TW200937453A - Composition for electrodes comprising aluminum powder having controlled particle size distribution and size, and electrodes made using the same - Google Patents

Composition for electrodes comprising aluminum powder having controlled particle size distribution and size, and electrodes made using the same Download PDF

Info

Publication number
TW200937453A
TW200937453A TW097145187A TW97145187A TW200937453A TW 200937453 A TW200937453 A TW 200937453A TW 097145187 A TW097145187 A TW 097145187A TW 97145187 A TW97145187 A TW 97145187A TW 200937453 A TW200937453 A TW 200937453A
Authority
TW
Taiwan
Prior art keywords
composition
electrode
particle size
size distribution
weight
Prior art date
Application number
TW097145187A
Other languages
Chinese (zh)
Other versions
TWI379315B (en
Inventor
Jae-Hwi Cho
Kuninori Okamoto
Yong-Hyun Kim
Hyun-Don Kim
Original Assignee
Cheil Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheil Ind Inc filed Critical Cheil Ind Inc
Publication of TW200937453A publication Critical patent/TW200937453A/en
Application granted granted Critical
Publication of TWI379315B publication Critical patent/TWI379315B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H01J11/26—Address electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H01J11/32—Disposition of the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/22—Electrodes
    • H01J2211/225—Material of electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Glass Compositions (AREA)

Abstract

Disclosed herein is a composition for electrodes that enables a firing process in air at a temperature of 600 DEG C or less and does not cause an increase in absolute resistance and a substantial variation of the resistance even when the composition is repeatedly subjected to the firing process. The composition for electrodes comprises: about 5 to about 95% by weight of aluminum powder, the aluminum powder having a particle size distribution of about 2.0 or less as expressed by the following Equation (1) and having D50 in the range of about 0.1μ m ≤ D50 ≤ about 20μ m; about 3 to about 60% by weight of an organic binder; and the balance of a solvent: Particle size distribution=(D90-D10)/D50 ------(1) wherein D10, D50, and D90 represent particle diameters at 10%, 50% and 90% points on an accumulation curve of a particle size distribution when the total weight is 100%. An electrode and a PDP fabricated using the composition are also disclosed.

Description

200937453 六、發明說明. 【發明所屬之技術領域】 本發明涉及一種電極用組合物和用此組合物製備的 電極。 【先前技術】 對於諸如電阻器、陶瓷電容器、熱敏電阻器 (thermistor)、變阻器（varistor)、電漿顯示面板等元件，電 極通常用包含銀粉作為導電填料的組合物並在以網版印刷 法(screen printing)、膠版印刷法(〇ff_Set printing)、微影法 (photolithography)等形成圖案之後用焙燒(firing)方法來形 然而，在電極驗合物的形射使祕粉作為導電填BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for an electrode and an electrode prepared using the composition. [Prior Art] For components such as resistors, ceramic capacitors, thermistors, varistors, plasma display panels, etc., electrodes are usually composed of a composition containing silver powder as a conductive filler and in screen printing (screen printing), offset printing (〇ff_Set printing), photolithography, etc., after forming a pattern, using a firing method, however, the shape of the electrode is used to make the secret powder as a conductive fill.

為了解決這些問題， 。隨後會破壞電極的可靠性。 © 導電填料材料來取代銀粉。In order to solve these problems, This will subsequently destroy the reliability of the electrode. © Conductive filler material to replace silver powder.

斗。但是鋁在空 製成的電極的電導性快速下降: 遺’人們£^致力於開發更加便宜的 造成用含有鋁填料的組合物 並且， 並且，闵盔* mFight. However, the electrical conductivity of the aluminum-made electrode is rapidly declining: the legacy of the people is devoted to the development of a cheaper composition resulting in the use of an aluminum-containing filler and, and, the helmet * m

菡時通常焙燒過程 由於隨著每次焙燒 陕速下降。 -% wrr的問題，人們已經 200937453 2出使用包含喊齡金的球形粉末。然而，使用球形粉 末使得，極的阻抗高達祕粉製備的電極阻抗的幾千倍， 並且在每次錢過程巾電極阻抗會增加·或更多。因 ，，包含喊is合金的球形粉末還沒有實際肋 【發明内容】 本發明提供一種電極用組合物，此組合物可以在空氣 中为600 C或更低的溫度進行焙燒過程，即使對此組合物When roasting, the calcination process usually declines due to the speed of each roasting. -% wrr problem, people have already used 200937453 2 out of the use of spherical powder containing the age of gold. However, the use of spherical powder makes the impedance of the poles up to several thousand times that of the electrode prepared by the secret powder, and the electrode impedance increases or more per time. Therefore, the spherical powder containing the alloy is not actually ribbed. SUMMARY OF THE INVENTION The present invention provides a composition for an electrode which can be calcined at a temperature of 600 C or lower in air, even if the combination is Object

❹ 重複進行上述錢過程也不會引起絕對阻抗的增加和阻抗 的實質性變化。 根據本發明的一方面，提供一種電極用組合物，包括： 約5〜約95 wt%的鋁粉，此鋁粉具有2 〇或更低的如下列 公式（1)所表示的粒度分佈(particle size出咖出此⑽），並且 具有約0.1 Hm$D50彡約20 μιη範圍内的D50;約3〜約 6〇 wt%的有機黏合劑(organic binder);餘量的溶劑： 粒度分佈=(D90-D10)/D50 ______⑴ 其中D10、D50和D90表示當總重量為1〇〇%時粒度 分佈的累積曲線上在10%、50%和90%的點處的粒徑。 根據本發明的另一方面，提供了用上述組合物製備的 電極和電漿顯示面板（plasma display panel，PDP )。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 現在通過下面的詳細描述來更加充分地說明本發 明’其中說明了本發明的部分而不是全部實施方式。實際 200937453 上，本發明可以許多不同的形式來實現，不應解釋為限制 成此處所列出的實施方式；更確切地，提供這些實施方式 使得本發明的公開滿足申請的法定要求。 ' 根據本發明的一個實施方式，電極用組合物包括導電 填料、破璃膠(glass frit)、有機黏合劑和溶劑。 導電填料包括鋁作為主要成分，並且呈粉末形式，尤 其是具有2.0或更低的如下列公式(1)所表示的粒度分佈的重复 Repeating the above money process will not cause an increase in absolute impedance and a substantial change in impedance. According to an aspect of the invention, there is provided a composition for an electrode comprising: from about 5 to about 95 wt% of an aluminum powder having a particle size distribution represented by the following formula (1) of 2 Å or less (particle) Size out of this (10)), and has a D50 in the range of about 0.1 Hm $ D50 彡 about 20 μηη; about 3 to about 6 〇 wt% of an organic binder; the balance of solvent: particle size distribution = ( D90-D10)/D50 ______(1) wherein D10, D50 and D90 represent the particle diameters at the points of 10%, 50% and 90% on the cumulative curve of the particle size distribution when the total weight is 1%. According to another aspect of the present invention, there is provided an electrode and a plasma display panel (PDP) prepared using the above composition. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] The present invention is now described more fully by the following detailed description. The present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the disclosure of the present invention satisfies the legal requirements of the application. According to an embodiment of the present invention, the composition for an electrode comprises a conductive filler, a glass frit, an organic binder, and a solvent. The conductive filler includes aluminum as a main component, and is in the form of a powder, particularly having a particle size distribution of 2.0 or less as expressed by the following formula (1).

球形粉末形式，並且具有約〇.丨μπι彡D5〇彡約2〇 μιη範圍 内的D50。 祖度分佈=(D90-D10)/D50 ......⑴ 、其中D10、D50和D90代表當總重量為1〇〇%時粒度 分佈的累積曲線上在腦、观和9〇%的點處的粒徑。 通常’雖然DIO、D50和D90可以限定為恒定的值， 但是在這個實施方式中，㈣、⑽和_均被設 =所述的預㈣範圍内，以從粉末狀樣品的顆粒大付 时2發明的範圍。所以’用作導電填料的具有落在這 f内的顆粒大小_粉落在本發明的範圍内。 ㈣ίΓί有如上所述的粒度分佈和顆粒大小的導電填料 不會產生錢行私㈣触，其阻抗也 藉由填料的轉可由触餘合金構成。紹合金 種銀二鍺及其組”的至少- 6 200937453It is in the form of a spherical powder and has a D50 in the range of about 2 〇 μπι彡D5 〇彡 about 2 〇 μιη. Probability distribution = (D90-D10) / D50 (1), where D10, D50 and D90 represent the cumulative curve of the particle size distribution on the brain, the view and 9〇% when the total weight is 1〇〇% The particle size at the point. Usually 'although DIO, D50 and D90 can be defined as constant values, but in this embodiment, (4), (10) and _ are all set to the pre-(four) range described above, in order to pay from the particles of the powder sample 2 The scope of the invention. Therefore, it is within the scope of the present invention to use a particle size falling within this f as a conductive filler. (d) ίΓί The conductive filler having the particle size distribution and particle size as described above does not produce a charge (four) touch, and its impedance is also composed of a residual alloy by the rotation of the filler. Shao alloy, silver bismuth and its group" at least - 6 200937453

根據本從αα &:七知人私& k〜， 填料，例如 在組合物中 的電極的導 約 95 wt%， 性。 將用作導電填料的鋁粉過篩（sieved)，使其粒产八 即(D90 - D10)/D50的值，為約2.0或更低，例^ ’ ®約⑺同時⑽在約職約範圍^ 結果是，根據本實施方式的電極用組合物可以在約6〇〇它 或更低的溫度下進行焙燒過程，即使此電極重複進行上述 焙燒過程也不會引起絕對阻抗的增加和阻抗的實質變化= 通常鋁粉的粒度分佈可以用粒度分佈儀來測量或通過 掃描式電子顯微鏡(scanning electronic micr〇sc〇py，SEM) 來得到。 根據本發明的一個實施方式，所述有機黏合劑為選自 ❹ 纖維素（celiui〇ses)、水溶性纖維素衍生物（wateF soluble cellulose derivative)以及藉由共聚具有烯類不飽和雙鍵的 . 單體和羧酸類單體得到的共聚物中的至少一種。所述具有 . 烯類不飽和雙鍵的單體例如為丙烯酸的酯類（丙烯酸甲酯 (methyl acrylate)、曱基丙烯酸乙醋(e%1⑽也似加⑹等）、 苯乙烯（styrene)、丙烯醯胺（acrylic amide)、丙烯腈 (acrylonitrile)等。所述羧酸類單體例如為丙烯酸、甲基丙 烯酸(methacrylicacid)、衣康酸(itac〇nicadd)等。 7According to the present invention, from the αα &: seven known human private & k~, the filler, for example, the conductivity of the electrode in the composition is 95 wt%. The aluminum powder used as the conductive filler is sieved to have a grain yield of eight (D90 - D10) / D50, which is about 2.0 or less, for example, ^ ' about (7) and (10) in the approximate contract range. As a result, the composition for an electrode according to the present embodiment can be subjected to a calcination process at a temperature of about 6 Torr or lower, even if the electrode is repeatedly subjected to the above-described baking process, the absolute impedance is not increased and the essence of the impedance is caused. Variation = Usually the particle size distribution of the aluminum powder can be measured with a particle size distribution meter or by scanning electron microscopy (SEM). According to an embodiment of the present invention, the organic binder is selected from the group consisting of ceilium sesame, a wate F soluble cellulose derivative, and an ethylenically unsaturated double bond by copolymerization. At least one of a copolymer obtained from a monomer and a carboxylic acid monomer. The monomer having an ethylenically unsaturated double bond is, for example, an ester of acrylic acid (methyl acrylate, ethyl methacrylate (e% 1 (10), such as (6), etc.), styrene, Acrylic amide, acrylonitrile, etc. The carboxylic acid monomer is, for example, acrylic acid, methacrylic acid, itaconic acid (itac〇nicadd), or the like.

200937453 6〇 wt% 5 5 e。 有機黏合劑含量小於約3 wt% ,則组人 物會在製絲料後呈降的減 燥後呈二降，㈣。如果有機黏合_:= =:i 5物會含有太多的有_ 機黏合劑在錢過財會充分分解，造成阻抗的吏^:有 例如約分解溫度可為約350〜約5〇crc， 在上述範圍内的分解溫度下，在培燒過程中可以調節 銘粉的乳鱗，使得電極具有良好的阻抗。 亚且，當使用上述有機黏合劑中的具有約2(rc或更低 的玻㈣轉彳b溫度(glass transition tempemture)的Ιέ結性有機 黏合劑(cohesive organic binder)時，組合物的膠版印刷會更 加容易。 ^在本發明的組合物中，溶劑用來溶解有機黏合劑並調 節組合物的黏度’而使其可以製成能塗敷到基板上的漿料。 上述溶劑可為選自具有約120〇C或更高的沸點且通常 用於製備電極用組合物的溶劑。根據一個實施方式，所述 溶劑為選自甲基溶纖劑(methyi ceii〇s〇ive)、乙基溶纖劑 (ethyl cellosolve)、丁基溶纖劑(butyl cellosolve)、脂肪族醇 (aliphatic alcohol)、a-萜品醇（α-terpineol)、β-箱品醇 (β-terpineol)、二氫萜品醇（dihydro-terpineol)、乙二醇 (ethylene glycol)、二甘醇單甲醚（diethylene glycol monomethyl ether)、二甘醇單***（diethylene glycol 8 200937453 monoethyl ether)、二甘醇單丙醚（diethylene glycol monopropyl ether)、二驗乙二醇單丁醚（dietherethylene glycol monobutyl ether)、二丙二醇單曱醚（dipropylene glycol monomethyl ether)、丙二醇單甲 _乙酸酉旨(pr〇pylene . glycol monomethyl ether acetate)、丙三醇(glycerol)、乙酸 丁酉旨（butyl acetate)、乙酸乙 g旨（ethyl acetate)、環己醇 (cyclohexanol)、丁基溶纖劑乙酸醋（butyl cellosolve acetate)、i旨醇（texanol)、礦油精(mineral spirit)、有機酸、 ® 油酸(oleic acid)及其組合中的至少一種。 由於可以調節溶劑的加入量來容易地調節黏度，溶劑 的含里可以根據具體應用來改變，可在約1〜約68 wt%範 圍内。 在本發明的組合物中，玻璃膠用作一種無機黏合劑， 末改善對基板的黏結力，其加入量可以為相對於1 〇〇重量 份組合物加入約1〜約30重量份。 玻璃膠的例子可非限制性地包括金屬氧化物類玻璃， ❹ f 括 Pb0、Bi2〇3、Si02、B2〇3、p205、ZnO 或 ai2〇3 中的 種或多種，並可具有約300〜約6〇〇。〇的玻璃轉化溫度 . Tg。 如果玻璃膠的玻璃轉化温度低於約300¾，則組合物 7收縮率會過度增加，這會擴大料齡合物形成的電極 。、邊緣捲曲。相反，如果玻璃膠的玻璃轉化温度高於約6〇〇 ^則組合物的導電成分可能不會被充分燒結恤如， 攻會增加電極的阻抗。 200937453 : ^如果破璃膠的加入量少於約i重量份，則難以實現本 孓3望的效果。相反，如果玻璃膠的加入量超過約30 重ϊ份，則組合物中導電填料的量會相對減少，使得由此 組合物形成的電極不能實現期望水準的導電性。 • 另方面’對於藉由加入玻璃膠製備的組合物，當用 .田射粒度分佈儀測量時，由於玻璃膠的影響，其粒度分佈 會輕微增加或降低。 _根據本發明的一個實施方式，如果需要，為了改善組 合物的流動性和加工性及在製備過程中的穩定性，所述組 合物可進一步含有選自紫外線穩定劑（ultravi〇let stabilizer)、黏度穩定劑（viscosity stabilizer)、消泡劑 (antifoaming agent)、分散劑（dispersing agent)、均化劑 (leveling agent)、抗氧化劑(antioxidant agent)、抗熱固化劑 (anti-heat curing agem)等及其組合中的至少一種添加劑。 這些添加劑為本領域普通技術人員所熟知，所以在此省略 其詳細舉例和說明。 ❹ 在由此組合物形成電極時，可使用乾膜光阻(dry film resistor，DFR)方法、網版印刷法、膠版印刷法、塗佈法或 . 微影法中的至少一種方法。 • 根據本發明的一個實施方式’當在形成電極中使用微 影法時，此組合物進一步包括光聚合化合物和光聚合引發 劑（initiator)。 光聚合化合物為用作感光樹脂的多官能基單體或募聚 體(oligomer)。適用於本發明的這個實施方式的光聚合化合 10 200937453 物非限制性地包括選自由如下物質組成的族群中的至少一 種：例如乙二醇二丙烯酸酯（ethyleneglycol diacrylate)、三 甘醇二丙烯酸酯(triethyleneglycol diacrylate)、1，4- 丁 二醇二 丙稀酸醋（1，4-1?1^11(1丨〇1(^(^如6)、1，6-己二醇二丙烯酸醋 . (1,6-hexanediol diacrylate)、新戊二醇二丙稀酸酉旨 (neopentylglycol diacrylate)、季戊四醇二丙烯酸酯 (pentaerythritol diacrylate)、季戊四醇三丙烯酸酉旨 (pentaerythritol triacrylate)、二季戊四醇二丙烯酸醋 (dipentaerythritol diacrylate)、二季戊四醇三丙烤酸酉旨 (dipentaerythritol triacrylate)、二季戊四醇五丙烯酸酉旨 (dipentaerythritol pentacrylate)、二季戊四醇六丙稀酸酉旨 (dipentaerythritol hexacrylate)、雙紛 A 二丙烯酸酯(bispenol A diacrylate)、三經甲基丙院三丙浠酸S旨(trimethylolpropane triacrylate)、酚酸·環氧丙稀酸酯(novolac epoxy acrylate)、 乙二醇二曱基丙烯酸酉旨（ethylene glycol dimethacrylate)、二 甘醇二曱基丙烤酸西旨（diethylene glycol dimethacrylate)、三 ® 甘醇二甲基丙稀酸酉旨(triethylene glycol dimethacrylate)、丙 一醇二曱基丙稀酸酉旨(propylene glycol dimethacrylate)、1,4- 丁一醇二曱基丙稀酸醋（1，4-butandiol dimethacrylate)、1,6- • 己—醇二甲基丙稀酸醋（1,6-hexanediol dime仕iacrylate)等及 其組合。 相對於100重量份的上述組合物，光聚合化合物的加 入里可為約0.1〜約20重量份。如果光聚合化合物的含量 低於約0.1重量份，則不足以發生光聚合，造成顯影過程 200937453 中的圖案遺漏。相反，如果光聚合化合物超過約曰 份，則由於過量的多官能基單體或募聚體，在培繞過，里 有機物質會分解，引起阻抗的增加。 ° ° 引發 合200937453 6〇 wt% 5 5 e. When the content of the organic binder is less than about 3 wt%, the group of people will decrease after drying after the silk material, and then decrease (4). If the organic bond _:= =:i 5 will contain too much _ machine adhesive in the money to fully decompose, resulting in impedance 吏 ^: for example, the decomposition temperature can be about 350 ~ about 5 〇 crc, in Under the decomposition temperature within the above range, the scale of the powder can be adjusted during the burning process, so that the electrode has good impedance. And, when using a cohesive organic binder having a glass transition tempem of about 2 (rc or less) in the above organic binder, offset printing of the composition It will be easier. ^ In the composition of the present invention, the solvent is used to dissolve the organic binder and adjust the viscosity of the composition' so that it can be made into a slurry which can be applied to the substrate. a solvent having a boiling point of about 120 〇C or higher and generally used for preparing an electrode composition. According to one embodiment, the solvent is selected from the group consisting of methyl cellosolve (methyi ceii〇sive), ethyl cellosolve. (ethyl cellosolve), butyl cellosolve, aliphatic alcohol, a-terpineol, β-terpineol, dihydroterpineol Dihydro-terpineol), ethylene glycol, diethylene glycol monomethyl ether, diethylene glycol 8 200937453 monoethyl ether, diethylene glycol monopropyl Ether), Dietherethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, glycerol , butyl acetate, ethyl acetate, cyclohexanol, butyl cellosolve acetate, texanol, mineral spirit At least one of an organic acid, an oleic acid, and a combination thereof. Since the viscosity can be easily adjusted by adjusting the amount of the solvent to be added, the solvent may be changed depending on the specific application, and may be from about 1 to about 68. In the composition of the present invention, the glass glue is used as an inorganic binder to improve the adhesion to the substrate, and may be added in an amount of about 1 to about 30 with respect to 1 part by weight of the composition. Parts by weight. Examples of the glass paste may include, without limitation, a metal oxide-based glass, ❹ f including one or more of Pb0, Bi2〇3, SiO2, B2〇3, p205, ZnO, or ai2〇3, and may have about 300~ About 6 baht. The glass transition temperature of bismuth. Tg. If the glass transition temperature of the glass frit is less than about 3003⁄4, the shrinkage of the composition 7 will excessively increase, which will enlarge the electrode formed by the ageing compound. The edges are curled. Conversely, if the glass transition temperature of the glass paste is higher than about 6 〇〇 ^, the conductive component of the composition may not be sufficiently sintered, and the attack will increase the impedance of the electrode. 200937453 : ^ If the amount of the glass frit is less than about i parts by weight, it is difficult to achieve the effect of the present. On the contrary, if the glass gum is added in an amount exceeding about 30 parts by weight, the amount of the conductive filler in the composition is relatively reduced, so that the electrode formed by the composition cannot achieve a desired level of conductivity. • In another aspect, for a composition prepared by adding a glass paste, when measured by a field particle size distribution meter, the particle size distribution may slightly increase or decrease due to the influence of the glass glue. According to one embodiment of the present invention, if necessary, in order to improve the fluidity and processability of the composition and stability during preparation, the composition may further contain an ultraviolet stabilizer (ultravi〇let stabilizer), Viscosity stabilizer, antifoaming agent, dispersing agent, leveling agent, antioxidant agent, anti-heat curing agem, etc. At least one additive in its combination. These additives are well known to those skilled in the art, so detailed examples and illustrations thereof are omitted herein. ❹ When the electrode is formed of the composition, at least one of a dry film resistor (DFR) method, a screen printing method, an offset printing method, a coating method, or a lithography method can be used. • According to an embodiment of the present invention, when a lithography method is used in forming an electrode, the composition further includes a photopolymerizable compound and a photopolymerization initiator. The photopolymerizable compound is a polyfunctional monomer or an oligomer used as a photosensitive resin. Photopolymerizable composition 10 200937453 suitable for use in this embodiment of the invention includes, without limitation, at least one selected from the group consisting of ethyleneglycol diacrylate, triethylene glycol diacrylate (triethyleneglycol diacrylate), 1,4-butanediol diacrylic acid vinegar (1,4-1?1^11 (1丨〇1(^(^)6), 1,6-hexanediol diacrylate vinegar (1,6-hexanediol diacrylate), neopentyllgic acid diacetate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate vinegar (pentaerythritol diacrylate) Dipentaerythritol diacrylate), dipentaerythritol triacrylate, dipentaerythritol pentacrylate, dipentaerythritol hexacrylate, bispen A Diacrylate), trimethylolpropane triacrylate, phenolic acid, acrylic acid Novolac epoxy acrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, tri-glycol dimethyl acrylate Triethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,4-butandiol dimethacrylate, 1,6 - • 1,6-hexanediol diacetic acid vinegar, etc., and combinations thereof. The photopolymerizable compound may be added in an amount of from about 0.1 to about 20 with respect to 100 parts by weight of the above composition. If the content of the photopolymerizable compound is less than about 0.1 part by weight, photopolymerization is insufficient to cause the pattern in the development process 200937453 to be omitted. On the contrary, if the photopolymerizable compound exceeds about 曰, the organic substance is decomposed due to an excessive amount of the polyfunctional monomer or the polymerizer, which causes an increase in the impedance. ° °

進而，根據本發明的一個實施方式，任何光聚人 劑都可以用於上述組合物的製備，只要這種引發 200〜約400 nm的紫外線波長内呈現良好的光反廡性^ 聚合引發劑可以是選自由二苯甲酮(benzophenone)、笨乙^ (acetophenone)、三嗪類(triazine-based)化合物等及其会且 構成的組中的至少一種。 π 相對於100重量份的組合物，光聚合引發劑的加入旦 可為約0·01<〜^約10重量份。 當在期望位置將上述組合物圖案化之後，在室溫下初 步乾燥組合物，然後在約100〜約20(rc的溫度下供^Z 而形成具有預定強度的電極圖案。 < 然後，在約450〜約600°C焙燒此電極圖案，從而使得 有機黏合劑和溶劑從圖案化的組合物中完全分離，而作為 無機黏合劑加入的玻璃膠則熔融來黏合導電填料。 通常焙燒過程不是一次完成，而是根據後面的電介質 製程而定’重複進行例如兩次或三次。 圖1為用根據本發明的一個實施方式的組合物製備的 電漿顯示面板(plasmadisplaypane卜PDP)的示意圖。 簽見圖1，根據本發明的一個實施方式，用組合物製 備電漿顯示面板10，電漿顯示面板10包括前基板1〇〇和 後基板150。 12 200937453 在電漿顯示面板ίο中’透明電極110水平配置 後基板150❺前基板100表面上，並在其上具有 112。在每個透明電極110上，形成有用於儲存由 内部產生的電荷的第-電介質層114和用於保護第二= 質層114並使電子釋放更容易的撾§〇層118。 ；| ❹ ❹ 並且，定址電極(address electr〇de)117縱向形成 前基板⑽的後基板15〇的上表面上層= 形成在具有定址電極117的後基板15〇的上表面上，並形 成有分隔物(Partitic)n)12()，分隔物12G含有相對應於= 色R、綠色G和藍色B的螢光物質132,以在 ς = 層115上定義晝素區域。 ；丨貝 ^諸如Ne+Ar、Ne+Xe等惰性氣體注入到前基板1〇〇 =後基板15〇之_空間，從而當臨界值錢高的電壓被 靶加到電極上時，藉由放電現象而發光。 在這樣的PDP中’匯流電極112和/或定址電極η? ^根據本發明的—個實施方式的組合物形成。具體來說， 這些電極_版印刷法、膠版印刷法、或微影i中的L種 形成。 根據本發_ —個實施方式，當這些電细微影法形 成枯，形成這些電極的方法包括： 將根據本發明的一個實施方式的組合物塗敷到玻璃基 板上來形成厚度為約5〜約40 μηι的組合物層； 在約80〜約15〇它的温度下乾燥所塗敷的組合物層約 2〇〜約60分鐘； 13 200937453 露於紫外線； 的區域（正性）或未暴 將乾燥的組合物層藉由光罩暴 藉由顯影從組合物層去除暴露 露的區域（負性）；和 ❹ ❹ 在約500〜約600 C乾燥和培燒組合物層。培 ，別限定，通常為足以分解基本全部的有機物的時H 相性實财式巾，在約5机錢高的溫度下 ==為約。.5〜約3小時’但是培燒時間並不限 m人“ ㈣本發明’以朗根據本發明 的、.且。物如此組合卿成電極的過財在約_。〇或 =溫度下可以進行純絲，並且即使是將此組合物重 也不會引起絕對阻抗的增加和阻抗的實質 的普通技術人員來說，本發明的詳細 情况將很明顯，所以，省略其具體描述。 1、鋁粉的製備 用任何機器製備球形銘粉’例如可以用於製備金屬粉 末的氣體霧化器（gas atomizer)或水霧化器（water atom窗)’此球形铭粉用作初始㈣。然後，用筛選機(cisa, 觀）篩選這些初始材料來製備具有各種粒度分佈 (D90-D10)和；D50的鋁粉實例。 这裡，當使用鋁合金製備鋁合金粉作為初始材料時， 也可以製備具有各種粒度分佈和平均粒徑的鋁合金粉。 用粒度分佈儀CILAS測量餘度分佈和平%粒徑，並 且用異丙醇作為分散劑。 14 200937453 的晴本發明的一個實施方式的方法製傍Further, according to an embodiment of the present invention, any photopolymerization agent can be used for the preparation of the above composition, as long as the initiation of the ultraviolet ray at a wavelength of from 200 to about 400 nm exhibits good light repellency. It is at least one selected from the group consisting of benzophenone, acetophenone, triazine-based compound, and the like. π With respect to 100 parts by weight of the composition, the photopolymerization initiator may have a denier of about 0·01 <~^ about 10 parts by weight. After patterning the above composition at a desired position, the composition is preliminarily dried at room temperature, and then an electrode pattern having a predetermined strength is formed at a temperature of about 100 to about 20 (rc). < The electrode pattern is baked at about 450 to about 600 ° C, so that the organic binder and the solvent are completely separated from the patterned composition, and the glass paste added as an inorganic binder is melted to bond the conductive filler. Usually, the baking process is not once. This is done, but is repeated, for example, two or three times, depending on the subsequent dielectric process. Figure 1 is a schematic illustration of a plasma display panel (PDP) prepared with a composition in accordance with one embodiment of the present invention. 1, a plasma display panel 10 is prepared from a composition according to an embodiment of the present invention. The plasma display panel 10 includes a front substrate 1 and a rear substrate 150. 12 200937453 In the plasma display panel ίο 'transparent electrode 110 The rear substrate 150 is horizontally disposed on the surface of the front substrate 100 and has 112 thereon. On each of the transparent electrodes 110, there is formed for storage by the inside. The generated charge-dielectric layer 114 and the § 〇 layer 118 for protecting the second layer 14 and making the electrons easier are released. ;| ❹ ❹ and, before the longitudinal formation of the address electr〇de 117 The upper surface of the upper substrate 15 of the substrate (10) is formed on the upper surface of the rear substrate 15A having the address electrodes 117, and is formed with a partition (Partitic) n) 12 (), and the spacer 12G contains a corresponding = The phosphor material 132 of color R, green G, and blue B defines a halogen region on the ς = layer 115.丨 ^ ^ Inert gas such as Ne + Ar, Ne + Xe is injected into the front substrate 1 〇〇 = back substrate 15 〇 space, so that when the threshold value of high voltage is applied to the electrode by the target, by the discharge phenomenon And glow. In such a PDP, the 'bus electrode 112 and/or the address electrode η? ^ are formed according to the composition of the embodiment of the present invention. Specifically, these electrodes are formed by an electrode-printing method, an offset printing method, or a lithography i. According to the present invention, when these electro-lithographic methods are formed, the method of forming the electrodes includes: applying a composition according to an embodiment of the present invention to a glass substrate to form a thickness of about 5 to about 40. a composition layer of μηι; drying the applied composition layer at a temperature of about 80 to about 15 Torr for about 2 Torr to about 60 minutes; 13 200937453 exposed to ultraviolet light; the area (positive) or not violent will dry The composition layer removes exposed areas (negative) from the composition layer by development by a reticle; and 干燥 干燥 干燥 干燥 干燥 干燥 干燥 干燥 干燥The culture is not limited, and is usually a H-phase solid wealth type towel which is sufficient to decompose substantially all of the organic matter, at a temperature of about 5 machine-high, == about. .5~about 3 hours', but the burning time is not limited to m" (4) The present invention is based on the present invention, and the combination of such a combination of the singularity of the electrode is about _. 〇 or = temperature The details of the present invention will be apparent to those skilled in the art, and the detailed description of the present invention will be omitted, even if it is such that the composition is heavy and does not cause an increase in absolute impedance and the nature of the impedance. Preparation of powders A spherical powder can be prepared by any machine 'for example, a gas atomizer or a water atom window which can be used for preparing a metal powder. This spherical powder is used as an initial (four). Then, Screening machine (cisa) screens these starting materials to prepare aluminum powder examples with various particle size distributions (D90-D10) and D50. Here, when aluminum alloy powder is prepared using aluminum alloy as a starting material, it can also be prepared. Aluminum alloy powder having various particle size distributions and average particle diameters. The balance distribution and % particle size were measured by a particle size distribution analyzer CILAS, and isopropyl alcohol was used as a dispersing agent. 14 200937453 The method of one embodiment of the invention is clear. Pong system

表 ❹ ❹ 2、電極用紐合物的製備 (1)實施例1-8和對比例1和2 ，說明本發明的實施例和對比例的組合物藉由如下方法 製備：混合用作導電填料的鋁粉、玻璃膠(無鉛類Bi_Zn_B 成·刀’軟化點480°C，平均直徑1.5 μπι)、用作有機黏合劑 的丙烯酸類共聚物(購自Geo Myung Co.，Ltd.，SPN #30-1, 77 ~ /皿度447 C)、用作溶劑的g旨醇（texanol)(購自Eastman 15 200937453Table ❹ 2, Preparation of Electrode Complex (1) Examples 1-8 and Comparative Examples 1 and 2, the compositions of the examples and comparative examples of the present invention were prepared by the following method: mixing as a conductive filler Aluminum powder, glass glue (lead-free Bi_Zn_B knives) softening point 480 ° C, average diameter 1.5 μπι), acrylic copolymer used as organic binder (purchased from Geo Myung Co., Ltd., SPN #30 -1, 77 ~ / 447 C), used as a solvent for texanol (purchased from Eastman 15 200937453)

Chemical Co., Ltd.)，然後用陶瓷三輥研磨機(3-roll mill)捏 煉(kneading)。表2列出了這些組合物的含量比例。Chemical Co., Ltd.) was then kneaded using a ceramic 3-roll mill. Table 2 lists the content ratios of these compositions.

❹ 表 2 (wt%) 組分 E1 E2 E3 E4 E5 E6 E7 E8 CE1 CE2 A1 粉(A) 57.5 - - - - * _ _ A1 粉(B) - 57.5 - - - - • _ AI 粉(C) - - 57.5 - - - _ • _ A1 粉(D) - - - 57.5 - - _ _ _ - A1 粉(E) - - - - 57.5 _ A1 粉(F) - - - - - 57.5 _ • _ A1 粉(G) - - - - - - 57.5 - _ _ A1 粉(H) - • • 57.5 A1 粉(I) - • • - • . 57.5 _ A1 粉(J) - - - - - _ _ _ _ 57.5 玻璃膠 9.97 9.97 9.97 9.97 9.97 9.97 9.97 9.97 9.97 9.97 有機黏合劑 19.11 19.11 19.11 19.11 19.11 19.11 19.11 19,11 19.11 19.11 溶劑 13.42 13.42 13.42 13.42 13.42 13.42 13.42 33.42 13.42 13.42 E :實施例、CE :對比例 (2)實施例9和10 為了藉由微影法形成電極圖案，其他實施例的組合物 16 200937453 藉由以與實施例1和7不同的含量混合與實施例1和7相 同的組分來製備，同時向其中進一步加入光聚合引發劑(購 自 Shiba Co·，Ltd. ’ IC369)和光聚合化合物（Satomer Co·， Ltd.，SR494) ’然後用陶瓷三輥研磨機捏煉。表3列出了 這些組合物的含量比例。 表3 組分 實施例9 實施例10 Α1 粉(Α) 58 Α1 粉(G) _ 58 玻璃膠 6.2 6.2 有機黏合劑 21 21 溶劑 6.3 6.3 光聚合引發劑 1.5 1.5 光聚合化合物 7 7 3、用這些組合物形成厚膜電極 用購自Tester Sangyo Co·，Ltd.的Pim〇塗佈機將實施 例1〜8和對比例i和2的紐合物塗敷到具有高熔點的ι〇 cm X 10 cm的玻璃基板上。然後，乾燥塗佈的組合物，並 在110°C下烘烤，然後從輸入到輸出在一個半小時内在帶 式爐(belt furnace)中於560〇C焙燒15分鐘的峰值保持時Z (peak holding time)。然後，形成電極的％ _的圖案^ 測量電極的阻抗。測量結果列於表4中。 ” 電極藉由如下方法形成：分別將實施例9和1〇的組合 17 200937453 物塗敷到基板上，來形成厚度為 °c乾燥所錄的組合物層約㈣’在110 由来罜.二丄 將乾燥的組合物層藉 域或未暴露㈣域；在WC㈣組合物^去除暴路的£ 測量這些電極的阻抗並將結果列於表4中。 4、測里重複培燒的電極的阻抗變化 測1 了用實施例1〜1 〇以及斜私丨n i uΜ次對比例2和2的組合物形 Ο❹ Table 2 (wt%) Component E1 E2 E3 E4 E5 E6 E7 E8 CE1 CE2 A1 Powder (A) 57.5 - - - - * _ _ A1 Powder (B) - 57.5 - - - - • _ AI powder (C) - - 57.5 - - - _ • _ A1 powder (D) - - - 57.5 - - _ _ _ - A1 powder (E) - - - - 57.5 _ A1 powder (F) - - - - - 57.5 _ • _ A1 Powder (G) - - - - - - 57.5 - _ _ A1 powder (H) - • • 57.5 A1 powder (I) - • • - • . 57.5 _ A1 powder (J) - - - - - _ _ _ _ 57.5 Glass Glue 9.97 9.97 9.97 9.97 9.97 9.97 9.97 9.97 9.97 9.97 Organic Binder 19.11 19.11 19.11 19.11 19.11 19.11 19.11 19,11 19.11 19.11 Solvent 13.42 13.42 13.42 13.42 13.42 13.42 13.42 33.42 13.42 13.42 E: Example, CE: Comparative Example (2) EXAMPLES 9 and 10 In order to form an electrode pattern by lithography, composition 16 200937453 of other examples was prepared by mixing the same components as in Examples 1 and 7 at different amounts from Examples 1 and 7, At the same time, a photopolymerization initiator (purchased from Shiba Co., Ltd. 'IC369) and a photopolymerizable compound (Satomer Co., Ltd., SR494) were further added thereto and then kneaded by a ceramic three-roll mill. . Table 3 lists the content ratios of these compositions. Table 3 Component Example 9 Example 10 Α1 powder (Α) 58 Α1 powder (G) _ 58 glass 6.2 6.2 organic binder 21 21 solvent 6.3 6.3 photopolymerization initiator 1.5 1.5 photopolymerization compound 7 7 3, with these Composition to form thick film electrode The compositions of Examples 1 to 8 and Comparative Examples i and 2 were applied to ι〇cm X 10 having a high melting point using a Pim(R) coater available from Tester Sangyo Co., Ltd. Cm on the glass substrate. Then, the coated composition was dried and baked at 110 ° C, and then the peak was maintained at 560 ° C for 15 minutes from the input to the output in a belt furnace for one minute and half. Holding time). Then, the pattern of % _ of the electrode is formed ^ to measure the impedance of the electrode. The measurement results are shown in Table 4. The electrodes were formed by applying the combination of Examples 9 and 1 17 17 200937453 onto the substrate, respectively, to form a layer of the composition recorded by drying at a thickness of ° c (four) 'at 110 罜. The dried composition layer is either domain-exposed or unexposed (four) domain; the impedance of these electrodes is measured in the WC (four) composition ^ removal storm path and the results are listed in Table 4. 4. The impedance change of the electrode repeatedly fired in the test The composition of the compositions of Examples 1 to 1 and Example 2 and 2 was measured.

成的電極的初始阻抗之後，將電極圖案進行額外的一次或 兩··人培燒，然後測量電極的阻抗變化。測量結果列於表4 中。 、口 表4After the initial impedance of the electrode is formed, the electrode pattern is subjected to an additional one or two, and then the impedance change of the electrode is measured. The measurement results are shown in Table 4. Port 4

El E2 E3 E4 E5 E6 R(Q) AR(%) R(Q) △R(〇/〇) R(Q) AR(%) R(Q) AR(%) R(Q) AR(°/〇) R(Q) AR(%) PF —— 0.18 - 0.15 - 0.25 - 0.16 - 0.18 - 0.17 - SF 一 _ 0.18 0 0.16 6.7 0.24 -4 0.16 0 0.19 5.5 0.18 5.9 TF 0.19 5.5 0.16 6.7 0.22 -12 0.16 0 0.19 5.5 0.20 11.8 E7 E8 E9 E10 CE1 CE2 R(a) △R(%) 學） △R(%) R(n) AR(%) ΙΙ(Ω) AR(%) R(Q) △R(%) R(a) △R(〇/〇) PF 0.19 - 0.17 - 0.2 - 0.14 _ 0.42 - 0.38 - SF 0.21 10.1 0.18 5.9 0.22 10 0.15 7.1 0.49 16.7 0.46 21 TF —— 0.20 5.3 0.18 5.9 0.2 0 0.14 0 0.55 30.9 0.53 39.5 PF :初次焙燒(560°C)後 SF :第二次焙燒(560°C)後 TF :第三次焙燒(560°C)後 18 200937453 E :實施例 CE :對比例 由表4可見，由實施例1〜l〇的具有約2.0或更低的 粒度分佈（(D90-D10)/D50)的組合物製備的電極具有比用 對比例1和2的組合物製備的電極低得多的初始阻抗。El E2 E3 E4 E5 E6 R(Q) AR(%) R(Q) △R(〇/〇) R(Q) AR(%) R(Q) AR(%) R(Q) AR(°/〇 R(Q) AR(%) PF —— 0.18 - 0.15 - 0.25 - 0.16 - 0.18 - 0.17 - SF _ 0.18 0 0.16 6.7 0.24 -4 0.16 0 0.19 5.5 0.18 5.9 TF 0.19 5.5 0.16 6.7 0.22 -12 0.16 0 0.19 5.5 0.20 11.8 E7 E8 E9 E10 CE1 CE2 R(a) △R(%) Learn) △R(%) R(n) AR(%) ΙΙ(Ω) AR(%) R(Q) △R(% R(a) △R(〇/〇) PF 0.19 - 0.17 - 0.2 - 0.14 _ 0.42 - 0.38 - SF 0.21 10.1 0.18 5.9 0.22 10 0.15 7.1 0.49 16.7 0.46 21 TF - 0.20 5.3 0.18 5.9 0.2 0 0.14 0 0.55 30.9 0.53 39.5 PF: after initial calcination (560 ° C) SF: second calcination (560 ° C) after TF: third calcination (560 ° C) after 18 200937453 E: Example CE: Comparative Example by Table 4 It can be seen that the electrode prepared from the compositions of Examples 1 to 10 having a particle size distribution of about 2.0 or less ((D90-D10)/D50) has a lower electrode than the composition prepared with the compositions of Comparative Examples 1 and 2. More initial impedance.

由於實施例1的D50為4,而對比例2的D50為4.06, 這些例子在D50方面非常相似。但是，由表4可見，這些 例子根據其粒度分佈在初始阻抗和後續再焙燒阻抗方面呈 現出非常顯著的區別。 並且’對於實施例6，當(D90-D10)/D50超過1.7時’ 根據重複焙燒的阻抗變化大於由(D9〇_D10)/D5〇在ι.7或 更低的組合物製成的電極。 、、、=果疋這些貫^例§兒明根據本發明僅僅藉由調節用 作導電填料的鋁粉的D50，並調節其粒度分佈（ (D9〇-Dl〇)/D5〇)至約2 〇或更低，即使是培燒和重複培燒 之後’也可崎顺低的秘阻抗和不顯著雜抗變化。 然本發明6^實施例揭露如上，然其並_以限定 ^ ’任何所屬_賴巾具有通常知識者，在不脫離 本發明之精神和範圍肉^ 脱離 發明之㈣範圍％ ® 0。权更動與潤飾，故本 【圖式簡單說ΪΓ 申請專魏_界定者為準。 發明的-個實施方式的組合物製備的 【主要元件符號說明】 19 200937453 ❹ 電漿顯示面板 :前基板 :透明電極 .匯流電極 :第一電介質層 :第二電介質層 :定址電極 :MgO 層 :分隔物 :螢光物質 :後基板 20Since the D50 of Example 1 was 4 and the D50 of Comparative Example 2 was 4.06, these examples were very similar in terms of D50. However, as can be seen from Table 4, these examples show very significant differences in initial impedance and subsequent re-baking resistance depending on their particle size distribution. And 'For Example 6, when (D90-D10)/D50 exceeds 1.7' the electrode according to the resistance change of the repeated baking is larger than the electrode made of the composition of (D9〇_D10)/D5〇 at ι.7 or lower . According to the present invention, only by adjusting the D50 of the aluminum powder used as the conductive filler, and adjusting the particle size distribution ((D9〇-Dl〇)/D5〇) to about 2 〇 or lower, even after cultivating and repeating the simmering, the succinct impedance and the insignificant tamper resistance change. However, the present invention has been disclosed as above, and it is intended that the scope of the invention is not limited by the spirit and scope of the invention, and the scope of the invention is excluded from the scope of the invention. The right to change and retouch, so this [simplification of the diagram ΪΓ application for special Wei _ defined as the standard. [Main component symbol description] of the composition of the invention - 19 200937453 ❹ Plasma display panel: front substrate: transparent electrode. Bus electrode: first dielectric layer: second dielectric layer: address electrode: MgO layer: Separator: Fluorescent substance: rear substrate 20

Claims (1)

200937453 七、申請專利範圍： 1. —種電極用組合物，包括： 的如Ht95腦_粉，所馳粉具有約2.0或更低 '下列么式（1)所表示粒度分佈： _ 粒度分佈=(D90-D10)/D50 公式（1) ❹ Ο 八德^’叫卜⑽和謂表示當總重量為聊棘粒度 :古，、積曲線上在1()%、5G%和％%的點處的粒徑，並 有約0.1 μη^ϋ50彡約20 μιη範圍内的D5〇 ; '·、勺3至約60 wt%的有機黏合劑；以及 餘量的溶劑。 2. 如申請專利範圍第〗項所述之組合物，其中所述銘 恭為銘或紹合金。 3」如申請專利翻第2酬述之組合物，其中所述铭 ^藉由將選自銀、銅、石夕、錫、鉻和鍺中的至少—種元 素與叙形成合金而得到。 4.如申請專魏财丨項崎之岭物，其中所述銘 里^有、力0.5〜約1.7的如公式(1)所表示的粒度分佈，並且 &quot;有約0.1 μηι彡D50彡約20 μπι範圍内的出〇。 —5.如申請專利範圍帛1項所述之組合物，其中所述有 ==劑為選自纖維素、水溶性纖維讀生物以及藉由共 有烯類不飽和雙鍵的單體與羧酸類單體得到的共聚物 肀的至少一種。 6.如申請專利範圍第5項所述之組合物，其中所述具 有烯類不飽和雙鍵的單體包括選自丙烯酸的酯類、苯乙 21 200937453 稀、丙稀酸胺和丙烯腈中的至少一種單體，且其中所述叛 酸類單體包括選自丙烯酸、甲基丙烯酸和衣康酸中的至少 一種羧酸類單體。 7. 如申請專利範圍第1項所述之組合物，其中所述溶 . 劑為選自甲基溶纖劑、乙基溶纖劑、丁基溶纖劑、脂肪族 醇、萜品醇、/3-萜品醇、二氫萜品醇、乙二醇、二甘 醇單曱醚、二甘醇單***、二甘醇單丙醚、二醚乙二醇單 丁醚、二丙二醇單曱醚、丙二醇單曱醚乙酸酯、丙三醇、 m ^ 乙酸丁酯、乙酸乙酯、環己醇、丁基溶纖劑乙酸酯、酯醇、 礦油精、有機酸、油酸及其組合中的至少一種。 8. 如申請專利範圍第1項所述之組合物，進一步包括 相對於100重量份的組合物為約1〜約30重量份的玻璃 膠。 9. 如申請專利範圍第8項所述之組合物，其中所述玻 璃膠包括 PbO、Bi203、Si02、B2〇3、P205、ZnO 或 Al2〇3 中的至少一種。 ❿ 10.如申請專利範圍第9項所述之組合物，其中所述玻 璃膠具有約300〜約600°C的玻璃轉化溫度。 . 11.如申請專利範圍第1項所述之組合物，其中所述有 機黏合劑具有約300〜約500°c的分解溫度。 12. 如申請專利範圍第1項所述之組合物，進一步包括 相對於100重量份的組合物為約0.1〜約20重量份的光聚 合化合物和約0.01〜約10重量份的光聚合引發劑。 13. 如申請專利範圍第1項所述之組合物，進一步包括 22 200937453 選自肩泡劑、均化劑、紫外線穩定劑、 定劑、分散劑、抗熱_m其組合中的至 、-種電極，崎自乾縣阻方法、塗佈法、網/ 刷法、膠版印刷法和微影法中的方法形成，並且包括在約 4步^〜約_^燒如中料利顧第1項所述之組合物的200937453 VII. Patent application scope: 1. A composition for an electrode, comprising: such as Ht95 brain powder, the powder has a viscosity of about 2.0 or less. The particle size distribution represented by the following formula (1): _ particle size distribution = (D90-D10)/D50 Formula (1) ❹ 八 Ba De ^ '叫卜 (10) and the predicate indicates that when the total weight is the granularity of the thorns: the ancient, the product curve is at the points of 1 ()%, 5G%, and %% The particle size, and has a D5 约 in the range of about 0.1 μη ϋ 50 彡 about 20 μηη; '·, spoon 3 to about 60 wt% of the organic binder; and the balance of the solvent. 2. The composition as set forth in claim </ RTI> of the scope of the patent, wherein the inscription is a Ming or Shao alloy. 3" The composition of claim 2, wherein said composition is obtained by forming at least one element selected from the group consisting of silver, copper, stellite, tin, chromium and strontium. 4. For example, if you apply for the special property of Wei Cai, Kanzaki, there is a particle size distribution as shown in formula (1) with a force of 0.5 to about 1.7, and &quot;about 0.1 μηι彡D50彡 about 20 μπι Out of range. The composition of claim 1, wherein the == agent is selected from the group consisting of cellulose, water-soluble fiber-reading organisms, and monomers and carboxylic acids by sharing ethylenically unsaturated double bonds. At least one of the copolymer oximes obtained from the monomers. 6. The composition of claim 5, wherein the monomer having an ethylenically unsaturated double bond comprises an ester selected from the group consisting of an ester of acrylic acid, phenylethyl 21 200937453, an amide, an acrylonitrile, and an acrylonitrile. At least one monomer, and wherein the oleic acid monomer comprises at least one carboxylic acid monomer selected from the group consisting of acrylic acid, methacrylic acid, and itaconic acid. 7. The composition of claim 1, wherein the solvent is selected from the group consisting of methyl cellosolve, ethyl cellosolve, butyl cellosolve, aliphatic alcohol, terpineol, /3 - terpineol, dihydroterpineol, ethylene glycol, diethylene glycol monoterpene ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diether glycol monobutyl ether, dipropylene glycol monoterpene ether, Propylene glycol monoterpene ether acetate, glycerol, m ^ butyl acetate, ethyl acetate, cyclohexanol, butyl cellosolve acetate, ester alcohol, mineral spirits, organic acids, oleic acid, and combinations thereof At least one. 8. The composition of claim 1, further comprising from about 1 to about 30 parts by weight of the glass gum relative to 100 parts by weight of the composition. 9. The composition of claim 8, wherein the glass gum comprises at least one of PbO, Bi203, SiO 2 , B 2 〇 3, P 205, ZnO or Al 2 〇 3 . The composition of claim 9, wherein the glass frit has a glass transition temperature of from about 300 to about 600 °C. 11. The composition of claim 1, wherein the organic binder has a decomposition temperature of from about 300 to about 500 °C. 12. The composition of claim 1, further comprising from about 0.1 to about 20 parts by weight of the photopolymerizable compound and from about 0.01 to about 10 parts by weight of the photopolymerization initiator relative to 100 parts by weight of the composition. . 13. The composition of claim 1, further comprising 22 200937453 selected from the group consisting of a shoulder foaming agent, a leveling agent, a UV stabilizer, a fixing agent, a dispersing agent, and a heat resistant combination of -, The electrode is formed by the method of the resistance method of the dry county, the coating method, the net/brush method, the offset printing method, and the lithography method, and is included in about 4 steps ^ ~ about _ ^ burning as in the middle of the material to benefit the first Composition of the item 參 60^立^1極’用微影法形成’並且包括在約450〜約 6〇〇α燒如申請專·圍第12項所述之組合物的步驟。 16.—種電漿顯示面板，包括： 前基板和面對所述前基板的後基板； 透月電極在面對所述後基板的所述前基 以水平方向配置； 上的縱向上 匯流電極，形成於所述透明電極上；以及 定址電極，位於面對所述前基板的所述後基板的表面 其中 所述匯流電極、所述定址電極或所述匯流電極 ”斤逑定址電極包括如巾請專職圍第M項所述之電極。 一種電漿顯示面板，包括： 前基板和面對所述前基板的後基板； 、透明電極’在面對所述後基板的所述前基板的表面上 以水平方向配置； ，&quot;IL電極，形成於所述透明電極上；以及 疋址電極’位於面對所述前基板的所述後基板的表面 上的縱向上， 200937453 其中，所述匯流電極、所述定址電極或述匯流電極與 所述定址電極包括如申請專利範圍第15項所述之電極。The step of forming a composition by the lithography method and including the composition described in the application of the above-mentioned item 12 is carried out at about 450 to about 6 Å. 16. A plasma display panel comprising: a front substrate and a rear substrate facing the front substrate; a vapor permeable electrode disposed in a horizontal direction on the front substrate facing the rear substrate; and a longitudinally upper bus electrode Formed on the transparent electrode; and an address electrode located on a surface of the rear substrate facing the front substrate, wherein the bus electrode, the address electrode or the bus electrode includes a towel Please fully engage the electrode described in item M. A plasma display panel comprising: a front substrate and a rear substrate facing the front substrate; and a transparent electrode 'on the surface of the front substrate facing the rear substrate And the upper electrode is formed on the transparent electrode; and the address electrode is located in a longitudinal direction on a surface of the rear substrate facing the front substrate, 200937453 wherein the confluence The electrode, the address electrode or the bus electrode and the address electrode include the electrode as described in claim 15. 24twenty four
TW097145187A 2007-11-22 2008-11-21 Composition for electrodes comprising aluminum powder having controlled particle size distribution and size, and electrodes made using the same TWI379315B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20070119523 2007-11-22
KR1020080042029A KR20090053667A (en) 2007-11-22 2008-05-06 Composition for fabricating the electrode comprising aluminium powder controlling the particle size distribution and size and electrode made by the same
KR1020080086507A KR101050529B1 (en) 2007-11-22 2008-09-02 Electrode forming composition comprising aluminum powder with controlled particle size distribution and size and electrode manufactured using the same

Publications (2)

Publication Number Publication Date
TW200937453A true TW200937453A (en) 2009-09-01
TWI379315B TWI379315B (en) 2012-12-11

Family

ID=40726288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145187A TWI379315B (en) 2007-11-22 2008-11-21 Composition for electrodes comprising aluminum powder having controlled particle size distribution and size, and electrodes made using the same

Country Status (4)

Country Link
JP (1) JP2009135101A (en)
KR (2) KR20090053667A (en)
CN (1) CN101441904B (en)
TW (1) TWI379315B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101204812B1 (en) * 2009-03-31 2012-11-27 도레이 카부시키가이샤 Photosensitive conductive paste, method for manufacturing display using photosensitive conductive paste, and display
KR101340541B1 (en) * 2010-12-13 2013-12-11 제일모직주식회사 Electrode Composition for Offset Printing, Method for Preparing a Electrode and a Plasma Display Panel using the Same
KR101411012B1 (en) * 2011-11-25 2014-06-24 제일모직주식회사 Electrode paste composite for a solar battery and electrode thereof and solar cell thereof
CN102426870B (en) * 2011-12-31 2013-10-09 四川虹欧显示器件有限公司 Electrode paste for plasma display panels, preparation method thereof and electrodes prepared from paste
JP6076687B2 (en) * 2012-10-22 2017-02-08 太陽ホールディングス株式会社 Conductive composition, electrode, plasma display panel and touch panel
US10672922B2 (en) 2014-08-28 2020-06-02 Dupont Electronics, Inc. Solar cells with copper electrodes
WO2016029397A1 (en) * 2014-08-28 2016-03-03 E.I. Du Pont De Nemours And Company Copper-containing conductive pastes and electrodes made therefrom
DE112014006907T5 (en) 2014-08-28 2017-06-08 E.I. Du Pont De Nemours And Company Copper-containing conductive pastes and electrodes made therefrom
JP6742877B2 (en) * 2016-09-28 2020-08-19 株式会社ノリタケカンパニーリミテド Conductive paste
JP6762848B2 (en) * 2016-11-02 2020-09-30 東洋アルミニウム株式会社 Paste composition
CN115565713A (en) * 2022-10-27 2023-01-03 广州市儒兴科技股份有限公司 Nano aluminum paste and preparation method and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003192339A (en) * 2001-12-27 2003-07-09 Showa Denko Kk Alumina particle, manufacturing method for the same and composition containing the same
KR20050122498A (en) * 2004-06-24 2005-12-29 삼성에스디아이 주식회사 A photosensitive paste composition, the pdp electrode prepared therefrom and a pdp comprising the pdp electrode
KR100709186B1 (en) * 2005-06-29 2007-04-18 삼성에스디아이 주식회사 Composition for performing electrode of plasma display panel, electrode prepared from the same, and plasma display panel comprising the electrode
KR100739061B1 (en) 2005-07-29 2007-07-12 삼성에스디아이 주식회사 Photosensitive composition for performing electrode, transfer film, electrode and plasma display panel comprising the same
KR100776133B1 (en) * 2007-01-05 2007-11-15 제일모직주식회사 Electrode composition for offset print, method for preparing a electrode by the same

Also Published As

Publication number Publication date
TWI379315B (en) 2012-12-11
KR101050529B1 (en) 2011-07-20
CN101441904A (en) 2009-05-27
KR20090053667A (en) 2009-05-27
CN101441904B (en) 2011-03-30
JP2009135101A (en) 2009-06-18
KR20090053676A (en) 2009-05-27

Similar Documents

Publication Publication Date Title
TW200937453A (en) Composition for electrodes comprising aluminum powder having controlled particle size distribution and size, and electrodes made using the same
TW200923975A (en) Composition for fabrication of electrode, electrode fabricated using the same, plasma display panel, and associated methods
JP2011503240A (en) Electrode composition for offset printing, electrode manufacturing method using the same, and plasma display panel using the same
TWI374336B (en) Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby
US8343384B2 (en) Composition for electrodes comprising aluminum powder having controlled particle size distribution and size, and electrodes made using the same
JP5243469B2 (en) Plasma display panel and manufacturing method thereof
JPH08119665A (en) Glass composition and plasma display panel using the same
KR20100075216A (en) Electrode composition, electrode and plasma display panel using the same
KR20100075218A (en) Composition of paste for fabricating the electrode and plasma display panel electrode fabricated using the same
JP4942711B2 (en) Methods and materials for fabricating bus electrodes for plasma display panels
KR20090048286A (en) Composition for fabricating the electrode comprising silver coated aluminium powder and electrode made by the same
JP3959811B2 (en) Method for manufacturing substrate for plasma display panel
KR101015107B1 (en) Composition for fabricating the black layer of PDP electrode and black layer of PDP electrode using the same, PDP device
KR101608120B1 (en) Method for manufacturing electrode for display apparatus, electrode for display apparatus manufactured using the same and display apparatus comprising the same
KR101097429B1 (en) Composition for fabricating black layer of pdp electrode
JP6100585B2 (en) Lead-free glass composition
JP2008288003A (en) Dielectric formation glass paste for plasma display panel
KR20090048287A (en) Composition for fabricating the electrode comprising silver powder and aluminium powder and electrode made by the same
KR20090114839A (en) Plasma display panel dielectric substance composition and plasma display panel comprising the same
JP2007106802A (en) Binder resin composition and inorganic microparticle-dispersed paste composition
JP2000173458A (en) Manufacture of substrate for plasma display
JP2002003786A (en) Vehicle for glass paste and glass paste
JP2002169274A (en) Photosensitive paste and mixture material for preparation of the paste

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees