immersion in a liquid can be maintained. (矽-modified acrylic resin) A tamper-modified acrylic resin used as an adhesive for an adhesive tape, which is a monomer having a vinyl group at a terminal of a polydimethylcyclodecane bond (hereinafter, referred to as "lanthanum macromonomer"), except for the monomer unit having a vinyl group at the terminal of the polydimethylsiloxane linkage, in addition to -14-201019401 There is no particular limitation, and examples thereof include a homopolymer of a lanthanoid macromonomer or an ethylene polymer composed of a polymerized lanthanide macromonomer and another vinyl compound. The fluorene-based macromonomer is a compound of a vinyl group such as a (meth) acryl fluorenyl group or a styryl group, which is a terminal of a polydimethyl siloxane chain (see, for example, JP-A-2000-080135). As the (meth)acrylic monomer, in addition to the alkyl (meth)acrylate φ, there are hydroxyalkyl (meth)acrylate, modified hydroxy (meth) acrylate, and (meth)acrylic acid. Wait. Examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, and (methyl). Isobutyl acrylate 'tert-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, dodecyl (meth)acrylate, octadecyl (meth)acrylate, and (a) The base is isodecyl acrylate, and the hydroxyalkyl (meth) acrylate or the like. Examples of the hydroxyalkyl (meth) acrylate include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate. Examples of the modified hydroxy (meth) acrylate include ethylene oxide-modified hydroxy (meth) acrylate and lactone-modified hydroxy (meth) acrylate. In the case of using (meth)acrylic acid, after synthesizing the ruthenium-modified acryl resin, it is reacted with acrylic acid such as epoxy propyl (meth)acrylate having an epoxy group to obtain a polymer having a vinyl group. -15- 201019401 In order to prevent the micro-paste residue called microparticles, it is suitable to use reactive hydroxyalkyl (meth)acrylate, or modified hydroxy (meth) acrylate, and tampering with at least one vinyl group. The ratio of the macromonomer unit of the oxime-modified acrylic resin is not particularly limited, but in 100 parts by mass of the ruthenium-modified acrylic resin, the lanthanide macromonomer unit is preferably 15 parts by mass or more and 50% by mass. The following. When the content of the lanthanum macromonomer is 15 parts by mass or more, the adhesive tape after the radiation irradiation can be easily peeled off from the semiconductor member, and the pick-up property can be improved. Further, if the content of the lanthanoid macromonomer unit is 50 parts by mass or less, the singulated semiconductor member retainability in the transfer step at the time of immersion in a liquid can be maintained. The amount of the hydrazine-modified acrylic resin is not particularly limited, but is preferably 0.1 part by mass or more and 10 parts by mass or less based on 100 parts by mass of the (meth) acrylate polymer. When the amount of the enamel-modified acrylic resin is 0.1 part by mass or more, the adhesive tape after the radiation irradiation can be easily peeled off from the semiconductor member, and the crystal pick-up property can be improved. Further, when the amount of the blending amount of the hydrazine-modified acrylic resin is ί or less by mass, the singulated semiconductor member retainability in the transfer step at the time of immersion in the liquid can be maintained. Various additives such as a polymerization initiator, a softener, an anti-aging agent, a chelating agent, an ultraviolet absorber, and a photostabilizer may be added to the adhesive layer. The thickness of the adhesive layer is not particularly limited, but is generally 5 μm or more and ΙΟΟμιη or less, preferably about 5 μm to 40 μm. The method of forming an adhesive layer on a base film to form an adhesive tape is not particularly limited by 201019401, and examples thereof include a gravure coater, a comma coater, a bar coater, and a knife coater. A method in which an applicator such as a roll coater directly applies an adhesive to a substrate. The adhesive layer can also be printed on the substrate film by letterpress printing, gravure printing, lithography, elexo printing, offset printing, or screen printing. (adhesive resin) The following resin must have the adhesive strength reduction temperature X relative to the adhesive tape shrinkage temperature Y is X <Y relationship, liquid temperature T is low, X φ <Τ <The relationship of ruthenium, preferably the adhesive resin may be such that the semiconductor member is not displaced due to swelling even if it is in contact with water. Specifically, it is preferably hydrophobic or insoluble or insoluble even if it is in contact with water. The adhesive resin having such a property includes an acrylic resin, an amine ester-based adhesive, and an epoxy-based adhesive. Preferably, the acrylic-based resin is preferably a hydrophobic (Α) polyfunctional (A) A group consisting of acrylate, (Β) monofunctional (meth) acrylate, and (C) poly Φ starting agent. It is preferably 100 parts by mass based on the total amount of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate, and may contain 50 to 97 parts by mass, (C) polymerization. Starting agent 〇. 1 to 20 parts by mass" (A) The amount of polyfunctional (meth) acrylate added in (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate The total amount of the esters is preferably from 3 to 50 parts by mass in 1 part by mass. (A) When the amount of the polyfunctional (meth) acrylate to be added is small, the property of peeling off from the semiconductor member when the cured body of the resin is not heated is exhibited (hereinafter, simply referred to as "peelability"). When there is a tendency for a long time, there is a tendency that the initial adhesion is lowered. ((A) Polyfunctional (meth) acrylate) As the (A) polyfunctional (meth) acrylate used as the adhesive resin, it is possible to use two or more at the oligomer/polymer terminal or side chain. (Methyl) a propylene-derived polyfunctional (meth) acrylate oligomer/polymer or a monomer of two or more (meth) acrylonitrile groups. G polyfunctional (meth) acrylate oligomer/polymer, for example, 1,2-polybutadiene terminal (meth) acrylate (for example, TE-2000, TEA-1000, manufactured by Japan Soda Co., Ltd.) 1,2, polybutadiene terminal (meth) methacrylate hydride (for example, TEAI-1000 manufactured by Nippon Soda Co., Ltd.), 1,4-polybutadiene terminal (meth) acrylate (for example, Osaka Organic Chemical Co., Ltd. BAC-45), polyisoprene terminal (meth) acrylate, polyester (meth) acrylate, polyether (meth) acrylate, polyester (methyl) Acrylate, bis-A-type epoxy (meth) acrylate (for example, VISCOTE #540 manufactured by Osaka Organic Chemical Co., Ltd., VISCOTE VR-77 manufactured by Showa Polymer Co., Ltd.). Examples of the bifunctional (meth) acrylate monomer include 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, and 1,6-hexyl Diol di(meth)acrylate, i,9-nonanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, 2- Ethyl-2-butyl propylene glycol (meth) acrylate, neopentyl glycol modified trimethylol propyl (meth) acrylate, tripropyl octadecyl -18 - 201019401 pentaerythritol II Acrylate, polypropylene glycol di(meth)acrylate, 2,2-bis(4-(methyl)propenyloxydiethoxyphenyl)propane, 2,2-bis(4-(methyl)propenyloxy Propoxyphenyl)propane, 2,2-bis(4-(methyl)acryloxytetraethoxyphenyl)propane, and the like. Examples of the trifunctional (meth) acrylate monomer include trimethylolpropyl tris(meth)acrylate and gin[(methyl) propylene oxime ethyl]isocyanate. Examples of the tetrafunctional or higher (meth) acrylate monomer include dimethylol (meth) acrylate, neopentyltetrakis (meth) acrylate, and neopentyl alcohol ethoxylate. Tetrakis(methyl) φ acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate. ((B) Monofunctional (meth)acrylic monomer) As the (B) monofunctional (meth)acrylic monomer used as the adhesive resin, methyl (meth)acrylate or (meth)acrylic acid is exemplified. Ethyl ester, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, isodecyl (meth) acrylate, Dodecyl (meth)acrylate, octadecyl (meth)acrylate, phenyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentene (methyl)acrylate, (methyl) Dicyclopentenyl acrylate, dicyclopentenyloxyethyl (meth)acrylate, isodecyl (meth)acrylate, methoxylated cyclotridecene (meth)acrylate, (meth)acrylic acid 2-hydroxyethyl ester, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, tetrahydro(meth)acrylate Oxime ester, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycidyl (meth)acrylate, caprolactone modified (meth) propylene Tetrahydrofurfuryl ester, 3-chloro-2-hydroxypropyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, (meth)acrylic acid-19-.201019401 -N , N-diethylaminoethyl ester, tert-butylaminoethyl (meth)acrylate, ethoxycarbonylmethyl (meth)acrylate, phenol-based ethylene oxide modified acrylate, acrylic phenol (epoxy Ethane 2 molar modified ester, acrylic phenol (ethylene oxide 4 molar modified) ester, p-isopropenyl based ethylene oxide modified acrylate, nonylphenol based ethylene oxide modified acrylic acid Ester, decyl acrylate (ethylene oxide 4 molar modified) ester, decyl acrylate (ethylene oxide 8 molar modified) ester, decyl acrylate (propylene oxide 2.5 molar modified) ester, 2 - Ethylhexacarbitol acrylate, Ethylene oxide modified phthalic acid (meth) acrylate, Ethylene oxide modified succinic acid (meth) acrylate, Trifluoroethyl (meth) acrylate Ester, acrylic acid, methacrylic acid, maleic acid, fumaric acid, ω-carboxypolycaprolactone mono(meth)acrylate, monohydroxyethyl (meth)acrylate, (methyl) Acrylic acid dimer, β-(meth)acryloyloxyethyl hydrogen succinate, n-(meth) propylene oxyalkyl hexahydroimide, and the like. The (C) polymerization initiator to be incorporated in the adhesive resin is preferably used in combination with an active light sensitized by visible light or ultraviolet rays to promote photohardening of the adhesive resin, and various photopolymerization initiators recognized can be used. . The amount of the (C) polymerization initiator added is 100 parts by mass, preferably 0.1 to 20 parts by mass based on the total of (Α) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate. Share. More preferably, it is 3 to 20 parts by mass. When the amount is 0.1 part by mass or more, the effect of promoting the hardening is surely obtained, and if it is 20 parts by mass or less, a sufficient curing rate can be obtained. In a more preferable form, by adding 3 parts by mass or more of the component (C), it is possible to harden without depending on the amount of light irradiation, and the degree of crosslinking of the cured body of the adhesive resin is increased, and it is not formed during the cutting process. It is better than the viewpoint of causing dislocation and other viewpoints or improving the stripping property than *20-201019401. As the (C) polymerization initiator, specifically, diphenyl ketone and derivatives thereof; benzyl group and derivatives thereof; hydrazine and its derivatives; benzoin, benzoin methyl ether, benzoin ethyl ether, A benzoin derivative such as benzoin propyl ether, benzoin butyl ether, benzyl dimethyl ketal or the like; an acetophenone derivative such as diethoxyacetophenone or 4-tert-butyltrichloroacetophenone; 2-dimethylaminoethyl benzoate, p-dimethylaminoethyl benzoate, diphenyl disulfide, 9-oxosulfanthene and its derivatives; camphorquinone, 7,7-dimethyl- 2,3-di-side oxy φ-bicyclo[2.2.1]heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dihydroxybicyclo[2.2.1]hept-1-carboxyl- 2-bromoethyl ester, 7,7-dimethyl-2,3-di-oxybicyclo[2.2.1]hept-1-carboxy-2, methyl, 7,7-dimethyl-2,3 - a cerebral oxime derivative such as a di-oxy-linked ring [2.2.1] hep-l-carboxylic acid chloride; 2-methyl-1-[4-(methylthio)phenyl]-2-? Alpha-aminoalkylphenone derivatives such as phenylpropan-1-one, 2-benzyl-2-dimethylamino-1-(4-fosinophenyl)-butan-1-one; benzoic acid Brewed diphenylphosphine, oxidized 2,4,6-trimethylbenzimidium diphenylphosphine, benzamidine diethoxyphosphine oxide, 2,4,6-trimethylbenzimidium dimethoxy® phenylphosphine, oxidation 2 a phosphinylphosphine derivative such as 4,6-trimethylbenzhydryldioxyphenylphosphine or the like. The photopolymerization initiator may be used in combination of one type or two types or more. In the present invention, a polar organic solvent may also be used in the adhesive resin. By sharing a polar organic solvent, the resin layer can be brought into contact with the liquid to be easily swollen to lower the bonding strength. The amount of the polar organic solvent added is 0.1 to 201019401 parts, preferably 0.5 to 1 part, based on the total amount of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylic acid. 〇 mass parts. When it is 5 parts by mass or more, the peeling property can be ensured, and if it is 1 part by mass or less, the initial adhesiveness is not lowered, and the adhesive resin tends to be peeled off into a film form. In the polar organic solvent, the adhesion of the adhesive resin to the liquid is further lowered, so that the boiling point is lowered. Therefore, the boiling point is preferably from 30 ° C to 200 ° C. The polar organic solvent may be an alcohol, a ketone or an ester, preferably an alcohol. Examples of the alcohols include methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, t-butyl alcohol, t-butyl alcohol, n-pentanol, isoamyl alcohol, and 2- Ethyl butanol and the like. Further, among the above alcohols, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol, and third butanol having a boiling point of 120 ° C or less are preferred. More preferably, it is methanol, ethanol, isopropanol or n-butanol. In the present invention, (A) a polyfunctional (meth) acrylate and (B) a monofunctional (meth) acrylate and a particulate substance which is insoluble in the (C) polymerization initiator may be used. Therefore, since the resin layer can maintain a constant thickness, the thickness accuracy is improved. The amount of the particulate matter to be added is preferably 0.1 to 20 parts by mass, more preferably 0.1 to 20 parts by mass, based on 100 parts by mass of the total of (A) the polyfunctional (meth) acrylate and (B) the monofunctional (meth) acrylate. It is 0.1 to 10 parts by mass. When the amount is 0.1 part by mass or more, the film thickness of the adhesive resin is slightly fixed, and if it is 20 parts by mass or less, there is no possibility that the initial adhesion is lowered. The material of the granular material is generally organic particles or inorganic particles used. Specifically, examples of the organic particles include polyethylene particles, polypropylene-22-201019401 olefin particles, crosslinked polymethyl methacrylate particles, and crosslinked polystyrene particles; and examples of the inorganic particles include glass. Ceramic particles such as cerium oxide, aluminum oxide, and titanium oxide. The material of the particulate material is preferably spherical and has a fixed particle size, a small amount of deformation of the particles, and a small unevenness in particle diameter from the viewpoint of uniformly controlling the film thickness of the adhesive resin. Preferred organic particles having such a condition are obtained as a monodisperse particle by a known emulsion polymerization method using a methyl methacrylate monomer, a styrene monomer, and a crosslinkable monomer. The ruthenium methacrylate particles, the crosslinked polystyrene particles or the inorganic particles have spherical cerium oxide. Further, among the particulate materials, from the viewpoint of storage stability such as particle sedimentation or reactivity of the composition, crosslinked polymethyl methacrylate particles and crosslinked polystyrene particles are more preferable. The adhesive resin of the present invention may be used in various elastomers and inorganics such as acrylic rubber, amine ester rubber, ABS (acrylonitrile-butadiene-styrene rubber) generally used in the range which does not impair the object of the present invention. Additives such as chelating agents, solvents, extenders, reinforcing materials, plasticizers, tackifiers, dyes, pigments, flame retardants, polymerization inhibitors, decane coupling agents, and surfactants. (Method of Coating Adhesive Resin) A method of applying an adhesive resin to a semiconductor member can be carried out using a bar coater, a spray gun, a spin coater or the like. (Release tape) The release tape is composed of a base material and an adhesive layer, and the adhesive force between the adhesive resin and the peeling tape is higher than that between the semiconductor member and the adhesive resin -23-201019401. (Substrate of release tape) The base material of the release tape may be a synthetic resin. The shape is a film or a sheet. The thickness of the substrate may be 50 μm or more and 25 μm or less. A preferred lower limit is 7 〇 μm, and a preferred upper limit is 150 μm. As the synthetic resin used as the substrate of the release tape, there are PVC (polyvinyl chloride) 'polyethylene, PET (polyethylene terephthalate), EVA (ethylene vinyl acetate copolymer), ethylene-acrylic acid. Ethyl ester copolymer, fluorene polypropylene, propylene-based copolymer, ethylene-acrylic acid copolymer, ionic polymer resin, polyimine, among which EVA (ethylene-vinyl acetate copolymer), ethylene-acrylic acid B is preferred Ester copolymer. The substrate may also be a laminate of a mixture of synthetic resins, a copolymer, and a synthetic resin. (Adhesive for peeling tape) The adhesive for the release tape may be an acrylic adhesive, an amine ester adhesive, or a polyoxygen adhesive, and is preferably an acrylic adhesive. As the acrylic adhesive, there are polymers of polymerized acrylic acid, methacrylic acid and their respective ester monomers; and unsaturated monomers copolymerizable with their monomers (for example, vinyl acetate, styrene, propylene) The copolymer copolymerized with nitrile is preferably a (meth) acrylate copolymer among the binders. In the adhesive layer, a low molecular weight compound having at least two or more intramolecular photopolymerizable carbon-carbon double bonds in a three-dimensional network in the molecule may be used by irradiation or irradiation of either ultraviolet rays or radiation. For example, a photocurable pressure-sensitive adhesive such as an acrylate compound or an urethane acrylate oligomer is used. -24- 201019401 Various additives such as a binder, a softener, an anti-aging agent, a chelating agent, an ultraviolet absorber, and a fixing agent may be added to the adhesive layer of the release tape. The thickness of the adhesive layer of the release tape is not particularly limited, but is 5 μm or more and 1 μm or less, preferably 5 μm is the lower limit, and _[ is the upper limit. The adhesive layer is formed on the base film to be an adhesive tape, and a coating machine such as a gravure coater, a bar coater, a squeegee machine, or a roll coater is directly exemplified on the substrate. Coating method. It is also possible to print an adhesive (fixing jig) on a base film by a relief printing, a gravure printing, a lithography, a brush, an offset printing, a screen printing, a brush, etc., as a fixing jig, via an adhesive resin fixing member. When the semiconductor member has a plate shape, it may be a smooth material, a singular or a membranous body, or a laminate of two or more kinds. Fixing materials are metal plate-like bodies such as stainless steel, aluminum and iron; synthesis of acrylic acid, polycarbon® ABS (acrylonitrile-butadiene-styrene), PET, nylon, amine imide, polyolefin or PVC Resin; glass, ceramic, etc. In the present invention, the fixing jig preferably transmits a wavelength of 20% or more. It does not take much time to pass through the adhesive resin at a wavelength of 365 nm or more. The fixing degree is not particularly limited as long as the above conditions are satisfied, and is preferably ΙΟΟμπι to more preferably 2 to 5 mm. The transmittance was measured using TOPCON UVR-2 as a measuring machine based on a transmittance of 365 nm. The starting and the light security are generally the flexographic printing layer of the k 40μιη method without the blade coating. The semiconductor is made of a plate holder, and the polycondensate is 3 5 5 nm, and the thickness of the hard part is 10 mm. The company is manufactured by -25-201019401. [Embodiment] The embodiment of the method for manufacturing a semiconductor member of the present invention is used. To illustrate. The method of manufacturing a semiconductor member in this embodiment is a one having a singulation step, a bonding step, a transfer step, and a picking step. The following 'describes individual steps. Also, the first to tenth figures are model display persons, which are different from the actual reduction scale. <Singulation step> φ In the singulation step, 20 μm of the adhesive resin 2 was applied onto the semiconductor member 1 (the 矽 wafer having a diameter of 8 Å and a thickness of 725 μm) by a spin coater, followed by affixing A fixing jig 3 (glass plate) having a thickness of 700 μm was used, and 10 kg was added to form a uniform surface, and the adhesive resin was cured by black light at a wavelength of 365 nm at 300 μm/cm 2 , and then diced. The fixing jig 3 is a glass plate that transmits light of 80% wavelength and 365 nm. The dicing was performed using a DAD 341 (not shown) manufactured by DISCO Corporation, and the dicing blade was manufactured using a NBC-ZH205O-27HEEE (illustration © omitted) manufactured by DISCO Corporation at a wafer size of 7.2 mm x 1 4.4 mm. The state after the singulation step is shown in Figure 1 "<Finishingstep> In the bonding step, the adhesive resin is further hardened at a wavelength of 365 nm at 16000 m J/cm 2 by using a curing device (not shown) manufactured by FUSION Co., Ltd. using an electrodeless discharge lamp. Thereafter, the adhesive tape 4 is bonded to the divided wafer surface of the semiconductor member 1 after the singulation step by using a roller mounting machine via the annular frame 5. The state after the bonding step is shown in Figures 2-26-201019401. <Transfer Step> In the transfer step, after immersing in warm water 6 at 90 ° C in the original state after the bonding step, the semiconductor member 1 is freely dropped and the adhesive resin 2 and the fixing jig 3 are removed. Stripped down. Fig. 3 shows the state of the immersion, and Fig. 4 shows the state after the free fall. The temperature of the warm water 6 in the transfer step is 90 ° C, and the G heat shrinkage temperature Y of the adhesive tape 4 is set to be lower by setting the adhesive force lowering temperature X of the adhesive resin 2 to be lower than 90 ° C. When the temperature is 90 ° C, the interface between the semiconductor member 1 and the adhesive tape 4 and the interface between the adhesive resin 2 and the fixing jig 3 can be peeled off at the interface between the semiconductor member 1 and the adhesive resin 2 . Further, reference numeral 7 in Fig. 3 denotes a support for supporting the annular frame 5, and reference numeral 9 denotes a container filled with warm water 6. <Picking Step> After the transfer step, the adhesive tape 4 following the annular frame 5 is pulled up in each of the semiconductor members 1 (see Fig. 5), and the substrate is thinned from the adhesive tape 4 On the side (the lower side of Fig. 5), a high-pressure mercury lamp manufactured by USHIO Electric Co., Ltd. was irradiated with ultraviolet rays at 150 mJ/cm2, and after the adhesive layer of the adhesive tape 4 was hardened, CAP-3 0011 made of Canon mechanical other than the one shown in the figure was used. It is carried out under the condition that the needle plug height is 〇.3 mm. The state at the time of picking up is shown in Fig. 6. Fig. 7 is a schematic view showing a cross section of a transfer step in the case of using a release tape. In this method, except that the semiconductor member 1 is changed to form a convergence on the surface thereof (contact surface with the adhesive resin 2). The imide vapor deposited film (not shown) is the same as the above-described method except for the tantalum wafer of -27-201019401. In this method, in order to form a tantalum wafer on which the polyimide film is deposited on the surface of the semiconductor member 1 (contact surface with the adhesive resin 2), the semiconductor member 1 and the adhesive tape 4 are not transferred in the transfer step. The interface, the interface between the adhesive resin 2 and the fixing jig 3 is peeled off at the interface between the adhesive resin 2 and the fixing jig 3. After the transfer step, the release tape 8 is attached to the surface of the adhesive resin 2 (see Fig. 9) in a state of being pulled up from the warm water 6 shown in Fig. 8, and is bonded to each of the adhesive resins 2 Pull off the peeling tape 8 (refer to Figure 10). After that, as shown in Fig. 5 and Fig. 6. Hereinafter, the adhesive tape and the adhesive resin used in the above steps will be described using Table 1. [Table 1] 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Net 90 90 40 100 30 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 Method Semi-conductor · Νΐη^η direction down, down, down, down, down, down, down, down, AAAAABCAAAAAAAAAAAAAA, Keno 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 Adhesive Adhesive 3 3 3 3 3 3 3 0.5 20 0.1 25 3 3 3 3 3 3 3 3 3 3 Band nmwmmme A100 A100 A100 A100 A100 A100 A100 A100 A100 Λ100 A100 A20 A200 A10 A300 B100 A100 A100 A100 A100 A100 Suspect tree 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 0.1 10 αοι 20 2 Peelability ◎ 〇〇 ◎ X ◎ ◎ ◎ ◎ 〇 ◎ ◎ 〇© ◎ ◎ 〇〇 fHfi Transferability ◎ 〇 ◎ X 〇© ◎ ◎ 〇〇 ◎ ◎ © 〇 @ © ◎ © o ft ◎ ◎ ◎ ◎ X ◎ o ◎ 〇 ◎ 〇 © o @ © 〇 @ ◎ 纤 ◎ ◎ o © X 〇〇 ◎ ◎ 〇〇◎ ◎ 〇〇〇◎ ◎ 〇o 〇ntm «1 m -28-201019401 (adhesive tape) adhesive tape-based substrate of the following. Substrate A: propylene-based copolymer (containing propylene, ethylene, 1·butene as a polymerization component, MFR (melt flow rate) 値7.5 g/10 min, density 〇·89 g/cm3 (manufactured by Sunallomer Co., Ltd., X500F)) . The thickness is 80 μm. Substrate Β: a random copolymer of ethylene and vinyl acetate (MFR 値 2·5 g/l , minute, vinyl acetate content 12%, density 0.93 g/cm 3 (manufactured by Mitsui DuPont Poly Chemical Co., Ltd.). Thickness 80 μm η.基材 Substrate C: PET, thickness 38 μm. (Adhesive for adhesive tape) The following are used as the adhesive. The numbers in Table 1 are parts by mass. (Meth) acrylate copolymer: 54% from ethyl acrylate, acrylic acid A copolymer composed of 19% of butyl ester and 24% of methoxyethyl acrylate is obtained by emulsion polymerization (polymerized product of the company). Polyfunctional isocyanate hardener · Trishydroxyl of diisocyanate Commercial product of methyl propane adduct (manufactured by Japan Polyurethane Co., Ltd., product name: CORONATE HL). Amino acid acrylate oligomer A: which is a diisocyanate at the terminal of poly(propylene oxide) glycol. a terminal acrylate oligomer composed of a trimer of a hexamethylene ester (aliphatic diisocyanate) and a terminal acrylate oligomer composed of a reaction of dipentaerythritol pentaacrylate, and a number average molecular weight (?η) 3,700 and the number of acrylate functional groups 15 urethane acrylate oligomers (polymers of the company). Amino acrylate oligomers: 2-hydroxyethyl acrylate reaction at the terminal of poly(propylene oxide) glycol • 29-201019401 a terminal acrylate oligomer composed of a reaction of 2-hydroxyethyl acrylate on a terminal isocyanate oligomer, having a number average molecular weight (?η) of 3,400 and a vinyl group of 2 acrylates per molecule. Ester oligomer (polymerized product of the company) 矽 modified acrylic resin: a fluorene-based oligomer having a (meth) acrylonitrile group at the terminal of a fluorene molecular chain, and polymerization consisting of methyl methacrylate or the like A commercial product of a lanthanide graft copolymer composed of a vinyl acrylate unit (manufactured by Kyoritsu Chemical Co., Ltd., product name: Actflow UTMM-LS2). 0 Although not described in Table 1, in the adhesive of the adhesive tape, 6 parts by mass of any photopolymerization initiator (benzyl dimethyl ketal, commercially available product). For example, the adhesive of the first experiment is formulated with (meth) acrylate copolymer A 100 parts by mass, polyfunctional Isocyanate hardener A 3 parts by mass, C 100 parts by mass of the acid urethane oligomer A, 2 parts by mass of the hydrazine-modified acrylic resin, and 6 parts by mass of the photopolymerization initiator. The adhesive tape was applied to a separator film made of PET. In the above, the thickness of the adhesive layer after drying is ΙΟμηι® coated, laminated on the substrate (adhesive resin). The following resin is compounded with (Α) polyfunctional (meth) acrylate, (Β) Specificity of the monofunctional (meth) acrylate and (C) polymerization initiator. Specifically, 'addition of urethane amide ("UV-3000B" manufactured by Nippon Synthetic Chemical Co., Ltd.) 8 parts by mass of dicyclopentanyl diacrylate (Japan) "KAY ARAD R-684" manufactured by Chemicals Co., Ltd.) 20 parts by mass of a total of 20 parts by mass as (A) polyfunctional (meth) acrylate; acrylic acid 2-(1,2-cyclohexyl-30-201019401 carboxyl group醯imino)ethyl ester ("ARONIXM-140" manufactured by Toagosei Co., Ltd.) 3 parts by mass, dicyclopentenyloxyethyl methacrylate ("QM-657" manufactured by Haas Co., Ltd.) 50 mass a total of 80 parts by mass as methacrylate (B) monofunctional (meth) acrylate; 2_Methyl(methylthio)phenyl]-2 -ofolinin-1 ketone ("ICGACURE907" manufactured by Ciba Specialty Chemicals Co., Ltd.) 2 parts by mass as (C) polymerization initiation 2,2-methylenebis(4-methyl-6-tert-butylphenol) 〇.1 parts by mass as a polymerization inhibitor to prepare an adhesive resin. 〇 (Release tape) The following tapes and adhesives are used for the release tape. Substrate: a random copolymer of ethylene and vinyl acetate (MFR 値 2.5 g/10 min, vinyl acetate content 12%, density 0.93 g/cm 3 , manufactured by Mitsui DuPont Poly Chemical Co., Ltd.) was used to have a thickness of 1 μm By. Adhesive: The adhesive is applied to a separator film made of PET and coated with a thickness of 2 μm of the adhesive layer after drying, and laminated on the substrate. ® (Materials) For the bonding materials of the release tape, the following are used. (Meth) acrylate copolymer: it is ethyl acrylate 54% 'butyl acrylate 19%, methoxy acrylate 24% copolymer' obtained by emulsion polymerization (polymerized by our company) 100 quality A polyfunctional isocyanate curing agent: a commercially available product of a trimethylolpropane adduct of 2,4-toluene diisocyanate (manufactured by Japan Polyurethane Co., Ltd., product name: CORONATE HL) 3 parts by mass - 31 - 201019401 Acrylic acid Amine ester oligomer: a terminal isocyanate oligomer composed of a trimer of diisocyanate (aliphatic diisocyanate) at the terminal of a poly(propylene oxide) glycol, further A terminal acrylic acid oligomer composed of pentaerythritol pentaacrylate anti-eagle, an amine acrylate oligomer having a number average molecular weight (?η) of 3,700 and an acrylate functional group of 15 (a polymerized product of the company) 100 parts by mass of light Polymerization initiator: 6 parts by mass of a benzyl dimethyl ketal (commercial product) (fixing jig) A fixing jig used is a glass plate having a thickness of 700 μm through 80% of 365 nm light. The semiconductor member manufacturing method according to the present invention was carried out by the above method using an adhesive tape, an adhesive resin, a release tape, and a fixing jig as described above, and evaluated. The results of the evaluation are shown in Table 1. Further, in Example 21, only the release tape was used to peel off the adhesive resin from the singulated semiconductor member. © (Evaluation of the peeling property) A 20 μm-coated glass plate having a thickness of 700 μm was bonded by spin coating a resin having a diameter of 8 Å and a thickness of 72 μm to a uniform surface. Thereafter, black light was used and the adhesive resin was cured at a wavelength of 365 nm and at 300 mJ/cm2. The cutting block was made by DACS 341 manufactured by DISCO Corporation and NBC-ZH205O-27HEEE manufactured by DISCO Company, and was fabricated at a wafer size of 7.2 mm χ 1 4.4 mm by using the FUSION company's hardened device-32- using an electrodeless discharge lamp. 201019401, after further hardening the adhesive resin at a wavelength of 1 6000 mJ/cm 2 at a wavelength of 3 65 nm, the adhesive tape is attached to the divided wafer surface via a ring-shaped plate frame, and the semiconductor member is immersed downward. In the liquid at 90 ° C, the adhesive resin was freely dropped from the semiconductor member and the glass from the fixing jig and peeled off. In the second experiment, the semiconductor member was immersed upward. The peeling of the wafer from the adhesive resin and the glass in one minute at the time of peeling is ◎, and the peeling can be performed within 30 minutes, and X can not be peeled off in 30 minutes or more. Further, when the semiconductor member is immersed downward in a liquid of 90 ° C φ, only the glass is peeled off from the semiconductor member, and when the adhesive resin is attached to the semiconductor member, after drying, the release tape is bonded to the subsequent layer. The resin is peeled off from the singulated semiconductor member in each of the adhesive resins. (Evaluation of transferability) The interval between the wafers transferred by the above method was measured in each of the longitudinal direction and the lateral direction, and compared with the wafer interval before transfer. The maximum variation amount of the wafer interval before transfer is 未μιη, and ΙΟμιη or more is less than 20μιη Φ, and 20μπι or more is X. (Evaluation of crystal pick-up property) After transfer by the above method, a high-pressure mercury lamp manufactured by USHIO Electric Co., Ltd. was irradiated with ultraviolet rays at 150 mJ/cm 2 from the surface of the base film of the adhesive tape, and after the adhesive layer was hardened, Canon machinery was used. The CAP-3 0011 is evaluated under the condition that the height of the needle is 〇.3mm, and the case where the crystal is 100% pickable is ◎, and the case where 90% or less is less than 100% is 〇, and the case is less than 90%. x. -33-201019401 The method for producing a semiconductor member according to the present invention provides a method for producing a semiconductor member excellent in peelability, transfer property, and pick-up property. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional schematic view showing a half of the singulation step in the embodiment of the present invention, a conductor member, an adhesive resin, and a fixing jig. Fig. 2 is a schematic cross-sectional view showing the state after the bonding step. Fig. 3 is a schematic cross-sectional view showing a state of immersion in the transfer step. Φ Fig. 4 is a schematic cross-sectional view showing the state after free fall in the transfer step. Fig. 5 is a schematic cross-sectional view showing a state in which the adhesive tape 4 of the annular frame 5 is pulled up together with the semiconductor member 1 after the transfer step. Fig. 6 is a schematic cross-sectional view showing the state at the time of picking up. Fig. 7 is a schematic cross-sectional view showing the transfer step using the release tape 8. Fig. 8 is a schematic cross-sectional view showing a state in which it is pulled up from the warm water 6 after the transfer step using the release tape 8. Fig. 9 is a schematic cross-sectional view showing a state in which the release tape 8 is attached to the surface of the adhesive resin 2. Fig. 10 is a schematic cross-sectional view showing a state in which the release tape 8 is peeled off together with the adhesive resin 2. [Description of main component symbols] 1 Semiconductor component that has been singulated 2 Resin resin -34- 201019401 3 Fixing fixture 4 Adhesive tape 5 Ring plate frame 6 Warm water 7 Pillar 8 Release tape 9 Container
-35--35-