TW200943519A - Improved methods of mid-frequency decoupling - Google Patents
Improved methods of mid-frequency decouplingInfo
- Publication number
- TW200943519A TW200943519A TW097145376A TW97145376A TW200943519A TW 200943519 A TW200943519 A TW 200943519A TW 097145376 A TW097145376 A TW 097145376A TW 97145376 A TW97145376 A TW 97145376A TW 200943519 A TW200943519 A TW 200943519A
- Authority
- TW
- Taiwan
- Prior art keywords
- embedded
- capacitors
- semiconductor package
- singulated
- electrodes
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/949,329 US8564967B2 (en) | 2007-12-03 | 2007-12-03 | Device and method for reducing impedance |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200943519A true TW200943519A (en) | 2009-10-16 |
Family
ID=40524564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097145376A TW200943519A (en) | 2007-12-03 | 2008-11-24 | Improved methods of mid-frequency decoupling |
Country Status (5)
Country | Link |
---|---|
US (1) | US8564967B2 (zh) |
EP (1) | EP2068360A3 (zh) |
JP (1) | JP2009200470A (zh) |
KR (1) | KR101409559B1 (zh) |
TW (1) | TW200943519A (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8624365B1 (en) * | 2010-07-23 | 2014-01-07 | Marvell International Ltd. | Interposer based capacitors for semiconductor packaging |
JP5598253B2 (ja) | 2010-10-25 | 2014-10-01 | 富士通セミコンダクター株式会社 | 半導体装置用基板及び半導体装置 |
US8975711B2 (en) * | 2011-12-08 | 2015-03-10 | Infineon Technologies Ag | Device including two power semiconductor chips and manufacturing thereof |
US9035194B2 (en) * | 2012-10-30 | 2015-05-19 | Intel Corporation | Circuit board with integrated passive devices |
US20140167900A1 (en) | 2012-12-14 | 2014-06-19 | Gregorio R. Murtagian | Surface-mount inductor structures for forming one or more inductors with substrate traces |
CN106031316B (zh) * | 2014-02-21 | 2019-06-28 | 三井金属矿业株式会社 | 内置电容器层形成用覆铜层压板、多层印刷线路板以及多层印刷线路板的制造方法 |
JP6669513B2 (ja) * | 2016-02-03 | 2020-03-18 | 富士ゼロックス株式会社 | 回路基板および回路基板の製造方法 |
US10892105B2 (en) | 2017-01-31 | 2021-01-12 | International Business Machines Corporation | Multi-layer capacitor package |
DE102018201842A1 (de) * | 2018-02-06 | 2019-08-08 | Siemens Aktiengesellschaft | Leistungselektronische Schaltung mit mehreren Leistungsmodulen |
EP3522188A1 (de) | 2018-02-06 | 2019-08-07 | Siemens Aktiengesellschaft | Kondensatoraufbau und leistungsmodul mit einem leistungselektronischen bauelement |
US10504826B1 (en) * | 2018-10-08 | 2019-12-10 | General Electric Company | Device almost last embedded device structure and method of manufacturing thereof |
US10692737B2 (en) | 2018-10-08 | 2020-06-23 | General Electric Company | Multilayer interconnect structure with buried conductive via connections and method of manufacturing thereof |
JP7482602B2 (ja) * | 2019-02-20 | 2024-05-14 | Tdk株式会社 | 薄膜キャパシタ内蔵基板及びその製造方法 |
US11581271B2 (en) * | 2019-03-14 | 2023-02-14 | Intel Corporation | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate |
US11523502B2 (en) * | 2020-05-06 | 2022-12-06 | Veea Inc. | Method and procedure for miniaturing a multi-layer PCB |
CN117936464B (zh) * | 2024-03-22 | 2024-06-14 | 成都万应微电子有限公司 | 芯片器件的封装腔体结构及降低封装腔体谐振的方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5161086A (en) | 1989-08-23 | 1992-11-03 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
EP1139705B1 (en) | 1999-09-02 | 2006-11-22 | Ibiden Co., Ltd. | Printed wiring board and method of producing the same |
KR20070101408A (ko) | 1999-09-02 | 2007-10-16 | 이비덴 가부시키가이샤 | 프린트배선판 및 프린트배선판의 제조방법 |
US6611419B1 (en) | 2000-07-31 | 2003-08-26 | Intel Corporation | Electronic assembly comprising substrate with embedded capacitors |
US6775150B1 (en) | 2000-08-30 | 2004-08-10 | Intel Corporation | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
US6847527B2 (en) | 2001-08-24 | 2005-01-25 | 3M Innovative Properties Company | Interconnect module with reduced power distribution impedance |
JP3910387B2 (ja) | 2001-08-24 | 2007-04-25 | 新光電気工業株式会社 | 半導体パッケージ及びその製造方法並びに半導体装置 |
JP4937495B2 (ja) | 2003-12-25 | 2012-05-23 | 新光電気工業株式会社 | キャパシタ装置、電子部品実装構造及びキャパシタ装置の製造方法 |
US7613007B2 (en) | 2004-12-21 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Power core devices |
US7548432B2 (en) * | 2005-03-24 | 2009-06-16 | Agency For Science, Technology And Research | Embedded capacitor structure |
US7701052B2 (en) | 2005-10-21 | 2010-04-20 | E. I. Du Pont De Nemours And Company | Power core devices |
EP1777745A3 (en) | 2005-10-21 | 2010-05-05 | E.I. Du Pont De Nemours And Company | Power core device including a capacitor and method of making thereof |
KR101329931B1 (ko) | 2006-04-25 | 2013-11-28 | 니혼도꾸슈도교 가부시키가이샤 | 배선기판 |
-
2007
- 2007-12-03 US US11/949,329 patent/US8564967B2/en active Active
-
2008
- 2008-11-17 EP EP08169295A patent/EP2068360A3/en not_active Withdrawn
- 2008-11-24 TW TW097145376A patent/TW200943519A/zh unknown
- 2008-12-02 KR KR1020080121065A patent/KR101409559B1/ko active IP Right Grant
- 2008-12-03 JP JP2008308827A patent/JP2009200470A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20090057922A (ko) | 2009-06-08 |
EP2068360A2 (en) | 2009-06-10 |
JP2009200470A (ja) | 2009-09-03 |
KR101409559B1 (ko) | 2014-06-20 |
US20090140400A1 (en) | 2009-06-04 |
EP2068360A3 (en) | 2010-12-22 |
US8564967B2 (en) | 2013-10-22 |
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