200848265 九、發明說明： 【發明所屬之技術領域】 本發明係關於將基板與在支撐體上設有感光材料層之 長條狀感光性薄片送出至一對壓接滾筒間，藉將前述感光 材料層貼合於前述基板，而製造感光性積層體之感光性積 層體的製造裝置及製造方法。 【先前技術】 如液晶面板用基板、印刷電路板用基板、PD P用基板， 係將具有感光性樹脂層（感光材料層）之感光性片體（感 光性薄片）貼合於基板表面而構成。感光性片體如在可撓 性塑膠支撐體上依序積層感光性樹脂層與保護膜。 使用於此種感光性片體之貼合的製造裝置，通常係採用 使玻璃基板及樹脂基板等基板各以指定之間隔離開，而輸 送至層壓滾筒間，並且將剝離有對應於前述基板上所貼合 之感光性樹脂層的範圍之保護膜的感光性片體輸送至前述 層壓滾筒間之方式。 如揭示於專利第3 3 1 609 3號公報之製造裝置，如第9圖 所示，係從輥1陸續送出感光性片體2，而供給至半厚度 切割裝置3，以指定之間隔切斷積層於構成感光性片體2 之支撐體上的保護膜及感光性樹脂層。其次，供給前述感 光性片體2至保護膜除去部4，使用黏合膠帶等剝離對應 於基板5之貼合範圍的保護膜後，供給至熱壓接滾筒6a、 6b間。另外，在熱壓接滾筒6a、6b間輸入加熱後之基板5， 經由藉剝離保護膜而露出之感光性樹脂層，將感光性片體 2加熱壓接於基板5之下面部。加熱壓接有感光性片體2 200848265 之基板5從熱壓接滾筒6a、6b輸出後，供給至分廟 藉切斷基板5間之感光性片體2而製造感光性積只 再者，感光性片體2係在可撓性支撐體上積層 脂層及保護膜而形成者，因爲在賦予張力之狀態_ 所以在感光性片體2中發生延展。特別是熱壓接$ * 6b因爲將感光性片體2加熱而貼合於基板5，所 接滾筒6a、6b之附近的延展大。因此，需要調整 感光性片體2之位置，將剝離有保護膜的感光性 ί 確地疋位而貼合於基板5之指定範圍。 此外，製造出之感光性積層體需要檢查是否在 指定位置貼合有感光性片體2。此時如第1 0圖所 定基板5之前後側端部與感光性片體2之側端 L 1 f、L lb，並且測定基板5之前端部及後端部與 光性片體2之半厚度切割部Hf、Hb的距離L2f、 判定此等距離Llf、Lib及L2f、L2b是否在容許 進行感光性積層體之品質保證。 ί 但是’先前之檢查方法，因爲係藉人工計測感 2對基板5之貼合位置，所以，不但計測時花費許 還可能造成計測錯誤，有效率且確實檢查製造出 光性積層體極爲困難。 【發明內容】 本發明之目的爲提供一種可有效率且高度精 貼合於基板之感光材料層的位置，進行製造出之 層體的品ί質保證之感光性積層體的製造裝置及製 本發明之感光性積層體之製造裝置，係送出在 I裝置7， ，體。 感光性樹 下輸送， 衰筒6a、 以在熱壓 基板5對 樹脂層正 基板5之 示，係測 部的距離 形成於感 L2b，藉 範圍內， 光性片體 多時間， 之全部感 確地計測 感光性積 造方法。 支撐體上 200848265 依序積層感光材料層與保護膜而構成之長條狀感光性薄 片，將對應於前述保護膜之剝離部分與殘留部分的交界位 置之加工部位，形成於從前述保護膜至前述感光材料層的 部分，剝離前述保護膜之前述剝離部分後，將前述長條狀 感光性薄片與被以指定之間隔供給的基板一起，對被加熱 ^ 之一對壓接滾筒間連續地送出，在前述基板間配置前述保 護膜之前述殘留部分，並且將露出之前述感光材料層貼合 於前述基板上，其次，從前述保護膜剝離前述支撐體，而 ( 製造感光性積層體，其特徵爲具備： 端部檢測部，其係檢測構成前述感光性積層體之前述基 板的基板端部，或是貼合於前述基板之前述感光材料層的 感光材料層端部； 攝影部，其係按照藉前述端部檢測部檢測前述基板端部 或前述感光材料層端部的時間點，攝影包含前述基板端部 及前述感光材料層端部之圖像；及 貼合位置算出部，其係處理藉前述攝影部所攝影之前述 1/ 圖像，算出前述感光材料層對前述基板之貼合位置。 此外’本發明之感光性積層體之製造方法，係送出在支 撐體上依序積層感光材料層與保護膜而構成之長條狀感光 性薄片，將對應於前述保護膜之剝離部分與殘留部分的交 界位置之加工部位，形成於從前述保護膜至前述感光材料 層的部分，剝離前述保護膜之前述剝離部分後，將前述長 條狀感光性薄片與被以指定之間隔供給的基板一起，對被 加熱之一對壓接滾筒間連續地送出，在前述基板間配置前 述保護膜之前述殘留部分，並且將露出之前述感光材料層 200848265 貼合於前述基板上，其次，從前述保護膜剝離前述支撐體’ 而製造感光性積層體，其特徵爲具備以下步驟： 檢測構成前述感光性肩層體之前述基板的基板端部’或 是貼合於前述基板之前述感光材料層的感光材料層端部； 按照前述基板端部或前述感光材料層端部之檢測時間 點，攝影包含前述基板端部及前述感光材料層端部之圖 像；及 處理攝影之前述圖像，算出前述感光材料層對前述基板 ( 之貼合位置。 本發明藉檢測基板端部或貼合於基板之感光材料層的 端部，按照其檢測時間點攝影包含基板端部及感光材料層 端部，算出感光材料層對基板之貼合位置，可輕易且正確 地進行製造出之感光性積層體的品質檢查。另外’藉顯示 品質檢查之結果，可預先避免瑕疵品出貨的情況。 從配合附圖之以下適當的實施形態例之說明’應可明瞭 上述之目的、特徵及優點。 ί 【實施方式】 第1圖係本實施形態之感光性積層體的製造裝置20之 槪略構成圖，該製造裝置20以液晶或有機EL用濾色器等 之製程，進行將由指定之寬度尺寸所構成的長條狀感光性 薄片22之感光性樹脂層28 (於後述）熱轉印於玻璃基板 24的作業。 第2圖係使用於製造裝置20之長條狀感光性薄片22的 剖面圖。該長條狀感光性薄片22係積層可撓性基底膜（支 撐體）26、感光性樹脂層（感光材料層）28及保護膜30 200848265 而構成。 如第1圖所示，製造裝置20具備：收容將長條狀感光 性薄片22捲繞成輥狀之感光性薄片輥23，而可從感光性薄 片輥23送出前述長條狀感光性薄片22之薄片送出機構 32 ;形成可在送出之長條狀感光性薄片22的保護膜30及 感光性樹脂層28之寬度方向切斷的2處交界部分之半切部 (加工部位）34a、34b (參照第2圖）的加工機構36 (加 工部）；及使一部分具有非接合部38a之接合標籤38 (參照 ί 第3圖）接合於保護膜30的標籤接合機構40。 在標籤接合機構40之下游設置：用於將長條狀感光性 薄片22從間歇輸送變更成連續輸送之貯存機構42;以指定 之長度間隔從長條狀感光性薄片22剝離保護膜30之剝離 機構44;在將玻璃基板24加熱至指定溫度之狀態下供給至 貼合位置之基板供給機構45;及將藉剝離前述保護膜30 而露出之感光性樹脂層28 —體地貼合於前述玻璃基板24 之貼合機構46。 (在貼合機構46中之貼合位置的上游附近，設置攝影包 含半切部34a、34b之長條狀感光性薄片22圖像的攝影部 47。製造裝置20依據藉攝影部47攝影之半切部34a、34b 的圖像，算出半切部34a、34b對貼合機構46之位置偏差 量，而進行長條狀感光性薄片22之輸送量修正。 在薄片送出機構32之下游附近，設置槪略貼合使用後 之長條狀感光性薄片22的後端與新使用之長條狀感光性 薄片22前端的貼合座49。在貼合座49之下游，爲了控制 因感光性薄片輥23捲曲偏差造成寬度方向之偏差，而設置 -10·200848265 IX. Description of the Invention: [Technical Field] The present invention relates to feeding a substrate and a long photosensitive sheet having a photosensitive material layer on a support to a pair of pressure rollers, by using the photosensitive material A manufacturing apparatus and a manufacturing method of a photosensitive laminated body in which a photosensitive laminated body is produced by laminating a layer on the substrate. [Prior Art] A substrate for a liquid crystal panel, a substrate for a printed circuit board, and a substrate for PD P are formed by bonding a photosensitive sheet (photosensitive sheet) having a photosensitive resin layer (photosensitive material layer) to the surface of the substrate. . The photosensitive sheet is formed by sequentially laminating a photosensitive resin layer and a protective film on a flexible plastic support. In a manufacturing apparatus for bonding such a photosensitive sheet, a substrate such as a glass substrate or a resin substrate is usually separated from each other by a predetermined interval, and is transported between the lamination rolls, and is peeled off corresponding to the substrate. The photosensitive sheet of the protective film in the range of the photosensitive resin layer to which it is bonded is conveyed between the lamination rolls. As shown in Fig. 9, the manufacturing apparatus disclosed in Japanese Patent Publication No. 3 3 609 3, the photosensitive sheet 2 is successively fed from the roll 1 and supplied to the half thickness cutting device 3, and cut at a predetermined interval. A protective film and a photosensitive resin layer which are laminated on the support constituting the photosensitive sheet 2 are laminated. Then, the photosensitive sheet 2 to the protective film removing portion 4 are supplied, and the protective film corresponding to the bonding range of the substrate 5 is peeled off using an adhesive tape or the like, and then supplied between the thermocompression bonding rolls 6a and 6b. Further, the substrate 5 after heating is input between the thermocompression bonding rolls 6a and 6b, and the photosensitive resin body 2 is heated and pressure-bonded to the lower surface portion of the substrate 5 via the photosensitive resin layer exposed by the peeling protective film. The substrate 5 heated and pressure-bonded to the photosensitive sheet 2 200848265 is output from the thermocompression bonding rolls 6a and 6b, and then supplied to the photosensitive sheet 2 between the divided substrates 5 to produce a photosensitive product. The slab 2 is formed by laminating a lipid layer and a protective film on a flexible support, and is stretched in the photosensitive sheet 2 because of the state of imparting tension. In particular, the thermocompression bonding $*6b is bonded to the substrate 5 by heating the photosensitive sheet 2, and the elongation in the vicinity of the adjacent rollers 6a and 6b is large. Therefore, it is necessary to adjust the position of the photosensitive sheet 2, and the photosensitive property from which the protective film is peeled off is accurately clamped and bonded to a predetermined range of the substrate 5. Further, the photosensitive laminate to be produced needs to be inspected for whether or not the photosensitive sheet 2 is bonded to a predetermined position. At this time, the front end portion of the substrate 5 and the side ends L 1 f, L lb of the photosensitive sheet 2 are fixed as shown in Fig. 10, and the front end portion and the rear end portion of the substrate 5 and the half of the optical sheet 2 are measured. The distance L2f between the thickness cutting portions Hf and Hb determines whether or not the distances Llf, Lib, and L2f, L2b are allowed to ensure the quality of the photosensitive laminate. ί However, the previous inspection method is based on the manual measurement of the bonding position of the sensor 2 to the substrate 5. Therefore, it is extremely difficult to measure the manufacturing time, and it is extremely difficult to check the manufacturing of the optical laminate. SUMMARY OF THE INVENTION An object of the present invention is to provide a device for producing a photosensitive laminate which can efficiently and accurately adhere to a position of a photosensitive material layer of a substrate, and which is capable of ensuring the quality of the produced layer. The manufacturing apparatus of the photosensitive laminated body is sent out in the I apparatus 7, and the body. Under the photosensitive tree, the failure tube 6a is displayed on the resin substrate positive substrate 5 on the hot-pressed substrate 5, and the distance between the measurement portions is formed in the sense L2b. In the range, the optical sheet has a lot of time, and all of them are accurately The method of measuring the photosensitive product is measured. a long strip-shaped photosensitive sheet which is formed by sequentially stacking a photosensitive material layer and a protective film on a support, and a processed portion corresponding to a boundary position between the peeled portion of the protective film and the residual portion is formed on the protective film to the foregoing After the peeling portion of the protective film is peeled off from the portion of the photosensitive material layer, the long photosensitive sheet is continuously fed out between the pair of heated rolls, and the substrate to be supplied at a predetermined interval. The remaining portion of the protective film is disposed between the substrates, and the exposed photosensitive material layer is bonded to the substrate, and then the support is peeled off from the protective film (the photosensitive laminate is characterized in that An end detecting unit that detects a substrate end portion of the substrate constituting the photosensitive laminate or an end portion of a photosensitive material layer bonded to the photosensitive material layer of the substrate; and a photographing unit The end detecting portion detects a time point of the end portion of the substrate or the end portion of the photosensitive material layer, and the photographing includes the substrate end And an image of the end portion of the photosensitive material layer; and a bonding position calculation unit that calculates a bonding position of the photosensitive material layer to the substrate by the 1/image imaged by the imaging unit. In the method for producing a photosensitive laminate according to the present invention, a long photosensitive sheet formed by sequentially laminating a photosensitive material layer and a protective film on a support is fed, and a boundary portion between the peeled portion and the residual portion corresponding to the protective film is provided. The processed portion of the position is formed in a portion from the protective film to the photosensitive material layer, and after peeling off the peeled portion of the protective film, the long-length photosensitive sheet is placed together with the substrate supplied at a predetermined interval. One of the heating is continuously fed between the pressure-bonding rolls, the remaining portion of the protective film is placed between the substrates, and the exposed photosensitive material layer 200848265 is bonded to the substrate, and then the support is peeled off from the protective film. A photosensitive laminate is produced, and is characterized in that it has the following steps: detecting the aforementioned constituents of the photosensitive shoulder layer a substrate end portion of the board or an end portion of the photosensitive material layer bonded to the photosensitive material layer of the substrate; and the substrate includes an end portion of the substrate and the aforementioned detection time point of the substrate end portion or the end portion of the photosensitive material layer An image of the end portion of the photosensitive material layer; and the image of the photographing is processed to calculate the bonding position of the photosensitive material layer to the substrate. The present invention utilizes the end portion of the detecting substrate or the end of the photosensitive material layer bonded to the substrate. According to the detection time point, the end portion of the substrate and the end portion of the photosensitive material layer are photographed, and the bonding position of the photosensitive material layer to the substrate is calculated, and the quality inspection of the photosensitive laminate can be easily and accurately performed. As a result of the quality inspection, it is possible to avoid the shipment of defective products in advance. The above-described objects, features and advantages will be apparent from the following description of the embodiments of the drawings. FIG. A schematic diagram of a manufacturing apparatus 20 for a photosensitive laminate according to an embodiment of the present invention, which is processed by a liquid crystal or a color filter for organic EL. The operation of thermally transferring the photosensitive resin layer 28 (described later) of the long photosensitive sheet 22 composed of the specified width dimension to the glass substrate 24 is performed. Fig. 2 is a cross-sectional view of the long photosensitive sheet 22 used in the manufacturing apparatus 20. The long-length photosensitive sheet 22 is formed by laminating a flexible base film (support) 26, a photosensitive resin layer (photosensitive material layer) 28, and a protective film 30 200848265. As shown in Fig. 1, the manufacturing apparatus 20 includes a photosensitive sheet roll 23 that winds the long photosensitive sheet 22 in a roll shape, and the long photosensitive sheet 22 can be fed from the photosensitive sheet roll 23. The sheet feeding mechanism 32 is formed into a half-cut portion (processed portion) 34a, 34b which can be cut at two boundary portions in the width direction of the protective film 30 and the photosensitive resin layer 28 of the long-length photosensitive sheet 22 (see The processing mechanism 36 (processed portion) of Fig. 2) and the label bonding mechanism 40 for bonding a part of the bonding label 38 (see Fig. 3) having the non-joining portion 38a to the protective film 30. A storage mechanism 42 for changing the long photosensitive sheet 22 from intermittent conveyance to continuous conveyance is provided downstream of the label joining mechanism 40; peeling of the protective film 30 from the long photosensitive sheet 22 at a predetermined length interval a mechanism 44; a substrate supply mechanism 45 that is supplied to the bonding position while heating the glass substrate 24 to a predetermined temperature; and a photosensitive resin layer 28 that is exposed by peeling off the protective film 30 to be bonded to the glass The bonding mechanism 46 of the substrate 24. (An imaging unit 47 that images an image of the long strip-shaped photosensitive sheet 22 including the half-cut portions 34a and 34b is provided in the vicinity of the upstream of the bonding position in the bonding mechanism 46. The manufacturing device 20 is based on the half-cut portion photographed by the photographing unit 47. In the images of 34a and 34b, the amount of deviation of the half-cut portions 34a and 34b with respect to the bonding mechanism 46 is calculated, and the amount of conveyance of the long-length photosensitive sheet 22 is corrected. In the vicinity of the downstream of the sheet feeding mechanism 32, a thumbnail is attached. The rear end of the long strip-shaped photosensitive sheet 22 after use and the bonding seat 49 at the tip end of the newly used long-length photosensitive sheet 22. The downstream of the bonding seat 49, in order to control the curl deviation due to the photosensitive sheet roll 23 Cause the deviation of the width direction, and set -10·
200848265 薄膜終端位置檢測器5 1。此處，薄膜終端位置調整 片送出機構32在寬度方向移動而進行，不過亦可附 滾筒之位置調整機構而進行。 加工機構3 6配置於滾筒組5 0下游，該滾筒組5 0 於算出收容捲繞於薄片送出機構32之感光性薄片車昆 輥徑。加工機構3 6具備相隔距離Μ程度之一對圓刃 52b。圓刃52a、5 2b在長條狀感光性薄片22之寬度力 動，而在夾著保護膜30之殘留部分B的指定之2處β 成半切部34a、34b (參照第2圖）。 如第2圖所示，半切部34a、34b至少需要切斷保 30及感光性樹脂層28，實際上，係以切入至可撓性基 26之方式設定圓刃52a、5 2b之切入深度。圓刃52a、 採用在不旋轉而固定之狀態下，移動於長條狀感光13 22之寬度方向，而形成半切部34a、34b之方式；及7 述長條狀感光性薄片22上滑動，而旋轉並移動於前纽 方向，而形成前述半切部34a、34b之方式。該半切部 34b亦可取代圓刃52a、 5 2 b，而採用如使用雷射光万 波之切割方式，或是以刀刃、剪切刃（湯姆生刃）_ 之方式。 半切部3 4 a、3 4 b設定成將感光性樹脂層2 8貼合方 基板24時，如從前述玻璃基板24之兩端部分別進； 各1 0 m m的位置。另外，玻璃基板2 4間之保護膜3 0 έ 部分Β，係作爲在後述之貼合機構4 6中’將感光性丰 2 8外框狀地貼合於前述玻璃基板24時之遮罩的功能 標籤接合機構40爲了對應於玻璃基板24間’保、 使薄 組合 係用 23的 5 2a、 向移 置形 :護膜 :底膜 52b :薄片 :在前 ;寬度 3 4a、 :超音 ^形成 >玻璃 、內側 j殘留 ί脂層 者。 呈保護 -11- 200848265 膜30之殘留部分B，而供給連結半切部34b側之剝離部分 A與半切部3 4 a側之剝離部分a的接合標鐵3 8。 如第3圖所示，接合標籤3 8構成長條紙狀，如以與保 護膜3 0相同之樹脂材料而形成。接合標籤3 8具有中央部 不塗布黏合劑之非接合部（包含微黏合）3 8 a，並且在該非 接合部3 8 a之兩側，亦即在前述接合標籤3 8之長度方向兩 端部具有：接合於前方之剝離部分A的第一接合部3 8b， 及接合於後方之剝離部分A的第二接合部3 8 c。 如第1圖所示，標籤接合機構4〇具備各指定間隔離開 而可貼合最大7片接合標籤38的吸附墊54a〜54g，並且在 藉前述吸附墊54a〜54g貼合前述接合標籤38之位置，升降 自如地配置用於從下方保持長條狀感光性薄片22之托架 56 ° 貯存機構42爲了吸收上游側之長條狀感光性薄片22的 間歇輸送與下游側之前述長條狀感光性薄片22的連續輸 送之速度差，而具備在箭頭方向搖動自如之跳動滾筒60。 配置於貯存機構42下游之剝離機構44具備用於遮斷長 條狀感光性薄片22之送出側的張力變動，使層壓時之張力 穩定化的吸入筒62。在吸入筒62附近配置剝離滾筒63， 並且經由該剝離滾筒63，自長條狀感光性薄片22以銳角之 剝離角剝離的保護膜3 0，除了殘留部分B，捲繞於保護膜 捲繞部64。 在剝離機構44之下游側設置可在長條狀感光性薄片22 上賦予張力之張力控制機構66。張力控制機構66在汽缸 68之驅動作用下，藉張力調節器70搖動變位，可調整長條 -12- 200848265 狀感光性薄片22之張力。另外，張力控制機構66依需要 使用即可，亦可刪除。 基板供給機構45具備：以夾著玻璃基板24之方式而設 置之基板加熱部（如加熱器）74，在箭頭Y方向輸送該玻 璃基板24之輸送部76，及檢測玻璃基板24之後端部的停 止位置之停止位置檢測感測器78。基板加熱部74隨時監視 玻璃基板24之溫度，於異常時，停止輸送部76及發出警 報，並且發送異常資訊，在爾後步驟NG排出異常之玻璃 ί : 基板24，可活用於品質管理或生產管理等。輸送部7 6中設 置無圖示之氣浮板，浮起玻璃基板24而在箭頭Υ方向輸 送。玻璃基板24之輸送亦可藉滾筒輸送機進行。 玻璃基板24之溫度測定宜在基板加熱部74內或貼合位 置之前進行。測定方法除了接觸式（如熱電偶）之外，亦 可爲非接觸式。 貼合機構46具備設置於上下，並且加熱成指定溫度之 橡膠滾筒（壓接滾筒）80a、80b。橡膠滾筒80a、80b上滑 (, 接備份滾筒82a、82b。一方之備份滾筒82b藉構成滾筒壓 板部8 3之加壓汽缸8 4，而擠壓於橡膠滾筒8 0 b側。 玻璃基板2 4藉構成從貼合機構4 6延伸於箭頭Y方向之 輸送路徑的數個基板輸送滾筒90a〜90d而輸送。在基板輸 送滾筒90b、90c間設置藉切斷玻璃基板24間之長條狀感 光性薄片22，所分離在玻璃基板24上貼合有感光材料層之 感光性積層體24a的刀具機構48。 在基板輸送滾筒90d之下游側配置有在積層數個感光性 積層體24a之狀態下儲存之儲存庫94,該儲存庫94中藉機 •13- 200848265 器人96搬運藉刀具機構48分離之感光性積層體24a。鄰接 於儲存庫94，而配置剝離殘留於感光性積層體24a之可撓 性基底膜26的剝離部98。剝離部98具有剝離滾筒100， 藉捲繞滾筒1 02捲繞經由剝離滾筒1 〇〇而剝離之可撓性基 底膜26。 接續剝離部9 8而配置檢測部1 04，其係檢測感光性樹脂 層28對構成剝離有可撓性基底膜26之感光性積層體24b 之玻璃基板2 4的貼合位置。如第4圖所不，檢測部1 0 4具 ί 備：檢測輸送之玻璃基板24的前端部及後端部，或是貼合 於玻璃基板24之感光性樹脂層28的前端部及後端部之光 感測器1 06 (端部檢測部），及攝影玻璃基板24之端部圖像 及感光性樹脂層28之端部圖像的CCD相機108a、108b(攝 影部）。此時CCD相機108a、108b如第5圖及第6圖所示， 設定各攝影區域109a、109b，而同時攝影玻璃基板24之端 部與感光性樹脂層28之端部。 另外，以上構成之製造裝置20係將薄片送出機構32、 加工機構36、標籤接合機構40、貯存機構42、剝離機構 44、張力控制機構66及攝影部47配置於貼合機構46之上 方，反之，亦可構成從前述薄片送出機構32至前述攝影部 47配置於前述貼合機構46之下方，長條狀感光性薄片22 之上下顛倒，而將感光性樹脂層28貼合於玻璃基板24下 側’此外，亦可將長條狀感光性薄片22之輸送路徑構成直 線狀。 製造裝置20內’經由隔牆1 10而隔離第一潔淨室丨i2a 與第二潔淨室11 2b。第一潔淨室112a中收容薄片送出機構 -14- 200848265 3 2至張力控制機構6 6，第二潔淨室1 1 2 b中收容攝影部4 7 以後之機構。第一潔淨室1 1 2 a與第二潔淨室1 1 2 b經由貫 穿部1 1 4而連通。 第7圖顯示檢測部1 04之控制電路方塊。檢測部1 〇4具 備：圖像處理部1 2 0，其係按照光感測器1 〇 6檢測玻璃基板 24或感光性樹脂層28之端部的檢測時間點，處理cCD相 機108a、108b攝影之圖像；貼合位置算出部122，其係依 據處理後之圖像資訊，算出感光性樹脂層2 8對玻璃基板2 4 ( 之貼合位置；判定部1 24，其係判定算出後之貼合位置是否 爲正確位置；及顯示部1 2 6，其係顯示判定部1 2 4之判定結 果。 其次’連同本發明之製造方法，說明以上構成之製造裝 置20的動作。 首先，從安裝於薄片送出機構32之感光性薄片輥23送 出長條狀感光性薄片22。長條狀感光性薄片22輸送至加工 機構3 6。 i 加工機構36中，圓刃52a、52b移動於長條狀感光性薄 片22之寬度方向，從保護膜30至感光性樹脂層28乃至可 撓性基底膜26切入前述長條狀感光性薄片22，而形成保護 膜30之殘留部分B的寬度Μ程度離開之半切部34a、34b (參照第2圖）。藉此，在長條狀感光性薄片22中，夾著 殘留部分B而設置前方之剝離部分A與後方之剝離部分A (參照第2圖）。 另外，殘留部分B之寬度Μ係以長條狀感光性薄片22 不延伸作爲前提，將供給至貼合機構46之橡膠滾筒80a、 200848265 8 0b間的玻璃基板24間之距離作爲基準而設定。此外，以 寬度Μ形成的一組半切部34a、34b係以貼合於玻璃基板 24之感光性樹脂層28的基準長度之間隔而形成於長條狀 感光性薄片22。 其次，長條狀感光性薄片22輸送至標籤接合機構40， 而將保護膜3 0之指定貼合部位配置於托架5 6上。標籤接 合機構40係藉吸附墊54b〜5 4g吸附保持指定數量之接合標 籤3 8，各接合標籤3 8橫跨保護膜3 0之殘留部分B，而一 ί 體地接合於前方之剝離部分A與後方之剝離部分A (參照 第3圖）。 如接合有7片接合標籤3 8之長條狀感光性薄片22，如 第1圖所示，經由貯存機構4 2防止送出側之張力變動後， 連續地輸送至剝離機構44。剝離機構44將長條狀感光性薄 片22之可撓性基底膜26吸附保持於吸入筒62，並且保護 膜30保留殘留部分B，而自前述長條狀感光性薄片22剝 離。該保護膜30經由剝離滾筒63剝離，而捲繞於保護膜 t 捲繞部64 (參照第1圖）。 在剝離機構44之作用下，保護膜30保留殘留部分B， 而自可撓性基底膜26剝離後，長條狀感光性薄片22藉張 力控制機構66進行張力調整，其次，在攝影部47中，以 指定之攝影時間點’攝影包含半切部3 4 a、3 4 b之長條狀感 光性薄片22的圖像。 藉通過攝影部47之長條狀感光性薄片22輸送至貼合機 構4 6，進行感光性樹脂層2 8對玻璃基板2 4之轉印處理。 此時，係依據藉攝影部47所攝影之半切部34a、34b的圖 -16 - 200848265 像，調整貼合機構46中之半切部34a、34b的位置。 貼合機構46起初係設定成橡膠滾筒80a、80b離開之狀 態，在橡膠滾筒80a、80b間之指定位置定位長條狀感光性 薄片22之半切部34a的狀態下，暫時停止輸送長條狀感光 性薄片22。在該狀態下，藉輸送部76將藉構成基板供給機 構45之基板加熱部74而加熱至指定溫度之玻璃基板24的 前端部搬入橡膠滾筒80a、80b間時，在加壓汽缸84之作 用下，備份滾筒82b及橡膠滾筒80b上昇，而在橡膠滾筒 80a、8 0b間以指定之壓力機壓力夾入玻璃基板24及長條狀 感光性薄片22。另外，橡膠滾筒80a、80b加熱至指定之層 壓溫度。 其次，橡膠滾筒80a、80b旋轉，將玻璃基板24及長條 狀感光性薄片22輸送於箭頭Y方向。結果感光性樹脂層 28被加熱熔化而轉印於玻璃基板24。 另外，層壓條件係速度爲1.0m / min〜10.0m / min，橡膠 滾筒80a、80b之溫度爲80 °C〜15(TC，前述橡膠滾筒80a、 iJ 80b之橡膠硬度爲40度〜90度，該橡膠滾筒80a、80b之壓 力機壓力（線壓）爲50N/cm〜400N/cm。 對玻璃基板24層壓一片長條狀感光性薄片22結束時， 停止橡膠滾筒80a、80b之旋轉，另外，藉基板輸送滾筒90a 夾住層壓有長條狀感光性薄片22之玻璃基板24的前端 部。此時，在橡膠滾筒80a、80b間之指定位置配置半切部 34b ° 而後，橡膠滾筒80b退開於從橡膠滾筒80a離開之方向， 而解除夾住，並且基板輸送滾筒90a以低速再度開始旋轉， -17- 200848265 長條狀感光性薄片22層壓於玻璃基板24之感光性積層體 在箭頭Y方向輸送對應於保護膜30之殘留部分B的寬度Μ 之距離程度，其次之半切部3 4 a被輸送至橡膠滾筒8 0 a之 下方附近的指定位置後，停止橡膠滾筒80a、80b之旋轉。 另外，以下將僅在半切部34a、34b間輸送長條狀感光性薄 片22之處理，稱爲「基板間輸送」。 另外，在前述之狀態下，經由基板供給機構45，而向貼 合位置輸送其次之玻璃基板24，藉反覆進行以上之動作， ^ 而連續地製造感光性積層體。 此時，感光性積層體之各個端部藉第2圖所示之保護膜 3 0的殘留部分B覆蓋。因此，感光性樹脂層2 8被轉印於 玻璃基板24時，橡膠滾筒80a、80b不致被前述感光性樹 脂層28污染。 藉貼合機構46貼合有感光性樹脂層28之玻璃基板24， 藉貼合機構46而在基板間輸送長條狀感光性薄片22後， 在暫時停止狀態時，藉設置於基板輸送滾筒90b、90c間之 ί 刀具機構48切斷玻璃基板24間之長條狀感光性薄片22 ’ 作爲感光性積層體2 4 a。另外’該感光性積層體2 4 a中保留 保護膜30。 分離之感光性積層體24a藉機器人96暫時積層於儲存 庫94。其次，積層於儲存庫94之感光性積層體24a搬運至 剝離部9 8後，藉經由剝離滾筒1 〇 〇，而從感光性積層體2 4 a 剝離保護膜3 0，來製造在玻璃基板2 4上僅貼合有感光性樹 脂層28之感光性積層體24b。另外，從感光性積層體24a 剝離之保護膜3 0藉捲繞滾筒1 02捲繞。 -18- 200848265 此處，因爲在賦予有指定張力之狀態下供給長條狀感光 性薄片2 2，並且在貼合機構4 6中加熱而貼合於玻璃基板 24，所以發生延展。此時，可能藉長條狀感光性薄片22之 延展量，導致感光性樹脂層2 8對玻璃基板24之貼合位置 不適切。 因此，配置於剝離部9 8下游側之檢測部1 04檢測感光 性積層體24b中感光性樹脂層28之貼合位置。 首先，如第4圖所示，構成檢測部104之光感測器106 ( 檢測輸送之玻璃基板24的前端部或貼合於玻璃基板24之 感光性樹脂層28的前端部時，將端部檢測信號輸出至CCD 相機108a、10 8b。CCD相機108a、10 8b按照前述端部檢測 信號攝影玻璃基板24之攝影區域109a、109b的圖像。此 時，攝影區域109a、109b中包含玻璃基板24之前端角落 部分及感光性樹脂層28之前端角落部分的圖像。 圖像處理部120處理藉CCD相機108a、108b所攝影之 圖像，特定玻璃基板24之前端角落部分及感光性樹脂層28 〇 之前端角落部分。貼合位置算出部122依據特定之各角落 部分的位置資訊，算出前端部中玻璃基板24之側部與感光 性樹脂層28之側部的距離LI f，及玻璃基板24之前端部與 感光性樹脂層2 8之前端部的距離L2f (參照第5圖）。判定 部124將算出之距離Llf、L2f與預先設定之容許距離作比 較，判定距離L 1 f、L2f是否在容許範圍內。藉將判定結果 顯示於顯示部1 26，可將在該感光性積層體24b前端側之感 光性樹脂層28的貼合狀態告知作業者。 同樣地，以光感測器1 06檢測玻璃基板24之後端部或 -19- 200848265 貼合於玻璃基板24之感光性樹脂層2 8的後端部之時間 點，藉CCD相機108a、108b攝影圖像，算出在後端部之玻 璃基板24與感光性樹脂層28的距離Lib、L2b，並將依據 其算出結果之判定結果顯示於顯示部1 26 (參照第6圖）。 如以上地自動檢測感光性樹脂層28對玻璃基板24之貼 合狀態，並將其判定結果顯示於顯示部1 26。因此，作業者 可依據顯示之判定結果，進行藉製造裝置20而製造出之全 部感光性積層體24b的品質檢查。 f 第8圖係其他實施形態之製造裝置200的槪略構成圖。 另外，在與第1圖所示之製造裝置20相同的構成要素上註 記相同參照符號，並省略其說明。 製造裝置200係將藉貼合機構46貼合有長條狀感光性 薄片22之玻璃基板24不分斷而輸送至冷卻部202加以冷 卻後，供給至剝離部204。剝離部204藉推進器206將玻璃 基板24間之長條狀感光性薄片22推上於上方向，成爲保 護膜30容易剝離之狀態後，從感光性樹脂層28剝離保護 1; 膜30，並藉捲繞滾筒208捲繞。藉此，分離玻璃基板24 間，而製造感光性積層體24b。製造出之感光性積層體24b 與製造裝置20之情況同樣地，藉檢測部1 04檢測玻璃基板 24及感光性樹脂層28之端部位置，進行貼合位置之算出及 判定處理。 另外，上述之實施形態係藉將從1支感光性薄片輥23 供給之長條狀感光性薄片22貼合於玻璃基板24,以製造所 謂單輥鋪設之感光性積層體24b而構成，不過亦可如將從2 支感光性薄片輥或3支以上之感光性薄片輥供給長條狀感 -20- 200848265 光性薄片22貼合於玻璃基板24，以製造所謂二輥鋪設、三 輥鋪設等之感光性積層體24b而構成。 【圖式簡單說明】 第1圖係本實施形態之製造裝置的槪略構成圖。 第2圖係使用於本實施形態之製造裝置的長條狀感光性 薄片之剖面圖。 第3圖係在長條狀感光性薄片上接合有接合標籤之狀態 的說明圖。 第4圖係端部檢測部及攝影部之配置關係說明圖。 第5圖係基板及感光材料層之前端部的攝影狀態之說明 圖。 · 第6圖係基板及感光材料層之後端部的攝影狀態之說明 圖。 第7圖係檢測部之控制電路方塊圖。 第8圖係其他實施形態之製造裝置的槪略構成圖。 第9圖係先前技術之製造裝置的槪略構成圖。 第1 0圖係基板及感光性片體之位置關係的說明圖。 【主要元件符號說明】 1 輥 2 感 光 性 片 體 3 半 厚 度 切 割裝置 4 保 護 膜 除 去部 5 基 板 6 a 熱 壓 接 滾 筒 6b 熱 壓 接 滾 筒 -21 - 200848265 7 分 離 裝 置 20 製 造 裝 置 22 長 條 狀 感 光 性 薄片 23 感 光 性 薄 片 輥 24 玻 璃 基 板 24a 感 光 性 疊 層 體 24b 感 光 性 疊 層 體 26 撓 曲 性 基 礎 膜 28 感 光 性 樹 脂 層 30 保 護 膜 32 薄 片 送 出 機 構 3 4a 半 厚 度 切 割 部 位 34b 半 厚 度 切 割 部 位 36 加 工 機 構 38 接 合 標 籤 38a 非 接 合 部 38b 第 —* 接 合 部 38c 第 二 接 合 部 40 標 籤 接 合 機 構 42 貯 存 機 構 44 剝 離 機 構 45 基 板 供 給 機 構 46 貼 合 機 構 47 攝 影 部 48 刀 具 機 構 -22- 200848265 49 貼合 50 滾筒 5 1 薄膜 52a 圓刃 52b 圓刃 5 4 a 〜5 4 g 吸附 56 托架 60 跳動 62 吸入 63 剝離 64 保護 66 張力 68 汽缸 70 張力 74 基板 76 輸送 78 停止 80a 橡膠 80b 橡膠 82a 備份 82b 備份 83 滾筒 84 加壓 9 0 a 〜9 0 d 基板 94 儲存200848265 Film end position detector 51. Here, the film end position adjusting blade feeding mechanism 32 is moved in the width direction, but may be performed by attaching the position adjusting mechanism of the drum. The processing mechanism 36 is disposed downstream of the drum set 50, and the drum set 50 calculates the diameter of the photosensitive sheet car that is stored and wound around the sheet feeding mechanism 32. The processing mechanism 36 has one of the distances Μ to the rounded edge 52b. The rounded edges 52a and 52b are urged in the width of the long-length photosensitive sheet 22, and are formed into half-cut portions 34a and 34b at two positions of the remaining portion B of the protective film 30 (see Fig. 2). As shown in Fig. 2, at least the half cut portions 34a and 34b need to be cut and the photosensitive resin layer 28 is cut. Actually, the cut depths of the round edges 52a and 52b are set so as to cut into the flexible base 26. The rounded blade 52a is moved in the width direction of the long strip photosensitive 13 22 in a state of being fixed without being rotated, and forms a half cut portion 34a, 34b; and 7 slides on the long strip photosensitive sheet 22, and The manner of rotating and moving in the front direction to form the aforementioned half cut portions 34a, 34b. The half-cut portion 34b may be replaced with a circular blade 52a, 52b, or a cutting method using a laser beam or a cutting edge (Tomb blade). The half-cut portions 3 4 a and 3 4 b are set such that when the photosensitive resin layer 28 is bonded to the square substrate 24, the respective portions of the glass substrate 24 are placed at positions of 10 m each. In addition, the protective film 30 έ part of the glass substrate 24 is a mask which is attached to the glass substrate 24 in a frame-like manner in a bonding mechanism 46 to be described later. In order to correspond to the glass substrate 24, the functional label bonding mechanism 40 has a shape of 5 2a for the thin combination system 23, a film shape: a film: a film 52b: a sheet: a front portion; a width of 3 4a, a super sound. > Glass, inner j residual gluten layer. The residual portion B of the film -30-200848265 is protected, and the peeling portion A of the joining half-cut portion 34b side and the peeling portion a of the half-cut portion 34a side are joined to the target metal 38. As shown in Fig. 3, the bonding label 38 is formed in a long paper shape, and is formed of the same resin material as the protective film 30. The bonding label 38 has a non-joining portion (including micro-adhesion) 3 8 a in which the adhesive portion is not applied at the center portion, and both sides of the non-joining portion 38 a, that is, both ends in the longitudinal direction of the aforementioned bonding label 38 The first joint portion 38b joined to the front peeling portion A and the second joint portion 38c joined to the rear peeling portion A. As shown in Fig. 1, the label joining mechanism 4A includes suction pads 54a to 54g which are separated from each other at a predetermined interval and which can bond up to seven sheets of the bonding labels 38, and the bonding labels 38 are bonded to the suction pads 54a to 54g. In the position, the bracket 56 for holding the long-length photosensitive sheet 22 from below is disposed in a freely movable manner. The storage mechanism 42 absorbs the intermittent conveyance of the long-length photosensitive sheet 22 on the upstream side and the aforementioned long-length photosensitive on the downstream side. The sheet 22 has a speed difference of continuous conveyance, and has a dancer cylinder 60 that is rockable in the direction of the arrow. The peeling mechanism 44 disposed downstream of the storage mechanism 42 is provided with a suction cylinder 62 for blocking the tension fluctuation on the delivery side of the long-length photosensitive sheet 22 and stabilizing the tension at the time of lamination. The peeling roller 63 is disposed in the vicinity of the suction tube 62, and the protective film 30 which is peeled off from the long-length photosensitive sheet 22 at an acute angle peeling angle is wound around the protective film winding portion except for the residual portion B. 64. A tension control mechanism 66 that can apply tension to the elongated photosensitive sheet 22 is provided on the downstream side of the peeling mechanism 44. The tension control mechanism 66 is oscillated by the tension adjuster 70 under the driving action of the cylinder 68, and the tension of the long strip -12-200848265 photosensitive sheet 22 can be adjusted. Further, the tension control mechanism 66 may be used as needed or may be deleted. The substrate supply mechanism 45 includes a substrate heating unit (such as a heater) 74 that is provided to sandwich the glass substrate 24, a transport unit 76 that transports the glass substrate 24 in the arrow Y direction, and a rear end portion that detects the glass substrate 24 The stop position detection sensor 78 of the stop position. The substrate heating unit 74 monitors the temperature of the glass substrate 24 at any time. When an abnormality occurs, the conveying unit 76 is stopped and an alarm is issued, and an abnormality information is transmitted, and in the subsequent step NG, the abnormal glass is discharged: the substrate 24 can be used for quality management or production management. Wait. An air floating plate (not shown) is provided in the conveying portion 76, and the glass substrate 24 is floated and transported in the direction of the arrow Υ. The transport of the glass substrate 24 can also be carried out by means of a roller conveyor. The temperature measurement of the glass substrate 24 is preferably performed in the substrate heating portion 74 or before the bonding position. In addition to contact methods (such as thermocouples), the measurement method can also be non-contact. The bonding mechanism 46 includes rubber rollers (crimping rollers) 80a and 80b which are disposed above and below and are heated to a predetermined temperature. The rubber cylinders 80a and 80b are slid upward (to be connected to the backup rollers 82a and 82b. One of the backup rollers 82b is pressed against the rubber cylinder 8 0b side by the pressurizing cylinders 8 4 constituting the roller presser portion 83. The glass substrate 2 4 It is transported by a plurality of substrate transport rollers 90a to 90d which are formed in a transport path extending from the bonding mechanism 46 in the direction of the arrow Y. Long strip-like photosensitivity between the substrate transport rollers 90b and 90c by cutting the glass substrate 24 is provided. The sheet member 22 is a cutter mechanism 48 in which the photosensitive laminate 24a of the photosensitive material layer is bonded to the glass substrate 24. The downstream of the substrate transport roller 90d is disposed in a state in which a plurality of photosensitive laminates 24a are stacked. In the storage library 94, the storage unit 94 takes the opportunity to carry out the photosensitive laminate 24a separated by the cutter mechanism 48. The adhesive layer 94 is adjacent to the storage 94, and the separation remains in the photosensitive laminate 24a. The peeling portion 98 of the flexible base film 26. The peeling portion 98 has the peeling roller 100, and the flexible base film 26 which is peeled off by the peeling roller 1 is wound by the winding roller 102. The peeling portion is connected to the peeling portion 98. Department 1 04, its inspection The photosensitive resin layer 28 is bonded to the glass substrate 24 which constitutes the photosensitive laminate 24b from which the flexible base film 26 is peeled off. As shown in Fig. 4, the detecting unit 104 has a detection and conveyance. The front end portion and the rear end portion of the glass substrate 24 or the photo sensor 106 (end portion detecting portion) bonded to the front end portion and the rear end portion of the photosensitive resin layer 28 of the glass substrate 24, and the photographic glass substrate CCD cameras 108a and 108b (photographing units) of the end image of 24 and the end image of photosensitive resin layer 28. At this time, CCD cameras 108a and 108b set each photographing area as shown in Figs. 5 and 6 109a and 109b, and at the same time, the end portion of the photographic glass substrate 24 and the end portion of the photosensitive resin layer 28. The manufacturing device 20 having the above configuration is a sheet feeding mechanism 32, a processing mechanism 36, a label bonding mechanism 40, and a storage mechanism 42. The peeling mechanism 44, the tension control mechanism 66, and the photographing unit 47 are disposed above the bonding mechanism 46. Conversely, the sheet feeding mechanism 32 to the photographing unit 47 may be disposed below the bonding mechanism 46, and may be long. The photosensitive sheet 22 is turned upside down, and The photosensitive resin layer 28 is bonded to the lower side of the glass substrate 24. Alternatively, the transport path of the long photosensitive sheet 22 may be linear. The inside of the manufacturing apparatus 20 'is isolated from the first clean room via the partition wall 10丨i2a and the second clean room 11 2b. The first clean room 112a houses the sheet feeding mechanism-14-200848265 3 2 to the tension control mechanism 6 6, and the second clean room 1 1 2 b houses the mechanism after the photographing unit 4 7 The first clean room 1 1 2 a and the second clean room 1 1 2 b communicate via the penetrating portion 1 1 4 . Fig. 7 shows a control circuit block of the detecting unit 104. The detecting unit 1 〇4 includes an image processing unit 1120 that detects the detection time point of the end portion of the glass substrate 24 or the photosensitive resin layer 28 in accordance with the photosensor 1 〇6, and processes the cCD cameras 108a and 108b. The image-matching position calculation unit 122 calculates the bonding position of the photosensitive resin layer 28 to the glass substrate 24 based on the processed image information, and the determination unit 1 24 determines the calculation result. Whether the bonding position is the correct position or not, and the display unit 1 2 6 displays the determination result of the determination unit 1 24. Next, the operation of the manufacturing apparatus 20 configured as above will be described together with the manufacturing method of the present invention. The photosensitive sheet roll 23 of the sheet feeding mechanism 32 feeds the long photosensitive sheet 22. The long photosensitive sheet 22 is conveyed to the processing mechanism 36. In the processing mechanism 36, the rounded edges 52a and 52b are moved in a strip shape. In the width direction of the photosensitive sheet 22, the long-length photosensitive sheet 22 is cut from the protective film 30 to the photosensitive resin layer 28 or the flexible base film 26, and the width B of the remaining portion B of the protective film 30 is separated. Half cut 34a, 34b ( In the long-length photosensitive sheet 22, the front peeling portion A and the rear peeling portion A are provided with the remaining portion B interposed therebetween (see Fig. 2). The width Μ is set on the premise that the long-length photosensitive sheet 22 does not extend, and the distance between the glass substrates 24 supplied between the rubber cylinders 80a and 200848265 8 0b of the bonding mechanism 46 is set as a reference. Further, the width Μ is formed. The set of half-cut portions 34a and 34b are formed on the long-length photosensitive sheet 22 at intervals of the reference length of the photosensitive resin layer 28 bonded to the glass substrate 24. Next, the long-length photosensitive sheet 22 is transported to the label. The bonding mechanism 40 is disposed on the carrier 56 by the designated bonding portion of the protective film 30. The label bonding mechanism 40 adsorbs and holds a predetermined number of bonding labels 3 8 by the adsorption pads 54b to 5 4g, and the bonding labels 3 8 Across the residual portion B of the protective film 30, and bonded to the front peeling portion A and the rear peeling portion A (refer to Fig. 3). If the 7-piece bonding label 38 is bonded, the strip-shaped photosensitive material is bonded. Sex sheet 22, as shown in Figure 1, The storage mechanism 42 prevents the tension on the delivery side from being changed, and then continuously conveys it to the peeling mechanism 44. The peeling mechanism 44 sucks and holds the flexible base film 26 of the long photosensitive sheet 22 in the suction cylinder 62, and the protective film 30 The remaining portion B is left and peeled off from the long-length photosensitive sheet 22. The protective film 30 is peeled off by the peeling roller 63 and wound around the protective film t-wound portion 64 (see Fig. 1). Under the action, the protective film 30 retains the residual portion B, and after the flexible base film 26 is peeled off, the long photosensitive film 22 is tension-adjusted by the tension control mechanism 66, and secondly, in the photographing unit 47, the designated photograph is taken. The time point 'photographs an image of the long strip-shaped photosensitive sheet 22 including the half cut portions 3 4 a, 3 4 b. The long photosensitive photosensitive sheet 22 of the photographing unit 47 is transported to the bonding mechanism 46, and the transfer process of the photosensitive resin layer 28 to the glass substrate 24 is performed. At this time, the positions of the half-cut portions 34a and 34b of the bonding mechanism 46 are adjusted in accordance with the image of Fig. 16-200848265 which is the half-cut portions 34a and 34b photographed by the photographing unit 47. The bonding mechanism 46 is initially set in a state in which the rubber rollers 80a and 80b are separated, and the long-length photosensitive member is temporarily stopped in a state in which the half-cut portion 34a of the long-length photosensitive sheet 22 is positioned at a predetermined position between the rubber cylinders 80a and 80b. Sex sheet 22. In this state, when the front end portion of the glass substrate 24 heated to a predetermined temperature by the substrate heating portion 74 constituting the substrate supply mechanism 45 is carried between the rubber rollers 80a and 80b, the transfer unit 76 is operated by the pressurizing cylinder 84. The backup roller 82b and the rubber roller 80b are raised, and the glass substrate 24 and the long photosensitive sheet 22 are sandwiched between the rubber cylinders 80a and 80b at a predetermined press pressure. Further, the rubber cylinders 80a, 80b are heated to a specified laminating temperature. Next, the rubber cylinders 80a and 80b are rotated to transport the glass substrate 24 and the elongated photosensitive sheet 22 in the arrow Y direction. As a result, the photosensitive resin layer 28 is heated and melted and transferred to the glass substrate 24. Further, the laminating condition is a speed of 1.0 m / min to 10.0 m / min, and the temperature of the rubber cylinders 80a, 80b is 80 ° C to 15 (TC, the rubber hardness of the rubber roller 80a, iJ 80b is 40 to 90 degrees The press pressure (linear pressure) of the rubber rolls 80a and 80b is 50 N/cm to 400 N/cm. When the long longitudinal photosensitive film 22 is laminated on the glass substrate 24, the rotation of the rubber rolls 80a and 80b is stopped. Further, the front end portion of the glass substrate 24 on which the long photosensitive sheet 22 is laminated is sandwiched by the substrate transfer roller 90a. At this time, the half cut portion 34b is disposed at a predetermined position between the rubber rolls 80a and 80b, and then the rubber roll 80b is placed. Retracted from the direction away from the rubber roller 80a, the clamping is released, and the substrate transporting roller 90a starts to rotate again at a low speed, and the photosensitive laminate 22 of the -17-200848265 long laminated photosensitive sheet 22 is laminated on the photosensitive substrate of the glass substrate 24. The arrow Y direction conveys the degree of the width Μ corresponding to the remaining portion B of the protective film 30, and the second half of the cut portion 34a is conveyed to a predetermined position near the lower side of the rubber roller 80a, and then the rubber rollers 80a, 80b are stopped. Rotate. In the following, the process of transporting the long-length photosensitive sheet 22 between the half-cut portions 34a and 34b is referred to as "inter-substrate transfer". Further, in the above-described state, the substrate supply mechanism 45 is transported to the bonding position. The glass substrate 24 is continuously subjected to the above operations, and the photosensitive laminated body is continuously produced. At this time, each end portion of the photosensitive laminated body is covered by the residual portion B of the protective film 30 shown in Fig. 2 . Therefore, when the photosensitive resin layer 28 is transferred to the glass substrate 24, the rubber cylinders 80a and 80b are not contaminated by the photosensitive resin layer 28. The glass substrate 24 to which the photosensitive resin layer 28 is bonded by the bonding mechanism 46 is When the long photosensitive sheet 22 is transported between the substrates by the bonding mechanism 46, the squeegee mechanism 48 provided between the substrate transport rollers 90b and 90c cuts the long strip between the glass substrates 24 in the temporary stop state. The photosensitive sheet 22' is used as the photosensitive laminate 2a. Further, the protective film 30 is left in the photosensitive laminate 2a. The separated photosensitive laminate 24a is temporarily laminated in the reservoir 94 by the robot 96. Next, the laminate to After the photosensitive laminate 24a of the reservoir 94 is transported to the peeling portion 98, the protective film 30 is peeled off from the photosensitive laminate 2 4 a via the peeling roller 1 to produce only the glass substrate 24 The photosensitive laminate 24b of the photosensitive resin layer 28 is combined. The protective film 30 peeled from the photosensitive laminate 24a is wound by the winding drum 102. -18- 200848265 Here, since the specified tension is imparted thereto In the state where the long photosensitive sheet 2 2 is supplied and heated in the bonding mechanism 46 to be bonded to the glass substrate 24, the stretching occurs. At this time, it is possible that the bonding position of the photosensitive resin layer 28 to the glass substrate 24 is unsuitable by the elongation of the long-length photosensitive sheet 22. Therefore, the detecting portion 104 disposed on the downstream side of the peeling portion 798 detects the bonding position of the photosensitive resin layer 28 in the photosensitive laminated body 24b. First, as shown in Fig. 4, the photo sensor 106 constituting the detecting unit 104 detects the end portion of the glass substrate 24 to be transported or the tip end portion of the photosensitive resin layer 28 bonded to the glass substrate 24, and ends the end portion. The detection signals are output to the CCD cameras 108a and 108b. The CCD cameras 108a and 108b capture images of the imaging regions 109a and 109b of the glass substrate 24 in accordance with the end detection signals. At this time, the imaging regions 109a and 109b include the glass substrate 24 therein. An image of the front corner portion and the front corner portion of the photosensitive resin layer 28. The image processing unit 120 processes the image photographed by the CCD cameras 108a and 108b, the front corner portion of the specific glass substrate 24, and the photosensitive resin layer 28 In the front corner portion, the bonding position calculation unit 122 calculates the distance LI f between the side portion of the glass substrate 24 and the side portion of the photosensitive resin layer 28 in the distal end portion, and the glass substrate 24 based on the position information of the specific corner portion. The distance L2f between the front end portion and the front end portion of the photosensitive resin layer 28 (see Fig. 5). The determining unit 124 compares the calculated distances Llf and L2f with a predetermined allowable distance to determine the distance L 1 f In the case where the result of the determination is displayed on the display unit 1 26, the bonding state of the photosensitive resin layer 28 on the tip end side of the photosensitive laminated body 24b can be notified to the operator. The detector 106 detects the rear end of the glass substrate 24 or -19-200848265 at the time of sticking to the rear end portion of the photosensitive resin layer 28 of the glass substrate 24, and images are taken by the CCD cameras 108a and 108b, and are calculated later. The distances Lib and L2b between the glass substrate 24 and the photosensitive resin layer 28 at the end are displayed on the display unit 1 26 (see Fig. 6). The photosensitive resin layer 28 is automatically detected as described above. The bonding state of the glass substrate 24 is displayed on the display unit 126. Therefore, the operator can perform quality inspection of all the photosensitive laminated bodies 24b manufactured by the manufacturing apparatus 20 based on the determination result of the display. F is a schematic configuration diagram of the manufacturing apparatus 200 of the other embodiment. The same components as those of the manufacturing apparatus 20 shown in Fig. 1 are denoted by the same reference numerals, and the description thereof is omitted. The glass substrate 24 to which the long photosensitive sheet 22 is bonded by the bonding mechanism 46 is transported to the cooling unit 202 without being cut, cooled, and then supplied to the peeling unit 204. The peeling unit 204 is propelled by the pusher 206. The long-length photosensitive sheet 22 between the glass substrates 24 is pushed up in the upper direction, and the protective film 30 is easily peeled off. Then, the protective 1 is peeled off from the photosensitive resin layer 28; the film 30 is wound by the winding drum 208. Thereby, the glass substrate 24 is separated, and the photosensitive laminated body 24b is manufactured. In the same manner as in the case of the manufacturing apparatus 20, the detection unit 104 detects the positions of the end portions of the glass substrate 24 and the photosensitive resin layer 28, and performs the calculation and determination processing of the bonding position. In the above-described embodiment, the long photosensitive sheet 22 supplied from one photosensitive sheet roll 23 is bonded to the glass substrate 24 to produce a so-called single-rolled photosensitive layered body 24b. It is possible to apply a long-length sensation -20-200848265 optical sheet 22 from two photosensitive sheet rolls or three or more photosensitive sheet rolls to the glass substrate 24 to produce so-called two-roll laying, three-roll laying, and the like. The photosensitive laminate 24b is configured. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic structural view of a manufacturing apparatus of the present embodiment. Fig. 2 is a cross-sectional view of a long photosensitive sheet used in the manufacturing apparatus of the embodiment. Fig. 3 is an explanatory view showing a state in which a joint label is joined to a long photosensitive sheet. Fig. 4 is an explanatory diagram showing the arrangement relationship between the end detecting portion and the photographing portion. Fig. 5 is an explanatory view showing the photographing state of the front end portion of the substrate and the photosensitive material layer. Fig. 6 is an explanatory view showing the photographing state of the end portion of the substrate and the photosensitive material layer. Figure 7 is a block diagram of the control circuit of the detecting unit. Fig. 8 is a schematic structural view of a manufacturing apparatus of another embodiment. Figure 9 is a schematic diagram of a prior art manufacturing apparatus. Fig. 10 is an explanatory view showing the positional relationship between the substrate and the photosensitive sheet. [Description of main component symbols] 1 Roller 2 Photosensitive sheet 3 Half thickness cutting device 4 Protective film removing portion 5 Substrate 6 a Thermocompression bonding roller 6b Thermocompression bonding roller-21 - 200848265 7 Separating device 20 Manufacturing device 22 Strip Photosensitive sheet 23 Photosensitive sheet roll 24 Glass substrate 24a Photosensitive laminate 24b Photosensitive laminate 26 Flexible base film 28 Photosensitive resin layer 30 Protective film 32 Sheet feeding mechanism 3 4a Half thickness cutting portion 34b Half thickness Cutting portion 36 Machining mechanism 38 Engagement label 38a Non-joining portion 38b -* Engagement portion 38c Second joint portion 40 Label engagement mechanism 42 Storage mechanism 44 Peeling mechanism 45 Substrate supply mechanism 46 Fitting mechanism 47 Photo portion 48 Tool mechanism-22- 200848265 49 Fit 50 Roller 5 1 Film 52a Round edge 52b Round edge 5 4 a ~ 5 4 g Adsorption 56 Bracket 60 Bounce 62 Intake 63 Stripping 64 Protection 66 Tension 68 Cylinder 70 Tension 74 Substrate 76 Conveying 78 Stop 80a Rubber 80b Rubber 82a Backup 82b Backup 83 Roller 84 Pressurization 9 0 a ~ 9 0 d Substrate 94 Storage
座 組 終端位置檢測器 墊 滾筒 筒 滾筒 膜捲繞部 控制機構 調節器 加熱部 部 位置檢測感測器 滾筒 滾筒 滾筒 滾筒 壓板部 汽缸 輸送滾筒 庫 -23- 200848265 96 機器人 98 剝離部 100 剝離滾筒 102 捲繞滾筒 104 檢測部 106 光感測器 108a CCD相機 108b CCD相機 109a 攝影區域 109b 攝影區域 110 隔牆 1 12a 第一潔淨室 1 12b 第二潔淨室 114 貫穿部 120 圖像處理部 122 貼合位置算出部 124 判定部 126 顯示部 200 製造裝置 202 冷卻部 204 剝離部 206 推進器 208 捲繞滾筒 A 剝離部分 B 殘留部分 -24- 200848265Block group end position detector pad drum cylinder roller film winding control mechanism adjuster heating portion position detection sensor roller drum roller plate press plate cylinder transfer drum library -23- 200848265 96 robot 98 peeling portion 100 peeling roller 102 roll Wound roller 104 detecting portion 106 photo sensor 108a CCD camera 108b CCD camera 109a photographing area 109b photographing area 110 partition wall 1 12a first clean room 1 12b second clean room 114 penetrating portion 120 image processing portion 122 fitting position calculation Section 124 Judging section 126 Display section 200 Manufacturing apparatus 202 Cooling section 204 Peeling section 206 Propeller 208 Winding drum A Stripping section B Residual section - 24 - 200848265
Hb 半 厚 度 切 割 部 Hf 半 厚 度 切 割 部 Llf 距 離 Lib 距 離 L2f 距 離 L2b 距 離Hb semi-thickness cutting section Hf semi-thickness cutting section Llf distance Lib distance L2f distance L2b distance
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