200947506 六、發明說明： 【發明所屬之技術領域】 本發明是有關於被使用於液晶電視機或個人電腦的背 面光光源等的放電燈及放電燈的製造方法。 【先前技術】 近年來，作爲被使用於液晶電視機等的光源，成爲被 使用著如日本特開2004-146351號公報（以下，專利文獻 1)的外部電極螢光燈或在如日本特開2006-394593號公 報（以下，專利文獻2)的玻璃燈泡的外面具有與內部電 極電性地連接的饋電端子的冷陰螢光燈。這些燈是在如專 利文獻2的第1〇圖的燈座120的背面光側的固定手段， 僅嵌入外部電極或饋電端子，就可做機械性連接與電性連 接。習知，在外部電極或饋電端子，使用著藉由浸焊等方 法所形成的焊料層。 但是’焊料層是有散熱效果低，容易剝落等的問題。 如此’在如日本特開2006-40857號公報（以下，專利文 獻3) ’或日本特開2005-5265號公報（以下，專利文獻 4) ’提案一種將筒狀的金屬體與焊料層形成於玻璃燈泡 的端部的放電燈的發明。 [專利文獻1 ] 曰本特開2004-146351號公報 [專利文獻2 ] 曰本特開2006-294593號公報 200947506 [專利文獻3] 曰本特開2006-4 0857號公報 [專利文獻4] 日本特開2005-5265號公報 【發明內容】 然而，在如專利文獻3或專利文獻4的放電燈，若受 到彎曲應力，或是落下，就會發生損壞玻璃燈泡的不方便 〇 本發明的目的是在於提供一種玻璃燈泡不容易損壞的 放電燈及放電燈的製造方法， 爲了達成上述目的，本發明的放電燈，屬於具備：玻 璃燈泡，及形成於上述玻璃燈泡的端部的焊料層，及被覆 設於上述玻璃燈泡的端部成爲與上述焊料層電性地導通的 金屬體，其特徵爲： 在上述金屬體的前端側與上述玻璃燈泡之間形成有非 緊貼層。 依照本發明，可抑制玻璃燈泡的損壞。 【實施方式】 (第1實施形態） 以下，針對於本發明的實施形態的放電燈參照圖式加 以說明。第1圖是表示用於說明針對於本發明的第1實施 形態的放電燈的圖式。 -6- 200947506 本實施形態的放電燈的主要部，是由例如硼矽酸玻璃 等的硬質玻璃所成的玻璃燈泡1所構成。在該玻璃燈泡1 的內部形成有放電空間11，在放電空間11被封入有氖Ne 與氫Ar的混合氣體所成的稀有氣體與水銀Hg。又，在玻 璃燈泡1的內面，形成有例如RGB的3波長螢光體所成 的螢光體層2。 在玻璃燈泡1的兩端部，作爲將電力供應於燈的饋電 端子形成有金屬端子3。該金屬端子3是以焊料層31與 金屬體3 2所構成。 焊料層31是形成於玻璃燈泡1的端部。在該焊料層 31的材料，可將添加銻Sb、鋅Zn、鋁A1等的焊料使用 於錫Sn、錫Sn與銦In的合金，錫sn與鉍Bi的合金等 〇 金屬體32是與焊料層31電性地導通般地，並將薄金 屬被重疊其一部分般地重捲的兩端作成開口的筒狀金屬， 被覆設於玻璃燈泡1的端部。作爲該金屬體32的材料， 使用接近於玻璃燈泡1的熱脹係數的材料較佳，例如按照 玻璃燈泡1的材料的熱脹係數，可使用鐵Fe、鎳Ni、銅 Cu、鈷Co、鉻Cr的單體或合金，又，在金屬體32的表 面，施加銅Cu、錫Sn、鋅Zn'銀Ag、金Au、鎳Ni等 的鍍金屬也可以。 在此，針對於金屬端子3的構造，參照第2圖更詳細 地說明。第2圖是表示用於說明第1圖的—點鏈線X部 分的擴大圖。 -7- 200947506 由圖可知，焊料層31是以第1焊料層311、第2焊 料層312及第3焊料層313所構成。第1焊料層311是與 玻璃燈泡1緊貼，惟與金屬體3 2未緊貼的焊料層，以0 mm<d$0.07mm左右的厚度形成於玻璃燈泡1端部的表面 。第2焊料層3 12是形成於金屬體32的後端側，亦即形 成於玻璃燈泡1的端部3 2 1側，緊貼於第1焊料層3 1 1與 金屬體32的焊料層。亦即，第2焊料層311是成爲進行 第1焊料層311與金屬體32的電性連接的部分。又，第 2焊料層312是從金屬體32的後端突出所形成。又，在 第2圖以虛線表示第1焊料層311與第2焊料層312的境 界，惟實際的狀態未存在此種境界。第3焊料層313是緊 貼於金屬體32的外表面的焊料層。 利用此些第1焊料層311與第2焊料層312，在金屬 體32的前端側，亦即距玻璃燈泡1的端部較遠的一側的 端部3 22的內表面與第1焊料層311的外表面之間，形成 有非緊貼層4。該非緊貼層4的適當尺寸，是將非緊貼層 4的管軸方向的長度作爲L時，則Lg 1.0mm，較佳爲L 2 3.0mm。又，所謂「緊貼」是指牢固地連結構件彼此間 的狀態。亦即，在構件間具有間隙之狀態，而僅接觸的狀 態並不是緊貼，而是非緊貼。 一面參照第3圖一面說明金屬端子3的一形成方法。 首先，如（a )所示地，在充滿熔融焊料5 1的焊料槽 5，浸漬密封兩端的玻璃燈泡1的一端，如（b )所示地緊 貼形成第1焊料層311。這時候，藉由超音波振動子52 -8 - 200947506 而進行浸漬於施加超音波振動的熔融焊料的所謂超音波浸 焊，提昇玻璃燈泡1與第1焊料層311的溶合較佳。之後 ’第1焊料層31 1被固化，亦即充分地乾燥之後，如（c )所示地在形成有第1焊料層311的玻璃燈泡〗部分覆設 金屬體32。 之後’將玻璃燈泡1與金屬體32的固定強度充分地 保持程度的金屬體32部分，例如從後端金屬體32的2/3 左右’如（d )所示地浸漬於熔融焊接5 1，形成緊貼於第 1焊料層311與金屬體32的第2焊料層312，該步驟，也 與（a)時同樣，進行超音波浸焊，提昇對於玻璃燈泡1 與金屬體3 2之間的間隙的焊劑的塡充率較佳。然後，停 止超音波振動子52的動作，在作成未進行超音波振動的 狀態的溶融焊料51，如（e)所示地，浸漬所剩下的金屬 體32，而在金屬體32的外表面全體形成第3焊料層313 。由此’在玻璃燈泡1與金屬體32的前端側之間形成非 緊貼層4下’在金屬體32的外表面全體可形成焊料。又 ’非緊貼層4的軸方向長度l是在（d)的步驟中，藉由 浸漬於熔融焊料51的金屬體32長度可變化，最後，從焊 料層5拉出玻璃燈泡〗，此時將朝金屬體32的後端側延 伸的尾巴狀焊料推擠至台等予以成形，而可形成如（f) 所示的金屬端子3。 以下’表示本發明的放電燈的本實施例的一規格。 玻璃燈泡1 : ER-N (日本電氣玻璃股份有限公司的玻 璃）、內徑=2.〇mm、外徑 R = 3.0mm、全長=960mm、 200947506 放電媒體：氖Ne +氬Ar、水銀Hg、 螢光體層2 ; RGB的3波長螢光體、 金屬端子3 ;形成長度= 25mm、 焊料層31: 「雪拉索耳薩」（音譯）（日本黑田科 技製的焊料，錫Sn-鋅Zn-鉍Sb)， 金屬體32:重捲厚度0.1mm的47合金（鎳：47%、 鐵=5 3 %的合金）所形成，在表面鍍銀Ag， 非緊貼層4 ;長度L = 7.0mm、間隔D =最大0.07mm。 製作焊料完全地塡充於上述實施例的放電燈與金屬體 及玻璃燈泡之間的習知的放電燈各5支，進行破損強度試 驗。將其結果表示於第4圖。又，如第12圖所示地，該 試驗是以固定具12固定距放電燈1的管端40mm部分的 狀態下，以推挽規13推壓軸方向的長度2 5 mm的金屬體 32的軸方向的中央附近，亦即，距管端12.5mm部分一直 到破損等爲止，進行測定此時的負荷的方法者。 由結果，可知實施例的燈是破損負荷全體上較大’惟 以習知例的第2燈與第5燈的破損負荷極端小’該原因是 在於燈的破損部位。具體上’第2燈與第5燈是破損金屬 體32的前端322部的玻璃燈泡1 ’該部分322是當牢固 地固定著金屬體32與玻璃燈泡1’則藉由槓桿原理而容 易集中應力，所以’即使小負荷也會破損。對此’實施例 的燈是利用形成於金屬體3 2的前端3 2 2側與玻璃燈泡1 之間的非緊貼層4 ’防止對於該部分3 22的應力集中之故 200947506 ’因而可能在小破損負荷下不會破損° 以下，針對於非緊貼層4的長度L不同的燈’進行施 加〇.4kaf的負荷，是否會破損的試驗。將其結果表不於 第5圖。 由結果，可知非緊貼層4的長度愈長’愈不容易破損 。尤其是，若長度L爲1 .〇mm以上，則破損率降低，又 ’若長度L爲3.0mm以上’則破損率成爲〇%。因此’非 緊貼層4的長度L，是Lgl.Omm，較佳爲L23.0mm。但 是，未緊貼的領域變大，則容易剝離之故，因而非緊貼層 4的長度L是LglOmm較佳。 因此，在第1實施形態中，形成與玻璃燈泡1緊貼， 而與金屬體32未緊貼的第1焊料層311，形成於金屬體 32的至少一部分，而緊貼於第1焊料層311與金屬體32 的第2焊料層312，緊貼於金屬體32的外表面全體的第3 焊料層313所構成的焊料層31，在金屬體32的前端側與 玻璃燈泡1之間形成非緊貼層4，由此，可抑制金屬體32 前端的玻璃燈泡1部分的應力集中之故，因而可實現該部 分不容易破損，且金屬體32表面不容易腐蝕等的放電燈 。又，將非緊貼層4的長度作爲L時，則可滿足L2 1 .Omm之故，因而可作成不容易破損。 又，藉由進行將玻璃燈泡的端部浸漬於施加超音波振 動的熔融焊料51，形成緊貼於玻璃燈泡1的第1焊料層 311的步驟；及固化第1焊料層311之後，在形成有第1 焊料層311的玻璃燈泡1部分覆設金屬體32的步驟；及 -11 - 200947506 將金屬體32的後端側的浸漬於施加超音波振動的熔融焊 料51’形成緊貼於第丨焊料層311與金屬體32的第2焊 料層312的步驟；及浸漬於未施加超音波振動到金屬體 32的前端側的熔融焊料51，形成緊貼於金屬體32的外表 面的第3焊料層313的步驟，在金屬體32的外表面形成 焊料下’在玻璃燈泡1與金屬體32的前端側之間可形成 非緊貼層4。 (第2實施形態） 第6圖是表示用於說明本發明的第2實施形態的放電 燈的圖式。針對於之後的實施形態的各部，與第1實施形 態的放電燈的各部同一部分是以同一符號表示，而省略其 說明。 在第2實施形態中，在金屬體32的外表面來形成有 第3焊料層313，因此，在本實施形態中，將放電燈固定 於背面光之際，以背面光側的燈座可保持金屬體32部分 之故，因而可防止藉由與焊料之摩擦使得焊料被剝落，而 該被剝落的焊料附著於放電燈的發光領域等的問題之發生 ，又，針對於本實施形態的5支燈，進行與第4圖相同試 驗之結果，確認了金屬體32前端的玻璃燈泡1部分不會 破損，而與第1實施形態同樣地不容易破損。 又，如第6圖的狀態，是藉由將玻璃燈泡1的端部浸 漬於施加超音波振動的熔融焊料51，形成緊貼於玻璃燈 泡1的第1焊料層311的步驟；及固化第1焊料層311之 -12- 200947506 後，在形成有第1焊料層3 1 1的玻璃燈泡1部分覆設金屬 體32的步驟；及一面冷卻金屬體32的前端側，一面加熱 後端側，形成緊貼於第1焊料層311與金屬體32的第2 焊料層312的步驟可形成。又，非緊貼層4長度L是藉由 變更冷卻範圍與加熱範圍，容易地可調整。 (第3實施形態） 第7圖是表示用於說明針對於本發明的第3實施形態 〇 的放電燈的圖式。 在第3實施形態中，在金屬體32的前端側與玻璃燈 泡1之間僅介有非緊貼層4。亦即，如第1、2實施形態 地在金屬體3 2的前端側的玻璃燈泡1之間未形成有焊料 。在此種實施形態中，也可得到與第1實施形態同樣的效 果。 Λ (第4實施形態） 第8圖是表示用於說明針對於本發明的第4實施形態 的放電燈的圖式。 在第4實施形態中，在金屬體32的內表面全體緊貼 有第2焊料層312，惟在金屬體32的前端側的第2焊料 層312與玻璃燈泡1之間形成非緊貼層4。在此種實施形 態中，也可得到與第1實施形態同樣的效果。 (第5實施形態） -13- 200947506 第9圖是表示用於說明針對於本發明的第5實施形態 的放電燈的圖式。 在第5實施形態中，在玻璃燈泡1的外表面形成有第 1焊料層311，且在金屬體32的內表面全體形成有第2焊 料層312，惟在金屬體32前端側的第1焊料層311與第2 焊料層312之間形成有非緊貼層4。在此種實施形態中， 也可得到與第1實施形態同樣的效果。又，在此種放電燈 ，是將在內表面事先形成焊料的金屬體32，使用在第3 圖的（c)的步驟就可實現。 (第6實施形態） 第10圖是表示用於說明針對於本發明的第6實施形 態的放電燈的圖式。 在第6實施形態中，在密封有電極61，內部導線62 ，外部導線63及珠形玻璃64所成的電極座5的玻璃燈泡 1’有非緊貼層4介設於金屬體32的前端側與第1焊料層 311之間的方式形成金屬端子3。亦即，成爲在冷陰極螢 光燈的端部形成金屬端子3。在此種形態中，也可得到與 第1實施形態同樣的效果。 又，本發明的實施形態是並不被限定於上述，例如如 下地，變更也可以。 金屬體32是並不被限定於重捲金屬板者，例如狀 也可以’利用銷模所射出等的方法所形成者也可以。使用 於第1焊料層311’第2焊料層312及第3焊料層313的 -14- 200947506 材料是並不被限定於同一材料，例如’第丨焊料層311是 使用與玻璃的緊貼性優異的材料，而第2焊料層312及第 3焊料層313是使用與金屬的緊貼性優異的材料等，組合 不相同的材料也可以。 如第11圖所示地，第3焊料層312是僅形成於金屬 體32的後端側的狀態也可以。這時候，與第2實施形態 同樣地’可防止與燈座之摩擦所導致的焊料之剝落。又， 如第11圖的燈是在第3圖的製造方法中，省略（e)的步 •驟就可形成。 非緊貼層4是並不需在其全部形成有間隙，而是一部 分作成接觸也可以。 【圖式簡單說明】 第1圖是表示用於說明針對於本發明的第1實施形態 的放電燈的圖式。 _ 第2圖是表示用於說明第1圖的一點鏈線X部分的BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a discharge lamp and a discharge lamp for use in a back light source or the like used in a liquid crystal television or a personal computer. [Prior Art] In recent years, an external electrode fluorescent lamp that is used in a light source such as a liquid crystal television or the like is disclosed in Japanese Laid-Open Patent Publication No. 2004-146351 (hereinafter, Patent Document 1). A cold fluorescent lamp having a feed terminal electrically connected to an internal electrode is provided on the outer surface of the glass bulb of JP-A-2006-394593 (hereinafter, Patent Document 2). These lamps are fixed means on the back side of the lamp holder 120 as shown in the first drawing of Patent Document 2, and can be mechanically and electrically connected only by embedding an external electrode or a feed terminal. Conventionally, a solder layer formed by a method such as dip soldering is used for the external electrode or the feed terminal. However, the solder layer has a problem that the heat dissipation effect is low and it is easy to peel off. In the case of the Japanese Patent Publication No. 2006-40857 (hereinafter, Patent Document 3) or Japanese Patent Laid-Open Publication No. 2005-5265 (hereinafter, Patent Document 4), it is proposed to form a cylindrical metal body and a solder layer. Invention of a discharge lamp at the end of a glass bulb. [Patent Document 1] Japanese Patent Application Laid-Open No. Hei. No. Hei. No. Hei. No. 2006-294593. However, in the discharge lamp of Patent Document 3 or Patent Document 4, if it is subjected to bending stress or falling, inconvenience of damaging the glass bulb occurs, and the object of the present invention is In order to achieve the above object, a discharge lamp of the present invention includes a glass bulb, a solder layer formed at an end portion of the glass bulb, and a coating for providing the discharge lamp and the discharge lamp. The end portion of the glass bulb is a metal body electrically connected to the solder layer, and a non-adhesive layer is formed between the front end side of the metal body and the glass bulb. According to the present invention, damage to the glass bulb can be suppressed. [Embodiment] (First embodiment) Hereinafter, a discharge lamp according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a view for explaining a discharge lamp according to a first embodiment of the present invention. -6- 200947506 The main part of the discharge lamp of the present embodiment is composed of a glass bulb 1 made of hard glass such as borosilicate glass. A discharge space 11 is formed inside the glass bulb 1, and a rare gas and mercury Hg formed by a mixed gas of 氖Ne and hydrogen Ar are sealed in the discharge space 11. Further, on the inner surface of the glass bulb 1, a phosphor layer 2 made of, for example, RGB three-wavelength phosphor is formed. At both end portions of the glass bulb 1, a metal terminal 3 is formed as a feed terminal for supplying electric power to the lamp. The metal terminal 3 is composed of a solder layer 31 and a metal body 32. The solder layer 31 is formed at the end of the glass bulb 1. In the material of the solder layer 31, a solder containing bismuth Sb, zinc Zn, aluminum A1 or the like may be used for an alloy of tin Sn, tin Sn, and indium In, and a tantalum metal body 32 such as an alloy of tin sn and bismu is a solder. The layer 31 is electrically connected to each other, and the thin metal is overlapped with a part of the rewinding portion to form an open cylindrical metal, and is covered on the end of the glass bulb 1. As the material of the metal body 32, a material which is close to the coefficient of thermal expansion of the glass bulb 1 is preferably used. For example, according to the coefficient of thermal expansion of the material of the glass bulb 1, iron Fe, nickel Ni, copper Cu, cobalt Co, chromium may be used. A metal or a Cr alloy may be plated with a metal such as copper Cu, tin Sn, zinc Zn'silver Ag, gold Au, or nickel Ni on the surface of the metal body 32. Here, the structure of the metal terminal 3 will be described in more detail with reference to Fig. 2 . Fig. 2 is an enlarged view showing a portion of the dotted chain line X for explaining Fig. 1; -7- 200947506 As can be seen from the figure, the solder layer 31 is composed of the first solder layer 311, the second solder layer 312, and the third solder layer 313. The first solder layer 311 is a solder layer that is in close contact with the glass bulb 1, but is not in contact with the metal body 32, and is formed on the surface of the end portion of the glass bulb 1 with a thickness of about 0 mm < d$0.07 mm. The second solder layer 3 12 is formed on the rear end side of the metal body 32, that is, on the end portion 31 of the glass bulb 1, and is in contact with the solder layer of the first solder layer 31 and the metal body 32. In other words, the second solder layer 311 is a portion that electrically connects the first solder layer 311 and the metal body 32. Further, the second solder layer 312 is formed to protrude from the rear end of the metal body 32. Further, the boundary between the first solder layer 311 and the second solder layer 312 is indicated by a broken line in Fig. 2, but the actual state does not exist. The third solder layer 313 is a solder layer that is in close contact with the outer surface of the metal body 32. The first solder layer 311 and the second solder layer 312 are used on the front end side of the metal body 32, that is, the inner surface of the end portion 32 from the end portion of the glass bulb 1 and the first solder layer. Between the outer surfaces of 311, a non-adhesive layer 4 is formed. The appropriate size of the non-adhesive layer 4 is such that when the length of the non-adhesive layer 4 in the tube axis direction is L, Lg is 1.0 mm, preferably L 2 3.0 mm. Further, "contact" means a state in which members are firmly connected to each other. That is, there is a state of a gap between members, and only the state of contact is not close, but is not close. A method of forming the metal terminal 3 will be described with reference to FIG. First, as shown in (a), at one end of the glass bulb 1 which is filled with the molten solder 51, the one end of the glass bulb 1 which is immersed at both ends of the seal is adhered to form the first solder layer 311 as shown in (b). At this time, so-called ultrasonic soaking of the molten solder immersed in the ultrasonic vibration by the ultrasonic vibrator 52 -8 - 200947506 is performed, and the glass bulb 1 and the first solder layer 311 are preferably fused. Thereafter, the first solder layer 31 1 is cured, i.e., sufficiently dried, and then the metal body 32 is overlaid on the portion of the glass bulb in which the first solder layer 311 is formed as shown in (c). Then, the portion of the metal body 32 that sufficiently maintains the fixing strength of the glass bulb 1 and the metal body 32, for example, from about 2/3 of the rear end metal body 32, is immersed in the fusion welding 51 as shown in (d). The second solder layer 312 that is in close contact with the first solder layer 311 and the metal body 32 is formed. In this step, as in the case of (a), ultrasonic soaking is performed to improve the adhesion between the glass bulb 1 and the metal body 3 2 . The flux of the gap is better. Then, the operation of the ultrasonic vibrator 52 is stopped, and the molten solder 51 in a state where the ultrasonic vibration is not performed is formed, and the remaining metal body 32 is immersed as shown in (e), and the outer surface of the metal body 32 is immersed. The third solder layer 313 is formed entirely. Thus, a solder is formed on the entire outer surface of the metal body 32 by forming a non-adhesive layer 4 between the glass bulb 1 and the front end side of the metal body 32. Further, the axial length l of the non-adhesive layer 4 is in the step (d), the length of the metal body 32 immersed in the molten solder 51 can be changed, and finally, the glass bulb is pulled out from the solder layer 5, at this time The tail-shaped solder extending toward the rear end side of the metal body 32 is pushed to a table or the like to be formed, and the metal terminal 3 as shown in (f) can be formed. The following 'is a specification of this embodiment of the discharge lamp of the present invention. Glass bulb 1 : ER-N (glass of Nippon Electric Glass Co., Ltd.), inner diameter = 2. 〇 mm, outer diameter R = 3.0 mm, full length = 960 mm, 200947506 Discharge medium: 氖Ne + argon Ar, mercury Hg, Phosphor layer 2; RGB 3-wavelength phosphor, metal terminal 3; forming length = 25 mm, solder layer 31: "Serrasoso" (transliteration), solder made by Japan Kuroda, tin-Sn-zinc Zn -铋Sb), metal body 32: re-rolled with a thickness of 0.1 mm of 47 alloy (nickel: 47%, iron = 53% alloy), silver-plated Ag on the surface, non-adhesive layer 4; length L = 7.0 Mm, interval D = maximum 0.07 mm. Each of the conventional discharge lamps of the discharge lamp of the above-described embodiment and the metal body and the glass bulb was fabricated to carry out a damage strength test. The result is shown in Fig. 4. Further, as shown in Fig. 12, the test is to push the axis of the metal body 32 having a length of 2 5 mm in the axial direction by the push-pull gauge 13 in a state where the fixture 12 is fixed at a distance of 40 mm from the end of the tube of the discharge lamp 1. The method of measuring the load at this time is performed in the vicinity of the center of the direction, that is, from the portion of the pipe end of 12.5 mm up to the breakage or the like. As a result, it can be seen that the lamp of the embodiment has a large damage load as a whole, but the damage load of the second lamp and the fifth lamp of the conventional example is extremely small. This is due to the damaged portion of the lamp. Specifically, the 'second lamp and the fifth lamp are the glass bulbs 1 of the front end portion 322 of the damaged metal body 32. This portion 322 is easy to concentrate stress by the principle of the lever when the metal body 32 and the glass bulb 1' are firmly fixed. , so 'even a small load will be damaged. The lamp of this embodiment is made of a non-adhesive layer 4' formed between the front end 3 2 2 side of the metal body 3 2 and the glass bulb 1 to prevent stress concentration for the portion 3 22 . In the case of the lamp 'with a different length L of the non-adhesive layer 4', a load of 〇.4 kaf is applied and the test is broken. The results are not shown in Figure 5. As a result, it can be seen that the longer the length of the non-adhesive layer 4 is, the less likely it is to be broken. In particular, when the length L is 1 mm or more, the breakage rate is lowered, and if the length L is 3.0 mm or more, the breakage rate is 〇%. Therefore, the length L of the non-adhesive layer 4 is Lgl.Omm, preferably L23.0 mm. However, if the area which is not in close contact becomes large, it is easy to peel off, and therefore the length L of the non-adhesive layer 4 is preferably LglOmm. Therefore, in the first embodiment, the first solder layer 311 which is in close contact with the glass bulb 1 and which is not in close contact with the metal body 32 is formed on at least a part of the metal body 32, and is in close contact with the first solder layer 311. The solder layer 31 composed of the third solder layer 313 of the metal body 32 and the third solder layer 313 which is in close contact with the entire outer surface of the metal body 32 forms a non-tight contact between the front end side of the metal body 32 and the glass bulb 1. By affixing the layer 4, the stress concentration of the portion of the glass bulb 1 at the tip end of the metal body 32 can be suppressed. Therefore, it is possible to realize a discharge lamp in which the portion is not easily broken and the surface of the metal body 32 is less likely to corrode. Further, when the length of the non-adhesive layer 4 is L, L21.0 mm can be satisfied, so that it is not easily broken. Further, the step of immersing the end portion of the glass bulb in the molten solder 51 to which the ultrasonic vibration is applied is performed to form the first solder layer 311 which is in close contact with the glass bulb 1, and after the first solder layer 311 is cured, the formation is performed. a step of partially covering the glass bulb 1 of the first solder layer 311 with the metal body 32; and -11 - 200947506 forming the molten solder 51' impregnated with the applied ultrasonic vibration on the rear end side of the metal body 32 to be in close contact with the second solder a step of forming the second solder layer 312 of the layer 311 and the metal body 32; and immersing the molten solder 51 which is not subjected to ultrasonic vibration to the front end side of the metal body 32, and forming a third solder layer which is in close contact with the outer surface of the metal body 32. The step of 313, under the formation of solder on the outer surface of the metal body 32, can form a non-adhesive layer 4 between the glass bulb 1 and the front end side of the metal body 32. (Second Embodiment) Fig. 6 is a view showing a discharge lamp for explaining a second embodiment of the present invention. In the respective portions of the embodiment, the same portions as those of the discharge lamp of the first embodiment are denoted by the same reference numerals and will not be described. In the second embodiment, since the third solder layer 313 is formed on the outer surface of the metal body 32, in the present embodiment, when the discharge lamp is fixed to the back surface light, the lamp holder on the back side light side can be held. Since the metal body 32 is partially prevented, the solder is prevented from being peeled off by the friction with the solder, and the peeled solder adheres to the problem of the light-emitting field of the discharge lamp or the like, and further, 5 pieces of the present embodiment are applied. As a result of performing the same test as in the fourth embodiment, it was confirmed that the glass bulb 1 at the tip end of the metal body 32 was not damaged, and was not easily broken as in the first embodiment. Further, in the state of Fig. 6, the end portion of the glass bulb 1 is immersed in the molten solder 51 to which ultrasonic vibration is applied, and the first solder layer 311 is adhered to the glass bulb 1; and the curing is performed first. After the solder layer 311 is -12-200947506, the metal bulb 32 is partially covered on the glass bulb 1 in which the first solder layer 31 is formed, and the rear end side is heated while cooling the rear end side of the metal body 32. The step of adhering to the first solder layer 311 and the second solder layer 312 of the metal body 32 can be formed. Further, the length L of the non-adhesive layer 4 is easily adjustable by changing the cooling range and the heating range. (Third Embodiment) FIG. 7 is a view for explaining a discharge lamp according to a third embodiment of the present invention. In the third embodiment, only the non-adhesive layer 4 is interposed between the front end side of the metal body 32 and the glass bulb 1. That is, as in the first and second embodiments, no solder is formed between the glass bulbs 1 on the distal end side of the metal body 32. Also in this embodiment, the same effects as those of the first embodiment can be obtained.第 (Fourth Embodiment) Fig. 8 is a view for explaining a discharge lamp according to a fourth embodiment of the present invention. In the fourth embodiment, the second solder layer 312 is in contact with the entire inner surface of the metal body 32, but the non-adhesive layer 4 is formed between the second solder layer 312 on the distal end side of the metal body 32 and the glass bulb 1. . Also in such an embodiment, the same effects as those of the first embodiment can be obtained. (Fifth Embodiment) -13-200947506 Fig. 9 is a view for explaining a discharge lamp according to a fifth embodiment of the present invention. In the fifth embodiment, the first solder layer 311 is formed on the outer surface of the glass bulb 1, and the second solder layer 312 is formed on the entire inner surface of the metal body 32, but the first solder on the front end side of the metal body 32. A non-adhesive layer 4 is formed between the layer 311 and the second solder layer 312. Also in such an embodiment, the same effects as those of the first embodiment can be obtained. Further, in such a discharge lamp, the metal body 32 in which the solder is formed on the inner surface in advance is realized by the procedure of (c) of Fig. 3 . (Embodiment 6) FIG. 10 is a view for explaining a discharge lamp according to a sixth embodiment of the present invention. In the sixth embodiment, the glass bulb 1' having the electrode 61, the inner lead 62, the outer lead 63, and the bead glass 64 is sealed with a non-adhesive layer 4 interposed on the front end of the metal body 32. The metal terminal 3 is formed in a manner between the side and the first solder layer 311. That is, the metal terminal 3 is formed at the end of the cold cathode fluorescent lamp. Also in this form, the same effects as those of the first embodiment can be obtained. Further, the embodiment of the present invention is not limited to the above, and may be changed as follows, for example. The metal body 32 is not limited to a heavy-rolled metal plate, and may be formed, for example, by a method in which a pin die is used. The materials used in the first solder layer 311' of the second solder layer 312 and the third solder layer 313 are not limited to the same material, for example, the 'the second solder layer 311 is excellent in adhesion to glass. The second solder layer 312 and the third solder layer 313 may be made of a material having excellent adhesion to metal or the like, and may be a combination of materials. As shown in Fig. 11, the third solder layer 312 may be formed only on the rear end side of the metal body 32. At this time, similarly to the second embodiment, the peeling of the solder due to the friction with the socket can be prevented. Further, the lamp of Fig. 11 is formed in the manufacturing method of Fig. 3, and the step (e) is omitted. The non-adhesive layer 4 does not need to have a gap formed therein, but a part may be made into a contact. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining a discharge lamp according to a first embodiment of the present invention. _ Fig. 2 is a view showing a portion of the dotted line X of Fig. 1
D 擴大圖。 第3(a)圖至第3(f)圖是表示用於說明金屬端子 的一形成方法的圖式。 第4圖是表示用於說明針對於實施例的燈泡與習知例 的燈的破損強度的圖式。 第5圖是表示用於說明一變更非緊貼層的長度L時的 破損強度的圖式。 第6圖是表示用於說明針對於本發明的第2實施形態 -15- 200947506 的放電燈的圖式。 第7圖是表示用於說明針對於本發明的第3實施形態 的放電燈的圖式。 第8圖是表示用於說明針對於本發明的第4實施形態 的放電燈的圖式。 第9圖是表示用於說明針對於本發明的第5實施形態 的放電燈的圖式。 第10圖是表示用於說明針對於本發明的第6實施形 態的放電燈的圖式。 第Η圖是表示用於說明本發明的變形例的圖式。 第12圖是表示針對於本發明的第1實施形態的放電 燈與習知的放電燈所實施的破損強度試驗方法的槪略圖。 【主要元件符號說明】 1 :玻璃燈泡 1 1 :放電空間 2 :螢光體層 3 :金屬端子 3 1 :焊料層 311 :第1焊料層 312 :第2焊料層 3 1 3 :第3焊料層 32 :金屬體 4 :非緊貼層 -16- 200947506 51 :熔融焊料D Enlarge the map. Figs. 3(a) to 3(f) are diagrams for explaining a method of forming a metal terminal. Fig. 4 is a view for explaining the damage strength of the lamp of the embodiment and the lamp of the conventional example. Fig. 5 is a view for explaining the damage strength when the length L of the non-adhesive layer is changed. Fig. 6 is a view showing a discharge lamp for explaining a second embodiment of the present invention -15-200947506. Fig. 7 is a view for explaining a discharge lamp according to a third embodiment of the present invention. Fig. 8 is a view for explaining a discharge lamp according to a fourth embodiment of the present invention. Fig. 9 is a view for explaining a discharge lamp according to a fifth embodiment of the present invention. Fig. 10 is a view for explaining a discharge lamp according to a sixth embodiment of the present invention. The figure is a diagram for explaining a modification of the present invention. Fig. 12 is a schematic view showing a method of testing the damage strength of the discharge lamp according to the first embodiment of the present invention and a conventional discharge lamp. [Description of main component symbols] 1 : Glass bulb 1 1 : Discharge space 2 : Phosphor layer 3 : Metal terminal 3 1 : Solder layer 311 : First solder layer 312 : Second solder layer 3 1 3 : Third solder layer 32 :Metal body 4 : Non-adhesive layer-16- 200947506 51 :Solid solder
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