M265688 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種顯示卡及晶片組之散人 置’更具體而言，主要係透過本創作之顯示卡及曰^ 卻將電腦之發熱源如顯示卡及晶片組:‘ 【先前技術】 有關於電腦元件的散熱裂置，習知皆是將散 別設計於個別之電腦元件之上，即個別於處理器’、、刀 )、顯示卡（VGA )或是晶片組（Chips&)之上言凡 牡詈政熱^置’但是此知運用於個別電腦元件之散熱 =’不僅佔用電腦機殼之内部空間’更無法節省成本’:、 ^別之電腦元件’纟自設置散熱裝置之散 =二就^_較小之散熱面積，其散熱傳導效率: 效率:也：之不好時，當然各個電腦元件之運作 等重大影響 使用後更會有作動不良及壽命降低 ㈣些情形都會造成使用者之困擾，因此，便有需 夠有效輸出該顯示卡及晶片組於作動時所產 及節ϊ:門Γίΐ冷=散熱結構，並且能提高散熱面積 【新型成貫為亟待解決之-大難題。 供一 知技術之問題，本創作之主要目的在於提 用以經、ϋ輪出顯示卡及晶片組之熱量的散熱組合裝置， 佔用太’多j散熱裝置係分別展設於個別之電腦元件，常 益法有缺點，並克服各個電腦元件產生的熱量， 降低ί缺^無法提供更高的散熱率，以及成本無法 M265688 為達上述目的，本創作係揭示—種 散熱組合裝置，主要特點係將該個別之璦埶狀=—j之 式設計，藉由該一整塊散熱板所增加了正合 :整塊散熱板_貞示卡及晶片組整::： 散熱兀件，且豐設於該一整塊散熱板之下，用以 之熱量，進而提供更高的散熱功能。 ’夕 有關本創作較詳細之内容及具體可行 參照圖式說明如下·· 貝刀式將 【實施方式】 本創作係一種顯示卡及晶片組之散熱組人 特點係將該個別之散熱裝置作一整合式設計:^以一敕 散熱板重疊於顯示卡及晶片組之上’藉由該一整塊散=板 較客知散熱板增加許多之散熱面#，以&整合其他散敎元 件，並疊設於該一整塊散熱板之下，用以輸出更多之= 量’進而提昇該散熱板之散熱率，並取代傳統散熱裝置 分=各自裝設於CPU、顯示卡及晶片組須佔用許多空間’，、 且無法提供更高之散熱功能之窘境， 以下為本創作較佳實施例之製作方式及實施步驟，茲 配合圖式做詳細說明。 首先請參閱第1圖，第1圖所示係本創作之一種顯示 卡及晶片組之散熱組合裝置丨，主要包括一整塊散熱板 1〇，一浮動式彈簧片2〇，至少二根散熱管30，一滑塊4〇， 一散熱墊50。 再者’該一整塊散熱板1〇大致呈一凸字型，該一整塊 散熱板10之下表面丨丨係設置有一與顯示卡接觸之g示$散 熱座13，以及一與晶片組散熱平台接觸之晶片組散熱座 14另外，该一彈簧片20係為一具有彈性之浮動式彈箬 片’該一彈簀片20之上表面係包含至少二孔洞21及至少二 M265688 固定件22，以及該至少二散熱管3〇，該一滑塊仙係 角度之滑塊，該-滑塊‘0之係包含有至；：： 孔洞42 ’該至少二孔洞42係用以容置該： 及導熱介f。 ^一放熱官3〇内部係容置有纖維 、有關本創作之-種顯示卡及晶片組之散熱組 之成形方法，係將該顯示卡及晶片組、 埶板10，以一麯劣泥々一，h …、、、1 口衣置1之散 日:板10 Μ伽之方式為實施特點之實施方式作說 下表第圖，有關本創作之一整塊散熱板10及並 ΐ座13及晶片組散熱座14，係以沖壓 :，2塑性變形，使該板材成形為進 板10之下表面11之適當部位係同時經由 曰音出有一與顯示卡接觸之平台’該—平台係為 散熱座13，以及另—與晶片組接觸之平台，= 平σ係為一晶片組散熱座14，其中，該一 2 含複數個可與主機板結合之細^ ; 個：、ηι1熱板10之上表面12之顯示卡散熱座13設有至少-個孔洞16，可，該彈簧片2〇結合之用。 夕一 -主第3圖所示，係為習知之一主機板100，該 一曰片电〗之上表面ι〇1係裝設有一顯示卡no 、至少 更：di進一步’該一顯示卡110之上表面m 121更星口 U2 ，該至少一晶片組120之上表面 21更/、有一散熱平台122。 之组穿特Ξ就本創作之顯示卡及晶片組之散熱組合裝置1 圖，‘士::配合圖式做詳細說明，首先，請參閱第1 凡珉上述將該一整塊散熱板1〇疊設並鎖緊於主 .M265688 士表面ι〇1之前，係先將該一散熱墊50緊密疊設於 ^ ^ 之下表面41，後續則再將該滑塊40裝設於該一整 塊散熱板^之顯示卡散熱座13之下表面，換言之，如第 2曰3及第4圖所示，其中，第4圖係為本創作之顯示卡 及二片組放熱組合裝置1之底視圖，該滑塊40係疊設於顯 =卡散熱座13與顯示卡11〇之散熱平台112之間，另外， 忒政熱墊50係疊設於該滑塊4〇與顯示卡11〇之散熱平台 112之間’在元成上述組裝動作後，再將該至少二散熱管 =裝設於滑塊40之貫穿孔洞42，後續再將該—整塊散熱板 ，由该散熱板10之週邊孔洞15固定於主機板丨⑽之上， 便70成此組I動作，又，由於該滑塊40係可旋轉及調整 ί度、故可將该一整塊散熱板10與該一主機板1〇〇間結合 =之公差，或是該一整塊散熱板10與顯示卡110之散熱平 =112結^之高度差，減少至最小，意即可使該一滑塊4〇 完全平坦疊設於該顯示卡之散熱平台112 ，以提高散熱的 均勻性。 另外，請參閱第5圖，係為本創作之顯示卡及晶片組 ，散，組合裝置丨之上視圖，當完成上述將該一整塊散熱 反10宜。又並鎖緊於主機板100之上時，再將該一具有彈性 浮動式彈簀片20裝設於該一整塊散熱板1〇之上表面12之 上，更具體而言係透過該浮動式彈簧片2〇之至少二固定件 22固定於该一整塊散熱板1〇之至少二孔洞π，將此一浮動 式彈簧片20裝設於該一顯示卡散熱座13上表面之處，可用 以避免該一整塊散熱板10直接壓迫至顯示卡11〇 ，以避免 顯示卡110翹曲或損壞。 當完成上述之組裝動作，係已將該一種顯示卡及晶片 ，之散熱組合裝置1裝設於該一主機板上，並完成所有組 衣動作，因此，請再參見第3圖，當顯示卡11〇作動時所 M265688 發出之勤^暑 # _ 熱管30二於^由該—滑塊_附並傳遞給該至少二散 介質，去〜f 二散熱管3〇内部係容置有纖維及導熱 “n〇T:;真空，該至少二散熱管30之-端接近顯 到達遠離鞀：：冒將滑塊40吸附之熱量攜帶至另-端，當 處，週而^ 之一端時，導熱介質已冷卻並流回原 4的、*禮奴始，该顯不卡110作動時所發出之埶量便能有 ;皮帶八ίί該至少二散熱管30所吸附之熱能，也可 ▼ ^熱風扇處散熱，同樣都可達到散熱之目的，另 主機板：上上=;2= 一”組散熱座14係也與 之散埶平二上片=2〇/妾觸’亚貼附於該晶片組120 12 透過該晶片組散熱座14將晶片組 曰上ΐ 由於該晶片組並非主要的發熱源，此- 曰曰片、、且放熱座14便足以讓晶片組12〇達到散熱冷卻 的0 再如第6圖所示，本創作之—種顯示卡及晶片組之 散熱組合裝置，上述較佳實施例，係揭示於使用至少二 根散熱管幫助散熱，但是並非用以限制本 ^ :吏用至少-根散熱管幫助散熱，另外，該」二二= 官更進一步係也可跨接搭載於處理器之散熱平台，進而 幫助處理器散熱，讓處理器能運作的更有效率。 本創作之一種顯不卡及晶片組之散熱組合裝置在組 裝時，當欲將該一散熱墊50與該滑塊4〇緊密結合前，係 可在於一者間舖上一層絕緣膜，用以隔絕散熱墊與該 滑塊40之導電性。 〃 ~ 本創作之顯示卡及晶片組之散熱組合裝置在組裝完 成後，由於該一整塊散熱板係位於該主機板之上，當= 手提電腦中，该一整塊散熱板更可作為鍵盤的支樓架， 意即該鍵盤係放置於該一整塊散熱板之上，受到該二整 M265688 塊散熱板的支撑，達到節省零件及降低成本的目的。 ㈣整塊散熱板，主要係針對顯示卡及晶片 此= 計，但並非用以限制本創作，因 料、/你f:整塊散熱才反，更可對應電腦元件之主要 ΐ;源；對應之形狀或尺寸之改變及散熱座之不同 3且：=:，習知技術已具備長足顯著之功效 = 成本的專利創作，透過本創作之 決；；ίΐ之熱量一併於該散熱組合裝置中得 佔用太夕*門％月自：部的的空間將不會因散熱裝置而 的問及提供更高的散熱功能克服有關散熱 輸出ΐΐΪΪίΪί設計經驗，乃創作出-種能夠有效 I置，提供更高的散埶率，以另ρ久Μ # 士斤j狀”、、、、且口 此可知，本創作相=降低成本等之優點，由 進。州乍相較於白知做法，已具備顯著功效增 限定=創f以!交佳實施例揭露於上，然其並非用以 精神和ή此項技藝者，在殘離本創作之 二二=做些許之更動與濁飾，因此本創作 當視後附之申請範圍所界定者為準。 j圖式簡單說明】 π巧千 第 第 第 第 。圖係為本創作之主要元件示意圖 乐2圖係為本創作之立體組裝示竟 3圖係為本創作之疊設於主機板上之立體圖 4圖係為賴作之上視目之立體圖 5圖係為本創作之底視圖 ^圖係為本創作另—立體組裝示意圖 主要元件符號說明】 M265688 1 :顯示卡及晶片組散熱組合裝置 10 :散熱板 π:散熱板之下表面 12 :散熱板之上表面 13 :顯示卡散熱座 14 ·晶片組散熱座 15 :與主機板結合之孔洞 16 :與浮動式彈簣片結合之孔洞 20 :浮動式彈簧片 21 :浮動式彈簧片之孔洞 22 :浮動式彈簧片之固定件 30 :散熱管 40 :滑塊 41 ··滑塊之下表面 42 :滑塊之孔洞 50 :散熱墊 100 :主機板 101 ·主機板之上表面 110 :顯示卡 111 :顯示卡之上表面 112 :顯示卡之散熱平台 120 ·晶片組 121 :晶片組之上表面 122 :晶片組之散熱平台M265688 8. Description of the new type: [Technical field to which the new type belongs] This creation is about the dispersal of a graphics card and chipset. More specifically, it mainly refers to the computer ’s heat source through the created graphics card and ^ For example, the graphics card and chipset: '[Previous technology] Regarding the thermal cracking of computer components, it is common practice to design the discrete components on individual computer components, that is, the processor and the processor. (VGA) or chipset (Chips &) on top of each other, but this knowledge is applied to the heat dissipation of individual computer components = 'not only takes up the internal space of the computer case' but also cannot save costs' :, ^ Other computer components': since the heat dissipation device is set up = two on ^ _ small heat dissipation area, its heat conduction efficiency: efficiency: also: when it is not good, of course, the operation of each computer component will have a major impact after use, etc. Poor operation and reduced life will cause user troubles. Therefore, it is necessary to effectively output the graphics card and chipset produced and save during operation: door Γίΐ 冷 = heat dissipation structure, and Can improve heat dissipation area [new type of implementation is urgently to be solved-a big problem. For the sake of knowing the technical problems, the main purpose of this creation is to provide a heat dissipation combination device that uses the heat of the graphics card and chipset to generate heat. The heat dissipation device that takes up too much is separately installed on individual computer components. The Chang Yi method has disadvantages, and overcomes the heat generated by various computer components, reduces the shortage, cannot provide higher heat dissipation rates, and cannot cost M265688. In order to achieve the above purpose, this creative department discloses a type of heat sink combination device. The main characteristics are The design of the individual === j style is added by the whole heat sink: the whole heat sink_zhengshi card and chip set: :: heat dissipation element, and is provided in The heat is used under the entire heat sink to provide higher heat dissipation. 'Even the more detailed content and specific feasibility of this creation are explained with reference to the drawings as follows: [Blade Style] [Implementation] This creation is a type of display card and chip set. The characteristics of the cooling group are the individual cooling devices. Integrated design: ^ Overlaying a heat sink on the graphics card and chipset. 'With this one piece of heat sink, the board adds a lot of heat sinking surface than the known heat sink #, to integrate other heat sink components, It is stacked under the entire heat sink to output more = volume 'to increase the heat dissipation rate of the heat sink and replace the traditional heat sink. Each of them must be installed on the CPU, graphics card and chipset. It occupies a lot of space, and cannot provide a higher heat dissipation function. The following is the production method and implementation steps of the preferred embodiment of the creation, and it is explained in detail with the drawings. First, please refer to FIG. 1. FIG. 1 is a heat dissipation assembly for a graphics card and a chip set of the present invention, which includes a whole heat sink 10, a floating spring sheet 20, and at least two heat sinks. Tube 30, a slider 40, and a heat sink 50. Furthermore, 'the entire heat sink 10 is roughly convex, and the lower surface of the whole heat sink 10 is provided with a g display heat sink 13 which is in contact with the display card, and a chip set The chipset heat sink 14 contacted by the heat dissipation platform. In addition, the spring piece 20 is a flexible floating elastic piece. The upper surface of the elastic piece 20 includes at least two holes 21 and at least two M265688 fixing members 22. , And the at least two heat pipes 30, the slider of the slider angle, and the-slider '0 system contains to :: hole 42' The at least two holes 42 are used to house the: And the thermal conductivity f. ^ One exothermic officer 30. The internal method contains a fiber, a display card and chip set related to the heat sink forming method. The display card and chip set, and the slab 10 are formed by a bad mud. First, h… ,,, 1 1 set of clothing scattered days: the method of the board 10 mega is the implementation of the characteristics of the implementation mode. The following table is shown in the figure below. One of this creation is the entire cooling plate 10 and the parallel seat 13 And the chipset heat sink 14 is plastically deformed by stamping: 2 to form the sheet into an appropriate portion of the lower surface 11 of the plate 10 while a platform is in contact with the graphics card through the sound. The platform is The heat sink 13 and the other platform that is in contact with the chipset, = flat σ is a chipset heat sink 14, wherein the one 2 contains a plurality of fine parts that can be combined with the motherboard ^; one: ηι1 hot plate 10 The display card heat sink 13 on the upper surface 12 is provided with at least one hole 16. However, the spring sheet 20 can be used in combination. Xiyi-the main picture 3, is a conventional motherboard 100, which is a chip on the top surface ι〇1 is equipped with a graphics card no, at least more: di further 'the graphics card 110 The upper surface m 121 further has a star opening U2, and the upper surface 21 of the at least one chipset 120 further has a heat dissipation platform 122. The group wears the heat dissipation combination device 1 of the graphics card and chip set created in this picture. 'Shi :: with the pattern to make a detailed description. First, please refer to No. 1 where the entire heat sink 1 is described above. Before being stacked and locked on the main surface of the M265688, the heat dissipation pad 50 is closely stacked on the lower surface 41 of the ^ ^, and then the slider 40 is installed on the entire block. The lower surface of the heat dissipation plate 13 of the heat dissipation plate ^, in other words, as shown in Figure 2 and Figure 3, where Figure 4 is a bottom view of the creative display card and two-piece heat radiation combination device 1 The slider 40 is stacked between the display card heat sink 13 and the cooling platform 112 of the display card 11o. In addition, the thermal pad 50 is stacked between the slider 40 and the display card 11o. Between the platforms 112 ', after Yuancheng's assembling action above, the at least two heat pipes = installed in the through holes 42 of the slider 40, and then the entire heat sink plate and the surrounding holes of the heat sink plate 10 15 is fixed on the main board 丨 70, then 70% of this group I action, and because the slider 40 can be rotated and adjusted, so it can be The tolerance between the combination of a whole heat sink 10 and the motherboard 100, or the height difference between the heat dissipation level of the whole heat sink 10 and the display card 110 = 112 knots, is reduced to a minimum, meaning that The slider 40 can be completely flatly stacked on the heat dissipation platform 112 of the display card to improve the uniformity of heat dissipation. In addition, please refer to Figure 5, which is the top view of the display card and chipset, fan, and combination device for this creation. When the above is completed, the entire block should be cooled down. When it is locked on the main board 100 again, the elastic floating elastic piece 20 is mounted on the upper surface 12 of the entire heat sink 10, more specifically, through the floating At least two fixing members 22 of the spring plate 20 are fixed to at least two holes π of the entire heat sink 10, and a floating spring plate 20 is mounted on the upper surface of the heat sink 13 of the display card. It can be used to prevent the entire heat sink 10 from being directly pressed to the display card 110 to avoid warping or damage of the display card 110. When the above assembly operation is completed, the display card and chip have been installed, and the heat dissipation combination device 1 is installed on the motherboard, and all the clothing operations are completed. Therefore, please refer to FIG. 3 again when the display card 11〇 When the operation is performed, M265688 issued by ^^ ## The heat pipe 30 二 于 ^ is attached to the slider and passed to the at least two bulk media. Go to f. The heat pipe 30 contains fibers and heat conduction inside. "N〇T:; Vacuum, the -end of the at least two heat sinks 30 is close to the far end and is far away from 鼗 :: The heat absorbed by the slider 40 is carried to the other-end, and when one end is everywhere, the heat transfer medium After cooling down and flowing back to the original 4, after the start of the ceremony, the amount of heat emitted by the display card 110 when it is actuated can be provided; the belt is eight and the heat energy absorbed by the at least two heat pipes 30 can also be ▼ ^ Hot fan Cooling everywhere can also achieve the purpose of heat dissipation. Another motherboard: upper upper =; 2 = one "group of heat sink 14 series is also scattered with flat two upper chip = 2〇 / 妾 touch 'sub-attach to the chip Group 120 12 puts the chipset on the chipset through the chipset heat sink 14 Since the chipset is not the main heat source, this- The chip and the exothermic seat 14 are enough to allow the chipset 120 to reach 0 for heat dissipation and cooling. As shown in FIG. 6, this creation—a type of display card and chipset heat dissipation combination device. The above-mentioned preferred embodiments are disclosed. It uses at least two heat pipes to help dissipate heat, but it is not intended to limit the problem ^: Officials use at least-one heat pipe to help dissipate heat. In addition, the "second two = official further can also be connected to the processor's cooling platform , Thereby helping the processor to dissipate heat, so that the processor can operate more efficiently. When assembling a heat sink combination device of a display card and a chip set in this creation, when a heat sink 50 is to be tightly combined with the slider 40, an insulating film may be laid between them for The thermal conductivity between the heat dissipation pad and the slider 40 is isolated. 〃 ~ After the assembly of the heat dissipation assembly of the graphics card and chip set in this creation is completed, because the entire heat sink is located on the motherboard, when = a laptop computer, the whole heat sink can be used as a keyboard The supporting frame means that the keyboard is placed on the entire heat sink and supported by the two whole M265688 heat sinks, so as to save parts and reduce costs. ㈣ The entire heat sink is mainly for graphics cards and chips, but it is not intended to limit this creation. Because of the material, you can only reverse the heat dissipation of the whole, and can also correspond to the main components of computer components. Source; Correspondence The shape or size changes and the difference between the heat sink 3 and: = :, the conventional technology has a significant effect = cost of the patent creation, through the decision of this creation; the heat of the heat is also included in the cooling combination device I have to occupy the door of the door of the night. The space of the ministry will not be asked by the heat dissipation device to provide a higher heat dissipation function. Overcome the design experience of heat dissipation. It is a kind of effective design that can provide more The high rate of dispersal is based on another ρ 久 Μ # 士 斤 j 状 ”,,,, and other words, the advantages of this creative phase = cost reduction, etc., from the beginning. Compared with Baizhi practices, the state has Significant effect increase limit = creative facsimile! The embodiment of Jiaojia was disclosed above, but it is not used for the spirit and price of this skill, leaving the second part of this creation = making some changes and decoration, so this creation Subject to the scope of the attached application. J Brief description of the drawings] π Qiaoqian No.1. The picture shows the main components of the creation. 2 The picture shows the three-dimensional assembly of the creation. 3 The picture shows the three-dimensional view of the creation superimposed on the motherboard. 4 The picture is a three-dimensional view of Lai Zuo's eyes. The picture is the bottom view of the creation. The picture is another creation. The three-dimensional assembly diagram illustrates the main component symbols.] M265688 1: Display card and chip set cooling assembly 10: Heat dissipation Plate π: lower surface of the heat sink 12: upper surface of the heat sink 13: heat sink of the graphics card 14 · heat sink of the chipset 15: hole combined with the motherboard 16: hole combined with the floating elastic sheet 20: floating Spring leaf 21: Hole of floating spring leaf 22: Fixing piece of floating spring leaf 30: Heat pipe 40: Slider 41 · Lower surface of slider 42: Hole of slider 50: Heat sink 100: Main board 101 The upper surface of the motherboard 110: the display card 111: the upper surface of the display card 112: the heat dissipation platform 120 of the graphics card · the chipset 121: the upper surface of the chipset 122: the heat dissipation platform of the chipset