TW200906959A - Sealing epoxy resin compostion and eletronic component apparatus using the same - Google Patents
Sealing epoxy resin compostion and eletronic component apparatus using the same Download PDFInfo
- Publication number
- TW200906959A TW200906959A TW097117160A TW97117160A TW200906959A TW 200906959 A TW200906959 A TW 200906959A TW 097117160 A TW097117160 A TW 097117160A TW 97117160 A TW97117160 A TW 97117160A TW 200906959 A TW200906959 A TW 200906959A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- epoxy resin
- compound
- carbon atoms
- formula
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007125526 | 2007-05-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200906959A true TW200906959A (en) | 2009-02-16 |
Family
ID=40031728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097117160A TW200906959A (en) | 2007-05-10 | 2008-05-09 | Sealing epoxy resin compostion and eletronic component apparatus using the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5572918B2 (ja) |
TW (1) | TW200906959A (ja) |
WO (1) | WO2008143016A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560250B (en) * | 2010-12-24 | 2016-12-01 | Lg Hausys Ltd | Adhesive resin composition containing amine based accelerator and decorative film comprising the same |
CN111154231A (zh) * | 2019-12-31 | 2020-05-15 | 湖北宏洋电子股份有限公司 | 一种环氧树脂组合物及其制备的挠性覆铜板 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102587422B1 (ko) * | 2018-05-31 | 2023-10-10 | 가부시끼가이샤 레조낙 | 컴파운드 및 성형체 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3396044B2 (ja) * | 1992-10-14 | 2003-04-14 | 日本ユニカー株式会社 | オルガノポリシロキサン−ポリラクトン共重合体 |
JP2862777B2 (ja) * | 1993-11-05 | 1999-03-03 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
JP3334998B2 (ja) * | 1994-03-30 | 2002-10-15 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
JPH08337635A (ja) * | 1995-06-12 | 1996-12-24 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH08337636A (ja) * | 1995-06-12 | 1996-12-24 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
-
2008
- 2008-05-08 WO PCT/JP2008/058570 patent/WO2008143016A1/ja active Application Filing
- 2008-05-08 JP JP2008122396A patent/JP5572918B2/ja active Active
- 2008-05-09 TW TW097117160A patent/TW200906959A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560250B (en) * | 2010-12-24 | 2016-12-01 | Lg Hausys Ltd | Adhesive resin composition containing amine based accelerator and decorative film comprising the same |
CN111154231A (zh) * | 2019-12-31 | 2020-05-15 | 湖北宏洋电子股份有限公司 | 一种环氧树脂组合物及其制备的挠性覆铜板 |
Also Published As
Publication number | Publication date |
---|---|
WO2008143016A1 (ja) | 2008-11-27 |
JP5572918B2 (ja) | 2014-08-20 |
JP2008303385A (ja) | 2008-12-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI355403B (ja) | ||
JP5400267B2 (ja) | 封止用エポキシ樹脂組成物及び電子部品装置 | |
TWI589617B (zh) | 密封用環氧樹脂組成物及電子零件裝置 | |
TWI503368B (zh) | Epoxy resin molding materials and electronic components for packaging | |
US20170037238A1 (en) | Heat-curable epoxy resin composition | |
JP4470887B2 (ja) | 封止用エポキシ樹脂成形材料および電子部品装置 | |
TWI310774B (ja) | ||
TWI793340B (zh) | 半導體封裝用熱固性樹脂組合物和半導體裝置 | |
JP2009102622A (ja) | 封止用エポキシ樹脂組成物及び電子部品装置 | |
JP5750777B2 (ja) | カリックスアレーン誘導体、カリックスアレーン誘導体の製造方法、エポキシ樹脂用硬化剤、エポキシ樹脂組成物及び電子部品装置 | |
JP2013237855A (ja) | 封止用エポキシ樹脂組成物及び電子部品装置 | |
TW200906959A (en) | Sealing epoxy resin compostion and eletronic component apparatus using the same | |
JP4329426B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP4367023B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP2005247890A (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP4367024B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP4366972B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP2008147494A (ja) | 封止用エポキシ樹脂組成物、その製造方法及び電子部品装置 | |
JP4268835B2 (ja) | エポキシ樹脂組成物およびその硬化物 | |
JP4715139B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP2013142136A (ja) | 半導体封止用難燃性液状エポキシ樹脂組成物及び半導体装置 | |
JP2010024266A (ja) | エポキシ樹脂組成物及びこれを用いた電子部品装置 | |
JP2009127036A (ja) | 封止用エポキシ樹脂組成物及びこの組成物で封止した素子を備えた電子部品装置 | |
JP2912468B2 (ja) | 樹脂組成物 | |
JP2003286389A (ja) | 半導体封止用エポキシ樹脂組成物 |