201015794 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種用於容置並固持晶片卡之固持裝 置’特別涉及一種用於攜帶型電子裝置上之晶片卡固持 裝置。 、 【先前技術】 隨著通訊事業之迅速發展，行動電話、個人數位助理 ❹（personal digital assistant, PDA)等各種攜帶型電子裝置之 使用越來越普及。隨著該等攜帶型電子裝置產品之功能日 益多元化，應用於該等攜帶型裝置上之用於存儲記惊之晶 片卡亦越來越多，例如SD卡（Secure Digiul Mem〇ryBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holding device for accommodating and holding a wafer card, and particularly to a wafer card holding device for a portable electronic device. [Prior Art] With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products are increasingly diversified, more and more wafer cards for storing the alarms are applied to such portable devices, such as SD cards (Secure Digiul Mem〇ry).
Card)、CF 卡（Compact Flash Card)、SIM 卡（SubscriberCard), CompactFlash Card, SIM card (Subscriber)
Identification Module Card，用戶識別卡）等。其中，SIM 卡係一種裝有1C晶片之塑膠卡片，其具有記錄個人用戶 號碼及通訊簿等功能，藉由更換SIM卡，其可供多個用戶 ❹使用。 習知晶片卡一般容置於攜帶型電子裝置之卡槽内。當 該晶片卡容置於該卡槽内時，該晶片卡上之積體電路藉由 一連接器與該攜帶型電子裝置之電路板連接。當需要更換 該晶片卡時，使用者使用手指直接按住該晶片卡暴露之部 分，並向該卡槽外拖動，藉由使用者手指與該晶片卡之間 之摩擦力使該晶片卡隨使用者手指運動，直至晶片卡由該 卡槽内滑出。 然，於實際使用中，由於晶片卡暴露於卡槽外之部分 6 201015794 按料露部分操作較為困難；有些型號之 ^ Μ容置於卡槽内。故，使用者難以直& 按壓該晶片卡之方彳燋叙姑曰y上丄 難乂措由置接 【發明内容】 曰曰片卡由卡槽滑出。 有f於以上缺陷，有必要提供一種易於更換晶片卡且 可有效容置、m持晶片卡之晶片相持裝置。、 體上^其包括—基體及—形成於該基 ❹有-用以插：曰裝設一晶片卡之卡裝設部，該卡裝設部具 一釋放件其卡之開口；所述晶片卡固持裝置還包括 上且可分別定位於所 ’用以將該晶片卡鎖持或解鎖於該卡裝 相較於習知技術，所述晶片卡固持裝置 藉由於基體之卡裝設部前方設置一釋放件，：易構現， 二片4 =及拆卸，同時使得晶片卡之安裝及更換過程 ❹變付更加簡單，容易操作。 【實施方式】 本發明公開-種晶片卡固持裝置，其適用於行動電 話、個人數位助理（P_nal digital㈣㈣，PDA)等攜帶 型電子裝置。下面將以本發明晶片卡固持裝置之較 例應用於一行動電話（圖未示）為例進行說明。 請參閱圖i，-晶片卡固持襄置⑽包括—基體 =板％、二爽持部4G及—釋放件％。所述基體ι〇 mm mi行動電話之機殼。所述基 7 201015794 ❹ 體10具有-側帛12，其上靠近其一端部位置處向下凹設 形成-大致矩形之條形凹槽121，並對應地於該側壁U 之端部形成一外侧壁⑵及-與該外側壁123相對平行之 内侧壁125。所述外侧壁⑵之外表面上沿平行於該條形 凹槽⑵方向凹設有條形導向槽13,該導向槽13之長度 與該條形凹槽121之長度相當。所述導向槽13内間隔地 凹設有-第-定位部15及—第二定位部17，以用於對裝 設於該基體1G之側壁12上之釋放件5()進行定位。於 實施例中所述第—定位部15及—第二定位部Η為分 間隔凹設於該導向槽13兩端之二半球形限位凹槽。 斤述電路板30大致呈矩形板狀，其裝設於所述基體 ίο上臨近該基體1G之條形凹槽121位置處。所述電路板 3〇上臨近該條形凹槽121之一側裝設有一卡連接器31。 ^所述二夾持部40相對裝設於所述電路板30上之卡連 接器31之兩側，並與所述卡連接器31及電路板共同 ❹，成-卡裝設部33，該卡裝設部33具有—詩***蟲片 9〇之且朝向條形凹槽121之開口（圖未標），以便晶片 卡90容置於該卡裝設部33内。 請參閱圖2,所述釋放件50為一橫截面大致呈“u” 形之播滑塊，其沿一與該晶片卡90滑動方向相垂直之方 向滑動地裝設於所述基體10之侧壁12之外侧壁123上且 位於所述開口前方位置處，用以將該晶片卡90卡鎖或解 鎖於該卡裝設部33内。所述釋放件5G包括-卡合壁51 及”該卡合壁51相對平行間隔設置之安裝壁53，該卡 8 201015794 〇壁51與文裝壁53之間圍成一大致矩形槽狀之裝配空間 55。所述卡合壁51與安裝壁53之間間隔之距離與所述基 體1〇之外側壁123之厚度尺寸相當，該安裝壁53之厚度 與所述條形凹槽121之寬度尺寸相當，以使得該釋放件 50可被相對滑動地裝設於該外侧壁123上，該釋放件刈 之安裝壁53被可滑動地裝夾於該條形凹槽121内。所述 卡合壁51之朝向該安裝壁53 一侧之内表面上對應於所述 ❹導向槽13内之第一定位部15或第二定位部17間隔凸設 有二球形凸塊52,以使該釋放件5〇裝設於該基體扨之 侧壁12上時可沿該導向槽13滑動，並分別定位於該導向 槽13之第一定位部15及第二定位部口位置處。 睛一併參閱圖3及圖4，裝入所述晶片卡9〇時，首 先，用手撥動所述釋放件50,使該釋放件5〇沿條形凹槽 121及外侧壁123上之導向槽13朝遠離該卡裝設部”之 一側滑移直至定位於該導向槽13之第—^位部15處。此 ©時，所述釋放件50之安裝壁51上之二球形凸塊52分別 對應卡合於該導向槽13之第—定位部15之二半球形限位 ^内。接下來，將所述晶片卡9〇滑人所述二夾持部4〇 ^連接器圍成之卡裝” 33内；最後，撥動所述釋 50朝向該卡裝設部33方向滑移直至定位於該導向槽 3之第二定位部17處，並播抵於所述晶片卡90之前方 以防止晶片卡90脫出’即完成所述晶片卡90之安裝。此 :庙：述釋放件50之安裝壁51上之二球形凸㈣分別 士應卡合於該導向槽13之第二定位部17之二半球形限位 9 201015794 凹槽内。當需要取出所述晶片卡9〇 述釋放件5〇,使該釋放件5〇沿條形凹槽 裝設部33之一側滑移直至定位於該導向；==: 部15處，即可輕易取出晶片卡9〇。 可以理解，所述釋放件5G之安_51上之球形 52並不限於本實施例中之二個，其亦可 增加或減少；㈣，所料向槽13内之1^際^ 第一疋位部17上之半球形限位凹槽亦不限於本實施例中 之二個’其對應於所述釋放件5〇之安裝壁51上之球形凸 塊52可根據實際需要增加或減少。 本發明所述晶片卡固持裝置⑽結構簡單，其藉由於 所述二夾持部40與卡連接器31圍成之卡裝設部33前方 設置一釋放件50，輕易地實現了晶片卡9〇之安裝及拆Identification Module Card, user identification card, etc. Among them, the SIM card is a plastic card equipped with a 1C chip, which has functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the SIM card. Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot. However, in actual use, since the wafer card is exposed to the outside of the card slot 6 201015794 It is difficult to operate according to the exposed portion; some models are placed in the card slot. Therefore, it is difficult for the user to directly and/or press the chip card. The 曰 曰 曰 曰 曰 乂 乂 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 In view of the above drawbacks, it is necessary to provide a wafer holding device that can easily replace a wafer card and can effectively accommodate and hold a wafer card. And comprising: a base body and - formed on the base - for inserting: a card mounting portion for mounting a wafer card, the card mounting portion having a release member opening the card; the wafer The card retaining device further includes a top and can be respectively positioned to lock or unlock the wafer card to the card. The wafer card retaining device is disposed in front of the card mounting portion of the base body. A release piece, easy to construct, two pieces of 4 = and disassembly, at the same time make the process of installing and replacing the wafer card easier and easier to operate. [Embodiment] The present invention discloses a wafer card holding device which is suitable for a portable electronic device such as a mobile phone, a personal digital assistant (P_nal digital (four) (four), PDA). In the following, an example of the wafer card holding device of the present invention is applied to a mobile phone (not shown) as an example. Referring to FIG. 1, the wafer card holding device (10) includes a substrate = a board %, a second holding portion 4G, and a release member %. The base of the substrate ι mm mm mobile phone. The base 7 201015794 body 10 has a side sill 12 which is recessed downwardly at a position near one end thereof to form a substantially rectangular strip-shaped recess 121 and correspondingly forms an outer side at the end of the side wall U. The wall (2) and the inner side wall 125 are opposite to the outer side wall 123. A strip-shaped guide groove 13 is formed on the outer surface of the outer side wall (2) in a direction parallel to the strip-shaped groove (2), and the length of the guide groove 13 is equivalent to the length of the strip-shaped groove 121. The guide groove 13 is recessed with a - first positioning portion 15 and a second positioning portion 17 for positioning the release member 5 () mounted on the side wall 12 of the base 1G. In the embodiment, the first positioning portion 15 and the second positioning portion Η are two hemispherical limiting grooves which are recessed at two ends of the guiding groove 13. The circuit board 30 has a substantially rectangular plate shape and is disposed on the base ίο adjacent to the strip-shaped recess 121 of the base 1G. A card connector 31 is mounted on one side of the circuit board 3 adjacent to the strip-shaped recess 121. The two clamping portions 40 are opposite to the card connector 31 mounted on the circuit board 30, and are coupled with the card connector 31 and the circuit board to form a card mounting portion 33. The card mounting portion 33 has an opening (not shown) that is inserted into the blade 91 and faces the strip groove 121 so that the wafer card 90 is housed in the card mounting portion 33. Referring to FIG. 2, the release member 50 is a broadcaster having a substantially U-shaped cross section, and is slidably mounted on the side of the base 10 in a direction perpendicular to the sliding direction of the wafer card 90. The outer side wall 123 of the wall 12 is located at a position in front of the opening for latching or unlocking the wafer card 90 into the card mounting portion 33. The release member 5G includes an engaging wall 51 and a mounting wall 53 that is spaced apart from each other in a parallel manner. The card 8 201015794 encloses a substantially rectangular groove between the wall 51 and the article wall 53. a space 55. The distance between the engaging wall 51 and the mounting wall 53 is equivalent to the thickness of the outer wall 123 of the base 1 , and the thickness of the mounting wall 53 and the width of the strip groove 121 Therefore, the release member 50 is slidably mounted on the outer side wall 123, and the mounting wall 53 of the release member is slidably mounted in the strip recess 121. The engaging wall Two spherical protrusions 52 are spaced apart from the first positioning portion 15 or the second positioning portion 17 on the inner surface of the side of the mounting wall 53 corresponding to the inside of the mounting wall 53 so that the release member 5 is provided. The shank is slidable along the guiding groove 13 and is respectively positioned at the position of the first positioning portion 15 and the second positioning portion of the guiding groove 13. The eye is also referred to FIG. And FIG. 4, when the wafer card 9 is loaded, first, the release member 50 is manually dialed to make the release member 5 follow the strip. The groove 13 and the guide groove 13 on the outer side wall 123 are slid toward the side away from the card mounting portion until they are positioned at the first portion 15 of the guide groove 13. In this case, the two spherical projections 52 on the mounting wall 51 of the release member 50 respectively correspond to the two hemispherical limits of the first positioning portion 15 of the guiding groove 13. Next, the wafer card 9 is slid into the card holder 33 surrounded by the two clamping portions 4 ; ^ connector; finally, the release 50 is slid toward the card mounting portion 33 Until the second positioning portion 17 of the guiding groove 3 is positioned, and is splayed in front of the wafer card 90 to prevent the wafer card 90 from coming out, that is, the installation of the wafer card 90 is completed. The two spherical protrusions (four) on the mounting wall 51 of the member 50 should be respectively engaged in the two hemispherical limit 9 201015794 of the second positioning portion 17 of the guiding groove 13. When the wafer card 9 needs to be taken out, The release member 5〇 is configured to slide the release member 5 之一 along one side of the strip-shaped groove mounting portion 33 until it is positioned at the guide; ==: at the portion 15, the wafer card 9 can be easily taken out. It is understood that The spherical shape 52 on the ampoule 51 of the release member 5G is not limited to two in the embodiment, and may be increased or decreased; (d), the first conduit portion 17 in the groove 13 is The upper hemispherical limiting groove is not limited to the two in the embodiment, and the spherical protrusion 52 corresponding to the mounting wall 51 of the releasing member 5〇 can be according to actual needs. The wafer card holding device (10) of the present invention has a simple structure, and is easily realized by providing a releasing member 50 in front of the card mounting portion 33 surrounded by the two clamping portions 40 and the card connector 31. Installation and removal of the chip card 9〇
卸，同時使得晶片卡90之安裝及更換過程變得更加簡 單’容易操作。 S ❹ 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，本發 明之範圍並不以上述實施例為限，舉凡熟悉本案技藝之人 士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 【圖式簡單說明】 圖1為本發明晶片卡固持裝置較佳實施例之立體分 解示意圖； 圖2為本發明晶片卡固持裝置之擋塊之立體示意圖； 201015794 卡時之立體示從意本圖發明曰曰片卡固持裝置内取出或裝入晶片 圖4為晶片卡裝設於本發明 體示意圖。 晶片卡固持t置内之立 【主要元件符號說明】 晶片卡固持裝置 侧壁 •外侧壁 響 導向槽 第二定位部 卡連接器 夹持部 卡合壁 安裝壁 晶片卡 100 12 123 13 17 31 40 51 53 基體 條形凹槽 内側壁 第一定位部 電路板 卡裝設部 釋放件 凸塊 裝配空間 10 121 125 15 30 33 50 52 55 90Unloading also makes the process of installing and replacing the wafer card 90 simpler and easier to operate. S ❹ In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a preferred embodiment of a wafer card holding device of the present invention; FIG. 2 is a perspective view of a stop of a wafer card holding device according to the present invention; The invention discloses that the wafer card holder is taken out or loaded into the wafer. FIG. 4 is a schematic view showing the wafer card mounted on the body of the present invention. The wafer card is held in the inside of the t-position [Main component symbol description] The wafer card holding device side wall • The outer side wall sounding guide groove The second positioning portion card connector clamping portion engaging wall mounting wall chip card 100 12 123 13 17 31 40 51 53 Base strip groove inner side wall first positioning part circuit board card mounting part release piece bump assembly space 10 121 125 15 30 33 50 52 55 90