200941832 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種可微動作地被設置在被搬送於 電子零件試驗裝置内的托盤、可收容半導體積體電路元件 等的各種電子零件（以下亦代表性稱為ic元件）的嵌入 器、以及具備此嵌入器的托盤及電子零件試驗裝置。 ❹ 參 【先前技術】 在1C 70件等的電子零件的製造過程中，為了試驗IC π件的性能或功能等，電子零件試驗裝置係被使用。 在構成電子零件試驗裝置的分類器（Handler)方面， 在用於收容試驗前或試驗後的Ie元件的托盤（以下稱為顧 客托盤[cust贿tray])、以及在電子零件試驗裝置内被 循環搬送的托盤（以下稱為測謎社奶 卜聃為測忒托盤）之間，有將Ic元件 承載替換的形式的物件。 在此種分類器中，使1C开彼杜如。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The following is also representative of an embed device called an ic device, and a tray and an electronic component testing device including the embedding device.先前 【 先前 先前 先前 先前 先前 先前 先前 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子In the Handler that constitutes the electronic component testing device, the tray for the Ie component (hereinafter referred to as the customer tray [cust bribe]) for accommodating the test before or after the test, and the electronic component test device are circulated. Between the transported trays (hereinafter referred to as the Detective Society's milk sputum is a sputum tray), there is an object in the form of replacing the Ic component. In this classifier, make 1C open the Du Duru
便α 70件接觸在測試頭、進行IC 元件測試的測試過程中，將T r - g ⑻ 70件收容在測試托盤的狀 態下，1C兀件係被按壓在測試頭。 在測試托盤方面，收容各1C元杜认* 動作的方式被設置。作為防幻=人器係以可微 用閃鎖（latch)機構的物件係為習知 珉入器，採 專利文獻1及2。）。 ’、、、〇的（例如’參考 在此類後入器中’藉由問鎖構件 嵌入器變成可對應不同尺寸的1(：元件 斤又量，一個 2247-10161-PF 5 200941832 元 所 的 然而，由於上述的任一種嵌入器皆是以正交於ic 件的收容方向的軸作為中心、問鎖構件會迴轉的構造， 、存在著IGtl件的尺寸寬度越大的話，應用性越降低 間題。 _ [專利文獻〗]日本特開2〇〇1_33518號公報 [專利文獻2]國際公開第〇3/〇75〇24號說明書 參 L發明内容】 [發明所欲解決之問題] 本發明所欲解決之問題係提供對於被試驗電子零件 的尺寸應用性高的嵌入器、 及具備此嵌入器的托盤及電 子零件試驗裝置。 [解決問題之技術手段] ⑴為達成上述㈣，根據本發明的第―觀點，提供 種嵌人器’其係以可微動作的方式被設於在電子零件試 驗裝置内被搬送的托盤、可收容 叹今被试驗電子零件，且包 括.閂鎖構件，可在接近於被收 钟私&^ 饥叹令在上述嵌入器的上述被 D電子零件的上面的關閉位置、以及;+ M及從被收容在上述嵌 #的上述被試驗電子容彳丰& 蒋叙.、 ㈣子零件的上面遠離的打開位置之間 ’以及支持構件，以可迴棘的古斗、必 掊右成 T XR轉的方式將上述問鎖構件支 器的平其中上述閃鎖構件係，至少在上述嵌人 作（Λ·Λ 上述支持構件作為迴轉中心做迴轉動 (乂考申5月專利範圍第1項）。 在上述發明中，雖然並未 饤列限疋’然而上述支持構 2247-ι〇\61_ρΓ 6 200941832 件係，以上述支持料 ——于零件 的收容方向成為實質上平行的方式、或是對於上述收容方 向傾斜的方式被設置在上述喪入器本體係較佳的（參考申 請專利範圍第2項）。 在上述發明中，雖然並未特別限定，然而上述問鎖構 件係，在對於上述後入器本體的主面傾斜的平面上、以上 ❹ ❹ =一做迴轉動作係較佳的(參考申請專利 在上述發明中，雖然並未特別限定，然而伴隨著上述 =構件的迴轉動作，上述被試驗電子零件的j::: 述問鎖構件的前端位置係變化為較 利範圍第4項）。 〜$甲吻專 件俜在雖然並未特別限定，然而上述閃鎖構 干係在上述打開位置中，實 長度方向係較佳的（參考申請專利範。圍著第上5迷項嵌^器本敢的 本二 …u 内部的收容凹…、有閃鎖構件被收容在 :…為較佳的(參考申請專利範圍 在上述發明中，雖銶 ; 部係沿著上述嵌入器本體：限定’然而上述收容凹 考申請專利範圍第7項)體的長度方向被設置為較佳的（參 在上述發明中，鏟鈇 述r-ΐ鎖構件偏壓至上述關閉位置別限定」然而更包括將上 (參考申請專利範圍第8項）。#第一彈性體係較佳的Then, 70 pieces of T r - g (8) were placed in the test tray during the test of the test head and IC component test, and the 1C element was pressed against the test head. In the test tray, the method of accommodating each 1C yuan recognition* action is set. As an anti-aliasing device, an object having a micro-flash latch mechanism is a conventional intrusion device, and Patent Documents 1 and 2 are employed. ). ',, 〇 (for example, 'Reference in such a ejector' becomes a type that can correspond to different sizes by means of the lock member inserter (: component sizing, a 2247-10161-PF 5 200941832 yuan) However, since any of the above-described embedders has a structure in which the lock member is rotated about the axis orthogonal to the accommodating direction of the ic member, and the size width of the IGt member is larger, the applicability is lowered. [Patent Document] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. 2-33518 [Patent Document 2] International Publication No. 3/〇75〇24, the contents of the disclosure of the invention. [Problems to be Solved by the Invention] The present invention The problem to be solved is to provide an inlay having high applicability to the size of the electronic component to be tested, and a tray and an electronic component testing device having the same. [Technical means for solving the problem] (1) In order to achieve the above (4), according to the present invention, The first aspect provides a seeding device that is provided in a micro-movable manner in a tray that is transported in an electronic component testing device, that can accommodate an electronic component that is tested, and includes a latching member. In the close position of the above-mentioned D-electronic parts of the above-mentioned embedder, and the + M and the above-mentioned tested electronic accommodating and accommodating the above-mentioned embedded # in close proximity to the received bells &; Jiang Xu., (d) between the open position of the sub-parts away from the open position and the support member, in the manner of the back of the spine, the right turn into the T XR turn the above-mentioned lock member support flat The lock member is at least in the above-mentioned inlay (Λ·Λ The above-mentioned support member is rotated as a center of rotation (乂考申五 patent scope item 1). In the above invention, although the limit is not listed' The above-mentioned support structure 2247-ι〇\61_ρΓ 6 200941832 is provided in the above-mentioned funnel system in such a manner that the support material is substantially parallel to the housing direction of the component or inclined to the storage direction. Preferably, the invention is not limited to the above-mentioned invention. However, the above-mentioned problem-locking member is on the plane inclined with respect to the main surface of the inverter body, and is ❹ ❹ = It is preferable to perform the turning operation (refer to the patent application in the above invention, although it is not particularly limited. However, with respect to the turning operation of the above-mentioned member, the front end position of the above-mentioned test electronic component j::: The change is the fourth item of the comparative advantage.) The weight loss component is not particularly limited, but the above-mentioned flash lock is in the above-mentioned open position, and the real length direction is preferred (refer to the patent application. The first 5 fascinating fixtures, the daring of the second...u, the inner containment recesses, and the flash lock members are housed in: ... is preferred (refer to the patent application scope in the above invention, although 銶; Along the above-described embedder body: the length direction of the body defining the 'sufficiency of the above-mentioned containment reference patent item 7' is set to be preferred (in the above invention, the shovel recites the r-shackle member biased to the above The closing position is not limited. However, it is also included (refer to item 8 of the patent application scope). #第一弹性*** preferably
2247-l〇i6i_pF 200941832 述發明中，雖然並未特別 問鎖構件的後端可按堡 广括將上述 桿，其中上述閃鎖構件的、絲 述嵌入器本體的槓 的前端和後端之間，# 、上相鎖構件 後端係被按壓，上述n 过閂鎖構件的 上述打開位置迴轉動竹】端係從上逸關閉位置朝 項）。 ^動作為較佳的（參考W專利範圍第9 在上述發明中’雖然並未特 槓桿從上述嵌入考太栌έΗ、去_ 又匕括將上述 °體朝遠離方向偏壓的第二彈性體# 較佳的(參考申請專利範圍第1〇項)。 彈性體係 在上述發明中，雖缺 在上、f與入…、並未特別限定，但更包括被設置 在上述後入器本體、可蔣μ、+. i . ^ , θ . 述槓桿按壓的槓桿板，其中經 由上述槓才干板及上述 ..,^ 後端MU, 力係作用在上述閃鎖構件的 “為較佳的(參考申請專利範圍第心）。 在上述發明中，雖秋 ❹ 收容在上述嵌入二 別限定’但更包括保持被 益的上述被試驗電子零件的托架 Ccarrier)，其 φ μ、+. ^ 、上述閂鎖構件係，在上述關閉位置中、 接近在被保持於上述托架的上述被試驗電子零件的上 在述打開位置中、從被保持於上述托架的上述被試 驗電子零件的上面遠離為較佳的（參考中請專利範圍第Μ 項）。 在上述發明中’雖然並未特別限定’但上述托架係， 具有上述被試驗電子零件的端子***人的複數個貫通孔 係較佳的（參考申請專利範圍第丨3項）。 2247-10161-pf 8 200941832 在上述發明中，雖然並未特別限 你I·、+、★ 彳―上述托架係可 足上述嵌入器本體裝卸為較佳 項）。 、麥考申睛專利範圍第14 (2)為了達成上述目的，根據本發 話，提供一種托盤，其在電子零件試內一點的 仟錢裝置内被搬送，且 具有上述嵌入器、以及可微動作地保 構件（參考申請專利範圍第15項）。、心的框架 2為了達成上述目的，根據本發明的第三觀點的 端子^-種電子零件試驗裝置’其將被試驗電子零件的 :子按壓至測試頭的接觸部以進行上述被試驗 ==且包括：測試部，在將上述被試驗電子零件收容 述托盤的狀態下，將上述被試驗電子零件按壓在上述 ^部，裝填（lGader)部，將收容試驗前的上述被試驗電 件的上述托盤搬入至上述測試部；以及卸載 ader)邠，將收容已完成試驗的上述被試驗電子零件 ^上f托盤自上述测試部搬出；其中上述托盤係，在上述 填邛、上述測試部及上述卸載部被循環搬送（參考申請 專利範圍第16項）。 ° [發明的效果] 動{在本發^ t，因為使問鎖構件至少平面上看來被迴轉 、可a加阿鎖構件的前端的移動量，對於被試驗 電子零件的尺寸的應用性係變高。 【實施方式 2247-10161-pp 9 200941832 以下基於圖面說明本發明的實施例。 第1圖係表示本發明的實施例中的電子零件試驗裝置 的概略剖面圖，第2圖係表示本發明的實施例中的電子零 件試驗裝置的立體圖，第3圖係表示本發明的實施例中的 托盤的處理的概念圖。 又，第3圖係為用以理解在電子零件試驗裝置内的把 盤的處理方法的圖，實際上也有將被並排在上下方向配置 ❹ ❹ 的構件以平面方式表示的部分。因此，其機械的（三次元 的）構造係參考第2圖說明。 、本實施例中的電子零件試驗裝置係，在施加高溫或低 溫的熱應力至ic元件的狀態下，使用測試頭5及測試器 6’試錄查)IC元件是否有適當的動作，基於該試驗結 果以分類1C元件的裝置。根據此電子零件試驗裝置的κ 元件㈣試係’被實施為使IC元件從成為試驗對象的 元件被多數搭載的顧客托盤KST(參考第5圖）替換搭載至 在操控器1内被循環搬送的測試托盤m(參考第6圖）。 又’ ic元件係’在圖中以符號IC表示。 如第1圖所示般’空間8係被設置在操控器！的下部， 測試頭5係以可交換方式被配置在此空間8。插座5〇係被 設置在測試頭5,通過電镜7被連接至測試器6。而且， 通過被形成在操控器i的開口部，可使κ元件和測試頭5 上的插座50電氣接艏，+ i 电乳接觸，可藉由來自測試器6的電氣信號 以進行IG元件的測試。又，在元件的種類交換之際， 被交換為適合其稽海的 ΤΓ-AL, ^ 種類的IC兀件的形狀及針（pin)數的插2247-l〇i6i_pF 200941832 In the invention, although it is not specifically mentioned that the rear end of the lock member can collectively include the above-mentioned rod, wherein the above-mentioned flash lock member is interposed between the front end and the rear end of the bar of the inserter body. , #, the rear end of the upper phase lock member is pressed, and the above-mentioned n-opening position of the n-latch member is turned back from the upper closing position to the item). ^Operation is preferred (refer to WO Patent Range No. 9 in the above invention. Although there is no special lever from the above-mentioned embedded test, the second elastomer which biases the above-mentioned body toward the away direction # 最佳 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Jiang μ, +. i . ^ , θ . The lever plate of the lever press, wherein the force is applied to the flash lock member via the above-mentioned lever plate and the above-mentioned rear end MU, which is preferred (refer to In the above invention, although the autumn raft is housed in the above-mentioned embedded type "but the carrier Ccarrier of the above-mentioned tested electronic component which retains the benefit, φ μ, +. ^ , the above The latching member is located away from the upper surface of the tested electronic component held by the bracket in the open position in the closed position in the closed position. Preferred (refer to the patent scope) In the above invention, the present invention is not particularly limited, but the above-described bracket is preferably a plurality of through holes having the terminals of the electronic component to be tested inserted (refer to Patent Application No. 3). 2247-10161-pf 8 200941832 In the above invention, although not particularly limited to I, +, ★ 彳 - the above bracket can be loaded and unloaded as the better in the above embedding body.), McCawshen Patent Requirement No. 14 (2) In order to achieve the above object, according to the present statement, there is provided a tray which is conveyed in a money-saving device at a point in an electronic component test, and has the above-described embedder and a micro-motion-proof member (refer to Patent Application No. 15). The frame of the heart 2 In order to achieve the above object, the terminal-type electronic component testing device according to the third aspect of the present invention presses the sub-test of the test electronic component to the test head. The test unit performs the above test == and includes a test unit that presses the electronic component to be tested on the above-mentioned part in a state in which the test electronic component is stored in the tray, and is loaded (lGa) In the der), the tray that carries the test electric component before the test is carried into the test unit; and the aer) is unloaded, and the test electronic component that has been subjected to the test is carried out from the test portion. The tray system is circulated and conveyed in the above-mentioned filling, the test portion, and the unloading portion (refer to item 16 of the patent application scope). [Effect of the invention] [In the present invention, because the lock member is made The amount of movement of the front end of the member to be tested is at least on the plane, and the amount of movement of the front end of the member can be increased. [Embodiment 2247-10161-pp 9 200941832 The following is based on the drawing. Embodiments of the invention. 1 is a schematic cross-sectional view showing an electronic component testing device in an embodiment of the present invention, FIG. 2 is a perspective view showing an electronic component testing device in an embodiment of the present invention, and FIG. 3 is a view showing an embodiment of the present invention. Conceptual illustration of the handling of the trays. Further, Fig. 3 is a view for explaining a method of processing the disk in the electronic component testing device, and actually, a portion in which members arranged in the vertical direction are arranged in a plane manner. Therefore, its mechanical (three-dimensional) structure is described with reference to Figure 2. In the electronic component testing apparatus of the present embodiment, when the thermal stress of high temperature or low temperature is applied to the ic element, the test head 5 and the tester 6' are used to test whether the IC component has an appropriate operation, based on the The test results are to classify the 1C component device. According to the κ element (4) test system of the electronic component test device, the IC device is replaced by a customer tray KST (refer to FIG. 5) that is mounted on the test object, and is circulated and transported in the manipulator 1 . Test tray m (refer to Figure 6). Further, the 'ic element system' is indicated by the symbol IC in the figure. As shown in Figure 1, the space 8 is set in the manipulator! In the lower part, the test head 5 is arranged in this space 8 in an exchangeable manner. The socket 5 is placed on the test head 5 and connected to the tester 6 through the electron microscope 7. Moreover, by being formed in the opening portion of the manipulator i, the κ element and the socket 50 on the test head 5 can be electrically connected, and the + i electric milk contacts can be made by the electrical signal from the tester 6 to perform the IG element. test. In addition, when the types of components are exchanged, they are exchanged for the shape of the 兀-AL, ^ type of IC components and the number of pins.
2247-10161-PF 10 200941832 座。 本實施例中的操控器1係，如第 Λ罘2圖及第3圖所示般， 由收納試驗前或試驗完成後的 成1俊的1C几件的收納部200、以及 將自收納部200被送來的IC元件 开廷入至測试部丨〇 〇的 填部糊、測試頭5的插座5G靠近内部的測試部刚 及將在測試部1QG進行試驗的已試驗完^ ^元件 的卸載部400所構成。 艰 Ο 以下說明有關操控器1的各部份。 〈收納部2 0 〇 > 第4圖係為被使用在本發明的實施例中的電子零件試 驗裝置的1C貯存器（stGcker)的分解立體圖，第5圖係為 被使用在本發明的實施例中的電子零件試驗裝置的顧客 托盤的立體圖。 收納部200係包括將收容試驗前的IC元件的顧客托 盤kst收納的試驗前貯存器2(Π、以及將對應於試驗結果 ©被分類的1C元件收容的顧客托盤KST收納的試驗沪 存器202。 τ 這些貯存器2(U、202係，如第4圖所示般，包括框 狀的托盤支持框203、以及從此托盤支持框2〇3的下部進 入而朝向上部昇降的升降器m。在此托盤支持框如、 顧客托盤KST係被複數堆疊重疊，成為只有被堆叠重叠的 顧客托盤KST藉由升降器204上下地移動的方式。又，在 本實施例中的葶客托盤KST係，如第5圖所示般，收容^ 元件的凹狀的收容部係，例如’被配列為14rx13列。 2247-10161-PF 11 200941832 因為試驗前貯存器201和試驗完成貯存器202係為同 構所以可將試驗前貯存器201和試驗完成貯存器 202的分別數量對應於需要而設定適當的數量。 在本實施例中，如第2圖及第3圖所示般，兩個貯存 器STK-B係被設置在試驗前貯存器2〇1，在其隔壁、兩個 空托盤貯存器STK'E被設置。各自的空托盤貯存器STK_E 係，被达入至知載部400的空顧客托盤KST被堆疊重疊。 ❹ ❹ 在空托盤貯存器STK_E的隔壁，在試驗完成貯存器 2°2,八個貯存器STKH2、…、STK-8被設置，對 應於試驗結果、以最多被區分為人個分類而收納的方式被 構成亦即’除了良品和不良品之外，可區分為良品之中 動作速度高速的物件、中速的物件、低速的物件、或是不 良品之中需要再測試的物件等。 〈裝填部30 0> 述的顧客托盤KST係，藉由被設置在收納部2〇〇和 裝置基台ιοί之間的托盤移送臂2〇5，從裝置基台ι〇ι的 下侧被搬運至裝填部3〇〇的兩處的窗部37〇。X，在此裝 填部300巾，元件搬送裝χ 31〇將被堆疊重疊在顧客托盤 KST的ICtl件暫且移送至精密器（preciser)36〇，在此修 正1C元件的相互位置關係。之後，元件搬送裴置31〇係 再次使被移送到此精密器360的IC元件移動替換堆疊 至停止在裝填部3 〇 〇的測試托盤tst。 裝填部300係，如上述般，具備將Ic元件從顧客托 盤KST替換堆疊至測試托盤TST的元件搬送裝置31 〇。此 2247-10161-PF 12 200941832 疋件搬送裝置310係’如第2圖所示般，包括被架設在裝 置基台101上的兩條軌道311、沿著這些軌道311可往返 移動於測試托盤TST和顧客托盤KST之間（將此方向作為γ 方向）的可動臂312、以及藉由此可動臂312被支持而可移 動於X方向的可動頭320。 在此元件搬送裝置310的可動頭32〇方面，吸著頭（未 圖不）係朝下被裝著，藉由此吸著頭一面吸引一面移動， φ 從顧客托盤KST保持1C元件、將此IC元件替換堆疊在測 試托盤TST。這樣的吸著頭係在一個的可動頭320例如被 没置為八個程度，成為可一次將八個1C元件替換堆疊在 測試托盤TST。 〈測試部1〇〇> 上述的測試托盤TST係，在裝填部300、IC元件被堆 疊放入之後、被放入至測試部10()，在將IC元件搭載在測 试托盤TST的狀態下，各IC元件的測試係被實行。 ® 測試部100係’如第2圖和帛3圖所示般，構成自： 在被搭載於測試托盤了^的Ic元件、施加作為目的的高 溫或是低溫的溫度應力的浸潰（soak)腔室110，以及將處 於在此浸潰腔室110、熱應力被施加的狀態的1(：元件按壓 在測試頭5 &測試腔室120，Μ及將來自在測試腔室12〇 被試驗的IC元件的熱應力除去的浸潰移除（刪〇ak)腔室 130 〇 在浸潰腔室110施砂高溫在Ic元件時，在浸潰移除 腔室130冑1C元件藉由送風冷卻而回歸至室溫。另一方 2247-10161-PF 13 200941832 面，在浸潰腔室110施加低溫在IC元件時，在浸潰移除 腔室130將1C元件以溫風或是加熱器等加熱後回復至結 露不會產生程度的溫度。 如第2圖所示般，測試部i 〇〇的浸潰腔室1丨〇以及浸 潰移除腔室1 30係較測試腔室12〇突出於上方。又，在浸 潰腔室110方面，如第3圖概念性所示般、垂直搬送裝置 係被設置，測試腔室120有空為止期間，複數片的測試托 〇 盤TST係一面被支持在此垂直搬送裝置一面待機。主要是 在此待機中，高溫或是低溫的熱應力係被施加在ic元件。 在測試腔室120方面，測試頭5係被配置在其中央， 測試托盤TST係被搬送至測試頭5之上，藉由冑IC元件 的輸出入端子HB(參考第U圖）電氣接觸在測試頭5的插 座50的接觸針51(參考第n圖），測試被進行。另一方面， 試驗已完成的測試托盤TST係在浸潰移除腔室13〇被除 熱，將ic元件的溫度回歸至室溫後，被搬出至卸載部4〇〇。 ® 在改潰腔室11 〇的上部方面，用以將測試托盤TST從 裝置基纟101搬入的人口係被形成。同樣地在浸潰移除 腔室130的上部，用以將測試托盤TST搬出至裝置基台1〇1 的出口也被形成。而且，如第2圖所示般，在裝置基台ι〇ι 方面通過這些入口或出口，用以將測試托盤TST從測試 邛100拿出放入的托盤搬送裝置102被設置。此托盤搬送 農置10 2係例如以迴轉滾子等被構成。 藉由此托盤搬送裝置102,從浸潰移除腔室13〇被搬 出的測試托盤TST係，在被搭載的全部的IC元件藉由元 2247-10161-PF 14 200941832 件搬送裝置410(後述）被替換堆疊後，成為經由卸載部4〇〇 和袭填部300被返送至浸潰腔室110的方式。 第6圖係為被使用在本發明的實施例中的電子零件試 驗裝置的測試托盤的分解立體圖。 測試托盤TST係’如第6圖所示般’具有方型的框架 構件701、以及平行於框架構件701且以等間隔被設置的 棧702、以及從棧702或是框架構件701的邊701a等間隔 〇 地突出的複數的安裝片703。而且，藉由棧7〇2或邊7〇la 和女裝片703，嵌入器收容部704被構成。 在各嵌入器收容部704方面，分別收容一個嵌入器 7^0。在嵌入器710的兩端方面，用以將此嵌入器7丨〇安 裝在安裴片703的安裝孔706係分別被形成，嵌入器71〇 係使用扣件705、以浮動狀態（三次元地可微動作的狀態） 被安裝於兩個安裝片703。此類的嵌入器71〇係，如第6 圖所示奴，在一片的測試托盤TST、以四行十六列的配列 〇 方式被安裝六十四個，藉由Ic元件被收容在嵌入器71〇, 成為IC元件被堆疊放入在測試托盤TST。 第7圖係為被使用在第6圖所示的測試托盤的嵌入器 的分解立體圖。第8A圖以及第8B圖係為本發明的實施例 中的嵌入器的平面圖，第9A圖〜第1〇β圖係為第8A圖及 第8B圖的剖面圖。 在本實施例中的嵌入器710係’如第7圖所示般，具 備嵌入器本體720、槓桿板750以尽元件托架760。 在敢入器本體720的約略中央，如第7圖所示，用以 2247-10161-pf 15 2009418322247-10161-PF 10 200941832 Block. The manipulator 1 in the present embodiment is a storage unit 200 of a 1C piece of 1C, and a self-accommodating part of the 1C, which is stored before or after the test, as shown in the second and third figures. The IC component that has been sent 200 is opened to the filling portion of the test unit, the socket 5G of the test head 5 is close to the internal test portion, and the tested component that will be tested in the test portion 1QG The unloading unit 400 is configured. Difficulties Ο The following describes the various parts of the manipulator 1. <Storage part 2 0 〇> Fig. 4 is an exploded perspective view of a 1C reservoir (stGcker) used in the electronic component testing device according to the embodiment of the present invention, and Fig. 5 is used in the practice of the present invention. A perspective view of a customer tray of an electronic component testing device in an example. The accommodating unit 200 includes a pre-test reservoir 2 for accommodating a customer tray kst for storing an IC component before the test (Π, and a test register 202 for storing the customer tray KST in which the 1C component corresponding to the test result © is stored. τ These reservoirs 2 (U, 202, as shown in Fig. 4, include a frame-shaped tray support frame 203, and a lifter m that enters from the lower portion of the tray support frame 2〇3 and moves up and down toward the upper portion. The tray support frame, for example, the customer tray KST is stacked in a plurality of stacks, so that only the stacked customer trays KST are moved up and down by the lifter 204. Further, in the present embodiment, the hacker tray KST is, for example, As shown in Fig. 5, the concave accommodating portion for accommodating the element is, for example, 'arranged as 14rx13 columns. 2247-10161-PF 11 200941832 Since the pre-test reservoir 201 and the test-completed reservoir 202 are isomorphic, The respective numbers of the pre-test reservoir 201 and the test completion reservoir 202 may be set to an appropriate number corresponding to the need. In the present embodiment, as shown in Figs. 2 and 3, the two reservoirs STK-B Is set at The pre-test reservoir 2〇1 is disposed at the partition wall and the two empty tray accumulators STK'E. The respective empty tray accumulators STK_E are stacked and overlapped by the empty customer tray KST reaching the knowledge carrying unit 400. ❹ ❹ In the partition wall of the empty tray storage STK_E, in the test completion storage 2 ° 2, eight reservoirs STKH2, ..., STK-8 are set, corresponding to the test results, are divided into a maximum of people classification The method is constructed, that is, in addition to good products and defective products, it can be divided into objects with high speed of movement, medium-speed objects, low-speed objects, and items that need to be retested among defective products. The customer tray KST system described in the section 30 0> is transported from the lower side of the apparatus base ι〇 to the loading by the tray transfer arm 2〇5 provided between the accommodating unit 2〇〇 and the apparatus base ιοί At the two parts of the window portion 37〇, X, in the loading unit 300, the component transport unit 31〇 temporarily transfers the IC tl piece stacked on the customer tray KST to the precision unit 36〇, Correct the mutual positional relationship of the 1C components here. After that, the element The transfer unit 31 again moves the IC component transferred to the precision device 360 to the test tray tst stopped at the loading unit 3. The loading unit 300 is provided with the Ic component from the customer as described above. The tray KST replaces the component transfer device 31 堆叠 stacked to the test tray TST. This 2247-10161-PF 12 200941832 疋 conveyance device 310 is as shown in Fig. 2, including two erected on the device base 101 The track 311, the movable arm 312 which can move back and forth between the test tray TST and the customer tray KST (the direction is the γ direction) along the tracks 311, and the movable arm 312 can be moved in the X direction by the support of the movable arm 312 The movable head 320. In the movable head 32 of the component conveying device 310, the suction head (not shown) is attached downward, and the suction head moves while sucking, and φ holds the 1C component from the customer tray KST. The IC component replacement is stacked on the test tray TST. Such a suction head is attached to a movable head 320, for example, to a degree of eight, so that eight 1C component replacements can be stacked on the test tray TST at a time. <Testing Unit 1> The test tray TST described above is placed in the test unit 10 after the loading unit 300 and the IC elements are stacked, and the IC element is mounted on the test tray TST. Next, the test system of each IC component is implemented. The test unit 100 is configured as follows: As shown in Fig. 2 and Fig. 3, the Ic element mounted on the test tray is subjected to soaking of the target high temperature or low temperature temperature stress. The chamber 110, and the 1 in which the thermal stress is applied, will be in the state of the impregnation chamber 110 (the element is pressed against the test head 5 & test chamber 120, and will be tested from the test chamber 12). The impregnation removal (deletion) chamber 130 of the thermal stress removal of the IC component is immersed in the immersion chamber 110 at a high temperature in the Ic component, and the component is immersed in the immersion removal chamber 130胄1C by air cooling. Returning to room temperature. On the other side, 2247-10161-PF 13 200941832, when the low temperature is applied to the IC component in the impregnation chamber 110, the 1C component is heated by a warm air or a heater after the impregnation removal chamber 130 is applied. Reverting to the temperature at which condensation does not occur. As shown in Fig. 2, the impregnation chamber 1丨〇 of the test portion i 丨〇 and the impregnation removal chamber 1 30 are protruded above the test chamber 12 Further, in the aspect of the impregnation chamber 110, as shown conceptually in Fig. 3, the vertical conveying device is set, and the measurement is performed. While the chamber 120 is empty, the plurality of test trays TST are supported while standing on the vertical conveyor. Mainly during this standby, high temperature or low temperature thermal stress is applied to the ic element. In the test chamber 120, the test head 5 is disposed in the center thereof, and the test tray TST is transported onto the test head 5, and is electrically contacted with the test head by the output terminal HB of the 胄 IC component (refer to FIG. U). The contact pin 51 of the socket 50 of 5 (refer to FIG. n), the test is performed. On the other hand, the test tray TST which has been tested is removed in the impregnation removal chamber 13 and the temperature of the ic element is returned. After being brought to room temperature, it is carried out to the unloading section 4〇〇. In the upper part of the chamber 11 is collapsed, the population system for carrying the test tray TST from the apparatus base 101 is formed. In addition to the upper portion of the chamber 130, an outlet for carrying the test tray TST out to the apparatus base 1〇1 is also formed. Moreover, as shown in Fig. 2, these inlets or outlets are passed through the apparatus base ι〇ι For taking the test tray TST out of the test 邛100 The tray transporting device 102 is installed. The pallet transporting farmer 10 is configured by, for example, a revolving roller. The test tray TST that is carried out from the impregnation removal chamber 13 by the tray transporting device 102 is used. After all the IC components mounted are replaced by the stack 2247-10161-PF 14 200941832 transfer device 410 (described later), the IC components are returned to the immersion chamber via the unloading unit 4 and the tampering unit 300. The mode of the chamber 110. Fig. 6 is an exploded perspective view of the test tray of the electronic component testing device used in the embodiment of the present invention. The test tray TST is 'having a square frame member 701 as shown in Fig. 6, and a stack 702 arranged at equal intervals parallel to the frame member 701, and a side 701a from the stack 702 or the frame member 701. A plurality of mounting pieces 703 projecting at intervals. Further, the embedder housing portion 704 is constituted by the stack 7〇2 or the side 7〇la and the women's piece 703. In each of the embedder housing portions 704, one embedder 7^0 is housed. In terms of both ends of the inserter 710, mounting holes 706 for mounting the inserter 7A in the ampoule 703 are respectively formed, and the embedder 71 is used in a floating state (three-dimensionally) The micro-actuatable state is mounted on the two mounting pieces 703. The embedder 71 of this type, as shown in Fig. 6, is installed in a test tray TST of one piece, and sixty-four pieces are arranged in four rows and sixteen columns, and the Ic component is housed in the embedder. 71〇, the IC components are stacked and placed in the test tray TST. Fig. 7 is an exploded perspective view of the embedder used in the test tray shown in Fig. 6. 8A and 8B are plan views of the embedder in the embodiment of the present invention, and Fig. 9A to Fig. 1B are cross-sectional views of Figs. 8A and 8B. The embedder 710 in this embodiment, as shown in Fig. 7, has an embedder body 720 and a lever plate 750 to extend the component holder 760. In the approximate center of the daring body 720, as shown in Figure 7, for 2247-10161-pf 15 200941832
收谷1C元件的元件收容部721被設置。元件收容部721 係如帛9A目~第！ 0B圖所示般，在上部具有】c元件進 入=進入口 72ia’同時在下部具有元件托架76〇被裝著的 裝著口 721b°it入口 721a和裝著〇 721b係連通，從進入 21a進入至凡件收容部721内的〗c元件係成為被導引 至被裝著於裝著口 721b的元件托架76〇。又，在本實施例 中’雖然說明了—個嵌人器71()收容—個K元件的方式， 然而在本發明中並未特別被限定於此，即使在—個截入器 本體720形成複數個元件收容部721，在同-嵌入器71〇 收容複數個1C元件亦可。 器本體720係’如第7圖所示般，具有由閃鎖構 件73卜螺旋彈簧732、軸m、槓桿7以、以及線圈彈著 735所構成的閂鎖機構。 閃鎖構件731係，如第9A圖和第9β圖所示般，且有 對於被收容在元件收容部721的κ元件的上面接近或是 、的别端731a、以及藉由槓桿734被按壓的後端？31c。 又’在閂鎖構件731中的前端731a以及後端731c之間， 成為k轉中〜731b的通孔被形成，藉由軸733被***至 此通孔1鎖構件731以可迴轉的方式被支持於锻 體 720。 閃鎖構件m係、，藉由將軸733作為中心迴轉，成為 問鎖構件m的前端731a可移動在接近於被收容在元件 收容部⑵的IC元件的上面、防止^元件跳出的位置（在 圖第9A圖、第1 〇A圖所示的狀態，以下簡單稱為 2247-10161-pp 16 200941832 關閉位置）、以及從被收容在元件收容部721的ic元件的 上面遠離而可作為ic元件的拔出***的位置（在第8b 圖、第9B圖、第Η)Β圖所示的狀態，以下簡單稱為打開 位置）之間的方式。 魯 ❹ 在本實施例，在第8A圖及第8B圖所示的嵌入器71〇 的平面上看，因為使閃鎖構件731的前端73U迴轉作動， 所以可確保前端731a的大的移動量。特別是，在本實施 例的嵌入器710’因為問鎖構件731的前端以“可移動至 元件收容部721的中央附近，所以也可收容在第8a圖、 第9A圖及第10A圖中以符號IC表示之尺寸上比較小的ic 元件，也可收容在同圖中以符號ICb表示之尺寸上比較大 的1C兀件，所以對於Ic元件的尺寸的應用性係提高。 螺旋彈簧732係，如第7圖、第1〇A圖及帛ι〇Β圖所 示般，將軲733作為迴轉中心，介於閃鎖構件731和嵌入 器本體720之間，藉由其彈性力，將問鎖構件731偏麼在 關閉位置。因而，在對抗螺旋彈簧732的彈性力、問鎖構 件731的後端731c被㈣時，問鎖構件731的前端73ia 係移動至打開位置。相對於此，朝閂鎖構彳73i的後端 731c的按壓被解除的話，藉由螺旋彈簧732的彈性力，成 為閂鎖構件731的前端731a回復至關閉位置的方式。 又’在本實施例中，如第1〇A圖及第⑽圖所示般， 對於㈣入器71G@ IC7t件的收容方向（通常係垂直方 向），在抽如於以元件側傾斜α度（例如p。程度）的 狀態下，# 733被***至嵌入器本體72〇。因此，問鎖構 2247 - 10161-ΡΕ1 17 200941832 件7 31的前端7 21 Q & 每Ula係，在對於嵌入器本體72〇的主 斜的平面PL上，成為將軸733作為中心迴轉動作的方式。 因^因為伴隨著閃鎖構件731的迴轉動作，閃鎖構件731 的前端73U的高度係成為可變動的所以也可對應 隨著種類交換的1(：元件的厚度的變更。 如第9A圖〜第106圖所示般，在嵌入器本體720的元 牛收谷部721的内壁面中，在沿著該喪入器本體72〇的長 _ 、 °的面上用以收容閂鎖構件731的收容凹部7 22係 被形成。在本實施例中，如第8B圖、第9b圖及第⑽圖 所示般，在打開位置中，問鎖構件731係被完全地收容在 收奋凹部722内’可將元件收容部721的開口尺寸依昭Ic 元件的尺寸以最大限度來活用。又，在本實施例中/因為 問鎖構件731在打開位置中，實質上沿著嵌入器本體？2。 的長度方向，所以在問鎖構件731中，可增長由迴轉中心 731b至前端731a的距離，所以可增加前端π"的迴轉 ❹ 動量。 槓桿734係，如第7圖所示般，在被形成於嵌入器本 體720的槓捍***孔723，經由線圈彈簧735被***。如 第7圖、第9A圖以及第9B圖所示般，在槓桿？34的下部、 段差部734a係被形成，且槓桿***孔723係連通於收容 凹部722,段差部734a係成為可抵接於問鎖構件731' 端731c 。 、後 .在未按壓槓桿734的狀態下，閂鎖構件73ι的前端 7 31 a係位於關閉位置，然而槓桿7 3 4 一被按壓的話，=由 2247-10161-PF 18 200941832 槓請，問鎖構件731的後端731c被按 二一轉移動至打開位置由於槓= 係，一麼下問鎖構件731的後端731c的話，同時朝向缺 入器本體72。的内側遷出，如第7圖所示般，段差部心 的接觸面不是平坦而是傾斜。 線圈彈簧735係將槓桿734偏愿至上方（從嵌入器本 體720遠離的方向）。因此，一接受朝下方（接近於嵌入器 本體720的方向）的按壓力的話，對抗線圈彈簧挪的彈 性力，横桿734移動至下方。另一方面，一解除朝横桿734 的按壓力的話，藉由線圈彈簧735的彈性力，成為槓桿734 回復至上方的方式。 如第7圖、第9A圖以及第9B圖所示般，長孔73牡 被形成在槓桿734的下部，们36從嵌人器本體72〇的外 侧破***至此長孔734b。藉此，槓桿？34朝上方的移動被 限制。 又’嵌入器本體720係’如第7圖所示般，具有由鉤 構件741、抽743以及線圈彈簧？42所構成的挟持機構。 鉤構件741係具有卡合於元件托架76〇的鉤接受部 761的鉤741a。此鉤構件741係，將與線圈彈簧？42 一起 被收容在嵌入器本體72〇的挾持收容部724，藉由從嵌入 器本體720的外側被***的轴743以可迴轉的方式被支 持。鉤構件741係，鉤741a朝向嵌入器本體72〇的方式， 藉由線圈彈簧742被偏壓。在嵌入器本體？2〇方面，此種 挾持機構被設置了兩個，可以可裝卸的方式保持元件托架 2247-i〇16l_p 19 200941832 :6〇。又’在本發明中，挾持機構的數量為複數的話，並 特別被限疋，例如即使在_個嵌人器本體m設置四個 挾持機構也可以。 ❹ 參 又，將元件托架760自嵌入器本體720取下之時，雖 然並未特別圖示，首先，在挾持收容部724將針狀的治具 自上方插人。其次，對抗線圈彈簧742的彈性力，使釣741a 迴轉至内側。藉此，因為釣川a和釣接受部761的卡合 被解除’所以可將元件托架從嵌入器本體72〇取下。 在嵌入器本體720的上側方面，如第了圖所示般，經 由線圈彈簧754,槓桿板75〇被安裝。 將横桿板㈣偏壓至上方(從嵌入器本體72〇遠離J 向）。因此，接受朝下方（接近篏入器本體720的方向）的 ㈣力的話’對抗線圈彈菁754的彈性力，槓桿板750係 朝下方移動，當該按覆力被解除之時，藉由線圈彈餐754 的彈性力，槓桿板750成為回復至上方的方式。又，如第 7圖、第1〇A圖以及第10B圖所示般，槓桿板巧。的長邊 751係’藉由卡合在被形成於嵌入器本體720的侧面的溝 725，槓桿板750朝上方的移動被限制。 在槓桿板750的約略中央處，如第7圖所示般嵌入 器本體720的元件收容部721露出般，開口 752被設置。 此開口 752係’不會造成經由進入口 721a朝元件收容部 721的1“件的出人的妨礙般，被形成為較進人口川& 約略大一些。 又，在槓桿板75G方面，如第7圖所示般，貫通孔753 2247-10161-PF 20 200941832 被叹置在對應於嵌入器本體720的挾持收容部723的位 置。此貫通孔753係，在將元件托架760從嵌入器本體72〇 拆裝之際被使用。 在喪入器本體720的下侧方面，如第7圖所示般，元 件托架760被裝著。The component housing portion 721 of the valley 1C element is provided. The component housing portion 721 is like a A9A mesh to the first! As shown in FIG. 0B, the upper portion has a c-element entry=inlet port 72ia', and at the lower portion, the mounting port 721bitit inlet 721a and the mounting port 721b are attached to the lower portion. The c-element that has entered the accommodating portion 721 is guided to the component holder 76 that is attached to the attachment opening 721b. Further, in the present embodiment, although the manner in which the embedding device 71 () accommodates a K element is described, it is not particularly limited in the present invention, even if it is formed in the interceptor body 720. The plurality of component housing portions 721 may accommodate a plurality of 1C components in the same-embedded device 71. As shown in Fig. 7, the main body 720 has a latch mechanism composed of a flash lock member 73, a coil spring 732, a shaft m, a lever 7, and a bobbin 735. The flash lock member 731 is similar to the upper end 731a of the κ element housed in the element accommodating portion 721 and is pressed by the lever 734 as shown in FIG. 9A and FIG. rear end? 31c. Further, between the front end 731a and the rear end 731c of the latch member 731, a through hole which is a k-turn to 731b is formed, and the shaft 733 is inserted into the through hole 1 and the lock member 731 is rotatably supported. For the forged body 720. The flash lock member m is rotated around the shaft 733, so that the front end 731a of the lock member m can be moved to a position close to the upper surface of the IC component housed in the component housing portion (2), preventing the component from jumping out (in The state shown in FIG. 9A and FIG. 1A is simply referred to as 2247-10161-pp 16 200941832 closed position), and can be used as an ic element away from the upper surface of the ic element housed in the component housing portion 721. The manner in which the inserted position (in the 8th, 9th, and ninth) is shown in the figure, which is hereinafter simply referred to as the open position). In the present embodiment, as seen from the plane of the embedder 71A shown in Figs. 8A and 8B, since the front end 73U of the flash lock member 731 is rotated, a large amount of movement of the front end 731a can be secured. In particular, in the embedder 710' of the present embodiment, since the front end of the lock member 731 is "movable to the vicinity of the center of the component housing portion 721, it can be accommodated in the 8a, 9A, and 10A drawings. The ic element having a relatively small size indicated by the symbol IC can also accommodate a 1C element having a relatively large size indicated by the symbol ICb in the same figure, so that the applicability to the size of the Ic element is improved. As shown in Fig. 7, Fig. 1A and Fig. ,, the 轱733 is used as a center of rotation between the flash lock member 731 and the inserter body 720, and the elastic force thereof is used to lock the lock. The member 731 is in the closed position. Therefore, when the elastic force against the coil spring 732 and the rear end 731c of the lock member 731 are (4), the front end 73ia of the lock member 731 is moved to the open position. When the pressing of the rear end 731c of the lock mechanism 73i is released, the elastic force of the coil spring 732 causes the front end 731a of the latch member 731 to return to the closed position. In the present embodiment, as in the first embodiment As shown in Figure A and Figure (10), for (4) Injector 71G @ IC7t member housing direction (usually in the vertical direction), in the state of being pulled by the element side by a degree (for example, p. degree), #733 is inserted into the embedder body 72〇. Therefore, the lock 2247 is asked. - 10161 - ΡΕ 1 17 200941832 The front end 7 of the 7 311 7 Q & Each Ula system is a mode in which the axis 733 is rotated as a center on the plane PL of the main slant of the embedder body 72 。. In the turning operation of the flash lock member 731, the height of the front end 73U of the flash lock member 731 is variable, and therefore it is also possible to correspond to the type 1 exchanged by the type (the thickness of the element is changed. For example, Fig. 9A to Fig. 106) Generally, in the inner wall surface of the bull-receiving portion 721 of the inserter body 720, the housing recess 7b for accommodating the latch member 731 is disposed along the length _, ° of the damper body 72 〇. In the present embodiment, as shown in Figs. 8B, 9b, and 10(10), in the open position, the lock member 731 is completely housed in the recessed recess 722. The opening size of the accommodating portion 721 is maximized according to the size of the Ic component. Further, in the present embodiment, since the lock member 731 is substantially in the longitudinal direction of the inserter body 2 in the open position, the lock lock member 731 can be grown from the swing center 731b to the front end 731a. The distance of the front end π" can be increased. The lever 734 is inserted into the lever insertion hole 723 formed in the inserter body 720 via the coil spring 735 as shown in Fig. 7. 7, 9A, and 9B, in the leverage? The lower portion of the 34 and the step portion 734a are formed, and the lever insertion hole 723 communicates with the housing recess 722, and the step portion 734a is abuttable against the end 731c of the lock member 731'. After the lever 734 is not pressed, the front end 7 31 a of the latch member 73 i is in the closed position, but if the lever 7 3 4 is pressed, = 2247-10161-PF 18 200941832 bar, ask the lock The rear end 731c of the member 731 is moved to the open position by the two-in-one rotation, and the rear end 731c of the lock member 731 is simultaneously turned toward the ejector body 72. The inside of the section is moved out. As shown in Fig. 7, the contact surface of the stepped portion is not flat but inclined. Coil spring 735 biases lever 734 upward (in the direction away from embedder body 720). Therefore, as soon as the pressing force toward the lower side (the direction close to the inserter body 720) is received, the crossbar 734 moves to the lower side against the elastic force of the coil spring. On the other hand, when the pressing force to the crossbar 734 is released, the elastic force of the coil spring 735 causes the lever 734 to return to the upper side. As shown in Fig. 7, Fig. 9A, and Fig. 9B, the long holes 73 are formed in the lower portion of the lever 734, and the females 36 are inserted into the long holes 734b from the outer side of the inner body 72b. With this, leverage? The movement of 34 upwards is limited. Further, as shown in Fig. 7, the 'embedder body 720 system' has a hook member 741, a pumping 743, and a coil spring. 42 holding mechanism. The hook member 741 has a hook 741a that is engaged with the hook receiving portion 761 of the component bracket 76A. This hook member 741 is going to be with the coil spring? 42 is housed in the holding portion 724 of the inserter body 72A, and is rotatably supported by a shaft 743 inserted from the outside of the insert body 720. The hook member 741 is biased by the coil spring 742 in such a manner that the hook 741a faces the inserter body 72. In the embedded body? In the second aspect, the holding mechanism is provided in two, and the component holder 2247-i〇16l_p 19 200941832 :6〇 can be held in a detachable manner. Further, in the present invention, the number of the holding mechanisms is plural, and is particularly limited, for example, even if four holding mechanisms are provided in the body unit m. Further, when the component holder 760 is removed from the embedding body 720, although not shown in the drawings, first, the needle-shaped jig is inserted from above in the holding portion 724. Next, against the elastic force of the coil spring 742, the fishing 741a is swung to the inner side. Thereby, since the engagement of the fishing boat a and the fishing receiving portion 761 is released, the component holder can be removed from the inserter body 72. On the upper side of the inserter body 720, as shown in the figure, the lever plate 75 is mounted via the coil spring 754. The crossbar (4) is biased to the top (from the inserter body 72 away from the J direction). Therefore, when the (four) force toward the lower side (the direction close to the intrusion main body 720) is received, the lever plate 750 moves downward, and the coil plate 750 moves downward. When the pressing force is released, the coil is used. The elastic force of the meal 754, the lever plate 750 becomes the way to return to the top. Further, as shown in Fig. 7, Fig. 1A, and Fig. 10B, the lever plate is clever. The long side 751 is engaged by the groove 725 formed on the side surface of the inserter body 720, and the upward movement of the lever plate 750 is restricted. At the approximate center of the lever plate 750, as shown in Fig. 7, the component housing portion 721 of the insert body 720 is exposed, and the opening 752 is provided. The opening 752 is formed to be approximately larger than the population of the "one member" of the member 721 via the inlet port 721a. Also, in the lever plate 75G, As shown in Fig. 7, the through hole 753 2247-10161-PF 20 200941832 is slid at a position corresponding to the holding accommodating portion 723 of the inserter body 720. This through hole 753 is used to connect the component holder 760 from the embedding device. The main body 72 is used for disassembly and assembly. On the lower side of the dejector main body 720, as shown in Fig. 7, the component holder 760 is mounted.
在元件托架760方面，貫通其底面的多數的導孔762 被設置。在本實施例中，藉由使IC元件的端子hb(參考第 9A圖〜第11圖）被嵌合於這些導孔762，將ic元件對於元 件托架760定位。因此，即使藉由IC元件的種類交換、 1C元件的外形改變時，有端子肋的大小或是間距相同的 話、元件托架m的交換不需要的情形，提高了元件托架 760的應用性。又’在本實施例中’對於一個端子RE使一 個導孔762被對應，然而在本發明中，並未特別被限定， 即使使一個導孔762對應於複數個端子肋也可以。 在元件托架760的上面’在同一對角線上的兩處挾 持機構的夠構件741的釣741a所卡合的鉤接受部Mi被 形成。例如，藉由1(：元件的種類交換，在端子肌間的間 距改變時’交換元件托架760。 圖係為本發明的實施例中的電子零件試驗裝置 的押出板、嵌入器、插座導件 從守仟以及插座的構造的剖面圖。 、如第11圖所示般，押出板121係、，在測試腔室12〇 中被設置於測試頭5的上方， 符初疋藉由未圖不的z轴驅 動裝置（例如流體壓缸）在z z軸方向上下移動。此押出板 對應於同時被料的1C元件的方式，以例如四 2247-10161-pp 21 200941832 灯十六列的配列方式被安裝在z軸驅動裝置。 在押出板121 #中央處，用以按壓1(：元件的按壓子 122係被形成。又，在押出板121的兩端，被***至嵌入 器710的導孔726及插座導件55的導y套筒“的導引針 123係被設置。 又，在嵌入器710的兩端方面，押出板121的導引針 123以及插座導件55的導引套筒⑸從上下分別被***的 φ 導孔726係被形成。 另一方面，在被固定於測試頭5的插座導件55的兩 端方面，押出板121的兩個導引針123被***的導引套筒 56被設置。 在1C元件的試驗時，2軸驅動裝置一下降的話，押出 板121的導引針123被***至嵌入器71〇的導孔726，又， 除了插座導件55的導引套筒56被***至嵌入器71〇的導 孔726之外’同時押出板ι21的導引針ι23被***至導弓丨 Ο 套筒56内，所以押出板121、嵌入器71〇及插座5〇係相 互地被定位。 1C元件的試驗係，在使1C元件的端子ΗΒ和插座5〇 的接觸針51電氣接觸的狀態下，藉由測試器6被實行。 此IC元件的試驗結果係’例如被記憶在藉由被賦予在測 試托盤TST的識別號碼、及在測試托盤TST的内部被分配 的1C元件的號碼所決定的位址。 〈卸載部400> •- 返回第2圖，和被設置在裝填部300的元件搬送裝置 2247-1Q152.-PF 22 200941832 310同一構造的元件搬送裝置410也在卸載部4〇〇被設置 兩台’藉由此元件搬送裝置410,從被運出至卸載部4〇〇 的測試托盤TST的已試驗完成的ic元件係被替換堆疊至 對應於試驗結果的顧客托盤KST。In the case of the component holder 760, a plurality of guide holes 762 penetrating the bottom surface thereof are provided. In the present embodiment, the ic element is positioned to the element holder 760 by fitting the terminal hb of the IC element (refer to Figs. 9A to 11) to the guide holes 762. Therefore, even when the type of the IC element is exchanged and the outer shape of the 1C element is changed, if the size or pitch of the terminal ribs is the same, the exchange of the element carrier m is unnecessary, and the applicability of the component holder 760 is improved. Further, in the present embodiment, a guide hole 762 is made to correspond to one terminal RE. However, in the present invention, it is not particularly limited, even if one guide hole 762 corresponds to a plurality of terminal ribs. A hook receiving portion Mi engaged with the fishing 741a of the sufficient member 741 of the two holding mechanisms on the same diagonal line on the upper side of the component bracket 760 is formed. For example, the exchange member bracket 760 is exchanged by 1 (: type exchange of components, when the pitch between the terminal muscles is changed.) The figure is an extrusion plate, an inserter, and a socket guide of the electronic component test device in the embodiment of the present invention. A cross-sectional view of the structure of the shackle and the socket. As shown in Fig. 11, the squeezing plate 121 is placed above the test head 5 in the test chamber 12 ,, and the symbol is not shown. The z-axis driving device (for example, the fluid pressure cylinder) is moved up and down in the direction of the zz axis. This extruding plate corresponds to the way of the 1C component being simultaneously fed, for example, in the arrangement of sixteen columns of 2247-10161-pp 21 200941832 lamps. It is attached to the z-axis driving device. At the center of the extruding plate 121 #, a pressing member 122 for pressing the member 1 is formed. Further, at both ends of the extruding plate 121, the guide hole is inserted into the embedding device 710. The guide pin 123 of the 726 and the guide y sleeve of the socket guide 55 is provided. Further, at both ends of the inserter 710, the guide pin 123 of the plate 121 and the guide sleeve of the socket guide 55 are pushed out. (5) The φ guide hole 726 which is inserted from the upper and lower sides is formed. In the aspect of the both ends of the socket guide 55 fixed to the test head 5, the guide sleeves 56 into which the two guide pins 123 of the extrusion plate 121 are inserted are disposed. In the test of the 1C component, the 2-axis drive As soon as the device is lowered, the guide pin 123 of the ejecting plate 121 is inserted into the guide hole 726 of the embedding device 71, and, in addition, the guiding sleeve 56 of the receptacle guide 55 is inserted into the guide hole 726 of the embedding device 71. The guide pin ι23 of the outer squeezing plate ι21 is inserted into the guide bow sleeve 56, so that the squeezing plate 121, the inserter 71 〇 and the socket 5 are mutually positioned. The test system of the 1C component is The terminal ΗΒ of the 1C element and the contact pin 51 of the socket 5〇 are electrically contacted by the tester 6. The test result of the IC component is, for example, memorized by the identification number given to the test tray TST. And the address determined by the number of the 1C component assigned to the inside of the test tray TST. <Unloading unit 400> •- Returning to Fig. 2, and the component transporting device 2247-1Q152.-PF provided in the loading unit 300 22 200941832 310 The component transfer device 410 of the same configuration is also in the unloading section 4" is set to "by the component transporting device 410, the tested ic components from the test tray TST that are transported out to the unloading section 4" are replaced and stacked to the customer tray KST corresponding to the test result. .
如第2圖所示般，在卸載部400中的裝置基台1〇1方 面，以從收納部200被運入至卸載部4〇〇的顧客托盤KST 相鄰在裝置基台101的上面的方式被配置的一對窗部470 ^ 被形成兩組。 又，雖然省略圖示，在每個窗部37〇、47〇的下侧方 面，用以使顧客托盤KST昇降的昇降桌被設置。在卸載部 400中，使藉由已試驗完成的1C元件成為滿載的顧客托盤 KST下降’將該滿載托盤交給托盤移送臂205。 以下，參考第8A圖〜第1 〇β圖，說明有關本實施例中 的嵌入器的動作。 例如，舉例使用元件搬送裝置41〇將被收容在測試托 β 盤tst的ic元件取出的情形說明。第8Α圖、第9Α圖及 第10Α圖係表示1C元件被收容在測試托盤TST的狀態（閂 鎖構件731的前端731a為關閉位置的狀態），在此狀態 下，元件搬送裝置410的吸著頭一接近於各嵌入器71()的 話’在此吸著頭的一部，槓桿板750被壓下。伴隨於此， 藉由槓桿734、閂鎖構件731的後端731c被壓下，閂鎖構 件731係，以軸733作為迴轉中心迴轉，閂鎖構件731的 前端731a朝打開位置的狀態遷移。 將此狀態在第8B圖、第9β圖及第10B圖表示，閂鎖 2247-10161-PF 23 200941832 構件731係，從1C元件的上面 ^ + iUtr7nn 還離’破完全收容在嵌入 器本體720的收容凹部722内，规# 吸耆頭係可保持IC元件。 如以上般，在本實施例中， d 因為使閂鎖構件731至少 在嵌入器710的平面上看來作 得動作，所以可將閂鎖構 件731的刖端731a的移動量择 口』 重增加，可提高對於1C元件的 尺寸的應用性。 又，以上說明的實施例係為 ❹ 參 ^ 4谷易理解本發明所做的 a己載，而不是為了限制本發明 I月而5己載的。因而，在被揭露 於上述實施例的各要素也包含屬 言屬於本發明的技術範圍中 的全部的設計變更及均等物的旨趣。 在上述實施例中，說明了使閃鎖構件731在對於後入 器本體72G的主面傾斜的平面pL上迴轉的方式，献而在 本發明中並未特別被限定於此。例如，使問鎖構件731在 對於嵌入器本體720的主面實質上平耔 貝貝上十仃的平面上迴轉的方 式亦可。又’在此時，在將力從槓桿m傳達至閃鎖構件 731之際’例如，利用楔的原理等，將從槓捍被輸入的垂 直方向的力變換為水平方向的話也可。 【圖式簡單說明】 第1圖係表示本發明的實施例中的電子零件試驗裝置 的概略剖面圖； 第2圖係表示本發明的實施例中的電子零件試驗裝置 的立體圖； » . 第3圖係表示本發明的實施例中的托盤的處理的概余 2247-10161-PF 24 200941832 圖； 第4圖係為被使用在本發明的實施例中的電子零件試 驗裝置的1C貯存器的分解立體圖； = 第5圖係為被使用在本發明的實施例中的電子零件 驗裝置的顧客托盤的立體圖； * 第Θ圖係為被使用在本發明的實施例中的電子零件 驗裝置的測試托盤的分解立體圖； ’As shown in FIG. 2, in the apparatus base 1〇1 of the unloading unit 400, the customer tray KST carried from the storage unit 200 to the unloading unit 4 is adjacent to the upper surface of the apparatus base 101. A pair of window portions 470^ configured in a manner are formed in two groups. Further, although not shown, a lower table for lifting and lowering the customer tray KST is provided on the lower side of each of the window portions 37A and 47B. In the unloading unit 400, the customer tray KST that has been fully loaded by the tested 1C component is lowered, and the full tray is delivered to the tray transfer arm 205. Hereinafter, the operation of the embedder in the present embodiment will be described with reference to Figs. 8A to 1B. For example, a case where the ic element housed in the test tray β-tst is taken out by the component transfer device 41 will be described. The eighth drawing, the ninth drawing, and the tenth drawing show the state in which the 1C element is housed in the test tray TST (the state in which the front end 731a of the latch member 731 is in the closed position), and in this state, the component conveying device 410 is sucked. As soon as the first one approaches the embedders 71(), the lever plate 750 is depressed. With this, the lever 734 and the rear end 731c of the latch member 731 are depressed, and the latch member 731 is rotated with the shaft 733 as a center of rotation, and the front end 731a of the latch member 731 is moved toward the open position. This state is shown in FIG. 8B, FIG. 9β and FIG. 10B, and the latch 2247-10161-PF 23 200941832 member 731 is attached from the upper surface of the 1C element ^ i itr7nn to the 'completely received in the embedder body 720'. In the housing recess 722, the gauge # suction head can hold the IC component. As described above, in the present embodiment, d, since the latch member 731 is made to act at least on the plane of the inserter 710, the amount of movement of the end 731a of the latch member 731 can be increased. The applicability to the size of the 1C component can be improved. Further, the above-described embodiments are those of the present invention, and are not intended to limit the present invention. Therefore, the respective elements disclosed in the above embodiments are intended to encompass all of the design changes and equivalents of the technical scope of the present invention. In the above embodiment, the manner in which the flash lock member 731 is rotated on the plane pL inclined with respect to the main surface of the rear injector body 72G has been described, and is not particularly limited in the present invention. For example, the question lock member 731 may be rotated in a plane which is substantially flat on the top surface of the inserter body 720. Further, at this time, when the force is transmitted from the lever m to the flash lock member 731, for example, the force in the vertical direction to which the lever is input may be converted into the horizontal direction by the principle of the wedge or the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an electronic component testing device in an embodiment of the present invention; and Fig. 2 is a perspective view showing an electronic component testing device in an embodiment of the present invention; The figure shows the remainder of the processing of the tray in the embodiment of the present invention 2247-10161-PF 24 200941832; Fig. 4 is the decomposition of the 1C reservoir of the electronic component testing device used in the embodiment of the present invention Fig. 5 is a perspective view of a customer tray used in the electronic component inspection apparatus in the embodiment of the present invention; * The first diagram is a test of the electronic component inspection apparatus used in the embodiment of the present invention. An exploded perspective view of the tray; '
❹ 第7圖係表示被使用在第6圖所示的測試托盤的 器的分解立體圖； 第8A圖係為本發明的實施例中的嵌入器的平面圖， 表示閂鎖構件位在關閉位置的狀態的圖； 第8B圖係為本發明的實施例中的嵌入器的平面圖， 表示閃鎖構件位於打開位置的狀態的圖； ， 第9A圖係為沿著第8A圖的IXA-IXA線的剖面圖； 第9B圖係為沿著第8B圖的IXB-IXB線的剖面圖； 第i〇A圖係為沿著第8A圖的χΑ_χΑ線的剖面圖； 第1〇B圖係為沿著第8Β圖的ΧΒ-ΧΒ線的剖面圖；以 1 1 圖係為表示本發明的實施例中的電子零件試驗 押出板、嵌入器、插座導件以及插座的構造的剖面 圖。 【主要元件符號說明】 1操控器、Figure 7 is an exploded perspective view showing the device used in the test tray shown in Figure 6; Figure 8A is a plan view showing the inserter in the embodiment of the present invention, showing the state in which the latch member is in the closed position. Figure 8B is a plan view of the embedder in the embodiment of the present invention, showing a state in which the flash lock member is in the open position; and Figure 9A is a cross-sectional view taken along line IXA-IXA of Figure 8A. Fig. 9B is a cross-sectional view taken along line IXB-IXB of Fig. 8B; Fig. 9A is a cross-sectional view taken along line χΑ_χΑ of Fig. 8A; Fig. 1B is taken along line 8 is a cross-sectional view of a ΧΒ-ΧΒ line; FIG. 1 is a cross-sectional view showing the structure of an electronic component test urging plate, an inserter, a socket guide, and a socket in an embodiment of the present invention. [Main component symbol description] 1 manipulator,
2247-l〇161_pF 25 200941832 5測試頭、 50插座、 6測試器、 TST測試托盤、 701框架構件、 710嵌入器、 720嵌入器本體、 721元件收容部、 參 721a進入口、 7 2 2收容凹部、 725 溝、 731閂鎖構件、 731a前端、 7 31 b迴轉中心、 7 31 c後端、 _ 732螺旋彈簧、 733 轴、 734槓桿、 750槓桿板、 752 開口、 760元件托架、 IC尺寸上比較小的IC元件 ICb尺寸上比較大的1C元件 2247-10161-PF 262247-l〇161_pF 25 200941832 5 test head, 50 socket, 6 tester, TST test tray, 701 frame member, 710 embedder, 720 embedder body, 721 component housing, 721a inlet, 7 2 2 housing recess , 725 groove, 731 latching member, 731a front end, 7 31 b swivel center, 7 31 c rear end, _ 732 coil spring, 733 shaft, 734 lever, 750 lever plate, 752 opening, 760 component bracket, IC size Smaller IC component ICb size larger 1C component 2247-10161-PF 26