TW200833728A - Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product - Google Patents

Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product

Info

Publication number
TW200833728A
TW200833728A TW096137286A TW96137286A TW200833728A TW 200833728 A TW200833728 A TW 200833728A TW 096137286 A TW096137286 A TW 096137286A TW 96137286 A TW96137286 A TW 96137286A TW 200833728 A TW200833728 A TW 200833728A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
cured product
disclosed
production methods
acenaphthylene
Prior art date
Application number
TW096137286A
Other languages
Chinese (zh)
Other versions
TWI427093B (en
Inventor
Kazuhiko Nakahara
Masasi Kaji
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200833728A publication Critical patent/TW200833728A/en
Application granted granted Critical
Publication of TWI427093B publication Critical patent/TWI427093B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is an epoxy resin having excellent fluidity and high filler filling property, which provides a cured product excellent in moisture resistance, heat resistance and flame retardance. This epoxy resin is suitable for sealing of electronic components and uses as circuit board materials. Also disclosed is a composition of such an epoxy resin. Specifically disclosed is an epoxy resin represented by the general formula (3) below, which is obtained by reacting epichlorohydrin with a phenol resin which is obtained by reacting 0.2-6.0 moles of indene or acenaphthylene with 1 mole of a bisphenol compound represented by the general formula (2) below. (In the formulae, X represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, -CO-, -O-, -S- or -SO2-; and R1-R4 independently represent a hydrogen atom or a substituent derived from indene or acenaphthylene.)
TW096137286A 2006-10-04 2007-10-04 Epoxy resins, phenol resins, and the like, epoxy resin compositions and hardened materials TWI427093B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006272566 2006-10-04

Publications (2)

Publication Number Publication Date
TW200833728A true TW200833728A (en) 2008-08-16
TWI427093B TWI427093B (en) 2014-02-21

Family

ID=39268601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096137286A TWI427093B (en) 2006-10-04 2007-10-04 Epoxy resins, phenol resins, and the like, epoxy resin compositions and hardened materials

Country Status (5)

Country Link
JP (1) JP5515058B2 (en)
KR (1) KR101423170B1 (en)
CN (1) CN101522739B (en)
TW (1) TWI427093B (en)
WO (1) WO2008041749A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600708B (en) * 2012-06-12 2017-10-01 新日鐵住金化學股份有限公司 Polyhydroxy polyether resin, manufacturing method of polyhydroxy polyether resin, resin composition containing the said polyhydroxy polyether resin, and hardened | cured material obtained from it

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5276031B2 (en) * 2010-02-26 2013-08-28 新日鉄住金化学株式会社 Crystalline epoxy resin, method for producing the same, epoxy resin composition using the same, and cured product
MY156448A (en) * 2010-07-30 2016-02-26 Dainippon Ink & Chemicals Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating material
CN103140523B (en) * 2010-09-27 2014-07-23 新日铁住金化学株式会社 Polyhydric hydroxy resin, epoxy resin, production method therefor, epoxy resin composition and cured product thereof
KR20130118289A (en) 2010-09-29 2013-10-29 디아이씨 가부시끼가이샤 Curable resin composition, substance resulting from curing same, phenol resin, epoxy resin, and semiconductor sealing material
JP7378090B2 (en) * 2018-07-19 2023-11-13 パナソニックＩｐマネジメント株式会社 Resin compositions, prepregs, resin-coated films, resin-coated metal foils, metal-clad laminates, and wiring boards
CN114149659B (en) * 2021-12-31 2023-07-14 苏州生益科技有限公司 Resin composition and use thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE785914A (en) * 1971-07-08 1973-01-08 Munchen Michael H PROCESS FOR MANUFACTURING FILM-GENERATED CONDENSATION PRODUCTS WHICH CAN BE USED AS BINDERS IN PRINTING INKS
ES407246A1 (en) * 1971-10-08 1975-10-16 Reichhold Albert Chemie Ag Modified natural resin binder and process for preparation
JP4150104B2 (en) * 1998-05-13 2008-09-17 新日本石油株式会社 Anticorrosion paint composition
JPH11343386A (en) * 1998-06-01 1999-12-14 Nippon Steel Chem Co Ltd Phenol resin composition and epoxy resin composition containing the same
JP4408978B2 (en) * 1999-01-12 2010-02-03 新日鐵化学株式会社 Production method of polyvalent hydroxy resin and epoxy resin
JP2001151861A (en) 1999-11-25 2001-06-05 Matsushita Electric Works Ltd Epoxy resin composition and semiconductor device
AU2003242221A1 (en) * 2002-06-11 2003-12-22 Nippon Steel Chemical Co., Ltd. Acenaphthylene modified phenolic resin and epoxy resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600708B (en) * 2012-06-12 2017-10-01 新日鐵住金化學股份有限公司 Polyhydroxy polyether resin, manufacturing method of polyhydroxy polyether resin, resin composition containing the said polyhydroxy polyether resin, and hardened | cured material obtained from it

Also Published As

Publication number Publication date
WO2008041749A1 (en) 2008-04-10
KR20090075826A (en) 2009-07-09
KR101423170B1 (en) 2014-07-25
JP5515058B2 (en) 2014-06-11
JPWO2008041749A1 (en) 2010-02-04
CN101522739A (en) 2009-09-02
TWI427093B (en) 2014-02-21
CN101522739B (en) 2012-09-05

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees