TW200833728A - Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product - Google Patents
Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured productInfo
- Publication number
- TW200833728A TW200833728A TW096137286A TW96137286A TW200833728A TW 200833728 A TW200833728 A TW 200833728A TW 096137286 A TW096137286 A TW 096137286A TW 96137286 A TW96137286 A TW 96137286A TW 200833728 A TW200833728 A TW 200833728A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- cured product
- disclosed
- production methods
- acenaphthylene
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
- C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Disclosed is an epoxy resin having excellent fluidity and high filler filling property, which provides a cured product excellent in moisture resistance, heat resistance and flame retardance. This epoxy resin is suitable for sealing of electronic components and uses as circuit board materials. Also disclosed is a composition of such an epoxy resin. Specifically disclosed is an epoxy resin represented by the general formula (3) below, which is obtained by reacting epichlorohydrin with a phenol resin which is obtained by reacting 0.2-6.0 moles of indene or acenaphthylene with 1 mole of a bisphenol compound represented by the general formula (2) below. (In the formulae, X represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, -CO-, -O-, -S- or -SO2-; and R1-R4 independently represent a hydrogen atom or a substituent derived from indene or acenaphthylene.)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006272566 | 2006-10-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200833728A true TW200833728A (en) | 2008-08-16 |
TWI427093B TWI427093B (en) | 2014-02-21 |
Family
ID=39268601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096137286A TWI427093B (en) | 2006-10-04 | 2007-10-04 | Epoxy resins, phenol resins, and the like, epoxy resin compositions and hardened materials |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5515058B2 (en) |
KR (1) | KR101423170B1 (en) |
CN (1) | CN101522739B (en) |
TW (1) | TWI427093B (en) |
WO (1) | WO2008041749A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI600708B (en) * | 2012-06-12 | 2017-10-01 | 新日鐵住金化學股份有限公司 | Polyhydroxy polyether resin, manufacturing method of polyhydroxy polyether resin, resin composition containing the said polyhydroxy polyether resin, and hardened | cured material obtained from it |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5276031B2 (en) * | 2010-02-26 | 2013-08-28 | 新日鉄住金化学株式会社 | Crystalline epoxy resin, method for producing the same, epoxy resin composition using the same, and cured product |
MY156448A (en) * | 2010-07-30 | 2016-02-26 | Dainippon Ink & Chemicals | Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating material |
CN103140523B (en) * | 2010-09-27 | 2014-07-23 | 新日铁住金化学株式会社 | Polyhydric hydroxy resin, epoxy resin, production method therefor, epoxy resin composition and cured product thereof |
KR20130118289A (en) | 2010-09-29 | 2013-10-29 | 디아이씨 가부시끼가이샤 | Curable resin composition, substance resulting from curing same, phenol resin, epoxy resin, and semiconductor sealing material |
JP7378090B2 (en) * | 2018-07-19 | 2023-11-13 | パナソニックIpマネジメント株式会社 | Resin compositions, prepregs, resin-coated films, resin-coated metal foils, metal-clad laminates, and wiring boards |
CN114149659B (en) * | 2021-12-31 | 2023-07-14 | 苏州生益科技有限公司 | Resin composition and use thereof |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE785914A (en) * | 1971-07-08 | 1973-01-08 | Munchen Michael H | PROCESS FOR MANUFACTURING FILM-GENERATED CONDENSATION PRODUCTS WHICH CAN BE USED AS BINDERS IN PRINTING INKS |
ES407246A1 (en) * | 1971-10-08 | 1975-10-16 | Reichhold Albert Chemie Ag | Modified natural resin binder and process for preparation |
JP4150104B2 (en) * | 1998-05-13 | 2008-09-17 | 新日本石油株式会社 | Anticorrosion paint composition |
JPH11343386A (en) * | 1998-06-01 | 1999-12-14 | Nippon Steel Chem Co Ltd | Phenol resin composition and epoxy resin composition containing the same |
JP4408978B2 (en) * | 1999-01-12 | 2010-02-03 | 新日鐵化学株式会社 | Production method of polyvalent hydroxy resin and epoxy resin |
JP2001151861A (en) | 1999-11-25 | 2001-06-05 | Matsushita Electric Works Ltd | Epoxy resin composition and semiconductor device |
AU2003242221A1 (en) * | 2002-06-11 | 2003-12-22 | Nippon Steel Chemical Co., Ltd. | Acenaphthylene modified phenolic resin and epoxy resin composition |
-
2007
- 2007-10-04 WO PCT/JP2007/069482 patent/WO2008041749A1/en active Search and Examination
- 2007-10-04 TW TW096137286A patent/TWI427093B/en not_active IP Right Cessation
- 2007-10-04 CN CN200780036932XA patent/CN101522739B/en not_active Expired - Fee Related
- 2007-10-04 JP JP2008537550A patent/JP5515058B2/en not_active Expired - Fee Related
- 2007-10-04 KR KR1020097008024A patent/KR101423170B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI600708B (en) * | 2012-06-12 | 2017-10-01 | 新日鐵住金化學股份有限公司 | Polyhydroxy polyether resin, manufacturing method of polyhydroxy polyether resin, resin composition containing the said polyhydroxy polyether resin, and hardened | cured material obtained from it |
Also Published As
Publication number | Publication date |
---|---|
WO2008041749A1 (en) | 2008-04-10 |
KR20090075826A (en) | 2009-07-09 |
KR101423170B1 (en) | 2014-07-25 |
JP5515058B2 (en) | 2014-06-11 |
JPWO2008041749A1 (en) | 2010-02-04 |
CN101522739A (en) | 2009-09-02 |
TWI427093B (en) | 2014-02-21 |
CN101522739B (en) | 2012-09-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |