TW200938599A - Curable high dielectric constant ink composition and high dielectric film - Google Patents

Abstract

The invention discloses a curable ink composition which comprises about 1-10 parts by weight of a curable epoxy resin system, about 1-30 parts by weight of ferroelectric ceramic powders, about 0.1-10 parts by weight of a polymeric dispersant, and about 50-96 parts by weight of a solvent. The ink composition is suitable for forming a high dielectric film by inkjet printing for built-in capacitors.

Description

200938599 九、發明說明： 【發明所屬之技術領域】 本發明係有關於墨水組成物，且特別是有關於 硬化交聯型高介電墨水組成物。 種可200938599 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to ink compositions, and more particularly to hardened crosslinked high dielectric ink compositions. Kind

【先前技徇J 近來電子產品生活化與高功能化之需求大增 ❹的印刷電路基板產業蓬勃發展，同時電子產品上朝4目對使 薄、短、小、多樣化及訊號傳輸的高速高頻化，因:輕、 電路基板上的被動原件與主動元件數量比例也大幅^刷 為了提高被動元件於印刷電路基板上的應用，將被^ _σ， 薄型化可大幅提降低電路板面積，以及利用小型化技術2 優點，將薄型化的被動元件嵌入電路板中，以提高元ς密 度’已成為發展趨勢。 就埋入式電容(Embedded capacitor)而言，其製程為利 ❹用多層板之内層板製程，採用蝕刻或網印方式，將電容直 接製作在内層板上，或製作成背膠銅箔使用增層方式，在 每壓成多層板後’即可取代面板上組裝時所需焊接的電 各’這樣的内藏電容技術現階段可以直接套用於硬板(Rigid PCB)製程。從現在電子產品的趨勢來看，高頻化、多功能 化’而且可攜式是必備的條件，這些產品中早已不乏印刷 電路板的需求’爲了縮裝與高功能化，介電層厚度薄型化 j提高電容值也將成為趨勢，如何形成超薄（數微米以下） 同门電基板，取代表面貼著（SMD)去偶合電容，成為印刷 5 200938599 電路板(PCB)產業要努力的課題。 現階段製作高電容材料層的方式不易製得具有 ^最m2以上之介電層，且現有PCB製程相容的高介 $材料中的有機樹脂介電常數皆不高’必需藉由厚度調降 才能達到】nFW以上高電容密度需求，因此當膜厚僅有 17因1^時介電強度將是決定該材料是否具有應用性的 ㈣2技術方式將高介電墨水直接噴印在基材上方 式’與先前習知利用餘刻或網印方式製作内埋 =;=^化’又容易達到超薄需求，是低^ (&lt;200C)達“ f容㈣的好方法。只 度受限於操作溫度下必須小於 ==墨達到低黏度要求，然而這卻也因此造成該油墨 ” +佳’甚至最終所形成之介電層的耐熱性及耐化 隹不足1此，若要藉由嗔墨列印(Inkjet _ti⑽製程 _ ;造超薄南電容材料應用於内埋式電容基板上，加強高 =用㈣的油墨可低純化與絲性，以及形成後的介 電θ之耐化性、耐熱性將更顯得重要。 .结構===多揭露電容製作方法及其各層 無機陶綱混合做簡單敘述，鮮： 攻碉具有超潯大電容特性薄膜。 料上5162977揭露一種埋入式電容結構，在材 ,”疋提及獲得高介電材料之方法—環氧樹財添加陶 6 200938599 :粉=技術’並未針對材料配方之重點技術詳做說 月亦凡王未針對噴印墨水設計考量。同樣地，美國專利 US 5800575與US 587〇274兩篇專利内容亦著重於 結構設計。 〃 美國專利US 5739193揭露一種高分子介電組成物，提 到熱可塑性樹脂及粉體之混合，主要是應用在熱熔融射出 成型的電子產品上。美國專利Us 66〇876〇 B2主要是利用 熱固性樹脂與高介電粉體來形成介電基材。另外us ❹6905757強調印刷電路板内埋電容層之製造方法，其内容 雖提到樹脂、纟且成及粉體之特性’但在說明書中也未曾出現 可利用噴印製作的材蝌配方。 上述專利中所提及的高介電材料配方，都有較大的黏 度(&gt;1 OOcps)，較大的^真充粉體顆粒(&gt;5〇〇 nm)，並無法用噴 印製程製作超薄電容，具可喷印性且高介電特性材料配方 絕非由習知之有機無機混成高介電材料配方技術所能輕易 學習得知。 過去利用喷印技術於製作介電薄膜上之專利，僅在 US20050137281A1揭示利用含氰基之乙烯共聚合物加入奈 米BaTi〇3介電陶瓷粉體，來達到可喷印高介電常數之墨水 目的，然而此類單純乙烯共聚合物系統介電材料耐熱性和 耐化性不佳，應用性將受限。 由上述說明得知，目前亟需一種可喷印式硬化型介電 墨水組成物材料配方，使超薄高介電層材料具有高时熱 性、耐化性等特性。 7 200938599 【發明内容】 本發明的主要目的在於提供一可硬化交聯型高介電墨 水組成物，特別適用於喷印製程以獲得超薄電容層，且同 時具有優異的财熱性與耐化性。 為達上述與其他目的，本發明之可硬化交聯型高介電 墨水組成物主要包括：約1〜10重量份之環氧樹脂系統；約 1〜30重量份之強介電性陶瓷粉體；約0.1〜10重量份之高分 子型分散劑；以及，約50至96重量份之溶媒，其沸點不 ❿低於l〇〇°C。 本發明更包括提供一種高介電薄膜，係由上述墨水組 成物經交聯硬化而成。 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉出較佳實施例，並配合所附圖式’作詳 細說明如下： 【實施方式】 〇 本發明揭示一種具可喷印性之硬化型高介電墨水組成 物材料配方技術，使超薄高介電層材料具有高耐熱性、耐 化性等特性，特別適合作為内藏式電容基板之電容介電 層。本發明之可硬化交聯型高介電墨水組成物主要包括： (A)環氧樹脂系統、（B)強介電性陶瓷粉體、（C)高分子型分 散劑、以及(D)溶媒。以下將針對各成分作詳細說明。 (A)環氧樹脂系統 本發明之高介電墨水組成物包括約1〜1〇重量份，較佳 8 200938599 約1〜5重量份之環氧樹脂系統（以100重量份之墨水組成物 為基準）所使用之環氧樹脂包括具有環氧基(〇xirane ring) 之單體、寡聚物、聚合物。具體的實例包括： ⑻雙酌 -A型環氧樹脂，例如DiglyCidyl ether of bisphenol A epoxy &gt; Tetrabromo bisphenol A diglycidyl ether epoxy ； (b) 雙酚-F型環氧樹脂 ❹ (c) 雙酚S型環氧樹脂 例如 dicyclopentadiene epoxy (d) 環脂肪族環氧樹脂 resin (e) 含萘環環氧樹脂 (f) 雙苯基環氧樹脂 ❹ (g) 酚醛清漆環氧樹脂 (h) 曱盼清漆環氣樹脂 (i)多官能基環 Η[Previous Technology J Recently, the demand for high-quality and high-performance electronic products has been booming in the printed circuit board industry. At the same time, the electronic products are moving toward a high-speed, short, small, diversified and signal transmission. Frequency, because: light, the ratio of the number of passive components and active components on the circuit board is also greatly improved. In order to improve the application of passive components on the printed circuit board, it will be reduced by _σ, which can greatly reduce the board area, and Utilizing the advantages of miniaturization technology 2, embedding thin passive components in a circuit board to increase the density of the elementary enamel has become a trend. In the case of an embedded capacitor, the process is to use the inner layer process of the multi-layer board, and the capacitor is directly fabricated on the inner layer board by etching or screen printing, or used as a backing copper foil. The layered method, after each pressing into a multi-layer board, can replace the electric power required for assembly on the panel. The built-in capacitor technology can be directly applied to the Rigid PCB process at this stage. From the current trend of electronic products, high-frequency, multi-functional and portable is an indispensable condition. There is no shortage of printed circuit boards in these products. In order to shrink and high-functionality, the thickness of the dielectric layer is thin. Increasing the capacitance value will also become a trend. How to form an ultra-thin (several micron or less) same-gate substrate instead of a surface-mount (SMD) decoupling capacitor has become an issue for the printing industry of 200938599 circuit board (PCB) industry. At this stage, the method of fabricating a high-capacitance material layer is not easy to produce a dielectric layer having a majority of m2 or more, and the dielectric constant of the organic resin in the high dielectric material of the existing PCB process is not high enough to be reduced by thickness. In order to achieve high capacitance density requirements above nFW, when the film thickness is only 17 due to 1 ^ dielectric strength will determine whether the material is applicable (4) 2 technical way to directly print high dielectric ink on the substrate 'It is easy to achieve the ultra-thin demand with the previous knowledge of using the residual or screen printing method to make the embedded ===^化', which is a good method for low ^ (&lt;200C) to reach f capacity (four). Only limited by At the operating temperature, it must be less than == ink to achieve low viscosity requirements, but this also causes the ink to be "+good" or even the heat resistance and chemical resistance of the resulting dielectric layer is less than one. Printing (Inkjet _ti (10) process _; making ultra-thin South capacitor material applied to the embedded capacitor substrate, strengthening the high = use (4) ink can be low purification and silk, and the formation of dielectric θ resistance and heat resistance Sex will be more important. Structure === more exposed capacitance production The method and its various layers of inorganic pottery are mixed and simply described. Fresh: The attack has a film with super-capacitance and large capacitance. On 5162977, a buried capacitor structure is disclosed, in which the material is mentioned, "When the method of obtaining a high dielectric material is mentioned" Epoxy tree added Tao 6 200938599: Powder = technology 'does not focus on the key technology of the material formula. The month is also not considered for the printing ink design. Similarly, the US patent US 5800575 and US 587〇274 two The patent content also focuses on structural design. 〃 US Pat. No. 5,739,193 discloses a polymeric dielectric composition, which refers to the mixing of thermoplastic resins and powders, mainly for use in hot melt injection molding of electronic products. U.S. Patent US 66 〇876〇B2 mainly uses thermosetting resin and high dielectric powder to form dielectric substrate. In addition, us ❹6905757 emphasizes the manufacturing method of buried capacitor layer in printed circuit board, which refers to resin, bismuth and powder. The characteristics 'but there is no material in the specification that can be produced by printing. The high dielectric material formulations mentioned in the above patents have a large viscosity ( &gt;1 OOcps), the larger ^ true charged powder particles (&gt; 5〇〇nm), and can not make ultra-thin capacitors with the printing process, the formulation with high printability and high dielectric properties is by no means The conventional organic-inorganic hybrid high-dielectric material formulation technology can be easily learned. In the past, a patent for the production of a dielectric film by a printing technique was disclosed in US Pat. No. 2,050,137, 281, the disclosure of which is incorporated herein by reference. 3 dielectric ceramic powder to achieve the purpose of printing high dielectric constant ink, however, such simple ethylene copolymer system dielectric materials have poor heat resistance and chemical resistance, and the application will be limited. It is known that there is a need for a formulation of a printable hardened dielectric ink composition material, which makes the ultra-thin high dielectric layer material have high heat and chemical resistance. 7 200938599 SUMMARY OF THE INVENTION The main object of the present invention is to provide a hardenable cross-linking type high dielectric ink composition, which is particularly suitable for use in a printing process to obtain an ultra-thin capacitor layer, and at the same time has excellent heat and chemical resistance. . For the above and other purposes, the hardenable crosslinked high dielectric ink composition of the present invention mainly comprises: about 1 to 10 parts by weight of an epoxy resin system; and about 1 to 30 parts by weight of a strong dielectric ceramic powder. About 0.1 to 10 parts by weight of the polymeric dispersant; and, about 50 to 96 parts by weight of the solvent, having a boiling point of not lower than 10 °C. The present invention further includes providing a high dielectric film formed by crosslinking and curing the above ink composition. The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the appended claims < The inkjet-type hardened high-dielectric ink composition material formulation technology makes the ultra-thin high-dielectric layer material have high heat resistance and chemical resistance, and is particularly suitable as a capacitor dielectric layer of a built-in capacitor substrate. . The hardenable crosslinked high dielectric ink composition of the present invention mainly comprises: (A) an epoxy resin system, (B) a ferroelectric ceramic powder, (C) a polymer type dispersant, and (D) a solvent. . The components will be described in detail below. (A) Epoxy Resin System The high dielectric ink composition of the present invention comprises about 1 to 1 part by weight, preferably 8 to 200938599, about 1 to 5 parts by weight of an epoxy resin system (100 parts by weight of the ink composition is The epoxy resin used in the reference includes a monomer having an epoxy group, an oligomer, and a polymer. Specific examples include: (8) Double-type epoxy resin such as DiglyCidyl ether of bisphenol A epoxy &gt; Tetrabromo bisphenol A diglycidyl ether epoxy; (b) Bisphenol-F type epoxy resin ❹ (c) Bisphenol S type Epoxy resin such as dicyclopentadiene epoxy (d) cycloaliphatic epoxy resin resin (e) naphthalene ring epoxy resin (f) bisphenyl epoxy resin ❹ (g) novolac epoxy resin (h) 曱 varnish ring Gas resin (i) polyfunctional ring oxime

氧樹脂，例如 例如 ⑴脂肪鏈型環氧樹脂， 〇 CH.-C十Hr0CH「— ， CHyO-GH^CH-Oi, 八 ， 叫-CH -CH? CH 广 CH -〇V〇-CH2-qCHJ r CHr O-OVCH-CH, ,0、 ， cVcH-〇V〇、CH心〔 〇、 CHr'CH-cHi 〇 〇 Λ , CH?-CH-CHr-0-C-CM-C-0-CH^€H-CH7 ? 9 200938599 ch-o-(ch^h^-CK_cAH! I ^ cH-o-iavcH，，』、 〇 0-CH,-CH-CH, i i di-O-C-TOrCH^CH-CHi-CH-lCH^-CK, I 〇 O-CHrCH-CH,Oxygen resin, for example, (1) aliphatic chain type epoxy resin, 〇CH.-C 十 Hr0CH "-, CHyO-GH^CH-Oi, 八,叫-CH-CH? CH 广CH-〇V〇-CH2-qCHJ r CHr O-OVCH-CH, ,0, , cVcH-〇V〇, CH heart [ 〇, CHr'CH-cHi 〇〇Λ , CH?-CH-CHr-0-C-CM-C-0-CH ^€H-CH7 ? 9 200938599 ch-o-(ch^h^-CK_cAH! I ^ cH-o-iavcH,,』, 〇0-CH,-CH-CH, ii di-OC-TOrCH^CH- CHi-CH-lCH^-CK, I 〇O-CHrCH-CH,

II

II

CH-o-c-iCHA-CH^CH-CH.-O-MCH^-CHj ! 〇 O-CH-Of-CH, i S i Cli-O-C-TOrCH-CH-CH^CH-tC^-CH 上述環氧樹脂可以單獨或混合使用，端視所需求之加 工及^性來作適當的選擇與調配。根據本發明，此處所使 用之環氧_旨㈣具有I5㈣上，更佳者具有18G。以上之 玻^轉移溫度以提供較佳的耐熱性。除了環氧樹脂外，環 ❹，樹脂系統中亦可視需要加入其他一種或一種以上熱塑性 高分子，例如聚乙烯縮丁醛、壓克力樹脂、聚醯胺-醯亞胺 等以調控高介電膜之物性如撓曲性。 除了樹脂成分外，環氧樹脂系統中可更包括硬化劑與 催化劑。硬化劑之添加量約5〜40重量份，以1〇〇重量份之 環氧樹脂為基準。較佳之硬化劑包括： (a)雙胺（diamine) : H2N—R]一NH2CH-oc-iCHA-CH^CH-CH.-O-MCH^-CHj ! 〇O-CH-Of-CH, i S i Cli-OC-TOrCH-CH-CH^CH-tC^-CH Oxygen resins can be used singly or in combination, and are appropriately selected and formulated depending on the processing and properties required. According to the present invention, the epoxy used herein has the meaning of (4) on I5 (four), and more preferably 18G. The above glass transition temperature provides better heat resistance. In addition to epoxy resin, it is also possible to add one or more thermoplastic polymers, such as polyvinyl butyral, acrylic resin, polyamido-imine, etc., to regulate high dielectric. The physical properties of the film are such as flexibility. In addition to the resin component, the epoxy resin system may further include a hardener and a catalyst. The amount of the hardener added is about 5 to 40 parts by weight based on 1 part by weight of the epoxy resin. Preferred hardeners include: (a) Diamine: H2N-R]-NH2

Ri可為芳香基、脂肪基、環脂肪基或含矽烷脂肪基等。 〇 (b)酸酐 例如六氫鄰苯二曱酸酐(hexahydrophthalic anhydride ; ΗΗΡΑ)、四氫鄰苯二曱酸針（tetrahydrophthalic anhydride ; ΤΗΡΑ)、甲基四氮鄰苯二曱酸針（methyl tetrahydrophthalic anhydride ; ΜΤΗΡΑ)、曱基六氫鄰苯二曱酸酐（methyl hexahydrophthalic anhydride ; MHHPA)等。 (c)盼樹脂(phenol resin) 例如 Phenol based resins、Naphthol based resins、 Terpene phenol resins、Dicyclopentadiene resins、 10 200938599 4,4’，4’’-Ethylidene trisphenol、Tetraphenylol ethane、 Tetraxylenol ethane、Tetracresolol ethane 等。 催化劑之添加量約0.1〜5重量份，以100重量份之環 氧樹脂為基準。較佳之催化劑包括： (a) 陽離子系觸媒 三氟化硼錯物，如 RNH2 · BF3, R2NH · BF3, R3N · BF3 等（其中R代表烷基）。 (b) 陰離子系觸媒 〇 三級胺、金屬氫氧化物、單環氧化物之配位陰離子觸 媒，如 R3N (R 代表烧基），tetramethylguanidine(TMG)， NCH2C-C(NH)_N(CH3)2 等。 (c) 咪嗤 1-曱基咪唑、1，2-二曱基咪唑、2-十七烷基咪唑、2-乙 基_4_曱基咪唑等。 (B)強介電性陶瓷粉體 ® 本發明之高介電墨水組成物包括約1〜30重量份，較佳 約5〜20重量份之強介電性陶瓷粉體（以100重量份之墨水 組成物為基準）。所使用之強介電性（Ferroelectric)陶兗粉 體，例如：BaTi03，以及植入金屬離子如Ca，Zr，Mg等之 BaTi03，Ba(Sr)Ti03陶瓷粉體。本發明之高介電喷墨墨水 所含之強介電性陶瓷粉體（或稱高介電粉體），為能使能利 用喷墨製程製作及提高喷印之介電層薄膜緻密性，其構成 粒子平均粒徑範圍為10〜400 nm，能小於250nm更佳。若 200938599 平均粒徑大於500 nm時，則在噴印高介電墨水過程中易堵 塞喷頭’難以列印圖案。本發明中亦可使用兩種以上不同 粒徑的陶瓷粉體，來增加陶瓷粉體的堆積密度以提高電容 值。 ° (C)分散劑 本發明之高介電墨水組成物包括約0.1〜1 〇重量份，較 佳約1〜5重量份之分散劑（以100重量份之墨水組成物為基 ❹準）。為使強介電性陶瓷粉體微粒能長期安定分散在含可交 聯硬化環氧樹脂之墨水中，須有適當的分散劑將介電粉體 粒子分散安定化，以避免墨水在長期使用過程中於墨昆内 内產生粒子聚'集沉降、黏度過大等問題產生，以維持噴墨 過程中墨滴大小、墨滴速度、墨滴喷印方向變異之最佳化。 爲了達到上述要求，本發明使用高分子型分散劑，其 與無機粉體具有良好的附著性，且又與有機樹脂間有優良 之相容性（亦可與有機樹脂帶有反應性），可大幅提升高介 ® 電薄膜之耐熱性與可靠性。較佳之高分子型分散劑包括聚 酯類、聚醯胺類、聚胺基酸酯類、聚磷酯類、或上述之共 聚物’可以單使用一種或是二者以上同時使用，其中以親 油性尚分子分散劑較佳，但亦可使用雙性型高分子分散 劑。商用上適合本發明之高分子型分散劑包括（但不限 於）：BYK-9010 (BYK chemie 公司）、KD 系列（Uniqema 公 司）、ADO 1 (Air products 公司）等。 12 200938599 (D)溶媒 本發明之南介電墨水組成物包括約5〇〜96重量份，較 佳約55〜85重量份之溶媒（以1〇〇重量份之墨水組成物為基 準）。本發明係使用沸點不低於1〇〇。〇之溶媒，以避免油墨 蒸亂壓過低導致喷印效果不佳。適合本發明之溶媒包括： 酸酯類、醇類、醯胺類、或前述之組合。具體的實例包括（但 不限於）：乳酸乙酯、醋酸丁酯、卡必醇乙酸酯、曱苯、二 曱苯、丁醇、乙二醇、丙二醇、曱氧基丙二醇、乙氧基; © 一醇、二甲基乙醯胺、或前述之組合。 應注意的是’本發明可使用單一溶媒系統或多溶媒系 統’因此除了上述丨弗點不低於鮮c之溶媒以外，亦可包 括沸點低於100°C之共溶媒，例如乙醇、丙醇、乙酸乙酯 (E)其他添加劑 ❹ 除了上述成分外，本發明之高介電墨水組成物亦可包 .其他習知常用於墨水組成物或介電薄膜之添加劑，如辦 黏著劑、料魏合劑、界㈣性劑等，以不 : 噴墨性質與介電性質為宜。复中矽 警見有之 基矽烷、胺基^夕烷等。増黏著劑例如是 虱 vir^l ’其中h分別重複單體之數目。 至 100 cps 本發明之高介電墨水組成物之黏度約介於！ 200938599 * 之間’可視噴墨機台之操作溫度與喷墨頭尺寸作適當調 整。墨水組成物之表面張力約介於20至60 Dyne/cm之間， 亦可視基板表面的親疏水性進行調整，以提升墨水之附著 性。 本發明之高介電墨水組成物不但具有良好油墨儲存性 以及喷墨性，加熱硬化交聯後又可賦予介電層有良好耐熱 及耐化性。此外，高介電墨水組成物所形成之介電薄膜高 電容值特性’特別適合以噴墨方式製作超薄型（厚度小於5 ❹ #m)内埋之電容材料。在較佳實施例中，可製作出介電常 數（1MHz)大於10之超薄高介電層。 應注意的是，本發明所揭露之熱可硬化型高介電墨水 組成物’除了可用喷印方式之外，亦可藉由凹版印刷塗佈 (Gravure coating) '旋轉塗佈、刮刀塗佈、凸版印刷 (Letterpress)、彈性凸版印刷（Flexography)等方式製備高介 電薄膜，達成超薄高介電基板。此外，所形成之高介電薄 膜亦非僅限於應用在内藏式電容基板，反之，熟悉此技藝 ® 人士當可將之應用在各種電子元件的製作，例如電晶體、 二極體、電阻等。 【實施例一】 &lt;南介電粉體分散液〉 將100克平均粒徑約100nm的BaTi〇3(Inframat Advanced Materials ’ BT-1)，加入20克高分子型分散劑 BYK-9010 (BYK chemie 供應，含酸基共聚合物 acid group 14 200938599 copolymer分散劑A)，並加入760克研磨介質錯·珠及150 克乳酸乙酯溶媒，接著以砂磨機潤濕研磨2小時作分散處 理，之後過濾分離研磨珠，即得到高介電粉體分散液。 &lt;樹脂黏結劑系統&gt; 將 10.50 克雙紛-A 環氧樹脂（bisphenol-A diglycidyl ether)(188EL，長春樹脂公司，台灣）、7.70克四溴化雙酚 -A 環氧樹脂（tetrabromo disphenol-A diglcidyl ether)(BEB-350，長春公司，台灣）、2.70克環脂肪族環氧 ® 樹月旨（eyclo aliphatic epoxy) (HP-7200，DIC，日本）、3.70 克多官能基環氧樹脂(Multifunctional epoxy) (EPPON502H, 曰本化藥）系統與460克的乳酸乙酯（ethyl lactate)溶媒，於 反應瓶中加熱到90°C混合溶解加熱時間約30分鐘，冷卻 之後即為環氧樹脂黏結劑-1，之後加入5.60克曱基六氫鄰 苯二曱酸酐交聯硬化劑(ACROS，美國）與〇.〇8克2-乙基-4-曱基咪唑催化劑（ACROS’美國），以高速攪拌機用2000 rpm攪拌10分鐘，即完成樹脂黏結劑。 ® &lt;高介電油墨系統〉 取2.5克上述高介電粉體分散液加入於克的樹脂黏 結劑中，擾拌30分鐘後即製成可硬化型介電墨水。接著使 用上述墨水裝入 Dimatix printer (DMCLCP-11610)墨水 匣，以Dimatix printer (DMP2800)噴墨列機内建液滴成形 銳墨儀，觀察其喷印結果。並將上述墨水喷印於銅箔基材 上，經過180。(：烘烤2.5小時，即可在銅箔上交聯硬化形成 一層高介電膜層。 15 200938599 【實施例二】 製備程序同實施例一，但其中高介電粉體改用平均粒 桎約 300nm 的 BaTi〇3 (Prosperity Dielectrics Co.，BT-2)， 各成分之添加量詳見表一。 【實施例三】 製備程序同實施例一，但其中分散劑改用另一種親油 性尚分子型分散劑KD-l(Uniqema，Hypermer分散劑C)， ❹各成分之添加量詳見表一。 【實施例四】 製備程序同實施例一，但其中高介電粉體改為BT-1與 BT-2混合使用，各成分之添加量詳見表一。 【實施例五】 製備程序同實施例一，但其中樹脂黏結劑系統加入聚 乙稀縮丁酸(1&gt;〇13^11171131^以)），配製如下： ® 將 9.20 克雙紛 _A 環氧樹脂（bisphenol-A diglycidyl ether)(188EL，長春樹脂公司，台灣）、6·50克四溴化雙酚 Ά 環氧樹脂（tetrabromo disphenol-A diglcidyl ether)(BEB-350，長春公司，台灣）、1.60克環脂肪族環氧 樹脂（cyclo aliphatic epoxy) (HP-7200，DIC，日本）、2.40 克多官能基環氧樹脂(Multifunctional epoxy) (EPPON502H， 曰本化藥）系統及4·91克Poly(vinyl butyral) (PVB，長春樹 脂公司，台灣）與460克的乳酸乙酯（ethyl lactate)溶媒，於 16 200938599 反應瓶中加熱到90°C混合溶解加熱時間約30分鐘，冷卻 之後即為環氧樹脂黏結劑-2，之後加入5.60克曱基六氫鄰 苯二曱酸酐交聯硬化劑（ACROS，美國）與0.08克2-乙基-4-曱基咪唑催化劑（ACROS，美國），以高速攪拌機用2000 rpm攪拌10分鐘，即完成樹脂黏結劑。 【實施例六】 @ 製備程序同實施例一，但其中高介電油墨系統配置以 取1.0克高介電粉體分散液加入於3.8克的樹脂黏結劑及 15克乳酸乙酯中，攪拌30分鐘後即製成可硬化型介電墨 水0 【實施例七】 製備程序同實施例一，但樹脂黏結劑系統中乳酸乙酯 (ethyl lactate)溶媒含量改為40克，另外高介電油墨系統配 置以取2.8克高介電粉體分散液加入於1.02克的樹脂黏結 劑中，攪拌30分鐘後即製成可硬化型介電墨水。 【比較例一】 製備程序同實施例一，但其中分散劑改用親水性分散 劑BYK-112 (BYK chemie供應，分散劑B) ’各成分之添加 量詳見表一。 【比較例二】 製備程序同實施例一，但其中溶媒改用曱乙酮’各成 17 200938599 分之添加量詳見表一。 【比較例三】 製備程序同實施例一，但其中高介電粉體改用ΒΤ_2， 且溶媒改用異丙醇，各成分之添加量詳見表一。 【比較例四】 製備程序同實施例一，但其中不加入環氧樹脂黏結 劑，各成分之添加量詳見表一。 比較 例一 比較 例二 比較 例三 比較 例四 實施 例一 實施 例二 實施 例三 實施 例四 實施 例五 實施 例六 實施 例七 高介電粉體分散液 BT-1 100.0 95.7 0 80.0 100.0 0 100.0 20.0 100.0 100.0 120.0 BT-2 0 0 90.4 0 0 100 0 80.0 0 0 0 劑A 0 19.5 16.7 0 20.0 20.0 0 20.0 20.0 20.0 40.0 綠劑B 20.0 0 0 0 0 0 卜0 0 0 卜0 0 綠劑C 0 0 0 10.1 0 0 20.0 0 0 0 0 高介電粉體溶 媒 (溶媒:乳酸乙酯） 150.0 0 0 150.0 150.0 150.0 150.0 150.0 150.0 150.0 150.0 高介電粉體溶 媒 (溶媒:曱乙酮） 0 150.7 0 0 0 0 0 0 0 0 0 高介電粉體溶 媒 (ί容媒：異丙醇） 0 0 150.6 0 0 0 0 0 0 0 0 樹脂黏結劑 環氧樹脂黏結 劑-1 (溶媒:乳酸乙S旨） 486.4 0 0 0 484.6 486.5 486.0 485.6 0 484.6 64.6 環獅旨黏結 劑-2 (溶媒:乳酸乙酯） 0 0 0 0 0 0 0 0 484.7 0 0 環氧樹脂黏結 劑-3 (ί容媒：曱乙酮） 0 486.5 0 0 0 0 0 0 0 0 0 18 200938599 壤乳樹脂黏結 劑_4 容媒：異丙醇） 0 0 487.0 0 0 0 0 0 0 0 0 硬化劑 5.60 5.62 5.53 0 5.60 5.58 5.59 5.61 5.60 5.60 5.61 催化劑 0.08 0.08 0.07 0 0.08 0.08 0.08 0.08 0.08 0.08 0.08 表二 特性 比較 例一 比較 例二 比較 例三 比較 例四 實施 例一 實施 例二 實施 例三 實施 例四 實施 例五 實施 例六 實施例 七 喷墨列印性 不佳 (塞孔） 不佳 (塞孔） 不佳 (塞孔） 佳 佳 佳 佳 佳 佳 佳 佳 高介電油墨黏度cps 12.0 7.8 6.9 9.2 9.9 9.8 8.8 8.9 10.6 3.2 12.8 高介電油墨表面張 力(dyne/cm) 30.7 242 21.4 30.5 30.8 31.3 30.6 30.8 30.2 30.5 30.9 介電常數(1MHz) 13.33 12.26 8.70 79.2 18.32 25.34 20.15 19.20 18.61 11.2 13.3 玻璃轉移溫度Tg (°C) 174 175 178 105 183 184 187 182 180 181 182 介電材料厚度μηι 1.8 2.3 2.8 27 3.5 4.2 3.5 3.8 3.3 1.2 4.5 而才化性* 通過 通過 通過 失敗 通過 通過 通過 通過 通過 通過 通過 *耐化性依ASTMD5402-93(Reapproved 1999)規範（以MEK溶劑擦找10次)Ri may be an aromatic group, a fat group, a cycloaliphatic group or a decane-containing aliphatic group or the like. 〇 (b) anhydride such as hexahydrophthalic anhydride (tetra), tetrahydrophthalic anhydride (ΤΗΡΑ), methyl tetrahydrophthalic anhydride (methyl tetrahydrophthalic anhydride; ΜΤΗΡΑ), methyl hexahydrophthalic anhydride (MHHPA), and the like. (c) phenol resins such as Phenol based resins, Naphthol based resins, Terpene phenol resins, Dicyclopentadiene resins, 10 200938599 4, 4', 4''-Ethylidene trisphenol, Tetraphenylol ethane, Tetraxylenol ethane, Tetracresolol ethane, and the like. The catalyst is added in an amount of about 0.1 to 5 parts by weight based on 100 parts by weight of the epoxy resin. Preferred catalysts include: (a) Cationic catalysts Boron trifluoride precursors such as RNH2 · BF3, R2NH · BF3, R3N · BF3 and the like (wherein R represents an alkyl group). (b) Anionic catalyzers, tertiary amines, metal hydroxides, monoepoxide coordination anion catalysts, such as R3N (R stands for alkyl), tetramethylguanidine (TMG), NCH2C-C(NH)_N ( CH3) 2 and so on. (c) Imidazole 1-mercaptoimidazole, 1,2-dimercaptoimidazole, 2-heptadecylimidazole, 2-ethyl-4-indolizole, and the like. (B) Ferroelectric Ceramic Powder® The high dielectric ink composition of the present invention comprises about 1 to 30 parts by weight, preferably about 5 to 20 parts by weight, of a ferroelectric ceramic powder (in terms of 100 parts by weight) The ink composition is the basis). The ferroelectric ceramic powder used, for example, BaTi03, and BaTi03, Ba(Sr)TiO3 ceramic powder implanted with metal ions such as Ca, Zr, Mg, and the like. The ferroelectric ceramic powder (or high dielectric powder) contained in the high dielectric inkjet ink of the present invention is capable of fabricating and improving the density of the dielectric layer film by inkjet process. The constituent particles have an average particle diameter ranging from 10 to 400 nm, and more preferably less than 250 nm. If the average particle size of 200938599 is greater than 500 nm, it is difficult to print the pattern during the printing of high dielectric ink. In the present invention, two or more ceramic powders having different particle diameters may be used to increase the bulk density of the ceramic powder to increase the capacitance. ° (C) Dispersant The high dielectric ink composition of the present invention comprises about 0.1 to 1 part by weight, preferably about 1 to 5 parts by weight of a dispersant (based on 100 parts by weight of the ink composition). In order to allow the ferroelectric ceramic powder particles to be stably dispersed in the ink containing the crosslinkable hardening epoxy resin for a long period of time, a suitable dispersing agent should be used to disperse and stabilize the dielectric powder particles to avoid long-term use of the ink. In the Inkunene, problems such as particle collection, settling, and excessive viscosity are generated to maintain the variation of ink droplet size, ink droplet velocity, and ink droplet printing direction variation during the inkjet process. In order to achieve the above requirements, the present invention uses a polymer type dispersant which has good adhesion to inorganic powders and has excellent compatibility with organic resins (may also be reactive with organic resins). Significantly improve the heat resistance and reliability of high-tech® films. Preferred polymer type dispersing agents include polyesters, polyamines, polyamino acid esters, polyphosphoric esters, or the above-mentioned copolymers, which may be used alone or in combination of two or more. The oily molecular dispersing agent is preferred, but an amphoteric polymer dispersing agent can also be used. Commercially available polymeric dispersants suitable for the present invention include, but are not limited to, BYK-9010 (BYK Chemie), KD series (Uniqema), ADO 1 (Air products), and the like. 12 200938599 (D) Solvent The south dielectric ink composition of the present invention comprises from about 5 to about 96 parts by weight, preferably from about 55 to about 85 parts by weight of the solvent (based on 1 part by weight of the ink composition). The present invention uses a boiling point of not less than 1 Torr. The solvent is used to avoid the ink from being steamed and the pressure is too low, resulting in poor printing. Solvents suitable for the present invention include: acid esters, alcohols, guanamines, or combinations of the foregoing. Specific examples include, but are not limited to, ethyl lactate, butyl acetate, carbitol acetate, toluene, diphenyl, butanol, ethylene glycol, propylene glycol, decyloxypropylene glycol, ethoxy; © monol, dimethylacetamide, or a combination of the foregoing. It should be noted that 'the present invention may use a single solvent system or a multi-solvent system'. Therefore, in addition to the above-mentioned solvent of not less than fresh c, a cosolvent having a boiling point of less than 100 ° C, such as ethanol or propanol, may be included. Ethyl acetate (E) Other additives ❹ In addition to the above components, the high dielectric ink composition of the present invention may also be packaged. Other conventional additives commonly used in ink compositions or dielectric films, such as adhesives, materials Mixtures, boundary (four) agents, etc., not: inkjet properties and dielectric properties are preferred. In the middle of the 矽 警 警 警 警 警 警 警 警 警 、 、 、 、 、 、. The 増 adhesive is, for example, 虱 vir^l ' where h repeats the number of monomers, respectively. Up to 100 cps The viscosity of the high dielectric ink composition of the present invention is about! 200938599 * The operating temperature of the visible inkjet machine and the size of the inkjet head are appropriately adjusted. The surface tension of the ink composition is between about 20 and 60 Dyne/cm, and can also be adjusted depending on the hydrophilicity of the substrate surface to improve the adhesion of the ink. The high dielectric ink composition of the present invention not only has good ink storage properties and ink jet properties, but also imparts good heat resistance and chemical resistance to the dielectric layer after heat hardening and crosslinking. Further, the high dielectric value characteristic of the dielectric film formed by the high dielectric ink composition is particularly suitable for producing an ultrathin (thickness less than 5 ❹ #m) buried capacitor material by an ink jet method. In the preferred embodiment, an ultra-thin high dielectric layer having a dielectric constant (1 MHz) greater than 10 can be fabricated. It should be noted that the heat-curable high-dielectric ink composition disclosed in the present invention can be rotated coating, blade coating, or the like by Gravure coating, in addition to the printing method. High dielectric films are prepared by Letterpress, Flexography, etc. to achieve ultra-thin high dielectric substrates. In addition, the formed high dielectric film is not limited to the use of a built-in capacitor substrate. On the contrary, those skilled in the art can apply it to various electronic components such as transistors, diodes, resistors, etc. . [Example 1] &lt;South dielectric powder dispersion> 100 g of BaTi〇3 (Inframat Advanced Materials 'BT-1) having an average particle diameter of about 100 nm was added to 20 g of a polymeric dispersant BYK-9010 (BYK) Chemie supplied, acid group-containing copolymer acid group 14 200938599 copolymer dispersant A), and added 760 g of grinding media wrong beads and 150 g of ethyl lactate solvent, followed by wet grinding with a sand mill for 2 hours for dispersion treatment, Thereafter, the beads are separated by filtration to obtain a high dielectric powder dispersion. &lt;Resin Adhesive System&gt; 10.50 g of bisphenol-A diglycidyl ether (188EL, Changchun Resin Co., Ltd., Taiwan), 7.70 g of tetrabromobisphenol-A epoxy resin (tetrabromo disphenol) -A diglcidyl ether) (BEB-350, Changchun, Taiwan), 2.70 g of cycloaliphatic epoxy® eyclo aliphatic epoxy (HP-7200, DIC, Japan), 3.70 g of polyfunctional epoxy resin (Multifunctional epoxy) (EPPON502H, 曰本化药) system and 460g of ethyl lactate solvent, heated in a reaction flask to 90 ° C, mixed and dissolved for about 30 minutes, after cooling, it is epoxy resin Adhesive-1, followed by 5.60 g of mercaptohexahydrophthalic anhydride cross-linking hardener (ACROS, USA) and 〇. 8 g of 2-ethyl-4-mercaptoimidazole catalyst (ACROS' USA), The resin binder was completed by stirring at 2000 rpm for 10 minutes in a high speed mixer. ® &lt;High Dielectric Ink System> 2.5 g of the above high dielectric powder dispersion was added to a gram of resin binder, and after 30 minutes of scramble, a hardenable dielectric ink was prepared. Then, the above ink was used to load the Dimatix printer (DMCLCP-11610) ink cartridge, and the liquid droplet forming sharp ink meter was built in the Dimatix printer (DMP2800) ink jet machine to observe the printing result. The ink was printed on a copper foil substrate and passed through 180. (: After baking for 2.5 hours, it can be cross-linked and hardened on the copper foil to form a high dielectric film layer. 15 200938599 [Example 2] The preparation procedure is the same as in the first embodiment, but the high dielectric powder is changed to the average particle size. About 300 nm of BaTi〇3 (Prosperity Dielectrics Co., BT-2), the addition amount of each component is shown in Table 1. [Example 3] The preparation procedure is the same as that in the first embodiment, but the dispersant is changed to another lipophilic property. Molecular dispersant KD-1 (Uniqema, Hypermer dispersant C), the addition amount of each component is shown in Table 1. [Example 4] The preparation procedure is the same as in the first embodiment, but the high dielectric powder is changed to BT- 1 is mixed with BT-2, and the addition amount of each component is shown in Table 1. [Example 5] The preparation procedure is the same as that in the first embodiment, but the resin binder system is added to the polyethylene butyric acid (1&gt;〇13^11171131 ^))), formulated as follows: ® 9.20 grams of bisphenol-A diglycidyl ether (188EL, Changchun Resin, Taiwan), 6.50 grams of bisphenol bisphenol oxime epoxy resin ( Tetrabromo disphenol-A diglcidyl ether)(BEB-350, Changchun Company, Taiwan) 1.60 g of cycloaliphatic epoxy resin (HP-7200, DIC, Japan), 2.40 g of polyfunctional epoxy (EPPON 502H, 曰本化药) system and 4.91 g Poly (vinyl butyral) (PVB, Changchun Resin Co., Ltd., Taiwan) and 460 g of ethyl lactate solvent, heated to 90 ° C in a reaction bottle of 16 200938599, dissolved and heated for about 30 minutes, after cooling Epoxy Resin Adhesive-2, followed by 5.60 g of mercaptohexahydrophthalic anhydride cross-linking hardener (ACROS, USA) with 0.08 g of 2-ethyl-4-mercaptoimidazole catalyst (ACROS, USA), The resin binder was completed by stirring at 2000 rpm for 10 minutes in a high speed mixer. [Example 6] @ The preparation procedure is the same as in the first embodiment, but the high dielectric ink system is configured to add 1.0 g of a high dielectric powder dispersion to 3.8 g of a resin binder and 15 g of ethyl lactate, and stir 30 After a minute, the hardenable dielectric ink 0 is prepared. [Example 7] The preparation procedure is the same as in the first embodiment, but the ethyl lactate solvent content in the resin binder system is changed to 40 g, and the high dielectric ink system is additionally used. The 2.8 g high dielectric powder dispersion was placed in a 1.02 g resin binder and stirred for 30 minutes to form a hardenable dielectric ink. [Comparative Example 1] The preparation procedure was the same as in Example 1, except that the dispersant was changed to the hydrophilic dispersant BYK-112 (available from BYK Chemie, Dispersant B). [Comparative Example 2] The preparation procedure was the same as in Example 1, except that the solvent was changed to acetophenone. [Comparative Example 3] The preparation procedure was the same as in Example 1, except that the high dielectric powder was changed to ΒΤ_2, and the solvent was changed to isopropyl alcohol. The addition amount of each component is shown in Table 1. [Comparative Example 4] The preparation procedure was the same as in Example 1, except that no epoxy resin binder was added, and the amounts of the components were as shown in Table 1. Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 High Dielectric Powder Dispersion BT-1 100.0 95.7 0 80.0 100.0 0 100.0 20.0 100.0 100.0 120.0 BT-2 0 0 90.4 0 0 100 0 80.0 0 0 0 Agent A 0 19.5 16.7 0 20.0 20.0 0 20.0 20.0 20.0 40.0 Green Agent B 20.0 0 0 0 0 0 Bu 0 0 0 Bu 0 0 Green Agent C 0 0 0 10.1 0 0 20.0 0 0 0 0 High dielectric powder solvent (solvent: ethyl lactate) 150.0 0 0 150.0 150.0 150.0 150.0 150.0 150.0 150.0 150.0 High dielectric powder solvent (solvent: acetophenone) 0 150.7 0 0 0 0 0 0 0 0 0 High dielectric powder solvent (ί: isopropyl alcohol) 0 0 150.6 0 0 0 0 0 0 0 0 Resin binder epoxy resin binder-1 (Solvent: lactate B S) 486.4 0 0 0 484.6 486.5 486.0 485.6 0 484.6 64.6 Ring lion adhesive-2 (Solvent: ethyl lactate) 0 0 0 0 0 0 0 0 484.7 0 0 Epoxy adhesive-3 (ί容:曱乙酮酮) 0 486.5 0 0 0 0 0 0 0 0 0 18 200938599 乳乳树脂胶剂_4 Medium: isopropanol) 0 0 487.0 0 0 0 0 0 0 0 0 Hardener 5.60 5.62 5.53 0 5.60 5.58 5.59 5.61 5.60 5.60 5.61 Catalyst 0.08 0.08 0.07 0 0.08 0.08 0.08 0.08 0.08 0.08 0.08 Table 2 Characteristics Comparison Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Example 1 Implementation Example 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Embodiment 7 Inkjet printing is poor (plug hole) Poor (plug hole) Poor (plug hole) Jia Jia Jia Jia Jia Jia Jia Gao Jie Electro-ink viscosity cps 12.0 7.8 6.9 9.2 9.9 9.8 8.8 8.9 10.6 3.2 12.8 High dielectric ink surface tension (dyne/cm) 30.7 242 21.4 30.5 30.8 31.3 30.6 30.8 30.2 30.5 30.9 Dielectric constant (1MHz) 13.33 12.26 8.70 79.2 18.32 25.34 20.15 19.20 18.61 11.2 13.3 Glass transition temperature Tg (°C) 174 175 178 105 183 184 187 182 180 181 182 Dielectric material thickness μηι 1.8 2.3 2.8 27 3.5 4.2 3.5 3.8 3.3 1.2 4.5 Qualification* Passing through the pass failure By passing the passage of * resistance according to ASTM D5402-93 (Reapproved 1999) specification (find 10 times with MEK solvent)

由表二之量測結果得知，比較例一使用親水性之分散 劑進行高介電粉體分散，導致分散不佳以致於噴印過程中 有塞墨現象墨列印性不佳。此外溶媒的選擇亦為關鍵因 素，由比較例二、三可知，即使使用了較合適的高分子型 分散劑，但由於溶媒選擇低沸點的曱乙酮與異丙醇，導致 分散後的油墨蒸氣壓過低，使得墨水喷印效果較不佳。此 外，從比較例四亦可得知在未添加可硬化交聯環氧樹脂墨 水所形成之高介電層，耐熱性與耐化性均不佳。 相較之下，實施例一使用高分子型分散劑與高沸點的 乳酸乙酯當溶媒即可得到相當不錯的喷印效果，介電常數 可達18.32。另外也可選擇較大粒徑的BaTi03如實施例 19 200938599 二，倒入粒徑為300nm的陶瓷粉體，經過分散劑的添佳及 溶媒的選擇再加上良好的砂磨分散，也可達良好的喷印效 果及優異的電氣性質，在玻璃轉移溫度上也可達到 184°C。實施例四顯示也可利用兩種不同粒徑的陶瓷粉體的 添加，來增加陶瓷粉體的堆積密度以提高電容值，介電常 數為19.20，喷印後的厚度也相當均勻。 根據上述實施例可知，本發明之可交聯硬化介電墨水 組合物，經加熱可形成較佳之对熱、耐化性之超薄高電容 ❿介電層，而且墨水配方具有優異喷墨穩定性，可應用於内 埋式電容之製作。 雖然本發明已以數個較佳實施例揭露如上，然其並非 用以限定本發明，任何所屬技術，領域中具有通常知識者， 在不脫離本發明之精神和範圍内，當可作任意之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利範圍所界 定者為準。 ❿ 20 200938599 【圖式簡單說明】 無。 【主要元件符號說明】From the measurement results of Table 2, it was found that Comparative Example 1 used a hydrophilic dispersant for dispersion of a high dielectric powder, resulting in poor dispersion so that the ink was poorly printed during the printing process. In addition, the choice of solvent is also a key factor. It can be seen from Comparative Examples 2 and 3 that even if a suitable polymer type dispersant is used, the solvent vapor after dispersion is selected because the solvent selects low-boiling ethyl ketone and isopropyl alcohol. The pressure is too low, making the ink printing effect worse. Further, from Comparative Example 4, it was also found that the high dielectric layer formed by the addition of the hardenable crosslinked epoxy resin ink was inferior in heat resistance and chemical resistance. In contrast, in the first embodiment, a polymer type dispersant and a high-boiling ethyl lactate are used as a solvent to obtain a relatively good printing effect, and the dielectric constant can reach 18.32. Alternatively, a larger particle size of BaTi03 can be selected as in Example 19 200938599. The ceramic powder having a particle size of 300 nm is poured, and the addition of the dispersant and the choice of the solvent plus the good sanding dispersion can also be achieved. Good printing results and excellent electrical properties can reach 184 ° C at glass transition temperature. The fourth embodiment shows that the addition of ceramic powders of two different particle sizes can also be used to increase the bulk density of the ceramic powder to increase the capacitance value, the dielectric constant is 19.20, and the thickness after printing is also relatively uniform. According to the above embodiments, the crosslinkable and hardenable dielectric ink composition of the present invention can be heated to form an ultra-thin high-capacitance dielectric layer which is better for heat and chemical resistance, and the ink formulation has excellent ink-jet stability. It can be applied to the fabrication of buried capacitors. While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention, and it is intended to be The scope of protection of the present invention is defined by the scope of the appended claims. ❿ 20 200938599 [Simple description of the diagram] None. [Main component symbol description]

Claims (1)

200938599 十、申請專利範圍： 1. 一種可硬化交聯刑古 曰 t向介電墨水組成物’包括： 約W0重置份之環氧樹脂系統； 、勺1 30重里伤之強介電性陶瓷粉體； 約0.1〜10重量份之高分子型分散劑；以及 、勺50 %重里份之溶媒，其彿點不低於loot：。 2. 如申明專概圍第1項所述之可硬化交聯型高介電 昼Jcf物纟中該環氧樹脂系統更包括一聚乙稀縮丁 路·力樹月曰、聚醒胺屬亞胺、或前述之組合。 申月專# j範圍第1項所述之可硬化交聯型高介電 土、Jc、’且成⑼其中該強介電性陶曼粉體包括u取、 Ba(Sr)Tl03前述兩者植入其他金屬離子所形成之陶瓷粉 體、或前述之組合。 4·如f π專利範圍第丨項所述之可硬化交聯^高介電 墨水組成物’其中該強介電性陶竞粉體之粒徑約W 至 400 nm之間。 ❹ 5.如申請專利範圍第〗項所述之可硬化交聯型高介電 墨水組成物’其中該高分子型分散劑包括：聚賴、聚醢 胺類、聚胺基酸S旨類、聚磷g旨類、上述之共聚物、或上述 之組合。 6. 如申請專利範圍第1項所述之可硬化交聯型高介電 墨水組成物’其中該高分子型分散劑包括：親油性高分子 型分散劑、雙性型高分子型分散劑、或上述之組合。 7. 如申請專利範_ i項所述之可硬化交聯^高介電 22 200938599 墨水，、且成##中該溶媒包括酸醋類、醇類、酿胺類、 或前述之組合。 8·如範圍第7項所述之可硬化交聯聖高介電 墨&amp;、且成⑯丨中該溶媒包括：乳酸乙酯、醋酸丁醋、卡 必醇乙酉夂酉曰、甲苯、二甲笨、丁醇、乙二醇、丙二醇、甲 氧基丙一 〔氧基丙二醇、二甲基乙醯胺、或前述之組 合0 ❿ ❹ 9.如申明專利範圍第1項所述之可硬化交聯型高介電 墨水組成物’其中該環氧樹脂系統包括HA型環氧樹 月曰、雙齡-F型環氧樹脂、雙紛s型環氧樹脂、環脂肪族環 氧樹月曰U環氧樹脂、雙苯基環氧樹脂、紛酸清 =脂、甲驗清漆環氧樹脂、多官能基環氧樹脂、脂肪鍵 ^•環氧樹脂、或前述之組合。 如申#專利範圍第丨項所述之可硬化交聯型高介電 土水.、且成物，其中該環氧樹脂系統更包括—硬化劑。 黑水:Π:範圍第1項所述之可硬化交聯型高介電 Ά、、成物’ S中該環氧樹脂系統更包括一催化劑。 12.如申請專利範圍第〗項所述之可硬化交聯型高介 '土水組成物’其中更包括、;弗點低於1G0°C之共溶媒。 黑二請專利範圍第1項所述之可硬化交聯型高介電 二'，其中該墨水組成物之表面張力約介於2 ⑽Dyne/cm之間。 主 $ k 。中％專利範圍第1項所述之可硬化交聯型高介f 墨水組成物’其中該墨水組成物之黏度約介於β100= 23 200938599 之間。 15. 一種高介電薄膜，係由申請專利範圍第1項至14 項任意一項之可硬化交聯型高介電墨水組成物經交聯硬化 而成。 16. 如申請專利範圍第15項所述之高介電薄膜，其係 作為内藏式電容基板之電容介電層。 ^ 17. 如申請專利範圍第15項所述之高介電薄膜，其中 該高介電薄膜之介電常數（1MHz)大於10。200938599 X. Patent application scope: 1. A hardenable cross-linking criminal 曰t-to-dielectric ink composition' includes: an epoxy resin system with about W0 reset parts; Powder; about 0.1 to 10 parts by weight of a polymeric dispersant; and a solvent of 50% by weight of the spoon, the point of which is not lower than the loot:. 2. In the case of the hardenable cross-linking type high dielectric 昼Jcf material mentioned in item 1 of the general specification, the epoxy resin system further includes a polythene condensate, a tree, a scorpion Imine, or a combination of the foregoing. The hard-hardenable high-dielectric soil, Jc, 'and (9), wherein the ferroelectric terrarium powder includes u, Ba(Sr)Tl03, both of which are mentioned in the above paragraph A ceramic powder formed by implanting other metal ions, or a combination thereof. 4. The hardenable crosslinked high dielectric ink composition as described in the 'f patent scope of the invention, wherein the ferroelectric ceramic powder has a particle size of between about W and 400 nm. ❹ 5. The hardenable cross-linking type high dielectric ink composition as described in claim </ RTI> wherein the polymer type dispersant comprises: poly-lysate, polyamine, polyamino acid S, Polyphosphorus g, the above copolymer, or a combination thereof. 6. The hardenable cross-linking type high dielectric ink composition according to claim 1, wherein the polymer type dispersant comprises: a lipophilic polymer type dispersant, an amphoteric type polymer type dispersant, Or a combination of the above. 7. The hardenable cross-linking according to the application of the patent model _i ^ 2009 20099999 Ink, and the solvent in the ## includes the acid vinegar, the alcohol, the amine, or a combination thereof. 8. The hardenable cross-linked St. High Dielectric Ink &amp; as described in the item 7 of the scope, wherein the solvent comprises: ethyl lactate, butyl acetate, carbitol, toluene, and Stupid, butanol, ethylene glycol, propylene glycol, methoxypropanyl [oxypropylene glycol, dimethylacetamide, or a combination of the foregoing 0 ❿ ❹ 9. Hardenable as described in claim 1 Cross-linked high dielectric ink composition' wherein the epoxy resin system comprises HA type epoxy tree moon, double age-F type epoxy resin, double s type epoxy resin, cycloaliphatic epoxy tree U epoxy resin, bisphenyl epoxy resin, acid clear = fat, varnish epoxy resin, polyfunctional epoxy resin, fat bond ^ epoxy resin, or a combination of the foregoing. The hardenable cross-linking type high dielectric earth water and water, as described in the above-mentioned patent scope, wherein the epoxy resin system further comprises a hardener. Black water: Π: The hardenable cross-linking type high dielectric 所述, and the composition described in the above item 1 includes the catalyst. 12. The hardenable cross-linking type high-intermediate soil-water composition as described in the scope of the patent application, further comprising: a co-solvent having a point below 1 G0 °C. Black 2, the hardenable cross-linking type high dielectric two' described in the first aspect of the patent, wherein the ink composition has a surface tension of about 2 (10) Dyne/cm. Master $ k . The hardenable cross-linking type high-intermediate ink composition described in the first aspect of the invention is wherein the viscosity of the ink composition is between β100=23 200938599. A high dielectric film obtained by crosslinking and hardening a hardenable crosslinked high dielectric ink composition according to any one of claims 1 to 14. 16. The high dielectric film of claim 15 which is a capacitor dielectric layer of a built-in capacitor substrate. The high dielectric film of claim 15, wherein the high dielectric film has a dielectric constant (1 MHz) greater than 10. 24 200938599 七、指定代表圖·· (一） 本案指定代表圖為：無。 (二） 本代表圖之元件符號簡單說明: 無024 200938599 VII. Designation of Representative Representatives (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: No 0 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式： ❿ 無。 48. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: ❿ No. 4