TW200933123A - Apparatus and method for simulataneous confocal full-field micro surface profilometry - Google Patents
Apparatus and method for simulataneous confocal full-field micro surface profilometryInfo
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Abstract
Description
200933123 九、發明說明: 【發明所屬之技術領域】 本發明係有關一種光學量測方法與裝置,尤其是指一 種利用同時擷取複數組分別具有不同聚焦位置之影像,以 解析待測物形貌特徵之一種共焦顯微形貌量測方法與裝 置。 【先前技術】 在1C產業、半導體產業、LCD產業或者是光電量測產 業等領域中,常需要進行諸如:晶圓的表面粗糙度和平面 度的量測、覆晶製程中金球凸塊的尺寸和共面度的量測、 晶圓共面度之量測、PCB缺陷檢測、端子瑕疵檢測與1C製 程檢測、微結構和微光學元件表面形貌的量測等,以判斷 製程產品的品質作為控制製程的依據。 在習用技術中,用來量測上述產品之特徵的方式為共 焦量測技術。例如在美國公開申請案US. Pub. No. 2006/0232790所揭露的一種共焦量測方法與裝置,其係利 用偵測光投射至待測物上,再藉由光學元件蒐集由該待測 物散射以及反射之測物光。然後將測物光聚焦至光偵測器 上。最後再根據光偵測器所收到之光訊號建立聚焦位置之 資訊,並根據聚焦位置之資訊決定待測物之距離。另一習 用技術如美國公開申請案US. Pat. No. 2004/0051879所公 開的一種共焦感測器,其係利用一對光感測器感測由待測 物散射之光強度,然後進行解析,以得到待測物之位置資 5 200933123 訊。 1述之共焦量測技術 測方式’來獲得不同 :乂九子式:直知榣之量 (pinh〇le)進行失度之^學切片影像’藉由針孔 射光慮除,保留聚;之^慮,將聚焦區外之反射先與散 Ο Ο 訊。由上述方法可二首即可,則物三度空間影像資 掃描之方式來獲得三維:二=刖共焦量測系統均利用垂直 率不佳以及易受到線上θ、^貝料’在量測上將造成量測致 測結果之不準確。線上”環境振動問題之干擾,造成量 綜合上述,因此τ 置來解決制技術所產焦顯微形貌量測方法與裝 【發明内容】 ,明提供1共焦顯微形貌 =Γ光分成複數組光群組,並改變光群 ^ \二之聚焦位置,然後同時擷取對應每一光群紐 衫j並將,像資訊進行解析以得到制物之形貌特徵之 _ '物反射之測物光分成複數組光群組,並 ,由不同厚度之折射元件改變光群組内每—道子測物光之 D5然後同時擷取對應每一光群組之影像,並進行 解析~㈣待測物之形貌特徵’以精確且快速完成全域式 三維輪廓量測。 200933123200933123 IX. Description of the Invention: [Technical Field] The present invention relates to an optical measurement method and apparatus, and more particularly to an image having different focus positions by simultaneously capturing a complex array to analyze the shape of the object to be tested. A method and apparatus for measuring confocal micromorphology of features. [Prior Art] In the fields of 1C industry, semiconductor industry, LCD industry or photoelectric measurement industry, it is often necessary to perform measurements such as surface roughness and flatness of wafers, and gold ball bumps in flip chip process. Measurement of dimensions and coplanarity, measurement of wafer coplanarity, detection of PCB defects, detection of terminal defects and 1C process inspection, measurement of microstructure and surface morphology of micro-optical components, etc., to judge the quality of process products As the basis for controlling the process. In conventional techniques, the means for measuring the characteristics of the above products is a confocal measurement technique. A confocal measurement method and apparatus disclosed in U.S. Patent Application Publication No. 2006/0232790, which utilizes detection light to be projected onto an object to be tested, and is then collected by the optical component. Object scattering and reflected object light. The subject light is then focused onto the photodetector. Finally, the information of the focus position is established according to the optical signal received by the photodetector, and the distance of the object to be tested is determined according to the information of the focus position. Another conventional technique, such as the confocal sensor disclosed in US Pat. No. 2004/0051879, which utilizes a pair of photo sensors to sense the intensity of light scattered by the object to be tested, and then proceeds. Analyze to get the position of the object to be tested 5 200933123. 1 The method of measuring confocal measurement technology is used to obtain the difference: 乂 子 子 : : : : : : : : : : : : : : pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin pin The consideration of the reflection outside the focus area is first and foremost. The above method can be used for two, and the three-dimensional space image scanning method is used to obtain three-dimensional: the two-n=confocal measurement system utilizes the vertical rate is poor and is susceptible to the measurement of the line θ, ^ bead material. The above will cause inaccuracies in the measurement results. The interference of the online "environmental vibration problem, the amount of the above is integrated, so the τ set to solve the method of measuring the microscopic topography of the technology produced by the technology and the installation [invention], provide a confocal microscopic morphology = Γ光分复复群光群Group, and change the focus position of the light group ^ \ two, and then draw corresponding to each light group button j and will analyze the information to obtain the topography of the object _ 'object reflection of the light division Complex array of light groups, and the D5 of each of the light objects in the light group is changed by the refractive elements of different thicknesses, and then the image corresponding to each light group is simultaneously captured and analyzed. (4) Shape of the object to be tested Appearance features 'to complete the global 3D contour measurement accurately and quickly. 200933123
本發明提供一種共焦顯微形貌量測裝置,其係利用DMD 來調制入射光投影圖形與光源強度,並藉由DMD所具備之 高免度與高解析等特性,以彌補量測資訊與空間解析不足 之問通,使得该共焦顯微形貌量測裝置可以適應於各種不 同待測物表面之應用。 Ο Ο 在一實施例令,本發明提供—種共焦顯微形貌量測方 法,其係包括有下列步驟:將—調制光源投射至一待測 物上,⑻將㈣待測物反射之獅光分光,㈣成複數組 ί群組’每一光群紐具有複數道子測物光;(C)分別改變 每α光群組之子測物光之聚焦位置;以及(d)根據步 驟(c) 所传到之子測物光重建出該待測物之—形貌特徵。 測奘在另一實施例中’本發明更提供一種共焦顯微形貌量 二置包括一光源調制部,其係可投射一調制光源於 #八2物上,分光部,其係可將由該待測物反射之測物 測以形成複數個光群組,每-個光群組具有複數道子 、,一聚焦位置調整部,其係可分別調制該複數個光 數道子測物光使每—子測物光具有不同之聚焦位 數個^像,取部,其係分職取每—個紐組以形成複 之子^ .母一個影像更具有複數個分別對應該子測物光 以;5二ί,以及一處理與控制單元,其係與該光源調制部 複數触部電性連接,該處理與控制單元可接收該 數個讀轉析出該待測物之形貌特徵。 元,另、實施例中,該光源調制部使用一光陣列反射單 、為微反射鏡裝置(digital micro-mirror device, 7 200933123 DMD) 〇 【實施方式】 為使貴審查委員能對本發明之特徵、目的及功能有 更進-步的認知與瞭解,下文特將本發明之裝置的相關細 部結構以及設計的理念原由進行說明,以使得審查委員可 以了解本發明之特點,詳細說明陳述如下. 請參閱圖一 Α所二,該圖係為本發明之共焦顯微形貌 量測方法實施例流程不意圖。該共焦顯微形貌量測方法包 括有下列步驟:首先進行步驟2〇,將—調制光源投射至一 待測物上。該,測物可為具有階高之待測物,也就是待測 物上具有不同高度之表面901〜903。在本實施例中,該調 制光源可以具有一明暗圖紋,該調制光源之明案圖紋係可 根據需要而定。例如:圖二A與圖二B所示,其中圖二a G 之調制光源圖紋為棋盤式的明暗圖纹,而圖二β則為弦波 4的圖紋。該調制光源的圖案可根據需要而任意變換投影 圖紋,例如丄改變編碼條紋寬度、週期、對比以改善量測 解析度與提高效率,因此並不以圖二八或圖二B為限。投 射至待測物之調制光源會經由待測物之反射而形成一測物 光。然後透過步驟2卜將由該待_反射之測物光分光, 以形成複數組光群組,每-光群組具有複數道子測物光。 在本少驟中,分光的方式’係可藉由分光鏡的排列組合, 將一道反射測物光分成複數遒子測物光。 接下來進灯步驟22分别改變每―光群組之子測物光 8 200933123 之聚焦位置。在本步驟之改變聚焦位置之方式係為偏折光 路的方式。在一實施例中’偏折光路的方式可分別使每一 光群組中之每一道子測物光通過不同厚度之偏折板,以改 變每一道子测物光之聚焦位置。最後在進行步驟23,根據 該複數道偏折測物光所得到之影像重建出該待測物之一形 貌特徵。接下來說明步驟22之細部流程,請參閱圖三所 不,该圖係為本發明之重建形貌特徵實施例流程示意圖。 重建形貌特徵首先以步驟230,擷取對應每一道偏折測物 光所對應^影像。由於每一個光群組具有複數道子偏折測 物光,而每一個子偏折測物光可以形成一個子影像,因此 在每一個光群組的影像中,具有複數個子影像 ,而且每一 個子影像的聚焦位置並不相同。也就是說,在同—個光群 組影像中具有複數聚焦位置不同之子影像。接著進行步驟 231,求得每一對應影像之一聚焦指標值。在本步驟中,由 於每-個子影像具有*同之m置,因此所擷取之影像 清晰度各有不同’所以每一個子影像可以藉由一演算法則 求取對應之聚焦指標值。 而求取聚焦指標值之演算法有很多,例如1〇113让的 自相關(autocorrelation)函數F5或F4演算法,而本實 施例係採用Vollath的F4演算法,如式(1)所示,之、寅 法。除了使用相關係數法(Multi_c〇effic=nt Correlation),也可以利用影像差異法(ι贴狀 Differentiation),例如:門檻絕對梯度演曾法 (Thresholded Absolute Gradient)或者是平方^度演^法 (squared gradient)等、灰度值峰谷深度法(二处异μ 200933123The invention provides a confocal micro-morphology measuring device, which uses DMD to modulate the incident light projection pattern and the intensity of the light source, and compensates for measurement information and spatial analysis by virtue of the high degree of exemption and high resolution of the DMD. Insufficient communication makes the confocal micromorphology measuring device adaptable to the application of various different objects to be tested.一 Ο In an embodiment, the present invention provides a method for measuring a confocal micromorphology, comprising the steps of: projecting a modulated light source onto an object to be tested, and (8) reflecting (4) a lion light reflected by the object to be tested. Splitting, (4) forming a complex array ί group 'each light group has a plurality of tracked object light; (C) respectively changing the focus position of the sub-meter light of each alpha light group; and (d) according to step (c) The measured light of the sub-detector reconstructs the topography of the object to be tested. In another embodiment, the present invention further provides a confocal microscopic topography comprising a light source modulating portion that can project a modulated light source on the #八二物, a light splitting portion, which can be The object of the object reflection is formed to form a plurality of light groups, each light group has a plurality of tracks, and a focus position adjustment portion is configured to respectively modulate the plurality of light number signals to make each light The measuring light has different focal points, and the part is taken, and each part is divided into each group to form a complex child. The mother image has multiple numbers corresponding to the sub-measurement light; And a processing and control unit electrically connected to the plurality of contacts of the light source modulating portion, and the processing and control unit can receive the topographical features of the plurality of read and transform samples. In another embodiment, the light source modulation unit uses a light array reflection unit and is a micro micro-mirror device (7 200933123 DMD). [Embodiment] In order to enable the examiner to characterize the present invention. The purpose, function and function have further advanced knowledge and understanding. The following detailed description of the detailed structure and design concept of the device of the present invention is made so that the reviewing committee can understand the characteristics of the present invention, and the detailed description is as follows. Referring to the drawings, the figure is not intended to be an embodiment of the confocal micromorphology measurement method of the present invention. The confocal micromorphology measurement method includes the following steps: First, step 2 is performed to project a modulated light source onto a sample to be tested. The object can be a test object having a step height, that is, surfaces 901 to 903 having different heights on the object to be tested. In this embodiment, the modulated light source may have a light and dark pattern, and the pattern of the modulated light source may be determined as needed. For example, as shown in Fig. 2A and Fig. 2B, the modulation light source pattern of Fig. 2 a G is a checkerboard pattern, and Fig. 2 β is the pattern of the sine wave 4. The pattern of the modulated light source can be arbitrarily transformed as needed, for example, changing the width, period, and contrast of the encoded stripe to improve the resolution and efficiency, and thus is not limited to FIG. 28 or FIG. The modulated light source that is incident on the object to be tested forms a test object light through reflection of the object to be tested. Then, the light to be reflected by the to-be-reflected light is split by step 2 to form a complex array of light groups, each of which has a plurality of tracked object light. In this small step, the way of splitting light can be divided into a plurality of dice detectors by means of a combination of arrangement of beamsplitters. Next, the light-on step 22 changes the focus position of the sub-object light 8 200933123 of each light group. The manner in which the focus position is changed in this step is a way of deflecting the light path. In one embodiment, the manner in which the optical paths are deflected may cause each of the sub-test objects in each of the optical groups to pass through deflecting plates of different thicknesses to change the focus position of each of the sub-tested objects. Finally, in step 23, a shape characteristic of the object to be tested is reconstructed according to the image obtained by deflecting the object light. Next, the detailed process of step 22 will be described. Please refer to FIG. 3, which is a schematic flowchart of the embodiment of the reconstructed topography of the present invention. Reconstructing the topographical features first takes step 230 and captures the corresponding image corresponding to each of the deflected objects. Since each light group has a plurality of track deflection target lights, and each sub-deflection object light can form a sub-image, in each image group, there are a plurality of sub-images, and each sub-image The focus position of the image is not the same. That is to say, there are sub-images with different focus positions in the same group of light group images. Next, in step 231, a focus index value of each corresponding image is obtained. In this step, since each sub-image has the same *, the captured images have different sharpnesses. Therefore, each sub-image can obtain a corresponding focus index value by an algorithm. There are many algorithms for obtaining the focus index value, for example, the autocorrelation function F5 or F4 algorithm of 1〇113, and this embodiment uses the Fla4th F4 algorithm, as shown in equation (1). , law. In addition to using the correlation coefficient method (Multi_c〇effic=nt Correlation), it is also possible to use the image difference method (Differentiation), for example: Thresholded Absolute Gradient or squared method (squared) Gradient), gray value peak-to-valley depth method (two different μ 200933123
Peaks and Valleys) ’例如:影像閥值總和演算法(image threshold content )或者是影像功率演算法(image power)、影像對比法(Image Contrast),例如:影像變異 演算法(Variance)或者是正規化便亦演算法(N〇rmal ized variance)、灰度統計圖法(Histogram),例如:灰度範圍 (Range)演算法或者是灰度熵值(Entropy)演算法等、頻域 法(Frequency-domain Analysis) ’例如:拉普拉斯演算法 ❹ (LaPlacian),或者其他有效之空間頻率分布鑑別法則得知 聚焦指標值。Peaks and Valleys) 'Example: image threshold content or image power, Image Contrast, for example, image variation algorithm (Variance) or normalization It is also an algorithm (N〇rmal ized variance) and a grayscale statistical method (Histogram), such as: gray range algorithm or gray entropy algorithm, frequency domain method (Frequency- Domain Analysis) 'For example: Laplacian algorithm La (LaPlacian), or other valid spatial frequency distribution identification rule to know the focus index value.
volH ΣΣ^Μχ+ι,;〇-IX/M x/(x + 2,y) (1) x=l 少=1 求出了聚焦指標值之後,接著進行步驟232,根據每 應衫像之聚焦指標值擬合出一聚焦指標曲線。接下來 以母一光群組影像具有三個子影像為例來說明擬合曲線之 ·© 置妹圖四所示’其中(a)〜(d)每一圖係分別不同聚焦位 . ,光條紋影像示意圖。其中,每一個子影像(a)〜(d) 影^者每一道之經由步驟21所形成之子測物光所產生的 : 圖四(a)為塊規階高在未達到聚焦位置所取得之影 像,四(b)為塊規階高在接近達到聚焦位置所取得之影 θ四(〇)為塊規階高在稍為遠離聚焦位置所取得之影像 向圖四(d、& ^ 7為塊規階高在遠離聚焦位置所取得之影像。由 值可、If中分別可以求得一聚焦指標,根據該聚焦指標 後订而斯曲線擬合以形成如圖五之聚焦反應曲線。最 订步驟233求出該聚焦反應曲線之峰值。例如:圖 200933123 四A至圖四D之每一張影像之數學模型表示如下式 ⑵〜⑸:volH ΣΣ^Μχ+ι,;〇-IX/M x/(x + 2,y) (1) x=l less=1 After finding the focus index value, proceed to step 232, according to each shirt image The focus indicator value is fitted to a focus indicator curve. Next, taking the three sub-images of the mother-one light group image as an example to illustrate the fitting curve, the source of the image is shown in Figure 4, where (a) ~ (d) each picture has different focus positions. Image schematic. Wherein, each of the sub-images (a) to (d) is generated by the sub-measurement light formed by the step 21 in each of the sub-images: Figure 4 (a) is obtained by the block gauge height not reaching the focus position. The image, four (b) is the block height of the block, and the image obtained by the approaching of the focus position is θ4 (〇). The block height is slightly away from the focus position. The image is shown in Figure 4 (d, & ^ 7 The block gauge height is obtained from the image obtained from the focus position. A focus index can be obtained from the value and If, respectively, and the curve is fitted according to the focus index to form a focus response curve as shown in FIG. Step 233 finds the peak value of the focus response curve. For example: Figure 200933123 The mathematical model of each of the four images A to D shows the following equations (2) to (5):
Jk = AeB(:「cf …⑵Jk = AeB(: "cf ...(2)
Ik+] = AeB^-C)2 …⑶Ik+] = AeB^-C)2 ...(3)
Ik+2=Aeeacf …⑷ U,:,c)2 …(5)Ik+2=Aeeacf ...(4) U,:,c)2 ...(5)
由於高斯方程式使用於非線性之數學模型,接著對式 (2)至(5)之方程式取自然對數,使其轉換成線性的數學 模型,如下式(6)〜(9)所示: ln/A = \nA + B(zk - C)2 -(6) 1ηΛ+ι : =In + B{zk+X - C)2 -(7) 叫+2 =In j + 5(ζλ+2 - Q2 …(8) 1ηΛ+3 = lnA + B(zk+3 - C)2 …(9) 利用四個方程式解三個未知數,利用最小平方法之方 式評估,尋找出最佳解,求出反應曲線之峰值C,其平方 總誤差E如下式(10)所示:Since the Gaussian equation is used in a nonlinear mathematical model, the equations of equations (2) through (5) are followed by natural logarithms, which are converted into linear mathematical models, as shown in the following equations (6) to (9): ln/ A = \nA + B(zk - C)2 -(6) 1ηΛ+ι : =In + B{zk+X - C)2 -(7) Called +2 =In j + 5(ζλ+2 - Q2 ...(8) 1ηΛ+3 = lnA + B(zk+3 - C)2 (9) Solve three unknowns using four equations, evaluate them by means of the least squares method, find the best solution, and find the response curve. The peak value C of the peak value E is as shown in the following equation (10):
2 -XnA-Biz^C)2} /=/:-1 8E ΘΑ …(10) 令2 -XnA-Biz^C)2} /=/:-1 8E ΘΑ ...(10) Order
dE dBdE dB
dE ~dC 0,可獲得三個方程式,聯立解 即可解出參數A、B及C的最佳值,求得之C值即為反應 曲線之峰值。 由圖四可發現,擷取之影像經過失焦—聚焦—失焦這 200933123 二個過程,經由聚焦函數評估對圖四之影像序列進行評估 後了求出聚焦指標曲線如圖五所示,曲線之峰值即為待 測樣品之實際高度值。其中圖五中標記(a)、(b)、與 2)則分別代表圖四(a )〜(d )之聚焦指標值與藉由四點擬 合之方式擬合出之聚焦深度反應曲線圖。由正確的聚焦反 應曲線方可求得正確的待測物深度,利用統計學中標準差 之觀念作為評估聚焦深度反應曲線之依據。 接下來說明應用前述方法之實施裝置’請參閱圖六所 不’該圖係為本發明之共焦顯微形貌量測裝置實施例示意 圖。在本實施例中’該共焦顯微形貌量測裝置3包括有一 光源調制部30、一分光部31、一聚焦位置調整部32、一 影像擷取部33以及一處理與控制單元34。該光源調制部 3〇 ’其係與該處理與控制單元34電性連接,該光源調制 部30可投射一調制光源91於一待測物9〇上。在本實施 例中’該光源調制部30更具有一光源體300、一光陣列 反射單元301以及一透鏡組302。該光源體300可投射出 一擴散光源至該光陣列反射單元301上。該光陣列反射單 元301 ’其係可將該光源體3〇〇所投射之光源反射以形成 一反射光源。在本實施例中,該光陣列反射單元301係可 選擇為微型反射鏡元件(digital micro-mirror device, DMD)或者是石夕基液晶元件(HqUid crystal on silicon, LCOS)等之數位調變元件。藉由前述之元件可以對該光源 體300所投射之光源進行調變以形成如圖二A或者是圖二 B之棋盤式或弦波式的圖案。 此外’如圖七A所示,該圖係為本發明之光源調制部 12 200933123 另一實施例示意圖。在本實施例中係將圖六之光陣列反射 單元301以光柵結構303取代,使該光源體所投射之光源 穿透該光柵結構303以形成一結構光源,再經過透鏡組 3 0 2調制該結構光源以形成該調制光源。藉由圖七之杏施 例,同樣也可以產生如圖二A或圖二B之祺盤式或弦波式 的圖案。除了前述之兩種不論是反射式或者是穿透式之方 式來形成調制光源,對於表面結構特徵(如:故路或粗糖 ❹度)比較明顯的待測物,也可以不使用該光栅結構3〇3以 及光陣列反射單元301,而是如圖七β所示,直接將光源 體300所發出光源穿透該透鏡組3〇2以形成該調制光源而 經由顯微物鏡投射至待測物上。 該透鏡組302 ’其係可調制該反射光源以形成一調制 光源。在本實施例中’該透鏡組302係由複數個凸透鏡 3020與3023以及偏極元件3〇21與3〇22所構成。其 鏡3020為一平凸透鏡而透鏡3023則為-雙凸透鏡。該偏 〇極兀件3021與3022則為線性偏極元件。當光經由平凸透 鏡3020使投影之擴散角度縮小,然後經過線偏極片蘭 …線偏極·調整光強使得產生之影像有良好之對比與 強度,最後藉由該雙凸读#训0 Μ (η ^ ^ 23則使光之準直形成調制 亡ί :外在存測物9 0與該透鏡·组3 ° 2之間更具有 二35 ’其係可導引該調制光源進人—顯微物鏡 =待測物9〇上。在本實施例中,該分光單元 ,、為”光鏡。该待剛物9〇則設置於可進行多維度運 -之^载平台37上’該承载平台37係與該處理與控制 早疋’·性連接。該承裁平台37可接收該處理與控制單 200933123 元34之控制訊號而進行多維度之位置調整運動。 由該待測物90反射光的部分稱之為測物光,經過顯 微物鏡36後又回到分光單元35,此時測物光92帶有待 .測物90之聚焦資訊,測物光92經過縮束元件补改變其 光束之大小,之後入射至分光部31進行分光之步驟。前 述之縮束元件38係可為一透鏡。該分光部31,其係可將 由該待測物反射之測物光分光以形成複數個光群組93與 ❹ 94,每一個光群組具有複數道子測物光。如圖八A所示: 該圖係為本發明之分光部分光示意圖。在本實施例中該 分光部31更具有一分光模組310以及一分光元件311。 該分光模組310 ’其係可將該待測物之反射光分光形成複 數道子測物光。該分光元件311,其係可將該複數道子測 物光为成相互正父之光群組93與94。該分光模組31 〇與 該分光元件311間更具有一偏極元件312 ,其係為一線性 偏極片。而該分光模組310則具有一第一分光單元31〇〇 q 以及一第一分光單元3111。該第一分光單元313,具有一 偏極分光鏡3130與直角反射鏡3131,其係可將該測物光 分成兩道偏極性皆轉變成45度之子測物光95與96。該 弟一分光單元314 ’其係同樣具有偏極分光鏡3140與直 角反射鏡3141可將由該第一分光單元313所分出之兩道 子測物95與96光再分成四道子測物光970〜974。最後再 藉由線性偏極片312使得四束光之偏極性轉變成45度之 子測物光。該第一分光單元313之偏極分光鏡3130與直 角反射鏡3131垂直對齊放置,而該第二分光單元314之 偏極分光鏡3140與直角反射鏡3141水平對齊放置。 200933123 "該分光元件可將前述之四道具有偏極性之子測物 光,分光成兩個相互正交之光群组93與94,每一個 ❹ ❹ 組具有四道子測物光。被分光後之兩個光群組的 入該聚焦位置調整部32。該聚焦位置調㈣⑽更^ 個折射元件320與321,其係分別與該光群組93盘、9^ 對應。該聚焦位置調整部32中之折射元件32〇盘、奶相 其係可分職制該複數個光群組之複數道子測物 焦位置。如所*,叫射元件32G為例,其係 複數個具有不同厚度之折射區域3232Q3以分別對 戶:屬光群組93與94中之每—個子測物光施; 中,母一個折射元件320與321纟有複數個與該光料中 之子測物光相對應之折射區域32〇〇〜32〇3,且每減 區域麵〜3203之厚度並不相同。例如以光群組 ^ 因^該光群組93具有四道子測物光,所以該折射元=挪 則设計成具有四個折射區域32〇〇〜32〇3,每一個 與每一道子測物光相對應。葬敕 ' 之厚度使得每-道子測物厶聚二產L二與: 透:=該透明材料係可選擇為破= 刀于材#,但不以此為限。此外,拼 人 目與其所對應之厚度射根據需要而娜。區域數 再回到圖六所示,該影像縣部33,i係 每—個光群組93與94以形成複數個影像每二個::擷: 有複數個分別對應該複數彳個衫像更具 施例中,該子影像。在本實 盥94相斟雍夕旦^4 係具有個分別與該光群组93 與94相對應之影像擷取單元咖與331以録光^= 15 200933123 影像。該影像擷取單元330與331可選擇為電耦合元件 (charge couple device, CCD)或者是互補式金屬氧化半 導體(Complementary Metal-〇χ i de-Sem i conductor, CMOS)。由於每一個光群組具有四道偏折測物光,且每一 道偏折測物光之聚焦位置並不相同,因此該二影像擷取單 元所擷取的影像具有四個子影像,每一個子影像對應每一 道之偏折測物光。藉由線性偏極片315與線性偏極片312 之調控使2x2之影像之光強度相同,四束光之垂直間距可 由偏極分光鏡3130直角反射鏡3131之移動錯位進行調 整與控制。而四束光之水平間距可由偏極分光鏡314〇直 角反射鏡3141之移動錯位進行調整,藉由不同厚度之折 射元件320與321之調控’使得測物光之聚焦位置產生改 變,讓影像感測單元3難331同時取得不同平面之影像。 =理與控制單元34’其係與承载待測物之承載平 ί光源調制部3G以及該影仙取部抑電性連接。 ^之# =早元34可接收該複數個影像轉析出該待 所示之、、^r可徵。至於騎該待職形貌特徵可利用圖三 擷取CHS析出待測物之表面特徵,藉由兩個影像 待測樣使影賴取單元咖與331各自量測 摩形貌,像,藉此重建出待測樣品之三維輪 具結果如圖九所示。 請參閱圖十與圖十一所示’盆 焦顯微,、圖十係為本發明之共 圖十:置另一實施例示意圖、圖十-係為 本上的元件光部ί光示意圖。在本實施例中基 ”1、所示之實施例相同,差異的是主要是 16 200933123 在於分光部之設計。當測物光92經過遮罩39(Field Aperture)改變其光束之大小之後,會入射至分光部31 ,進行分光之程序。藉由線性偏極片318使光之偏極性轉 - 變成45度之線偏極光,經過第一分光單元316。該第一 分光單元具有一對偏極分光鏡3160與3161以及一直角 反射鏡3162。通過該第一分光單元316之後,測物光由 一束分成兩束,藉由線性偏極片315使兩束光之偏極性 Ο 皆轉變成45度之線偏極光。 _ 通過該線性偏極片315之偏極光接著經過第二分光單 元317’其係同樣具有一對偏極分光鏡與gin以及 一直角反射鏡3172後。該偏極分光鏡317〇、偏極分光 鏡3171與直角反射鏡3172使兩束光分成四束光,再經 由線性偏極片312使得四束光之偏極性轉變成45度之 線偏極光。並藉由分光元件311將光束分到影像感測單 元330與331。由於測物光經過分光部31後,因第一分 © 光單兀316與第二分光單元317中之偏極分光鏡3160、 316卜3170與3171與直角反射鏡3162與3172之位置落 差,使得各光束所經過之光程有所差異,因而光源之聚 焦位置皆不相同,所以影像感測單元330與331可同時 取得不同t焦位置之影像。為了使兩個影像感測單元 與。。331能各自量測到不同兩個聚焦變化深度,於影像感 測單TO330與331之光路中放入不同厚度之折射元件32〇 與321 ’藉由調整折射元件320與321之厚度使得測物光 之聚焦位置產生改變(如圖八B所示),讓影像感測單元 330與331同時取得不同兩個聚焦變化深度之影像,量測 200933123 出不同位置之形貌資訊,藉此即時重建出待測物之三維 形貌。 在圖十與圖Η—中之偏極分光鏡3160與3161以及 直角反射鏡3162水平對齊放置;而偏極分光鏡317〇與 3171以及直角反射鏡3172垂直對齊放置,使得測物光輸 出之影像為2x2之分佈。藉由線性偏極片318、315與312 之調控測物光之偏極性,使2x2之影像之光強度相同,四 ❹ 束光之水平間距可由直角反射鏡3162之移動錯位進行調 整與控制。而四束光之垂直間距可由直角反射鏡3172之 移動錯位進行調整,藉由不同厚度之320與321之調控, ,知測物光之聚焦位置產生改變,讓影像感測單元330與 ρ像感;則單元331同時取得兩個不同聚焦變化深度之影 像0 〇 制^上所述者,僅為本發明之實施例,當不能以之限 變化」範圍。即大凡依本發明申請專利範圍所做之均等 明之$飾,仍將不失本發明之要義所在,亦不脫離本發 月狎和範圍,故都應視為本發明的進一步實施狀況。 與襄=上述’本發明提供之—種共焦顯微形貌量測方法 量測工章可以精確且快速完成全域式三維輪腐量測以符合 產業之in’進而提高該產業之競爭力以及帶動週遭 備之要減已符合發明專利法所規定申請發明所需具 委員允撥發明專利之申請,謹·貴審查 辩時間惠予審視,並賜准專利為禱。 18 200933123 【圈式簡單說明】 圖一 A所示,該圖係為本發明之共焦顯微形貌量測方法實 施例流程示意圖。 圖一 B係為待測物示意圖。 圖二A與圖二B係為本發明之調制光源圖紋示意圖。 圖三係為本發明之重建形貌特徵實施例流程示意圖。 圖四之(a)〜(d)係分別為不同聚焦位置之結構光條紋影像 ❹ 示意圖。 圖五係為根據圖四所擬和出之聚焦反應曲線示意圖。 圖六係為本發明之共焦顯微形貌量測裝置實施例示意圖。 圖七A係為本發明之光源調制部另一實施例示意圖。 圖七B係為本發明之光源調制部又一實施例示意圖。 圖八A係為本發明之分光部分光示意圖。 圖八B係為本發明之折射元件示意圖。 q 圖九係為三維輪廓形貌解析結果示意圖。 圖十係為本發明之共焦顯微形貌量測裝置另一實施例示意 圖。 圖十一係為圖十之實施例中之分光部分光示意圖。 【主要元件符號說明】 2- 共焦顯微形貌量測方法 20〜23-步驟 3- 共焦顯微形貌量測裝置 19 200933123 30-光源調制部 300- 光源體 301- 光陣列反射單元 302- 透鏡組 3020、 3023-凸透鏡 3021、 3022-偏極元件 3 0 3 _光桃結構 〇 3卜分光部 310- 分光模組 311- 分光元件 312- 偏極元件 313- 第一分光單元 3130- 偏極分光鏡 3131- 直角反射鏡 U 314-第二分光單元 3140- 偏極分光鏡 3141- 直角反射鏡 315- 線性偏極片 316- 第一分光單元 3160-偏極分光鏡 3161_偏極分光鏡 3162-直角反射鏡 317- 第二分光單元 20 200933123 3170_偏極分光鏡 3171_偏極分光鏡 3172-直角反射鏡 318 _偏極分光鏡 32-聚焦位置調整部 320、321-折射元件 3200〜3203-折射區域 © 33-影像擷取部 330、331-影像擷取單元 34- 處理與控制單元 35- 分光單元 36- 顯微物鏡 37- 承載平台 38- 縮束元件 q 39-遮罩 90-待測物 901〜903-表面 9卜調制光源 92-測物光 93、94-光群組 9 5、9 6 -子測物光 21From dE ~dC 0, three equations can be obtained. The simultaneous solution can solve the optimal values of parameters A, B and C, and the C value is the peak value of the reaction curve. It can be found from Fig. 4 that the captured image is subjected to defocusing-focusing-defocusing in 200933123. After evaluating the image sequence of Fig. 4 through the focus function evaluation, the focus index curve is obtained as shown in Fig. 5. The peak value is the actual height value of the sample to be tested. The markers (a), (b), and 2) in Figure 5 represent the focus index values of Figures 4(a) to (d), respectively, and the depth-of-focus response curves fitted by four-point fitting. . From the correct focus response curve, the correct depth of the object to be tested can be obtained, and the concept of standard deviation in statistics is used as the basis for evaluating the depth response curve. Next, an embodiment of a confocal microtopography measuring apparatus according to the present invention will be described with reference to the embodiment of the present invention. In the present embodiment, the confocal microscopic topography measuring device 3 includes a light source modulating portion 30, a light splitting portion 31, a focus position adjusting portion 32, an image capturing portion 33, and a processing and control unit 34. The light source modulating unit 3 ′′ is electrically connected to the processing and control unit 34 , and the light source modulating unit 30 can project a modulated light source 91 on a sample to be tested 9 . In the present embodiment, the light source modulating portion 30 further has a light source body 300, a light array reflecting unit 301, and a lens group 302. The light source body 300 can project a diffused light source onto the light array reflecting unit 301. The light array reflecting unit 301' reflects the light source projected by the light source body 3' to form a reflecting light source. In this embodiment, the light array reflecting unit 301 can be selected as a digital micro-mirror device (DMD) or a digital modulation component such as a HQUid crystal on silicon (LCOS). . The light source projected by the light source body 300 can be modulated by the aforementioned elements to form a checkerboard or sinusoidal pattern as shown in Fig. 2A or Fig. 2B. Further, as shown in Fig. 7A, the figure is a schematic diagram of another embodiment of the light source modulation section 12 200933123 of the present invention. In this embodiment, the light array reflecting unit 301 of FIG. 6 is replaced by a grating structure 303, such that the light source projected by the light source body penetrates the grating structure 303 to form a structured light source, and then modulated by the lens group 306. A light source is structured to form the modulated light source. By the example of the apricot of Fig. 7, it is also possible to produce a pattern of a disk or a chord type as shown in Fig. 2A or Fig. 2B. In addition to the foregoing two methods, whether reflective or transmissive, to form a modulated light source, the grating structure may not be used for a relatively obvious object to be tested on a surface structural feature (such as a road or a raw sugar twist). 〇3 and the light array reflecting unit 301, but as shown in FIG. 7β, the light source emitted from the light source body 300 is directly penetrated through the lens group 3〇2 to form the modulated light source and projected onto the object to be tested through the microscope objective. . The lens group 302' modulates the reflected light source to form a modulated light source. In the present embodiment, the lens group 302 is composed of a plurality of convex lenses 3020 and 3023 and polarizing elements 3〇21 and 3〇22. The mirror 3020 is a plano-convex lens and the lens 3023 is a lenticular lens. The biasing elements 3021 and 3022 are linear biasing elements. When the light is reduced by the plano-convex lens 3020, the diffusion angle of the projection is reduced, and then the line is polarized. The line is polarized and the light intensity is adjusted so that the generated image has good contrast and intensity. Finally, the lenticular reading is 0. (η ^ ^ 23 makes the collimation of the light to form a modulation ί: the external stored object 90 and the lens group 3 ° 2 have two more than 35 ', which can guide the modulation source into the human-display The micro objective lens is on the object to be tested. In the embodiment, the light splitting unit is a "light mirror. The material to be rigid 9 is disposed on the platform 37 which can be multi-dimensionally transported." The platform 37 is connected to the processing and control. The contracting platform 37 can receive the control signal of the processing and control sheet 200933123 and perform a multi-dimensional position adjustment motion. The light is reflected by the object to be tested 90. The part is called the object light, and passes through the microscope objective 36 and then returns to the beam splitting unit 35. At this time, the object light 92 carries the focus information of the object to be measured 90, and the object light 92 is changed by the contraction component to change its beam. The size is then incident on the spectroscopic portion 31 to perform spectroscopic steps. The aforementioned contraction element 38 is The light splitting portion 31 is configured to split the light of the object reflected by the object to be detected to form a plurality of light groups 93 and ❹ 94, each light group having a plurality of track object light. 8A is a schematic view of the light splitting portion of the present invention. In the embodiment, the light splitting portion 31 further has a light splitting module 310 and a light splitting element 311. The light splitting module 310' The reflected light of the object to be tested is split to form a plurality of tracked object light, and the light splitting element 311 is configured to light the plurality of tracked objects into mutually positive light groups 93 and 94. The beam splitting module 31 is There is further a polarizing element 312 between the beam splitting elements 311, which is a linear polarizing plate, and the beam splitting module 310 has a first beam splitting unit 31〇〇q and a first beam splitting unit 3111. The first splitting light The unit 313 has a polarization beam splitter 3130 and a right angle mirror 3131, which can split the object light into two sub-objects light 95 and 96 whose polarities are converted into 45 degrees. The dipole-light splitting unit 314' The system also has a polarizing beam splitter 3140 and a right angle mirror 3141 which can be The two sub-objects 95 and 96 separated by a splitting unit 313 are subdivided into four sub-objects 970 to 974. Finally, the polarities of the four beams are converted into sub-measures of 45 degrees by the linear polarizer 312. The polarizing beam splitter 3130 of the first beam splitting unit 313 is vertically aligned with the right angle mirror 3131, and the polarizing beam splitter 3140 of the second beam splitting unit 314 is horizontally aligned with the right angle mirror 3141. 200933123 " The component can split the aforementioned four sub-tested object light into two mutually orthogonal light groups 93 and 94, each of which has four sub-test light. The two light groups after being split are entered into the focus position adjusting portion 32. The focus position adjusts (4) (10) and further refracting elements 320 and 321 which respectively correspond to the light group 93, 9^. The refracting element 32 in the focus position adjusting portion 32 can divide the plurality of track measurement object focal positions of the plurality of light groups. For example, the ejector element 32G is exemplified by a plurality of refracting regions 3232Q3 having different thicknesses for respectively: each of the light groups 93 and 94 is light-measured; 320 and 321 纟 have a plurality of refracting regions 32 〇〇 32 32 〇 3 corresponding to the sub-object light in the light material, and the thickness of each subtracting region ~ 3 203 is not the same. For example, the light group ^ has a four-subject object light, so the refracting element = is designed to have four refraction areas 32 〇〇 32 32 〇 3, each and each sub-test The object light corresponds. The thickness of the funeral 使得 ' 测 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 = = = = = = = = = = = = = = = = = = = = = = = = In addition, the spelling and the corresponding thickness of the shot are based on the needs. The number of regions is returned to Figure 6, where the image county 33, i is each of the light groups 93 and 94 to form a plurality of images every two:: 撷: there are a plurality of pairs corresponding to a plurality of shirts More in this example, the sub-image. In the embodiment of the present invention, the image capturing unit and the image are respectively associated with the light groups 93 and 94 to record light. The image capturing units 330 and 331 may be selected as a charge couple device (CCD) or a complementary metal-oxide-semiconductor (CMOS). Since each light group has four deflected object light, and the focus position of each of the deflected object lights is not the same, the image captured by the two image capturing unit has four sub-images, each of which has four sub-images. The image corresponds to the deflected object light of each track. By adjusting the linear polarizer 315 and the linear polarizer 312, the light intensity of the 2x2 image is the same, and the vertical pitch of the four beams can be adjusted and controlled by the shift misalignment of the polarizer 3131 right angle mirror 3131. The horizontal spacing of the four beams can be adjusted by the displacement misalignment of the polarizing beam splitter 314 and the right angle mirror 3141. The adjustment of the refractive elements 320 and 321 of different thickness causes the focus position of the measuring object to change, giving the image sense. The measuring unit 3 is difficult to obtain images of different planes at the same time. The control unit 34' is electrically connected to the carrier light source modulating portion 3G carrying the object to be tested and the shadow portion. ^##早元34 can receive the plurality of images and analyze the ones to be displayed. As for the appearance of the waiting feature, the surface features of the object to be tested can be extracted by using the CHS in FIG. 3, and the two images to be tested are used to measure the appearance of the image and the image. The result of reconstructing the three-dimensional wheel of the sample to be tested is shown in Figure 9. Please refer to Fig. 10 and Fig. 11 for the 'potential microscopy', and Fig. 10 is the same as the invention. Fig. 10 is a schematic view showing another embodiment, and Fig. 10 is a schematic diagram of the light portion of the element. In the present embodiment, the base "1" is the same as the embodiment shown, and the difference is mainly that 16 200933123 lies in the design of the spectroscopic portion. When the object light 92 changes its beam size through the mask 39 (Field Aperture), The program for splitting is performed by the spectroscopic unit 31. The linear polarizer 318 converts the polarity of the light into a line of 45 degrees, and passes through the first beam splitting unit 316. The first beam splitting unit has a pair of polarized poles. The beam splitters 3160 and 3161 and the right-angle mirror 3162. After passing through the first beam splitting unit 316, the object light is split into two by a beam, and the polarization of the two beams is converted into 45 by the linear polarizer 315. The line is polarized. The polarized light passing through the linear polarizer 315 then passes through the second beam splitting unit 317', which also has a pair of polarizing beamsplitters and gin and a right-angle mirror 3172. The polarizing beam splitter The 317 〇, the polarizing beam splitter 3171 and the right angle mirror 3172 divide the two beams into four beams, and then convert the polarity of the four beams into 45-degree linear polarized light via the linear polarizer 312. And by using the beam splitting element 311 splits the beam into the image The units 330 and 331. Since the object light passes through the beam splitting portion 31, the polarizing beamsplitters 3160, 316, 3170 and 3171 and the right angle mirrors 3162 and 3172 in the first and second beam splitting units 317 The position difference is such that the optical paths of the light beams are different, and thus the focus positions of the light sources are different, so the image sensing units 330 and 331 can simultaneously acquire images of different t focal positions. In order to sense the two images. The units 331 can measure different depths of focus change respectively, and the refractive elements 32 321 321 321 of different thicknesses are placed in the optical paths of the image sensing sheets TO 330 and 331 ' by adjusting the thickness of the refractive elements 320 and 321 The focus position of the measuring light is changed (as shown in FIG. 8B), and the image sensing units 330 and 331 simultaneously obtain images of different depths of focus change, and measure the shape information of different positions in 200933123, thereby The three-dimensional shape of the object to be tested is reconstructed in real time. The polarized beamsplitters 3160 and 3161 and the right-angle mirror 3162 are horizontally aligned in Fig. 10 and Fig. ;; and the polarized beamsplitters 317〇 and 3171 and the right angle are placed at right angles. The mirrors 3172 are vertically aligned so that the image of the light output of the object is 2x2. The polarization of the object is controlled by the polarization of the linear polarizers 318, 315 and 312, so that the light intensity of the 2x2 image is the same. The horizontal spacing of the beam light can be adjusted and controlled by the movement misalignment of the right angle mirror 3162. The vertical spacing of the four beams can be adjusted by the displacement of the right angle mirror 3172, and the measurement is performed by 320 and 321 of different thicknesses. The focus position of the object light is changed to make the image sensing unit 330 and the image image sense; then the unit 331 simultaneously obtains two images of different depths of focus change, which is only an embodiment of the present invention. Can't change by scope. It is to be understood that the scope of the present invention is not limited to the scope of the present invention, and is not to be construed as a further embodiment of the present invention. And the above-mentioned 'the confocal micro-morphology measurement method measurement tool provided by the present invention can accurately and quickly complete the global three-dimensional round rotting measurement to meet the industry's in order to improve the competitiveness of the industry and drive the surrounding It is necessary to reduce the application for the invention of the invention patents required by the invention patent law, and it is necessary to examine the time of the examination and grant the patent as a prayer. 18 200933123 [Simple description of the circle] As shown in Figure 1A, this figure is a schematic flow chart of the embodiment of the confocal micromorphology measurement method of the present invention. Figure 1 B is a schematic diagram of the object to be tested. 2A and 2B are schematic diagrams of the modulation light source of the present invention. FIG. 3 is a schematic flow chart of an embodiment of a reconstructed topography feature of the present invention. Figure 4 (a) ~ (d) are schematic diagrams of structured light stripe images 不同 at different focus positions. Figure 5 is a schematic diagram of the focused reaction curve according to Figure 4. Figure 6 is a schematic view showing an embodiment of the confocal micromorphology measuring device of the present invention. Fig. 7A is a schematic view showing another embodiment of the light source modulation unit of the present invention. Fig. 7B is a schematic view showing still another embodiment of the light source modulation unit of the present invention. Figure 8A is a schematic view of the light splitting portion of the present invention. Figure 8B is a schematic view of a refractive element of the present invention. q Figure 9 is a schematic diagram of the results of 3D contour topography analysis. Figure 10 is a schematic view of another embodiment of the confocal microtopography measuring apparatus of the present invention. Figure 11 is a schematic view showing the light splitting portion of the embodiment of Figure 10. [Explanation of main component symbols] 2-Confocal micromorphology measurement method 20 to 23 - Step 3 - Confocal micromorphology measuring device 19 200933123 30-Light source modulation section 300 - Light source body 301 - Light array reflection unit 302 - Lens group 3020, 3023-convex lens 3021, 3022-polarization element 3 0 3 _ light peach structure 〇 3 division light section 310 - beam splitting module 311 - light splitting element 312 - polarized element 313 - first light splitting unit 3130 - polarized beam splitter 3131- Right angle mirror U 314-Second beam splitter 3140- Polarizing beam splitter 3141 - Right angle mirror 315 - Linear pole piece 316 - First beam splitting unit 3160 - Polarizing beam splitter 3161_ Polarizing beam splitter 3162 - Right angle Mirror 317 - second beam splitting unit 20 200933123 3170_ polarized beam splitter 3171_ polarized beam splitter 3172 - right angle mirror 318 _ polarized beam splitter 32 - focus position adjusting portion 320, 321 - refractive element 3200 ~ 3203 - refraction Area © 33 - Image capturing unit 330, 331 - Image capturing unit 34 - Processing and control unit 35 - Beam splitting unit 36 - Microscope objective 37 - Bearing platform 38 - Shrinking element q 39 - Mask 90 - Object to be tested 901~903-surface 9 modulation light source 92-test light 93, 94-light group 9 5, 9 6 - sub-object light 21
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Cited By (3)
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TWI452256B (en) * | 2011-03-14 | 2014-09-11 | Omron Tateisi Electronics Co | Confocal measuring device |
US9041940B2 (en) | 2012-02-03 | 2015-05-26 | Takaoka Toko Co., Ltd. | Three-dimensional shape measuring apparatus |
TWI798723B (en) * | 2021-05-13 | 2023-04-11 | 財團法人工業技術研究院 | Depth measurement apparatus and method |
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TWI583919B (en) * | 2015-12-03 | 2017-05-21 | 財團法人金屬工業研究發展中心 | Non-contact 3d scanning system and method thereof |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI452256B (en) * | 2011-03-14 | 2014-09-11 | Omron Tateisi Electronics Co | Confocal measuring device |
US9041940B2 (en) | 2012-02-03 | 2015-05-26 | Takaoka Toko Co., Ltd. | Three-dimensional shape measuring apparatus |
TWI507659B (en) * | 2012-02-03 | 2015-11-11 | Takaoka Toko Co Ltd | Three-dimensional shape measuring apparatus |
TWI798723B (en) * | 2021-05-13 | 2023-04-11 | 財團法人工業技術研究院 | Depth measurement apparatus and method |
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