201016369 六、發明說明： · 【發明所屬之技術領域】 -本發明係有關於一種短路環雷射切割機之量測系統， 特別是指一種在液晶面板的生產製造過程中，將短路環以 r 雷射切割機進行切割時，同時進行切割狀況的量測檢查， 並將訊息回饋，以即時調整製程參數之量測系統。 【先前技術】 血 液晶顯示裝置係利用一對玻璃基板於其中間夾置有液 響 晶材料而黏合，藉著二玻璃基板之間的各電極施加電信 號，以調制外來光源之入射光，而於螢幕上顯示資料。 液晶顯示裝置具有超越陰極射線管（CRT)之優點，例 如能量消耗低、厚度小且質輕；因此，液晶顯示褒置具有 作為後世代顯示裝置之吸引力，使其需求與產量大幅增 高。而液晶顯示裝置包括多個像素電極，係排列成二元陣 列。在為了改善液晶顯示裝置的顯示品質，以增量地生產 主動式液晶顯示裝置，其中，如以薄膜電晶體（TFT)的切 ® 換元件，係用以供像素電極使用。 然而，因為切換元件的製造方法複雜，可能因掃描線 ’ （scan 1 ine，即閘極線）及信號線（data line，即源極 -線）導致缺陷顯示，如短路所致之線缺陷、缺陷性切換元 件所致之點缺陷及顯示不均勻等。因為液晶顯示裝置之生 產良率並非百分之百，故須充分檢查顯示品質，而且為了 改善最終液晶顯示裝置之良率即顯示品質，檢查結果須迅 速回饋至製造過程。 201016369 一 液晶顯示裝置通常的檢查方法’係利用探針與液晶顯 示面板之夕個仏號輸入終端個別接觸，之後，再施加檢查 ， 電^號以啟動液晶面板；在此情況下，以其操作圖型之 改變檢查，/或分析液晶面板之缺陷，其檢查及/或分析係 以操作人員的目測及/或使用照相機進行。 另外，薄膜電晶體係位於源極線與閘極線之每個交 點，而各薄膜電晶體之汲極施加信號於對應的像素電極， 每個像素電極皆在中間夾置有液晶層之情況下面對於對應 _之電極，而於液晶層中保持顯示數據電壓，以於螢幕中顯 示影像，因為源極線及閘極線係由絕緣膜彼此絕緣，故顯 不器中可能因靜電而產生缺陷；例如，薄膜電晶體製造過 程中，液晶面板之製造及包裝過程中，可能產生靜電。在 此狀況下，所生成之靜電充斥在源極線及/或閘極線中，施 加大幅高於實際驅動電壓之電壓，使絕緣膜之介電質損壞 及/或產生非期望之缺換元件特性。 ^ 上述的檢查方法係在液晶面板生產製造過程完成之 ❿後才會進行，即使及時將檢查結果回饋到前段的生產製造 過程中，僅能對下一批的生產進行製程參數調整，以改進 •良率，郃無法對此批已生產製造完成的液晶面板進行及時 回饋’僅能藉檢查及/或分析以篩選出未產生缺陷的良品， 導致生產成本的浪費；再者，檢查的係以一定的比率進行 抽驗，並非是全檢，因此會有漏檢的風險。 、為了防止靜電損士褒’沿液晶顯示裝置之外，緣，提供使 源極線及閘極線線路短路之短路環（sh〇rt ring)。然而， 在檢查完成之後，必須將短路環給切斷，以回復原本液晶 顯不裝置的電路，才能進行正常的顯示，因此已有短 4 201016369 • 雷射切割機的問世。 · 雷射=割機的切割過程’亦係包含在生產製造過程 .中，因此也必須在整個生產製造過程完成之後，才& • 短路環切割後的檢測；如此，不但使檢測過程多一道程序仃 更是無法及時回饋到前段的生產製造過程，同樣料 下-批的生產進行製程參數調整，以提高良率，卻是: 對本批的生產進行任何製程及良率補救，僅能對已經^成 生產製造的本批產品進行檢測及/或分析， 雀 鲁 率與生產成本。 再者’由於雷射光是連續發射光的能量，如 位置停留太久，會造成能量累積，造成線路燒灼，而使產 品報廢；故雷射在切割液晶面板上的短路環時，益 晶面板稍作停留以進行取像，並進而進行量測與回 成目前在解決切割短路環後及時檢測的瓶頸。 也 所以’如何設計-種能夠在生產製造過財，運 射切割機以雷射切割短路環時，同時進行全面檢測切 ❷ 況的檢測，並即時回饋以調整雷射的能量等參數，以降 生產成本，縮短工時並提高良率，是目 - 割的量測系統方面’-個刻不容緩的課題。丑環雷射切 【發明内容】 =鑑於此’本發明係提供一種短路環雷射 之 測系統’以於短路環的切割過程中，能 量 本發—-==== 201016369 產工時’同時又能提高良率的量測系統。 A達上述目的，本發明係提供—種短路環雷射切 之量測系統，該雷射切割機係以一切割標記為基準，:饵 該短路環的切割，該量測系統包括：_用以拍&該短 切割狀況的取像裝置，具有高速快門的功能，並利用 光燈進行補光；一輸入有預先計算好該取像衷置的取像位 置及取像次數資料的轴卡’並***該取像裝置，以進行押 制該取像裝置的取像位置以及控制該閃光燈配合高速快門 的作動；以及一將該取像裝置所拍攝的資料直接拷貝至—201016369 VI. Description of the invention: · Technical field of the invention - The invention relates to a measuring system for a short-circuit ring laser cutting machine, in particular to a short-circuit ring in the production process of a liquid crystal panel When the laser cutting machine performs cutting, the measurement of the cutting condition is simultaneously performed, and the message is fed back to instantly adjust the measuring system of the process parameters. [Prior Art] A blood liquid crystal display device is bonded by sandwiching a pair of glass substrates with a liquid crystal material interposed therebetween, and an electric signal is applied by electrodes between the two glass substrates to modulate the incident light of the external light source. Display the data on the screen. The liquid crystal display device has advantages over a cathode ray tube (CRT), such as low energy consumption, small thickness, and light weight; therefore, the liquid crystal display device has an attractiveness as a display device of a later generation, and its demand and output are greatly increased. The liquid crystal display device includes a plurality of pixel electrodes arranged in a binary array. In order to improve the display quality of a liquid crystal display device, an active liquid crystal display device is incrementally produced, in which a thin film transistor (TFT) is used for a pixel electrode. However, since the manufacturing method of the switching element is complicated, a defect display may be caused by a scan line (scan 1 ine) and a data line (source line), such as a line defect caused by a short circuit, Point defects and display unevenness caused by defective switching elements. Since the production yield of the liquid crystal display device is not 100%, the display quality must be sufficiently checked, and in order to improve the yield of the final liquid crystal display device, that is, the display quality, the inspection result must be quickly fed back to the manufacturing process. 201016369 A general inspection method for a liquid crystal display device is to use a probe to individually contact an imaginary input terminal of a liquid crystal display panel, and then apply a check to activate the liquid crystal panel; in this case, operate with the same The pattern change is checked, and/or the defects of the liquid crystal panel are analyzed, and the inspection and/or analysis is performed by the operator's visual inspection and/or using a camera. In addition, the thin film electro-crystal system is located at each intersection of the source line and the gate line, and the drain of each thin film transistor applies a signal to the corresponding pixel electrode, and each pixel electrode has a liquid crystal layer interposed therebetween. For the corresponding electrode, the display data voltage is maintained in the liquid crystal layer to display the image on the screen, because the source line and the gate line are insulated from each other by the insulating film, so that the display may be defective due to static electricity; For example, during the manufacture of a thin film transistor, static electricity may be generated during the manufacture and packaging of the liquid crystal panel. In this case, the generated static electricity is flooded in the source line and/or the gate line, applying a voltage substantially higher than the actual driving voltage, causing damage to the dielectric of the insulating film and/or generating an undesired missing component. characteristic. ^ The above inspection method will not be carried out after the completion of the manufacturing process of the LCD panel. Even if the inspection results are returned to the previous manufacturing process in time, the process parameters can only be adjusted for the next batch of production to improve. Yield, you can't give timely feedback on the LCD panels that have been manufactured in this batch. 'Only inspection and/or analysis can be used to screen out good products that have not produced defects, resulting in waste of production costs. The rate of sampling is not a full inspection, so there is a risk of missing inspections. In order to prevent electrostatic damage, along the edge of the liquid crystal display device, a short-circuit ring (sh〇rt ring) for short-circuiting the source line and the gate line is provided. However, after the inspection is completed, the short-circuiting ring must be cut off to restore the circuit of the original liquid crystal display device for normal display, so there is a short 4 201016369 • Laser cutting machine. · Laser = cutting process of the cutting machine is also included in the manufacturing process. Therefore, it must be after the completion of the entire manufacturing process, and the detection after the short-circuit ring is cut; thus, not only the detection process but also one more The program is not able to give back to the previous production process in time, and the same batch-batch production process parameter adjustment to improve the yield, but: Any process and yield recovery for the production of this batch can only be ^In the production of this batch of products for testing and / or analysis, the rate of the bird and production costs. Furthermore, because laser light is the energy of continuous emission of light, if the position stays for too long, energy accumulation will occur, causing the line to burn, and the product will be scrapped; therefore, when the laser cuts the short-circuit ring on the liquid crystal panel, the Yijing panel is slightly The pause is taken for image taking, and then the measurement and the return to the bottleneck that is detected in time after the short circuit is cut. Therefore, 'how to design--can be used in production and manufacturing, when the laser cutting machine cuts the short-circuit ring by laser, at the same time, the detection of the comprehensive inspection is carried out, and the parameters such as the energy of the laser are adjusted immediately to reduce the production. Cost, shortening the working hours and increasing the yield are the subject of the measurement system of the target-cutting. Ugly Ring Laser Cutting [Summary] In view of the fact that the present invention provides a short-circuit ring laser measuring system, in the process of cutting the short-circuit ring, the energy is generated--==== 201016369 A measurement system that improves yield. A for the above purpose, the present invention provides a short-circuit ring laser cutting measurement system, the laser cutting machine is based on a cutting mark, the bait of the short-circuit ring is cut, the measuring system comprises: The image capturing device of the short cutting condition has a function of a high-speed shutter and uses a light to fill light; and an input has an axis card that pre-calculates the image capturing position and the image capturing frequency of the image capturing device. 'Insert the image capturing device to perform the image capturing position of the image capturing device and control the flashing light to cooperate with the high speed shutter; and directly copy the data captured by the image capturing device to -
影像處理緩衝區，在該影像處理緩衝區進行一檢測機制， 處理之後的資料即回馈至該雷射切割機，以即時進行製程 參數的調整的影像處理裝置。 較佳者，該檢測機制係為量測一切割道的精度，該精 度包括一切割寬度、一切割偏移量以及一由該切割標記的 中心位置到切割尾端的距離’其中，該切割偏移量包含一 以切割標記的中心位置量測到該切割寬度的上邊界之數值 ，以及一以切割標記的中心位置量測到該切割寬度的下邊 •界之數值。。 較佳者’該取像裝置係包括一 CCD及一影像擷取卡（ vision grab card) ’該轴卡係***該影像擷取卡，該影像 擷取卡截取到一影像後，將該影像以一軟體將其置放到一 隊列緩衝區（Queue Buffer)。 因此，本發明藉由上述之結構，在雷射切割機進行切 割時，即同時進行檢測，可達到百分之百的全面檢測，且 將檢測的資料即時回饋到雷射切割機，以進行製程參數的 調整，提高本批生產的良率’不但節省工時，也降低了生 6 201016369 產成本及製造成本。 . 點，實施方式中詳細敛述本發明之詳細特徵以及優 ，内定:μ奋足以使任何熟習相關技藝者了解本發明之技術 利r圍/實施’且根據本說明書所揭露之内容、申請專 相Ui優:何熟習相關技藝者可輕易地理解本發明 【實施方式】 鲁 彡配合圖式將本發明較佳實施例詳細說明如下。 請同時參考圖i及圖2’係分別表示本發明一實施例 顧結構方額，以及液晶面板經過雷射切割後的部分線路 ^。本發明所使用的短路環雷射切割機（圖未示），係以兩 切割標記（cut mark) Μ作為切割路線之基準，來進行短 路環的切割。於本實施例中，兩切割標記Μ分別為起始切 割標記以及終點切割標記。 ^在本實施例中，裝設在上述短路環雷射切割機的，量測 %系統1，包含一取像裝置2、一軸卡3以及一影像處理農置 4 ° 取像裝置2係用以拍攝短咚環切割狀況，由於雷射切 割機在切割時，無法使液晶面板停下來進行取像，因此具 有一定的移動速度，而為了要精蜂地取像，在取像裝置2 即具有高速快門的功能，並利用一閃光燈21進行補光。而 取像裝置更包括有一 CCD 22及影像掘取卡23，係分別用 以進行拍攝取像與截取影像。 軸卡3則輸入有多數個預先計算好取像裝置2之取像 饭置以及取像次數的資料，並***取像裝置2的影像摘取 201016369 卡23 ’藉由影像擷取卡烈，以進行控制CCI) 22分別到各 個取像位置拍攝取像，同時控制閃光燈21配合高速快門的 ^ 作動’以進行的補光。而CCD 22拍攝取像完成後，即將影 . 像傳輸回影像擷取卡23以進行截取影像。 請再參考圖3,係表示本發明處理影像資料的示意圖； 影像處理褒置4係將取像裝置2的CCD 22所拍攝的影像， 傳回到影像操取卡23以進行戴取影像，再將戴取的影像資 料直接拷貝至一影像處理緩衝區41，在影像處理緩衝區41 進行一檢測機制S’處理之後的資料即回饋至雷射切割機， 以進行製程參數的調整。 籲 於檢測進行時，須要能同時處理影像，又要能依順序 暫存影像，進行取像與檢測的並行處理。當負責取像的影 像擷取卡23戴取到影像後，就將截取的影像以一軟體將= ，放到隊列緩衝區（Queue Buffer) 3卜再經過檢測機制 s不斷地到隊列緩衝區31確認是否有影像暫存，若是有影 2話，即將影像從隊列緩衝區31移到影像處理緩衝區 中進行影像處理’即進行檢測機制s (如圖i所示）。 自士述的檢測機制s，係進行量測雷射切割機進行切割 —產生的-切割道的精度，該精度包括—切割寬度W、 的=移ί以及一由切割標記M的中心位置到切割尾端 位詈晉fV、中1切割偏移量包含一以切割標記M的中心 二=T割：度W的上邊界之數值A，以及-以切割The image processing buffer performs a detection mechanism in the image processing buffer, and the processed data is fed back to the laser cutting machine to immediately perform image processing adjustment of the process parameters. Preferably, the detection mechanism is to measure the accuracy of a cutting pass, the precision including a cutting width, a cutting offset and a distance from a center position of the cutting mark to a cutting end, wherein the cutting offset The amount includes a value that measures the upper boundary of the cutting width at the center of the cutting mark, and a value of the lower edge of the cutting width measured by the center position of the cutting mark. . Preferably, the image capturing device includes a CCD and a vision grab card. The axis card is inserted into the image capture card. After the image capture card captures an image, the image is captured by the image capture card. A software puts it into a queue buffer (Queue Buffer). Therefore, according to the above structure, the present invention can achieve 100% comprehensive detection when the laser cutting machine performs cutting, that is, simultaneous detection, and the detected data is immediately fed back to the laser cutting machine to adjust the process parameters. To improve the yield of this batch of production' not only saves man-hours, but also reduces production costs and manufacturing costs. The detailed features and advantages of the present invention will be described in detail in the embodiments, and it is to be understood that the skilled artisan can understand the technical scope of the present invention and implement the invention according to the contents disclosed in the specification. The present invention can be easily understood by those skilled in the art. [Embodiment] The preferred embodiment of the present invention will be described in detail below with reference to the drawings. Referring to Fig. 1 and Fig. 2', respectively, the structure of one embodiment of the present invention and the partial line of the liquid crystal panel after laser cutting are shown. The short-circuit ring laser cutting machine (not shown) used in the present invention cuts the short-circuit ring by using two cut marks Μ as a reference for the cutting path. In the present embodiment, the two cutting marks Μ are the initial cutting mark and the end cutting mark, respectively. In the present embodiment, the measurement % system 1 is mounted on the short-circuit ring laser cutting machine, and includes an image capturing device 2, a shaft card 3, and an image processing agricultural 4 ° image capturing device 2 for When the laser cutting machine is in the process of cutting, the liquid crystal panel cannot be stopped for image capturing, so it has a certain moving speed, and in order to take a picture, the image capturing device 2 has a high speed. The function of the shutter and the use of a flash 21 to fill the light. The image capture device further includes a CCD 22 and an image capture card 23 for capturing and capturing images, respectively. The axis card 3 inputs a plurality of pre-calculated data of the image taking device and the image capturing times of the image capturing device 2, and inserts the image capturing device of the image capturing device 2 into the 201016369 card 23' by the image capturing card. The control CCI 22 is taken to each of the image capturing positions to capture the image, and the flash 21 is controlled to cooperate with the high speed shutter to perform the fill light. After the CCD 22 captures the image, the image is transferred back to the image capture card 23 for capturing the image. Please refer to FIG. 3 again, which is a schematic diagram of processing image data according to the present invention. The image processing device 4 transmits the image captured by the CCD 22 of the image capturing device 2 to the image processing card 23 for wearing the image, and then The captured image data is directly copied to an image processing buffer 41, and the data after the image processing buffer 41 performs a detection mechanism S' is fed back to the laser cutting machine to adjust the process parameters. When the detection is carried out, it is necessary to be able to process the images at the same time, and it is necessary to temporarily store the images in order, and perform parallel processing of image capturing and detection. When the image capture card 23 responsible for capturing images is taken to the image, the captured image is placed in a queue buffer (Queue Buffer) by a software, and then continuously passed to the queue buffer 31 through the detection mechanism s. Confirm whether there is image temporary storage. If there is shadow 2, move the image from the queue buffer 31 to the image processing buffer for image processing', that is, the detection mechanism s (as shown in Figure i). The self-reported detection mechanism s is used to measure the precision of the cutting-generated-cutting track by the laser cutting machine, which includes - the cutting width W, the = shifting and a cutting position M from the center of the cutting mark The tail end position 詈f, the middle 1 cutting offset includes a value A of the upper boundary of the cutting mark M: the upper boundary of the degree W, and - to cut
測到切割寬度w的下邊界之數值J 因此，本發明藉由上述的結構， 割的同時，即進行檢測的動t，可達到百分之;的全= 201016369 • 測，且檢測之後的資料可以即時回饋到雷射切割機，以進 行製程參數的調整，使本批生產得以提高良率，而不需要 ，等到本批生產結束，在生產下一批時才進行製程參數的調 整，不但節省工時，也降低了生產成本及製造成本。 * 綜上所述，乃僅記載本發明為呈現解決問題所採用的 技術手段之較佳實施方式或實施例而已，並非用來限定本 發明專利實施之範圍。即凡與本發明專利申請範圍文義相 符，或依本發明專利範圍所做的均等變化與修飾，皆為本 發明專利範圍所涵蓋。 參 【圖式簡單說明】 圖1係表示本發明一實施例的結構方塊圖； 圖2係表示本發明該實施例之液晶面板經過雷射切割後 的部分線路圖；以及 圖3係表示本發明處理影像資料的示意圖。 【主要元件符號說明】 1 量測系統 2 取像裝置. 21 閃光燈 22 CCD 23 影像擷取卡 3 軸卡 31 隊列緩衝區 4 影像處理裝置 41 影像處理緩衝區 A 以切割標記的中心位置量測到切割寬度的上 邊界之數值 ^ 以切割標記的中心位置量測到切割寬度的下 • 邊界之數值 Μ =標記的中心位置到切割尾端的距離 切割標記 S 檢測機制 W 切割寬度The value of the lower boundary of the cutting width w is measured. Therefore, according to the above structure, the present invention can perform the detection, that is, the movement t of the detection can reach 100%; the full = 201016369 • the measurement, and the data after the detection It can be immediately fed back to the laser cutting machine to adjust the process parameters, so that the production of this batch can be improved, without the need to wait until the end of the batch production, the process parameters are adjusted in the next batch, not only saving Working hours also reduce production costs and manufacturing costs. In the above, the present invention is merely described as a preferred embodiment or embodiment of the technical means for solving the problem, and is not intended to limit the scope of implementation of the present invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention; FIG. 2 is a partial circuit diagram showing a liquid crystal panel of the embodiment of the present invention after laser cutting; and FIG. 3 is a view showing the present invention. A schematic diagram of processing image data. [Main component symbol description] 1 Measurement system 2 Image capture device. 21 Flash 22 CCD 23 Image capture card 3 Axis card 31 Queue buffer 4 Image processing device 41 Image processing buffer A is measured at the center of the cutting mark The value of the upper boundary of the cutting width ^ The lower the cutting width is measured at the center of the cutting mark. • The value of the boundary Μ = the distance from the center of the mark to the end of the cutting mark. S Marking mechanism W Cutting width