200909599 九、發明說明： 【發明所屬之技術領域】 ·- 本發明涉及一種固持裝置，尤其涉及一種於濺鍍過程 中對基材進行固持之固持裝置。 【先前技術】 濺鍍係利用等離子體產生之離子去撞擊陰極靶材，將 靶材内之原子撞出而沈積於基材表面上堆積成鍍膜。由於 濺鍍可同時達成較佳之沈積效率、精確之成份控制、以及 較低之製造成本，故於工業上被廣泛應用。濺鍍之研究可 參閱T Ushiki等人於1998年IEEE系統、國際可靠性物理 會議（Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International)上發表之論文 Reduction of Plasma-Induced Gate Oxide Damage Using Low-Energy Large-Mass Ion Bombardment in Gate-Metal Sputtering Deposition。 如圖1所示，對基材10進行濺鍍時，通常需要採用一 固持裝置1對該基材10進行固持。現有之固持裝置1通常 包括一個套環12及複數螺栓13，藉由於基板11及套環12 上分別開設複數與該螺栓13相配合之螺孔（未標示），並利 用該螺栓13穿過該螺孔以連接該套環12及該基板11、可 使該套環12施加一壓力於該基材10之濺鍍表面10a，從而 達到將該基材10固定於該基板11之目的。惟，利用該套 環12固定該基材10時，由於套環12從該基材10之濺鍍 表面10a上施加一壓力，故該套環12該基材10之濺鍍表 5 200909599 互抵觸，這將導致該基材10之濺鑛表面i〇a ;灯又、恰，其邊緣部分100a由於被該套環12遮蓋而 未能被濺鍍到，從而景彡變？||兮且 遮盖 攸而办響到該基材10之整體濺鍍效果。 有鑒於此，提供—種可使基材之賤 鍍效果之固持裝置實為必要。 筏仟叙佺濺 【發明内容】 下面將以實施例說明一種基材固持裝置 之濺鍍表面獲得較佳之濺鍍效果。 /、便丞材 :種基㈣持裝置，詩在_過程中對基材進行固 、’該基材具有—_表面及―與該㈣表面相鄰之側 材固：裝置包括-個用於承載該基材之基板;複 =早兀，其環繞該基材分佈於基板上，以分別從該基 該基材；複數固持單元，其分別連接於該 土板及該複數夹持早元，以將該複數夾持單元㈣於基板 上0 π相對於先前技術，該基材固持裝置藉由設置複數夹持 早=以分別從該基材之側面抵持住該基村，從而可於賤鐘 過程中對該基材㈣持作用，並可避免基材之濺鑛表面於 滅鍍時被遮蓋住，進而可使該基材獲得較佳之靖效果。 【實施方式】 下面將結合圖式對本發明實施例作進一步之詳細說 明。 請參閱圖2,本發明第一實施例提供之一種基材固持装 置20，其用於在濺鍍過程中對基材2〇〇進行固持。該基材 200909599 200具有一濺鍍表面200a及至少一與該濺鍍表面200a相鄰 之側面200b。該基材固持裝置20包括一個基板21、複數 夾持單元22及複數固持單元23。 該基板21用於承載該基材200，其上表面21a上設置 有複數基準孔，如螺紋通孔210，優選地，該基材200可為 一圓柱形結構，其侧面200b為該圓柱形結構之外圓周面。 當然，該基材200亦可為其他結構，如長方體結構等。 請一並參閱圖2及圖3，該複數夾持單元22環繞該基 材200分佈於該基板21上，並分別從該基材200之外圓周 面200b抵持住該基材200。具體地，如圖3所示，該夾持 單元22可為一抵片，該抵片22為一個“ L”形結構，其包 括一基部221及一延伸部222，該延伸部222由該基部221 一端延伸出來並垂直於該基部221，且該基部221設置有一 個與該基準孔210相配合之定位孔，如螺紋通孔220。 該固持單元23可為螺栓，且該螺栓包括一個螺柱23a 及一個螺母23b。 本實施例中，該複數抵片22之數目為四個，當然亦可 為兩個、三個或其他大於兩個之數目，且該四個抵片22環 繞該基材200之外圓周面200b均勻分佈於該基板200上， 並進一步分別藉由其延伸部222抵觸住該外圓周面200b。 相對應地，該複數固持單元23之數目亦可為四個，且該四 個固持單元23分別與該基板21之複數基準孔210中之其 中四個、及該四個抵片22之四個定位孔220相配合，以分 別將該四個抵片22固定於該基板21上。 7 200909599 工作時D亥螺栓23之螺柱23a從該抵片22之-側依 =過該抵片22之螺紋通孔22()及該基板21之螺紋通孔 並進—步從該抵片22相對之另—侧旋人該螺栓23之 ^母23b’:而可借由該螺栓23將該抵片22固定於該基板 ，亚達成使該抵片22之延伸部222從該基材扇之外 圓周面200b抿持住_其知_ 9nn > 例中，當該基极2 …。可理解’於本實施 土极之厗度較大時，該基板21上之 2::可設置為螺紋盲孔，相對應地，該固持單元a可設 2螺釘(圖未示)，藉由將該螺釘依次旋入該抵片22之螺 固及該基板21之螺紋通孔210，可將該抵片22 20〇"Vi^板21上’並可同樣達到使該抵片22從該基材 圓周面2〇〇b抵持住該基材2〇〇之目的。 由於鐵氟龍材料具有較佳之彈性，是故優選地， =抵片22與該基板21及該基材細之接觸面 二:層鐵氟龍膜層22a，如圖3所示，該螺栓㈣螺釘緊 猎由該縣龍膜層22a可緩衝該抵片22對該基㈣ 姑^山’同日守’由於鐵氟龍材料還具備較佳之滑動性，是 文精由Z氟龍膜層22a還可减少該複數抵片^該基材 於^ 鳩之間之摩擦，故該鐵氟龍臈層瓜可 定^㈣22對該基材20◦進行抵持時，對該基材200起一 疋之保護作用。 發明第二實施例提供之—種基材固持裝置40，與本 ^於一貫施例提供之基材固持裝置2〇相比，其不同之處 ;L 土板21之上表面2la與該基材2〇〇之濺鍍表面2〇〇a 8 200909599 .大小一致，該固持單元23為螺釘，該基準孔210為開設於 該基板21之側面21b上之螺紋盲孔。 工作時，該螺釘23從該抵片22之一側依次旋入該抵 片22之螺紋通孔220及該基板21之螺紋盲孔210,從而可 將該抵片22固定於該基板21上，並達成使該抵片22之基 部221從該基材200之外圓周面200b抵持住該基材200之 目的。 本發明第一實施例及第二實施例分別提供之基材固持 裝置20、40,其藉由設置複數夾持單元22以分別從該基材 200之侧面200b抵持住該基材200，從而可於濺鍍過程中 對該基材200起固持作用，並可避免該基材200之濺鍍表 面200a於濺鍍時被遮蓋住，進而可使該基材200獲得較佳 之濺鍍效果。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係採用現有之固持裝置對基材進行固持之俯視示 意圖。 圖2係圖1所示之現有之固持裝置之剖面示意圖。 圖3係採用本發明第一實施例提供之基材固持裝置對 基材進行固持時之俯視示意圖。 9 200909599 圖4係圖3所示之基材固持裝置對基材進行固持時之 剖面示意圖。 圖5係本發明第一實施例提供之基材固持裝置之抵片 之結構不意圖。 圖6係採用本發明第二實施例提供之基材固持裝置對 基材進行固持時之俯視不意圖。 圖7係圖6所示之基材固持裝置對基材進行固持時之 剖面示意圖。 【主要元件符號說明】 固持裝置 1 基材 10，200 濺鍍表面 10a ， 200a 边缘部分 100a 基板 11，21 套環 12 螺栓 13 基材固持裝置 20，40 側面 200b，21b 上表面 21a 螺紋通孔 210 ， 220 夾持單元 22 鐵氟龍膜層 22a 基部 221 延伸部 222 10 200909599 固持單元 23 螺柱 23a 螺母 23b 11200909599 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a holding device, and more particularly to a holding device for holding a substrate during a sputtering process. [Prior Art] Sputtering uses ions generated by plasma to strike a cathode target, and atoms in the target are knocked out and deposited on the surface of the substrate to form a coating. Since sputtering can achieve better deposition efficiency, precise composition control, and lower manufacturing cost, it is widely used in the industry. For the study of sputtering, refer to the paper published by T Ushiki et al. in the 1998 IEEE System, International Physics Symposium Proceedings (1998. 36th Annual. 1998 IEEE International). Reduction of Plasma-Induced Gate Oxide Damage Using Low -Energy Large-Mass Ion Bombardment in Gate-Metal Sputtering Deposition. As shown in Fig. 1, when the substrate 10 is sputtered, it is usually necessary to hold the substrate 10 with a holding device 1. The conventional holding device 1 generally includes a collar 12 and a plurality of bolts 13 . The plurality of bolts (not labeled) that cooperate with the bolts 13 are respectively disposed on the substrate 11 and the collar 12 , and the bolts 13 are used to pass through the bolts 13 . The screw hole is connected to the collar 12 and the substrate 11, and the collar 12 can be applied with a pressure on the sputtering surface 10a of the substrate 10 to achieve the purpose of fixing the substrate 10 to the substrate 11. However, when the substrate 10 is fixed by the collar 12, since the collar 12 applies a pressure from the sputtering surface 10a of the substrate 10, the spacer 12 of the substrate 10 is in conflict with the sputtering table 5 200909599. This will result in the splashed surface i〇a of the substrate 10; the lamp is, and the edge portion 100a is not covered by the collar 12 due to the cover 12 being covered, thereby changing the landscape? ||兮 攸 办 办 。 。 。 。 。 。 。 。 。 。 。 该 该 该 该In view of this, it is necessary to provide a holding device that can effect the enamel plating effect of the substrate. SUMMARY OF THE INVENTION The following describes an embodiment of a sputtered surface of a substrate holding device to obtain a better sputtering effect. /, coffin: seed (four) holding device, poetry in the process of the substrate is solid, 'the substrate has - surface and - side of the (four) surface adjacent to the solid: the device includes - for a substrate carrying the substrate; a composite substrate disposed on the substrate to separate the substrate from the substrate; a plurality of holding units respectively connected to the soil plate and the plurality of clamping elements, With respect to the prior art, the substrate holding unit (4) is placed on the substrate with respect to the prior art, and the substrate holding device can be held by the plurality of clamps early to respectively resist the base from the side of the substrate. During the process of the clock, the substrate (4) is acted upon, and the splashed surface of the substrate is prevented from being covered during the deplating, thereby obtaining a better effect of the substrate. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the drawings. Referring to FIG. 2, a first embodiment of the present invention provides a substrate holding device 20 for holding a substrate 2 in a sputtering process. The substrate 200909599 200 has a sputtered surface 200a and at least one side 200b adjacent the sputtered surface 200a. The substrate holding device 20 includes a substrate 21, a plurality of holding units 22, and a plurality of holding units 23. The substrate 21 is used to carry the substrate 200. The upper surface 21a is provided with a plurality of reference holes, such as threaded through holes 210. Preferably, the substrate 200 can be a cylindrical structure, and the side surface 200b is the cylindrical structure. Outside the circumference. Of course, the substrate 200 can also be other structures, such as a rectangular parallelepiped structure. Referring to FIG. 2 and FIG. 3 together, the plurality of clamping units 22 are distributed around the substrate 200 on the substrate 21, and respectively resist the substrate 200 from the outer circumferential surface 200b of the substrate 200. Specifically, as shown in FIG. 3, the clamping unit 22 can be a splicing piece. The splicing piece 22 is an "L"-shaped structure, and includes a base portion 221 and an extending portion 222. The extending portion 222 is formed by the base portion. One end of the 221 extends and is perpendicular to the base 221, and the base 221 is provided with a positioning hole, such as a threaded through hole 220, which cooperates with the reference hole 210. The holding unit 23 can be a bolt, and the bolt includes a stud 23a and a nut 23b. In this embodiment, the number of the plurality of gussets 22 is four, and of course, two, three or other numbers greater than two, and the four gussets 22 surround the outer circumferential surface 200b of the substrate 200. It is evenly distributed on the substrate 200, and further interferes with the outer circumferential surface 200b by its extending portion 222, respectively. Correspondingly, the number of the plurality of holding units 23 may also be four, and four of the plurality of reference holes 210 of the four holding units 23 and the substrate 21 and four of the four resisting pieces 22 The positioning holes 220 are fitted to fix the four abutting pieces 22 to the substrate 21, respectively. 7 200909599 When the stud 23a of the D-Hail bolt 23 is in operation, the threaded through hole 22 () of the abutting piece 22 and the threaded through hole 22 of the base plate 21 are passed from the side of the abutting piece 22 and the threaded through hole of the substrate 21 is advanced from the abutting piece 22 The other side of the screw 23 is the female 23b': the anchor 22 can be fixed to the substrate by the bolt 23, and the extension 222 of the contact 22 is fanned from the substrate. The outer circumferential surface 200b is held _ _ _ 9nn > In the example, when the base 2 .... It can be understood that the 2:: on the substrate 21 can be set as a thread blind hole, and correspondingly, the holding unit a can be provided with 2 screws (not shown). The screw is screwed into the screwing of the abutting piece 22 and the threaded through hole 210 of the substrate 21, and the yoke 22 can be erected and the same can be achieved. The substrate circumferential surface 2〇〇b resists the purpose of the substrate 2〇〇. Since the Teflon material has better elasticity, it is preferable that the contact pad 22 has a fine contact surface with the substrate 21 and the substrate: a layer of the Teflon film layer 22a, as shown in FIG. 3, the bolt (4) The screw is hunt by the county's dragon film layer 22a to cushion the bond piece 22 to the base (four) Gu ^ Shan 'the same day guard' because the Teflon material also has better slidability, is the fines from the Z-fluorone film layer 22a The friction between the substrate and the substrate can be reduced, so that the Teflon layer can be protected against the substrate 20 when the substrate 20 is resisted. effect. The substrate holding device 40 provided by the second embodiment is different from the substrate holding device 2 provided by the conventional embodiment; the upper surface 2la of the L soil plate 21 and the substrate 2〇〇 Sputtering surface 2〇〇a 8 200909599 . The holding unit 23 is a screw having a uniform size. The reference hole 210 is a threaded blind hole formed on the side surface 21b of the substrate 21. During operation, the screw 23 is screwed into the threaded through hole 220 of the abutting piece 22 and the threaded blind hole 210 of the base plate 21 from one side of the abutting piece 22, so that the abutting piece 22 can be fixed on the substrate 21. The purpose of causing the base portion 221 of the contact piece 22 to abut against the base material 200 from the outer circumferential surface 200b of the base material 200 is achieved. The substrate holding device 20, 40 according to the first embodiment and the second embodiment of the present invention respectively provides a plurality of clamping units 22 for respectively abutting the substrate 200 from the side surface 200b of the substrate 200, thereby The substrate 200 can be held in a sputtering process, and the sputtering surface 200a of the substrate 200 can be prevented from being covered during sputtering, thereby enabling the substrate 200 to obtain a better sputtering effect. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the holding of a substrate by a conventional holding device. 2 is a schematic cross-sectional view of a conventional holding device shown in FIG. 1. Fig. 3 is a top plan view showing the substrate holding device according to the first embodiment of the present invention when the substrate is held. 9 200909599 FIG. 4 is a schematic cross-sectional view showing the substrate holding device shown in FIG. 3 when the substrate is held. Fig. 5 is a schematic view showing the structure of a resist of a substrate holding device according to a first embodiment of the present invention. Fig. 6 is a plan view showing the substrate holding device according to the second embodiment of the present invention when the substrate is held. Fig. 7 is a schematic cross-sectional view showing the substrate holding device shown in Fig. 6 when the substrate is held. [Main component symbol description] Holding device 1 Substrate 10, 200 Sputtering surface 10a, 200a Edge portion 100a Substrate 11, 21 Collar 12 Bolt 13 Substrate holding device 20, 40 Side 200b, 21b Upper surface 21a Threaded through hole 210 , 220 clamping unit 22 Teflon film layer 22a base 221 extension 222 10 200909599 holding unit 23 stud 23a nut 23b 11