201015062 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種多聯板之標記的檢知方法，尤指 一種完整擷取多聯板影像再加以分析多聯板上之子板的 不良品標記、或多聯板上的定位標靶之檢知裝置方法，並 將其檢知結果之資訊傳遞給後方之生產機台者。 【先前技術】 : 習知的電路板係為一種大面積的主板，例如電腦系統 ' 中的主機板，但隨著電子裝置如PDA、手機或數位相機的 體積越來越小，電路基板的體積也跟著縮小。而為了生產 的效率的考量，業者將多數個小型電路板（又稱為子板） 合併成一片大型電路板（又稱為多聯板）以方便後續量產 製程的進行。但由於生產的過程中該等小型電路板可能會 由於製程上的變異而造成不符合電性導通（即開路、短路 φ 等電路特徵）的規格，故上述列為不良品的小型電路板就 會以人工的方式將一不良品標記（bad mark)設置於該些 小型電路板上，以使後續的取置製程能依據檢知取得相關 資訊後，避開上述不良的電路板，以避免將元件裝設於該 • · 些不良子板上。另考量該多聯板上的兩兩子板之間需有一 « - 固定間距，以利後續表面黏著元件置件的精度需求，但該 兩兩子板之間存在有製造與材料收縮率不同所產生的距 離誤差，經多聯板合併之後所累積的誤差將會造成表面黏 著元件的置件精度問題，是故後續的生產機台（如取置 6 201015062 機、d i e bonder等等）均需額外針對每片子板的定位標把 (local fiducial mark)進行視覺辨識處理，以校正上 述之誤差值’但此-額外的視覺辨識處理時間將會大量降 低生產線的稼動率（約1〇%_3〇%不等 另一方面，傳統上取置機會載入該多聯板，並利用一 移動式攝f彡機先進行縣（fiduGial咖）的定位 φ 利用上述攝影機進行不良品標記的分析檢知作業或 位，把（local fiducial mark)的辨識檢測作業。換 話說，傳統取置機是利用同一具攝影機搭配滑、 叫e)特餘與不良子㈣記时析及檢知，且該 =須依靠XY载台的硬體動作以進行移動來一一擷取 檢，中的每—小型電路板上是否有不良記號，進 不良㈣資訊’接著才開始根據上述的檢知資 ί聯板=:步驟，完成全部的置件後，最後再進行载出 故&傳統取置機拥硬體移動方式進行上述之檢知不 業，對於聯板數越來越多的情況下，勢必 曰k成置件機台的生產時間大幅增加。 單請：：第九圖，以目前的取置機來說，該攝影機進行 有：，，的多聯板之檢知整體時= 开為30私、（包含攝影機的移動時間等等），加 ， 片、標靶檢知時間為4秒，再加上置件時間為：出 設-片子板置放4個元件、每一元件置放 7 201015062 4 : 片子板均為良品時，置件時間的計算為⑽月x201015062 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for detecting a mark of a multi-plate, in particular, a method of completely capturing a multi-plate image and then analyzing the daughter board on the multi-board The detection device method of the good target mark or the positioning target on the multi-plate, and the information of the detection result is transmitted to the rear production machine. [Prior Art]: The conventional circuit board is a large-area motherboard, such as a motherboard in a computer system, but with the smaller and smaller electronic devices such as PDAs, mobile phones, or digital cameras, the size of the circuit substrate Also shrink. In order to consider the efficiency of production, the industry combines a large number of small boards (also known as daughter boards) into a large circuit board (also known as a multi-board) to facilitate subsequent mass production processes. However, due to variations in the process, such small circuit boards may not conform to the specifications of electrical conduction (ie, circuit characteristics such as open circuit and short circuit φ) during the manufacturing process, so the small circuit boards listed as defective products will be Manually setting a bad mark on the small circuit boards, so that the subsequent acquisition process can avoid the bad circuit board after the relevant information is obtained, so as to avoid the components. Installed on these bad boards. Another consideration is that there should be a «- fixed spacing between the two sub-boards on the multi-plate, in order to meet the precision requirements of the subsequent surface-adhesive component placement, but there is a difference in manufacturing and material shrinkage between the two sub-boards. The resulting distance error, the accumulated error after the multi-plate combination will cause the placement accuracy of the surface-adhesive component, so the subsequent production machine (such as the 6 201015062 machine, die bonder, etc.) need additional Visually identify the local fiducial mark for each sub-board to correct the above error value'. However, the additional visual recognition processing time will greatly reduce the production rate of the production line (about 1〇%_3〇%). On the other hand, the traditional acquisition opportunity is loaded into the multi-plate, and the positioning of the county (fiduGial coffee) is first performed by using a mobile camera. The above-mentioned camera is used for the analysis and detection of the defective product mark or Bit, the local fiducial mark identification test operation. In other words, the traditional pick-up machine uses the same camera with sliding, called e) special and bad (four) time analysis and detection, and = It is necessary to rely on the hardware action of the XY stage to move to check one by one, whether there is a bad mark on each small circuit board, and the bad (four) information' then proceed according to the above-mentioned detection. =: Steps, after all the parts have been completed, and finally, the loading and closing of the traditional pick-and-place machine is carried out in a hard-moving manner to perform the above-mentioned detection and unsuccessful operation. The production time of the k-set machine has increased significantly. Single please:: The ninth picture, in the current pick-up machine, the camera carries:,, the detection of the multi-board is overall = open to 30 private, (including camera movement time, etc.), plus , the film and target detection time is 4 seconds, plus the set time is: the output - the film board is placed 4 components, each component is placed 7 201015062 4 : When the film board is good, the placement time Calculated as (10) month x
4個兀件X 〇· J秒/個二 Τπ马ΐϋϋ月X 和為74 # 0和），使得取置機的置件時間總 迴焊機：的=ΜΤ生產線上的印刷機之作業時間為25秒， t= 二作#業時間則為25秒，故整條生產線一 的Γ產瓶V:使:::取置機的作業就會成為整條生產線 θ 仔產線的生產產能受到限制。 4人緣疋本發明人有感上述缺失之可改善，提出-種設 計合理且有效改善上述缺失之本發明。U種°又 【發明内容】 知方法發二目的’在於提供-種多聯板之標記的檢 時間（約1於__° ,法係利用一獨立的檢知裝置在相當短的 影像八折，、、Τ秒進行多聯板的完整影像之操取並進行 Ty 以”】別該多聯板上的子板上 記，再將該此子板的拾&次〜®見不艮〇 口才不 可利用該檢；送至取置機’該取置機即 檢知裝置係應用在置件步驟之前，以 的閒置時間的問題。 守双相田長 件方ί了上述之目的，本發明係提供—種多聯板的置 仵方法，包括以下半跑./、 且 步驟，提供^ · U)進行一多聯板之標記的檢知 /八 的多聯板之標記的檢知裝置擷取一多聯 的全影像，並檢知該多聯板的每—子板: 標記，再輸出-檢知資料；以及⑴提供-取^ 201015062 該取置機台係根據該檢知資料於屬於良品的子板上進行 一置件步驟。 本發明在傳統取置機台前方提供一種多聯板之標記 的檢知方法與裝置，包括以下步驟：（a)提供一多聯板， 其包括複數個子板，其中該等子板中屬於不良品的子板上 設有一不良品標記（bad mark );(b)提供一獨立的多聯 板之標記的檢知裝置，該多聯板之標記的檢知裝置包括一 影像擷取單元以及一運算單元，其中利用該影像擷取單元 ^ 擷取該多聯板的全影像；以及（c)利用該運算單元依序 檢知該多聯板之該等子板的影像，以判定每一子板上是否 有該不良品標記，並將檢知資訊傳遞給後方的取置機台。 本發明具有以下有益的效果：本發明提出之檢知裝置 及其方法係主要利用一較大視野（f i e 1 d of vi ew，F0V) 的影像擷取單元，進行多聯板的全影像擷取，故其可以擷 取到該多聯板的完整影像以取代置件機中的移動式影像4 pieces of X 〇 · J seconds / two Τ ΐϋϋ 马ΐϋϋ月 X and 74 # 0 and), so that the pick-up time of the total reflow machine: = the working time of the printing machine on the production line is 25 seconds, t = two works # industry time is 25 seconds, so the entire production line of the production bottle V: so that::: the operation of the machine will become the entire production line θ production line production capacity is limited . The present inventors have felt that the above-mentioned deficiency can be improved, and the present invention which is reasonable in design and effective in improving the above-described deficiency is proposed. U kind ° and [invention] The method of the second method is to provide the detection time of the marking of the multi-plate (about 1 in __°, the system uses a separate detecting device to make a 20% discount on a relatively short image. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The inspection cannot be used; it is sent to the pick-up machine. The pick-up machine is the problem that the detecting device is used before the placing step, and the idle time is fixed. The above-mentioned purpose is provided by the present invention. - a method for placing a multi-plate, including the following half-run. /, and steps, providing a detection device for marking the detection of a multi-plate, marking the multi-plate of eight Multi-connected full image, and detect each sub-board of the multi-plate: mark, then output - check data; and (1) provide - take ^ 201015062 The pick-up machine is based on the test data in the good A step is performed on the sub-board. The present invention provides a multi-plate mark in front of the conventional pick-up machine The detecting method and device include the following steps: (a) providing a multi-plate, comprising a plurality of sub-boards, wherein a sub-board belonging to the defective product in the sub-board is provided with a bad mark; Providing a separate detecting device for marking the multi-plate, the detecting device of the marking of the multi-board includes an image capturing unit and an operation unit, wherein the multi-layer is captured by the image capturing unit And (c) sequentially using the computing unit to detect images of the sub-boards of the multi-board to determine whether the defective product mark is on each sub-board and transmit the detection information to the rear The present invention has the following beneficial effects: the detecting device and the method thereof according to the present invention mainly utilize a large field of view (fie 1 d of vi ew, F0V) image capturing unit to perform multiple connections. The full image of the board is captured, so it can capture the complete image of the multi-plate to replace the mobile image in the machine.
擷取單元針對單一的子板進行影像擷取，且再利用運算單 A 元以軟體高速運算的方式對該多聯板的完整影像進行影 像分析，藉此可快速得知子板上之不良品標記的檢知結 果，並將檢知結果傳遞給後續的取置機，讓取置機不用花 費時間進行不良子板的檢測，故可縮短取置機的產出時間 (eye 1 e t i me )，例如在先前技術所提到的100個ΜICR0-SD 的多聯板原需74秒，而使用本發明後僅需44秒，故可進 一步提高整條生產線的產出效率。 為使能更進一步瞭解本發明之特徵及技術内容，請參 201015062 閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提 供參考與說明用’並非用來對本發明加以限制者。 【實施方式】 本發明係在取置機前方提供—種多聯板之標記的檢 知褒置1，其係用以快速地、獨立地檢知該多聯板之複數 固子板上的不良品標記（bad mark)或是定位標乾（⑻&丄 hdudai mark) ’並傳遞給後方取置機，讓後續的置件步 驟能根據該標記的檢知裝置2所得到的檢知資料，針對屬 於良品的子板進行置件，而使取置機的待機時間（包括進 片、-出片、標乾檢知時間及不良品標記的檢知時間）大幅 縮紐’不用在置件機上進行該項檢知作業 ，線，。請先參考第二圖，其為一種多聯 樣之不思圖，其包括複數個子板3 0 1，該些子板3 〇工 f經過-定的判別步驟後便會被區分為良品及不良品，而 =子板3 Q 1就會以不良品標記㈤―） 、彡‘不之’遠標記的檢知裝置1即能快速的檢知 的檢S t品標記3 1 ’使取置機台4 0可以根據該標記 π Ί /1所得到的檢知資料針對屬於良品的子板3 置件，即取置機台不會將元件設置於不良的子板 ^ ◦ 1上’進而達成節省材料的功效。 =何顺品的子板3〇1，何者又為= 並將貝訊傳遞給後方取置機，節省了傳统取置 機利用硬體機構進行移動以檢知不良子板所浪費= 201015062 請復參考第一圖，其為本發明之多聯板之標記的檢知 裝置1之示意圖，其中該多聯板之標記的檢知裝置1包括The capture unit performs image capture on a single daughter board, and then uses the operation unit A to perform image analysis on the complete image of the multiple board in a software high-speed operation manner, thereby quickly obtaining the defective product mark on the daughter board. The detection result is transmitted to the subsequent pick-up machine, so that the take-up machine does not take time to detect the bad sub-board, so the output time of the pick-up machine (eye 1 eti me ) can be shortened, for example The multi-plate of 100 Μ ICR0-SD mentioned in the prior art originally took 74 seconds, and only 44 seconds after using the present invention, the output efficiency of the entire production line can be further improved. For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings. [Embodiment] The present invention provides a detecting device 1 for marking a multi-plate in front of a pick-up machine, which is used for quickly and independently detecting the failure of a plurality of solid plates on the multi-plate. A good mark (bad mark) or a positioning mark ((8) & 丄hdudai mark) ' is transmitted to the rear pick-up machine, so that the subsequent setting step can be based on the detected data obtained by the marked detecting device 2, The sub-boards that belong to the good product are placed, and the standby time of the pick-up machine (including the filming, filming, inspection time and the detection time of the defective product mark) is greatly reduced. Perform the inspection operation, line, and. Please refer to the second figure, which is a multi-sample, which includes a plurality of sub-boards 300, and the sub-boards 3 are divided into good and non-determined steps. Good product, and = sub-board 3 Q 1 will be marked with defective products (5) -), 彡 'not' remote detection device 1 can quickly detect the detection of S t mark 3 1 ' make the machine The table 40 can be based on the detection data obtained by the mark π Ί /1 for the daughter board 3 belonging to the good product, that is, the pick-up machine does not set the component on the bad daughter board ^ ◦ 1 and further saves The efficacy of the material. = He Shunpin's daughter board 3〇1, which is = and transmits Beixun to the rear pick-up machine, saving the traditional pick-up machine to use the hardware mechanism to move to detect the bad sub-board waste = 201015062 Please refer to the A diagram of a detecting device 1 for marking a multi-plate of the present invention, wherein the detecting device 1 of the marking of the multi-plate includes
一影像擷取單元1 〇以及一運算單元2 〇，其中該影像擷 取單元10具有一預定解析度及一預定放大倍率且在一 預定工作距離（working distance) WD下擷取該多聯板3 0之影像。本發明主要係利用較大視野的影像擷取單元1 0配合相對應的預定工作距離WD的條件進行多聯板3 ◦ 全影像之擷取工作。本發明以較大視野的影像擷取單元丄 0配合預定工作距離WD，讓該影像擷取單元i 〇可以一次 性的抓取該多聯板3 〇的完整影像，以解決傳統上必須移 動影像擷取硬體而個別地進行單一子板3 〇 i的影像擷 取所造成的閒置時間的消耗。例如本發明所提出之影像擷 取單元1 0之影像解析度（Image Res〇luti〇n)可為 576畫素（pixel )’搭配鏡頭所形成的空間解析度（Sp^ial Resolution)可為 〇. 25 至 〇. 5 公厘/晝素（mm/pixei )，而An image capturing unit 1 and an arithmetic unit 2, wherein the image capturing unit 10 has a predetermined resolution and a predetermined magnification and captures the multi-plate 3 at a predetermined working distance WD 0 image. The invention mainly uses the image capturing unit 10 of a larger field of view to cooperate with the corresponding predetermined working distance WD to perform the capturing operation of the multi-panel 3 ◦ full image. The image capturing unit 丄0 of the larger field of view cooperates with the predetermined working distance WD, so that the image capturing unit i 抓 can capture the complete image of the multi-plate 3 一次性 at one time, so as to solve the problem that the image must be moved conventionally. The consumption of idle time caused by image capture of a single daughter board 3 〇i is taken separately by hardware. For example, the image resolution (Image Res〇luti〇n) of the image capturing unit 10 proposed by the present invention can be 576 pixels (pixel) and the spatial resolution (Sp^ial Resolution) formed by the lens can be 〇 25 to 〇. 5 mm / 昼 (mm/pixei), and
工=距離WD可為糊至·公厘（賴）。又例如該影像操 取早兀10也可為大型的線性掃瞄器’其工作距離帅可 在20至3GG公厘（mm)的條件下擷取多聯板3 〇的全影 像。再者，在本具體實施例中，該影像擷取單元丄〇更進 一步包括複數個發光單元1 〇 1，以提供該影像縣單元 1 0最佳㈣明情況，該科光單元丨Q丨 體或是曰光燈管等。 口知尤徑 之運算單元2 0則 影像分析軟體依序 而該多聯板之標記的檢知裝置1 用以接收該多聯板3 0之影像並利用 11 201015062Worker = distance WD can be paste to metric (Lai). For example, if the image is operated as early as 10, it can be a large linear scanner. The working distance is 20 to 3 GG (mm), and the full image of the multi-plate 3 is captured. Furthermore, in the specific embodiment, the image capturing unit further includes a plurality of light emitting units 1 〇1 to provide an optimal (four) case of the image county unit, the light unit 丨Q body Or a twilight tube, etc. The arithmetic unit 20 of the oscillating path is in sequence, and the detecting device 1 of the multi-plate is used to receive the image of the multi-plate 30 and utilize 11 201015062
檢視該多聯板3 〇上之子板3 〇 ；[的影像。請參考第三 圖運算單元2 0主要具有多種模組，包括一主模組2 〇 1，一與該主模組20 1連接的開關模組2 〇 2 ; 一與該 主模組2 0 1連接之控制模組2 〇 3 ; 一與該主模組2 〇 1連接之輔助模組2 〇 4 ;—與該主模組2 〇 1連接之參 數設定模組2 G 5 ;以及-與該主模組2 Q i連接之系統 模組2 0 6，舉例來說該主模組2 〇丄更包括主選單、工 作設定等控制手段以讓該運算單元2 〇進行接收並分析 該多聯板3 G的完整影像；又如該參數狀模組2 〇 5包 括多聯板參數狀之手段、檢知參數之手段#，該多聯板 參數設定之手段可設定待檢知多聯板3 Q的尺寸規格，而 該檢知參數之手段可設定不同的檢知條件，如光源大小 等’使該運算單it 2 Q可以回饋控制該影像擷取單元工◦ 進行最佳的影像擷取。而該運算單元2◦的其他模組在於 進行產品的選擇或系統調整等功能，在此不再贅述。 另外該多聯板之標記的檢知裝置i可搭配—取置機 0 ’實際上該取置機台4 ◦可為晶片取置機或打線 機，如die bonder等其他可用以進行晶片取置或線路連 接的機台或設備（例如應用在BGA的封裝製程，可生 MICRO” Π等產品），而該取置機台4〇可以經由 該運算料2 0獲得檢知資料，該檢知資料可記錄有該多 ，板上之子板的優劣情況’該取置機台4◦並可依據 -貝料進行置件的作業。換句話說，該多聯板之標記的檢 知裝置1可應用於SMD製m般元件廠的打 12 201015062 二考::圖包括=明所提出之多聯板之標記的 n /，⑷：提供—多聯板3 0 ’其包括複數個子板3 %&等子板3 ◦ 1中屬於不良品的子板3 0 1上 不良品標記（bad mark) 3丄。而在步驟（a)之 2 記步驟’係利用雷射或貼附的方法將該不良View the image of the daughter board 3 〇 on the multi-panel 3 〇 ; Please refer to the third figure, the computing unit 20 has a plurality of modules, including a main module 2 〇1, a switch module 2 〇2 connected to the main module 20 1 , and a main module 2 0 1 Connected control module 2 〇 3 ; an auxiliary module 2 〇 4 connected to the main module 2 〇 1 ; a parameter setting module 2 G 5 connected to the main module 2 〇 1 ; The main module 2 Q i is connected to the system module 206, for example, the main module 2 includes a main menu, a work setting and the like to allow the computing unit 2 to receive and analyze the multi-board The complete image of 3 G; and if the parameter-like module 2 〇 5 includes the means of multi-plate parameter shape, the means of detecting the parameter #, the means for setting the multi-plate parameter can set the multi-plate 3 Q to be detected The size specification, and the means for detecting the parameter can set different detection conditions, such as the size of the light source, etc., so that the operation unit it 2 Q can feedback control the image capturing unit process for optimal image capturing. The other modules of the computing unit 2 are for performing product selection or system adjustment, and are not described here. In addition, the detecting device i of the multi-plate can be matched with the pick-and-place machine 0'. In fact, the pick-up machine 4 can be a wafer pick-up machine or a wire-punching machine, such as a die bonder, etc., for wafer pick-up. Or a line-connected machine or device (for example, a package process in the BGA, which can be used to produce a MICRO" product), and the pick-up machine 4 can obtain the detection data via the computing material 20, the detection data. It can be recorded that there are many, the advantages and disadvantages of the daughter board on the board. The machine can be placed in accordance with the - bedding material. In other words, the marking device 1 of the multi-plate can be applied. In the SMD system, the component factory is playing 12 201015062. The second test:: The figure includes = the mark of the multi-plate proposed by Ming, n /, (4): provide - multi-plate 3 0 'which includes a plurality of sub-boards 3 % & In the daughter board 3 ◦ 1, the defective board mark (bad mark) 3 1 on the sub-board 3 0 1 of the defective product, and the step '' in the step (a) is to use the laser or attach method to treat the defect.
制Γ己3 ^置於屬於不良品的子板3 0 1上，以利後續 衣程之進行’其中該不良品標記3 1具有-預定尺寸，例 X 3 (咖2)或4X 4 (mm2)等大小，且該不良品標記3 的主要特徵需具有高度的反差，以利影像分析的準確 、、而該等子板3〇1更可以是軟板，由於軟板材質的收 縮以及軟板尺寸越來越小的情況下，軟板的偏移量就必須 加以考慮，故每-子板3 〇工更設有定位標免（l〇cai fiducial mark)，根據定位標靶的位置，以決定所需要的 偏移補償量。 步驟（b):提供一獨立的多聯板之標記的檢知裝置 1，該多聯板之標記的檢知裝置i包括一影像擷取單元工 〇,及一運算單元2 0，其中利用該影像擷取單元i ◦擷 取5亥多聯板3 0的全影像，如前文所述，該影像擷取單元 10具有一預定解析度及一預定放大倍率且在一預定工 作距離（working distance) WD下擷取該多聯板3 〇之完 整影像。 步驟（c)利用該運算單元2 〇依序檢知該多聯板3 13 201015062 =等子板3 〇 i的影像，以判定每一子 否有該不良品標却q , 丄工疋 9 Π rS i。在此步驟之前，使用者可利用該 〇中的參數設定模組2 〇 5設定該子板3 〇 1的尺寸’亦即進行—設定該子板30 以使該運算單元^ 步驟， 聯板3 0之料以根據該子板尺寸料檢知該多 等子板3〇 1的影像。 另外’該運算單元2 〇 int⑽ting) R0I卜夾二先疋義檢知£域（啊^ _移動至對庫第五A圖)，並將該檢知區域 藉此，該運篡Ϊ Ϊ析之子板3 〇 1影像上的位置， ° 早兀2 0可分析該檢知區域R〇I中 不良品標記3 i，以判定此—子板3Q1上2 = 3 品標記31;接荖钛锃w 疋企有该不良 2 0舍Ρ θ 果。接下㈣運算單元 =〇會判疋疋否繼續進行下—個子板3qi的分析工 擷取的多聯板30的影像中之最後-個 ====檢知結果以輸出-檢知資料。 八批㈣ 分錄料歸讀，故此一 刀析步驟所花費的時間甚小，如一秒或小於一秒。The Γ 3 3 ^ is placed on the sub-board 301 belonging to the defective product to facilitate the subsequent process of carrying out 'where the defective product mark 31 has a predetermined size, such as X 3 (Caf 2) or 4X 4 (mm2) ), and the main features of the defective product mark 3 need to have a high contrast to facilitate accurate image analysis, and the daughter boards 3〇1 can be soft boards, due to the shrinkage of the soft board material and the soft board. When the size is getting smaller and smaller, the offset of the soft board must be considered. Therefore, each sub-board 3 is equipped with a l〇cai fiducial mark, according to the position of the positioning target. Determine the amount of offset compensation you need. Step (b): providing a separate detection device 1 for the marking of the multi-plate, the detecting device i of the marking of the multi-plate includes an image capturing unit process, and an operation unit 20, wherein the The image capturing unit i captures a full image of the 5H multi-plate 30. As described above, the image capturing unit 10 has a predetermined resolution and a predetermined magnification and is at a predetermined working distance. The complete image of the multi-plate 3 is captured by the WD. Step (c) using the computing unit 2 to sequentially detect the image of the multi-plate 3 13 201015062 = equal sub-board 3 〇i, to determine whether each sub-label has the bad product, but the 疋 9 Π rS i. Before this step, the user can use the parameter setting module 2 〇 5 in the 设定 to set the size of the sub-board 3 〇 1 'that is, proceed to set the sub-board 30 to make the computing unit ^ step, the board 3 The material of 0 detects the image of the multi-sub-board 3〇1 according to the size of the sub-board. In addition, the operation unit 2 〇int(10)ting) R0I folder 2 first 疋 检 检 检 £ ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The position on the image of the plate 3 〇1, ° 兀20 can analyze the defective product mark 3 i in the detection area R〇I to determine that the sub-board 3Q1 is 2 = 3 product mark 31; The company has the bad 2 0 Ρ θ. Next, the (4) arithmetic unit = 〇 will judge whether to continue the analysis of the next sub-board 3qi. The last one of the images of the multi-plate 30 captured ==== The detection result is output-detected data. Eight batches (4) of the sub-records are returned, so the time taken for the analysis step is very small, such as one second or less.
請參考第五圖至第五β圖並 封裝，如附件二至附件1_圖_其顯不另一種態樣（BGA 的衿知、㈣Γ士Γ 之實體照片）的多聯板30 =知仙，在本實施财該多聯板3 〇包括十個子板3 01，且該多聯板30的尺寸約 箄早；士且丄/ 么厘(mm)，而該 0 1僅有最左側端的上下兩個子板3 〇上上設 有不良品標記3 1，當檢知步驟卩彳 取單元她該多聯板30:!=先利用該影像擷 的几整影像；接著該運算單 201015062 定義一檢知區域_對應該最左側端的子板3 弟五A圖），在本實施例中，該檢知區域係 定義於該子板3 Q 1的左下角以對應該不良品標記3 / 的位置（δ亥檢知區域R〇I的位置亦可由該運算單元2 〇加 以設定）’而該運算單元2 〇即可判讀出該最左侧下端的 子板3 0十上设有不良品標記3丄，即該最左側下端的子 板3 0 1係屬於不良品。接著，該運算單元2 〇會將檢知 區域RGI依序移動至其他的子板3 Q i影像上（如第五B 1)以判別其他子板3 〇 1上是否有不良品標記3 1， 最後即可輪出一檢知資料給後端的取置機台4 0，該取置 機台4 0即可應用該檢知資料進行每一子板3 〇 i的後 端製作程序。 請參考第六圖，其顯示另一種態樣（MICR〇_SD，如附 件一所不之實體照片）的多聯板3 0的檢知過程，在本實 施例中該多聯板3 0包括七十個子板3 0 1，且該多聯板 驗 3 0的尺寸約為330公厘（mm)，而該等子板3 〇丄僅有 編號8、9、15、42及66的子板3 0 1上設有不良品標記 3 1。當檢知步驟開始時，先利用該影像擷取單元1 〇在 鏡頭組、感測元件及其他適當條件的情況下擷取該多聯板 ' 3 ◦的完整影像；接著該運算單元2 0會先定義一檢知區 域R01對應該編號1的子板3 0 1，而該運算單元2 0即 可判讀出該編號1的子板3 〇 1上是否設有不良品標記3 1 ’即判斷該編號1的子板3 〇 1是否屬於不良品。接著， 該運算單元2 〇會將檢知區域R0I依序移動至其他的子板 15 201015062 3 0 1影像上直到編號70的子板3 〇 1為止，以判別其 他子板3 ◦ 1上是否有不良品標記3丄，最後即可輪出二 檢知資料給後端的取置機台4 Q，而表丨則顯示最後 知資料，該取置機台4 Q即可應用該檢知資料進行每一子 板3 Ο 1的置件程序’例如該取置機台4 Q並*會對歸 為不良品的子板3 Ο 1進行後續的置件作業，以達 材料成本的目的。 $ 表1 01 02 03 04 05 06 07 08 09 10 ϋ_ 12 1L 敌 NG R5 一 — 一 — 一 一 ~·— R4 NG NG — -— — 一 -— — __ _ 上3 NG 一 一 — — — — __ -—' R2 一 — 一 —- — —---- NG 二 -ZL. R1 一 — — -— 鲁在表1中，—表示該子板301的位置上並益不 良品標記31，故該子板3〇1係為良品；而，， 位ί上出現不良品標記31，故該子板 係為不良。°，由表1與第六_時可以得知本發 =所w之多聯板之標記的檢知裝置1及檢知方法可以 有2別出現不良品標記3 i的子板3 〇工：另外本發明 二Γ=:檢知裝置1僅花費卜2秒即可得到表1 別檢知的方式同樣進行檢知-百片 子板3〇1所茜的時間相比（如随0-SD的多聯板之檢 16 201015062 知整體時間可估算為30秒），本發明可大幅提高檢知的效 率，進而提高生產效能，例如以100個子板的情況下，檢 知的時間可縮短至小於一秒。 而如步驟（a)所述，當該等子板30 1為軟板的情 況下，該多聯板之標記的檢知裝置1亦可以利用定位標靶 (local fiducial mark)的位置分析每一子板3 〇工的 偏移量，並將其儲存於檢知資料中，而該取置機台4 〇則 φ 可以根據檢知資料中的紀錄先進行偏移量的補償，再進行 • 兀，置件的步驟。而一般的情況下，軟板上的定位標靶之 數里大於不良品標記的數量，故在此情況下，更可以凸顯 出本發明對於置件產線之產能的提高。 明參考第七圖，其為本發明之另一實施例，係將該多 聯板之標記的檢知裝置2應用於多條生產線的情況，第七 圖僅緣出第一生產線（Une—卜第七圖上方之生產線）及 第二生產線（Line-2，第七圖下方之生產線），但不以上 • 述為限，其中第一生產線包括兩台取置機台4〇，第二生 產線同樣也包括兩台取置機^0，但取置機台4〇可依 照實際需要進行調配，例如該取置機台4 〇可為晶片取置 機、打線機等等。檢知而經過該多聯板之標記的檢知裝置 知的多聯板3◦則可以分別進人第—生產線或第二 ^線進仃相關製程，且每—生產線上的取置機台4◦可 =接f該資料庫單元5〇以得知待作業之多聯板30 每：子板3 01的位置，以正確的進行後端製程， 母一取置機台40的作業情況也可以上傳至該資料庫單 17 201015062 元5 Ο，讓使用者清楚知道多聯板3 0在哪一條生產線上 的哪一機台位置’以及該多聯板3 0上的子板3 〇 1所經 過的生產道次。 值得注意的是，由於本發明所提出之影像擷取單元工 0可以擷取到完整的多聯板3 0之全影像，故上述的多聯 板之標記的檢知裝置1均是設置在取置機台4 〇外側，亦 即多聯板3 0係先經過多聯板之標記的檢知裝置丄檢知 之後再藉由輸送帶等裝置送進取置機台4 〇進行製程。然 而本發明之多聯板之標記的檢知裝置1亦可内建安裝於 取置機台4 0中，僅需將取置機台4 〇内部的空間架構進 行相關規劃’例如取置機台4 〇必須具有一定高度，以使 該影像擷取單元1 〇能有足夠的預定工作距離WD，該取置 機台4 0也必須具有一定橫向長度，以避免機械構件等阻 礙到發光單元1〇1的照射光線而影響取像的品質。 請參考第八圖，本發明更提出一種多聯板的置件方 藝法，係利用前述的步驟先擷取多聯板3 〇的全影像，再利 用影像分析的技術在很短的時間内得到該多聯板3 〇上 母一子板3 〇 1是否為不良品的資料；再將該檢知資料傳 $給取置機台4 Q ’該取置機台4 Q則可以根據檢知資料 2行m而#多聯板的置件方法更包括-在檢知步驟之 月,J的印刷步驟，以及—在置件步驟之後的迴焊（reflow) 步驟。 %可以有效縮短取置機台4 0的閒置時間中的 不良《口‘。己的檢知時間’故可以提高產線生產的效能。仍 18 201015062 然以酬片的MICR〇-SD的置件生產線來說，彻 之多聯板的置件方法的生產線，印刷機的作業時間^ 秒，迴焊爐的作業時間也為25秒，而本發明的多 標記的檢知裝置i的擷取影像、檢知不良品標記（包括— 位標靶）的時間為1秒，晶片取置機的工作時間則為進片二 退片、標靶檢知時間、置件時間的時間為44秒，故敫條 =、=ycle time即為44秒;故可大幅提昇先“ 所述的生產cycle time (從74秒縮短至44秒）， :的產能，以此提高的產能可計算出—年的產值提高的 金額，以一年機台運作12個月、一個月託天、一天肋 ^時’若卫作效率為8成ϋ件置放時間為U秒、 母一片收益0.1元為例，可用下列計算式12 (月）X X託 (天）X 20 (小時）χ 3600 (秒）χ 8〇%+ 〇. 1 (顆/秒） X 〇.1(元）χ 40% = 6912000 (元），亦即一年 〔 升將近七百萬元。若一條峰著綠卜古；么〜 ^ •印刷機的作業時間仍為25秒，迴焊爐的作業時 3也為25秒，取置機的工作時間為4秒（進片、艮 ==+ (3〇/2)秒(不良品檢知時間)二2) (置：夺間）=39秒’故整條生產線的_如即 時門仍之，運用本發明之置件方法，印刷機的作業 二It:’迴焊爐的作業時間也為25秒，多聯板之 “的檢知裝置1的擷取影像、檢知不良品標記（包括定 位標乾）的時間為丨秒，取置機的工作時間為4秒（進片、 退片、餘檢知時間）+ (4〇/2)秒（置件時間）秒， 19 201015062 故整條生產線的eye 1 e t i me即為25秒，相較之下生產效 能也就提高了 37%。 綜上所述，本發明具有下列諸項優點： 1、 具有較佳的檢知效率，由於該影像擷取單元具有 較大視野，使其得以擷取該多聯板的完整影像，再針對該 完整影像進行每一子板影像的分析；亦即本發明係一次性 的擷取完整的全影像，再利用運算單元的高速運算能力及 影像分析技術判別每一子板上是否有不良品標記，藉此可 ® 輸出多聯板的上之不良子板的檢知資料，以使取置機台得 以根據該檢知資料進行置件，以解決傳統取置機台必須先 進行不良品檢知再進行置件所造成的閒置時間過長的問 題。 2、 另一方面，本發明利用較有效率的檢知方法以快 速判讀子板的優劣情況，使得後續的取置機台可以直接接 收該不良品檢知裝置所得到的檢知資料，藉此可提高生產 A 線的產能，例如每片產出時間就可以大幅的縮短。 ❿ 惟以上所述僅為本發明之較佳實施例，非意欲侷限本 發明之專利保護範圍，故舉凡運用本發明說明書及圖式内 容所為之等效變化，均同理皆包含於本發明之權利保護範 圍内，合予陳明。 【圖式簡單說明】 第一圖係本發明之多聯板之標記的檢知裝置之示意圖。 第二圖係第一種態樣之多聯板之示意圖。 20 201015062 第三圖係本發明之多聯板之標記的檢知裝置之運算單元之 功能方塊圖。 第四圖係本發明之多聯板之標記的檢知方法之流程圖。 第五圖係本發明之第二種態樣之多聯板之示意圖。 第五A圖至第五B圖係本發明利用一 R0I依序檢知子板之 示意圖。 第六圖係本發明之第三種態樣之多聯板之示意圖。 第七圖係本發明之多聯板之標記的檢知裝置應用於多生產 線之不意圖。 第八圖係本發明之多聯板之置件方法之流程圖。 第九圖係習知之多聯板之置件方法之流程圖。 附件一係MICR0-SD電路板之實體照片。 附件二至附件六係BGA封裝的電路板之實體照片。 【主要元件符號說明】 ® 1 多聯板之標記的檢知裝置 發光單元 主模組 開關模組 控制模組 輔助模組 參數設定模組 系統模組 10 影像擷取單元 101 2 0 運算單元 2 0 1 2 0 2 2 0 3 2 0 4 2 0 5 2 0 6 21 201015062 3 0 多聯板 3 1 不良品標記 4 0 取置機台 5 0 資料庫單元 WD 工作距離 ROI 檢知區域 3 0 1 子板Please refer to the fifth to fifth beta diagrams and package, such as Annex II to Annex 1_图_, which shows another aspect (BGA's knowledge, (4) the photo of the entity of the gentleman's )) 30 = Zhixian In the implementation of the present invention, the multi-plate 3 includes ten sub-boards 3 01, and the size of the multi-plate 30 is about early; and 丄 / 厘 (mm), and the 0 1 has only the leftmost end The two sub-boards 3 are provided with a defective product mark 3 1, and when the detecting step captures the unit, the multi-plate 30:!= first uses several images of the image; then the operation list 201015062 defines one The detection area _ corresponds to the leftmost side of the sub-board 3, the fifth picture A), in this embodiment, the detection area is defined in the lower left corner of the sub-board 3 Q 1 to correspond to the position of the defective product mark 3 / (The position of the R 〇 I detection area R 〇 I can also be set by the arithmetic unit 2 ) ' ' ' ' 而 而 而 运算 运算 运算 运算 运算 运算 运算 运算 运算 运算 运算 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子丄, that is, the leftmost lower sub-board 3 0 1 is a defective product. Then, the arithmetic unit 2 依 sequentially moves the detection area RGI to the other sub-board 3 Q i images (such as the fifth B 1) to determine whether there are defective labels 3 1 on the other sub-boards 3 〇 1 . Finally, a detection data can be rotated to the back-end pick-up machine 40, and the pick-up machine 40 can apply the detection data to perform the back-end production process of each daughter board 3 〇i. Please refer to the sixth figure, which shows the detection process of the multi-board 30 of another aspect (MICR〇_SD, such as the physical photo of the attached one). In the embodiment, the multi-board 30 includes Seventy daughter boards are 3 0 1, and the multi-plate test 300 has a size of about 330 mm (mm), and the sub-boards 3 have only daughter boards numbered 8, 9, 15, 42 and 66. There is a defective product mark 3 1 on the 3 0 1 . When the detecting step starts, the image capturing unit 1 is first used to capture the complete image of the multi-plate '3 〇 under the lens group, the sensing component and other suitable conditions; then the computing unit 20 will First, a detection area R01 is defined corresponding to the sub-board 3 0 1 of the number 1. The operation unit 20 can determine whether or not the defective item mark 3 1 ' is disposed on the sub-board 3 〇 1 of the number 1. Whether the sub-board 3 〇1 of the number 1 is a defective product. Next, the arithmetic unit 2 依 sequentially moves the detection area R0I to the other sub-board 15 201015062 3 0 1 image until the sub-board 3 〇 1 of the number 70 to determine whether there is any other sub-board 3 ◦ 1 The defective product is marked 3丄, and finally the second detection data can be rotated to the rear access machine 4 Q, and the watch display the last known information, the pick-up machine 4 Q can apply the detection data for each The placement procedure of a daughter board 3 Ο 1 'for example, the pick-up machine 4 Q and * will perform subsequent placement operations on the daughter board 3 Ο 1 classified as a defective product for the purpose of material cost. $ 表1 01 02 03 04 05 06 07 08 09 10 ϋ_ 12 1L Enemy NG R5 One - one - one ~ ~ - R4 NG NG — - — — One — — __ _ On 3 NG One — — — — — __ -—' R2 - one - - - - - - - NG II - ZL. R1 - - - - Lu in Table 1, - indicates the position of the daughter board 301 and benefits the defective product mark 31, so The sub-board 3〇1 is a good product; however, the defective product mark 31 appears on the bit ί, so the sub-board is defective. °, from Table 1 and the sixth _, the detection device 1 and the detection method of the mark of the multi-plate of the present invention can be found to have two sub-boards 3 in which the defective product mark 3 i appears: In addition, the second detection of the present invention: the detection device 1 takes only 2 seconds to obtain the same manner as in Table 1. The detection is performed in the same manner as the time when the 100-chip board 3〇1 is used (for example, with 0-SD) The multi-board inspection 16 201015062 knows that the overall time can be estimated to be 30 seconds), the invention can greatly improve the efficiency of detection, thereby improving the production efficiency, for example, in the case of 100 sub-boards, the detection time can be shortened to less than one second. As described in the step (a), when the sub-boards 30 1 are soft boards, the detecting device 1 of the multi-boards can also analyze each position by using a local fiducial mark. The offset of the completion of the daughter board 3 is stored in the detection data, and the φ of the pick-up machine φ can be compensated according to the record in the detection data, and then • 兀, the steps of the placement. In general, the number of positioning targets on the flexible board is larger than the number of defective products. Therefore, in this case, the productivity of the present invention for the production line of the parts can be highlighted. Referring to the seventh figure, which is another embodiment of the present invention, the detecting device 2 for marking the multi-plate is applied to a plurality of production lines, and the seventh drawing is only for the first production line (Une-Bu The production line above the seventh figure) and the second production line (Line-2, the production line below the seventh figure), but not limited to the above, the first production line includes two pick-up machines 4, the second production line is the same It also includes two pick-up machines ^0, but the pick-up machine 4 can be adjusted according to actual needs, for example, the pick-up machine 4 can be a wafer pick-up machine, a wire machine, and the like. The multi-plate 3, which is detected by the detecting device of the multi-plate, can be separately entered into the first production line or the second line, and the pick-up machine 4 on each production line ◦可=接f the database unit 5〇 to know the position of the multi-plate 30 to be operated: the position of the sub-board 301 to correctly perform the back-end process, and the operation of the mother-receiving machine 40 can also be Upload to the database list 17 201015062 yuan 5 Ο, let the user know clearly which machine position on the production line of the multi-board 30 is 'and the sub-board 3 〇1 on the multi-board 30 Production route. It should be noted that, since the image capturing unit 0 proposed by the present invention can capture the full image of the complete multi-board 30, the above-mentioned multi-board marking detecting device 1 is set in the fetching manner. The outside of the machine 4, that is, the multi-plate 30 is detected by the detecting device of the multi-plate, and then sent to the pick-up machine 4 by a conveyor or the like to perform the process. However, the detecting device 1 for marking the multi-plate of the present invention can also be built and installed in the pick-up machine 40, and only the space structure inside the pick-up machine 4 needs to be related to the planning. 4 〇 must have a certain height, so that the image capturing unit 1 can have a sufficient predetermined working distance WD, and the taking-in machine 40 must also have a certain lateral length to prevent mechanical components and the like from obstructing the light-emitting unit 1〇. The illumination of 1 affects the quality of the image taken. Referring to the eighth figure, the present invention further proposes a method for setting the multi-plate, which uses the foregoing steps to first capture the full image of the multi-plate 3, and then uses the technique of image analysis in a short time. Obtaining whether the parent-child sub-board 3 〇1 of the multi-plate 3 is a defective product; and transmitting the detection data to the pick-up machine 4 Q 'the pick-up machine 4 Q can be detected according to the detection The data 2 rows m and #multi-plate mounting method further includes - the printing step of J in the month of the detecting step, and - the reflow step after the placing step. % can effectively shorten the bad "mouth" in the idle time of the pick-up machine 40. The detection time of the company can improve the production efficiency of the production line. Still 18 201015062 However, in the case of the MICR〇-SD part production line of the remuneration piece, the production line of the multi-layer board mounting method, the working time of the printing machine is 2 seconds, and the working time of the reflow furnace is also 25 seconds. In the multi-mark detection device i of the present invention, the time for capturing the image, detecting the defective product mark (including the target mark) is 1 second, and the working time of the wafer pick-up machine is the film take-off and the mark. The target detection time and the time of the placement time are 44 seconds, so the crepe =, = ycle time is 44 seconds; therefore, the production cycle time (from 74 seconds to 44 seconds) can be greatly improved. The production capacity, in order to increase the production capacity, can be calculated as the amount of annual production value increase, with a one-year machine operation for 12 months, one month, one day, one day, if the efficiency is 80%. For example, the time is U seconds and the mother piece yields 0.1 yuan. The following formula can be used: 12 (month) XX (days) X 20 (hours) χ 3600 (seconds) χ 8〇%+ 〇. 1 (pieces/second) X 〇.1 (yuan) χ 40% = 6912000 (yuan), that is, one year [up to nearly seven million yuan. If a peak is green, ancient ~; ~ ~ • printing press The working time is still 25 seconds, the working time of the reflow oven is also 25 seconds, and the working time of the pick-up machine is 4 seconds (injection, 艮==+ (3〇/2) seconds (defective product detection time) 2)) (set: seized) = 39 seconds 'so the entire production line _ such as the instant door still, using the method of the invention, the operation of the printing machine II:: The working time of the reflow furnace is also 25 In seconds, the time of capturing the image of the detecting device 1 of the multi-plate, detecting the defective product mark (including the positioning of the dry mark) is leap second, and the working time of the pick-up machine is 4 seconds (incoming film, unloading, The remaining detection time) + (4 〇 / 2) seconds (set time) seconds, 19 201015062, so the entire production line eye 1 eti me is 25 seconds, compared to 37% increase in production efficiency. In summary, the present invention has the following advantages: 1. It has better detection efficiency, because the image capturing unit has a larger field of view, so that it can capture the complete image of the multi-plate, and then The complete image is used to analyze each sub-board image; that is, the present invention captures a complete full image at a time, and then uses the high-speed computing capability and image analysis technology of the computing unit to determine whether there is a defective product mark on each sub-board. In this way, the detection data of the bad sub-board on the multi-plate can be output, so that the fetching machine can be placed according to the detection data, so that the traditional fetching machine must first detect the defective product. The problem of idle time caused by the placement is too long. 2. On the other hand, the present invention utilizes a more efficient detection method to quickly interpret the pros and cons of the sub-board, so that the subsequent fetching machine can directly receive the detection data obtained by the defective product detecting device, thereby It can increase the production capacity of the production line A, for example, the output time per piece can be greatly shortened. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent changes to the description of the present invention and the contents of the drawings are all included in the present invention. Within the scope of protection of rights, it is given to Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of a detecting device for marking a multi-plate of the present invention. The second figure is a schematic diagram of the multi-plate of the first aspect. 20 201015062 The third figure is a functional block diagram of the arithmetic unit of the detecting device of the marking of the multi-plate of the present invention. The fourth figure is a flow chart of the method for detecting the marking of the multi-plate of the present invention. The fifth drawing is a schematic view of a multi-plate of the second aspect of the present invention. The fifth to fifth diagrams B show a schematic diagram of the present invention using a R0I to sequentially detect the daughter board. The sixth drawing is a schematic view of a multi-plate of the third aspect of the present invention. The seventh drawing is a schematic view of the detecting device of the marking of the multi-plate of the present invention applied to a multi-production line. The eighth figure is a flow chart of the method for placing the multi-plate of the present invention. The ninth figure is a flow chart of a conventional method for placing a multi-plate. Attachment 1 is a physical photo of the MICR0-SD board. Attachment 2 to Annex 6 are physical photographs of the boards of the BGA package. [Main component symbol description] ® 1 Multi-plate marking detection device Light-emitting unit Main module Switch module Control module Auxiliary module parameter setting module System module 10 Image capturing unit 101 2 0 Operation unit 2 0 1 2 0 2 2 0 3 2 0 4 2 0 5 2 0 6 21 201015062 3 0 Multi-plate 3 1 Defective mark 4 0 Pick-up machine 5 0 Library unit WD Working distance ROI Detection area 3 0 1 board
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