TW201012557A - Coating apparatus and coating method - Google Patents

Coating apparatus and coating method Download PDF

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TW201012557A
TW201012557A TW098117304A TW98117304A TW201012557A TW 201012557 A TW201012557 A TW 201012557A TW 098117304 A TW098117304 A TW 098117304A TW 98117304 A TW98117304 A TW 98117304A TW 201012557 A TW201012557 A TW 201012557A
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substrate
temperature
gas
coating
unit
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TW098117304A
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Chinese (zh)
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TWI485009B (en
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Shiro Kondo
Atsuo Kajima
Makoto Tomitori
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Tokyo Ohka Kogyo Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A coating apparatus including a substrate carrying section for floating and transporting a substrate and a coating section for applying a liquid on the substrate being transported by the substrate carrying section, wherein the substrate carrying section has a gas pumping portion for pumping a gas to the substrate, and a temperature control portion for controlling the gas.

Description

201012557 六、發明說明： 【發明所屬之技術領域】 本發明是關於塗布裝置及塗布方法。 本案是根據於2008年06月1〇日在日本所申請的日 本特願2008-151720號案來主張優先權，在此引用其內容 【先前技術】 在液晶顯示器等的構成顯示面板的玻璃基板上，形成 有配線或電極、彩色濾光片等的細微圖案。一般來說這種 圖案，是用例如光微影技術等的方法所形成。在光微影技 術中，分別進行：在玻璃基板上形成光阻膜的光阻膜形成 步驟、將該光阻膜進行圖案曝光的曝光步驟、及之後將該 光阻膜予以顯像的顯像步驟。 在光阻膜形成步驟，所使用的塗布裝置，是在玻璃基 板的表面上塗布光阻膜。已知的塗布裝置（例如參考專利 文獻1)的構造，例如使玻璃基板浮起於台部上進行搬運 ，在藉由與台部相對向設置的狹縫噴嘴而上浮移動的玻璃 基板的表面塗布光阻劑。 在該塗布裝置，以往是藉由將來自鋪設於工廠等的空 氣供給源的空氣，噴射於玻璃基板’來使該玻璃基板浮起 ，而因爲空氣使用量會變得很大量，所以近年來提出了使 用鼓風機來供給空氣的構造。 [先前技術文獻] -5- 201012557 [專利文獻1] 日本特開2005 -23 6092號公報 【發明內容】 [發明欲解決的課題] 可是，藉由鼓風機或壓縮機等的空氣供給機構所供給 的空氣，會藉由空氣供給機構本身的發熱或空氣供給路線 內的熱量，讓包含塗布裝置的空間的溫度，變得較例如配 置有塗布裝置的潔淨室內等的溫度更高。而會有因爲將具 有溫度差的空氣吹向玻璃基板，而讓搬運中的玻璃基板產 生溫度不均的可能性。搬運中的玻璃基板的溫度不均，會 成爲光阻膜的乾燥不均，進而讓膜厚度不均的原因，所以 必須要求用來減少該溫度不均情形的構造 例如，近年來伴隨著顯示面板的大型化，在製程中使 用的玻璃基板的尺寸也大型化。大型尺寸的玻璃基板，會 有更顯著產生溫度不均的傾向，則有更強烈的需求要有這 種減少溫度不均情形的構造。並不限於使用藉由空氣供給 機構所供給的空氣的情況，在使用例如從在工廠鋪設的空 氣供給源所供給的空氣等，從其他供給源供給的空氣的情 況也是一樣。 鑑於以上的情形，本發明的目的要提供一種塗布裝置 及塗布方法，能減少在基板產生的溫度不均情形，且能防 止產生液狀體的膜厚度不均情形。 201012557 [用以解決課題的手段] 爲了達成上述目的，本發明的第一型態的塗布裝置， 是具備有：使基板浮起來進行搬運的基板搬運部、以及在 藉由上述基板搬運部進行搬運的同時，將液狀體塗布於上 述基板的塗布部，且其特徵爲具備有：設置於上述基板搬 運部’朝上述基板噴出氣體的氣體噴出部、以及用來調節 上述氣體的溫度的溫度調節部。 Φ 藉由本發明的第一型態的塗布裝置，具備有：設置於 基板搬運部，朝基板噴出氣體的氣體噴出部、以及用來調 節氣體的溫度的溫度調節部，所以可以藉由該溫度調節部 _ 來調節朝基板噴出氣體的溫度。藉此，可以減輕在基板產 生的溫度不均情形，則可防止產生液狀體的膜厚度不均的 情形。 在第一型態的塗布裝置，較佳爲上述基板搬運部，具 有與上述塗布部對應的塗布區域，上述溫度調節部，將噴 φ 出到上述塗布區域的上述氣體的溫度進行調節。 在塗布區域是將液狀體塗布到基板上，所以特別需要 高精度進行氣體的溫度管理。藉由上述構造的塗布裝置， 基板搬運部具有與塗布部對應的塗布區域，溫度調節部將 噴出到塗布區域的氣體溫度進行調節，所以在特別需要氣 體溫度調節的塗布區域，可以減少在基板產生溫度不均的 情形。 在第一型態的塗布裝置，較佳爲上述基板搬運部，具 有將上述基板搬出的基板搬出區域，上述溫度調節部，將 201012557 噴出到上述基板搬出區域的上述氣體的溫度進行調節° 如果在塗布好液狀體之後在基板產生溫度不均的情形 的話，該溫度不均情形會影響到基板上的液狀體，可能會 因爲該影響而產生液狀體的膜厚度不均的情形。藉由上述 構造的塗布裝置，基板搬運部具有將基板搬出的基板搬出 區域，溫度調節部將噴出到基板搬出區域的氣體溫度進行 調節，所以可以減少在塗布好液狀體的基板產生溫度不均 的情形。藉此，可以防止液狀體的膜厚度不均的情形。 在第一型態的塗布裝置，較佳爲上述基板搬運部，具 有將上述基板搬入的基板搬入區域，上述溫度調節部，將 噴出到上述基板搬入區域的上述氣體的溫度進行調節。 如果在塗布好液狀體之前在基板產生溫度不均的情形 的話，基板的溫度不均情形會影響到所塗布的液體狀態， 可能會因爲該影響而產生液狀體的膜厚度不均的情形。藉 由上述構造的塗布裝置，基板搬運部具有將基板搬入的基 板搬入區域，溫度調節部將噴出到基板搬入區域的氣體溫 度進行調節，所以可以減少在塗布液狀體之前的基板產生 溫度不均的情形。藉此，可以防止液狀體的膜厚度不均的 情形。 在第一型態的塗布裝置，較佳爲上述基板搬運部，具 有與上述塗布部對應的塗布區域，上述溫度調節部，將噴 出到上述基板搬運部之中與上述塗布區域鄰接的區域的上 述氣體的溫度進行調節。 藉由上述構造的塗布裝置，基板搬運部具有與塗布部 -8- 201012557 對應的塗布區域，溫度調節部，將噴出到基板搬運部之中 與塗布區域鄰接的區域的氣體的溫度進行調節，所以在對 基板塗布液狀體的前後時機，可以分別減少在基板產生溫 度不均的情形。藉此能有效地防止液狀體的膜厚度不均的 情形。 在第一型態的塗布裝置，較佳爲上述溫度調節部，是 將上述氣體的溫度調節成：配合用來搬運上述基板的搬運 Φ 空間的溫度。 搬運中的基板的溫度，會與用來搬運基板的搬運空間 的溫度大致相等。 ， 藉由上述構造的塗布裝置，將氣體的溫度調節成：配 合用來搬運基板的搬運空間的溫度，所以可以防止搬運中 的基板的溫度產生變化。藉此，可以防止在基板產生溫度 不均的情形。 在第一型態的塗布裝置，較佳爲上述溫度調節部，將 φ 上述氣體的溫度調節在20t〜25°C的範圍內。 藉由上述構造的塗布裝置，將氣體的溫度調節在接近 常溫的20 °C〜25°C的範圍內，所以可以減輕溫度調節的負 擔。 在第一型態的塗布裝置，較佳爲上述基板搬運部，是 具有：與上述塗布部對應的塗布區域、將上述基板搬入的 基板搬入區域、以及將上述基板搬出的基板搬出區域，上 述溫度調節部，分別對上述塗布區域、上述基板搬入區域 及上述基板搬出區域的各區域設定上述氣體的溫度。 -9- 201012557 藉由上述構造的塗布裝置，基板搬運部，是具有：與 塗布部對應的塗布區域、將基板搬入的基板搬入區域、以 及將基板搬出的基板搬出區域，溫度調節部，分別對塗布 區域、上述基板搬入區域及上述基板搬出區域的各區域設 定氣體的溫度，所以可以更高精度地調節氣體的溫度。 在第一型態的塗布裝置，較佳爲上述氣體噴出部，對 用來搬運上述基板的搬運空間噴出氣體。 藉由上述構造的塗布裝置，氣體噴出部是對搬運空間 噴出氣體，所以將經過溫度調節的氣體噴出到於搬運空間 搬運的基板。藉此，可減少在基板產生溫度不均的情形。 在第一型態的塗布裝置，上述基板搬運部，具有：將 用來搬運上述基板的搬運空間的氣體予以吸引的吸引機構 、與將藉由上述吸引機構所吸引的上述氣體朝上述氣體噴 出部循環的循環路線。 藉由上述構造的塗布裝置，由於基板搬運部，具有： 將搬運空間的氣體予以吸引的吸引機構、與將藉由吸引機 構所吸引的氣體朝氣體噴出部循環的循環路線，將配置於 搬運空間上的經過溫度調節的氣體予以吸引，則能使該氣 體循環將其朝搬運空間噴出。藉此則能減輕溫度調節的負 在第一型態的塗布裝置，較佳爲上述循環路線，具有 :用來將包含於上述氣體的異物的流通加以限制的過濾器 〇 藉由上述構造的塗布裝置，循環路線，具有：用來將 -10- 201012557 包含於氣體的異物的流通加以限制的過濾器，所以可以防 止異物混入到循環而噴出的氣體。 在第一型態的塗布裝置，較佳爲在用來供給上述氣體 的路線上’設置有：將用來搬運上述基板的搬運空間的溫 度保持爲一定溫度的冷卻機構及加熱機構的其中至少一方 〇 藉由上述構造的塗布裝置，在用來將氣體供給到上述 Φ 基板搬運部的路線上，設置有：將用來搬運基板的搬運空 間的溫度保持爲一定溫度的冷卻機構及加熱機構的其中至 少一方，所以可以藉由上述冷卻機構、加熱機構來調節氣 _ 體的溫度。 本發明的第二型態的塗布方法，是使基板浮起而於塗 布區域、基板搬出區域依序進行搬運，且同時在上述塗布 區域對上述基板塗布液狀體的塗布方法，其特徵爲：調節 氣體的溫度’將調節過溫度的上述氣體對上述基板噴出， Φ 使上述基板浮起。 藉由本發明的第二型態的塗布方法，調節氣體的溫度 ，將調節過溫度的上述氣體對上述基板噴出，使上述基板 浮起’所以可以減少在基板產生的溫度不均情形，可以防 止液狀體產生膜厚度不均情形。 在第二型態的塗布方法，較佳是在塗布上述液狀體之 前’將朝上述基板噴出的上述氣體的溫度加以調節。 藉由上述組成的塗布方法，是在塗布液狀體之前，將 朝基板噴出的氣體的溫度加以調節，所以可以減少在塗布 -11 - 201012557 液狀體之前的基板產生的溫度不均情形，可以防止液狀體 產生膜厚度不均情形。 在第二型態的塗布方法，較佳爲在將上述基板搬入到 上述塗布區域之前’將朝上述基板噴出的上述氣體的溫度 加以調節。藉由上述組成的塗布方法，在將基板搬入之前 ’將朝基板噴出的氣體的溫度加以調節，所以在搬入基板 時可以減少在基板產生的溫度不均情形。藉此可以防止液 狀體的膜厚度不均情形》 Λ 在第二型態的塗布方法，較佳爲在將塗布好液狀體的 上述基板從上述基板搬出區域搬出之前，將朝上述基板噴 出的上述氣體的溫度加以調節》 藉由上述組成的塗布方法，在將基板搬出之前，將朝 基板噴出的氣體的溫度加以調節，所以在搬出基板時，例 如在基板塗布好液狀體之後，可以減少在基板產生的溫度 不均情形。藉此可以防止液狀體的膜厚度不均情形。 在第二型態的塗布方法，較佳是將上述氣體的溫度調 ⑬ 節成：配合用來搬運上述基板的上述搬運空間的溫度。 藉由上述組成的塗布方法，將氣體的溫度調節成：配 合用來搬運基板的搬運空間的溫度，所以可以防止搬運中 的基板的溫度產生變化。藉此，可以防止在基板產生溫度 不均的情形。 在第二型態的塗布方法，較佳爲將上述氣體的溫度調 節在20 °C〜25 t的範圍內。 藉由上述組成的塗布方法，將氣體的溫度調節在接近 -12- 201012557 常溫的20 °C〜25 °C的範圍內，所以可以減輕溫度調節的負 擔。 在第二型態的塗布方法，較佳爲將上述氣體的溫度調 節成：根據上述基板的搬運位置而將不同溫度的氣體噴出 到上述基板。 藉由上述組成的塗布方法，將氣體的溫度調節成：根 據基板的搬運位置而將不同溫度的氣體噴出到基板，所以 φ 能以更高精度減少基板的溫度不均情形。 在第二型態的塗布方法，較佳爲對用來搬運上述基板 的搬運空間內噴出氣體。 , 藉由上述組成的塗布方法，是對搬運空間噴出氣體， 所以將經過溫度調節的氣體噴出到於搬運空間搬運的基板 。藉此，可減少在基板產生溫度不均的情形。 在第二型態的塗布方法，較佳爲將用來搬運上述基板 的搬運空間的氣體予以吸引，將所吸引的上述氣體對上述 φ 基板噴出。 藉由上述組成的塗布方法，吸引搬運空間內的氣體， 將所吸引的氣體對基板噴出，所以可以減輕溫度調節的負 擔。 [發明效果] 藉由本發明，在基板搬運部設置有：朝基板噴出氣體 的氣體噴出部，且具備有用來調節該氣體的溫度的溫度調 節部，所以可以藉由上述溫度調節部來調節朝基板噴出的 -13- 201012557 氣體的溫度。藉此，可減少在基板產生的溫度不均的情形 ，且能防止液狀體產生膜厚度不均的情形。 【實施方式】 根據圖面來說明本發明的第一實施方式。 第1圖是本實施方式的塗布裝置1的立體圖。 如第1圖所示，本實施方式的塗布裝置1，是例如在 液晶面板等所用的玻璃基板上塗布光阻劑的塗布裝置，是 以：基板搬運部2、塗布部3、管理部4，爲主要構成元件 。該塗布裝置1，是在藉由基板搬運部2使基板浮起的狀 態來進行搬運，且藉由塗布部3將光阻劑塗布於該基板上 ，藉由管理部4來管理塗布部3的狀態。塗布裝置1，是 使用來配置於例如潔淨室內等潔淨的環境下較佳。 第2圖是塗布裝置1的正視圖，第3圖是塗布裝置1 的俯視圖，第4圖是塗布裝置1的側視圖。參考這些圖面 來詳細說明塗布裝置1的構造。以下在說明塗布裝置1的 構造時，爲了容易表示，使用XYZ座標系統來說明圖中 的方向。將基板搬運部2的長軸方向也就是基板的搬.運方 向記爲X方向。將從俯視方向觀察與X方向（基板搬運 方向）垂直相交的方向記爲Y方向。將與包含X方向軸 及Y方向軸的平面垂直的方向記爲Z方向。分別在X方 向、Y方向及Z方向，圖中箭頭的方向爲+方向，與箭頭 的方向相反的方向爲一方向。 -14- 201012557 (基板搬運部） 首先說明基板搬運部2的構造。 基板搬運部2具有：框架21、台部22、搬運機構23 。在基板搬運部2，藉由搬運機構23將基板S於台部22 上朝+X方向搬運。 框架21’是例如載置於地面上，並且用來支承台部 22及搬運機構23的支承構件。框架21是分割爲三個部分 0 ，該三個部分排列於γ方向上。框架中央部21a，是分割 的三個部分之中配置於Y方向的中央的部分，來支承台部 22。框架側部21b’配置於框架中央部21a的—Y方向側 . ’支承著搬運機構23。在框架側部21b與框架中央部21a 之間設置有間隙。框架側部21c，配置在框架中央部21a 的+ Y方向側’支承著搬運機構23。在框架側部21c與框 架中央部2 1 a之間設置有間隙。框架中央部2 1 a、框架側 部21b及框架側部21c，在X方向爲長軸方向，各部分在 Ο X方向的尺寸大致相同。 台部22，具有：搬入側台25、處理台27、與搬出側 台28。搬入側台25、處理台27以及搬出側台28，是在框 架中央部2 1 a上，以該順序從基板搬運方向的上游側排列 到下游側（朝+ X方向）。 搬入側台25，是由例如不鏽鋼（SUS )等所構成，是 從俯視方向觀察大致正方形的板狀構件。藉由將搬入側台 25的形狀形成爲俯視方向觀察爲大致正方形，則即使在將 具有長軸及短軸方向的基板進行搬運的情況，也可將該基 -15- 201012557 板朝其中任一方向進行搬運。在本實施方式，搬入側台25 上的區域爲基板搬入區域25S。基板搬入區域25S，是將 從裝置外部搬運過來的基板S進行搬入的區域。 在搬入側台25，分別設有複數的空氣噴出孔25a、與 複數的升降銷出沒孔25b。該空氣噴出孔25a及升降銷出 沒孔25b，是分別設置成貫穿搬入側台25。 空氣噴出孔25a，是將空氣噴出到搬入側台25的台表 面2 5c上的孔，配置成從俯視方向觀察爲矩陣狀。空氣噴 出孔25a連接著沒有圖示的空氣供給源。在搬入側台25， 藉由從空氣噴出孔25a所噴出的空氣而能使基板S朝+ Z 方向浮起。 升降銷出沒孔25b，是設置在搬入側台25的基板搬入 位置。升降銷出沒孔25b，讓供給到台表面25c的空氣不 會漏出。 在搬入側台25之中的Y方向的兩端部，各設置有一 個校準裝置25d。校準裝置25d，是將搬入到搬入側台25 的基板S予以定位的裝置。各校準裝置25d具有：長孔部 、與設在該長孔部內的定位構件，藉由將搬入到搬入側台 25的基板從兩側機械性地予以夾持，來定位基板的位置。 在搬入側台25的—Z方向側，也就是在搬入側台25 的背面側，設置有升降機構26。升降機構26，設置成從 俯視方向觀察重疊於搬入側台25的基板搬入位置25U( 參考第7圖）。升降機構26具有：升降構件26a、與複數 的升降銷26b。升降構件26a，連接於沒有圖示的驅動機 201012557 構，藉由該驅動機構的驅動而讓升降構件26a朝Z方向移 動。複數的升降銷2 6b，從升降構件26a的上面部朝向搬 入側台25豎立設置。各升降銷26b，是配置在：從俯視方 向觀察分別與上述升降銷出沒孔25b重疊的位置。藉由讓 升降構件26a朝Z方向移動，則各升降銷26b會從升降銷 出沒孔25b出沒於台表面25c上。各升降銷26b的+ Z方 向的端部是設置成分別與Z方向上的位置一致，而能將從 φ 裝置外部搬運過來的基板S保持爲水平的狀態。 處理台27，是以例如硬質氧化鋁膜（鋁及鋁合金的硬 質陽極氧化皮膜）爲主成分的光吸收材料來覆蓋台表面 _ 27c的從俯視方向觀察爲矩形的板狀構件，是設置在相對 於搬入側台25的+ X方向側。在處理台27之中以光吸收 材料覆蓋的部位，會抑制雷射光等的光線反射。該處理台 27，Y方向爲長軸。處理台27的Y方向的尺寸，與搬入 側台25的Y方向尺寸大致相同。在本實施方式，處理台 φ 27上的區域爲進行光阻劑塗布的塗布處理區域（塗布區域 )27S = 在處理台27設置有：將空氣噴出到台表面27c上的 複數的空氣噴出孔27a、與將台表面27c上的空氣予以吸 引的複數的空氣吸引孔27b。這些空氣噴出孔27a及空氣 吸引孔27b，設置成貫穿處理台27。在處理台27的內部 ，設置有：用來對通過於空氣噴出孔2 7a及空氣吸引孔 2 7b的氣體的壓力施加阻力的沒有圖示的複數個溝部。該 複數個溝部，在台部內部連接於空氣噴出孔27a及空氣吸 -17- 201012557 引孔27b。 在處理台27，空氣噴出孔27a的間距，是相較於設置 在搬入側台25的空氣噴出孔25a的間距更狹窄，與搬入 側台25相比，將空氣噴出孔27a設置得較緊密。因此， 與其他的台部相比，在該處理台27能以較高精確度來調 節基板的浮起量，基板的浮起量例如可控制爲10 μιη以上 ΙΟΟμηι以下，而ΙΟμπι以上50μιη以下較佳。 搬出側台28，設置在相對於處理台27的+ Χ方向側 ，由與設置在基板搬入區域25 S的搬入側台25大致相同 的材質、尺寸所構成。針對搬出側台28的形狀，也是從 俯視方向觀察爲大致正方形。在本實施方式，搬出側台28 上的區域爲基板搬出區域28S。基板搬出區域28S，是將 塗布好光阻劑的基板S搬出到裝置外部的基板搬出區域 28S ° 與搬入側台2 5同樣地，在搬出側台2 8設置有：空氣 噴出孔28a及升降銷出沒孔28b。升降機構29設置在：搬 出側台28的-Z方向側，也就是搬出側台28的背面側。 升降機構29，設置成從俯視方向觀察重疊於搬出側台28 的基板搬出位置。升降機構29的升降構件2 9a及升降銷 29b，與設置在搬入側台25的升降機構26的各部位爲相 同的構造。該升降機構29，當將搬出側台28上的基板S 搬出到外部裝置時，能藉由基板S交接用的升降銷29b來 將基板S抬起。 搬運機構23，具有保持住基板S將其朝+ χ方向搬運 -18- 201012557 的機構’且在框架側部21b及框架側部21c上設置有一對 。該一對搬運機構23,是相對於台部22的Y方向中央呈 線對稱的構造’除了該線對稱之外爲相同的構造。於是， 以下舉例來說明設置於框架側部21b的搬運機構23。 搬運機構23，具有：搬運機23a、基板保持部23b、 軌道23c。搬運機23a的構造是在內部設置有例如線性馬 達’藉由驅動該線性馬達，讓搬運機23a可於軌道23c上 φ 移動（參考第3圖及第4圖）。 基板保持部23b，是將基板S之中—Y方向側的側緣 部予以保持的保持部。基板S的上述側緣部，是相對於台 . 部22露出的部分，是沿著基板搬運方向的一個側部。在 搬運機23 a的+ X方向側的面上是沿著γ方向設置有例如 四個基板保持部23b，安裝於該搬運機23a。在各基板保 持部23b設置有吸附墊（省略圖示），藉由這些吸附墊將 基板S予以吸附保持。 φ 軌道23c，設置於框架側部21b上，是在：搬入側台 25、處理台27、及搬出側台28的側方涵蓋各台部地延伸 著，藉由滑動於該軌道23c而能讓搬運機23 a沿著上述各 台部移動。 在框架側部21b及框架側部21c處設置的各搬運機構 23，能夠獨立搬運基板S。例如，如第3圖所示，能夠以 :設置在框架側部21b的搬運機構23、與設置在框架側部 21c的搬運機構23，來保持不同的基板S，在該情況，可 藉由各搬運機構23交互地搬運基板，所以能讓生產能力 -19- 201012557 提升。 而在要將具有上述基板S的一半程度的面積的基板進 行搬運的情況，例如以兩個搬運機構23各保持一枚，藉 由使兩個搬運機構23朝+ X方向一同行進，則能同時搬 運兩枚基板。 (塗布部） 參考第2圖〜第4圖來說明塗布部3的構造。 塗布部3，是用來在基板S上塗布光阻劑的部分，具 有：門型框架31、與噴嘴32。 門型框架31，具有：支柱構件31a、與架橋構件31b ，是設置成在Y方向跨越處理台27。支柱構件31a，在處 理台27的Y方向側各設置有一個，各支柱構件31a分別 支承於框架側部21b及框架側部21c。各支柱構件31a， 是設置成讓其上端部的高度位置一致。架橋構件31b，是 架橋於各支柱構件31a的上端部之間，相對於該支柱構件 31a可進行升降。201012557 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a coating apparatus and a coating method. The present application claims priority based on Japanese Patent Application No. 2008-151720, filed on Jan. 1, 2008, in Japan, the content of which is hereby incorporated by reference. A fine pattern of wiring or electrodes, color filters, and the like is formed. Generally, such a pattern is formed by a method such as photolithography. In the photolithography technique, a photoresist film forming step of forming a photoresist film on a glass substrate, an exposure step of patterning the photoresist film, and a subsequent image development of the photoresist film are respectively performed. step. In the photoresist film forming step, the coating device used is coated with a photoresist film on the surface of the glass substrate. In the structure of a known coating apparatus (for example, refer to Patent Document 1), for example, a glass substrate is floated on a table portion and conveyed, and a surface of a glass substrate that is moved upward by a slit nozzle provided to face the table portion is coated. Photoresist. In the above-mentioned coating apparatus, the glass substrate is ejected by air from an air supply source placed in a factory or the like to float the glass substrate, and since the amount of air used is large, it has been proposed in recent years. A configuration in which an air blower is used to supply air. [Prior Art Document] -5-201012557 [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-23-6092 [Description of the Invention] [Problems to be Solved by the Invention] However, it is supplied by an air supply mechanism such as a blower or a compressor. The air is heated by the heat of the air supply mechanism or the heat in the air supply path, so that the temperature of the space including the coating device is higher than the temperature of, for example, a clean room in which the coating device is disposed. On the other hand, there is a possibility that unevenness in temperature may occur in the glass substrate being conveyed by blowing air having a temperature difference to the glass substrate. When the temperature of the glass substrate during conveyance is uneven, the unevenness of the drying of the photoresist film may occur, and the thickness of the film may be uneven. Therefore, it is necessary to require a structure for reducing the temperature unevenness. For example, in recent years, the display panel is accompanied. The size of the glass substrate used in the process is also increased. Large-sized glass substrates tend to have a more pronounced temperature unevenness, and there is a stronger demand for such a structure that reduces temperature unevenness. It is not limited to the case where the air supplied by the air supply means is used, and the air supplied from the other supply source is also used, for example, using air supplied from an air supply source installed in the factory. In view of the above circumstances, an object of the present invention is to provide a coating apparatus and a coating method which can reduce the temperature unevenness generated in a substrate and prevent the film thickness unevenness of the liquid from being generated. 201012557 [Means for Solving the Problem] In order to achieve the above object, a coating apparatus according to a first aspect of the present invention includes a substrate conveying unit that floats a substrate and transports the substrate, and conveys the substrate conveying unit At the same time, the liquid material is applied to the application portion of the substrate, and is characterized in that the gas discharge portion that is provided in the substrate transport portion 'to discharge the gas to the substrate and the temperature adjustment for adjusting the temperature of the gas are provided. unit. Φ The coating apparatus of the first aspect of the present invention includes a gas discharge unit that is provided in the substrate conveyance unit and that discharges gas to the substrate, and a temperature adjustment unit that adjusts the temperature of the gas, so that the temperature adjustment can be performed. Part _ to adjust the temperature of the gas ejected toward the substrate. Thereby, it is possible to reduce the temperature unevenness generated in the substrate, and it is possible to prevent the film thickness of the liquid from being uneven. In the first type of coating device, it is preferable that the substrate transporting portion has a coating region corresponding to the coating portion, and the temperature adjusting portion adjusts a temperature of the gas that is sprayed to the coating region. Since the liquid material is applied to the substrate in the coating region, it is particularly necessary to perform temperature management of the gas with high precision. According to the coating apparatus of the above configuration, the substrate conveying portion has the coating region corresponding to the coating portion, and the temperature adjusting portion adjusts the temperature of the gas ejected to the coating region. Therefore, in the coating region where the gas temperature adjustment is particularly required, the substrate generation can be reduced. Uneven temperature. In the first type of coating apparatus, preferably, the substrate transporting unit has a substrate carrying-out area for carrying out the substrate, and the temperature adjusting unit adjusts a temperature of the gas that is ejected to the substrate carrying-out area by 201012557. When the temperature is uneven on the substrate after the liquid material is applied, the temperature unevenness may affect the liquid on the substrate, and the film thickness of the liquid may be uneven due to the influence. According to the coating apparatus of the above configuration, the substrate conveyance unit has the substrate carry-out area for carrying out the substrate, and the temperature adjustment unit adjusts the temperature of the gas ejected to the substrate carry-out area, thereby reducing temperature unevenness in the substrate coated with the liquid material. The situation. Thereby, it is possible to prevent the film thickness of the liquid from being uneven. In the first type of coating apparatus, preferably, the substrate transporting unit has a substrate carrying-in area into which the substrate is carried, and the temperature adjusting unit adjusts a temperature of the gas ejected into the substrate carrying-in area. If temperature unevenness occurs in the substrate before the liquid is applied, the temperature unevenness of the substrate may affect the state of the applied liquid, and the film thickness of the liquid may be uneven due to the influence. . According to the coating apparatus of the above-described structure, the substrate conveyance unit has the substrate carrying-in area in which the substrate is carried in, and the temperature adjustment unit adjusts the temperature of the gas discharged to the substrate carrying-in area, so that the temperature unevenness of the substrate before the application of the liquid body can be reduced. The situation. Thereby, it is possible to prevent the film thickness of the liquid from being uneven. In the first type of coating device, it is preferable that the substrate transporting portion has a coating region corresponding to the coating portion, and the temperature adjusting portion ejects the region of the substrate transporting portion adjacent to the coating region. The temperature of the gas is adjusted. According to the coating apparatus of the above configuration, the substrate conveying portion has a coating region corresponding to the coating portion -8 to 201012557, and the temperature adjusting portion adjusts the temperature of the gas ejected into the region adjacent to the coating region among the substrate conveying portions, so that the temperature is adjusted. When the liquid crystal is applied to the substrate, the temperature unevenness may be reduced on the substrate. Thereby, it is possible to effectively prevent the film thickness of the liquid from being uneven. In the first type of coating apparatus, preferably, the temperature adjusting unit adjusts the temperature of the gas to match the temperature of the transport Φ space for transporting the substrate. The temperature of the substrate being transported is approximately equal to the temperature of the transport space for transporting the substrate. According to the coating apparatus of the above configuration, the temperature of the gas is adjusted so as to match the temperature of the conveyance space for transporting the substrate, so that the temperature of the substrate during conveyance can be prevented from changing. Thereby, it is possible to prevent the temperature from being uneven on the substrate. In the first type of coating apparatus, preferably, the temperature adjusting unit adjusts the temperature of the gas of φ in a range of 20 t to 25 °C. According to the coating apparatus of the above configuration, the temperature of the gas is adjusted to be in the range of 20 ° C to 25 ° C which is close to the normal temperature, so that the burden of temperature adjustment can be alleviated. In the first type of the coating apparatus, the substrate transporting unit preferably includes a coating region corresponding to the coating portion, a substrate loading region for loading the substrate, and a substrate carrying-out region for carrying out the substrate, the temperature. The adjustment unit sets the temperature of the gas to each of the application region, the substrate loading region, and the substrate carry-out region. -9-201012557 The substrate transporting unit has a coating region corresponding to the coating portion, a substrate loading region for loading the substrate, and a substrate carrying-out region for carrying the substrate, and the temperature adjusting portion is respectively provided by the coating device. Since the temperature of the gas is set in each of the application region, the substrate loading region, and the substrate carrying-out region, the temperature of the gas can be adjusted with higher precision. In the first type of coating device, it is preferable that the gas ejecting portion ejects a gas to a transport space for transporting the substrate. According to the coating apparatus of the above configuration, since the gas ejecting portion ejects the gas to the transport space, the temperature-regulated gas is ejected to the substrate transported in the transport space. Thereby, it is possible to reduce the occurrence of temperature unevenness on the substrate. In the first type of coating apparatus, the substrate transporting unit includes: a suction mechanism that sucks gas for transporting the transport space of the substrate; and the gas that is sucked by the suction mechanism toward the gas discharge unit The cyclic route of the loop. In the coating apparatus of the above-described structure, the substrate transporting unit has a suction mechanism that sucks the gas in the transport space and a circulation route that circulates the gas sucked by the suction mechanism toward the gas ejecting unit, and is disposed in the transport space. The temperature-adjusted gas is attracted to the gas, and the gas is circulated to discharge it toward the transportation space. Thereby, it is possible to reduce the temperature-adjusting negative-coating apparatus of the first type, preferably the above-described circulation route, having a filter for restricting the flow of foreign matter contained in the gas, and coating by the above configuration The device, the circulation route, has a filter for restricting the flow of foreign matter contained in the gas of -10-201012557, so that it is possible to prevent foreign matter from being mixed into the gas discharged by the circulation. In the first type of coating device, it is preferable that at least one of a cooling mechanism and a heating mechanism that maintains a temperature of a conveyance space for transporting the substrate at a constant temperature is provided on a route for supplying the gas. In the coating device for the above-described structure, a cooling mechanism and a heating mechanism for maintaining the temperature of the conveyance space for transporting the substrate at a constant temperature are provided on the route for supplying the gas to the Φ substrate conveyance portion. Since at least one of them is provided, the temperature of the gas body can be adjusted by the above-described cooling mechanism and heating means. The coating method of the second aspect of the present invention is a method of applying a liquid to a substrate in a coating region and a substrate carrying-out region by sequentially floating a substrate, and simultaneously applying a liquid to the substrate in the coating region. Adjusting the temperature of the gas 'The above-mentioned gas whose temperature has been adjusted is ejected to the substrate, and Φ floats the substrate. According to the coating method of the second aspect of the present invention, the temperature of the gas is adjusted, and the temperature-adjusted gas is ejected onto the substrate to float the substrate. Therefore, temperature unevenness occurring on the substrate can be reduced, and the liquid can be prevented. The shape of the film is uneven. In the second type of coating method, it is preferred to adjust the temperature of the gas ejected toward the substrate before applying the liquid. According to the coating method of the above composition, the temperature of the gas ejected toward the substrate is adjusted before the application of the liquid material, so that the temperature unevenness of the substrate before the application of the liquid material of -11 - 201012557 can be reduced, and Prevent the liquid film from being uneven in film thickness. In the second type of coating method, it is preferred to adjust the temperature of the gas ejected toward the substrate before the substrate is carried into the coating region. According to the coating method of the above composition, the temperature of the gas ejected toward the substrate is adjusted before the substrate is carried in. Therefore, temperature unevenness occurring in the substrate can be reduced when the substrate is carried in. Therefore, it is possible to prevent the film thickness unevenness of the liquid material. Λ In the second type of coating method, it is preferred that the substrate coated with the liquid material is ejected toward the substrate before being carried out from the substrate carrying-out region. The temperature of the gas is adjusted by the coating method of the above composition, and the temperature of the gas ejected toward the substrate is adjusted before the substrate is carried out. Therefore, when the substrate is unloaded, for example, after the substrate is coated with the liquid, Reduce the temperature unevenness generated on the substrate. Thereby, the film thickness unevenness of the liquid can be prevented. In the second type of coating method, it is preferred that the temperature of the gas is adjusted to match the temperature of the transfer space for transporting the substrate. According to the coating method of the above composition, the temperature of the gas is adjusted so as to match the temperature of the conveyance space for transporting the substrate, so that the temperature of the substrate during conveyance can be prevented from changing. Thereby, it is possible to prevent the temperature from being uneven on the substrate. In the second type of coating method, it is preferred to adjust the temperature of the above gas in the range of 20 ° C to 25 t. By the coating method of the above composition, the temperature of the gas is adjusted to be in the range of 20 ° C to 25 ° C which is close to -12 - 201012557, so that the burden of temperature adjustment can be alleviated. In the second type of coating method, it is preferable to adjust the temperature of the gas to discharge the gas of different temperatures to the substrate in accordance with the conveyance position of the substrate. According to the coating method of the above composition, the temperature of the gas is adjusted so that the gas of different temperatures is ejected to the substrate in accordance with the conveyance position of the substrate, so that φ can reduce the temperature unevenness of the substrate with higher precision. In the second type of coating method, it is preferred to eject a gas into a conveyance space for transporting the substrate. According to the coating method of the above composition, since the gas is ejected to the conveyance space, the temperature-regulated gas is ejected to the substrate conveyed in the conveyance space. Thereby, it is possible to reduce the occurrence of temperature unevenness on the substrate. In the second type of coating method, it is preferable that the gas for transporting the transfer space of the substrate is sucked, and the sucked gas is ejected onto the φ substrate. According to the coating method of the above composition, the gas in the transport space is sucked, and the sucked gas is ejected to the substrate, so that the burden of temperature adjustment can be reduced. According to the present invention, the substrate transporting portion is provided with a gas ejecting portion that ejects gas toward the substrate, and a temperature adjusting portion for adjusting the temperature of the gas. Therefore, the temperature adjusting portion can adjust the substrate toward the substrate. The temperature of the gas ejected from -13 to 201012557. Thereby, it is possible to reduce the temperature unevenness occurring in the substrate, and it is possible to prevent the liquid film from being uneven in thickness of the film. [Embodiment] A first embodiment of the present invention will be described based on the drawings. Fig. 1 is a perspective view of the coating device 1 of the present embodiment. As shown in FIG. 1 , the coating device 1 of the present embodiment is, for example, a coating device that applies a photoresist to a glass substrate used for a liquid crystal panel or the like, and is a substrate conveying unit 2 , a coating unit 3 , and a management unit 4 . It is the main constituent element. The coating device 1 is transported while the substrate is being lifted by the substrate transport unit 2, and the photoresist is applied to the substrate by the application unit 3, and the application unit 4 manages the application unit 3 by the management unit 4. status. The coating device 1 is preferably used in a clean environment such as a clean room. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. Hereinafter, in explaining the structure of the coating apparatus 1, the direction in the drawing will be described using an XYZ coordinate system for easy display. The direction of the long axis of the substrate conveyance unit 2, that is, the direction in which the substrate is moved, is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) as viewed from the plan view is referred to as the Y direction. The direction perpendicular to the plane including the X-axis and the Y-axis is referred to as the Z direction. In the X direction, the Y direction, and the Z direction, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is one direction. -14- 201012557 (Substrate conveying unit) First, the structure of the board conveying unit 2 will be described. The board conveyance unit 2 has a frame 21, a table portion 22, and a conveyance mechanism 23. In the substrate conveyance unit 2, the substrate S is conveyed on the table portion 22 in the +X direction by the conveyance mechanism 23. The frame 21' is, for example, a support member that is placed on the ground and that supports the table portion 22 and the transport mechanism 23. The frame 21 is divided into three parts 0 which are arranged in the γ direction. The frame center portion 21a is a portion disposed at the center in the Y direction among the divided three portions, and supports the table portion 22. The frame side portion 21b' is disposed on the -Y direction side of the frame center portion 21a. The carrier mechanism 23 is supported. A gap is provided between the frame side portion 21b and the frame center portion 21a. The frame side portion 21c is disposed on the +Y direction side of the frame center portion 21a to support the transport mechanism 23. A gap is provided between the frame side portion 21c and the frame center portion 21a. The frame center portion 2 1 a, the frame side portion 21b, and the frame side portion 21c are in the long axis direction in the X direction, and the dimensions of the respective portions in the ΟX direction are substantially the same. The table portion 22 has a loading side table 25, a processing table 27, and a carry-out side table 28. The loading side table 25, the processing table 27, and the unloading side table 28 are arranged in the frame center portion 21a from the upstream side in the substrate conveyance direction to the downstream side (in the +X direction). The loading side table 25 is made of, for example, stainless steel (SUS) or the like, and is a substantially square plate-like member viewed from a plan view. By forming the shape of the carry-in side stand 25 into a substantially square shape in a plan view, even if the substrate having the long axis and the short axis direction is transported, the base -15-201012557 can be plated toward either of them. Carrying in the direction. In the present embodiment, the area on the loading side table 25 is the substrate loading area 25S. The substrate loading area 25S is an area in which the substrate S transported from the outside of the apparatus is carried in. The loading side table 25 is provided with a plurality of air ejection holes 25a and a plurality of lifting pin insertion holes 25b. The air ejection hole 25a and the lift pin exit hole 25b are provided to penetrate the loading side table 25, respectively. The air ejection hole 25a is a hole that ejects air to the table surface 25c of the loading side table 25, and is arranged in a matrix shape as viewed in a plan view. An air supply source (not shown) is connected to the air ejection hole 25a. At the loading side table 25, the substrate S can be floated in the +Z direction by the air ejected from the air ejection hole 25a. The lift pin exit hole 25b is a substrate loading position provided on the carry-in side table 25. The lift pin exits the hole 25b so that the air supplied to the table surface 25c does not leak. A calibration device 25d is provided at each of both end portions of the loading side table 25 in the Y direction. The calibration device 25d is a device that positions the substrate S carried into the loading side table 25. Each of the aligning devices 25d has a long hole portion and a positioning member provided in the long hole portion, and the position of the substrate is positioned by mechanically sandwiching the substrate carried into the loading side table 25 from both sides. The elevating mechanism 26 is provided on the -Z direction side of the loading side table 25, that is, on the back side of the loading side table 25. The elevating mechanism 26 is provided so as to be viewed from a plan view in a direction in which the substrate loading position 25U is superimposed on the loading side table 25 (refer to Fig. 7). The elevating mechanism 26 has a lifting member 26a and a plurality of lifting pins 26b. The elevating member 26a is connected to a drive unit 201012557 (not shown), and the elevating member 26a is moved in the Z direction by the drive of the drive mechanism. A plurality of lift pins 26b are erected from the upper surface portion of the elevating member 26a toward the transport side table 25. Each of the lift pins 26b is disposed at a position overlapping the lift pin exit hole 25b as viewed in a plan view. When the elevating member 26a is moved in the Z direction, the lift pins 26b are ejected from the lift pin exit holes 25b on the table surface 25c. The end portions of the lift pins 26b in the +Z direction are provided so as to be aligned with the positions in the Z direction, and the substrate S conveyed from the outside of the φ device can be kept horizontal. The processing table 27 is a plate-shaped member which is rectangular in plan view when the light-absorbing material containing a hard aluminum oxide film (hard anodic oxide film of aluminum and aluminum alloy) as a main component is covered with a surface of the table surface _27c. With respect to the +X direction side of the loading side table 25. The portion of the processing table 27 covered with the light absorbing material suppresses reflection of light such as laser light. The processing table 27 has a long axis in the Y direction. The dimension of the processing table 27 in the Y direction is substantially the same as the dimension of the loading side table 25 in the Y direction. In the present embodiment, the region on the processing table φ 27 is a coating processing region (coating region) for performing photoresist coating. 27S = The processing table 27 is provided with a plurality of air ejection holes 27a for discharging air onto the table surface 27c. And a plurality of air suction holes 27b that attract the air on the table surface 27c. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing table 27. Inside the processing table 27, a plurality of groove portions (not shown) for applying a resistance to the pressure of the gas passing through the air ejection hole 27a and the air suction hole 27b are provided. The plurality of grooves are connected to the air ejection hole 27a and the air suction hole -17-201012557 through hole 27b inside the table portion. In the processing table 27, the pitch of the air ejection holes 27a is narrower than the pitch of the air ejection holes 25a provided in the loading side table 25, and the air ejection holes 27a are provided closer than the loading side table 25. Therefore, compared with other stages, the processing table 27 can adjust the floating amount of the substrate with high precision, and the floating amount of the substrate can be controlled, for example, to 10 μm or more and ΙΟΟμηι or less, and ΙΟμπι or more and 50 μm or less. good. The unloading side table 28 is provided on the + Χ direction side with respect to the processing table 27, and is composed of substantially the same material and size as the loading side table 25 provided in the substrate loading area 25 S. The shape of the carry-out side stand 28 is also substantially square as viewed from the plan view. In the present embodiment, the area on the carry-out side stand 28 is the substrate carry-out area 28S. The substrate carrying-out area 28S is a substrate carrying-out area 28S that carries the substrate S coated with the photoresist onto the outside of the apparatus. Similarly to the loading-side stage 2 5, the carrying-out side table 28 is provided with an air ejection hole 28a and a lift pin. Infested hole 28b. The elevating mechanism 29 is provided on the -Z direction side of the carry-out side stand 28, that is, the back side of the carry-out side stand 28. The elevating mechanism 29 is provided so as to be viewed from a plan view direction in a substrate carrying-out position that is superimposed on the carry-out side table 28. The elevating member 29a and the elevating pin 29b of the elevating mechanism 29 have the same structure as the respective portions of the elevating mechanism 26 provided on the loading side table 25. When the substrate S on the carry-out side table 28 is carried out to the external device, the elevating mechanism 29 can lift the substrate S by the lift pins 29b for the transfer of the substrate S. The transport mechanism 23 has a mechanism for holding the substrate S to carry the -18-201012557 in the + χ direction, and a pair is provided on the frame side portion 21b and the frame side portion 21c. The pair of transport mechanisms 23 have a structure that is line-symmetric with respect to the center of the base portion 22 in the Y direction. The structure is the same except for the line symmetry. Therefore, the transport mechanism 23 provided to the frame side portion 21b will be described below by way of example. The transport mechanism 23 includes a transporter 23a, a substrate holding portion 23b, and a rail 23c. The structure of the transporter 23a is such that a linear motor is provided inside, for example, by driving the linear motor, and the transporter 23a can be moved by φ on the rail 23c (refer to Figs. 3 and 4). The substrate holding portion 23b is a holding portion that holds the side edge portion on the -Y direction side of the substrate S. The side edge portion of the substrate S is a portion exposed to the table portion 22 and is a side portion along the substrate conveyance direction. On the surface on the +X direction side of the conveyor 23a, for example, four substrate holding portions 23b are provided along the γ direction, and are attached to the carrier 23a. Adsorption pads (not shown) are provided in the respective substrate holding portions 23b, and the substrate S is adsorbed and held by the adsorption pads. The φ rail 23c is provided on the frame side portion 21b so as to extend over the side portions of the loading side table 25, the processing table 27, and the carry-out side table 28, and can be slid by the rail 23c. The transporter 23a moves along each of the above-described stages. Each of the transport mechanisms 23 provided at the frame side portion 21b and the frame side portion 21c can independently transport the substrate S. For example, as shown in Fig. 3, the transport mechanism 23 provided in the frame side portion 21b and the transport mechanism 23 provided on the frame side portion 21c can hold different substrates S. In this case, each can be The transport mechanism 23 carries the substrates interactively, so that the production capacity can be increased from -19 to 201012557. On the other hand, when the substrate having the area of about half of the substrate S is to be transported, for example, one of the two transport mechanisms 23 is held one by one, and by moving the two transport mechanisms 23 in the +X direction, it is possible to simultaneously Carry two substrates. (Coating portion) The structure of the coating portion 3 will be described with reference to Figs. 2 to 4 . The coating portion 3 is a portion for applying a photoresist on the substrate S, and has a gate frame 31 and a nozzle 32. The portal frame 31 has a pillar member 31a and a bridge member 31b that are disposed to cross the processing table 27 in the Y direction. The pillar members 31a are provided one on each side in the Y direction of the processing table 27, and each of the pillar members 31a is supported by the frame side portion 21b and the frame side portion 21c. Each of the strut members 31a is disposed such that the height positions of the upper end portions thereof coincide. The bridging member 31b is bridged between the upper end portions of the respective strut members 31a, and is movable up and down with respect to the strut members 31a.

該門型框架31是連接於移動機構34，移動機構34, 具有軌道構件35及驅動機構36。而在框架側部21b及框 架側部21c的溝部21d內例如各設置有一條軌道構件35, 分別朝X方向延伸。各軌道構件35，分別設置成較管理 部4更朝-X方向側延伸。驅動機構36，是連接於門型框 架31，且使塗布部3沿著軌道構件35移動的致動器。而 該門型框架31，藉由沒有圖示的移動機構讓其也可朝Z -20- 201012557 方向移動。 噴嘴32，是作成其中一方向爲長軸的長條狀， 在門型框架31的架橋構件31b的—Z方向側的面 該噴嘴32之中的- Z方向的前端，沿著本身的長 設置有狹縫狀的開口部32a，從該開口部32a將光 出。噴嘴32，其開口部32a的長軸方向與Y方向 並且該開口部32a配置成與處理台27相對向。開口 的長軸方向的尺寸是較基板S的Y方向的尺寸更小 會將光阻劑塗布到基板S的周邊區域。在噴嘴3 2 設置有使光阻劑流通到開口部32a的沒有圖示的流 在該流通路連接著沒有圖示的光阻劑供給源。該光 給源例如具有沒有圖示的泵浦，藉由以該泵浦將光 出到開口部32a，則從開口部32a將光阻劑吐出。 構件31a設置有沒有圖示的移動機構，藉由該移動 讓在架橋構件31b所保持的噴嘴32可朝Z方向移 噴嘴32設置有沒有圖示的移動機構，藉由該移動 噴嘴32可相對於架橋構件31b朝Z方向移動。在 架31的架橋構件31b下面安裝：用來將噴嘴32的 32a，也就是噴嘴32的前端32c以及與該噴嘴前端 對向的相對向面之間的Z方向上的距離予以測定的 33。沿著Y方向設置有例如三個該感應器33。 (管理部） 來說明管理部4的構造。 是設置 部。在 軸方向 阻劑吐 平行， 部32a ，而不 的內部 通路。 阻劑供 阻劑推 在支柱 機構， 動。在 機構讓 門型框 開口部 3 2c相 感應器 -21 - 201012557 管理部4’是爲了讓吐出到基板S的光阻劑（液狀體 )的吐出量爲定量而將噴嘴32進行管理的部位’是設置 在：基板搬運部2之中的相對於塗布部3的- X方向側。 該管理部4，具有：預備吐出機構41、浸漬槽42、噴嘴洗 淨裝置43、將這些構造予以收容的收容部44、以及用來 保持該收容部的保持構件45。 預備吐出機構41、浸漬槽42、及噴嘴洗淨裝置43’ 是以該順序朝- X方向側排列。預備吐出機構4 1 ’是預備 性地將光阻劑吐出的部分，該預備吐出機構41是在將塗 布部3配置於塗布處理區域27S上的狀態，設置在最接近 噴嘴32的位置，浸漬槽42，是在內部儲存有稀釋劑等的 溶劑的液體槽。噴嘴洗淨裝置43’是用來將噴嘴32的開 口部32a附近予以沖洗的裝置，是具有：朝Y方向移動的 沒有圖示的洗淨機構、以及使該洗淨機構移動的沒有圖不 的移動機構。該移動機構，設置在較上述洗淨機構更靠近 - X方向側。噴嘴洗淨裝置43’藉由設置有移動機構的部 分，與預備吐出機構41及浸漬槽42相比，其X方向的尺 寸較大。而針對預備吐出機構41、浸漬槽42、噴嘴洗淨 裝置43的配置方式，並不限於本實施方式的配置方式， 也可以用其他的配置方式。 收容部44的Y方向的尺寸，較上述門型框架31的支 柱構件3 1 a之間的距離更小，上述門型框架31能超過收 容部44朝X方向移動。門型框架31，針對於在收容部44 內處設置的預備吐出機構41、浸漬槽42及噴嘴洗淨裝置 -22- 201012557 43,能夠跨越該各部分來接達。 保持構件45連接於管理部移動機構46。管理部移動 機構46，具有軌道構件47及驅動機構48。軌道構件47 分別設置在框架側部21b及框架側部21c的溝部21e內， 分別朝X方向延伸。各軌道構件47，是配置在：與塗布 部3的門型框架31連接的軌道構件35之間。各軌道構件 47的一 X方向的端部，設置至例如框架側部21b及框架側 φ 部21c的一X方向的端部。驅動機構48，是連接於保持構 件45而使管理部4沿著軌道構件47上移動的致動器。 (空氣噴出機構、吸引機構） 第5圖是基板搬運部2的搬入側台25、處理台27及 搬出側台28的空氣噴出機構、吸引機構的構造的顯示圖 。根據該圖，來說明關於上述各台部的空氣噴出及空氣吸 引的構造。 參 在 搬入側台25及搬出側台28設置有空氣噴出機構（ 氣體噴出部）50、55,沒有設置吸引機構。各空氣噴出機 構50、55的構造在兩台部爲相同構造。該空氣噴出機構 5 〇、5 5 ’分別具有：鼓風機5丨、5 6、溫度控制單元5 2、 57、歧管 53、58。 從各鼓風機51、56起藉由配管50a、55a分別連接於 溫度控制單元52、57。該溫度控制單元52、57，設置有 :例如冷媒機構等的冷卻機構或電熱線等的加熱機構，藉 由該冷卻機構及加熱機構，則可調節所供給的空氣的溫度 -23- 201012557 。溫度控制單元52與溫度控制單元57’能夠獨立調節空 氣的溫度。溫度控制單元52、57，是藉由配管5〇1)、551) 分別連接於歧管53、58。 在歧管53、58，分別安裝有溫度感應器54、59 °溫 度感應器54、59 ’會測量歧管53、58內的空氣的溫度’ 將測量結果分別發送到溫度控制單元5 2、5 7 °在溫度控制 單元52、57，使該溫度感應器54、59的測量結果反饋而 能調節空氣的溫度。溫度控制單元52、57及溫度感應器 54、59，分別構成了：使空氣的溫度反饋來進行調節的溫 度調節機構（溫度調節部）81、82。 在配管50b、55b安裝有壓力計，藉由配管50c、55c 分別連接於搬入側台25及搬出側台28。在各配管50a〜 50c、55a〜55c，設置有各種閥。在配管50a〜50c、55a〜 55c，也可設置有：用來測定氣體中粒子量的氣體中粒子 量測定器。 另一方面，在處理台27，除了空氣噴出機構（氣體噴 出部）60之外，還設置有吸引機構70。 第6圖是於處理台27設置的空氣噴出機構及吸引機 構的構造的顯示圖。如該圖所示，空氣噴出機構60具有 :鼓風機61、溫度控制單元62、過濾器63、壓力自動控 制器（APC ) 64、歧管65、溫度感應器66、及噴出量監 測口 67。 鼓風機61，是將空氣供給到空氣噴出機構的空氣供給 源，藉由配管60a而連接於溫度控制單元62。作爲空氣供 -24- 201012557 給源’也可取代鼓風機61，而連接工廠等的空氣供給線路 〇 溫度控制單元62，是用來將例如所供給的空氣的溫度 加以調節的單元。在溫度控制單元62內的空氣流通部， 設置有：例如冷媒機構等的冷卻機構或電熱線等的加熱機 構。藉由該冷卻機構或加熱機構，則能使空氣的溫度上升 或下降。在溫度控制單元62，能相對於上述溫度控制單元 φ 52、57獨立來調節空氣的溫度。溫度控制單元62，是藉 由配管60b而連接於APC64。 在配管60b設置有過濾器63。過濾器63是用來將與 所供給的空氣混合的異物予以去除的部位。而在配管60b 也可設置沒有圖示的溢流閥。 APC64，是用來調節空氣的供給量的單元。APC64， 具有：蝶形閥64a與控制器64b。控制器64b能夠調節蝶 形閥64a的開度，藉由調節該蝶形閥64a的開度則可調節 ❷ 空氣的供給量。APC64，是經由配管6 0c而連接於歧管65 〇 在配管60c，安裝有流量計69a及壓力計69b。藉由 該流量計69a及壓力計69b來測定配管60c內的空氣的流 量及壓力。各測定結果，例如發送到APC64。 歧管65，是用來使流通於配管60c的空氣分歧的單元 。在該歧管65，是將配管60 c連接於：分歧後的複數的配 管60d。各配管60d連接於處理台27的空氣噴出孔27a。 於是，來自APC 64的空氣，會經由配管60c及各配管60d -25- 201012557 而從空氣噴出孔27a噴出。 溫度感應器66，是用來測定歧管65內的空氣的溫 的感應器。藉由溫度感應器66所測定的空氣的溫度資 ，會經由例如通訊迴路等而發送到溫度控制單元62。在 度控制單元62，藉由使該溫度感應器66的測量結果反 而能調節空氣的溫度。溫度控制單元62及溫度感應器 ，構成了使空氣的溫度反饋來將其調節的溫度調節機構 溫度調節部）83。 噴出量監測口 67，其構造具有空氣的流量檢測用口 藉由該流量檢測用口可檢測台部正下方的氣體流量。在 噴出量監測口 67設置有流量計67a及壓力計67b，而可 定從空氣噴出孔27a噴出的空氣流量及壓力。而利用流 計67a及壓力計67b所測定的結果，會發送到APC64內 控制器64b。 在上述配管60a〜60e，安裝有各種閥部等，在各閥 能調節適當開度。 吸引機構7〇，具有：鼓風機71、壓力自動控制器 APC) 72、收集槽73、歧管74、及吸引壓力監測口 75 鼓風機71、APC72、收集槽73、歧管74，是互相藉由 管7 0a〜70c連接，在各配管7 0a〜70c安裝有各種閥部 而也可取代鼓風機71而使用工廠等的空氣吸引線路。 也可不設置歧管74。 APC72，設置有：用來調節空氣的供給量的蝶形 72a、與控制器72b。吸引量監測口 75，藉由配管70e 度 料 溫 饋 6 6 ( j 該 測 量 的 部 配 〇 而 閥 而 201012557 連接於處理台27，在該連接部分連接有空氣的流量檢測用 口。在吸引量監測口 75，藉由該流量檢測用口可檢測處理 台27的正下方的氣體流量。在吸引量監測口 75安裝有流 量計75a及壓力計75b，而可測定藉由空氣吸引孔27b所 吸引的空氣流量及壓力。利用流量計75a及壓力計75b所 測定的結果，會發送到APC72內的控制器72b。 也可在APC72與空氣吸引孔27b之間設置有流量計 φ ，將測定結果經由電線（在圖中以破線表示）等而發送到 APC72內的控制器72b。配管60c與配管70c之間藉由連 接部80連接，而可切換爲：清洗用的洗淨液吸引線路與 . 真空吸引（空氣吸引）線路。 (塗布動作） 接著來說明如上述構造的塗布裝置1的動作。 第7圖，是顯示塗布裝置1的動作過程的俯視圖。參 ❷ 考各圖來說明將光阻劑R塗布在基板S的動作。在該動作 ，以讓短軸方向平行於搬運方向的方式，將基板S搬入到 基板搬入區域25S，使該基板S浮起而進行搬運，且在塗 布處理區域27S塗布光阻劑，將已塗布好該光阻劑的基板 S從基板搬出區域28S搬出。在第7圖省略管理部4的圖 示，是要容易判斷搬入側台25的構造。以破線顯示門型 框架31，而容易判斷噴嘴32及感應器33的構造。以下來 說明各部分的詳細動作。 在將基板搬入到基板搬入區域25S之前，使塗布裝置 -27- 201012557 1待機。具體來說，在搬入側台25的基板搬入位置25U 的—Y方向側配置搬運機23a，將設於基板保持部23b的 吸附襯墊的高度位置定位在基板S的浮起高度位置，並且 從搬入側台25的空氣噴出孔25a、處理台27的空氣噴出 孔27a、空氣吸引孔27b及搬出側台28的空氣噴出孔28a 分別將空氣噴出或吸引，成爲將空氣供給到讓基板浮起於 台部22的表面的程度的狀態。 此時，在搬入側台25的空氣噴出機構50、處理台27 的空氣噴出機構60及搬出側台28的空氣噴出機構55，分 別藉由溫度感應器54、59、66，來測定從空氣噴出孔25a 、27a、2 8a所噴出的空氣的溫度，將測定結果發送到溫度 控制單元5 2、5 7、6 2。 在溫度控制單元52、57、62，會根據上述測定結果， 來將流通於本身內部的空氣的溫度進行調節。此時的調節 溫度，成爲與塗布裝置1的周圍溫度大致相等的溫度較佳 。該溫度可以調節成配置著塗布裝置1的潔淨室內的溫度 ，例如20°C〜25°C左右的溫度。空氣溫度超過25°C的話 ，則可能因爲該空氣的熱量讓基板S變形，所以將空氣的 溫度範圍控制在上述範圍內較佳。 當進行該溫度調節時，會預先測定塗布裝置1的周圍 的溫度，將所測定的周圍溫度當作基準溫度而將其儲存在 溫度控制單元52、57、62的沒有圖示的控制器等也可以 ，例如也可另外配置溫度計，將藉由該溫度計所測定的溫 度作爲基準溫度。如果基準溫度與藉由溫度感應器54、59 -28 201012557 、66所測定的溫度不同的話，則藉由溫度控制單元52、 57、62將空氣的溫度調節成讓空氣的溫度配合基準溫度。 藉由使溫度控制單元52、57、62與溫度感應器54、59、 66分別作爲溫度調節機構8丨、82、83的功能，則從空氣 噴出孔25a、27a、28a所噴出的空氣的溫度，會變得與塗 布裝置1周圍的溫度大致相等。 在塗布裝置1以上述方式完成待機之後，例如藉由沒 φ 有圖示的搬運臂等，如第7圖所示，若從外部將基板S搬 運到基板搬入位置25U，則使升降構件26a朝+ Z方向移 動，將升降銷26b從升降銷出沒孔25b突出到台表面25c _ 。而藉由該升降構件26a的動作，升降銷26b將基板S抬 起，進行該基板S的交接動作。而從校準裝置25d的上述 長孔使上述定位構件突出於台表面25c。 在接收基板S之後，使升降構件26a下降將升降銷 2 6b收容於升降銷出沒孔25b內。此時，由於在台表面 鲁 25c形成有空氣層，所以基板S藉由該空氣而保持爲相對 於台表面25c浮起的狀態。當基板S到達空氣層的表面時 ，藉由校準裝置25d的定位構件來進行基板S的定位。 在定位之後，將在基板搬入位置的一 γ方向側處配置 的各基板保持部23 b的上述吸附襯墊吸附於基板S的背面 來保持基板S。在藉由基板保持部23b保持住基板S的背 面之後，使搬運機23 a沿著軌道23 c移動。伴隨著搬運機 23a的移動而讓基板S開始朝+ X方向的移動。 從搬入側台25的空氣噴出孔25a噴出的空氣溫度是 -29- 201012557 調節成與塗布裝置1的周圍的溫度大致相等，所以當將基 板S搬入到搬入側台25時，與上述空氣接觸的基板S不 易產生溫度不均的情形，而不易產生光阻劑R的膜厚度不 均的情形。 一旦基板S的搬運方向前端到達噴嘴32的開口部3 2a 的位置，如第7圖所示，則從噴嘴32的開口部32a朝向 基板S吐出光阻劑。光阻劑的吐出動作，是使噴嘴32的 位置固定，藉由搬運機23a —邊搬運基板S —邊來進行。 伴隨著基板S的移動，則如第7圖所示在基板S上塗布光 阻膜R。藉由讓基板S通過，吐出光阻劑的開口部32a下 面，而在基板S的預定區域形成光阻膜R。此時，從處理 台27的空氣噴出孔27a噴出的空氣的溫度，是調節成與 塗布裝置1的周圍溫度大致相等，與該空氣接觸的基板S 不易產生溫度不均的情形，而不易產生光阻劑的膜厚度不 均的情形。 形成了光阻膜R的基板S，是藉由搬運機23a將其朝 向搬出側台28搬運。在搬出側台28，在相對於台表面 2 8c浮起的狀態，如第7圖所示將基板S搬運到基板搬出 位置2 8 U。 一旦基板S到達基板搬出位置28U，使升降機構29 的升降構件2 9a朝向+ Z方向移動。藉由升降構件29 a的 移動，升降銷29b從升降銷出沒孔28b朝向基板S的背面 突出，藉由升降銷29b將基板S抬起。在該狀態，例如在 搬出側台28的+ X方向側處設置的外部的搬運臂，會接 -30- 201012557 達於搬出側台28，而接收基板S。在將基板S交接 臂之後，將搬運機23a再回到搬入側台25的基板 置25U，待機直到要搬運下個基板S。 當進行基板S搬出時，從搬出側台28的空氣 28a噴出的空氣的溫度，是調節成與塗布裝置1的 度大致相等，與該空氣接觸的基板S不易產生溫度 情形，而不易產生光阻劑的膜厚度不均的情形。 φ 當進行下個基板S的搬運時，例如藉由設置於 部21c上的搬運機構23，保持住基板S將其進行搬 尙未要搬運下個基板S的期間，在塗布部3,進行 . 持噴嘴32的吐出狀態的預備吐出動作。如第8圖 藉由軌道構件35(參考第4圖）使門型框架31朝 向移動到管理部4的位置。 在使門型框架31移動到管理部4的位置之後 門型框架31的位置將噴嘴32的前端接達到噴嘴洗 參 43,藉由該噴嘴洗淨裝置43來將噴嘴前端3 2c洗泻 在噴嘴前端32c洗淨後，將該噴嘴32接達到 出機構41。在預備吐出機構41，會一邊將開口部 預備吐出面之間的距離予以測定，一邊將噴嘴32 的開口部32a移動到Z方向上的預定位置，一邊 32朝一X方向移動，一邊從開口部3 2a預備吐出光 在預備吐出動作之後，將門型框架3 1回到原 。當藉由設置於框架側部21c上的搬運機構23要 個基板S時，使噴嘴32移動到Z方向上的預定位 到搬運 搬入位 噴出孔 周圍溫 不均的 框架側 運。在 用來保 所示， —X方 ，調整 淨裝置 〇 預備吐 32a與 的前端 使噴嘴 阻劑。 來位置 搬運下 置。藉 -31 - 201012557 由對基板S反覆進行塗布光阻膜R的塗布動作 動作，則在基板S形成優質的光阻膜R。 而也可因應需要’例如每預定次數接達到管理部$《轰 ，則將上述噴嘴32接達到浸漬槽42內。在浸漬槽42，是 藉由將噴嘴32的開口部3 2a暴露於，儲存於浸漬槽42的 溶劑（稀釋劑）的蒸氣環境，來防止噴嘴32乾燥。 藉由本實施方式，在基板搬運部2設置有將;空氣 板S噴出的空氣噴出機構（氣體噴出部）50、55、6〇，且 具備有：用來調節該空氣（氣體）的溫度的溫度調節機構 (溫度調節部）81、82、83’所以可以藉由該溫度調節機 構81、82、83來將朝基板S噴出的空氣的溫度予以調節 。藉此，則可減少在基板S產生的溫度不均情形，且可防 止在基板S上塗布的光阻劑產生的膜厚度不均情形。 藉由本實施方式，將溫度調節機構81〜83分別設置 在搬入側台25、處理台27及搬出側台28，則在各台部是 獨立來設定空氣的溫度，所以能更高精度地調節氣體的溫 度。 本發明的技術範圍並不限定於上述實施方式，可以在 不脫離本發明的主旨的範圍進行適當變更。本發明並不被 上述說明所限定，僅藉由附加的申請專利範圍所限定。 例如，在上述實施方式，對於從鼓風機所供給的空氣 進行溫度調節，而將進行過該溫度調節的空氣噴出，而並 不限於此，也可例如使藉由吸引機構70所吸引的空氣循 環到空氣噴出機構（氣體噴出部），將該循環後的空氣噴 -32- 201012557 出。例如也可經由將空氣噴出機構60與吸引機構70予以 連接的連接部80，而進行循環；也可藉由在空氣噴出機構 60與吸引機構70之間另外設置循環路線，使所吸引的空 氣循環。也可從吸引機構70將空氣循環到空氣噴出機構 50、55。如上述在藉由吸引機構70將所吸引的空氣進行 循環的情況，也可在循環路線配置用來限制異物通過的過 濾器。而也可具有用來使台部22上的空氣朝空氣噴出機 φ 構50、55、60循環的構造。 在上述實施方式，雖然將溫度感應器54、59、66分 別安裝於歧管53、58、65，而並不限於此，也可是安裝於 _ 其他部位的構造，例如安裝於配管的構造、或安裝於空氣 噴出孔25a、27a、28a的構造。 在上述實施方式，雖然是將溫度感應器安裝在與各台 部的空氣噴出孔對應的部位，而並不限於此，例如也可僅 針對從處理台27的空氣噴出孔27a噴出的空氣來設置溫 φ 度感應器。而也可僅針對從處理台27的空氣噴出孔27a、 搬出側台28的空氣噴出孔28a噴出的空氣，來設置溫度 感應器。 在上述實施方式，雖然在搬入側台25及搬出側台28 上全體性地調節空氣的溫度，而並不限於此，例如也可僅 針對從搬入側台25的一部分或搬出側台28的一部分噴出 的空氣’來調節溫度。在該情況，例如對搬入側台25之 中與處理台27相接的區域（與塗布區域鄰接的區域）、 搬出側台28之中與處理台27相接的區域（與塗布區域鄰 -33- 201012557 接的區域）等，對於以處理台27爲中心的一區域上噴出 的空氣的溫度進行調節較佳。 在上述實施方式，是將從搬入側台25、處理台27及 搬出側台28噴出的空氣調節爲相同溫度，而並不限於此 ，也可以在各台部調節成不同的溫度。例如在搬出側台28 ，也可調節成可使塗布於基板S上的光阻劑乾燥的溫度。 藉此，則可使光阻劑的乾燥步驟所需要的時間減少。 【圖式簡單說明】 第1圖是顯示本發明的一個實施方式的塗布裝置的構 造的立體圖。 第2圖是顯示第1圖的塗布裝置的構造的正視圖。 第3圖是顯示第1圖的塗布裝置的構造的俯視圖。 _ 第4圖是顯示第1圖的塗布裝置的構造的側視圖。The portal frame 31 is coupled to the moving mechanism 34, and has a moving mechanism 34 having a rail member 35 and a drive mechanism 36. Further, for example, one rail member 35 is provided in each of the frame side portion 21b and the groove portion 21d of the frame side portion 21c, and extends in the X direction. Each of the rail members 35 is provided to extend toward the -X direction side from the management portion 4, respectively. The drive mechanism 36 is an actuator that is coupled to the door frame 31 and that moves the coating portion 3 along the rail member 35. The door frame 31 can also be moved in the direction of Z-20-201012557 by a moving mechanism not shown. The nozzle 32 is formed in an elongated shape in which one direction is a long axis, and the front end in the -Z direction of the nozzle 32 on the surface on the -Z direction side of the bridge member 31b of the portal frame 31 is set along its own length. The slit-shaped opening 32a has light emitted from the opening 32a. The nozzle 32 has a longitudinal direction of the opening 32a and a Y direction, and the opening 32a is disposed to face the processing table 27. The dimension in the long axis direction of the opening is smaller than the dimension in the Y direction of the substrate S. The photoresist is applied to the peripheral region of the substrate S. The nozzle 3 2 is provided with a flow (not shown) for allowing the photoresist to flow to the opening 32a. A photoresist supply source (not shown) is connected to the flow path. The light source has, for example, a pump (not shown), and when the light is emitted to the opening 32a by the pump, the photoresist is discharged from the opening 32a. The member 31a is provided with a moving mechanism (not shown). By this movement, the nozzle 32 held by the bridging member 31b can be provided with a moving mechanism (not shown) in the Z direction shifting nozzle 32, by which the moving nozzle 32 can be opposed to The bridging member 31b moves in the Z direction. Mounted below the bridging member 31b of the frame 31 is a 33 for measuring the distance in the Z direction between the nozzle 32a, that is, the front end 32c of the nozzle 32, and the opposing surface opposed to the nozzle tip. For example, three of the inductors 33 are disposed along the Y direction. (Management Unit) The structure of the management unit 4 will be described. It is the setting department. In the axial direction, the resist vomits parallel to the portion 32a without the internal passage. The resist is supplied as a resist in the pillar mechanism. In the mechanism, the door frame opening portion 3 2c phase sensor-21 - 201012557 is used to manage the nozzle 32 for the amount of discharge of the photoresist (liquid material) discharged to the substrate S to be quantitative. ' is provided in the -X direction side with respect to the application part 3 among the board|substrate conveyance part 2. The management unit 4 includes a preliminary discharge mechanism 41, a dipping tank 42, a nozzle cleaning device 43, an accommodating portion 44 for accommodating these structures, and a holding member 45 for holding the accommodating portion. The preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43' are arranged in the -X direction side in this order. The preliminary discharge mechanism 4 1 ' is a portion for preliminarily discharging the photoresist, and the preliminary discharge mechanism 41 is disposed at a position closest to the nozzle 32 in a state where the application portion 3 is placed on the coating treatment region 27S, and the immersion tank 42. A liquid tank in which a solvent such as a diluent is stored therein. The nozzle cleaning device 43' is a device for flushing the vicinity of the opening 32a of the nozzle 32, and has a cleaning mechanism (not shown) that moves in the Y direction, and a cleaning mechanism that moves the cleaning mechanism. Mobile agency. The moving mechanism is disposed closer to the -X direction side than the above-described cleaning mechanism. The nozzle cleaning device 43' has a larger size in the X direction than the preliminary discharge mechanism 41 and the immersion tank 42 by the portion in which the moving mechanism is provided. The arrangement of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements may be used. The dimension of the accommodating portion 44 in the Y direction is smaller than the distance between the pillar members 31a of the door frame 31, and the portal frame 31 can move in the X direction beyond the accommodating portion 44. The door frame 31 is capable of being received across the respective portions of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device -22-201012557 which are provided in the accommodating portion 44. The holding member 45 is connected to the management unit moving mechanism 46. The management unit moving mechanism 46 has a rail member 47 and a drive mechanism 48. The rail members 47 are respectively provided in the frame side portion 21b and the groove portion 21e of the frame side portion 21c, and respectively extend in the X direction. Each of the rail members 47 is disposed between the rail members 35 connected to the portal frame 31 of the coating portion 3. An end portion of each of the rail members 47 in the X direction is provided, for example, at an end portion of the frame side portion 21b and the frame side φ portion 21c in the X direction. The drive mechanism 48 is an actuator that is coupled to the holding member 45 to move the management portion 4 along the rail member 47. (Air ejection mechanism, suction mechanism) Fig. 5 is a view showing the structure of the air ejection mechanism and the suction mechanism of the loading side table 25, the processing table 27, and the delivery side table 28 of the substrate conveying unit 2. The structure of the air ejection and the air suction of each of the above-described base portions will be described based on the figure. The loading side table 25 and the unloading side table 28 are provided with air ejection mechanisms (gas ejection portions) 50 and 55, and no suction mechanism is provided. The structure of each of the air ejecting mechanisms 50, 55 has the same structure at both portions. The air ejecting mechanisms 5 〇, 5 5 ' have blowers 5 丨 and 56, temperature control units 5 2, 57, and manifolds 53, 58 respectively. The respective air blowers 51 and 56 are connected to the temperature control units 52 and 57 via pipes 50a and 55a, respectively. The temperature control units 52 and 57 are provided with, for example, a cooling mechanism such as a refrigerant mechanism or a heating mechanism such as a heating wire. By the cooling mechanism and the heating mechanism, the temperature of the supplied air can be adjusted -23-201012557. The temperature control unit 52 and the temperature control unit 57' are capable of independently adjusting the temperature of the air. The temperature control units 52, 57 are connected to the manifolds 53, 58 by pipes 5?1), 551), respectively. In the manifolds 53, 58 respectively, temperature sensors 54, 59 ° temperature sensors 54, 59 ' will measure the temperature of the air in the manifolds 53, 58 ' send the measurement results to the temperature control unit 5 2, 5 7 ° in the temperature control unit 52, 57, the measurement results of the temperature sensors 54, 59 can be adjusted to adjust the temperature of the air. The temperature control units 52 and 57 and the temperature sensors 54 and 59 respectively constitute temperature adjustment mechanisms (temperature adjustment units) 81 and 82 that adjust the temperature of the air to be adjusted. A pressure gauge is attached to the pipes 50b and 55b, and is connected to the carry-in side stand 25 and the carry-out side stand 28 by the pipes 50c and 55c, respectively. Various valves are provided in each of the pipes 50a to 50c and 55a to 55c. In the pipes 50a to 50c and 55a to 55c, a gas particle measuring device for measuring the amount of particles in the gas may be provided. On the other hand, in the processing table 27, in addition to the air ejecting mechanism (gas ejecting portion) 60, a suction mechanism 70 is provided. Fig. 6 is a view showing the structure of the air ejection mechanism and the suction mechanism provided in the processing table 27. As shown in the figure, the air ejection mechanism 60 includes a blower 61, a temperature control unit 62, a filter 63, an automatic pressure controller (APC) 64, a manifold 65, a temperature sensor 66, and a discharge amount monitoring port 67. The blower 61 is an air supply source that supplies air to the air discharge mechanism, and is connected to the temperature control unit 62 via a pipe 60a. As the air supply -24-201012557, the source may be replaced by the blower 61, and the air supply line 连接 of the connection factory or the like 〇 the temperature control unit 62 is means for adjusting the temperature of the supplied air, for example. The air circulation portion in the temperature control unit 62 is provided with a cooling mechanism such as a refrigerant mechanism or a heating mechanism such as a heating wire. By the cooling mechanism or the heating mechanism, the temperature of the air can be raised or lowered. At the temperature control unit 62, the temperature of the air can be independently adjusted with respect to the above-described temperature control units φ 52, 57. The temperature control unit 62 is connected to the APC 64 via a pipe 60b. A filter 63 is provided in the pipe 60b. The filter 63 is a portion for removing foreign matter mixed with the supplied air. A relief valve (not shown) may be provided in the pipe 60b. APC64 is a unit for adjusting the supply amount of air. The APC 64 has a butterfly valve 64a and a controller 64b. The controller 64b can adjust the opening degree of the butterfly valve 64a, and the supply amount of the helium air can be adjusted by adjusting the opening degree of the butterfly valve 64a. The APC 64 is connected to the manifold 65 via the piping 60c. The piping 60c is attached to the flowmeter 69a and the pressure gauge 69b. The flow rate and pressure of the air in the pipe 60c are measured by the flow meter 69a and the pressure gauge 69b. The results of each measurement are, for example, sent to APC64. The manifold 65 is a unit for diverging the air flowing through the pipe 60c. In the manifold 65, the pipe 60c is connected to a plurality of pipes 60d which are divided. Each of the pipes 60d is connected to the air ejection hole 27a of the processing table 27. Then, the air from the APC 64 is ejected from the air ejection hole 27a via the pipe 60c and the pipes 60d - 25 - 201012557. The temperature sensor 66 is a sensor for measuring the temperature of the air in the manifold 65. The temperature of the air measured by the temperature sensor 66 is sent to the temperature control unit 62 via, for example, a communication circuit or the like. In the degree control unit 62, the temperature of the air can be adjusted by making the measurement result of the temperature sensor 66 instead. The temperature control unit 62 and the temperature sensor constitute a temperature adjustment mechanism temperature adjustment unit 83 that feeds back the temperature of the air to adjust it. The discharge amount monitoring port 67 is configured to have a flow rate detecting port for air. The flow rate detecting port can detect the gas flow rate directly below the table portion. The discharge amount monitoring port 67 is provided with a flow meter 67a and a pressure gauge 67b, and can set the flow rate and pressure of the air ejected from the air ejection hole 27a. The result measured by the flow meter 67a and the pressure gauge 67b is sent to the controller 64b in the APC 64. Various valves and the like are attached to the pipes 60a to 60e, and an appropriate opening degree can be adjusted for each valve. The suction mechanism 7B has a blower 71, a pressure automatic controller APC 72, a collecting tank 73, a manifold 74, and a suction pressure monitoring port 75. The blower 71, the APC 72, the collecting tank 73, and the manifold 74 are mutually connected by a tube. In the connection of 70a to 70c, various valve portions are attached to the respective pipes 70a to 70c, and an air suction line such as a factory may be used instead of the blower 71. It is also possible not to provide the manifold 74. The APC 72 is provided with a butterfly 72a for adjusting the supply amount of air, and a controller 72b. The suction amount monitoring port 75 is connected to the processing table 27 by a pipe 70e with a temperature feed 6 6 (j), and the valve is connected to the processing station 27, and a flow detecting port for air is connected to the connecting portion. The flow rate detecting port can detect the flow rate of the gas directly below the processing table 27. The flow rate detecting port 75 is provided with a flow meter 75a and a pressure gauge 75b, and can be measured by the air suction hole 27b. The air flow rate and pressure are transmitted to the controller 72b in the APC 72 by the flow meter 75a and the pressure meter 75b. A flow meter φ may be provided between the APC 72 and the air suction hole 27b, and the measurement result may be passed through The electric wire (shown by a broken line in the drawing) is sent to the controller 72b in the APC 72. The pipe 60c and the pipe 70c are connected by the connecting portion 80, and can be switched to: a washing liquid suction line for cleaning and a vacuum. (Air suction) line (Coating operation) Next, the operation of the coating device 1 having the above configuration will be described. Fig. 7 is a plan view showing the operation of the coating device 1. The operation of applying the photoresist R to the substrate S will be described. In this operation, the substrate S is carried into the substrate loading region 25S so that the short axis direction is parallel to the conveyance direction, and the substrate S is floated and transported. Further, a photoresist is applied to the coating treatment region 27S, and the substrate S to which the photoresist has been applied is carried out from the substrate carry-out region 28S. The illustration of the management unit 4 is omitted in Fig. 7, and it is easy to determine the loading side table 25. The structure of the door frame 31 is broken, and the structure of the nozzle 32 and the sensor 33 can be easily determined. The detailed operation of each part will be described below. Before the substrate is carried into the substrate carrying-in area 25S, the coating device -27-201012557 1 Specifically, the carrier 23a is disposed on the -Y direction side of the substrate loading position 25U of the loading side table 25, and the height position of the suction pad provided in the substrate holding portion 23b is positioned at the floating height position of the substrate S. Further, air is ejected or sucked from the air ejection hole 25a of the loading side table 25, the air ejection hole 27a of the processing table 27, the air suction hole 27b, and the air ejection hole 28a of the delivery side table 28, respectively. A state in which the substrate is floated on the surface of the table portion 22. At this time, the air ejecting mechanism 50 of the loading side table 25, the air ejecting mechanism 60 of the processing table 27, and the air ejecting mechanism 55 of the unloading side table 28 are The temperature of the air ejected from the air ejection holes 25a, 27a, and 28a is measured by the temperature sensors 54, 59, 66, respectively, and the measurement results are sent to the temperature control units 5, 5, 7 and 6 2 at the temperature. The control units 52, 57, and 62 adjust the temperature of the air flowing inside themselves based on the above measurement results. The temperature to be adjusted at this time is preferably a temperature substantially equal to the ambient temperature of the coating device 1. This temperature can be adjusted to a temperature in a clean room in which the coating device 1 is disposed, for example, a temperature of about 20 ° C to 25 ° C. When the air temperature exceeds 25 °C, the substrate S may be deformed by the heat of the air, so it is preferable to control the temperature range of the air within the above range. When this temperature adjustment is performed, the temperature around the coating apparatus 1 is measured in advance, and the measured ambient temperature is used as a reference temperature, and is stored in a controller (not shown) of the temperature control units 52, 57, and 62. For example, a thermometer may be separately disposed, and the temperature measured by the thermometer may be used as a reference temperature. If the reference temperature is different from the temperature measured by the temperature sensors 54, 59-28 201012557, 66, the temperature of the air is adjusted by the temperature control units 52, 57, 62 to match the temperature of the air to the reference temperature. By using the temperature control units 52, 57, 62 and the temperature sensors 54, 59, 66 as the functions of the temperature adjustment mechanisms 8, 82, 82, 83, respectively, the temperature of the air ejected from the air ejection holes 25a, 27a, 28a It will become approximately equal to the temperature around the coating device 1. After the coating apparatus 1 has completed the standby in the above-described manner, for example, by the transport arm or the like having no φ, as shown in FIG. 7, when the substrate S is transported from the outside to the substrate loading position 25U, the elevating member 26a is caused to face. + Z direction movement, the lift pin 26b protrudes from the lift pin exit hole 25b to the table surface 25c_. By the operation of the elevating member 26a, the lift pin 26b lifts the substrate S and performs the transfer operation of the substrate S. Further, the above-mentioned long hole from the aligning device 25d causes the above-mentioned positioning member to protrude from the table surface 25c. After receiving the substrate S, the elevating member 26a is lowered to accommodate the elevating pin 26b in the elevating pin exit hole 25b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is maintained in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the positioning of the substrate S is performed by the positioning member of the calibration device 25d. After the positioning, the suction pad of each of the substrate holding portions 23b disposed on the γ-direction side of the substrate loading position is adsorbed on the back surface of the substrate S to hold the substrate S. After the back surface of the substrate S is held by the substrate holding portion 23b, the carrier 23a is moved along the rail 23c. The substrate S starts moving in the +X direction in accordance with the movement of the conveyor 23a. The temperature of the air ejected from the air ejection hole 25a of the loading side table 25 is -29-201012557, and is adjusted to be substantially equal to the temperature around the coating device 1, so that when the substrate S is carried into the loading side table 25, it is in contact with the air. The substrate S is less likely to cause temperature unevenness, and the film thickness unevenness of the photoresist R is not easily generated. When the leading end of the substrate S in the conveyance direction reaches the position of the opening portion 3 2a of the nozzle 32, as shown in Fig. 7, the photoresist is discharged from the opening 32a of the nozzle 32 toward the substrate S. The discharge operation of the photoresist is performed by fixing the position of the nozzle 32 and transporting the substrate S by the transporter 23a. With the movement of the substrate S, the photoresist film R is applied onto the substrate S as shown in Fig. 7. The resist film R is formed in a predetermined region of the substrate S by passing the substrate S through the opening 32a of the photoresist. At this time, the temperature of the air ejected from the air ejection hole 27a of the processing table 27 is adjusted to be substantially equal to the ambient temperature of the coating device 1, and the substrate S that is in contact with the air is less likely to cause temperature unevenness, and is less likely to generate light. The case where the film thickness of the resist is uneven. The substrate S on which the photoresist film R is formed is conveyed toward the carry-out side table 28 by the transporter 23a. In the state in which the carry-out side table 28 is floated on the table surface 28c, the substrate S is transported to the substrate carry-out position 2 8 U as shown in Fig. 7 . When the substrate S reaches the substrate carry-out position 28U, the elevating member 29a of the elevating mechanism 29 is moved in the +Z direction. By the movement of the elevating member 29a, the lift pin 29b protrudes from the lift pin exit hole 28b toward the back surface of the substrate S, and the substrate S is lifted by the lift pin 29b. In this state, for example, the external transfer arm provided at the +X direction side of the carry-out side stand 28 is connected to the carry-out side stand 28 by -30-201012557, and receives the substrate S. After the substrate S is transferred to the arm, the carrier 23a is returned to the substrate 25U of the loading side table 25, and stands by until the next substrate S is to be transported. When the substrate S is carried out, the temperature of the air ejected from the air 28a of the unloading side table 28 is adjusted to be substantially equal to the degree of the coating device 1, and the substrate S that is in contact with the air is less likely to generate temperature, and is less likely to generate a photoresist. The case where the film thickness of the agent is uneven. φ When the next substrate S is transported, for example, by the transport mechanism 23 provided on the portion 21c, the substrate S is held and moved, and the next substrate S is not transported, and the coating portion 3 is performed. The preliminary discharge operation of the discharge state of the nozzle 32 is held. As shown in Fig. 8, the door frame 31 is moved toward the position of the management portion 4 by the rail member 35 (refer to Fig. 4). After the door frame 31 is moved to the position of the management unit 4, the front end of the nozzle 32 is connected to the nozzle wash 43 by the nozzle cleaning device 43 to wash the nozzle front end 32c to the nozzle. After the front end 32c is cleaned, the nozzle 32 is connected to the outlet mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while the opening 32a of the nozzle 32 is moved to an X position, and the opening 3 is moved from the opening 3 2a Preparing the spitting light After the preliminary ejection operation, the portal frame 3 1 is returned to the original. When the substrate S is required by the transport mechanism 23 provided on the frame side portion 21c, the nozzle 32 is moved to a predetermined position in the Z direction to the side of the frame where the temperature around the transport carry-in hole is uneven. In order to protect the display, the -X side, adjust the net device 预备 to prepare the spit 32a and the front end to make the nozzle resist. Come to the location to carry the next. By the operation of applying the coating resist film R to the substrate S, a high-quality resist film R is formed on the substrate S. Alternatively, the nozzle 32 may be connected to the dipping tank 42 in response to the need, e.g., every time a predetermined number of times is reached. In the immersion tank 42, the nozzle 32 is prevented from drying by exposing the opening portion 32a of the nozzle 32 to the vapor atmosphere of the solvent (diluent) stored in the immersion tank 42. According to the present embodiment, the substrate transport unit 2 is provided with air ejecting means (gas ejecting units) 50, 55, and 6 that eject the air plate S, and is provided with a temperature for adjusting the temperature of the air (gas). The adjustment mechanisms (temperature adjustment sections) 81, 82, and 83' can adjust the temperature of the air ejected toward the substrate S by the temperature adjustment mechanisms 81, 82, and 83. Thereby, the temperature unevenness generated in the substrate S can be reduced, and the film thickness unevenness caused by the photoresist applied on the substrate S can be prevented. According to the present embodiment, since the temperature adjustment mechanisms 81 to 83 are provided on the loading side table 25, the processing table 27, and the unloading side table 28, the temperature of the air is set independently for each of the stages, so that the gas can be adjusted with higher precision. temperature. The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the scope of the invention. The invention is not limited by the foregoing description, but is defined by the scope of the appended claims. For example, in the above-described embodiment, the air supplied from the blower is temperature-regulated, and the air subjected to the temperature adjustment is ejected. However, the present invention is not limited thereto, and the air sucked by the suction mechanism 70 may be circulated, for example. The air ejecting mechanism (gas ejecting unit) sprays the air after the cycle -32 - 201012557. For example, the connection portion 80 that connects the air ejection mechanism 60 and the suction mechanism 70 may be circulated; or the circulation route may be additionally provided between the air ejection mechanism 60 and the suction mechanism 70 to circulate the attracted air. . Air can also be circulated from the suction mechanism 70 to the air ejection mechanisms 50, 55. In the case where the suctioned air is circulated by the suction mechanism 70 as described above, a filter for restricting the passage of foreign matter may be disposed in the circulation route. Further, it is also possible to have a structure for circulating the air on the stage portion 22 toward the air ejecting machine φ structures 50, 55, and 60. In the above embodiment, the temperature sensors 54, 59, and 66 are attached to the manifolds 53, 58, and 65, respectively, and are not limited thereto, and may be attached to other parts of the structure, for example, a structure attached to the pipe, or The structure is attached to the air ejection holes 25a, 27a, and 28a. In the above-described embodiment, the temperature sensor is attached to the portion corresponding to the air ejection hole of each of the stages, and the present invention is not limited thereto. For example, the temperature sensor may be provided only for the air ejected from the air ejection hole 27a of the processing table 27. Temperature φ sensor. Alternatively, the temperature sensor may be provided only for the air ejected from the air ejection hole 27a of the processing table 27 and the air ejection hole 28a of the unloading side table 28. In the above-described embodiment, the temperature of the air is entirely adjusted on the loading side table 25 and the unloading side table 28, and the present invention is not limited thereto. For example, only a part of the loading side table 25 or a part of the carrying-out side table 28 may be used. The ejected air' adjusts the temperature. In this case, for example, a region (a region adjacent to the coating region) that is in contact with the processing table 27 among the loading side tables 25, and a region that is in contact with the processing table 27 among the carrying-out side tables 28 (adjacent to the coating region - 33 - 201012557 The area to be connected, etc., is preferably adjusted for the temperature of the air ejected from a region centered on the processing table 27. In the above embodiment, the air discharged from the loading side table 25, the processing table 27, and the unloading side table 28 is adjusted to the same temperature, and the present invention is not limited thereto, and the respective stages may be adjusted to different temperatures. For example, the carry-out side table 28 can also be adjusted to a temperature at which the photoresist applied on the substrate S can be dried. Thereby, the time required for the drying step of the photoresist can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a front elevational view showing the structure of the coating device of Fig. 1. Fig. 3 is a plan view showing the structure of the coating device of Fig. 1. Fig. 4 is a side view showing the structure of the coating device of Fig. 1.

第5圖是對第1圖的塗布裝置所具備的台部供給空氣 的機構的構造的顯示圖。 Q 第6圖是第1圖的塗布裝置所具備的空氣供給機構及 吸引機構的構造的顯示圖。 第7圖是本發明的一個實施方式的塗布裝置的動作的 顯示圖。 第8圖是本發明的一個實施方式的塗布裝置的動作的 顯示圖。 【主要元件符號說明】 -34- 201012557 S :基板 R :光阻膜 1 :塗布裝置 2 :基板搬運 3 :塗布部 2 5 :搬入側$ 25S :基板搬 _ 25a :空氣噴 2 7 :處理台 27a :空氣噴 27b :空氣吸 27S :塗布處 2 8 :搬出側ΐ 28a :空氣噴 28S :基板搬 φ 28U :基板搬 50 、 55 、 60 ： 51 、 56 、 61 : 52 、 57 、 62 : 53 、 58 、 65 : 54 、 59 、 66 ： 70 :吸引機# 80 :連接部 81、82、8 3 ·· 部 入區域 出孔 出孔 引孔 理區域（塗布區域） 出孔 出區域 出位置 空氣噴出機構（氣體噴出部） 鼓風機 溫度控制單元 歧管 溫度感應器 溫度調節機構（溫度調節部） -35-Fig. 5 is a view showing the structure of a mechanism for supplying air to the table portion provided in the coating device of Fig. 1. Q Fig. 6 is a view showing the structure of an air supply mechanism and a suction mechanism provided in the coating device of Fig. 1. Fig. 7 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 8 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. [Description of main component symbols] -34- 201012557 S : Substrate R: Photoresist film 1 : Coating device 2 : Substrate transfer 3 : Coating unit 2 5 : Carrying in side $ 25S : Substrate transfer _ 25a : Air spray 2 7 : Processing table 27a : Air spray 27b : Air suction 27S : Coating position 2 8 : Carry out side ΐ 28a : Air spray 28S : Substrate transfer φ 28U : Substrate transfer 50 , 55 , 60 : 51 , 56 , 61 : 52 , 57 , 62 : 53 , 58 , 65 : 54 , 59 , 66 : 70 : suction machine # 80 : connecting parts 81 , 82 , 8 3 · · part of the area exit hole outlet hole hole area (coating area) out hole out area out position air Discharge mechanism (gas ejection unit) Blower temperature control unit manifold temperature sensor temperature adjustment mechanism (temperature adjustment unit) -35-

Claims (1)

201012557 七、申請專利範面： 1· 一種塗布裝置，是具備有：使基板浮起來進行搬 運的基板搬運部 '以及在藉由上述基板搬運部進行搬運的 同時’將液狀體塗布於上述基板的塗布部，其特徵爲： 具備有： 設置於上述基板搬運部，朝上述基板噴出氣體的氣體 噴出部、 以及調節上述氣體的溫度的溫度調節部。 2. 如申請專利範圍第1項的塗布裝置，其中上述基 板搬運部，具有與上述塗布部對應的塗布區域， 上述溫度調節部，將噴出到上述塗布區域的上述氣體 的溫度進行調節。 3. 如申請專利範圍第1項的塗布裝置，其中上述基 板搬運部，具有將上述基板搬出的基板搬出區域， 上述溫度調節部，將噴出到上述基板搬出區域的上述 氣體的溫度進行調節。 4. 如申請專利範圍第1項的塗布裝置，其中上述基 板搬運部，具有將上述基板搬入的基板搬入區域， 上述溫度調節部，將噴出到上述基板搬入區域的上述 氣體的溫度進行調節。 5. 如申請專利範圍第1項的塗布裝置，其中上述基 板搬運部，具有與上述塗布部對應的塗布區域， 上述溫度調節部，將噴出到上述基板搬運部之中與上 述塗布區域鄰接的區域的上述氣體的溫度進行調節。 -36- 201012557 6·如申請專利範圍第I項的塗布裝置，其中上述溫 度調節部，將上述氣體的溫度調節成：配合用來搬運上述 基板的搬運空間的溫度。 7.如申請專利範圍第1項的塗布裝置，其中上述溫 度調節部’將上述氣體的溫度調節在20 °C〜25 t的範圍內 〇 8 ·如申請專利範圍第1項的塗布裝置，其中上述基 0 板搬運部，具有：與上述塗布部對應的塗布區域、將上述 基板搬入的基板搬入區域、以及將上述基板搬出的基板搬 出區域， . 上述溫度調節部，分別對上述塗布區域、上述基板搬 入區域及上述基板搬出區域的各區域設定上述氣體的溫度 〇 9.如申請專利範圍第1項的塗布裝置，其中上述氣 體噴出部，對用來搬運上述基板的搬運空間噴出氣體。 Φ 10.如申請專利範圍第1項的塗布裝置，其中上述基 板搬運部，具有： 將用來搬運上述基板的搬運空間的氣體予以吸引的吸 引機構、 與將藉由上述吸引機構所吸引的上述氣體朝上述氣體 噴出部循環的循環路線。 11.如申請專利範圍第10項的塗布裝置，其中上述 循環路線，具有：用來將包含於上述氣體的異物的流通加 以限制的過濾器。 -37- 201012557 12. 如申請專利範圍第1項的塗布裝置，其中在將上 述氣體供給到上述基板搬運部的路線上，設置有：將用來 搬運上述基板的搬運空間的溫度保持爲一定溫度的冷卻機 構及加熱機構的其中至少一方。 13. —種塗布方法，是使基板浮起而於塗布區域、基 板搬出區域依序進行搬運，且同時在上述塗布區域對上述 基板塗布液狀體的塗布方法，其特徵爲： 調節氣體的溫度，將調節過溫度的上述氣體對上述基 板噴出，使上述基板浮起。 14. 如申請專利範圍第13項的塗布方法，其中是在 塗布上述液狀體之前，將朝上述基板噴出的上述氣體的溫 度加以調節。 15. 如申請專利範圍第13項的塗布方法，其中在將 上述基板搬入到上述塗布區域之前，將朝上述基板噴出的 上述氣體的溫度加以調節。 16. 如申請專利範圍第13項的塗布方法，其中在將 塗布好液狀體的上述基板從上述基板搬出區域搬出之前， 將朝上述基板噴出的上述氣體的溫度加以調節。 17. 如申請專利範圍第13項的塗布方法，其中是將 上述氣體的溫度調節成：配合用來搬運上述基板的搬運空 間的溫度。 18. 如申請專利範圍第13項的塗布方法，其中將上 述氣體的溫度調節在20 °C〜25 °C的範圍內。 19. 如申請專利範圍第13項的塗布方法，其中將上 -38- 201012557 述氣體的溫度調節成：根據上述基板的搬運位置而將不同 溫度的氣體噴出到上述基板。 20. 如申請專利範圍第13項的塗布方法，其中對用 來搬運上述基板的搬運空間內噴出氣體。 21. 如申請專利範圍第13項的塗布方法，其中將用 來搬運上述基板的搬運空間的氣體予以吸引，將所吸引的 上述氣體對上述基板噴出。 參 -39-201012557 VII. Patent application plane: 1. A coating apparatus including a substrate transporting unit that floats a substrate and transports it, and a liquid material is applied to the substrate while being transported by the substrate transporting unit The coating unit is characterized by comprising: a gas discharge unit that is provided in the substrate conveyance unit to discharge a gas toward the substrate; and a temperature adjustment unit that adjusts a temperature of the gas. 2. The coating apparatus according to claim 1, wherein the substrate conveying portion has a coating region corresponding to the coating portion, and the temperature adjusting portion adjusts a temperature of the gas discharged to the coating region. 3. The coating apparatus according to claim 1, wherein the substrate conveying unit has a substrate carrying-out area for carrying out the substrate, and the temperature adjusting unit adjusts a temperature of the gas discharged to the substrate carrying-out area. 4. The coating apparatus according to claim 1, wherein the substrate conveying unit has a substrate loading area into which the substrate is carried, and the temperature adjusting unit adjusts a temperature of the gas discharged to the substrate loading area. 5. The coating device according to claim 1, wherein the substrate conveying portion has an application region corresponding to the coating portion, and the temperature adjusting portion discharges an area adjacent to the coating region among the substrate conveying portions. The temperature of the above gas is adjusted. The coating apparatus according to the first aspect of the invention, wherein the temperature adjusting unit adjusts a temperature of the gas to match a temperature of a conveyance space for conveying the substrate. 7. The coating device according to claim 1, wherein the temperature adjusting portion 'adjusts the temperature of the gas to a range of from 20 ° C to 25 t 〇 8 · a coating device according to claim 1 of the patent application, wherein The substrate transporting unit includes: a coating region corresponding to the coating portion, a substrate loading region into which the substrate is carried in, and a substrate carrying-out region for carrying out the substrate, wherein the temperature adjusting portion respectively applies the coating region and the coating region The coating device of the first aspect of the present invention, wherein the gas ejecting unit ejects a gas to a conveyance space for transporting the substrate. The coating apparatus according to claim 1, wherein the substrate transporting unit includes: a suction mechanism that sucks gas for transporting the transport space of the substrate; and the suction unit that is attracted by the suction mechanism A circulation route in which the gas circulates toward the gas ejecting portion. 11. The coating apparatus according to claim 10, wherein the circulation route has a filter for restricting circulation of foreign matter contained in the gas. The coating apparatus of the first aspect of the invention, wherein the supply of the gas to the substrate conveyance unit is performed to maintain a temperature of a conveyance space for conveying the substrate at a constant temperature. At least one of the cooling mechanism and the heating mechanism. 13. A coating method in which a substrate is floated and sequentially transported in a coating region and a substrate carrying-out region, and a liquid coating method is applied to the substrate in the coating region, wherein a temperature of the gas is adjusted. The gas having the adjusted temperature is sprayed onto the substrate to float the substrate. 14. The coating method according to claim 13, wherein the temperature of the gas ejected toward the substrate is adjusted before the application of the liquid. 15. The coating method according to claim 13, wherein the temperature of the gas ejected toward the substrate is adjusted before the substrate is carried into the coating region. 16. The coating method according to claim 13, wherein the temperature of the gas ejected toward the substrate is adjusted before the substrate on which the liquid material is applied is carried out from the substrate carrying-out region. 17. The coating method of claim 13, wherein the temperature of the gas is adjusted to match the temperature of the transport space for transporting the substrate. 18. The coating method according to claim 13, wherein the temperature of the gas is adjusted within a range of from 20 ° C to 25 ° C. 19. The coating method according to claim 13, wherein the temperature of the gas of the above-mentioned -38-201012557 is adjusted to eject a gas of a different temperature to the substrate according to the conveyance position of the substrate. 20. The coating method according to claim 13, wherein the gas is ejected into the carrying space for transporting the substrate. 21. The coating method according to claim 13, wherein the gas for transporting the transport space of the substrate is sucked, and the sucked gas is discharged onto the substrate. Reference -39-
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