201004720 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種塗膠分配方法，尤其是指一種藉 由控制點膠器之點膠頭的移動速度，使其所輸出之膠液量 能夠精準且均勻的喷塗在基板上。 【先前技術】 按，在印刷電路板之基板的製造過程當中，常常需要 塗覆一些黏性之材料，如膠液，以利用所塗覆之黏性之膠 液將電子零件固定在基板上。而就該黏性膠液塗覆於基板 上時必須是均勻的，以使電子零件能夠被確實安裝在基板 上，同時又不會影響該基板上之電路的運作，因此設計一 個可將膠液確實均勻塗覆在基板上之方式便成為不斷追 求電路小型化之製程的重點課題。 請參閱我國在97年2月11日公告之第93114343號 「由一分配器將黏性材料分配至一基板上之方法」發明專 利案，該方法包括： 提供一代表欲被分配至該基板上之該黏性材料之一 目標量的目標値及一代表欲被分配於該基板上之目標値 上之一長度的長度値； 操作該分配器，以便將一第一複數分別數量之黏性材 料塗敷至一校正表面上； 產生一回饋信號，該回饋信號代表被塗敷至該校正表 面上之該等第一複數分別數量之黏性材料中所包含之一 被量測黏性材料量； 決定該分配器與該基板間相對運動之一速度値，此將 導致該黏性材料之目標量被分配在該基板上之該長度 5 201004720 i材=^縣度_代表為-第二㈣分職量之黏 該速度舞㈣分配11域基板上’⑽將該等第 _表:^黏崎料塗敷至職板上之該長度値 至-已提供—種可將黏性材料分配 板上之方法’“發明人為滿足業者的不201004720 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a glue dispensing method, and more particularly to a glue amount that is output by controlling the moving speed of a dispensing head of a dispenser It can be sprayed on the substrate accurately and evenly. [Prior Art] In the manufacturing process of a substrate of a printed circuit board, it is often necessary to apply a viscous material such as a glue to fix the electronic component on the substrate by using the applied viscous glue. When the adhesive glue is applied to the substrate, it must be uniform, so that the electronic component can be surely mounted on the substrate without affecting the operation of the circuit on the substrate, so that a glue can be designed. The method of uniformly coating on the substrate has become a key issue in the process of continuously pursuing circuit miniaturization. Please refer to the invention patent of No. 93314343, "Distributing a viscous material to a substrate by a dispenser", which comprises: providing a representative to be distributed to the substrate a target of the target amount of the viscous material and a length 之一 representing a length of one of the target ridges to be distributed on the substrate; operating the dispenser to apply a first plurality of viscous materials Applying to a correction surface; generating a feedback signal representative of the amount of the viscous material contained in one of the first plurality of viscous materials applied to the correction surface; Determining a speed 値 of the relative movement between the dispenser and the substrate, which causes the target amount of the viscous material to be distributed on the substrate. The length of the material is 5 201004720. The material = ^ county degree _ represents - second (four) points The viscosity of the position of the speed dance (four) allocated on the 11-domain substrate '(10) the first _ table: ^ the thickness of the adhesive coated onto the vocational board 値 to - has been provided - can be placed on the viscous material Method of 'inventor to satisfy the operator Do not
^乃，孜孜不倦之精神，並藉由其豐富之專業知I =膠量及出膠時間經驗值，以得到點膠二s 2方t所輸出之驗i能夠鮮且㈣时塗在基板上 【發明内容】 $明之塗膠分配方法的主要目的，係在提供一種透 f期望的總出膠量及實際出膠量的反覆校正，而得到一正 時間後’再利用該時間與該對應欲喷塗膠液之長 膠器之點膠頭的移動速度，以藉此令基板上之 所喷塗之膠液量能夠更為精準及均勻。 而為達上述本發明之塗膠分配方法的目的與功效，本 月之塗膠分配方法主要係先設定期望的總出膠量，並以 點膠頭在-單位時間内喷出一測試膠量於校正單元，再透 過校正單元量測所擠出之膠液重量，再將該膠液重量與期 望的總出膠量比較’若實際出膠量大於期望的總出膠量則 縮短出膠時間’若實際出膠量小於期望的總出膠量則延長 出，時間，直到實際出膠量符合期望的總出膠量後，再以 該得到之出膠時間及對應欲噴塗膠液之長度二數據計算 6 201004720 得到該出點膠器之點膠頭的移動球 基板上之膠液的量能夠精準及均句度，而達點膠器喷塗於 【實施方式】 <效果。 為令本發明所運用之技術内W 功效有更完整且清楚的揭露，⑼翻目的及其達成之 併參閱所揭之圖式及圖號：；下詳細說明之’並請一 首先’清參閱第一圖所示，龙a 構示意圖。該控制系統⑴具有_：=點膠器的控制系統架^Yes, the spirit of tirelessness, and through its rich professional knowledge I = glue amount and glue time experience value, to get the test of the output of the two s 2 squares of the dispensing i can be fresh and (4) coated on the substrate [ SUMMARY OF THE INVENTION The main purpose of the method for dispensing the glue is to provide a reverse correction of the desired total amount of glue dispensed and the actual amount of glue dispensed, and after obtaining a positive time, 'reuse the time and the corresponding spray The moving speed of the dispensing head of the long glue of the glue solution can thereby make the amount of the glue sprayed on the substrate more precise and uniform. In order to achieve the purpose and efficacy of the above-mentioned glue dispensing method of the present invention, this month's glue dispensing method mainly sets the desired total amount of glue, and sprays a test glue amount in a unit time. In the calibration unit, the weight of the glue that is squeezed out is measured by the correction unit, and the weight of the glue is compared with the desired total amount of glue. If the actual amount of glue is greater than the desired total amount of glue, the time is shortened. 'If the actual amount of glue is less than the expected total amount of glue, the time will be extended until the actual amount of glue meets the desired total amount of glue, and then the time of the glue is obtained and the length of the corresponding glue is required. Data calculation 6 201004720 The amount of glue on the moving ball substrate of the dispensing head of the dispenser can be accurately and uniformly sentenced, and the glue dispenser is sprayed on the [embodiment] <effect. In order to achieve a more complete and clear disclosure of the efficacy of the technology used in the present invention, (9) reconcile the purpose and achieve the reference to the illustrated figure and figure number: the following detailed description and 'first please' The first figure shows the dragon a structure. The control system (1) has a control system rack of _:= dispenser
透過運動㈣ϋ⑽連接至XYZ=m該電腦^) 膠器之點膠頭⑵於X、γ、z轴^動1503)，以驅動點 (⑷’與電腦（11)連線，並控制點膠頭之又， 該電腦（11)尚與一校正單元（15)連 夕， ^ 運線，該校正單元（15)為 質量校正天平;一點膠溫度控制器⑽與該電腦 線’以控制該點膠頭⑵内之膠液處於怪溫狀態， :使膠液簡-定之_度，進而令其塗覆在基板上時具 備一定之擴散速度。 當電腦（11)接收到轉量校正的命令後，便會透過電 腦（11)經運動控制器（12)驅動χγζ軸驅動器作動，以將該 點膠頭⑵位移至校正單元⑽處，以開始進行出膠量校 正的動作。杈正時，在點膠頭（2)移位的過程中，該電腦 (11)藉由點膠控制器（丨4)控制著點膠頭（2)以定速之方式 擠出勝液’同時以點膠溫度控制器（16)控制該點膠頭（2) 内之膠液之溫度，使點膠頭（2)内之膠液保持一定之黏稠 度與塗覆在基板上後的擴散速度。 另’請再參閱第二圖所示，其係本發明之「塗膠分配 方法」的步驟流程圖。 201004720 本發明之「塗膠分配方法」包括以下步驟【請同時併 參第一圖】： (a) 係先透過電腦（11)選擇進行所需塗覆膠液之重量測試 作業，並在電腦（11)上進行設定所預期之總出膠量的 期望值； (b) 同時並設定一單位時間，並在該單位時間内定速擠出 膠液； (c) 接著以電腦（11)並經運動控制器（12)操控XYZ軸驅動 φ 器（13)連動該點膠頭（2)位移至對應校正單元（15)處； ' (d)由點膠控制器（14)依據所設定之出膠單位時間内之時 間内操控該點膠頭（2)擠出膠液於校正單元（15)上； (e) 透過該精密之校正單元（15)量測於該出膠時間内所擠 出之膠液的總重量，並將此一總重量值傳回電腦（11); (f) 該電腦（11)便依據所傳回之在該出膠時間内所擠出之 膠液的總重量值與期望的總出膠量比較，若實際出膠 量大於期望的總出膠量則透過點膠控制器（14)縮短點 φ 膠頭（2)的出膠時間，若實際出膠量小於期望的總出膠 量則同樣透過點膠控制器（14)延長點膠頭（2)的出膠 時間； (g) 重複執行步驟（f)，直到實際出膠量符合期望的總出膠 量； (h) 當實際出膠量符合期望的總出膠量後，該電腦（11)再 以該得到之出膠時間及所對應欲喷塗膠液之長度二數 據計算得到在對應塗覆的距離内該點膠頭（2)所需的 移動速度。 簡而言之，本發明之塗膠分配方法主要係欲在一已知 8 201004720 的固定長度上均勻喷塗一固定之期望膠液量，而為達此一 目的，故先於校正單元（15)上於單位時間内喷塗膠液，再 由該校正單元（15)量測該測試膠液量之重量，並將此一測 試膠液量之重量與期望膠液量之重量相比較，若測試膠液 量之重量小於期望膠液量之重量則增加喷塗膠液時間，若 測試膠液量之重量大於期望膠液量之重量則減少喷塗膠 液時間，重複執行此動作至符合期望膠液量之重量的合理 誤差内後，再擷取其喷塗之時間值，作為實際喷塗膠液之 時間，最後再對應欲喷塗膠液之長度便可求得點膠頭（2) 所需之移動速度。 綜上所述，本發明實施例確能達到所預期之使用功 效，又其所揭露之具體構造，不僅未曾見諸於同類產品 中，亦未曾公開於申請前，誠已完全符合專利法之規定與 要求，爰依法提出發明專利之申請，懇請惠予審查，並賜 准專利，則實感德便。 201004720 【圖式簡單說明】 第一圖：本發明之點膠器的控制系統架構示意圖 第二圖：本發明之塗膠分配方法的步驟流程圖 【主要元件符號說明】Connect to XYZ=m through the motion (4)ϋ(10)^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Moreover, the computer (11) is still in conjunction with a correction unit (15), ^ line, the correction unit (15) is a mass correction balance; a glue temperature controller (10) and the computer line 'to control the point The glue in the rubber head (2) is in a strange temperature state, so that the glue liquid is set to a certain degree, so that it has a certain diffusion speed when it is coated on the substrate. When the computer (11) receives the command of the rotation correction Then, the χγ ζ axis driver is driven by the motion controller (12) through the computer (11) to displace the dispensing head (2) to the correction unit (10) to start the action of correcting the glue amount. During the shifting of the dispensing head (2), the computer (11) controls the dispensing head (2) by means of a dispensing controller (丨4) to squeeze the winning liquid at a constant speed while simultaneously dispensing the temperature. The controller (16) controls the temperature of the glue in the dispensing head (2) so that the glue in the dispensing head (2) maintains a certain consistency and is coated with The diffusion speed after the plate is also shown in the second figure, which is a flow chart of the steps of the "gluing distribution method" of the present invention. 201004720 The "gluing distribution method" of the present invention includes the following steps. And refer to the first picture]: (a) Firstly, through the computer (11), select the weight test of the required coating glue, and set the expected value of the total amount of glue expected on the computer (11); b) Simultaneously set a unit time and extrude the glue at a constant speed within the unit time; (c) Then operate the XYZ axis drive φ device (13) with the computer (11) and via the motion controller (12). The rubber head (2) is displaced to the corresponding correction unit (15); '(d) The dispensing controller (14) controls the dispensing head according to the set time of dispensing the glue (2) The liquid is applied to the calibration unit (15); (e) the total weight of the glue squeezed during the dispensing time is measured by the precision calibration unit (15), and the total weight value is transmitted back to the computer ( 11); (f) The computer (11) is based on the total weight of the glue that is passed back during the dispensing time. Compared with the expected total amount of glue, if the actual amount of glue is greater than the desired total amount of glue, the dispensing time of the point φ head (2) is shortened by the dispensing controller (14), if the actual amount of glue is less than expected The total amount of glue is also extended by the dispensing controller (14) to extend the dispensing time of the dispensing head (2); (g) Repeat step (f) until the actual amount of glue meets the desired total amount of glue; (h) After the actual amount of glue is in accordance with the desired total amount of glue, the computer (11) calculates the distance at the corresponding coating by using the obtained glue time and the length of the corresponding glue to be sprayed. The required moving speed of the dispensing head (2). Briefly, the glue dispensing method of the present invention is mainly intended to uniformly spray a fixed amount of the desired glue on a fixed length of the known 8 201004720, and for this purpose, it is prior to the correction unit (15). Spraying the glue on the unit time, and then measuring the weight of the test glue by the calibration unit (15), and comparing the weight of the test glue amount with the weight of the desired glue amount, if If the weight of the test glue is less than the weight of the desired glue amount, the time of spraying the glue is increased. If the weight of the test glue is greater than the weight of the desired glue amount, the time of spraying the glue is reduced, and the action is repeated until the desired one is met. After the reasonable error of the weight of the glue, the time value of the spraying is taken as the time of spraying the glue, and finally the dispensing head can be obtained according to the length of the glue to be sprayed (2) The speed of movement required. In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific structure disclosed therein has not been seen in similar products, nor has it been disclosed before the application, and has completely complied with the provisions of the Patent Law. And the request, the application for the invention of a patent in accordance with the law, please forgive the review, and grant the patent, it is really sensible. 201004720 [Simplified description of the drawings] First: Schematic diagram of the control system architecture of the dispenser of the present invention. Second diagram: Flow chart of the steps of the glue dispensing method of the present invention.
(1) 控制系統 (11) 電腦 (12) 運動控制器 (13) XYZ軸驅動器 (14) 點膠控制器 (15) 校正單元 (16) 點膠溫度控制器 (2) 點膠頭 10(1) Control system (11) Computer (12) Motion controller (13) XYZ axis driver (14) Dispensing controller (15) Correction unit (16) Dispensing temperature controller (2) Dispensing head 10