TW201012377A - Heat dissipation device - Google Patents
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- TW201012377A TW201012377A TW97135041A TW97135041A TW201012377A TW 201012377 A TW201012377 A TW 201012377A TW 97135041 A TW97135041 A TW 97135041A TW 97135041 A TW97135041 A TW 97135041A TW 201012377 A TW201012377 A TW 201012377A
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201012377 九、發明說明: 【發明所屬之技術領域】 本發明係涉及一種散熱裝置,尤係涉及一種用於對發 熱電子元件進行散熱之散熱裝置。 【先前技術】 隨著電子資訊產業之快速發展,中央處理器等發熱電 子元件南速、高頻及集成化使其發熱量劇增’如不及時排 ❹除該等熱量’將引起發熱電子元件自身溫度之升高,進而 導致發熱電子元件之損壞或其性能之降低。故,需要對發 熱電子元件進行散熱。目前,業者常用之散熱方式係在發 熱電子元件表面裝設一散熱裝置。 該散熱裝置包括一吸熱板、一散熱器及將該吸熱板與 散熱器熱連接之一熱管,該吸熱板與電路板上之發熱電子 元件貼合,其四個角上各設有一套管,該套管垂直吸熱板 設置,每一套管内設有一彈簧螺釘’在安裝該散熱裝置時, 罾該吸熱板藉由四顆彈簧螺釘固定於電路板上,以使吸熱板 與發熱電子元件緊密接觸。 然而,上述散熱裝置安裝時需要四顆螺釘才可將該亨 熱板固定於電路板上,需要螺釘之數量較多,安裝過 為繁,’不利於節約成本’同時,電路板上相應之亦要言 四個女裝孔’這亦導致了電路板走線之難度增大,而若这 用更少之螺釘’會導致螺釘與吸熱板之施力點減少,不截 將吸熱板穩固地固定至發熱電子元件上。 6 201012377 【發明内容】 有鑒於此, 裝置。 有必要提供一種安裝簡便以及穩固之散熱 也也為種散熱裝置包括一吸熱板、-散熱器及將吸埶板 與散熱器熱連接之-熱管,該吸熱板上設有第一;:二 Ά所述第一、第二彈片分別設於所述吸熱板之兩相對侧 上所述第-彈片包括一鎖合部及分別設於所 兩端之兩結合部,所述鎖合部上只設有―個第—通孔,戶: 述兩結合部上各設有—個第二通孔,所述第—彈片藉由第 二通孔固定於吸熱板上,所述第二彈片只設有―個第一通 孔及至少-個第二通孔,所述第二彈片藉由第二通孔固定 於吸熱板上,所述第―、第二彈片之第—通孔用於將所述 吸熱板固定於一電路板上。 一種散熱裝置’包括吸熱板及分別連接在吸熱板相對 之兩侧上之第-彈片與第二彈片,該第一彈片與吸熱板藉 φ由至少兩個施力點連接,該第二彈片與吸熱板藉由至少一 個施力點連接’該第一彈片與第二彈片上分別只設置一個 鎖固點而用於將該吸熱板固定至與發熱電子元件接觸。 與習知技術相比,本發明中之散熱裝置安裝時,僅需 要兩個螺釘,使散熱裝置之安裝更加簡便,電路板上對應 亦只兩要δ免置兩個安裝孔,安裝孔數量較少,從而降低了 電路板走線之難度,但同時並沒有減少第一、第二彈片與 吸熱板之施力點個數,保證吸熱板之安裝穩固性不受影響。 【實施方式】 201012377 下面參照附圖結备實施例對本發明作進一步說明。 請參照圖1,本發明第一實施例之散熱裝置10包括一 吸熱板30、一散熱器60、將該吸熱板30與散熱器60熱連 接之一熱管20及將該吸熱板30固定之第一彈片4〇與第二 彈片50。 八 如圖2所示,該吸熱板30為一方形片體’其係由導熱 性良好之金屬製成,如銅、鋁等。該吸熱板3〇之上表面於 四個角之内侧各設有一銷釘31,以用於固定所述第一彈片 響40與第二彈片5〇。 該熱管20包括一冷凝端21及一蒸發端22,該冷凝端 21與該散熱器6G結合,該蒸發端22焊接於該吸熱板3〇 之上表面之中部。 該第一彈片40與第二彈片5〇均為平板狀且結構相 同’ U下以第-彈片4〇為例進行說明。第一彈片包括201012377 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] With the rapid development of the electronic information industry, the south speed, high frequency and integration of the heat-generating electronic components such as the central processing unit have caused a sudden increase in the amount of heat generated. If the heat is not removed in time, it will cause the heat-generating electronic components. The increase in self temperature causes damage to the heat-generating electronic components or a decrease in their performance. Therefore, heat dissipation of the heating electronic components is required. At present, the heat dissipation method commonly used by the industry is to install a heat sink on the surface of the heating electronic component. The heat dissipating device comprises a heat absorbing plate, a heat sink and a heat pipe thermally connecting the heat absorbing plate and the heat sink. The heat absorbing plate is attached to the heat generating electronic component on the circuit board, and each of the four corners is provided with a sleeve. The sleeve is vertically heat absorbing plate, and each sleeve is provided with a spring screw. When the heat sink is installed, the heat absorbing plate is fixed on the circuit board by four spring screws, so that the heat absorbing plate is in close contact with the heat generating electronic component. . However, the above-mentioned heat dissipating device requires four screws to fix the heat-reinforcing plate to the circuit board, and the number of screws needs to be large, and the installation is complicated, which is not conducive to cost saving, and correspondingly on the circuit board. It is said that the four women's holes' also lead to an increase in the difficulty of circuit board routing, and if this uses fewer screws', the force points of the screws and the heat absorbing plate will be reduced, and the heat absorbing plate will be firmly fixed without cutting. To the heating electronic components. 6 201012377 SUMMARY OF THE INVENTION In view of this, the device. It is necessary to provide an easy-to-install and stable heat dissipation. Also, the heat sink includes a heat absorbing plate, a heat sink, and a heat pipe that thermally connects the suction plate to the heat sink. The heat absorbing plate is provided with a first; The first and second elastic pieces are respectively disposed on opposite sides of the heat absorbing plate, and the first elastic piece includes a locking portion and two joint portions respectively disposed at the two ends, and the locking portion is only provided There is a first through hole, and each of the two joint portions is provided with a second through hole, and the first elastic piece is fixed on the heat absorbing plate by the second through hole, and the second elastic piece is only provided a first through hole and at least one second through hole, wherein the second elastic piece is fixed to the heat absorbing plate by the second through hole, and the first through hole of the first and second elastic pieces is used for The heat absorbing plate is fixed on a circuit board. A heat dissipating device includes a heat absorbing plate and a first elastic piece and a second elastic piece respectively connected to opposite sides of the heat absorbing plate, wherein the first elastic piece and the heat absorbing plate are connected by at least two force applying points, and the second elastic piece is connected with The heat absorbing plate is connected by at least one force applying point. The first elastic piece and the second elastic piece are respectively provided with only one locking point for fixing the heat absorbing plate to contact with the heat generating electronic component. Compared with the prior art, when the heat dissipating device of the present invention is installed, only two screws are needed, so that the mounting of the heat dissipating device is more convenient, and only two mounting holes are required for the circuit board, and the number of mounting holes is relatively small. Less, thus reducing the difficulty of the circuit board routing, but at the same time does not reduce the number of points of the first and second shrapnel and the heat absorbing plate, to ensure that the installation stability of the heat absorbing plate is not affected. [Embodiment] 201012377 The present invention will be further described below with reference to the accompanying drawings. Referring to FIG. 1 , a heat dissipating device 10 according to a first embodiment of the present invention includes a heat absorbing plate 30 , a heat sink 60 , a heat pipe 20 for thermally connecting the heat absorbing plate 30 and the heat sink 60 , and a heat insulating plate 30 . A spring 4 〇 and a second elastic piece 50. As shown in Fig. 2, the heat absorbing plate 30 is a square piece which is made of a metal having good thermal conductivity such as copper, aluminum or the like. The upper surface of the heat absorbing plate 3 is provided with a pin 31 on the inner side of the four corners for fixing the first elastic piece 40 and the second elastic piece 5''. The heat pipe 20 includes a condensation end 21 and an evaporation end 22, and the condensation end 21 is coupled to the heat sink 6G, and the evaporation end 22 is welded to the upper portion of the upper surface of the heat absorption plate 3A. The first elastic piece 40 and the second elastic piece 5〇 are both flat and have the same structure. The first elastic piece 4〇 is taken as an example. The first shrapnel includes
::合部41 #兩結合部42。該鎖合部41 i長條狀,並於 其中間部位設有-第—通孔43。該兩結合部^均大致呈 f ’其由該鎖合部41之兩端分別向其同側垂直延伸 另一端’二部42之—端與鎖合部41之端部垂直連接, 自由端,該兩結合部42之自由端相對設置且間 二二::一結合部42之自由端設有-第二通孔… 通孔44與吸熱板3G上之銷針31對應。 別晉二裝Γ ’將第一彈片40與第二彈片5〇之鎖合部41分 使一對相對侧邊之外側(如圖1所示),並 與第二彈片50上之第二通孔44分別對應吸 8 201012377 .力點,防二: 以使吸熱板30之四角各形成-施 為力 …、板3〇兩端翹起,從而保證吸熱板30均勻 :藉由第强在安裝該散熱裝置1〇時,只需要兩顆螺釘分 二=一彈片40與第二彈片5〇之第一通孔43 : ^裝置1G固定於—電路板上(圖未示),使吸埶板^ 施:路板上之發熱電子元件接觸,在保證具有足夠數量之 響程,並節約了成本。其次 以了女裝過 只設有一個第一通孔43,即相當於只設:個彈鎖片固:上 少==只需要設置兩個安裝孔,安裝孔數量較 而降低了電路板走線之難度。 請^續參照圖3’其為本發明第二實施例之散熱裳置 ^,該散熱裝置10a與第一實施例之散_ ι〇類似, 二:同之處在於··該散熱裝置1〇a包括一第一彈片術及 彈片50a’該第-彈片術與第二彈片池安裝在吸 j 30a之相對兩側’該第-彈片4〇a與第一實施例之散 熱^ 1〇中之第—彈片40之結構與安裝方式相同,該第 =片他呈條形,其垂直於第—彈片術及吸熱板3如, 該第二彈片5〇a 一端設有一第一通孔Η,另一端設有一第 二通孔52,該吸祕30a 一側邊之中部對應該第二通孔^ 設有一銷釘3la,該第二彈片50a先藉由該第二通孔52固 定於吸熱板30a上,使設有第一通孔51之端部垂直於吸献 板3〇a且突伸於吸熱板30a之外,再藉由該第一通孔51將 9 .201012377 定於一電路板上,採用第-彈片術與 二Τ5使用之方式,亦僅需在電路板上設置兩 個女装孔’时可以增大該散熱裝置恤之空間適用性。 -彈Γ:大為月第三實施例中之第一彈片條,該第 ㈣框狀’㈣於將本發Μ第一實施 例:之第-彈片40之兩結合部42之自由端相對延伸並連 接為-體,使其兩結合部42之間形成一增強部^,再於該 增強部45上增設兩第二通孔她,如此,可以增二 之強度,同時增加第一彈片働與吸熱板3〇之間之 細力點,比如在本實施例中可提供多達四個施力點,使吸 ::30彈之Λ1更為均勻’本實施例中之第二彈片(圖未示) 與第一彈片40b之結構及安裝方式相同。 圖5所示為本發明第四實施例中之彈片,其中第 片撕與第二彈片5〇c之間藉由一連接件47連接起來。該 術與第二彈片服位於同一平面内且結構相 同,以下以第一彈片條為例,該第-彈片40c大致呈一 矩形框狀,相當於將本發明第—實施例中之第—彈片扣之 兩結合部42之自由端相對延伸並連接為—體,使其兩結合 部42之間形成一增強部45c。該連接件㈣一條形片體且 與第一彈片4〇C及第二彈片5〇c所在之平面平行,其在高 度方向上位於上方且與第一彈片條及第二彈片5〇c間隔 一定距離,該連接件47與第一彈片4〇c及第二彈片5〇c之 牦強邛45c垂直,該連接件47之兩端垂直向下延伸分別與 第彈片4〇c及第二彈片5〇c之增強部a之外側中部連 201012377 =使第-彈片40c與第二彈片5〇c對稱連接於該連接件 之兩端。此種結構,可以使彈片之取放更方便,並且不 易造成元件之丟失。 絲上所述,本發明符合發明專利之要件,羞依法提出 專利申請。惟以上所述者僅為本發明之較佳實施例,舉凡 熟悉本#技藝之人士,在爰依本發明精神所狀等效修飾 或變化,皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例之散熱裝置之立體組裴圖。 圖2係圖1所示散熱裝置之立體分解圖。 圖3係本發明第二實施例之散熱裝置之立體圖。 圖4係本發明第三實施例中之彈片之立體圖。 圖5係本發明第四實施例中之彈片之立體圖。 【本發明主要元件符號說明】 散熱裝置 10 熱管 20 冷凝端 21 蒸發端 22 吸熱板 30、 30a 銷釘 31、 31a 第一彈片 40、 40a、40b、40c 鎖合部 41 結合部 42 第一通孔 43、 51 第二通孔 44、 44b、 52 增強部 45、 45c 連接件 47 第二彈片 50、 50a、 50c 散熱器 60 11:: Joint portion 41 #two joint portion 42. The locking portion 41 i is elongated and has a - through hole 43 at a middle portion thereof. The two joint portions are substantially f', and the two ends of the lock portion 41 extend perpendicularly to the same side thereof, and the other end of the two portions 42 are perpendicularly connected to the end portion of the lock portion 41, and the free end is The free ends of the two joint portions 42 are oppositely disposed and the second end of the joint portion 42 is provided with a second through hole. The through hole 44 corresponds to the pin 31 on the heat absorbing plate 3G. The second elastic piece 40 and the second elastic piece 5〇 of the locking portion 41 are divided into a pair of opposite side outer sides (as shown in FIG. 1), and the second opening on the second elastic piece 50 The holes 44 respectively correspond to the suction 8 201012377. The force point, the anti-two: so that the four corners of the heat absorbing plate 30 are formed - the force is applied... the two sides of the plate 3 are tilted up, thereby ensuring that the heat absorbing plate 30 is uniform: by the strong installation When the heat dissipating device is 1 ,, only two screws are required to be divided into two: one elastic piece 40 and the first elastic piece 5 〇 first through hole 43 : ^ device 1G is fixed on the circuit board (not shown), so that the suction plate ^ Application: The contact of the heating electronic components on the road board ensures a sufficient number of sound paths and saves costs. Secondly, there is only one first through hole 43 in the women's clothing, which is equivalent to only one: one spring lock piece solid: less on == only need to set two mounting holes, the number of mounting holes is lower and the circuit board is lowered The difficulty of the line. Referring to FIG. 3, which is a heat dissipation device according to a second embodiment of the present invention, the heat dissipation device 10a is similar to the dispersion of the first embodiment, and the second point is that the heat dissipation device 1〇 a includes a first shrapnel and shrapnel 50a' the first shrapnel and the second shrapnel pool are mounted on opposite sides of the suction j 30a 'the first shrapnel 4〇a and the heat sink of the first embodiment The structure of the first elastic piece 40 is the same as that of the mounting method. The first piece has a strip shape, and is perpendicular to the first elastic piece and the heat absorbing plate 3. For example, the second elastic piece 5〇a has a first through hole at one end, and the other A second through hole 52 is disposed at one end, and a second through hole is disposed in the middle of the side of the absorbing member 30a. The second elastic piece 50a is first fixed to the heat absorbing plate 30a by the second through hole 52. The end portion of the first through hole 51 is perpendicular to the suction plate 3〇a and protrudes out of the heat absorbing plate 30a, and the first through hole 51 is used to fix the 9.201012377 on a circuit board. With the use of the first-elastic and the second-inch 5, it is only necessary to set two women's holes on the circuit board to increase the space suitability of the heat sink.- magazine: the first spring strip in the third embodiment of the month, the fourth (four) frame shape '(four) is opposite to the free end of the two joint portions 42 of the first-spring piece 40 of the first embodiment of the present hairpin And connecting the body to form a reinforcing portion between the two joint portions 42, and adding two second through holes to the reinforcing portion 45, so that the strength can be increased, and the first elastic piece is increased. The fine points between the heat absorbing plates 3〇, for example, can provide up to four force application points in the present embodiment, so that the suction: 30 elastic Λ 1 is more uniform 'the second elastic piece in this embodiment (Fig. The structure and installation of the first elastic piece 40b are the same. Fig. 5 shows a spring piece according to a fourth embodiment of the present invention, wherein the first piece tearing and the second elastic piece 5〇c are connected by a connecting member 47. The first elastic strip is exemplified in the same plane as the second elastic piece. The first elastic piece 40c is substantially in the shape of a rectangular frame, which is equivalent to the first elastic piece in the first embodiment of the present invention. The free ends of the two joint portions 42 are oppositely extended and connected to each other such that a reinforcing portion 45c is formed between the two joint portions 42. The connecting member (4) has a strip-shaped body and is parallel to a plane in which the first elastic piece 4〇C and the second elastic piece 5〇c are located, and is located above the height direction and spaced apart from the first elastic piece strip and the second elastic piece 5〇c The connecting member 47 is perpendicular to the first elastic piece 4〇c and the second elastic piece 5〇c, and the two ends of the connecting piece 47 extend vertically downwardly to the first elastic piece 4〇c and the second elastic piece 5, respectively. The outer side of the reinforcing portion a of the 〇c is connected to the central portion of the connecting member 201012377. The first elastic piece 40c and the second elastic piece 5〇c are symmetrically connected to both ends of the connecting member. This structure makes it easier to pick and place the shrapnel and is less likely to cause loss of components. As stated on the silk, the invention complies with the requirements of the invention patent and is ashamed to file a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations of the present invention in the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heat dissipating device according to a first embodiment of the present invention. 2 is an exploded perspective view of the heat sink shown in FIG. 1. Figure 3 is a perspective view of a heat sink according to a second embodiment of the present invention. Figure 4 is a perspective view of a shrapnel in a third embodiment of the present invention. Figure 5 is a perspective view of a shrapnel in a fourth embodiment of the present invention. [Description of main components of the present invention] Heat sink 10 Heat pipe 20 Condensing end 21 Evaporating end 22 Heat absorbing plate 30, 30a Pins 31, 31a First elastic piece 40, 40a, 40b, 40c Locking portion 41 Bonding portion 42 First through hole 43 , 51 second through holes 44, 44b, 52 reinforcements 45, 45c connecting members 47 second elastic pieces 50, 50a, 50c heat sink 60 11
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TW97135041A TWI411388B (en) | 2008-09-12 | 2008-09-12 | Heat dissipation device |
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TW97135041A TWI411388B (en) | 2008-09-12 | 2008-09-12 | Heat dissipation device |
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TW201012377A true TW201012377A (en) | 2010-03-16 |
TWI411388B TWI411388B (en) | 2013-10-01 |
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Cited By (1)
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TWI611749B (en) * | 2011-03-11 | 2018-01-11 | Huang Chong Xian | Radiator assembly |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US6816375B2 (en) * | 2001-08-03 | 2004-11-09 | Texas Instruments Incorporated | Heat sink attachment |
US6724632B2 (en) * | 2002-07-18 | 2004-04-20 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly with adjustable clip |
TWM265688U (en) * | 2004-10-15 | 2005-05-21 | Inventec Corp | Heat sink assembly device for display card and chipset |
TWM265692U (en) * | 2004-10-22 | 2005-05-21 | Inventec Corp | Heat sink module for electronic device |
JP2008198864A (en) * | 2007-02-14 | 2008-08-28 | Toshiba Corp | Electronic equipment and semiconductor package |
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TWI611749B (en) * | 2011-03-11 | 2018-01-11 | Huang Chong Xian | Radiator assembly |
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